Wafer working device and working method for wafer

Abstract

In the present invention, an expanding device 6 (wafer working device) comprises: a wafer placing unit 72 on which expanding tape Te is placed, the expanding tape having arranged thereon a plurality of semiconductor chips Ch separated from a wafer We; imaging units 73a-73d which are placed on the wafer placing unit 72 and image the semiconductor chips Ch arranged on the expanding tape Te; and a control unit 71 which controls the imaging of the semiconductor chips performed by the imaging units 73a-73d. The control unit 71 executes control, utilizing the imaging units 73a-73d, in which a separation surface of the semiconductor chips Ch arranged on the expanding tape Te is imaged.

Description

Wafer working device and wafer working method

[0001] The present invention relates to a wafer working device and a method for working on a wafer.

[0002] 2. Description of the Related Art Conventionally, wafer working devices for working on wafers have been known, and such a wafer working device is disclosed, for example, in Japanese Patent Laid-Open Publication No. 2023-018740.

[0003] The above-mentioned Japanese Patent Application Laid-Open No. 2023-018740 discloses an inspection device (wafer working device) equipped with a camera unit that inspects multiple semiconductor chips separated from a wafer. This inspection device is configured so that the camera unit can move above the wafer, captures images of the wafer from above, and inspects the shapes and sizes of the semiconductor chips separated from the wafer.

[0004] JP 2023-018740 A

[0005] However, in the inspection device of the above-mentioned Japanese Patent Laid-Open No. 2023-018740, the camera unit is configured to be movable above the wafer, and images of the wafer are taken from above to inspect the shape and size of the semiconductor chips separated from the wafer. Therefore, although it is possible to inspect the shape and size of the semiconductor chips separated from the wafer, it is not possible to inspect the separation surfaces of the semiconductor chips, making it difficult to accurately inspect the separation state of the semiconductor chips. Therefore, it is desired to inspect the separation surfaces of the semiconductor chips separated from the wafer and accurately inspect the separation state of the semiconductor chips.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a wafer working device and a wafer working method that are capable of inspecting the separation surfaces of semiconductor chips separated from a wafer and accurately inspecting the separation state of the semiconductor chips.

[0007] A wafer working device according to a first aspect of the present invention comprises a wafer placing section on which a sheet member on which a plurality of semiconductor chips separated from a wafer are placed is placed, an imaging section placed on the wafer placing section and which images the semiconductor chips arranged on the sheet member, and a control section which controls the imaging of the semiconductor chips by the imaging section, and the control section controls the imaging of the divided surfaces of the semiconductor chips arranged on the sheet member by the imaging section.

[0008] In the wafer working device according to the first aspect of the present invention, as described above, the control unit controls the imaging unit to capture images of the division surfaces of the semiconductor chips placed on the sheet member. This allows the division surfaces of the semiconductor chips separated from the wafer to be inspected based on images of the division surfaces of the semiconductor chips separated from the wafer, thereby enabling accurate inspection of the division state of the semiconductor chips. Furthermore, since the division state of the semiconductor chips separated from the wafer can be inspected while they are placed on the sheet member, inspection can be performed immediately after the semiconductor chips are separated. As a result, if a defect occurs during the division of the semiconductor chips, the defect can be immediately recognized.

[0009] In the wafer working device according to the first aspect, the imaging unit is preferably configured to image the division surfaces of the semiconductor chips arranged on the sheet member from an obliquely upward direction. With this configuration, even if the spacing between the semiconductor chips after division is small, the division surfaces can be easily imaged by imaging from an obliquely upward direction. Furthermore, since the division surfaces and the top surfaces of the semiconductor chips can be imaged simultaneously, the division state of the semiconductor chips can be inspected more accurately.

[0010] In the wafer working device according to the first aspect, the semiconductor chip preferably has a rectangular shape in a plan view, and the imaging unit is configured to image each side of the rectangular semiconductor chip from an oblique direction in a plan view so as to simultaneously image multiple divided surfaces of the semiconductor chip placed on the sheet member. With this configuration, multiple divided surfaces can be simultaneously imaged, thereby preventing the number of times the divided surfaces of the semiconductor chip are imaged from increasing. As a result, the divided surfaces can be inspected efficiently.

[0011] The wafer working device according to the first aspect preferably further includes a rotation drive unit that rotates the wafer mounting unit about a rotation axis in the vertical direction, and the control unit controls the imaging unit to capture images of the divided surfaces of the semiconductor chips placed on the sheet member at multiple rotation angles achieved by the rotation drive unit. With this configuration, the divided surfaces of the semiconductor chips can be captured from multiple angles using a common imaging unit, making it possible to more accurately inspect the divided state of the semiconductor chips without increasing the number of imaging units.

[0012] In the wafer working device in which the imaging unit images the divided surfaces of the semiconductor chips arranged on the sheet member from diagonally above, preferably, the imaging unit is configured to be able to simultaneously image the divided surfaces of the semiconductor chips arranged on the sheet member from a plurality of diagonally above directions, and the control unit controls the imaging unit to simultaneously image the divided surfaces of the semiconductor chips arranged on the sheet member from a plurality of diagonally above directions. With this configuration, the divided surfaces of the semiconductor chips can be simultaneously imaged from a plurality of angles, thereby preventing the imaging time of the divided surfaces of the semiconductor chips from becoming long and enabling more accurate inspection of the divided state of the semiconductor chips.

[0013] In the wafer working device in which the imaging unit images the dividing surfaces of the semiconductor chips placed on the sheet member from an obliquely upward angle, the imaging unit is preferably configured to image the semiconductor chips placed on the sheet member from an obliquely upward angle that captures the dividing surfaces at the boundaries between the sheet member and the semiconductor chips. With this configuration, the dividing surfaces from the upper surfaces of the semiconductor chips to the lower surfaces that contact the sheet member can be imaged by the imaging unit, so that the dividing state of the semiconductor chips can be inspected more accurately based on the captured image of the entire dividing surfaces of the semiconductor chips in the height direction.

[0014] The wafer working device according to the first aspect preferably further comprises a spinner including a cleaning liquid supply unit that supplies cleaning liquid to a wafer placed on a sheet member placed on the wafer placement unit and a rotation drive unit that rotates the wafer placement unit about a vertical axis of rotation, and the imaging unit is provided in the spinner. With this configuration, the semiconductor chips can be imaged and inspected in the spinner that cleans the separated semiconductor chips after wafer separation, eliminating the need for a separate inspection device.

[0015] In this case, preferably, the wafer mounting device further includes: a first moving unit that supports an imaging unit at one end thereof and includes a first arm that rotates about its other end thereof, and moves the imaging unit between an imaging position on the wafer above the wafer mounting unit and a retracted position retracted from the wafer; and a second moving unit that supports a cleaning liquid supply unit at one end thereof and includes a second arm that rotates about its other end thereof, and moves the cleaning liquid supply unit between a supply position on the wafer above the wafer mounting unit and a retracted position retracted from the wafer. With this configuration, it is possible to easily image the separated semiconductor chips by the imaging unit from above the spinner that cleans the semiconductor chips with cleaning liquid.

[0016] In the wafer working device having the first and second moving units, the rotation center at the other end of the first arm and the rotation center at the other end of the second arm are preferably located at different positions on the outer periphery of the wafer placement section, and each of the first arm and the second arm has a curved shape that is convexly curved outward from the wafer placement section. With this configuration, even if the movable angle range of each of the multiple arms is increased, the curved shape of the arms can prevent them from interfering with each other.

[0017] A method for working on a wafer according to a second aspect of the present invention divides a wafer placed on a sheet member into a plurality of semiconductor chips, and images of the divided surfaces of the divided semiconductor chips placed on the sheet member are taken.

[0018] In a second aspect of the present invention, a wafer processing method includes imaging the division surfaces of semiconductor chips placed on a sheet member as described above. This allows the division surfaces of the semiconductor chips separated from the wafer to be inspected based on the images of the division surfaces of the semiconductor chips separated from the wafer, thereby providing a wafer processing method capable of accurately inspecting the division state of the semiconductor chips. Furthermore, since the division state of the semiconductor chips separated from the wafer can be inspected while they are placed on the sheet member, inspection can be performed immediately after the semiconductor chips are separated. As a result, a wafer processing method can be provided that allows for immediate recognition of defects that may occur during the division of the semiconductor chips.

[0019] According to the present invention, as described above, the separation surfaces of the semiconductor chips separated from the wafer can be inspected, and the separation state of the semiconductor chips can be inspected with high accuracy.

[0020] FIG. 1 is a schematic diagram showing an overview of a semiconductor wafer processing system provided with a dicing apparatus and an expanding apparatus according to an embodiment. FIG. 2 is a plan view showing a tape application apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 3 is a plan view showing a grinding apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 4 is a plan view showing a tape replacement apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 5 is a plan view showing a grooving apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 6 is a plan view showing a dicing apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 7 is a plan view showing an expanding apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 8 is a flowchart showing a semiconductor chip manufacturing process of a semiconductor wafer processing system according to an embodiment. FIG. 9 is a plan view showing a spinner of an expanding apparatus of a semiconductor wafer processing system according to an embodiment. FIG. 10 is a side view for explaining imaging of a semiconductor chip of a semiconductor wafer processing system according to an embodiment. FIG. 11 is a plan view for explaining imaging of a semiconductor chip of a semiconductor wafer processing system according to an embodiment. FIG. 12 is a diagram showing an example of an image of a semiconductor chip captured in a semiconductor wafer processing system according to an embodiment. FIG. 13 is a diagram showing an imaging unit for imaging a semiconductor chip of a semiconductor wafer processing system according to a modified embodiment.

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] The configuration of a semiconductor wafer processing system 100 according to an embodiment of the present invention will be described with reference to FIGS.

[0023] (Semiconductor Wafer Processing System) As shown in FIG. 1, the semiconductor wafer processing system 100 is an apparatus for processing a wafer We. The semiconductor wafer processing system 100 is configured to form a modified portion in the wafer We and to divide the wafer We along the modified portion to form multiple semiconductor chips Ch. Here, the wafer We is a thin, circular plate formed from crystals of a semiconductor material that is the material for semiconductor integrated circuits. The processing in the semiconductor wafer processing system 100 forms a modified portion inside the wafer We along a dividing line. In other words, the wafer We is processed so that it can be divided along the dividing line. Here, the modified portion refers to cracks, voids, etc. formed inside the wafer We by the laser Ld.

[0024] Specifically, the semiconductor wafer processing system 100 includes a tape application device 1, a grinding device 2, a tape replacement device 3, a grooving device 4, a dicing device 5, and an expanding device 6.

[0025] As shown in FIG. 1, in the semiconductor wafer processing system 100, a wafer We is processed in the following order: a tape applying device 1, a grinding device 2, a tape replacing device 3, a grooving device 4, a dicing device 5, and an expanding device 6.

[0026] <Taping Apparatus> The tape applying apparatus 1 is configured to apply a protective tape Tb to the circuit surface of a wafer We (see FIG. 1).

[0027] Specifically, as shown in FIG. 2 , the tape application device 1 includes a cassette storage unit 11, a robot hand 12, a transport mechanism 13, and a protective tape application unit 14. The cassette storage unit 11 is configured to store frames Rf, wafers We, and wafers We with frames Rf attached thereto. The robot hand 12 is configured to transport each of the frames Rf and wafers We from the cassette storage unit 11 to the transport mechanism 13. The robot hand 12 is configured to transport the wafers We with frames Rf attached thereto from the transport mechanism 13 to the cassette storage unit 11. The transport mechanism 13 is configured to transport the wafers We to a position in the protective tape application unit 14 where the protective tape Tb can be applied. The protective tape application unit 14 is configured to apply the protective tape Tb to the wafers We transported by the transport mechanism 13 and to apply the frames Rf to the protective tape Tb.

[0028] <Grinding Device> The grinding device 2 is configured to reduce the thickness of the wafer We by grinding the wafer We from the surface opposite to the circuit surface (see FIG. 1).

[0029] Specifically, as shown in FIG. 3, the grinding device 2 includes a first cassette unit 21, a robot hand 22, a plurality of suction holding units 23, a plurality of grinding units 24, a finish polishing unit 25, a crystal defect forming unit 26, a second cassette unit 27, and a single rotating table unit 28.

[0030] The first cassette unit 21 is configured to accommodate wafers We before grinding. The robot hand 22 is configured to transport the wafer We, to which the frame Rf is attached, from the first cassette unit 21 to one of the plurality of suction holders 23 that is closest to the first cassette unit 21. The robot hand 22 is also configured to transport the wafer We, to which the frame Rf is attached, after grinding, to the second cassette unit 27 from one of the plurality of suction holders 23 that is closest to the second cassette unit 27. The plurality of suction holders 23 are configured to suck and hold the wafer We, to which the frame Rf is attached, to the protective tape Tb.

[0031] The plurality of grinding units 24 are configured to grind the back surface of the wafer We, which is the side opposite the circuit surface, in stages. The plurality of grinding units 24 include a rough grinding unit 24a, a finish grinding unit 24b, and a fine grinding unit 24c. The rough grinding unit 24a is configured to grind the back surface of the wafer We with a first abrasive having a first particle diameter. The finish grinding unit 24b is configured to grind the back surface of the wafer We with a second abrasive having a second particle diameter smaller than the first particle diameter. The fine grinding unit 24c is configured to grind the back surface of the wafer We with a third abrasive having a third particle diameter smaller than the second particle diameter.

[0032] The finish polishing unit 25 is configured to polish the back surface of the wafer We ground by the multiple grinding units 24. The crystal defect forming unit 26 is configured to form minute crystal defects on the back surface of the wafer We ground by the finish polishing unit 25. The crystal defect forming unit 26 is configured to perform a so-called gettering operation. The second cassette unit 27 is configured to accommodate the wafer We on which crystal defects have been formed in the crystal defect forming unit 26. Each of the multiple suction holding units 23 is configured to rotate and move to positions corresponding to the single rotary table unit 28, the multiple grinding units 24, the finish polishing units 25, and the crystal defect forming unit 26, respectively.

[0033] <Tape Replacing Device> The tape replacing device 3 is configured to, after the grinding device 2 grinds the wafer We, apply an expanding tape Te to the surface of the wafer We opposite the circuit surface, and peel off the protective tape Tb applied to the circuit surface of the wafer We (see FIG. 1). The expanding tape Te is an example of a "sheet member" in the claims.

[0034] Specifically, as shown in FIG. 4, the tape replacement device 3 includes a cassette storage section 31, a robot hand 32, a conveying mechanism 33, an expanding tape application section 34, and a protective tape peeling section (not shown).

[0035] The cassette storage section 31 is configured to be able to store a wafer We attached to a protective tape Tb together with a frame Rf, and a wafer We attached to an expanding tape Te together with a frame Rf.

[0036] The robot hand 32 is configured to transport the wafer We, which is attached to the protective tape Tb together with the frame Rf, from the cassette storage unit 31 to the transport mechanism 33. The transport mechanism 33 is configured to transport the wafer We, which is attached to the protective tape Tb together with the frame Rf, to the expanding tape applying unit 34. The expanding tape applying unit 34 is configured to apply the expanding tape Te to the surface of the frame Rf opposite to the surface to which the protective tape Tb is attached, thereby applying the frame Rf and the wafer We to the protective tape Tb and the expanding tape Te, respectively.

[0037] <Grooving Device> The grooving device 4 is configured to irradiate a laser beam Lg along the streets Ws between the semiconductor chips Ch on the circuit surface of the wafer We, to which the frame Rf and protective tape Tb are not attached, to separate the insulating film and the test pattern before the dicing device 5 forms modified portions on the wafer We. Here, the laser beam Lg is light with a wavelength shorter than that of the infrared region. The insulating film is the interlayer insulating film of the wafer We. The insulating film is formed of a low-k material with a relatively low dielectric constant as an interlayer insulating film material. The test pattern is a test conductive pattern for performing a function test on the semiconductor chips Ch on the wafer We. The test pattern is a so-called TEG (Test Element Group).

[0038] Specifically, as shown in FIG. 5 , the grooving device 4 includes a cassette unit 41, a laser irradiation unit 42, and a circuit surface coating and cleaning unit 43. The cassette unit 41 is configured to accommodate a wafer We to which a frame Rf and a protective tape Tb are not attached. The laser irradiation unit 42 is configured to irradiate a laser Lg that separates the insulating film and the test pattern on the wafer We. The circuit surface coating and cleaning unit 43 is configured to coat the circuit surface of the wafer We before separating the insulating film and the test pattern, and to clean the circuit surface of the wafer We after separating the insulating film and the test pattern.

[0039] <Dicing Apparatus> The dicing apparatus 5 is configured to form a modified portion inside the wafer We for dividing the wafer We (see FIG. 1).

[0040] Specifically, as shown in FIG. 6 , the dicing apparatus 5 includes a dicing unit 50, a cassette unit 51, and a wafer transport unit 52. The dicing unit 50 is configured to form modified areas by irradiating the wafer We with a laser beam Ld (see FIG. 1 ) having a wavelength that is transparent to the wafer We along streets Ws (division lines). Here, the laser beam Ld is light having a wavelength in the near-infrared region. The dicing apparatus 5 is also configured to form modified areas by irradiating the wafer We with the laser beam Ld while moving and rotating the wafer We. The cassette unit 51 is configured to accommodate multiple wafers We attached to protective tape Tb together with frames Rf. The wafer transport unit 52 is configured to transport the wafers We attached to protective tape Tb together with frames Rf between the cassette unit 51 and the dicing unit 50.

[0041] The expanding device 6 is configured to attach an expanding tape Te to the surface of the wafer We opposite the circuit surface, and then expand the expanding tape Te to divide the wafer We into a plurality of semiconductor chips Ch (see FIG. 1). The expanding device 6 is an example of a "wafer working device" in the claims.

[0042] 7, the expanding device 6 includes a cassette unit 601, a lift-up hand unit 602, a suction hand unit 603, a cooling unit 605, an expanding unit 606, an expansion maintaining member 607, a heat shrink unit, an ultraviolet ray irradiation unit, a squeegee unit 610, and a clamp unit 611. The expanding device 6 also includes a spinner 7 for cleaning the wafer We.

[0043] The cassette unit 601 is configured to be able to store a wafer ring structure W in which a frame Rf and a wafer We are attached to an expanding tape Te. The lift-up hand unit 602 is configured to be able to remove the wafer ring structure W from the cassette unit 601. The lift-up hand unit 602 is configured to be able to store the wafer ring structure W in the cassette unit 601. The suction hand unit 603 is configured to suck the frame Rf of the wafer ring structure W from above.

[0044] The cooling unit 605 is configured to cool the expanding tape Te from below. The expanding section 606 is configured to expand the expanding tape Te of the wafer ring structure W to divide the wafer We along the streets Ws (see FIG. 1 ). The expansion maintaining member 607 is configured to press the expanding tape Te from above to prevent the expanding tape Te near the wafer We from shrinking due to heating by the heat shrink section. The heat shrink section is configured to shrink the expanding tape Te expanded by the expanding section 606 by heating while maintaining the gaps between the multiple semiconductor chips Ch. The ultraviolet irradiation section is configured to irradiate the expanding tape Te with ultraviolet light to reduce the adhesive strength of the adhesive layer of the expanding tape Te.

[0045] The squeegee unit 610 is configured to further divide the wafer We along the modified portion by locally pressing the wafer We from below after expanding the expanding tape Te. The clamp unit 611 is configured to be able to move the wafer ring structure W in the vertical direction while gripping the frame Rf of the wafer ring structure W.

[0046] (Semiconductor Chip Manufacturing Process) The overall operation of the semiconductor wafer processing system 100 will now be described with reference to FIG.

[0047] In step S1, the wafer We and the frame Rf are applied to the protective tape Tb in the tape application device 1. That is, the protective tape application unit 14 applies the protective tape Tb to the wafer We transported by the transport mechanism 13, and also applies the frame Rf to the protective tape Tb.

[0048] In step S2, the modified portion is removed from the wafer We in the grinding device 2. That is, the plurality of grinding units 24 grinds the back surface of the wafer We, which is the side opposite to the circuit surface, in stages to thin the wafer We.

[0049] In step S3, the protective tape Tb is peeled off in the tape replacing device 3, and the wafer We and the frame Rf are attached to the expanding tape Te. That is, the expanding tape attaching unit 34 peels off the protective tape Tb from the wafer We with the frame Rf, and then attaches the expanding tape Te to the wafer We from which the protective tape Tb has been peeled off, and also attaches the frame Rf to the expanding tape Te.

[0050] In step S4, the insulating film and the test pattern are divided in the grooving device 4. That is, the laser irradiation unit 42 irradiates the laser Lg along the streets Ws between the semiconductor chips Ch on the circuit surface of the wafer We that is not attached to the protective tape Tb together with the frame Rf, thereby dividing the insulating film and the test pattern.

[0051] In step S5, modified portions are formed on the wafer We in the dicing device 5. That is, the dicing unit 50 forms modified portions by irradiating the wafer We with a laser Ld (see FIG. 1) along the streets Ws.

[0052] In step S6, the expanding tape Te is expanded in the expanding device 6, and the wafer We is divided into a plurality of semiconductor chips Ch. That is, the clamp unit 611 is lowered while holding the frame Rf, and the expanding tape Te that is in contact with the expanding unit 606 is pulled downward, thereby expanding the expanding tape Te. As a result, the expanding tape Te is divided along the cracks formed in the streets Ws of the wafer We due to the tensile force generated in the expanding tape Te by the expansion, and the wafer We is divided into a plurality of semiconductor chips Ch.

[0053] After step S6, the semiconductor chip manufacturing process ends.

[0054] (Inspection of the division state of semiconductor chips) In the semiconductor wafer processing system 100, after the wafer We is divided into multiple semiconductor chips Ch in the expanding device 6, the division surfaces of the divided semiconductor chips Ch can be imaged to inspect the division state of the semiconductor chips Ch.

[0055] Specifically, in the spinner 7 of the expanding device 6, an image of the wafer We on the expanding tape Te is taken, and the state of division of the semiconductor chips Ch is inspected.

[0056] The inspection of the division state of the semiconductor chips Ch is performed by a control unit 71 (see FIG. 9). The control unit 71 is configured by, for example, a computer. The control unit 71 includes a processing unit such as a CPU (Central Processing Unit) and a storage unit such as a memory, and performs control processing by executing a program using the processing unit.

[0057] The control unit 71 captures an image of the wafer We on the expanding tape Te and performs a process of inspecting the division state of the semiconductor chips Ch based on the captured image. The control unit 71 controls the imaging units 73a to 73d to capture the images of the semiconductor chips Ch. The control unit 71 also performs an inspection based on whether the ends (upper and lower ends) of the division surfaces of the semiconductor chips Ch are straight (whether the cross section is within a predetermined width range). The control unit 71 issues a warning or an error if the ends (upper and lower ends) of the division surfaces of the semiconductor chips Ch are not straight (if they meander beyond the predetermined range). The control unit 71 also performs an inspection based on whether the semiconductor chips Ch are separated by a predetermined distance from adjacent semiconductor chips Ch after being divided. The control unit 71 issues a warning or an error if the distance between adjacent semiconductor chips Ch is not the predetermined distance. The control unit 71 also performs an inspection based on whether the length of one side of the divided semiconductor chips Ch is within a predetermined range. If the length of one side of the divided semiconductor chip Ch is smaller than a predetermined range, the control unit 71 judges that the semiconductor chip Ch is missing and issues a warning or an error. If the length of one side of the divided semiconductor chip Ch is larger than a predetermined range, the control unit 71 judges that the semiconductor chip Ch is not divided and issues a warning or an error.

[0058] The control unit 71 also performs inspections for each street (a portion between adjacent semiconductor chips Ch) that divides the semiconductor chip Ch. The divided semiconductor chips Ch have a substantially rectangular shape in a plan view. The streets are arranged to separate the rectangular semiconductor chips Ch.

[0059] After the spinner 7 processes the wafer We into a plurality of semiconductor chips Ch, it supplies a cleaning liquid to the surface of the wafer We and rotates the wafer to clean it. As shown in FIG. 9 , the spinner 7 includes a wafer placement unit 72, imaging units 73 a, 73 b, 73 c, and 73 d, a rotation drive unit 74, a cleaning liquid supply unit 75, and a hot air supply unit 76.

[0060] The expanding tape Te, on which a plurality of semiconductor chips Ch separated from the wafer We are arranged, is placed on the wafer placing section 72. The wafer placing section 72 also holds a frame Rf that holds the expanding tape Te. This allows the wafer placing section 72 to hold the plurality of separated semiconductor chips Ch rotatably around a vertical axis of rotation.

[0061] The imaging units 73a to 73d image the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te from an obliquely upward direction. Specifically, as shown in Fig. 10, the imaging units 73a to 73d image the semiconductor chips Ch arranged on the expanding tape Te from an obliquely upward direction that allows the entire division surfaces of the semiconductor chips Ch to be imaged. In other words, the imaging units 73a to 73d are configured to image the semiconductor chips Ch arranged on the expanding tape Te from an obliquely upward angle that allows the division surfaces at the boundaries between the expanding tape Te and the semiconductor chips Ch to be captured.

[0062] 11, the imaging units 73a to 73d are configured to capture images of each side of the rectangular semiconductor chip Ch from an oblique direction in a plan view so as to simultaneously capture images of multiple divided surfaces of the semiconductor chip Ch arranged on the expanding tape Te. Note that the imaging units 73a to 73d may capture images of each side of the rectangular semiconductor chip Ch from a direction parallel to or perpendicular to the side in a plan view.

[0063] 9 , the imaging unit 73a is movably supported by a first moving unit 732a. The first moving unit 732a supports the imaging unit 73a at one end and includes an arm 731a that rotates around the other end. The first moving unit 732a moves the imaging unit 73a between an imaging position on the wafer We and a retracted position retracted from the wafer We above the wafer placement unit 72. The arm 731a rotates around a rotation axis A1 located on the outer periphery of the wafer placement unit 72. The arm 731a has a curved shape that curves convexly outward from the wafer placement unit 72.

[0064] The imaging unit 73b is movably supported by a first moving unit 732b. The first moving unit 732b supports the imaging unit 73b at one end and includes an arm 731b that rotates around the other end. The first moving unit 732b moves the imaging unit 73b above the wafer placement unit 72 between an imaging position on the wafer We and a retracted position retracted from the wafer We. The arm 731b rotates around a rotation axis A2 located on the outer periphery of the wafer placement unit 72. The arm 731b has a curved shape that curves convexly outward from the wafer placement unit 72.

[0065] The imaging unit 73c is movably supported by a first moving unit 732c. The first moving unit 732c supports the imaging unit 73c at one end and includes an arm 731c that rotates around the other end. The first moving unit 732c moves the imaging unit 73c above the wafer placement unit 72 between an imaging position on the wafer We and a retracted position retracted from the wafer We. The arm 731c rotates around a rotation axis A3 located on the outer periphery of the wafer placement unit 72. The arm 731c has a curved shape that curves convexly outward from the wafer placement unit 72.

[0066] The imaging unit 73d is movably supported by a first moving unit 732d. The first moving unit 732d supports the imaging unit 73d at one end and includes an arm 731d that rotates around the other end. The first moving unit 732d also moves the imaging unit 73d between an imaging position on the wafer We and a retracted position retracted from the wafer We above the wafer placement unit 72. The arm 731d rotates around a rotation axis A4 located on the outer periphery of the wafer placement unit 72. The arm 731d has a curved shape that curves convexly outward from the wafer placement unit 72.

[0067] Each of the imaging units 73a to 73d images the wafer We from an obliquely upward direction while moving between the outer and inner radial positions on the wafer We. For example, as shown in FIG. 9, the imaging unit 73a captures images at positions B1 to B7, ranging from the outer radial position B1 to the inner radial position B7. The number of imaging positions is set based on the size of the wafer We and the angle of view of the imaging unit 73a, so that all images can be captured in the radial direction. Similarly, the imaging units 73b to 73d capture images at multiple positions in the radial direction.

[0068] The imaging units 73a to 73d are arranged so that their imaging directions are different from one another with respect to the radial direction of the wafer placement unit 72. For example, the imaging unit 73a is arranged so that its imaging direction is along the radially inward direction. The imaging unit 73b is arranged so that its imaging direction is oriented rightward with respect to the radially inward direction. The imaging unit 73c is arranged so that its imaging direction is along the radially outward direction. The imaging unit 73d is arranged so that its imaging direction is oriented leftward with respect to the radially inward direction. This allows the multiple imaging units 73a to 73d to capture images of the wafer We on the wafer placement unit 72 from different angles.

[0069] The rotation drive unit 74 rotates the wafer placement unit 72 around a vertical rotation axis, and the imaging units 73a to 73d capture images of the wafer We at multiple rotation positions where the wafer placement unit 72 rotates the wafer We.

[0070] The cleaning liquid supply unit 75 supplies cleaning liquid to the wafer We placed on the expanding tape Te placed on the wafer placement unit. For example, the cleaning liquid supply unit 75 supplies pure water as the cleaning liquid to the wafer We. The cleaning liquid supply unit 75 is movably supported by a second moving unit 752. The second moving unit 752 supports the cleaning liquid supply unit 75 at one end and includes an arm 751 that rotates around the other end. The second moving unit 752 also moves the cleaning liquid supply unit 75 above the wafer placement unit 72 between a supply position on the wafer We and a retracted position retracted from the wafer We. The arm 751 rotates around a rotation axis A5 located on the outer periphery of the wafer placement unit 72. The arm 751 has a curved shape that curves convexly outward from the wafer placement unit 72.

[0071] The hot air supply unit 76 supplies hot air to the wafer We placed on the expanding tape Te placed on the wafer placement unit 72 to dry the cleaning liquid. The hot air supply unit 76 is movably supported by a moving unit 762. The moving unit 762 supports the hot air supply unit 76 at one end and includes an arm 761 that rotates around the other end. The moving unit 762 also moves the hot air supply unit 76 above the wafer placement unit 72 between a hot air supply position above the wafer We and a retracted position retracted from the wafer We. The arm 761 rotates around a rotation axis A6 located on the outer periphery of the wafer placement unit 72. The arm 761 has a curved shape that curves convexly outward from the wafer placement unit 72.

[0072] Furthermore, the rotation axes (rotation centers) of the arms 731a, 731b, 731c, 731d, 751, and 761 are disposed at different positions on the outer periphery of the wafer placement unit 72. Specifically, the rotation axes (rotation centers) of the arms 731a, 731b, 731c, 731d, 751, and 761 are disposed at approximately equal angular intervals (60 degrees) on the outer periphery of the wafer placement unit 72.

[0073] In this embodiment, the control unit 71 controls the imaging units 73a to 73d to capture images of the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te. Specifically, the control unit 71 controls the imaging units 73a to 73d to capture images of the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te from diagonally above.

[0074] Furthermore, the control unit 71 controls the imaging units 73a to 73d to capture images of the divided surfaces of the semiconductor chips Ch arranged on the expanding tape Te at multiple rotation angles to which the wafer placing unit 72 is rotated by the rotation drive unit 74. Specifically, the control unit 71 controls the imaging units 73a to 73d to capture images of the divided surfaces of the semiconductor chips Ch arranged on the expanding tape Te while rotating the wafer placing unit 72 by the rotation drive unit 74.

[0075] The control unit 71 also inspects the division state based on the imaging results of imaging the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te. The division state inspection includes, for example, an inspection as to whether or not there are any undivided semiconductor chips Ch, an inspection as to whether or not the upper surfaces of the divided semiconductor chips Ch have been divided without meandering, an inspection as to whether or not there is any chipping on the upper surfaces of the divided semiconductor chips Ch, an inspection as to whether or not there is any foreign matter on the upper surfaces of the divided semiconductor chips Ch, an inspection as to whether or not the lower surfaces of the divided semiconductor chips Ch have been divided without meandering, an inspection as to whether or not there is any chipping on the lower surfaces of the divided semiconductor chips Ch, an inspection as to whether or not the state of the divided surfaces of the divided semiconductor chips Ch is normal, etc.

[0076] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0077] In this embodiment, as described above, the control unit 71 controls the imaging units 73a to 73d to capture images of the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te. This allows the division surfaces of the semiconductor chips Ch separated from the wafer We to be inspected based on images of the division surfaces of the semiconductor chips Ch separated from the wafer We, thereby enabling accurate inspection of the division state of the semiconductor chips Ch. Furthermore, since the division state of the semiconductor chips Ch separated from the wafer We can be inspected while they are arranged on the expanding tape Te, inspection can be performed immediately after the semiconductor chips Ch are separated. As a result, if a defect occurs during the division of the semiconductor chips Ch, the defect can be immediately recognized.

[0078] Furthermore, in this embodiment, as described above, the imaging units 73a to 73d are configured to image the division surfaces of the semiconductor chips Ch arranged on the expanding tape Te from an obliquely upward direction. This makes it possible to easily image the division surfaces by imaging from an obliquely upward direction, even when the spacing between the semiconductor chips Ch after division is small. Furthermore, since the division surfaces and the top surfaces of the semiconductor chips Ch can be imaged simultaneously, the division state of the semiconductor chips Ch can be inspected more accurately.

[0079] Furthermore, in this embodiment, as described above, the semiconductor chip Ch has a rectangular shape in a plan view, and the imaging units 73a to 73d are configured to image each side of the rectangular semiconductor chip Ch from an oblique direction in a plan view so as to simultaneously image multiple divided surfaces of the semiconductor chip Ch arranged on the expanding tape Te. This allows multiple divided surfaces to be imaged simultaneously, thereby preventing the number of times the divided surfaces of the semiconductor chip Ch are imaged from increasing. As a result, the divided surfaces can be inspected efficiently.

[0080] Furthermore, in this embodiment, as described above, a rotation drive unit 74 is provided that rotates the wafer mounting unit 72 about a vertical rotation axis. Furthermore, the control unit 71 controls the imaging units 73a to 73d to capture images of the division surfaces of the semiconductor chips Ch placed on the expanding tape Te at multiple rotation angles to which the wafer mounting unit 72 is rotated by the rotation drive unit 74. This allows the common imaging units 73a to 73d to capture images of the division surfaces of the semiconductor chips Ch from multiple angles, making it possible to more accurately inspect the division state of the semiconductor chips Ch without increasing the number of imaging units 73a to 73d.

[0081] Furthermore, in this embodiment, as described above, the imaging units 73a to 73d are configured to image the semiconductor chips Ch placed on the expanding tape Te from an obliquely upward angle that captures the dividing surface at the boundary between the expanding tape Te and the semiconductor chips Ch. This allows the imaging units 73a to 73d to image the dividing surface from the top surface of the semiconductor chips Ch to the bottom surface that contacts the expanding tape Te, so that the divided state of the semiconductor chips Ch can be inspected with even greater precision based on the captured image of the entire dividing surface of the semiconductor chips Ch in the height direction.

[0082] Furthermore, in this embodiment, as described above, a spinner 7 is provided that includes a cleaning liquid supply unit 75 that supplies cleaning liquid to the wafer We placed on the expanding tape Te placed on the wafer placement unit 72, and a rotation drive unit 74 that rotates the wafer placement unit 72 about a vertical axis of rotation. Also, the imaging units 73a to 73d are provided on the spinner 7. As a result, the semiconductor chips Ch can be imaged and inspected in the spinner 7 that cleans the separated semiconductor chips Ch after dividing the wafer We, eliminating the need to provide a separate device for inspection.

[0083] Furthermore, in this embodiment, as described above, first moving units 732a to 732d are provided, which support imaging units 73a to 73d at one end and include arms 731a to 731d that rotate about the other end, and which move imaging units 73a to 73d between an imaging position on the wafer We and a retracted position retracted from the wafer We above the wafer placement unit 72. Also, a second moving unit 752 is provided, which supports a cleaning liquid supply unit 75 at one end and includes an arm 751 that rotates about the other end, and which moves cleaning liquid supply unit 75 between a supply position on the wafer We and a retracted position retracted from the wafer We above the wafer placement unit 72. This makes it possible to easily capture images of the divided semiconductor chips Ch by imaging units 73a to 73d from above the spinner 7 that cleans the semiconductor chips Ch with cleaning liquid.

[0084] Furthermore, in this embodiment, as described above, the rotation center on the other end of each of the arms 731a to 731d and the rotation center on the other end of the arm 751 are located at different positions on the outer periphery of the wafer placement section 72, and each of the arms 731a to 731d and the arm 751 has a curved shape that is convexly curved outward from the wafer placement section 72. This makes it possible to prevent the curved shapes of the arms from interfering with each other even if the movable angle range of each of the multiple arms is increased.

[0085] [Modifications] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above-mentioned embodiments, and further includes all modifications (modifications) within the meaning and scope of the claims.

[0086] For example, in the above-described embodiment, an example of a configuration in which multiple independently movable imaging units are used to image semiconductor chips arranged on an expanding tape (sheet member) from multiple diagonally upward directions is described. However, the present invention is not limited to this. In the present invention, as shown in the example of FIG. 13 , an imaging unit 81 capable of imaging from multiple diagonally upward directions may be used to image semiconductor chips arranged on a sheet member from multiple diagonally upward directions. That is, the imaging unit 81 may be configured to simultaneously image from multiple diagonally upward directions, and the control unit 71 may control the imaging unit 81 to image the division surfaces of semiconductor chips arranged on the expanding tape Te (sheet member) from multiple diagonally upward directions. This allows the division surfaces of semiconductor chips Ch to be simultaneously imaged from multiple angles, thereby preventing the imaging time of the division surfaces of semiconductor chips Ch from increasing and more accurately inspecting the division state of semiconductor chips Ch.

[0087] In addition, in a configuration in which the imaging unit 81 can simultaneously capture images from multiple directions from diagonally above, multiple cameras 811, 812, 813, and 814 may be provided so that the imaging directions are different from each other, as shown in Fig. 13. Alternatively, a common camera may be provided, and the field of view may be divided by an optical system including mirrors and lenses, so that images are captured simultaneously from multiple imaging directions by the common camera (image sensor).

[0088] In the above embodiment, an example of a configuration in which an imaging unit that images semiconductor chips placed on the expanding tape (sheet member) is provided in a spinner that cleans wafers is shown, but the present invention is not limited to this. In the present invention, an imaging unit that images semiconductor chips placed on the sheet member may be provided in a post-expanding inspection device that is provided separately from the spinner.

[0089] Furthermore, although an example of a configuration in which an imaging unit that images semiconductor chips arranged on the expanding tape (sheet member) is provided in the expanding device has been shown, the present invention is not limited to this. In the present invention, an imaging unit that images semiconductor chips arranged on the sheet member may be provided in a post-expansion inspection device that is provided separately from the expanding device.

[0090] In the above embodiment, an example of a configuration in which the imaging unit that captures images of semiconductor chips placed on the expanding tape (sheet member) is moved by rotating is shown, but the present invention is not limited to this. In the present invention, the imaging unit that captures images of semiconductor chips placed on the sheet member may be provided in a fixed position. Furthermore, the imaging unit may be moved by a mechanism that can move linearly in both the vertical and horizontal directions.

[0091] In the above embodiment, an example of a configuration in which four imaging units are provided to capture images of semiconductor chips arranged on the expanding tape (sheet member) is shown, but the present invention is not limited to this. In the present invention, three or less, or five or more imaging units may be provided to capture images of semiconductor chips arranged on the sheet member.

[0092] DESCRIPTION OF SYMBOLS 6 Expanding device (wafer working device) 7 Spinner 71 Control unit 72 Wafer placing unit 73a, 73b, 73c, 73d Imaging unit 74 Rotation drive unit 75 Cleaning liquid supply unit 731a, 731b, 731c, 731d Arm (first arm) 732a, 732b, 732c, 732d First moving unit 751 Arm (second arm) 752 Second moving unit Ch Semiconductor chip Te Expanding tape (sheet member) We Wafer

Claims

1. A wafer working device comprising: a wafer placing section on which a sheet member on which a plurality of semiconductor chips separated from a wafer are placed; an imaging section placed on the wafer placing section and which images the semiconductor chips placed on the sheet member; and a control section which controls the imaging of the semiconductor chips by the imaging section, wherein the control section controls the imaging section to image the divided surfaces of the semiconductor chips placed on the sheet member.

2. The wafer working device according to claim 1, wherein said imaging section is configured to image the division surface of said semiconductor chip placed on said sheet member from obliquely above.

3. A wafer working device as described in claim 1, wherein the semiconductor chip has a rectangular shape in a plan view, and the imaging unit is configured to image each side of the rectangular semiconductor chip from an oblique direction in a plan view so as to simultaneously image multiple divided surfaces of the semiconductor chip arranged on the sheet member.

4. A wafer working device as described in claim 1, further comprising a rotation drive unit that rotates the wafer mounting unit about a vertical axis of rotation, wherein the control unit controls the imaging unit to capture images of the parting surface of the semiconductor chip arranged on the sheet member at multiple rotation angles reached by the rotation drive unit when the wafer mounting unit is rotated by the rotation drive unit.

5. A wafer working device as described in claim 2, wherein the imaging unit is configured to be capable of simultaneously capturing images from multiple directions from diagonally above, and the control unit controls the imaging unit to capture images of the dividing surface of the semiconductor chip arranged on the sheet member from multiple directions from diagonally above.

6. A wafer working device as described in claim 2, wherein the imaging unit is configured to image the semiconductor chip placed on the sheet member from an obliquely upward angle that captures the dividing surface at the boundary between the sheet member and the semiconductor chip.

7. A wafer working device as described in claim 1, further comprising a spinner including a cleaning liquid supply unit that supplies cleaning liquid to the wafer placed on the sheet member placed on the wafer placement unit, and a rotation drive unit that rotates the wafer placement unit about a vertical rotation axis, wherein the imaging unit is provided on the spinner.

8. A wafer working device as described in claim 7, further comprising: a first moving unit including a first arm supporting the imaging unit at one end side and rotating around the other end side, and moving the imaging unit between an imaging position on the wafer above the wafer mounting unit and a retracted position retracted from the wafer; and a second moving unit including a second arm supporting the cleaning liquid supply unit at one end side and rotating around the other end side, and moving the cleaning liquid supply unit between a supply position on the wafer above the wafer mounting unit and a retracted position retracted from the wafer.

9. A wafer working device as described in claim 8, wherein a rotation center on the other end side of the first arm and a rotation center on the other end side of the second arm are disposed at different positions on the outer periphery of the wafer placement portion, and each of the first arm and the second arm has a curved shape that is convexly curved outwardly of the wafer placement portion.

10. A method of working on a wafer, comprising: dividing a wafer placed on a sheet member into a plurality of semiconductor chips; and imaging the division surfaces of the divided semiconductor chips placed on the sheet member.

Images