Bonding device having system error compensation function, and method

Abstract

The present application discloses a bonding device having a system error compensation function. The bonding device comprises: a movable object pick-up table, configured to move a first element; a stage, configured to move a second element; a first image acquisition device, configured to read alignment markers of the first element and the second element when driven to an alignment position; and a second image acquisition device, the second image acquisition device being configured to, in response to the bonding device executing a system error correction operation, read alignment markers of the first element and the second element when driven to a bonding position, so as to obtain a system error compensation value, wherein in response to the bonding device executing a bonding operation, the bonding device performs a system error compensation operation on the basis of the system error compensation value, so that the first element and the second element driven to the bonding position are aligned. The present application further discloses a related method. The present application improves the positioning accuracy of the bonding device, thereby improving bonding efficiency.

Description

A bonding device and method with system error compensation function

Technical field

[0001] The disclosed embodiments of the present application relate to the field of semiconductor manufacturing, and more particularly, to a bonding device and method with a system error compensation function. [Background Technology]

[0002] As semiconductor technology enters the post-Moore era, chip structures are evolving toward three-dimensional structures to meet the demands of high integration and high performance. Bonding technology, enabling the fabrication of stacked chips, is a key enabler of this "beyond Moore's Law" initiative. Bonding accuracy is a crucial parameter in the bonding process, significantly impacting its application.

[0003] [Summary of the invention]

[0004] According to an embodiment of the present application, the present application proposes a bonding device with a system error compensation function and a related method.

[0005] The first aspect of the present application discloses a bonding device with a system error compensation function, comprising: a movable picking stage, configured to move a first element; a carrier, configured to move a second element; a first image acquisition device, configured to read the alignment marks of the first element and the second element driven to the alignment position; a second image acquisition device, in response to the bonding device performing a system error correction operation, the second image acquisition device is configured to read the alignment marks of the first element and the second element driven to the bonding position to obtain a system error compensation value; wherein, in response to the bonding device performing a bonding operation, the bonding device performs a system error compensation operation based on the system error compensation value to align the first element and the second element driven to the bonding position.

[0006] The second aspect of the present application discloses a bonding method applied to a bonding device, comprising: using a movable pick-up table and / or a carrier of the bonding device to respectively move a first element and a second element to an alignment position; using a first image acquisition device of the bonding device to read alignment marks of the first element and the second element in the alignment position, so that the first element and the second element are aligned in the height direction; in response to the bonding device performing a system error correction operation, driving the first element and the second element to the bonding position, and using the second image acquisition device of the bonding device to identify the alignment marks of the first element and the second element in the bonding position to obtain a system error compensation value of the bonding device; in response to the bonding device performing a bonding operation, performing a system error compensation operation based on the system error compensation value to align the first element and the second element driven to the bonding position.

[0007] The details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims.

Brief Description of the Drawings

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0009] FIG1 is a schematic structural diagram of a bonding device according to an embodiment of the present application;

[0010] FIG2 is a top view of a first image acquisition device according to an embodiment of the present application;

[0011] FIG3 is a top view of a second image acquisition device according to an embodiment of the present application;

[0012] FIG4 is a schematic diagram of an alignment state according to an embodiment of the present application;

[0013] FIG5 is a schematic diagram of a non-aligned bit state according to an embodiment of the present application;

[0014] FIG6 is a schematic flow chart of the bonding method according to an embodiment of the present application. [Specific implementation method]

[0015] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0016] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0017] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0018] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0019] Please refer to Figure 1, which is a structural schematic diagram of a bonding device according to an embodiment of the present application. Specifically, the bonding device 100 may include: a movable object-picking platform 10, a carrier 20, a first image acquisition device 30 and a second image acquisition device 40.

[0020] The movable pickup platform 10 is configured to move the first component 11 ; the carrier 20 is configured to move the second component 21 .

[0021] The first image acquisition device 30 is configured to read the alignment marks of the first element 11 and the second element 21 driven to the alignment position. The alignment position, i.e., the alignment marks of the first element 11 and the second element 21, appear in the field of view of the first image acquisition device 30. The bonding device 100 is further configured to adjust the first element 11 and the second element 21 in the alignment position based on the alignment marks read by the first image acquisition device 30, so that the first element 11 and the second element 21 in the alignment position are aligned in the height direction. For example, the bonding device 100 drives the movable object picking stage 10 and / or the carrier stage 20 to adjust based on the information of the alignment marks read by the first image acquisition device 30 to align the first element 11 and the second element 21, that is, when the first element 11 and the second element 21 are located in the bonding start position, the alignment mark of the first element 11 is aligned with the alignment mark of the second element 21 in the height direction. The second image acquisition device 40 is configured to read the alignment marks of the first element 11 and the second element 21 driven to the bonding position in response to the bonding device 100 performing the system error correction operation to obtain the system error compensation value. The bonding position is the area where the first element 11 and the second element 21 perform the bonding operation. For example, the movable pick-up stage 10 moves the first element 11 and / or the carrier stage 20 moves the second element 21 along the height direction to the bonding position where the first element 11 and the second element 21 complete the bonding. The second image acquisition device 40 is configured to identify the alignment marks of the first element 11 and the second element 21 driven to the bonding position, and then obtain the system error compensation value.

[0022] Furthermore, in response to the bonding device 100 performing a bonding operation, based on the system error compensation value, the bonding device 100 performs a system error compensation operation to align the first element 11 and the second element 21 driven to the bonding position. For example, the bonding device 100 adjusts the movable pick-up table 10 and / or the carrier 20 based on the system error compensation value to align the first element 11 and the second element 21 after moving along the height direction and completing the bonding.

[0023] Among them, the system error compensation value is a correction compensation value, that is, the compensation value of the alignment deviation caused by the vertical displacement in the process of the bonding device 100 being moved by the movable picking table 10 to drive the first element 11 and / or the carrier 20 to drive the second element 21 along the height direction to complete the bonding of the first element 11 and the second element 21. In some embodiments, the system error compensation value also includes the compensation value of the alignment deviation caused by the bonding force applied to the first element and the second element during the bonding process, and then the bonding operation is performed based on the system error compensation value, thereby improving the positioning accuracy and bonding efficiency of the bonding device.

[0024] Specifically, in response to the bonding device 100 performing a bonding operation, the bonding device 100 adjusts the movable pick-up stage 10 and / or the carrier 20 based on the system error compensation value to perform a system error compensation operation on the first element 11 and the second element 21 in the alignment position, and then moves the movable pick-up stage 10 and / or the carrier 20 in the height direction so that the first element 11 and the second element 21 are driven to the bonding position; or, in response to the bonding device 100 performing a bonding operation, the bonding device 100 moves the movable pick-up stage 10 and / or the carrier 20 in the height direction so that the first element 11 and the second element 21 are driven to the bonding position, and adjusts the movable pick-up stage 10 and / or the carrier 20 based on the system error compensation value to perform a system error compensation operation on the first element 11 and the second element 21.

[0025] Furthermore, the bonding device 100 also includes a base 51 and a machine frame 52, wherein the movable picking platform 10 is configured to be movable along the X and Y directions of the horizontal plane, and movable along the height direction Z; the carrier 20 is configured to be movable along the X and Y directions of the horizontal plane, and can be rotated in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the carrier 20, wherein the rotation angle θ is the horizontal adjustment angle of the carrier 20.

[0026] It should be noted that Figure 1 only shows an embodiment in which the movable picking platform 10 is set at the top of the machine frame 52 and the carrier 20 is set on the base 51. In another embodiment, the movable picking platform 10 can also be set on the base 51 and the carrier 20 is set at the top of the machine frame 52, specifically to achieve moving the first component 11 and the second component 21 to the bonding position. Therefore, the positions of the movable picking platform 10 and the carrier 20 are not limited in this application.

[0027] Specifically, in some embodiments, the base 51 and the machine frame 52 together form a structure having a cavity, wherein the machine frame 52 has a top plate 521 and a plurality of side plates 522 respectively connected to the top plate 521. The base 51 is generally a planar structure, and the ends of the plurality of side plates 522 of the machine frame 52 are respectively arranged on the base 51. The machine 50 also includes a displacement acquisition component 53, which can be a component such as a laser interferometer or a plane grating for achieving high-precision positioning. Furthermore, the displacement acquisition component 53 is configured to determine the displacement information of the carrier 20 and the movable object collection platform 10 along the first direction Y and the second direction X; based on the displacement information along the first direction Y and the second direction X, the displacement acquisition component 53 is also configured to determine the coordinate information of the second element 21 and the first element 11 in the first direction Y and the second direction X.

[0028] In some embodiments, the movable pickup stage 10 may have a macro-micro dual-stage motion mechanism, which includes a macro-drive member capable of submicron coarse positioning and a micro-drive member capable of submicron precision positioning, so that the movable pickup stage can move in a "coarse adjustment + fine adjustment" manner in the X, Y, Z, and rotational directions. Specifically, the movable pickup stage 10 can be composed of a first drive member 111, a second drive member 112, a rotary drive member 113, and a bond pickup head 114 in a stacked combination to pick up and move the first component 11, wherein the bond pickup head 114 is connected to the rotary drive member 113 and the end of the bond pickup head 114 is directed toward the first component 11. The first drive member 111 is configured to move the second drive member 112 and the rotary drive member 113 in a horizontal plane along the first direction Y and / or the second direction X, thereby moving the bond pickup head 114 in the horizontal plane along the first direction Y and / or the second direction X. Furthermore, the second driving member 112 is configured to move the rotating driving member 113 along the third direction Z in a plane perpendicular to the horizontal plane, and then move the bonding pickup head 114 along the third direction Z, and the rotating driving member 113 is configured to rotate the bonding pickup head 114 so that the bonding pickup head 114 picks up the first component 11 and drives the first component 11 to move along the height direction until it completes bonding with the second component 21.

[0029] Correspondingly, the second driving member 112 can achieve precise positioning of the bonding pickup head 114 in the third direction Z by moving the rotary driving member 113 along the third direction Z. The rotary driving member 113 can achieve micro-radian level positioning accuracy.

[0030] It should be noted that the first drive member 111 / the second drive member 112 / the rotary drive member 113 may also include: a motor, for example, a linear motor or a rotary motor, to provide power to the corresponding drive members respectively. It is understandable that the structural design of the macro-micro dual-stage motion mechanism of the first drive member 111 in the embodiment of the present application may also refer to the specific structure in the relevant technology. As long as the function of moving the bonding pickup head 114 along the first direction Y in the horizontal plane and achieving sub-micron precision positioning can be achieved, this application does not impose specific restrictions. Accordingly, the structural design of the macro-micro dual-stage motion mechanism of the second drive member 112 and the structural design of the macro-micro dual-stage motion mechanism of the rotary drive member 113 may also refer to the specific structure in the relevant technology, as long as their corresponding functions can be achieved.

[0031] The first direction Y, the second direction X, and the third direction Z intersect with each other to establish a spatial coordinate system. Preferably, the first direction Y, the second direction X, and the third direction Z are perpendicular to each other, as shown in FIG1 . Specifically, if the direction of the Y-axis is parallel to the first direction Y, the direction of the X-axis is parallel to the second direction X, and the direction of the Z-axis is parallel to the third direction Z, then the first driving member 111 may also be referred to as a Y-axis or X-axis driving member, and the second driving member 112 may also be referred to as a Z-axis driving member.

[0032] Optionally, the movable picking table 10 can also be a single-stage motion mechanism or other types of motion mechanisms, as long as it can move the first element 11 to be bonded to the preset surface position of the second element 21 to be bonded while meeting specific precision requirements, and perform high-precision displacement operations on the first element 11 according to the system error compensation value, and bond it to the preset surface position of the second element 21 to be bonded.

[0033] In some embodiments, the carrier 20 includes a chuck 211 and a third driving member 212. The chuck 211 is configured to carry the second element 21 to be bonded. The carrier 20 may also have a macro-micro dual-stage motion mechanism. The third driving member 212 is configured to move the chuck 211 along the first direction Y and / or the second direction X in the horizontal plane, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the carrier 20, wherein the rotation angle θ is the horizontal adjustment angle of the carrier 20.

[0034] It can be understood that the movable object-picking platform 10 / carrier 20 can be moved in the horizontal direction, height direction, and rotation direction by multiple driving devices, or it can be controlled by a driving device with multiple position angle adjustments.

[0035] Among them, the third driving member 212 may include: a first direction driving member, a second direction driving member and a horizontal adjustment member, the first direction driving member is configured to move the chuck 211 along the first direction Y in the horizontal plane, the second direction driving member is configured to move the chuck 211 along the second direction X in the horizontal plane, and the horizontal adjustment member is configured to rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the carrier 20, wherein the rotation angle θ is the horizontal adjustment angle of the carrier 20.

[0036] In some embodiments, the first image acquisition device 30 is used to obtain the alignment mark of the first element 11 and the alignment mark of the second element. For example, the first image acquisition device 30 includes an upper view image acquisition unit and a lower view image acquisition unit. The upper view image acquisition unit has a first viewing angle and is configured to identify the alignment mark of the first element 11. The lower view image acquisition unit has a second viewing angle and is configured to identify the alignment mark of the second element 21. The upper view image acquisition unit and the lower view image acquisition unit can be arranged relative to each other. For example, when identifying the alignment mark, the upper view image acquisition unit can be located on the side of the top plate 521 of the base 51 facing the machine frame 52, and the lower view image acquisition unit can be located on the side of the top plate 521 of the machine frame 52 facing the base 51; or the upper view image acquisition unit and the lower view image acquisition unit can also be arranged as an integral device, for example, a top-down view image acquisition device. When identifying the alignment mark, the top-down view image acquisition device is located in a cavity formed by the base 51 and the machine frame 52.

[0037] Preferably, the first image acquisition device 30 is taken as an example of a top-down image acquisition device, as shown in Figure 2, which is a top view of the first image acquisition device of an embodiment of the present application. The first image acquisition device 30 includes an top-down image acquisition unit 31 and a bottom-down image acquisition unit 32. The top-down image acquisition unit 31 is adjacent to the bottom-down image acquisition unit 32, and the distance between the two can be adjusted according to product requirements. The bonding device 100 drives at least one of the movable object picking platform 10 or the carrier 20 to adjust based on the alignment mark of the first component 11 identified by the top-down image acquisition unit 31 and the alignment mark of the second component 21 identified by the bottom-down image acquisition unit 32, so as to align the first component 11 and the second component 21 in the alignment position, so that the alignment mark of the first component 11 is aligned with the alignment mark of the second component 21 in the height direction.

[0038] After aligning the first component 11 and the second component 21 in the alignment position, and before the first component 11 and / or the second component 21 are moved in the height direction, the first image acquisition device 30 is driven to the initial position. For example, the first image acquisition device 30 further includes an acquisition device rotation drive 33 to drive the entire first image acquisition device 30 to rotate, thereby realizing the conversion between the initial position and the working position. The working position is when the first image acquisition device 30 is moved to the bonding position area so that the alignment marks of the first component 11 and the second component 21 located at the bonding start position appear in the field of view of the first image acquisition device 30. The initial position is when the first image acquisition device 30 is moved out of the bonding position area so that the first component 11 and the second component 21 can be bonded.

[0039] The upward image acquisition unit 31 includes an upward image processing component 311 and an upward image acquisition component 312. The upward image acquisition unit 31 has a first viewing angle, which is an upward viewing angle, and is configured to identify the alignment mark of the first component 11. The downward image acquisition unit 32 includes a downward image processing component 321 and a downward image acquisition component 322. The downward image acquisition unit 32 has a second viewing angle, which is a downward viewing angle, and is configured to identify the alignment mark of the second component 21. Optionally, the upward image acquisition component 312 and the downward image acquisition component 322 may be cameras. For example, the upward image acquisition component 312 may be referred to as an upward camera, and the downward image acquisition component 322 may be referred to as a downward camera.

[0040] In some embodiments, both the upward-viewing image acquisition unit 31 and the downward-viewing image acquisition unit 32 may include image acquisition components, a prism, and an objective lens system, etc., to identify the alignment marks of the first element 11 and the second element 21 .

[0041] It is understood that the center point of the upward image acquisition unit 31 and the downward image acquisition unit 32 is the center of the field of view of the upward and downward image acquisition devices. Specifically, the position information corresponding to the alignment mark of the first component 11 read by the upward image acquisition unit 31 and the position information corresponding to the alignment mark of the second component 21 read by the downward image acquisition unit 32 can be converted into position coordinates in the same coordinate system.

[0042] In some embodiments, a second image acquisition device 40 is disposed around the bonding position. The second image acquisition device 40 has a third viewing angle for identifying alignment marks between the first component 11 and the second component 21 after movement in the height direction and / or bonding. The third viewing angle can be an upper or lower viewing angle. The movable platform 10 drives the first component 11 and / or the carrier 20 drives the second component 21 to move in the height direction to the bonding position where the first component 11 and the second component 21 are bonded. The second image acquisition device 40 is configured to identify alignment marks between the first component 11 and the second component 21 after movement in the height direction and / or bonding. That is, after the movable platform 10 drives the first component 11 and / or the carrier 20 drives the second component 21 to move in the height direction to complete bonding between the first component 11 and the second component 21, the second image acquisition device 40 identifies alignment marks between the first component 11 and the second component 21 after movement in the height direction and bonding, thereby obtaining a system error compensation value.

[0043] Preferably, in some embodiments, as shown in FIG1 , the second image acquisition device 40 is disposed on the second driving member 112 via a cantilever to follow the displacement of the movable pickup platform 10 carrying the first component 11 in the first direction Y, the second direction X, and the third direction Z, wherein the first direction Y and the second direction X are different directions intersecting in a horizontal plane, and the third direction Z is a height direction perpendicular to the horizontal plane, so that position information of the alignment marks of the first component 11 and the second component 21 after bonding can be conveniently and quickly acquired. At this time, the viewing angle of the second image acquisition device 40 is a downward viewing angle, and is configured to identify the alignment marks of the first component 11 and the second component 21 after downward movement and / or bonding operation, that is, to identify the alignment marks of the downwardly moved first component 11 and the second component 21, as well as the alignment marks of the first component 11 and the second component 21 after bonding.

[0044] In response to the bonding device 100 performing the system error correction operation, the second image acquisition device 40 recognizes the alignment mark of the first component 11 when it is located at the bonding start position; the bonding device 100 drives the movable pick-up table 10 to drive the first component 11 and / or the carrier 20 to carry the second component 21 to move along the height direction and perform the bonding operation of the first component 11 and the second component 21; the second image acquisition device 40 recognizes the alignment mark of the first component 11 and the second component 21 after bonding, that is, after the first component 11 and the second component 21 are bonded, the second image acquisition device 40 recognizes the alignment mark of the first component 11 The alignment mark and the alignment mark of the second element 21 identified through the first element 11 can be understood that, since the first element 11 is in the process of moving downward and bonding the first element 11 and the second element 21, the alignment mark position of the first element 11 and the second element 21 after bonding will produce a displacement deviation compared with the alignment mark position at the bonding starting position, that is, the alignment mark of the first element 11 and the second element 21 after moving downward and / or performing the bonding operation is identified by the second image acquisition device 40, and the system error compensation value is obtained, that is, the displacement compensation value of the alignment position generated in the process of the first element 11 and / or the second element 21 carried by the movable object picking table 10 moving downward in the height direction by the first element 11 and / or the carrier 20 carrying the second element 21 to complete the bonding of the first element 11 and the second element 21 is obtained.

[0045] In some embodiments, the second image acquisition device 40 includes at least one image acquisition unit to identify the alignment marks of the first element 11 and the second element 21 at the bonding position. For example, the second image acquisition device 40 may include an image acquisition unit configured to simultaneously identify the alignment marks of the first element 11 and the second element 21 after the bonding operation is performed.

[0046] Preferably, the second image acquisition device 40 may include two image acquisition units, as shown in FIG3 , which is a top view of the second image acquisition device 40 according to an embodiment of the present application. The second image acquisition device 40 is a bottom-view image acquisition device, including an image acquisition unit 41 and an image acquisition unit 42. The image acquisition unit 41 and the image acquisition unit 42 are configured to identify the alignment marks of the first component 11 and the second component 21 on the bonding position, for example, to identify the alignment marks of the first component 11 and the second component 21 after moving in the height direction and / or performing the bonding operation. For example, the second image acquisition device 40 identifies the first component 11. 1, and alignment mark B1 and alignment mark B2 of the second component 21 that matches the first component 11, wherein alignment mark A1 matches alignment mark B1, and alignment mark A2 matches alignment mark B2, the image acquisition unit 41 can be used to identify the alignment mark A1 of the first component 11 and the alignment mark B1 of the second component 21, and the image acquisition unit 42 can be used to identify the alignment mark A2 of the first component 11 and the alignment mark B2 of the second component 21. The two image acquisition units can ensure a sufficiently large field of view to accurately identify the alignment marks. It will be understood by those skilled in the art that the downward image acquisition device can also include three or more downward image acquisition units to ensure a sufficient field of view to accurately identify the alignment marks. Optionally, the downward image acquisition units 41 and 42 include cameras to identify the alignment marks of the first component 11 and the second component 21 after moving in the height direction and / or performing a bonding operation.

[0047] In some embodiments, in response to the bonding device 100 performing a system error correction operation, the first element 11 is configured as a first correction plate, and the second element 21 is configured as a matching second correction plate, that is, the first correction plate matches the second correction plate, and there are at least one paired alignment mark thereon, such as alignment mark A1 and alignment mark A2 of the first correction plate, and alignment mark B1 and alignment mark B2 of the second correction plate that matches the first correction plate, wherein the alignment mark A1 matches the alignment mark B1, and the alignment mark A2 matches the alignment mark B2, that is, when the alignment mark A1 is aligned with the alignment mark B1, and the alignment mark A2 is aligned with the alignment mark B2, it can be determined that the first correction plate and the second correction plate are aligned. In response to the bonding device 100 performing a bonding operation, the first element 11 is configured as a chip or wafer to be bonded, and accordingly, the second element 21 is configured as a wafer or chip to be bonded. At this time, the bonding device 100 can move the movable pick-up table 10 and / or the carrier 20 along the height direction based on the system error compensation value, so that the chip or wafer to be bonded after moving along the height direction and the wafer or chip to be bonded are aligned, so as to move the first element 11 to be bonded to the preset surface position of the second element 21 to be bonded, and bond it to the preset surface position of the second element 21 to be bonded.

[0048] It can be understood that the system error correction operation is a process of reading the alignment marks of the first element 11 and the second element 21 moved to the bonding position along the height direction to obtain the coordinate deviation value generated in the vertical direction as the system error compensation value, wherein the first element 11 is configured as a first correction plate and the second element 21 is configured as a matching second correction plate; and the system error compensation operation is a process in which the bonding device 100 adjusts the movable pick-up table 10 and / or the carrier 20 based on the system error compensation value to perform the bonding of the first element 11 and the second element 21, wherein the first element 11 is configured as a chip or wafer to be bonded, and the second element 21 is configured as a wafer or chip to be bonded.

[0049] Furthermore, in some embodiments, the first calibration plate is a transparent, translucent or calibration plate having a through-hole structure, that is, the second image acquisition device 40 can identify the alignment mark of the second calibration plate through the first calibration plate. For example, the transparent calibration plate can be a glass plate, and the translucent calibration plate can be a translucent glass plate. In response to the bonding device 100 performing a system error correction operation, the movable object picking stage 10 drives the first calibration plate and / or the carrier drives the second calibration plate to move along the height direction until the first calibration plate contacts and bonds with the second calibration plate. The second image acquisition device 40 is configured to identify the alignment marks of the first calibration plate and the second calibration plate after moving along the height direction and / or performing the bonding operation, thereby obtaining a system error compensation value.

[0050] In some embodiments, the upward image acquisition unit 31, in response to the first image acquisition device 30 being driven to the alignment position, as shown in Figure 4, which is a state schematic diagram of the alignment position of an embodiment of the present application, is configured to identify the alignment mark of the first component 11, that is, to identify the alignment mark of the first component 11 at the bonding start position through the upward image processing component 311; the downward image acquisition unit 32, in response to the first image acquisition device 30 being driven to the alignment position, is configured to identify the alignment mark of the second component 21, that is, to identify the alignment mark of the second component 21 at the bonding start position through the downward image processing component 321.

[0051] Among them, the bonding device 100 drives at least one of the movable object picking stage 10 or the carrier 20 to adjust based on the alignment mark of the first element 11 identified by the upward image acquisition unit 31 and the alignment mark of the second element 21 identified by the downward image acquisition unit 32 to align the first element 11 and the second element 21, that is, the first element 11 and the second element 21 both appear in the camera field of view of the first image acquisition device 30, and performs difference calculation based on the coordinate data of the alignment marks of the first element 11 and the second element 21 to obtain the X / Y / θ difference and adjusts and compensates by driving at least one of the movable object picking stage 10 or the carrier 20 to achieve alignment of the first element 11 and the second element 21.

[0052] Furthermore, in some embodiments, after aligning the first element 11 and the second element 21, for example, in response to the bonding device 100 performing a system error correction / bonding operation, after aligning the first element 11 and the second element 21, the movable pick-up stage 10 drives the first element 11 and / or the carrier carrying the second element 21 to move in the height direction to a bonding position where the first element 11 and the second element 21 are bonded. Before the movable pick-up stage 10 drives the first element 11 to move in the height direction, the first image acquisition device 30 is driven to a non-alignment position, for example, an initial position of the first image acquisition device 30, as shown in FIG5 , which is a schematic diagram of the state of the non-alignment position according to an embodiment of the present application, thereby avoiding obstruction of the first element 11 and / or the second element 21 during the movement in the height direction, and achieving the goal of moving the first element 11 and / or the second element 21 in the height direction to a preset surface position where the surfaces of the first element 11 and the second element 21 contact each other, and performing the bonding process on the first element 11 and the second element 21 at the preset surface position.

[0053] In some embodiments, the second image acquisition device 40 is a downward-looking image acquisition device, which is disposed on the movable object-taking platform 10, wherein when the bonding device 100 performs a system error correction operation, the first element and the second element aligned at the alignment position are configured to move in the height direction to the bonding position, and the second image acquisition device 40 is configured to identify the alignment marks of the first element 11 and the second element 21 at the bonding position. For example, the second image acquisition device 40 can identify the alignment marks of the first element 11 and the second element 21 moving in the height direction, and obtain the difference between the alignment marks of the first element and the second element, wherein the difference between the alignment marks includes the difference in the X direction and the difference in the Y direction in the coordinate system established by the second image acquisition device 40, for example, the first element 11 The first calibration plate is transparent, and the second element 21 is a matching second calibration plate. After the movable picking stage 10 drives the first element 11 and / or the carrier carrying the second element 21 to move in the height direction to the bonding position where the first element 11 and the second element 21 are bonded, the alignment mark of the first calibration plate can be identified by the second image acquisition device 40, and the alignment mark of the second calibration plate can be identified by the first calibration plate. Then, based on the difference between the alignment marks of the first element 11 and the second element 21 after moving in the height direction and performing the bonding process, that is, based on the alignment marks of the first element 11 and the second element 21 after moving in the height direction and / or performing the bonding operation, the X / Y direction coordinate difference between them is calculated as the system error value, and then the system error correction operation is performed.

[0054] In some embodiments, the bonding device 100 can obtain multiple system error values ​​by performing system error correction operations multiple times, that is, by obtaining multiple times the movable object picking table 10 drives the first element 11 located at the bonding starting position and / or the carrier 20 carries the second element 21 located at the bonding starting position to move along the height direction to the bonding position where the first element 11 and the second element 21 are bonded, the second image acquisition device 40 completes the identification of the alignment marks of the first element 11 and the second element 21 moving along the height direction, obtains multiple system error compensation values ​​through difference calculation, and obtains the system error compensation value based on the average of the multiple system error values. The bonding device 100 sets the moving path of the movable object picking table 10 and / or the carrier 20 based on the system error compensation value before performing the bonding operation, and then performs the bonding operation to achieve higher precision alignment of the first element 11 and the second element 21 that are finally bonded.

[0055] In some embodiments, the second image acquisition device 40 is detachably provided on the movable object picking stage 10 to perform a system error correction operation. It can be understood that by providing the second image acquisition device 40 on the movable object picking stage 10 to perform a system error correction operation, after obtaining the system error compensation value, the second image acquisition device 40 can be removed. In response to the bonding device 100 performing a bonding operation, the bonding device 100 moves the movable object picking stage 10 and / or the carrier 20 in the height direction based on the system error compensation value, so that the first element 11 and the second element 21 after moving in the height direction are aligned and bonded.

[0056] Please refer to FIG6 , which is a schematic flow chart of a bonding method according to an embodiment of the present application. The method is applied to the bonding device 100 described above. As shown in FIG6 , the method may include the following steps:

[0057] S61: Use the movable pick-up platform and / or the carrier of the bonding device to move the first component and the second component to the alignment position respectively.

[0058] The movable pick-up table 10 and / or the carrier 20 of the bonding device 100 are used to move the first component 11 and the second component 21 to the alignment position respectively. The alignment position includes the starting position of the first component 11 and the second component 21 when bonding, and may also include the position where the first component 11 and the second component 21 appear in the field of view of the first image acquisition device 30 of the bonding device 100.

[0059] S62: Using the first image acquisition device of the bonding device, read the alignment marks of the first component and the second component in the alignment position, so as to align the first component and the second component in the height direction.

[0060] The first image acquisition device 30 of the bonding device 100 is used to read the alignment marks of the first component 11 and the second component 21 in the alignment position, and the movable object picking platform 10 and / or the carrier 20 are driven to adjust based on the alignment marks to align the first component 11 and the second component 21, that is, the alignment mark of the first component 11 is aligned with the alignment mark of the second component 21 in the vertical direction.

[0061] S63: In response to the bonding device performing a system error correction operation, the first component and the second component are driven to the bonding position, and the second image acquisition device of the bonding device is used to identify the alignment marks of the first component and the second component at the bonding position to obtain a system error compensation value of the bonding device.

[0062] In response to the bonding device 100 performing a system error correction operation, the first element 11 and the second element 21 are driven to the bonding position, for example, by using the movable pick-up table 10 and / or the carrier 20 to move the first element 11 and / or the second element 21 in the height direction until bonding is completed, and then the second image acquisition device 40 of the bonding device 100 is used to identify the alignment marks 21 of the first element 11 and the second element after the movement in the height direction and / or the bonding operation is performed, that is, the alignment marks of the first element 11 and the alignment marks of the second element 21 before the movement in the height direction, as well as the alignment marks of the first element 11 and the alignment marks of the second element 21 after the movement in the height direction and / or the bonding operation is performed, and the system error correction operation is completed by the position change of the alignment marks of the first element 11 and the second element 21. By performing the system error correction operation multiple times, multiple system error values ​​of the bonding device 100 can be obtained, and the system error compensation value of the bonding device 100 is obtained based on the average of the multiple system error values.

[0063] S64 : In response to the bonding apparatus performing a bonding operation, performing a system error compensation operation based on the system error compensation value to align the first element and the second element driven to the bonding position.

[0064] When the bonding device 100 performs a bonding operation, a system error compensation operation is performed based on the obtained system error compensation value, so that the first element 11 and the second element 21 driven to the bonding position are aligned, that is, the bonding device 100 sets the movable pick-up table 10 and / or the carrier 20 to move in the height direction to the compensation value during the bonding process based on the system error compensation value, so as to successfully move the first element 11 to be bonded along the height direction to the preset surface position of the second element 21 to be bonded, and bond it at the preset surface position of the second element 21.

[0065] In some embodiments, in response to the bonding device 100 performing a system error correction operation, the first element 11 is configured as a first correction plate, and the second element 21 is configured as a matching second correction plate, that is, the first correction plate matches the second correction plate, and there are at least one paired alignment mark thereon, such as alignment mark A1 and alignment mark A2 of the first correction plate, and alignment mark B1 and alignment mark B2 of the second correction plate that matches the first correction plate, wherein the alignment mark A1 matches the alignment mark B1, and the alignment mark A2 matches the alignment mark B2, that is, when the alignment mark A1 is aligned with the alignment mark B1, and the alignment mark A2 is aligned with the alignment mark B2, it can be determined that the first correction plate and the second correction plate are aligned.

[0066] Furthermore, in response to the bonding device 100 performing a system error correction operation, the first element 11 and the second element 21 are driven to the bonding position, and the second image acquisition device 40 of the bonding device 100 is used to identify the alignment marks of the first element 11 and the second element 21 at the bonding position to obtain a system error compensation value of the bonding device 100, including: using the movable object picking stage 10 and / or the carrier 20 to move the first element 11 and the second element 21 to the bonding position; using the second image acquisition device 40 to identify the difference between the alignment marks of the first element 11 and the second element 21 at the bonding position as the system error value to obtain the system error compensation value.

[0067] For example, the first element 11 is a transparent first calibration plate, and the second element 21 is a matching second calibration plate. After the movable object-picking platform 10 drives the first element 11 and / or the carrier carrying the second element 21 to move along the height direction to the bonding position where the first element 11 and the second element 21 are bonded, the alignment mark of the first calibration plate can be identified by the second image acquisition device 40, and the alignment mark of the second calibration plate can be identified by the first calibration plate. Then, based on the difference between the alignment marks of the first element 11 and the second element 21 after moving along the height direction and performing the bonding process, that is, based on the alignment marks of the first element 11 and the second element 21 after moving along the height direction and / or performing the bonding operation, the X / Y direction coordinate difference between them is calculated as the system error value, and then the system error correction operation is performed.

[0068] In some embodiments, the bonding apparatus 100 performs the systematic error correction operation multiple times to obtain a plurality of systematic error values, and obtains a systematic error compensation value based on an average of the plurality of systematic error values.

[0069] The bonding device 100 performs a system error correction operation multiple times to obtain a plurality of system error values, that is, the movable pick-up table 10 drives the first component 11 located at the alignment position and / or the carrier 20 carries the second component 21 located at the alignment position to move along the height direction to the bonding position where the first component 11 and the second component 21 are bonded together, the second image acquisition device 40 completes the identification of the alignment marks of the first component 11 and the second component 21 moving along the height direction, obtains a plurality of system error compensation values ​​by difference calculation, and obtains the system error compensation value based on the average of the plurality of system error values. The bonding device 100 sets the moving path of the movable pick-up table 10 and / or the carrier 20 based on the system error compensation value before performing the bonding operation, and then performs the bonding operation, so that the first component 11 and the second component 21 that are finally bonded can be aligned with higher precision.

[0070] In some embodiments, the first calibration sheet is transparent, translucent, or has a through hole.

[0071] The first calibration plate is transparent, translucent, or has a through-hole structure, that is, the second image acquisition device 40 can identify the alignment mark of the second calibration plate through the first calibration plate. For example, the transparent calibration plate can be a glass plate, and the translucent calibration plate can be a translucent glass plate. In response to the bonding device 100 performing a system error correction operation, the movable object picking stage 10 drives the first calibration plate and / or the carrier drives the second calibration plate to move along the height direction until the first calibration plate contacts and bonds with the second calibration plate. The second image acquisition device 40 is configured to identify the alignment marks of the first calibration plate and the second calibration plate after moving along the height direction and / or performing the bonding operation, thereby obtaining a system error compensation value.

[0072] In some embodiments, in response to the bonding apparatus 100 performing a bonding operation, the first element 11 is configured as a chip or wafer to be bonded, and the second element 21 is configured as a wafer or chip to be bonded.

[0073] Furthermore, in response to the bonding device 100 performing a bonding operation, a system error compensation operation is performed based on the system error compensation value to align the first element 11 and the second element 21 driven to the bonding position, including: using the movable loading platform 10 and / or the carrier 20 to move the first element 11 and the second element 21 to the bonding position, and performing a system error compensation operation to align the first element and the second element driven to the bonding position.

[0074] The first element 11 and the second element 21 are moved to the bonding position by using the movable loading platform 10 and / or the carrier 20, and a system error compensation operation is performed, that is, the first element 11 and the second element 21 in the alignment position are adjusted based on the acquired system error compensation value of the bonding device 100, and moved to the bonding position, so that the first element and the second element driven to the bonding position are aligned for the bonding operation.

[0075] In some embodiments, the movable picking stage 10 and / or the carrier 20 is used to move the first element 11 and the second element 21 to the bonding position, and a system error compensation operation is performed to align the first element 11 and the second element 21 driven to the bonding position, including: adjusting the movable picking stage 10 and / or the carrier 20 based on the system error compensation value to perform a system error compensation operation on the first element 11 and the second element 21 in the alignment position, and then moving the movable picking stage 10 and / or the carrier 20 in the height direction to drive the first element 11 and the second element 21 to the bonding position; or while moving the movable picking stage 10 and / or the carrier 20 in the height direction to drive the first element 11 and the second element 21 to the bonding position, adjusting the movable picking stage 10 and / or the carrier 20 based on the system error compensation value to perform a system error compensation operation on the first element 11 and the second element 21.

[0076] In some embodiments, before using the first image acquisition device 30 of the bonding apparatus 100 to read the alignment marks of the first component 11 and the second component 21 in the alignment position to align the first component 11 and the second component 21 in the height direction, the first image acquisition device 30 is driven to move from the initial position to the working position to read the alignment marks of the first component 11 and the second component 21 in the alignment position. The working position is when the first image acquisition device 30 is moved to the bonding position area so that the alignment marks of the first component 11 and the second component 21 in the bonding start position appear within the field of view of the first image acquisition device 30, and the initial position is when the first image acquisition device 30 is moved out of the bonding position area.

[0077] Furthermore, after the first image acquisition device 30 of the bonding device 100 reads the alignment marks of the first component 11 and the second component 21 in the alignment position so that the first component 11 and the second component 21 are aligned in the height direction, the first image acquisition device 30 is driven to move from the working position to the initial position to facilitate the subsequent system error correction operation or bonding operation.

[0078] In some embodiments, the first image acquisition device 30 is a top-down image acquisition device.

[0079] The first image acquisition device 30 is used to obtain the alignment mark of the first component 11 and the alignment mark of the second component. For example, the first image acquisition device 30 includes an upper view image acquisition unit and a lower view image acquisition unit. The upper view image acquisition unit has a first viewing angle and is configured to identify the alignment mark of the first component 11. The lower view image acquisition unit has a second viewing angle and is configured to identify the alignment mark of the second component 21. The upper view image acquisition unit and the lower view image acquisition unit can be arranged relative to each other. For example, when identifying the alignment mark, the upper view image acquisition unit can be located on the side of the top plate 521 of the base 51 facing the machine frame 52, and the lower view image acquisition unit can be located on the side of the top plate 521 of the machine frame 52 facing the base 51; or the upper view image acquisition unit and the lower view image acquisition unit can also be arranged as an integral device, for example, a top-down view image acquisition device. When identifying the alignment mark, the top-down view image acquisition device is located in a cavity formed by the base 51 and the machine frame 52.

[0080] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A bonding device with a system error compensation function, characterized in that, it includes: A movable pick-up stage configured to move the first component; A carrier stage configured to move the second component; A first image acquisition device configured to read the alignment marks of the first component and the second component driven to the alignment position; A second image acquisition device, in response to the bonding device performing a system error correction operation, the second image acquisition device is configured to read the alignment marks of the first component and the second component driven to the bonding position to obtain a system error compensation value; Wherein, in response to the bonding device performing a bonding operation, based on the system error compensation value, the bonding device performs a system error compensation operation to align the first component and the second component driven to the bonding position.

2. The bonding device according to claim 1, characterized in that, The bonding device is further configured to adjust the first component and the second component in the alignment position based on the alignment marks read by the first image acquisition device, so that the first component and the second component in the alignment position are aligned in the height direction.

3. The bonding device according to claim 1, characterized in that, In response to the bonding device performing the system error correction operation, the first component is configured as a first calibration chip, and the second component is configured as a matching second calibration chip; In response to the bonding device performing the bonding operation, the first component is configured as a chip or wafer to be bonded, and the second component is configured as a wafer or chip to be bonded.

4. The bonding device according to claim 3, characterized in that, The first calibration chip is a transparent, semi-transparent or calibration chip with through holes.

5. The bonding device according to claim 2, characterized in that, In response to the bonding device performing a system error correction operation, the first component and the second component aligned in the alignment position are configured to move to the bonding position in the height direction, and the second image acquisition device is configured to identify the alignment marks of the first component and the second component at the bonding position, and obtain the difference between the alignment marks of the first component and the second component as the system error value to perform the system error correction operation.

6. The bonding device according to claim 5, characterized in that, The bonding device performs the system error correction operation multiple times to obtain multiple system error values, and obtains the system error compensation value based on the average value of the multiple system error values.

7. The bonding device according to claim 5, characterized in that, The second image acquisition device is detachably arranged on the movable pick-up stage to perform the system error correction operation.

8. The bonding device according to claim 5, characterized in that, The second image acquisition device includes at least one image acquisition unit to identify the alignment marks of the first component and the second component at the bonding position.

9. The bonding device according to claim 5, characterized in that, In response to the bonding device performing the bonding operation, the bonding device adjusts the movable pick-up stage and / or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element at the alignment position, and then moves the movable pick-up stage and / or the carrier stage in the height direction to drive the first element and the second element to the bonding position; In response to the bonding device performing the bonding operation, while the bonding device moves the movable pick-up stage and / or the carrier stage in the height direction to drive the first element and the second element to the bonding position, the bonding device adjusts the movable pick-up stage and / or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element.

10. The bonding device according to claim 1, wherein, further comprising: a base and a machine table frame, wherein the machine table frame is disposed on the base, the movable pick-up stage is disposed on the machine table frame, the carrier stage is disposed on the base, and the movable pick-up stage and / or the carrier stage are configured to be movable along the X direction, the Y direction, and the height direction Z, and rotatable in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable pick-up stage and / or the carrier stage.

11. The bonding device according to claim 1, wherein, the first image acquisition device is an up-and-down view image acquisition device, comprising: an up-view image acquisition unit, which is configured to identify the alignment mark of the first element in response to the first image acquisition device being driven to the working position; a down-view image acquisition unit, which is configured to identify the alignment mark of the second element in response to the first image acquisition device being driven to the working position; wherein, the bonding device drives at least one of the movable pick-up stage or the carrier stage to be adjusted based on the alignment mark of the first element identified by the up-view image acquisition unit and the alignment mark of the second element identified by the down-view image acquisition unit, so as to align the first element and the second element at the alignment position.

12. The bonding device according to claim 11, wherein, after aligning the first element and the second element at the alignment position and before moving the first element and / or the second element in the height direction, the first image acquisition device is driven to the initial position.

13. A bonding method applied to a bonding device, wherein, comprising: using the movable pick-up stage and / or the carrier stage of the bonding device to move the first element and the second element to the alignment position respectively; using the first image acquisition device of the bonding device to read the alignment marks of the first element and the second element at the alignment position, so that the first element and the second element are aligned in the height direction; In response to the bonding device performing a system error correction operation, driving the first element and the second element to a bonding position, and using a second image acquisition device of the bonding device to identify the alignment marks of the first element and the second element at the bonding position, so as to obtain a system error compensation value of the bonding device; In response to the bonding device performing a bonding operation, performing a system error compensation operation based on the system error compensation value, so that the first element and the second element driven to the bonding position are aligned.

14. The bonding method according to claim 13, wherein, in response to the bonding device performing the system error correction operation, the first element is configured as a first correction sheet, and the second element is configured as a matching second correction sheet; the step of, in response to the bonding device performing a system error correction operation, driving the first element and the second element to a bonding position, and using a second image acquisition device of the bonding device to identify the alignment marks of the first element and the second element at the bonding position, so as to obtain a system error compensation value of the bonding device, includes: moving the first element and the second element to the bonding position by using the movable pick-up stage and / or the carrier stage; identifying the difference between the alignment marks of the first element and the second element at the bonding position by using the second image acquisition device as a system error value, so as to obtain the system error compensation value.

15. The bonding method according to claim 14, wherein, the bonding device performs the system error correction operation multiple times to obtain multiple system error values, and obtains the system error compensation value based on the average value of the multiple system error values.

16. The bonding method according to claim 14, wherein, the first correction sheet is a transparent, semi-transparent or correction sheet with through holes.

17. The bonding method according to claim 13, wherein, in response to the bonding device performing the bonding operation, the first element is configured as a chip or wafer to be bonded, and the second element is configured as a wafer or chip to be bonded; the step of, in response to the bonding device performing a bonding operation, performing a system error compensation operation based on the system error compensation value, so that the first element and the second element driven to the bonding position are aligned, includes: moving the first element and the second element to the bonding position by using the movable pick-up stage and / or the carrier stage, and performing the system error compensation operation, so that the first element and the second element driven to the bonding position are aligned.

18. The bonding method according to claim 17, wherein, the step of moving the first element and the second element to the bonding position by using the movable pick-up stage and / or the carrier stage, and performing the system error compensation operation, so that the first element and the second element driven to the bonding position are aligned, includes: Adjust the movable pick-up stage and / or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element in the alignment position, and then move the movable pick-up stage and / or the carrier stage in the height direction to drive the first element and the second element to the bonding position; or While moving the movable pick-up stage and / or the carrier stage in the height direction to drive the first element and the second element to the bonding position, adjust the movable pick-up stage and / or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element.

19. The bonding method according to claim 13, characterized in that Before using the first image acquisition device of the bonding device to read the alignment marks of the first element and the second element in the alignment position so that the first element and the second element are aligned in the height direction the bonding method further includes: Driving the first image acquisition device to move from the initial position to the working position to read the alignment marks of the first element and the second element in the alignment position; After using the first image acquisition device of the bonding device to read the alignment marks of the first element and the second element in the alignment position so that the first element and the second element are aligned in the height direction, the bonding method further includes: Driving the first image acquisition device to move from the working position to the initial position to facilitate performing the subsequent system error correction operation or the bonding operation.

20. The bonding method according to claim 19, characterized in that The first image acquisition device is an up-and-down view image acquisition device.

Images