A new type of portable passive cooler driven by thermal energy

Abstract

The subject matter of the invention is a new type of portable passive cooler driven by thermal energy, that provides temperature control and thus safety of the relevant systems in built-in or portable electro-mechanical or electronic systems that have volume restrictions and require quiet operation, has a main flow part comprising of main vapor channels with an expanding cross-section and mini / micro channels with a capillary effect; the vapor bubbles formed by the boiling of the refrigerant inside the cooler or the vapor formed as a result of evaporation remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section; the vapor bubbles or vapor formed are accelerated away from the lower region due to the upward expanding cross-section of the main vapor channels, and the thermal energy taken from the part to be cooled is rapidly removed and the cooling process is improved; the upper zone volume is less than the lower zone, which triggering pressure imbalances within the system due to the smaller volume of the upper zone compared to the lower zone; and the fluid that condenses into liquid phase due to the thermal energy discharged to the external environment is allowed to return to the lower zone due to the effect of pressure imbalances created in addition to the force of gravity and capillarity, thereby improving the flow circulation and thus the cooling performance; Unlike conventional wick structures, it is a new type of thermal energy-driven portable passive cooler that allows the liquid working fluid to return to the lower zone by capillarity effect through multiple capillary channels in the main flow part and to continue the cooling process without any interaction with the vapor flow and without being subjected to drag limit and friction losses.

Description

[0001] A NEW TYPE OF PORTABLE PASSIVE COOLER DRIVEN BY THERMAL ENERGY

[0002] The technical field to which the invention relates:

[0003] The invention relates to a new type of portable passive thermal energy-driven cooler for temperature control in built-in or portable electro-mechanical systems which are volume-constrained and require quiet operation.

[0004] In particular, the invention relates to a new type of portable passive cooler, which has a main flow part including main vapor channels with expanding cross-section and mini / micro channels with capillary effect, which is activated only by placing it on the surface to be cooled, which does not require any electrical drive system, in which the vapor bubbles formed by boiling the refrigerant inside remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section, and the refrigerant returning to the liquid phase by condensing moves in the opposite direction in the mini / micro-sized capillary channels with the capillary effect and comes back to the lower region, It is about a new type of portable passive cooler driven by thermal energy that can be used for temperature control of all portable or stable electromechanical systems, where the pressure manipulated by the volumetric difference of the upper and lower zones plays a role in the flow cycle, where the counter-directional vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0005] The known state of the technic:

[0006] In medical devices, military equipment, transportation vehicles and technological machines developed for daily life, thermal energy released due to operation is an important source of problems. If the thermal density generated in any device is not dissipated or, in other words, removed from the device, it leads to temperature increase and deformation. As a result, permanent problems can occur that can render the device unusable. Therefore, cooling of electro-mechanical systems is an important area of research.

[0007] In existing systems or in current systems produced with developing technology, different cooling techniques based on natural convection or forced convection are generally used for cooling. Natural convection cooling using finned heat sinks or forced airflow cooling using fans are widely used in electronic systems with limited volume, such as televisions, computers and medical measuring devices. In structures with larger volumes and high thermal energy density, such as automotive engine blocks, forced liquid flow cooling is preferred. Air cooling, whether natural or forced convection, results in lower heat transfer performances compared to liquid cooling systems. In addition, fans used to improve heat transfer cause noise problems and sometimes cause air currents that disturb the user. Liquid cooling systems, on the other hand, require additional equipment such as pumps and connecting pipes in the system and therefore large volumes. These disadvantages and the increase in cooling load due to technological development necessitate the development and use of cooling systems that operate quietly, utilize phase change, do not take up much space, and do not contain additional equipment such as pumps, compressors and pipe-fittings. One of the devices that can be evaluated in this context is a cooler called a vapor chamber. The vapor chambers used in the known state of the art are a closed box in the shape of a rectangular prism with some refrigerant inside, and a thin wick is placed inside the box so that it touches the side wall surfaces and the ceiling surface. The bottom surface of the cooler is positioned over the component to be cooled. Due to the heat passing through the bottom surface, the fluid in the box vaporizes and rises and returns to the bottom of the box along the side walls in liquid form through the wick. In the vapor chambers of the state of the art, evaporation takes place in a large and uniform region, which reduces the rate at which the vapor moves away from the bottom surface and reduces the heat transfer performance. In addition, in the vapor chambers in the known of the state of the art, a thin material called a wick is used to allow the liquid phase fluid to return to the floor area. This material is placed adjacent to the ceiling and side wall. It is very difficult to place the wick uniformly. Also, the area covered by the wick is quite small compared to the vapor zone. Therefore, the amount of liquid entering the evaporator zone (bottom section) is limited, the capillarity force provided is weak (capillarity limit dominates), and the problem of entrainment limit occurs as liquid and vapor contact on the wick surface and move in opposite directions. These limits and problems significantly limit the performance of vapor chambers.

[0008] In this context, there is a need for innovative cooling techniques or devices with a unique geometry and operating mechanism where reverse vapor and liquid flows do not come into contact with each other, not only the conventional evaporation mechanism, but also the boiling mechanism that provides bubble formation and more violent phase change is used as a heat transfer mechanism, and the vapor bubbles accelerate with the expansion effect and remove the heat from the surface, the effectiveness of the capillarity effect is increased by using a large number of capillary tubes, where the pressure manipulated as a result of the volumetric difference of the upper and lower zones plays a role in the flow cycle, and where the liquid can return to the evaporator zone without encountering any limiting factors.

[0009] In the known state of the art, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, being activated only by placing it on the surface to be cooled, not requiring any electrical drive system, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0010] The patent document numbered "DE202013001316U1" in the known state of the art was examined. The subject invention relates to a vapor chamber cooler having a plurality of cooling fins, a cavity formed in one part and two plates connected to each other to form a closed cavity. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0011] The patent document numbered "US11421942B2" in the known state of the art was examined. The invention relates to a vapor chamber in the inner cavity of a body having a working fluid, a wick and an internal space. In particular, the invention discloses a vapor chamber having a body formed with a first and second plate, wherein the working zone is formed in the inner volume, wherein the working zone functions as a vapor chamber and is preferably formed as wide as possible, having first and second working zones. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding crosssection and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0012] The patent document numbered "US10973151 B2" in the known state of the art was examined. The invention relates to a vapor chamber having an improved thermal coupling between a heating element and a vapor chamber. In particular, the invention discloses a vapor chamber comprising a casing, a column located in the inner cavity of the casing and supporting the casing from the inside, a working fluid located in the inner cavity of the casing, and recessed portions located on at least a portion of the main outer surface of the casing. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0013] The patent document numbered "US11585606B2" in the known state of the art was examined. The invention relates to a vapor chamber comprising a housing, a working fluid, a microchannel and a wick. In particular, the invention relates to a vapor chamber comprising a casing comprising an upper casing sheet and a lower casing sheet facing each other and joined at an outer edge so as to define an inner cavity therebetween, a working fluid located in the sealed inner cavity, a microchannel located in the lower casing sheet and forming a flow path for the working fluid, and a wick located in the inner cavity and in contact with the microchannel. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs. The patent document numbered "US11277940B2" in the known state of the art was examined. The invention relates to a vapor chamber comprising a casing, a wick structure joined to the main inner surface of the casing and a working fluid disposed inside the casing. In particular, the invention discloses a vapor chamber in which the wick structure is joined to the casing at a joint portion within the joint region and where the ratio of the total area of the joint portion within the joint region to the area of the joint region is 50% or less. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs. The patent document numbered "US11359869B2" in the known state of the art was examined. The invention relates to a vapor chamber comprising a casing having a first layer and a second layer opposed to each other and joined to each other in the peripheral region of the casing, a working fluid in the inner cavity of the casing, a wick structure on the main surface of the first layer opposed to the second layer, and multiple columns on the main surface of the second layer opposed to the first layer. In particular, the invention relates to a vapor chamber comprising, in the vapor chamber, a portion disposed along at least a part of the circumferential region of the first layer casing and inclined in a height direction towards the connection portion with the second layer, wherein the first portion at the junction of the second layer overlaps in a height direction with the second portion of the second layer in a second region in contact with the pillars. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0014] The patent document numbered "US2009294104A1" in the known state of the art was examined. The invention relates to a vapor chamber comprising a plate and a wick structure, and in particular discloses a plate having a heated and condensed end and containing a working fluid, a wick structure comprising three parts, and a vapor chamber in which the amount of working fluid associated with the second wick part is less than that in the first wick part. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0015] The patent document numbered "US10514211 B2" in the known state of the art was examined. The invention relates to a vapor chamber with a high heat transfer capacity capable of efficiently returning the working fluid to the vaporization section. In particular, the invention discloses a vapor chamber formed by a hollow flat vessel, a base member and a lid covering the opening of the base member, wherein a phase changeable working fluid is retained in the vessel, and fins are arranged in the vessel to conduct the heat of a heat generating object between the bottom plate of the base member and the lid. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0016] The patent document numbered "US11555656B2" in the known state of the art was examined. The invention relates to a vapor chamber comprising a body having a first layer and a second layer facing each other. In particular, the invention discloses a vapor chamber in which at least a portion of the outer edge of the body has a step shape, a protective film covers the boundary between the end portion of the stepshaped second layer and the first layer, the working fluid is enclosed in the body, and a wick is provided on the inner wall of the first or second layer. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs. The patent document numbered "US2010065255A1" in the known state of the art was examined. The subject invention relates to a vapor chamber comprising a chamber, a working fluid, a lower wick structure and a plurality of supporting members. The invention discloses a vapor chamber having a top cover, a bottom plate and a chamber containing a working fluid, wherein the lower wick structure is located in the bottom plate, the supporting elements are placed in the chamber and the working fluid in the vapor phase flows back from the top cover to the bottom plate through the supporting elements. In the system in question, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs.

[0017] As a result, in the known state of the technic, there is no type of cooler or vapor chamber type heat pipe having a main flow part with a combination of main vapor channels with an expanding cross-section and mini / micro channels creating a capillary effect, the vapor bubbles formed by the boiling of the refrigerant in it remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro sized capillary channels with the effect of capillarity and comes back to the lower region, pressure manipulated as a result of the volumetric difference between the upper and lower zones plays a role in the flow cycle, reverse vapor and liquid flows do not come into contact with each other and no entrainment limit occurs. Due to the shortcomings of the known state of the art and the inadequacy of the existing solutions, an innovation in the relevant technical field was deemed necessary.

[0018] Purpose of the invention:

[0019] The most important objective of the invention is to ensure temperature control and prevent any possible thermal-based problems regarding in built-in or in portable electro-mechanical systems by a novel technique; a technique in which having a main flow part consisting of main vapor channels with expanding cross-section and mini / micro channels with capillary effect; a novel technique in which the vapor bubbles formed by the boiling of the refrigerant remove the heat it receives from the surface to be cooled by rising in the main vapor channels with expanding cross-section, and the refrigerant, which condenses and returns to the liquid phase, moves in the opposite direction in the mini / micro-sized capillary channels with the effect of capillarity and comes back to the lower region; a novel technique in which the pressure manipulated as a result of the volumetric difference of the upper and lower regions plays a role in the flow cycle, the reverse steam and liquid flows do not come into contact with each other and the drift limit does not occur.

[0020] Another important aim of the invention is to improve the cooling process by accelerating the vapor bubbles or vapor away from the bottom surface and thus from the evaporator area due to the upwardly expanding cross-section of the main vapor channels, and to improve the cooling process by rapidly removing the thermal energy from the part to be cooled.

[0021] Another aim of the invention is to improve the flow circulation and therefore the cooling performance by ensuring that the vapor accelerating upwards from the main vapor ducts with expanding cross-section triggers a pressure imbalance in the system due to the lower volume in the upper region compared to the lower region, and that the fluid, which condenses into liquid phase due to the thermal energy discharged to the external environment, returns to the lower region (evaporator region) due to the effect of increased pressure imbalance in addition to the force of gravity and capillarity.

[0022] Another aim of the invention, unlike conventional wick structures, is to ensure that the liquid work fluid returns to the lower zone with the capillarity effect along the many capillary channels in the main flow part and that the cooling process can be maintained without any interaction with the vapor flow and without being subjected to drag limit and friction losses. Natural convection or forced convection-based cooling techniques are generally used in current electronic or electro-mechanical systems and in current systems produced in parallel with the developing technology, in order to maintain device safety by providing temperature control. In particular, systems such as televisions, laptops, measurement and control devices, which have volume constraints and are expected to be lighter but more functional and quieter in future designs, are generally cooled by natural (no fan) or forced (fan) convection mechanisms using air as the fluid through heat emitters and heat sinks. The natural convection mechanism is the weakest heat transfer technique when air is used as the fluid, or more precisely, in gas flows. Although heat transfer can be slightly improved with forced convection created by adding a fan to the gas flows, the heat transfer coefficient values obtained are not at a level that can meet the cooling loads emerging due to the developing technology. In addition, in such cooling systems, in order to increase the heat transfer coefficient as much as possible, the fan speed and / or dimensions are increased and as a result, the volume of the device is increased, the amount of electrical energy consumed and the noise level increases. In conventional forced convection cooling systems where (single-phase) liquid is used as the fluid, large volumes are required, noise level increases and maintenance costs increase due to the necessity of pump and pipeline materials needed for liquid circulation. As clearly stated above, due to the disadvantages of conventional cooling systems, there is a need for alternative solutions for the cooling requirement in high performance and small size electronic or electro-mechanical devices produced due to the development in technology. One of the devices that can be evaluated in this context is the so-called vapor chamber. Such structures consist of a container, a wick and a working fluid (refrigerant). In the vapor chambers used in the known state of the art, the working fluid evaporates as a result of the thermal energy received from the bottom base and moves upwards under the influence of buoyancy forces along a large cross-section. Moving away from the region where the heat is received, the fluid transfers the heat it has received from the upper layer to the external environment and returns to the lower region in liquid phase through a porous structure such as a sieve placed along the side walls and called a wick. In the vapor chambers used in the known state of the art, the vaporization of the fluid and the upward movement of the vaporized fluid occur in mass form in a region of large and constant cross-section. Therefore, the evaporation rate or the rate of mass movement of the vapor is relatively low, which reduces the cooling capacity. Furthermore, in the vapor chambers used in the known state of the art, the wick is placed along the side walls. This not only limits the amount of fluid that must return to the lower zone in the liquid phase, but also creates a contact surface between the vapor and liquid flows in the opposite direction, leading to drag / friction losses, reduced flow rate, formation of a drag limit, re-evaporation of a portion of the liquid phase fluid or mixing of liquid droplets into the vapor flow. The above-mentioned reasons limit the cooling capacity of the vapor chambers used in the known state of the art. Therefore, there is a need for new designs, cooling systems and / or techniques that allow the vaporized fluid or vapor bubbles to accelerate and leave the surface, where the reverse vapor and liquid flows do not come into contact with each other, where the fluid that turns into liquid phase can come to the lower zone in higher amounts and easily, and where the movement of the fluid in the liquid phase is supported by the effect of pressure imbalances triggered by the volumetric difference of the upper and lower zones in addition to the capillary force. In this context, a new type of portable passive cooler driven by thermal energy; having a main flow part that includes main vapor channels with expanding cross-section and mini / micro channels that create capillarity effect together, the vapor bubbles formed by the boiling of the refrigerant inside or the vapor formed as a result of evaporation remove the heat taken from the surface to be cooled by rising in the main vapor channels with expanding cross-section, The vapor bubbles or vapors are accelerated away from the bottom surface and therefore from the evaporator area due to the upwardly expanding cross-section of the main vapor channels, and the thermal energy taken from the part to be cooled is removed quickly and the cooling process is improved, The triggering of pressure imbalances due to the lower volume of the upper zone compared to the lower zone and the return of the fluid, which condenses into liquid phase due to the thermal energy discharged to the external environment, to the lower zone due to the effect of pressure imbalances triggered within the system in addition to the force of gravity and capillarity, thereby improving the flow circulation and thus the cooling performance, Unlike conventional wick structures, it is superior to the state of the art in that it allows the liquid working fluid to return to the lower zone by capillarity effect through the numerous capillary channels in the main flow part and the cooling process can be maintained without any interaction with the vapor flow and without being subjected to drag limit and friction losses. As detailed above, a new type of thermal energy driven portable passive cooler is superior to the state of the art due to the differences in the geometrical structure of the parts, the working mechanism, the types of forces involved in the working mechanism and the flow phenomena.

[0023] Explanation of the figures:

[0024] FIGURE -1; Perspective view of a new type of portable passive cooler with thermal energy drive.

[0025] FIGURE -2; Disassembly view of a new type of portable passive cooler with thermal energy drive.

[0026] FIGURE -3; Front view of the cross section of a new type of portable passive cooler with thermal energy drive.

[0027] FIGURE -4; Perspective view of the cross-section of a new type of portable passive cooler with thermal energy drive.

[0028] §EKiL -5; Top view of the main flow part.

[0029] Reference numbers:

[0030] RF. Refrigerant

[0031] 100. A new type of portable passive cooler driven by thermal energy

[0032] 110. Housing

[0033] 120. Cover

[0034] 121. Filling / draining port

[0035] 130. Filling / draining port plug

[0036] 140. Main flow part

[0037] 150. Subzone

[0038] 160. Top zone

[0039] 170. Main vapor channels with expanding cross section

[0040] 180. Mini / micro channels

[0041] Description of the invention:

[0042] The subject matter of the invention, A new type of portable passive cooler driven by thermal energy (100) with thermal energy drive, provides temperature control and thus safety of the related systems in built-in or portable electro-mechanical systems that have volume restrictions and require quiet operation. The invention is A new type of portable passive cooler driven by thermal energy (100) with thermal energy drive, comprising, as basic components, a housing (110), a cover (120), a filling / draining port (121 ), a filling / draining port plug (130), a main flow part (140) and a refrigerant (RF). The refrigerant (RF) is filled to 20 - 30% of the internal volume after vacuumization of the internal volume of a new type of portable passive cooler driven by thermal energy (100) driven by thermal energy through the filling / draining port (121 ). The filling / emptying port (121 ) is closed with a filling / emptying port plug (130) to ensure a closed and sealed internal environment. Any refrigerant (water, ethanol, methanol, methanol, R134a, etc.) suitable for the operating temperature and the type of materials constituting the system can be used as refrigerant (RF). The bottom surface of the housing (110) is placed on the component to be cooled. It will be advantageous to prefer metals with high heat conduction coefficient such as copper, silver, aluminum, brass as the housing (110) material. The refrigerant (RF), which is initially liquid in the subzone (150), starts to evaporate and boil under the effect of the heat taken from the component to be cooled and turns into the vapor phase. As the phase change occurs, the amount of heat extracted from the component to be cooled is considerably higher compared to single phase cooling systems. The formed vapor bubbles rise rapidly in the main vapor channels with expanding cross section (170) with expanding crosssection located in the main flow part (140) and reach the upper region (160). The upwardly expanding cross-section of the main vapor channels with expanding cross section (170) allows the vapor to accelerate and move away from the lower subzone (150), thus ensuring rapid cooling. The refrigerant (RF) in the vapor phase moving upwards comes to the upper zone (160). The volume of the upper zone (160) is relatively smaller than the volume of the subzone (150). Therefore, pressure imbalances within the system are triggered. Moreover, the thermal energy from the lower zone is transferred to the external environment in the upper zone and the vapor phase refrigerant (RF) becomes liquid. The main flow part (140) contains a large number of mini / micro diameter channels (180). The liquid refrigerant (RF) moves through these channels towards the subzone (150) by capillarity. The movement is not only driven by capillarity, but also pressure imbalances triggered as a result of the unique design help the liquid to move easily and quickly from the upper zone (160) to the subzone (150). Thus, a high cooling performance is achieved by improving or accelerating fluid circulation in a new type of portable passive cooler driven by thermal energy (100). Another important point can be expressed as follows: Unlike conventional wick structures, due to the structure of the main flow part (140) used in a new type of portable passive cooler driven by thermal energy (100), the vapor phase refrigerant and the liquid phase refrigerant move in opposite directions without any contact with each other. Therefore, entrainment between the liquid and vapor flows does not occur, the amount of liquid is not reduced, or the liquid flow is not blocked due to the entrainment limit. A new type of portable passive cooler driven by thermal energy (100) is superior to the state of the art in terms of both geometrical structure and operating mechanism.

[0043] The number of mini / micro channels (180), the type of refrigerant (RF), the type of materials constituting the system, and the channel diameters in a new type of portable passive cooler driven by thermal energy (100) with thermal energy drive may have different values. The stated changes basically do not affect the working mechanism or the unique feature of a new type of portable passive cooler driven by thermal energy cooler (100) driven by thermal energy that is the subject of the invention.

Claims

CLAIMS1 . A new type of portable passive cooler driven by thermal energy cooler (100) to control temperature to provide the safety of the relevant systems in built-in or portable electro-mechanical systems that are volume-constrained and require quiet operation consisting of a housing (110), a cover (120), a filling / draining port (121 ) as basic components and a filling / draining port plug (130), a refrigerant (RF) and a main flow part (140) including main vapor channels with expanding cross section (170) with an expanding cross-section and mini / micro channels (180) forming a capillary effect, characterized in that comprising;• The main flow part (140), which includes main vapor channels with expanding cross section (170) with an expanding cross-section and mini / micro channels (180) that create a capillary effect, which allows the vapor to be rapidly removed upstream, which allows the reverse direction liquid and vapor flows to occur without interacting with each other, which allows the cooling process to be maintained without being subjected to drag limit and friction losses and improves the cooling performance,• The main vapor channels with expanding cross section (170) with an expanding cross-section that enable the vapor bubbles formed by the boiling of the refrigerant (RF) or the vapor formed as a result of evaporation to accelerate upwards from the lower surface and thus from the subzone (150) due to its expanding cross-sectional structure and improve the cooling process,• Unlike conventional wick structures, the mini / micro channels (180) that allow the liquid refrigerant (RF) to return to the subzone (150) by capillary action through a large number of capillary channels,• Due to the smaller volume of the upper zone (160) compared to the subzone (150), pressure imbalances within the system are triggered and the refrigerant (RF), which condenses into liquid phase due to the thermal energy discharged to the external environment, returns to the lower zone due to the effect of pressure imbalances triggered within the system in addition to the force of gravity and capillarity, thus improving the flow circulation and thus the cooling performance,• Due to the smaller volume of the upper zone (160) compared to the subzone (150), pressure imbalances within the system are triggered and the refrigerant (RF), which condenses into liquid phase due to the thermal energy discharged to the external environment, returns to the lower zone due to the effect of pressure imbalances triggered within the system in addition to the force of gravity and capillarity, thus improving the flow circulation and thus the cooling performance.

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