Substrate processing device and substrate transport method

Abstract

The present invention pertains to a substrate processing device and a substrate transport method. In the present invention, a control unit: causes a shutter hoisting unit to move two distance sensors 31, 32 vertically; while the two distance sensors 31, 32 are being moved, causes the two distance sensors 31, 32 to respectively measure two distances DA, DB between the two distance sensors 31, 32 and two different points EA, EB on a peripheral edge section of each substrate W housed in a carrier mounted on a carrier mounting section; on the basis of the two distances DA, DB corresponding to each substrate W and the diameter DM or the radius of each substrate W, calculates the center position CP in a horizontal plane of the substrate W; and, on the basis of the center position CP in the horizontal plane of each substrate W, causes a substrate transport robot to transport a plurality of substrates W from the carrier.

Description

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSPORT METHOD

[0001] The present invention relates to a substrate processing apparatus and a substrate transport method for processing substrates, such as semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices.

[0002] A conventional substrate processing apparatus includes two sets of mapping sensors (transmission type sensors) arranged at two different positions along the direction in which the substrate is loaded and unloaded from the carrier. After the two sets of mapping sensors enter the carrier, the two sets of mapping sensors are moved downward. This allows two heights of the substrate at the two different positions to be detected. Based on these two substrate heights, the differential height of the tilted substrate and the amount of substrate misalignment toward the back of the carrier are detected (see, for example, Patent Document 1).

[0003] Patent Document 2 discloses a substrate transport device equipped with a detection unit, which is a mechanism for detecting the position, shape, etc. of each substrate stored in a storage unit (carrier). The detection unit includes three distance sensors that use infrared rays, ultrasonic waves, etc.

[0004] JP 2016-072384 A JP 2014-032996 A

[0005] However, conventional substrate processing apparatuses have the following problem: A substrate transport robot removes substrates from a carrier placed on a carrier placement unit. During this process, if there is an error in the shape of the carrier, for example, the hand of the substrate transport robot will only move to a pre-registered position, which may result in transport problems such as failing to remove a substrate.

[0006] In Patent Document 1, the amount of misalignment of the substrate toward the rear side of the carrier is detected, but it is not possible to detect the amount of misalignment of the substrate in the horizontal direction perpendicular to the direction in which the substrate is inserted into or removed from the carrier.

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus and a substrate transport method that can prevent substrate transport problems even if the substrate is misaligned in the horizontal plane.

[0008] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention includes a carrier placement unit for placing a processing carrier having a plurality of slots for storing a plurality of substrates in a horizontal position arranged vertically and a carrier opening for loading and unloading the plurality of substrates, a substrate transport robot having a hand for supporting one substrate and capable of moving the hand, two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier via the carrier opening, a sensor lifting unit for moving the two distance sensors vertically, and a control unit, wherein the control unit is The two distance sensors are moved vertically by the sensor lifting section, and while the two distance sensors are moving, the two distance sensors measure two distances between the two distance sensors and two different points on the periphery of each substrate stored in the processing carrier placed on the carrier placement section, and the center position of each substrate in a horizontal plane is calculated based on the two distances corresponding to each substrate and the diameter of each substrate, and the substrate transport robot transports the multiple substrates from the processing carrier based on the center position of each substrate in the horizontal plane.

[0009] The substrate processing apparatus according to the present invention includes two distance sensors arranged horizontally so as to face a plurality of substrates in a processing carrier through the carrier opening. The control unit measures, while the two distance sensors are moving, two distances to two different points on the periphery of each substrate in the processing carrier placed on the carrier placement unit. The control unit also calculates the horizontal center position of each substrate from the two distances and the diameter of each substrate. The calculated horizontal center position indicates the accurate position of the substrate. Therefore, even if the substrate is misaligned in the horizontal plane, problems with substrate transport by the substrate transport robot can be prevented.

[0010] Furthermore, in the substrate processing apparatus described above, the control unit executes a teaching process and a teaching correction process, and as the teaching process, the control unit causes the substrate transport robot to move the hand into a standard carrier placed on the carrier placement unit, sets a position where the hand picks up a standard substrate stored in a predetermined standard slot of a plurality of standard slots of the standard carrier as a teaching position, moves the two distance sensors up and down to a height position corresponding to the standard substrate stored in the standard slot by the sensor lift unit, measures two standard distances between the two distance sensors and two different points on the periphery of the standard substrate stored in the standard slot, calculates a standard center position in a horizontal plane of the standard substrate based on the two standard distances and a diameter of the standard substrate, and associates the standard center position with the teaching position, and then executes the following steps: and a substrate transport robot for transporting the substrate from the processing carrier, the substrate transport robot preferably performs the teaching correction process by moving the two distance sensors vertically using the sensor lifting unit, measuring two distances between the two distance sensors and two different points on the periphery of each substrate stored in the processing carrier placed on the carrier placement unit while the two distance sensors are moving, calculating a central position in the horizontal plane of each substrate based on the two distances corresponding to each substrate and the diameter of each substrate, calculating a positional deviation amount of the central position for a substrate stored in a slot corresponding to the standard slot among the plurality of slots of the processing carrier based on the standard central position, and correcting the teaching position associated with the standard central position using the positional deviation amount, and transporting the substrate from the processing carrier by the substrate transport robot based on the corrected teaching position.

[0011] The position where a standard substrate stored in a specified standard slot of the standard carrier is picked up by a hand is set as a teaching position. Two distance sensors are used to measure two standard distances to the standard substrate. A standard center position is then calculated based on the two standard distances and the diameter of the standard substrate. The standard center position is associated with the teaching position. The amount of positional deviation of the center position of a substrate stored in a slot of the processing carrier corresponding to the standard slot is calculated based on the standard center position. The teaching position is corrected using the calculated amount of positional deviation. This allows the teaching position in the horizontal plane to be corrected effectively.

[0012] In the substrate processing apparatus described above, it is preferable that the control unit performs the teaching process for all of the plurality of standard slots of the standard carrier and the teaching correction process for all of the plurality of slots of the processing carrier, thereby enabling the teaching positions in the horizontal plane to be properly corrected for all of the plurality of substrates on the processing carrier.

[0013] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the control unit performs the teaching process for the first standard slot at the bottom and the second standard slot at the top of the plurality of standard slots of the standard carrier, and as the teaching process for a third standard slot between the first standard slot and the second standard slot of the plurality of standard slots, calculates a third teaching position for the third standard slot from the geometric relationship between the first teaching position for the first standard slot and the second teaching position for the second standard slot, calculates a third standard center position for the third standard slot from the geometric relationship between the first standard center position for the first standard slot and the second standard center position for the second standard slot, associates the third standard center position with the third teaching position, and performs the teaching correction process for all of the plurality of slots of the processing carrier.

[0014] The teaching process is performed for the first standard slot at the bottom row and the second standard slot at the top row of the standard carrier, and the third standard slot between them is calculated from a geometric relationship, making the teaching process easy.

[0015] Furthermore, in the above-described substrate processing apparatus, it is preferable that the substrate transport robot has two or more hands including the hand, each supporting one substrate, and can move the two or more hands as a unit, and when the two or more hands support two or more substrates of the plurality of substrates, the control unit calculates an average value of two or more of the center positions in the horizontal plane corresponding to the two or more substrates, and transports the two or more substrates from the processing carrier by the substrate transport robot based on the average value.

[0016] When two or more hands are moved integrally, the average value of two or more center positions corresponding to two or more substrates supported by the two or more hands is calculated, and the two or more substrates are transported based on this average value. Therefore, even if the substrates are misaligned in the horizontal plane, problems with transporting the substrates by the substrate transport robot can be prevented.

[0017] Preferably, the substrate processing apparatus further comprises an alarm unit that emits at least one of sound and light, and the control unit controls the alarm unit to emit at least one of sound and light when the amount of misalignment exceeds a predetermined range, thereby enabling an operator to recognize that the amount of misalignment has exceeded the predetermined range.

[0018] Further, a substrate transport method according to the present invention is a substrate transport method for a substrate processing apparatus including: a carrier placement unit for placing a processing carrier having a plurality of slots for storing a plurality of substrates in a horizontal position arranged in a vertical direction and a carrier opening for loading and unloading the plurality of substrates; a substrate transport robot having a hand for supporting one substrate and capable of moving the hand; two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier via the carrier opening; and a sensor lifting unit for moving the two distance sensors in a vertical direction, The method is characterized by comprising a sensor moving process for moving sensors in an up and down direction; a distance measurement process for measuring, by the two distance sensors while the two distance sensors are moving, two distances between the two distance sensors and two different points on the periphery of each substrate stored in the processing carrier placed on the carrier placement section; a center position calculation process for calculating the center position in a horizontal plane of each substrate based on the two distances corresponding to each substrate and the diameter of each substrate; and a transport process for transporting the plurality of substrates from the processing carrier by the substrate transport robot based on the center position in the horizontal plane of each substrate.

[0019] According to the substrate processing apparatus and substrate transport method of the present invention, problems in transporting a substrate can be prevented even if the substrate is misaligned in the horizontal plane.

[0020] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. FIG. 2 is a cross-sectional view of a carrier. FIG. 3 is a front view of a carrier. FIG. 4 is a longitudinal sectional view mainly showing an indexer block of the substrate processing apparatus according to the first embodiment. FIG. 5 is a side view of a lid attaching / detaching unit. FIG. 6 is a plan view showing two distance sensors positioned at a standby position. FIG. 7 is a plan view showing two distance sensors positioned at a measurement position. FIG. 8 is a plan view showing two distance sensors and a substrate. FIG. 9 is a side view of a substrate transport robot. FIG. 10 is a plan view of a hand. FIG. 11 is a block diagram showing a control configuration of a substrate processing apparatus. FIG. 12 is a flowchart showing an operation of the substrate processing apparatus. FIG. 13 is a view for explaining an operation for acquiring a teaching position of a standard substrate to be stored in a first slot. FIG. 14 is a view for explaining an operation for acquiring a teaching position of a standard substrate to be stored in a first slot. FIG. 15 is a view for explaining calculation of a teaching position of a Z component for the second to twenty-fourth slots. FIG. 16 is a view for explaining calculation of teaching positions of an X component and a Y component for the second to twenty-fourth slots. FIG. 17 is a longitudinal sectional view for explaining measurement by two distance sensors for calculating a standard center position. FIG. 18 is a view for explaining calculation of a standard center position of a Z component for the second to twenty-fourth slots. FIG. 10 is a diagram for explaining calculation of standard central positions of the X and Y components for the 2nd to 24th slots. FIG. 11 is a longitudinal sectional view for explaining measurements by two distance sensors for calculating a central position. FIG. 12 is a plan view for explaining correction of a teaching position. FIG. 13 is a longitudinal sectional view mainly showing an indexer block of a substrate processing apparatus according to a second embodiment. FIG. 14 is a side view of a sensor unit. FIG. 15 is a side view of a substrate transport robot equipped with two or more hands according to a third embodiment. FIG. 16 is a diagram showing two distance sensors provided on a hand according to a modified example. FIG. 17 is a plan view showing a sensor moving unit that swings two distance sensors according to a modified example.

[0021] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to the first embodiment. Fig. 2 is a cross-sectional view of a carrier. Fig. 3 is a front view of the carrier.

[0022] In this specification, when teaching positions TP1 to TP25 are not particularly distinguished, they are called teaching positions TP. When points EA1 to EA25 are not particularly distinguished, they are called points EA. When points EB1 to EB25 are not particularly distinguished, they are called points EB. When distances DA1 to DA25 are not particularly distinguished, they are called distances DA. When distances DB1 to DB25 are not particularly distinguished, they are called distances DB. When standard center positions DP1 to DP25 are not particularly distinguished, they are called standard center positions DP. When center positions CP1 to CP25 are not particularly distinguished, they are called center positions CP. When positional deviation amounts DF1 to DF25 are not particularly distinguished, they are called positional deviation amounts DF. When modified teaching positions RTP1 to RTP25 are not particularly distinguished, they are called modified teaching positions RTP.

[0023] 1. Configuration of the Substrate Processing Apparatus> See FIG. 1. The substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 includes an indexer block 3 and a processing block 5. The indexer block 3 includes a plurality of (e.g., two) carrier platforms 7, a substrate transport robot IR, a wall 9, and a plurality of (e.g., two) lid attaching / detaching units 11. The horizontal direction in which the indexer block 3 and the processing block 5 are arranged is the X direction (front-to-back direction). The horizontal direction in which the two carrier platforms 7 are arranged is the Y direction (width direction). The Y direction is perpendicular to the X direction.

[0024] Each of the two carrier placement units 7 places a carrier C thereon. The carrier C stores a plurality of substrates W (e.g., 25 substrates W) arranged in a vertical direction (Z direction) and positioned horizontally. The carrier C also stores a plurality of substrates W at a predetermined interval (e.g., 10 mm). The substrates W are formed in a circular disk shape. The substrates W may or may not be warped, and may be formed by bonding a plurality of substrates together. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this. For example, the carrier may be a so-called cassette (open cassette) that does not have a lid 17 (described below) that covers an access port 14 (described below).

[0025] 2 and 3, the carrier C includes a container 13, an outlet 14, a plurality of (e.g., 25) shelves 15, and a lid 17. The container 13 accommodates a plurality of substrates W. The outlet 14 is provided on the front of the container 13. The outlet 14 is an opening for loading and unloading a plurality of substrates W. The substrates W in the container 13 of the carrier C are unloaded through the outlet 14. The substrates W are also loaded through the outlet 14. When the carrier C is transported, a lid 17 that covers the outlet 14 is attached to the container 13. The outlet 14 corresponds to the carrier opening of the present invention. The carrier C corresponds to the processing carrier of the present invention.

[0026] The shelves 15 are arranged in the vertical direction (Z direction) inside the carrier C (container 13). The shelves 15 are arranged at equal intervals (e.g., 10 mm intervals) in the vertical direction. Each of the shelves 15 can support one substrate W in a horizontal position.

[0027] The plurality of shelf sections 15 include a plurality of (e.g., 25) shelves 15A and a plurality of (e.g., 25) shelves 15B. The 25 shelves 15A are provided on the left inner wall 13B of the container 13, and the 25 shelves 15B are provided on the right inner wall 13C of the container 13. The 25 shelves 15A face the 25 shelves 15B, respectively. One substrate W is placed on each pair of shelves 15A, 15B.

[0028] In this embodiment, carrier C can accommodate a maximum of 25 substrates W (n being a natural number greater than or equal to 2). See FIG. 3. Within carrier C, for example, a space for accommodating one substrate W between two shelves 15 adjacent in the vertical direction (Z direction) is called a slot. Carrier C has 25 slots SL1, SL2 to SL23, SL24, and SL25. The 25 slots SL1 to SL25 are arranged in order from the bottom. Slot SL1 is the slot located at the lowest position, and slot SL25 is the slot located at the highest position.

[0029] 1 and 4 . The two carrier platforms 7 are arranged in the front part of the indexer block 3. The two carrier platforms 7 are arranged outside the front wall 9A. The front wall 9A has passage openings 9C at positions corresponding to the removal openings 14 of the carriers C placed on the carrier platforms 7. That is, the front wall 9A is provided with two passage openings 9C (see FIG. 1 ). The passage openings 9C are formed to be approximately the same size as the removal openings 14 of the carriers C. The substrate transport robot IR removes substrates W from the carriers C placed on the carrier platforms 7 through the passage openings 9C.

[0030] Each passage opening 9C is closed by a shutter portion 19 of the lid attaching / detaching portion 11 to isolate the atmosphere outside and inside the wall portion 9. Two lid attaching / detaching portions 11 are provided for each of the two carrier mounting portions 7. As shown in Fig. 5, each of the two lid attaching / detaching portions 11 includes a shutter portion 19, a shutter advance / retreat portion 21, a shutter lifting / lowering portion 23, and a height sensor 25.

[0031] As described above, the shutter unit 19 closes the passage opening 9C. The shutter unit 19 also removes the lid unit 17 from the carrier C and attaches the lid unit 17 to the carrier C. The shutter unit 19 also holds the removed lid unit 17. The shutter advancing / retracting unit 21 moves the shutter unit 19 forward and backward in the X direction. The shutter lifting / lowering unit 23 moves the shutter unit 19 up and down (Z direction). The shutter advancing / retracting unit 21 and the shutter lifting / lowering unit 23 each include an electric motor. The height sensor 25 is configured, for example, by a linear encoder or a rotary encoder.

[0032] The shutter advancing / retracting unit 21 advances and retreats two distance sensors 31, 32 and a sensor moving unit 33 (described later) in the X direction. The shutter lifting / lowering unit 23 raises and lowers the two distance sensors 31, 32 and the sensor moving unit 33 (described later) in the vertical direction (Z direction). The shutter lifting / lowering unit 23 corresponds to the sensor lifting / lowering unit of the present invention.

[0033] The indexer block 3 further includes two distance sensors 31, 32 and a sensor moving unit 33. The two distance sensors 31, 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. As shown in Figures 6 and 7, the two distance sensors 31, 32 are arranged so as to face the plurality of substrates W in the carrier C across the take-out opening 14. The two distance sensors 31, 32 are arranged horizontally. That is, the distance sensor 31 is arranged at the same height as the distance sensor 32.

[0034] The two distance sensors 31, 32 each measure a distance. The two distance sensors 31, 32 measure two distances DA, DB between the two distance sensors 31, 32 and two different points (points EA, EB) on the periphery of the substrate W in the carrier C placed on the carrier mount 7. Specifically, the first distance sensor 31 measures the distance DA between the tip TA of the first distance sensor 31 and point EA on the periphery of the substrate W (see FIG. 8). The second distance sensor 32 measures the distance DB between the tip TB of the second distance sensor 32 and point EB on the periphery of the substrate W (see FIG. 8). Point EA is a different point from point EB. Note that points EA and EB are positions that vary depending on, for example, the position where the laser light is irradiated. Furthermore, the tip ends TA, TB are each assumed to be at a reference position when measuring the distance.

[0035] Each of the two distance sensors 31, 32 is an optical distance sensor. Each of the two distance sensors 31, 32 includes a light projector and a light receiver. The light projector irradiates a laser beam toward a measurement object (e.g., the peripheral edge of the substrate W). The light receiver detects the laser beam reflected by the measurement object. The first distance sensor 31 is configured in the same manner as the second distance sensor 32. Note that each of the two distance sensors 31, 32 may irradiate light other than laser beam, such as infrared light. Furthermore, each of the two distance sensors 31, 32 may be a sensor that uses ultrasonic waves.

[0036] The sensor moving unit 33 is provided on the upper surface of the shutter unit 19. As shown in Figures 6 and 7, the sensor moving unit 33 moves the two distance sensors 31, 32 in the X direction between the measurement position MEP and the standby position. Figure 6 shows a state in which the two distance sensors 31, 32 are located at the standby position. Figure 7 shows a state in which the two distance sensors 31, 32 are located at the measurement position MEP. The measurement position MEP and the standby position are preset positions.

[0037] The sensor moving unit 33 includes a sensor support member 33A, two guide rails 33B, a screw shaft 33C, an electric motor 33D, and a position sensor (e.g., a rotary encoder) (not shown). The sensor support member 33A is C-shaped in plan view. Two distance sensors 31 and 32 are attached to both ends of the C-shaped sensor support member 33A. The two guide rails 33B and the screw shaft 33C are arranged to extend in the X direction. The two guide rails 33B support the sensor support member 33A so that it can move in the X direction. That is, the sensor support member 33A is guided in the X direction by the two guide rails 33B. The screw shaft 33C penetrates the sensor support member 33A and engages with an internal thread 33F of the sensor support member 33A. The output shaft of the electric motor 33D is connected to the base end of the screw shaft 33C.

[0038] When the electric motor 33D rotates the screw shaft 33C in the forward direction around its axis, the two distance sensors 31, 32 and the sensor support member 33A are advanced (see FIG. 7). When the electric motor 33D rotates the screw shaft 33C in the reverse direction around its axis, the two distance sensors 31, 32 and the sensor support member 33A are retracted (see FIG. 6).

[0039] 8, for example, it is assumed that there is a center line AX1 that passes through or near the center position of the substrate W and extends in the X direction. In this case, the two distance sensors 31 and 32 are disposed symmetrically in the Y direction with respect to the center line AX1. The distance SF1 from the center line AX1 to the first distance sensor 31 is approximately the same as the distance SF2 from the center line AX1 to the second distance sensor 32.

[0040] Furthermore, the position (coordinates) of point EA in the horizontal plane (X and Y directions) can be obtained from the position of the tip TA of the first distance sensor 31, the distance DA, and the distance SF1. Furthermore, the position (coordinates) of point EB in the horizontal plane can be obtained from the position of the tip TB of the second distance sensor 32, the distance DB, and the distance SF2. The center position of the substrate W (standard substrate WT) is calculated from points EA, EB, and the diameter DM or radius of the substrate W (standard substrate WT).

[0041] Fig. 9 is a side view of the substrate transport robot IR. Fig. 10 is a plan view of the hand 35. The substrate transport robot IR has a hand 35 that supports one substrate W, and is capable of moving the hand 35. In addition to the hand 35, the substrate transport robot IR is equipped with an articulated arm 37 and a lifting platform 39.

[0042] The hand 35 includes a hand body 41 and three or more (for example, four) guides 43. The hand body 41 is Y-shaped in a plan view. The four guides 43 are formed on the upper surface of the hand body 41. The four guides 43 receive the peripheral edge of the substrate W. Each of the four guides 43 includes a receiving portion 43A and a guide wall 43B. The peripheral edge of the substrate W rests on the four receiving portions 43A. The four guide walls 43B surround the substrate W placed on the four receiving portions 43A and limit movement of the substrate W in the horizontal direction (XY direction).

[0043] Furthermore, for example, if the substrate W is misaligned on the horizontal plane and is not surrounded by the four guide walls 43B but is placed on top of the guide walls 43B, there is a possibility that a transport problem will occur, such as the substrate W falling from the hand 35.

[0044] The articulated arm 37 is configured as, for example, a SCARA (selective compliance assembly robot arm) type robot arm. A base end (base end portion) of the articulated arm 37 is attached to a lifting platform 39. A tip end (tip end portion) of the articulated arm 37 is connected to the hand 35. The articulated arm 37 moves the hand 35 in the horizontal direction to transport the substrate. The articulated arm 37 is driven by a plurality of electric motors including an electric motor of a rotation drive unit 37D, which will be described later.

[0045] The articulated arm 37 includes, for example, a first arm 37A, a second arm 37B, a third arm 37C, and a rotation drive unit 37D. The base end of the first arm 37A is attached to the rotation drive unit 37D so as to be rotatable about a vertical axis AX2. The base end of the second arm 37B is attached to the tip of the first arm 37A so as to be rotatable about a vertical axis AX3. The base end of the third arm 37C is attached to the tip of the second arm 37B so as to be rotatable about a vertical axis AX4. The tip of the third arm 37C is connected to the base end of the hand 35. The rotation drive unit 37D includes an electric motor. The rotation drive unit 37D rotates the first arm 37A about the vertical axis AX2.

[0046] The rotation drive unit 37D is equipped with a rotary encoder 45A that measures the amount of rotation of the first arm 37A about the vertical axis AX2. The first arm 37A is equipped with a rotary encoder 45B that measures the amount of rotation of the second arm 37B about the vertical axis AX3. The second arm 37B is equipped with a rotary encoder 45C that measures the amount of rotation of the third arm 37C about the vertical axis AX4. The three rotary encoders 45A to 45C provide the position of the hand 35 in the X and Y directions. In other words, the position of the hand 35 in the horizontal plane is obtained.

[0047] The lifting platform 39 raises and lowers the hand 35 and the articulated arm 37. The lifting platform 39 includes a slider 39A, a guide rail 39B, a screw shaft 39C, an electric motor 39D, and a rotary encoder 39E. The slider 39A is fixed to, for example, the rotary drive unit 37D of the articulated arm 37. The guide rail 39B and the screw shaft 39C are each disposed to extend in the vertical direction (Z direction). The guide rail 39B and the screw shaft 39C each pass through the slider 39A. The screw shaft 39C meshes with an internal thread 39F of the slider 39A. The output shaft of the electric motor 39D is connected to the lower end of the screw shaft 39C.

[0048] When the electric motor 39D rotates the screw shaft 39C in the forward direction around its axis, the slider 39A, the rotary drive unit 37D, and the hand 35 are raised. When the electric motor 39D rotates the screw shaft 39C in the reverse direction around its axis, the slider 39A, the rotary drive unit 37D, and the hand 35 are lowered. The rotary encoder 39E measures the amount of rotation of the output shaft and the screw shaft of the electric motor 39D to measure the height position of the hand 35. Although the rotary encoder 39E is used as the height position sensor, a linear encoder may be used instead of the rotary encoder 39E.

[0049] 1, the processing block 5 includes a plurality of processing units 49, a center robot CR, and a substrate platform (shelf) PS. The substrate platform PS is provided between the substrate transport robot IR and the center robot CR. The substrate platform PS can accommodate one or more substrates W.

[0050] The processing units 49 perform a predetermined process on the substrate W. For example, each processing unit 49 includes a holding / rotating part 51 and a nozzle 53. The holding / rotating part 51 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The nozzle 53 ejects a processing liquid onto the upper surface of the substrate W held by the holding / rotating part 51.

[0051] The center robot CR includes a hand 55 that supports one substrate W in a horizontal position. The center robot CR is capable of moving the hand 55. The center robot CR is capable of transporting the substrate W between the plurality of processing units 49 and the substrate platform PS.

[0052] In addition to the hand 55, the center robot CR is equipped with an advancing / retreating unit 57 and an elevating / rotating unit 59. The advancing / retreating unit 57 moves the hand 55 forward and backward. The elevating / rotating unit 59 rotates the hand 55 and the advancing / retreating unit 57 about a vertical axis AX5 to change the orientation of the hand 55. The elevating / rotating unit 59 also raises and lowers the hand 55 and the advancing / retreating unit 57 in the vertical direction (Z direction). The advancing / retreating unit 57 and the elevating / rotating unit 59 each include one or more electric motors.

[0053] The advancing / retreating unit 57 also includes a position sensor (e.g., a rotary encoder or a linear encoder) that measures the position of the hand 55 when it is advanced or retracted. The lifting / rotating unit 59 includes a direction sensor (e.g., a rotary encoder) that detects the orientation of the hand 55 around the vertical axis AX5, and a height sensor (e.g., a rotary encoder or a linear encoder) that detects the height position of the hand 55. The position sensor and direction sensor provide the position of the hand 55 in the X and Y directions.

[0054] 11 is a block diagram showing a control system of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 61 and a storage unit 63. The control unit 61 controls each component of the substrate processing apparatus 1 (e.g., the substrate transport robot IR, the two distance sensors 31 and 32, and the lid attaching / detaching unit 11). The control unit 61 includes one or more processors, such as a central processing unit (CPU). The storage unit 63 includes at least one of a read-only memory (ROM), a random-access memory (RAM), and an auxiliary storage device (e.g., a hard disk). The storage unit 63 stores computer programs required to control each component of the substrate processing apparatus 1. The storage unit 63 also stores the diameter DM or radius of each of the substrate W and the standard substrate WT.

[0055] The substrate processing apparatus 1 includes an alarm unit 65 and an input unit 67. The alarm unit 65 notifies the operator of information by emitting at least one of sound and light. The alarm unit 65 includes at least one of an electronic buzzer, a speaker, and an electric light. The input unit 67 includes at least one of a keyboard, a mouse, a joystick, a cross key, a button switch, and a touch panel.

[0056] 2. Operation of the Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowchart in Fig. 12. Steps S01 to S07 are steps for the teaching process (teaching work). Steps S11 to S14 are steps for transporting and processing substrates W (product substrates). First, the teaching process of the substrate transport robot IR will be described with reference to steps S01 to S07.

[0057] The teaching process in this description is the process of making the substrate transport robot IR learn the positions to take when removing a substrate W from a carrier C placed on the carrier placement section 7 or when storing a substrate W into the carrier C.

[0058] First, a standard carrier CT is placed on one of the two carrier placement sections 7 (one carrier placement section 7 and the other carrier placement section 7). The standard carrier CT is, for example, a carrier C that is free of distortion and formed substantially according to design values. In other words, the standard carrier CT is a non-defective carrier C. The standard carrier CT and the standard substrate WT (described later) may also be made of metal (for example, aluminum).

[0059] 2 and 3, the standard carrier CT is configured to be able to store 25 standard substrates WT. The standard carrier CT placed on the carrier mounting section 7 stores two standard substrates WT in the lowest slot SL1 and the top slot SL25. The standard substrates WT are also substrates W that are, for example, free of distortion and formed substantially according to design values. The two standard substrates WT are stored in preset positions in the two slots SL1 and SL25 of the standard carrier CT. It is assumed that the lid 17 is not attached to the standard carrier CT.

[0060] After the standard carrier CT is transported to one of the carrier placement units 7, the lid attaching / detaching unit 11 retracts the shutter unit 19, and then lowers the shutter unit 19 to the position shown by the solid line in Fig. 4. This opens the passage opening 9C provided in the front wall 9A, allowing the substrate transport robot IR to access the inside of the standard carrier CT.

[0061] [Step S01] Obtaining the teaching position for the substrate in slot SL1 The operator causes the control unit 61 to control the substrate transport robot IR via the input unit 67. As shown in FIG. 13, the substrate transport robot IR causes the hand 35 to enter the standard carrier CT so that it is positioned below the standard substrate WT stored in slot SL1. Then, as shown in FIG. 14, the substrate transport robot IR raises the hand 35 so that the upper surface of the hand 35 (the four receiving portions 43A of the four guides 43) firmly contacts the lower surface of the standard substrate WT in slot SL1, with the standard substrate WT almost placed on the shelf 15. This operation is visually confirmed by the operator, for example.

[0062] Once the operator confirms that the hand 35 has come into contact with the standard substrate WT, he or she registers the position (coordinates in the X, Y, and Z directions) of the hand 35. That is, the operator causes the control unit 61 to acquire position data from the four rotary encoders 39E, 45A to 45C via the input unit 67 and set the data as teaching position TP1. For example, when the hand 35 is at teaching position TP1, the position of symbol FP shown in Figures 9 and 10 is at teaching position TP1. The control unit 61 stores the teaching position TP1 in the memory unit 63.

[0063] [Step S02] Obtaining the teaching position for the substrate in slot SL25 Then, the operator causes the control unit 61 to control the substrate transport robot IR via the input unit 67. The substrate transport robot IR causes the hand 35 to enter the standard carrier CT so that it is positioned below the standard substrate WT stored in slot SL25. The substrate transport robot IR then raises the hand 35 to pick up the standard substrate WT, thereby bringing the upper surface of the hand 35 into firm contact with the lower surface of the standard substrate WT in slot SL25, with the standard substrate WT almost resting on the shelf 15.

[0064] Once the operator confirms that the hand 35 has come into contact with the standard substrate WT, he or she registers the position (coordinates in the X, Y, and Z directions) of the hand 35. That is, the operator causes the control unit 61 to obtain data from the four rotary encoders 39E, 45A to 45C via the input unit 67 and set the data as the teaching position TP25. For example, when the hand 35 is at the teaching position TP25, the position of the symbol FP shown in Figures 9 and 10 is assumed to be at the teaching position TP25. The control unit 61 then stores the teaching position TP25 in the memory unit 63.

[0065] [Step S03] Calculation of teaching positions for slots SL2 to SL24 The teaching positions TP2 to TP24 for slots SL2 to SL24 are calculated by the control unit 61. First, we will explain why this calculation is possible. There are individual differences among the carrier mounting units 7. Therefore, when either the carrier C or the standard carrier CT is mounted on the carrier mounting unit 7, it will tilt in one of the X or Y directions. This inherent tilt determines a certain relationship between the X, Y, and Z directions, making it possible to calculate the teaching positions.

[0066] Therefore, the control unit 61 calculates 23 (n-2) teaching positions TP2 to TP24 between the two teaching positions TP1 and TP25 from the geometric relationship between the two teaching positions TP1 and TP25.

[0067] Specifically, as shown in Figures 15 and 16, the control unit 61 calculates 23 teaching positions TP2 to TP24 (coordinates in the X, Y, and Z directions) so that the 25 teaching positions TP1 to TP25 are arranged at equal intervals on a straight line LN1 connecting the two teaching positions TP1 and TP25. During this calculation, the two teaching positions TP1 and TP25 do not change. The 25 teaching positions TP1 to TP25 are stored in the memory unit 63.

[0068] To explain more specifically, the control unit 61 calculates the Z components of the 23 teaching positions TP2 to TP24 so that the Z components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the Z component of the straight line LN1 connecting the two teaching positions TP1 and TP25, as shown in Figure 15.

[0069] 16, the control unit 61 calculates the X components of the 23 teaching positions TP2 to TP24 so that the X components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the X component of the straight line LN1 connecting the two teaching positions TP1 and TP25. Furthermore, the control unit 61 calculates the Y components of the 23 teaching positions TP2 to TP24 so that the Y components of the 25 teaching positions TP1 to TP25 are arranged at equal intervals on the Y component of the straight line LN1 connecting the two teaching positions TP1 and TP25.

[0070] [Step S04] Calculation of the standard center position of the substrate in slot SL1 The operator moves the hand 35 via the input unit 67 to a position that does not interfere with the operation of the lid attaching / detaching unit 11 and the sensor moving unit 33. The standard carrier CT remains placed on one of the carrier placement units 7.

[0071] Thereafter, the operator causes the control unit 61 to control the lid attaching / detaching unit 11, the sensor moving unit 33, and the two distance sensors 31, 32 via the input unit 67. The shutter lifting / lowering unit 23 of the lid attaching / detaching unit 11 raises the two distance sensors 31, 32 to a height position facing the standard substrate WT in the slot SL1 in the standard carrier CT. Thereafter, the sensor moving unit 33 advances the two distance sensors 31, 32 from the standby position to the measurement position MEP shown in FIG. 7. This makes the two distance sensors 31, 32 ready for measurement.

[0072] Thereafter, the two distance sensors 31, 32 each irradiate the peripheral edge of the standard substrate WT in the slot SL1 with laser light, as shown by the dashed lines in Fig. 17. As a result, the first distance sensor 31 measures a distance DA1 to a point EA1 on the peripheral edge of the standard substrate WT, as shown in Fig. 8. The second distance sensor 32 measures a distance DB1 to a point EB1 on the peripheral edge of the standard substrate WT. The two measured distances DA1, DB1 are stored in the memory unit 63.

[0073] Furthermore, the control unit 61 calculates the center position (X-coordinate and Y-coordinate) of the standard substrate WT in the horizontal plane (XY directions) of the slot SL1 based on the two distances DA1, DB1 and the diameter DM or radius of the standard substrate WT. The calculated center position is stored in the memory unit 63 as the XY coordinates of the standard center position DP1.

[0074] The height sensor 25 of the lid attachment / detachment unit 11 measures the height positions of the two distance sensors 31 and 32 at which the distances DA1 and DB1 are measured, i.e., the height positions of the points EA1 and EB1. The height positions of the points EA1 and EB1, or their average height position, are stored in the memory unit 63 as the Z coordinates of the standard center position DP1.

[0075] [Step S05] Calculation of the standard center position of the substrate in slot SL25 The shutter lifting unit 23 raises the two distance sensors 31, 32 to a height position facing the standard substrate WT in slot SL25 in the standard carrier CT. The two distance sensors 31, 32 remain at the measurement position MEP.

[0076] Thereafter, the two distance sensors 31, 32 each irradiate the peripheral edge of the standard substrate WT in the slot SL25 with laser light, as shown by the solid lines in Figure 17. As a result, the first distance sensor 31 measures a distance DA25 to a point EA25 on the peripheral edge of the standard substrate WT. The second distance sensor 32 measures a distance DB25 to a point EB25 on the peripheral edge of the standard substrate WT. The two measured distances DA25, DB25 are stored in the memory unit 63.

[0077] Furthermore, the control unit 61 calculates the center position (X-coordinate and Y-coordinate) of the standard substrate WT in the horizontal plane (XY directions) of the slot SL25 based on the two distances DA25, DB25 and the diameter DM or radius of the standard substrate WT. The calculated center position is stored in the memory unit 63 as the XY coordinates of the standard center position DP25.

[0078] The height sensor 25 of the lid attachment / detachment unit 11 measures the height positions of the two distance sensors 31 and 32 that measured the distances DA25 and DB25, i.e., the height positions of points EA25 and EB25. The height positions of points EA25 and EB25, or their average height position, are stored in the memory unit 63 as the Z-coordinates of the standard center position DP25.

[0079] [Step S06] Calculation of Standard Center Positions for Slots SL2 to SL24 The control unit 61 calculates 23 standard center positions DP2 to DP24 for the slots SL2 to SL24 using the same method as in step S03.

[0080] The control unit 61 calculates 23 standard center positions DP2 to DP24 between the two standard center positions DP1 and DP25 from the geometric relationship between the two standard center positions DP1 and DP25.

[0081] Specifically, the control unit 61 calculates 23 standard center positions DP2 to DP24 so that the 25 standard center positions DP1 to DP25 are arranged at equal intervals on a straight line LN2 connecting the standard center positions DP1 and DP25, as shown in Figures 18 and 19. During this calculation, the two standard center positions DP1 and DP25 do not change. The standard center positions DP1 to DP25 (coordinates in the X, Y, and Z directions) are stored in the storage unit 63.

[0082] Although the standard center positions DP1 and DP25 are calculated in the order of steps S04 and S05, the standard center positions DP1 and DP25 may be calculated in the order of steps S05 and S04. The same applies to steps S01 and S02.

[0083] [Step S07] Associating teaching positions with standard center positions After that, the control unit 61 associates the 25 standard center positions DP1 to DP25 with the 25 teaching positions TP1 to TP25, respectively.

[0084] For example, the standard center position DP1 is associated with the teaching position TP1. The standard center position DP2 is associated with the teaching position TP2. The standard center position DP3 is associated with the teaching position TP3. The standard center position DP25 is associated with the teaching position TP25. Note that the timing of association is not limited to the timing after step S06.

[0085] This completes the teaching process for the substrate transport robot IR associated with one of the carrier placement units 7. For example, after measuring the distances DA25 and DB25 in step S05, the sensor moving unit 33 of the lid attaching / detaching unit 11 moves the two distance sensors 31 and 32 back to their standby positions (see FIG. 6). Thereafter, the shutter advancing / retreating unit 21 and the shutter lifting / lowering unit 23 close the passage opening 9C with the shutter unit 19.

[0086] Thereafter, the standard carrier CT storing the two standard substrates WT is moved from one carrier platform 7 to the other carrier platform 7. As in steps S01 to S07, a teaching process is performed for the substrate transport robot IR associated with the other carrier platform 7. That is, the teaching process is performed for the substrate transport robot IR for each carrier platform 7.

[0087] Next, the transport of the substrate W (product substrate) and the processing of the substrate W will be described with reference to steps S11 to S14.

[0088] A carrier C storing 25 substrates W is placed on one of the two carrier mounting parts 7. The lid attaching / detaching part 11 removes the lid part 17 from the carrier C placed on the carrier mounting part 7 and holds the removed lid part 17. The shutter advancing / retracting part 21 of the lid attaching / detaching part 11 retracts the lid part 17 toward the substrate transport robot IR. This opens the passage opening 9C. The shutter lifting / lowering part 23 of the lid attaching / detaching part 11 slightly lowers the shutter part 19 to move (advance) the two distance sensors 31, 32 into the carrier C.

[0089] [Step S11] Calculation of the center positions of the substrates (product substrates) in slots SL1 to SL25. Then, the sensor moving unit 33 moves (advances) the two distance sensors 31, 32 from the standby position to the measurement position MEP (see FIG. 7). Then, the shutter lifting unit 23 lowers the two distance sensors 31, 32 to detect the presence or absence of a substrate W and to measure the two distances DA, DB (see FIG. 20). Note that the movement direction of the two distance sensors 31, 32 may be upward.

[0090] While the two distance sensors 31, 32 are descending, the two distance sensors 31, 32 measure two distances DA (DA1 to DA25) and DB (DB1 to DB25) between the two distance sensors 31, 32 and two different points EA (EA1 to EA25) and EB (EB1 to EB25) on the periphery of each substrate W stored in a carrier C placed on the carrier placement section 7.

[0091] For example, the two distance sensors 31 and 32 measure two distances DA25 and DB25 to two different points EA25 and EB25 on the periphery of the substrate W stored in slot SL25. The two distance sensors 31 and 32 measure two distances DA24 and DB24 to two different points EA24 and EB24 on the periphery of the substrate W stored in slot SL24. The two distance sensors 31 and 32 also measure two distances DA1 and DB1 to two different points EA1 and EB1 on the periphery of the substrate W stored in slot SL1.

[0092] In addition, the control unit 61 calculates the center position CP (CP1 to CP25) of each substrate W in the horizontal plane (XY direction) based on the two distances DA and DB corresponding to each substrate W and the diameter DM or radius of each substrate W.

[0093] For example, the center position CP25 in the horizontal plane of the substrate W stored in slot SL25 is calculated based on two distances DA25, DB25 corresponding to the substrate W stored in slot SL25 and the diameter DM (e.g., 300 mm) or radius (e.g., 150 mm) of the substrate W.

[0094] Furthermore, a central position CP24 in the horizontal plane of the substrate W stored in slot SL24 is calculated based on the two distances DA24, DB24 corresponding to the substrate W stored in slot SL24 and the diameter DM or radius of the substrate W. Furthermore, a central position CP1 in the horizontal plane of the substrate W stored in slot SL1 is calculated based on the two distances DA1, DB1 corresponding to the substrate W stored in slot SL1 and the diameter DM or radius of the substrate W.

[0095] Furthermore, the height sensor 25 of the lid attachment / detachment part 11 measures the height positions of the two distance sensors 31, 32 that each measured 25 pairs of distances DA, DB (DA1 to DA25, DB1 to DB25), i.e., the height positions of points EA, EB. The height positions of points EA, EB, or their average height position (for example, the average height position of two points EA1, EB1), are stored in the memory unit 63 as the Z-direction coordinates of the center position CP. That is, 25 height positions (Z-direction coordinates) corresponding to the 25 substrates W are stored in the memory unit 63.

[0096] The two distance sensors 31, 32 also detect the presence or absence of a substrate W in the carrier C. For example, if the two distance sensors 31, 32 output two distances DA25, DB25 for slot SL25, the control unit 61 determines that a substrate W is present in slot SL25. On the other hand, if the two distance sensors 31, 32 do not output two distances DA25, DB25 for slot SL25, the control unit 61 determines that no substrate W is present in slot SL25. Even if distances DA25, DB25 are output, if they are not within a preset range, the control unit 61 determines that no substrate W is present in slot SL25.

[0097] Twenty-five center positions CP1 to CP25 (coordinates in the X, Y, and Z directions) including the 25 height positions are stored in the storage unit 63. In addition, 25 distances DA1 to DA25 and 25 distances DB1 to DB25 are also stored in the storage unit 63. Information on the presence or absence of 25 slots SL1 to SL25 is also stored in the storage unit 63.

[0098] [Step S12] Correcting the teaching positions See Fig. 21. The control unit 61 calculates the 25 positional deviation amounts DF1 to DF25 (positional deviation amounts in the X, Y, and Z directions) of the 25 center positions CP1 to CP25 based on the 25 standard center positions DP1 to DP25.

[0099] The 25 slots SL1 to SL25 (25 standard slots) of the standard carrier CT correspond to the 25 slots SL1 to SL25 of the carrier C. Therefore, for example, slot SL25 of the standard carrier CT corresponds to slot SL25 of the carrier C.

[0100] In this case, the standard center position DP25 related to slot SL25 of the standard carrier CT is used as a reference, and the positional deviation amount DF25 of the center position CP25 corresponding to the substrate W stored in slot SL25 of the carrier C is calculated. That is, the positional deviation amount DF25 is calculated as the difference between the center position CP25 and the standard center position DP25 (positional deviation amount DF25 = center position CP25 - standard center position DP25).

[0101] Similarly, slot SL24 of the standard carrier CT corresponds to slot SL24 of carrier C. In this case, the standard center position DP24 related to slot SL24 of the standard carrier CT is used as a reference, and a positional deviation amount DF24 of the center position CP24 corresponding to the substrate W stored in slot SL24 of carrier C is calculated (positional deviation amount DF24 = center position CP24 - standard center position DP24).

[0102] Similarly, the slot SL1 of the standard carrier CT corresponds to the slot SL1 of the carrier C. In this case, the positional deviation DF1 of the center position CP1 is calculated based on the standard center position DP1 (positional deviation DF1 = center position CP1 - standard center position DP1).

[0103] Furthermore, the control unit 61 uses the 25 positional deviation amounts DF1 to DF25 (positional deviation amounts in the X, Y, and Z directions) to correct the 25 teaching positions TP1 to TP25 associated with the 25 standard center positions DP1 to DP25. The corrected 25 teaching positions TP1 to TP25 are called 25 corrected teaching positions RTP1 to RTP25. The 25 positional deviation amounts DF1 to DF25 and the 25 corrected teaching positions RTP1 to RTP25 (coordinates in the X, Y, and Z directions) are stored in the storage unit 63.

[0104] When any of the 25 positional deviation amounts DF1 to DF25 exceeds a preset range, the control unit 61 notifies the operator that the range has been exceeded by the notification unit 65. When the positional deviation amount DF exceeds the preset range, it may not be possible to place the substrate W inside the four guide walls 43B of the four guides 43 shown in Fig. 10. In this case, a transport problem may occur, such as the substrate W falling off the hand 35 during transport of the substrate W. The notification by the notification unit 65 makes it possible to avoid transport problems in advance that may occur even if the teaching position TP is corrected.

[0105] [Step S13] Substrate Transport Thereafter, the substrate transport robot IR uses the hand 35 to take out the 25 substrates W one by one from the carrier C placed on the carrier rest part 7, based on the 25 corrected teaching positions RTP1 to RTP25. The substrate transport robot IR transports the taken-out substrates W to the substrate rest part PS.

[0106] The center robot CR picks up a substrate W from the substrate rest part PS and transports the substrate W to one of a plurality of processing units 49. Each processing unit 49 performs a predetermined process (e.g., cleaning process with pure water) on the substrate W transported by the center robot CR.

[0107] The center robot CR takes a processed substrate W that has been subjected to a preset process from one of the processing units 61, and transports the substrate W to the substrate rest part PS. The substrate transport robot IR takes the processed substrate W from the substrate rest part PS and returns the substrate W to the carrier C on the carrier rest part 7. When returning the substrates W, the substrate transport robot IR uses the hand 35 to return the 25 substrates W one by one to the carrier C, based on the 25 correction teaching positions RTP1 to RTP25.

[0108] [Step S14] Repeat? If a substrate W (product substrate) stored in another carrier C is to be processed in the processing unit 49, return to step S11. If the teaching process is to be performed again, end the flowchart shown in FIG. 12 and return to step S01.

[0109] According to this embodiment, two distance sensors 31, 32 are arranged horizontally so as to face the substrates W in the carrier C across the take-out port 14. While the two distance sensors 31, 32 are moving, the control unit 61 measures two distances DA, DB to two different points EA, EB on the periphery of each substrate W in the carrier C placed on the carrier mount part 7, using the two distance sensors 31, 32. The control unit 61 also calculates the center position CT of each substrate W in the horizontal plane from the two distances DA, DB and the diameter DM or radius of each substrate W. The calculated center position CT in the horizontal plane indicates the accurate position of the substrate W. Therefore, even if the substrate W is misaligned in the horizontal plane, problems with the substrate W being transported by the substrate transport robot IR can be prevented.

[0110] For example, the position at which the hand 35 picks up a standard substrate WT stored in slot SL1 of the standard carrier CT is set as the teaching position TP1. Two distances DA1 and DB1 to the standard substrate WT are measured by two distance sensors 31 and 32, respectively. A standard center position DP1 is then calculated based on the two distances DA1 and DB1 and the diameter DM or radius of the standard substrate WT. The standard center position DP1 is associated with the teaching position TP1. A positional deviation DF1 of the center position CT1 of a substrate W stored in slot SL1 of the carrier C corresponding to slot SL1 of the standard carrier CT is calculated based on the standard center position DP1. The teaching position TP1 is corrected using the calculated positional deviation DF1. This allows the teaching position TP1 in the horizontal plane to be accurately corrected.

[0111] Teaching processing is performed for the bottom slot SL1 and the top slot SL25 of the standard carrier CT, and calculation is performed from the geometric relationship for at least one slot SL2 to SL24 between them. This makes it easy to perform the teaching processing.

[0112] For example, slot SL1 of the standard carrier CT corresponds to the first standard slot of the present invention. Slot SL25 of the standard carrier CT corresponds to the second standard slot of the present invention. At least one of the 23 slots SL2 to SL24 of the standard carrier CT corresponds to the third standard slot of the present invention.

[0113] Furthermore, for example, teaching position TP1 corresponds to the first teaching position of the present invention. Teaching position TP25 corresponds to the second teaching position of the present invention. At least one of the 23 teaching positions TP2 to TP24 corresponds to the third teaching position of the present invention.

[0114] Furthermore, for example, the standard center position DP1 corresponds to the first standard center position of the present invention. The standard center position DP25 corresponds to the second standard center position of the present invention. At least one of the 23 standard center positions DP2 to DP24 corresponds to the third standard center position of the present invention. Furthermore, the diameter DM or radius corresponds to the diameter of the present invention.

[0115] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first embodiment will be omitted.

[0116] In the first embodiment, the two distance sensors 31 and 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. In this regard, as shown in Fig. 22, the two distance sensors 31 and 32 may be provided separately from the lid attaching / detaching unit 11 and the substrate transport robot IR.

[0117] 22 and 23, the indexer block 3 includes a sensor unit 71. The sensor unit 71 includes two distance sensors 31 and 32, a sensor support member 73, an advance / retreat unit 75, an elevation unit 76, and a height sensor 78. The sensor support member 73 supports the two distance sensors 31 and 32 that are aligned in the Y direction.

[0118] The advancing / retreating unit 75 advances and retreats the two distance sensors 31, 32 and the sensor support member 73 in the X direction. The lifting / lowering unit 76 moves the two distance sensors 31, 32, the sensor support member 73, and the advancing / retreating unit 75 up and down (Z direction). The advancing / retreating unit 75 and the lifting / lowering unit 76 each include an electric motor. The height sensor 78 is configured by, for example, a linear encoder or a rotary encoder.

[0119] The sensor unit 71 moves the two distance sensors 31, 32 etc. so as not to interfere with the lid attaching / detaching unit 11. As shown by the dashed lines in Fig. 22 , the sensor unit 71 keeps the two distance sensors 31, 32 on standby at positions where they will not interfere with substrate transport by the substrate transport robot IR. Furthermore, as shown by the solid lines in Fig. 22 , when measuring distance, the sensor unit 71 moves the two distance sensors 31, 32 to a measurement position MEP (see Figs. 7 and 8 ) within the carrier C placed on the carrier mount 7.

[0120] In addition, when the indexer block 3 is provided with the sensor unit 71 and the lid attaching / detaching unit 11 is not necessary, the indexer block 3 does not need to be provided with the lid attaching / detaching unit 11.

[0121] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first and second embodiments will be omitted.

[0122] In the first embodiment, the substrate transport robot IR includes one hand 35. In this regard, in the third embodiment, the substrate transport robot IR may include two or more hands 35.

[0123] See Figure 24. The substrate transport robot IR includes, for example, five hands 35 and a hand connecting member 81. Each of the five hands 35 supports one substrate W. The five hands 35 are arranged in the vertical direction at intervals of, for example, 10 mm, similar to the spacing between the shelf portions 15 of the carrier C. The hand connecting member 81 connects the five hands 35. Therefore, the substrate transport robot IR can move the hands 35 as a unit.

[0124] 12, the teaching position TP may be acquired and corrected as follows. For example, it is assumed that a standard substrate WT is stored in slot SL3 (third from the bottom) of a standard carrier CT placed on the carrier mount 7. The hand 35 third from the bottom of the five hands 35 is designated by the reference symbol 35A.

[0125] In step S01, the substrate transport robot IR first inserts the five hands 35 into the standard carrier CT so that the hands 35A are positioned below the standard substrate WT. The substrate transport robot IR then raises the five hands 35, bringing the upper surfaces of the hands 35A into contact with the lower surface of the standard substrate WT in slot SL3. The control unit 61 acquires position data from the four rotary encoders 39E, 45A-45C for the position where the hands 35A make contact, and sets this as the teaching position TP3. For example, when the five hands 35 are at teaching position TP3, the position of the symbol FP shown in FIG. 24 is considered to be at teaching position TP3.

[0126] In step S04, the shutter lifting unit 23 moves the two distance sensors 31, 32 to height positions corresponding to the standard substrate WT stored in slot SL3 of the standard carrier CT. The control unit 61 then acquires two distances DA3, DB3 related to the standard substrate WT using the two distance sensors 31, 32. The control unit 61 then calculates a standard center position DP3 in the horizontal plane of the standard substrate WT based on the two distances DA3, DB3, etc. Furthermore, in step S07, the standard center position DP3 is associated with the teaching position TP1.

[0127] In step S11, the control unit 61 calculates center positions CP1 to CP25 for the 25 substrates W in the carrier C. Furthermore, when five hands 35 support five substrates W, the control unit 61 calculates the average value of the five center positions CP1 to CP5 in the horizontal plane corresponding to the five substrates.

[0128] In step S12, the control unit 61 calculates, with respect to the standard center position DP3, an average positional deviation DF3 of the center positions CP1 to CP5 corresponding to the five substrates W. The control unit 61 uses the average positional deviation DF3 to correct the teaching position TP3 associated with the standard center position DP3.

[0129] Based on the corrected teaching position TP3 (i.e., corrected teaching position RTP3), the control unit 61 causes the substrate transport robot IR to transport five substrates W from the carrier C to the slots SL1 to SL5. That is, based on the average value of the five center positions CP1 to CP5, the control unit 61 causes the substrate transport robot IR to transport five substrates W from the carrier C.

[0130] According to this embodiment, for example, when five hands 35 are moved integrally, an average value of five center positions CT corresponding to the five substrates W supported by the five hands 35 is calculated, and the five substrates W are transported based on this average value. Therefore, even if the substrates W are misaligned in the horizontal plane, problems with the substrate transport by the substrate transport robot can be prevented.

[0131] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0132] (1) In the first embodiment described above, for example, the two distance sensors 31, 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. In this regard, as shown in Fig. 25, the two distance sensors 31, 32 may be provided at the tip of the hand 35 of the substrate transport robot IR. Furthermore, the substrate transport robot IR may be provided with another articulated arm 37, and the two distance sensors 31, 32 may be provided at the tip of the articulated arm 37.

[0133] (2) In the first embodiment described above, the two distance sensors 31, 32 are provided on the upper surface of the shutter unit 19 via the sensor moving unit 33. However, the two distance sensors 31, 32 may be provided on the upper surface of the shutter unit 19 without via the sensor moving unit 33. In this case, the two distance sensors 31, 32 measure the two distances DA, DB while being fixed to the upper surface of the shutter unit 19 without being moved in the X direction.

[0134] (3) In the first embodiment described above, the sensor moving unit 33 moved the two distance sensors 31, 32 forward and backward in the X direction. However, as shown in FIG. 26 , the sensor moving unit 83 may swing each of the two distance sensors 31, 32. The sensor moving unit 83 includes a swinging member 85 to which the distance sensor 31 is attached, a swinging member 87 to which the distance sensor 32 is attached, and at least one electric motor (not shown). The sensor moving unit 83 swings the distance sensor 31 around the vertical axis AX7 and swings the distance sensor 32 around the vertical axis AX8.

[0135] (4) In the above-described embodiments and modifications, the 23 teaching positions TP2 to TP24 are obtained based on the two teaching positions TP1 and TP25. However, the 23 teaching positions TP2 to TP24 may be obtained using a standard substrate WT stored in a standard carrier CT, as in steps S01 and S02 shown in FIG.

[0136] Furthermore, the 23 standard center positions DP2 to DP24 are obtained based on the two standard center positions DP1 and DP25. However, the 23 standard center positions DP2 to DP24 may also be obtained using a standard substrate WT stored in a standard carrier CT, as in steps S04 and S05 shown in Figure 12. This allows the teaching positions in the horizontal plane to be properly corrected for all 25 substrates W in carrier C.

[0137] (5) In the above-described embodiments and modifications, the indexer block 3 includes two distance sensors 31 and 32. However, the indexer block 3 may include three or more distance sensors. In other words, the indexer block 3 may include at least two distance sensors. The center position CP can be calculated with even higher accuracy based on the three distances and the diameter DM or radius.

[0138] (6) In the above-described embodiments and modifications, the substrate transport robot IR includes the articulated arm 37 and the lifting platform 39. In this regard, the substrate transport robot IR may include an advancing / retreating unit 57 and an elevating / rotating unit 59, like the center robot CR.

[0139] DESCRIPTION OF SYMBOLS 1...substrate processing apparatus 7...carrier placement section IR...substrate transport robot 11...lid attachment / detachment section 14...removal opening SL1 to SL25...slot 23...shutter lifting section 25...height sensor 31, 32...distance sensor 35...hand 39E, 45A to 45C...rotary encoder 61...control section 63...storage section 65...notification section TP (TP1 to TP25)...teaching position EA (EA1 to EA25)...point EB (EB1 to EB25)...point DA (DA1 to DA25)...distance DB (DB1 to DB25)...distance DP (DP1 to DP25)...standard center position CP (CP1 to CP25)...center position DF (DF1 to DF25) ... Positional deviation amount RTP (RTP1 to RTP25) ... Corrected teaching position DM ... Diameter 76 ... Elevator 78 ... Height sensor C ... Carrier CT ... Standard carrier WT ... Standard board W ... Board

Claims

1. A processing apparatus comprising: a carrier placement section for placing a processing carrier having a plurality of slots arranged in the vertical direction for storing a plurality of horizontally oriented substrates and a carrier opening for inserting and removing the plurality of substrates; a substrate transport robot having a hand for supporting one substrate and capable of moving the hand; two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier via the carrier opening; a sensor lifting section for moving the two distance sensors in the vertical direction; and a control section, wherein the control section: moves the two distance sensors in the vertical direction using the sensor lifting section; while the two distance sensors are moving, measures two distances between the two distance sensors and two different points on the periphery of each substrate stored in the processing carrier placed on the carrier placement section; and calculates the center position of each substrate in the horizontal plane based on the two distances corresponding to each substrate and the diameter of each substrate; a substrate transport robot transporting the substrates from the processing carrier based on the central position of each substrate in a horizontal plane, the substrate transport robot transporting the substrates from the processing carrier.

2. In the substrate processing apparatus according to claim 1, the control unit executes a teaching process and a teaching correction process, and as the teaching process, the control unit causes the hand to enter the standard carrier placed on the carrier placement unit by the substrate transport robot, and sets a position where the hand picks up a standard substrate stored in a predetermined standard slot out of a plurality of standard slots of the standard carrier as a teaching position, moves the two distance sensors vertically by the sensor lifting unit to a height position corresponding to the standard substrate stored in the standard slot, measures two standard distances between the two distance sensors and two different points on the periphery of the standard substrate stored in the standard slot by the two distance sensors, respectively, calculates a standard center position in the horizontal plane of the standard substrate based on the two standard distances and a diameter of the standard substrate, and associates the standard center position with the teaching position, and then, as the teaching correction process, when the substrate is transported from the processing carrier, moves the two distance sensors vertically by the sensor lifting unit, A substrate processing apparatus comprising: while the two distance sensors are moving, the two distance sensors measure two distances between the two distance sensors and two different points on the peripheral edge of each substrate stored in the processing carrier placed on the carrier mounting section; calculating a central position in a horizontal plane of each substrate based on the two distances corresponding to each substrate and the diameter of each substrate; calculating an amount of positional deviation of the central position for a substrate stored in a slot corresponding to the standard slot among the plurality of slots of the processing carrier, based on the standard central position; and correcting the teaching position associated with the standard central position using the amount of positional deviation; and transporting the substrate of the plurality of substrates from the processing carrier by the substrate transport robot based on the corrected teaching position.

3. A substrate processing apparatus as described in claim 2, characterized in that the control unit performs the teaching process for all of the plurality of standard slots of the standard carrier, and performs the teaching correction process for all of the plurality of slots of the processing carrier.

4. In the substrate processing apparatus of claim 2, the control unit executes the teaching process for a first standard slot which is the lowest of the multiple standard slots of the standard carrier and a second standard slot which is the highest of the multiple standard slots, and as the teaching process for a third standard slot between the first standard slot and the second standard slot of the multiple standard slots, calculates a third teaching position for the third standard slot from the geometric relationship between a first teaching position for the first standard slot and a second teaching position for the second standard slot, calculates a third standard center position for the third standard slot from the geometric relationship between a first standard center position for the first standard slot and a second standard center position for the second standard slot, associates the third standard center position with the third teaching position, and performs the teaching correction process for all of the multiple slots of the processing carrier.

5. A substrate processing apparatus as described in claim 1, wherein the substrate transport robot has two or more hands including the hand, each supporting one substrate, and is capable of moving the two or more hands as a unit; and when the two or more hands support two or more substrates among the plurality of substrates, the control unit calculates an average value of the two or more central positions in the horizontal plane corresponding to the two or more substrates, and transports the two or more substrates from the processing carrier by the substrate transport robot based on the average value.

6. A substrate processing apparatus as described in claim 2, further comprising an alarm unit which emits at least one of sound and light, wherein the control unit controls the alarm unit to emit at least one of sound and light when the amount of positional deviation exceeds a preset range.

7. A substrate transport method for a substrate processing apparatus comprising: a carrier mounting section for mounting a processing carrier having a plurality of slots for storing a plurality of substrates in a horizontal position arranged vertically and a carrier opening for inserting and removing the plurality of substrates; a substrate transport robot having a hand for supporting one substrate and capable of moving the hand; two distance sensors arranged horizontally so as to face the plurality of substrates in the processing carrier via the carrier opening; and a sensor lifting section for moving the two distance sensors in a vertical direction, the method comprising: a sensor moving step for moving the two distance sensors in a vertical direction by the sensor lifting section; a distance measuring step for measuring, while the two distance sensors are moving, two distances between the two distance sensors and two different points on the periphery of each substrate stored in the processing carrier placed on the carrier mounting section; and a center position calculating step for calculating a center position in a horizontal plane of each substrate based on the two distances corresponding to each substrate and the diameter of each substrate. a transport step of transporting the plurality of substrates from the processing carrier by the substrate transport robot based on the central position of each substrate in a horizontal plane.

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