Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer. A substrate processing apparatus (1) comprises: a substrate-holding part (5); a processing head (10); a tape winding reel (22); a winding reel rotation mechanism (32); a tape outside diameter acquisition mechanism (70) for acquiring the outside diameter of a wound body (36) of the processing tape (2) wound around the tape winding reel (22); a rotation torque calculation unit (72) for calculating, on the basis of the outside diameter, the rotation torque necessary for the tape winding reel (22) to wind the processing tape (2) with a predetermined tape tensile force; and an operation control unit (60) for controlling the operation of the winding reel rotation mechanism (32). The operation control unit (60) is configured to cause the winding reel rotation mechanism (32) to rotate the tape winding reel (22) with the calculated rotation torque.

Description

Substrate processing apparatus and substrate processing method

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a wafer.

[0002] In recent years, managing the surface condition of substrates has attracted attention from the perspective of improving yield in semiconductor device manufacturing. During the semiconductor device manufacturing process, various materials are deposited on silicon wafers. As a result, unwanted films and surface roughness form around the edges of the substrate. In recent years, a method of transporting a substrate by holding only the edges with an arm has become common. Under these circumstances, the unwanted films remaining on the edges peel off during various processes and adhere to devices formed on the substrate, reducing yield. Therefore, to remove the unwanted films from the edges of the substrate, the edges of the substrate are polished using a polishing device.

[0003] This type of polishing apparatus polishes the peripheral edge of a substrate by sliding a polishing tape against the peripheral edge of the substrate. More specifically, the substrate is held by a substrate holder and rotated, while the polishing head presses the polishing tape against the peripheral edge of the substrate, polishing the peripheral edge of the substrate. During polishing of the substrate, the polishing tape is fed by a processing tape supply mechanism from a tape supply reel to a tape take-up reel via the polishing head.

[0004] JP 2008-87136 A JP 2018-46189 A

[0005] The outer diameter of the abrasive tape wound on the take-up reel increases as the amount of abrasive tape used increases. When a thick or long abrasive tape is used, the difference in the outer diameter of the abrasive tape at the start and end of winding becomes significantly larger.

[0006] Typically, a tape take-up reel rotates with a constant rotational torque, and the tape tension required to wind up the abrasive tape is inversely proportional to the outer diameter of the wound abrasive tape. Therefore, as the outer diameter of the abrasive tape increases, the tape tension decreases, and the tape take-up reel may not be able to properly wind the abrasive tape. One option is to rotate the tape take-up reel with a large, constant rotational torque so that the abrasive tape can be properly wound up when the outer diameter of the abrasive tape increases. However, a large rotational torque imparts excessive tape tension, especially at the beginning of winding the abrasive tape, placing a load on the abrasive tape. As a result, problems such as damage to the abrasive tape and an impact on the feed speed of the abrasive tape may occur.

[0007] Therefore, the present invention provides a substrate processing apparatus and a substrate processing method that can wind a processing tape onto a tape take-up reel with an appropriate tape tension even when the outer diameter of the processing tape roll changes significantly.

[0008] In one aspect, a substrate processing apparatus is provided, comprising: a substrate holding unit that holds and rotates a substrate; a processing head that processes the substrate by pressing a processing tape against the substrate; a tape take-up reel that takes up the processing tape used to process the substrate; a take-up reel rotation mechanism that rotates the tape take-up reel; a tape outer diameter acquisition mechanism that acquires the outer diameter of the processing tape wound around the tape take-up reel; a rotational torque calculation unit that calculates, based on the acquired outer diameter, the rotational torque required for the tape take-up reel to wind up the processing tape with a predetermined tape tension; and an operation control unit that controls the operation of the take-up reel rotation mechanism, wherein the operation control unit is configured to give a command to the take-up reel rotation mechanism to rotate the tape take-up reel with the calculated rotational torque.

[0009] In one aspect, the tape outer diameter acquisition mechanism is an outer diameter measuring device that measures the outer diameter of the reel, and the rotational torque calculation unit is configured to calculate the rotational torque based on the measured outer diameter. In one aspect, the tape outer diameter acquisition mechanism includes a thickness measuring device that measures the thickness of the processing tape and an outer diameter calculation unit that calculates the outer diameter of the reel based on the measured thickness of the processing tape and the amount of processing tape used, and the rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter. In one aspect, the tape outer diameter acquisition mechanism includes an outer diameter calculation unit that calculates the outer diameter of the reel based on the thickness of the processing tape and the amount of processing tape used input via an input device, and the rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter. In one aspect, the processing tape is a polishing tape having a polishing surface, and the processing head is a polishing head that presses the polishing surface against the substrate to polish the substrate.

[0010] In one aspect, a substrate processing method is provided, which includes holding and rotating a substrate, pressing a processing tape against the substrate with a processing head to process the substrate, rotating a tape take-up reel with a take-up reel rotation mechanism to wind the processing tape used in processing the substrate onto the tape take-up reel, obtaining an outer diameter of the processing tape wound onto the tape take-up reel, calculating a rotational torque required for the tape take-up reel to wind the processing tape with a predetermined tape tension based on the obtained outer diameter, and rotating the tape take-up reel with the take-up reel rotation mechanism at the calculated rotational torque, thereby winding the processing tape onto the tape take-up reel.

[0011] In one aspect, acquiring the outer diameter of the reel involves measuring the outer diameter of the reel using an outer diameter measuring device, and calculating the rotational torque involves calculating the rotational torque based on the measured outer diameter. In one aspect, acquiring the outer diameter of the reel involves measuring the thickness of the processing tape using a thickness measuring device and calculating the outer diameter of the reel based on the measured thickness of the processing tape and the amount of processing tape used, and calculating the rotational torque involves calculating the rotational torque based on the calculated outer diameter. In one aspect, acquiring the outer diameter of the reel involves calculating the outer diameter of the reel based on the thickness of the processing tape and the amount of processing tape used input via an input device, and calculating the rotational torque involves calculating the rotational torque based on the calculated outer diameter. In one aspect, processing the substrate involves polishing the substrate by pressing a polishing surface of a polishing tape against the substrate with a polishing head.

[0012] The substrate processing apparatus and the substrate processing method can acquire the outer diameter of the process tape wound around the tape take-up reel, and calculate the rotational torque for winding the process tape with a predetermined appropriate tape tension based on the acquired outer diameter of the winding. As a result, even if the outer diameter of the process tape winding changes significantly, the process tape can be wound around the tape take-up reel with an appropriate tape tension.

[0013] Fig. 2 is a side view showing an embodiment of a substrate processing apparatus; Fig. 3 is a plan view of the substrate processing apparatus shown in Fig. 1; Fig. 4 is a schematic view showing an outer diameter measuring device as a processing tape supply mechanism and a tape outer diameter obtaining mechanism according to the present embodiment; Fig. 5 is a schematic view showing a state in which a processing tape is wound onto a tape take-up reel; Fig. 6 is a schematic view showing another embodiment of the tape outer diameter obtaining mechanism; Fig. 7 is a view explaining a method for calculating the outer diameter of a roll based on the measured thickness of the processing tape; Fig. 8 is a schematic view showing yet another embodiment of the tape outer diameter obtaining mechanism;

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing one embodiment of a substrate processing apparatus 1, and FIG. 2 is a plan view of the substrate processing apparatus 1 shown in FIG. 1. The substrate processing apparatus 1 of this embodiment is an apparatus for processing the peripheral portion of a substrate W such as a wafer. In this specification, the peripheral portion of the substrate W refers to an area including at least one of the bevel portion, top edge portion, and bottom edge portion of the substrate W. In one embodiment, the substrate processing apparatus 1 may be an apparatus for processing a notch of the substrate W, or an apparatus for processing the back surface of the substrate W.

[0015] As shown in Figure 1, the substrate processing apparatus 1 includes a substrate holding unit 5 that holds and rotates the substrate W, a processing head 10 that processes the substrate W by pressing a processing tape 2 against the substrate W, a processing tape supply mechanism 20 that supplies the processing tape 2 to the processing head 10 and recovers it from the processing head 10, a lower supply nozzle 41, and an upper supply nozzle 42.

[0016] Specific examples of the substrate processing apparatus 1 include a polishing apparatus that polishes a substrate W and a cleaning apparatus that cleans a substrate W. When the substrate processing apparatus 1 is a polishing apparatus, the processing tape 2 is a polishing tape having a polishing surface to which abrasive grains are fixed, and the processing head 10 is a polishing head that presses the polishing tape against the substrate W to polish the substrate W. When the substrate processing apparatus 1 is a cleaning apparatus, the processing tape 2 is a cleaning tape made of nonwoven fabric, woven fabric, knitted fabric, or the like, and the processing head 10 is a cleaning head that presses the cleaning tape against the substrate W to clean the substrate W.

[0017] In this embodiment, the substrate processing apparatus 1 includes one processing head 10, but in one embodiment, the substrate processing apparatus 1 may include two or more processing heads.

[0018] The substrate holder 5 includes a holding stage 7 that holds the substrate W by vacuum suction, a shaft 8 connected to the center of the holding stage 7, and a holding stage drive mechanism 9 that rotates and moves the holding stage 7 up and down. The holding stage drive mechanism 9 is configured to rotate the holding stage 7 about a rotation axis Cr and move it up and down along the rotation axis Cr. The axis passing through the center O1 of the substrate W coincides with the rotation axis Cr of the holding stage 7.

[0019] The processing tape supply mechanism 20 includes a tape supply reel 21 that supplies the processing tape 2 to the processing head 10, a tape take-up reel 22 that takes up the processing tape 2 that has been used to process the substrate W, and a plurality of guide rollers 24, 25, 26, and 27. The tape supply reel 21, the tape take-up reel 22, and the plurality of guide rollers 24, 25, 26, and 27 are fixed to a reel base 28.

[0020] Before being used to process a substrate W, a roll 35 of the processing tape 2 is attached to the tape supply reel 21. The processing tape 2 is fed from the tape supply reel 21 to the tape take-up reel 22 via the processing head 10. The direction of travel of the processing tape 2 is guided by guide rollers 24, 25, 26, and 27. After being used to process a substrate W, the processing tape 2 is taken up onto the tape take-up reel 22 to form the roll 36.

[0021] The processing tape supply mechanism 20 further includes a supply reel rotation mechanism 31 and a take-up reel rotation mechanism 32. The supply reel rotation mechanism 31 is connected to the tape supply reel 21, and the take-up reel rotation mechanism 32 is connected to the tape take-up reel 22. The supply reel rotation mechanism 31 is configured to apply a rotational torque to the tape supply reel 21 to rotate the tape supply reel 21. The take-up reel rotation mechanism 32 is configured to apply a rotational torque to the tape take-up reel 22 to rotate the tape take-up reel 22.

[0022] In one embodiment, each of the supply reel rotation mechanism 31 and the take-up reel rotation mechanism 32 is a combination of a motor and a motor driver that applies a voltage to the motor. The rotation torque of the motor can be changed by the voltage applied to the motor from the motor driver.

[0023] 1, the supply reel rotation mechanism 31 and the take-up reel rotation mechanism 32 rotate the tape supply reel 21 and the tape take-up reel 22 in opposite directions, thereby applying a predetermined tension to the processing tape 2. The processing tape 2 is fed at a predetermined speed by a tape feeding mechanism 18 provided in the processing head 10.

[0024] The lower supply nozzle 41 is configured to supply liquid to the lower surface of the substrate W. The upper supply nozzle 42 is configured to supply liquid to the upper surface of the substrate W. An example of a liquid supplied to the substrate W is pure water. During processing of the substrate W, the liquid is supplied from the lower supply nozzle 41 to the lower surface of the substrate W, and the liquid is supplied from the upper supply nozzle 42 to the upper surface of the substrate W.

[0025] The processing head 10 includes a pressing member 12 that presses the processing tape 2 against the peripheral edge of the substrate W, and an air cylinder (drive mechanism) 15 that moves the pressing member 12 toward the peripheral edge of the substrate W. The pressing force of the processing tape 2 against the substrate W is adjusted by controlling the air pressure supplied to the air cylinder 15. The pressing member 12 is disposed on the back side of the processing tape 2. Instead of the air cylinder 15, an electric actuator may be used as the drive mechanism that moves the pressing member 12 toward the peripheral edge of the substrate W.

[0026] 2, the substrate processing apparatus 1 further includes a tilt mechanism 50 that tilts the processing head 10 relative to the substrate holding surface 7a of the holding stage 7. The tilt mechanism 50 is connected to the processing head 10. The tilt mechanism 50 includes a tilt arm 52 connected to the processing head 10, and an arm rotation device 53 that rotates the tilt arm 52. One end of the tilt arm 52 is located at the same height as the substrate holding surface 7a of the holding stage 7, and is connected to the arm rotation device 53. The other end of the tilt arm 52 is connected to the processing head 10.

[0027] When the arm rotation device 53 rotates the tilt arm 52, the tilt mechanism 50 can tilt the entire processing head 10 at a predetermined tilt speed relative to the substrate W on the substrate holding surface 7a of the holding stage 7. Furthermore, the tilt mechanism 50 is configured to maintain the processing head 10 at a predetermined tilt angle. Note that the specific configuration of the tilt mechanism 50 is not limited to that of this embodiment, as long as it can tilt the processing head 10 relative to the substrate holding surface 7a of the holding stage 7 and the substrate W.

[0028] The holding stage drive mechanism 9 of the substrate holding unit 5, the air cylinder 15 and tape feed mechanism 18 of the processing head 10, the supply reel rotation mechanism 31 and take-up reel rotation mechanism 32 of the processing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, and the arm rotation device 53 of the tilt mechanism 50 are electrically connected to the operation control unit 60. The operations of the holding stage drive mechanism 9 of the substrate holding unit 5, the air cylinder 15 and tape feed mechanism 18 of the processing head 10, the supply reel rotation mechanism 31 and take-up reel rotation mechanism 32 of the processing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, and the arm rotation device 53 of the tilt mechanism 50 are controlled by the operation control unit 60.

[0029] The operation control unit 60 includes at least one computer. The operation control unit 60 includes a storage device 60a in which programs and the like are stored, and an arithmetic unit 60b that executes calculations according to instructions included in the programs. The storage device 60a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic unit 60b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 60 is not limited to these examples.

[0030] The peripheral edge of a substrate W is processed as follows: The substrate W to be processed is placed on the substrate holding surface 7a of the holding stage 7 of the substrate holder 5 and held by vacuum suction. The substrate holder 5 lowers the substrate W to the processing position and rotates the holding stage 7. Liquid is then supplied from the lower supply nozzle 41 and the upper supply nozzle 42. Next, the air cylinder 15 of the processing head 10 is driven to press the processing tape 2 against the peripheral edge of the substrate W with the pressing member 12, thereby processing the peripheral edge of the substrate W. During processing of the substrate W, the tilt mechanism 50 tilts the processing head 10 at a predetermined tilting speed relative to the substrate holding surface 7a of the holding stage 7. Alternatively, the tilt mechanism 50 maintains the processing head 10 at a predetermined tilt angle relative to the substrate holding surface 7a of the holding stage 7.

[0031] The substrate processing apparatus 1 further includes a tape outer diameter acquisition mechanism that acquires the outer diameter of the roll 36 of the processing tape 2 taken up on the tape take-up reel 22. As shown in FIG. 1 , in this embodiment, the tape outer diameter acquisition mechanism is an outer diameter measuring device 70 that measures the outer diameter of the roll 36 of the processing tape 2 taken up on the tape take-up reel 22.

[0032] 3 is a schematic diagram showing the processing tape supply mechanism 20 and an outer diameter measuring device 70 serving as a tape outer diameter obtaining mechanism according to this embodiment. As shown in FIG. 3 , the outer diameter measuring device 70 serving as a tape outer diameter obtaining mechanism is disposed radially outward of the reel 36 of the processing tape 2 wound around the tape take-up reel 22. The outer diameter measuring device 70 is configured to measure the outer diameter D of the reel 36 based on the distance to the surface of the reel 36 of the processing tape 2. In one embodiment, the outer diameter measuring device 70 includes a non-contact or contact displacement sensor and a signal processing unit that detects the outer diameter D of the reel 36 based on a signal output by the displacement sensor.

[0033] The specific configuration of the outer diameter measuring device 70 is not limited to the above-described embodiment, as long as it can measure the outer diameter of the roll 36 of the processing tape 2 taken up on the tape take-up reel 22. For example, the outer diameter measuring device 70 may be configured to include an image generating device that generates an image of the roll 36 of the processing tape 2, and to detect the outer diameter D of the roll 36 based on the generated image of the roll 36 of the processing tape 2.

[0034] The substrate processing apparatus 1 further includes a rotational torque calculation unit 72 that calculates the rotational torque required for the tape take-up reel 22 to take up the processing tape 2 at a predetermined tape tension, based on the outer diameter D of the winding 36 of the processing tape 2 acquired by the tape outer diameter acquisition mechanism. In this embodiment, the rotational torque calculation unit 72 is configured to calculate the rotational torque required for the tape take-up reel 22 to take up the processing tape 2 at a predetermined tape tension, based on the outer diameter D of the winding 36 of the processing tape 2 measured by the outer diameter measurement device 70.

[0035] The rotational torque calculation unit 72 is electrically connected to the tape outer diameter acquisition mechanism, and the outer diameter D of the winding 36 of the processing tape 2 acquired by the tape outer diameter acquisition mechanism is sent to the rotational torque calculation unit 72. In this embodiment, the rotational torque calculation unit 72 is electrically connected to the outer diameter measurement device 70, and the outer diameter D of the winding 36 of the processing tape 2 measured by the outer diameter measurement device 70 is sent to the rotational torque calculation unit 72.

[0036] 4 is a schematic diagram showing how the process tape 2 is wound onto the tape take-up reel 22. The take-up reel rotation mechanism 32 rotates the tape take-up reel 22 with a rotational torque T, and the process tape 2 is wound onto the tape take-up reel 22 with a tape tension F. The relationship between the rotational torque T, the tape tension F, and the outer diameter D of the winding 36 of the process tape 2 wound onto the tape take-up reel 22 is expressed by the following equation (1): F=2T / D (1)

[0037] The rotational torque calculation unit 72 uses the above formula (1) to calculate the rotational torque T from the outer diameter D of the winding 36 of the processing tape 2 measured by the outer diameter measurement device 70 and a predetermined tape tension F. The tape tension F is predetermined to an appropriate value for properly winding the processing tape 2 onto the tape take-up reel 22. The tape tension F is constant during processing of the substrate W. In one embodiment, the tape tension F is constant from the start of use of the processing tape 2 until the entire processing tape 2 is wound onto the tape take-up reel 22.

[0038] The rotational torque calculation unit 72 is electrically connected to the operation control unit 60, and the rotational torque T calculated by the rotational torque calculation unit 72 is sent to the operation control unit 60. The operation control unit 60 is configured to give a command to the take-up reel rotation mechanism 32 to rotate the tape take-up reel 22 with the calculated rotational torque T.

[0039] The rotational torque calculation unit 72 includes at least one computer. The rotational torque calculation unit 72 includes a storage device 72a storing programs and the like, and an arithmetic unit 72b that executes calculations according to instructions included in the programs. The storage device 72a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic unit 72b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the rotational torque calculation unit 72 is not limited to these examples. In one embodiment, the rotational torque calculation unit 72 may be configured integrally with the operation control unit 60.

[0040] The acquisition of the outer diameter D of the reel 36 of the processing tape 2 by the tape outer diameter acquisition mechanism (in this embodiment, measurement of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter measurement device 70) and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed during processing of the substrate W. Alternatively, the acquisition of the outer diameter D of the reel 36 of the processing tape 2 by the tape outer diameter acquisition mechanism (in this embodiment, measurement of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter measurement device 70) and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed each time processing of one substrate or a predetermined number of substrates is completed.

[0041] According to this embodiment, the substrate processing apparatus 1 acquires the outer diameter D of the winding 36 of the process tape 2 wound around the tape take-up reel 22, and can calculate the rotational torque T for winding the process tape 2 with a predetermined appropriate tape tension F based on the acquired outer diameter D of the winding 36. As a result, even if the outer diameter D of the winding 36 of the process tape 2 changes significantly, the process tape 2 can be wound around the tape take-up reel 22 with an appropriate tape tension F.

[0042] 5 is a schematic diagram showing another embodiment of the tape outer diameter obtaining mechanism. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the above-described embodiment, and therefore, redundant description will be omitted. The tape outer diameter obtaining mechanism of this embodiment includes, instead of the outer diameter measuring device 70, a thickness measuring device 75 that measures the thickness of the processing tape 2, and an outer diameter calculating unit 76 that calculates the outer diameter D of the roll 36 based on the thickness of the processing tape 2 measured by the thickness measuring device 75 and the amount of processing tape 2 used.

[0043] 5, the thickness measuring device 75 of this embodiment includes two distance measuring devices 75a and 75b arranged on either side of the processing tape 2 in the thickness direction of the processing tape 2, and a signal processing unit 75c electrically connected to the distance measuring devices 75a and 75b. The two distance measuring devices 75a and 75b each measure the distance to the surface of the processing tape 2. The signal processing unit 75c is configured to detect the thickness of the processing tape 2 based on the distances to the surface of the processing tape 2 measured by the distance measuring devices 75a and 75b. Examples of the two distance measuring devices 75a and 75b include non-contact or contact displacement sensors.

[0044] In this embodiment, the two distance measuring devices 75a, 75b are arranged on both sides of the processing tape 2 extending between the tape unwinding reel 21 and the processing head 10, but in one embodiment, the two distance measuring devices 75a, 75b may also be arranged on both sides of the processing tape 2 extending between the processing head 10 and the tape take-up reel 22.

[0045] The specific configuration of the thickness measuring device 75 is not limited to this embodiment as long as it can measure the thickness of the processing tape 2. For example, the thickness measuring device 75 may be configured to include a fixed wall having a support surface along which the processing tape 2 is placed, and one distance measuring device, and to measure the difference between the distance to the support surface of the fixed wall and the distance to the surface of the processing tape 2 on the support surface as the thickness of the processing tape 2.

[0046] The outer diameter calculation unit 76 is electrically connected to the thickness measurement device 75, and the thickness of the processing tape 2 measured by the thickness measurement device 75 is sent to the outer diameter calculation unit 76. The outer diameter calculation unit 76 is configured to calculate the outer diameter D of the roll 36 based on the thickness of the processing tape 2 measured by the thickness measurement device 75 and the amount of processing tape 2 used. The amount of processing tape 2 used is calculated based on the rotation speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2. In this specification, the "amount of processing tape 2 used" refers to the cumulative amount of processing tape 2 used since the start of use of an unused processing tape 2.

[0047] The rotation speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2 are stored in the storage device 60a of the operation control unit 60. Specifically, the motor rotation speed of the tape feeding device 18 is stored in the storage device 60a as a predetermined processing recipe. The feeding time of the processing tape 2 is determined by measuring the cumulative operating time of the motor of the tape feeding device 18 from the time when use of an unused processing tape 2 begins, and storing this value in the storage device 60a. The outer diameter calculation unit 76 is electrically connected to the operation control unit 60, and the rotation speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2 are sent to the outer diameter calculation unit 76.

[0048] 6 is a diagram illustrating a method for calculating the outer diameter D of the reel 36 based on the thickness Y of the processing tape 2 measured by the outer diameter calculation unit 76. The product S1 of the thickness Y of the processing tape 2 measured by the thickness measurement device 75 and the amount of processing tape used L is equal to the area S2 of the reel 36 of the processing tape 2 when viewed in the axial direction of the tape take-up reel 22.

[0049] The area S2 of the winding body 36 of the processing tape 2 when viewed from the axial direction of the tape take-up reel 22 is expressed by the following formula (2): S2=π / 4(D ２ -E ２ ) (2) where D is the outer diameter of the winding body 36, and E is the outer diameter of the core 22a of the tape take-up reel 22. Therefore, the following equation (3) holds true, and the outer diameter D of the winding body 36 is expressed by the following equation (4): Y×L=π / 4(D ２ -E ２ ) (3) D=√(Y×L×4 / π+E ２ ) (4)

[0050] The outer diameter calculation unit 76 uses the above formula (4) to calculate the outer diameter D of the reel 36 from the thickness Y of the processing tape 2, the amount of processing tape 2 used, and the outer diameter E of the core 22a of the tape take-up reel 22. The outer diameter E of the core 22a of the tape take-up reel 22 is stored in advance in a storage device 76a of the outer diameter calculation unit 76, which will be described later.

[0051] 5 , in this embodiment, the rotational torque calculation unit 72 is electrically connected to the outer diameter calculation unit 76, and the outer diameter D of the winding 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 is sent to the rotational torque calculation unit 72. The rotational torque calculation unit 72 calculates the rotational torque T from the outer diameter D of the winding 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 and the predetermined tape tension F, using the above-mentioned equation (1).

[0052] The outer diameter calculation unit 76 includes at least one computer. The outer diameter calculation unit 76 includes a storage device 76a storing programs and the like, and an arithmetic unit 76b that executes calculations according to instructions included in the programs. The storage device 76a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid-state drive (SSD). Examples of the arithmetic unit 76b include a central processing unit (CPU) and a graphics processing unit (GPU). However, the specific configuration of the outer diameter calculation unit 76 is not limited to these examples. In one embodiment, the outer diameter calculation unit 76 may be configured integrally with the rotational torque calculation unit 72 and / or the operation control unit 60.

[0053] The thickness measurement device 75 measures the thickness of the processing tape 2 at least each time a processing tape 2 of a different thickness is attached to the tape unwinding reel 21. The calculation of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter calculation unit 76 and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed during processing of a substrate W. Alternatively, the calculation of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter calculation unit 76 and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed each time processing of one substrate or a predetermined number of substrates is completed.

[0054] Figure 7 is a schematic diagram showing yet another embodiment of the tape outer diameter acquisition mechanism. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figures 5 and 6, and therefore a duplicated description will be omitted. In this embodiment, the outer diameter calculation unit 76 is configured to calculate the outer diameter of the roll 36 based on the thickness of the processing tape 2 input via the input device 80 and the amount of processing tape 2 used. The specific numerical value of the thickness of the processing tape 2 can be obtained from the processing tape 2 specification data provided by the processing tape 2 manufacturer.

[0055] The input device 80 is electrically connected to the outer diameter calculation unit 76, and the thickness of the processing tape 2 input to the input device 80 is sent to the outer diameter calculation unit 76. The input device 80 may be a device included in the substrate processing apparatus 1, or may be a device provided outside the substrate processing apparatus 1. The thickness of the processing tape 2 is input via the input device 80 at least each time a processing tape 2 of a different thickness is attached to the tape unwind reel 21.

[0056] The outer diameter calculation unit 76 uses the above-mentioned equation (4) to calculate the outer diameter D of the reel 36 from the thickness of the processing tape 2, the amount of processing tape 2 used, and the outer diameter E of the core 22a of the tape take-up reel 22, which are input via the input device 80. The outer diameter D of the reel 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 is sent to the rotational torque calculation unit 72. The rotational torque calculation unit 72 uses the above-mentioned equation (1) to calculate the rotational torque T from the outer diameter D of the reel 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 and a predetermined tape tension F.

[0057] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims.

[0058] The present invention can be used in a substrate processing apparatus and a substrate processing method for processing substrates such as wafers.

[0059] REFERENCE SIGNS LIST 1 substrate processing apparatus 2 processing tape 5 substrate holding section 7 holding stage 7a substrate holding surface 8 shaft 9 holding stage drive mechanism 10 processing head 12 pressing member 15 air cylinder (drive mechanism) 18 tape feed mechanism 20 processing tape supply mechanism 21 tape unwinding reel 22 tape take-up reel 24, 25, 26, 27 guide roller 28 reel base 31 unwinding reel rotation mechanism 32 take-up reel rotation mechanism 35, 36 winding body 41 lower supply nozzle 42 upper supply nozzle 50 tilt mechanism 52 tilt arm 53 arm rotation device 60 operation control section 60a storage device 60b arithmetic device 70 outer diameter measuring device 72 rotation torque calculation section 72a storage device 72b arithmetic device 75 thickness measuring device 75a, 75b Distance measuring device 75c Signal processing unit 76 Outer diameter calculation unit 76a Storage device 76b Arithmetic unit 80 Input device

Claims

1. A substrate processing apparatus comprising: a substrate holding unit that holds and rotates a substrate; a processing head that processes the substrate by pressing a processing tape against the substrate; a tape take-up reel that takes up the processing tape used in processing the substrate; a take-up reel rotation mechanism that rotates the tape take-up reel; a tape outer diameter acquisition mechanism that acquires the outer diameter of the processing tape wound around the tape take-up reel; a rotational torque calculation unit that calculates the rotational torque required for the tape take-up reel to wind up the processing tape with a predetermined tape tensile force based on the acquired outer diameter; and an operation control unit that controls the operation of the take-up reel rotation mechanism, wherein the operation control unit is configured to give a command to the take-up reel rotation mechanism to rotate the tape take-up reel with the calculated rotational torque.

2. The substrate processing apparatus of claim 1, wherein the tape outer diameter acquisition mechanism is an outer diameter measuring device that measures the outer diameter of the roll, and the rotational torque calculation unit is configured to calculate the rotational torque based on the measured outer diameter.

3. The substrate processing apparatus of claim 1, wherein the tape outer diameter acquisition mechanism comprises: a thickness measuring device that measures the thickness of the processing tape; and an outer diameter calculation unit that calculates the outer diameter of the roll based on the measured thickness of the processing tape and the amount of processing tape used; and the rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter.

4. The substrate processing apparatus of claim 1, wherein the tape outer diameter acquisition mechanism includes an outer diameter calculation unit that calculates the outer diameter of the roll based on the thickness of the processing tape and the amount of processing tape used input via an input device, and the rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter.

5. A substrate processing apparatus according to any one of claims 1 to 4, wherein the processing tape is a polishing tape having a polishing surface, and the processing head is a polishing head that presses the polishing surface against the substrate to polish the substrate.

6. A substrate processing method comprising: holding and rotating a substrate, and pressing a processing tape against the substrate with a processing head to process the substrate; rotating a tape take-up reel with a take-up reel rotation mechanism to wind the processing tape used in processing the substrate onto the tape take-up reel; obtaining an outer diameter of the processing tape wound around the tape take-up reel; calculating a rotational torque required for the tape take-up reel to wind the processing tape with a predetermined tape tension based on the obtained outer diameter; and rotating the tape take-up reel with the take-up reel rotation mechanism with the calculated rotational torque, thereby winding the processing tape onto the tape take-up reel.

7. The substrate processing method of claim 6, wherein obtaining the outer diameter of the winding body comprises measuring the outer diameter of the winding body with an outer diameter measuring device, and calculating the rotational torque comprises calculating the rotational torque based on the measured outer diameter.

8. The substrate processing method of claim 6, wherein obtaining the outer diameter of the roll comprises measuring a thickness of the processing tape with a thickness measuring device and calculating the outer diameter of the roll based on the measured thickness of the processing tape and the amount of processing tape used, and calculating the rotational torque comprises calculating the rotational torque based on the calculated outer diameter.

9. The substrate processing method of claim 6, wherein obtaining the outer diameter of the roll comprises calculating the outer diameter of the roll based on a thickness of the processing tape and an amount of the processing tape used input via an input device, and calculating the rotational torque comprises calculating the rotational torque based on the calculated outer diameter.

10. The substrate processing method according to any one of claims 6 to 9, wherein processing the substrate comprises pressing a polishing surface of a polishing tape against the substrate with a polishing head to polish the substrate.

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