Optical module

Abstract

The present application discloses an optical module, comprising a DSP chip, an adjustable voltage source, and an MCU. The DSP chip comprises an electrical input pin and an electrical input / output pin, an electrical input / output pin of the MCU is connected to the electrical input / output pin of the DSP chip, an electrical output pin of the MCU is connected to a control pin of the adjustable voltage source, and a voltage output pin of the adjustable voltage source is connected to the electrical input pin of the DSP chip. The DSP chip is used for storing a voltage adjustment feedback flag bit. The MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source on the basis of the voltage adjustment feedback flag bit. In the present application, the MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source on the basis of the voltage adjustment feedback flag bit so as to supply the minimum voltage required by the DSP chip, thereby reducing the power consumption of the optical module to the maximum extent while ensuring that the performance of the optical module is not affected.

Description

optical modules

[0001] This application claims priority to application number 202311578952.7 filed with the China Patent Office on November 24, 2023; priority to application number 202323204150.8 filed with the China Patent Office on November 24, 2023; all contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] circuit boards;

[0007] a tunable laser electrically connected to the circuit board and configured to emit light of different wavelengths;

[0008] A DSP chip is electrically connected to the circuit board and is configured to output a modulated current, wherein the DSP chip stores a voltage regulation feedback flag;

[0009] a coherent optical component electrically connected to the tunable laser and the DSP chip, respectively, the coherent optical component being configured to receive a modulation current output by the DSP chip and modulate the light emitted by the tunable laser according to the modulation current to generate an optical signal;

[0010] an adjustable voltage source, wherein a voltage output pin of the adjustable voltage source is connected to an electrical input pin of the DSP chip, and the adjustable voltage source is configured to provide voltage to the DSP chip;

[0011] An MCU is electrically connected to the DSP chip and configured to output different gain voltages to the DSP chip to adjust the modulation current output by the DSP chip, thereby adjusting the output optical power of the optical signal; an electrical output pin of the MCU is connected to a control pin of the adjustable voltage source, and an electrical input and output pin of the MCU is connected to an electrical input and output pin of the DSP chip. The MCU is configured to read the voltage regulation feedback flag and adjust the output voltage of the voltage output pin of the adjustable voltage source according to the voltage regulation feedback flag. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0014] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0015] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0016] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG5 is a structural diagram of an optical module excluding a housing according to some embodiments of the present disclosure;

[0018] FIG6 is a diagram showing the internal structure of a tunable laser according to some embodiments of the present disclosure;

[0019] FIG7 is a structural diagram of a coherent optical component provided according to some embodiments of the present disclosure;

[0020] FIG8 is an exploded view of a coherent optical assembly according to some embodiments of the present disclosure;

[0021] FIG9 is a cross-sectional view of a coherent optical assembly according to some embodiments of the present disclosure;

[0022] FIG10 is an assembly diagram of a cover shell and a bottom shell according to some embodiments of the present disclosure;

[0023] FIG11 is an exploded view of a cover shell and a bottom shell according to some embodiments of the present disclosure;

[0024] FIG12 is an exploded view of a coherent optical assembly with the cover and bottom shell removed according to some embodiments of the present disclosure;

[0025] FIG13 is a cross-sectional view of a coherent optical assembly with the cover and bottom shell removed according to some embodiments of the present disclosure;

[0026] FIG14 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate according to some embodiments of the present disclosure;

[0027] FIG15 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided in accordance with some embodiments of the present disclosure from another perspective;

[0028] FIG16 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate according to some embodiments of the present disclosure;

[0029] FIG17 is a structural diagram of an electrical transfer fixture provided according to some embodiments of the present disclosure;

[0030] FIG18 is a structural diagram of an electrical adapter fixture provided in accordance with some embodiments of the present disclosure from another perspective;

[0031] FIG19 is an assembly diagram of an electrical transfer fixture, an optical chip, and an optical matching chip according to some embodiments of the present disclosure;

[0032] FIG20 is a structural block diagram of components on a circuit board in an optical module according to some embodiments of the present disclosure;

[0033] FIG21 is a diagram illustrating the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component according to some embodiments of the present disclosure;

[0034] FIG22 is a structural diagram of a DSP provided according to some embodiments of the present disclosure;

[0035] FIG23 is a structural diagram of an MCU provided according to some embodiments of the present disclosure;

[0036] FIG24 is a structural diagram of an adjustable voltage source according to some embodiments of the present disclosure;

[0037] FIG25 is a schematic diagram of a coherent optical component according to some embodiments of the present disclosure;

[0038] FIG26 is an assembly diagram of a coherent optical component and an MCU according to some embodiments of the present disclosure;

[0039] FIG27 is another assembly diagram of a coherent optical component and an MCU according to some embodiments of the present disclosure;

[0040] FIG28 is a splitting ratio curve provided according to some embodiments of the present disclosure;

[0041] FIG29 is a structural block diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

[0042] FIG30 is a schematic diagram of the internal structure of an MCU provided according to some embodiments of the present disclosure;

[0043] FIG31 is a schematic diagram of a process in which an MCU provides a gain voltage to a DSP chip according to some embodiments of the present disclosure;

[0044] FIG32 is a flow chart of a method for adjusting the output optical power of an optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0045] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0046] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0047] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0048] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0049] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0050] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0051] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0052] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0053] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0054] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0055] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0056] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0057] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0058] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0059] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0060] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0061] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0062] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0063] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a tunable laser 901, a coherent optical component 902, and a DSP chip 301.

[0064] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0065] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0066] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0067] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from opening 204 and is inserted into the electrical connector of the host computer 100. Opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 can connect to the tunable laser 901 and coherent optical component 902 in the optical module 200.

[0068] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300, tunable laser 901, coherent optical component 902, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, tunable laser 901, coherent optical component 902, and the like, positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0069] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0070] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0071] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0072] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0073] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0074] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0075] A tunable laser 901 (also called a light source) is connected to the circuit board 300 and is used to transmit light. The optical module also includes a transmitting fiber adapter 700 and a receiving fiber adapter 701. The transmitting fiber adapter 700 is used to transmit high-frequency optical signals, while the receiving fiber adapter 701 is used to receive high-frequency optical signals. A coherent optical component 902 is placed on the circuit board to achieve high-speed optical-to-electrical signal conversion.

[0076] Specifically, coherent optical assembly 902 includes an optical transmission interface, an optical reception interface, and a local oscillator optical interface. A first optical fiber extends from the optical transmission interface, a second optical fiber extends from the optical reception interface, and a third optical fiber extends from the local oscillator optical interface. The optical transmission interface is connected to the transmitting optical fiber adapter 700, the optical reception interface is connected to the receiving optical fiber adapter 701, and the local oscillator optical interface is connected to the tunable laser 901. The first, second, and third optical fibers form a fiber array, and the coherent optical assembly is connected to the transmitting optical fiber adapter, the receiving optical fiber adapter, and the tunable laser 901, respectively, through the fiber array. Coherent optical assembly 902 is also connected to the DSP chip 301.

[0077] The light emitted by the tunable laser 901 is input into the coherent optical component 902 through the local oscillator optical interface, and the laser is split into beams inside the coherent optical component 902. One beam is used as the transmission beam and enters the coherent modulation chip inside the coherent optical component. Under the drive of the high-frequency electrical signal of the DSP chip 301, the electrical-optical signal conversion is realized. The converted high-frequency optical signal is output from the optical transmission interface of the module; the other beam is used as the local oscillator beam and is coherently demodulated with the high-frequency optical signal input into the coherent optical component 902 from the module's optical receiving port. The demodulated electrical signal enters the DSP chip 301 for signal processing, thereby completing the optical-electrical signal conversion.

[0078] Figure 5 is a structural diagram of an optical module excluding the housing, provided in accordance with some embodiments of the present disclosure. In conjunction with Figures 4 and 5 , in some embodiments, a tunable laser 901, a coherent optical component 902, a DSP chip 301, an adjustable voltage source 302, and an MCU 303 are provided on the surface of a circuit board 300. The coherent optical component 902 internally includes a coherent optical modulator, which is used to modulate optical signals. Exemplarily, the coherent optical modulator is a silicon-based coherent optical modulator or a thin-film lithium niobate-based coherent optical modulator.

[0079] The tunable laser 901 is used as an external light source for the coherent light modulator. The tunable laser 901 emits light from the side, and the light it emits enters the coherent light modulator. For example, the tunable laser 901 can output light of different wavelengths.

[0080] The host computer transmits the electrical signal to the DSP chip 301 through the gold finger 301. In some embodiments, optical signals may be distorted during transmission in the optical fiber link. In the embodiment of the present application, the DSP chip 301 is used to counteract and compensate for distortion, thereby reducing the impact of distortion on the system bit error rate. The DSP chip 301 can perform various signal compensation processes, such as chromatic dispersion compensation and polarization mode dispersion compensation. For example, the DSP chip 301 converts the 16-channel PAM-4 electrical signals emitted by the host computer into four-channel transmitting end PAM-4 electrical signals. The coherent optical modulator modulates the received four-channel PAM-4 electrical signals onto the light emitted by the tunable laser 901, thereby generating a transmitting optical signal.

[0081] FIG6 is a diagram illustrating the internal structure of a tunable laser according to some embodiments of the present disclosure. As shown in FIG6 , in some embodiments, the tunable laser 901 includes a package cavity, which includes a gain chip 910, a lens 920, a wavelength selection component, a phase shifter 940, and a reflector 960. For example, the wavelength selection component includes a first filter and a second filter, such as a first etalon 930 and a second etalon 950. In some embodiments, when the first etalon 930 and the second etalon 950 are heated to different temperatures, the tunable laser 901 can output light of different wavelengths.

[0082] In some embodiments, carriers are injected into the gain chip 910, causing it to emit light across a wide wavelength range based on the carriers. Specific currents are then supplied to the first and second etalons 930, 950, respectively, heating them to specific temperatures. This allows light of a specific wavelength to be selected from the broad spectrum of light (light across a wide wavelength range), achieving wavelength selection. Wavelength tuning is achieved by supplying different currents to the wavelength selection component to adjust its temperature.

[0083] The light emitted by gain chip 910 is divergent. This divergent beam can be collimated into a parallel beam by lens 920 and then enter first etalon 930 as parallel light. The combination of first etalon 930 and second etalon 950 allows wavelengths to be selected that can pass through both etalons simultaneously. Specifically, by heating first etalon 930 and second etalon 950 separately, the desired wavelength (target wavelength) can be selected through their vernier effect.

[0084] First etalon 930 and second etalon 950 are spaced apart to form a vernier etalon. Their FSRs (Free spectral ranges) differ. Based on the vernier principle, light waves in the common passband of first etalon 930 and second etalon 950 can be screened. Specifically, when a wavelength in the transmission spectra of the two etalons overlaps (i.e., is aligned), light of that specific wavelength can be selected.

[0085] In some embodiments, by heating the first etalon 930 and the second etalon 950 to different temperatures, the refractive indices of the two etalons change accordingly, and the optical path lengths of the two etalons change accordingly. The cavity length of the resonant cavity changes accordingly, and the wavelengths selected by the two etalons change, thereby outputting light of different wavelengths and achieving wavelength tuning.

[0086] In some embodiments, the resonant cavity of the tunable laser 901 is relatively long, and there are many possible oscillating cavity modes. The filter transmission spectrum only allows one of the cavity modes to have low loss and form a laser oscillation output. Because the cavity mode is easily drifted due to the influence of temperature, stress, etc., and the output wavelength is related to the cavity mode, which in turn causes the output wavelength to drift, it is necessary to lock the specific wavelength selected by the wavelength selection component. In some embodiments, by changing the temperature of the phase shifter 940 to change the refractive index of the phase shifter 940, the optical length of the phase shifter 940 is changed, and the cavity length of the resonant cavity is changed to lock the cavity length of the resonant cavity, and accordingly lock the cavity mode of the resonant cavity, and thus lock the wavelength.

[0087] In some embodiments, one end face of the gain chip 910 serves as the first resonant end face of the resonant cavity of the tunable laser 901, and the reflector 960 serves as the second resonant end face of the resonant cavity. The first resonant end face and the second resonant end face constitute a resonant cavity. The resonant cavity has a laser mode wavelength (i.e., a resonant wavelength) that it supports. The laser mode can be a longitudinal mode or a transverse mode. The laser mode wavelength is related to the length of the resonant cavity. When the current wavelength is the laser mode wavelength supported by the resonant cavity, the light of the current wavelength can oscillate in the resonant cavity and obtain a positive net gain, ultimately forming a laser output. When the current wavelength is not a wavelength supported by the resonant cavity, the light cannot oscillate in the resonant cavity and eventually disappears in the resonant cavity. By tuning the temperature of the wavelength selection component and tuning the length of the resonant cavity to the resonant cavity length corresponding to light of a specific wavelength (i.e., the target wavelength), the light of the specific wavelength selected by the wavelength selection component reflects back and forth and oscillates in the resonant cavity. When the gain equals the loss, spontaneous emission is converted to stimulated emission, thereby forming a laser output.

[0088] FIG7 is a structural diagram of a coherent optical component provided according to some embodiments of the present disclosure. FIG8 is an exploded view of a coherent optical component provided according to some embodiments of the present disclosure. As shown in FIG7 and FIG8, the coherent optical component 902 includes a cover 921 and a substrate 923. The substrate 923 is fixed on the circuit board 300. The cover 921 is covered on the substrate 923 to form a first storage cavity. An optical chip and an optical matching chip are arranged in the first storage cavity. The optical chip includes a coherent modulation chip 925. The optical matching chip includes a driver chip 926 and a transimpedance amplifier chip 924. The coherent modulation chip 925 is used for modulation and demodulation of optical signals. The driver chip 926 is used to provide a modulation current to the coherent modulation chip 925 so that the coherent modulation chip 925 can realize modulation of the optical signal. The transimpedance amplifier chip 924 is used to amplify the electrical signal. The electrical signal is obtained by demodulating the received optical signal by the coherent modulation chip 925.

[0089] The substrate 923 is a circuit adapter board used to transfer electrical signals from the circuit board 300 to the first storage cavity, and also to transfer electrical signals within the first storage cavity to the circuit board 300. In some embodiments, the substrate 923 includes circuit traces, etc., which connect the circuit board 300 to the optical chip and optical matching chip within the first storage cavity.

[0090] In some embodiments, the optical chip and the optical matching chip are both mounted in the first storage cavity using a BGA package with a face-mounted surface mount process. Specifically, the second surfaces of the optical chip and the optical matching chip are mounted on the substrate, while the first surfaces of the optical chip and the optical matching chip are provided with bonding pads. A gap exists between the first surfaces of the optical chip and the optical matching chip and the cover 921, and the first surfaces of the optical chip and the optical matching chip are connected to the substrate via bonding wires.

[0091] Under the upright mounting process, the heat dissipation of the optical chip and the optical matching chip becomes a difficult point. First, the heat dissipation performance of the substrate is poor. The substrate is soldered on the circuit board, and the heat conducted to the substrate will also cause thermal interference to other devices on the circuit board. Secondly, the main heat dissipation path of the optical chip and the optical matching chip is the first side of the optical chip and the optical matching chip - air - cover 921 - thermal gasket - upper shell of the optical module. However, there are wire bonding pads on the first side of the optical chip and the optical matching chip, and the area available for heat dissipation on the first side of the optical chip and the optical matching chip is small. In addition, the optical chip and the optical matching chip are still a certain distance away from the cover 921, and the thermal conductivity of the air is small, resulting in only a very small part of the heat of the optical chip and the optical matching chip being conducted outside the optical module, resulting in low heat dissipation efficiency.

[0092] To address this issue, in some embodiments, the optical chip and optical matching chip are mounted within the first storage cavity using a flip-chip process. Specifically, the second surfaces of the optical chip and optical matching chip are mounted on the inner top wall of the cover 921. Solder pads are provided on the first surfaces of the optical chip and optical matching chip. A gap exists between the first surfaces of the optical chip and optical matching chip and the substrate, and the first surfaces of the optical chip and optical matching chip are connected to the substrate via wire bonding.

[0093] The packaging process for a coherent optical component involves first attaching the optical chip and optical matching chip to the inner top wall of the cover 921, then securing the cover 921 to the substrate 923, and finally bonding the pads of the optical chip and optical matching chip to the pad area on the substrate 923. However, after the cover 921 is secured to the substrate 923, bonding tools cannot enter the first storage cavity enclosed by the cover 921 and the substrate 923, making it impossible to bond the pads of the optical chip and optical matching chip to the pad area on the substrate 923. Therefore, an electrical adapter fixture 922 is required within the first storage cavity to transfer electrical signals from the optical chip and optical matching chip to the circuit board, and also to transfer electrical signals from the circuit board to the optical chip and optical matching chip.

[0094] The electrical transfer fixture 922 is a circuit transfer board used to transfer electrical signals on the circuit board 300 to the optical chip and optical matching chip, and also to transfer electrical signals from the optical chip and optical matching chip to the circuit board 300. In some embodiments, the electrical transfer fixture 922 includes circuit traces, etc., which connect the circuit board 300 to the optical chip and optical matching chip through the circuit traces.

[0095] Figure 9 is a cross-sectional view of a coherent optical assembly according to some embodiments of the present disclosure. As shown in Figure 9, in some embodiments, a cover 921 and a substrate 923 form a first storage cavity, within which an electrical adapter fixture 922 is disposed. The electrical adapter fixture 922 includes a solder pad area and a solder ball area. The solder pad area is wire-bonded to the optical chip and the optical matching chip, while the solder ball area is connected to the substrate 923.

[0096] As shown in Figures 8 and 9, the coherent optical assembly further includes an optical fiber array 927. One end of the optical fiber array 927 is located within the second storage cavity, and the other end of the optical fiber array 927 extends outside the second storage cavity. The three optical fibers of the optical fiber array 927 extending outside the second storage cavity are respectively connected to the light source, the transmitting optical fiber adapter 700, and the receiving optical fiber adapter 701, so that the optical fiber array 927 receives light emitted by the light source 901, transmits optical signals from the receiving optical fiber adapter 701, and transmits optical signals to the transmitting optical fiber adapter 700. The first storage cavity and the second storage cavity enclose a storage cavity.

[0097] Figure 10 is an assembly diagram of a cover and bottom shell provided according to some embodiments of the present disclosure. Figure 11 is an exploded view of the cover and bottom shell provided according to some embodiments of the present disclosure. As shown in Figures 10 and 11, the coherent optical assembly further includes a bottom shell 928. The cover shell 921 and the bottom shell 928 define a second storage cavity 9218 having a through hole 9217 for securing the optical fiber array 927 within the second storage cavity 9218. Specifically, one end of the optical fiber array 927 is located within the second storage cavity 9218, and the other end of the optical fiber array 927 extends outside the second storage cavity 9218 through the through hole 9217.

[0098] As shown in FIG11 , in some embodiments, the cover 921 is provided with a first protrusion 9215 and a second protrusion 9216. The first protrusion 9215 is provided corresponding to the transimpedance amplifier chip 924, and the second protrusion 9216 is provided corresponding to the driver chip 926. The first protrusion 9215 is in contact with the transimpedance amplifier chip 924, and the second protrusion 9216 is in contact with the driver chip 926. The first protrusion 9215 and the second protrusion 9216 not only compensate for the height difference between the transimpedance amplifier chip 924 and the driver chip 926 and the coherent modulation chip 925, thereby ensuring that the first surfaces of the transimpedance amplifier chip 924, the driver chip 926, and the coherent modulation chip 925 are flush, but also dissipate heat. The first protrusion 9215 and the second protrusion 9216 increase the thickness of the cover 921, thereby improving the heat dissipation efficiency of the cover 921.

[0099] As shown in Figure 11, in some embodiments, the cover shell 921 includes a cover shell bottom plate 9213 and a cover shell side plate 9214, the upper surface of the cover shell side plate 9214 is in contact with and connected to the cover shell bottom plate 9213, and the lower surface of the cover shell side plate 9214 is in contact with and connected to the substrate 923, the cover shell bottom plate 9213 and the cover shell side plate 9214 form a first storage groove 9211 and a second storage groove 9212, the second storage groove 9212 and the bottom shell 928 form a second storage cavity 9218, the first storage groove is arranged corresponding to the optical chip and the optical matching chip, the first storage groove 9211 and the second storage groove 9212 are connected, and the first storage groove 9211 is provided with a first protrusion 9215 and a second protrusion 9216.

[0100] One end of the cover side plate 9214 has a through hole 9217. One end of the bottom shell 928 is in contact with the side wall of the through hole 9217, and two oppositely disposed side walls of the other end of the bottom shell 928 are in contact with the side walls of the second storage cavity 9218. Specifically, the bottom shell 928 includes a first bottom shell portion 9281 and a second bottom shell portion 9282. The width of the first bottom shell portion 9281 is smaller than the width of the second bottom shell portion 9282, so that the first bottom shell portion 9281 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the second bottom shell portion 9282 are in contact with the side walls of the second storage slot.

[0101] Figure 12 is an exploded view of a coherent optical assembly, excluding the cover and bottom housing, according to some embodiments of the present disclosure. Figure 13 is a cross-sectional view of a coherent optical assembly, excluding the cover and bottom housing, according to some embodiments of the present disclosure. As shown in Figures 12 and 13, in some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925, so that the coherent modulation chip 925 receives light and received optical signals transmitted by the optical fiber array 927, and also sends transmitted optical signals to the optical fiber array 927.

[0102] In order to avoid or slow down the reflection of the light and the transmitted optical signal in the optical fiber array 927 at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925, thereby affecting the optical power, the central axis of the optical fiber array 927 and the central axis of the optical port of the coherent modulation chip 925 are at an angle of 6° to 8° to reduce the reflection of the light and the transmitted optical signal at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925.

[0103] In some embodiments, the optical fiber array 927 and the coherent modulation chip 925 are directly bonded by glue, that is, the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925 are directly connected by glue.

[0104] In some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925 via a connector 929. Specifically, the end surface of one end of the connector 929 is connected to the end surface of the optical fiber array 927 via glue, and the upper surface of the other end of the connector 929 is connected to the first surface of the coherent modulation chip 925 via glue. This increases the bonding surface between the connector 929 and the optical fiber array 927, thereby improving the connection stability between the optical fiber array 927 and the coherent modulation chip 925.

[0105] FIG14 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments of the present disclosure. FIG15 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments of the present disclosure from another perspective. FIG16 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments of the present disclosure. As shown in FIG14 , FIG15 and FIG16 , an electrical transfer fixture 922 is fixed on a substrate 923, and the electrical transfer fixture 922 is electrically connected to the substrate 923. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are wired to the electrical transfer fixture 922 to transmit the electrical signals of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 to the substrate 923 via the electrical transfer fixture 922, and also to transmit the electrical signals on the substrate 923 to the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 via the electrical transfer fixture 922.

[0106] In some embodiments, the electrical transfer fixture 922 is soldered to the substrate 923 via solder balls, which not only fixes the electrical transfer fixture 922 to the substrate 923 but also enables electrical connection between the electrical transfer fixture 922 and the substrate 923 .

[0107] To protect the gold wires, in some embodiments, a gap is provided between the first surfaces of the optical chip and the optical matching chip and the substrate. This gap prevents the gold wires from colliding with components within the cavity, thereby protecting the gold wires.

[0108] To reduce the bonding distance between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 and the electrical adapter fixture 922, in some embodiments, the electrical adapter fixture 922 is provided with multiple hollowed-out regions. Second bonding pads are provided in the areas surrounding the hollowed-out regions of the electrical adapter fixture 922. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out regions. The first bonding pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all bonded to the second bonding pads. The areas surrounding the hollowed-out regions of the electrical adapter fixture 922 are provided with second bonding pads. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out regions. This ensures that the first bonding pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are flush with the second bonding pads, thereby shortening the gold wire between the first bonding pads and the second bonding pads.

[0109] In some embodiments, the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922. If the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922, then the electrical adapter fixture 922 can be located in the second storage cavity enclosed by the cover 921 and the substrate 923.

[0110] In some embodiments, the second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924. The second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 to compensate for the height difference between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924, so that the first surfaces of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are flush. For example, the second surface of the coherent modulation chip 925 is flush with the upper surface of the electrical transfer fixture 922, and the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 are recessed relative to the upper surface of the electrical transfer fixture 922; the second surface of the coherent modulation chip 925 protrudes relative to the upper surface of the electrical transfer fixture 922; and the second surface of the coherent modulation chip 925 is recessed relative to the upper surface of the electrical transfer fixture 922.

[0111] Figure 17 is a structural diagram of an electrical transfer fixture provided according to some embodiments of the present disclosure. Figure 18 is a structural diagram of an electrical transfer fixture provided according to some embodiments of the present disclosure from another perspective. Figure 19 is an assembly diagram of an electrical transfer fixture, an optical chip and an optical matching chip provided according to some embodiments of the present disclosure. As shown in Figures 17, 18 and 19, the electrical transfer fixture 922 includes a substrate body 9221. A plurality of hollow areas are provided on a side of the substrate body 9221 facing the optical fiber array 927. The plurality of hollow areas include a first hollow area 9224, a second hollow area 9222 and a third hollow area 9223. The first hollow area 9224 is closer to the optical fiber array 927 than the second hollow area 9222 and the third hollow area 9223. The first hollow area 9224 is At the opening of the electrical adapter fixture 922, a coherent modulation chip 925 is placed in the first hollow area 9224, the second hollow area 9222 is connected to the first hollow area 9224, a transimpedance amplifier chip 924 is placed in the second hollow area 9222, the third hollow area 9223 is connected to the first hollow area 9224, there is a barrier 9225 between the third hollow area 9223 and the second hollow area 9222, and a driver chip 926 is placed in the third hollow area 9223.

[0112] As shown in FIG18 , in some embodiments, a pad area and a solder ball area are provided on the lower surface of the substrate body 9221. The pad area is connected to the solder ball area, and the solder ball area is surrounded by the pad area. The solder ball area is the area on the lower surface of the substrate body 9221 excluding the pad area. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all wire-bonded to the pad area, and the electrical adapter fixture 922 is connected to the substrate 923 via the solder ball area. The wires used to bond the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 to the pad area are gold wires.

[0113] In some embodiments, the pad area of ​​the electrical adapter fixture 922 is flush with the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 to shorten the gold wire distance between the pad area of ​​the electrical adapter fixture 922 and the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924.

[0114] In some embodiments, the pad area and the solder ball area are flush with each other, that is, the distance from the pad area to the substrate 923 is equal to the distance from the solder ball area to the substrate 923 .

[0115] In some embodiments, the pad area is recessed relative to the solder ball area, that is, the distance from the pad area to the substrate 923 is greater than the distance from the solder ball area to the substrate 923, thereby increasing the gap height between the pad area and the substrate 923, and then increasing the vertical distance between the gold wire and the substrate 923, thereby further protecting the gold wire.

[0116] The signal line of the solder ball area extends upward to the pad area, so that the electrical signal of the pad area is transmitted to the substrate 923, and the electrical signal of the substrate 923 is also transmitted to the pad area. Because the pad area is recessed upward relative to the solder ball area, the signal line of the solder ball area extends upward to the second pad of the pad area.

[0117] As shown in Figures 18 and 19, in some embodiments, the substrate body 9221 includes a first electrical transfer fixing portion 9226 and a second electrical transfer fixing portion 9227. The first electrical transfer fixing portion 9226 is a solder ball area, and the second electrical transfer fixing portion 9227 is a solder pad area. The first electrical transfer fixing portion 9226 and the second electrical transfer fixing portion 9227 are respectively located in two extension directions of the electrical transfer fixing member 922. The first electrical transfer fixing portion 9226 is located around the second electrical transfer fixing portion 9227. The first electrical transfer fixing portion 9226 is connected to the second electrical transfer fixing portion 9227. The vertical distance between the first electrical transfer fixing portion 9226 and the substrate 923 is smaller than the vertical distance between the second electrical transfer fixing portion 9227 and the substrate 923. The first electrical transfer fixing portion 9226 is fixed to the substrate 923 through solder balls to achieve electrical connection between the electrical transfer fixing member 922 and the substrate 923. The second electrical transfer fixing portion 9227 is provided with multiple hollow areas, and the area around the hollow areas in the second electrical transfer fixing portion 9227 is provided with a second solder pad, which is wire-bonded to the first solder pad to achieve electrical connection between the electrical transfer fixing member 922 and the optical chip and the optical matching chip.

[0118] In some embodiments, the first power transfer fixing portion 9226 and the second power transfer fixing portion 9227 are respectively located in two extending directions of the power transfer fixing member 922. For example, the first power transfer fixing portion 926 extends downward along the vertical direction of the power transfer fixing member 922 so that the first power transfer fixing portion 926 is perpendicular to the substrate 923, and the second power transfer fixing portion 9227 extends leftward along the horizontal direction of the power transfer fixing member 922 so that the second power transfer fixing portion 9227 is parallel to the substrate 923, and the first power transfer fixing portion 926 and the second power transfer fixing portion 9227 are perpendicular to each other.

[0119] In some embodiments, the first electrical transfer fixing portion 9226 includes two first arms connected to form an L-shaped first open slot with an opening. An optical chip and an optical matching chip are disposed within the first open slot. The opening is distal to the optical matching chip, and the optical fiber array 927 traverses the opening to connect with the coherent modulation chip 925 within the U-shaped slot. A second electrical transfer fixing portion 9227 is disposed within the first open slot. The second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226, i.e., the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form an L-shaped second open slot. The second open slot has a hollowed-out area, in which the coherent modulation chip 925, the transimpedance amplifier chip 924, and the driver chip 926 are disposed. Since there is at least one second arm around the hollowed-out area to limit the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0120] As shown in FIG18 , in some embodiments, the first electrical transfer fixing portion 9226 includes three first arms, which are sequentially connected to form a U-shaped first open slot with an opening. An optical chip and an optical matching chip are disposed within the first open slot. The opening is distal to the optical matching chip, and the optical fiber array 927 traverses the opening and connects to the coherent modulation chip 925 within the U-shaped slot. A second electrical transfer fixing portion 9227 is disposed within the first open slot and is connected to the first electrical transfer fixing portion 9226. That is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form a U-shaped second open slot. The second open slot has a hollowed-out area, in which the coherent modulation chip 925, the transimpedance amplifier chip 924, and the driver chip 926 are disposed. Since there are at least two second arms around the hollowed-out area, the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are further limited; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0121] In some embodiments, the second electrical transfer fixing portion 9227 includes a first pad portion 92271, a second pad portion 92272, a third pad portion 92273, a fourth pad portion 92274, and a fifth pad portion 92275. The first pad portion 92271, the second pad portion 92272, the third pad portion 92273, the fourth pad portion 92274, and the fifth pad portion 92275 are sequentially connected to form a U-shaped placement recess. A gap is provided between the placement recess and the substrate 923. A second pad is disposed within the placement recess. The second pad within the placement recess is wire-bonded to the first pads of the optical chip and the optical matching chip, thereby creating a gap between the first pads of the optical chip and the optical matching chip and the substrate 923, thereby protecting the gold wire between the first pad and the second pad.

[0122] In some embodiments, the second electrical connection fixing portion 9227 also includes a sixth pad portion, which is the side of the barrier 9225 facing the substrate 923. The sixth pad portion is connected to the middle area of ​​the third pad portion 92273 so that the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926.

[0123] The first solder pad portion 92271 and the fifth solder pad portion 92275 are both arranged corresponding to the coherent modulation chip 925. The first solder pad portion 92271 is located behind the coherent modulation chip 925, and the fifth solder pad portion 92275 is located in front of the coherent modulation chip 925. The second solder pads of the first solder pad portion 92271 and the fifth solder pad portion 92275 are both wire-bonded to the first solder pad of the coherent modulation chip 925 to electrically connect the coherent modulation chip 925 to the electrical adapter fixture 922.

[0124] The second pad portion 92272 is arranged corresponding to the transimpedance amplifier chip 924, the second pad portion 92272 is located behind the transimpedance amplifier chip 924, the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926, and the transimpedance amplifier chip 924 is located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the transimpedance amplifier chip 924 is respectively connected with the second pad portion 92272, the third pad portion 92273 and the second pad of the sixth pad portion, so that the transimpedance amplifier chip 924 is electrically connected to the electrical adapter fixture 922; the first pad of the transimpedance amplifier chip 924 is also connected with the first pad of the coherent modulation chip 925, so that the transimpedance amplifier chip 924 is electrically connected to the coherent modulation chip 925.

[0125] The fourth pad portion 92274 is arranged corresponding to the driver chip 926. The fourth pad portion 92274 is located at the front end of the driver chip 926. The driver chip 926 is also located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the driver chip 926 is respectively connected to the fourth pad portion 92274, the third pad portion 92273 and the second pad of the sixth pad portion, so that the driver chip 926 is electrically connected to the electrical adapter fixture 922; the first pad of the driver chip 926 is also connected to the first pad of the coherent modulation chip 925, so that the driver chip 926 is electrically connected to the coherent modulation chip 925.

[0126] Figure 20 is a block diagram of the components on the circuit board in the optical module provided according to some embodiments of the present disclosure. As shown in Figure 20, the tunable laser 901 outputs light of different wavelengths to the coherent optical modulator. The MCU outputs different gain voltages to the DSP chip 301 to change the signal amplitude of the modulation current output by the corresponding DSP chip, thereby providing different modulation currents to the coherent optical modulator. The DSP chip 301 outputs the modulation current to the coherent optical modulator to achieve modulation of the optical signal. The coherent optical modulator modulates the light emitted by the tunable laser 901 according to the modulation current, and a power detector (MPD) is provided on the output optical path of the optical signal to detect the output optical power of the optical signal.

[0127] In addition, the adjustable voltage source is used to provide an adjustable voltage to the DSP chip, and the coherent optical component is used to implement modulation and demodulation of the optical signal. Specifically, the DSP chip includes an electrical input pin, an electrical input / output pin, and an electrical output pin. The electrical input pin of the DSP chip is connected to the voltage output pin of the adjustable voltage source, the electrical input / output pin of the DSP chip is connected to the first electrical input / output pin of the MCU, the electrical output pin of the DSP chip is connected to the coherent optical component, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source, and the second electrical input / output pin of the MCU is connected to the coherent optical component.

[0128] In some embodiments, a DSP chip, a voltage source, an MCU, and a coherent optical component are provided on the circuit board 300. The DSP chip and the MCU are both connected to the coherent optical component. The voltage source is connected to the MCU and the DSP chip respectively, and the voltage source provides a fixed voltage to the DSP chip.

[0129] The DSP chip requires different minimum voltages for different processes. The voltage source provides the DSP chip with a fixed voltage, resulting in high power consumption in the optical module. To address this issue, the MCU reads the DSP chip's power supply parameters in real time and adjusts the output voltage of the adjustable voltage source based on these parameters to provide the minimum voltage required by the DSP chip. This minimizes power consumption while ensuring that the optical module's performance is not affected. Power supply parameters include the voltage regulation status flag and the voltage regulation feedback flag.

[0130] Figure 21 shows the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component according to some embodiments of the present disclosure. As shown in Figures 5 and 21 , the DSP chip includes an electrical input pin, an electrical input / output pin, and an electrical output pin. The electrical input pin of the DSP chip is connected to the voltage output pin of the adjustable voltage source, the electrical input / output pin of the DSP chip is connected to the first electrical input / output pin of the MCU, the electrical output pin of the DSP chip is connected to the coherent optical component 902, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source 302, and the second electrical input / output pin of the MCU is connected to the coherent optical component 902.

[0131] Figure 22 is a block diagram of a DSP provided according to some embodiments of the present disclosure. As shown in Figure 22, the DSP chip includes a first register and a second register. The first register is used to store a voltage regulation status flag, and the second register is used to store a voltage regulation feedback flag. The voltage regulation status flag indicates whether the voltage regulation feedback flag is valid. If the voltage regulation status flag is a first value, the DSP chip has completed the calculation, and the voltage regulation feedback flag is valid. If the voltage regulation status flag is a second value, the DSP chip has not completed the calculation, and the voltage regulation feedback flag is invalid. The adaptive voltage regulation control feedback flag indicates the voltage compensation direction of the DSP chip. If the voltage regulation feedback flag is a first value, it indicates that compensation is required towards low voltage; if the voltage regulation feedback flag is a second value, it indicates that no voltage compensation is required; if the voltage regulation feedback flag is a third value, it indicates that compensation is required towards high voltage. The MCU reads the voltage regulation feedback flag based on the voltage regulation status flag and adjusts the MCU's output voltage based on the read voltage regulation feedback flag to adjust the output voltage of the adjustable voltage source.

[0132] Figure 23 is a block diagram of an MCU provided according to some embodiments of the present disclosure. As shown in Figure 23, in some embodiments, the MCU includes a third register, a fourth register, and a fifth register. The third register is used to store the step voltage, the fourth register is used to store the initial voltage, the fifth register is used to store the real-time voltage, and the sixth register is used to store the adaptive voltage regulation control loop switch flag.

[0133] The initial voltage is the maximum operating voltage required by the DSP chip to ensure normal startup. After the optical module is powered on, the MCU transmits the initial voltage to the adjustable voltage source, which then outputs the maximum operating voltage required by the DSP chip corresponding to the initial voltage to ensure normal startup. For example, the initial voltage is 0.65V.

[0134] The real-time voltage includes the initial voltage. After the optical module is powered on, the MCU copies the initial voltage in the fourth register to the fifth register. At this time, the real-time voltage in the fifth register is the initial voltage.

[0135] The MCU determines the voltage compensation direction based on the voltage regulation feedback flag it reads, and calculates the first output voltage based on the voltage compensation direction, the step voltage, and the real-time voltage. For example, when the MCU reads a first value for the voltage regulation feedback flag, the first output voltage = real-time voltage - step voltage; when the MCU reads a second value for the voltage regulation feedback flag, the first output voltage = real-time voltage; and when the MCU reads a third value for the voltage regulation feedback flag, the first output voltage = real-time voltage + step voltage.

[0136] As shown in Figure 23, the MCU also includes a sixth register for storing an adaptive voltage regulation control loop switch flag. When the adaptive voltage regulation control loop switch flag is a first value, it indicates that the adaptive voltage regulation control loop is enabled; when the adaptive voltage regulation control loop switch flag is a second value, it indicates that the adaptive voltage regulation control loop is disabled.

[0137] After reading that the adaptive voltage regulation control loop switch flag is a first value, the MCU reads the voltage regulation state flag. When the voltage regulation state flag is read as the first value, the MCU reads the voltage regulation feedback flag and adjusts the output voltage of the MCU according to the voltage regulation feedback flag.

[0138] As shown in Figure 23, the MCU also includes a seventh register, which is used to store the power compensation ratio. After reading that the adaptive voltage regulation control loop switch flag is the first value, the MCU transmits the power compensation ratio to the DSP chip. The DSP chip adjusts the voltage regulation feedback flag according to the power compensation ratio.

[0139] The specific process for calculating the power compensation ratio is as follows: the MCU controls the first output voltage to be output at equal intervals, collects multiple DSP parameters, calculates the average value of each DSP parameter at a voltage value, and then calculates the average value of each DSP parameter at multiple voltage values ​​to obtain the power compensation ratio. For example, if the power compensation ratio is 4.3%, taking into account the margin, the power compensation margin set in the MCU's seventh register is 4.5%.

[0140] Because the optical module is a small package, the DSP chip requires up to 30A of current, making a large adjustable voltage source unsuitable for powering the DSP chip impossible. To ensure 30A is delivered to the DSP chip within the limited space of the optical module, in some embodiments, the adjustable voltage source is a multi-phase power supply chip that can meet the voltage and current requirements of the DSP.

[0141] Figure 24 is a structural diagram of an adjustable voltage source provided according to some embodiments of the present disclosure. As shown in Figure 24, the adjustable voltage source includes a first power chip, a second power chip, and a third power chip. The first, second, and third power chips are connected in parallel. The sum of the phase currents of the first, second, and third power chips is equal to the output current of the adjustable voltage source, which can meet the voltage and current requirements of the DSP.

[0142] The input pin (IN) of the first power chip is connected to the input voltage, and the input pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to receive the power voltage. For example, the power voltage is 3.3V.

[0143] The output pin (SW) of the first power chip is connected to the DSP chip through the ninth resistor R9. The output pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to provide output voltage to the DSP chip.

[0144] The multi-phase mode / synchronization control pin (Mode / Sync) of the first power chip is connected to the multi-phase mode / synchronization control pin of the second power chip and the multi-phase mode / synchronization control pin of the third power chip respectively.

[0145] The feedback pin (FB) of the first power supply chip is connected to the MCU through the seventh resistor R7, and the feedback pin of the first power supply chip is also grounded through the sixth resistor R6. The feedback pin of the first power supply chip is connected to the DSP chip through the eighth resistor R8, and the timing resistor pin (RT) of the first power supply chip is grounded through the fifth resistor R5.

[0146] The feedback pin of the second power supply chip is connected to the input voltage, the timing resistor pin of the second power supply chip is connected to the feedback pin of the second power supply chip through the third resistor R3, the timing resistor pin of the second power supply chip is also grounded through the fourth resistor R4, and the voltage ratio received by FB and RT of the second power supply chip is R3:R4.

[0147] The feedback pin of the third power supply chip is connected to the input voltage, the timing resistor pin of the third power supply chip is connected to the feedback pin of the third power supply chip through the first resistor R1, the timing resistor pin of the third power supply chip is also grounded through the second resistor R2, and the voltage ratio received by FB and RT of the third power supply chip is R1:R2.

[0148] The first power chip is a main phase power chip, and the phase of the first power chip is 0°. The second power chip and the third power chip are slave phase power chips, and the phase of the second power chip is 120°, and the phase of the third power chip is 240°, so that the adjustable voltage source is a three-phase power chip, and the three phase currents of the three-phase power chip are equal to the output current of the three-phase power chip.

[0149] The multi-phase mode / synchronization control pin (Mode / Sync) sets the clock of the master phase power chip in the multi-phase power chip as an output. At the same time, after the FB of the slave phase power chip is directly connected to the input voltage, the clock of the slave phase power chip is configured as an input to receive the clock output of the master phase power chip.

[0150] The timing resistor pin (RT) of the master phase power chip is used to set the master phase power chip's switching frequency. After the slave phase power chip's FB is directly connected to the input voltage, the master phase power chip's Mode / Sync outputs the switching frequency to the slave phase power chip's Mode / Sync, ensuring that the master and slave phase power chips have the same switching frequency.

[0151] In some embodiments, the ratio of the third resistor R3 to the fourth resistor R4 is a first preset value, so that the phase of the second power chip is 120°. For example, the first preset value is 7:5, that is, the ratio of the third resistor R3 to the fourth resistor R4 is 7:5.

[0152] In some embodiments, the ratio of the first resistor R1 to the second resistor R2 is a second preset value, so that the phase of the third power chip is 240°. For example, the second preset value is 5:7, that is, the ratio of the first resistor R1 to the second resistor R2 is 5:7.

[0153] The output voltage of the MCU is a first output voltage, and the output voltage of the adjustable voltage source is a second output voltage. The first output voltage and the second output voltage are in a preset relationship. The output voltage of the adjustable voltage source can be adjusted by simply adjusting the output voltage of the MCU.

[0154] The default relationship is: V out =0.6424-0.1424*V mcu , where V out is the second output voltage, V mcu is the first output voltage.

[0155] According to the current flowing into FB is equal to the current flowing out of FB, that is (V out -V FB ) / R8+(V out -V mcu ) / R7=V FB / R6. R8=4.7k, R6=R7=33k, V FB =5, V out =0.6424-0.1424*V mcu .

[0156] In some embodiments, the MCU reads the voltage regulation feedback flag of the DSP chip in real time, and adjusts the output voltage of the voltage output pin of the adjustable voltage source in real time according to the voltage regulation feedback flag to provide the minimum voltage required by the DSP chip. This can minimize the power consumption of the optical module while ensuring that the performance of the optical module is not affected.

[0157] Figure 25 is a schematic diagram of a coherent optical component provided according to some embodiments of the present disclosure. Figure 26 is an assembly diagram of a coherent optical component and an MCU provided according to some embodiments of the present disclosure. As shown in Figures 25 and 26, in some embodiments, the coherent optical component includes a storage cavity, in which a coherent modulation chip, a transimpedance amplifier chip and a driver chip are arranged. The coherent modulation chip includes a spectrometer, a modulation area, a demodulation area and a photodetector (MPD). The driver chip is connected to the modulation area, the transimpedance amplifier chip is connected to the demodulation area, and the spectrometer is respectively connected to the modulation area, the demodulation area and the photodetector. The spectrometer is used to divide the light emitted by the light source into emitted light and local oscillation light according to the working current. The modulation area modulates the emitted light into an emitted light signal under the modulation current of the driver chip. The demodulation area uses the local oscillation light to demodulate the received light signal to obtain an electrical signal, and the transimpedance amplifier chip (TIA) amplifies the electrical signal. The light source emits light, which is then divided into transmitted light and local oscillator light by the spectrometer. The transmitted light is modulated into a transmitted light signal in the modulation area and then emitted. The local oscillator light and the received light signal are demodulated in the demodulation area to obtain an electrical signal.

[0158] The optical splitter includes an optical input interface, an optical output interface, and an electrical input interface. The optical input interface receives light from the light source. One optical output interface is connected to the modulation area to transmit the emitted light to the modulation area for modulation. The other optical output interface is connected to the demodulation area and the photodetector respectively to transmit most of the local oscillation light to the demodulation area for demodulation, and also transmit a small part of the local oscillation light to the photodetector to monitor the local oscillation light flowing through the demodulation area.

[0159] As shown in Figures 25 and 26, in some embodiments, an MCU is provided on the circuit board 300, and the MCU is respectively connected to the electrical input interface of the spectrometer and the photodetector. The MCU controls the operating current of the electrical input interface of the spectrometer according to the sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector.

[0160] In some embodiments, the beam splitter includes a first interferometer arm and a second interferometer arm, each of which is provided with a heater, and the MCU is connected to each of the two heaters. The MCU adjusts the operating current of the two heaters to change the refractive index of the first interferometer arm and the second interferometer arm, thereby changing the phase difference between the light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the beam splitter.

[0161] In some embodiments, the spectrometer includes a first interferometer arm and a second interferometer arm, wherein a heater is provided on the first interferometer arm or the second interferometer arm, the heater being connected to an electrical input interface of the spectrometer, and the MCU being connected to the heater. The MCU adjusts the operating current of one heater to change the refractive index of the interferometer arm provided with the heater, thereby changing the phase difference between light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the spectrometer.

[0162] In some embodiments, one end of the photodetector is connected to the optical output interface of the optical splitter, and the other end of the photodetector is connected to the MCU to monitor the local oscillator light flowing through the demodulation region.

[0163] A sampling resistor is provided between the other end of the photodetector and the MCU. One end of the sampling resistor is connected to the other end of the photodetector, and the other end of the sampling resistor is connected to the MCU, so that the MCU collects the sampled voltage across the sampling resistor.

[0164] In some embodiments, the MCU includes an eighth register, and the eighth register stores a plurality of splitting ratio functions.

[0165] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to wavelengths, with one splitting ratio function corresponding to each wavelength. The MCU calls the splitting ratio function according to the wavelength and adjusts the working current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, when the wavelength is λ1, the splitting ratio function is Y λ1 ; When the wavelength is λ2, the splitting ratio function is Y λ2 ; When the wavelength is λ3, the splitting ratio function is Y λ3 .

[0166] In some embodiments, the optical module further includes a temperature measuring component, which is used to measure the temperature of the optical module.

[0167] In some embodiments, a temperature measuring element is located within the coherent optical assembly, that is, within a storage cavity of the coherent optical assembly. The temperature measuring element is connected to the MCU and positioned around the coherent modulation chip to measure the temperature around the coherent modulation chip, thereby measuring the temperature of the optical module. For example, the temperature measuring element includes a thermistor. The thermistor is temperature-sensitive and exhibits different resistance values ​​at different temperatures. The MCU determines the temperature around the coherent modulation chip based on the resistance value of the thermistor.

[0168] In some embodiments, a temperature measuring element is integrated into the MCU, and is used to measure the temperature around the MCU and thereby measure the temperature of the optical module. For example, the temperature measuring element is a temperature sensor integrated into the MCU, and the MCU obtains the temperature around the MCU based on the temperature sensor.

[0169] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to temperatures, with one splitting ratio function corresponding to each temperature. The MCU calls the splitting ratio function according to the temperature and controls the operating current of the electrical input interface of the splitter according to the sampled voltage and the splitting ratio function corresponding to the temperature. For example, at temperature T1, the splitting ratio function is Y T1 ; At temperature T2, the splitting ratio function is Y T2 ; At temperature T3, the splitting ratio function is Y T3 .

[0170] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to both temperature and wavelength, with each temperature and wavelength corresponding to a splitting ratio function. The MCU retrieves the splitting ratio function corresponding to the temperature and wavelength based on the temperature and wavelength, and controls the operating current of the electrical input interface of the splitter based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3.

[0171] When the temperature of the coherent modulation chip is controlled to be relatively stable, the coherent modulation chip can be mounted on the inner top wall of the cover shell as shown in Figure 7. When the temperature of the coherent modulation chip is controlled to be relatively stable, the coherent modulation chip can be placed on a semiconductor cooler (TEC), a conductor cooler is placed in the storage cavity, and a temperature measuring device is placed on the semiconductor cooler. The temperature measuring device is used to measure the temperature of the coherent optical component. The semiconductor cooler is connected to the power chip, which supplies power to the semiconductor cooler. The power chip is also connected to the MCU. The MCU adjusts the electrical signal sent to the power chip according to the resistance value of the temperature measuring device. The power chip dynamically adjusts the current transmitted to the semiconductor cooler according to the received electrical signal to keep the temperature of the semiconductor cooler constant, and thus the temperature of the coherent modulation chip constant.

[0172] The temperature is relatively stable within the preset time. The MCU calls the splitting ratio function according to the temperature and controls the working current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, at temperature T1, the splitting ratio function is Y T1 ; At temperature T2, the splitting ratio function is Y T2 ; At temperature T3, the splitting ratio function is Y T3 .

[0173] Alternatively, if the temperature remains relatively stable within a preset time, the MCU retrieves the splitting ratio function based on the temperature and wavelength, and controls the operating current of the splitter's electrical input interface based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3. Relatively stable temperatures mean that the difference between two adjacent temperatures is within the error range.

[0174] In some embodiments, a current source is provided between the MCU and the electrical input interface of the spectrometer, the input interface of the current source is connected to the MCU, and the output interface of the current source is connected to the electrical input interface of the wind-solar device. The MCU obtains a control signal based on the sampling voltage and the splitting ratio function, and the current source adjusts the operating current output to the electrical input interface of the spectrometer according to the control signal.

[0175] FIG27 is another assembly diagram of a coherent optical component and an MCU provided according to some embodiments of the present disclosure. As shown in FIG27 , in some embodiments, a digital-to-analog converter (DAC) is provided between the MCU and the electrical input interface of the spectrometer. The DAC is located on the circuit board 300. One end of the DAC is connected to the MCU, and the other end of the DAC is connected to the electrical input interface of the spectrometer. The MCU obtains a digital current signal based on the sampling voltage and the splitting ratio function, and the DAC converts the digital current signal into an analog current signal. For example, the DAC is a current-type DAC, which converts the digital current signal into an analog current signal to provide an analog current signal to the heater of the spectrometer. The analog current signal of the heater is the analog current signal of the spectrometer, and the analog current signal is the working current.

[0176] In some implementations, the splitting ratio function is used to characterize the correspondence between the control signal and the sampled voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the control signal, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampled voltage.

[0177] In some embodiments, the splitting ratio function is used to characterize the corresponding relationship between the operating current and the sampling voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the operating current, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0178] Figure 28 shows a splitting ratio curve according to some embodiments of the present disclosure. As shown in Figure 28 , the horizontal axis represents the operating current of the splitter, and the vertical axis represents the sampling current of the photodetector. The splitting ratio curve is a graph showing the relationship between the operating current of the splitter and the sampling current of the photodetector. The splitting ratio function is a function obtained by fitting multiple points of the splitting ratio curve.

[0179] As shown in Figure 28, in some embodiments, a splitting ratio function is used to characterize the relationship between operating current and sampling current. For example, the horizontal axis of the splitting ratio curve corresponding to the splitting ratio function represents the operating current, and the vertical axis represents the sampling current. The MCU controls the splitter's operating current to increase at equal intervals starting from zero while simultaneously collecting the sampling current of the photodetector to obtain the splitting ratio curve, and thus the splitting ratio function.

[0180] In the present application, the MCU retrieves the splitting ratio function according to the temperature, and controls the operating current of the electrical input interface of the splitter according to the splitting ratio function and the sampling voltage, so that the splitter can achieve splitting.

[0181] The above-mentioned method of changing the refractive index of the interference arm in the coherent light modulator is to set a heater on the first interference arm or the second interference arm, and then connect the heater to the MCU. By adjusting the operating current of the heater, the refractive index of the interference arm provided with the heater is changed to change the phase difference of the light passing through the first interference arm and the second interference arm. Of course, in addition to the above method, it is also possible that, in some embodiments, a bias current is provided to the coherent light modulator by a bias current source. The MCU adjusts the bias current provided to the coherent light modulator by controlling the bias current source. Exemplarily, the coherent light modulator is an MZ modulator, and the modulation area of ​​the coherent light modulator includes two interference arms. By adjusting the bias current output to the coherent light modulator, the refractive index of the interference arm in the coherent light modulator can be changed, thereby changing the phase difference between the two interference arms in the coherent light modulator to adjust the operating point of the coherent light modulator. Exemplarily, by adjusting the bias current output to the coherent light modulator, the phase difference between the two interference arms in the coherent light modulator is adjusted to π / 2, so that the coherent light modulator is at the optimal operating point.

[0182] In some embodiments, the MCU outputs a gain voltage to the DSP chip 301. The DSP chip 301, in response to the gain voltage, outputs a modulation current, thereby providing the modulation current to the coherent optical modulator. The modulation current output by the DSP chip 301 is an AC signal. Exemplarily, the modulation current output by the DSP chip 301 is a differential signal. The coherent optical modulator modulates the light emitted by the tunable laser according to the modulation current, thereby generating an optical signal. Exemplarily, the coherent optical modulator modulates the intensity of the light emitted by the tunable laser according to the modulation current, thereby generating an optical signal. When the MCU outputs different gain voltages to the DSP chip 301, the signal amplitude of the modulation current output by the corresponding DSP chip changes, thereby providing different modulation currents to the coherent optical modulator.

[0183] The output optical power of an optical signal fluctuates with different wavelengths and temperatures. For example, a coherent optical module's transmitted optical power is higher at lower temperatures and lower at higher temperatures. Another example is that the longer the wavelength, the higher the transmitted optical power, while the shorter the wavelength, the lower the transmitted optical power. This results in inconsistent output optical power, making it difficult to ensure output power stability.

[0184] The output optical power depends on the bias current and the modulation current, so the output optical power can be adjusted by adjusting the bias current or the modulation current. In the present application, the coherent optical modulator can be maintained at the optimal operating point by adjusting the bias current. At this time, if the output optical power is adjusted by adjusting the bias current, the optimal operating point of the coherent optical modulator may be offset. Based on this, the present application adjusts the gain voltage output to the DSP chip 301, thereby adjusting the modulation current output by the DSP chip 301, thereby achieving the purpose of adjusting the output optical power. At the same time, in order to perform wavelength and temperature compensation for the output optical power, the MCU stores wavelength compensation rules and temperature compensation rules respectively. According to the wavelength compensation rules, the reference voltage corresponding to the current wavelength can be obtained. According to the temperature compensation rules, the temperature compensation coefficient corresponding to the current temperature can be obtained. Then, the gain voltage is obtained based on the reference voltage and the temperature compensation coefficient. The gain voltage is the gain voltage output to the DSP chip 301 after wavelength compensation and temperature compensation. The gain voltage is the final gain voltage value provided to the DSP chip 301. This application provides a gain voltage to the DSP chip 301, causing it to output a target modulation current, thereby adjusting the output optical power of the optical signal to the target value. In this application, the current wavelength and temperature are obtained, and then wavelength and temperature compensation are performed on the output optical power to obtain a gain voltage. This gain voltage is then provided to the DSP chip. At this point, the modulation current output by the DSP chip can maintain the output optical power of the optical module at the target value.

[0185] Figure 29 is a block diagram of the circuit board structure of an optical module according to some embodiments of the present disclosure. In some embodiments, a tunable laser 901 outputs light of different wavelengths to a coherent optical modulator. The DSP chip 301 outputs a modulation current to the coherent optical modulator. The coherent optical modulator modulates the light emitted by the tunable laser 901 based on the modulation current, such as intensity modulation, thereby modulating the optical signal. For example, a power detector is provided in the output optical path of the optical signal to detect the output optical power of the optical signal.

[0186] In some embodiments, when the MCU outputs different gain voltages to the DSP chip 301, the signal amplitude of the modulation current output by the corresponding DSP chip changes, thereby providing different modulation currents to the coherent optical modulator, ultimately achieving adjustment of the output optical power. In this application, by adjusting the gain voltage output to the DSP chip 301, the modulation current output by the DSP chip 301 is adjusted, meeting the requirements for wavelength compensation and temperature compensation of the output optical power. Furthermore, because the modulation current is an alternating signal, it is more conducive to improving the signal quality of the optical signal.

[0187] In some embodiments, at a fixed temperature and wavelength, a power detector detects optical power, compares the detected optical power value with a threshold, and reports the comparison result to the MCU. The MCU adjusts the gain voltage output to the DSP chip 301 based on the reported value, thereby adjusting the output optical power. For example, at room temperature and medium wavelength, the detected value is compared with the threshold, and the comparison result is reported to the MCU.

[0188] Figure 30 is a schematic diagram of the internal structure of an MCU provided according to some embodiments of the present disclosure. As shown in Figure 30, in some embodiments, the MCU stores a first register and a second register to perform wavelength compensation and temperature compensation for the output optical module, respectively. For example, the first register stores wavelength compensation rules, while the second register stores temperature compensation rules.

[0189] In some embodiments, the output optical power is affected by wavelength and temperature. Therefore, the present application compensates the output optical power according to wavelength compensation rules and temperature compensation rules, respectively. By outputting a wavelength- and temperature-compensated gain voltage to the DSP chip 301, the DSP chip 301 outputs a target modulation current. This target modulation current stabilizes the output optical power. For example, the wavelength- and temperature-compensated gain voltage is output to the DSP chip 301, thereby adjusting the output optical power to the target value.

[0190] In some embodiments, the first register stores wavelength compensation rules. Exemplarily, the wavelength compensation rules include the corresponding gain voltages output to the DSP chip 301 when the output optical power of the optical signal is adjusted to a target value at different wavelengths at a preset temperature. Exemplarily, if the preset temperature is room temperature, the corresponding gain voltages in the wavelength compensation rules are: the corresponding gain voltages output to the DSP chip 301 when the output optical power of the optical signal is adjusted to a target value at room temperature and at each wavelength. For ease of description, the gain voltage corresponding to each wavelength in the wavelength compensation rules is referred to as a reference voltage. Therefore, the wavelength compensation rules include the reference voltages corresponding to each wavelength at the preset temperature. The reference voltages corresponding to each wavelength can be queried through the wavelength compensation rules. The reference voltages are the gain voltage output values ​​corresponding to wavelength compensation.

[0191] In some embodiments, the second register stores temperature compensation rules. Exemplarily, the temperature compensation rules include temperature compensation coefficients corresponding to various temperatures at a preset wavelength. Exemplarily, the temperature compensation coefficient refers to the ratio between the gain voltage output to the DSP chip 301 corresponding to when the output optical power of the optical signal is adjusted to the target value at the current temperature at the preset wavelength and a reference gain voltage. The reference gain voltage is the gain voltage output to the DSP chip 301 corresponding to when the output optical power of the optical signal is adjusted to the target value at the preset temperature and preset wavelength. The preset temperature can be room temperature, and the preset wavelength can be medium wavelength. It is understood that the "preset temperature" mentioned in this application refers to room temperature, and the "preset wavelength" refers to medium wavelength. Of course, other temperatures and other wavelengths can also be used. The temperature compensation coefficients corresponding to various temperatures can be queried through the temperature compensation rules.

[0192] In some embodiments, the current wavelength and current temperature are obtained, and then a reference voltage corresponding to the current wavelength is obtained according to wavelength compensation rules. A temperature compensation coefficient corresponding to the current temperature is obtained according to temperature compensation rules. Then, a gain voltage is obtained based on the reference voltage and the temperature compensation coefficient. The gain voltage is the gain voltage output to the DSP chip 301 after wavelength compensation and temperature compensation are performed, respectively. It will be understood that the reference voltage only represents the gain voltage output value corresponding to wavelength compensation. If temperature compensation is subsequently performed, the reference voltage is not the final gain voltage provided to the DSP chip 301. The gain voltage is the final gain voltage provided to the DSP chip 301. If only wavelength compensation is performed without subsequent temperature compensation, the reference voltage is the final gain voltage provided to the DSP chip 301.

[0193] This application provides a gain voltage to the DSP chip, causing it to output a target modulation current, thereby adjusting the output optical power of the optical signal to the target value. In this application, the current wavelength and temperature are obtained, and then the output optical power is wavelength- and temperature-compensated to obtain a gain voltage. This gain voltage is then provided to the DSP chip. At this point, the modulation current output by the DSP chip can maintain the output optical power of the optical module at the target value.

[0194] In some embodiments, obtaining a gain voltage based on a reference voltage and a temperature compensation coefficient includes multiplying the reference voltage by the temperature compensation coefficient to obtain the gain voltage. The gain voltage is the gain voltage value corresponding to wavelength compensation and temperature compensation, respectively. This application provides a gain voltage to a DSP chip, causing the DSP chip to output a target modulation current, thereby adjusting the output optical power of the optical signal to a target value.

[0195] In some embodiments, a temperature sensor is provided within the MCU to collect the current temperature. The MCU is also electrically connected to the tunable laser 901 to obtain the current wavelength output by the tunable laser 901.

[0196] In some embodiments, generating the wavelength compensation rule includes:

[0197] The gain voltage output to the DSP chip 301 is adjusted at the preset temperature and the first wavelength to adjust the output optical power of the optical signal to the target value, and the current gain voltage is recorded as the initial gain voltage value. For example, the preset temperature is room temperature and the first wavelength is medium wavelength.

[0198] The gain voltage output to the DSP chip 301 is adjusted at the preset temperature and the second wavelength to adjust the output optical power of the optical signal to a target value, and a first ratio is obtained, wherein the first ratio is the ratio between the current gain voltage and the initial gain voltage value.

[0199] The gain voltage output to the DSP chip 301 is adjusted at the preset temperature and the third wavelength to adjust the output optical power of the optical signal to the target value, and a second ratio is obtained, wherein the second ratio is the ratio between the current gain voltage and the initial gain voltage value.

[0200] The relationship between the reference voltage and the wavelength is fitted according to the first ratio and the second ratio, and a wavelength compensation rule is generated. Exemplarily, the wavelength compensation rule is a corresponding relationship table between each wavelength and the reference voltage.

[0201] The wavelength compensation rules in this application include the reference voltage corresponding to each wavelength at a preset temperature. The wavelength compensation rules can be used to query the reference voltage corresponding to each wavelength. The reference voltage is the gain voltage output value corresponding to wavelength compensation.

[0202] In some embodiments, generating temperature compensation rules includes:

[0203] The gain voltage output to the DSP chip 301 is adjusted at a preset wavelength and a first temperature to adjust the output optical power of the optical signal to a target value, and the current gain voltage is recorded as a reference gain voltage. For example, the preset wavelength is medium wavelength and the first temperature is room temperature.

[0204] The gain voltage output to the DSP chip 301 is adjusted at the preset wavelength and the second temperature so that the output optical power of the optical signal is adjusted to a target value, and a first temperature compensation coefficient is obtained based on the current gain voltage and the reference gain voltage. The first temperature compensation coefficient is the ratio of the current gain voltage to the reference gain voltage.

[0205] The gain voltage output to the DSP chip 301 is adjusted at a preset wavelength and a third temperature so that the output optical power of the optical fiber signal is adjusted to a target value, and a second temperature compensation coefficient is obtained based on the current gain voltage and the reference gain voltage, wherein the second temperature compensation coefficient is a ratio between the current gain voltage and the reference gain voltage.

[0206] The relationship between the temperature compensation coefficient and the temperature is fitted based on the first temperature compensation coefficient and the second temperature compensation coefficient, and a temperature compensation rule is generated. For example, the temperature compensation rule is a corresponding relationship table between various temperatures and temperature compensation coefficients.

[0207] The temperature compensation rule in this application includes the temperature compensation coefficient corresponding to each temperature at a preset wavelength. The temperature compensation coefficient corresponding to each temperature can be queried through the temperature compensation rule.

[0208] In some embodiments of the present application, wavelength compensation and temperature compensation are performed on the output optical power of the optical signal according to wavelength compensation rules and temperature compensation rules, respectively, to obtain a gain voltage. The gain voltage is the final gain voltage value input to the DSP chip 301. The present application provides the gain voltage to the DSP chip so that the DSP chip outputs a target modulation current, thereby adjusting the output optical power of the optical signal to the target value.

[0209] Figure 31 is a schematic diagram illustrating a process in which an MCU outputs a gain voltage to a DSP chip according to some embodiments of the present disclosure. As shown in Figure 31 , in some embodiments, the MCU stores a first register and a second register, respectively. The first register stores wavelength compensation rules, and the second register stores temperature compensation rules.

[0210] The wavelength compensation rule determines the reference voltage corresponding to the current wavelength, and the temperature compensation rule determines the temperature compensation coefficient corresponding to the current temperature. The gain voltage is then derived from the reference voltage and temperature compensation coefficient. This gain voltage is the final gain voltage output to the DSP. This application provides the gain voltage to the DSP chip, causing it to output the target modulation current, thereby adjusting the output optical power of the optical signal to the target value.

[0211] Figure 32 is a flow chart of a method for adjusting the output optical power of an optical module according to some embodiments of the present disclosure. As shown in Figure 32, in some embodiments, the method for adjusting the output optical power of an optical module includes: S110: obtaining the current wavelength and current temperature; S120: obtaining a reference voltage corresponding to the current wavelength according to a wavelength compensation rule; S130: obtaining a temperature compensation coefficient corresponding to the current temperature according to a temperature compensation rule; S140: obtaining a gain voltage based on the reference voltage and the temperature compensation coefficient; and S150: outputting the gain voltage to the DSP chip.

[0212] The present application provides a gain voltage to the DSP chip so that the DSP chip outputs a target modulation current, thereby adjusting the output optical power of the optical signal to a target value.

[0213] In the present application, in the above-mentioned embodiments, a reference voltage corresponding to the current wavelength is obtained according to the wavelength compensation rules, a temperature compensation coefficient corresponding to the current temperature is obtained according to the temperature compensation rules, and then a gain voltage is obtained based on the reference voltage and the temperature compensation coefficient. The present application provides a gain voltage to the DSP chip so that the DSP chip outputs a target modulation current, thereby adjusting the output optical power of the optical signal to a target value. It will be appreciated that in some embodiments of the present application, a reference voltage corresponding to the current temperature may be obtained according to the temperature compensation rules, a wavelength compensation coefficient corresponding to the current wavelength may be obtained according to the wavelength compensation rules, and then a gain voltage may be obtained based on the reference voltage and the wavelength compensation coefficient. The present application provides a gain voltage to the DSP chip so that the DSP chip outputs a target modulation current, thereby adjusting the output optical power of the optical signal to a target value.

[0214] In some embodiments, a first register inside the MCU is used to store temperature compensation rules, and a second register inside the MCU is used to store wavelength compensation rules.

[0215] The temperature compensation rule includes the corresponding relationship between different temperatures and reference voltages at a preset wavelength. The reference voltage is the gain voltage output to the DSP chip 301 corresponding to adjusting the output optical power of the optical signal to a target value at the preset wavelength.

[0216] The wavelength compensation rule includes the correspondence between different wavelengths and wavelength compensation coefficients at a preset temperature. The wavelength compensation coefficient is the ratio of the gain voltage output to the DSP chip 301 when the output optical power of the optical signal at the current wavelength is adjusted to the target value at the preset temperature, to the gain voltage when the output optical power of the optical signal at the preset wavelength is adjusted to the target value. For example, the preset temperature can be room temperature, and the preset wavelength can be medium wavelength.

[0217] In some embodiments, a method for adjusting the output optical power of an optical module includes: obtaining a current wavelength and a current temperature; obtaining a reference voltage corresponding to the current temperature according to a temperature compensation rule; obtaining a wavelength compensation coefficient corresponding to the current wavelength according to the wavelength compensation rule; and obtaining a gain voltage based on the reference voltage and the wavelength compensation coefficient. For example, the gain voltage is obtained by multiplying the reference voltage by the wavelength compensation coefficient. The gain voltage is the gain voltage output to the DSP chip 301 after wavelength and temperature compensation. This application provides the gain voltage to the DSP chip, causing it to output a target modulation current, thereby adjusting the output optical power of the optical signal to a target value.

[0218] In the above embodiment of the present application, a reference voltage corresponding to the current wavelength is obtained according to the wavelength compensation rules, a temperature compensation coefficient corresponding to the current temperature is obtained according to the temperature compensation rules, and a gain voltage is then obtained based on the reference voltage and the temperature compensation coefficient. The present application adjusts the output optical power of the optical signal to the target value by providing the gain voltage to the DSP chip, causing the DSP chip to output a target modulation current. Alternatively, a reference voltage corresponding to the current temperature can be obtained according to the temperature compensation rules, a wavelength compensation coefficient corresponding to the current wavelength can be obtained according to the wavelength compensation rules, and the gain voltage can be obtained based on the reference voltage and the wavelength compensation coefficient. The present application adjusts the output optical power of the optical signal to the target value by providing the gain voltage to the DSP chip, causing the DSP chip to output a target modulation current. It is understood that the reference voltage can also be obtained at a preset temperature and wavelength, a first compensation coefficient corresponding to the current temperature can be obtained according to the temperature compensation rules, a second compensation coefficient corresponding to the current wavelength can be obtained according to the wavelength compensation rules, and the gain voltage can be obtained based on the reference voltage, the first compensation coefficient, and the second compensation coefficient. The present application adjusts the output optical power of the optical signal to the target value by providing the gain voltage to the DSP chip, causing the DSP chip to output a target modulation current.

[0219] The reference voltage is the gain voltage output to the DSP chip 301 when the output optical power of the optical signal is adjusted to the target value at a preset temperature and a preset wavelength. For example, the preset temperature can be room temperature, and the preset wavelength can be medium wavelength.

[0220] The temperature compensation rule includes a first compensation coefficient corresponding to each temperature at a preset wavelength. Exemplarily, the first compensation coefficient is the ratio of the gain voltage corresponding to adjusting the output optical power of the optical signal to a target value at the current temperature at the preset wavelength to a reference gain voltage. Exemplarily, the reference gain voltage is the gain voltage corresponding to adjusting the output optical power of the optical signal to the target value at the preset temperature and wavelength. Exemplarily, the preset temperature can be room temperature, and the preset wavelength can be medium wavelength.

[0221] The wavelength compensation rule includes a correspondence between different wavelengths and a second compensation coefficient at a preset temperature. The second compensation coefficient is the ratio of the gain voltage corresponding to when the output optical power of the optical signal at the current wavelength is adjusted to a target value at the preset temperature to the gain voltage corresponding to when the output optical power of the optical signal at the preset wavelength is adjusted to the target value. For example, the preset temperature can be room temperature, and the preset wavelength can be a medium wavelength.

[0222] In some embodiments, a method for adjusting the output optical power of an optical module includes: obtaining a reference voltage corresponding to a preset temperature and a preset wavelength; obtaining a first compensation coefficient corresponding to the current temperature based on a temperature compensation rule; obtaining a second compensation coefficient corresponding to the current wavelength based on a wavelength compensation rule; and obtaining a gain voltage based on the reference voltage, the first compensation coefficient, and the second compensation coefficient. For example, the gain voltage is obtained by multiplying the reference voltage, the first compensation coefficient, and the second compensation coefficient. The gain voltage is the gain voltage output to the DSP chip 301 after wavelength compensation and temperature compensation. This application provides the gain voltage to the DSP chip, causing it to output a target modulation current, thereby adjusting the output optical power of the optical signal to a target value.

[0223] In the present application, by adjusting the gain voltage output to the DSP chip 301 , and thus adjusting the modulation current output by the DSP chip 301 , the requirements for wavelength compensation and temperature compensation of the output optical power can be met.

[0224] In this application, the purpose of adjusting the output optical power is achieved by adjusting the gain voltage output to the DSP chip, thereby adjusting the modulation current output by the DSP chip. At the same time, in order to perform wavelength and temperature compensation on the output optical power, the MCU stores wavelength compensation rules and temperature compensation rules respectively, and obtains the gain voltage according to the wavelength compensation rules and temperature compensation rules. The gain voltage is the gain voltage output to the DSP chip after wavelength compensation and temperature compensation, and the gain voltage is the final gain voltage value provided to the DSP chip. This application provides a gain voltage to the DSP chip so that the DSP chip outputs the target modulation current, thereby adjusting the output optical power of the optical signal to the target value. This application compensates for the optical power of wavelength and temperature simultaneously, thereby reducing the influence of wavelength and temperature on the optical power, thereby maintaining the stability of the output optical power of the optical signal.

[0225] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: Circuit boards; a tunable laser electrically connected to the circuit board and configured to emit light of different wavelengths; A DSP chip is electrically connected to the circuit board and is configured to output a modulated current, wherein the DSP chip stores a voltage regulation feedback flag; A coherent optical component is electrically connected to the tunable laser and the DSP chip, respectively, and is configured to receive a modulation current output by the DSP chip, and modulate the light emitted by the tunable laser according to the modulation current to generate an optical signal; an adjustable voltage source, wherein a voltage output pin of the adjustable voltage source is connected to an electrical input pin of the DSP chip, and the adjustable voltage source is configured to provide voltage to the DSP chip; The MCU is electrically connected to the DSP chip and configured to output different gain voltages to the DSP chip to adjust the modulation current output by the DSP chip, thereby adjusting the output optical power of the optical signal; the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source, the electrical input and output pin of the MCU is connected to the electrical input and output pin of the DSP chip, and the MCU is configured to read the voltage regulation feedback flag and adjust the output voltage of the voltage output pin of the adjustable voltage source according to the voltage regulation feedback flag.

2. The optical module according to claim 1, wherein: The DSP chip includes a register; the register is configured to store a voltage regulation feedback flag bit, and the voltage regulation feedback flag bit is configured to represent a voltage compensation direction of the DSP chip.

3. The optical module according to claim 2, characterized in that: The MCU includes a register configured to store a step voltage, an initial voltage, and a real-time voltage, wherein the real-time voltage includes the initial voltage; The MCU is configured to calculate a first output voltage according to the read voltage regulation feedback flag, the step voltage and the real-time voltage to adjust the output voltage of the voltage output pin of the adjustable voltage source.

4. The optical module according to claim 2, characterized in that: The register of the MCU is also configured to store an adaptive voltage regulation control loop switch flag bit; After the MCU reads that the adaptive voltage regulation control loop switch flag is a first value, it reads the voltage regulation control state flag.

5. The optical module according to claim 3, characterized in that: The first output voltage and the second output voltage are in a preset relationship, and the preset relationship is: V out =0.6424-0.1424*V mcu Among them, V out is the second output voltage, V mcu is the first output voltage, the first output voltage is the output voltage of the MCU, and the second output voltage is the output voltage of the voltage output pin of the adjustable voltage source.

6. The optical module according to claim 2, characterized in that: The adjustable voltage source includes a first power chip, a second power chip and a third power chip; The first power chip, the input pin is connected to the input voltage, the output pin is connected to the DSP chip through the ninth resistor, the feedback pin is connected to the MCU through the seventh resistor, and the timing resistor pin is grounded through the sixth resistor; The second power chip, the input pin is connected to the input pin of the first power chip, the output pin is connected to the output pin of the first power chip, the multi-phase mode / synchronous control pin is connected to the multi-phase mode / synchronous control pin of the first power chip, the feedback pin is connected to the input voltage, the timing resistor pin is connected to the feedback pin through the third resistor, and the timing resistor pin is also grounded through the fourth resistor; The third power supply chip has an input pin connected to the input pin of the second power supply chip, an output pin connected to the output pin of the second power supply chip, a multi-phase mode / synchronous control pin connected to the multi-phase mode / synchronous control pin of the first power supply chip, a feedback pin connected to the input voltage, a timing resistor pin connected to the feedback pin through a first resistor, and the timing resistor pin is also grounded through a second resistor.

7. The optical module according to claim 6, characterized in that: A ratio of the second resistor to the first resistor is a first preset value, and a ratio of the fourth resistor to the third resistor is a second preset value.

8. The optical module according to claim 2, characterized in that: The register of the DSP also stores a voltage regulation control state flag bit; When the voltage regulation control state flag bit read by the MCU is a first value, the voltage regulation feedback flag bit is read.

9. The optical module according to claim 2, characterized in that: The register of the MCU is also configured to store a power compensation ratio.

10. The optical module according to claim 1, wherein: The coherent optical component includes a coherent optical modulator; The MCU is configured to change the refractive index of the interference arm in the coherent light modulator by adjusting the bias current provided to the coherent light modulator, thereby changing the phase difference between the two interference arms of the coherent light modulator to adjust the working point of the coherent light modulator; The MCU is configured to: obtain a reference voltage corresponding to the current wavelength according to a wavelength compensation rule, obtain a temperature compensation coefficient corresponding to the current temperature according to a temperature compensation rule, obtain a gain voltage according to the reference voltage and the temperature compensation coefficient, and then output the gain voltage to the DSP chip.

11. The optical module according to claim 10, wherein: The MCUs respectively include: A first register is configured to store the wavelength compensation rule, wherein the wavelength compensation rule includes: a correspondence between different wavelengths and the reference voltage at a preset temperature; the reference voltage represents a gain voltage corresponding to when the output optical power of the optical signal is adjusted to a target value at the preset temperature; The second register is configured to store the temperature compensation rule, wherein the temperature compensation rule includes: a correspondence between different temperatures and a temperature compensation coefficient at a preset wavelength; the temperature compensation coefficient represents a ratio between a gain voltage corresponding to when the output optical power of the optical signal is adjusted to a target value at a current temperature at the preset wavelength and a reference gain voltage.

12. The optical module according to claim 11, wherein: The MCU is configured as: Get the current wavelength and current temperature; Acquire a reference voltage corresponding to the current wavelength according to the wavelength compensation rule; Obtaining a temperature compensation coefficient corresponding to the current temperature according to the temperature compensation rule; A gain voltage is obtained according to the reference voltage and the temperature compensation coefficient, wherein the gain voltage is the product of the reference voltage and the temperature compensation coefficient.

13. The optical module according to claim 11, wherein: The MCU is configured as: Adjusting the gain voltage output to the DSP chip at a preset temperature and a first wavelength so that the output optical power of the optical signal is adjusted to a target value, and recording the current gain voltage as an initial value of the gain voltage; Adjusting the gain voltage output to the DSP chip at a preset temperature and a second wavelength so that the output optical power of the optical signal is adjusted to a target value, and obtaining a first ratio, wherein the first ratio represents a ratio between a current gain voltage and an initial value of the gain voltage; Adjusting the gain voltage output to the DSP chip at a preset temperature and a third wavelength so that the output optical power of the optical signal is adjusted to a target value, and obtaining a second ratio, wherein the second ratio represents a ratio between a current gain voltage and an initial value of the gain voltage; The relationship between the reference voltage and the wavelength is fitted according to the first ratio and the second ratio, and the wavelength compensation rule is generated.

14. The optical module according to claim 11, wherein: The reference gain voltage is a gain voltage corresponding to when the output optical power of the optical signal is adjusted to a target value at the preset temperature and the preset wavelength.

15. The optical module according to claim 11, characterized in that: The MCU is configured as: Adjusting the gain voltage output to the DSP chip at a preset wavelength and a first temperature so that the output optical power of the optical signal is adjusted to a target value, and recording the current gain voltage as a reference gain voltage; The gain voltage output to the DSP chip is adjusted at a preset wavelength and a second temperature so that the output optical power of the optical signal is adjusted to a target value, and a first temperature compensation coefficient is obtained according to the current gain voltage and the reference gain voltage, wherein the first temperature compensation coefficient is a ratio between the current gain voltage and the reference gain voltage; The gain voltage output to the DSP chip is adjusted at a preset wavelength and a third temperature so that the output optical power of the optical signal is adjusted to a target value, and a second temperature compensation coefficient is obtained according to the current gain voltage and the reference gain voltage, wherein the second temperature compensation coefficient is a ratio between the current gain voltage and the reference gain voltage; The relationship between the temperature compensation coefficient and temperature is fitted according to the first temperature compensation coefficient and the second temperature compensation coefficient, and the temperature compensation rule is generated.

16. The optical module according to claim 1, wherein: The MCU is configured to change the refractive index of the interference arm in the coherent light modulator by adjusting the bias current provided to the coherent light modulator, thereby changing the phase difference between the two interference arms of the coherent light modulator to adjust the working point of the coherent light modulator; The MCU is configured to: obtain a reference voltage corresponding to the current temperature according to a temperature compensation rule, obtain a wavelength compensation coefficient corresponding to the current wavelength according to a wavelength compensation rule, obtain a gain voltage according to the reference voltage and the wavelength compensation coefficient, and then provide the gain voltage to the DSP chip.

17. The optical module according to claim 16, characterized in that: The MCUs respectively include: A first register is configured to store the temperature compensation rule, wherein the temperature compensation rule includes: a correspondence between different temperatures at a preset wavelength and the reference voltage; the reference voltage is a gain voltage corresponding to when the output optical power of the optical signal is adjusted to a target value at the preset wavelength; The second register is configured to store the wavelength compensation rule, wherein the wavelength compensation rule includes: a correspondence between different wavelengths and wavelength compensation coefficients at a preset temperature; the wavelength compensation coefficient is a ratio between a gain voltage corresponding to when the output optical power of the optical signal at the current wavelength is adjusted to a target value at the preset temperature and a gain voltage corresponding to the preset wavelength.

18. An optical module, comprising: A DSP chip, comprising a register; the register is configured to store a voltage regulation feedback flag, and the voltage regulation feedback flag is configured to represent a voltage compensation direction of the DSP chip; an adjustable voltage source, whose voltage output pin is connected to the electrical input pin of the DSP chip and is configured to provide voltage to the DSP chip; The MCU has an electrical output pin connected to the control pin of the adjustable voltage source, and an electrical input / output pin connected to the electrical input / output pin of the DSP chip, and is configured to read the voltage regulation feedback flag and adjust the output voltage of the voltage output pin of the adjustable voltage source according to the voltage regulation feedback flag.

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