Heat medium supply device

Abstract

This heat medium supply device (1) is provided with: a precooling heat medium supply pipe (41) that branches from a heating-side return pipe (25) and extends to a precooling heat exchanger (40); and a precooling heat medium return pipe (42) that extends from the pre-cooling heat exchanger (40) and is connected to the heating-side return pipe (25). A branch point (B1) at which the precooling heat medium supply pipe (41) branches from the heating-side return pipe (25) is positioned on the upstream side of a heating device (7) and supplies a heating medium before being heated by the heating device (7) to the precooling heat exchanger (40). A connection point (C1) between the precooling heat medium return pipe (42) and the heating-side return pipe (25) is positioned on the upstream side of the heating device (7) and supplies the heating medium that has passed through the precooling heat exchanger (40) to the heating device (7) through the heating-side return pipe (25).

Description

Heat medium supply device

[0001] The present invention relates to a heat medium supplying device that supplies a heat medium to a semiconductor manufacturing device such as an etching device, a CVD device, or a PVD device to adjust the temperature of the semiconductor manufacturing device.

[0002] Semiconductor manufacturing equipment (e.g., etching equipment, CVD equipment, and PVD equipment) for manufacturing semiconductor devices is configured to perform manufacturing processes while controlling the processing temperature. For example, in an etching equipment, the processing temperature of the wafer is controlled by flowing a temperature-controlled liquid as a heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] 7 is a schematic diagram showing a conventional example of a heat medium supplying device that supplies a heat medium to semiconductor manufacturing equipment. The heat medium supplying device 500 includes a heating device 501 that heats the heat medium and a cooling device 502 that cools the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is transferred to the heating-side tank 504 and then transferred from the heating-side tank 504 into a heat medium mixer 507. Meanwhile, the heat medium stored in the cooling-side tank 505 is transferred to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is transferred to the heat medium mixer 507.

[0004] The heated and cooled heat mediums are mixed in heat medium mixer 507 and adjusted to the temperature required for semiconductor manufacturing equipment 510. The temperature-adjusted heat medium is sent to semiconductor manufacturing equipment 510, thereby maintaining semiconductor manufacturing equipment 510 at the target temperature. The heat medium that has passed through semiconductor manufacturing equipment 510 is returned to heat medium mixer 507, where it is divided and transferred to heating-side tank 504 and cooling-side tank 505. In this way, the heat medium circulates between heat medium supply device 500 and semiconductor manufacturing equipment 510.

[0005] Because the heated and cooled heat transfer media used to adjust the temperature of semiconductor manufacturing equipment 510 are mixed in heat transfer media mixer 507, the flow rate of the heat transfer media sent from heating-side tank 504 to semiconductor manufacturing equipment 510 does not match the flow rate of the heat transfer media returning from semiconductor manufacturing equipment 510 to heating-side tank 504. Similarly, the flow rate of the heat transfer media sent from cooling-side tank 505 to semiconductor manufacturing equipment 510 does not match the flow rate of the heat transfer media returning from semiconductor manufacturing equipment 510 to cooling-side tank 505. As a result, a difference occurs in the liquid levels of the heat transfer media in heating-side tank 504 and cooling-side tank 505.

[0006] Therefore, by opening the on-off valve 520 when the difference in liquid level of the heat medium in the heating-side tank 504 and the cooling-side tank 505 becomes large, the heat medium is moved from the heating-side tank 504 to the cooling-side tank 505 or from the cooling-side tank 505 to the heating-side tank 504. As a result, the amounts of heat medium in the heating-side tank 504 and the cooling-side tank 505 can be balanced.

[0007] However, when a high-temperature heat medium moves from the heating-side tank 504 to the cooling-side tank 505, the temperature of the heat medium in the cooling-side tank 505 rises, increasing the load on the cooling device 502. On the other hand, when a low-temperature heat medium moves from the cooling-side tank 505 to the heating-side tank 504, the temperature of the heat medium in the heating-side tank 504, which has been heated by the heating device 501, drops, causing heat loss. Furthermore, as a result of changes in the temperatures in each tank, the temperature of the heat medium supplied to the semiconductor manufacturing equipment 510 may change.

[0008] Therefore, in order to mitigate the temperature changes of the heat medium in the heating side tank 504 and the cooling side tank 505, it has been proposed to use a heater 522 and a chiller 523 to heat or cool the heat medium moving between the heating side tank 504 and the cooling side tank 505 (see, for example, Patent Document 1).

[0009] JP 2023-98068 A

[0010] However, the heater 522 and the chiller 523 are devices that use energy (mainly electricity) supplied from the outside, and therefore increase the overall energy consumption of the heat medium supply device 500. In particular, in factories where many semiconductor manufacturing devices 510 are installed, there is a demand for a reduction in energy consumption.

[0011] Therefore, the present invention provides a heat medium supplying device that can lower the temperature of the heat medium moving from the heating-side tank to the cooling-side tank without using external energy, and also provides a heat medium supplying device that can raise the temperature of the heat medium moving from the cooling-side tank to the heating-side tank without using external energy.

[0012] In one aspect, a heat medium supplying device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing device includes a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing device, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing device, a heating-side tank and a cooling-side tank for holding the heat medium, a tank connecting pipe for connecting the heating-side tank and the cooling-side tank, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the cooling-side tank, a pre-cooling heat exchanger connected to the tank connecting pipe and for cooling the heat medium that flows through the tank connecting pipe from the heating-side tank toward the cooling-side tank, a pre-cooling heat medium supply pipe branching from the heating-side return pipe and extending to the pre-cooling heat exchanger, and a cooling medium supply pipe branching from the heating-side return pipe and extending to the pre-cooling heat exchanger. a pre-cooling heat medium return pipe extending from a tank connected to the heating-side tank and connected to the heating-side return pipe, the heating device being provided on the heating-side return pipe and configured to heat the heat medium flowing through the heating-side return pipe, the branch point of the pre-cooling heat medium supply pipe from the heating-side return pipe being located upstream of the heating device and configured to supply the heat medium before being heated by the heating device to the pre-cooling heat exchanger, the connection point of the pre-cooling heat medium return pipe and the heating-side return pipe being located upstream of the heating device and configured to supply the heat medium that has passed through the pre-cooling heat exchanger to the heating device through the heating-side return pipe, and the pre-cooling heat exchanger being configured to exchange heat between the heat medium flowing through the tank connecting pipe from the heating-side tank toward the cooling-side tank and the heat medium supplied through the pre-cooling heat medium supply pipe.

[0013] The pre-cooling heat exchanger exchanges heat between the heat medium flowing through the tank connecting pipe from the heating-side tank to the cooling-side tank and the heat medium that has passed through the semiconductor manufacturing equipment. The heat of the heat medium flowing through the tank connecting pipe is recovered by the heat medium that has passed through the semiconductor manufacturing equipment, thereby lowering the temperature of the heat medium flowing from the heating-side tank to the cooling-side tank without using an external energy source. In addition, the heat medium that has recovered heat in the pre-cooling heat exchanger is sent to a heating device and heated by the heating device. Because the temperature of the heat medium that has recovered heat has already been raised, the load on the heating device is reduced, achieving energy savings.

[0014] In one aspect, the heat transfer medium supply device further includes a communication valve provided in the tank communication pipe, a pre-cooling supply valve provided in the pre-cooling heat transfer medium return pipe or the pre-cooling heat transfer medium supply pipe, and an operation control unit that controls the operation of the communication valve and the pre-cooling supply valve, and the operation control unit is configured to open the pre-cooling supply valve while the communication valve is open.

[0015] While the communication valve is open, the pre-cooling supply valve is also open, and the heat transfer medium that has passed through the semiconductor manufacturing equipment is sent to the pre-cooling heat exchanger. Therefore, the heat transfer medium flowing through the tank communication pipe is cooled in the pre-cooling heat exchanger. As a result, the high-temperature heat transfer medium in the heated tank is prevented from moving directly to the cold tank.

[0016] In one aspect, the heat medium supply device further includes a heating side return temperature measuring device provided in the heating side return pipe at a position upstream of the heating device, and a communication temperature measuring device provided in the tank communication pipe, and the operation control unit is configured to open the communication valve and the pre-cooling supply valve when the temperature of the heat medium in the heating side return pipe measured by the heating side return temperature measuring device is lower than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

[0017] At some stage in the manufacturing process performed by the semiconductor manufacturing equipment, the heat transfer medium may be heated by the semiconductor manufacturing equipment. If the heat transfer medium passing through the semiconductor manufacturing equipment is at a high temperature, it cannot cool the heat transfer medium flowing through the tank connecting pipe and cannot recover heat. Therefore, the operation control unit opens the communication valve and pre-cooling supply valve when the temperature of the heat transfer medium in the heating-side return pipe is lower than the temperature of the heat transfer medium in the tank connecting pipe. This operation allows the heat transfer medium passing through the semiconductor manufacturing equipment to cool the heat transfer medium flowing through the tank connecting pipe and recover heat.

[0018] In one aspect, the heat medium supply device further includes a preheating heat exchanger connected to the tank connecting pipe and configured to heat the heat medium flowing through the tank connecting pipe from the cooling-side tank toward the heating-side tank, a preheating heat medium supply pipe branching from the cooling-side return pipe and extending to the preheating heat exchanger, and a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling-side return pipe, and the cooling device is provided on the cooling-side return pipe and configured to cool the heat medium flowing through the cooling-side return pipe, and the branching point of the preheating heat medium supply pipe from the cooling-side return pipe is The preheating heat exchanger is located upstream of the cooling device and is configured to supply the heat medium to the preheating heat exchanger before being cooled by the cooling device, and the connection point between the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device and is configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling side return pipe, and the preheating heat exchanger is configured to exchange heat between the heat medium flowing through the tank connecting pipe from the cooling side tank to the heating side tank and the heat medium supplied through the preheating heat medium supply pipe.

[0019] The preheating heat exchanger exchanges heat between the heat medium flowing through the tank connecting pipe from the cooling-side tank to the heating-side tank and the heat medium that has passed through the semiconductor manufacturing equipment. The heat from the heat medium that has passed through the semiconductor manufacturing equipment is recovered by the heat medium flowing through the tank connecting pipe, which allows the temperature of the heat medium flowing from the cooling-side tank to the heating-side tank to be raised without using an external energy source. In addition, the heat medium that has absorbed heat in the preheating heat exchanger is sent to a cooling device and cooled by the cooling device. Because the temperature of the heat medium that has absorbed heat has already been lowered, the load on the cooling device is reduced, achieving energy savings.

[0020] In one aspect, the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe are each connected to the plurality of semiconductor manufacturing equipment.

[0021] In one aspect, a heat medium supplying device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing device includes a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing device, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing device, a heating-side tank and a cooling-side tank for holding the heat medium, a tank connecting pipe for connecting the heating-side tank and the cooling-side tank, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the cooling-side tank, a preheating heat exchanger connected to the tank connecting pipe and for heating the heat medium that flows through the tank connecting pipe from the cooling-side tank toward the heating-side tank, a preheating heat medium supply pipe branching from the cooling-side return pipe and extending to the preheating heat exchanger, and a heat medium supply pipe branching from the cooling-side return pipe and extending to the preheating heat exchanger. a preheating heat medium return pipe extending from a tank connected to the cooling-side return pipe, the cooling device being provided on the cooling-side return pipe and configured to cool the heat medium flowing through the cooling-side return pipe, a branch point of the preheating heat medium supply pipe from the cooling-side return pipe being located upstream of the cooling device and configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger, a connection point between the preheating heat medium return pipe and the cooling-side return pipe being located upstream of the cooling device and configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling-side return pipe, and the preheating heat exchanger being configured to exchange heat between the heat medium flowing through the tank connecting pipe from the cooling-side tank toward the heating-side tank and the heat medium supplied through the preheating heat medium supply pipe.

[0022] The preheating heat exchanger exchanges heat between the heat medium flowing through the tank connecting pipe from the cooling-side tank to the heating-side tank and the heat medium that has passed through the semiconductor manufacturing equipment. The heat from the heat medium that has passed through the semiconductor manufacturing equipment is recovered by the heat medium flowing through the tank connecting pipe, which allows the temperature of the heat medium flowing from the cooling-side tank to the heating-side tank to be raised without using an external energy source. In addition, the heat medium that has absorbed heat in the preheating heat exchanger is sent to a cooling device and cooled by the cooling device. Because the temperature of the heat medium that has absorbed heat has already been lowered, the load on the cooling device is reduced, achieving energy savings.

[0023] In one aspect, the heat transfer medium supply device further includes a communication valve provided in the tank communication pipe, a preheating supply valve provided in the preheating heat transfer medium return pipe or the preheating heat transfer medium supply pipe, and an operation control unit that controls the operation of the communication valve and the preheating supply valve, and the operation control unit is configured to open the preheating supply valve while the communication valve is open.

[0024] While the communication valve is open, the preheat supply valve is also open, and the heat transfer medium that has passed through the semiconductor manufacturing equipment is sent to the preheat heat exchanger. Therefore, the heat transfer medium flowing through the tank communication pipe is heated in the preheat heat exchanger. As a result, the low-temperature heat transfer medium in the cooling-side tank is prevented from moving directly to the high-temperature tank.

[0025] In one aspect, the heat medium supply device further includes a cooling side return temperature measuring device provided in the cooling side return pipe at a position upstream of the cooling device, and a communication temperature measuring device provided in the tank communication pipe, and the operation control unit is configured to open the communication valve and the preheating supply valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side return temperature measuring device is higher than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

[0026] At some stage in the manufacturing process performed by the semiconductor manufacturing equipment, the heat transfer medium may be cooled by the semiconductor manufacturing equipment. If the heat transfer medium passing through the semiconductor manufacturing equipment is at a low temperature, it cannot heat the heat transfer medium flowing through the tank connecting pipe, and the heat transfer medium flowing through the tank connecting pipe cannot recover heat from the heat transfer medium that has passed through the semiconductor manufacturing equipment. Therefore, the operation control unit opens the communication valve and the preheat supply valve when the temperature of the heat transfer medium in the cooling-side return pipe is higher than that of the heat transfer medium in the tank connecting pipe. This operation allows the heat transfer medium that has passed through the semiconductor manufacturing equipment to heat the heat transfer medium flowing through the tank connecting pipe, and the heat transfer medium flowing through the tank connecting pipe to recover heat from the heat transfer medium that has passed through the semiconductor manufacturing equipment.

[0027] In one aspect, the heat medium supply device further includes a pre-cooling heat exchanger connected to the tank connecting pipe and cooling the heat medium flowing through the tank connecting pipe from the heating-side tank toward the cooling-side tank, a pre-cooling heat medium supply pipe branching from the heating-side return pipe and extending to the pre-cooling heat exchanger, and a pre-cooling heat medium return pipe extending from the pre-cooling heat exchanger and connected to the heating-side return pipe, the heating device is provided on the heating-side return pipe and is configured to heat the heat medium flowing through the heating-side return pipe, and the branch point of the pre-cooling heat medium supply pipe from the heating-side return pipe is The pre-cooling heat exchanger is located upstream of the heating device and is configured to supply the heat medium to the pre-cooling heat exchanger before being heated by the heating device, the connection point between the pre-cooling heat medium return pipe and the heating side return pipe is located upstream of the heating device and is configured to supply the heat medium that has passed through the pre-cooling heat exchanger to the heating device through the heating side return pipe, and the pre-cooling heat exchanger is configured to exchange heat between the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank and the heat medium supplied through the pre-cooling heat medium supply pipe.

[0028] The pre-cooling heat exchanger exchanges heat between the heat medium flowing through the tank connecting pipe from the heating-side tank to the cooling-side tank and the heat medium that has passed through the semiconductor manufacturing equipment. The heat of the heat medium flowing through the tank connecting pipe is recovered by the heat medium that has passed through the semiconductor manufacturing equipment, thereby lowering the temperature of the heat medium flowing from the heating-side tank to the cooling-side tank without using an external energy source. In addition, the heat medium that has recovered heat in the pre-cooling heat exchanger is sent to a heating device and heated by the heating device. Because the temperature of the heat medium that has recovered heat has already been raised, the load on the heating device is reduced, achieving energy savings.

[0029] In one aspect, the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe are each connected to the plurality of semiconductor manufacturing equipment.

[0030] The heat medium supplying device exchanges heat between the heat medium flowing through the tank connecting pipe and the heat medium that has passed through the semiconductor manufacturing equipment. Because the heat medium that has passed through the semiconductor manufacturing equipment is used as energy for temperature adjustment, the heat medium supplying device can lower the temperature of the heat medium moving from the heating-side tank to the cooling-side tank or raise the temperature of the heat medium moving from the cooling-side tank to the heating-side tank without using external energy.

[0031] Fig. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device and semiconductor manufacturing equipment. Fig. 2 is a schematic diagram showing another embodiment of the heat medium supplying device. Fig. 3 is a schematic diagram showing yet another embodiment of the heat medium supplying device. Fig. 4 is a schematic diagram showing yet another embodiment of the heat medium supplying device. Fig. 5 is a schematic diagram showing yet another embodiment of the heat medium supplying device. Fig. 6 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device and a plurality of semiconductor manufacturing equipment. Fig. 7 is a schematic diagram showing a conventional example of a heat medium supplying device that supplies a heat medium to semiconductor manufacturing equipment.

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. Fig. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device 1 and a semiconductor manufacturing apparatus 2. The heat medium supplying device 1 is configured to supply a heat medium to the semiconductor manufacturing apparatus 2 (e.g., an etching apparatus, a CVD apparatus, a PVD apparatus, etc.) to adjust the temperature of the semiconductor manufacturing apparatus 2.

[0033] As shown in Fig. 1, the semiconductor manufacturing system includes a heating medium supplying device 1, a heating medium mixer 5 connected to the heating medium supplying device 1, and semiconductor manufacturing equipment 2 connected to the heating medium mixer 5. The heating medium supplying device 1 is connected to the semiconductor manufacturing equipment 2 via the heating medium mixer 5. In the embodiment shown in Fig. 1, an etching device that performs dry etching on wafers is used as the semiconductor manufacturing equipment 2, but the semiconductor manufacturing equipment 2 is not limited to this embodiment.

[0034] The heat medium supplying device 1 includes a heating device 7 that heats the heat medium, a cooling device 8 that cools the heat medium, a heating medium transfer pipe 11 that sends the heated heat medium to the semiconductor manufacturing equipment 2, and a cooling medium transfer pipe 12 that sends the cooled heat medium to the semiconductor manufacturing equipment 2. The heating medium transfer pipe 11 and the cooling medium transfer pipe 12 are connected to a heat medium mixer 5 and communicate with the semiconductor manufacturing equipment 2 via the heat medium mixer 5. The heat medium mixer 5 includes a plurality of flow control valves (not shown) that communicate with the heating medium transfer pipe 11 and the cooling medium transfer pipe 12, respectively. The heat medium mixer 5 is configured to adjust the temperature required for the semiconductor manufacturing equipment 2 by mixing the heated heat medium and the cooled heat medium while adjusting the flow rates of the heated heat medium and the cooled heat medium.

[0035] In one embodiment, a fluorine-based inert liquid is used as the heat medium. An example of the heating device 7 is an electric heater. An example of the cooling device 8 is a vapor compression refrigerator, an absorption refrigerator, etc. Vapor compression refrigerators include turbo refrigerators, screw refrigerators, rotary refrigerators, scroll refrigerators, etc., and any of these can be used. The configurations of the heating device 7 and the cooling device 8 are not particularly limited as long as they can heat and cool the heat medium.

[0036] The heat medium supplying device 1 further includes a heating-side tank 15 and a cooling-side tank 16 that hold a heat medium, a tank connecting pipe 20 that connects the heating-side tank 15 and the cooling-side tank 16, a connecting valve 21 provided in the tank connecting pipe 20, a heating-side return pipe 25 that returns the heat medium that has passed through the semiconductor manufacturing apparatus 2 to the heating-side tank 15, and a cooling-side return pipe 26 that returns the heat medium that has passed through the semiconductor manufacturing apparatus 2 to the cooling-side tank 16. The heating-side return pipe 25 extends from the heating medium mixer 5 to the heating-side tank 15. The cooling-side return pipe 26 extends from the heating medium mixer 5 to the cooling-side tank 16. The heating medium transfer pipe 11 extends from the heating-side tank 15 to the heating medium mixer 5. The cooling medium transfer pipe 12 extends from the cooling-side tank 16 to the heating medium mixer 5. The gas layer of the heating-side tank 15 and the gas layer of the cooling-side tank 16 are connected by a gas layer communication pipe 17. The gas layer communication pipe 17 is located at a position higher than the liquid level of the heat medium in the heating-side tank 15 and the cooling-side tank 16.

[0037] The heating device 7 is provided in the heating-side return pipe 25 and is configured to heat the heat medium flowing through the heating-side return pipe 25. The heating device 7 is arranged upstream of the heating-side tank 15. The heat medium heated by the heating device 7 is transferred to the heating-side tank 15 through the heating-side return pipe 25 and stored in the heating-side tank 15. The heat medium supplying device 1 is equipped with a heating-side liquid level detecting device 31 that detects the liquid level of the heat medium in the heating-side tank 15.

[0038] The heating medium supplying device 1 includes a heating-side pump 33 connected to a heating medium transfer pipe 11. When the heating-side pump 33 is operated, the heating medium (heated heating medium) in the heating-side tank 15 is sent through the heating medium transfer pipe 11 to the heating medium mixer 5, and then sent from the heating medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0039] The cooling device 8 is provided in the cooling medium transfer pipe 12 and is configured to cool the heat medium flowing through the cooling medium transfer pipe 12. The cooling device 8 is arranged downstream of the cooling-side tank 16. The heat medium supplying device 1 includes a cooling-side pump 34 connected to the cooling medium transfer pipe 12. When the cooling-side pump 34 is operated, the heat medium is cooled by the cooling device 8 while flowing from the cooling-side tank 16 through the cooling medium transfer pipe 12. The cooled heat medium is sent to the heat medium mixer 5 through the cooling medium transfer pipe 12, and further sent from the heat medium mixer 5 to the semiconductor manufacturing apparatus 2. The heat medium supplying device 1 includes a cooling-side liquid level detecting device 32 that detects the liquid level of the heat medium in the cooling-side tank 16.

[0040] The heated and cooled heat mediums are mixed in the heat medium mixer 5 to generate a heat medium having a preset temperature. The heat medium at the preset temperature is transferred from the heat medium mixer 5 to the semiconductor manufacturing equipment 2 and heats or cools wafers (not shown) inside the semiconductor manufacturing equipment 2 as it passes through the semiconductor manufacturing equipment 2. The heat medium that has passed through the semiconductor manufacturing equipment 2 is returned to the heat medium mixer 5 and splits into two flows. One of the two flows flows into the heating-side return pipe 25, and the other flows into the cooling-side return pipe 26. The heat medium that has flowed into the heating-side return pipe 25 is heated by the heating device 7 and then flows into the heating-side tank 15. The heat medium that has flowed into the cooling-side return pipe 26 flows through the cooling-side return pipe 26 into the cooling-side tank 16.

[0041] In this way, the heat medium circulates between the heating-side tank 15 and the semiconductor manufacturing equipment 2 through the heating medium transfer pipe 11 and the heating-side return pipe 25, and simultaneously circulates between the cooling-side tank 16 and the semiconductor manufacturing equipment 2 through the cooling medium transfer pipe 12 and the cooling-side return pipe 26. As the heat medium circulates between the heat medium supply device 1 and the semiconductor manufacturing equipment 2, a difference occurs between the liquid level of the heat medium in the heating-side tank 15 and the liquid level of the heat medium in the cooling-side tank 16.

[0042] The heat medium supply device 1 of this embodiment is configured to move the heat medium from the heating-side tank 15 to the cooling-side tank 16 as follows when the liquid level of the heat medium in the heating-side tank 15 is too high or when the liquid level of the heat medium in the cooling-side tank 16 is too low.

[0043] The heat medium supplying device 1 includes an operation control unit 35 that controls the operation of the communication valve 21 provided in the tank communication pipe 20. The operation control unit 35 is configured to open the communication valve 21 to move the heat medium from the heating-side tank 15 to the cooling-side tank 16 through the tank communication pipe 20 when the liquid level of the heat medium in the heating-side tank 15 detected by the heating-side liquid level detecting device 31 exceeds a predetermined upper limit level, or when the liquid level of the heat medium in the cooling-side tank 16 detected by the cooling-side liquid level detecting device 32 falls below a predetermined lower limit level. The driving force for moving the heat medium is the difference in liquid head between the heating-side tank 15 and the cooling-side tank 16.

[0044] The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a in which programs and the like are stored, and an arithmetic unit 35b that executes calculations according to instructions included in the programs. The storage device 35a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic unit 35b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0045] When the liquid level of the heat medium in the heating-side tank 15 drops to a predetermined level as a result of the movement of the heat medium, or when the liquid level of the heat medium in the cooling-side tank 16 rises to a predetermined level, the operation control unit 35 is configured to close the communication valve 21. The communication valve 21 is an actuator-driven valve such as an electric valve.

[0046] The heat medium supplying device 1 is configured to cool the heat medium moving from the heating-side tank 15 to the cooling-side tank 16 through the tank connecting pipe 20 when the connecting valve 21 is open. More specifically, the heat medium supplying device 1 includes a pre-cooling heat exchanger 40 connected to the tank connecting pipe 20 and cooling the heat medium flowing through the tank connecting pipe 20 from the heating-side tank 15 to the cooling-side tank 16, a pre-cooling heat medium supply pipe 41 branching from the heating-side return pipe 25 and extending to the pre-cooling heat exchanger 40, and a pre-cooling heat medium return pipe 42 extending from the pre-cooling heat exchanger 40 and connected to the heating-side return pipe 25.

[0047] The heat medium supply device 1 further includes a pre-cooling supply valve 45 provided in the pre-cooling heat medium return pipe 42. In this embodiment, the pre-cooling supply valve 45 is a three-way valve and is disposed at a connection point C1 between the pre-cooling heat medium return pipe 42 and the heating side return pipe 25. The pre-cooling supply valve 45 is an actuator-driven valve such as an electric valve. In one embodiment, the pre-cooling supply valve 45 may be a two-way valve (on-off valve). The pre-cooling supply valve 45 is electrically connected to the operation control unit 35, and the operation of the pre-cooling supply valve 45 is controlled by the operation control unit 35.

[0048] When the operation control unit 35 opens the pre-cooling supply valve 45, the pre-cooling heat medium return pipe 42 is connected to the heating side return pipe 25, and as a result, at least a portion of the heat medium flowing through the heating side return pipe 25 flows into the pre-cooling heat medium supply pipe 41. The heat medium is transferred to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41. When the operation control unit 35 closes the pre-cooling supply valve 45, communication between the pre-cooling heat medium return pipe 42 and the heating side return pipe 25 is blocked. As a result, the supply of the heat medium to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41 is stopped.

[0049] The pre-cooling heat exchanger 40 is configured to exchange heat between the heat medium supplied through the pre-cooling heat medium supply pipe 41 and the heat medium flowing through the tank connecting pipe 20 from the heating-side tank 15 to the cooling-side tank 16. The heat medium flowing through the tank connecting pipe 20 is a heat medium heated by the heating device 7 and has a high temperature. On the other hand, the heat medium flowing through the pre-cooling heat medium supply pipe 41 is a mixture of the heated and cooled heat medium. Therefore, the temperature of the heat medium flowing through the pre-cooling heat medium supply pipe 41 is lower than the temperature of the heat medium flowing through the tank connecting pipe 20. In the pre-cooling heat exchanger 40, the heat of the heat medium flowing through the tank connecting pipe 20 is recovered by the heat medium transferred through the pre-cooling heat medium supply pipe 41. As a result, the temperature of the heat medium flowing through the tank connecting pipe 20 decreases, and then the heat medium with the decreased temperature flows into the cooling-side tank 16.

[0050] In this way, the pre-cooling heat exchanger 40 can lower the temperature of the heat medium flowing from the heating-side tank 15 to the cooling-side tank 16 without using external energy. Since an excessive temperature rise of the heat medium in the cooling-side tank 16 is prevented, the load on the cooling device 8 can be reduced, and the heat medium supply device 1 can accurately control the temperature of the heat medium to be supplied to the semiconductor manufacturing equipment 2.

[0051] A branch point B1 of the pre-cooling heat medium supply pipe 41 from the heating side return pipe 25 is located upstream of the heating device 7, and supplies the heat medium before it is heated by the heating device 7 to the pre-cooling heat exchanger 40. A connection point C1 between the pre-cooling heat medium return pipe 42 and the heating side return pipe 25 is also located upstream of the heating device 7, and the heat medium that has passed through the pre-cooling heat exchanger 40 is supplied to the heating device 7 through the pre-cooling heat medium return pipe 42 and the heating side return pipe 25. The branch point B1 is located upstream of the connection point C1.

[0052] The heat medium flowing through the pre-cooling heat medium return pipe 42 has already been heated by the heat recovery in the pre-cooling heat exchanger 40. Therefore, the heat medium that has passed through the pre-cooling heat medium return pipe 42 is sent to the heating device 7 in an elevated temperature state, and is further heated by the heating device 7. Because the temperature of the heat medium from which heat has been recovered has already been elevated, the load on the heating device 7 is reduced, and energy savings can be achieved.

[0053] The operation control unit 35 is configured to open the pre-cooling supply valve 45 while the communication valve 21 is open. While the communication valve 21 is open, the pre-cooling supply valve 45 is opened, and the heat medium that has passed through the semiconductor manufacturing equipment 2 is sent to the pre-cooling heat exchanger 40. Therefore, the heat medium flowing through the tank communication pipe 20 is cooled by the pre-cooling heat exchanger 40. As a result, the high-temperature heat medium in the heating-side tank 15 is prevented from moving directly to the low-temperature-side tank.

[0054] The heat medium supplying device 1 further includes a heating-side return temperature measuring device 47 provided in the heating-side return pipe 25 at a position upstream of the heating device 7, and a communication temperature measuring device 51 provided in the tank connecting pipe 20. The communication temperature measuring device 51 is disposed between the heating-side tank 15 and the connecting valve 21. The heating-side return temperature measuring device 47 and the communication temperature measuring device 51 are electrically connected to the operation control unit 35. The measured value of the temperature of the heat medium in the heating-side return pipe 25 measured by the heating-side return temperature measuring device 47 and the measured value of the temperature of the heat medium in the tank connecting pipe 20 measured by the connecting temperature measuring device 51 are sent to the operation control unit 35. The operation control unit 35 is configured to open the connecting valve 21 and the pre-cooling supply valve 45 when the temperature of the heat medium in the heating-side return pipe 25 is lower than the temperature of the heat medium in the tank connecting pipe 20.

[0055] At a certain stage in the manufacturing process performed by the semiconductor manufacturing equipment 2, the heat medium may be heated by the semiconductor manufacturing equipment 2. If the heat medium that has passed through the semiconductor manufacturing equipment 2 is at a high temperature, it cannot cool the heat medium flowing in the tank connecting pipe 20 and cannot recover heat. Therefore, the operation control unit 35 opens the communication valve 21 and the pre-cooling supply valve 45 when the temperature of the heat medium in the heating-side return pipe 25 is lower than the temperature of the heat medium in the tank connecting pipe 20. Through this operation, the heat medium that has passed through the semiconductor manufacturing equipment 2 can cool the heat medium flowing in the tank connecting pipe 20 and recover heat.

[0056] In the embodiment shown in FIG. 1 , the pre-cooling supply valve 45 is provided in the pre-cooling heat medium return pipe 42. However, in one embodiment, the pre-cooling supply valve 45 may be provided in the pre-cooling heat medium supply pipe 41. For example, the pre-cooling supply valve 45 may be provided at a branch point B1 of the pre-cooling heat medium supply pipe 41 from the heating side return pipe 25. In this configuration, when the pre-cooling supply valve 45 is opened, the pre-cooling heat medium supply pipe 41 is connected to the heating side return pipe 25. As a result, at least a portion of the heat medium flowing through the heating side return pipe 25 flows into the pre-cooling heat medium supply pipe 41. When the pre-cooling supply valve 45 is closed, communication between the pre-cooling heat medium supply pipe 41 and the heating side return pipe 25 is blocked. As a result, the supply of the heat medium to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41 is stopped.

[0057] Fig. 2 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment described with reference to Fig. 1, and therefore, redundant description will be omitted. In the embodiment shown in Fig. 2, the pre-cooling supply valve 45 provided in the pre-cooling heat medium return pipe 42 is a two-way valve (on-off valve). The pre-cooling supply valve 45 is an actuator-driven valve such as an electric valve.

[0058] The heating medium supplying device 1 includes a heating-side flow rate limiting device 55 provided in the heating-side return pipe 25. The heating-side flow rate limiting device 55 is disposed upstream of the heating device 7. More specifically, the heating-side flow rate limiting device 55 is located downstream of a branch point B1 where the pre-cooling heating medium supply pipe 41 branches off from the heating-side return pipe 25, and upstream of a connection point C1 between the pre-cooling heating medium return pipe 42 and the heating-side return pipe 25.

[0059] The heating-side flow rate limiting device 55 is configured to limit the flow rate of the heat medium flowing through the heating-side return pipe 25. Specific examples of the heating-side flow rate limiting device 55 include an orifice and a flow rate control valve. A portion of the heat medium flowing through the heating-side return pipe 25 is transferred to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41, and the other portion of the heat medium flowing through the heating-side return pipe 25 passes through the heating-side flow rate limiting device 55 and is transferred to the heating device 7.

[0060] In this embodiment as well, the pre-cooling heat exchanger 40 can lower the temperature of the heat medium flowing from the heating-side tank 15 to the cooling-side tank 16 without using external energy. In addition, the heat medium from which heat has been recovered in the pre-cooling heat exchanger 40 is sent to the heating device 7 and heated by the heating device 7. Because the temperature of the heat medium from which heat has been recovered has already increased, the load on the heating device 7 is reduced, and energy savings can be achieved.

[0061] 2, the pre-cooling supply valve 45 is provided in the pre-cooling heat medium return pipe 42, but in one embodiment, the pre-cooling supply valve 45 may be provided in the pre-cooling heat medium supply pipe 41. In this configuration, when the pre-cooling supply valve 45 is opened, the pre-cooling heat medium supply pipe 41 is connected to the heating side return pipe 25, and as a result, a portion of the heat medium flowing through the heating side return pipe 25 flows into the pre-cooling heat medium supply pipe 41. When the pre-cooling supply valve 45 is closed, communication between the pre-cooling heat medium supply pipe 41 and the heating side return pipe 25 is blocked. As a result, the supply of the heat medium to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41 is stopped.

[0062] Fig. 3 is a schematic diagram showing another embodiment of the heat medium supplying device 1. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to Fig. 1, and therefore redundant description will be omitted. The heat medium supplying device 1 of the embodiment shown in Fig. 3 includes a preheating heat exchanger 60, instead of the precooling heat exchanger 40, that heats the heat medium flowing through the tank connecting pipe 20 from the cooling-side tank 16 to the heating-side tank 15.

[0063] 3 , the heat medium supplying device 1 includes the preheating heat exchanger 60 connected to the tank connecting pipe 20, a preheating heat medium supply pipe 61 branching from the cooling-side return pipe 26 and extending to the preheating heat exchanger 60, and a preheating heat medium return pipe 62 extending from the preheating heat exchanger 60 and connected to the cooling-side return pipe 26. The cooling device 8 is provided in the cooling-side return pipe 26 and configured to cool the heat medium flowing through the cooling-side return pipe 26. The heat medium cooled by the cooling device 8 is transferred through the cooling-side return pipe 26 to the cooling-side tank 16 and stored in the cooling-side tank 16.

[0064] The heat medium supply device 1 of this embodiment is configured to move the heat medium from the cooling-side tank 16 to the heating-side tank 15 as follows when the liquid level of the heat medium in the cooling-side tank 16 is too high or when the liquid level of the heat medium in the heating-side tank 15 is too low.

[0065] The operation control unit 35 is configured to open the communication valve 21 to move the heat medium from the cooling-side tank 16 to the heating-side tank 15 through the tank communication pipe 20 when the liquid level of the heat medium in the cooling-side tank 16 detected by the cooling-side liquid level detection device 32 exceeds a preset upper limit level, or when the liquid level of the heat medium in the heating-side tank 15 detected by the heating-side liquid level detection device 31 falls below a preset lower limit level. The driving force for moving the heat medium is the difference in liquid head between the heating-side tank 15 and the cooling-side tank 16.

[0066] The preheating heat exchanger 60 is configured to heat the heat medium that moves from the cooling-side tank 16 to the heating-side tank 15 through the tank communication pipe 20 when the communication valve 21 is open. When the liquid level of the heat medium in the cooling-side tank 16 drops to a predetermined level as a result of the movement of the heat medium, or when the liquid level of the heat medium in the heating-side tank 15 rises to a predetermined level, the operation control unit 35 is configured to close the communication valve 21.

[0067] The heat medium supply device 1 further includes a preheating supply valve 65 provided in the preheating heat medium return pipe 62. In this embodiment, the preheating supply valve 65 is a three-way valve and is disposed at a connection point C2 between the preheating heat medium return pipe 62 and the cooling-side return pipe 26. The preheating supply valve 65 is an actuator-driven valve such as an electric valve. In one embodiment, the preheating supply valve 65 may be a two-way valve (on-off valve). The preheating supply valve 65 is electrically connected to the operation control unit 35, and the operation of the preheating supply valve 65 is controlled by the operation control unit 35.

[0068] When the operation control unit 35 opens the preheating supply valve 65, the preheating heat medium return pipe 62 is connected to the cooling-side return pipe 26, and as a result, at least a portion of the heat medium flowing through the cooling-side return pipe 26 flows into the preheating heat medium supply pipe 61. The heat medium is transferred to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61. When the operation control unit 35 closes the preheating supply valve 65, communication between the preheating heat medium return pipe 62 and the cooling-side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0069] The preheating heat exchanger 60 is configured to exchange heat between the heat medium supplied through the preheating heat medium supply pipe 61 and the heat medium flowing through the tank connecting pipe 20 from the cooling-side tank 16 to the heating-side tank 15. The heat medium flowing through the tank connecting pipe 20 is a heat medium cooled by the cooling device 8 and has a low temperature. On the other hand, the heat medium flowing through the preheating heat medium supply pipe 61 is a mixture of a heated heat medium and a cooled heat medium. Therefore, the temperature of the heat medium flowing through the preheating heat medium supply pipe 61 is higher than the temperature of the heat medium flowing through the tank connecting pipe 20. In the preheating heat exchanger 60, the heat of the heat medium transferred through the preheating heat medium supply pipe 61 is recovered by the heat medium flowing through the tank connecting pipe 20. As a result, the temperature of the heat medium flowing through the tank connecting pipe 20 rises, and then the heat medium with the increased temperature flows into the heating-side tank 15.

[0070] In this way, the preheating heat exchanger 60 can increase the temperature of the heat medium flowing from the cooling-side tank 16 to the heating-side tank 15 without using external energy. Since an excessive decrease in temperature of the heat medium in the heating-side tank 15 is prevented, the load on the heating device 7 can be reduced, and the heat medium supplying device 1 can accurately control the temperature of the heat medium to be supplied to the semiconductor manufacturing equipment 2.

[0071] A branch point B2 of the preheating heat medium supply pipe 61 from the cooling side return pipe 26 is located upstream of the cooling device 8, and supplies the heat medium before being cooled by the cooling device 8 to the preheating heat exchanger 60. A connection point C2 between the preheating heat medium return pipe 62 and the cooling side return pipe 26 is also located upstream of the cooling device 8, and the heat medium that has passed through the preheating heat exchanger 60 is supplied to the cooling device 8 through the preheating heat medium return pipe 62 and the cooling side return pipe 26. The branch point B2 is located upstream of the connection point C2.

[0072] The heat medium flowing through the preheating heat medium return pipe 62 has already been cooled by having heat removed in the preheating heat exchanger 60. Therefore, the heat medium that has passed through the preheating heat medium return pipe 62 is sent to the cooling device 8 in a state where its temperature has been reduced, and is further cooled by the cooling device 8. Because the temperature of the heat medium from which heat has been removed has already been reduced, the load on the cooling device 8 is reduced, and energy savings can be achieved.

[0073] The operation control unit 35 is configured to open the preheating supply valve 65 while the communication valve 21 is open. While the communication valve 21 is open, the preheating supply valve 65 is opened, and the heat medium that has passed through the semiconductor manufacturing equipment 2 is sent to the preheating heat exchanger 60. Therefore, the heat medium flowing through the tank communication pipe 20 is heated by the preheating heat exchanger 60. As a result, the low-temperature heat medium in the cooling-side tank 16 is prevented from moving directly to the high-temperature-side tank.

[0074] The heat medium supplying device 1 further includes a cooling-side return temperature measuring device 67 provided in the cooling-side return pipe 26 at a position upstream of the cooling device 8, and a communication temperature measuring device 52 provided in the tank connecting pipe 20. The communication temperature measuring device 52 is disposed between the cooling-side tank 16 and the connecting valve 21. The cooling-side return temperature measuring device 67 and the communication temperature measuring device 52 are electrically connected to the operation control unit 35. The measured value of the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side return temperature measuring device 67 and the measured value of the temperature of the heat medium in the tank connecting pipe 20 measured by the connecting temperature measuring device 52 are sent to the operation control unit 35. The operation control unit 35 is configured to open the connecting valve 21 and the preheating supply valve 65 when the temperature of the heat medium in the cooling-side return pipe 26 is higher than the temperature of the heat medium in the tank connecting pipe 20.

[0075] At a certain stage in the manufacturing process performed by the semiconductor manufacturing equipment 2, the heat medium may be cooled by the semiconductor manufacturing equipment 2. If the heat medium that has passed through the semiconductor manufacturing equipment 2 is at a low temperature, the heat medium cannot heat the heat medium flowing in the tank connecting pipe 20, and the heat medium flowing in the tank connecting pipe 20 cannot recover heat from the heat medium that has passed through the semiconductor manufacturing equipment 2. Therefore, the operation control unit 35 opens the communication valve 21 and the preheat supply valve 65 when the temperature of the heat medium in the cooling-side return pipe 26 is higher than the temperature of the heat medium in the tank connecting pipe 20. Through this operation, the heat medium that has passed through the semiconductor manufacturing equipment 2 can heat the heat medium flowing in the tank connecting pipe 20, and the heat medium flowing in the tank connecting pipe 20 can recover heat from the heat medium that has passed through the semiconductor manufacturing equipment 2.

[0076] In the embodiment shown in FIG. 3 , the preheating supply valve 65 is provided in the preheating heat medium return pipe 62. However, in one embodiment, the preheating supply valve 65 may be provided in the preheating heat medium supply pipe 61. For example, the preheating supply valve 65 may be provided at branch point B2 of the preheating heat medium supply pipe 61 from the cooling-side return pipe 26. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 communicates with the cooling-side return pipe 26. As a result, at least a portion of the heat medium flowing through the cooling-side return pipe 26 flows into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, communication between the preheating heat medium supply pipe 61 and the cooling-side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0077] Fig. 4 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment described with reference to Fig. 3, and therefore, redundant description will be omitted. In the embodiment shown in Fig. 4, the preheating supply valve 65 provided in the preheating heat medium return pipe 62 is a two-way valve (open / close valve). The preheating supply valve 65 is an actuator-driven valve such as an electric valve.

[0078] The heat medium supplying device 1 includes a cooling-side flow rate limiting device 75 provided in the cooling-side return pipe 26. The cooling-side flow rate limiting device 75 is arranged upstream of the cooling device 8. More specifically, the cooling-side flow rate limiting device 75 is located downstream of a branch point B2 where the preheating heat medium supply pipe 61 branches off from the cooling-side return pipe 26, and upstream of a connection point C2 between the preheating heat medium return pipe 62 and the cooling-side return pipe 26.

[0079] The cooling-side flow rate limiting device 75 is configured to limit the flow rate of the heat medium flowing through the cooling-side return pipe 26. Specific examples of the cooling-side flow rate limiting device 75 include an orifice and a flow rate control valve. A portion of the heat medium flowing through the cooling-side return pipe 26 is transferred to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61, and the other portion of the heat medium flowing through the cooling-side return pipe 26 passes through the cooling-side flow rate limiting device 75 and is transferred to the cooling device 8.

[0080] In this embodiment as well, the preheating heat exchanger 60 can increase the temperature of the heat medium flowing from the cooling-side tank 16 to the heating-side tank 15 without using external energy. In addition, the heat medium from which heat has been removed in the preheating heat exchanger 60 is sent to the cooling device 8 and cooled by the cooling device 8. Because the temperature of the heat medium from which heat has been removed has already dropped, the load on the cooling device 8 is reduced, and energy savings can be achieved.

[0081] 4, the preheating supply valve 65 is provided in the preheating heat medium return pipe 62, but in one embodiment, the preheating supply valve 65 may be provided in the preheating heat medium supply pipe 61. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 is connected to the cooling-side return pipe 26, and as a result, at least a portion of the heat medium flowing through the cooling-side return pipe 26 flows into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, communication between the preheating heat medium supply pipe 61 and the cooling-side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0082] Fig. 5 is a schematic diagram showing an embodiment of the heat medium supplying device 1 that combines the embodiment shown in Fig. 1 and the embodiment shown in Fig. 3. The heat medium supplying device 1 of the embodiment shown in Fig. 5 includes both a pre-cooling heat exchanger 40 that cools the heat medium flowing through the tank connecting pipe 20 from the heating-side tank 15 to the cooling-side tank 16, and a pre-heating heat exchanger 60 that heats the heat medium flowing through the tank connecting pipe 20 from the cooling-side tank 16 to the heating-side tank 15. Other configurations of this embodiment that are not particularly described are the same as those of the embodiments shown in Figs. 1 and 3, so duplicated descriptions will be omitted.

[0083] This embodiment, which is equipped with a pre-cooling heat exchanger 40 and a pre-heating heat exchanger 60, can reduce the thermal fluctuations in the heating side tank 15 and the cooling side tank 16 that occur due to the movement of the heat medium, and can also reduce the load on both the heating device 7 and the cooling device 8.

[0084] The heating-side flow rate limiting device 55 described with reference to Fig. 2 and the cooling-side flow rate limiting device 75 described with reference to Fig. 4 can also be applied to the embodiment shown in Fig. 5. The pre-cooling supply valve 45 may be provided in the pre-cooling heat medium supply pipe 41. The pre-heating supply valve 65 may be provided in the pre-heating heat medium supply pipe 61.

[0085] 6 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat medium supplying device 1 and a plurality of semiconductor manufacturing apparatuses 2. The heat medium supplying device 1 is the heat medium supplying device 1 of any of the embodiments described with reference to FIGS. 1 to 5. As shown in FIG. 6, the heat medium supplying device 1 is connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat medium mixers 5. More specifically, the heating medium transfer pipe 11, the cooling medium transfer pipe 12, the heating side return pipe 25, and the cooling side return pipe 26 of the heat medium supplying device 1 are each connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat medium mixers 5. The heat medium supplying device 1 of this embodiment can adjust the processing temperatures of the plurality of semiconductor manufacturing apparatuses 2.

[0086] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims.

[0087] The present invention can be used in a heat medium supplying device that supplies a heat medium to semiconductor manufacturing equipment, such as an etching equipment, a CVD equipment, or a PVD equipment, to adjust the temperature of the semiconductor manufacturing equipment.

[0088] REFERENCE SIGNS LIST 1 Heating medium supply device 2 Semiconductor manufacturing device 5 Heating medium mixer 7 Heating device 8 Cooling device 11 Heating medium transfer pipe 12 Cooling medium transfer pipe 15 Heating side tank 16 Cooling side tank 20 Tank connecting pipe 21 Connecting valve 25 Heating side return pipe 26 Cooling side return pipe 17 Gas layer connecting pipe 31 Heating side liquid level detection device 32 Cooling side liquid level detection device 33 Heating side pump 34 Cooling side pump 35 Operation control unit 40 Pre-cooling heat exchanger 41 Pre-cooling heat medium supply pipe 42 Pre-cooling heat medium return pipe 45 Pre-cooling supply valve 47 Heating side return temperature measuring device 51, 52 Connecting temperature measuring device 55 Heating side flow rate limiting device 60 Pre-heating heat exchanger 61 Pre-heating heat medium supply pipe 62 Pre-heating heat medium return pipe 65 Pre-heating supply valve 67 Cooling side return temperature measuring device 75 Cooling side flow rate limiting device B1, B2 Branch point C1, C2 Connection point

Claims

1. A heat medium supplying device for supplying a heat medium for adjusting a temperature of a semiconductor manufacturing equipment, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing equipment; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing equipment; a heating-side tank and a cooling-side tank for holding the heat medium; a tank connecting pipe for connecting the heating-side tank and the cooling-side tank; a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the heating-side tank; a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the cooling-side tank; a pre-cooling heat exchanger connected to the tank connecting pipe and for cooling the heat medium that flows through the tank connecting pipe from the heating-side tank to the cooling-side tank; a pre-cooling heat medium supply pipe branching off from the heating-side return pipe and extending to the pre-cooling heat exchanger; and a pre-cooling heat medium return pipe extending from the pre-cooling heat exchanger and connected to the heating-side return pipe, a branch point of the pre-cooling heat medium supply pipe from the heating side return pipe is located upstream of the heating device and is configured to supply the heat medium before being heated by the heating device to the pre-cooling heat exchanger; a connection point of the pre-cooling heat medium return pipe and the heating side return pipe is located upstream of the heating device and is configured to supply the heat medium that has passed through the pre-cooling heat exchanger to the heating device through the heating side return pipe; and the pre-cooling heat exchanger is configured to exchange heat between the heat medium flowing through the tank connecting pipe from the heating side tank to the cooling side tank and the heat medium supplied through the pre-cooling heat medium supply pipe.

2. The heat medium supply device of claim 1, further comprising: a communication valve provided in the tank communication pipe; a pre-cooling supply valve provided in the pre-cooling heat medium return pipe or the pre-cooling heat medium supply pipe; and an operation control unit that controls operation of the communication valve and the pre-cooling supply valve, wherein the operation control unit is configured to open the pre-cooling supply valve while the communication valve is open.

3. The heat medium supply device according to claim 2, further comprising: a heating side return temperature measuring device provided in the heating side return pipe at a position upstream of the heating device; and a communication temperature measuring device provided in the tank communication pipe, wherein the operation control unit is configured to open the communication valve and the pre-cooling supply valve when the temperature of the heat medium in the heating side return pipe measured by the heating side return temperature measuring device is lower than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

4. A preheating heat exchanger connected to the tank connecting pipe for heating the heat medium flowing through the tank connecting pipe from the cooling side tank to the heating side tank; a preheating heat medium supply pipe branching off from the cooling side return pipe and extending to the preheating heat exchanger; and a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling side return pipe, wherein the cooling device is provided on the cooling side return pipe and configured to cool the heat medium flowing through the cooling side return pipe, a branch point of the preheating heat medium supply pipe from the cooling side return pipe is located upstream of the cooling device and configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger, and a connection point of the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device and configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling side return pipe, 2. The heat medium supply device according to claim 1, wherein the preheating heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank connecting pipe from the cooling side tank toward the heating side tank and the heat medium supplied through the preheating heat medium supply pipe.

5. The heat medium supply device according to claim 1, wherein the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing equipment.

6. A heat medium supplying device for supplying a heat medium for adjusting a temperature of a semiconductor manufacturing equipment, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing equipment; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing equipment; a heating side tank and a cooling side tank for holding the heat medium; a tank connecting pipe for connecting the heating side tank and the cooling side tank; a heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the heating side tank; a cooling side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the cooling side tank; a preheating heat exchanger connected to the tank connecting pipe and for heating the heat medium that flows through the tank connecting pipe from the cooling side tank to the heating side tank; a preheating heat medium supply pipe branching off from the cooling side return pipe and extending to the preheating heat exchanger; and a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling side return pipe, a branch point of the preheating heat medium supply pipe from the cooling side return pipe located upstream of the cooling device and configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger; a connection point of the preheating heat medium return pipe and the cooling side return pipe located upstream of the cooling device and configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling side return pipe; and the preheating heat exchanger configured to perform heat exchange between the heat medium flowing through the tank connecting pipe from the cooling side tank to the heating side tank and the heat medium supplied through the preheating heat medium supply pipe.

7. The heat medium supply device according to claim 6, further comprising: a communication valve provided in the tank communication pipe; a preheating supply valve provided in the preheating heat medium return pipe or the preheating heat medium supply pipe; and an operation control unit that controls operation of the communication valve and the preheating supply valve, wherein the operation control unit is configured to open the preheating supply valve while the communication valve is open.

8. The heat medium supply device according to claim 7, further comprising: a cooling side return temperature measuring device provided in the cooling side return pipe at a position upstream of the cooling device; and a communication temperature measuring device provided in the tank communication pipe, wherein the operation control unit is configured to open the communication valve and the pre-heating supply valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side return temperature measuring device is higher than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

9. A pre-cooling heat exchanger connected to the tank connecting pipe for cooling the heat medium flowing through the tank connecting pipe from the heating side tank to the cooling side tank; a pre-cooling heat medium supply pipe branching off from the heating side return pipe and extending to the pre-cooling heat exchanger; and a pre-cooling heat medium return pipe extending from the pre-cooling heat exchanger and connected to the heating side return pipe, wherein the heating device is provided on the heating side return pipe and configured to heat the heat medium flowing through the heating side return pipe, a branch point of the pre-cooling heat medium supply pipe from the heating side return pipe is located upstream of the heating device and configured to supply the heat medium before being heated by the heating device to the pre-cooling heat exchanger, and a connection point of the pre-cooling heat medium return pipe and the heating side return pipe is located upstream of the heating device and configured to supply the heat medium that has passed through the pre-cooling heat exchanger to the heating device through the heating side return pipe, 7. The heat medium supply device according to claim 6, wherein the pre-cooling heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank and the heat medium supplied through the pre-cooling heat medium supply pipe.

10. The heat medium supply device according to claim 6, wherein the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing equipment.

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