Power system, electric drive system, and vehicle

Abstract

The present application relates to the technical field of power systems, and provides a power system, an electric drive system, and a vehicle. The power system comprises: a radiator provided with a recessed space, a cooling liquid being circulated in the radiator; a plurality of power devices, the plurality of power devices being located within the recessed space and connected to an inner wall of the radiator; at least two bus capacitors, the at least two bus capacitors being located on two sides of the radiator and connected to the two sides of the radiator; and a printed circuit board (PCB), electrically connected to the plurality of power devices and the at least two bus capacitors. The radiator is configured to be connected to both the power devices and the bus capacitors, so that the radiator can dissipate heat not only from the power devices but also from the bus capacitors. The PCB is electrically connected to the plurality of power devices and the at least two bus capacitors to form the power system, ensuring that the power system has good heat dissipation performance.

Description

Power system, electric drive system and vehicle Technical Field

[0001] This application relates to the field of power system technology, and more specifically, to a power system, an electric drive system, and a vehicle. This application claims priority to patent application number 2023115587205, filed with the State Intellectual Property Office of China on November 21, 2023, and entitled "A Power System, an Electric Drive System, and a Vehicle." Background Art

[0002] Driven by the global energy crisis and environmental pollution, automotive electrification has become a growing trend. As the key powertrain of electric vehicles, the electric drive system is responsible for generating power and recovering the necessary energy. Power devices are crucial components for energy conversion in electric drive systems. Currently, power devices come in two forms: modules that integrate specific circuit topologies according to specific functions, such as a 6-in-1 3-phase full-bridge module or a 2-in-1 half-bridge module; and single-transistor discrete devices, such as TO247 packaged devices. Integrated modules typically have specific performance specifications and are suitable for standard performance and platform-based applications. However, they are not well-suited for market applications with specialized performance requirements or specialized structural requirements. Therefore, a power system based on discrete devices that can accommodate performance expansion and differentiated structural requirements is particularly important.

[0003] Current power system solutions based on discrete devices include two types: planar cooler layout, press-fit mounting, and indirect water cooling; and vertical cooler layout, press-fit mounting, and indirect water cooling. These two power device layouts, due to their press-fit mounting and indirect water cooling, result in high cooling thermal resistance. Furthermore, the heat sink only cools the power device and lacks effective heat dissipation for heat-generating components in the system (such as busbar capacitors). These weaknesses can affect system output performance.

[0004] Summary of the Invention

[0005] The main purpose of the present application is to provide a power system, an electric drive system and a vehicle to solve the problem of poor heat dissipation effect of the radiator in the prior art.

[0006] To achieve the above objectives, according to one aspect of the present application, a power system is provided. The power system includes: a radiator having a recessed space through which coolant flows; a plurality of power devices located within the recessed space and connected to the inner wall of the radiator; at least two busbar capacitors located on either side of the radiator and connected to both sides of the radiator; and a PCB circuit board electrically connected to the plurality of power devices and the at least two busbar capacitors.

[0007] Furthermore, the radiator includes: a base, the base has a accommodating space, at least two busbar capacitors are connected to the base; an upper cover, a portion of the upper cover extends into the accommodating space, and another portion of the upper cover overlaps the side wall of the base, the upper cover extending into the accommodating space has a recessed space, a plurality of power devices located in the recessed space are connected to the side wall of the upper cover, and the plurality of power devices are arranged in sequence along the length direction of the upper cover.

[0008] Furthermore, at least two of the multiple power devices are arranged opposite to each other, and a compression spring is provided between the at least two oppositely arranged power devices. The bottom of the compression spring is connected to the bottom of the upper cover, and the compression spring is respectively abutted against the at least two oppositely arranged power devices. A thermally conductive insulation layer is provided between one side of the power device and the side wall of the upper cover.

[0009] Furthermore, a brazing layer is provided between the multiple power devices and the inner wall of the upper cover, a plurality of brazing materials are provided in the brazing layer, and the multiple power devices are welded to the side wall of the upper cover through the brazing layer.

[0010] Furthermore, a plurality of first wing pins are provided in the accommodating space of the base. The plurality of first wing pins are arranged at intervals along the height direction of the two side walls of the base, and the plurality of first wing pins are in contact with the upper cover.

[0011] Furthermore, the upper cover includes a recessed portion and two folded edges. The bottom surface of the recessed portion contacts the bottom surface of the base. A recessed space is provided inside the recessed portion. Each top of the recessed portion is connected to a folded edge, and the folded edge is clamped on the side wall of the base. The outer wall of the recessed portion is provided with a plurality of second wing pins. The plurality of second wing pins are arranged at intervals along the height direction of the upper cover, and the plurality of first wing pins and the plurality of second wing pins are arranged alternately.

[0012] Furthermore, at least two busbar capacitors are respectively located on both sides of the base, and the at least two busbar capacitors are respectively connected to one end of the base having the plurality of first wing pins.

[0013] Furthermore, a sealing ring is provided between the folded edge of the upper cover and the top of the base.

[0014] Furthermore, an opening is provided at the bottom of the compression spring piece, and the opening is used for a bolt to pass through, and the compression spring piece is connected to the bottom of the recessed space by means of the bolt.

[0015] According to another aspect of the present application, an electric drive system is provided. The electric drive system includes a power system, and the power system includes the above-mentioned power system.

[0016] According to another aspect of the present application, a vehicle is provided, the vehicle including an electric drive system, which is the above-mentioned electric drive system.

[0017] By applying the technical solution of the present application, a heat sink is set up to be connected to power devices and bus capacitors at the same time, so that the heat sink can not only dissipate heat for the power devices, but also for the bus capacitors. The PCB circuit board is electrically connected to multiple power devices and at least two bus capacitors to form a power system, thereby achieving good heat dissipation performance of the power system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings that constitute part of this application are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0019] FIG1 shows a front schematic diagram of a first embodiment of a power system according to the present application;

[0020] FIG2 shows a bottom schematic diagram of a first embodiment of a power system according to the present application;

[0021] FIG3 shows a bottom schematic diagram of a second embodiment of a power system according to the present application;

[0022] FIG4 shows a bottom schematic diagram of a second embodiment of a power system according to the present application;

[0023] FIG5 shows a schematic structural diagram of a base of a power system according to the present application;

[0024] FIG6 shows a schematic structural diagram of an upper cover of a power system according to the present application;

[0025] FIG7 shows a schematic structural diagram of a first embodiment of a power device of a power system according to the present application;

[0026] FIG8 shows a schematic structural diagram of a second embodiment of a power device of a power system according to the present application;

[0027] FIG9 shows a schematic circuit block diagram of a power system according to the present application.

[0028] Among them, the above-mentioned drawings include the following figure marks: 1. power device; 11. thermal insulation layer; 12. soldering layer; 2. radiator; 21. base; 211. first fin pin; 22. upper cover; 221. recessed portion; 2211. second fin pin; 222. folded edge; 3. busbar capacitor; 4. PCB circuit board; 5. clamping spring; 51. bolt; 6. sealing ring. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be interpreted as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of layers and regions may be exaggerated, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0033] It should be noted that this application takes the three-phase full-bridge circuit topology as an example. As shown in Figure 9, the power system consists of a three-phase full-bridge circuit composed of 6 power devices, a bus capacitor, and a drive / control unit. The power devices in the three-phase full-bridge circuit are standard single-tube discrete power devices. The commonly used package for discrete power devices is TO247 package. The bus capacitor is connected in parallel at the DC bus end to realize instantaneous high-power charging and discharging of the power system. The drive / control circuit realizes the control logic and drives the power device according to the control logic to complete power conversion.

[0034] 1 to 8 , according to a specific embodiment of the present application, a power system is provided.

[0035] Specifically, as shown in Figure 1, the power system includes: a radiator 2, the radiator 2 has a recessed space, and coolant flows through the radiator 2; multiple power devices 1, the multiple power devices 1 are located in the recessed space, and the multiple power devices 1 are connected to the inner wall of the radiator 2; at least two bus capacitors 3, at least two bus capacitors 3 are located on both sides of the radiator 2, and at least two bus capacitors 3 are connected to both sides of the radiator 2; a PCB circuit board 4, the PCB circuit board 4 is electrically connected to the multiple power devices 1 and at least two bus capacitors 3.

[0036] In this embodiment, by setting the heat sink 2 to be connected to the power device 1 and the bus capacitor 3 at the same time, the heat sink 2 can not only dissipate heat for the power device 1, but also dissipate heat for the bus capacitor 3. The PCB circuit board 4 is electrically connected to multiple power devices 1 and at least two bus capacitors 3 to form a power system, thereby ensuring good heat dissipation performance of the power system.

[0037] Furthermore, the heat sink 2 includes: a base 21, the base 21 has a storage space, at least two bus capacitors 3 are connected to the base 21; an upper cover 22, a portion of the upper cover 22 extends into the storage space, and another portion of the upper cover 22 is overlapped on the side wall of the base 21, the upper cover 22 extending into the storage space has a recessed space, and multiple power devices 1 located in the recessed space are connected to the side wall of the upper cover 22, and the multiple power devices 1 are arranged in sequence along the length direction of the upper cover 22. This arrangement allows the upper cover 22 and the base 21 to play a structural coordination role, and the structure is simple. The power device 1 is placed in the recessed space of the upper cover 22, saving space. In addition, the power device 1 is connected to the upper cover 22, and the bus capacitor 3 is connected to the base, so that the heat sink 2 dissipates heat for the power device 1 and the bus capacitor 3, and the heat dissipation effect of the power system is good.

[0038] As shown in Figures 1 and 2, at least two power devices 1 among the multiple power devices 1 are arranged opposite to each other, and a clamping spring 5 is provided between the at least two power devices 1 arranged opposite to each other. The bottom of the clamping spring 5 is connected to the bottom of the upper cover 22, and the clamping spring 5 is respectively in contact with the at least two power devices 1 arranged opposite to each other, and a thermally conductive insulating layer 11 is provided between one side of the power device 1 and the side wall of the upper cover 22. Specifically, the thermally conductive insulating layer 11 can be a thermally conductive insulating pad, a thermally conductive insulating glue, etc., which is used to ensure that the power device 1 is in good contact with the surface of the upper cover 22 to ensure heat dissipation. In this embodiment, the clamping spring 5 is U-shaped, and the clamping spring 5 is used to apply a pre-tightening force to the power devices 1 on both sides, so that the power devices 1 on both sides can fit tightly with the side wall of the upper cover 22 of the radiator 2, thereby facilitating heat dissipation for the power device 1 and preventing the power device 1 from falling.

[0039] As shown in Figures 3 and 4, a brazing layer 12 is provided between the multiple power devices 1 and the inner wall of the upper cover 22. Brazing layer 12 contains a plurality of solders, and the multiple power devices 1 are welded to the sidewall of the upper cover 22 via the brazing layer 12. The solder ensures a secure connection between the multiple power devices 1 and the upper cover 22, while also ensuring good heat dissipation. Solders are classified by composition into soft solders, including tin-based, lead-based, and zinc-based solders, and hard solders, including aluminum-based, silver-based, copper-based, and nickel-based solders.

[0040] As shown in Figure 5 , the housing space of the base 21 is provided with a plurality of first fin pins 211. These first fin pins 211 are spaced apart along the height direction of the two sidewalls of the base 21 and contact the upper cover 22. The base 21 can be made of aluminum, and the first fin pins 211 are manufactured through a process such as forging. These first fin pins 211 are PinFin fins, which are used to increase the heat dissipation area of ​​the radiator and enhance its heat dissipation capacity.

[0041] As shown in Figure 6, the upper cover 22 includes a recessed portion 221 and two folded edges 222. The bottom surface of the recessed portion 221 contacts the bottom surface of the base 21. The interior of the recessed portion 221 is provided with a recessed space. Each top of the recessed portion 221 is connected to a folded edge 222, which is clamped to the side wall of the base 21. The outer wall of the recessed portion 221 is provided with a plurality of second wing pins 2211. The plurality of second wing pins 2211 are arranged at intervals along the height direction of the upper cover 22, and the plurality of first wing pins 211 and the plurality of second wing pins 2211 are arranged in an alternating manner. The upper cover 22 can be made of aluminum or copper material, and the PinFin wing pins are manufactured through forging and other processes to increase the heat dissipation area of ​​the radiator and improve the heat dissipation capacity. The base 21 and the upper cover 22 of the radiator 2 are both designed with PinFin wing pins. The double-sided wing pin staggered tooth design avoids the gap between the unilateral wing pin and the flat mating surface, which causes the coolant to cool along the gap, resulting in poor cooling effect of the power device and affecting the performance output of the power device.

[0042] Figures 7 and 8 show discrete power devices, typically in TO247 packages. The power device type can be IGBT or SiC MOS.

[0043] Furthermore, at least two busbar capacitors 3 are located on either side of the base 21, and are each connected to one end of the base 21 having a plurality of first fins 211. The busbar capacitors 3 are connected to the surface of the base 21 with the PinFin fins, thereby enhancing the heat dissipation capability of the busbar capacitors 3, reducing heat generation in the busbar capacitors 3, and improving the output performance of the power system.

[0044] Furthermore, a sealing ring 6 is provided between the folded edge 222 of the upper cover 22 and the top of the base 21. The sealing ring 6 is used to tightly connect the upper cover 22 and the base 21. The sealing ring is an annular sealing member with a notch. It is compressed and has elastic properties, pressing against the inner walls of the upper cover 22 and the base 21 to provide a seal.

[0045] Furthermore, the bottom of the compression spring 5 is provided with an opening for a bolt 51 to pass through. The compression spring 5 is connected to the bottom of the recessed space via the bolt 51. The bolt 51 is used to securely connect the compression spring 5 to the upper cover 22. The compression spring is U-shaped, with a hole on the bottom for bolt fastening. The two sides of the U-shaped spring clamp compress the power device, ensuring good contact between the power device and the heat sink while also improving shock resistance.

[0046] According to another aspect of the present application, an electric drive system is provided, which includes a power system, and the power system includes the above-mentioned power system. The power system includes: a radiator 2, the radiator 2 has a recessed space, and a coolant flows through the radiator 2; a plurality of power devices 1, the plurality of power devices 1 are located in the recessed space, and the plurality of power devices 1 are connected to the inner wall of the radiator 2; at least two bus capacitors 3, at least two bus capacitors 3 are located on both sides of the radiator 2, and at least two bus capacitors 3 are connected to both sides of the radiator 2; a PCB circuit board 4, the PCB circuit board 4 is electrically connected to the plurality of power devices 1 and the at least two bus capacitors 3. By setting the radiator 2 to be connected to the power devices 1 and the bus capacitors 3 at the same time, the radiator 2 can not only dissipate heat for the power devices 1, but also dissipate heat for the bus capacitors 3. The PCB circuit board 4 is electrically connected to the plurality of power devices 1 and the at least two bus capacitors 3 to form a power system, so that the heat dissipation performance of the power system is good.

[0047] According to another aspect of the present application, a vehicle is provided, which includes an electric drive system, and the electric drive system is the above-mentioned electric drive system. The power system includes: a radiator 2, the radiator 2 has a recessed space, and coolant flows through the radiator 2; a plurality of power devices 1, the plurality of power devices 1 are located in the recessed space, and the plurality of power devices 1 are connected to the inner wall of the radiator 2; at least two bus capacitors 3, at least two bus capacitors 3 are located on both sides of the radiator 2, and at least two bus capacitors 3 are connected to both sides of the radiator 2; a PCB circuit board 4, the PCB circuit board 4 is electrically connected to the plurality of power devices 1 and the at least two bus capacitors 3. By setting the radiator 2 to be connected to the power devices 1 and the bus capacitors 3 at the same time, the radiator 2 can not only dissipate heat for the power devices 1, but also dissipate heat for the bus capacitors 3. The PCB circuit board 4 is electrically connected to the plurality of power devices 1 and the at least two bus capacitors 3 to form a power system, so that the heat dissipation performance of the power system is good.

[0048] In another embodiment of the present application, the power system of the present application is composed of a power device, a heat sink, a capacitor, a clamping spring and a PCB circuit board, specifically relating to a power system and a heat sink. The power system is based on discrete power devices, such as TO247 packaged devices. The discrete power device is welded to the concave heat sink through a brazing layer, or the discrete power device is connected to the concave heat sink through an insulating thermal conductive layer through a clamping spring to achieve efficient heat dissipation. The concave heat sink is divided into two layers, namely the heat sink frame top cover and the heat sink frame base. PinFin fins are designed inside the heat sink frame top cover and the heat sink frame base, and the staggered teeth complement each other, thereby increasing the heat dissipation area and improving the heat dissipation capacity of the heat sink. The heat sink frame top cover and the heat sink base are sealed by a sealing ring; the DC bus capacitor is closely connected to the heat sink to achieve good heat dissipation, thereby reducing the impact of bus capacitor heating on system output performance.

[0049] The bottom surface of the power chip is connected to the liner through a sintering process, achieving a highly reliable connection while achieving good heat dissipation; the top surface of the chip is connected to the buffer copper sheet through a sintering process, and the top surface of the buffer copper sheet is connected to the conductive frame through a sintering process. The buffer copper layer can effectively reduce the damage to the power chip caused by excessive stress when the conductive frame is directly connected to the power chip; the conductive frame connects the power chips that need to be connected in parallel through brazing or sintering processes to form a high-variable power chipset or a low-side chipset. The conductive frame-high side and the conductive frame-low side are insulated through an insulating layer to achieve high and low side insulation. The large-area laminated conductive frame can achieve ultra-low stray inductance of the power system. At the same time, the large-area conductive frame is more effective in dissipating heat from the power chip, which is conducive to high-performance, high-power and high-current output of the power system; the positive and negative power terminals of the power system are designed in an embracing or laminated manner to achieve mutual cancellation of the positive and negative magnetic fluxes, reducing the stray inductance between the positive and negative poles.

[0050] This application connects the power device to the heat sink by pressing the spring sheet or brazing, ensuring heat dissipation through good connection and improving shock resistance. Brazing power devices can also use pressing spring sheets to ensure high shock resistance of the power device.

[0051] The radiator adopts a double-sided PinFin structure to increase the heat dissipation area to ensure efficient heat dissipation. At the same time, the double-sided PinFin staggered tooth structure reduces the poor cooling of power devices caused by the coolant flowing along the low flow resistance due to the structural tolerance gap between the single-sided PinFin and the mating plane.

[0052] The PinFin structure of the heat sink can be circular, diamond, elliptical, etc., depending on the cooling and structure of the power device.

[0053] The heat sink adopts a double-sided PinFin design, which can achieve good heat dissipation for power devices while also dissipating heat for bus capacitors, reducing the power system performance degradation caused by excessive temperature of power devices and bus capacitors.

[0054] The clamping spring adopts a U-shaped elastic structure to clamp the power device to ensure a reliable connection between the power device and the heat sink, thereby reducing the risk of the power device slipping due to vibration or poor contact with the heat sink that affects the heat dissipation performance.

[0055] The concave heat sink design enables synchronous cooling of power devices and busbar capacitors, improves the heat dissipation performance of the power system's heating components, and enhances the power system's output performance.

[0056] By arranging busbar capacitors close to power devices, the parasitic inductance of the power system power loop is reduced and the operating safety of the power system is improved.

[0057] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0058] In addition to the above, it should be noted that references to "one embodiment," "another embodiment," "an embodiment," and the like in this specification refer to specific features, structures, or characteristics described in conjunction with that embodiment as included in at least one embodiment generally described in this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in conjunction with any embodiment, it is intended that such feature, structure, or characteristic, when implemented in conjunction with other embodiments, also fall within the scope of this application.

[0059] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0060] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A power system, characterized in that: include: A radiator (2), the radiator (2) having a recessed space, and a coolant flowing through the radiator (2); A plurality of power devices (1), wherein the plurality of power devices (1) are located in the recessed space, and the plurality of power devices (1) are connected to the inner wall of the heat sink (2); At least two bus capacitors (3), at least two of the bus capacitors (3) are located on both sides of the radiator (2), and at least two of the bus capacitors (3) are connected to both sides of the radiator (2); A PCB circuit board (4), wherein the PCB circuit board (4) is electrically connected to the plurality of power devices (1) and at least two of the bus capacitors (3).

2. The power system according to claim 1, characterized in that: The radiator (2) comprises: A base (21), the base (21) having a receiving space, and at least two of the bus capacitors (3) are connected to the base (21); An upper cover (22), a portion of the upper cover (22) extends into the accommodating space, and another portion of the upper cover (22) overlaps the side wall of the base (21), the upper cover (22) extending into the accommodating space has the recessed space, the plurality of power devices (1) located in the recessed space are connected to the side wall of the upper cover (22), and the plurality of power devices (1) are arranged in sequence along the length direction of the upper cover (22).

3. The power system according to claim 2, characterized in that: At least two of the plurality of power devices (1) are arranged opposite to each other, a clamping spring (5) is provided between the at least two oppositely arranged power devices (1), the bottom of the clamping spring (5) is connected to the bottom of the upper cover (22), the clamping spring (5) is respectively in contact with the at least two oppositely arranged power devices (1), and a heat-conducting insulating layer (11) is provided between one side of the power device (1) and the side wall of the upper cover (22).

4. The power system according to claim 2, characterized in that: A soldering layer (12) is provided between the plurality of power devices (1) and the inner wall of the upper cover (22), a plurality of solders are provided in the soldering layer (12), and the plurality of power devices (1) are welded to the side wall of the upper cover (22) through the soldering layer (12).

5. The power system according to claim 2, characterized in that: A plurality of first wing pins (211) are arranged in the accommodation space of the base (21), and the plurality of first wing pins (211) are arranged at intervals along the height direction of the two side walls of the base (21), and the plurality of first wing pins (211) are in contact with the upper cover (22).

6. The power system according to claim 5, characterized in that: The upper cover (22) comprises a recessed portion (221) and two folded edges (222), the bottom surface of the recessed portion (221) contacts the bottom surface of the base (21), the recessed space is provided inside the recessed portion (221), each top of the recessed portion (221) is connected with the folded edges (222), the folded edges are clamped on the side wall of the base (21), and the outer wall of the recessed portion (221) is provided with a plurality of second wing pins (2211), the plurality of second wing pins (2211) are arranged at intervals along the height direction of the upper cover (22), and the plurality of first wing pins (211) and the plurality of second wing pins (2211) are arranged alternately.

7. The power system according to claim 5, characterized in that: At least two of the bus capacitors (3) are respectively located on two sides of the base (21), and at least two of the bus capacitors (3) are respectively connected to one end of the base (21) having the plurality of first wing pins (211).

8. The power system according to claim 6, characterized in that: A sealing ring (6) is provided between the folded edge (222) of the upper cover (22) and the top of the base (21).

9. The power system according to claim 3, characterized in that: An opening is provided at the bottom of the clamping spring sheet (5), and the opening is used for a bolt (51) to pass through. The clamping spring sheet (5) is connected to the bottom of the recessed space via the bolt (51).

10. An electric drive system, characterized in that: The electric drive system includes a power system, and the power system includes the power system according to any one of claims 1 to 9.

11. A vehicle, characterized in that: The vehicle includes an electric drive system, and the electric drive system is the electric drive system according to claim 10.

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