Transparent display screen

Abstract

A transparent display screen (1000), comprising a transparent motherboard (3) and one or more transparent light-emitting modules (100) installed on the transparent motherboard (3), wherein the transparent motherboard (3) is provided with a transmission circuit for providing a power supply and a signal for the transparent light-emitting modules (100); the transparent light-emitting modules (100) are provided with a driving circuit and several light-emitting pixels (2) which are arranged in an array; the light-emitting pixels (2) are connected to the driving circuit, and the driving circuit is connected to the transmission circuit of the transparent motherboard (3); and the transparent light-emitting modules (100) are separated from the transparent motherboard (3), and the sizes of the transparent light-emitting modules (100) are generally small, such that within the machining stroke range of a precision machining device, it can be ensured that the transparent light-emitting modules (100) are manufactured more conveniently, the efficiency is higher, and the quality is more stable. Moreover, the transparent motherboard (3) can be manufactured in a great size, but an internal circuit thereof is of a relatively simple structure and achieves a higher level of integration, such that the quality can be easily ensured.

Description

A transparent display screen

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 1, 2023, with application number 202323308161.0 and invention name “A Transparent Display Screen”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of LED transparent display screens. Background Art

[0003] Transparent LED displays are gaining widespread market adoption and are now available in a variety of product forms. These displays typically consist of a transparent substrate and a number of LEDs arrayed on it. The transparent substrate typically consists of a transparent glass substrate or a non-transparent substrate with light-transmitting holes or slots, which create a transparent effect.

[0004] Currently, transparent substrates with light-transmitting holes on the market are generally based on printed circuit boards (PCBs). LED lamp beads with built-in driver chips are mounted in the opaque area outside the light-transmitting holes. In actual applications, the length of such PCB substrates is generally 1m-1.5m. This length is quite fragile for PCBs with array light-transmitting holes. In addition, the non-light-transmitting area is very narrow and thin. Once a break occurs, the entire circuit board is easily scrapped, which is not conducive to production quality management and actual installation application.

[0005] The inventors of the above-mentioned LED lamp beads with built-in driver chips realized that their chips often use addressing to confirm the position of the LED lamp beads on the display screen. The lamp beads at each position have different addresses. Therefore, in actual production, it is necessary to manage a large number of materials, which also brings troubles to after-sales service.

[0006] Application Contents

[0007] To solve the above problems, the present application provides a transparent display screen, comprising a transparent motherboard and one or more transparent light-emitting modules mounted on the transparent motherboard; the transparent motherboard is provided with a transmission circuit for providing power and signals to the transparent light-emitting modules; the transparent motherboard and the transparent light-emitting modules as a whole present a transparent display effect;

[0008] The transparent light-emitting module is provided with a driving circuit and a plurality of light-emitting pixels arranged in an array. The light-emitting pixels include a driving chip and a light-emitting chip. Each light-emitting pixel is connected to the driving circuit, and the driving circuit is connected to the transmission circuit of the transparent motherboard. In this way, each transparent light-emitting module is electrically connected to the transparent motherboard to provide power and signals for the light-emitting pixels on the transparent light-emitting module.

[0009] This application separates the transparent light-emitting module from the transparent motherboard. The transparent light-emitting module is generally smaller, within the machining range of precision machining equipment. This ensures easier, more efficient, and more stable manufacturing of the transparent light-emitting module. While the transparent motherboard can be manufactured in larger sizes, its relatively simple internal circuit structure and higher integration make it easier to maintain stable quality and provide easier after-sales service.

[0010] Furthermore, the transparent light-emitting module is provided with an electrical connection portion; the transparent motherboard is provided with a module connection portion, and the module connection portion on the transparent motherboard is electrically connected to the electrical connection portion on the module substrate to electrically connect the driving circuit on the transparent light-emitting module and the transmission circuit on the transparent motherboard, so as to input power and signals from the transparent motherboard to the transparent light-emitting module.

[0011] Furthermore, the electrical connection portion on the transparent light-emitting module and the module connection portion on the transparent motherboard are both correspondingly provided with a plurality of power connection structures and signal connection structures.

[0012] Furthermore, the power connection structure on the transparent light-emitting module is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard is a second power connection hole, and the signal connection structure is a second signal connection hole; the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole are connected by electrical connectors.

[0013] Furthermore, the power connection structure and the signal connection structure on the transparent light-emitting module are centrally or dispersedly arranged at the corners or edges of the transparent light-emitting module.

[0014] Furthermore, the transparent light-emitting module and the transparent motherboard are both printed circuit boards, consisting of at least two circuit layers; the transparent motherboard is provided with a light-transmitting area, and the transparent light-emitting module is provided with light-transmitting holes arranged in an array;

[0015] The circuit layer on the transparent motherboard forms the transmission circuit for providing power and signals to the module substrate; the circuit layer on the transparent light-emitting module forms a driving circuit for providing power and signals to each of the light-emitting pixels.

[0016] Furthermore, the light-transmitting holes on the transparent light-emitting module and the transparent motherboard include a central light-transmitting hole in the shape of a full hole in the central area, adjacent light-transmitting holes in the shape of half holes at the four sides, and adjacent corner light-transmitting holes in the shape of a quarter hole at the corners; the adjacent light-transmitting holes of two adjacent light-emitting modules can be combined to form a full hole, and the adjacent corner light-transmitting holes of four light-emitting modules can be combined to form a full hole.

[0017] Furthermore, the number of the transparent light-emitting modules is N, wherein the transparent motherboard includes a non-transparent frame and N hollow light-transmitting areas formed in the non-transparent frame, and each hollow light-transmitting area is correspondingly provided with one of the transparent light-emitting modules.

[0018] Furthermore, the transparent motherboard is further provided with an external connection interface area connected to the power module and the signal module; the external connection interface area is provided with connection PIN pins connected to the power module and the signal module.

[0019] Furthermore, the transparent light-emitting module is bonded to the transparent motherboard.

[0020] Furthermore, the transparent motherboard is a transparent glass board, and the transmission circuit is provided on the transparent glass board.

[0021] Furthermore, the transparent light-emitting module includes a transparent substrate, on which the driving circuit is provided; and the light-emitting pixel array is arranged on the driving circuit of the transparent substrate.

[0022] The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below, and other features and advantages of the disclosure will be apparent from the description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a perspective exploded schematic diagram of a first transparent display screen provided in a specific embodiment of the present invention;

[0024] FIG2 is a schematic top view of a transparent light-emitting module in a first transparent display screen provided in a specific embodiment of the present invention;

[0025] FIG3 is a perspective schematic diagram of a transparent light-emitting module in a first transparent display screen provided in a specific embodiment of the present invention;

[0026] FIG4 is a schematic top view of a transparent motherboard in a first transparent display screen provided in a specific embodiment of the present invention;

[0027] Figure 5 is an enlarged schematic diagram of point A in Figure 4;

[0028] FIG6 is a schematic top view of a first transparent display screen provided in a specific embodiment of the present invention;

[0029] FIG7 is an enlarged schematic diagram of point B in FIG6;

[0030] FIG8 is a perspective exploded schematic diagram of a second transparent display screen provided in a specific embodiment of the present invention;

[0031] FIG9 is an enlarged schematic diagram of point C in FIG8 ;

[0032] FIG10 is a perspective exploded schematic diagram of a third transparent display screen provided in a specific embodiment of the present invention;

[0033] FIG11 is an enlarged schematic diagram of point D in FIG10;

[0034] FIG12 is a perspective exploded schematic diagram of a fourth transparent display screen provided in a specific embodiment of the present invention;

[0035] FIG13 is an enlarged schematic diagram of point E in FIG12;

[0036] FIG14 is a perspective exploded schematic diagram of a fifth transparent display screen provided in a specific embodiment of the present invention;

[0037] FIG15 is a perspective schematic diagram of a transparent light-emitting module in a fifth transparent display screen provided in a specific embodiment of the present invention;

[0038] FIG16 is a perspective exploded schematic diagram of a sixth transparent display screen provided in a specific embodiment of the present invention;

[0039] FIG17 is an enlarged schematic diagram of point F in FIG16;

[0040] FIG18 is a schematic diagram of power supply and signal control for a transparent display screen provided in a specific embodiment of the present application.

[0041] The reference numerals in the specific embodiment are as follows: 100, transparent light-emitting module; 1000, transparent display screen; 101, peripheral non-transparent area; 102, peripheral connection area;

[0042] 1. Module substrate; 2. Luminous pixels; 3. Transparent motherboard; 4. Signal module; 5. Power module;

[0043] 11. First light-transmitting hole; 12. Pixel recessed hole; 13. Electrical connection portion; 11a. Center light-transmitting hole; 11b. Side light-transmitting hole; 11c. Corner light-transmitting hole; 31. Second light-transmitting hole; 32. External connection area; 32v. Positive power supply line; 32g. Negative power supply line; 32d. Signal line; 321. Connection PIN pin; 33. Module connection portion; 331. Electrical connection piece; 34. Non-transparent frame; 31A. Hollow light-transmitting area. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0045] In the description of this application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting this application. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0047] Example 1

[0048] As shown in Figures 1 to 7, this embodiment provides a transparent display screen 1000, comprising a transparent motherboard 3 and one or more transparent light-emitting modules 100 mounted on the transparent motherboard 3. The transparent motherboard 3 is provided with a transmission circuit (not shown) for providing power and signals to the transparent light-emitting modules 100. The transparent motherboard 3 and the transparent light-emitting modules 100 as a whole present a transparent display effect.

[0049] The transparent light-emitting module 100 is provided with a driving circuit (not shown) and a plurality of light-emitting pixels 2 arranged in an array. The light-emitting pixels 2 include a driving chip and a light-emitting chip. Each light-emitting pixel 2 is connected to the driving circuit, which is connected to the transmission circuit of the transparent motherboard 3. This electrically connects each transparent light-emitting module 100 to the transparent motherboard 3, providing power and signals for the light-emitting pixels 2 on the transparent light-emitting module 100.

[0050] The specific implementation of the transparent motherboard 3 and the transparent light-emitting module 100 is not particularly limited in this application. As long as they visually appear transparent, a transmission circuit and a drive circuit are formed thereon, and the transmission circuit and the drive circuit are electrically connected so that they can provide power and signals to the light-emitting pixels 2. The transparent light-emitting module 100 generally includes a module substrate 1, on which the light-emitting pixels 2 are disposed. The module substrate 1 can be a layered structure with more than one layer. Generally speaking, the transparent display effect of the transparent motherboard 3 and the module substrate 1 can be achieved by using a transparent material as a base material or carrier. For example, the transparent motherboard 3 can be a transparent glass plate with a transmission circuit disposed thereon. The module substrate 1 included in the transparent light-emitting module 100 is a transparent substrate with a drive circuit disposed thereon. The transparent substrate can be a transparent glass plate or a transparent film, and the light-emitting pixels 2 are arrayed on the drive circuit of the transparent substrate.

[0051] The transparent motherboard 3 and the transparent light-emitting module 100 can also be realized by setting a transparent area and a non-transparent area on a non-transparent substrate or carrier. The transparent effect is achieved through the transparent area, and the driving circuit and the transmission circuit can be set on the non-transparent area.

[0052] In this example, the aforementioned non-transparent material is used as a substrate or carrier, and the projection of the light-transmitting area on the transparent light-emitting module 100 is located within the light-transmitting area on the transparent motherboard 3; this means that the light-transmitting area on the transparent light-emitting module 100 is not blocked by the non-light-transmitting area on the transparent motherboard 3. Preferably, both the transparent motherboard 3 and the transparent light-emitting module 100 are arrayed with corresponding light-transmitting holes, with the area outside the light-transmitting holes forming a non-light-transmitting area. Taking the transparent light-emitting module 100 as an example, generally, the greater the ratio of the light-transmitting area to the non-light-transmitting area, the higher the transparency and good the permeability of the transparent light-emitting module 100. For the sake of distinction, the light-transmitting holes on the transparent light-emitting module 100 are referred to as first light-transmitting holes 11, and the light-transmitting holes on the transparent motherboard 3 are referred to as second light-transmitting holes 31. In the present application, the transparent light-emitting module 100 is formed of a non-transparent material. Both the transparent light-emitting module 100 and the transparent motherboard 3 are printed circuit boards, consisting of at least two circuit layers. The circuit layers on the transparent motherboard 3 form a transmission circuit for providing power and signals to the module substrate. The circuit layers on the transparent light-emitting module 100 form a drive circuit, which provides power and signals to each light-emitting pixel 2. For example, the transparent motherboard 3 is preferably directly a printed circuit board, consisting of at least two circuit layers, and the circuit layers thereon form a drive circuit, which provides power and signals to each light-emitting pixel 2. Similarly, the transparent motherboard 3 is formed of a non-transparent material, for example, generally directly a printed circuit board, consisting of at least two circuit layers, and the circuit layers thereon form a transmission circuit, which is used to connect to the drive circuit and provide power and signals to each light-emitting pixel 2.

[0053] The size of the light-transmitting hole can be optimized according to actual needs during the production process, and a balance can be found between maintaining transparency and ensuring product display performance. For those skilled in the art, since the idea has been introduced in this example, they can obtain it without any creative work.

[0054] The areas outside the light-transmitting holes form a non-light-transmitting area. The light-transmitting and non-light-transmitting areas on the transparent motherboard 3 described in this example do not necessarily need to correspond one-to-one with the light-transmitting holes and non-light-transmitting areas on the transparent light-emitting module 100. Instead, it suffices to arrange the projections of the light-transmitting holes on the transparent light-emitting module 100 so that they lie within the light-transmitting areas on the transparent motherboard 3. Because the transparent motherboard 3 does not need to be arrayed with light-emitting pixels 2, only a relatively small non-light-transmitting area is required for arranging the transmission circuitry. Therefore, the light-transmitting area on the transparent motherboard 3 can be large or small. For example, in one embodiment, the light-transmitting area of ​​the transparent motherboard 3 includes second light-transmitting holes 31 arranged in an array thereon; the areas outside the second light-transmitting holes 31 form a non-light-transmitting area; and the second light-transmitting holes 31 are arranged in a one-to-one correspondence with the first light-transmitting holes 11 and the second light-transmitting holes 21.

[0055] In this example, as a preferred embodiment, a pixel pad (not shown in the figure) is provided on the driving circuit, and the pixel pads are arranged in an array in the non-light-transmitting area outside the first light-transmitting hole 11; wherein, a number of light-emitting pixels 2 are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light-emitting pixels 2 include a driving chip and a light-emitting chip; the light-emitting chips in this application are well known to the public, and commonly, the light-emitting chips include red light-emitting chips, green light-emitting chips and blue light-emitting chips. Each light-emitting pixel 2 in this application includes a driving chip, so its driving chip is not independently provided like a conventional LED display device, but the driving chip is integrated in each light-emitting pixel 2. As shown in the figure, the light-emitting pixel 2 in this example can be an LED lamp bead after the integrated lamp cup.

[0056] As shown in Figures 2 and 3, the transparent light-emitting module 100 is provided with an electrical connection portion 13. As shown in Figure 4, the transparent motherboard 3 is provided with a module connection portion 33. The module connection portion 33 on the transparent motherboard 3 is electrically connected to the electrical connection portion 13 on the module substrate to electrically connect the driving circuit on the transparent light-emitting module 100 and the transmission circuit on the transparent motherboard 3, thereby inputting power and signals from the transparent motherboard 3 to the transparent light-emitting module 100.

[0057] Specifically, the electrical connection portion 13 on the transparent light-emitting module 100 and the module connection portion 33 on the transparent motherboard 3 are each provided with a plurality of power connection structures and signal connection structures. The power connection structures and signal connection structures are generally present as electrical connection holes. For example, metallized holes are provided on the transparent light-emitting module 100 and the transparent motherboard 3 as the electrical connection holes, and the electrical connection holes are electrically connected via the electrical connector.

[0058] Specifically, the power connection structure on the transparent light-emitting module 100 is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard 3 is a second power connection hole, and the signal connection structure is a second signal connection hole; the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole are connected by electrical connectors.

[0059] In this example, the electrical connection part 13 includes several power connection structures and signal connection structures in the non-light-transmitting area. Among them, the power connection structure is the first power connection hole, and the signal connection structure is the first signal connection hole. The power connection structure and signal connection structure of the electrical connection part 13 are concentrated or dispersedly arranged at any position of the non-light-transmitting area on the transparent light-emitting module 100. Preferably, the power connection structure and signal connection structure of the electrical connection part 13 are concentrated or dispersedly arranged at the corner position or edge of the module substrate 1. In this example, the power connection structure and signal connection structure of the electrical connection part 13 are concentratedly arranged. In this example, as shown in Figures 2 and 3, a non-light-transmitting structure is set at one or more first light-transmitting holes 11 of the transparent light-emitting module 100 as the electrical connection part 13. Similarly, in this example, as shown in Figure 4, a non-light-transmitting structure is set in one or more second light-transmitting holes 31 in the transparent motherboard 3 as the module connection part 33. The electrical connection part 13 of the transparent substrate 1 and the module connection part 33 in the transparent motherboard 3 are correspondingly connected.

[0060] In this example, the power connection structure on the transparent light-emitting module 100 is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard 3 is a second power connection hole, and the signal connection structure is a second signal connection hole; as shown in the enlarged schematic diagrams such as Figures 5 and 7, the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole, are connected by electrical connectors 331. In this example, the electrical connector 331 is a metal needle-shaped or metal column-shaped connector. It is welded by the metal needle-shaped or metal column-shaped connector. Of course, the power connection structure and signal connection structure on the above-mentioned module substrate 1, as well as the power connection structure and signal connection structure on the transparent template 3, can also be other electrical connection methods. As long as they can ultimately achieve electrical connection between the module substrate 1 and the transparent template 3.

[0061] Among the light-transmitting holes of the transparent motherboard 3 and the transparent light-emitting module 100, taking the first light-transmitting hole 11 on the transparent light-emitting module 100 as an example, it includes a central light-transmitting hole 11a with a full hole shape set in the central area, adjacent light-transmitting holes 11b with half holes at the four sides, and adjacent corner light-transmitting holes 11c with a quarter hole shape at the corners; the adjacent side light-transmitting holes 11b of two adjacent light-emitting modules can be combined to form a full hole; the adjacent corner light-transmitting holes 11c of four light-emitting modules can be combined to form a full hole.

[0062] The transparent motherboard 3 also has an external connection area 32 connected to the power module 5 and the signal module 4. Connecting pins 321 are also provided on the external connection area 32. As shown in FIG18 , the connecting pins 321 on the external connection area 32 are internally connected to the transmission circuit on the transparent motherboard 3 and are connected to the external power module 5 and the signal module 4 via these connecting pins 321. This transmission circuit includes a power transmission circuit and a signal transmission circuit. The power transmission circuit includes a positive power line 32v and a negative power line 32g, each of which is connected to each transparent light-emitting module 100 to provide power. The signal transmission circuit includes a plurality of signal lines 32d connected to each transparent light-emitting module 100 to provide signals to each transparent light-emitting module 100.

[0063] As a further preferred embodiment, the transparent light emitting module 100 is bonded to the transparent motherboard 3. This not only realizes the electrical connection between the transparent motherboard 3 and the transparent light emitting module 100, but also enhances the mechanical strength of the transparent motherboard 3 and the transparent light emitting module 100.

[0064] Because each light-emitting pixel 2 is equipped with a driver chip that directly drives the light-emitting chip, the internal circuitry of the transparent light-emitting module 100 is very simple. Generally, in addition to the power supply line, all the light-emitting pixels 2 in the transparent light-emitting module 100 can be connected in series using one or two signal lines at most. N transparent light-emitting modules 100 are mounted on a transparent motherboard 3, and the number of signal lines required on the transparent motherboard 3 can be as few as N and as many as 2N. Therefore, neither the transparent light-emitting modules 100 nor the transparent motherboard 3 require additional electronic components, making the entire product clean and tidy.

[0065] The transparent light-emitting module 100 of this technology is small and easy to manufacture and maintain, while the transparent motherboard 3, lacking mounted components, is simple and inexpensive to manufacture. This combination reduces quality risks during production and application. In particular, for LED lamp beads using fixed-address built-in driver chips, only the addresses of the light-emitting pixels 2 mounted within the transparent light-emitting module 100 need to be managed, eliminating the need to consider the addresses of light-emitting pixels 2 located at different locations within the screen for different projects.

[0066] This application separates the transparent light-emitting module 100 from the transparent motherboard 3. The transparent light-emitting module 100 is generally small, typically ranging from 80 to 160 mm in length and width. This allows for convenient, efficient, and consistent manufacturing within the machining range of precision machining equipment. While the transparent motherboard 3 can be manufactured in larger sizes, its relatively simple internal circuit structure and higher integration make it easier to maintain consistent quality. This also simplifies after-sales service.

[0067] Example 2

[0068] As shown in FIG8 and FIG9 , this embodiment is substantially the same as the transparent display screen 1000 disclosed in the above-mentioned embodiment 1, with the only difference being the form and position of the first light-transmitting hole 11 in the transparent light-emitting module 100 and the position arrangement of the second light-transmitting hole 31 in the transparent motherboard 3.

[0069] The light-transmitting holes in the transparent light-emitting module 100 are all full-hole central light-transmitting holes 11a, with no light-transmitting holes around the edges, forming a peripheral non-transmitting area 101. Correspondingly, several areas corresponding to the transparent light-emitting modules 100 are provided on the transparent motherboard 3. The light-transmitting holes in each area are also full-hole central light-transmitting holes 11a, similar to the light-transmitting holes in the transparent light-emitting module 100. No light-transmitting holes are provided around the edges, forming a peripheral non-transmitting area on each transparent motherboard 3 corresponding to the transparent light-emitting module 100.

[0070] The peripheral non-transparent area is provided with a plurality of discrete electrical connection holes for achieving electrical connection, which serve as the electrical connection portion 13 of the transparent light-emitting module 100 and the module connection portion 33 of the transparent motherboard 3. The transparent light-emitting module 100 and the transparent motherboard 3 are then electrically connected via electrical connectors thereon.

[0071] In this example, the edges of the transparent light-emitting module 100 are set as non-perforated peripheral non-transparent areas, which is beneficial to the flatness and stability of the transparent light-emitting module 100. There is enough wiring space on the edges, which is beneficial for processing and also makes the internal wiring more reasonable and reliable.

[0072] Example 3

[0073] As shown in Figures 10 and 11, this example is basically the same as the solution of Example 2, and discloses a new transparent display screen 1000. The design of its transparent motherboard 3 is different. Assume that the number of transparent light-emitting modules 100 is N, wherein the transparent motherboard 3 includes a non-transparent frame 34 and N hollow light-transmitting areas 31A formed in the non-transparent frame 34. Each hollow light-transmitting area 31A corresponds to a transparent light-emitting module 100.

[0074] A plurality of electrical connection holes for achieving electrical connection are separately provided on the above-mentioned peripheral non-transparent area of ​​the transparent light-emitting module 100, serving as the electrical connection portion 13 of the transparent light-emitting module 100. At the same time, a plurality of electrical connection holes are provided on the above-mentioned non-transparent frame 34, serving as the module connection portion 33 of the transparent motherboard 3. The electrical connection between the transparent light-emitting module 100 and the transparent motherboard 3 is then achieved through the electrical connectors thereon.

[0075] The transparent motherboard 3 can be hollowed out in this way, and the transparent motherboard 3 and the transparent light-emitting module 100 can be welded together through the electrical connection parts distributed at the four corners. On the one hand, it provides power and signals to the transparent light-emitting module 100, and on the other hand, it also realizes the mechanical connection of the transparent light-emitting module 100.

[0076] Example 4

[0077] As shown in Figures 12 and 13, this example discloses a new transparent display screen 1000. Most aspects of this example are identical to those of Example 3, differing only in its transparent light-emitting module 100, which adopts the structure of Example 1. To facilitate electrical connection, this example, based on Example 1, provides peripheral connection areas 102 at the corners of the transparent light-emitting module 100. Electrical connection holes are dispersed throughout these corners of the peripheral connection areas 102, serving as electrical connection portions 13, which are electrically connected to the electrical connection holes dispersed throughout the module connection portion 33 of the non-transparent frame 34 of the transparent motherboard 3. This approach also achieves a superior transparent display effect.

[0078] Example 5

[0079] As shown in Figures 14 and 15, this example discloses a new transparent display screen 1000. Most of the content in this example is the same as that of the above-mentioned Example 3. The difference lies in the use of another transparent light-emitting module 100. The transparent light-emitting module 100 is provided with a plurality of pixel recesses 12 arranged in an array, in which the light-emitting pixels 2 are installed. The pixel recesses 12 are potted with a light-transmitting glue (not marked in the figure) to transparently encapsulate the light-emitting pixels 2 in the pixel recesses 12; the light-emitting pixels 2 and the light-transmitting glue form an LED package accommodated in the pixel recesses 12. The light-transmitting glue potting further protects the transparent light-emitting module 100, and the encapsulated transparent light-emitting module 100 has better airtightness and is more waterproof and moisture-proof. The light-emitting pixels 2 in the pixel recesses 12 are further protected.

[0080] Example 6

[0081] As shown in Figures 16 and 17, this example discloses a new transparent display screen 1000. The structure of the transparent motherboard 3 in this example is the same as that of the transparent motherboard 3 in Example 1. The transparent light-emitting module 100 is a transparent light-emitting module 100 similar to that in Example 5. The transparent light-emitting module 100 is provided with a plurality of pixel recesses 12 arranged in an array, into which the light-emitting pixels 2 are mounted. The pixel recesses 12 are then potted with a light-transmitting adhesive (not labeled in the figures) to transparently encapsulate the light-emitting pixels 2 within the pixel recesses 12. The difference from Example 1 is that the first light-transmitting holes 11 in the transparent light-emitting module 100 include a central light-transmitting hole 11a in the center region, half-hole adjacent light-transmitting holes 11b at the four sides, and quarter-hole adjacent corner light-transmitting holes 11c at the corners. The adjacent side light-transmitting holes 11b of two adjacent light-emitting modules can be combined to form a full hole. The adjacent corner light-transmitting holes 11c of four light-emitting modules can be combined to form a full hole.

[0082] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A transparent display screen, wherein: It comprises a transparent motherboard and one or more transparent light-emitting modules mounted on the transparent motherboard; the transparent motherboard is provided with a transmission circuit for providing power and signals to the transparent light-emitting modules; the transparent motherboard and the transparent light-emitting modules present a transparent display effect as a whole; The transparent light-emitting module is provided with a driving circuit and a plurality of light-emitting pixels arranged in an array, wherein the light-emitting pixels include a driving chip and a light-emitting chip; each of the light-emitting pixels is connected to the driving circuit, and the driving circuit is connected to the transmission circuit of the transparent motherboard; Each of the transparent light-emitting modules is electrically connected to the transparent motherboard to provide power and signals for the light-emitting pixels on the transparent light-emitting modules.

2. The transparent display screen according to claim 1, wherein: The transparent light-emitting module is provided with an electrical connection part; the transparent motherboard is provided with a module connection part, and the module connection part on the transparent motherboard is electrically connected to the electrical connection part on the module substrate to electrically connect the driving circuit on the transparent light-emitting module and the transmission circuit on the transparent motherboard, and input power and signals from the transparent motherboard to the transparent light-emitting module.

3. The transparent display screen according to claim 2, wherein: The electrical connection part on the transparent light-emitting module and the module connection part on the transparent motherboard are both correspondingly provided with a plurality of power connection structures and signal connection structures.

4. The transparent display screen according to claim 3, wherein: The power connection structure on the transparent light-emitting module is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard is a second power connection hole, and the signal connection structure is a second signal connection hole; the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole are connected by electrical connectors.

5. The transparent display screen according to claim 4, wherein: The power connection structure and the signal connection structure on the transparent light-emitting module are centrally or dispersedly arranged at the corners or edges of the transparent light-emitting module.

6. The transparent display screen according to claim 1, wherein: The transparent light-emitting module and the transparent motherboard are both printed circuit boards, which are composed of at least two circuit layers; a light-transmitting area is provided on the transparent motherboard, and light-transmitting holes are arranged in an array on the transparent light-emitting module; The circuit layer on the transparent motherboard forms the transmission circuit, which is used to provide power and signals for the module substrate; The circuit layer on the transparent light-emitting module forms a driving circuit, and the driving circuit provides power and signals for each of the light-emitting pixels.

7. The transparent display screen according to claim 6, wherein: The transparent light-emitting module and the light-transmitting holes on the transparent motherboard include a central light-transmitting hole in the shape of a full hole in the central area, adjacent light-transmitting holes in the shape of half holes at the four sides, and adjacent corner light-transmitting holes in the shape of a quarter hole at the corners; the adjacent light-transmitting holes of two adjacent light-emitting modules can be combined to form a full hole, and the adjacent corner light-transmitting holes of four light-emitting modules can be combined to form a full hole.

8. The transparent display screen according to claim 1, wherein: The number of the transparent light-emitting modules is N, wherein the transparent motherboard includes a non-transparent frame and N hollow light-transmitting areas formed in the non-transparent frame, and each hollow light-transmitting area is correspondingly provided with one of the transparent light-emitting modules.

9. The transparent display screen according to claim 1, wherein: The transparent motherboard is also provided with an external connection interface area connected with the power module and the signal module; the external connection interface area is provided with connection PIN pins connected with the power module and the signal module.

10. The transparent display screen according to claim 1, wherein: The transparent light emitting module is bonded and connected to the transparent motherboard.

11. The transparent display screen according to claim 1, wherein: The transparent motherboard is a transparent glass board, and the transmission circuit is arranged on the transparent glass board.

12. The transparent display screen according to claim 1, wherein: The transparent light-emitting module comprises a transparent substrate, on which the driving circuit is arranged; and the light-emitting pixel array is arranged on the driving circuit of the transparent substrate.

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