Pick-and-place device and method for identifying head position of pick-and-place device

The pick-and-place device employs camera units and an optical box with a fiducial mark to accurately confirm the head position, addressing the challenge of maintaining precision over time and improving operational accuracy.

WO2025110847A1PCT designated stage expired Publication Date: 2025-05-30HANWHA PRECISION MACHINERY CO LTD
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Patent Information

Application Number
PCT/KR2024/096350
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-11-22
Filing Date
2024-10-11
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

Existing pick-and-place devices face challenges in accurately confirming the head position, especially as the operation time continues or new processes are performed, due to the individual movement or fixation of first and second camera units and the head.

Method used

A pick-and-place device is designed with first and second camera units positioned on the pick and place units, respectively, and an optical box with a fiducial mark that is arranged to have a light path distance corresponding to the working distance of the cameras. The head is positioned at a preset distance perpendicular to the imaging direction of the optical box and cameras, allowing for precise alignment and confirmation of the head center point.

Benefits of technology

This configuration enables precise and accurate confirmation of the head position, reducing errors and improving the precision of pick-and-place operations, even as the operation time extends or new processes are initiated.

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Abstract

A pick-and-place device according to an embodiment of the present invention comprises: a head for picking up a target disposed on a pick unit and placing the picked-up target on a place unit; a first and a second camera unit which are arranged on the pick unit and the place unit, respectively, and photograph the targets of the pick unit and the place unit at a working distance; and an optical box having a fiducial mark disposed therein and disposed to have a light path distance from the first camera unit or the second camera unit to the fiducial mark, wherein the head is disposed to have a preconfigured distance (D) from the optical box in a direction perpendicular to a photographing direction (PD) of the first and the second camera unit.
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Description

Pick-and-place device and method for checking the head position of the pick-and-place device

[0001] Embodiments of the present invention relate to a pick-and-place device and a method for confirming a head position of the pick-and-place device.

[0002] A pick-and-place device can refer to any device that performs pick-and-place operations. For example, pick-and-place devices are a type of industrial robot primarily used in automated processes. For example, pick-and-place devices can be used in a variety of fields, including logistics, semiconductor manufacturing, display manufacturing, automobile manufacturing, and battery manufacturing.

[0003] With the recent advancements in miniaturization and ultra-precision processes, reducing errors in pick-and-place devices is crucial. In particular, precise positioning of the head that picks up and places the target is essential.

[0004] Typically, when performing a pick-and-place operation in the semiconductor field, in order to improve the production efficiency of a bonder device or a pick-and-place device, a camera can be installed above the head and pre-alignment can be performed when the head is in the supply area or work area.

[0005] However, in order to improve work performance, if the camera is positioned at the top and the head performs pick-and-place work through the lower part of the head from below the camera, it becomes difficult to confirm the exact location of the center of the lower part of the head.

[0006] In addition, since the first camera of the pick-up unit and the second camera and head of the place unit are moved or fixed individually, it may become more difficult to confirm the exact location of the lower center of the head, and although the location of the lower center of the head can be inferred during the pick-and-place operation, the accuracy of confirming the location of the lower center of the head may significantly decrease as the operation time continues or a new process is performed.

[0007] According to one aspect of the present invention, the main object is to provide a pick-and-place device for more precisely correcting the position of a head in which an error has occurred, and a method for confirming the head position of the pick-and-place device.

[0008] However, these tasks are exemplary, and the tasks to be solved by the present invention are not limited thereto.

[0009] A pick-and-place device according to one embodiment of the present invention comprises: a head for picking up a target placed on a pick portion and placing the picked-up target on a place portion; first and second camera portions respectively placed on the pick portion and the place portion and photographing the targets of the pick portion and the place portion at a working distance; and an optical box having a fiducial mark placed therein and arranged to have a light path distance from the first camera portion or the second camera portion to the fiducial mark, wherein the head is arranged to have a preset distance (D) in a direction perpendicular to an imaging direction (PD) of the optical box and the first and second camera portions.

[0010] The above walking distance and the above optical path distance may correspond.

[0011] The optical box and the head may further include a control unit for transporting and positioning the optical box, and the control unit may include an optical box transport unit for transporting the optical box; a head transport unit for transporting the head to have a preset distance from the optical box; and a distance setting unit for setting a distance (D) between the optical box transported through the optical box transport unit and the head transported through the head transport unit.

[0012] The optical box transport unit can place the optical box at a position having an optical path distance equal to the working distance of the first camera unit or the second camera unit.

[0013] The optical box transport unit can position the optical box with reference to the preset distance (D) between the optical box and the head so that the optical box is aligned with the head center point (C) and the first camera unit or the head center point (C) and the second camera unit.

[0014] At least one reflector is arranged inside the optical box, and the at least one reflector changes the path of light incident through the first camera unit or the second camera unit and creates a plurality of optical paths, and the sum of the plurality of optical paths may be an optical path distance.

[0015] The optical box may include a fiducial mark positioned at a location where the optical path progresses; a diffuser formed at a portion adjacent to the fiducial mark; and a lighting unit that emits light toward the fiducial mark in a direction opposite to the direction in which the optical path progresses based on the fiducial mark.

[0016] The first camera unit or the second camera unit may be positioned on the lower side of the head and the optical box.

[0017] A method for confirming a head position of a pick-and-place device according to one embodiment of the present invention comprises the steps of: a first camera unit being positioned above the pick unit while maintaining a working distance from the pick unit; a second camera unit being positioned above the place unit while maintaining a working distance from the place unit; a step of an optical box transport device arranging an optical box between the first camera unit and the pick unit, or between the second camera unit and the place unit; and a step of a head transport device arranging a head at a position having a preset distance (D) in a direction perpendicular to an imaging direction (PD) of the optical box and the first and second camera units that are already arranged.

[0018] The optical box transport device can position the optical box with reference to the preset distance (D) between the optical box and the head so that the head center point (C) is aligned with the first camera unit or the second camera unit.

[0019] The optical box transport device can arrange the optical box to have an optical path distance that is the same as the working distance of the first camera unit or the second camera unit.

[0020] Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

[0021] A pick-and-place device and a method for confirming a head position of a pick-and-place device according to one embodiment of the present invention can implement a pick-and-place device and a method for confirming a head position of a pick-and-place device capable of correcting a head position in which an error may occur.

[0022] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0023] FIG. 1 is a block diagram showing components of a pick-and-place device according to one embodiment of the present invention.

[0024] Figure 2 is a block diagram showing components of the control unit of the present embodiment.

[0025] Figure 3 is a conceptual diagram showing the main components of the pick-and-place device of the present embodiment.

[0026] Fig. 4 is a drawing showing the main structure inside the optical box according to the present embodiment.

[0027] FIG. 5 is a drawing showing the main structure inside an optical box according to another embodiment.

[0028] Figure 6 is a flowchart illustrating a method for confirming the head position of a pick-and-place device according to one embodiment of the present invention.

[0029] The present invention is susceptible to various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the description. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention. In describing the present invention, identical components are identified by the same reference numerals even when illustrated in different embodiments.

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same drawing reference numerals, and redundant descriptions thereof will be omitted.

[0031] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0032] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0033] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0034] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0035] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0036] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. In this application, terms such as "comprise" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood to not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0037] Hereinafter, a pick-and-place device according to one embodiment of the present invention will be described with reference to FIGS. 1 to 4.

[0038] Fig. 1 is a block diagram illustrating components of a pick-and-place device according to one embodiment of the present invention. Fig. 2 is a block diagram illustrating components of a control unit according to the present embodiment. Fig. 3 is a conceptual diagram illustrating major components of a pick-and-place device according to the present embodiment. Fig. 4 is a diagram illustrating the main structure inside an optical box according to the present embodiment.

[0039] Referring to FIGS. 1 to 4, a pick-and-place device according to one embodiment of the present invention includes a head (100) that picks up a target (TG) placed in a pick section (10) and places the picked-up target (TG) in a place section (20), first and second camera sections (11, 21) that are respectively placed in the pick section (10) and the place section (20) and capture images of the targets of the pick section (10) and the place section (20) at a working distance (WD), and an optical box (200) that has a mark placed inside and is placed to have a light path distance (Light Path Distance) from the first camera section (11) or the second camera section (21) to the mark (M). At this time, the head (100) is positioned so as to have a preset distance (D) in a direction perpendicular to the optical box (200) and the imaging direction (PD) of the first and second camera units (11, 21).

[0040] A pick-and-place device may be, for example, a die bonder. A die bonder can mount a die (semiconductor chip) on a substrate, such as a wiring board or lead frame, and also assemble a product package. For a precise bonding process, the die bonder needs to accurately bond the die on the bonding surface of the substrate. Alternatively, the pick-and-place device may be, for example, a component mounting device, a chip mounter, etc. However, die bonders, component mounting devices, and chip mounters are merely examples of the pick-and-place device of the present invention and do not limit the scope of the present invention.

[0041] Referring to FIG. 1, the pick-and-place device of the present invention may include a pick-up unit (10) for picking up a target (TG) and a place unit (20) for placing the target (TG). At this time, the device may include a head (100) for picking up or placing the target (TG), and a head transport device (110) for transporting the head to a set position. In addition, the device may include an optical box (200) for setting the mounting position of the head (100) and an optical box transport device (210) for transporting the optical box (200).

[0042] The head (110) may be a component for performing a pick and place operation on a target (TG) placed in the pick section (10) and the place section (20). For example, the head (110) may include a suction head, a finger-driven head, a magnetic head, or a custom head.

[0043] For example, in some cases, a pick-and-place device may include multiple arms or multiple heads. In the following description of the present invention, the head is described as a suction head, but the scope of the present invention is not limited thereto.

[0044] The head transfer device (110) may be a component for moving the head (100). The head transfer device (110) may drive the head (100) along the vertical and horizontal axes. However, the axis operation of the head transfer device (110) may have a certain degree of error when operated for a long period of time. Therefore, it is necessary to perform the manufacturing process while compensating for such errors in the semiconductor manufacturing process.

[0045] The first and second camera units (11, 21) may be components that include optical sensors and capture images of a target to generate optical images. The first and second camera units (11, 21) are arranged on the upper side of the head (100) and can capture images of the upper surface of the target (TG) and the upper surface of the head (100). For example, the first and second camera units (11, 21) are arranged on the target (TG) and the head (100) so as to face the target (TG) and the head (100), and the first and second camera units (11, 21) can generate image data including the upper surface of the target (TG) and the upper surface of the head (100). At this time, the first camera unit (11) is arranged in the pick unit and can obtain information on the center point (C) of the head (100) and the center point of the target (TG) when the head (100) picks up the target (TG). The second camera unit (21) is placed in the place unit, and can obtain information on the center point (C) of the head (100) and the center point of the target (TG) when the head (100) places the target (TG).

[0046] Generally, the first camera unit (11) placed in the pick-up unit (10) and the second camera unit placed in the place unit (11) are located at the upper part of the head (100), and it may be difficult to accurately confirm the center point of the head when the head (100) performs a pick-up or placing operation.

[0047] This means that the first and second camera units and the head can move or be fixed individually, and while the head position can be roughly inferred through the first and second camera units, it can become difficult to precisely determine the head position as the work continues or a new task begins. In particular, in semiconductor processes, it is necessary to pick up or place the target in an accurate location based on the precise head position.

[0048] Accordingly, according to the present embodiment, an optical box (200) having a separate fiducial mark (M) that can confirm the position of the head (100) is provided in each of the first camera unit (11) for pickup and the second camera unit (21) for placing, so that the center point (C) of the head (100) and the center point information of the target (TG) can be more precisely obtained in the first and second camera units (11, 21).

[0049] There may be a method of displaying a fiducial mark (M) on the head (100) that can confirm the position of the head (100). However, in the case of the first and second camera units (11, 21) that capture the head (100) and the target (TG), the working distance (WD), which is the distance from the lens to the subject, is essential for focusing on the subject, and if a fiducial mark (M) is formed on the head, it may become difficult to determine the exact position of the head (100) because the working distance from the first and second camera units (11, 21) may not be satisfied.

[0050] Accordingly, according to this embodiment, the mounting position of the head (100) can be accurately confirmed using the first and second camera units (11, 21) through an optical box (200) that includes a separate optical system from the head (100) and has a fiducial mark (M) formed inside.

[0051] Specifically, an optical box (200) is arranged between the first camera unit (11) and the pick unit (10), or the second camera unit (21) and the place unit (20), and the optical box (200) can be arranged so that the fiducial mark (M) is positioned at a position that satisfies the working distance (WD) of the first and second camera units (11, 21) through the light path distance inside the optical box (200). That is, the optical box (200) can have a distance in which the light path distance from the first camera unit (11) or the second camera unit (21) to the fiducial mark (M) inside the optical box (200) corresponds to the working distance (WD) distance from the pick unit (10) or the place unit (20) of the first camera unit (11) or the second camera unit (21).

[0052] After the optical box (200) is placed, the head (100) can be placed so as to have a preset distance (D) from the optical box (200) based on the placement position of the optical box (200). Through this, the head (100) can be placed so that the position of the center point (C) of the head (100) is aligned with the imaging positions of the first and second camera units (11, 21).

[0053] The control unit (300) may be a component for controlling components of the pick-and-place device (100), generating and transmitting control commands, and receiving and storing data generated by the components. For example, the control unit (300) may be a user terminal, a computing device, a server, etc. For example, the control unit (300) may obtain information on the center point (C) of the head (100) and information on the center point of the target (TG) based on image data generated by the first and second camera units (11, 21).

[0054] The control unit (300) may include a memory, a processor, and a communication module. Hereinafter, operations, commands, controls, etc. performed by the control unit in this specification are performed by a processor that executes commands stored in a memory, which will be described later, and data or information generated by the processor may be understood to be transmitted to an external device by a communication module.

[0055] The memory stores data that supports various functions of the control unit (300). The memory can store a number of application programs (or applications) run by the control unit, data for the operation of the control unit (300), and commands. The application programs are stored in the memory, installed in the control unit (300), and can be driven by the processor to perform the operation (or function) of the control unit (300).

[0056] A processor can control other components by executing instructions stored in memory. A processor can execute instructions stored in memory. A processor is a component that performs calculations and controls other devices. It can primarily refer to a central processing unit (CPU), an application processor (AP), or a graphics processing unit (GPU).

[0057] The communication module can perform wired communication functions with other components, or wireless communication via an antenna. Wireless communication can refer to communication using existing communication facilities installed by telecommunications companies and wireless communication networks that utilize the frequencies of those facilities. Alternatively, wireless communication can refer to short-range communication such as Bluetooth, Bluetooth Low Energy (BLE), beacons, Radio Frequency Identification (RFID), Near Field Communication (NFC), Infrared Data Association (IrDA), Ultra Wideband (UWB), and ZigBee.

[0058] The control unit (300) can transport and position the optical box (200) and the head (100). The control unit (300) can include an optical box transport unit (310) that transports the optical box (200), a head transport unit (320) that transports the head (100) to have a preset distance (D) from the optical box (200), and a distance setting unit (330) that sets the distance (D) between the heads transported through the optical box transport unit (310).

[0059] The optical box transport unit (310) can place the optical box (200) at a position having the same optical path distance as the working distance (WD) of the first camera unit (11) or the second camera unit (21). The first camera unit (11) or the second camera unit (21) can precisely check, through the position of the fiducial mark (M) inside the optical box (200), not only the position of the optical box (200), but also the position of the head (100) placed at a preset distance (D) from the fiducial mark (M) and the position of the center point (C) of the head (100).

[0060] That is, the optical box transport unit (310) can be positioned with reference to the preset distance (D) between the optical box (200) and the head (100) so that the optical box (200) is positioned so that the head center point (C) is aligned with the first camera unit (11) or the second camera unit (21).

[0061] The head transfer unit (320) can transfer and position the head (100) so that the vertical line crossing the center point (C) of the head (100) and the optical box (200) have a preset distance (D). At this time, the head (100) can be attached to one side of the optical box (200). That is, the location where the head (100) is mounted on the optical box (200) is preset, and when the head (100) is attached to the corresponding location on one side of the optical box (200), the attachment location of the head (100) to the optical box (200) can be preset so that the distance between the vertical line of the center point (C) of the head (100) and the fiducial mark (M) of the optical box (200) maintains the preset distance (D).

[0062] The preset distance (D) may mean a distance in a direction perpendicular to the shooting direction (PD) of the first camera unit (11) or the second camera unit (21).

[0063] Referring primarily to FIG. 4 as an example, at least one reflector (m1, m2, m3, m4, m5) is arranged inside the optical box (200), and at least one reflector can change the path of light incident through the first camera unit (11) or the second camera unit (21) and create a plurality of optical paths (a, b, c, d, e, f).

[0064] At this time, the sum of multiple optical paths (a+b+c+d+e+f) can be the optical path distance. This optical path distance can have the same length as the working distance (WD). By creating an optical path that circulates inside the optical box in this way and extending the optical path, the fiducial mark (M) is arranged at a distance that matches the working distance of the first and second camera units (11, 21), so that when the first and second camera units (11, 21) capture the fiducial mark (M), the subject of capture can satisfy the range of the working distance (WD).

[0065] Through this, the position of the optical box (200), the position of the head (100) positioned at a preset distance from the optical box (200), and the position of the head center point (C) can be more precisely confirmed using the optical box (200).

[0066] The number of reflectors, the reflection angle, the number of multiple optical paths, the optical path distance, and the sum of the optical path distances shown in FIG. 4 are exemplary, and in the case where the optical path distance corresponds to the working distance from the first and second camera units (11, 21) to the pick unit and place unit (10, 20), the number of reflectors, the reflection angle, the number of multiple optical paths, the optical path distance, etc. can be implemented in various structures inside the optical box.

[0067] An optical box (200) according to the present embodiment may include a fiducial mark (M) positioned at a position where an optical path progresses, a diffuser (DIF) formed in a portion adjacent to the fiducial mark (M), and a lighting unit (LED) that emits light toward the fiducial mark (M) in a direction opposite to the direction in which the optical path progresses based on the fiducial mark (M).

[0068] The phenomenon of light source loss of the first and second camera units (11, 21) due to reflectors can be addressed through the lighting unit (LED). That is, the light source loss of the first and second camera units (11, 21) that is lost while passing through multiple reflectors can be compensated for by using the bill of the lighting unit (LED), and the recognition of the fiducial mark (M) can be enabled. In particular, the lighting unit (LED) is arranged in the opposite direction to the portion of the light source that advances from the first and second camera units (11, 21) to the fiducial mark (M) based on the fiducial mark (M), so that the light source that has advanced from the first and second camera units (11, 21) can help capture the fiducial mark (M) more clearly.

[0069] The lighting unit (LED) is designed to pass through the diffuser (DIF) to reach the fiducial mark (M). That is, the diffuser (DIF) is placed between the lighting unit (LED) and the fiducial mark (M), and the light from the lighting unit (LED) is designed to pass through the diffuser (DIF). As a result, the light from the lighting unit (LED) that passes through the diffuser (DIF) is scattered as it reaches the fiducial mark (M).

[0070] The light source proceeding from the first and second camera units (11, 21) can make the fiducial mark (M) more clearly recognizable by contrasting the diffuser (DIF) portion where the light of the lighting unit (LED) is scattered and visible with the mark portion of the fiducial mark (M).

[0071] FIG. 5 is a drawing showing the main structure inside an optical box according to another embodiment.

[0072] Referring to FIG. 5, the first camera unit (11') or the second camera unit (21') according to another embodiment of the present invention may be placed on the lower side of the head (100) and the optical box (200). That is, the first camera unit (11') or the second camera unit (21') may be placed on the pick unit (10) or the place unit (20) and may emit a light source upward.

[0073] In this case, in order to provide an optical path distance for light coming from the bottom to the top, the first reflector (m1') of the optical box (200') can be arranged so that the direction of light coming from the bottom to the top is directed toward the inside of the optical box (200').

[0074] At this time, the sum of the optical path distances of the optical box (200') can be a'+b+c+d+e+f.

[0075] In another embodiment, the camera unit may be located on the upper side of the head (100), or on the pick unit (10) or place unit (20), i.e., on the lower side of the head (100). In this case, a reflector structure of an optical box capable of responding to both the optical paths of light emitted from the lower and upper sides may be formed.

[0076] Hereinafter, a method for confirming the head position of a pick-and-place device according to one embodiment of the present invention will be described with reference to FIG. 6. For details not shown in FIG. 6, reference may be made to FIGS. 1 to 5.

[0077] Figure 6 is a flowchart illustrating a method for confirming the head position of a pick-and-place device according to one embodiment of the present invention.

[0078] Referring to FIG. 6, a method for confirming a head position of a pick-and-place device according to an embodiment of the present invention comprises the steps of: a first camera unit (11) being positioned at an upper portion of the pick unit (10) while maintaining a working distance (WD) with the pick unit (10), a second camera unit (21) being positioned at an upper portion of the place unit (20) while maintaining a working distance (WD) with the place unit (20), a step (S100) in which an optical box transport device places an optical box (200) between the first camera unit (11) and the pick unit (10), or between the second camera unit (21) and the place unit (20), and a step (S300) in which a head transport device (110) places the head (100) at a position having a preset distance (D) in a direction perpendicular to the imaging direction (PD) of the previously placed optical box (200) and the first and second camera units (11, 21). Includes.

[0079] At this time, the optical box transport device (210) can be positioned with reference to the preset distance (D) between the optical box (200) and the head (100) so that the optical box (200) is positioned so that the head center point (C) is aligned with the first camera unit (11) or the second camera unit (21).

[0080] In addition, the optical box transport device (210) can be arranged so that the optical box (200) has an optical path distance equal to the working distance of the first camera unit (11) or the second camera unit (21).

[0081] In this way, by using the optical box (200) combined with the head (100), the first and second camera units (11, 21) can more precisely check the position of the head (100) and the position of the head center point (C).

[0082] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely examples. Those skilled in the art will readily appreciate that various modifications and equivalent alternative embodiments are possible based on the embodiments described herein. Therefore, the true scope of technical protection of the present invention should be determined based on the appended claims.

[0083] Specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. In order to describe the invention concisely and clearly, descriptions of conventional general techniques and configurations may be omitted. In addition, the connection or absence of connection between the lines of components illustrated in the drawings are merely examples of functional connections and / or physical or circuit connections, and in an actual device, they may be expressed as various functional connections, physical connections, or circuit connections that are replaceable or additional. In addition, if there is no specific mention such as "essential" or "important," it may not be a component absolutely necessary for the application of the present invention.

[0084] The terms "above" and "above" or similar designators used in the description and claims of the invention can refer to both singular and plural numbers, unless specifically limited. In addition, when a range is described in an embodiment, it is intended that the invention includes the application of individual values ​​falling within the range (unless otherwise stated), and it is equivalent to describing each individual value constituting the range in the description of the invention. In addition, unless the order of steps constituting a method according to an embodiment is explicitly stated or stated to the contrary, the steps can be performed in any appropriate order. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., "for example," etc.) in the embodiments is merely for the purpose of describing the embodiments in more detail, and the scope of the embodiments is not limited by the examples or exemplary terms, unless otherwise limited by the claims. In addition, those skilled in the art will recognize that various modifications, combinations, and variations can be configured according to design conditions and factors within the scope of the appended claims or their equivalents.

Claims

1. A head that picks up targets placed in the pick section and puts down targets picked up in the place section; First and second camera units, which are respectively positioned in the pick section and the place section, and capture images of the targets of the pick section and the place section at a working distance; and An optical box is provided with a fiducial mark arranged inside and arranged to have a light path distance from the first camera unit or the second camera unit to the fiducial mark. A pick-and-place device in which the head is positioned to have a preset distance (D) in a direction perpendicular to the imaging direction (PD) of the optical box and the first and second camera units.

2. In paragraph 1, A pick-and-place device wherein the above-mentioned working distance and the above-mentioned optical path distance correspond.

3. In paragraph 1, Further comprising a control unit for transporting and positioning the optical box and the head; The above control unit, An optical box transport unit for transporting the above optical box; A head transfer unit for transferring the head to have a preset distance from the optical box; and A pick-and-place device including a distance setting unit that sets the distance (D) between an optical box transported through the optical box transport unit and a head transported through the head transport unit.

4. In paragraph 3, A pick-and-place device in which the optical box transport unit places the optical box at a position having an optical path distance equal to the working distance of the first camera unit or the second camera unit.

5. In paragraph 3, A pick-and-place device in which the optical box transport unit places the optical box with reference to a preset distance (D) between the optical box and the head so that the optical box is aligned with the head center point (C) and the first camera unit or the head center point (C) and the second camera unit.

6. In paragraph 1, At least one reflector is placed inside the optical box, The at least one reflector changes the path of light incident through the first camera unit or the second camera unit and creates a plurality of light paths, A pick-and-place device, wherein the sum of the plurality of optical paths is an optical path distance.

7. In paragraph 6, The above optical box, A fiducial mark placed at a location where the above optical path proceeds; A diffuser formed in a portion adjacent to the above fiducial mark; and A pick-and-place device including a lighting unit that emits light toward the fiducial mark in a direction opposite to the direction of travel of the light path based on the fiducial mark.

8. In paragraph 6, A pick-and-place device, wherein the first camera unit or the second camera unit is positioned on the lower side of the head and the optical box.

9. A step in which the first camera unit is positioned above the pick unit while maintaining a walking distance from the pick unit, and the second camera unit is positioned above the place unit while maintaining a walking distance from the place unit; A step of the optical box transport device placing the optical box between the first camera part and the pick part, or between the second camera part and the place part; and A method for confirming the head position of a pick-and-place device, comprising a step of positioning a head at a position having a preset distance (D) in a direction perpendicular to the imaging direction (PD) of the optical box and the first and second camera sections, by a head transfer device.

10. In paragraph 9, A method for confirming the head position of a pick-and-place device, wherein the optical box transport device places the optical box with reference to a preset distance (D) between the optical box and the head so that the head center point (C) is aligned with the first camera unit or the head center point (C) is aligned with the second camera unit.

11. In paragraph 9, A method for confirming the head position of a pick-and-place device, wherein the optical box transport device positions the optical box so that it has an optical path distance that is the same as the working distance of the first camera unit or the second camera unit.

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