Temperature control system and method

Abstract

A temperature control system and method. The temperature control method comprises: a temperature controller (11), a pipe (32), an air supply device (33), and at least two liquid temperature control devices including a first liquid temperature control device (34) and a second liquid temperature control device (35). The first liquid temperature control device (34) is mounted inside a first device to be temperature-controlled (36), and the second liquid temperature control device (35) and the air supply device (33) are mounted inside a second device to be temperature-controlled (37); the temperature controller (11), the pipe (32), and the at least two liquid temperature control devices form a temperature control loop; the temperature controller (11) is used for performing temperature control on the first device to be temperature-controlled (36) and the second device to be temperature-controlled (37) by means of the temperature control loop; and the air supply device (33) is used for performing temperature control on the second device to be temperature-controlled (37). On the basis that one temperature controller (11) performs temperature control on two devices to be temperature-controlled, temperature control of the second device to be temperature-controlled (37) can be performed by means of the air supply device (33), thereby meeting different temperature requirements of two devices to be temperature-controlled.

Description

Temperature control system and method Technical Field

[0001] The present application relates to the field of temperature control technology, and in particular to a temperature control system and method. Background Art

[0002] Since temperature affects the capacity, safety, lifespan and other performance of the equipment, in order to ensure the long-term safe and stable operation of the equipment, it is generally necessary to configure a temperature control system to control the temperature.

[0003] For example, energy storage equipment includes devices such as battery modules and power conversion systems (PCS). As shown in the schematic diagram of the basic structure of the energy storage device in Figure 1, it can be seen that in the related art, the temperature control of the battery module 12 and the power conversion system 13, two types of temperature-controlled devices, is generally performed by a temperature controller 11. However, the temperature requirements of the battery module and the PCS are different. The temperature requirement of the battery module is relatively low, generally around 18°C; while the temperature requirement of the PCS is relatively high, generally around 30°C to 40°C. Therefore, it is difficult for a single temperature controller to simultaneously meet the temperature control requirements of these two types of temperature-controlled devices with different temperature requirements.

[0004] To save costs, reduce floor space, and address the aforementioned issues, a commonly used temperature control solution for energy storage devices is the combined liquid cooling of the battery modules and air cooling of the energy storage converter, as shown in Figure 2. This solution uses only one temperature controller to control the battery module temperature, while heat dissipation holes are provided in the PCS housing to connect to the outside air. Fan 14 is then installed to dissipate heat from the PCS. However, a disadvantage of this current temperature control solution is that, during the high summer temperatures, air cooling makes it difficult to effectively dissipate heat from the PCS. Furthermore, dust in the external environment can easily contaminate the PCS's internal components. Furthermore, during the cold winter months, when temperatures are very low, the temperature controller switches from cooling mode to heating mode to heat and insulate the battery modules. However, the PCS side, with only a fan, cannot provide sufficient heat and insulation.

[0005] Summary of the Invention

[0006] Based on the above problems, the present application provides a temperature control system and method, which can control the temperature of two devices to be temperature controlled by one temperature controller, and can also control the temperature of the second device to be temperature controlled by an air supply device. It can simultaneously meet the different temperature requirements of the two devices to be temperature controlled, achieve cooling and heat dissipation or heating and insulation, and the overall power consumption, cost, and volume of the equipment will not increase significantly.

[0007] In order to achieve the above effects, the technical solutions adopted in this application are as follows:

[0008] According to one aspect of the present application, a temperature control system is proposed, comprising: a temperature controller, a pipeline, an air supply device, and at least two liquid temperature control devices including a first liquid temperature control device and a second liquid temperature control device; wherein,

[0009] The first liquid temperature control device is installed inside the first device to be temperature-controlled, and the second liquid temperature control device and the air supply device are installed inside the second device to be temperature-controlled;

[0010] The temperature controller, the pipeline and the at least two liquid temperature control devices form a temperature control loop;

[0011] The temperature controller is used to control the temperature of the first device to be temperature-controlled and the second device to be temperature-controlled through the temperature control circuit;

[0012] The air supply device is used to control the temperature of the second device to be temperature-controlled.

[0013] According to some embodiments, in the above-mentioned temperature control system, both the first device to be temperature-controlled and the second device to be temperature-controlled are provided with a housing, and the housing forms a sealed space.

[0014] According to some embodiments, in the above-mentioned temperature control system, the second device to be temperature-controlled is provided with a discharge pipe for discharging condensed water formed in the second liquid temperature control device out of the second device to be temperature-controlled.

[0015] According to some embodiments, in the above-mentioned temperature control system, the second liquid temperature control device is provided with fins.

[0016] According to some embodiments, in the above-mentioned temperature control system, a guide air duct is formed between the second liquid temperature control device and the air supply device.

[0017] According to some embodiments, in the above-mentioned temperature control system, the air supply equipment is provided in one or more groups.

[0018] According to some embodiments, the temperature control system further includes: a partition; the partition is used to separate the space of the second device to be temperature-controlled into at least two relatively independent cabins.

[0019] According to some embodiments, the temperature control system further includes: an air-cooling radiator disposed inside the second device to be temperature-controlled.

[0020] According to some embodiments, in the above-mentioned temperature control system, the air-cooling radiator is used to install electrical components provided inside the second device to be temperature-controlled.

[0021] According to some embodiments, in the above-mentioned temperature control system, the air-cooling radiator is embedded in the partition, and fins are provided on a side of the air-cooling radiator facing the second liquid temperature control device.

[0022] According to some embodiments, in the above-mentioned temperature control system, the air supply equipment is provided in at least two groups, which are respectively installed in the at least two cabins.

[0023] According to one aspect of the present application, a temperature control method is also proposed, which is applied to the above-mentioned temperature control system. The temperature control method includes:

[0024] The temperature controller controls the outlet temperature of the liquid at its outlet according to the temperature threshold, so that the temperature at the liquid inlet of the first liquid temperature control device of the first device to be temperature-controlled reaches the temperature threshold;

[0025] The temperature threshold is a temperature set according to the temperature control requirement of the first device to be temperature-controlled.

[0026] According to some embodiments, the temperature control method further includes:

[0027] Control the temperature inside the second temperature-controlled device to meet the preset conditions through the air supply device;

[0028] The preset condition is that the temperature inside the second temperature-controlled device is not higher than the maximum operating temperature of the electrical components provided inside the second temperature-controlled device and / or is not lower than the dew point temperature inside the second temperature-controlled device.

[0029] According to some embodiments, controlling the temperature inside the second temperature-controlled device by the air supply device to meet a preset condition includes:

[0030] The temperature inside the second device to be temperature-controlled is controlled to meet a preset condition by controlling the rotation speed of the air supply device and / or starting and stopping the air supply device.

[0031] According to some embodiments, when more than one set of air supply devices is provided, controlling the rotation speed of the air supply devices and / or starting and stopping the air supply devices to control the temperature inside the second device to be temperature-controlled to meet a preset condition includes:

[0032] The temperature inside the second temperature-controlled device is controlled to meet a preset condition by individually controlling the rotation speed of each group of air supply devices and / or starting and stopping each group of air supply devices.

[0033] The beneficial effects of a temperature control system and method provided by the embodiments of the present application are:

[0034] Compared with the solution of combining liquid cooling of battery modules and air cooling of energy storage inverters in related technologies, the technical solution provided by the present application can perform temperature control on both the first device to be temperature controlled and the second device to be temperature controlled by only one temperature controller. On the basis of the temperature control of the two devices to be temperature controlled by the temperature controller, the second device to be temperature controlled can also be temperature controlled by the air supply device, thereby meeting the different temperature requirements of the two devices to be temperature controlled at the same time.

[0035] Temperature control through a temperature controller can meet the temperature control requirements of cooling and heat dissipation and heating and insulation.

[0036] The overall power consumption, cost and volume of the equipment have not increased significantly.

[0037] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without exceeding the scope of protection required by this application.

[0039] FIG1 is a schematic diagram showing the basic structure of an energy storage device according to an exemplary embodiment;

[0040] FIG2 shows a schematic structural diagram of a battery module liquid cooling combined with an energy storage converter air cooling according to an exemplary embodiment;

[0041] FIG3 shows a schematic structural diagram of a temperature control system according to an exemplary embodiment;

[0042] FIG4 shows a schematic structural diagram of a second liquid temperature control device according to an exemplary embodiment;

[0043] FIG5 is a schematic structural diagram of a single cabin of a second device to be temperature-controlled according to an exemplary embodiment;

[0044] FIG6 shows a schematic structural diagram of a double-cabin body of a second device to be temperature-controlled according to an exemplary embodiment;

[0045] FIG7 is a schematic flow chart showing a temperature control method according to an exemplary embodiment;

[0046] FIG8 is a schematic flow chart showing a temperature control method according to another exemplary embodiment.

[0047] Description of reference numerals:

[0048] 11-temperature controller; 111-liquid outlet; 112-liquid return port; 12-battery module; 13-energy storage converter; 14-fan; 32-pipeline; 33-air supply equipment; 34-first liquid temperature control equipment; 35-second liquid temperature control equipment; 36-first device to be temperature-controlled; 37-second device to be temperature-controlled; 371-electrical component; 372-main heat-generating electrical component; 38-housing; 39-discharge pipe; 40-fin; 41-air-cooled radiator; 42-temperature measuring equipment; 43-humidity measuring equipment; 44-partition. DETAILED DESCRIPTION

[0049] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the drawings represent like or similar parts, and thus repetitive description thereof will be omitted.

[0050] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0051] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0052] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, while others may be combined or partially combined. Therefore, the actual execution order may vary depending on the actual situation.

[0053] It should be understood that while the terms "first," "second," "third," etc., may be used herein to describe various devices, these components should not be limited by these terms. These terms are used to distinguish one device from another. Thus, the first device to be temperature-controlled discussed below could be referred to as the second device to be temperature-controlled without departing from the teachings of the present invention. As used herein, the term "and / or" includes any one of the associated listed items and all combinations of one or more of them.

[0054] FIG3 shows a schematic structural diagram of a temperature control system according to an exemplary embodiment.

[0055] As shown in FIG3 , according to one aspect of the present application, a temperature control system is proposed, comprising: a temperature controller 11 , a pipeline 32 , an air supply device 33 , and at least two liquid temperature control devices including a first liquid temperature control device 34 and a second liquid temperature control device 35 .

[0056] The first liquid temperature control device 34 is installed inside the first device to be temperature-controlled 36 , and the second liquid temperature control device 35 and the air supply device 33 are installed inside the second device to be temperature-controlled 37 .

[0057] The temperature control machine 11, the pipeline 32 and at least two liquid temperature control devices form a temperature control loop.

[0058] The temperature controller 11 is used to control the temperature of the first device to be temperature-controlled 36 and the second device to be temperature-controlled 37 through a temperature control loop.

[0059] The air supply device 33 is used to control the temperature of the second device to be temperature-controlled 37 .

[0060] In this embodiment, the temperature controller 11 can include a cooling mode and a heating mode. When the temperature controller 11 is in the cooling mode, the temperature controller 11 can cool and dissipate heat for the first device to be temperature-controlled 36 and the second device to be temperature-controlled 37 through the temperature control circuit, and can also cool and dissipate heat for the second device to be temperature-controlled 37 through the air supply device 33. When the temperature controller 11 is in the heating mode, the temperature controller 11 can heat and keep the first device to be temperature-controlled 36 and the second device to be temperature-controlled 37 through the temperature control circuit, and can also heat and keep the second device to be temperature-controlled 37 through the air supply device 33.

[0061] The pipe 32 may include an inlet pipe and a return pipe. The liquid outlet 111 of the temperature controller 11 is connected to one end of at least two liquid temperature control devices via the inlet pipe in the pipe 32. The liquid return port 112 of the temperature controller 11 is connected to the other ends of the at least two liquid temperature control devices via the return pipe in the pipe 32, forming a temperature control loop. The temperature control loop contains a temperature control medium, which includes but is not limited to pure water, a mixture of water and other liquids, a gas, or a gas-liquid mixture. For example, a mixed liquid such as a 50% ethylene glycol solution may be used.

[0062] The air supply device 33 can be a fan, specifically an AC fan, a DC fan, etc. The air supply device 33 can circulate air in the space of the second temperature-controlled device 37, thereby improving the heat exchange efficiency of the air in the space between the second liquid temperature control device 35 and the second temperature-controlled device 37, and heating and maintaining the temperature of the second temperature-controlled device 37.

[0063] The air supply device 33 can also improve the cold exchange efficiency of the gas in the space between the second liquid temperature control device 35 and the second device to be temperature controlled 37 , thereby cooling and dissipating the heat of the second device to be temperature controlled 37 .

[0064] If the device to be temperature-controlled is an energy storage device, the first device to be temperature-controlled 36 can be a battery module within the energy storage device, and the second device to be temperature-controlled 37 can be a PCS within the energy storage device. When the first device to be temperature-controlled 36 is a battery module and the second device to be temperature-controlled 37 is a PCS, the first and second devices to be temperature-controlled 36, 37 have different temperature control requirements. For example, the temperature control requirement for the first device to be temperature-controlled 36 can be 18°C, while the temperature control requirement for the second device to be temperature-controlled 37 can be 30°C to 40°C.

[0065] The first temperature-controlled device 36 and the second temperature-controlled device 37 can be two types of temperature-controlled devices with different temperature control requirements, or they can also be two types of temperature-controlled devices with the same temperature control requirements. For example, the temperature control requirements of the first temperature-controlled device 36 and the second temperature-controlled device 37 can both be 25°C, or both be 10°C to 20°C. When an electrical component 371 is disposed within the second temperature-controlled device 37, the second liquid temperature control device 35 does not directly contact the electrical components 371 within the second temperature-controlled device 37 that are susceptible to moisture, such as certain power electronic components in a PCS.

[0066] Taking the first device to be temperature-controlled 36 as a battery module with a temperature control requirement of 18°C, and the second device to be temperature-controlled 37 as a PCS with a temperature control requirement of 30°C to 40°C as an example, the temperature controller 11 in the temperature control system preferentially controls the outlet temperature of the liquid at the liquid outlet 111 of the temperature controller 11 based on the temperature control requirement of 18°C ​​for the first device to be temperature-controlled 36 (battery module). When the temperature control requirement of 18°C ​​for the first device to be temperature-controlled 36 is reached, the temperature inside the second liquid temperature control device 35 is also 18°C. At this time, the temperature inside the second device to be temperature-controlled 37 can be controlled by the air supply device 33 to meet the temperature requirement of 30°C to 40°C. This embodiment can temperature-control devices to be temperature-controlled with different temperature requirements by using the temperature controller 11 and the air supply device 33 in combination.

[0067] According to some embodiments, as shown in FIG3 , in the temperature control system, the first temperature-controlled device 36 and the second temperature-controlled device 37 are both provided with a housing 38 , which forms a sealed space. The air supply device 33 can be provided on the inner wall of the housing 38 .

[0068] Considering that if the second device to be temperature-controlled 37 is equipped with electrical components, condensation may easily form on the surface of the second liquid temperature-control device 35 within the second device to be temperature-controlled 37 during temperature control, especially when the temperature controller 11 is in cooling mode. This condensation may affect the operation and service life of the electrical components 371 within the second device to be temperature-controlled 37. To avoid this effect, as shown in FIG3 , according to some embodiments, the temperature control system includes a drain pipe 39 in the second device to be temperature-controlled 37 for draining condensation formed on the second liquid temperature-control device 35 from the second device to be temperature-controlled 37. If both the first device to be temperature-controlled 36 and the second device to be temperature-controlled 37 are equipped with a housing 38, the drain pipe 39 can drain condensation formed on the second liquid temperature-control device 35 to the exterior of the housing 38 of the second device to be temperature-controlled 37.

[0069] FIG4 shows a schematic structural diagram of a second liquid temperature control device according to an exemplary embodiment.

[0070] According to some embodiments, as shown in FIG. 4 , in the aforementioned temperature control system, the second liquid temperature control device 35 is provided with fins 40, which can improve the temperature control effect of the air supply device 33 and the second liquid temperature control device 35 within the second temperature-controlled device 37. The fins 40 can increase the contact area between the second liquid temperature control device 35 and the gas within the second temperature-controlled device, thereby improving the cooling / heat exchange efficiency of the second liquid temperature control device 35 and thereby enhancing the cooling and heat dissipation / heating and insulation effects.

[0071] According to some embodiments, as shown in FIG3 , in the aforementioned temperature control system, a guide air duct is formed between the second liquid temperature control device 35 and the air supply device 33, thereby improving the cooling / heat exchange efficiency within the interior of the second temperature-controlled device 37. When the air supply device 33 is in operation, it transfers the cooling / heating energy from the second liquid temperature control device 35 to the interior of the second temperature-controlled device 37, thereby cooling / heating the interior of the second temperature-controlled device 37 and the electrical components 371 therein.

[0072] According to some embodiments, the temperature control system described above includes one or more air supply devices 33. Each air supply device 33 includes at least one fan. If the air supply device 33 is a fan, one or more fans may be provided. Each fan group includes at least one fan. In this embodiment, the temperature control system can control the temperature inside the second device to be temperature-controlled 37 to be no higher than the maximum operating temperature of the electrical component 371 provided within the second device to be temperature-controlled 37 and / or no lower than the dew point temperature within the second device to be temperature-controlled 37 by controlling the rotation speed of the air supply device 33 and / or starting and stopping the air supply device 33.

[0073] FIG5 shows a schematic structural diagram of a single cabin of a second device to be temperature-controlled according to an exemplary embodiment.

[0074] In this embodiment, as shown in FIG5 , the temperature control system described above, in addition to comprising: an air supply device 33, a second liquid temperature control device 35, a housing 38, and an air guide duct, may further include: an air-cooling radiator 41. The air-cooling radiator 41 may specifically be a metal block, such as an aluminum block. The air-cooling radiator 41 may be disposed within the second device to be temperature-controlled 37. To improve the temperature control effect of the second liquid temperature control device 35 and the air supply device 33 within the second device to be temperature-controlled 37, the air-cooling radiator 41 may be used to mount electrical components 371 disposed within the second device to be temperature-controlled 37. Specifically, the electrical component 371 generating a heat amount greater than a preset value, i.e., the electrical component 372 generating the primary heat, may be disposed within the air-cooling radiator 41. Fins 40 may also be disposed on the side of the air-cooling radiator 41 facing the second liquid temperature control device 35.

[0075] As shown in Figure 5 , when the temperature control system includes an air-cooling radiator 41, a guide air duct can be formed between the second liquid temperature control device 35, the air-cooling radiator 41, and the air supply device 33 to improve the efficiency of heat / cold exchange between the second liquid temperature control device 35 and the air-cooling radiator 41. When the air supply device 33 is in operation, it transfers heat / cold from the second liquid temperature control device 35 to the air-cooling radiator 41, cooling and dissipating heat / heating the space of the second device to be temperature-controlled 37 and the electrical components mounted on the air-cooling radiator 41.

[0076] In this embodiment, as shown in FIG5 , the temperature control system may further include a temperature measuring device 42 and a humidity measuring device 43. The temperature measuring device 42 and the humidity measuring device 43 may be located within the second device to be temperature-controlled 37 to monitor the temperature and humidity within the second device to be temperature-controlled 37 in real time. Specifically, the temperature measuring device 42 may be located near an electrical component 371 within the second device to be temperature-controlled 37 to monitor the temperature around the electrical component 371 in real time. The humidity measuring device 43 may be located near an electrical component 371 within the second device to be temperature-controlled 37 to monitor the humidity around the electrical component 371 in real time.

[0077] When the second temperature-controlled device 37 is equipped with an air-cooled radiator 41, the temperature measuring device 42 and the humidity measuring device 43 can be configured on the air-cooled radiator 41 to facilitate real-time monitoring of the temperature (i.e., the temperature on the surface of the air-cooled radiator 41) and humidity (i.e., the humidity on the surface of the air-cooled radiator 41) around the main heat-generating electrical component 372.

[0078] This application takes into account that when the second liquid temperature control device 35 leaks and sprays liquid, the liquid is sprayed onto the electrical component 371 set inside the second temperature control device 37, which will affect the operation and service life of the electrical component 371. In order to ensure the normal operation and long service life of the electrical component 371.

[0079] FIG6 shows a schematic structural diagram of a double-chamber structure of a second device to be temperature-controlled according to an exemplary embodiment. As shown in FIG6 , the temperature control system described above in the present application further includes: a partition 44. The partition 44 divides the space of the second device to be temperature-controlled 37 into two relatively independent chambers. The second liquid temperature control device 35 is arranged in one of the chambers, and the electrical component 371 arranged inside the second device to be temperature-controlled 37 is arranged in the other chamber. The second liquid temperature control device 35 is separated from the electrical component 371. Based on the above scheme, when liquid leakage occurs in the second liquid temperature control device 35, the liquid will not be sprayed onto the electrical component 371 arranged inside the second device to be temperature-controlled 37, which can improve the operational stability and longer service life of the electrical component 371.

[0080] In addition, it should be noted that the partition 44 in the structural diagram shown in FIG6 is used to separate the space of the second temperature-controlled device 37 into at least two relatively independent cabins, and the number of cabins is not limited.

[0081] When the temperature control system includes a partition, the second liquid temperature control device 35 can be set in one of the compartments, and the electrical component 371 set inside the second temperature-controlled device 37 can be set in other compartments. This can prevent the second liquid temperature control device 35 from leaking and spraying liquid, which will affect the operation and service life of the electrical component 371 set inside the second temperature-controlled device 37.

[0082] According to some embodiments, as shown in FIG6 , in addition to the aforementioned temperature control system including a partition 44, the temperature control system may further include an air-cooling radiator 41. The air-cooling radiator 41 may be disposed within the second device to be temperature-controlled 37 and used to accommodate the electrical components 371 disposed within the second device to be temperature-controlled 37. The air-cooling radiator 41 may be embedded within the partition 44, and fins 40 may be provided on the side of the air-cooling radiator 41 facing the second liquid temperature control device 35. The fins provided on the air-cooling radiator 41 serve the same function as the fins provided on the second liquid temperature control device 35, improving the temperature control efficiency of the air supply device 33 and the second liquid temperature control device 35 within the second device to be temperature-controlled 37. The fins 40 increase the contact area between the air-cooling radiator 41 and the air within the second device to be temperature-controlled, thereby increasing the efficiency of heat exchange and cooling, and thereby enhancing the cooling and heat dissipation / heating and insulation effects.

[0083] When the electrical component 371 arranged inside the second temperature-controlled device 37 is arranged in the air-cooling radiator 41 of other compartments, the embedded air-cooling radiator 41 is provided with fins 40 on the side facing the second liquid temperature control device 35, which is beneficial to improve the cold / heat exchange efficiency between the second liquid temperature control device 35 and the air-cooling radiator 41, and improve the temperature control effect of other compartments where the electrical component 371 is arranged.

[0084] In the present application, when one or more air supply devices 33 are provided and the temperature control system does not include a partition 44, one or more air supply devices 33 can be provided inside the second device to be temperature-controlled 37, specifically, can be provided on the inner wall of the shell 38. When one or more air supply devices 33 are provided and the temperature control system includes a partition 44, one or more air supply devices 33 can be placed in one of the compartments in the second device to be temperature-controlled 37 where the second liquid temperature control device 35 is provided. In addition, according to some embodiments, based on the above-mentioned temperature control system including a partition 44, at least two groups of air supply devices 33 are provided, and are respectively installed in at least two compartments. That is, when more than one group of air supply devices 33 are provided, the air supply devices 33 are respectively installed in at least two compartments. Each independent compartment can be equipped with an air supply device 33, which can improve the temperature control effect inside each compartment.

[0085] According to one aspect of the present application, a temperature control method is proposed, which is applied to the above-mentioned temperature control system. The inventive concept of the temperature control method is that the temperature controller preferentially controls the liquid outlet temperature at the liquid outlet of the temperature controller according to the temperature (temperature threshold) set according to the temperature control requirements of the device to be temperature controlled (i.e., the first device to be temperature controlled) that is not equipped with an air supply device, so that the temperature at the liquid inlet of the first liquid temperature control device of the first device to be temperature controlled reaches the temperature threshold.

[0086] When the temperature at the liquid inlet of the first liquid temperature control device of the first device to be temperature controlled reaches the temperature threshold, the temperature at the liquid inlet of the second liquid temperature control device of the second device to be temperature controlled also reaches the temperature threshold of the first device to be temperature controlled. At this time, the rotation speed of the air supply device can be controlled to control the temperature inside the second device to be temperature controlled (i.e., the temperature around the electrical components, if the temperature measuring device is configured on an air-cooled radiator, it is the temperature on the surface of the air-cooled radiator) not higher than the maximum operating temperature of the electrical components set inside the second device to be temperature controlled and / or not lower than the dew point temperature inside the second device to be temperature controlled.

[0087] The temperature inside the second device to be temperature-controlled (i.e., the temperature around the electrical components; if the temperature measuring device is arranged on an air-cooled radiator, the temperature on the surface of the air-cooled radiator) can also be controlled by starting and stopping the air supply device to be not higher than the maximum operating temperature of the electrical components set inside the second device to be temperature-controlled and / or not lower than the dew point temperature inside the second device to be temperature-controlled.

[0088] FIG7 is a flow chart of a temperature control method according to an exemplary embodiment. As shown in FIG7 , the temperature control method includes:

[0089] S101: The temperature controller controls the outlet temperature of the liquid at its outlet according to a temperature threshold, so that the temperature at the liquid inlet of the first liquid temperature control device of the first device to be temperature-controlled reaches the temperature threshold.

[0090] In this embodiment, the temperature threshold is a temperature set according to the temperature control requirement of the first device to be temperature-controlled.

[0091] FIG8 is a schematic flow chart showing a temperature control method according to another exemplary embodiment.

[0092] According to some embodiments, as shown in FIG8 , the temperature control method further includes:

[0093] S201: Control the temperature inside the second temperature-controlled device by the air supply device to meet a preset condition.

[0094] According to some embodiments, in S201, controlling the temperature inside the second temperature-controlled device by the air supply device to meet a preset condition includes:

[0095] The temperature inside the second temperature-controlled device is controlled to meet a preset condition by controlling the speed of the air supply device and / or starting and stopping the air supply device. To ensure the operational safety of the air supply device, a maximum speed is set for the air supply device. The speed of the air supply device is less than or equal to the maximum speed.

[0096] According to some embodiments, when more than one set of air supply devices is provided, controlling the rotation speed of the air supply devices and / or starting and stopping the air supply devices to control the temperature inside the second device to be temperature-controlled to meet a preset condition includes:

[0097] The temperature inside the second device to be temperature-controlled is controlled to meet a preset condition by individually controlling the rotation speed of each group of air supply devices and / or starting and stopping each group of air supply devices.

[0098] In this embodiment, the space inside the second device to be temperature-controlled includes at least two compartments, and the air supply equipment is provided with at least two groups, which are respectively installed in the at least two compartments. The rotation speed of each group of air supply equipment in each compartment and / or the start and stop (number of groups or number) of each group of air supply equipment in each compartment can be controlled separately to control the temperature of each compartment inside the second device to be temperature-controlled to meet the preset conditions.

[0099] In this embodiment, the preset condition is that the temperature inside the second temperature-controlled device is no higher than the maximum operating temperature of the electrical components installed in the second temperature-controlled device and / or no lower than the dew point temperature inside the second temperature-controlled device. The dew point temperature is calculated based on the temperature measured by the temperature measuring device and the humidity measured by the humidity measuring device.

[0100] The temperature inside the second temperature-controlled device is the temperature measured by a temperature measuring device, which is positioned near an electrical component disposed within the second temperature-controlled device. The temperature inside the second temperature-controlled device is the temperature around the electrical component. If the second temperature-controlled device is equipped with an air-cooled radiator, the temperature measuring device may be positioned on the air-cooled radiator. The temperature inside the second temperature-controlled device is the temperature around the electrical component to be heated (i.e., the surface temperature of the air-cooled radiator).

[0101] When the speed of the air supply device is 0, there is no direct contact between the second liquid temperature control device and the electrical components arranged inside the second temperature-controlled device. The thermal insulation of the gas inside the second temperature-controlled device can basically ensure that the electrical components have a higher temperature.

[0102] In addition, an air-cooled radiator is provided inside the second device to be temperature-controlled in the temperature control system, and when the electrical components provided inside the second device to be temperature-controlled are installed on the air-cooled radiator, there is no direct contact between the second liquid temperature control device and the air-cooled radiator. Through the heat insulation of the gas inside the second device to be temperature-controlled, it can basically be ensured that the surface of the air-cooled radiator has a higher temperature, thereby ensuring that the electrical components have a higher temperature.

[0103] When the temperature controller is in cooling mode, the cold exchange effect between the second liquid temperature control device and the gas inside the second temperature-controlled device and the air-cooled radiator can be improved by increasing the rotation speed of the air supply device and / or increasing the number of groups or numbers of air supply devices that are turned on, thereby improving the heat dissipation effect of the electrical components installed inside the second temperature-controlled device and achieving cooling and heat dissipation.

[0104] When the temperature controller is in heating mode, the heat exchange effect between the second liquid temperature control device and the gas inside the second temperature-controlled device and the air-cooled radiator can be improved by increasing the rotation speed of the air supply device and / or increasing the number of groups or numbers of air supply devices that are turned on, thereby improving the heating effect of the electrical components installed inside the second temperature-controlled device and achieving heating and heat preservation.

[0105] For example, in winter, when the ambient temperature is very low (e.g., 4°C), the temperature controller is in heating mode to ensure that the temperature of the temperature-controlled medium entering the first liquid temperature-controlled device of the first temperature-controlled device remains at 18°C, thereby maintaining the heat of the first temperature-controlled device. At this time, the temperature of the temperature-controlled medium entering the second liquid temperature-controlled device of the second temperature-controlled device is also 18°C, and the air supply device can transfer heat to the electrical components installed in the second temperature-controlled device. The higher the speed of the air supply device or the more units are in operation, the greater the wind speed, and the better the heating and heat preservation effect on the electrical components installed in the second temperature-controlled device.

[0106] The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the technical solutions and core concepts of the present application. Therefore, changes or modifications made by those skilled in the art based on the concepts of the present application, the specific implementation methods, and the scope of application of the present application, all fall within the scope of protection of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A temperature control system, characterized in that: include: A temperature controller, a pipeline, an air supply device, and at least two liquid temperature control devices including a first liquid temperature control device and a second liquid temperature control device; wherein, The first liquid temperature control device is installed inside the first device to be temperature controlled, and the second liquid temperature control device and the air supply device are installed inside the second device to be temperature controlled; The temperature control machine, the pipeline and the at least two liquid temperature control devices form a temperature control loop; The temperature controller is used to perform temperature control on the first device to be temperature-controlled and the second device to be temperature-controlled through the temperature control circuit; The air supply device is used to perform temperature control on the second device to be temperature-controlled.

2. The temperature control system according to claim 1, characterized in that: The first device to be temperature-controlled and the second device to be temperature-controlled are both provided with a shell, and the shell forms a sealed space.

3. The temperature control system according to claim 1, characterized in that: The second device to be temperature-controlled is provided with a discharge pipe for discharging condensed water formed by the second liquid temperature-controlled device out of the second device to be temperature-controlled.

4. The temperature control system according to claim 1, characterized in that: The second liquid temperature control device is provided with fins.

5. The temperature control system according to claim 1, characterized in that: A guide air duct is formed between the second liquid temperature control device and the air supply device.

6. The temperature control system according to claim 1, characterized in that: The air supply equipment is provided in one or more groups.

7. The temperature control system according to any one of claims 1 to 6, characterized in that: Also includes: Partitions; The partition is used to separate the space of the second temperature-controlled device into at least two relatively independent cabins.

8. The temperature control system according to claim 7, characterized in that: Also includes: The air-cooling radiator is arranged inside the second temperature-controlled device.

9. The temperature control system according to claim 8, characterized in that: The air-cooling radiator is used to install electrical components arranged inside the second temperature-controlled device.

10. The temperature control system according to claim 8, characterized in that: The air-cooling radiator is embedded in the partition plate, and a fin is arranged on a side of the air-cooling radiator facing the second liquid temperature control device.

11. The temperature control system according to claim 7, characterized in that: The air supply equipment is provided in at least two groups and is respectively installed in the at least two cabins.

12. A temperature control method, characterized in that: Applied to the temperature control system according to any one of claims 1 to 11, the temperature control method comprises: The temperature controller controls the liquid outlet temperature at its liquid outlet according to the temperature threshold, so that the temperature at the liquid inlet of the first liquid temperature control device of the first temperature-controlled device reaches the temperature threshold; The temperature threshold is a temperature set according to the temperature control requirement of the first temperature-controlled device.

13. The temperature control method according to claim 12, characterized in that: The temperature control method further comprises: Control the temperature inside the second temperature-controlled device to meet preset conditions through the air supply device; The preset condition is that the temperature inside the second temperature-controlled device is not higher than the maximum operating temperature of the electrical components arranged inside the second temperature-controlled device and / or is not lower than the dew point temperature inside the second temperature-controlled device.

14. The temperature control method according to claim 13, characterized in that: The controlling the temperature inside the second temperature-controlled device by the air supply device to meet a preset condition includes: The temperature inside the second temperature-controlled device is controlled to meet a preset condition by controlling the rotation speed of the air supply device and / or starting and stopping the air supply device.

15. The temperature control method according to claim 14, characterized in that: When more than one group of air supply devices are provided, controlling the rotation speed of the air supply devices and / or starting and stopping the air supply devices to control the temperature inside the second temperature-controlled device to meet a preset condition includes: The temperature inside the second temperature-controlled device is controlled to meet a preset condition by individually controlling the rotation speed of each group of air supply devices and / or starting and stopping each group of air supply devices.

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