Electroplating fixture, electroplating device, and electroplating fixture detection method

Abstract

An electroplating fixture, an electroplating device and an electroplating fixture detection method. The electroplating fixture comprises a holding cylinder and a sealing ring, wherein the inner wall of the holding cylinder is provided with an annular boss configured to support a wafer; the sealing ring wraps the annular boss and extends from the annular boss to the cylinder wall of the holding cylinder; and a gas channel is provided in the cylinder wall of the clamping cylinder, the opening of the gas channel is arranged at the position where the clamping cylinder is wrapped by the sealing ring, and whether the sealing ring is damaged can be determined by pumping gas through the gas channel. The electroplating fixture can be used for reliable wafer electroplating.

Description

Electroplating fixture, electroplating device and electroplating fixture detection method Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to an electroplating fixture, an electroplating device, and an electroplating method. Background Art

[0002] Currently, wafer electroplating processes are divided into two types: vertical rack plating and horizontal jet cup plating. Rack plating involves immersing the wafer vertically in the plating solution, allowing multiple wafers to be plated simultaneously within a single plating tank. Cup plating involves placing the wafers within a cup-shaped plating tank, where the plating process is performed one wafer at a time. Compared to rack plating, cup plating offers a more controllable, single-wafer process and represents a key development direction for high-quality electroplating. Advanced cup plating processes typically require a secure sealing ring around the wafer edge to prevent the plating solution from contacting the wafer edge and the backside of the wafer to be plated.

[0003] However, as the electroplating operation progresses, the rubber sealing ring will age and gradually become damaged in some parts. In particular, smaller damage to the rubber sealing ring is difficult to detect with the naked eye, resulting in electroplating failure.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electroplating fixture, an electroplating device, and an electroplating method, which can detect damage on a sealing component at least to a certain extent.

[0006] In the first aspect, the present application provides an electroplating fixture, comprising: a clamping cylinder, the inner wall of which is provided with an annular boss, the annular boss being used to support a wafer; a sealing ring, which wraps the annular boss and extends from the annular boss to the cylinder wall of the clamping cylinder; an air duct is provided in the cylinder wall of the clamping cylinder, the air duct opening of the air duct is provided at the position where the clamping cylinder is wrapped by the sealing ring, and the sealing ring is detected whether it is damaged by evacuating air from the air duct.

[0007] Specifically, a clamping cylinder opening groove is provided at a position where the clamping cylinder is wrapped by the sealing ring, and the clamping cylinder opening groove is connected to the airway through the airway opening.

[0008] Specifically, the opening groove of the clamping cylinder is arranged around the clamping cylinder.

[0009] Specifically, there are multiple air passages, and the multiple air passages are connected at different positions of the opening groove of the clamping tube.

[0010] Specifically, there are a plurality of opening grooves of the clamping cylinder and a plurality of air passages, each of the opening grooves of the clamping cylinder is connected to at least one air passage, and the plurality of opening grooves of the clamping cylinder are arranged at intervals.

[0011] Specifically, the sealing ring extends from the annular boss to the inner wall of the clamping cylinder. The electroplating fixture further includes a fixture inner ring, which is arranged on the inner side of the clamping cylinder and covers the first edge of the sealing ring located on the inner wall of the clamping cylinder.

[0012] Specifically, an inner wall of the clamping cylinder is provided with an internal step structure, the first edge is located at the internal step structure, and the inner ring of the clamp covers the first edge at the internal step structure.

[0013] Specifically, the sealing ring extends from the annular boss to the outer wall of the clamping cylinder. The electroplating fixture further includes a fixture shield, which is arranged outside the clamping cylinder and covers the second edge of the sealing ring located on the outer wall of the clamping cylinder.

[0014] Specifically, an outer wall of the clamping cylinder is provided with an external step structure, the second edge of the sealing ring is located at the external step structure, and the clamp shield covers the second edge at the external step structure.

[0015] Specifically, the electroplating fixture further includes a rotating circular plate provided with an exhaust device, the rotating circular plate is connected to the clamping cylinder via a fixture connector, and the air duct is also provided in the rotating circular plate and the fixture connector.

[0016] In a second aspect, the present application provides an electroplating device, comprising: an electroplating tank; and an electroplating fixture as described in any one of the above items, wherein the electroplating fixture is used to make the surface of the wafer to be electroplated face the electroplating tank.

[0017] In the third aspect, the present application provides an electroplating fixture detection method, which is applied to the electroplating fixture as described in any of the above items, including: evacuating the air duct arranged in the electroplating fixture and detecting the exhaust flow; based on the exhaust flow, counting the gas flow changes at the air duct opening covered by the sealing ring; based on the gas flow changes, judging whether the sealing ring is damaged.

[0018] In a fourth aspect, the present application provides a method for detecting an electroplating fixture, which is applied to an electroplating fixture as described in any of the above items, including: evacuating the air duct arranged in the electroplating fixture and detecting the evacuated air pressure; based on the evacuated air pressure, counting the gas pressure changes at the air duct opening covered by the sealing ring; and judging whether the sealing ring is damaged based on the gas pressure changes.

[0019] In the electroplating fixture of the present application, since the airway opening is arranged at the position where the clamping cylinder is wrapped by the sealing ring, whether the sealing ring is damaged can be detected by performing air extraction detection on the airway.

[0020] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0021] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

[0022] Summary of the Figures

[0023] The features and performance of the present application are further described by the following examples and drawings.

[0024] The accompanying drawings are incorporated into and constitute a part of the specification, illustrating embodiments consistent with the present application and, together with the specification, explaining the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort. In the drawings:

[0025] FIG1 shows a schematic structural diagram of an electroplating fixture according to an embodiment of the present application;

[0026] FIG2 shows a schematic structural diagram of a clamping cylinder and a clamp connecting piece according to an embodiment of the present application;

[0027] FIG3 is a schematic diagram showing a partial structure of a clamping cylinder and a clamp connecting member according to an embodiment of the present application;

[0028] FIG4 is a schematic diagram showing a partial structure of a clamping cylinder and a clamp connecting member according to an embodiment of the present application;

[0029] FIG5 shows a schematic structural diagram of a clamping cylinder and a clamp connecting member according to an embodiment of the present application;

[0030] FIG6 shows a schematic structural diagram of an electroplating fixture according to an embodiment of the present application;

[0031] FIG7 shows a schematic structural diagram of an electroplating device according to an embodiment of the present application;

[0032] FIG8 shows a schematic flow chart of an electroplating method according to an embodiment of the present application;

[0033] FIG9 shows a schematic flow chart of an electroplating method according to an embodiment of the present application.

[0034] Preferred embodiment of this application

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0036] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0037] 1 to 4 , this embodiment provides an electroplating fixture 1 that can detect whether a sealing ring 15 inside the electroplating fixture 1 is damaged.

[0038] As shown in Figure 1, the electroplating fixture 1 includes a clamping cylinder 11, a power assembly 12 that drives the clamping cylinder 11 to rotate, a rotating circular plate 13 and a clamp connector 14. Among them, the clamping cylinder 11 is cylindrical and has two ends along its axial direction. An annular boss 111 is protruding from the inner wall of the lower end of the clamping cylinder 11 shown in Figure 1. The wafer 2 is arranged in the clamping cylinder 11, and the edge of the surface to be electroplated of the wafer 2 is supported by the annular boss 111. The power assembly 12 includes a rotating drive member. The power assembly 12 is arranged at the center of the rotating circular plate 13. The rotating circular plate 13 is connected to the other end of the clamping cylinder 11 through the clamp connector 14. The power assembly 12 drives the clamping cylinder 11 to rotate through the rotating circular plate 13 and the clamp connector 14, so that the wafer 2 rotates during electroplating, which can enable the wafer 2 to be electroplated evenly. Specifically, the clamp connector 14 can be one or more. When there are multiple clamp connectors 14, the multiple clamp connectors 14 are evenly distributed along the circumference of the rotating circular plate 13, so that the rotating circular plate 13 and the clamping cylinder 11 are stably connected. For example, as shown in Figure 2, the clamp connector 14 can be at least two connecting rods, evenly distributed along the circumference of the rotating circular plate 13, or two connecting rods can be a group, and the two groups of connecting rods are symmetrically arranged on both sides of the rotating circular plate 13. Each group of connecting rods can also form a connecting frame, and the connection area between the connecting frame and the rotating circular plate 13 is larger, and the connection area between the connecting frame and the clamping cylinder 11 is larger, which can increase the connection strength. In this embodiment, the clamp connector 14 can also be a connecting plate, a connecting block or other structures.

[0039] Referring to Figure 1 again, the clamping cylinder 11 is a cylindrical cylinder. The diameter of the inner wall of the lower end of the clamping cylinder 11 is equal to the diameter of the wafer 2. The diameter of the hole formed on the inner wall of the annular boss 111 is slightly smaller than the diameter of the wafer 2, so that the clamping cylinder 11 contacts the edge of the wafer to position the wafer 2. The annular boss 111 supports the edge of the wafer to be electroplated, so that the electroplating fixture 1 can stably clamp the wafer 2. The diameter of the end of the clamping cylinder 11 away from the annular boss 111 is greater than the diameter of the wafer 2, so that the wafer 2 can be placed in the clamping cylinder 11 conveniently. At least one section of the inner wall of the clamping cylinder can be inclined to provide a guiding effect for the wafer 2. The annular boss 111 can be integrally provided with the clamping cylinder 11. In other embodiments of the embodiments of the present application, the annular boss 111 can be connected to the clamping cylinder 11 by welding, bonding, etc.

[0040] Referring to Figure 3, the electroplating fixture 1 also includes a sealing ring 15, which wraps the annular boss 111 so that the annular boss 111 can contact the wafer 2 through the sealing ring 15. The electroplating fixture 1 also includes a fixture inner ring 16, which is arranged on the inner side of the clamping cylinder, and a fixture shield 17, which is arranged on the outer side of the clamping cylinder. The sealing ring 15 extends from the annular boss 111 to the inner wall and outer wall of the clamping cylinder. The first edge 151 of the sealing ring on the inner wall of the clamping cylinder is pressed by the clamp inner ring 16, and the second edge 152 of the sealing ring on the outer wall of the clamping cylinder is pressed by the clamp shield 17 to fix the position of the sealing ring 15. Since the sealing ring 15 extends toward the inner wall of the clamping cylinder, the inner wall of the clamping cylinder contacts the edge of the wafer through the sealing ring 15, so that the sealing effect of the wafer edge is better. Furthermore, an internal step structure is provided on the inner wall of the clamping cylinder. A first edge 151 of the sealing ring on the inner wall of the clamping cylinder extends to the internal step structure. The first edge 151 of the sealing ring is pressed by the inner ring 16 of the clamp at the internal step structure to better secure the sealing ring 15. Similarly, an external step structure can be provided on the outer wall of the clamping cylinder. A second edge 152 of the sealing ring on the outer wall of the clamping cylinder is pressed by the clamp shield 17 at the external step structure to better secure the sealing ring 15.

[0041] As shown in FIG4 , the external step structure is further provided with a plurality of annular grooves 112. The sealing ring 15 is made of an elastic material such as rubber. When the sealing ring 15 is pressed, it is compressed into the annular grooves 112, so that the second edge 152 of the sealing ring is wavy, thereby better fixing the sealing ring 15. The annular groove 112 can also be provided on the internal step structure, the clamp inner ring 16 and / or the clamp shield 17, and the number of annular grooves 112 can also be one.

[0042] An air channel 113 is provided in the wall of the clamping tube 11, and the air channel opening 114 of the air channel 113 is provided at the position where the clamping tube 11 is wrapped by the sealing ring 15. The air channel 113 is also connected to a vacuum device (not shown), so that when the vacuum device is used to vacuum the air channel 113, it is possible to judge whether the sealing ring 15 at the position of the air channel opening 114 is damaged based on the change in the gas flow or air pressure in the air channel 113. The sealing ring 15 is arranged to fit the clamping tube 11, but the sealing ring 15 is made of elastic material. The elasticity of the sealing ring 15 may deteriorate due to aging and other reasons, thereby causing a micron-level gap between the sealing ring 15 and the clamping tube 11. Therefore, vacuuming the air channel 113 can not only judge whether the sealing ring 15 at the position of the air channel opening 114 is damaged, but also detect whether the entire sealing ring 15 is damaged through the gap. The air channel 113 also extends from the inner wall of the clamping cylinder 11 to the fixture connector 14 and the rotating circular plate 13 until it is connected to the air extraction device in the power assembly 12. The air channel 113 in the clamping cylinder 11 can be one or more, and accordingly, the air channel 113 in the clamp connector 14 can also be one or more, and the air channel 113 in the rotating circular plate 13 can also be one or more. In a specific embodiment, referring to Figure 2, if the clamp connector 14 is a connecting rod, the air channel 113 can be set in the connecting rod. In other embodiments of the embodiments of the present application, the air extraction device is set outside the electroplating fixture 1.

[0043] In other embodiments of the embodiments of the present application, the air duct 113 extends to the inside of the annular boss 111, and the air duct opening 114 is arranged at the position where the annular boss 111 is wrapped by the sealing ring 15. In other embodiments of the embodiments of the present application, there are multiple air duct openings 114, and the multiple air duct openings 114 are distributed on both sides of the supporting surface of the annular boss 111. When the annular boss 111 supports the wafer 2, the wafer 2 makes the sealing ring 15 close to the supporting surface under the action of gravity. The air duct openings 114 distributed on both sides of the supporting surface can respectively detect the sealing ring 15 located on both sides of the supporting surface, so as to better judge whether the sealing ring 15 is damaged. Multiple air duct openings 114 can also be arranged around the clamping cylinder 11 or the annular boss 111, so that it can detect whether the sealing ring 15 is damaged from more directions.

[0044] Specifically, when the sealing ring 15 is intact, the gas flow rate will be smaller than when it is damaged. For example, it may be less than 3 standard liters per minute (sccm), and will gradually decrease until the flow rate approaches 0 as the air passage 113 is evacuated. When the sealing ring 15 is damaged, the damage will cause gas to continue to enter the air passage 113, and the gas flow rate will be larger than when it is intact, and will not change significantly as the air passage 113 is evacuated. For example, it may be maintained at 5 sccm. In other embodiments of the present application, when the sealing ring 15 is intact, the gas pressure will be greater than when it is damaged, and will gradually increase until it cannot be evacuated as the air passage 113 is evacuated. When the sealing ring 15 is damaged, the damage will cause gas to continue to enter the air passage 113, and the gas pressure will be smaller than when it is intact, and will not change significantly as the air passage 113 is evacuated.

[0045] In another embodiment of the present application, as shown in Figure 5, a clamping cylinder opening groove 115 with a notch facing the sealing ring 15 is provided at the position where the clamping cylinder 11 is wrapped by the sealing ring 15. The clamping cylinder opening groove 115 is connected to the airway 113 through the airway opening 114, that is, the airway opening 114 is provided in the clamping cylinder opening groove 115, and the airway 113 draws air through the notch of the clamping cylinder opening groove 115, which can increase the range of detecting the sealing ring 15. At the same time, when the notch is partially blocked by the sealing ring 15 or impurities, since the clamping cylinder opening groove 115 has a certain depth, gas can still flow inside the clamping cylinder opening groove 115, thereby achieving a better detection effect.

[0046] 5 , the clamping tube opening groove 115 is an annular opening groove arranged along the circumference of the clamping tube 11, so that the sealing ring 15 can be detected from more directions. When there are multiple air passages 113, each air passage 113 is connected to a different position of the annular opening groove.

[0047] In one embodiment of the present application, as shown in FIG6 , when there are multiple air passages 113, there may also be multiple clamping tube opening slots 115, each of which is connected to at least one air passage 113, and each of which is connected to an air extraction device. The air extraction device can control the opening and closing of each air passage 113 to detect the sealing ring 15 through each of the clamping tube opening slots 115. The multiple clamping tube opening slots 115 are arranged at intervals to reduce the impact on the strength of the clamping tube 11, and the multiple clamping tube opening slots 115 are arranged along the circumferential direction of the clamping tube 11. In other embodiments of the present application, the multiple clamping tube opening slots 115 can be arranged along the axial direction of the clamping tube 11.

[0048] In other embodiments of the embodiments of the present application, a boss opening groove with a notch facing the sealing ring 15 is provided at the position where the annular boss 111 is wrapped by the sealing ring 15. The structure of the boss opening groove is similar to that of the clamping tube opening groove 115. The specific structure can be referred to the setting of the clamping tube opening groove 115 and will not be repeated here.

[0049] Referring to Figure 1 again, the electroplating fixture 1 also includes a wafer pressing block 18. The wafer pressing block 18 is arranged in the clamping cylinder 11 and is used to apply pressure to the back of the wafer 2 away from the surface to be electroplated, so that the edge of the wafer fits tightly against the annular boss 111 to achieve a better sealing effect. The end face size of the wafer pressing block 18 used to press the wafer 2 is the same as the size of the wafer 2, so that the force is evenly applied to all parts of the wafer 2, thereby improving the flatness of the electroplating. A protrusion is provided on the edge of one end of the wafer pressing block 18 away from the wafer 2 in a direction away from the wafer 2, and the protrusion extends to the end of the clamping cylinder 11 away from the annular boss 111 and a bending structure is provided on the end face of the clamping cylinder 11 away from the annular boss 111. The bending structure is clamped on the end face of the clamping cylinder 11 away from the annular boss 111 to limit the wafer pressing block 18. The distance between the end face of the wafer pressing block 18 used to press the wafer 2 and the annular boss 111 is the thickness of a wafer 2, that is, the distance between the clamping surface of the bending structure of the wafer pressing block 18 and the end face of the wafer pressing block 18 used to press the wafer 2 minus the height of the clamping cylinder 11 is equal to the thickness of a wafer 2, so as to prevent the wafer pressing block 18 from excessively squeezing the wafer 2 and causing damage to the wafer 2.

[0050] Referring to FIG. 7 , this embodiment further provides an electroplating device, including the electroplating fixture 1 as described above.

[0051] As shown in Figure 7, the electroplating device also includes an electroplating tank 3 filled with electroplating liquid. When the electroplating fixture 1 clamps the edge of the wafer 2, the surface of the wafer to be electroplated faces the electroplating tank 3, so that when the electroplating fixture 1 clamps the wafer 2 and moves into the electroplating tank 3, the surface of the wafer to be electroplated is immersed in the electroplating tank 3 for cup plating.

[0052] Referring to FIG. 8 , this embodiment further provides an electroplating fixture detection method, which is performed by the electroplating fixture 1 or the electroplating device described above.

[0053] The electroplating fixture detection method includes at least steps S110 to S130, which are described in detail as follows:

[0054] S110: exhaust the air passage 113 provided in the electroplating fixture 1 and detect the exhaust flow rate.

[0055] S120: Counting the change in gas flow at the airway opening 114 covered by the sealing ring 15 according to the exhaust flow.

[0056] The change in the air extraction flow rate is the change in the gas flow rate at the airway opening 114 covered by the sealing ring 15 .

[0057] S130: Determine whether the sealing ring 15 is damaged based on the change in gas flow rate.

[0058] When the sealing ring 15 is intact, the gas flow rate will be smaller than when it is damaged. For example, it may be less than 3 standard liters per minute (sccm), and will gradually decrease until the flow rate approaches 0 as the gas channel 113 is evacuated. When the sealing ring 15 is damaged, the damage will allow gas to continue to enter the gas channel 113, and the gas flow rate will be larger than when it is intact. There will be no significant change as the gas channel 113 is evacuated. For example, it may be maintained at 5 sccm.

[0059] Step S110 may be performed before the electroplating fixture 1 clamps the wafer 2 , or may be performed during the process of the electroplating fixture 1 clamping the wafer 2 .

[0060] In this electroplating method, by evacuating the air channel 113, the gas flow change at the air channel opening 114 covered by the sealing ring 15 is obtained to determine whether gas continues to enter, thereby determining whether the sealing ring 15 is damaged.

[0061] Referring to FIG. 9 , this embodiment further provides an electroplating fixture detection method, which is performed by the electroplating fixture 1 or the electroplating device described above.

[0062] The electroplating fixture detection method includes at least steps S210 to S230, which are described in detail as follows:

[0063] S210: The air passage 113 provided in the electroplating fixture 1 is evacuated and the evacuated air pressure is detected.

[0064] S220: Counting the gas pressure change at the airway opening 114 covered by the sealing ring 15 according to the pumped gas pressure.

[0065] The variation of the pumped air pressure is calculated based on the detected pumped air pressure. The variation of the pumped air pressure is the variation of the gas pressure at the airway opening 114 covered by the sealing ring 15 .

[0066] S130: Determine whether the sealing ring 15 is damaged based on the change in gas pressure.

[0067] When the sealing ring 15 is intact, the gas pressure will be greater than when it is damaged, and as the air channel 113 is evacuated, the gas pressure will gradually increase until it can no longer be evacuated; when the sealing ring 15 is damaged, the damage will cause gas to continue to enter the air channel 113, and the gas pressure will be lower than when it is intact, and there will be no obvious change as the air channel 113 is evacuated.

[0068] Step S210 may be performed before the electroplating fixture 1 clamps the wafer 2 , or may be performed during the process of the electroplating fixture 1 clamping the wafer 2 .

[0069] In this electroplating method, by evacuating the airway 113, the gas pressure change at the airway opening 114 covered by the sealing ring 15 is obtained to determine whether gas continues to enter, thereby determining whether the sealing ring 15 is damaged.

[0070] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art that are not disclosed herein.

[0071] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electroplating fixture, characterized in that: include: A clamping cylinder, the inner wall of which is provided with an annular boss, and the annular boss is used to support the wafer; A sealing ring, wrapping the annular boss and extending from the annular boss to the wall of the clamping cylinder; An air passage is arranged in the wall of the clamping tube, and an air passage opening of the air passage is arranged at a position where the clamping tube is wrapped by the sealing ring, and whether the sealing ring is damaged is detected by pumping air from the air passage.

2. The electroplating fixture according to claim 1, characterized in that: A clamping tube opening groove is provided at a position where the clamping tube is wrapped by the sealing ring, and the clamping tube opening groove is connected to the airway through the airway opening.

3. The electroplating fixture according to claim 2, characterized in that: The opening groove of the clamping tube is arranged around the clamping tube.

4. The electroplating fixture according to claim 3, characterized in that: There are multiple air passages, and the multiple air passages are connected at different positions of the opening groove of the clamping tube.

5. The electroplating fixture according to claim 2, characterized in that: There are a plurality of opening grooves of the clamping tube and a plurality of air passages. Each of the opening grooves of the clamping tube is connected to at least one air passage, and the plurality of opening grooves of the clamping tube are arranged at intervals.

6. The electroplating fixture according to claim 1, characterized in that: The sealing ring extends from the annular boss to the inner wall of the clamping tube. The electroplating fixture also includes a fixture inner ring, which is arranged on the inner side of the clamping tube and covers the first edge of the sealing ring located on the inner wall of the clamping tube.

7. The electroplating fixture according to claim 6, characterized in that: The inner wall of the clamping cylinder is provided with an internal step structure, the first edge is located at the internal step structure, and the inner ring of the clamp covers the first edge at the internal step structure.

8. The electroplating fixture according to claim 1, characterized in that: The sealing ring extends from the annular boss to the outer wall of the clamping tube. The electroplating fixture also includes a fixture shield, which is arranged on the outside of the clamping tube and covers the second edge of the sealing ring located on the outer wall of the clamping tube.

9. The electroplating fixture according to claim 8, characterized in that: The outer wall of the clamping cylinder is provided with an external step structure, the second edge of the sealing ring is located at the external step structure, and the clamp shield covers the second edge at the external step structure.

10. The electroplating fixture according to claim 1, characterized in that: It also includes a rotating circular plate provided with an air extraction device, the rotating circular plate is connected to the clamping cylinder through a clamp connecting piece, and the air channel is also arranged in the rotating circular plate and the clamp connecting piece.

11. An electroplating device, characterized in that: include: Electroplating tanks; The electroplating fixture as described in any one of claims 1-10 is used to make the surface of the wafer to be electroplated face the electroplating tank.

12. A method for detecting an electroplating fixture, characterized in that: The electroplating fixture used in any one of claims 1 to 10 comprises: exhausting the air passage disposed in the electroplating fixture and detecting the exhaust flow rate; According to the air extraction flow rate, counting the change of the gas flow rate at the airway opening covered by the sealing ring; Whether the sealing ring is damaged is determined according to the change in the gas flow rate.

13. A method for detecting an electroplating fixture, characterized in that: The electroplating fixture used in any one of claims 1 to 10 comprises: exhausting the air passage disposed in the electroplating fixture and detecting the exhaust pressure; According to the pumped air pressure, counting the change in gas pressure at the airway opening covered by the sealing ring; Whether the sealing ring is damaged is determined based on the change in the gas pressure.

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