Antenna structure and electronic device
By introducing the second radiator to the antenna structure electrically connects the first radiator and optimizing the structural design, the problem of reducing the size of the antenna structure and assembly complexity is solved, and an antenna design with a smaller size and lower cost is realized.
Patent Information
- Application Number
- PCT/CN2024/098268
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-30
- Filing Date
- 2024-06-07
- Publication Date
- 2025-07-31
AI Technical Summary
In the prior art, due to the size limitations of the antenna structure of the electronic device, it is difficult to further reduce the size without changing the operating frequency, and there are problems such as complex assembly process and high cost.
By introducing a second radiator into the antenna structure, using it to electrically connect to the first radiator, the electrical dimension of the antenna is increased without increasing the overall thickness, and the structure is optimized through various implementations to simplify the manufacturing process and reduce costs.
The antenna structure is achieved by doubled in size without increasing thickness, while simplifying the assembly process, reducing costs, and keeping the antenna performance unchanged.
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Figure CN2024098268_31072025_PF_FP_ABST
Abstract
Description
Antenna structure and electronic equipment
[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on November 30, 2023, with application number 202311637438.6 and application name “Antenna Structure and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of antenna technology, and in particular to an antenna structure and an electronic device. Background Art
[0003] With the development of communication technology and electronic devices, higher requirements have been placed on the performance and size of electronic devices. Due to the size and other internal structural limitations of electronic devices, the size and performance requirements of antenna structures are relatively high. This requires that the size of the antenna structure be designed to be smaller without changing the operating frequency of the antenna structure.
[0004] Summary of the Invention
[0005] Embodiments of the present application provide an antenna structure and an electronic device, which are used to reduce the size of the antenna structure.
[0006] To achieve the above objectives, this application adopts the following technical solutions:
[0007] In a first aspect of an embodiment of the present application, an antenna structure is provided, comprising a first substrate and a first radiator and a second radiator intersecting and electrically connected to each other. The first substrate has a first surface, on which the first radiator is disposed. The second radiator is disposed in a thickness direction of the first substrate.
[0008] In the antenna structure provided by the embodiment of the present application, the first radiator is equivalent to the radiator of the antenna structure. By providing a second radiator electrically connected to the first radiator, the electrical size of the antenna structure is effectively extended by the second radiator, which can make the size of the antenna structure smaller without increasing the size of the antenna structure in the direction parallel to the first substrate. In addition, the second radiator is provided in the thickness direction of the first substrate 110, which can avoid increasing the thickness of the antenna structure. The embodiment of the present application provides a solution that can halve the size of the antenna structure compared to the antenna structure of the same operating frequency in the prior art.
[0009] In one possible implementation, the antenna structure further includes a third radiator, which is disposed on a side of the first substrate away from the first radiator. The third radiator is electrically connected to the first radiator via the second radiator. This further increases the electrical size of the antenna structure without increasing the overall size of the antenna structure.
[0010] In one possible implementation, there is a gap between the third radiator and the first substrate. In this way, the antenna structure provided by the embodiment of the present application has multiple implementations.
[0011] In one possible implementation, the first substrate has a second surface disposed opposite to the first surface, and the third radiator is disposed on the second surface of the first substrate.
[0012] In one possible implementation, the antenna structure further includes a connecting portion located on a side of the first radiator away from the first substrate, the connecting portion being electrically connected to both the first radiator and the second radiator. Thus, the antenna structure provided in the embodiment of the present application has multiple implementations.
[0013] In one possible implementation, the antenna structure further includes a third radiator, which is disposed on a side of the first substrate away from the first radiator. The third radiator is electrically connected to the first radiator via the second radiator. The connecting portion, the second radiator, and the third radiator are integrally formed. This eliminates the need for manual assembly, reduces costs, and improves the integration of the antenna structure.
[0014] In one possible implementation, the second radiator is disposed on the surface where the first substrate intersects the first surface. Thus, the antenna structure provided in the embodiment of the present application has multiple implementations.
[0015] In one possible implementation, the second radiator penetrates the first substrate along the thickness direction of the first substrate. In this way, the antenna structure provided by the embodiment of the present application has multiple implementations.
[0016] In one possible implementation, the second radiator includes multiple vias, which are spaced apart in a direction perpendicular to the thickness of the first substrate. Thus, the first and third radiators are connected using multiple vias, making the antenna structure simpler and more compact.
[0017] In one possible implementation, the antenna structure further includes a first microstrip strip structure, disposed on the first surface of the first substrate and located on a side of the first radiator away from the second radiator. In this manner, the first microstrip strip structure is used to couple electromagnetic waves to the first radiator, thereby radiating excitation from the antenna structure. Furthermore, the first microstrip strip is coupled to the feed portion, and the operating bandwidth of the antenna structure can be adjusted by adjusting the size and position of the first microstrip strip.
[0018] In one possible implementation, the antenna structure further includes a second microstrip strip structure, which is disposed on the first surface of the first substrate and intersects with the first microstrip strip structure in its extension direction. This allows for a dual-port, frequency-differentiated, dual-polarized antenna structure.
[0019] In one possible implementation, the antenna further includes a fourth radiator and a fifth radiator; the fourth radiator is disposed in the thickness direction of the first substrate; the fourth radiator intersects with the first radiator and is electrically connected to the first radiator; the fifth radiator is disposed on a side of the first substrate away from the first radiator; and the fifth radiator is electrically connected to the first radiator via the fourth radiator. This allows for a dual-port, co-frequency, dual-polarization antenna structure.
[0020] In one possible implementation, the antenna structure further includes a second substrate and a feeder; the second substrate is disposed on a side of the first substrate away from the first radiator; and the feeder is disposed between the first and second substrates and is used to connect the first and second substrates. This allows the antenna structure to be fed via the feeder, eliminating the need for cable feeding.
[0021] In one possible implementation, the antenna structure further includes a third radiator, which is disposed on a surface of the second substrate close to the first substrate; the third radiator is electrically connected to the first radiator via the second radiator. This makes the antenna structure 10 compact and easy to manufacture.
[0022] According to a second aspect of an embodiment of the present application, an electronic device is provided, comprising the antenna structure according to any one of the first aspects and a housing, wherein the antenna structure is arranged in the housing.
[0023] The electronic device provided in the second aspect of the embodiment of the present application includes the antenna structure of any one of the first aspects, and its beneficial effects are the same as those of the antenna structure, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;
[0025] FIG2A is a schematic structural diagram of an antenna structure;
[0026] FIG2B is a cross-sectional view of FIG2A along the direction A1A2;
[0027] FIG3A is a schematic structural diagram of another antenna structure;
[0028] FIG3B is a cross-sectional view of FIG3A along the line B1B2;
[0029] FIG4A is a simulation diagram of the scattering parameters of the antenna structure shown in FIG2A ;
[0030] FIG4B is a simulation diagram of the scattering parameters of the antenna structure shown in FIG3A;
[0031] FIG4C is a radiation pattern of the antenna structure shown in FIG2A;
[0032] FIG4D is a radiation pattern of the antenna structure shown in FIG3A;
[0033] FIG5A is a schematic structural diagram of yet another antenna structure;
[0034] FIG5B is a schematic structural diagram of yet another antenna structure;
[0035] FIG5C is a schematic structural diagram of yet another antenna structure;
[0036] FIG5D is a schematic structural diagram of yet another antenna structure;
[0037] FIG5E is a schematic structural diagram of yet another antenna structure;
[0038] FIG6A is a schematic structural diagram of an antenna structure provided in an embodiment of the present application;
[0039] FIG6B is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0040] FIG7 is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0041] FIG8A is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0042] FIG8B is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0043] FIG9A is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0044] FIG9B is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0045] FIG9C is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0046] FIG10 is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0047] FIG11 is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0048] FIG12 is a schematic structural diagram of another antenna structure provided in an embodiment of the present application;
[0049] FIG13A is a diagram showing a simulation of scattering parameters of an antenna structure;
[0050] FIG13B is a diagram showing a simulation of scattering parameters of another antenna structure;
[0051] FIG14A shows a radiation pattern of another antenna structure;
[0052] FIG14B shows a radiation pattern of yet another antenna structure;
[0053] FIG14C shows a radiation pattern of yet another antenna structure;
[0054] FIG15 is a simulation diagram showing the scattering parameters of another antenna structure.
[0055] Figure 1: 1-electronic device; 2-display module; 3-middle frame; 4-housing; 5-cover; 10-antenna structure; 101-fence structure; 110-first substrate; 120-second substrate; 130-feeding part; 131-contact; 132-antenna shrapnel; 210-first radiator; 211-connecting part; 230-third radiator; 220-second radiator; 240-fourth radiator; 250-fifth radiator; 212-second connecting part; 310-first microstrip strip structure; 320-second microstrip strip structure. DETAILED DESCRIPTION
[0056] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0057] Hereinafter, the terms "second," "first," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature qualified as "second," "first," etc., may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "plurality" means two or more.
[0058] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative descriptions and clarifications, and may change accordingly according to changes in the orientation of the components in the drawings.
[0059] In the embodiments of this application, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can mean fixed connection, detachable connection, or integration; it can mean direct connection or indirect connection through an intermediate medium. In addition, the term "coupling" can mean direct electrical connection or indirect electrical connection through an intermediate medium. The term "contact" can mean direct contact or indirect contact through an intermediate medium.
[0060] In the embodiments of the present application, "and / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.
[0061] For ease of understanding, the relevant technical terms involved in the embodiments of this application are explained and described below.
[0062] A home gateway is a network device located within a modern home. Its function is to connect home users to the Internet, enabling various smart devices in the home to access Internet services and enabling communication between these smart devices. Simply put, a home gateway acts as a bridge, connecting various smart devices within the home and connecting them to external networks. Technically, a home gateway performs bridging / routing, protocol conversion, address management, and translation within the home and between the home and external networks. It also acts as a firewall and provides services such as voice over internet protocol (VoIP) and video over internet protocol (Voice over IP).
[0063] Electrical length: refers to the ratio of physical length (i.e. mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave.
[0064] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.
[0065] Optical communication network systems have become the current mainstream communication network systems. For example, in optical communication network systems, the access method of the access network (AN) is fiber access (FTTx), which is also called optical access network (OAN). The fiber access methods of the optical access network include fiber to the cabinet (FTTCab), fiber to the curb (FTTC), fiber to the building (FTTB) and fiber to the home (FTTR).
[0066] In some embodiments, the optical communication network system is integrated into an electronic device. The electronic device may include, for example, a server, a switch, a fiber optic network card, and a fiber optic transceiver. The optical communication network system may be integrated into the same electronic device or integrated into different electronic devices. This embodiment of the present application does not limit this, and may be configured appropriately based on actual circumstances.
[0067] In other embodiments, an electronic device is also illustrated. The electronic device can be applied to various communication systems or communication protocols, such as: global system of mobile communication (GSM), code division multiple access (CDMA) system, wideband code division multiple access wireless (WCDMA), general packet radio service (GPRS), long term evolution (LTE), etc. The electronic device is, for example, consumer electronic products, home electronic products, vehicle-mounted electronic products, and financial terminal products. Among them, consumer electronic products are, for example, wireless routers, mobile phones, tablet computers (pads), laptop computers, e-readers, personal computers (PCs), personal digital assistants (PDAs), desktop displays, smart wearable products (e.g., smart watches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, etc. Home electronic products include smart door locks, televisions, remote controls, refrigerators, and rechargeable small household appliances (e.g., soymilk makers and robot vacuums). Car-mounted electronic products include car navigation systems and car DVD players. Financial terminal products include ATMs and self-service terminals. The embodiments of this application do not impose any particular restrictions on the specific form of the above-mentioned electronic devices. For ease of explanation, the following embodiments are all illustrated using a mobile phone as an example.
[0068] Taking the structure of an electronic device as an example, as shown in FIG1 , the electronic device 1 mainly includes a display module 2 , a middle frame 3 , a housing (or battery cover, rear housing) 4 and a cover plate 5 .
[0069] The display module 2 has a light-emitting side through which a display image can be seen and a back side arranged opposite to the light-emitting side. The back side of the display module 2 is close to the middle frame 3 , and the cover plate 5 is arranged on the light-emitting side of the display module 2 .
[0070] The display module 2 includes a display panel (DP).
[0071] In one possible embodiment of the present application, the display module 2 is a liquid crystal display module. In this case, the display screen is a liquid crystal display (LCD). Therefore, the display module 2 further includes a backlight unit (BLU) located on the back side of the LCD screen (away from the side of the LCD used to display images).
[0072] The backlight module can provide light to the liquid crystal display screen, so that each sub-pixel in the liquid crystal display screen can emit light to realize image display.
[0073] Alternatively, in another possible embodiment of the present application, the display module 2 is an organic light-emitting diode (OLED) display module. In this case, the display screen is an organic light-emitting diode (OLED) display screen. Because each subpixel in an OLED display screen is provided with an electroluminescent layer, the OLED display screen can achieve self-luminescence after receiving an operating voltage. In this case, the display module 2 with an OLED display screen does not need to be provided with the aforementioned backlight module.
[0074] The cover plate 5 is located on a side of the display module 2 away from the middle frame 3 . The cover plate 5 may be, for example, a cover glass (CG), which may have a certain toughness.
[0075] The middle frame 3 is located between the display module 2 and the housing 4. The surface of the middle frame 3 facing away from the display module 2 is used to mount internal components such as the battery, printed circuit board (PCB), camera, and antenna structure. When the housing 4 and middle frame 3 are closed, these internal components are located between the housing 4 and the middle frame 3.
[0076] Illustratively, the antenna structure may be applied to the above-mentioned electronic device 1 to enable the electronic device 1 to receive or send wireless signals, thereby realizing wireless communication functions.
[0077] Among them, the patch antenna design without the need for cables has become a type of antenna structure commonly used in electronic devices 1 .
[0078] FIG2A illustrates a patch antenna structure 10, which includes a first substrate 110 and a second substrate 120 stacked together. The second substrate 120 can be a printed circuit board within the electronic device 1 described above. Alternatively, the second substrate 120 can be disposed on a printed circuit board. This is not limited in the present embodiment.
[0079] Exemplarily, as shown in FIG. 2A, the first substrate 110 is a square with a side length of d1, and the area of the first substrate 110 is d1 2 . As shown in FIG. 2B, the thickness h1 of the antenna structure 10 is the sum of the thicknesses of the first substrate 110 and the second substrate 120.
[0080] Among them, the size d1 of the first substrate 110 is related to the operating frequency of the antenna structure 10. For example, when the operating frequency of the antenna structure 10 shown in FIG. 2A is 2.4 GHz, the size of the first substrate 110 is about 60 mm, that is, d1 is about 60 mm.
[0081] As the performance of the electronic device 1 continues to improve, there are also certain requirements for the appearance design of the electronic device 1. Exemplarily, the antenna structure of the electronic device 1 in the home gateway (for example, the FTTR / WiFi device) has gradually evolved from a single external antenna structure to a multi-external antenna structure, and then to the current internal antenna structure.
[0082] Due to the limitations of the size of the electronic device 1 and other structures within the electronic device 1, there are certain requirements for both the performance and size of the internal antenna structure, and the design requirements for the internal antenna structure are higher than those for the external antenna structure.
[0083] However, due to the relatively large size d1 of the first substrate 110, it occupies a relatively large internal space of the electronic device 1, affecting the use of the electronic device 1.
[0084] Based on this, in order to reduce the size of the antenna structure, an embodiment of the present application further illustrates an antenna structure. As shown in FIG. 3A, the antenna structure 10 includes a first substrate 110, a second substrate 120, and a plurality of fence structures 101. There is a gap between the first substrate 110 and the second substrate 120, and the first substrate 110 and the second substrate 120 are connected by the fence structures 101.
[0085] Among them, as shown in FIG. 3B, the surface of the second substrate 120 away from the first substrate 110 is covered with a metal layer. The fence structures 101 penetrate through the first substrate 110, and the plurality of fence structures 101 are located on the surface of the second substrate 120 close to the first substrate 110. The fence structures 101 do not penetrate through the second substrate 120. At this time, the fence structures 101 do not form an electrical connection with the metal layer of the second substrate 120, and the formed current distribution equivalently extends the electrical size of the antenna structure 10, reducing the size d2 (d2 < d1) of the antenna structure 10, enabling the antenna structure 10 to achieve resonance at a lower frequency and electromagnetic wave radiation at a smaller size.
[0086] Figure 4A illustrates the scattering parameters of the antenna structure shown in Figure 2A , Figure 4B illustrates the scattering parameters of the antenna structure shown in Figure 3A , Figure 4C illustrates the radiation pattern of the antenna structure shown in Figure 2A , and Figure 4D illustrates the radiation pattern of the antenna structure shown in Figure 3A . As can be seen from Figures 4A and 4B , the resonant frequency of the antenna structure 10 in Figure 2A and the resonant frequency of the antenna structure 10 in Figure 3A are substantially the same, both around 2.5 GHz. The radiation direction of the antenna structure 10 in Figure 2A and the radiation direction of the antenna structure 10 in Figure 3A are also substantially the same.
[0087] Therefore, the antenna structure 10 shown in FIG. 3A reduces the size of the antenna structure 10 without changing the performance of the antenna structure 10 .
[0088] However, the antenna structure 10 shown in FIG. 3A is relatively complex in structure, has high tolerances, is difficult to assemble, and also increases the thickness of the antenna structure 10 .
[0089] As shown in FIG3B , the thickness h2 of the antenna structure 10 is the sum of the thickness of the first substrate 110 , the thickness of the second substrate 120 and the thickness of the fence structure 101 . Therefore, the thickness of the antenna structure shown in FIG3A is greater than the thickness of the antenna structure shown in FIG2A .
[0090] Based on this, in order to reduce the difficulty of the assembly process of the antenna structure, the embodiment of the present application also illustrates an antenna structure. As shown in Figure 5A, the antenna structure 10 includes multiple sub-antenna layers (sub-antenna layers shown in Figures 5B-5E) stacked together.
[0091] As shown in FIG5A , the antenna structure 10 includes multiple sub-antenna layers, and metalized vias are used between each sub-antenna layer to adjust current distribution.
[0092] Exemplarily, the antenna structure 10 shown in Figure 5A includes a first sub-antenna layer 11 (as shown in Figure 5B), a second sub-antenna layer 12 (as shown in Figure 5C), a third sub-antenna layer 13 (as shown in Figure 5D) and a fourth sub-antenna layer 14 (as shown in Figure 5E) arranged in a stacked manner.
[0093] However, the antenna structure 10 has a large number of sub-antenna layers, and each sub-antenna layer is thicker, which increases the overall thickness of the antenna structure 10. In addition, the dielectric material in the sub-antenna layer has high requirements, and low dielectric constant materials need to be used, resulting in a larger thickness of the antenna structure 10 and higher cost.
[0094] Based on this, to reduce the thickness of the antenna structure, an embodiment of the present application provides an antenna structure. As shown in Figure 6A, the antenna structure 10 includes a first substrate 110, a first radiator 210, and a second radiator 220. The first substrate 110 has a first surface a1, on which the first radiator 210 is disposed. The second radiator 220 is disposed along the thickness of the first substrate 110. The first radiator 210 and the second radiator 220 intersect and are electrically connected.
[0095] In the embodiment of the present application, the use of the second radiator 220 can effectively increase the electrical size of the antenna structure 10, thereby reducing the size of the first radiator 210 of the antenna structure 10. Therefore, by adding the second radiator 220, the area of the first radiator 210 can be reduced without increasing the overall thickness of the antenna structure 10.
[0096] 6A , the first substrate 110 has a second surface a2 opposite to the first surface a1. That is, along the thickness direction of the first substrate 110, the first substrate 110 has the first surface a1 and the second surface a2 opposite to each other.
[0097] For ease of illustration, the thickness direction of the first substrate 110 is referred to as the third direction z, and the directions intersecting the third direction z, i.e., the two directions in the plane of the first substrate 110, are referred to as the first direction x and the second direction y, respectively. In other words, the plane formed by the first direction x and the second direction y is parallel to the plane of the first substrate 110. The first direction x, the second direction, and the third direction z intersect with each other.
[0098] The first substrate 110 has a first surface a1 and a second surface a2 opposite to each other. A first radiator 210 is disposed on the first surface a1 of the first substrate 110. For example, the first radiator 210 can be regarded as a metal layer on the surface of the first substrate 110.
[0099] The first radiator 210 can be regarded as the radiator of the antenna structure 10 .
[0100] That is, the size of the first radiator 210 is the same as the size of the radiator of the antenna structure 10 .
[0101] Regarding the second radiator 220 , as shown in FIG. 6A , the second radiator 220 is located in the thickness direction of the first substrate 110 .
[0102] The second radiator 220 can be located in a plane defined by the first direction x and the third direction z. Alternatively, the second radiator 220 can be located in a plane defined by the second direction y and the third direction z. For ease of illustration, the plane defined by the second radiator 220 is referred to as the plane defined by the first direction x and the third direction z. In other words, the second radiator 220 can extend along the first direction x.
[0103] Exemplarily, the second radiator 220 is located at a surface where the first surface a1 and the second surface a2 of the first substrate 110 intersect. In other words, the second radiator 220 is in direct contact with the first substrate 110 .
[0104] Alternatively, for example, a gap may be formed between the second radiator 220 and the first substrate 110 .
[0105] The embodiment of the present application does not limit this, and it can be reasonably configured according to actual conditions, as long as the second radiator 220 intersects with the first radiator 210 and is electrically connected.
[0106] Regarding the size of the second radiator 220 , illustratively, along the third direction z, the size of the second radiator 220 may be smaller than the thickness of the first substrate 110 .
[0107] Alternatively, for example, along the third direction z, the size of the second radiator 220 may be equal to the thickness of the first substrate 110 .
[0108] Alternatively, for example, along the third direction z, the size of the second radiator 220 may be greater than the thickness of the first substrate 110 .
[0109] The embodiments of the present application do not limit this, and it can be reasonable based on actual conditions.
[0110] 6B , the antenna structure 10 further includes a third radiator 230 . The third radiator 230 is disposed on a side of the first substrate 110 away from the connecting portion 211 .
[0111] The third radiator 230 is electrically connected to the first radiator 210 through the second radiator 220 .
[0112] That is, the second radiator 220 connects the first radiator 210 and the third radiator 230. That is, the second radiator 220 intersects both the first radiator 210 and the third radiator 230. That is, the second radiator 220 intersects the first radiator 210 and the third radiator 230.
[0113] At this time, along the third direction z, the size of the second radiator 220 is greater than or equal to the thickness of the first substrate 110 .
[0114] For example, the third radiator 230 may be disposed on the second surface a2 of the first substrate 110. Alternatively, the third radiator 230 may not be disposed on the second surface a2 of the first substrate 110. In other words, the third radiator 230 may or may not be in contact with the first substrate 110. This is not limited in this embodiment of the present application.
[0115] Exemplarily, the third radiator 230 is parallel to the first substrate 110. That is, the first radiator 210, the third radiator 230 and the first substrate 110 are parallel to each other. For example, the first radiator 210 and the third radiator 230 are both in a plane defined by the first direction x and the second direction y.
[0116] Alternatively, illustratively, the plane where the third radiator 230 is located intersects with the first substrate 110 , that is, the third radiator 230 is arranged obliquely relative to the first substrate 110 .
[0117] Exemplarily, along the first direction x, the sizes of the first radiator 210 , the second radiator 220 and the third radiator 230 may be the same.
[0118] In the embodiment of the present application, the dimensions of the first radiator 210 and the third radiator 230 along the second direction y are not limited and can be appropriately set according to actual conditions. For example, along the second direction y, the dimension of the first radiator 210 is smaller than the dimension of the third radiator 230. Alternatively, for example, along the second direction y, the dimension of the first radiator 210 is equal to the dimension of the third radiator 230. Alternatively, for example, along the second direction y, the dimension of the first radiator 210 is larger than the dimension of the third radiator 230.
[0119] In some embodiments, as shown in FIG. 7 , the antenna structure 10 further includes a connecting portion 211 .
[0120] As shown in FIG. 7 , the connecting portion 211 is disposed on a side of the first radiator 210 away from the first substrate 110 .
[0121] Exemplarily, the connection portion 211 is disposed on a surface of the first radiator 210 away from the first substrate 110 .
[0122] 7 , the connecting portion 211 covers the first radiator 210 , that is, the connecting portion 211 is in direct contact with the first radiator 210 .
[0123] The connecting portion 211 is electrically connected to the first radiator 210 .
[0124] For example, the material of the connection portion 211 is different from the material of the first radiator 210 .
[0125] Exemplarily, the connecting portion 211 , the third radiator 230 and the second radiator 220 may be an integrally formed structure.
[0126] In this way, manual assembly is unnecessary, costs are reduced, and the integration of the antenna structure 100 is improved.
[0127] In some embodiments, as shown in FIG. 7 , the second radiator 220 is disposed on a surface where the first substrate 110 intersects the first surface a1 .
[0128] Exemplarily, as shown in FIG. 7 , the connecting portion 211 , the third radiator 230 , and the second radiator 220 are wrapped around the periphery of the first substrate 110 .
[0129] In other embodiments, as shown in FIG. 8A and FIG. 8B , the second radiator 220 passes through the first substrate 110 .
[0130] In this case, the connection portion 211 may not be required.
[0131] As shown in FIG. 8B , the second radiator 220 penetrates the first substrate 110 along the thickness direction of the first substrate 110 .
[0132] That is, as shown in FIG. 8B , the second radiator 220 penetrates the first substrate 110 along a direction (ie, a third direction z) from the first surface a1 of the first substrate 110 to the second surface a2 of the first substrate 110 .
[0133] Exemplarily, as shown in FIG8A , the second radiator 220 includes a plurality of conductive holes 201 , and the plurality of conductive holes 201 are arranged at intervals along a direction perpendicular to the thickness direction of the first substrate.
[0134] That is, the plurality of vias 201 can be arranged sequentially and spaced apart along the first direction x. Alternatively, the plurality of vias 201 can also be arranged sequentially and spaced apart along the second direction y. Alternatively, the plurality of vias 201 can be arranged sequentially and spaced apart along both the first direction x and the second direction y. This embodiment of the present application is not limited to this, and it is sufficient that the plurality of vias 201 are all connected to the first radiator 210.
[0135] The antenna structure 10 provided in the embodiment of the present application only requires forming the first radiator 210 and the third radiator 230 on the first surface a1 and the second surface a2 of the first substrate 110, respectively, and then connecting the first radiator 210 and the third radiator 230 using a plurality of vias 201. This makes the antenna structure 10 simpler and more compact, and also allows the first radiator 210 and the third radiator 230 to be excited simultaneously.
[0136] In the embodiment of the present application, the dimensions of the first radiator 210 and the connecting portion 211 along the first direction x and the second direction y are not limited.
[0137] Exemplarily, along the first direction x, the size of the connection portion 211 is smaller than the size of the first radiator 210 . Alternatively, exemplary, along the first direction x, the size of the connection portion 211 is equal to the size of the first radiator 210 .
[0138] 7 , along the second direction y, the size of the connection portion 211 is smaller than that of the first radiator 210 . Alternatively, along the second direction y, the size of the connection portion 211 is equal to that of the first radiator 210 .
[0139] In some embodiments, as shown in FIG. 9A , a gap is provided between the third radiator 230 and the first substrate 110 .
[0140] That is, the third radiator 230 is not in direct contact with the first substrate 110 .
[0141] Exemplarily, a dimension of the second radiator 220 along the thickness direction of the first substrate 110 is greater than the thickness of the first substrate 110 .
[0142] That is, along the third direction z, the size of the second radiator 220 is larger than the size of the first substrate 110 .
[0143] In other words, along the third direction z, the size of the first substrate 110 is smaller than the size of the second radiator 220.
[0144] Exemplarily, as shown in FIG. 9A , along the thickness direction z of the first substrate 110 , the size of the second radiator 220 is greater than the thickness of the first substrate 110 .
[0145] As shown in FIG. 9A , the first surface a1 and the second surface a2 of the first substrate 110 are disposed opposite to each other.
[0146] In this case, the second surface a2 of the first substrate 110 opposite to the first surface a1 may also be provided with a metal layer. Alternatively, the second surface a2 may not be provided with a metal layer. This embodiment of the application does not limit this, and may be reasonably set according to actual conditions.
[0147] In some other embodiments, as shown in FIG. 9B , the third radiator 230 is disposed on the second surface a2 of the first substrate 110 .
[0148] That is, the third radiator 230 is in direct contact with the first substrate 110 .
[0149] Exemplarily, along the thickness direction z of the first substrate 110 , the size of the second radiator 220 is equal to the thickness of the first substrate 110 .
[0150] At this time, the second surface a2 of the first substrate 110 is not provided with a metal layer.
[0151] In this way, the third radiator 230 can be prevented from being electrically connected to the metal layer disposed on the second surface a2 of the first substrate 110 and causing a short circuit.
[0152] Continuing to refer to FIG. 9A , in some embodiments, the antenna structure 10 further includes a second substrate 120 and a feeding portion 130 .
[0153] Exemplarily, as shown in FIG. 9A , the second substrate 120 is disposed on a side of the first substrate 110 away from the connecting portion 211 .
[0154] In other words, the second substrate 120 and the first substrate 110 are stacked.
[0155] 9A , the second substrate 120 includes a first surface b1 and a second surface b2 opposite to each other, wherein the first surface b1 of the second substrate 120 is close to the first substrate 110 , and the second surface b2 of the second substrate 120 is far from the first substrate 110 .
[0156] In some implementations, the second substrate 120 can be considered as a printed circuit board of the electronic device 1. The radiation generated by the antenna structure 10 can be reflected by the second substrate 120 to form a directional antenna.
[0157] For example, as shown in FIG9A , the second substrate 120 may include a first metal layer 121 disposed on the second surface b2 .
[0158] As shown in FIG. 9A , the feeding portion 130 is disposed between the first substrate 110 and the second substrate 120 . The feeding portion 130 is used to connect the first substrate 110 and the second substrate 120 .
[0159] In some embodiments, as shown in FIG9A , the feeding portion 130 includes a contact 131 and an antenna spring 132 . The contact 131 and the antenna spring 132 are electrically connected and used to connect the first substrate 110 and the second substrate 120 .
[0160] For example, a transmission line (not shown) is disposed in the second substrate 120 , and a solder pad (not shown) is disposed on the first surface b1 of the second substrate 120 , wherein the solder pad is electrically connected to the antenna spring 132 .
[0161] In the embodiment of the present application, the signal is transmitted via the transmission line of the second substrate 120 to the antenna spring 132 connected to the pad, and then transmitted to the first substrate 110 via the contact 131, completing the signal transmission to the first substrate 110. The antenna structure 10 provided in the embodiment of the present application transmits signals via the feeder 130, eliminating the need for a cable to feed the antenna structure 10, thereby reducing costs.
[0162] In the embodiment of the present application, along the thickness direction (third direction) z of the first substrate 110, the size of the second radiator 220 is less than or equal to the sum of the thickness of the first substrate 110 and the size of the feeding portion 130. In other words, the third radiator 230 is disposed between the first substrate 110 and the second substrate 120.
[0163] In some embodiments, along the thickness direction (third direction) z of the first substrate 110 , the size of the second radiator 220 is smaller than the sum of the thickness of the first substrate 110 and the size of the feeding portion 130 .
[0164] That is, along the third direction z, the size of the second radiator 220 is smaller than the sum of the thickness of the first substrate 110 and the distance between the first substrate 110 and the second substrate 120 .
[0165] In other words, the third radiator 230 does not contact the second substrate 120 . That is, there is a gap between the third radiator 230 and the second substrate 120 .
[0166] In the implementation of this application, the distance between the first substrate 110 and the second substrate 120 can be understood as the distance between the second surface a2 of the first substrate 110 and the first surface b1 of the second substrate 120 .
[0167] In this case, for example, the first surface b1 of the second substrate 120 may be provided with a metal layer. Alternatively, the first surface b1 of the second substrate 120 may not be provided with a metal layer. This embodiment of the present application does not limit this, and any reasonable configuration may be made according to actual conditions.
[0168] In some other implementations, along the thickness direction (third direction) z of the first substrate 110 , the size of the second radiator 220 is equal to the sum of the thickness of the first substrate 110 and the size of the feeding portion 130 .
[0169] That is, along the third direction z, the size of the second radiator 220 is equal to the sum of the thickness of the first substrate 110 and the distance between the first substrate 110 and the second substrate 120 .
[0170] In other words, the third radiator 230 is in contact with the second substrate 120 , that is, the third radiator 230 is in contact with the first surface b1 of the second substrate 120 .
[0171] 9C , the third radiator 230 is disposed on a surface of the second substrate 120 close to the first substrate 110 . That is, the third radiator 230 is disposed on the first surface b1 of the second substrate 120 .
[0172] In this case, the third radiator 230 may be a metal layer disposed on the first surface b1 of the second substrate 120 , and the metal layer on the first surface b1 of the second substrate 120 is connected to the first radiator 210 through the second radiator 220 .
[0173] In the embodiment of the present application, the size of the second radiator 220 is not limited. That is, the third radiator 230 can be disposed between the first substrate 110 and the second substrate 120, with a gap between the third radiator 230 and both the first substrate 110 and the second substrate 120. Alternatively, the third radiator 230 can be disposed on the second surface a2 of the first substrate 110, i.e., the third radiator 230 is in direct contact with the second substrate 120. Alternatively, the third radiator 230 can be disposed on the first surface b1 of the second substrate 120, i.e., the third radiator 230 is in direct contact with the second substrate 120.
[0174] It should be noted that if the third radiator 230 is disposed between the first substrate 110 and the second substrate 120, that is, there is a gap between the third radiator 230 and both the first substrate 110 and the second substrate 120, the second surface a2 of the first substrate 110 may or may not be provided with a metal layer, and the first surface b1 of the second substrate 120 may or may not be provided with a metal layer. If the third radiator 230 is also disposed on the second surface a2 of the first substrate 110, that is, the third radiator 230 is in direct contact with the second substrate 120, the second surface a2 of the first substrate 110 is not provided with a metal layer. If the third radiator 230 is also disposed on the first surface b1 of the second substrate 120, that is, the third radiator 230 is in direct contact with the second substrate 120, the first surface b1 of the second substrate 120 is not provided with a metal layer.
[0175] That is, the third radiator 230 does not contact the metal layer on the substrate (the first substrate 110 or the second substrate 120 ).
[0176] In some embodiments, as shown in FIG9A , the second surface b2 of the second substrate 120 may be provided with a first metal layer 121. Alternatively, as shown in FIG9B , the second surface b2 of the second substrate 120 may not be provided with a first metal layer. This embodiment of the present application is not limited to this, and any suitable configuration may be made based on actual conditions.
[0177] The antenna structure 10 provided in the embodiment of the present application can control the resonance point and operating frequency of the antenna structure 10 by adjusting the size of the third radiator 230 along the second direction y and the size of the second radiator 220 along the third direction z.
[0178] In some embodiments, as shown in FIG. 10 , the antenna structure 10 further includes a first microstrip structure 310 .
[0179] As shown in FIG. 10 , the first microstrip strip structure 310 is disposed on the first surface a1 of the first substrate 110 , and the first microstrip strip structure 310 is disposed opposite to the second radiator 220 .
[0180] That is, the first microstrip structure 310 and the second radiator 220 are respectively disposed on two opposite sides of the first substrate 110 .
[0181] The extending direction of the first microstrip structure 310 may be the same as the extending direction of the second radiator 220 .
[0182] In the embodiment of the present application, the first microstrip strip 310 is coupled to the feeding portion 130 , and the operating bandwidth of the antenna structure 10 can be changed by adjusting the size and position of the first microstrip strip 310 .
[0183] The first microstrip structure 310 is used to couple electromagnetic waves to the first radiator 210 to complete radiation excitation of the antenna structure 10 .
[0184] In some embodiments, as shown in FIG. 11 , the antenna structure 10 further includes a second microstrip structure 320 .
[0185] The second microstrip strip structure 320 is disposed on the first surface a1 of the first substrate 110 and intersects with the extending direction of the first microstrip strip structure 310 .
[0186] Exemplarily, the first microstrip strip structure 310 extends along a first direction x, and the second microstrip strip structure 320 extends along a second direction y, wherein the first direction x and the second direction y intersect.
[0187] That is, the second radiator 220 , the second microstrip structure 320 and the first microstrip structure 310 are respectively disposed on three edges of the first substrate 110 .
[0188] In this way, the antenna structure 10 has a first port in the first direction x and a second port in the second direction y, which enables the antenna structure 10 to achieve high-frequency radiation in the second direction y, thereby realizing a dual-port, different-frequency, and dual-polarization antenna structure.
[0189] In some embodiments, as shown in FIG. 12 , the antenna structure 10 further includes a fourth radiator 240 and a fifth radiator 250 .
[0190] As shown in FIG12 , the fourth radiator 240 is disposed in the thickness direction of the first substrate 110 and is disposed opposite the second microstrip structure 320. The fifth radiator 250 is disposed on a side of the first substrate 110 away from the first radiator 210 and is connected to the first radiator 210 via the fourth radiator.
[0191] The fourth radiator 240 is disposed at a position similar to that of the second radiator 220 , both disposed in the thickness direction of the first substrate 110 , but differs in that the fourth radiator 240 and the second radiator 220 are respectively disposed on adjacent sidewalls of the first substrate 110 .
[0192] For example, the fourth radiator 240 may penetrate the first substrate 110. Alternatively, the fourth radiator 240 may be disposed on a sidewall surface of the first substrate 110 adjacent to the second radiator 220. This embodiment of the present application does not limit this, and may be reasonably disposed according to actual conditions.
[0193] Exemplarily, the second radiator 220 extends along the first direction x, and the fourth radiator 240 extends along the second direction x. That is, the extension directions of the second radiator 220 and the fourth radiator 240 intersect.
[0194] In this way, the antenna structure 10 has a first port in the first direction x and a second port in the second direction y, which enables the antenna structure 10 to achieve high-frequency radiation in the second direction y, thereby realizing a dual-port, same-frequency, dual-polarization antenna structure.
[0195] In some embodiments, the antenna structure 10 further includes a second connection portion 212. The second connection portion 212 is disposed on a side of the first radiator 210 away from the first substrate 110. The second connection portion 212 is electrically connected to both the first radiator 210 and the fourth radiator 240.
[0196] At this time, the connection portion 211 for connecting the first radiator 210 and the second radiator 220 is referred to as a first connection portion 211 .
[0197] Exemplarily, the second connection portion 212 may be disposed on a side of the first connection portion 211 away from the first radiator 210 .
[0198] Alternatively, the second connection portion may also be disposed between the first connection portion 211 and the first radiator 210 .
[0199] The embodiments of the present application do not limit this, and can be reasonably set according to actual conditions.
[0200] Exemplarily, the second connection portion 212 , the fourth radiator 240 and the fifth radiator 250 are an integrally formed structure.
[0201] In this way, the antenna structure 10 is easy to prepare and the process is simple.
[0202] The antenna structure 10 shown in FIG. 7 is simulated below, and the size of the first radiator 210 of the first substrate 110 in the antenna structure 10 is set to 30 mm*30 mm, and the thickness remains unchanged at 5 mm.
[0203] Figure 13A is a schematic diagram of a simulation of the operating bandwidth of the antenna structure 10 shown in Figure 7, and Figure 13B is a schematic diagram of a simulation of the antenna efficiency of the antenna structure 10 shown in Figure 7. As can be seen from Figures 13A and 13B, while the size of the antenna structure 10 is reduced in the embodiment of the present application, the resonant frequency of the antenna structure 10 remains essentially unchanged, remaining around 2.5 GHz.
[0204] Figures 14A to 14C respectively illustrate the radiation patterns of the antenna structure 10 when the operating frequencies are 2.4 GHz, 2.45 GHz, and 2.5 GHz. It can be seen that the size of the antenna structure 10 is reduced in the embodiment of the present application, and the radiation direction of the antenna structure 10 remains basically unchanged.
[0205] In the embodiment of the present application, the antenna structure 10 shown in Figure 8A is also simulated. Figure 15 is a schematic diagram of the working bandwidth simulation of the antenna structure 10 shown in Figure 8A. Comparing Figure 13A and Figure 15, it can be seen that the resonant frequency of the antenna structure 10 has not changed.
[0206] The antenna structure 10 provided in the embodiment of the present application includes a first substrate 110 and intersecting and electrically connected first and second radiators 210 and 220. The first substrate 110 has a first surface a1, on which the first radiator 210 is disposed. The second radiator 220 is disposed in the thickness direction of the first substrate 110. In the antenna structure 10 provided in the embodiment of the present application, the first radiator 210 is equivalent to the radiator of the antenna structure 10. By providing the second radiator 220 electrically connected to the first radiator 210, the second radiator 220 effectively extends the electrical dimensions of the antenna structure 10, enabling a smaller design for the antenna structure 10 without increasing the dimensions of the antenna structure 10 in a direction parallel to the first substrate 110. Furthermore, the second radiator 220 is disposed in the thickness direction of the first substrate 110, thereby maintaining the thickness of the antenna structure 10. The embodiment of the present application provides a solution that can halve the dimensions of the antenna structure 10 compared to conventional antenna structures operating at the same frequency.
[0207] In addition, the antenna structure 10 provided in the embodiment of the present application is powered by the feeding portion 130 , without the need for feeding through a cable.
[0208] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. An antenna structure, characterized in that, Comprising: A first substrate, on a first surface of the first substrate, a first radiator is provided; A second radiator, disposed in the thickness direction of the first substrate; The first radiator and the second radiator intersect, and the first radiator and the second radiator are electrically connected.
2. The antenna structure according to claim 1, wherein The antenna structure further includes a third radiator, the third radiator is disposed on a side of the first substrate away from the first radiator; the third radiator is electrically connected to the first radiator through the second radiator.
3. The antenna structure according to claim 2, wherein There is a gap between the third radiator and the first substrate.
4. The antenna structure according to claim 2, characterized in that, The first substrate has a second surface opposite to the first surface, and the third radiator is disposed on the second surface of the first substrate.
5. The antenna structure according to any one of claims 1-4, characterized in that The antenna structure further includes a connecting portion; the connecting portion is located on a side of the first radiator away from the first substrate, and the connecting portion is electrically connected to both the first radiator and the second radiator.
6. The antenna structure according to claim 5, wherein The antenna structure further includes a third radiator, the third radiator is disposed on a side of the first substrate away from the first radiator; the third radiator is electrically connected to the first radiator through the second radiator; the connecting portion, the second radiator and the third radiator are an integrally formed structure.
7. The antenna structure according to any one of claims 1-6, characterized in that, The second radiator is disposed on a surface of the first substrate intersecting with the first surface.
8. The antenna structure according to any one of claims 1-6, characterized in that, The second radiator penetrates the first substrate along the thickness direction of the first substrate.
9. The antenna structure according to claim 8, wherein The second radiator includes a plurality of via holes, and the plurality of via holes are arranged at intervals in a direction perpendicular to the thickness direction of the first substrate.
10. The antenna structure according to any one of claims 1-9, characterized in that, The antenna structure further includes a first microstrip structure, the first microstrip structure is disposed on the first surface of the first substrate, and the first microstrip structure is located on a side of the first radiator away from the second radiator.
11. The antenna structure according to claim 10, wherein The antenna structure further includes a second microstrip structure, the second microstrip structure is disposed on the first surface of the first substrate, and the second microstrip structure intersects with the extending direction of the first microstrip structure.
12. The antenna structure according to any one of claims 1-11, characterized in that, The antenna further includes a fourth radiator and a fifth radiator; the fourth radiator is disposed in the thickness direction of the first substrate; the fourth radiator and the first radiator intersect and are electrically connected to the first radiator; the fifth radiator is disposed on a side of the first substrate away from the first radiator; the fifth radiator is electrically connected to the first radiator through the fourth radiator.
13. The antenna structure according to any one of claims 1-12, characterized in that, The antenna structure further includes a second substrate and a feeding portion; The second substrate is disposed on a side of the first substrate away from the first radiator; The feeding portion is disposed between the first substrate and the second substrate and is used for connecting the first substrate and the second substrate.
14. The antenna structure according to claim 13, characterized in that, The antenna structure further includes a third radiator, the third radiator is disposed on a surface of the second substrate close to the first substrate; the third radiator is electrically connected to the first radiator through the second radiator.
15. An electronic device, characterized in that, Comprising the antenna structure according to any one of claims 1-14 and a housing; the antenna structure is disposed in the housing.