Device comprising a substrate and method for providing a device comprising a substrate

Abstract

A device comprising a substrate, an integrated circuit arranged on the substrate and at least one heat dissipation element arranged on the substrate, for example for carrying off heat from at least one component of the device.

Description

[0001] Description

[0002] title

[0003] Device comprising a substrate and method for providing a device comprising a substrate

[0004] State of the art

[0005] The disclosure relates to a device comprising a substrate.

[0006] The disclosure further relates to a method for providing a device comprising a substrate.

[0007] Disclosure of the invention

[0008] Exemplary embodiments relate to a device comprising a substrate, at least one integrated circuit arranged on the substrate, and at least one thermal dissipation device arranged on the substrate, for example, for cooling at least one component of the device. In further exemplary embodiments, this enables efficient cooling directly in the region of the at least one integrated circuit arranged on the substrate and can, in further exemplary embodiments, be integrated, for example, into existing, conventional cooling concepts that include, for example, heat spreaders.

[0009] In further exemplary embodiments, it is provided that the at least one thermal dissipation device does not have a molding compound or is not designed as a molding compound.

[0010] In further exemplary embodiments, it is provided that the at least one thermal dissipation device comprises, for example, contains, a coolant and is designed to utilize a phase change of the coolant for heat dissipation. This enables particularly efficient heat dissipation in further exemplary embodiments.

[0011] In further exemplary embodiments, it is provided that the at least one thermal dissipation device comprises a coolant, wherein, for example, at least temporarily, no phase change of the coolant is used, for example, no phase change of the coolant at all. In other words, in further exemplary embodiments, configurations are also conceivable in which a coolant is used, but the coolant does not undergo a phase change.

[0012] In further exemplary embodiments, it is provided that the at least one thermal dissipation device has at least one heat pipe (e.g. "heat pipe") or is designed as a heat pipe.

[0013] In further exemplary embodiments, it is provided that the at least one thermal dissipation device has at least one steam chamber or is designed as a steam chamber.

[0014] In further exemplary embodiments, it is provided that at least one device comprising at least one microelectromechanical system, MEMS, for example a MEMS device, is provided in the region a) of the at least one thermal dissipation device and / or in the region b) of the at least one integrated circuit.

[0015] In further exemplary embodiments, it is provided that the at least one MEMS device is also arranged on the substrate.

[0016] In further exemplary embodiments, it is provided that the at least one MEMS device is at least partially integrated into the at least one thermal dissipation device.

[0017] In further exemplary embodiments, it is provided that the at least one MEMS device is designed to move, for example, convey, a coolant or the coolant of the at least one thermal dissipation device. In further exemplary embodiments, the at least one MEMS device can generate, for example, mechanical vibrations and / or rotation for this purpose.

[0018] In further exemplary embodiments, it is provided that the at least one MEMS device is designed as a pump or fan.

[0019] In further exemplary embodiments, it is provided that the at least one MEMS device is designed to move a medium surrounding the at least one integrated circuit and / or the at least one thermal dissipation device, for example to cause, for example, forced, convection of the medium.

[0020] In further exemplary embodiments, it is provided that at least one first MEMS device is provided and at least partially integrated into the at least one thermal dissipation device, for example in order to move, e.g. to convey, any coolant present in the at least one thermal dissipation device, and that at least one second MEMS device is provided and arranged in the region of the at least one thermal dissipation device and / or in the region of the at least one integrated circuit, for example in order to move, e.g. to convey, any ambient medium present which at least partially surrounds the at least one thermal dissipation device and / or the at least one integrated circuit.

[0021] In further exemplary embodiments, it is provided that the at least one thermal dissipation device is arranged in the same virtual plane as the at least one integrated circuit. In further exemplary embodiments, this enables a particularly compact configuration and / or direct heat dissipation from so-called hot spots.

[0022] In further exemplary embodiments, it is provided that a plurality of integrated circuits are arranged on the substrate, wherein the at least one thermal dissipation device is arranged between at least two of the plurality of integrated circuits. In further exemplary embodiments, it is provided that a vertical extent (e.g. thickness) of the at least one thermal dissipation device extending parallel to a surface normal of the substrate is substantially the same size (e.g. deviations of + / - 10% thickness are permissible in some exemplary embodiments) as a vertical extent of the at least one integrated circuit extending parallel to a surface normal of the substrate, wherein, for example, the vertical extent of the at least one thermal dissipation device is the same size as or smaller than the vertical extent of the at least one integrated circuit.

[0023] In further exemplary embodiments, it is provided that the at least one thermal dissipation device is designed to enable a transport of thermal energy a) in at least one direction parallel to a surface of the substrate and / or b) in at least one direction perpendicular to the surface of the substrate.

[0024] In further exemplary embodiments, it is provided that the device has a heat-conducting device, for example a heat spreader, which is arranged, for example, substantially parallel to the substrate and which is thermally conductively connected to the at least one integrated circuit and the at least one thermal dissipation device. For example, the at least one thermal dissipation device and the at least one integrated circuit can be arranged between the substrate and the heat spreader, for example forming a layered structure, wherein a first layer comprises the substrate, a second layer comprises the heat spreader, and a third layer, which is arranged between the first layer and the second layer, comprises the at least one thermal dissipation device and the at least one integrated circuit.

[0025] In further exemplary embodiments, the device according to the embodiments forms a multi-chip package, for example, a multi-chip package, which comprises, for example, one or more integrated circuits ("chips"), e.g., chiplets. Optionally, in further exemplary embodiments of the device, further components such as thermal interface material, TIM, and / or molding compound, etc., may be provided.

[0026] In further exemplary embodiments, such a multi-chip package can be provided using the device according to the embodiments. Optionally, in further exemplary embodiments of the multi-chip package, additional components such as thermal interface material, TIM, and / or molding compound, etc., can be provided.

[0027] Further exemplary embodiments relate to a product, for example a control unit, for example for a motor vehicle, comprising at least one device, for example at least one multi-chip package, according to the embodiments.

[0028] Further exemplary embodiments relate to a vehicle, for example a motor vehicle, comprising at least one device according to the embodiments and / or at least one product, for example a control unit, according to the embodiments.

[0029] Further exemplary embodiments relate to a method for providing a device comprising a substrate, at least one integrated circuit arranged on the substrate and at least one thermal dissipation device arranged on the substrate, for example for cooling at least one component of the device, the method comprising: providing the substrate, arranging the at least one integrated circuit on the substrate, arranging the at least one thermal dissipation device on the substrate.

[0030] Further exemplary embodiments relate to a use of the device according to the embodiments and / or the product according to the embodiments and / or the vehicle according to the embodiments and / or the method according to the embodiments for at least one of the following elements: a) internal heat dissipation of a device having at least one integrated circuit, for example a multi-chip module, b) enabling an increased power density in multi-chip modules, c) reducing orAvoiding hotspots, for example in multi-chip modules, d) Ensuring that a permissible maximum temperature of at least one integrated circuit, for example of a multi-chip module, is not exceeded, e) Increasing a temperature range, for example a temperature window, for operation of at least one integrated circuit, for example of a multi-chip module, f) Providing a cooling device in the form of a chip, for example chiplets, g) Providing at least one multi-chip module with integrated cooling, h) Enabling a longer running time of the multi-chip module, for example by means of a low average temperature, i) Reducing a number or extent of temperature changes, e.g. by dampening temperature peaks.

[0031] Further features, possible applications, and advantages of the invention will become apparent from the following description of exemplary embodiments of the invention, which are illustrated in the figures of the drawing. All described or illustrated features, individually or in any combination, constitute the subject matter of the invention, regardless of their summary in the claims or their references, as well as regardless of their wording or representation in the description or in the drawing.

[0032] The drawing shows:

[0033] Fig. 1 schematically shows a simplified block diagram according to exemplary embodiments,

[0034] Fig. 2 schematically shows a simplified block diagram according to exemplary embodiments,

[0035] Fig. 3 schematically shows a simplified block diagram according to exemplary embodiments,

[0036] Fig. 4 schematically shows a simplified block diagram according to exemplary embodiments, Fig. 5 schematically shows a simplified side view according to exemplary embodiments,

[0037] Fig. 6 schematically shows a simplified plan view according to exemplary embodiments,

[0038] Fig. 7 schematically shows a simplified block diagram according to exemplary embodiments,

[0039] Fig. 8 schematically shows a simplified block diagram according to exemplary embodiments,

[0040] Fig. 9 schematically shows a simplified flow diagram according to exemplary embodiments,

[0041] Fig. 10 schematically illustrates aspects of uses according to exemplary embodiments.

[0042] Exemplary embodiments, Fig. 1 , relate to a device 100 comprising a substrate 110, at least one integrated circuit 120 arranged on the substrate 110 and at least one thermal dissipation device 130 arranged on the substrate 110, for example for cooling at least one component of the device 100. In further exemplary embodiments, this enables efficient cooling directly in the region of the at least one integrated circuit 120 arranged on the substrate 110 and can, in further exemplary embodiments, for example, be integrated into existing, conventional concepts for cooling, which have, for example, heat spreaders.

[0043] By way of example, Fig. 1 shows an optional heat spreader 112 according to further exemplary embodiments, which is thermally conductively connected to the components 120, 130. From Fig. 1 it can be seen that the thermal dissipation device 130 is arranged on the substrate 110, for example next to, e.g. directly next to, the at least one integrated circuit 120 and thus also enables heat dissipation of the at least one integrated circuit 120 in the horizontal direction in Fig. 1, e.g. relative to the optional heat spreader 112. In further exemplary embodiments, at least partial heat dissipation of the thermal dissipation device 130 can take place by means of the optional heat spreader 112.

[0044] In further exemplary embodiments, Fig. 1 , it is provided that the at least one thermal dissipation device 130 does not have a molding compound or is not designed as a molding compound.

[0045] In further exemplary embodiments, Fig. 1 , it is provided that the at least one thermal dissipation device 130 has, for example, contains, a coolant 132 and is designed to utilize a phase change of the coolant 132 for heat dissipation, e.g., a phase change from a liquid state to a gaseous state (and possibly back to the liquid state). This enables particularly efficient heat dissipation in further exemplary embodiments.

[0046] In further exemplary embodiments, Fig. 2, it is provided that the at least one thermal dissipation device 130 has at least one heat pipe (e.g. "heat pipe") 134 or is designed as a heat pipe 134.

[0047] In further exemplary embodiments, Fig. 2, it is provided that the at least one thermal dissipation device 130 has at least one vapor chamber 136 (e.g. "vapor chamber") or is designed as a vapor chamber 136.

[0048] In further exemplary embodiments, Fig. 1 , it is provided that at least one device having at least one microelectromechanical system, MEMS, 142, for example MEMS device, 140 is provided in the region a) of the at least one thermal dissipation device 130 and / or in the region b) of the at least one integrated circuit 120.

[0049] In further exemplary embodiments, it is provided that the at least one MEMS device 140 is also arranged on the substrate 110. In further exemplary embodiments, Fig. 3, it is provided that the at least one MEMS device 140 is at least partially integrated into the at least one thermal dissipation device 130.

[0050] In further exemplary embodiments, Fig. 3, it is provided that the at least one MEMS device 140 is designed to move, for example, convey, a coolant 132 of the at least one thermal dissipation device 130 (see block arrow A1). In further exemplary embodiments, the at least one MEMS device 140 can generate, for example, mechanical vibrations and / or rotation for this purpose.

[0051] In further exemplary embodiments, it is provided that the at least one MEMS device 140 is designed as a pump or fan.

[0052] In further exemplary embodiments, Fig. 1 , it is provided that the at least one MEMS device 140 is designed to move a medium M surrounding the at least one integrated circuit 120 and / or the at least one thermal dissipation device 130, for example to cause a, for example forced, convection of the medium M.

[0053] In further exemplary embodiments, it is provided that at least one first MEMS device 140 (Fig. 1) is provided and is at least partially integrated into the at least one thermal dissipation device 130 (Fig. 3), for example in order to move, e.g. to convey, a possibly present coolant 132 of the at least one thermal dissipation device 130, and that at least one second MEMS device (not shown) is provided and is arranged in the region of the at least one thermal dissipation device 130 and / or in the region of the at least one integrated circuit 120, for example in order to move, e.g. to convey, a possibly present ambient medium M (Fig. 1) which at least partially surrounds the at least one thermal dissipation device and / or the at least one integrated circuit.

[0054] In further exemplary embodiments, Fig. 1 , it is provided that the at least one thermal dissipation device 130 is arranged in the same virtual plane VE as the at least one integrated circuit 120. In further exemplary embodiments, this enables a particularly compact configuration and / or direct heat dissipation from so-called hot spots. Furthermore, in further exemplary embodiments, Fig. 1 , an optional, e.g., common, heat spreader 112 can be provided for both components 120, 130.

[0055] In further exemplary embodiments 100a of the device, Fig. 4, it is provided that a plurality of integrated circuits 120-1, 120-2, 120-3 are arranged on the substrate 110, wherein the at least one thermal dissipation device 130 is arranged between at least two integrated circuits 120-1, 120-2 of the plurality of integrated circuits 120-1, 120-2, 120-3.

[0056] In further exemplary embodiments, Fig. 1 , it is provided that a vertical extent vA1 (e.g. thickness) of the at least one thermal dissipation device 130 extending parallel to a surface normal ON of the substrate 110 is substantially the same size (e.g. deviations of + / - 10% thickness are permissible in some exemplary embodiments) as a vertical extent vA2 of the at least one integrated circuit 120 extending parallel to the surface normal ON of the substrate 110, wherein, for example, the vertical extent vA1 of the at least one thermal dissipation device 130 is the same size as or smaller than the vertical extent vA2 of the at least one integrated circuit 120.

[0057] In further exemplary embodiments, Fig. 1 , it is provided that the at least one thermal dissipation device 130 is designed to enable a transport of thermal energy a) in at least one direction parallel to a surface of the substrate 110 (i.e., for example, vertically in Fig. 1) and / or b) in at least one direction perpendicular to the surface of the substrate 110 (i.e., for example, horizontally in Fig. 1).

[0058] In further exemplary embodiments, Fig. 1 , it is provided that the device 100 has a heat conducting device, for example a heat spreader, 112, which is arranged, for example, substantially parallel to the substrate 110, and which is thermally conductively connected to the at least one integrated circuit 120 and the at least one thermal dissipation device 130. For example, the at least one thermal dissipation device 130 and the at least one integrated circuit 120 can be arranged between the substrate 110 and the heat spreader 112, for example forming a layered structure, wherein a first layer comprises the substrate 110, wherein a second layer comprises the heat spreader 112, and wherein a third layer, which is arranged between the first layer and the second layer, comprises the at least one thermal dissipation device 130 and the at least one integrated circuit 120.

[0059] In further exemplary embodiments, Fig. 1 , the device according to the embodiments forms a multi-chip package, for example a multi-chip package, which comprises, for example, one or more integrated circuits ("chips"), e.g., chiplets, 120 (Fig. 1), 120-1, 120-2, 120-3 (Fig. 4). Optionally, in further exemplary embodiments of the device, further components such as thermal interface material, TIM, and / or molding compound, etc., may be provided (not shown in Figs. 1, 4).

[0060] In further exemplary embodiments, such a multi-chip package can be provided using the device according to the embodiments. Optionally, in further exemplary embodiments of the multi-chip package, additional components such as thermal interface material, TIM, and / or molding compound, etc., can be provided.

[0061] Fig. 5 schematically shows a simplified side view of a device 100b according to further exemplary embodiments, and Fig. 6 schematically shows a top view of the device 100b. Reference numeral 110a symbolizes a substrate, for example made of an organic material, e.g. polymer material. Reference numeral 112a symbolizes a heat spreader, e.g. made of a metal material such as copper or aluminum. Reference numeral 113 symbolizes, for example, an electrically conductive adhesion layer, e.g. comprising an adhesive containing silver. Reference numeral 114 symbolizes an interposer, e.g. made of silicon, e.g. comprising vertical electrical connections (e.g. TSVs, through-silicon vias) through the silicon interposer. The interposer 114 serves in the present case, e.g. as a common carrier for the plurality of integrated circuits 120-1, 120-2, 120-3, e.g. chips, for example chiplets.In further exemplary embodiments, a copper layer, e.g., consisting of so-called copper pillars (e.g., small, vertical pillars of copper), is provided between the interposer 114 and the chiplets 120-1, 120-2, 120-3. The copper pillars 115 serve, for example, as connecting elements in the semiconductor assembly 100b. Optionally, the copper layer 115 can also comprise an underfill material, e.g., an adhesive. For example, the copper layer 115 has a thickness of approximately 10 μm.

[0062] Reference numeral 116 symbolizes a further, optional, copper layer, for example in the form of copper columns, for example with a thickness of approximately 100 μm. Optionally, copper layer 116 can include an interposer. Reference numeral 117 symbolizes a layer for, for example, electrical and / or mechanical contacting, for example, of a target system (not shown). Layer 117 can include, for example, solder balls.

[0063] Reference numeral 118 symbolizes areas that optionally contain molding compound and / or components of a housing.

[0064] Block arrows A2, A3 symbolize heat transport in the vertical direction from the thermal dissipation element 130 to the heat spreader 112a (block arrow A2) and to the interposer 114 (block arrow A3), as enabled based on the principle according to the embodiments. This allows efficient heat dissipation directly between the chiplets 120-1, 120-2, and, for example, unwanted hot spots in the device 110b can be avoided or reduced.

[0065] The block arrows A4, A4 symbolize a heat transport in the horizontal direction from the thermal dissipation element 130 (see also block arrow A3) to or in the interposer 114.

[0066] Fig. 6 shows, by way of example, a top view of the device 100b according to Fig. 5, from which further details of the thermal dissipation element 130 according to exemplary embodiments can be seen. In the present case, the thermal dissipation element 130 has, for example, three MEMS devices 140-1, 140-2, 140-3, each of which has, for example, a heat pipe and, for example, a pump for conveying a coolant 132 (Fig. 1) of the heat pipe. In further exemplary embodiments, Fig. 5, 6, the thermal dissipation element 130 can also be understood as a "chiplet module", which can be arranged on the substrate 110a, for example similar to the chiplets 120-1, 120-2, 120-3, and can be combined with further components 112a, 114a for heat dissipation, for example also in the sense of an integration of the dissipation element chiplet 130 into the device 100b.

[0067] In further exemplary embodiments, the dissipation element chiplet 130 forms a heat sink, e.g., for the neighboring chiplets, wherein the thermal energy is dissipated from the chiplet 130 into the further components 112a, 114a, see block arrows A2, A3, A4.

[0068] In further exemplary embodiments, the use of a phase-change cooling architecture / technology (e.g., heat pipe or vapor chamber) enables efficient heat dissipation directly in the chiplet 130.

[0069] In further exemplary embodiments, the thermal dissipation device 130 may be arranged horizontally or vertically or in any other orientation, e.g., relative to the substrate.

[0070] In further exemplary embodiments, a MEMS-based fan or a MEMS-based pump can also support heat dissipation by means of the phase-change method, for example by promoting or enhancing, for example, natural convection, whereby, for example, forced convection on a microscale within the chiplet 130 or around the chiplet 130 can be achieved.

[0071] In further exemplary embodiments, the principle according to the embodiments improves independence, e.g., of the heat dissipation efficiency, from an installation position of the multi-chip module 100b.

[0072] In further exemplary embodiments, the principle according to the embodiments improves the "startup behavior" of the phase-change method. In further exemplary embodiments, the principle according to the embodiments increases a temperature window for the operation of the device 100, 100a, 100b.

[0073] In further exemplary embodiments, the principle according to the embodiments improves a general cooling performance, for example within the device 100, 100a, 100b.

[0074] Further exemplary embodiments, Fig. 7, relate to a product, for example control unit, 1000 for example for a motor vehicle 10 (Fig. 8), comprising at least one device 100, for example at least one multi-chip package, according to the embodiments.

[0075] Further exemplary embodiments, Fig. 8, relate to a vehicle, for example a motor vehicle, 10 comprising at least one device 100 according to the embodiments and / or at least one product, for example a control unit, 1000 according to the embodiments. Thus, in further exemplary embodiments, highly integrated multi-chip packages can be provided, for example, which can be used for functions such as (high-)broadband data transmission and / or signal processing, etc.

[0076] Further exemplary embodiments, Fig. 9, relate to a method for providing a device 100 comprising a substrate, at least one integrated circuit arranged on the substrate and at least one thermal dissipation device arranged on the substrate, for example for cooling at least one component of the device, the method comprising: providing 200 the substrate 110, arranging 202 the at least one integrated circuit 120 on the substrate 110, arranging 204 the at least one thermal dissipation device 130 on the substrate 110.

[0077] Further exemplary embodiments, Fig. 10, relate to a use 300 of the device 100 according to the embodiments and / or the product 1000 according to the embodiments and / or the vehicle 10 according to the embodiments and / or the method according to the embodiments for at least one of the following elements: a) internal cooling 301 of a device 100 having at least one integrated circuit, for example a multi-chip module, b) enabling 302 an increased power density in multi-chip modules, c) reducing or avoiding 303 hotspots, for example in, for example, multi-chip

[0078] Modules, d) ensuring 304 that a permissible maximum temperature of at least one integrated circuit, for example a multi-chip module, is not exceeded, e) increasing 305 a temperature range, for example a temperature window, for operation of at least one integrated circuit, for example a multi-chip module, f) providing

[0079] 306 a cooling device in the form of a chip, for example chiplets, g) providing 307 at least one multi-chip module with integrated cooling, h) enabling a longer running time of the multi-chip module, for example by low average temperature, i) reducing a number or extent of temperature changes, e.g. by damping

[0080] Temperature peaks.

Claims

Claims 1. Device (100; 100a; 100b) comprising a substrate (110), at least one integrated circuit (120; 120-1, 120-2, 120-3) arranged on the substrate (110), and at least one thermal dissipation device (130) arranged on the substrate (110), for example for dissipating heat from at least one component (110, 120) of the device (100; 100a; 100b).

2. Device (100; 100a; 100b) according to claim 1, wherein the at least one thermal dissipation device (130) does not have a molding compound or is not designed as a molding compound.

3. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one thermal dissipation device (130) has, for example contains, a coolant (132) and is designed to use a phase change of the coolant (132) for heat dissipation.

4. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one thermal dissipation device (130) has at least one heat pipe (134) or is designed as a heat pipe (134).

5. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one thermal dissipation device (130) has at least one steam chamber (136) or is designed as a steam chamber (136).

6. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein at least one device comprising at least one microelectromechanical system, MEMS, (142), for example MEMS device, (140) in the region a) of the at least one thermal dissipation device (130) and / or in the region b) of the at least one integrated circuit (120; 120-1, 120-2, 120-3).

7. The device (100; 100a; 100b) of claim 6, wherein the at least one MEMS device (140) is also arranged on the substrate (110).

8. Device (100; 100a; 100b) according to at least one of claims 6 to 7, wherein the at least one MEMS device (140) is at least partially integrated into the at least one thermal dissipation device (130).

9. Device (100; 100a; 100b) according to at least one of claims 6 to 8, wherein the at least one MEMS device (140) is designed to move, for example to convey, one or the coolant (132) of the at least one thermal dissipation device (130), (A1).

10. Device (100; 100a; 100b) according to at least one of claims 6 to 9, wherein the at least one MEMS device (140) is designed as a pump or fan.

11. Device (100; 100a; 100b) according to at least one of claims 6 to 8, wherein the at least one MEMS device (140) is designed to move a medium (M) surrounding the at least one integrated circuit (120; 120-1, 120-2, 120-3) and / or the at least one thermal dissipation device (130), for example to effect, for example forced, convection of the medium (M).

12. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one thermal dissipation device (130) is arranged in a same virtual plane (VE) as the at least one integrated circuit (120; 120-1, 120-2, 120-3).

13. The device (100; 100a; 100b) according to at least one of the preceding claims, wherein a plurality of integrated circuits (120-1, 120-2, 120-3) are arranged on the substrate (110), and wherein the at least one thermal dissipation device (130) is arranged between at least two of the plurality of integrated circuits (120-1, 120-2, 120-3).

14. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein a plane extending parallel to a surface normal (ON) of the A vertical extent (vA1) of the at least one thermal dissipation device (130) extending across the substrate is substantially equal to a vertical extent (vA2) of the at least one integrated circuit (120; 120-1, 120-2, 120-3) extending parallel to a surface normal (ON) of the substrate, wherein, for example, the vertical extent (vA1) of the at least one thermal dissipation device (130) is equal to or smaller than the vertical extent (vA2) of the at least one integrated circuit (120; 120-1, 120-2, 120-3).

15. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one thermal dissipation device (130) is designed to enable transport of thermal energy a) in at least one direction parallel to a surface of the substrate (110) and / or b) in at least one direction perpendicular to the surface of the substrate (110).

16. Device (100; 100a; 100b) according to at least one of the preceding claims, comprising a heat conducting device, for example a heat spreader, (112; 112a) which is arranged, for example, substantially parallel to the substrate (110) and which is thermally conductively connected to the at least one integrated circuit (120; 120-1, 120-2, 120-3) and the at least one thermal dissipation device (130).

17. Product, for example control unit, (1000), for example for a motor vehicle (10), comprising at least one device (100; 100a; 100b) according to at least one of the preceding claims.

18. Vehicle, for example a motor vehicle, (10), comprising at least one device (100; 100a; 100b) according to at least one of claims 1 to 16 and / or at least one product, for example a control unit, (1000) according to claim 17.

19. Method for providing a device (100; 100a; 100b) comprising a substrate (110), at least one integrated circuit (120; 120-1, 120-2, 120-3) arranged on the substrate (110) and at least one thermal dissipation device (130) arranged on the substrate (110), for example for cooling at least one component (110, 120) the device (100; 100a; 100b), the method comprising: providing (200) the substrate (110), arranging (202) the at least one integrated circuit (120; 120-1, 120-2, 120-3) on the substrate (110), arranging (204) the at least one thermal dissipation device (130) on the substrate (110).

20. Use (300) of the device (100; 100a; 100b) according to at least one of claims 1 to 16 and / or of the product (1000) according to claim 17 and / or of the vehicle (10) according to claim 18 and / or of the method according to claim 19 for at least one of the following elements: a) internal cooling (301) of a device having at least one integrated circuit (120; 120-1, 120-2, 120-3), for example a multi-chip module, b) enabling (302) an increased power density in multi-chip modules, c) reducing orAvoiding (303) hotspots, for example in multi-chip modules, d) Ensuring (304) that a permissible maximum temperature of at least one integrated circuit (120; 120-1, 120-2, 120-3), for example of a multi-chip module, is not exceeded, e) Increasing (305) a temperature range, for example a temperature window, for operation of at least one integrated circuit (120; 120-1, 120-2, 120-3), for example of a multi-chip module, f) Providing (306) a cooling device in the form of a chip, for example chiplets, g) Providing (307) at least one multi-chip module with integrated cooling, h) Enabling a longer operating time of the multi-chip module, for example by means of a low average temperature, i) Reducing a number or extent of temperature changes, e.g. by damping Temperature peaks.

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