Bonding apparatus and bonding method

Abstract

A bonding apparatus and a bonding method. The bonding apparatus comprises: a movable object-taking table, which is configured to move a first element; a bearing platform, which is configured to move a second element; and an image collection apparatus, which is configured to respectively read alignment identifiers of the first element and the second element located on two sides of the image collection apparatus, wherein the read alignment identifier of the first element and the alignment identifier of the second element are located in the same coordinate system. The bonding apparatus determines an alignment difference value of the first element and the second element on the basis of coordinate information of the alignment identifier of the first element, coordinate information of the alignment identifier of the second element, and preset calibration information preset of the image collection apparatus; and on the basis of the alignment difference value, the bonding apparatus drives the movable object-taking table and / or the bearing platform to be adjusted to execute an alignment compensation operation, so that the first element and the second element are aligned and bonded.

Description

Bonding device and bonding method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 7, 2023, with application number 202311684199.X and invention name “A bonding device and bonding method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of semiconductor manufacturing, and in particular to a bonding device and a bonding method. Background Art

[0004] As semiconductor technology enters the post-Moore era, chip structures are evolving toward three-dimensional structures to meet the demands of high integration and high performance. Bonding technology, enabling the fabrication of stacked chips, is a key enabler of this "beyond Moore's Law" initiative. Bonding accuracy is a crucial parameter in the bonding process, significantly impacting its application.

[0005] Summary of the Invention

[0006] According to various embodiments of the present application, a bonding device and a bonding method are provided.

[0007] A bonding device provided by the present application includes: a movable object-picking table, configured to move a first component; a carrying platform, configured to move a second component; an image acquisition device, configured to respectively read the alignment marks of the first component and the second component located on both sides of the image acquisition device, wherein the alignment mark of the first component and the alignment mark of the second component after reading are located in the same coordinate system, and the bonding device determines the alignment difference between the first component and the second component based on the coordinate information of the alignment mark of the first component, the coordinate information of the alignment mark of the second component and the calibration information preset by the image acquisition device; wherein, based on the alignment difference, the bonding device drives the movable object-picking table and / or the carrying platform to adjust to perform an alignment compensation operation, so that the first component and the second component are aligned and bonded.

[0008] On the other hand, the present application provides a bonding method, including: reading the alignment mark of a first element and the alignment mark of a second element, wherein the first element and the second element are located on different sides, and the alignment mark of the first element and the alignment mark of the second element after reading are located in the same coordinate system; determining the alignment difference between the first element and the second element based on the coordinate information of the alignment mark of the first element, the coordinate information of the alignment mark of the second element and preset calibration information; the bonding device drives the first element and / or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

[0009] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0011] FIG1 is a schematic structural diagram of a first embodiment of a bonding device in the present application;

[0012] FIG2 is a schematic structural diagram of a second embodiment of a bonding device in the present application;

[0013] FIG3 is a schematic diagram of the structure of the alignment mark transferred to the same plane;

[0014] FIG4 is a schematic diagram of a calibration coordinate system corresponding to the bonding device in this application;

[0015] FIG5 is a schematic flow chart of an embodiment of a bonding method in the present application;

[0016] FIG6 is a schematic diagram of the bonding device in the present application determining coordinate information of the first element and the second element;

[0017] FIG7 is a schematic diagram of a process of bonding a first component to a predetermined surface position of a second component by a bonding device in the present application;

[0018] FIG8 is a schematic diagram of coordinate information in a calibration coordinate system when a first component is bonded to a preset surface position of a second component in the present application.

[0019] In the accompanying drawings, there are a bonding device 10, a movable picking table 100, a first driving component 110, a carrying platform 200, a second driving component 210, an image acquisition device 300, an upward image acquisition component 310, an upward image acquisition unit 311, a first reflection unit 312, a downward image acquisition component 320, a downward image acquisition unit 321, a second reflection unit 322, an image acquisition drive 330, a first element 400, a second element 500, a machine platform 600, a base 610, a machine platform frame 620, and a supply platform 700. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0021] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0022] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] The technical solution of the present application is described in detail below with reference to the accompanying drawings and embodiments.

[0024] Please refer to FIG1 , which is a schematic structural diagram of a first embodiment of a bonding device provided in the present application.

[0025] As shown in Figure 1, the bonding device 10 includes: a movable object-picking stage 100, a carrying platform 200, and an image acquisition device 300; the movable object-picking stage 100 is configured to pick up and move a first component 400, the carrying platform 200 is configured to carry and move a second component 500, and the image acquisition device 300 is configured to respectively read the alignment marks of the first component 400 and the second component 500 located on both sides of the image acquisition device, wherein the alignment marks of the first component 400 and the alignment marks of the second component 500 after reading are located in the same coordinate system. The bonding device 10 determines the alignment difference between the first component 400 and the second component 500 based on the coordinate information of the alignment mark of the first component 400, the coordinate information of the alignment mark of the second component 500, and the calibration information preset by the image acquisition device 300.

[0026] In which, the bonding device 10 drives the movable object picking table 100 and / or the carrying platform 200 to adjust based on the alignment difference to perform an alignment compensation operation, so that the first component 400 and the second component 500 are aligned and bonded; the alignment difference is also the coordinate difference between the first component 400 and the second component 500 in the same coordinate system; wherein, the calibration information is the coordinate system (measurement) ratio of the image acquisition device 300, which can be determined by internal parameters and / or external parameters of the image acquisition device 300.

[0027] In some embodiments, the movable object-taking platform 100 can be set on the platform frame 620 , and the image acquisition device 300 can also be set on the platform frame 620 , and the platform frame 620 is set on the base 610 .

[0028] It is understandable that, in some embodiments, the first component 400 may be a wafer to be bonded or a chip to be bonded; correspondingly, the second component 500 may be a wafer to be bonded or a chip to be bonded.

[0029] It should be noted that Figure 1 only shows an embodiment in which the movable pickup platform 100 is arranged on the top of the machine frame 620 and the carrying platform 200 is arranged on the base 610; in another embodiment, the movable pickup platform 100 can be arranged on the base 610, and the carrying platform 200 is arranged on the machine frame 620, specifically to achieve moving the first component 400 and the second component 500 to the alignment position. Therefore, the positions of the movable pickup platform 100 and the carrying platform 200 are not limited in this application.

[0030] Specifically, in response to the bonding device 10 performing the picking operation, the bonding device 10 drives the movable pick-up table 100 to first pick up the first component 400 to be bonded at the picking position, and then drives the movable pick-up table 100 to the alignment position; and the bonding device 10 also drives the carrying platform 200 carrying the second component 500 to be bonded to the alignment position, and after the first component 400 and the second component 500 arrive at the alignment position, drives the image acquisition device 300 to the working position, and then in response to the image acquisition device 300 being driven to the working position, the image acquisition device 300 can simultaneously identify and read the alignment mark of the first component 400 and the alignment mark of the second component 500 on both sides of the image acquisition device 300; and the alignment mark of the first component 400 and the alignment mark of the second component 500 after reading are located in the same coordinate system and obtains coordinate information of the alignment mark of the first element in the coordinate system, and obtains coordinate information of the alignment mark of the second element in the coordinate system; the bonding device 10 determines the alignment difference between the first element 400 and the second element 500 based on the coordinate information of the alignment mark of the first element, the coordinate information of the alignment mark of the second element and the calibration information preset by the image acquisition device 300; after obtaining the alignment difference, the bonding device 10 drives the movable pick-up stage 100 and / or the carrying platform 200 to adjust based on the alignment difference to perform an alignment compensation operation to align the first element 400 and the second element 500, and moves the movable pick-up stage 100 and / or the carrying platform 200 in the height direction after alignment, such as moving downward, so that the first element 400 and the second element 500 after moving downward are in contact and bonded.

[0031] In some embodiments, the first component 400 may be moved vertically to the bonding position first, and then an alignment compensation operation may be performed to align the first component and the second component. Finally, the first component 400 may be moved downward to bond the first component 400 to the second component 500.

[0032] In other embodiments, the alignment compensation operation may be performed while moving in the height direction, so that the first component 400 and the second component 500 are aligned while moving in the height direction, thereby improving the bonding efficiency.

[0033] Among them, the picking position is the position where the movable object picking platform 100 picks up the first component 400, the alignment position is the position where the first component 400 and the second component 500 are aligned; the working position is the position where the image acquisition device 300 obtains the alignment mark of the first component 400 and the second component 500, which is generally located between the first component 400 and the second component 500 before bonding. More precisely, the working position is the position between the first component 400 and the second component 500 when the first component 400 and the second component 500 are moved to the alignment position.

[0034] In addition, the same coordinate system in which the alignment mark of the first element 400 and the alignment mark of the second element 500 are located can be the same camera field of view, that is, the alignment mark of the first element 400 and the alignment mark of the second element 500 are transferred to the same camera field of view, and thus, the coordinate system is set within the camera field of view to determine the coordinate information of the first alignment mark and the coordinate information of the second alignment mark.

[0035] In some embodiments, the movable pickup platform 100 can be driven to adjust, the carrying platform 200 can be driven to adjust, or the movable pickup platform 100 and the carrying platform 200 can be driven to adjust at the same time, so that the first component 400 is quickly aligned with the second component 500.

[0036] In some embodiments, when the movable object-picking platform 100 drives the first component 400 to move in the height direction, such as moving downward, and before moving downward, the bonding device 10 is required to drive the image acquisition device 300 to the initial position, that is, to move the image acquisition device 300 away from the working position, to avoid the image acquisition device 300 blocking the impact of the first component 400 during the downward movement.

[0037] That is, it is only necessary to obtain the alignment mark of the first element 400 and the alignment mark of the second element 500 once, and then the alignment difference between the first element 400 and the second element 500 can be determined based on the alignment mark of the first element, the alignment mark of the second element and the preset calibration information, and then the alignment between the first element 400 and the second element 500 can be completed once based on the alignment difference, avoiding the time-consuming problem caused by multiple alignments.

[0038] In this embodiment, the bonding device provided by the present application is provided with an integrated image acquisition device, and the image acquisition device can obtain the alignment marks of the first element and the second element on different sides in the same coordinate system, and then compare them with the preset calibration information. The bonding device determines the alignment difference between the first element 400 and the second element 500, so that the bonding device can complete the alignment and bonding of the first element 400 and the second element 500 at one time based on the alignment difference. At the same time, there is no need to perform multiple alignments on each second element 500 to be bonded, which effectively shortens the time consumption, and is conducive to improving the bonding efficiency and increasing the yield.

[0039] Please refer to FIG2 , which is a schematic structural diagram of a second embodiment of the bonding device provided in this application.

[0040] As shown in FIG2 , the bonding apparatus 10 includes: a movable pick-up stage 100, a carrying platform 200, an image acquisition device 300, and a machine platform 600; wherein the movable pick-up stage 100 is configured to pick up and move a first component 400, the carrying platform is configured to carry and move a second component 500, and the image acquisition device 300 is configured to read the alignment marks of the first component 400 and the second component 500 on both sides of the image acquisition device 300, respectively. wherein the alignment marks of the first component 400 and the alignment marks of the second component 500 after reading are located in the same coordinate system. The bonding device determines the alignment difference between the first component 400 and the second component 500 based on the coordinate information of the alignment mark of the first component 400, the coordinate information of the alignment mark of the second component 500, and the calibration information preset by the image acquisition device 300; the machine 600 includes a base 610 and a machine frame 620, the machine frame 620 is set on the base 610, the movable object picking table 100 is set on the machine frame 620 and faces the base 610, the carrying platform 200 is set on the base 610, and the image acquisition device 300 is set on the machine frame 620 and faces the base 610.

[0041] It should be noted that Figure 2 only shows an embodiment in which the movable pickup table 100 is arranged on the top of the machine frame and the carrying platform 200 is arranged on the base; in another embodiment, the movable pickup table 100 can be arranged on the base, and the carrying platform 200 is arranged on the machine frame, specifically to achieve moving the first component 400 and the second component 500 to the bonding position. Therefore, the positions of the movable pickup table 100 and the carrying platform 200 are not limited in this application.

[0042] In some embodiments, the bonding device is configured to adjust the first element 400 and the second element 500 at the alignment position based on the alignment mark of the first element 400 and the alignment mark of the second element 500 identified by the image acquisition device 300, so that the first element 400 and the second element 500 at the alignment position are aligned in the height direction.

[0043] Furthermore, in response to the bonding device performing an alignment compensation operation, the first element 400 and the second element 500 aligned at the alignment position are configured to move to the bonding position, and the image acquisition device 300 is configured to identify the alignment mark of the first element 400 and the alignment mark of the second element 500 on the bonding position, obtain the difference between the alignment marks of the first element 400 and the second element 500, and use the comparison result of the difference with the preset calibration information as the alignment difference to perform the alignment compensation operation.

[0044] In some embodiments, in response to the bonding device performing a bonding operation, the bonding device adjusts the movable pick-up stage 100 and / or the carrying platform 200 based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500 in the alignment position, and moves the movable pick-up stage 100 and / or the carrying platform 200 in the height direction so that the first component 400 and the second component 500 are driven to the bonding position;

[0045] Furthermore, in response to the bonding device performing a bonding operation, the bonding device moves the movable pick-up table 100 and / or the carrying platform 200 in the height direction so that the first component 400 and the second component 500 are driven to the bonding position, and at the same time, adjusts the movable pick-up table 100 and / or the carrying platform 200 based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500.

[0046] In some embodiments, the image acquisition device 300 is a top-down image acquisition device, which can acquire images from an upward perspective and images from a downward perspective at the same time; specifically, it includes an upward image acquisition component 310 and a downward image acquisition component 320.

[0047] In response to the image acquisition device 300 being driven to the working position, the upward image acquisition component 310 is configured to identify at least one alignment mark of the first component 400 in the calibration coordinate system, which may be two, such as a first alignment mark and a second alignment mark; and the downward image acquisition component 320 is configured to identify at least one alignment mark of the second component 500 in the calibration coordinate system, which may be two, such as a third alignment mark and a fourth alignment mark. Taking one alignment mark as an example, the upward image acquisition component 310 identifies the first alignment mark of the first component 400, and the downward image acquisition component 320 identifies the third alignment mark of the second component 500. Based on the first and third alignment marks, i.e., the first and third alignment marks captured directly in the calibration coordinate system, the coordinate difference between the first component 400 and the second component 500 is determined. The coordinate difference is then compared with preset calibration information to determine the alignment difference between the first component 400 and the second component 500.

[0048] The upward image acquisition component 310 may include an upward image acquisition unit 311 and a first reflection unit 312. In response to the image acquisition device 300 being driven to the working position, the upward image acquisition unit 311 is configured to identify at least one alignment mark of the first element 400; in response to the upward image acquisition unit 311 identifying at least one alignment mark of the first element 400, the first reflection unit 312 transfers at least one alignment mark of the first element 400 to the correction coordinate system; the downward image acquisition component 320 may include a downward image acquisition unit 321 and a second reflection unit Element 322, in response to the image acquisition device 300 being driven to the working position, the downward image acquisition unit 321 is configured to identify at least one alignment mark of the second element 500; in response to the downward image acquisition unit 321 identifying at least one alignment mark of the second element 500, the second reflection unit 322 transfers the at least one alignment mark of the second element 500 to the correction coordinate system, and then determines the coordinate difference between the alignment mark of the first element 400 and the alignment mark of the second element 500 in the correction coordinate system, and then determines the alignment difference between the first element 400 and the second element 500.

[0049] In some embodiments, in order to obtain a larger viewing angle, the distribution of the alignment mark is not restricted, that is, there are multiple alignment marks that need to be identified, then there can be multiple upward image acquisition units 311 and multiple downward image acquisition units 321, so as to obtain the alignment marks required for the first element 400 and the second element 500.

[0050] In addition, the first reflecting unit 312 and the second reflecting unit 322 may also have multiple reflecting mirrors, specifically to achieve the purpose of transferring the alignment mark of the first element 400 and the alignment mark of the second element 500 to the correction coordinate system in the same plane.

[0051] In order to more clearly demonstrate that the alignment marks are transferred to the same plane, a description is given below with reference to the accompanying drawings.

[0052] Refer to FIG3 , which is a schematic diagram of the structure in which the alignment mark is transferred to the same plane.

[0053] As shown in Figure 3, an upward image acquisition unit, a downward image acquisition unit, two first reflection units and two second reflection units are used as an example for explanation; after the upward image acquisition unit 311 identifies and obtains the alignment mark of the first element 400, the alignment mark of the first element 400 is transmitted to the plane through the two first reflection units 312, and after the downward image acquisition unit 321 identifies and obtains the alignment mark of the second element 500, the alignment mark of the second element 500 is transmitted to the same plane through the two second reflection units 322, and then the coordinate difference between the alignment marks of the first element 400 and the second element 500 can be obtained in the correction coordinate system of the plane, and then the coordinate difference is compared with the calibration information, that is, the coordinate difference is compared with the coordinate system ratio, and then the alignment difference between the first element 400 and the second element 500 is determined.

[0054] In some embodiments, after aligning the first element 400 and the second element 500 in the alignment position, and before moving the first element 400 and / or the second element 500 in the height direction, it is also necessary to drive the image acquisition device to the initial position to prevent the image acquisition device from affecting subsequent bonding operations.

[0055] The movable object-collecting platform 100 is configured to be movable along the X and Y directions of the horizontal plane, along the height direction Z, and to be rotatable in a vertical plane perpendicular to the horizontal plane; the carrying platform 200 is configured to be movable along the X and Y directions of the horizontal plane, along the height direction Z, and to be rotatable in a vertical plane perpendicular to the horizontal plane; the image acquisition device 300 is configured to be rotatable in the horizontal plane, wherein the rotation axis in the rotation direction is located outside the working position, specifically to enable the image acquisition device 300 to be rotated to the working position or to the initial position.

[0056] In some embodiments, the image acquisition device 300 can move in the height direction, and can also move in the X direction and the Y direction of the horizontal plane.

[0057] Among them, the X direction and the Y direction are intersecting directions in the same horizontal plane. For example, the X direction and the Y direction are perpendicular to each other in the same horizontal plane. The height direction is the direction perpendicular to the horizontal plane, that is, the vertical direction. The rotation direction is the rotation in the horizontal plane.

[0058] In some embodiments, the movable picking table 100 can be a picking piece that can be flipped, that is, after picking up the first component 400 at the picking position, it is flipped so that the bonding surface of the first component 400 faces the first driving component 110. After reaching the bonding position, the picking piece is flipped again so that the bonding surface of the first component 400 faces the second component 500, to avoid the bonding surface of the first component 400 being damaged during the movement.

[0059] Among them, the bonding position is the position corresponding to the first component 400 and the second component 500 that can be bonded. The position corresponding to the alignment mark read by the image acquisition device 300 is the working position, that is, the position corresponding to the first component 400 and the second component 500. The initial position is the position of the image acquisition device 300 in the non-working state.

[0060] In some embodiments, a vibration isolation and shock absorbing device may be further provided at the bottom of the base 610 to eliminate vibrations caused by the carrying platform 200 when moving the second component 500 to be bonded and during the bonding process, thereby improving the stability of the bonding device 10.

[0061] In some embodiments, the bonding device 10 also includes a first drive component 110 and a second drive component 210, wherein the first drive component 110 is arranged on the machine frame and connected to the movable pickup table 100, and the first drive component 110 is configured to carry the movable pickup table 100 to move along the X direction and Y direction of the horizontal plane, and to move along the height direction, and to rotate in a vertical plane perpendicular to the horizontal plane; the second drive component 210 is arranged on the base and connected to the carrying platform 200, and the second drive component 210 is configured to carry the carrying platform 200 to move along the X direction and Y direction of the horizontal plane, and to move along the height direction, and to rotate in a vertical plane perpendicular to the horizontal plane.

[0062] In order to facilitate timely replacement of related components when a fault occurs, the first driving assembly 110 can be detachably arranged on the machine frame 620; the second driving assembly 210 can also be detachably arranged on the base 610.

[0063] It should be noted that the first drive assembly 110 and the second drive assembly 210 may also include: a motor, for example, a linear motor or a rotary motor, to provide power to the corresponding drive members. It is understandable that the structural design of the first drive assembly 110 in the embodiment of the present application may also refer to the specific structure in the relevant technology. As long as the function of moving the movable pickup table 100 along the X direction and the Y direction in the horizontal plane and achieving nanometer-level precision positioning can be achieved, this application does not impose specific restrictions. Accordingly, the structural design of the second drive assembly 210 may also refer to the specific structure in the relevant technology, as long as its corresponding function can be achieved.

[0064] Optionally, the X direction, the Y second direction, and the Z direction (height direction) are perpendicular to each other. Specifically, the Y direction may be parallel to the direction where the Y axis is located, the X direction may be parallel to the direction where the X axis is located, and the Z direction may be parallel to the direction where the Z axis is located.

[0065] Optionally, the supporting platform 200 may also be a single-stage motion mechanism or other types of motion mechanisms, as long as it can move the second element 500 to be bonded to the preset surface position corresponding to the first element 400 to be bonded and bond it to the preset surface position of the first element 400 to be bonded while meeting specific precision requirements.

[0066] In some embodiments, the bonding device 10 may further include a supply platform 700, which is disposed on the base 610 and is configured to provide the first component 400 to be bonded to the movable picking table 100, that is, a plurality of first components 400 to be bonded are placed on the supply platform 700, and the movable picking table 100 picks up the first component 400 on the supply platform 700 at the picking position, and then carries the first component 400 to the alignment position for alignment.

[0067] The following describes the working process of the bonding device 10.

[0068] Specifically, the upward image acquisition component 310 of the image acquisition device 300 has a first viewing angle and is configured to read at least one alignment mark of the first component 400 to be bonded, while the downward image acquisition component 320 of the image acquisition device 300 has a second viewing angle and is configured to read at least one alignment mark of the second component 500 to be bonded; the first component includes a first alignment mark and the second component includes a third alignment mark as an example for explanation, such as the first alignment mark B1 and the third alignment mark T1. The image acquisition device 300 may be disposed on the machine frame 620. After the movable pickup table 100 carries the first component 400 to be bonded to the alignment position, and the carrying platform carries the second component 500 to be bonded to the alignment position, the bonding device 10 drives the image acquisition device 300 to the working position, that is, the image acquisition device 300 is positioned below the first component 400 and above the second component 500. The image acquisition device 300 then acquires a first alignment mark B1 corresponding to the first component 400 through the upward image acquisition component 310, and acquires a third alignment mark T1 corresponding to the second component 500 through the downward image acquisition component 320. The alignment mark of the first component 400 is then transmitted to the calibration coordinate system through the first reflection unit 312, and the alignment mark of the second component 500 is transmitted to the calibration coordinate system through the second reflection unit 322. The coordinate information of each alignment mark is obtained, and a coordinate difference is determined based on the coordinate information. The coordinate difference is compared with the calibration information to determine the alignment difference between the first component 400 and the second component 500.

[0069] At this time, the first viewing angle can also be referred to as an upward viewing angle, and the second viewing angle can also be referred to as a downward viewing angle; it can be understood that the image acquisition device 300 may not be limited to a connection relationship with other components, as long as the image acquisition device 300 is in a working position between the first element 400 and the second element 500 when acquiring the alignment mark of the first element 400 and the alignment mark of the second element 500.

[0070] In some embodiments, the image acquisition device 300 further includes an image acquisition driver 330, one end of which is connected to the machine frame 620, and the other end is connected to the image acquisition device 300. Before the first component 400 and the second component 500 are aligned, the image acquisition driver 330 is driven to move from the initial position to the working position, so that the image acquisition device 300 respectively obtains the first alignment mark and the second alignment mark of the first component 400 through the upward image acquisition component 310, and obtains the third alignment mark and the fourth alignment mark of the second component 500 through the downward image acquisition component 320; and after the alignment of the first component 400 and the second component 500 is completed, the image acquisition device 300 is driven to move from the working position to the initial position, thereby preventing the image acquisition device 300 from affecting the related operations during the subsequent alignment compensation operation or bonding operation of the bonding device.

[0071] In order to better express the relationship between the first alignment mark and the second alignment mark, a coordinate system may be established.

[0072] Please refer to FIG4 , which is a schematic diagram of the calibration coordinate system corresponding to the bonding device in this application.

[0073] As shown in FIG4 , after obtaining the first alignment mark B1 corresponding to the first component 400 and the third alignment mark T1 corresponding to the second component 500, the first alignment mark B1 and the third alignment mark T1 are transferred to the same plane through the reflection unit, and a correction coordinate system is defined in the plane based on the calibration information of the image acquisition device 300, and then the coordinate information corresponding to the first alignment mark B1 and the third alignment mark T1 in the correction coordinate system is obtained, such as B1(x B1 ,y B1 ), T1(x T1 ,y T1 ), and then calculate the coordinate difference based on the coordinate information of each alignment mark, and determine the alignment difference between the first element and the second element with the calibration information, and then determine the bonding alignment position of the first element 400 and the second element 500 according to the alignment difference, so that the first element 400 and the second element 500 are bonded according to the bonding alignment position.

[0074] In this embodiment, an integrated image acquisition device is provided, and the image acquisition device can obtain the alignment marks of the first element and the second element in the correction coordinate system within the same camera field of view, and then compare them with the calibration information. The bonding device determines the alignment difference between the first element and the second element, so that the bonding device completes the alignment of the first element and the second element and bonds them based on the alignment difference. At the same time, there is no need to align each second element to be bonded multiple times, which effectively shortens the time consumption, and is conducive to improving bonding efficiency and increasing productivity.

[0075] Furthermore, the image acquisition device of the present application uses the image acquisition cameras above and below to simultaneously capture alignment marks in both the upward and downward directions, and then transmits these alignment marks in both directions to the same camera field of view, thereby unrestricting the distribution of the alignment marks of the first component 400 to be bonded and the alignment marks of the second component 500 to be bonded. Therefore, the effect of the camera field of view limitation on the alignment marks of the first component 400 to be bonded and the alignment marks of the second component 500 to be bonded is effectively reduced.

[0076] Furthermore, the bonding device in the present application forms a closed motion loop through the cooperation of the first drive component, the second drive component and the displacement acquisition component, so that the carrier platform can achieve nanometer-level precision positioning, thereby effectively improving the bonding accuracy.

[0077] Based on the above bonding device, a method for bonding the second component 500 and the first component 400 using the above bonding device will be described below.

[0078] Refer to Figure 5, which is a flow chart of an embodiment of a bonding method in the present application. The following describes in detail the various steps of the bonding method provided in this embodiment in conjunction with Figure and Figure to Figure.

[0079] Specifically, as shown in FIG5 , the bonding method can be applied to the bonding device in any of the above embodiments, and the bonding method includes the following steps:

[0080] S10 , reading an alignment mark of a first component and an alignment mark of a second component, wherein the first component and the second component are located on different sides, and the read alignment mark of the first component and the read alignment mark of the second component are located in the same coordinate system.

[0081] Among them, in order to reduce the operation of reading the alignment mark multiple times, after obtaining the alignment mark in the upward viewing direction and the alignment mark in the downward viewing direction, all the alignment marks can be transferred to the same plane, that is, the corresponding alignment marks in the upward viewing direction and the downward viewing direction can be marked in the same camera field of view.

[0082] Specifically, the movable pick-up table 100 is driven to move to the picking position, and the first component 400 to be bonded on the supply platform 700 is picked up. After picking up the first component 400 to be bonded, the movable pick-up table 100 is driven to move to the alignment position. At the same time, the carrying platform 200 is driven to carry the second component 500 to move to the alignment position. At this time, the first component 400 corresponds to the second component 500. Due to the different bonding positions of the components, the alignment of the first component 400 and the second component 500 may deviate, and bonding cannot be performed directly. Therefore, alignment correction is required first; that is, the image acquisition device 300 is driven to the alignment position, so that the upward image acquisition component 310 of the image acquisition device 300 corresponds to the first component 400, and the downward image acquisition component 320 of the image acquisition device 300 corresponds to the second component 500. In other words, the image acquisition device 300 is driven to move between the first component 400 and the second component 500, so that the first component 400 and the second component 500 can appear simultaneously within the camera field of view of the image acquisition device 300 and read the corresponding alignment marks. At this time, the upward image acquisition component 310 of the image acquisition device 300 can read the first alignment mark B1 on the first component 400 to be bonded, and the downward image acquisition component 320 of the image acquisition device 300 can read the third alignment mark T1 on the second component 500 to be bonded.

[0083] Furthermore, a correction coordinate system is defined by the calibration information of the image acquisition device 300 , and coordinate information corresponding to the first alignment marks B1 and B2 and the second alignment marks T1 and T2 in the correction coordinate system is obtained.

[0084] The calibration information is the coordinate system (measurement) ratio of the image acquisition device 300 , which may be determined by internal parameters and / or external parameters of the image acquisition device 300 .

[0085] Please refer to FIG. 6 , which is a schematic diagram of the bonding device in the present application determining the coordinate information of the first component and the second component.

[0086] As shown in FIG6 , the first component may have two alignment marks, such as the first alignment mark B1 and the second alignment mark B2, and the second component may have two alignment marks, such as the third alignment mark T1 and the fourth alignment mark T2. Since the alignment mark of the first component and the alignment mark of the second component are both in the same plane, a unified coordinate system, i.e., a correction coordinate system, is established to determine the positional relationship between the alignment marks. For example, an origin is determined within the camera field of view using the calibration information corresponding to the image acquisition device to define the correction coordinate system, including the X-axis and the Y-axis, wherein the origin may be a boundary intersection, the X-axis may be a straight line in the X-direction, and the Y-axis may be a straight line in the Y-direction. Then, the coordinate information corresponding to the first alignment mark B1 and the second alignment mark B2 as well as the third alignment mark T1 and the fourth alignment mark T2 in the correction coordinate system is obtained, such as B1(x B1 ,y B1 ), B2(x B2 ,y B2 ), T1(x T1 ,y T1 ), T2(x T2 ,y T2 ).

[0087] In order to determine whether the first element and the second element are aligned, it is necessary to perform the determination based on the coordinate information in the correction coordinate system.

[0088] S20 , determining an alignment difference between the first component and the second component according to coordinate information of the alignment mark of the first component, coordinate information of the alignment mark of the second component, and preset calibration information.

[0089] Among them, the coordinate information of the alignment mark of the first element is the coordinate of the alignment mark in the correction coordinate system, the coordinate information of the alignment mark of the second element is the coordinate of the alignment mark in the correction coordinate system, and the preset calibration information is the coordinate system (measurement) ratio determined by the image acquisition device based on the internal reference.

[0090] Continuing to refer to FIG4, in the calibration coordinate system, including the X-axis and the Y-axis, the first connecting line between the first alignment mark B1 of the first component 400 and the third alignment mark T1 of the second component 500 is set as L1. According to the preset calibration information, the coordinate information of the first alignment mark B1 is determined as B1 (x B1 ,y B1 ), the coordinate information of the third alignment mark T1 is T1(x T1 ,y T1 ), and then the difference information between the first element 400 and the second element 500 can be determined according to the distance information of the first line L1 and the angle relationship between the first line L1 and the X-axis and the Y-axis.

[0091] Continuing to refer to Figure 6, in the correction coordinate system, the second line between the first alignment mark B1 and the second alignment mark B2 of the first component 400 to be bonded is set to L2, and the first angle between the second line L2 and the X-axis direction in the correction coordinate system is α1; the third line between the third alignment mark T1 and the fourth alignment mark T2 of the second component 500 to be bonded is set to L3, and the second angle between the third line L3 and the X-axis in the correction coordinate system is α2. Then, the angular deviation △α between the first component 400 to be bonded and the second component 500 to be bonded in the correction coordinate system is the difference between the first angle α1 and the second angle α2, that is: △α is the absolute value of (α2-α1), and then the alignment difference between the first component 400 and the second component 500 can be determined based on the angular deviation and the coordinate difference between the alignment marks.

[0092] Specifically, after obtaining the coordinate information of the first alignment mark B1 and the second alignment mark B2 of the first component, and the coordinate information of the third alignment mark T1 and the fourth alignment mark T2 of the second component, a difference calculation is performed to obtain the coordinate difference between the alignment marks, that is, to obtain the first X-axis difference △x1 between B1 and T1 on the X-axis, △x1=(x B1 -x T1 ), the second X-axis difference between B2 and T2 on the X-axis △x2, △x2=(x B2 -x T2 ) and the first Y-axis difference △y1 between B1 and T1 on the Y-axis, △y1=(y B1 -y T1 ), the second Y-axis difference between B2 and T2 on the X-axis is △y2, △y2=(y B2 -y T2 ), and the absolute value of the angular deviation Δα between the second connecting line L2 and the third connecting line L3, where Δα = (α2 - α1). The first X-axis difference Δx1, the second X-axis difference Δx2, the first Y-axis difference Δy1, the second Y-axis difference Δy2, and the angular deviation Δα are then compared with the coordinate system (measurement) ratio to determine the alignment difference between the first component 400 and the second component 500.

[0093] That is, the bonding alignment position of the first component 400 and the second component 500 can be determined based on the first X-axis difference △x1, the second X-axis difference △x2, the first Y-axis difference △y1, the second Y-axis difference △y2, and the angular deviation value △α. Then, the alignment difference between the first component 400 and the second component 500 can be determined by combining the above-mentioned differences with the calibration information preset by the image acquisition device 300.

[0094] In some embodiments, the height difference between the first element 400 and the second element 500 can also be determined based on the first distance between the first element 400 and the image acquisition device 300 and the second distance between the second element and the image acquisition device 300. Subsequently, the first element 400 can be moved in the height direction based on the height difference, such as moving the first element 400 downward so that the first element 400 and the second element 500 contact each other, thereby avoiding damage to the first element 400 and the second element 500 due to excessive downward movement, or avoiding failure to complete bonding due to excessive downward movement.

[0095] S30 : The bonding device drives the first element and / or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

[0096] Refer to Figures 7 and 8. Figure 7 is a schematic diagram of the process of bonding the first element to the preset surface position of the second element by the bonding device in the present application, and Figure 8 is a schematic diagram of the coordinate information in the correction coordinate system when the first element is bonded to the preset surface position of the second element in the present application.

[0097] In order to align the first component with the second component, the movable object-picking platform 100 can be driven to move the first component 400, or the carrying platform 200 can be driven to move the second component; that is, in response to the bonding device performing the alignment compensation operation, the first component 400 and the second component 500 are driven to the alignment position, and the first component 400 and the second component 500 in the alignment position are adjusted so that the first component 400 and the second component 500 in the alignment position are aligned in the height direction, and then the upward image acquisition unit of the image acquisition device is used to identify the alignment mark of the first component 400, and the downward image acquisition component 320 of the image acquisition device is used to identify the alignment mark of the second component 500, and then the alignment mark of the first component 400 and the alignment mark of the second component 500 are transferred to the same plane to obtain the corresponding coordinate difference; and the comparison result of the coordinate difference and the preset calibration information is used as the alignment difference to perform the alignment compensation operation so that the first component 400 is aligned with the second component 500.

[0098] In some embodiments, in response to the bonding device performing a bonding operation, the first element 400 is configured as a chip or wafer to be bonded, and the second element 500 is configured as a wafer or chip to be bonded; the first element 400 and the second element 500 are moved to an alignment position using a movable pick-up table and / or a carrying platform, and an alignment compensation operation is performed to align the first element 400 and the second element 500 driven to the alignment position.

[0099] Among them, the movable picking stage 100 and / or the carrying platform 200 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500 in the alignment position, and then the movable picking stage 100 is moved in the height direction so that the first component 400 and the second component 500 are driven to the bonding position; or the movable picking stage 100 and / or the carrying platform 200 are moved in the height direction so that the first component 400 and the second component 500 are driven to the bonding position, and at the same time, the movable picking stage 100 and / or the carrying platform 200 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 400 and the second component 500.

[0100] In some embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the movable pickup platform 100 is driven to move in the X-axis direction according to the X-axis coordinate difference, and the movable pickup platform 100 is driven to move in the Y-axis direction according to the Y-axis coordinate difference.

[0101] Furthermore, the movable pickup platform 100 can be driven for fine adjustment according to the angle deviation value Δα, and the alignment position of the first element 400 and the second element 500 can be determined according to the calibration information preset by the image acquisition device 300, so that the first element 400 and the second element 500 are aligned.

[0102] In other embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the carrying platform 200 is driven to move in the X-axis direction according to the X-axis coordinate difference, and is driven to move in the Y-axis direction according to the Y-axis coordinate difference.

[0103] In other embodiments, after obtaining the X-axis coordinate difference and the Y-axis coordinate difference, the carrying platform 200 and the movable picking platform 100 are simultaneously driven to move in the X-axis direction according to the X-axis coordinate difference, and the carrying platform 200 and the movable picking platform 100 are simultaneously driven to move in the Y-axis direction according to the Y-axis coordinate difference.

[0104] Furthermore, the supporting platform 200 and the movable object-picking platform 100 can be simultaneously driven to perform fine adjustment according to the angle deviation value △α, and the alignment position of the first element 400 and the second element 500 can be determined according to the calibration information preset by the image acquisition device 300, so that the first element 400 and the second element 500 are aligned.

[0105] As shown in Figure 7, after the first component 400 and the second component 500 are aligned, the movable picking platform 100 is driven to move in the height direction based on the height difference, such as downward, to drive the first component 400 to move downward, and make the first component 400 after moving downward contact the second component 500 on the supporting platform 200 and bond them. The coordinate information of the first alignment mark B1 of the first component 400 and the third alignment mark T1 of the second component 500 after bonding in the correction coordinate system is shown in Figure 8.

[0106] In some embodiments, before the first component 400 and the second component 500 are aligned, the image acquisition device 300 of the bonding device needs to be driven to move from the initial position to the working position so that the image acquisition device 300 can read the alignment marks of the first component and the second component in the alignment position; and after the first component 400 and the second component 500 are aligned, the image acquisition device 300 needs to be driven to move from the working position to the initial position so as to perform subsequent alignment compensation operations or bonding operations to avoid the first component 400 being blocked during the downward movement.

[0107] Specifically, the first element 400 and the second element 500 are aligned, and before the first element 400 moves in the height direction, such as before moving downward, the bonding device 10 drives the image acquisition device 300 to move from the working position to the initial position, and then drives the second driving component 210 to carry the first element 400 on the movable object picking platform 100 downward, and moves downward according to the height difference, so that the first element 400 contacts the second element on the carrying platform 200 and is bonded.

[0108] In this embodiment, the acquired alignment mark of the first element and the alignment mark of the second element are transferred to the same coordinate system to determine the coordinate information of the alignment mark of the first element and the alignment mark of the second element in the same coordinate system. Therefore, the alignment difference between the first element and the second element can be determined based on the coordinate information, and then the first element and / or the second element can be adjusted based on the alignment difference to align the first element and the second element; that is, the bonding method in the present application is applied to the above-mentioned bonding device, and therefore has the same beneficial effects as the bonding device, which will not be repeated here.

[0109] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A bonding device, characterized in that, it includes: A movable pick-up stage configured to move the first component; A carrying platform configured to move the second component; An image acquisition device configured to respectively read the alignment marks of the first component and the second component on both sides of the image acquisition device. Wherein, the alignment marks of the first component and the second component after being read are in the same coordinate system, and the bonding device determines the alignment difference between the first component and the second component based on the coordinate information of the alignment marks of the first component, the coordinate information of the alignment marks of the second component, and the calibration information preset by the image acquisition device; Wherein, the bonding device drives the movable pick-up stage and / or the carrying platform to make adjustments to perform an alignment compensation operation based on the alignment difference, so that the first component and the second component are aligned and bonded.

2. The bonding device according to claim 1, characterized in that, the image acquisition device is an up-and-down view image acquisition device, including: An up-view image acquisition component, in response to the image acquisition device being driven to the working position, the up-view image acquisition component is configured to identify at least one alignment mark of the first component in the calibration coordinate system; A down-view image acquisition component, in response to the image acquisition device being driven to the working position, the down-view image acquisition component is configured to identify at least one alignment mark of the second component in the calibration coordinate system; Wherein, the bonding device determines the coordinate difference based on at least one alignment mark of the first component and at least one alignment mark of the second component, and further determines the alignment difference between the first component and the second component based on the coordinate difference and the calibration information preset by the image acquisition device.

3. The bonding device according to claim 2, characterized in that, the up-view image acquisition component includes: An up-view image acquisition unit, in response to the image acquisition device being driven to the working position, the up-view image acquisition unit is configured to identify at least one alignment mark of the first component; A first reflection unit, in response to the up-view image acquisition unit identifying at least one alignment mark of the first component, the first reflection unit transmits at least one alignment mark of the first component into the calibration coordinate system; the down-view image acquisition component includes: A down-view image acquisition unit, in response to the image acquisition device being driven to the working position, the down-view image acquisition unit is configured to identify at least one alignment mark of the second component; A second reflection unit, in response to the down-view image acquisition unit identifying at least one alignment mark of the second component, the second reflection unit transmits at least one alignment mark of the second component into the calibration coordinate system.

4. The bonding device according to claim 1, characterized in that, the bonding device is further configured to be based on the first component respectively identified by the image acquisition device the alignment marks of the first component and the alignment marks of the second component, and adjust the first component and the second component in the aligned position so that the first component and the second component in the aligned position are aligned in the height direction.

5. The bonding device according to claim 4, wherein, in response to the bonding device performing an alignment compensation operation, the first component and the second component aligned in the aligned position are configured to move to the bonding position, the image acquisition device is configured to identify the alignment marks of the first component and the alignment marks of the second component in the bonding position, obtain the difference between the alignment marks of the first component and the second component, and use the comparison result of the difference and the preset calibration information as the alignment difference to perform the alignment compensation operation.

6. The bonding device according to claim 5, wherein, in response to the bonding device performing a bonding operation, the bonding device adjusts the movable pick-up stage and / or the carrier platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component in the aligned position, and moves the movable pick-up stage and / or the carrier platform in the height direction so that the first component and the second component are driven to the bonding position; in response to the bonding device performing the bonding operation, while the bonding device moves the movable pick-up stage and / or the carrier platform in the height direction so that the first component and the second component are driven to the bonding position, the bonding device adjusts the movable pick-up stage and / or the carrier platform based on the alignment difference to perform an alignment compensation operation on the first component and the second component.

7. The bonding device according to claim 6, wherein, after aligning the first component and the second component in the aligned position and before moving the first component and / or the second component in the height direction, the image acquisition device is driven to the initial position.

8. The bonding device according to claim 1, wherein, further comprising: a machine base, including a base and a machine base frame, wherein the machine base frame is disposed on the base, the movable pick-up stage is disposed on the machine base frame, the carrier platform is disposed on the base, the movable pick-up stage and / or the carrier platform are configured to be movable along the X direction, the Y direction, and the height direction Z, and can rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable pick-up stage and / or the carrier platform.

9. A bonding method, wherein, applied to a bonding device, comprising: reading the alignment marks of the first component and the alignment marks of the second component, wherein the first component and the second component are located on different sides, and the alignment marks of the first component and the alignment marks of the second component after reading are in the same coordinate system; determining the alignment difference between the first component and the second component according to the coordinate information of the alignment marks of the first component, the coordinate information of the alignment marks of the second component, and the preset calibration information; Based on the alignment difference, the bonding device drives the first element and / or the second element to perform an adjustment to execute an alignment compensation operation, so that the first element and the second element are aligned and bonded.

10. The bonding method according to claim 9, wherein, the reading of the alignment mark of the first element and the alignment mark of the second element includes: In response to the bonding device performing a bonding operation, driving the movable pick-up stage of the bonding device to pick up and move the first element to the alignment position, and driving the carrier platform of the bonding device to carry and move the second element to the alignment position; Driving the image acquisition device of the bonding device to the working position, and respectively identifying the alignment mark of the first element and the alignment mark of the second element in the correction coordinate system.

11. The bonding method according to claim 9, wherein, In response to the bonding device performing an alignment compensation operation, driving the first element and the second element to the alignment position, and adjusting the first element and the second element at the alignment position so that the first element and the second element at the alignment position are aligned in the height direction.

12. The bonding method according to claim 9, wherein, In response to the bonding device performing the alignment compensation operation, driving the image acquisition device of the bonding device to the working position; Using the upper-view image acquisition component of the image acquisition device to identify at least one alignment mark of the first element, and using the lower-view image acquisition component of the image acquisition device to identify at least one alignment mark of the second element; Transferring at least one alignment mark of the first element and at least one alignment mark of the second element to the same coordinate system to obtain the coordinate difference between at least one alignment mark of the first element and at least one alignment mark of the second element; Taking the comparison result of the coordinate difference and the preset calibration information as the alignment difference to perform the alignment compensation operation.

13. The bonding method according to claim 9, wherein, In response to the bonding device performing a bonding operation, the first element is configured as a chip or a wafer to be bonded, and the second element is configured as a wafer or a chip to be bonded; Using the movable pick-up stage and / or the carrier platform of the bonding device to move the first element and the second element to the alignment position, and performing an alignment compensation operation so that the first element and the second element driven to the alignment position are aligned.

14. The bonding method according to claim 13, wherein, the using the movable pick-up stage and / or the carrier platform of the bonding device to move the first element and the second element to the alignment position, and performing an alignment compensation operation so that the first element and the second element driven to the alignment position are aligned, includes: Adjust the movable pick-up stage and / or the carrier stage based on the alignment difference value to perform an alignment compensation operation on the first element and the second element at the alignment position, and then move the movable pick-up stage and / or the carrier stage in the height direction so that the first element and the second element are driven to the bonding position; or While moving the movable pick-up stage and / or the carrier stage in the height direction so that the first element and the second element are driven to the bonding position, adjust the movable pick-up stage and / or the carrier stage based on the alignment difference value to perform an alignment compensation operation on the first element and the second element.

15. The bonding method according to claim 9, wherein, Before the first element and the second element are aligned, the bonding method further includes: Driving the image acquisition device of the bonding device to move from the initial position to the working position to read the alignment marks of the first element and the second element at the alignment position; After the first element and the second element are aligned, the bonding method further includes: Driving the image acquisition device to move from the working position to the initial position so as to perform subsequent alignment compensation operations or bonding operations.

Images