Marking device, marking method, semiconductor wafer, and semiconductor chip

Abstract

The present invention provides a marking device (AE) which makes it possible to reduce the motivation for a third party to reproduce a semiconductor wafer or a semiconductor chip and which imparts a prescribed mark MK on, for example, a semiconductor wafer WF or a semiconductor chip CP. The marking device comprises: a first marking means (10) for imparting, in first impartation form (12), a first mark (MK1) on a semiconductor wafer (WF) or a semiconductor chip (CP); and a second marking means (29) for imparting, in second impartation form (22), a second mark (MK2) on the semiconductor wafer (WF) or the semiconductor chip (CP) on which the first marking means (10) has imparted the first mark (MK1).

Description

Marking device and marking method, as well as semiconductor wafer and semiconductor chip

[0001] The present invention relates to a marking device, a marking method, a semiconductor wafer, and a semiconductor chip.

[0002] 2. Description of the Related Art Marking devices that apply predetermined marks to semiconductor wafers are known (see, for example, Japanese Patent Application Laid-Open No. 2003-122998).

[0003] JP 2016-112579 A

[0004] The laser processing device (marking device) described in Patent Document 1 is capable of applying an anti-counterfeiting mark (second mark) to a semiconductor wafer in addition to an ID mark (first mark). However, if a third party attempts to duplicate a semiconductor wafer that has been marked with the first mark and second mark by the marking device, this can be done with just one laser light irradiation unit (marking means), which is an inconvenience.

[0005] An object of the present invention is to provide a marking device and marking method, as well as a semiconductor wafer and a semiconductor chip, that can reduce the incentive for a third party to replicate a semiconductor wafer or semiconductor chip.

[0006] The present invention employs the configurations described in the claims.

[0007] According to the present invention, since a second mark is applied by a second application method to a semiconductor wafer or semiconductor chip to which a first mark has been applied by a first application method, it is not possible to duplicate a semiconductor wafer or semiconductor chip with only one marking means. Therefore, it is easy to understand that the burden in terms of cost and labor will be large, and it is possible to reduce the motivation of a third party to duplicate a semiconductor wafer or semiconductor chip.

[0008] 1A to 1D are explanatory diagrams of a marking device, a semiconductor wafer, and a semiconductor chip according to an embodiment of the present invention, and FIGS. 1E to 1H are explanatory diagrams of modified examples.

[0009] An embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are perpendicular to each other, with the X-axis and Y-axis being axes within a predetermined plane, and the Z-axis being an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, the view from the front in FIG. 1A is used as the reference, and when directions are indicated without specifying the figure, "up" refers to the direction of the Z-axis arrow, "down" refers to the opposite direction, "left" refers to the direction of the X-axis arrow, "right" refers to the opposite direction, "front" refers to the direction of the Y-axis arrow, and "rear" refers to the opposite direction.

[0010] The marking device EA for carrying out the marking method of the present invention is a device for applying a predetermined mark MK (see FIG. 1(B)) to a semiconductor wafer (hereinafter also simply referred to as "wafer") WF, and is equipped with: a first marking means 10 for carrying out a first marking step of applying a first mark MK1 to the wafer WF by a laser printer 12 as a first marking form; a second marking means 20 for carrying out a second marking step of applying a second mark MK2 to the wafer WF, to which the first mark MK1 has been applied by the first marking means 10, by an inkjet printer 22 as a second marking form; an energy applying means 30 for carrying out an energy applying step of applying ultraviolet rays UV as a predetermined energy to the adhesive sheet AS; and an imaging means 40 for carrying out an imaging step of imaging both the first mark MK1 and the second mark MK2 to form mark images and outputting the mark images to another device, and is disposed above a moving means 50 for transporting the wafer WF. In this embodiment, an adhesive sheet AS is attached as a laminate to one surface of the wafer WF, and the first marking means 10 and the second marking means 20 apply predetermined marks MK to the adhesive sheet AS, thereby applying the predetermined marks MK to the wafer WF via the adhesive sheet AS. Furthermore, the adhesive sheet AS undergoes hardening as a change specific to the ultraviolet rays UV when exposed to the ultraviolet rays UV.

[0011] The first marking means 10 includes a so-called XY table 11 as a driving device that can move a slider 11A in the front-rear and left-right directions, and a laser printer 12 supported by the slider 11A, and is configured to mark a first mark MK1 on the adhesive sheet AS. As shown in each drawing in Figure 1(C), the first mark MK1 marked by the laser printer 12 has an irregular outer edge shape when observed under magnification, and each mark has its own unique characteristics due to the irregular outer edge shape.

[0012] The second marking means 20 includes a so-called XY table 21 as a driving device that can move a slider 21A in the front-rear and left-right directions, and an inkjet printer 22 supported by the slider 21A, and is configured to print a second mark MK2 on the adhesive sheet AS. As shown in each drawing in Figure 1 (C), when observed under magnification, the second mark MK2 printed by the inkjet printer 22 has an irregular outer edge shape and an unspecified number of scattered marks SM present around it, and each mark has its own unique characteristics due to the irregular outer edge shape and the scattered marks SM.

[0013] The energy applying means 30 includes an ultraviolet light emitter 31 capable of emitting ultraviolet light UV.

[0014] The imaging means 40 includes a camera 41, and captures images of the first mark MK1 and the second mark MK2, thereby capturing the irregular outer edge shapes thereof as well as the scattered marks SM, and forms mark images by capturing the individual characteristics of the first mark MK1 and the second mark MK2. The imaging means 40 of this embodiment outputs the mark images to another device, thereby enabling the other device to handle the wafer WF in a specific manner.

[0015] The moving means 50 includes a linear motor 51 as a driving device, and a support table 52 supported by a slider 51A of the linear motor 51 and having a support surface 52A that can be adsorbed and held by a pressure reduction means (holding means) such as a vacuum pump or a vacuum ejector (not shown).

[0016] The operation of the marking apparatus EA will now be described. First, the marking apparatus EA has its components positioned in the initial positions shown by solid lines in Fig. 1A. A user of the marking apparatus EA (hereinafter simply referred to as "user") inputs a signal to start automatic operation via an operation means (not shown) such as an operation panel or a personal computer. Next, the user or a transport means (not shown) such as an articulated robot or a belt conveyor places the wafer WF on the support table 52 with the adhesive sheet AS facing up, as shown in Fig. 1A. Then, the moving means 50 drives a pressure reducing means (not shown) to start suction and holding the wafer WF on the support surface 52A.

[0017] Thereafter, the moving means 50 drives the linear motor 51 to move the wafer WF supported by the support table 52 to the right, and when the wafer WF reaches a first marking position MP1 where the first marking means 10 can apply a first mark MK1, the driving of the linear motor 51 is stopped. Next, the first marking means 10 drives the XY table 11 and the laser printer 12 to mark the first mark MK1 on the adhesive sheet AS. Note that in this embodiment, the first mark MK1 is a predetermined logo mark, and the first marking means 10 marks the first mark MK so that when the wafer WF is later divided along the cut lines CL shown in FIG. 1B into a plurality of semiconductor chips (hereinafter also simply referred to as "chips") CP as shown in FIG. 1D, the first mark MK1 is applied to a predetermined position on each chip CP.

[0018] Then, when the first marking device 10 has completed applying the first mark MK1, the moving device 50 drives the linear motor 51 to move the wafer WF to the right, and when the wafer WF reaches a second marking position MP2 where the second marking device 20 can apply the second mark MK2, the driving of the linear motor 51 is stopped. Next, the second marking device 20 drives the XY table 21 and the inkjet printer 22 to print the second mark MK2 on the adhesive sheet AS. Note that in this embodiment, the second mark MK2 is a predetermined symbol consisting of any number or letter, and the second marking device 20 prints the second mark MK2 so that when the wafer WF is later singulated along the cut lines CL into a plurality of chips CP as shown in FIG. 1(D), the second mark MK2 is applied to each chip CP at a predetermined position.

[0019] Thereafter, when the application of the second mark MK2 by the second marking means 20 is completed, the energy applying means 30 drives the ultraviolet light emitter 31 to emit ultraviolet light UV, and then the moving means 50 drives the linear motor 51 to move the wafer WF to the right to apply ultraviolet light UV to the adhesive sheet AS. As a result, the adhesive sheet AS hardens and ultraviolet light UV is applied to the entire adhesive sheet AS, and then the energy applying means 30 stops driving the ultraviolet light emitter 31. Next, when the wafer WF being transported by the moving means 50 reaches an imaging position RP where the imaging means 40 can image both the first mark MK1 and the second mark MK2, the imaging means 40 drives the camera 41 to image both the first mark MK1 and the second mark MK2 to form mark images.

[0020] 1A, when support table 52 reaches a predetermined position at the right end of linear motor 51, moving means 50 stops driving linear motor 51, then stops driving decompression means (not shown), and releases suction and holding on support surface 52A. Next, when a user or transport means (not shown) holds wafer WF and transports wafer WF to the next process, moving means 50 drives linear motor 51 to return support table 52 to its initial position, and the same operations as those described above are repeated thereafter.

[0021] In this embodiment, after the wafer WF is transferred to the next process, the mark image output by the imaging means 40 is shared with other devices in the next process and thereafter. That is, after the wafer WF is transferred to the next process, other devices that handle the wafer WF capture the first mark MK1 and the second mark MK2 to form other mark images, and the other devices compare the mark images with the other mark images to enable specific handling of the wafer WF, such as detecting counterfeiting of the wafer WF or selecting a processing method for the wafer WF.

[0022] According to the embodiment described above, the second mark MK2 is applied by the inkjet printer 22 to the wafer WF on which the first mark MK1 has been applied by the laser printer 12, so it is not possible to duplicate the wafer WF with only one marking means. Therefore, it is easy to understand that the burden in terms of cost, labor, etc. will be large, and it is possible to reduce the motivation of a third party to duplicate the wafer WF.

[0023] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the first marking means may be anything that can apply a first mark to a semiconductor wafer or semiconductor chip in a first application form, and is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0024] The marking device EA of the present invention may be a marking device that applies a predetermined mark MK to a semiconductor chip CP, and may include a first marking means 10 that performs a first marking step of applying a first mark MK1 to the semiconductor chip CP using a laser printer 12 as a first marking method, and a second marking means 20 that performs a second marking step of applying a second mark MK2 to the semiconductor chip CP to which the first mark MK1 has been applied using an inkjet printer 22 as a second marking method. This marking device EA can achieve the same effects as the above-described embodiment. In this case, an adhesive sheet AS may be laminated on the semiconductor chip CP, and the first marking means 10 and the second marking means 20 can apply the predetermined mark MK to the adhesive sheet AS, thereby applying the predetermined mark MK to the semiconductor chip CP via the adhesive sheet AS.

[0025] 1(B), the semiconductor wafer WF of the present invention may be provided with predetermined marks MK, and the predetermined marks MK may include, for example, first marks MK1 provided by a laser printer 12 as a first providing mode and second marks MK2 provided by an inkjet printer 22 as a second providing mode. By providing such a semiconductor wafer WF, the same effects as those of the above embodiment can be achieved.

[0026] 1(D), the semiconductor chip CP of the present invention may be provided with a predetermined mark MK, and the predetermined mark MK may include a first mark MK1 provided by a laser printer 12 as a first providing form and a second mark MK2 provided by an inkjet printer 22 as a second providing form. By providing such a semiconductor chip CP, it is possible to achieve the same effects as those of the above embodiment.

[0027] The first marking means 10 may employ, as the first marking form, for example, an inkjet printer, a letterpress printer, an intaglio printer, a lithographic printer, a silk screen printer, a screen printer, a thermal printer, a thermal transfer printer, a dot impact printer, or the like. Any device may be employed as long as it can apply the first mark MK1 in a form different from the second marking form. As shown in FIG. 1(E), the first mark MK1 may be applied directly to the wafer WF, or the first mark MK1 may be applied only to the wafer WF or the chip CP, or only to the adhesive sheet AS. Alternatively, the first mark MK1 may be provided on both the wafer WF and the adhesive sheet AS, or the first mark MK1 may be provided on both the chip CP and the adhesive sheet AS, or a predetermined mark MK such as a logo, number, letter, diagram, picture, symbol, etc. may be provided on the wafer WF or the chip CP as the first mark MK1, or a predetermined mark MK used to prevent counterfeiting of the wafer WF or the chip CP may be provided on the wafer WF or the chip CP as the first mark MK1, or the moving means 50 may move the supporting table The first mark MK1 may be applied without stopping the movement of the cable 52, or the XY table 21 may be eliminated from the second marking means 20 by supporting the laser printer 12 as the first application form and the inkjet printer 22 as the second application form with the slider 11A of the XY table 11, or a single mark may be adopted as the first application form, or multiple marks of the same type may be adopted, or multiple marks of different types may be adopted, or there may be no driving device for moving the mark adopted as the first application form, or scattered marks SM may appear. The first marks MK1 may be provided in such a manner that the scattered marks SM do not appear, or the first marks MK1 may be provided so as to straddle each cut line CL as shown in the upper part of FIG. 1(E) and the upper part of FIG. 1(F), or the first marks MK1 may be provided outside the cut lines CL as shown in the lower part of FIG. 1(E), or one or more first marks MK1 may be provided inside the cut lines CL as shown in the lower part of FIG. 1(F), or when the substrate is singulated along the cut lines CL to become a plurality of chips CP,The first marks MK1 may be applied so that they are not applied to each chip CP individually, or if a laser printer is used as the first marking method, the first marks MK1 may be applied by discoloring or developing a color in the laminate, the wafer WF, or the chip CP.

[0028] The second marking means 20 may employ, as the second marking form, for example, a laser printer, a letterpress printer, an intaglio printer, a lithographic printer, a silk screen printer, a screen printer, a thermal printer, a thermal transfer printer, a dot impact printer, or the like. Any device may be employed as long as it can apply the second mark MK2 in a form different from the first marking form. As shown in FIG. 1(E), the second mark MK2 may be applied directly to the wafer WF, or the second mark MK2 may be applied only to the wafer WF or the chip CP, or the second mark MK2 may be applied only to the adhesive sheet AS. Alternatively, the second mark MK2 may be provided on both the wafer WF and the adhesive sheet AS, or the second mark MK2 may be provided on both the chip CP and the adhesive sheet AS, or a predetermined mark MK such as a logo, number, letter, diagram, picture, symbol, etc. may be provided on the wafer WF or the chip CP as the second mark MK2, or a predetermined mark MK used to prevent counterfeiting of the wafer WF or the chip CP may be provided on the wafer WF or the chip CP as the second mark MK2, or the moving means 50 may move the supporting table The second mark MK2 may be applied without stopping the movement of the slider 52, or the XY table 11 may be eliminated from the first marking means 10 by supporting the laser printer 12 as the first marking mode and the inkjet printer 22 as the second marking mode with the slider 21A of the XY table 21, or a single marking mode may be adopted as the second marking mode, or multiple marks of the same type may be adopted, or multiple marks of different types may be adopted, or a driving device for moving the marking mode adopted as the second marking mode may not be required, or a scattered mark SM may be generated. The second marks MK2 may be provided as shown in FIG. 1E and FIG. 1F, or the second marks MK2 may be provided so as to straddle each cut line CL as shown in the upper part of FIG. 1E and FIG. 1F, or the second marks MK2 may be provided outside the cut line CL as shown in the lower part of FIG. 1E, or one or more second marks MK2 may be provided inside the cut line CL as shown in the lower part of FIG. 1F, or when the substrate is divided along the cut line CL into a plurality of chips CP,The second marks MK2 may be applied so that the second marks MK2 are not applied to each chip CP individually, or if a laser printer is used as the second marking method, the second marks MK2 may be applied by discoloring or developing a color in the laminate, the wafer WF, or the chip CP.

[0029] The energy applying means 30 may apply a predetermined energy to the adhesive sheet AS before applying both the first mark MK1 and the second mark MK2 to the wafer WF or the chip CP, or may apply a predetermined energy to the adhesive sheet AS after applying both the first mark MK1 and the second mark MK2 to the wafer WF or the chip CP, or may apply a predetermined energy to the adhesive sheet AS after applying the first mark MK1 to the wafer WF or the chip CP and before applying the second mark MK2 to the wafer WF or the chip CP, or may be provided at a location other than the location shown in the above embodiment, and may be provided anywhere as long as it is a location where a predetermined energy can be applied to the adhesive sheet AS. Alternatively, the moving means 50 may apply the predetermined energy without stopping the movement of the support table 52, or the moving means 50 may apply the predetermined energy by stopping the movement of the support table 52.The predetermined energy may be any energy that applies electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, a heating medium such as hot water or hot air, or a cooling medium such as cold water or cold air, and any energy that applies energy specific to the laminate may be used as long as it is capable of causing a change in the laminate that is specific to that energy, taking into account the characteristics, properties, properties, material, composition and configuration of the laminate, and it may or may not be provided in the marking device EA of the present invention.

[0030] The imaging means 40 may image only the first mark MK1 to form a mark image, or may image only the second mark MK2 to form a mark image, or may image the entire first mark MK1 or the second mark MK2 to form a mark image, or may image a portion of them to form a mark image, or may image the first mark MK1 or the second mark MK2 using an optical sensor to form a mark image, or the moving means 50 may stop the movement of the support table 52 and image a predetermined mark MK to form a mark image, or may also image the scattered marks SM to form a mark image, or may form a mark image without imaging the scattered marks SM, and may or may not be provided in the marking device EA of the present invention.

[0031] The moving means 50 may be a support table 52 that cannot be held by suction on the support surface 52A, and may or may not be provided in the marking device EA of the present invention.

[0032] The marking device EA may include a covering means for performing a covering step of providing a covering material to cover at least one of the first mark MK1 and the second mark MK2. Examples of such a covering means include an adhesive sheet, a pressure-sensitive adhesive sheet, a resin material, paint, varnish, rubber, an adhesive, a pressure-sensitive adhesive, a resin plate, a metal plate, etc. The covering means may be a sheet pasting device or a sheet laminating device that provides an adhesive sheet, a pressure-sensitive adhesive sheet, etc., a sprayer or a transfer roller that provides a resin material, paint, varnish, rubber, an adhesive, a pressure-sensitive adhesive, etc., or a stacker or a mounting device that provides a resin plate, a metal plate, etc. The covering material may cover only the first mark MK1, only the second mark MK2, or both the first mark MK1 and the second mark MK2. Alternatively, the covering material may be provided to cover the entire first mark MK1 or the entire second mark MK2, or to cover only a portion of the first mark MK1 or the second mark MK2. The covering material may be transparent, translucent, or opaque. If the covering material is opaque, the imaging means 40 may employ a camera 41 that can see through the covering material to capture images of the first mark MK1 and the second mark MK2. The marking device EA may also include a laminating means that performs a laminating step of laminating a laminate on the semiconductor wafer WF or the semiconductor chip CP. In this case, for example, in the marking device EA, after the semiconductor wafer WF or chip CP without a laminate on it is placed on the support surface 52A, the laminating means may laminate a laminate on the wafer WF or chip CP before the wafer WF or chip CP reaches the first mark application position MP1.

[0033] The laminate may be any material, such as an adhesive sheet, a pressure-sensitive adhesive sheet, a resin material, paint, varnish, rubber, adhesive, pressure-sensitive adhesive, a resin plate, a metal plate, etc., and may be laminated on only one side of the wafer WF or chip CP, or on only the other side of the wafer WF or chip CP, or on both one and the other sides of the wafer WF or chip CP, or may not be laminated on the wafer WF or chip CP, or may be laminated on the wafer WF or chip CP after a predetermined mark MK has been applied to the wafer WF or chip CP, or may be one that causes a change specific to the predetermined energy applied by the energy application means 30, or one that causes a change specific to another energy applied by another energy application means, in which case the marking device AE may be equipped with another energy application means. The change specific to the predetermined energy or the change specific to the other energy that is caused in the laminate by the predetermined energy or the other energy may be any change, such as hardening, softening, shrinkage, expansion, vaporization, liquefaction, solidification, discoloration, oxidation, penetration, fixation, a decrease in adhesive strength, or an increase in adhesive strength. At least one of the first mark MK1 and the second mark MK2 may undergo a change specific to the predetermined energy when applied by the energy application means 30, or may undergo a change specific to the other energy when applied by another energy application means. In this case, the marking device AE may be equipped with another energy application means. Note that the change specific to the predetermined energy or the change specific to the other energy that is caused in at least one of the first mark MK1 and the second mark MK2 may be any change, such as hardening, softening, shrinkage, expansion, vaporization, liquefaction, solidification, discoloration, oxidation, penetration, fixation, a decrease in adhesive strength, or an increase in adhesive strength. The scattered marks SM may be both visible to the naked eye and invisible to the naked eye, or may be only visible to the naked eye, or may be only invisible to the naked eye.The wafer WF may be cut along cut lines CL from the state shown in the upper part of Fig. 1(E) to form chips CP as shown in Fig. 1(G), or may be cut along cut lines CL from the state shown in the upper part of Fig. 1(F) to form chips CP as shown in Fig. 1(H). An orientation flat or a V-notch indicating the orientation may be formed on the outer edge, or an orientation flat or a V-notch may not be formed on the outer edge, and a circuit may or may not be formed on the chip. The chips CP may be formed by not cutting the wafer WF along cut lines CL, but may have predetermined marks MK as shown in Fig. 1(G) or 1(H), or may or may not have a circuit.

[0034] The next process may be any process, such as a plating process, a cleaning process, an etching process, a dipping process, a cutting process, an oxide film forming process, a nitriding process, a grinding process, a sandblasting process, a polishing process, a painting process, a laminating process, a sheet bonding process, a surface treatment process, a drilling process, a bending process, an inspection process, a verification process, an irradiation process, etc.

[0035] The materials, types, shapes, etc. of the coating material, laminate, wafer WF, and chip CP in the present invention are not particularly limited. For example, the coating material, laminate, wafer WF, and chip CP may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes, and at least one of the coating material and laminate may be pressure-sensitive adhesive, heat-sensitive adhesive, or other adhesive. When a heat-sensitive adhesive is used, the coating or laminate may be formed by an appropriate method, such as providing a heating means, such as a coil heater or the heating side of a heat pipe, for heating the heat-sensitive adhesive. Furthermore, when an adhesive sheet or pressure-sensitive adhesive sheet is used as such a covering material or laminate, the adhesive sheet or pressure-sensitive adhesive sheet may be, for example, a single layer consisting of only an adhesive layer or pressure-sensitive adhesive layer, a two-layer structure consisting of a substrate and an adhesive layer or a substrate and a pressure-sensitive adhesive layer, a three-layer structure or more layers consisting of one or more intermediate layers laminated between the substrate and the adhesive layer or between the substrate and the pressure-sensitive adhesive layer, a three-layer structure or more layers consisting of one or more cover layers laminated on the top surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are releasably provided, a double-sided adhesive sheet or double-sided pressure-sensitive adhesive sheet consisting of only an adhesive layer or pressure-sensitive adhesive layer, a double-sided adhesive sheet or double-sided pressure-sensitive adhesive sheet in which an adhesive layer or pressure-sensitive adhesive layer is laminated on both outermost surfaces of one or more intermediate layers, etc. Furthermore, examples of the wafer WF include, for example, a silicon semiconductor wafer and a compound semiconductor wafer, and examples of the semiconductor chip CP include, for example, a silicon semiconductor chip and a compound semiconductor chip. The covering material or laminate may be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. The size relationship between the covering material, the laminate, and the wafer WF and the size relationship between the covering material, the laminate, and the chip CP may be any size relationship, such as one being the largest, all being the same size, any two being the same size, or all being different sizes.

[0036] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0037] In the above-described embodiments, there is a certain object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A. In other words, object A and object B that move relatively may be such that object B moves relative to object A, which is stationary, or object A may move relative to object B, which is stationary, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a supporting (holding) means or a supporting (holding) member that supports (holds) a supported member (held member) is used, a configuration may be adopted in which the supported member is supported (held) by a gripping means such as a chuck motor or a chuck cylinder, Coulomb force, an adhesive (adhesive sheet, adhesive tape), a pressure-sensitive adhesive (adhesive sheet, adhesive tape), a magnetic force, Bernoulli adsorption, suction adsorption, a driving device, or the like.

[0038] EA...marking device 10...first marking means 12...laser printer (first marking mode) 20...second marking means 22...inkjet printer (second marking mode) 30...energy applying means 40...imaging means AS...adhesive sheet (laminate) CP...semiconductor chip MK...predetermined mark MK1...first mark MK2...second mark UV...ultraviolet light (predetermined energy) WF...semiconductor wafer

Claims

1. A marking device for applying a predetermined mark to a semiconductor wafer or a semiconductor chip, comprising: a first marking means for applying a first mark to the semiconductor wafer or the semiconductor chip in a first application manner; and a second marking means for applying a second mark in a second application manner to the semiconductor wafer or the semiconductor chip to which the first mark has been applied by the first marking means.

2. The marking device according to claim 1, characterized in that a laminate is laminated on the semiconductor wafer or the semiconductor chip, and at least one of the first marking means and the second marking means applies the specified mark to the laminate, thereby applying the specified mark to the semiconductor wafer or the semiconductor chip through the laminate.

3. The marking device according to claim 2, characterized in that the laminate undergoes a change specific to the given energy when a given energy is applied thereto, and further comprising an energy application means for applying the given energy to the laminate.

4. A marking device as described in claim 1 or claim 2, characterized in that it is provided with an imaging means for imaging at least one of the first mark and the second mark to form a mark image and outputting the mark image to another device.

5. A marking device according to claim 1 or 2, further comprising a covering means for providing a covering material so as to cover at least one of said first mark and said second mark.

6. A marking method for applying a predetermined mark to a semiconductor wafer or a semiconductor chip, comprising: a first marking step of applying a first mark to the semiconductor wafer or the semiconductor chip in a first application form; and a second marking step of applying a second mark in a second application form to the semiconductor wafer or the semiconductor chip to which the first mark has been applied in the first marking step.

7. A semiconductor wafer having a predetermined mark applied thereto, the predetermined mark including a first mark applied by a first application form and a second mark applied by a second application form.

8. A semiconductor chip having a predetermined mark applied thereto, the predetermined mark including a first mark applied by a first application form and a second mark applied by a second application form.

Images