Power electronics component, power converter assembly, and method for assembling multiple such components

Abstract

The invention relates to a power electronics component which comprises a substrate and a semiconductor assembly arranged on the substrate. The power electronics component additionally comprises at least two input power connections and at least two output power connections which are arranged on at least one side of the power electronics component. The power electronics component is designed to be joinable with at least one other power electronics component of the same design, in particular an identically designed power electronics component, in a stacking direction in order to form an assembly of power electronics components. Additionally, the power electronics component is designed such that each input power connection of the power electronics component can be electrically connected to the respective functionally corresponding input power connections of the at least one other power electronics component via a first connection line which can be paired with the input power connection, and each output power connection of the power electronics component can be electrically connected to the respective functionally corresponding output power connections of the at least one other power electronics component via a second connection line which can be paired with the output power connection.

Description

[0001] Power electronic unit, power converter arrangement and method for assembling several such units

[0002] The invention relates to a power electronics component and a power converter assembly comprising a plurality of power electronics components. Furthermore, the invention relates to a method for assembling at least two power electronics components into a power converter assembly. Furthermore, the invention relates to an electrical power converter for a motor vehicle and a power converter for coupling electrical networks or for an industrial process assembly.

[0003] A power electronics unit is often designed to operate in a power range > 1 kW. For this purpose, such a unit requires liquid cooling during operation. An electrical power converter for a motor vehicle, for coupling electrical networks, or for an industrial process arrangement, e.g., a plasma process arrangement or heating arrangement, comprising in particular a high-frequency amplifier arrangement, can comprise the aforementioned power electronics unit and can be designed in particular to generate an RF output power, in particular for plasma excitation, such as in plasma coating processes, preferably for the production of semiconductor structures.

[0004] Cooling poses particular challenges, especially in the field of electrical power converters for motor vehicles. Environmental conditions such as ambient temperature, humidity, contamination, as well as vibration and load fluctuations, are particularly demanding. For example, the ambient temperature has a significant impact on the temperature of the coolant. The requirements for efficiency and maximum dimensions are also particularly stringent.

[0005] Cooling also presents particular challenges, especially in the field of interconnecting electrical grids. Hardly any other area places greater demands on efficiency and durability in continuous operation with rapidly fluctuating power. One possible application is a charger and discharger for large batteries, such as flow batteries.

[0006] Since electrochemical efficiency during charging and discharging of such batteries is often already a major challenge, efforts are increasingly being made to improve the efficiency and reliability of the power converters used for this purpose. Efficiency can be improved if the inverters and / or power converters are kept within a defined temperature range and the required cooling fluid pumping power can be reduced.

[0007] There are also particular challenges for cooling, particularly in the field of electrical power conversion for special power-intensive industrial processes prone to instability, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, melting of solids, heating and / or gasification of liquids using, for example, microwave energy or induction heating, or plasma torches. This can be a process for generating radiation, e.g. microwave radiation, X-rays or particle accelerators. What all these processes have in common is that they are designed to generate and accelerate charged atomic or subatomic particles in a gas and / or plasma environment or liquid. Another thing all these processes have in common is that they have a high power consumption in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more.For the stated power range, frequencies > 20 kHz, preferably > 200 kHz, and in particular > 2 MHz are generated internally or for external applications. Many of these processes also have very high requirements for the stability of the power supply because the processes are highly complex, such as semiconductor production using plasma processes and / or heating by electromagnetic fields. Typically, power is converted from a mains frequency in the range of approximately 50 Hz to 60 Hz to different frequencies that can be in the above-mentioned range. Conversion to direct current power, also known as DC power, is also conceivable. Even when converting to direct current power, the power signal is often converted internally to a frequency in the above-mentioned range. This frequency is then rectified again according to the voltage, current and power requirements.For this conversion of electrical power into other frequencies, a large number of electronic components and assemblies are required, in particular power semiconductor components such as transistors or diodes, in particular PIN diodes, for example for switching RF power between different paths, or a combination of transistor with diode designed for currents > 10 A and voltages > 400 V.

[0008] A particularly demanding area is a process for plasma excitation, especially plasma processing, such as coating, e.g. PVD, CVD, or etching. Such processes are used in the manufacture of semiconductors such as microprocessor components and / or memory chips. Here, the requirements for reliability, durability, and process repeatability are particularly high. At the same time, the required power levels are also very high. In addition, the required output modulations, e.g. in modern electrical power converters with an RF amplifier arrangement or pulsed high-voltage power supplies with pulse shaping, have recently increased steadily. One requirement for an RF amplifier arrangement can, for example, be the ability to be pulsed with several different power levels, which is called multi-level pulsing (MLP). Another requirement for an RF amplifier arrangement can, for example,the ability to adjust the frequency and thus, for example, to respond quickly to load changes, which is called auto-frequency tuning (AFT). A further requirement can be, for example, the ability to provide a very high DC voltage, e.g. greater than or equal to 2 kV, in particular greater than or equal to 7 kV, in pulsed form, with pulse frequencies greater than or equal to 1 kHz, in particular greater than or equal to 10 kHz, particularly preferably greater than or equal to 200 kHz. With all these requirements, the demands on power semiconductor components that are installed in the RF amplifier arrangement and used to generate the RF power also increase.

[0009] Electronic components and assemblies generate heat loss during operation. This heat loss often occurs in a very limited area of ​​just a few mm 2 , e.g. < 8 mm 2Dissipating this waste heat to protect components and / or assemblies from damage due to overheating presents a particular challenge. Often, very large and material-intensive heat sinks are used for this purpose, and their production is very costly.

[0010] In the prior art, the heat is dissipated by cooling using a cold plate. When cooling with such a conventional cold plate, the heat transfer from the electrical component, which may have a copper layer, to the cooling medium is achieved by applying a material such as thermal paste to the thermal interface, which dissipates the generated heat. However, such a thermal interface material proves to be disadvantageous. On the one hand, it represents an additional heat transfer with thermal resistance, and on the other hand, it is subject to wear, which gradually deteriorates its effectiveness during operation. Likewise, the surface area of ​​the cold plate is increased, or the number and performance of the components is reduced in order to dissipate a greater amount of heat. Both options prove to be insufficient.Since the space in the housing of such a power supply is limited, expanding the cooling surface is not possible indefinitely. Reducing the performance of individual components is also not effective. Overall, inadequate cooling of the electrical components results in costs.

[0011] In particular, the demands placed on these components to convert power that cannot be delivered to the load under certain conditions into heat are also increasing. These losses, which are converted into heat, can be > 500 W in some applications, especially > 1 kW. This heat must be dissipated by the power semiconductor components, otherwise they will be destroyed by overheating.

[0012] In power electronic systems, there is also a need to be able to adapt the power for which the system is designed to the respective requirements. One possible approach is to design the power electronic system as a power converter arrangement consisting of several power electronic components. The necessary electrical, thermal, and fluidic connections lead to high manufacturing complexity and material costs.

[0013] It is an object of the invention to provide a power electronic unit and a power converter arrangement of several such units, which enable a simplified interconnection of the units.

[0014] The stated object is achieved by a power electronics unit according to claim 1. The power electronics unit comprises a substrate, a semiconductor assembly arranged on the substrate, and at least two input power terminals and at least two output power terminals arranged on at least one side of the power electronics unit. The power electronics unit is designed such that it can be combined with at least one other power electronics unit of the same type, in particular of identical construction, in a stacking direction to form an arrangement of power electronics units.Furthermore, the power electronics unit is designed such that each input power terminal of the power electronics unit is electrically connectable to the respective functionally corresponding input power terminals of the at least one further power electronics unit via a first connecting line assignable to the input power terminal, and each output power terminal of the power electronics unit is electrically connectable to the respective functionally corresponding output power terminals of the at least one further power electronics unit via a second connecting line assignable to the output power terminal. The power electronics unit according to the embodiments of the present development can be combined with other units of the same design to form an arrangement. This arrangement can also be referred to as a stack arrangement or a power converter arrangement.Components of the same design are components whose dimensions and size are designed such that they can be combined with the power electronic component in the stacking direction to form an arrangement. The input power connections of the component are electrically connected to the input power connections of the at least one further component via first connecting lines. This can, for example, achieve a parallel connection of the input power connections of the components. Analogously, the output power connections of the component are electrically connected to the output power connections of the at least one further component via second connecting lines. This can, for example, achieve a parallel connection of the output power connections of the components.By connecting the input and output power connections of the modules in parallel, the respective power of the individual modules can, for example, contribute to a scalable overall power output of the arrangement. If the power requirement increases, additional modules can be added to the stacked arrangement. Conversely, if power requirements decrease, modules can be removed from the stacked arrangement. The individual power electronic modules can be manufactured in large quantities and thus cost-effectively. The interconnection of the modules in the stacked arrangement using the first and second connecting lines is simple and clear.

[0015] The development also relates to an arrangement, also called a "stack arrangement" or "power converter arrangement," of power electronic components, which comprises at least two power electronic components. The power electronic components each comprise a substrate, a semiconductor assembly arranged on the substrate, and at least two input power terminals and at least one output power terminal, which are arranged on at least one side of the power electronic component. The power electronic components are assembled in a stacking direction to form the arrangement. The arrangement comprises at least two associated first connecting lines for the at least two input power terminals of each power electronic component and at least one associated second connecting line for the at least one output power terminal of each power electronic component.The corresponding input power terminals of the power electronic components are electrically connected to one another by means of the at least two first connecting lines, and the corresponding output power terminals of the power electronic components are electrically connected to one another by means of the at least one second connecting line.

[0016] The power converter arrangement according to the embodiments of the development is composed of at least two power electronic components. The input and output power connections of the components can be electrically connected to one another by means of the first and second connecting lines. In this way, an arrangement with an electrical power composed of the sum of the powers of the individual power electronic components can be provided. The power for which the arrangement is designed is scalable. By adding or removing individual power electronic components, the power of the arrangement can be changed and adapted to a changing demand, for example.

[0017] Furthermore, the development relates to a method for assembling at least two power electronic components into a power converter arrangement. The power electronic components each comprise a substrate, a semiconductor assembly arranged on the substrate, and at least two input power terminals and at least one output power terminal arranged on at least one side of the power electronic component. The method comprises assembling the at least two power electronic components in a stacking direction to form the arrangement.Furthermore, the method comprises electrically connecting the corresponding input power terminals of the power electronic components by means of at least two first connecting lines and electrically connecting the corresponding output power terminals of the power electronic components by means of at least one second connecting line.

[0018] The development also relates to an electrical power converter for a motor vehicle, which has an arrangement or power converter arrangement as described above. Furthermore, the development relates to a power converter for coupling electrical networks, which has an arrangement as described above.

[0019] Advantageous embodiments and further developments, which can be used individually or in combination with one another, are the subject of the dependent claims and the following description. In one aspect, the input power connections of the power electronics unit are configured such that corresponding input power connections of the power electronics unit and the at least one further power electronics unit can be connected in parallel by means of the first connecting lines, and that corresponding output power connections of the power electronics unit and the at least one further power electronics unit can be connected in parallel by means of the second connecting lines.

[0020] In one aspect, the power electronics unit comprises at least three output power terminals, wherein each output power terminal of the power electronics unit is electrically connectable to the respective functionally corresponding output power terminals of the at least one further power electronics unit via a second connecting line that can be assigned to the output power terminal. Thus, the power electronics unit can be designed as a three-phase inverter.

[0021] In one aspect, the power electronic unit is a power converter, in particular an inverter.

[0022] In one aspect of the development, the power electronics module is designed as a two-phase inverter, which has a first DC input power connection, a second DC input power connection, a first AC output power connection, and a second AC output power connection. This allows a complete bridge circuit, also called a full-bridge circuit, to be arranged on one power electronics module. Cooling is so efficient that the full-bridge circuit can be arranged entirely on one power electronics module, and several of the full-bridge circuits can be connected in parallel in a stack.

[0023] In one aspect, the power electronics unit comprises a first current path and a second current path, each with two series-connected power semiconductor components, wherein the node between the two power semiconductor components of the first current path is electrically connected directly or indirectly to the first AC output power terminal of the power electronics unit, and wherein the node between the two power semiconductor components of the second current path is electrically connected directly or indirectly to the first AC output power terminal of the power electronics unit. In one aspect of the development, the power electronics unit is designed as a three-phase inverter having a first DC input power terminal, a second DC input power terminal, a first AC output power terminal, a second AC output power terminal, and a third AC output power terminal.The cooling is so efficient that such a three-phase inverter can be arranged entirely on a power electronics unit and several of the three-phase inverters can be connected in parallel in a stack.

[0024] In one aspect, the power electronics unit comprises a first current path, a second current path, and a third current path, each having two power semiconductor components connected in series, wherein the node between the two power semiconductor components of the first current path is electrically connected directly or indirectly to the first AC output power terminal of the power electronics unit, wherein the node between the two power semiconductor components of the second current path is electrically connected directly or indirectly to the second AC output power terminal of the power electronics unit, and wherein the node between the two power semiconductor components of the third current path is electrically connected directly or indirectly to the third AC output power terminal of the power electronics unit.

[0025] In one aspect, the substrate of each power electronic component has a metallization on at least one side. Further preferably, the substrate is Direct Bonded Copper (DBC) or Direct Bonded Aluminum (DBA). According to alternatively preferred embodiments, the substrate can be an AMB (Active Metal Brazed) substrate, an IMB (Insulated Metal Substrate), or a thick-film substrate.

[0026] In one aspect, the semiconductor assembly comprises at least one bare die. Such a bare die can, for example, be applied or soldered directly onto the metallization.

[0027] It is advantageous if the semiconductor assembly comprises at least one control terminal, which is led out of the respective power electronics component separately from the power terminals, preferably by means of a wire connection. The control connection lines can therefore, for example, be led out to the side of the component. It is advantageous if the power electronics component comprises a heat sink with a cooling channel through which coolant can flow, which is arranged on the side of the substrate facing away from the semiconductor assembly.

[0028] In one aspect, each input power terminal of one of the power electronic units is electrically connected to the respective corresponding input power terminals of the other power electronic units via the first connecting line assigned to the input power terminal, and each output power terminal of one of the power electronic units is electrically connected to the respective corresponding output power terminals of the other power electronic units via the second connecting line assigned to the output power terminal. The electrical connection of corresponding input and output power terminals of the units enables, for example, a parallel connection of the input and output power terminals.

[0029] It is advantageous if corresponding input power connections of the power electronic components are connected in parallel by means of the first connecting lines, and corresponding output power connections of the power electronic components are connected in parallel by means of the second connecting lines. Connecting the input and output power connections of the various components in parallel enables, for example, the power of a single component to be multiplied. This makes it possible to scale the power of the arrangement composed of individual components. If, for example, more power is required than before, additional components can be added to the arrangement. If, on the other hand, the power provided by the arrangement is not fully utilized, individual components can be removed again.

[0030] It is therefore advantageous if additional power electronic components can be subsequently attached to the arrangement.

[0031] In one aspect, the arrangement of the input power connections and the output power connections on at least one side of the power electronics unit is identical for all power electronics units. The at least largely identical arrangement of the power connections simplifies, for example, the attachment of the connecting cables and the wiring of the units. Furthermore, clarity is improved, thereby reducing the risk of incorrect wiring. It is advantageous if the power electronics units are of the same design. Connecting identical units in parallel, for example, enables a multiplication of the power.

[0032] In one aspect of the development, the first and second connecting lines extend side by side without crossing over along at least one side of the arrangement. By avoiding crossing over, a particularly simple cable routing can be achieved, with a low risk of short circuits or flashovers.

[0033] In one aspect, the first and second connecting lines run parallel to each other. The parallel connection of the connecting lines enables space-saving, safe, and clear wiring of the components. In particular, the risk of faulty wiring, short circuits, and flashovers is reduced.

[0034] In one aspect, the first and second connecting lines extend across all power electronic components. In particular, the connecting lines are designed, for example, as continuous connecting lines that electrically connect all components of the arrangement to one another.

[0035] In one aspect, the first and second connecting lines extend in a straight line or a slightly curved line on at least one side of the assembly.

[0036] In one aspect, the first connecting lines and the second connecting lines extend within a plane provided on one side of the arrangement. In this embodiment, a plane is provided on one side of the arrangement in which the first and second connecting lines are arranged. This enables, for example, a compact, space-saving, and clearly arranged wiring of the input and output power connections of the modules. The connecting lines can, for example, be easily accessible, which facilitates maintenance.

[0037] In one aspect of the development, the stacking direction has a dominant vector component that runs perpendicular to the substrates of the power electronic components. The components can, for example, be arranged exactly on top of one another or at an angle to one another.

[0038] In one aspect, the first and second connecting lines run in the stacking direction of the arrangement. Preferably, the connecting lines run parallel to the stacking direction along the arrangement, more preferably along the entire stack. It is advantageous if the stacking direction runs perpendicular to the substrates of the power electronic components. In this embodiment, the components are arranged one above the other in a stacking direction perpendicular to the substrates. As a result, for example, a compact and mechanically stable arrangement can be obtained.

[0039] In one aspect, the first and second connecting lines are designed as strip-shaped conductor tracks. Strip-shaped conductor tracks are suitable, for example, for high current intensities because they can provide a comparatively large conductor cross-section. Furthermore, they enable, for example, reliable electrical connections to the power terminals.

[0040] In one aspect, the first and second connecting lines are connected to the power terminals of the power electronic components via one of the following: at least one welded connection, at least one soldered connection. This enables electrical connections with low contact resistance.

[0041] In one aspect, the power electronic components are arranged in the arrangement such that an end face of a first power electronic component rests against the end face of an adjacent power electronic component facing the first power electronic component. Such a compact and thus space-saving arrangement of the components is possible, for example, because the individual components are each equipped with heat sinks to dissipate the heat generated during operation.

[0042] In one aspect, each power electronics unit comprises a heat sink with a cooling channel through which coolant can flow, a coolant supply, and a coolant discharge. In the arrangement of the power electronics units, the heat sinks of the power electronics units are connected to form a cooling circuit. In particular, it is advantageous to fluidically connect the heat sinks of the units to one another in such a way that a cooling circuit is formed. In this way, for example, it is no longer necessary to supply each heat sink separately with coolant. Instead, the coolant can, for example, be supplied to the cooling circuit via a central supply and discharged again via a central coolant discharge.

[0043] In one aspect, the development comprises an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement or heating arrangement, comprising a power converter arrangement as described above or below, in particular designed to generate an RF output power.

[0044] In one aspect, the power electronics unit comprises: two power semiconductor components, in particular transistors, each having a first and a second power terminal and a control terminal, wherein both power semiconductor components, in particular transistors, are connected by one of their power terminals to form a series circuit. A direct current or direct voltage can be connected to the remaining power terminals, wherein control electronics is further provided which is connected to the control terminals of the power semiconductor components, in particular the two transistors, and the control electronics is designed to switch the power semiconductor components, in particular transistors, from a first conductive state to a second conductive state, wherein the conductivity of the two states is different, such that they can generate AC power, in particular RF power.

[0045] In one aspect, the electrical power converter comprises: a printed circuit board on which a power transformer having a primary winding and a secondary winding is arranged, wherein the primary winding is connected to the at least one power terminal of the power semiconductor components, in particular transistors, wherein the primary winding and the secondary winding of the power transformer are each designed as planar conductor tracks which are arranged in different layers of the printed circuit board and the printed circuit board has a thermal connection to a carrier unit.

[0046] Further advantageous embodiments are described in more detail below with reference to several exemplary embodiments shown in the drawings, to which the development is not limited, however.

[0047] They show schematically:

[0048] Fig. 1 shows a power electronic unit.

[0049] Fig. 2 shows the connection surfaces of a transistor.

[0050] Fig. 3 shows a cross-section through a power electronic unit.

[0051] Fig. 4 shows a cross-section through an alternative embodiment of a power electronic unit.

[0052] Fig. 5 shows a power converter arrangement with two power electronic components. Fig. 6 shows a circuit diagram of a three-pole inverter.

[0053] Fig. 7 shows a circuit diagram of a bipolar inverter. Fig. 8 shows an industrial process arrangement with an electrical power converter.

[0054] Fig. 9 shows an electrical power converter for coupling to an electrical network. Fig. 10 shows an electrical power converter for a motor vehicle.

[0055] In the following description of preferred embodiments of the present development, like reference numerals designate like or comparable components.

[0056] Fig. 1 shows a component 2, particularly for applications in the field of power electronics. The component 2 comprises a first substrate 4. The first substrate 4 has a first metallization 6 on the side of the component 2 facing the viewer and a second metallization 8 on the opposite second side. The first substrate 4 can preferably be a ceramic substrate with metallizations applied thereto. More preferably, the first substrate 4 is direct bonded copper (DBC) or direct bonded aluminum (DBA). Alternatively, the first substrate 4 can be an AMB (active metal brazed) substrate.

[0057] A heat sink 10 is arranged on the side of the first substrate 4 facing away from the viewer to dissipate the heat generated by the semiconductor components. The heat sink 10 is thermally and mechanically connected to the second metallization 8 of the first substrate 4. The heat sink 10 is preferably manufactured from a plurality of metal foils using a metal-layer bonding process. To dissipate the heat, the heat sink 10 can, for example, have cooling channels through which coolant can flow.

[0058] A second substrate 12 is arranged on the side of the heat sink 10 facing away from the first substrate 4. The second substrate 12 has a third metallization 14 on the side facing the heat sink 10 and a fourth metallization 16 on the side facing away from the heat sink 10. The second substrate 12 is thermally and mechanically connected to the heat sink 10 via the third metallization 14.

[0059] The first metallization 6 comprises a plurality of electrically separated metallization regions 6a to 6e, which are shown hatched in Fig. 1. Transistors 18a and 20a and a diode 22a are arranged on the metallization region 6a. The transistors 18a and 20a can be, for example, IGBTs or MOSFETs. The fourth metallization 16 facing away from the heat sink 10 can, like the first metallization 6, be divided into a plurality of metallization regions on which semiconductor components can be arranged. Fig. 2 shows an example of how the contact areas of a transistor, for example the transistor 18a, can be formed. The transistor 18a shown as an example in Fig. 2 has, on its first side, four emitter connection areas 24, a control connection area 26, and a test connection area 28 required for test purposes.A collector terminal area 30 is provided on the rear side of the transistor 18a.

[0060] As shown in Fig. 1, the transistors 18a and 20a are mounted on the metallization region 6a such that an electrical contact is formed between the metallization region 6a and the collector pads of the transistors 18a and 20a. The emitter pads 24 of the transistors 18a and 20a are electrically connected to the metallization region 6d via first connecting wires 32. The diode 22a is also mounted on the metallization region 6a. An electrical contact is formed between the metallization region 6a and a first power terminal of the diode 22a. A second power terminal of the diode 22a is electrically connected to the metallization region 6d via first connecting wires 32.

[0061] The control terminals of the transistors can, for example, be led out to the side of the assembly 2. In the embodiment shown in Fig. 1, the control terminals of the transistors 18a and 20a are connected, for example, via second connecting wires 34 to control connection lines 36, which are led out to the side of the assembly 2 on or within an insulating region 38.

[0062] Two transistors 18b and 20b and a diode 22b are arranged on the metallization region 6b. Power terminals of these semiconductor components are electrically connected to the metallization region 6d via first connecting wires 32. The control terminals of the transistors 18b and 20b are electrically connected to the control connection lines 36 via second connecting wires 34.

[0063] Two transistors 18c and 20c, as well as a diode 22c, are arranged on the metallization region 6c. Power terminals of these semiconductor components are connected to the metallization region 6d via first connecting wires 32. The control terminals of the transistors 18c and 20c are electrically connected to the control connection lines 36 via second connecting wires 34.

[0064] A first input power terminal 39a is arranged laterally on the assembly 2 and is electrically connected to the metallization region 6d. A second input power terminal 39b is arranged on the side of the assembly 2 facing away from the viewer and is electrically connected to a metallization region of the fourth metallization 16. The first input power terminal 39a and the second input power terminal 39b protrude beyond the edge of the assembly 2.

[0065] Output power terminals 40a, 40b, 40c are arranged laterally on the assembly 2. The output power terminals 40a, 40b, 40c protrude beyond the edge of the assembly 2. The output power terminal 40a is electrically connected to the metallization area 6a, the output power terminal 40b is electrically connected to the metallization area 6b, and the output power terminal 40c is electrically connected to the metallization area 6c.

[0066] The fourth metallization 16 on the side of the assembly 2 facing away from the viewer is also divided into different metallization regions, analogous to the first metallization 6. Further output power terminals 40d, 40e, 40f are arranged on the side of the assembly 2 facing away from the viewer, which protrude beyond the edge of the assembly 2. The output power terminals 40d, 40e, 40f are each electrically connected to associated metallization regions of the fourth metallization 16.

[0067] Fig. 3 shows a cross-section through the assembly 2. On the side of the first substrate 4 facing the viewer, the metallization regions 6c, 6d, 6e of the first metallization 6 can be seen. Diode 22c can be seen on the metallization region 6c. The output power terminal 40c is connected to the metallization region 6c. The first and second connecting wires 32, 34, the control connection lines 36, and the insulating region 38 are not shown in Fig. 3.

[0068] On the side of the first substrate 4 facing away from the viewer, the second metallization 8 is thermally and mechanically connected to the heat sink 10. In the example shown in Fig. 3, the heat sink 10 is manufactured using a metal layer bonding process. Individual metal foils 42a-42f, preferably copper foils, are at least partially structured by laser processing and / or punching and / or manufactured by electroplating processes and then joined together. The structuring or manufacturing is carried out in such a way that after the layers have been joined together, closed cooling channels 44 are created through which a cooling medium can flow. By means of a cooling channel structure, the coolant can be guided specifically to the areas of the heat sink 10 that require particular heat dissipation. The metal foils are preferably bonded together using a bonding process under high pressure and at high temperature.For this purpose, oxide layers, for example, can be formed on the surfaces of the copper layers, which are then welded together. The temperature is preferably selected so high that the oxide layers melt but the metal foils do not. In this way, the metal foils bond to form a monolithic heat sink. If the metal foils are made of copper, for example, this is also referred to as direct copper bonding, abbreviated to DCB. The metal foils 42a-42f preferably have a thickness of 0.4 mm or less, in particular 0.25 mm or less.

[0069] There are different possibilities for producing the structure shown in Fig. 3. According to a first possibility, the production of the first substrate 4 provided with metallizations 6 and 8 and the heat sink 10 each takes place in separate steps. The heat sink 10 is then firmly connected to the second metallization 8, for example by means of a bonding process, in particular by means of direct copper bonding. In this way, the second metallization 8 can be part of the heat sink 10, in particular of the monolithic heat sink. According to a second, alternative manufacturing method, all layers, i.e. both the first substrate 4, the second metallization 8 and the metal foils 42a-42f from which the heat sink 10 is formed, are connected to one another in a bonding process under high pressure and at high temperature, preferably by means of direct copper bonding and direct bonded copper.Further preferably, the first metallization 6 is also applied to the top side of the first substrate 4 in the same step.

[0070] On the side of the heat sink 10 facing away from the viewer, the second substrate 12 is arranged with the third metallization 14 and the fourth metallization 16. The fourth metallization 16 can be divided into a plurality of metallization regions 16a to 16e, analogous to the first metallization 6. A diode 22d can be seen on the metallization region 16c. Also visible in Fig. 3 is the output power terminal 40d, which is electrically connected to the metallization region 16c.

[0071] Fig. 4 shows an alternative embodiment of a structural unit 46 comprising only one substrate. This first substrate 4 with the metallizations 6 and 8 is arranged on the side of the heat sink 10 facing the viewer. In this structural unit 46, no further substrate is arranged on the side of the heat sink 10 facing away from the viewer.

[0072] Fig. 5 shows an arrangement 48, also called a “power converter arrangement” 48, which consists of two or more modules stacked on top of one another. The arrangement 48 shown in Fig. 5 comprises two modules, namely the module 2 shown in Fig. 1 and a further module 50 of the same design. “Same design” here means that the dimensions of the further module 50 correspond to the dimensions of the module 2 at least to the extent that a stacked arrangement is possible. Furthermore, it is advantageous if the arrangement of the input power connections and the output power connections of the power electronic modules to be stacked corresponds at least substantially to one another. Preferably, the two modules 2 and 50 can be of identical design, although such identical correspondence is not absolutely necessary.

[0073] The modules 2 and 50 are stacked in a stacking direction 52. The stacking direction 52, in which the modules 2, 50 are stacked, runs either perpendicular to or inclined to the planes defined by the substrates of the modules 2, 50. Preferably, the dominant vector component of the stacking direction 52 runs perpendicular to the substrates of the power electronic modules 2, 50.

[0074] The assembly 2 has the input power terminals 39a, 39b and the output power terminals 40a-40f. The further assembly 50 has input power terminals 54a, 54b and output power terminals 56a-56f.

[0075] The power converter arrangement 48 of the modules 2, 50 comprises a plurality of connecting lines for interconnecting the input power terminals and the output power terminals of the various modules. In particular, first connecting lines are provided, which are designed to electrically connect functionally corresponding input power terminals of the modules. Furthermore, second connecting lines are provided, which are designed to electrically connect functionally corresponding output power terminals of the modules.

[0076] In particular, the power converter arrangement 48 shown in Fig. 5 comprises a DC input line 58a, which electrically connects the input power connection 39a of the structural unit 2 to the functionally corresponding input power connection 54a of the further structural unit 50. In addition, the power converter arrangement 48 comprises a DC+ input line 58b, which electrically connects the input power connection 39b of the structural unit 2 to the functionally corresponding input power connection 54b of the further structural unit 50. The DC input line 58a and the DC+ input line 58b are first connecting lines, which are designed to electrically connect functionally corresponding input power connections of the structural units to one another. The DC input line 58a and the DC+ input line 58b can, for example, be designed as ribbon-shaped connecting lines that run without overlapping one another.Preferably, the first connecting lines run parallel to one another, specifically preferably in the stacking direction 52. The power converter arrangement 48 also includes an AC-U output line 60a, which electrically connects the output power terminals 40a, 40f, 56a, 56f to one another. Phase U of the AC voltage is tapped via the AC-U output line 60a. The AC-U output line 60a is connected to the first AC output power terminal 61a.

[0077] The power converter assembly 48 also includes an AC-V output line 60b, which electrically connects the output power terminals 40b, 40e, 56b, 56e. The second phase V of the AC voltage can be tapped via the AC-V output line 60b. The AC-V output line 60b is connected to the second AC output power terminal 61b.

[0078] In addition, the power converter assembly 48 includes an AC-W output line 60c, which electrically connects the output power terminals 40c, 40d, 56c, 56d. The third phase W of the AC voltage can be tapped via the AC-W output line 60c. The AC-W output line 60c is connected to the third AC output power terminal 61c.

[0079] In the example shown in Fig. 5, the AC output lines 60a, 60b, 60c serve both to form electrical connections within a component and to interconnect functionally corresponding output power connections of different components.

[0080] The AC-U output line 60a, the AC-V output line 60b, and the AC-W output line 60c are thus second connecting lines designed to electrically connect functionally corresponding output power connections of the modules. The AC output lines 60a, 60b, 60c are preferably designed as ribbon-shaped connecting lines that extend crossover-free along the power converter arrangement 48. The AC output lines 60a, 60b, 60c are preferably arranged parallel to one another and preferably run in the stacking direction 52.

[0081] In the embodiment shown in Fig. 5, all first connecting lines and second connecting lines are arranged within a plane on one side of the arrangement 48 and run parallel to one another within this plane. This enables a compact and clear interconnection of the modules 2, 50.

[0082] The first connecting lines and the second connecting lines connect the functionally corresponding input power connections and output power connections in parallel. This parallel connection of several power electronic components makes it possible to combine the partial power outputs of the individual components into a single unit with a correspondingly higher power output. The required power can thus be provided in a scalable manner by connecting individual components in parallel. In particular, it is also possible to subsequently add one or more additional power electronic components to an existing arrangement, for example, to adapt the power output to new requirements. In this way, the power output of the entire arrangement can be designed in a scalable manner.

[0083] When assembling the modules to form a power converter assembly 48, the heat sinks of the individual modules are preferably connected to form a common coolant circuit. For this purpose, the individual modules 2, 50 can preferably have fluid ports, whereby fluidic connections are formed between the individual modules when stacking the modules, thus creating a cooling circuit encompassing all the heat sinks of the assembly 48. As shown in Fig. 5, the module 2 can be equipped with a coolant connection 62, which has a coolant supply 64 and a coolant discharge 66 for the coolant circuit.

[0084] In the example of Fig. 1, the structural unit 2 can be designed, for example, as a three-pole inverter, wherein several of these inverters can be combined to form an arrangement 48 as shown in Fig. 5.

[0085] The circuit diagram of this assembly 2 is shown in Fig. 6. The circuit includes the first input power terminal 39a, which is connectable to the DC input line 58a, and the second input power terminal 39b, which is connectable to the DC+ input line 58b.

[0086] The circuit comprises six power switching units 68a to 68f. Each of the power switching units 68a to 68f comprises a transistor 18a-18f, a transistor 20a-20f, and a diode 22a-22f connected in parallel. The control terminals of the transistors are each electrically connected to at least one of the control connection lines 36.

[0087] The circuit has three current paths connected between the first input power terminal 39a and the second input power terminal 39b. The first current path comprises the series-connected power switching units 68a and 68f. The power switching unit 68a comprises the two transistors 18a and 20a and the diode 22a, which are mounted on the top side of the assembly 2 on the metallization region 6a. The control terminals of the transistors 18a, 20a are connected to at least one of the control connection lines 36. The power switching unit 68f comprises the two transistors 18f and 20f and a parallel-connected diode 22f, which are arranged on a corresponding metallization region on the side of the assembly 2 facing away from the user. The control terminals of the transistors 18f, 20f are electrically connected to at least one of the control connection lines 36.

[0088] The power switching unit 68a and the power switching unit 68f are electrically connected to each other at a first node 70a. As can be seen in Fig. 5, the output power terminals 40a and 40f of the assembly 2 are electrically connected to each other by the AC-U output line 60a. The first node 70a shown in Fig. 5 is thus created by the electrical connection of the output power terminals 40a and 40f. The AC-U output line 60a is therefore connected to the first node 70a. The phase U of the AC output signal can be tapped at the first node 70a.

[0089] The second current path includes the series-connected power switching units 68b and 68e. The two power switching units 68b and 68e are electrically connected to each other at a second node 70b. The second node 70b is created because the AC V output line 60b electrically connects the output power terminals 40b and 40e. The AC V output line 60b is therefore connected to the second node 70b. The phase V of the AC output signal can be tapped at the second node 70b.

[0090] The third current path includes the series-connected power switching units 68c and 68f. The two power switching units 68c and 68f are electrically connected to each other at the third node 70c. The third node 70c is created because the AC-W output line 60c electrically connects the output power terminals 40c and 40d. The AC-W output line 60c is therefore connected to the third node 70c. The W phase of the AC output signal can be tapped at the third node 70c.

[0091] The inverter shown in Fig. 6 can be used, for example, in an electric vehicle. Alternatively, such an inverter can be used, for example, as a power converter for connecting electrical grids.

[0092] According to an alternative embodiment, the module can be designed, for example, as a bipolar inverter that converts a DC input voltage into an AC output voltage. A circuit diagram of such a bipolar inverter is shown in Fig. 7. The circuit shown in Fig. 7 again includes the first input power terminal 39a, which is connectable to the DC input line 58a, and the second input power terminal 39b, which is connectable to the DC+ input line 58b.

[0093] In contrast to the embodiment shown in Fig. 6, the circuit of Fig. 7 has two current paths connected between the first input power terminal 39a and the second input power terminal 39b.

[0094] The first current path comprises a series connection of a power switching unit 72a and a power switching unit 72d, which are connected to each other at a first node 74a.

[0095] Analogously, the second current path comprises a series connection of a power switching unit 72b and a power switching unit 72c, which are connected to one another at a second node 74b. Each of the power switching units 72a-72d shown schematically in Fig. 7 comprises at least one transistor 76a-76d, at least one diode 78a-78d connected in parallel, and at least one series diode 80a-80d connected in series therewith, preferably a Schottky diode. An AC1 output line 82a is connected to a first AC output power terminal 83a. An AC2 output line 82b is connected to a second AC output power terminal 83b.

[0096] A capacitor 84 is also connected between the first input power terminal 39a and the second input power terminal 39b.

[0097] Fig. 8 shows an industrial process arrangement 1 with an electrical power converter 400 with an embodiment of a power converter arrangement 48. The industrial process arrangement is preferably a plasma process arrangement or heating arrangement.

[0098] The industrial process arrangement 1 shows:

[0099] - an electrical power converter 400,

[0100] - a load 200, preferably a plasma process or heating process, e.g. an induction or microwave heating process, wherein the load 200 is electrically connected to the electrical power converter 400 so that the electrical power converter 400 can supply the load 200 with the required electrical power, - optionally an additional adaptation unit 300 which is connected between the power converter 400 and the load 200.

[0101] The power converter 400 has:

[0102] - two of the power converter arrangements 48, as described above or below, e.g. in the description of Figs. 1 to 7, with heat sinks 10,

[0103] - a carrier unit 21 ,

[0104] - a circuit board 75,

[0105] - a unit to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, in particular transistors 76a-76d

[0106] - further electronic components 8a, 8b, 8c, wherein the further electronic components 8a, 8b, 8c and the unit to be cooled are arranged on or at a printed circuit board 75 and are connected by electrical contacts, and wherein the unit to be cooled has a fixed, in particular material-locking, connection to the heat sink 10.

[0107] Two power semiconductor components, in particular transistors 76a-76d, are arranged on or on the circuit board 75 as the unit 10 to be cooled. Each transistor has a first and a second power terminal and a control terminal. Both transistors 76a-76d can be connected to one of their power terminals in a series circuit. A DC current or DC voltage source can be connected to the remaining power terminals via the input power terminals 39a, 39b. Control electronics 114 can be connected to the control terminals of the power semiconductor components.

[0108] The power converter 400 is designed to provide an AC voltage, in particular an RF output power. Accordingly, it comprises a two-pole inverter as structural unit 2, as shown, for example, in Fig. 7.

[0109] This can also be carried out as disclosed in WO2017 / 001599 A1.

[0110] Several of these inverters are combined to form an arrangement 48, as shown in Fig. 5, for example.

[0111] Also arranged on the circuit board 75 is a power transformer 197, comprising a primary winding 196 and a secondary winding 194. The primary winding 196 and the secondary winding 194 of the power transformer 197 are each embodied as planar conductor tracks arranged in different layers of the circuit board 75. The circuit board 75 has a thermal connection to the carrier unit 21, which is designed to cool the circuit board 75.

[0112] This can also be implemented as disclosed in W02017 / 001602 A1.

[0113] The thermal connection to the carrier unit 21 can comprise a thermally conductive compensating layer, the first surface of which is firmly connected to the first surface of the circuit board 75, and a connecting layer, the first surface of which is firmly connected to the second surface of the thermally conductive compensating layer and the second surface of which is firmly connected to the heat spreader. The thermal connection can be implemented, for example, as described in patent application number DE 102023 129490.3, filed on October 25, 2023.

[0114] Fig. 9 shows an electrical power converter 401 for coupling to an electrical network 500, which includes a power converter assembly 48. The electrical power converter 401 differs from the electrical power converter 400 in that it has a three-phase connection for coupling to an electrical network 500. Accordingly, it has a three-pole inverter as structural unit 2, as shown, for example, in Fig. 6. Several of these inverters are combined to form an assembly 48, as shown, for example, in Fig. 5.

[0115] Fig. 10 shows an electrical power converter 100 for an electric motor vehicle, which is suitable for supplying an electric motor M 3~ connected to it with electrical power or for taking this power from it and feeding it back, e.g., into a battery. This electrical power converter 100 also has a power converter arrangement 48. Electrically powered motor vehicles are generally operated in three phases. Accordingly, it has a three-pole inverter as structural unit 2, as shown, for example, in Fig. 6. Several of these inverters are combined to form an arrangement 48, as shown, for example, in Fig. 5.

[0116] The features disclosed in the above description, the claims and the drawings may be important both individually and in any combination for the realization of the development in its various forms.

Claims

PATENT CLAIMS 1. Power electronics unit (2), which comprises: a substrate (4), a semiconductor assembly arranged on the substrate (4), at least two input power connections (39a, 39b) and at least two output power connections (40a-40f), which are arranged on at least one side of the power electronics unit (2), wherein the power electronics unit (2) is designed such that o it can be joined with at least one further power electronics unit (50) of the same type, in particular of identical construction, in a stacking direction (52) to form an arrangement (48) of power electronics units (2, 50), and o each input power connection (39a, 39b) of the power electronics unit (2) is connected to the respectively functionally corresponding input power connections (54a, 54b) of the at least one further power electronics unit (50) via a Input power connection assignable first connecting line (58a,58b) is electrically connectable and each output power terminal (40a-40f) of the power electronics unit (2) is electrically connectable to the respective functionally corresponding output power terminals (56a-56f) of the at least one further power electronics unit (50) via a second connecting line (60a-60c) assignable to the output power terminal.

2. Power electronics unit (2) according to claim 1, wherein the input power connections (39a, 39b) of the power electronics unit (2) are designed such that corresponding input power connections (39a, 39b, 54a, 54b) of the power electronics unit (2) and the at least one further power electronics unit (50) can be connected in parallel by means of the first connecting lines (58a, 58b), and that corresponding output power connections (40a-40f, 56a-56f) of the power electronics unit (2) and the at least one further power electronics unit (50) can be connected in parallel by means of the second connecting lines (60a-60c).

3. Power electronic unit (2) according to claim 1 or claim 2, characterized in that the power electronic unit (2) comprises at least three output power connections (40a-40f), wherein each of the three output power connections (40a-40f) of the power electronic unit (2) is connected to the respective functionally corresponding output power connections (56a-56f) of the at least one further power electronic unit (50) via a second connecting line (60a-60c) which can be assigned to the output power connection.

4. Power electronic unit (2) according to one of the preceding claims, characterized in that the power electronic unit (2) is a power converter, in particular an inverter.

5. Power electronics unit (2) according to one of the preceding claims, characterized in that the power electronics unit (2) is designed as a two-phase inverter which has a first DC input power connection (39a), a second DC input power connection (39b), a first AC output power connection (83a), a second AC output power connection (83b).

6. Power electronics unit (2) according to claim 5, characterized in that the power electronics unit (2) comprises a first current path and a second current path, each with two power semiconductor components connected in series, wherein the node between the two power semiconductor components of the first current path is electrically connected directly or indirectly to the first AC output power terminal (83a) of the power electronics unit (2), and wherein the node between the two power semiconductor components of the second current path is electrically connected directly or indirectly to the second AC output power terminal (83b) of the power electronics unit (2).

7. Power electronics unit (2) according to one of claims 1 to 4, characterized in that the power electronics unit (2) is designed as a three-phase inverter which has: a first DC input power connection (39a), a second DC input power connection (39b), a first AC output power connection (61a), a second AC output power connection (61b), a third AC output power connection (61c).

8. Power electronic module (2) according to claim 7, wherein the power electronic module (2) comprises a first current path, a second current path and a third current path, each with two power semiconductor components connected in series, wherein the node between the two power semiconductor components of the first current path is directly or indirectly electrically connected to the first AC output power terminal (61a) of the power electronics unit (2), wherein the node between the two power semiconductor components of the second current path is electrically connected directly or indirectly to the second AC output power terminal (61b) of the power electronics unit (2), and wherein the node between the two power semiconductor components of the third current path is electrically connected directly or indirectly to the third AC output power terminal (61c) of the power electronics unit (2).

9. Power electronic unit (2) according to one of the preceding claims, characterized in that the substrate (4, 12) of each power electronic unit (2) has a metallization (6, 8, 14, 16) on at least one side.

10. Power electronics unit (2) according to one of the preceding claims, characterized in that the semiconductor assembly comprises at least one bare die.

11. Power electronics unit (2) according to one of the preceding claims, wherein the semiconductor assembly comprises at least one control terminal (26) which is led out of the respective power electronics unit (2) separately from the power terminals, preferably by means of a wire connection.

12. Power electronics assembly (2) according to one of the preceding claims, characterized in that the power electronics assembly (2) comprises a heat sink (30) with a cooling channel (44) through which coolant can flow, which cooling channel is arranged on the side of the substrate (4) facing away from the semiconductor assembly.

13. A power converter arrangement (48) of power electronic modules (2, 50), which comprises at least two power electronic modules (2, 50), wherein the power electronic modules (2, 50) each have: a substrate (4), a semiconductor module arranged on the substrate (4), at least two input power connections and at least one output power connection, which are arranged on at least one side of the power electronic module, wherein the power electronic modules (2, 50) are assembled in a stacking direction (52) to form the power converter arrangement (48), wherein the power converter arrangement (48) is connected to the at least two input power connections (39a, 39b, 54a, 54b) of each power electronic module (2, 50) comprises at least two associated first connecting lines (58a, 58b) and at least one associated second connecting line (60a-60c) for the at least one output power connection (40a-40f, 56a-56f) of each power electronic unit (2, 50), wherein the corresponding input power connections (39a, 39b, 54a, 54b) of the power electronic units (2, 50) are electrically connected to one another by means of the at least two first connecting lines (58a, 58b) and wherein the corresponding output power connections (40a-40f, 56a-56f) of the power electronic units (2, 50) are electrically connected to one another by means of the at least one second connecting line (60a-60c).

14. Power converter arrangement (48) according to claim 13, characterized in that each input power connection (39a, 39b) of one of the power electronic components (2) is electrically connected to the respectively corresponding input power connections (54a, 54b) of the other power electronic components (50) via the first connecting line (58a, 58b) assigned to the input power connection (39a, 39b) and that each output power connection (40a-40f) of one of the power electronic components (2) is electrically connected to the respectively corresponding output power connections (56a-56f) of the other power electronic components (50) via the second connecting line (60a-60c) assigned to the output power connection (40a-40f).

15. Power converter arrangement (48) according to claim 13 or claim 14, characterized in that mutually corresponding input power connections (39a, 39b, 54a, 54b) of the power electronic components (2, 50) are connected in parallel by means of the first connecting lines (58a, 58b) and that mutually corresponding output power connections (40a-40f, 56a-56f) of the power electronic components (2, 50) are connected in parallel by means of the second connecting lines (60a-60c).

16. Power converter arrangement (48) according to one of claims 13 to 15, characterized in that further power electronic components can be subsequently attached to the power converter arrangement (48).

17. Power converter arrangement (48) according to one of claims 13 to 16, wherein the arrangement of the input power terminals (39a, 39b, 54a, 54b) and the output power terminals (40a-40f, 56a-56f) on at least one side of the power electronics unit is identical in all power electronics units (2, 50).

18. Power converter arrangement (48) according to one of claims 13 to 17, characterized in that the power electronic components (2, 50) are power electronic components of the same type.

19. The power converter assembly (48) according to any one of claims 13 to 18, wherein the first and second connecting lines (58a, 58b, 60a-60c) extend adjacent to one another without crossing over along at least one side of the assembly (48).

20. Power converter arrangement (48) according to one of claims 13 to 19, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) run parallel to one another.

21. Power converter arrangement (48) according to one of claims 13 to 20, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) extend over all power electronic components (2, 50).

22. Power converter arrangement (48) according to one of claims 13 to 21, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) run in a straight line or a slightly curved line on at least one side of the arrangement (48).

23. The power converter assembly (48) of any one of claims 13 to 22, wherein the first connecting lines (58a, 58b) and the second connecting lines (60a-60c) extend within a plane provided on one side of the assembly (48).

24. The power converter assembly (48) of any one of claims 13 to 23, wherein the stacking direction (52) has a dominant vector component.

25. Power converter arrangement (48) according to one of claims 13 to 24, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) run in the stacking direction (52) of the arrangement (48).

26. Power converter arrangement (48) according to one of claims 13 to 25, characterized in that the stacking direction (52) runs perpendicular to the substrates (4) of the power electronic components (2, 50).

27. Power converter arrangement (48) according to one of claims 13 to 26, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) are designed as strip-shaped conductor tracks.

28. Power converter arrangement (48) according to one of claims 13 to 27, characterized in that the first and second connecting lines (58a, 58b, 60a-60c) are provided with the power terminals (39a, 39b, 40a-40f, 54a, 54b, 56a-56f) of the power electronic units (2, 50) are connected via one of the following: at least one welded connection, at least one soldered connection.

29. Power converter arrangement (48) according to one of claims 13 to 28, characterized in that the power electronic components (2, 50) in the arrangement (48) are arranged such that an end face of a first power electronic component (2) rests against the end face of an adjacent power electronic component (50) facing the first power electronic component (2).

30. Power converter arrangement (48) according to one of claims 13 to 29, characterized in that each power electronic unit comprises a heat sink (30) with a cooling channel (44) through which coolant can flow, a coolant supply (62) and a coolant discharge (66), wherein in the arrangement (48) of the power electronic units (2, 50) the heat sinks (30) of the power electronic units (2, 50) are connected to form a cooling circuit.

31. A method for assembling at least two power electronic components (2, 50) to form a power converter arrangement (48), wherein the power electronic components (2, 50) each comprise: a substrate (4), a semiconductor assembly arranged on the substrate (4), at least two input power terminals and at least one output power terminal arranged on at least one side of the power electronic component, the method comprising: Assembling the at least two power electronic assemblies (2, 50) in a stacking direction (52) to form the power converter arrangement (48), electrically connecting the corresponding input power terminals (39a, 39b, 54a, 54b) of the power electronic assemblies (2, 50) by means of at least two first connecting lines (58a, 58b) and electrically connecting the corresponding output power terminals (40a-40f, 56a-56f) of the power electronic assemblies (2, 50) by means of at least one second connecting line (60a, 60b, 60c).

32. An electrical power converter (100) for a motor vehicle comprising a power converter assembly (48) according to any one of claims 13 to 30.

33. Electrical power converter (401) for coupling to an electrical network (500), which comprises a power converter arrangement (48) according to one of claims 13 to 30.

34. Electrical power converter (400) for an industrial process arrangement (1), preferably a plasma process arrangement or heating arrangement, comprising a power converter arrangement (48) according to one of the preceding claims 13 to 30, in particular designed to generate an RF output power.

35. Electrical power converter (400) according to one of claims 33 or 34, characterized in that the power electronic unit (188, 118) comprises: - two power semiconductor components, in particular transistors (18a-18f, 20a-20f, 76a-76d), each having a first and a second power terminal and a control terminal, wherein both power semiconductor components, in particular transistors, are connected by one of their power terminals to form a series circuit, wherein a direct current or direct voltage is connected to the remaining power terminals, wherein control electronics (114) is further provided which is connected to the control terminals of the power semiconductor components, in particular of the two transistors (S1, S2), and the control electronics (114) is designed to switch the power semiconductor components, in particular transistors, from a first conducting state to a second conducting state, wherein the conductivity of the two states is different, so that they can generate AC power, in particular RF power.

36. Electrical power converter (400) according to one of the preceding claims 33 to 35, comprising a printed circuit board (75) on which a power transformer (197) with a primary winding (196) and a secondary winding (194) is arranged, wherein the primary winding (196) is connected to the at least one power terminal of the power semiconductor components, in particular transistors, wherein the primary winding (196) and the secondary winding (194) of the power transformer (197) are each designed as planar conductor tracks which are arranged in different layers of the printed circuit board (75) and the printed circuit board has a thermal connection to a carrier unit (21).

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