Substrate clamping apparatus and method

Abstract

The present invention relates to the technical field of semiconductor devices. Disclosed are a substrate clamping apparatus and a method. The substrate clamping apparatus comprises: a measurement module, used for acquiring type data of a substrate; a chuck, used for placing the substrate; an execution module, comprising: a pneumatic unit, provided on the chuck and used for clamping the substrate; a main pipe, one end of the main pipe being connected to an air source, and the other end being connected to the pneumatic unit; and a pressure regulating unit, provided on the main pipe and used for regulating the air pressure in the main pipe; and a processing module, used for receiving the type data and controlling, on the basis of the type data, the pressure regulating unit to regulate the air pressure in the main pipe, such that the air pressure is matched with the type data. The substrate clamping apparatus can automatically output matched clamping forces according to different substrates, thus improving substrate production efficiency.

Description

Substrate clamping device and method Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a substrate clamping device and method. Background Art

[0002] With the continuous advancement and development of high-tech science and technology, the performance and variety of semiconductor chips are also constantly increasing. There are many different types of wafers. According to their thickness, wafers can be divided into Taiko wafers (wafers with a thin center and a thick ring around them), thin wafers, standard wafers, thick wafers, and thickened wafers. According to their diameter, wafers are mainly divided into 6-inch, 8-inch, and 12-inch wafers. According to their materials, wafers can be divided into Si, SiC, GaAs wafers, etc. Wafers of different thicknesses, sizes, and materials can withstand different external forces. Therefore, different wafers require different clamping forces during the process, which cannot be too large or too small.

[0003] The clamping force of the wafer on the wafer cannot be automatically adjusted by the existing wafer clamping device, which can easily cause damage to the wafer.

[0004] Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a substrate clamping device and method in order to overcome the defect in the prior art that the clamping force of the substrate clamping device on the substrate cannot be automatically adjusted.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] A substrate clamping device, comprising:

[0008] A detection module, used to obtain type data of the substrate;

[0009] a chuck for placing the substrate;

[0010] Execution module, including:

[0011] a pneumatic unit, disposed on the chuck, for clamping the substrate;

[0012] a main pipe, one end of which is connected to the air source, and the other end of which is connected to the pneumatic unit;

[0013] a pressure regulating unit, provided on the main pipe and used for regulating the air pressure in the main pipe;

[0014] A processing module is used to receive the type data and control the pressure regulating unit to adjust the air pressure in the main line according to the type data so that the air pressure matches the type data.

[0015] The detection module acquires the substrate type data, and the processing module controls the pressure regulating unit of the execution module to adjust the matching air pressure based on the substrate type data. Different air pressures correspond to different clamping forces, which enables the substrate clamping device to automatically output a matching clamping force for different types of substrates. Therefore, there is no need to manually change the control parameters of the execution module according to different substrates, thereby improving the production efficiency of substrates. In addition, by pneumatically clamping the substrate, the clamping force of the pneumatic unit can be changed by changing the air pressure. The control method is simple and can achieve high-precision control of the output force of the pneumatic unit.

[0016] A substrate clamping method, comprising:

[0017] Pre-storing the corresponding relationship between substrate type data and substrate clamping force;

[0018] Get the type data of the substrate;

[0019] According to the corresponding relationship, a clamping force matching the type of the substrate is applied to the substrate.

[0020] Through this method, a clamping force that matches different substrates can be automatically output without manual adjustment, thereby improving production efficiency and accuracy and being conducive to improving the yield rate of the substrates.

[0021] Summary of the Figures

[0022] The features and performance of the present application are further described by the following examples and drawings.

[0023] FIG1 is a schematic diagram of the system structure of a substrate clamping device according to Example 1 of the present invention;

[0024] FIG2 is a schematic structural diagram of a chuck according to Example 1 of the present invention;

[0025] FIG3 is a schematic structural diagram of a pneumatic unit according to Example 1 of the present invention;

[0026] FIG4 is a schematic diagram of the system structure of a substrate clamping device according to Example 2 of the present invention;

[0027] FIG5 is a schematic diagram of the system structure of a substrate clamping device according to Example 3 of the present invention;

[0028] FIG6 is a schematic diagram of the system structure of a substrate clamping device according to Example 4 of the present invention;

[0029] FIG7 is a schematic diagram of the system structure of a substrate clamping device according to Example 5 of the present invention;

[0030] FIG8 is a schematic flow chart of a substrate clamping method according to a sixth embodiment of the present invention.

[0031] Preferred embodiment of this application

[0032] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0033] Example 1

[0034] As shown in Figures 1 and 2, this embodiment provides a substrate clamping device, comprising a detection module 100, a chuck 400, an execution module, and a processing module 200. The detection module 100 is used to obtain substrate type data. The chuck 400 is used to place the substrate. The execution module includes a pneumatic unit 310, a main line 320, and a pressure regulating unit 330. The pneumatic unit 310 is disposed on the chuck 400 and is used to clamp the substrate. One end of the main line 320 is connected to the air source 700 and the other end is connected to the pneumatic unit 310. The pressure regulating unit 330 is disposed on the main line 320 and is used to regulate the air pressure in the main line 320. The processing module 200 receives the substrate type data and, based on the substrate type data, controls the pressure regulating unit 330 to adjust the air pressure in the main line 320 so that the air pressure matches the substrate type data, thereby causing the pneumatic unit 310 to output a clamping force that matches the substrate type data.

[0035] Specifically, the type data of the substrate includes parameters such as the thickness, size, and material of the substrate. The type data of the substrate is obtained through the detection module 100, and the processing module 200 can control the pressure regulating unit 330 of the execution module to adjust the air pressure in the main line 320 according to the type data of the substrate. Different air pressures correspond to different clamping forces, which enables the substrate clamping device to automatically output matching clamping forces according to different types of substrates. Therefore, there is no need to manually change the control parameters of the execution module according to different substrates, thereby improving the production efficiency and yield of the substrate. In addition, by pneumatically clamping the substrate, the clamping force of the pneumatic unit 310 can be changed by changing the air pressure. The control method is simple and can achieve high-precision control of the output force of the pneumatic unit 310.

[0036] As an example, a substrate is placed in a substrate carrier for transportation. The substrate carrier is marked with the type data of the substrate currently carried. The detection module 100 obtains the type data of the substrate by reading the mark on the substrate carrier. The mark can specifically be a barcode or RFID tag containing substrate type data. The type data of different substrates corresponds to different clamping forces. The clamping force has a one-to-one correspondence with the air pressure in the main line 320. Therefore, the correspondence between the type data of the substrate and the air pressure can be known. The correspondence between the type data of the substrate and the air pressure is stored in the database in the processing module 200 in advance. When the processing module 200 receives the type data of the substrate, it can call this database to obtain the matching air pressure.

[0037] Furthermore, as shown in FIG3 , the pneumatic unit 310 includes a cylinder 311 and an actuator 312. The cylinder 311 drives the actuator 312 to move, and the actuator 312 contacts the outer edge of the substrate to clamp the substrate in the chuck 400. The structure of the pneumatic unit 310 is simple and compact, and it takes up little space, which is convenient for layout in a limited space, and the output force control of the pneumatic unit 310 is simpler and more precise. Among them, as shown in FIG2 , there are three pneumatic units 310, which are spaced apart on one side of the chuck 400. In addition, three fixing members 500 are respectively provided on the other side of the chuck 400. The cylinder 311 drives the actuator 312 to move, and can clamp the substrate between the actuator 312 and the fixing member 500, so that the substrate is fixed in the chuck 400.

[0038] In this embodiment, three pneumatic units 310 are provided, as shown in Figure 1 . Each pneumatic unit 310 is connected to the main line 320 via a branch line 350 , and each pneumatic unit 310 is connected in parallel. Multiple pneumatic units 310 provide greater stability during the substrate clamping process. The parallel structure of each pneumatic unit 310 ensures consistent air pressure and exerts the same clamping force on the substrate, resulting in more precise control.

[0039] In other embodiments, the number of pneumatic units 310 is not limited thereto, and only one or other numbers may be provided if usage requirements are met.

[0040] In some embodiments, the diameter of the branch pipeline 350 is smaller than the diameter of the main pipeline 320, which can ensure the adequacy of the gas flow supply, avoid unstable pressure in the branch pipeline 350 due to insufficient gas flow, and help improve the stability of the output of the pneumatic unit 310.

[0041] In this embodiment, the execution module further includes a first valve 341, which is disposed on the main line 320 between the pressure regulating unit 330 and the pneumatic unit 310. The processing module 200 is further configured to control the on / off state of the first valve 341. By adding the first valve 341, the first valve 341 can be closed while the pressure regulating unit 330 is regulating the pressure in the main line 320. Once the pressure regulation is complete, the first valve 341 is opened, thereby ensuring a more stable clamping force output by the pneumatic unit 310.

[0042] As an example, the pressure regulating unit 330 is a pressure regulating valve, which is communicatively connected to the processing module 200 .

[0043] The communication connection method can adopt one or a combination of wired communication and wireless communication, and the specific selection can be made according to needs, and no excessive restrictions are made here.

[0044] Example 2

[0045] This embodiment is basically the same as the solution of Example 1, except that, as shown in Figure 4, the execution module also includes a first pressure sensor 360, the first pressure sensor 360 is communicatively connected to the processing module 200, and the first pressure sensor 360 is arranged on the main line 320 between the pressure regulating unit 330 and the pneumatic unit 310, and is used to measure the air pressure in the main line 320 after being regulated by the pressure regulating unit 330.

[0046] In this solution, the first pressure sensor 360 is in communication with the processing module 200 and can provide real-time feedback of the air pressure on the main line 320 to the processing module 200, facilitating precise control of the pneumatic unit 310 to avoid air pressure loss and damage to the substrate.

[0047] In this embodiment, the execution module further includes a manual on / off valve 371 and a manual pressure-regulating valve 372. The manual pressure-regulating valve 372 is disposed on the main line 320 between the pressure-regulating unit 330 and the gas source 700, and the manual on / off valve 371 is disposed on the main line 320 between the manual pressure-regulating valve 372 and the gas source 700. The manual pressure-regulating valve 372 can be used to pre-adjust the pressure of the main line 320 to an appropriate value, making the pressure of the main line 320 more stable and preventing the pressure of the main line 320 from being affected by fluctuations in the gas source 700.

[0048] Example 3

[0049] This embodiment is basically the same as the solution of Example 2, except that, as shown in Figure 5, in this embodiment, the execution module includes not only a first valve 341, but also a second valve 342. One passage of the second valve 342 is connected to the external atmosphere, and the other passage of the second valve 342 is connected to the main line 320 after the first valve 341. The pneumatic unit 310 is connected to the main line 320 between the first valve 341 and the second valve 342. The processing module 200 is also used to control the switching state of the second valve 342.

[0050] In this solution, by opening the first valve 341 and closing the second valve 342, the gas in the main line 320 is controlled to drive the pneumatic unit 310 to apply thrust to the substrate, thereby clamping it. By closing the first valve 341 and opening the second valve 342, the gas in the pneumatic unit 310 can flow through the second valve 342 to the outside atmosphere, thereby releasing the substrate. The clamping and release of the substrate can be controlled simply by controlling the open and closed states of the first valve 341 and the second valve 342.

[0051] Specifically, the first valve 341 and the second valve 342 are solenoid valves, and the first valve 341 and the second valve 342 are respectively connected to the processing module 200 for communication.

[0052] The communication connection method can adopt one or a combination of wired communication and wireless communication, and the specific selection can be made according to needs, and no excessive restrictions are made here.

[0053] Example 4

[0054] As shown in FIG6 , this embodiment is substantially the same as the solution in Example 3, except that, in this embodiment, the execution module further includes a control line 344, and the first valve 341 and the second valve 342 are pneumatic valves. The first valve 341 and the second valve 342 are connected to the gas source 700 via the control line 344. The control line 344 is provided with a solenoid valve 343, which is in communication with the processing module 200. By controlling the opening and closing of the solenoid valve 343, the processing module 200 can control the connectivity of the control line 344, thereby controlling the operating states of the first valve 341 and the second valve 342. Specifically, when the solenoid valve 343 is closed, the first valve 341 is in a closed state, and the second valve 342 is connected. The gas in the pneumatic unit 310 can flow into the external atmosphere through the second valve 342, thereby loosening the substrate; when the solenoid valve 343 is opened, the gas in the gas source 700 can pass through the solenoid valve to reach the first valve 341 and the second valve 342, thereby opening the first valve 341 and closing the second valve 342, and controlling the gas in the main line 320 to drive the pneumatic unit 310 to apply thrust to the substrate to clamp the substrate.

[0055] Specifically, the first valve 341 and the second valve 342 are both two-position, two-way valves. The first valve 341 initially operates in a closed state, while the second valve 342 initially operates in a connected state. The first and second valves 341 and 342 are always in opposite open and closed states, where the open and closed states include a connected state and a closed state. The first and second valves 341 and 342 are always in opposite open and closed states, allowing them to synchronize state changes via a single control line.

[0056] In other embodiments, a control pipeline may be provided for each of the first valve 341 and the second valve 342 to be controlled independently.

[0057] Example 5

[0058] As shown in FIG7 , this embodiment is substantially the same as the solution in Example 3, except that, in this embodiment, the substrate clamping device further includes a second pressure sensor 380, which is disposed on the branch line 350. The second pressure sensor 380 is used to detect the air pressure in the branch line 350. The air pressure in the branch line 350 is the same as the air pressure in the cylinder 311 in the pneumatic unit 310. Therefore, the air pressure in the pneumatic unit 310 can be indirectly detected by the second pressure sensor 380. The second pressure sensor 380 is connected to the processing module 200 via wireless communication. By providing the second pressure sensor 380 to detect the air pressure in the pneumatic unit 310 and feeding it back to the processing module 200, when the pneumatic unit 310 leaks, the second pressure sensor 380 will detect the pressure fluctuation and feed it back to the processing module 200. When the actual measurement value of the second pressure sensor 380 exceeds a preset range, a leak alarm can be issued.

[0059] In other embodiments, the second pressure sensor 380 and the processing module 200 may also be connected via wired communication.

[0060] In this embodiment, the substrate clamping device further includes a force sensor 600, which is disposed on the actuator 312 of the pneumatic unit 310 and is used to measure the clamping force of the actuator 312. The force sensor 600 is connected to the processing module 200 via wireless communication. The force sensor 600 can provide feedback to the processing module 200 on the clamping force exerted by the actuator 312 on the substrate, thereby detecting whether the actual clamping force exerted by the actuator 312 on the substrate is consistent with the theoretical clamping force.

[0061] In other embodiments, the force sensor 600 and the processing module 200 may also be connected via wired communication. The force sensor may also be located on a fixture on the chuck to measure the actual clamping force of the actuator on the substrate.

[0062] Example 6

[0063] As shown in FIG8 , this embodiment provides a substrate clamping method, including:

[0064] S10 , pre-storing the correspondence between substrate type data and substrate clamping force.

[0065] S20: Acquire substrate type data.

[0066] S30 . Apply a clamping force that matches the type of the substrate to the substrate according to the corresponding relationship.

[0067] Through this method, the substrate clamping device can automatically output a clamping force that matches different types of substrates without manual adjustment, thereby improving production efficiency and accuracy and facilitating improved substrate yield.

[0068] Specifically, the substrate clamping device is a chuck, which can clamp the substrate by pneumatic clamping.

[0069] In this embodiment, step S20 specifically includes:

[0070] S21 . Identify type data of the substrate in the substrate carrying device.

[0071] S22, placing the substrate into a corresponding substrate carrying device.

[0072] S23 , obtaining the type data of the substrate by obtaining the identification in the substrate carrying device.

[0073] Of course, in other embodiments, the type data of the substrate may also be directly acquired through an optical sensor.

[0074] Although specific embodiments of the present invention have been described above, those skilled in the art will appreciate that these are merely illustrative and that the scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications are intended to fall within the scope of the present invention.

Claims

1. A substrate clamping device, characterized in that: include: A detection module, used for obtaining type data of the substrate; A chuck, used for placing the substrate; Execution module, including: A pneumatic unit, disposed on the chuck, for clamping the substrate; A main pipeline, one end of which is connected to the air source, and the other end of which is connected to the pneumatic unit; A pressure regulating unit, disposed on the main pipe and used to regulate the air pressure in the main pipe; A processing module is used to receive the type data and control the pressure regulating unit to adjust the air pressure in the main line according to the type data so that the air pressure matches the type data, thereby causing the pneumatic unit to output a clamping force that matches the type data.

2. The substrate clamping device according to claim 1, characterized in that: The substrate clamping device further comprises a fixing part. The pneumatic unit is arranged on one side of the chuck, and the fixing part is correspondingly arranged on the other side of the chuck. The pneumatic unit is used to cooperate with the fixing part to clamp the substrate.

3. The substrate clamping device according to claim 2, characterized in that: The pneumatic unit includes a cylinder and an actuator, wherein the cylinder is used to drive the actuator to move so that the actuator contacts the outer edge of the substrate to clamp the substrate in the chuck.

4. The substrate clamping device according to claim 3, characterized in that: The substrate clamping device further comprises a force sensor, which is communicatively connected with the processing module and is disposed on the actuator or the fixing member to measure the clamping force of the actuator on the substrate.

5. The substrate clamping device according to claim 1, characterized in that: The detection module acquires the type data of the substrate by detecting the mark on the substrate carrying device, the substrate carrying device is used to carry the substrate, and the mark on the substrate carrying device stores the type data of the substrate currently carried.

6. The substrate clamping device according to claim 1, characterized in that: The execution module also includes a first pressure sensor, which is communicatively connected to the processing module and is disposed on the main pipe between the pressure regulating unit and the pneumatic unit, and is used to measure the air pressure in the main pipe after being regulated by the pressure regulating unit.

7. The substrate clamping device according to claim 1, characterized in that: The substrate clamping device further includes a branch pipeline, a plurality of the pneumatic units are provided, each of the pneumatic units is connected to the main pipeline through the branch pipeline, and each of the pneumatic units is a parallel structure.

8. The substrate clamping device according to claim 7, characterized in that: The diameter of the branch pipeline is smaller than the diameter of the main pipeline.

9. The substrate clamping device according to claim 7, characterized in that: The substrate clamping device further includes a second pressure sensor, which is communicatively connected to the processing module and is disposed on the branch pipeline for measuring the air pressure in the branch pipeline.

10. The substrate clamping device according to claim 1, characterized in that: The execution module further includes a first valve, which is disposed on the main pipe between the pressure regulating unit and the pneumatic unit. The processing module is also used to control the switch state of the first valve.

11. The substrate clamping device according to claim 10, characterized in that: The execution module also includes a second valve, one passage of the second valve is connected to the outside, and another passage of the second valve is connected to the main line after the first valve. The pneumatic unit is connected to the main line between the first valve and the second valve, and the processing module is also used to control the switching state of the second valve.

12. The substrate clamping device according to claim 11, characterized in that: The first valve and the second valve are solenoid valves, and the first valve and the second valve are respectively connected to the processing module for communication.

13. The substrate clamping device according to claim 11, characterized in that: The execution module also includes a control pipeline, the first valve and the second valve are pneumatic valves, the first valve and the second valve are connected to the air source through the control pipeline, a solenoid valve is arranged on the control pipeline, the solenoid valve is communicatively connected with the processing module, and the processing module is also used to control the connectivity state of the control pipeline by controlling the switch of the solenoid valve.

14. The substrate clamping device according to claim 13, characterized in that: The first valve and the second valve are both two-position two-way valves, the initial working position of the first valve is a closed state, the initial working position of the second valve is a connected state, and the opening and closing states of the first valve and the second valve are always opposite.

15. A substrate clamping method, characterized in that: It includes: Pre-storing the corresponding relationship between the type data of the substrate and the clamping force of the substrate; Get the type data of the substrate; According to the corresponding relationship, a clamping force matching the type of the substrate is applied to the substrate.

16. The substrate clamping method according to claim 15, wherein: The step of obtaining the type data of the substrate comprises: Identifying type data of a substrate in a substrate carrier; placing the substrate into a corresponding substrate carrying device; The type data of the substrate is obtained by obtaining an identification in a substrate carrying device.

17. The substrate clamping method according to claim 15, wherein: The substrate clamping device clamps the substrate in a pneumatic manner.

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