Composite laser processing mechanism and composite laser processing method

Abstract

A composite laser processing mechanism and a composite laser processing method. The composite laser processing mechanism comprises: a conveying mechanism (101) used for conveying a material belt (102); a composite laser emitting mechanism (103) used for emitting at least two laser beams to perform composite processing on the material belt (102), so as to form a plurality of processing trajectories on the material belt (102), wherein the plurality of processing trajectories are respectively formed by processing the material belt (102) by different laser beams emitted by the composite laser emitting mechanism (103); and a first suction mechanism (104) and a second suction mechanism (105) respectively disposed at an upstream position and a downstream position of a laser projection area close to the material belt (102), the upstream position, the downstream position and the laser projection area being located on a same plane, and the first suction mechanism (104) and the second suction mechanism (105) being used for suctioning the material belt (102).

Description

Composite laser processing mechanism and composite laser processing method

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202311507702.4 filed on November 13, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of laser processing technology, and in particular to a composite laser processing mechanism and a composite laser processing method. Background Art

[0004] Laser processing equipment is an important equipment currently used in product processing, cleaning, punching, engraving and other fields. It focuses the laser and irradiates it onto the material strip, using the high temperature of the laser to melt or vaporize parts of the material strip, thereby processing a specific shape on the material strip or cutting the material strip to give it a specific contour.

[0005] In relevant technologies, laser processing equipment is often equipped with a single single optical path system to process the material strip or multiple single optical path systems to process the material strip in sections. The former requires that when the material strip is conveyed to the processing area, the laser spot projected on the material strip must be controlled to move quickly in a short time to complete the complete processing trajectory. This processing method has high requirements on laser power and is limited by the maximum speed of the galvanometer. Under the working condition of high-speed material strip transmission, it is difficult for the laser to complete the complete processing trajectory in a short time. The latter requires multiple single optical path systems to cooperate with each other, and each single optical path system processes the material strip at different stages of the material strip transmission. Under the working condition of high-speed material strip transmission, its processing stability is poor, the process compatibility is low, and the implementation cost is high.

[0006] Summary of the Invention

[0007] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0008] To solve the above problems, the embodiments of the present application propose a composite laser processing mechanism and a composite laser processing method, in which at least two laser beams are emitted by the composite laser emitting mechanism to perform composite processing on the material strip, thereby improving the stability and compatibility of the laser processing process under high-speed material strip transmission conditions and reducing the implementation cost.

[0009] In a first aspect, an embodiment of the present application provides a composite laser processing mechanism, comprising:

[0010] A conveying mechanism, used for conveying the material belt;

[0011] a composite laser emitting mechanism, configured to emit at least two laser beams to perform composite processing on the material strip, so as to form a plurality of processing tracks on the material strip, wherein the plurality of processing tracks are formed by processing the material strip with different laser beams emitted by the composite laser emitting mechanism;

[0012] The first adsorption mechanism and the second adsorption mechanism are respectively arranged at the upstream position and the downstream position of the laser projection area close to the material belt, and the upstream position, the downstream position and the laser projection area are in the same plane. The first adsorption mechanism and the second adsorption mechanism are used to adsorb the material belt, wherein the laser projection area is the area where at least two laser beams emitted by the composite laser emitting mechanism are projected onto the material belt.

[0013] In some embodiments, the composite laser emitting mechanism includes a field mirror, at least two laser injection holes and at least two laser reflecting mechanisms, the laser reflecting mechanism includes a first reflecting component and a second reflecting component, the first reflecting component is used to reflect the laser from the laser injection hole to the second reflecting component, the second reflecting component is used to reflect the laser reflected from the first reflecting component to the field mirror, and the field mirror is used to focus the laser and then emit it to the material strip.

[0014] In some embodiments, the sizes of the light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism and projected on the material strip are different, or the sizes of the light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism and projected on the material strip are the same; the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism focused in the thickness direction of the material strip are different, or the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism and focused in the thickness direction of the material strip are the same; the positions of the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism and projected on the material strip overlap, or there is a distance between the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism and projected on the material strip.

[0015] In some embodiments, the laser emitted by the composite laser emitting mechanism includes at least a first laser beam and a second laser beam, and the first laser beam and the second laser beam process the material strip in the following manner:

[0016] The first laser beam and the second laser beam respectively form a first processing track and a second processing track that do not overlap on the material strip;

[0017] Alternatively, the first laser beam and the second laser beam simultaneously form a first processing track and a second processing track that overlap on the material strip;

[0018] Alternatively, the first laser beam and the second laser beam successively form a first processing track and a second processing track on the material strip, and the first processing track and the second processing track overlap.

[0019] A second aspect of the present application provides a composite laser processing method, which is applied to the composite laser processing mechanism described in any one of the first aspect embodiments. The method includes:

[0020] Obtain laser processing requirements;

[0021] Determining the power and depth of field of each laser beam emitted by the composite laser emission mechanism, as well as the size of the light spot and the sub-processing trajectory formed by each laser beam projected on the material strip according to the laser processing requirements;

[0022] Controlling the composite laser emitting mechanism to emit the laser beams correspondingly toward the material strip according to the power, depth of field and spot size of each laser beam;

[0023] The propagation direction of each laser beam is controlled according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, wherein each processing trajectory is formed by a different laser beam emitted by the composite laser emission mechanism.

[0024] In some embodiments, the laser processing requirements include at least one of a laser processing trajectory, a laser processing process, and a laser processing method. The laser processing process includes at least one of laser cutting, laser cleaning, laser engraving, laser drilling, and laser marking. The laser processing method includes at least one of segmented processing, joint processing, and follow-up processing.

[0025] In some embodiments, determining the power and depth of field of each laser beam emitted by the composite laser emission mechanism, and the spot size and sub-processing trajectory formed by each laser beam projected on the material strip according to the laser processing requirements includes:

[0026] determining the power and depth of field of each laser beam emitted by the composite laser processing mechanism according to the laser processing process;

[0027] Determining a sub-processing trajectory of each laser beam emitted by the composite laser emitting mechanism according to the laser processing trajectory and the laser processing mode;

[0028] The size of the light spot formed by each laser beam projected onto the material strip is determined according to the laser processing technology and / or the laser processing method.

[0029] In some embodiments, the laser processing method is segmented processing, the composite laser emission mechanism includes multiple reflective components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, including:

[0030] Determining a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emitting mechanism, the sub-processing trajectories and the laser beams correspond one to one, and all the sub-processing trajectories are combined to form the laser processing trajectory;

[0031] The inclination of each of the reflective components is adjusted according to all the sub-processing tracks, so that the light spot formed by each laser beam projected on the material strip moves according to the corresponding sub-processing track.

[0032] In some embodiments, the laser processing method is joint processing, the composite laser emission mechanism includes multiple reflective components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, including:

[0033] Determining a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emission mechanism, the sub-processing trajectories and the laser beams correspond one to one, and each sub-processing trajectory overlaps with the laser processing trajectory;

[0034] The inclination of each of the reflective components is adjusted according to the sub-processing trajectory so that all the laser beams emitted by the composite laser processing mechanism converge to form overlapping light spots and then process the material strip together.

[0035] In some embodiments, the processing method is follow-up processing, the composite laser emission mechanism includes multiple reflective components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, including:

[0036] Determining a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emission mechanism, the sub-processing trajectories and the laser beams correspond one to one, and each sub-processing trajectory is parallel to the laser processing trajectory;

[0037] The inclination of each of the reflective components is adjusted according to the sub-processing trajectory, so that the light spots formed by the multiple laser beams emitted by the composite laser emitting mechanism and projected on the material move successively along the sub-processing trajectory.

[0038] The embodiments of the present application propose a composite laser processing mechanism and a composite laser processing method, wherein the composite laser processing mechanism includes: a conveying mechanism for conveying a material belt; a composite laser emitting mechanism for emitting at least two laser beams to perform composite processing on the material belt, so as to form multiple processing tracks on the material belt, wherein the multiple processing tracks are respectively formed by processing the material belt with different laser beams emitted by the composite laser emitting mechanism; a first adsorption mechanism and a second adsorption mechanism, respectively arranged at an upstream position and a downstream position of a laser projection area close to the material belt, wherein the upstream position, the downstream position and the laser projection area are in the same plane, and the first adsorption mechanism and the second adsorption mechanism are used to adsorb the material belt, wherein the laser projection area is an area where at least two laser beams emitted by the composite laser emitting mechanism are projected onto the material belt. Based on this, the embodiment of the present application performs composite processing on the material strip by emitting at least two laser beams through a composite laser emitting mechanism, which can avoid the problem that single-segment processing is prone to uncutting and is easily limited by the maximum speed of the galvanometer and cannot form a complete processing trajectory in the short time when the material strip passes through the processing area. It also does not require multiple laser processing mechanisms to cooperate with each other, thereby improving the processing stability under high-speed conveying conditions of the material strip and reducing the cost of achieving stable processing under high-speed conveying conditions of the material strip.

[0039] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. The purposes and other advantages of the present application can be achieved and obtained through the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a schematic structural diagram of a composite laser processing mechanism provided in an embodiment of the present application;

[0041] 2a to 2j are schematic diagrams of different light spots generated by a composite laser emitting mechanism according to an embodiment of the present application;

[0042] FIG3 is a schematic structural diagram of a composite laser processing mechanism provided in an embodiment of the present application;

[0043] FIG4 is a flow chart of a composite laser processing method provided in an embodiment of the present application;

[0044] FIG5 is a sub-flow chart of step S402 of FIG4;

[0045] FIG6 is a diagram showing a processing trajectory of a material strip processed using a composite laser processing mechanism according to an embodiment of the present application;

[0046] 7a to 7f are schematic diagrams of cutting trajectories for cutting a material strip and processing a tab using the composite laser processing mechanism provided in an embodiment of the present application;

[0047] 8a to 8e are schematic diagrams of processing a material strip using the composite laser processing mechanism provided in an embodiment of the present application.

[0048] The accompanying drawings are used to provide a further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0050] It should be understood that in the description of the embodiments of this application, "multiple" (or multiple) means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, and "above," "below," and "within" are understood to include the number itself. The use of "first," "second," and the like in the description is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features, or implicitly indicating the order of the indicated technical features.

[0051] In view of the problems in related technologies that single-segment processing is easy to be cut, segmented processing requires multiple processing mechanisms to cooperate with each other, the processing process is unstable under the condition of high-speed conveying of the material belt, and the implementation cost is high. The embodiment of the present application provides a composite laser processing mechanism, including: a conveying mechanism for conveying the material belt; a composite laser emitting mechanism for emitting at least two laser beams to perform composite processing on the material belt to form multiple processing tracks on the material belt, wherein the multiple processing tracks are respectively formed by processing the material belt with different laser beams emitted by the composite laser emitting mechanism; a first adsorption mechanism and a second adsorption mechanism, respectively arranged at an upstream position and a downstream position of a laser projection area close to the material belt, the upstream position, the downstream position and the laser projection area are in the same plane, the first adsorption mechanism and the second adsorption mechanism are used to adsorb the material belt, wherein the laser projection area is an area where at least two laser beams emitted by the composite laser emitting mechanism are projected on the material belt.

[0052] Referring to Figure 1, the conveying mechanism 101 is used to convey the material belt 102. During the processing, as the conveying mechanism 101 rotates, the material belt 102 is pulled by the conveying mechanism 101 and conveyed. The conveying mechanism 101 can work continuously, for example, in the scenario of cutting battery tabs; the conveying mechanism 101 can also work periodically, for example, in the scenario of laser cleaning and laser drilling, the composite laser emitting mechanism 103 periodically emits at least two laser beams in the direction of the material belt 102, and the moving trajectories of the two laser beams are independent of each other.

[0053] 1 , the composite laser emitting mechanism 103 is used to emit at least two laser beams in the direction of the material strip 102 to perform composite processing on the material strip 102, so as to form multiple processing tracks on the material strip 102. The multiple processing tracks may be completely overlapped, partially overlapped, or not overlapped at all. Specifically, it needs to be determined according to actual processing requirements. For example, if a pole ear with a first depth needs to be cut on the material strip 102, the laser emitted by the composite laser emitting mechanism 103 includes a first laser beam and a second laser beam. The first laser beam first moves from the outside of the material strip 102 to the inside of the material strip 102 along the width direction of the material strip 102, and stops irradiating when it moves to the position of the first depth to form a pole ear. The first side of the material strip 102 is cut by the second laser beam, and the second laser beam directly starts to process the material strip 102 at the first depth position of the material strip 102. As the material strip 102 is continuously conveyed, the second laser beam cuts the bottom edge of the pole ear at the first depth position, and then moves along the width direction of the material strip 102 along the inside of the material strip 102 toward the outside of the material strip 102, and cooperates with the conveying mechanism 101 to pull the material strip 102 to move, and process the second side of the pole ear on the material strip 102. It can be understood that the first side, bottom edge and second side here are connected in sequence. In this way, the material strip 102 can be compositely processed by the two laser beams emitted by the composite laser emitting mechanism 103, and the outline of the pole ear can be cut on the material strip 102. In this embodiment, two laser beams are emitted by a composite laser mechanism to perform composite processing on the material strip 102. On the one hand, it avoids the problem that the material strip 102 cannot be cut due to single-segment processing of the traditional single-optical path system and is easily limited by the maximum speed of the field mirror, and cannot stably form a complete processing trajectory under the condition of high-speed transmission of the material strip 102. On the other hand, there is no need for multiple optical path systems to process the material strip 102 respectively at different stages of the material strip 102 transmission. In this way, there is no need for multiple laser processing mechanisms to cooperate with each other, and the material strip 102 can be stably composite processed under the condition of high-speed transmission of the material strip 102. In this embodiment, two laser beams are emitted by a composite laser emitting mechanism 103 to process a first processing track and a second processing track on the material strip 102 respectively. In this way, the processing track formed by each laser beam is shorter than the complete tab profile. Under the same working conditions, the required laser power is lower. In this way, the heat effect caused by the laser processing is smaller and the metal leakage is less. Without changing the laser power, the time required to process the complete tab profile is shorter. Therefore, the material strip 102 can be supported to operate at a higher speed transmission condition, thereby improving the processing stability of the material strip 102 under the high-speed transmission condition.

[0054] Referring to Figure 1, in an embodiment of the present application, a first adsorption mechanism 104 and a second adsorption mechanism 105 are respectively set at the upstream position and the downstream position of the laser projection area close to the material belt 102. It can be understood that the laser projection area refers to the area projected on the material belt 102 by the composite laser emitting mechanism 103. In this embodiment, a first adsorption mechanism 104 and a second adsorption mechanism 105 are respectively set at the upstream position and the downstream position of the laser projection area. When the material belt 102 is conveyed to the laser projection area, the two ends of this part of the material belt 102 are respectively adsorbed by the first adsorption mechanism 104 and the second adsorption mechanism 105, which can keep the position of the material belt 102 relatively stable when passing through the laser projection area, avoid the shaking of the material belt 102 caused by wind or other factors, improve the stability of the processing trajectory formed by the laser processing material belt 102, and improve the stability of the laser processing.

[0055] In some embodiments, the first adsorption mechanism 104 and the second adsorption mechanism 105 are arranged on the same side in the thickness direction of the material strip 102. For example, the first adsorption mechanism 104 and the second adsorption mechanism 105 are both arranged on the side of the material strip 102 facing the composite laser emitting mechanism 103 in the thickness direction, or the first adsorption mechanism 104 and the second adsorption mechanism 105 are both arranged on the side of the material strip 102 facing away from the composite laser emitting mechanism 103 in the thickness direction. Based on this, the first adsorption mechanism 104 and the second adsorption mechanism 105 can adsorb the material strip 102 in the same direction, which can better adsorb the material strip 102 and thus fix the material strip 102, so that the material strip 102 can maintain a stable shape when passing through the laser projection area, thereby improving the stability of laser processing.

[0056] In some embodiments, the composite laser emitting mechanism 103 includes a field lens, at least two laser injection holes, and at least two laser reflection mechanisms. The laser injection holes correspond to the laser reflection mechanisms in a one-to-one manner. The laser reflection mechanisms include a first reflection component and a second reflection component. Laser light enters the composite laser emitting mechanism 103 through the laser injection hole. The first reflection component is used to reflect the laser light entering the laser injection hole to the second reflection component. The second reflection component then reflects the laser light to the position of the field lens. After being focused by the field lens, the laser light is emitted toward the material strip 102, and the laser light is projected onto the material strip 102 to form a laser projection area. It is understood that the composite laser emitting mechanism 103 may also include a mounting housing, the laser reflection mechanism is fixed inside the mounting housing, and the laser injection hole is defined on the outer wall of the housing. The two laser injection holes can be defined at different locations on the mounting housing. For example, if the mounting housing is a rectangular parallelepiped housing, the two laser injection holes can be defined on the same side wall of the mounting housing, or the two laser injection holes can be defined on two adjacent side walls of the mounting housing, or the two laser injection holes can be defined on two opposing side walls of the mounting housing. It is understandable that the mounting housing may also be spherical, pyramidal, or other shapes, which are not limited in this embodiment. At least two laser reflection mechanisms operate independently, and can form multiple laser beams to perform composite processing on the material strip 102 according to actual processing requirements.

[0057] In some embodiments, the spot sizes formed by the at least two laser beams emitted by the composite laser emitting mechanism 103 and projected onto the material strip 102 are different, or the spot sizes formed by the at least two laser beams emitted by the composite laser emitting mechanism 103 and projected onto the material strip 102 are the same. Specifically, different spot sizes are required for different actual processing requirements. For example, when a specified texture needs to be planned on the surface of the material strip 102 by laser, and the texture is composed of processing tracks of different widths, or when rough processing needs to be performed first by a laser beam with a larger spot and then fine processing needs to be performed by a laser beam with a smaller spot, the composite laser emitting mechanism 103 needs to emit two laser beams to form spots of different sizes on the material strip 102.

[0058] In some embodiments, the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism 103 in the thickness direction of the material strip 102 are different, or the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism 103 in the thickness direction of the material strip 102 are the same. Specifically, depending on actual processing requirements, the depths of field of the laser beams focused on the material strip 102 may also be different. Specifically, for example, when a hole is to be drilled in a material strip 102 of a certain thickness using a laser, laser beams with different depths of field are required depending on the depth of the hole.

[0059] In some embodiments, the positions of the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism 103 on the material strip 102 overlap, or the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism 103 on the material strip 102 are separated by a distance. Specifically, the light spots formed by the two laser beams on the material strip 102 may overlap, so that the material strip 102 can be processed by the two laser beams together, which can reduce the power requirement for each laser beam. Alternatively, the light spots formed by the two laser beams on the material strip 102 are separated by a distance, and the two laser beams cut the material strip 102 to form two processing tracks. In this way, each laser beam only needs to complete a portion of the processing track, which is more efficient than completing the entire processing track by a single laser beam.

[0060] The laser emitted by the composite laser emitting mechanism 103 includes at least a first laser beam and a second laser beam. The manner in which the first laser beam and the second laser beam process the material strip 102 includes: the first laser beam and the second laser beam respectively form a first processing track and a second processing track that do not overlap on the material strip 102; specifically, the first laser beam and the second laser beam can be projected onto different positions of the material strip 102, respectively. During the processing, the first laser beam and the second laser beam respectively move along different tracks, and cooperate with the conveying mechanism 101 to pull the material strip 102, forming a first processing track and a second processing track that do not overlap on the material strip 102. The first processing track and the second processing track together constitute a complete processing track. In this way, each laser beam emitted by the composite laser emitting mechanism 103 only needs to process a part of the processing track on the material strip 102. Compared with the single laser processing solution, the processing track required to be formed by each laser beam is shorter, and the processing time is shorter, which can support the material strip 102 to be conveyed at a higher speed.

[0061] In some embodiments, the first laser beam and the second laser beam simultaneously form overlapping first processing tracks and second processing tracks on the material tape 102; it can be understood that the light spots formed by the first laser beam and the second laser beam projected on the material tape 102 overlap, so that the same position of the material tape 102 is processed together by the two laser beams at the same time, thereby improving the efficiency of processing the material tape 102 and supporting the material tape 102 to run at a higher transmission rate.

[0062] In some embodiments, the first laser beam and the second laser beam successively form a first processing track and a second processing track on the material strip 102, and the first processing track and the second processing track overlap. Specifically, in the conveying direction of the material strip 102, the first laser beam first starts to process the material strip 102 at the upstream position of the second laser beam to form a complete processing track, and the second laser beam performs secondary processing on the processing track formed by the first laser beam at the downstream position of the first laser beam. It can be understood that the first light spot formed by the first laser beam projected on the material strip 102 can be larger than the second light spot formed by the second laser beam projected on the material strip 102. In this way, the material strip 102 is first roughly processed by the first laser beam and then finely processed by the second laser beam, which can avoid defects caused by inadequate processing of the first material strip 102, resulting in unqualified products.

[0063] 2a to 2j, taking the example of the composite laser emitting mechanism 103 emitting two laser beams, and the two laser beams being projected onto the material strip 102 to form a first light spot and a second light spot, FIG2a shows that the depth of field of the first light spot and the second light spot respectively formed by the two laser beams are the same, the spot sizes are different, and there is a distance between the first light spot and the second light spot; FIG2b shows that the depth of field and the spot size of the first light spot and the second light spot respectively formed by the two laser beams are the same, and there is a distance between the first light spot and the second light spot; FIG2c shows that the depth of field of the first light spot and the second light spot respectively formed by the two laser beams are the same, the spot sizes are different, and the first light spot and the second light spot coincide with each other; FIG2d shows that the depth of field and the spot size of the first light spot and the second light spot respectively formed by the two laser beams are the same, and the first light spot and the second light spot coincide with each other; FIG2e shows that the depth of field of the first light spot and the second light spot respectively formed by the two laser beams are different, the spot sizes are different, and the position of the first light spot and the second light spot coincide with each other ; Figure 2f shows that the depths of field of the first light spot and the second light spot respectively formed by the two laser beams are different, the spot sizes are the same, and the first light spot and the second light spot coincide with each other; Figure 2g shows that the depths of field of the first light spot and the second light spot respectively formed by the two laser beams are the same, the spot sizes are different, the first light spot and the second light spot are separated by a distance, and the distance between the first light spot and the second light spot is larger than that in Figure 2a; Figure 2h shows that the depths of field and the spot sizes of the first light spot and the second light spot respectively formed by the two laser beams are the same, the first light spot and the second spot are separated by a distance, and the distance between the first light spot and the second spot is larger than that in Figure 2a; Figure 2i shows that the spot sizes and depths of field of the first light spot and the second light spot respectively formed by the two laser beams are different, and the first light spot and the second spot are separated by a distance; Figure 2j shows that the depths of field of the first light spot and the second light spot respectively formed by the two laser beams are different, the spot sizes are the same, and the first light spot and the second spot are separated by a distance.

[0064] 3 , in some embodiments, the composite laser processing mechanism further includes a light blocking device 201. The light blocking device 201 is provided with a first slit and a second slit at both ends along the length direction of the material strip 102. The material strip 102 passes through the light blocking device 201 through the first slit and the second slit. The light blocking device 201 is provided with a first opening on the side facing the composite laser emitting mechanism 103. At least two laser beams emitted by the composite laser emitting mechanism 103 are transmitted through the first opening into the interior of the light blocking device 201, and the portion of the material strip 102 within the light blocking device 201 is laser processed. It is understood that the sidewalls of the light blocking device 201 can be made of non-ferrous metal, silicon carbide, or a material with an optical coating. The sidewalls of the light blocking device 201 have good anti-laser ablation properties, which can prevent the laser from penetrating the material strip 102 and then being emitted, posing a safety hazard.

[0065] 3 , in some embodiments, the conveying mechanism 101 includes a first transmission roller 401 and a second transmission roller 402. In the conveying direction of the material belt 102, the first transmission roller 401 is located upstream of the first adsorption mechanism 104, and the second transmission roller 402 is located downstream of the second adsorption mechanism 105. It can be understood that the first transmission roller 401 and the second transmission roller 402 can be cylindrical, and the material belt 102 fits tightly with the first transmission roller 401 and the second transmission roller 402. The friction between the material belt 102 and the first transmission roller 401 and the second transmission roller 402 is utilized, and the material belt 102 is rotated by rotating the transmission rollers, thereby realizing the transmission of the material belt 102.

[0066] In some embodiments, the first adsorption mechanism 104 and the second adsorption mechanism 105 are both housed within the light blocking device 201. In the conveying direction of the material strip 102, the first adsorption mechanism 104 is located upstream of the first opening, and the second adsorption mechanism 105 is located downstream of the first opening. The laser light emitted by the composite laser emitting mechanism 103 is emitted from the first opening into the light blocking device 201. By housing the first adsorption mechanism 104 and the second adsorption mechanism 105 within the light blocking device 201, the first adsorption mechanism 104 and the second adsorption mechanism 105 can be directly fixed to the inner sidewall of the light blocking device 201 without the need for an additional fixing mechanism to fix the first adsorption mechanism 104 and the second adsorption mechanism 105.

[0067] 3 , in some embodiments, the light blocking device 201 is provided with a second opening on one side along the width direction of the material strip 102, and the composite laser processing mechanism further includes a side suction mechanism 301, the side suction mechanism 301 including a side suction pipe and a negative pressure device, the negative pressure device being used to form a negative pressure zone, and the negative pressure device being connected to the first opening via the side suction pipe. After the negative pressure device forms the negative pressure zone, an air pressure difference is generated between the negative pressure device and the interior of the light blocking device 201. Under the action of this air pressure difference, fine suspended particles such as dust generated by laser processing of the material strip 102 inside the light blocking device 201 will be sucked into the side suction pipe, thereby cleaning the suspended particles of dust inside the light blocking device 201 and preventing these suspended particles from accumulating inside the light blocking device 201, causing the laser to be scattered inside the light blocking device 201, thereby affecting the laser processing effect.

[0068] In some embodiments, the composite laser processing mechanism also includes a material guiding mechanism 302. In the transmission direction of the material belt 102, the material guiding mechanism 302 is arranged between the second adsorption mechanism 105 and the second transmission roller 402. The material guiding mechanism 302 is connected to the light blocking device 201 and is used to clear the material processed from the material belt 102 inside the light blocking device 201. It can be understood that after the material belt 102 is processed by the laser, the processed material will form waste and separate from the material belt 102. After the laser processes the material belt 102 to generate waste, the waste will fall to the bottom of the light blocking device 201 and then enter the material guiding mechanism 302 connected to the interior of the light blocking device 201, thereby cleaning the material processed from the material belt 102 inside the light blocking device 201 and avoiding the accumulation of waste inside the light blocking device 201.

[0069] 4 , an embodiment of the present application further proposes a composite laser processing method, including but not limited to steps S401 to S402 .

[0070] Step S401: Obtain laser processing requirements.

[0071] It can be understood that the laser processing requirements include at least one of the laser processing trajectory, the laser processing process, and the laser processing method. The laser processing trajectory is used to indicate the complete processing trajectory formed by the laser projected on the surface of the material strip; the laser processing process includes at least one of laser cutting, laser cleaning, laser engraving, laser drilling, and laser marking, that is, the composite laser processing mechanism can only perform one of the laser processing processes, or it can perform multiple laser processing processes at the same time, for example, controlling multiple laser beams to simultaneously perform laser cutting and laser cleaning on the material strip; the laser processing method includes at least one of segmented processing, joint processing, and follow-up processing. For example, the composite laser emission mechanism can simultaneously emit four laser beams, namely the first laser beam, the second laser beam, the third laser beam, and the fourth laser beam. The first laser beam and the second laser beam are segmented and processed to form the first sub-processing trajectory and the second sub-processing trajectory respectively. The first sub-processing trajectory and the second sub-processing trajectory constitute a complete laser processing trajectory. The third laser beam and the first laser beam are processed together, and the fourth laser beam and the second laser beam are processed follow-up.

[0072] Step S402 , determining the power and depth of field of each laser beam emitted by the composite laser emitting mechanism, as well as the spot size and sub-processing trajectory formed by each laser beam projected on the material strip according to the laser processing requirements.

[0073] Referring to FIG1 , the composite laser emitting mechanism (103) can emit at least two laser beams simultaneously, and the laser beams are projected onto the material strip to form at least two light spots, each of which can move independently, thereby forming corresponding multiple processing tracks on the material strip. It is understood that each laser beam can be set with different power, depth of field, and light spot size according to actual laser processing requirements, and the light spot formed by each laser beam projected onto the material strip can also move along different sub-processing tracks according to the laser processing requirements.

[0074] Step S403 , controlling the composite laser emitting mechanism to emit a corresponding laser beam toward the material strip according to the power, depth of field and spot size of each laser beam.

[0075] It can be understood that after determining the power, depth of field and spot size of the laser beam, a laser beam of corresponding power and divergence can be generated based on the power, depth of field and spot size of each laser beam. After the laser beam is emitted from the laser input hole into the composite laser emitting mechanism, it is reflected by the galvanometer and focused by the field lens and then emitted, and projected onto the material strip to form a spot with corresponding depth of field and corresponding size.

[0076] Step S404 , controlling the propagation direction of each laser beam according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, wherein each processing trajectory is formed by a different laser beam emitted by the composite laser emission mechanism.

[0077] During the process of laser propagation and irradiation of the material strip, the inclination of each galvanometer of the composite laser emission mechanism is adjusted based on the sub-processing trajectory corresponding to each laser beam. This can change the propagation direction of each laser beam, so that the light spot formed by the laser beam projected on the material strip moves according to the corresponding sub-processing trajectory.

[0078] Specifically, the composite laser emission mechanism includes a plurality of reflective components, which are arranged inside the composite laser emission mechanism. After the laser beam enters the composite laser emission mechanism through the laser injection hole, it will be reflected multiple times by the reflective components inside the composite laser emission mechanism and then emitted in the direction of the material strip. By adjusting the inclination of each reflective component, the propagation direction of the laser beam can be changed, so that the position of the light spot formed by the laser beam projected on the material strip changes. When the laser processing method is segmented processing, multiple sub-processing trajectories are determined according to the laser processing trajectory, wherein the number of sub-processing trajectories is determined according to the number of laser beams emitted by the composite laser emission mechanism, and the sub-processing trajectories and laser beams correspond one to one. All sub-processing trajectories are merged to form a laser processing trajectory; the inclination of each reflective component of the composite laser emission mechanism is adjusted according to all sub-processing trajectories, so that the light spot formed by each laser beam projected on the material strip moves according to the corresponding sub-processing trajectory. At this time, by dividing the complete laser processing trajectory into multiple non-overlapping sub-processing trajectories, each laser moves according to a corresponding sub-processing trajectory, and processes the corresponding sub-processing trajectory on the material strip. Specifically, when the laser processing method is segmented processing, the complete laser processing trajectory can be divided into multiple non-overlapping sub-processing trajectories, so that each laser beam processes one segment thereof. At this time, each laser beam only needs to form a segment of the complete laser processing trajectory, and the moving path of each laser beam is shorter than the complete laser processing trajectory, so that the laser processing efficiency is no longer limited by the maximum speed of the galvanometer, and can support the material strip to run at a higher speed.

[0079] Specifically, the composite laser emission mechanism includes multiple reflective components disposed within the composite laser emission mechanism. After the laser beam enters the composite laser emission mechanism through the laser injection hole, it is reflected multiple times by the reflective components within the composite laser emission mechanism before being emitted toward the material strip. By adjusting the inclination of each reflective component, the propagation direction of the laser beam can be changed, thereby changing the position of the laser beam projected on the material strip to form a spot. When the laser processing method is joint processing, multiple sub-processing trajectories are determined based on the laser processing trajectory, wherein the number of sub-processing trajectories is determined by the number of laser beams emitted by the composite laser emission mechanism. The sub-processing trajectories correspond to the laser beams one-to-one, and each sub-processing trajectory overlaps with the laser processing trajectory. The inclination of each reflective component of the composite laser emission mechanism is adjusted according to the sub-processing trajectory so that all laser beams emitted by the composite laser processing mechanism converge to form an overlapping spot, and then jointly process the material strip. This effectively increases the laser power at the spot, allowing the laser beam to process the material strip more efficiently.

[0080] Specifically, the composite laser emitting mechanism includes a plurality of reflecting components, which are arranged inside the composite laser emitting mechanism. After the laser beam enters the composite laser emitting mechanism through the laser injection hole, it will be reflected multiple times by the reflecting components inside the composite laser emitting mechanism before being emitted toward the material strip. By adjusting the inclination of each reflecting component, the propagation direction of the laser beam can be changed, thereby changing the position of the light spot formed by the laser beam projected on the material strip. When the laser processing method is follow-up processing, multiple sub-processing trajectories are determined according to the laser processing trajectory, wherein the number of sub-processing trajectories is determined according to the number of laser beams emitted by the composite laser emitting mechanism, the sub-processing trajectories and the laser beams correspond one to one, and each sub-processing trajectory overlaps with each other; the inclination of each reflecting component of the composite laser emitting mechanism is adjusted according to the sub-processing trajectory, so that the light spots formed by the multiple laser beams emitted by the composite laser emitting mechanism projected on the material move successively according to the sub-processing trajectory. In this way, the laser beam emitted first processes the material strip to form the first sub-processing track, and the laser beam emitted later follows the movement of the laser beam emitted first to perform secondary processing on the first processing track formed by the laser beam emitted first on the material strip. This can reduce the defects caused by the processing of the laser beam emitted first and avoid the unsatisfactory processing results caused by the processing of the laser beam emitted first.

[0081] 5 , in some embodiments, step S402 may include but is not limited to the following steps S501 to S503 .

[0082] Step S501 : determining the power and depth of field of each laser beam emitted by the composite laser processing mechanism according to the laser processing technology.

[0083] It can be understood that the present embodiment can be used for laser processing processes such as laser cleaning, laser cutting, laser scribing, laser drilling, and laser marking. Different laser powers are required for different processing processes. Specifically, when used for laser cleaning, the laser power needs to be sufficient to evaporate materials such as dirt or coatings adhering to the surface of the material strip, while also preventing the laser from affecting the material strip itself. In this case, only a laser beam with relatively low power and shallow depth of field is required, so that the laser beam is focused on the surface of the material strip to form a spot and reciprocate. Correspondingly, when laser cutting is required, the material strip itself needs to be cut. In this case, a laser with relatively high power and relatively deep depth of field is required to quickly ablate the material strip and form cutting marks. When laser scribing, laser drilling, or laser marking is required, a laser with relatively moderate power and a shallower depth of field than that for laser cutting and a deeper depth of field than that for laser cleaning is required to ablate scratches, marks, or slots of a specific shape on the material strip without penetrating the material strip.

[0084] Step S502 : determining a sub-processing trajectory of each laser beam emitted by the composite laser emitting mechanism according to the laser processing trajectory and the laser processing mode.

[0085] It can be understood that the laser processing trajectory indicates the moving trajectory of the light spot formed by the laser beam projected on the surface of the material strip. The laser processing methods include segmented processing, follow-up processing and joint processing. Based on different laser processing methods, the sub-processing trajectory of each laser beam is different. Specifically, when the laser processing method is segmented processing, the complete laser processing trajectory can be divided into multiple non-overlapping sub-processing trajectories, so that each laser beam processes one section of it. At this time, each laser beam only needs to form a section of the complete laser processing trajectory. The moving path of each laser beam is shorter than the complete laser processing trajectory, so that the laser processing efficiency is no longer limited by the maximum speed of the galvanometer, and the material strip can be supported to run at a higher speed; and when the laser processing method is joint processing, the multiple laser beams emitted by the composite laser emission mechanism can be controlled to project onto the material strip to form overlapping light spots, which can effectively increase the laser power of the light spot, so that the laser beam The material strip can be processed more efficiently; when the laser processing method is follow-up processing, the composite laser emission mechanism can be controlled to emit multiple laser beams in succession, and the light spots formed by these laser beams projected on the material strip move in succession according to the same sub-processing trajectory. Taking the composite laser emission mechanism emitting two laser beams, namely the first laser beam and the second laser beam as an example, the first laser beam first forms a first sub-processing trajectory on the material strip, and the light spot formed by the second laser beam projected on the material strip moves along the sub-processing trajectory formed by the first laser beam, and the material strip is processed twice. In this way, the defects in the processing of the first laser beam can be eliminated to avoid unqualified products caused by inadequate processing of the first laser beam.

[0086] Step S503 : determining the size of the light spot formed by each laser beam projected on the material strip according to the laser processing technology and / or laser processing method.

[0087] It is understandable that the required spot size is different for different laser processing technologies and laser processing methods. For example, when laser scribing is required, a finer spot needs to be formed. When laser drilling is required, the spot size needs to be determined according to the size of the punched hole. When using different laser processing methods, the demand for spot size is also different. For example, when the laser processing method is follow-up processing, a larger spot can be generated first to perform rough processing on the material strip, and then a smaller spot can be generated to perform secondary fine processing on the basis of rough processing.

[0088] Referring to Figure 6, Figure 6 is a cutting contour diagram of the segmented processing of the material strip by the composite laser processing mechanism proposed in an embodiment of the present application, when cutting the pole ear, the first processing track 601 includes the first side of the pole ear, the second processing track 602 includes the second side of the pole ear, and the adjacent first side and second side are connected by a connecting edge. Specifically, the connecting edge here can be the bottom edge of the pole ear, the terminal end of the first processing track 601 includes a first arc track, the terminal end of the second processing track 602 includes a second arc track, and the adjacent first processing track 601 and the second processing track The trace 602 is connected by the overlapping of the first arcuate trace and the second arcuate trace. It is understandable that, since the material strip 102 is processed in sections by at least two laser beams in this application, the two or more processing traces formed by the segmented processing need to be connected to each other so that the outline of the tab can be processed in the material strip 102. In this embodiment, the first arcuate trace is used as the terminal end of the first processing trace 601, and the second arcuate trace is used as the terminal end of the second processing trace 602. In this way, it can better ensure that the first processing trace 601 and the second processing trace 602 intersect. For example, the first processing trace 601 includes a first side edge of the tab and a first arcuate trace extending along the first side edge toward the second side edge of the tab. The second processing trace 602 includes the second side edge of the tab, a bottom edge of the tab for connecting the first side edge and the second side edge, and a second arcuate trace extending from the inside of the material strip 102 toward the outside of the material strip 102 at an end of the bottom edge of the tab near the first side edge.

[0089] In some embodiments, the working method of segmented processing of the first laser beam and the second laser beam to form non-overlapping first processing tracks and second processing tracks is described with reference to FIG. 7 a to FIG. 7 d .

[0090] Referring to Figure 7a, the first laser beam moves from the outside of the material strip to the inside of the material strip along the width direction of the material strip, cooperates with the conveying mechanism to convey the material strip, and cuts the first side edge 701a of the pole ear on the material strip. The second laser beam starts cutting at a certain depth of the material strip, and as the material strip is conveyed, the lower straight edge of the pole ear is first cut inside the material strip, and then moves in the opposite direction of the first laser beam to cut the second side edge of the pole ear. The second laser beam moves to the upper straight edge position of the pole ear and stops moving. Under the conveying action of the conveying mechanism, the upper straight edge of the pole ear is cut. The lower straight edge, second side edge and upper straight edge of the pole ear together constitute the second processing track 701b. After the first processing track 701a and the second processing track 701b are connected, the outline of the pole ear is cut on the material strip.

[0091] Referring to Figure 7b, the first laser beam moves from the outside of the material strip to the inside of the material strip along the width direction of the material strip, cooperates with the conveying mechanism to convey the material strip, and stops after cutting the first side edge 702a of the pole ear on the material strip. The second laser beam starts cutting at a certain depth of the material strip. As the material strip is conveyed, the lower straight edge of the pole ear is first cut inside the material strip, and then moves in the opposite direction of the first laser beam until the second laser beam is no longer projected on the material strip, thereby cutting the second side edge of the pole ear. The lower straight edge and the second side edge of the pole ear together constitute the second processing trajectory 702b. After the first processing trajectory 702a and the second processing trajectory 702b are connected, the outline of the pole ear is cut on the material strip.

[0092] Referring to Figure 7c, the first laser beam and the second laser beam start cutting at the same width but different lengths of the material strip respectively. The landing point of the light spot formed by the first laser beam does not move, and cooperates with the conveying mechanism to cut the lower straight edge of the pole ear inside the material strip to form a first processing track 703a; the second laser beam first moves from the inside to the outside of the material strip in the width direction of the material strip to form the first side edge of the pole ear, and then stops moving when it moves to a position close to the edge of the material strip. The material strip is pulled by the conveying mechanism to cut the upper straight edge of the pole ear at the edge of the material strip, and then the second laser beam moves in the opposite direction to cut the second side edge of the pole ear. The first side edge, upper straight edge and second side edge of the pole ear together constitute the second processing track 703b. After the first processing track 703a and the second processing track 703b are connected, the outline of the pole ear is cut on the material strip.

[0093] Referring to Figure 7d, the first laser beam and the second laser beam start cutting at the same width but different lengths of the material strip respectively. The landing point of the light spot formed by the first laser beam does not move, and cooperates with the conveying mechanism to cut the lower straight edge of the pole ear inside the material strip to form a first processing track 704a; the second laser beam first moves from the inside to the outside of the material strip in the width direction of the material strip to form the first side edge of the pole ear until the second laser beam is no longer projected on the material strip, and then the second laser beam moves in the opposite direction to cut the second side edge of the pole ear. The first side edge and the second side edge of the pole ear together constitute the second processing track 704b. After the first processing track 704a and the second processing track 704b are connected, the outline of the pole ear is cut on the material strip.

[0094] 7e and 7f , the first laser beam and the second laser beam are projected onto the material strip to form overlapping light spots, jointly processing the material strip to cut a complete tab outline 705a or 706a on the material strip. Alternatively, the first laser beam and the second laser beam may be sequentially processed to cut a complete tab outline 705a or 706a on the material strip.

[0095] It can be understood that the motion trajectory, power, depth of field and spot size of the multiple laser beams emitted by the composite laser emission mechanism can be adjusted independently. In addition to cutting the pole ears in the above-mentioned embodiment, the composite laser processing equipment proposed in the embodiment of the present application can also be used for other processing processes. Referring to Figures 8a to 8e, Figures 8a to 8e are schematic diagrams of processing the material strip using the composite laser provided in this embodiment.

[0096] Referring to Figure 8a, Figure 8a is a schematic diagram of laser cleaning of a material strip by a composite laser processing mechanism. For example, for a material strip with multiple grooves 801a on its surface, using traditional cleaning methods can easily cause cleaning waste to enter the grooves 801a, resulting in poor cleaning effect. By using the composite laser processing mechanism proposed in the embodiment of the present application, a composite laser emitting mechanism can be used to generate multiple laser beams that are projected onto the surface of the material strip, quickly evaporating dirt or coatings on the surface of the material strip, thereby cleaning the surface of the material strip. Specifically, the movement trajectory of the light spot formed by the multiple laser beams projected on the material strip is shown in 801b. The light spot reciprocates horizontally or vertically on the surface of the material strip to clean the surface of the material strip. At this time, the power of the laser beam formed is relatively low and the depth of field is shallow. In order to improve the cleaning efficiency, the size of the light spot formed by the laser beam projected on the material strip is as large as possible. In this way, the cleaning of the surface of the material strip can be completed more quickly.

[0097] 8b and 8c, FIG8b and FIG8c are schematic diagrams of horizontal and vertical marking on the surface of the material strip by a composite laser processing mechanism, respectively. At this time, the moving trajectories of the light spots formed by the multiple laser beams emitted by the composite laser emitting mechanism and projected on the material strip are parallel to each other, and the light spots formed by the multiple laser beams projected on the material strip move according to the trajectory shown in 802c. Specifically, the multiple laser beams can move in the same direction, or the two laser beams can move in opposite directions, so that multiple parallel markings are formed on the surface of the material strip. According to the movement direction of the laser, multiple scratches 802a parallel to the width direction of the material strip can be formed on the surface of the material strip, or multiple scratches 803a parallel to the transmission direction of the material strip can be formed on the surface of the material strip. The cross-section of the scratch 802a in the thickness direction of the material strip is shown in 802b, and the cross-section of the scratch 803a in the thickness direction of the material strip is shown in 803b. At this time, since only lines need to be drawn on the surface of the material strip, the power of the laser beam should be higher than that during laser cleaning, but lower than that during laser cutting. The spot size formed by the laser beam projected on the surface of the material strip should be smaller, and the depth of field of the laser beam should be deeper than that during laser cleaning.

[0098] Referring to Figure 8d, Figure 8d is a schematic diagram of a composite laser processing mechanism scribing a mesh pattern on the surface of a material strip. At this point, the movement trajectory of the light spot formed by the multiple laser beams emitted by the composite laser emitting mechanism on the material strip is shown as 804c. Specifically, the multiple laser beams emitted by the composite laser emitting mechanism can be divided into two groups. The movement trajectories of the light spots formed by the laser beams belonging to the same group are parallel to each other, while the movement trajectories of the light spots of the two groups of laser beams are perpendicular to each other, thereby forming a mesh pattern of scratches 804a on the surface of the material strip. The cross-section of scratch 804a along the thickness direction of the material strip is shown as 804b. At this point, since only the surface of the material strip needs to be scribed, the laser beam power should be higher than the laser beam power during laser cleaning, but lower than the laser beam power during laser cutting. The size of the light spot formed by the laser beam projected on the surface of the material strip should be smaller than that during laser cleaning, and the depth of field of the laser beam should be deeper than that during laser cleaning.

[0099] Referring to Figure 8e, Figure 8e is a schematic diagram of punching a material strip through a composite laser processing mechanism. At this time, the composite laser emitting mechanism emits multiple laser beams with a certain depth of field. The depth of field of the laser is determined according to the depth of the punching. The multiple laser beams emitted by the composite laser emitting mechanism are simultaneously projected onto the material strip, and multiple openings 805a with depths corresponding to the laser depth of field are ablated on the material strip. The cross-section of the opening 805a is shown in 805b. Specifically, at this time, the multiple laser beams emitted by the composite laser emitting mechanism are projected onto the material strip to form multiple light spots. The multiple light spots can form a straight line parallel to the width direction of the material strip or parallel to the conveying direction of the material strip. After a row of openings 805a are ablated on the material strip by these light spots, the light spots can move in the direction shown by 805c, that is, in a direction parallel to or perpendicular to the width of the material strip, to form multiple rows of openings 805a on the material strip in sequence. At this time, since it is only necessary to punch holes on the surface of the material strip without penetrating the material strip, the power of the laser beam should be higher than the laser beam power during laser cleaning, but lower than the laser beam power during laser cutting. The size of the spot formed by the laser beam projected on the surface of the material strip is determined by the diameter of the punched surface, and the depth of field of the laser beam is determined by the depth of the laser drilling.

[0100] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above implementation mode. Technical personnel familiar with the art can also make various equivalent modifications or substitutions under the shared conditions that do not violate the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A composite laser processing mechanism, comprising: A conveying mechanism (101) for conveying a material belt (102); A composite laser emitting mechanism (103) is used to emit at least two laser beams to perform composite processing on the material strip (102) so as to form multiple processing tracks on the material strip (102), wherein the multiple processing tracks are formed by processing the material strip (102) with different laser beams emitted by the composite laser emitting mechanism (103); The first adsorption mechanism (104) and the second adsorption mechanism (105) are respectively arranged at an upstream position and a downstream position of a laser projection area close to the material belt (102), and the upstream position, the downstream position and the laser projection area are in the same plane. The first adsorption mechanism (104) and the second adsorption mechanism (105) are used to adsorb the material belt (102), wherein the laser projection area is an area where at least two laser beams emitted by the composite laser emitting mechanism (103) are projected onto the material belt (102).

2. The composite laser processing mechanism according to claim 1, wherein: The composite laser emitting mechanism (103) comprises a field mirror, at least two laser injection holes and at least two laser reflecting mechanisms, wherein the laser reflecting mechanism comprises a first reflecting component and a second reflecting component, wherein the first reflecting component is used to reflect the laser from the laser injection hole to the second reflecting component, and the second reflecting component is used to reflect the laser reflected from the first reflecting component to the field mirror, and the field mirror is used to focus the laser and then emit it to the material strip (102).

3. The composite laser processing mechanism according to claim 1, wherein: The sizes of the light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism (103) projected on the material strip (102) are different, or the sizes of the light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism (103) projected on the material strip (102) are the same; the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism (103) focused in the thickness direction of the material strip (102) are different, or the depths of field of the at least two laser beams emitted by the composite laser emitting mechanism (103) focused in the thickness direction of the material strip (102) are the same; the positions of the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism (103) projected on the material strip (102) overlap, or there is a distance between the at least two light spots formed by the at least two laser beams emitted by the composite laser emitting mechanism (103) projected on the material strip (102).

4. The composite laser processing mechanism according to claim 1, wherein: The laser emitted by the composite laser emitting mechanism (103) comprises at least a first laser beam and a second laser beam, and the first laser beam and the second laser beam process the material strip (102) in the following manner: The first laser beam and the second laser beam respectively form a first processing track and a second processing track that do not overlap on the material strip (102); Alternatively, the first laser beam and the second laser beam simultaneously form a first processing track and a second processing track that overlap on the material strip (102); Alternatively, the first laser beam and the second laser beam successively form a first processing track and a second processing track on the material strip (102), and the first processing track and the second processing track overlap.

5. A composite laser processing method, applied to the composite laser processing mechanism according to any one of claims 1 to 4, wherein: The method comprises: Obtain laser processing requirements; Determine the power and depth of field of each laser beam emitted by the composite laser emission mechanism, and the size of the light spot and the sub-processing trajectory formed by each laser beam projected on the material strip according to the laser processing requirements; According to the power, depth of field and spot size of each laser beam, the composite laser emission mechanism is controlled to emit the laser beam correspondingly toward the material strip; The propagation direction of each laser beam is controlled according to the sub-processing trajectory to form multiple processing trajectories corresponding to the laser processing requirements on the material strip, wherein each processing trajectory is formed by a different laser beam emitted by the composite laser emission mechanism.

6. The method according to claim 5, wherein: The laser processing requirements include at least one of a laser processing trajectory, a laser processing process, and a laser processing method. The laser processing process includes at least one of laser cutting, laser cleaning, laser engraving, laser drilling, and laser marking. The laser processing method includes at least one of segmented processing, joint processing, and follow-up processing.

7. The method according to claim 6, wherein: The method of determining the power and depth of field of each laser beam emitted by the composite laser emission mechanism and the size of the light spot and the sub-processing trajectory formed by each laser beam projected on the material strip according to the laser processing requirements includes: Determining the power and depth of field of each laser beam emitted by the composite laser processing mechanism according to the laser processing technology; Determining a sub-processing trajectory of each of the laser beams emitted by the composite laser emitting mechanism according to the laser processing trajectory and the laser processing mode; The size of the light spot formed by each laser beam projected onto the material strip is determined according to the laser processing technology and / or the laser processing method.

8. The method according to claim 7, wherein: The laser processing method is segmented processing, the composite laser emission mechanism includes a plurality of reflective components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form a plurality of processing trajectories corresponding to the laser processing requirements on the material strip, including: Determine a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emitting mechanism, the sub-processing trajectories correspond to the laser beams one by one, and all the sub-processing trajectories are combined to form the laser processing trajectory; The inclination of each of the reflection components is adjusted according to all the sub-processing tracks, so that the light spot formed by each laser beam projected on the material strip moves according to the corresponding sub-processing track.

9. The method according to claim 7, wherein: The laser processing method is joint processing, the composite laser emission mechanism includes a plurality of reflective components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form a plurality of processing trajectories corresponding to the laser processing requirements on the material strip, including: Determine a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emitting mechanism, the sub-processing trajectories correspond to the laser beams one by one, and each sub-processing trajectory overlaps with each other; The inclination of each of the reflective components is adjusted according to the sub-processing trajectory so that the multiple laser beams emitted by the composite laser emitting mechanism converge to form overlapping light spots to process the material strip.

10. The method according to claim 7, wherein: The processing method is follow-up processing, the composite laser emission mechanism includes a plurality of reflection components, and the propagation direction of each laser beam is controlled according to the sub-processing trajectory to form a plurality of processing trajectories corresponding to the laser processing requirements on the material strip, including: Determine a plurality of sub-processing trajectories according to the laser processing trajectory, wherein the number of the sub-processing trajectories is determined according to the number of the laser beams emitted by the composite laser emitting mechanism, the sub-processing trajectories correspond to the laser beams one by one, and each sub-processing trajectory overlaps with each other; The inclination of each of the reflection components is adjusted according to the sub-processing trajectory, so that the light spots formed by the multiple laser beams emitted by the composite laser emitting mechanism projected on the material move successively along the sub-processing trajectory.

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