Optical module

Abstract

An optical module (200) comprises a coherent optical assembly (902); the coherent optical assembly (902) comprises a cover shell (921) and a substrate (923); the substrate (923) is fixed on a circuit board (300); the cover shell (921) covers the substrate (923) to form a storage cavity; an optical chip, an optical matching chip, and an electrical adapter fixed member (922) are provided in the storage cavity; bonding pads are provided on first surfaces of the optical chip and the optical matching chip, and second surfaces of the optical chip and the optical matching chip are attached to the cover shell (921). The electrical adapter fixed member (922) is provided with a plurality of hollowed areas, the optical chip and the optical matching chip are placed in the corresponding hollowed areas, and gaps are provided between the first surfaces of the optical chip and the optical matching chip and the substrate (923).

Description

optical modules

[0001] This disclosure claims priority to the Chinese patent application filed with the China Patent Office on November 24, 2023, with application number 202311584680.1, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] A coherent optical module consists of a light source and a coherent optical component, which are connected to each other. Light from the light source enters the coherent optical component, where it is split into two beams. One beam, acting as the transmitted light, enters the coherent modulation chip inside the coherent optical component to convert the electrical signal into an optical signal. The converted high-speed optical signal is then output from the optical transmit interface. The other beam, acting as the local oscillator light, undergoes coherent demodulation with the high-speed optical signal input from the optical receive interface to complete the optical-to-electrical signal conversion.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module to improve heat dissipation efficiency.

[0006] According to some embodiments of the present disclosure, an optical module is provided, including:

[0007] circuit boards;

[0008] A coherent optical component is arranged on a circuit board; the coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical adapter fixture are arranged in the storage cavity, the first surfaces of the optical chip and the optical matching chip are provided with a first soldering pad, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; the electrical adapter fixture is fixed on the substrate, and the electrical adapter fixture is electrically connected to the substrate; the electrical adapter fixture has multiple hollow areas, the optical chip and the optical matching chip are placed in the corresponding hollow areas, and the electrical adapter fixture is provided with a second soldering pad on the side facing away from the cover shell, the second soldering pad is located around the hollow area, there is a gap between the second soldering pad and the substrate, the first soldering pad is wired to the second soldering pad so that there is a gap between the first surface of the optical chip and the optical matching chip and the substrate.

[0009] According to some embodiments of the present disclosure, an optical module is provided, including:

[0010] circuit boards;

[0011] A coherent optical component is arranged on a circuit board; the coherent optical component includes a cover shell and a substrate, the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical adapter fixture are arranged in the storage cavity, the first surfaces of the optical chip and the optical matching chip are provided with a first soldering pad, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; the electrical adapter fixture is fixed on the substrate, and the electrical adapter fixture is electrically connected to the substrate; the electrical adapter fixture has multiple hollow areas and storage recesses, the storage recesses are located around the hollow areas, the optical chip and the optical matching chip are placed in the corresponding hollow areas, there is a gap between the storage recess and the substrate, the first soldering pad is wired to the second soldering pad of the storage recess, so that there is a gap between the first surface of the optical chip and the optical matching chip and the substrate respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] FIG1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure;

[0014] FIG2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure;

[0015] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0016] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG5 is a structural diagram of a coherent optical component in an optical module according to some embodiments of the present disclosure;

[0018] FIG6 is an exploded view of a coherent optical component in an optical module according to some embodiments of the present disclosure;

[0019] FIG7 is a cross-sectional view of a coherent optical component in an optical module according to some embodiments of the present disclosure;

[0020] FIG8 is an assembly diagram of a cover shell and a bottom shell in an optical module according to some embodiments of the present disclosure;

[0021] FIG9 is an exploded view of a cover shell and a bottom shell in an optical module according to some embodiments of the present disclosure;

[0022] FIG10 is an exploded view of the coherent optical components of the optical module excluding the cover and bottom shell according to some embodiments of the present disclosure;

[0023] FIG11 is a cross-sectional view of a coherent optical component of an optical module excluding a cover and a bottom shell according to some embodiments of the present disclosure;

[0024] FIG12 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate in an optical module according to some embodiments of the present disclosure;

[0025] FIG13 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate in an optical module provided according to some embodiments of the present disclosure, from another perspective;

[0026] FIG14 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate in an optical module according to some embodiments of the present disclosure;

[0027] FIG15 is a structural diagram of an electrical adapter fixture in an optical module according to some embodiments of the present disclosure;

[0028] FIG16 is a structural diagram of an electrical adapter fixture in an optical module provided in accordance with some embodiments of the present disclosure from another perspective;

[0029] FIG17 is an assembly diagram of an electrical adapter fixture, an optical chip, and an optical matching chip in an optical module according to some embodiments of the present disclosure;

[0030] FIG18 is a structural diagram of an optical module excluding a housing according to some embodiments of the present disclosure;

[0031] FIG19 is a diagram illustrating the relationship between an MCU, an adjustable voltage source, a DSP, and coherent optical components in an optical module according to some embodiments of the present disclosure;

[0032] FIG20 is a structural diagram of a DSP in an optical module according to some embodiments of the present disclosure;

[0033] FIG21 is a structural diagram of an MCU in an optical module according to some embodiments of the present disclosure;

[0034] FIG22 is a structural diagram of an adjustable voltage source in an optical module according to some embodiments of the present disclosure;

[0035] FIG23 is a schematic diagram of a coherent optical component in an optical module according to some embodiments of the present disclosure;

[0036] FIG24 is an assembly diagram of a coherent optical component and an MCU in an optical module according to some embodiments of the present disclosure;

[0037] FIG25 is another assembly diagram of a coherent optical component and an MCU in an optical module according to some embodiments of the present disclosure;

[0038] FIG26 is a splitting ratio curve provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0039] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0040] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0041] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0042] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0043] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0044] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0045] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0046] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0047] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0048] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0049] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0050] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0051] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light source 901, and a coherent optical component 902.

[0052] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0053] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0054] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0055] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the light source 900 and the coherent optical component 902 in the optical module 200.

[0056] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300, the light source 900, and the coherent optical component 902 within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light source 900, and the coherent optical component 902, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0057] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0058] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0059] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0060] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0061] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0062] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0063] The light source 901 is connected to the circuit board 300 and is configured to emit light.

[0064] The optical module further includes a transmitting optical fiber adapter 700 and a receiving optical fiber adapter 701. The transmitting optical fiber adapter 700 is configured to transmit a high-frequency optical signal, and the receiving optical fiber adapter 701 is configured to receive a high-frequency optical signal.

[0065] Coherent optical component 902, placed on a circuit board, is configured to achieve high-speed optical-to-electrical signal conversion. Specifically, coherent optical component 902 includes an optical transmit interface, an optical receive interface, and a local oscillator (LO) optical interface. A first optical fiber extends from the optical transmit interface, a second optical fiber extends from the optical receive interface, and a third optical fiber extends from the LO interface. The optical transmit interface connects to the transmit fiber adapter 700, the optical receive interface connects to the receive fiber adapter 701, and the LO interface connects to the light source 901. The first, second, and third optical fibers form a fiber array, through which the coherent optical component connects to the transmit fiber adapter, the receive fiber adapter, and the light source 901, respectively. Coherent optical component 902 is also connected to the DSP chip 301.

[0066] The light emitted by the light source 901 is input into the coherent optical component 902 through the local oscillator optical interface, and the laser is split into beams inside the coherent optical component 902. One beam is used as the transmission beam and enters the coherent modulation chip inside the coherent optical component. Under the drive of the high-frequency electrical signal of the DSP chip 301, the electrical-optical signal conversion is realized. The converted high-frequency optical signal is output from the optical transmission interface of the module; the other beam is used as the local oscillator beam and is coherently demodulated with the high-frequency optical signal input into the coherent optical component 902 from the module's optical receiving port. The demodulated electrical signal enters the DSP chip 301 for signal processing, thereby completing the optical-electrical signal conversion.

[0067] Figure 5 is a structural diagram of a coherent optical component in an optical module according to some embodiments of the present disclosure, and Figure 6 is an exploded view of a coherent optical component in an optical module according to some embodiments of the present disclosure. As shown in Figures 5 and 6 , the coherent optical component 902 may include a cover 921 .

[0068] In some examples, the coherent optical component 902 may include a substrate 923. The substrate 923 is fixed on the circuit board 300.

[0069] In some examples, the cover shell 921 may be disposed on the substrate 923 to form a first storage cavity, and an optical chip and an optical matching chip may be disposed in the first storage cavity.

[0070] In some examples, the optical chip may include a coherent modulation chip 925. The coherent modulation chip 925 is configured to modulate and demodulate optical signals.

[0071] In some examples, the optical matching chip may include a driver chip 926. The driver chip 926 is configured to provide a modulation current to the coherent modulation chip 925, so that the coherent modulation chip 925 can modulate the optical signal.

[0072] In some examples, the optical chip may include a transimpedance amplifier chip 924 . The transimpedance amplifier chip 924 is configured to amplify electrical signals, where the electrical signals are obtained by demodulating the received optical signals by the coherent modulation chip 925 .

[0073] In some examples, the substrate 923 may be a circuit adapter board, and the substrate 923 may be configured to transfer the electrical signal on the circuit board 300 to the first storage cavity.

[0074] In some examples, the substrate 923 can be configured to transfer electrical signals within the first storage cavity to the circuit board 300. In some embodiments, the substrate 923 can include circuit traces, etc., which connect the circuit board 300 to the optical chip and optical matching chip within the first storage cavity.

[0075] In some embodiments, the optical chip and the optical matching chip can both be mounted in the first storage cavity using a BGA package with a face-mounted surface mount process. Specifically, the second surfaces of the optical chip and the optical matching chip are mounted on the substrate, and the first surfaces of the optical chip and the optical matching chip are provided with wire bonding pads. A gap is provided between the first surfaces of the optical chip and the optical matching chip and the cover 921, and the first surfaces of the optical chip and the optical matching chip are connected to the substrate via wire bonding.

[0076] Under the upright mounting process, the heat dissipation of the optical chip and the optical matching chip becomes a difficult point. First, the heat dissipation performance of the substrate is poor. The substrate is soldered on the circuit board, and the heat conducted to the substrate will also cause thermal interference to other devices on the circuit board. Secondly, the main heat dissipation path of the optical chip and the optical matching chip is the first side of the optical chip and the optical matching chip - air - cover 921 - thermal gasket - upper shell of the optical module. However, there are wire bonding pads on the first side of the optical chip and the optical matching chip, and the area available for heat dissipation on the first side of the optical chip and the optical matching chip is small. In addition, the optical chip and the optical matching chip are still a certain distance away from the cover 921, and the thermal conductivity of the air is small, resulting in only a very small part of the heat of the optical chip and the optical matching chip being conducted outside the optical module, resulting in low heat dissipation efficiency.

[0077] To address this issue, in some embodiments, the optical chip and optical matching chip can be mounted within the first storage cavity using a flip-chip process. Specifically, the second surfaces of the optical chip and optical matching chip are mounted on the inner top wall of the cover 921. Pads are provided on the first surfaces of the optical chip and optical matching chip, and a gap is provided between the first surfaces of the optical chip and optical matching chip and the substrate. The first surfaces of the optical chip and optical matching chip are connected to the substrate via wire bonding.

[0078] The packaging process for a coherent optical component involves first attaching the optical chip and optical matching chip to the inner top wall of the cover 921, then securing the cover 921 to the substrate 923, and finally bonding the pads of the optical chip and optical matching chip to the pad area on the substrate 923. However, after the cover 921 is secured to the substrate 923, bonding tools cannot enter the first storage cavity enclosed by the cover 921 and the substrate 923, making it impossible to bond the pads of the optical chip and optical matching chip to the pad area on the substrate 923. Therefore, an electrical adapter fixture 922 is required within the first storage cavity to transfer electrical signals from the optical chip and optical matching chip to the circuit board, and also to transfer electrical signals from the circuit board to the optical chip and optical matching chip.

[0079] The electrical transfer fixture 922 is a circuit transfer board configured to transfer the electrical signals on the circuit board 300 to the optical chip and the optical matching chip.

[0080] In some examples, the electrical transfer fixture 922 can be configured to transfer electrical signals from the optical chip and the optical matching chip to the circuit board 300. In some embodiments, the electrical transfer fixture 922 can include circuit traces, etc., which connect the circuit board 300 to the optical chip and the optical matching chip through the circuit traces.

[0081] Figure 7 is a cross-sectional view of a coherent optical component in an optical module according to some embodiments of the present disclosure. As shown in Figure 7, in some embodiments, a cover 921 and a substrate 923 can enclose a first storage cavity, within which an electrical adapter fixture 922 can be disposed. The electrical adapter fixture 922 can include a solder pad area and a solder ball area. The solder pad area can be wire-bonded to the optical chip and the optical matching chip, and the solder ball area can be connected to the substrate 923.

[0082] As shown in Figures 6 and 7, the coherent optical assembly may include an optical fiber array 927. One end of the optical fiber array 927 may be located within the second storage cavity, and the other end of the optical fiber array 927 may extend outside the second storage cavity. The three optical fibers of the optical fiber array 927 extending outside the second storage cavity are respectively connected to the light source, the transmitting optical fiber adapter 700, and the receiving optical fiber adapter 701, so that the optical fiber array 927 receives light emitted by the light source 901, transmits optical signals from the receiving optical fiber adapter 701, and transmits optical signals to the transmitting optical fiber adapter 700. The first storage cavity and the second storage cavity may enclose the storage cavity.

[0083] Figure 8 is an assembly diagram of the cover and bottom shell of an optical module according to some embodiments of the present disclosure, and Figure 9 is an exploded view of the cover and bottom shell of an optical module according to some embodiments of the present disclosure. As shown in Figures 8 and 9, the coherent optical assembly may include a bottom shell 928, and the cover shell 921 and the bottom shell 928 enclose a second storage cavity 9218 having a through hole 9217 to secure the optical fiber array 927 within the second storage cavity 9218. In other words, one end of the optical fiber array 927 can be located within the second storage cavity 9218, and the other end of the optical fiber array 927 can extend outside the second storage cavity 9218 through the through hole 9217.

[0084] As shown in FIG9 , in some embodiments, the cover 921 may be provided with a first protrusion 9215 . The first protrusion 9215 may be provided corresponding to the transimpedance amplifier chip 924 . The first protrusion 9215 is in contact with and connected to the transimpedance amplifier chip 924 .

[0085] In some examples, the cover 921 may be provided with a second protrusion 9216 . The second protrusion 9216 is provided corresponding to the driver chip 926 , and the second protrusion 9216 is in contact with the driver chip 926 .

[0086] In some examples, the first protrusion 9215 and the second protrusion 9216 can be configured to compensate for the height difference between the transimpedance amplifier chip 924 and the driver chip 926 and the coherent modulation chip 925, thereby ensuring that the first surfaces of the transimpedance amplifier chip 924, the driver chip 926, and the coherent modulation chip 925 are flush with each other. The first protrusion 9215 and the second protrusion 9216 can also be configured to dissipate heat. The first protrusion 9215 and the second protrusion 9216 increase the thickness of the cover 921 to improve the heat dissipation efficiency of the cover 921.

[0087] As shown in Figure 9, in some embodiments, the cover shell 921 may include a cover shell bottom plate 9213 and a cover shell side plate 9214, the upper surface of the cover shell side plate 9214 is in contact and connected with the cover shell bottom plate 9213, and the lower surface of the cover shell side plate 9214 is in contact and connected with the substrate 923, the cover shell bottom plate 9213 and the cover shell side plate 9214 form a first storage groove 9211 and a second storage groove 9212, the second storage groove 9212 and the bottom shell 928 form a second storage cavity 9218, the first storage groove is arranged corresponding to the optical chip and the optical matching chip, the first storage groove 9211 and the second storage groove 9212 are connected, and the first storage groove 9211 is provided with a first protrusion 9215 and a second protrusion 9216.

[0088] One end of the cover side plate 9214 has a through hole 9217, one end of the bottom shell 928 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the other end of the bottom shell 928 are in contact with the side walls of the second storage cavity 9218. Specifically, the bottom shell 928 may include a first bottom shell portion 9281 and a second bottom shell portion 9282, wherein the width of the first bottom shell portion 9281 is smaller than the width of the second bottom shell portion 9282, so that the first bottom shell portion 9281 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the second bottom shell portion 9282 are in contact with the side walls of the second storage slot.

[0089] Figure 10 is an exploded view of the coherent optical components of an optical module provided in accordance with some embodiments of the present disclosure, excluding the cover and bottom housing. Figure 11 is a cross-sectional view of the coherent optical components of an optical module provided in accordance with some embodiments of the present disclosure, excluding the cover and bottom housing. As shown in Figures 10 and 11, in some embodiments, the optical fiber array 927 can be connected to the coherent modulation chip 925, so that the coherent modulation chip 925 receives light and received optical signals transmitted by the optical fiber array 927, and also sends transmitted optical signals to the optical fiber array 927.

[0090] In order to prevent the light in the optical fiber array 927 and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925, thereby affecting the optical power, the central axis of the optical fiber array 927 and the central axis of the optical port of the coherent modulation chip 925 are at an angle of 6° to 8°, thereby reducing the light and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925.

[0091] In some embodiments, the optical fiber array 927 and the coherent modulation chip 925 may be directly bonded together using glue, that is, the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925 are directly connected using glue.

[0092] In some embodiments, the optical fiber array 927 and the coherent modulation chip 925 can be connected via a connector 929. That is, the end surface of one end of the connector 929 is connected to the end surface of the optical fiber array 927 via glue, and the upper surface of the other end of the connector 929 is connected to the first surface of the coherent modulation chip 925 via glue. This increases the bonding surface between the connector 929 and the optical fiber array 927, thereby improving the connection stability between the optical fiber array 927 and the coherent modulation chip 925.

[0093] Figure 12 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate in an optical module according to some embodiments of the present disclosure. Figure 13 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate in an optical module according to some embodiments of the present disclosure from another perspective. Figure 14 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate in an optical module according to some embodiments of the present disclosure. As shown in Figures 12, 13, and 14, the electrical adapter fixture 922 can be fixed to the substrate 923, and the electrical adapter fixture 922 and the substrate 923 are electrically connected.

[0094] In some examples, the coherent modulation chip 925 and the electrical transfer fixture 922 can be connected by wire bonding to transmit the electrical signal of the coherent modulation chip 925 to the substrate 923 via the electrical transfer fixture 922. Alternatively, the electrical signal on the substrate 923 is transmitted to the coherent modulation chip 925 via the electrical transfer fixture 922.

[0095] In some examples, the driver chip 926 and the electrical transfer fixture 922 can be wired to transmit the electrical signal of the driver chip 926 to the substrate 923 via the electrical transfer fixture 922. Alternatively, the electrical signal on the substrate 923 is transmitted to the driver chip 926 via the electrical transfer fixture 922.

[0096] In some examples, the transimpedance amplifier chip 924 and the electrical transfer fixture 922 can be wired to transmit the electrical signal of the transimpedance amplifier chip 924 to the substrate 923 via the electrical transfer fixture 922. Alternatively, the electrical signal on the substrate 923 is transmitted to the transimpedance amplifier chip 924 via the electrical transfer fixture 922.

[0097] In some embodiments, the electrical transfer fixture 922 can be soldered to the substrate 923 via solder balls, which not only fixes the electrical transfer fixture 922 to the substrate 923 but also enables electrical connection between the electrical transfer fixture 922 and the substrate 923 .

[0098] To protect the gold wires, in some embodiments, a gap is provided between the first surfaces of the optical chip and the optical matching chip and the substrate. This gap prevents the gold wires from colliding with components within the cavity, thereby protecting the gold wires.

[0099] In order to shorten the bonding distance between the coherent modulation chip 925, the driver chip 926, the transimpedance amplifier chip 924 and the electrical adapter fixture 922, in some embodiments, the electrical adapter fixture 922 may be provided with multiple hollow areas, and the area surrounding the hollow areas in the electrical adapter fixture 922 is provided with a second solder pad.

[0100] In some examples, the coherent modulation chip 925 can be placed in the corresponding hollowed-out area, and the first pad of the coherent modulation chip 925 can be wire-bonded to the second pad.

[0101] In some examples, the driver chip 926 can be placed in the corresponding hollowed-out area. The first pad of the driver chip 926 can be wire-bonded to the second pad.

[0102] In some examples, the transimpedance amplifier chip 924 can be placed in the corresponding hollowed-out region, and the first pad of the transimpedance amplifier chip 924 can be wire-bonded to the second pad.

[0103] In some examples, a second solder pad is provided in the area surrounding the hollowed-out area of ​​the electrical adapter fixture 922, and the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out area, so that the first solder pads of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 are all flush with the second solder pad, thereby shortening the gold wire between the first solder pad and the second solder pad.

[0104] In some embodiments, the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922. If the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922, then the electrical adapter fixture 922 can be located in the second storage cavity enclosed by the cover 921 and the substrate 923.

[0105] In some embodiments, the second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924. The second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 to compensate for the height difference between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924, so that the first surfaces of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are flush. For example, the second surface of the coherent modulation chip 925 is flush with the upper surface of the electrical transfer fixture 922, and the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 are recessed relative to the upper surface of the electrical transfer fixture 922; the second surface of the coherent modulation chip 925 protrudes relative to the upper surface of the electrical transfer fixture 922; and the second surface of the coherent modulation chip 925 is recessed relative to the upper surface of the electrical transfer fixture 922.

[0106] Figure 15 illustrates the structure of an electrical adapter fixture in an optical module according to some embodiments of the present disclosure. Figure 16 illustrates the structure of an electrical adapter fixture in an optical module according to some embodiments of the present disclosure from another perspective. Figure 17 illustrates the assembly of the electrical adapter fixture, optical chip, and optical matching chip in an optical module according to some embodiments of the present disclosure. As shown in Figures 15, 16, and 17, the electrical adapter fixture 922 includes a substrate body 9221 having multiple hollowed-out areas on the side facing the optical fiber array 927.

[0107] In some examples, the plurality of hollow regions may include a first hollow region 9224. In some examples, the first hollow region 9224 is an opening of the electrical switching fixture 922, and the coherent modulation chip 925 is placed in the first hollow region 9224.

[0108] In some examples, the plurality of hollow regions may include a second hollow region 9222 . The second hollow region 9222 is connected to the first hollow region 9224 , and a transimpedance amplifier chip 924 is placed in the second hollow region 9222 .

[0109] In some examples, the plurality of hollow regions may include a third hollow region 9223 . The third hollow region 9223 is connected to the first hollow region 9224 . A barrier 9225 is provided between the third hollow region 9223 and the second hollow region 9222 . A driver chip 926 is placed in the third hollow region 9223 .

[0110] In some examples, the first hollowed-out area 9224 is closer to the optical fiber array 927 than the second hollowed-out area 9222 and the third hollowed-out area 9223 .

[0111] As shown in Figure 16, in some embodiments, the lower surface of the substrate body 9221 can be provided with a solder pad area and a solder ball area, the solder pad area is connected to the solder ball area, the solder pad area is surrounded by the solder ball area, and the solder ball area is the area of ​​the lower surface of the substrate body 9221 excluding the solder pad area.

[0112] In some examples, the coherent modulation chip 925 is connected to the pad area by wire bonding, and the electrical transfer fixture 922 is connected to the substrate 923 through the solder ball area. The wires used to connect the coherent modulation chip 925 to the pad area by wire bonding can be gold wires.

[0113] In some examples, the driver chip 926 can be connected to the pad area by wire bonding. The wires used for the wire bonding between the driver chip 926 and the pad area can be gold wires.

[0114] In some examples, the transimpedance amplifier chip 924 can be connected to the pad region by wire bonding, and the wires used for the wire bonding between the transimpedance amplifier chip 924 and the pad region can be gold wires.

[0115] In some embodiments, the pad area of ​​the electrical adapter fixture 922 is flush with the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 to shorten the gold wire distance between the pad area of ​​the electrical adapter fixture 922 and the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924.

[0116] In some embodiments, the pad area and the solder ball area are flush with each other, that is, the distance from the pad area to the substrate 923 is equal to the distance from the solder ball area to the substrate 923 .

[0117] In some embodiments, the pad area is recessed relative to the solder ball area, that is, the distance from the pad area to the substrate 923 is greater than the distance from the solder ball area to the substrate 923, thereby increasing the gap height between the pad area and the substrate 923, and then increasing the vertical distance between the gold wire and the substrate 923, thereby further protecting the gold wire.

[0118] The signal line of the solder ball area extends upward to the pad area, so that the electrical signal of the pad area is transmitted to the substrate 923, and the electrical signal of the substrate 923 is also transmitted to the pad area. Because the pad area is recessed upward relative to the solder ball area, the signal line of the solder ball area extends upward to the second pad of the pad area.

[0119] As shown in Figures 16 and 17, in some embodiments, the substrate body 9221 may include a first electrical transfer fixing portion 9226. The first electrical transfer fixing portion 9226 may be a solder ball area. The first electrical transfer fixing portion 9226 may be located in the first extension direction of the electrical transfer fixture 922. The first electrical transfer fixing portion 9226 is fixed to the substrate 923 via solder balls to achieve electrical connection between the electrical transfer fixture 922 and the substrate 923.

[0120] In some examples, the substrate body 9221 may include a second electrical transfer fixing portion 9227. The second electrical transfer fixing portion 9227 may be a solder pad area. The second electrical transfer fixing portion 9227 may be located in a second extension direction of the electrical transfer fixture 922. The second extension direction intersects the first extension direction. The second electrical transfer fixing portion 9227 may be provided with multiple hollowed-out regions. Second solder pads are provided in the areas surrounding the hollowed-out regions of the second electrical transfer fixing portion 9227. The second solder pads are wire-bonded to the first solder pads to electrically connect the electrical transfer fixture 922 to the optical chip and the optical matching chip.

[0121] In some examples, the first electrical transfer fixing portion 9226 is located around the second electrical transfer fixing portion 9227. The first electrical transfer fixing portion 9226 is connected to the second electrical transfer fixing portion 9227, and the vertical distance between the first electrical transfer fixing portion 9226 and the substrate 923 is smaller than the vertical distance between the second electrical transfer fixing portion 9227 and the substrate 923.

[0122] For example, the first electrical transfer fixing portion 9226 may extend downward along the vertical direction of the electrical transfer fixing member 922 , so that the first electrical transfer fixing portion 9226 is disposed perpendicular to the substrate 923 .

[0123] In some examples, the second electrical transfer fixing portion 9227 can extend leftward along the horizontal direction of the electrical transfer fixing member 922 so that the second electrical transfer fixing portion 9227 is arranged parallel to the substrate 923, and the first electrical transfer fixing portion 9226 and the second electrical transfer fixing portion 9227 are arranged vertically.

[0124] In some embodiments, the first electrical switching fixing portion 9226 may include two first arms, which are connected to form an L-shaped first opening groove with an opening. An optical chip and an optical matching chip are arranged in the first opening groove. The opening is away from the optical matching chip, and the optical fiber array 927 crosses the opening and is connected to the coherent modulation chip 925 in the U-shaped groove.

[0125] In some examples, a second electrical transfer fixing portion 9227 may be disposed within the first open slot. The second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226. That is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form an L-shaped second open slot. The second open slot has a hollowed-out area, and the coherent modulation chip 925, the transimpedance amplifier chip 924, and the driver chip 926 are disposed within the hollowed-out area. Since there is at least one second arm around the hollowed-out area to limit the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0126] As shown in Figure 16, in some embodiments, the first electrical switching fixing portion 9226 may include three first arms, which are connected in sequence to form a first U-shaped open groove with an opening. An optical chip and an optical matching chip are arranged in the first open groove. The opening is away from the optical matching chip, and the optical fiber array 927 crosses the opening and is connected to the coherent modulation chip 925 in the U-shaped groove.

[0127] In some examples, a second electrical transfer fixing portion 9227 may be provided in the first opening slot, and the second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226, that is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form a U-shaped second opening slot, and the second opening slot has a hollowed-out area, and a coherent modulation chip 925, a transimpedance amplifier chip 924 and a driver chip 926 are provided in the hollowed-out area. Since there are at least two second arms around the hollowed-out area, the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are further limited; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0128] In some embodiments, the second electrical relay fixing portion 9227 may include a first pad portion 92271 .

[0129] In some examples, the second electrical relay fixing portion 9227 may include a second pad portion 92272 . The second pad portion 92272 may be connected to the first pad portion 92271 .

[0130] In some examples, the second electrical relay fixing portion 9227 may include a third pad portion 92273 . The third pad portion 92273 may be connected to the second pad portion 92272 .

[0131] In some examples, the second electrical relay fixing portion 9227 may include a fourth pad portion 92274 . The fourth pad portion 92274 may be connected to the third pad portion 92273 .

[0132] In some examples, the second electrical relay fixing portion 9227 may include a fifth pad portion 92275 . The fifth pad portion 92275 may be connected to the fourth pad portion 92274 .

[0133] In some examples, the first pad portion 92271, the second pad portion 92272, the third pad portion 92273, the fourth pad portion 92274, and the fifth pad portion 92275 are sequentially connected to form a U-shaped placement recess. A gap exists between the placement recess and the substrate 923. A second pad is disposed within the placement recess. The second pad within the placement recess is wire-bonded to the first pads of the optical chip and the optical matching chip, thereby creating a gap between the first pads of the optical chip and the optical matching chip and the substrate 923, thereby protecting the gold wires between the first and second pads.

[0134] In some embodiments, the second electrical connection fixing portion 9227 may include a sixth pad portion, which is the side of the barrier 9225 facing the substrate 923, and the sixth pad portion is connected to the middle area of ​​the third pad portion 92273 so that the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926.

[0135] The first solder pad portion 92271 and the fifth solder pad portion 92275 can both be set corresponding to the coherent modulation chip 925, the first solder pad portion 92271 is located behind the coherent modulation chip 925, and the fifth solder pad portion 92275 is located in front of the coherent modulation chip 925. The second solder pads of the first solder pad portion 92271 and the fifth solder pad portion 92275 are both wire-bonded to the first solder pad of the coherent modulation chip 925 to electrically connect the coherent modulation chip 925 to the electrical adapter fixture 922.

[0136] The second pad portion 92272 can be set corresponding to the transimpedance amplifier chip 924, and the second pad portion 92272 is located behind the transimpedance amplifier chip 924. The sixth pad portion can be located between the transimpedance amplifier chip 924 and the driver chip 926. The transimpedance amplifier chip 924 is located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the transimpedance amplifier chip 924 is respectively connected to the second pad portion 92272, the third pad portion 92273 and the second pad of the sixth pad portion, so that the transimpedance amplifier chip 924 is electrically connected to the electrical adapter fixture 922; the first pad of the transimpedance amplifier chip 924 is also connected to the first pad of the coherent modulation chip 925, so that the transimpedance amplifier chip 924 is electrically connected to the coherent modulation chip 925.

[0137] The fourth pad portion 92274 is arranged corresponding to the driver chip 926. The fourth pad portion 92274 is located at the front end of the driver chip 926. The driver chip 926 is also located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the driver chip 926 is respectively connected to the fourth pad portion 92274, the third pad portion 92273 and the second pad of the sixth pad portion, so that the driver chip 926 is electrically connected to the electrical adapter fixture 922; the first pad of the driver chip 926 is also connected to the first pad of the coherent modulation chip 925, so that the driver chip 926 is electrically connected to the coherent modulation chip 925.

[0138] In some embodiments, an optical module includes a circuit board and a coherent optical component, the coherent optical component being disposed on the circuit board and configured to implement modulation and demodulation of optical signals. The coherent optical component includes a cover and a substrate, the substrate being fixed to the circuit board and electrically connected to the circuit board. The cover is disposed on the substrate to form a storage cavity, within which an optical chip, an optical matching chip, and an electrical adapter fixture are disposed. The first surfaces of the optical chip and the optical matching chip are provided with first solder pads, while the second surfaces of the optical chip and the optical matching chip are not provided with solder pads. The second surfaces of the optical chip and the optical matching chip are mounted on the inner top wall of the cover. The heat generated by the optical chip and the optical matching chip is directly conducted to the cover without passing through air to the cover, thereby improving heat dissipation efficiency. The heat generated by the optical chip and the optical matching chip is directly conducted to the cover and no longer enters the circuit board, thereby preventing thermal interference with electrical components on the circuit board. To ensure the normal operation of the optical chip and the optical matching chip, the electrical adapter fixture is fixed to the substrate, electrically connected to the substrate, and wire-bonded to the first solder pads of the optical chip and the optical matching chip. The electrical signals on the circuit board are transmitted to the optical chip and the optical matching chip in sequence through the substrate and the electrical adapter fixture. The electrical signals of the optical chip and the optical matching chip are transmitted to the circuit board in sequence through the electrical adapter fixture and the substrate, so that the optical chip and the optical matching chip can work normally. Since the gold wires between the electrical adapter fixture and the first solder pads of the optical chip and the optical matching chip are easily damaged, in order to protect the gold wires, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate. There is a gap between the first surface of the optical chip and the optical matching chip and the substrate to prevent the gold wires from colliding with the components in the storage cavity, thereby protecting the gold wires. In order to shorten the gold wires, the electrical adapter fixture has multiple hollow areas and second solder pads. The second solder pads are arranged on the side of the electrical adapter fixture that is away from the cover shell. The second solder pads are located around the hollow areas. The optical chip and the optical matching chip are both placed in the corresponding hollow areas. The first solder pads of the optical chip and the optical matching chip are both wire-bonded to the second solder pads. The second pads are located around the hollowed-out area, and the optical chip and optical matching chip are placed within the corresponding hollowed-out area, so that the first pads of the optical chip and the optical matching chip are flush with the second pads, thereby shortening the gold wire between the first and second pads. There is a gap between the second pads and the substrate, and the first and second pads are wire-bonded to ensure a gap between the first surface of the optical chip and the optical matching chip and the substrate.In some embodiments, a first solder pad is provided on the first side of the optical chip and the optical matching chip, and the second sides of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell to improve heat dissipation efficiency; the electrical adapter fixture is electrically connected to the substrate, the substrate is electrically connected to the circuit board, and the electrical adapter fixture is wired to the first solder pad of the optical chip and the optical matching chip to ensure the normal operation of the optical chip and the optical matching chip; the electrical adapter fixture has multiple hollowed-out areas, and the optical chip and the optical matching chip are both placed in the corresponding hollowed-out areas, and a second solder pad is provided in the area around the hollowed-out area in the electrical adapter fixture, so that the first solder pads of the optical chip and the optical matching chip are flush with the second solder pad, thereby shortening the gold wire between the first solder pad and the second solder pad.

[0139] In some embodiments, a DSP chip, a voltage source, an MCU, and a coherent optical component are provided on the circuit board 300. The DSP chip and the MCU are both connected to the coherent optical component. The voltage source is connected to the MCU and the DSP chip respectively, and the voltage source provides a fixed voltage to the DSP chip.

[0140] The DSP chip requires different minimum voltages for different processes. The voltage source provides the DSP chip with a fixed voltage, resulting in high power consumption in the optical module. To address this issue, the MCU reads the DSP chip's power supply parameters in real time and adjusts the output voltage of the adjustable voltage source based on these parameters to provide the minimum voltage required by the DSP chip. This minimizes power consumption while ensuring that the optical module's performance is not affected. Power supply parameters include the voltage regulation status flag and the voltage regulation feedback flag.

[0141] Figure 18 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, excluding the housing. Figure 19 is a diagram showing the relationship between the MCU, adjustable voltage source, DSP, and coherent optical components in the optical module provided according to some embodiments of the present disclosure. As shown in Figures 18 and 19, a DSP chip 301, an adjustable voltage source 302, an MCU 303, and a coherent optical component 902 are provided on a circuit board 300. The DSP chip 301 and the MCU 303 are both connected to the coherent optical component 902. The adjustable voltage source 302 is connected to the MCU 303 and the DSP chip 301, respectively. The adjustable voltage source 302 is configured to provide an adjustable voltage to the DSP chip. The coherent optical component is configured to implement modulation and demodulation of optical signals. That is, the DSP chip includes an electrical input pin, an electrical input / output pin, and an electrical output pin. The electrical input pin of the DSP chip is connected to the voltage output pin of the adjustable voltage source, the electrical input / output pin of the DSP chip is connected to the first electrical input / output pin of the MCU, the electrical output pin of the DSP chip is connected to the coherent optical component 902, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source 302, and the second electrical input / output pin of the MCU is connected to the coherent optical component 902.

[0142] Figure 20 is a block diagram of the DSP in an optical module provided according to some embodiments of the present disclosure. As shown in Figure 20, the DSP chip includes a first register and a second register. The first register is configured to store a voltage regulation status flag, and the second register is configured to store a voltage regulation feedback flag. The voltage regulation status flag is configured to indicate whether the voltage regulation feedback flag is valid. If the voltage regulation status flag is a first value, the digital signal processing chip has completed the calculation, and the voltage regulation feedback flag is valid. If the voltage regulation status flag is a second value, the digital signal processing chip has not completed the calculation, and the voltage regulation feedback flag is invalid. The adaptive voltage regulation control feedback flag is configured to indicate the voltage compensation direction of the digital signal processing chip. If the voltage regulation feedback flag is a first value, it indicates that compensation is required towards low voltage; if the voltage regulation feedback flag is a second value, it indicates that no voltage compensation is required; if the voltage regulation feedback flag is a third value, it indicates that compensation is required towards high voltage. The MCU reads the voltage regulation feedback flag based on the read voltage regulation status flag and adjusts the MCU output voltage based on the read voltage regulation feedback flag to adjust the output voltage of the adjustable voltage source.

[0143] Figure 21 is a block diagram of an MCU in an optical module according to some embodiments of the present disclosure. As shown in Figure 21, in some embodiments, the MCU includes a third register, a fourth register, and a fifth register. The third register is configured to store a step voltage, the fourth register is configured to store an initial voltage, the fifth register is configured to store a real-time voltage, and the sixth register is configured to store an adaptive voltage regulation control loop switch flag.

[0144] The initial voltage is the maximum operating voltage required by the DSP chip to ensure normal startup. After the optical module is powered on, the MCU transmits the initial voltage to the adjustable voltage source, which then outputs the maximum operating voltage required by the DSP chip corresponding to the initial voltage to ensure normal startup. For example, the initial voltage is 0.65V.

[0145] The real-time voltage includes the initial voltage. After the optical module is powered on, the MCU copies the initial voltage in the fourth register to the fifth register. At this time, the real-time voltage in the fifth register is the initial voltage.

[0146] The MCU determines the voltage compensation direction based on the voltage regulation feedback flag it reads, and calculates the first output voltage based on the voltage compensation direction, the step voltage, and the real-time voltage. For example, when the MCU reads a first value for the voltage regulation feedback flag, the first output voltage = real-time voltage - step voltage; when the MCU reads a second value for the voltage regulation feedback flag, the first output voltage = real-time voltage; and when the MCU reads a third value for the voltage regulation feedback flag, the first output voltage = real-time voltage + step voltage.

[0147] As shown in FIG21 , the MCU further includes a sixth register configured to store an adaptive voltage regulation control loop switch flag. When the adaptive voltage regulation control loop switch flag is a first value, it indicates that the adaptive voltage regulation control loop is enabled; when the adaptive voltage regulation control loop switch flag is a second value, it indicates that the adaptive voltage regulation control loop is disabled.

[0148] After reading that the adaptive voltage regulation control loop switch flag is a first value, the MCU reads the voltage regulation state flag. When the voltage regulation state flag is read as the first value, the MCU reads the voltage regulation feedback flag and adjusts the output voltage of the MCU according to the voltage regulation feedback flag.

[0149] As shown in Figure 21, the MCU also includes a seventh register, which is configured to store the power compensation ratio. After the MCU reads that the adaptive voltage regulation control loop switch flag is the first value, the MCU transmits the power compensation ratio to the DSP chip. The DSP chip adjusts the voltage regulation feedback flag according to the power compensation ratio.

[0150] The specific process for calculating the power compensation ratio is as follows: the MCU controls the first output voltage to be output at equal intervals, collects multiple DSP parameters, calculates the average value of each DSP parameter at a voltage value, and then calculates the average value of each DSP parameter at multiple voltage values ​​to obtain the power compensation ratio. For example, if the power compensation ratio is 4.3%, taking into account the margin, the power compensation margin set in the MCU's seventh register is 4.5%.

[0151] Because the optical module is a small package, the DSP chip requires up to 30A of current, making a large adjustable voltage source unsuitable for powering the DSP chip impossible. To ensure 30A is delivered to the DSP chip within the limited space of the optical module, in some embodiments, the adjustable voltage source is a multi-phase power supply chip that can meet the voltage and current requirements of the DSP.

[0152] Figure 22 is a structural diagram of an adjustable voltage source in an optical module according to some embodiments of the present disclosure. As shown in Figure 22, the adjustable voltage source includes a first power chip, a second power chip, and a third power chip. The first, second, and third power chips are connected in parallel. The sum of the phase currents of the first, second, and third power chips is equal to the output current of the adjustable voltage source, which can meet the voltage and current requirements of the DSP.

[0153] The input pin (IN) of the first power chip is connected to the input voltage, and the input pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to receive the power voltage. For example, the power voltage is 3.3V.

[0154] The output pin (SW) of the first power chip is connected to the DSP chip through the ninth resistor R9. The output pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to provide output voltage to the DSP chip.

[0155] The multi-phase mode / synchronization control pin (Mode / Sync) of the first power chip is connected to the multi-phase mode / synchronization control pin of the second power chip and the multi-phase mode / synchronization control pin of the third power chip respectively.

[0156] The feedback pin (FB) of the first power supply chip is connected to the MCU through the seventh resistor R7, and the feedback pin of the first power supply chip is also grounded through the sixth resistor R6. The feedback pin of the first power supply chip is connected to the DSP chip through the eighth resistor R8, and the timing resistor pin (RT) of the first power supply chip is grounded through the fifth resistor R5.

[0157] The feedback pin of the second power supply chip is connected to the input voltage, the timing resistor pin of the second power supply chip is connected to the feedback pin of the second power supply chip through the third resistor R3, the timing resistor pin of the second power supply chip is also grounded through the fourth resistor R4, and the voltage ratio received by FB and RT of the second power supply chip is R3:R4.

[0158] The feedback pin of the third power supply chip is connected to the input voltage, the timing resistor pin of the third power supply chip is connected to the feedback pin of the third power supply chip through the first resistor R1, the timing resistor pin of the third power supply chip is also grounded through the second resistor R2, and the voltage ratio received by FB and RT of the third power supply chip is R1:R2.

[0159] The first power chip is a main phase power chip, and the phase of the first power chip is 0°. The second power chip and the third power chip are slave phase power chips, and the phase of the second power chip is 120°, and the phase of the third power chip is 240°, so that the adjustable voltage source is a three-phase power chip, and the three phase currents of the three-phase power chip are equal to the output current of the three-phase power chip.

[0160] The multi-phase mode / synchronization control pin (Mode / Sync) sets the clock of the master phase power chip as the output in the multi-phase power chip. At the same time, after the FB of the slave phase power chip is directly connected to the input voltage, the clock of the slave phase power chip is configured as an input, receiving the clock output of the master phase power chip.

[0161] The timing resistor pin (RT) of the master phase power chip is used to set the master phase power chip's switching frequency. After the slave phase power chip's FB is directly connected to the input voltage, the master phase power chip's Mode / Sync outputs the switching frequency to the slave phase power chip's Mode / Sync, ensuring that the master and slave phase power chips have the same switching frequency.

[0162] In some embodiments, the ratio of the third resistor R3 to the fourth resistor R4 is a first preset value, so that the phase of the second power chip is 120°. For example, the first preset value is 7:5, that is, the ratio of the third resistor R3 to the fourth resistor R4 is 7:5.

[0163] In some embodiments, the ratio of the first resistor R1 to the second resistor R2 is a second preset value, so that the phase of the third power chip is 240°. For example, the second preset value is 5:7, that is, the ratio of the first resistor R1 to the second resistor R2 is 5:7.

[0164] The output voltage of the MCU is a first output voltage, and the output voltage of the adjustable voltage source is a second output voltage. The first output voltage and the second output voltage are in a preset relationship. The output voltage of the adjustable voltage source can be adjusted by simply adjusting the output voltage of the MCU.

[0165] The preset relationship is: Vout=0.6424-0.1424*Vmcu, where Vout is the second output voltage and Vmcu is the first output voltage.

[0166] Since the current flowing into FB is equal to the current flowing out of FB, (Vout-VFB) / R8+(Vout-Vmcu) / R7=VFB / R6, R8=4.7k, R6=R7=33k, VFB=5, Vout=0.6424-0.1424*Vmcu.

[0167] In some embodiments, the optical module may include a digital signal processing chip, an adjustable voltage source and an MCU, the digital signal processing chip includes an electrical input pin and an electrical input / output pin, the electrical input / output pin of the MCU is connected to the electrical input / output pin of the digital signal processing chip, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source, the voltage output pin of the adjustable voltage source is connected to the electrical input pin of the digital signal processing chip, and the MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source to power the digital signal processing chip.

[0168] In some examples, the digital signal processing chip may include a register configured to store a voltage regulation feedback flag. The adaptive voltage regulation control state feedback flag is configured to characterize the voltage compensation direction of the digital signal processing chip. The voltage regulation feedback flag is a first value, indicating that compensation is required in the low voltage direction; the voltage regulation feedback flag is a second value, indicating that no voltage compensation is required; and the voltage regulation feedback flag is a third value, indicating that compensation is required in the high voltage direction. The MCU reads the voltage regulation feedback flag and adjusts the output voltage of the voltage output pin of the adjustable voltage source according to the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. In some embodiments, the MCU reads the voltage regulation feedback flag of the digital signal processing chip in real time and adjusts the output voltage of the voltage output pin of the adjustable voltage source in real time according to the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. This can minimize the power consumption of the optical module while ensuring that the performance of the optical module is not affected.

[0169] FIG23 is a schematic diagram of a coherent optical component in an optical module according to some embodiments of the present disclosure, and FIG24 is an assembly diagram of a coherent optical component and an MCU in an optical module according to some embodiments of the present disclosure. As shown in FIG23 and FIG24, in some embodiments, the coherent optical component includes a storage cavity, in which a coherent modulation chip, a transimpedance amplifier chip, and a driver chip are arranged. The coherent modulation chip includes a spectrometer, a modulation area, a demodulation area, and a photodetector (MPD). The driver chip is connected to the modulation area, the transimpedance amplifier chip is connected to the demodulation area, and the spectrometer is respectively connected to the modulation area, the demodulation area, and the photodetector. The spectrometer is configured to divide the light emitted by the light source into transmitted light and local oscillator light according to the working current. The modulation area modulates the transmitted light into a transmitted light signal under the modulation current of the driver chip. The demodulation area uses the local oscillator light to demodulate the received optical signal to obtain an electrical signal. The transimpedance amplifier chip (TIA) amplifies the electrical signal. The light source emits light, which is then divided into transmitted light and local oscillator light by the spectrometer. The transmitted light is modulated into a transmitted light signal in the modulation area and then emitted. The local oscillator light and the received light signal are demodulated in the demodulation area to obtain an electrical signal.

[0170] The optical splitter includes an optical input interface, an optical output interface, and an electrical input interface. The optical input interface receives light from the light source. One optical output interface is connected to the modulation area to transmit the emitted light to the modulation area for modulation. The other optical output interface is connected to the demodulation area and the photodetector respectively to transmit most of the local oscillation light to the demodulation area for demodulation, and also transmit a small part of the local oscillation light to the photodetector to monitor the local oscillation light flowing through the demodulation area.

[0171] As shown in Figures 23 and 24, in some embodiments, an MCU is provided on the circuit board 300, and the MCU is connected to the electrical input interface of the spectrometer and the photodetector respectively. The MCU controls the operating current of the electrical input interface of the spectrometer according to the sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector.

[0172] In some embodiments, the beam splitter includes a first interferometer arm and a second interferometer arm, each of which is provided with a heater, and the MCU is connected to each of the two heaters. The MCU adjusts the operating current of the two heaters to change the refractive index of the first interferometer arm and the second interferometer arm, thereby changing the phase difference between the light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the beam splitter.

[0173] In some embodiments, the spectrometer includes a first interferometer arm and a second interferometer arm, wherein a heater is provided on the first interferometer arm or the second interferometer arm, the heater being connected to an electrical input interface of the spectrometer, and the MCU being connected to the heater. The MCU adjusts the operating current of one heater to change the refractive index of the interferometer arm provided with the heater, thereby changing the phase difference between light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the spectrometer.

[0174] In some embodiments, one end of the photodetector is connected to the optical output interface of the optical splitter, and the other end of the photodetector is connected to the MCU to monitor the local oscillator light flowing through the demodulation region.

[0175] A sampling resistor is provided between the other end of the photodetector and the MCU. One end of the sampling resistor is connected to the other end of the photodetector, and the other end of the sampling resistor is connected to the MCU, so that the MCU collects the sampled voltage across the sampling resistor.

[0176] In some embodiments, the MCU includes an eighth register, and the eighth register stores a plurality of splitting ratio functions.

[0177] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to wavelengths, with each wavelength corresponding to a splitting ratio function. The MCU retrieves the splitting ratio function based on the wavelength and adjusts the operating current of the electrical input interface of the splitter based on the sampled voltage and the splitting ratio function. For example, at wavelength λ1, the splitting ratio function is Yλ1; at wavelength λ2, the splitting ratio function is Yλ2; and at wavelength λ3, the splitting ratio function is Yλ3.

[0178] In some embodiments, the optical module further includes a temperature measuring component configured to measure the temperature of the optical module.

[0179] In some embodiments, a temperature measuring element is located within the coherent optical assembly, that is, within a storage cavity of the coherent optical assembly. The temperature measuring element is connected to the MCU and positioned around the coherent modulation chip to measure the temperature around the coherent modulation chip, thereby measuring the temperature of the optical module. For example, the temperature measuring element includes a thermistor. The thermistor is temperature-sensitive and exhibits different resistance values ​​at different temperatures. The MCU determines the temperature around the coherent modulation chip based on the resistance value of the thermistor.

[0180] In some embodiments, the temperature measuring component is integrated into the MCU and configured to measure the temperature around the MCU and thereby measure the temperature of the optical module. For example, the temperature measuring component is a temperature sensor integrated into the MCU, and the MCU obtains the temperature around the MCU based on the temperature sensor.

[0181] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to temperature, with each temperature corresponding to a splitting ratio function. The MCU retrieves the splitting ratio function based on the temperature and controls the operating current of the electrical input interface of the splitter based on the sampled voltage and the splitting ratio function corresponding to the temperature. For example, at temperature T1, the splitting ratio function is YT1; at temperature T2, the splitting ratio function is YT2; and at temperature T3, the splitting ratio function is YT3.

[0182] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to both temperature and wavelength, with each temperature and wavelength corresponding to a splitting ratio function. The MCU retrieves the splitting ratio function corresponding to the temperature and wavelength based on the temperature and wavelength, and controls the operating current of the electrical input interface of the splitter based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3.

[0183] When the temperature of the coherent modulation chip is controlled to be relatively stable, the coherent modulation chip can be mounted on the inner top wall of the cover shell as shown in Figure 7. When the temperature of the coherent modulation chip is controlled to be relatively stable, the coherent modulation chip can be placed on a semiconductor cooler (TEC), a conductor cooler is placed in the storage cavity, and a temperature measuring element is placed on the semiconductor cooler, and the temperature measuring element is configured to measure the temperature of the coherent optical component. The semiconductor cooler is connected to the power chip, which supplies power to the semiconductor cooler. The power chip is also connected to the MCU. The MCU adjusts the electrical signal sent to the power chip according to the resistance value of the temperature measuring element, and the power chip dynamically adjusts the current transmitted to the semiconductor cooler according to the received electrical signal, so as to keep the temperature of the semiconductor cooler constant, and thus the temperature of the coherent modulation chip constant.

[0184] If the temperature remains relatively stable within a preset time, the MCU will retrieve the splitting ratio function based on the temperature and control the operating current of the splitter's electrical input interface based on the sampled voltage and the splitting ratio function. For example, at temperature T1, the splitting ratio function is YT1; at temperature T2, the splitting ratio function is YT2; and at temperature T3, the splitting ratio function is YT3.

[0185] Alternatively, if the temperature remains relatively stable within a preset time, the MCU retrieves the splitting ratio function based on the temperature and wavelength, and controls the operating current of the splitter's electrical input interface based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3. Relatively stable temperatures mean that the difference between two adjacent temperatures is within the error range.

[0186] In some embodiments, a current source is provided between the MCU and the electrical input interface of the spectrometer, the input interface of the current source is connected to the MCU, and the output interface of the current source is connected to the electrical input interface of the wind-solar device. The MCU obtains a control signal based on the sampling voltage and the splitting ratio function, and the current source adjusts the operating current output to the electrical input interface of the spectrometer according to the control signal.

[0187] FIG25 is another assembly diagram of a coherent optical component and an MCU in an optical module provided according to some embodiments of the present disclosure. As shown in FIG25 , in some embodiments, a digital-to-analog converter (DAC) is provided between the MCU and the electrical input interface of the spectrometer. The DAC is located on a circuit board 300. One end of the DAC is connected to the MCU, and the other end of the DAC is connected to the electrical input interface of the spectrometer. The MCU obtains a digital current signal based on the sampling voltage and the splitting ratio function, and the DAC converts the digital current signal into an analog current signal. For example, the DAC is a current-type DAC, which converts the digital current signal into an analog current signal to provide an analog current signal to the heater of the spectrometer. The analog current signal of the heater is the analog current signal of the spectrometer, and the analog current signal is the working current.

[0188] In some implementations, the splitting ratio function is configured to represent the corresponding relationship between the control signal and the sampling voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the control signal, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0189] In some embodiments, the splitting ratio function is configured to represent the corresponding relationship between the operating current and the sampling voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the operating current, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0190] Figure 26 shows a splitting ratio curve according to some embodiments of the present disclosure. As shown in Figure 26 , the horizontal axis represents the operating current of the splitter, and the vertical axis represents the sampling current of the photodetector. The splitting ratio curve is a graph showing the relationship between the operating current of the splitter and the sampling current of the photodetector. The splitting ratio function is a function obtained by fitting multiple points of the splitting ratio curve.

[0191] As shown in Figure 26, in some embodiments, the splitting ratio function is configured to represent the corresponding relationship between the operating current and the sampling current. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the operating current, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling current. The MCU controls the operating current of the splitter to increase the output at equal intervals starting from zero, while simultaneously collecting the sampling current of the photodetector to obtain the splitting ratio curve, and thus the splitting ratio function.

[0192] In some embodiments, a coherent optical component includes a coherent modulation chip. The coherent modulation chip includes an optical splitter, a modulation section, and a demodulation section. The optical splitter includes an optical input interface, two optical output interfaces, and an electrical input interface. The optical input interface receives light from a light source. One optical output interface is connected to the modulation section, and the other optical output interface is connected to the demodulation section and a photodetector. The optical splitter is configured to separate the light source light into transmitted light and local oscillator light based on an operating current. The modulation section is configured to modulate the transmitted light into a transmitted light signal, and the demodulation section uses the local oscillator light to demodulate the received light signal. An MCU is connected to the photodetector and the electrical input interface of the optical splitter, respectively. The MCU adjusts the operating current of the optical splitter based on a sampling voltage. The MCU includes a register that stores multiple light ratio functions that correspond to temperature. The MCU controls the operating current of the electrical input interface of the optical splitter based on the temperature-dependent light ratio function and the light ratio function and the sampling voltage. In some embodiments of the present disclosure, the MCU retrieves the light ratio function based on temperature and controls the operating current of the electrical input interface of the optical splitter based on the light ratio function and the sampling voltage, thereby enabling the optical splitter to achieve light splitting.

[0193] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Circuit boards; A coherent optical component is arranged on the circuit board; The coherent optical component comprises a cover shell and a substrate, wherein the substrate is fixed on the circuit board, the substrate is electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical switching fixture are arranged in the storage cavity, a first solder pad is arranged on the first surface of the optical chip and the optical matching chip, and the second surfaces of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell; The electrical switching fixture is fixed on the substrate, and the electrical switching fixture is electrically connected to the substrate; The electrical transfer fixture has a plurality of hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, a second solder pad is provided on a side of the electrical transfer fixture facing away from the cover shell, the second solder pad is located around the hollowed-out area, a gap is formed between the second solder pad and the substrate, and the first solder pad is connected to the second solder pad by wire bonding, so that there is a gap between the first surface of the optical chip and the first surface of the optical matching chip and the substrate.

2. The optical module according to claim 1, wherein: The electrical transfer fixture includes a first electrical transfer fixing portion and a second electrical transfer fixing portion, the first electrical transfer fixing portion is connected to the second electrical transfer fixing portion, the first electrical transfer fixing portion is located in a first extension direction of the electrical transfer fixture, the second electrical transfer fixing portion is located in a second extension direction of the electrical transfer fixture, the first electrical transfer fixing portion is located around the second electrical transfer fixing portion, a vertical distance between the first electrical transfer fixing portion and the substrate is smaller than a vertical distance between the second electrical transfer fixing portion and the substrate, the first electrical transfer fixing portion is fixed to the substrate through solder balls to achieve electrical connection between the electrical transfer fixture and the substrate; the second electrical transfer fixing portion is provided with the plurality of hollow areas, the area around the hollow areas in the second electrical transfer fixing portion is provided with the second soldering pad, the second soldering pad is wired to the first soldering pad to achieve electrical connection between the electrical transfer fixture and the optical chip and the optical matching chip.

3. The optical module according to claim 2, wherein: The second electrical transfer fixing portion includes a first pad portion, a second pad portion, a third pad portion, a fourth pad portion and a fifth pad portion, wherein the first pad portion, the second pad portion, the third pad portion, the fourth pad portion and the fifth pad portion are connected in sequence; The first pad portion and the fifth pad portion are respectively arranged corresponding to the optical chip, and the first pad portion and the fifth pad portion are respectively connected to the optical chip by wire bonding; The second pad portion is arranged corresponding to one of the optical matching chips, the fourth pad portion is arranged corresponding to another of the optical matching chips, the two optical matching chips are respectively located between the optical chip and the third pad portion, the second pad, the optical chip and the third pad portion are all wire-bonded to one of the optical matching chips, and the fourth pad portion, the optical chip and the third pad portion are all wire-bonded to another of the optical matching chips.

4. The optical module according to claim 2, wherein: The first electrical switching fixing portion includes three arms, which are connected in sequence to form an open slot with an opening, in which the optical chip and the optical matching chip are arranged, the opening is away from the optical matching chip, and the optical fiber array crosses the opening to connect the optical fiber array to the optical chip.

5. The optical module according to claim 1, wherein: The multiple hollowed-out areas include a first hollowed-out area, a second hollowed-out area and a third hollowed-out area, the first hollowed-out area is located at the opening of the electrical switching fixture, the first hollowed-out area is connected to the second hollowed-out area, the first hollowed-out area is connected to the third hollowed-out area, a blocking plate is provided between the second hollowed-out area and the third hollowed-out area, the optical chip is placed in the first hollowed-out area, the driver chip of the optical matching chip is placed in the second hollowed-out area, the transimpedance amplifier chip of the optical matching chip is placed in the third hollowed-out area, and the blocking plate is located between the driver chip and the transimpedance amplifier chip.

6. The optical module according to claim 1, wherein: The electrical switching fixture is connected to the inner top wall of the cover shell on one side facing the cover shell; The cover shell includes a coherent bottom plate and a coherent side plate, the coherent bottom plate is connected to the coherent side plate, the lower surface of the coherent side plate is connected to the substrate, and the lower surface of the coherent bottom plate is connected to the upper surface of the electrical switching fixture.

7. The optical module according to claim 1, wherein: The second surface of the optical chip protrudes relative to the second surface of the optical matching chip, the second surface of the optical chip is flush with the upper surface of the electrical switching fixture, the second surface of the optical matching chip is recessed relative to the upper surface of the electrical switching fixture, and a protrusion is provided on the inner top wall of the cover shell, and the protrusion is provided corresponding to the optical matching chip.

8. The optical module according to claim 1, wherein: The coherent optical component further comprises a bottom shell, which is covered on the cover shell to form a second storage cavity, in which an optical fiber array is placed, and the optical fiber array is connected to the coherent modulation chip.

9. An optical module, comprising: Circuit boards; A coherent optical component is arranged on the circuit board; The coherent optical component comprises a cover shell and a substrate, wherein the substrate is fixed on the circuit board and electrically connected to the circuit board, and the cover shell is arranged on the substrate to form a storage cavity; an optical chip, an optical matching chip and an electrical switching fixture are arranged in the storage cavity, and a first solder pad is arranged on the first surface of the optical chip and the optical matching chip, and the optical The chip and the second surface of the optical matching chip are both mounted on the inner top wall of the cover shell; The electrical switching fixture is fixed on the substrate, and the electrical switching fixture is electrically connected to the substrate; The electrical switching fixture has a plurality of hollowed-out areas and placement recesses, wherein the placement recesses are located around the hollowed-out areas, the optical chip and the optical matching chip are placed in the corresponding hollowed-out areas, there is a gap between the placement recess and the substrate, and the first solder pad is wired to the second solder pad of the placement recess so that there is a gap between the first surface of the optical chip and the first surface of the optical matching chip and the substrate respectively.

10. The optical module according to claim 9, wherein: The second surface of the optical chip is flush with the upper surface of the electrical switching fixture, the second surface of the optical matching chip is recessed relative to the upper surface of the electrical switching fixture, and a protrusion is provided on the lower surface of the coherent base plate, and the protrusion is arranged corresponding to the optical matching chip.

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