Method and system for manufacturing electrically conductive adhesive tape

Abstract

A method and system for manufacturing an electrically conductive adhesive tape. The method for manufacturing an electrically conductive adhesive tape comprises: providing a first insulating film; providing a second film layer and a third film layer, wherein one of the second film layer and the third film layer comprises an insulating layer, and the other one comprises a metal layer; bonding the second film layer on the first insulating film, cutting the second film layer so as to form a plurality of second film units or the second film layer having the plurality of second film units formed by cutting in advance, and removing a second waste material after cutting; and bonding the third film layer on the plurality of second film units, cutting the third film layer so as to form a plurality of third film units or the third film layer having the plurality of third film units formed by cutting in advance, and removing a third waste material after cutting, wherein each second film unit corresponds to one of the plurality of third film units, and each second film unit is covered with a corresponding third film unit.

Description

Method and system for manufacturing conductive tape

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. CN 2023116528613, filed on December 5, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of cell electroplating, and in particular to a method and system for manufacturing a conductive tape for cell electroplating. Background Art

[0004] In the field of solar cell (cell) manufacturing, metallization is a crucial process. Screen printing is typically used to create grid lines, but the silver paste used in screen printing is relatively expensive, and the grid lines formed by screen printing have a low aspect ratio, resulting in low photovoltaic efficiency and high production costs. To address these issues, electroplating is currently commonly used to create metal grid lines for cells.

[0005] In the electroplating process of battery cells, the surface-treated or pre-treated battery cell semi-finished products are immersed in an electroplating solution containing metal ions. Then, an electric current is applied to the battery cell semi-finished products, and the metal ions are deposited into a metal grid layer on the surface of the battery cell semi-finished products through electrochemical reactions. Conventional technology usually uses a conductive clamp to directly clamp the area to be electroplated on the battery cell semi-finished products, and quickly connects the battery cell semi-finished products to the electroplating power supply to form a conductive circuit for electroplating. However, in the process of electroplating by directly clamping the battery cell semi-finished products with a conductive clamp, if the conductive clamp cannot tightly clamp the battery cell, it may cause uneven electroplating of the battery cell or even failure to be electroplated; if the operation is improper or there is a quality problem with the conductive clamp, it may cause damage to the battery cell and generate the risk of fragments. There are also other factors affecting the clamping and electroplating process, which may lead to unstable electroplating quality, such as uneven coating thickness, inconsistent coating color, etc., which affect the electroplating effect.

[0006] Based on this, conductive tape is attached to the semi-finished battery cell, and the conductive tape is used to connect the semi-finished battery cell and the conductive clip to solve the above problem. In view of the above, it is necessary to provide a method and system for batch manufacturing of conductive tape, which can efficiently produce conductive tape for battery cell electroplating. Summary of the Invention

[0007] The present disclosure relates to a method and system for manufacturing a conductive tape, which is used for mass-producing, low-cost, and automated conductive tape for electroplating of battery cells.

[0008] A first aspect of the present disclosure provides a method for manufacturing a conductive tape, comprising:

[0009] Step I—Providing a first insulating film;

[0010] Step II—providing a second film layer and a third film layer, wherein one of the second film layer and the third film layer comprises an insulating layer, and the other comprises a metal layer;

[0011] Step III—combining the second film layer on the first insulating film, cutting the second film layer to form a plurality of second film units or the second film layer has a plurality of second film units pre-cut, and removing the second waste material after cutting; and

[0012] Step IV: Laminating the third film layer onto a plurality of the second film units, cutting the third film layer to form a plurality of third film units or the third film layer having a plurality of third film units pre-cut, and removing the third film waste after cutting;

[0013] Each of the second membrane units corresponds to one of the plurality of third membrane units, and each of the second membrane units is covered with a corresponding third membrane unit.

[0014] In one embodiment, in step III, after the second film layer is composited on the first insulating film, the second film layer is punched to obtain a plurality of second film units.

[0015] In one embodiment, in step IV, after the third film layer is laminated on the second film layer, the third film layer is punched to obtain a plurality of third film units.

[0016] In one embodiment, the third film layer includes the metal layer, and the third film unit includes a metal sheet formed by cutting the metal layer; the method further includes:

[0017] Step V—Provide an insulating fourth film layer, composite the fourth film layer on a plurality of the third film units, cut the fourth film layer to form a plurality of fourth film units or the fourth film layer has a plurality of pre-cut fourth film units, each of the fourth film units covers a portion or all of a third film unit.

[0018] In one embodiment, the third film layer includes the metal layer, and the third film unit includes a metal sheet formed by cutting the metal layer; in the step IV, an insulating fourth film layer is covered on the upper surface of the third film layer, and after being compounded on the second film unit, the third film layer and the fourth film layer are cut to form a stack of multiple third film units and fourth film units, and the length of the stack is less than the length of the second film unit, so that part of the lower surface of the third film unit is shielded by the second film unit to allow the lower surface of at least one end of the third film unit to be exposed.

[0019] In one embodiment, the third film layer includes the metal layer and a conductive adhesive film covering the metal layer, and the method further includes a step of pre-treating the third film layer, the pre-treating step including: partially cutting the conductive adhesive film to form a plurality of windows on the conductive adhesive film to expose the metal layer; wherein, after cutting in step IV, the windows are located at the ends of the third film units formed by cutting.

[0020] In one embodiment, the second film layer includes the metal layer and a conductive adhesive film covering the metal layer, and the method further includes a step of pre-treating the second film layer, the pre-treating step including: partially cutting the conductive adhesive film to form a plurality of windows on the conductive adhesive film to expose the metal layer; wherein, after the cutting in step III, the windows are located at the ends of the second film units formed by cutting.

[0021] In one embodiment, the third film layer includes a first metal layer, a second metal layer and a conductive adhesive film located between the first metal layer and the second metal layer. The method also includes a step of pre-treating the third film layer, and the pre-treating step includes: locally cutting the second metal layer to form a plurality of second metal layer units; wherein, after cutting in step IV, the second metal layer unit is located on the end of the third film unit formed by cutting, and the second metal layer unit is located on the outside of the second film unit.

[0022] In one embodiment, the metal layer includes a metal foil, a surface of the metal foil is covered with a conductive adhesive layer, and the metal foil is adhered to the first insulating film or the second film layer through the conductive adhesive layer.

[0023] In one embodiment, the metal foil includes copper foil, aluminum foil, gold foil, silver foil or nickel foil.

[0024] In one embodiment, the third membrane layer includes a metal layer, a portion of the lower surface of the third membrane unit is shielded by the second membrane unit, and the length of the third membrane unit is greater than that of the second membrane unit so that the lower surface of at least one end of the metal layer is exposed.

[0025] In one embodiment, the first insulating film includes a first insulating layer and a first insulating adhesive layer covering one side surface of the first insulating layer, and the first insulating layer is adhered to the second film layer through the first insulating adhesive layer.

[0026] In one embodiment, the second film layer or the third film layer includes an insulating layer and an insulating adhesive layer covering the insulating layer, and the second film layer and the third film layer are adhered to each other via the insulating adhesive layer.

[0027] In one embodiment, in the finished product of the conductive tape, the first insulating film is in the form of a continuous strip, one or more rows of the second film units are provided on the first insulating film, each row of the second film units includes a plurality of second film units arranged at intervals along the length direction of the first insulating film, each second film unit is provided with a third film unit, and the third film unit covers all or part of the second film unit.

[0028] In one embodiment, the first insulating film, the second film layer or the third film layer is unwound from a film roll by an unwinder and then composited by a composite machine; the second film layer or the third film layer is covered with a release film, and the release film is peeled off and rolled up before composite; the second waste material after cutting off a plurality of the second film units is rolled up by a winder; the third waste material after cutting off a plurality of the third film units is rolled up by a winder.

[0029] In one embodiment, in step III or IV, when the film layers are compounded, the temperature and / or humidity near the film layers are controlled to be within a preset range.

[0030] In one embodiment, the second film layer is pre-cut to form a plurality of second film units, and the second film units are connected to the waste portion of the cut second film layer. After being compounded onto the first insulating film, the waste of the second film layer is separated from the second film units, and the waste of the second film layer is removed.

[0031] In one embodiment, the third membrane layer is pre-cut to form a plurality of third membrane units, and the third membrane units are connected to the waste portion of the cut third membrane layer. After being compounded onto the second membrane layer, the waste of the third membrane layer is separated from the third membrane units, and the waste of the third membrane layer is removed.

[0032] In one embodiment, the method is specifically implemented by the following steps:

[0033] Providing a first insulating film, providing a third insulating film as a second film layer, and overlapping and compounding the third insulating film on the upper surface of the first insulating film;

[0034] Punching the third insulating film on the upper surface of the first insulating film into the third insulating film having a second preset shape, and removing waste material of the punched third insulating film;

[0035] Providing a metal foil film as a third film layer, and overlapping and laminating the metal foil film on the upper surface of the first insulating film so that the metal foil film covers the third insulating film having a second preset shape;

[0036] punching the metal foil film covering the third insulating film having the second preset shape into the metal foil film having the first preset shape, and removing the punched metal foil film, wherein the third insulating film having the second preset shape does not completely cover the metal foil film having the first preset shape; and

[0037] Providing a second insulating film as a fourth film layer, and overlapping and compounding the second insulating film on the upper surface of the first insulating film so that the second insulating film covers the metal foil film having the first preset shape;

[0038] punching the second insulating film into the second insulating film having a third preset shape, and removing waste material after punching the second insulating film;

[0039] The metal foil is pre-treated before being covered on the third insulating film: a first preset portion of the conductive adhesive layer of the metal foil is cut off so that the metal foil and the third insulating film overlap and are punched into a second preset shape. In the longitudinal direction of the conductive tape, one end of the punched conductive adhesive layer is flush with one end of the punched third insulating film and the metal foil layer is partially exposed, while the other end of the conductive adhesive layer is not shielded by the third insulating film; or, in the longitudinal direction of the conductive tape, both ends of the punched conductive adhesive layer are not shielded by the punched third insulating film. Insulation shielding, and one end of the conductive adhesive layer is configured to expose part of the metal foil layer; or, a second metal foil layer is overlapped and compounded on the conductive adhesive layer of the metal foil film, and the second metal foil layer is punched out to remove a second preset portion, so that the metal foil film is overlapped and compounded on the third insulating film and punched into the second preset shape. In the length direction of the conductive tape, both ends of the punched conductive adhesive layer are not insulation shielded by the punched third insulating film, and the punched second metal foil layer is located on the outside of the third insulating film, thereby exposing the second metal foil layer.

[0040] A second aspect of the present disclosure provides a system for manufacturing a conductive tape, comprising:

[0041] a first unwinder, which is used to install and unwind the first insulating film roll;

[0042] Second unwinder;

[0043] a third unwinder, wherein one of the second unwinder and the third unwinder is used to install and unwind the insulating film roll, and the other is used to install and unwind the film roll containing the metal layer;

[0044] A laminating machine having a gap for allowing a plurality of films to pass through after being unwound and laminated, wherein the plurality of films are laminated with each other after passing through the gap; and

[0045] The cutting machine comprises a cutter for cutting at least one layer of the composite films into a preset pattern.

[0046] In one embodiment, the system further comprises:

[0047] A finished tape rewinder, which is used to rewind the tape after passing through the cutting machine;

[0048] The waste winder is used to wind up the cut waste.

[0049] In one embodiment, the first unwinder, the second unwinder, and the third unwinder are arranged on the compound machine; the compound machine includes:

[0050] a first compounding unit for compounding the film unwound by the second unwinder onto the upper surface of the first insulating film unwound by the first unwinder; and

[0051] a second compounding unit, which is used to compound the film unwound by the third unwinder onto the upper surface of the laminated film compounded by the first compounding unit;

[0052] The cutting machine is located at the rear side of the second composite unit to cut the two layers of film on the first insulating film.

[0053] In one embodiment, the system further includes a fourth unwinder, the system includes a plurality of the compounding units and a plurality of the cutting units, the plurality of the compounding units and the plurality of the cutting units are arranged at intervals, and each of the compounding units is provided with one, two or three of the first to fourth unwinders; the system further includes a release film winder for winding the release film separated from the film roll.

[0054] In one embodiment, the system further comprises a temperature and humidity control device configured to control the temperature and / or humidity near the film layer within a preset range.

[0055] As described above, the manufacturing method and manufacturing system of the conductive tape according to the embodiment of the present disclosure have the following beneficial effects:

[0056] Through the manufacturing method of the conductive tape of the embodiment of the present disclosure, conductive tape can be manufactured in large quantities, greatly improving production efficiency and effectively reducing production costs; large-scale production can ensure the consistency and stability of the tape, and avoid fluctuations in product quality due to different manual operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solution of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0058] FIG1 schematically shows a flow chart of manufacturing a conductive tape according to an embodiment of the present disclosure;

[0059] FIG2 schematically shows another flow chart of manufacturing a conductive tape according to an embodiment of the present disclosure;

[0060] FIG3 schematically shows a partial side view of a conductive tape according to an embodiment of the present disclosure, wherein a metal foil film is laminated on a first insulating film;

[0061] FIG4 schematically shows a system in which a first insulating film and a metal foil film are composited according to an embodiment of the present disclosure;

[0062] FIG5 schematically shows a partial top view of the conductive tape shown in FIG3 ;

[0063] FIG6 schematically shows a partial side view of a second conductive tape according to an embodiment of the present disclosure, wherein a second insulating film is laminated on the metal foil film;

[0064] FIG7 schematically shows a system for manufacturing the conductive tape shown in FIG6 according to an embodiment of the present disclosure;

[0065] FIG8 schematically shows a partial side view of a third conductive tape according to an embodiment of the present disclosure;

[0066] FIG. 9 schematically shows a system for manufacturing the conductive tape shown in FIG. 8 according to an embodiment of the present disclosure.

[0067] FIG10 schematically shows a partial top view of the conductive tape shown in FIG8 ;

[0068] FIG11 schematically shows a partial side view of a fourth conductive tape according to an embodiment of the present disclosure;

[0069] FIG12 schematically shows a system for manufacturing the conductive tape shown in FIG11 according to an embodiment of the present disclosure;

[0070] FIG13 schematically shows a partial top view of the conductive tape shown in FIG11 ;

[0071] FIG14 schematically shows a partial side view of a fifth conductive tape according to an embodiment of the present disclosure;

[0072] FIG15 schematically illustrates a system for manufacturing the conductive tape shown in FIG14 according to an embodiment of the present disclosure;

[0073] FIG16 schematically shows a partial side view of a sixth conductive tape according to an embodiment of the present disclosure;

[0074] FIG17 schematically shows a partial side view of a seventh conductive tape according to an embodiment of the present disclosure;

[0075] FIG18 schematically shows a partial side view of an eighth conductive tape according to an embodiment of the present disclosure;

[0076] in,

[0077] 100-first insulation roll; 10-first insulation film; 11-first insulation layer; 110-first insulation layer roll; 12-first insulation adhesive layer; 200-second insulation roll; 20-second insulation film unit; 21-second insulation layer; 22-second insulation adhesive layer; 300-third insulation roll; 30-third insulation film unit; 31-third insulation layer; 32-third insulation adhesive layer; 400-metal foil roll; 40-metal foil film unit; 41-first metal foil layer; 42-conductive adhesive layer; 43-second metal foil layer; 60-compounding machine; 61-compounding unit; 621-unwinding machine; 622-rewinding machine; 63-guiding mechanism; 70-cutting machine; 71-knife; 80-silicone film roll; 90-release film; 91-waste; 92-conductive tape. DETAILED DESCRIPTION

[0078] The preferred embodiments of the present disclosure are described in detail below with reference to the accompanying drawings to make the advantages and features of the present disclosure more easily understood by those skilled in the art. It should be noted that the descriptions of these embodiments are intended to facilitate understanding of the present disclosure and do not constitute a limitation of the present disclosure. In addition, the technical features involved in the various embodiments of the present disclosure described below may be combined with each other as long as they do not conflict with each other.

[0079] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one structure or feature shown in the drawings to other structures or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. Additionally, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. As used herein, "between" is inclusive of both endpoints.

[0080] In the context of the present disclosure, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0081] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present disclosure in a schematic manner, and therefore the illustrations only show components related to the present disclosure rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the shape, quantity and proportion of each component may be variable, and the component layout may also be more complex.

[0082] In conventional cell electroplating processes, a conductive clip that can conduct electricity is usually used to directly clamp the semi-finished cell and place it in an electroplating tank for electroplating. The inventors have found that the electroplating quality of this conventional process is not high. For example, if the conductive clip directly clamps the semi-finished cell, it may not be easy to tightly clamp the semi-finished cell, resulting in uneven electroplating of the semi-finished cell or the inability to electroplate, or the conductive clip is clamped too tightly, resulting in fragments of the semi-finished cell, affecting the uniformity of the electroplating of the cell. Based on the above findings, the inventors adhered one end of the conductive tape to the semi-finished cell and the other end to the working end of the conductive clip, which not only avoids damage caused by direct contact between the conductive clip and the semi-finished cell, but also enables the semi-finished cell to be connected to the circuit, allowing for smooth electroplating and improving the quality of cell electroplating. The following embodiment provides a method and system for batch production of conductive tape.

[0083] Referring to Figures 1 to 18 , the conductive tape includes at least three layers of film: from bottom to top, a first insulating film 10, a second film unit, and a third film unit. The second film unit is formed by cutting the second film layer, and the third film unit is formed by cutting the third film layer. In one embodiment, the second film layer is a metal foil film described below, and the third film layer is a fourth insulating film described below. Specifically, the metal foil film is sandwiched between two insulating film layers (the first insulating film and the fourth insulating film), as shown in Figure 6 . In another embodiment, the second film layer is a third insulating film described below, and the third film layer is a metal foil film described below, as shown in Figure 9 . The metal foil film includes a metal layer and a conductive adhesive coated on the metal layer. The metal layer can be a metal foil, such as copper foil, aluminum foil, gold foil, silver foil, or nickel foil.

[0084] The conductive tape may also include a fourth film unit. Specifically, the conductive tape includes a first insulating film 10, a second film unit, a third film unit, and a fourth film unit stacked sequentially from bottom to top. In this case, the second film layer is the third insulating film described below, the third film layer is the metal foil film described below, and the fourth film unit is formed by cutting the fourth film layer, and the fourth film layer is the fourth insulating film described below, as shown in Figures 11, 14, 16 to 18.

[0085] It should also be noted that the finished conductive tape is in the form of a continuous strip, wound into a tape roll. The first insulating film 10 is continuous and serves as a base film, which can be a release film. This first insulating film 10 is peeled off during electroplating. The first insulating film 10 is composited with multiple spaced-apart laminated film structures (including a metal foil film unit 40, a second insulating film unit 20, and / or a third insulating film unit 30). Each laminated film structure, after being separated from the first insulating film 10, can be connected between the semi-finished cell to be plated and the conductive clip to serve as a conductive member. Figures 3, 5, 6, 8, 10, 11, 13, 14, 17, and 18 illustrate only one of the laminated film structures on the first insulating film 10, while Figure 16 illustrates three laminated film structures on the first insulating film 10. However, it should be understood that, in practice, the first insulating film 10 of a conductive tape can be composited with more laminated film structures. One or more rows of second membrane units are disposed on the first insulating film 10. Each row of second membrane units includes multiple second membrane units spaced apart along the length of the first insulating film. Each second membrane unit is provided with a third membrane unit, which covers all or part of the second membrane unit. In other words, one or more rows of stacked membrane structures are disposed on the first insulating film 10. Each row of stacked membrane structures includes multiple stacked membrane structures spaced apart along the length of the first insulating film.

[0086] As shown in Figures 4, 7, 9, 12, and 15, the system for manufacturing conductive tape includes at least: a laminating machine 60, a cutting machine 70, a temperature and humidity control device (not shown), a roller cutter (not shown), multiple unwinders, and multiple rewinders. The laminating machine 60 is configured to overlap and laminate multiple layers of film, the cutting machine 70 is configured to punch the film layers into a predetermined shape, the temperature and humidity control device is configured to detect and control the temperature and humidity of the film layers to maintain them within a predetermined range, and the roller cutter is configured to cut the composite film layers into conductive tape 92 of a predetermined shape.

[0087] The raw materials used in the system include at least a first insulating film 10 and a metal foil film. In one example, the first insulating film 10 is in the form of a first insulating film roll 100, wherein the continuous first insulating film 10 is wound into the first insulating film roll 100, and the first insulating film 10 includes at least a first insulating layer 11. The metal foil film is in the form of a metal foil film roll 400, wherein the continuous metal foil film is wound into the metal foil film roll 400, and the metal foil film includes a first metal foil layer 41 and a conductive adhesive layer 42, and the size of the metal foil film is no larger than the size of the first insulating film 10. The compounding machine 60 and the cutting machine 70 are spaced apart and staggered, starting with one compounding machine 60 and ending with another compounding machine 60. The conductive tape manufacturing system also includes a control module for controlling the compounding machine, the cutting machine, and other devices to cooperate with all mechanisms to complete the manufacturing of the conductive tape 92, further improving the automation level of the entire system.

[0088] Specifically, the laminating machine 60 has multiple laminating units 61 arranged on a flat surface along the material feed direction. The laminating units 61 are configured to overlap and laminate multiple film layers. The system also includes multiple unwinders and rewinders. The unwinders are configured to unwind new material rolls, while the rewinders are configured to rewind waste material 91 or conductive tape 92. The system also includes multiple guides 63 arranged along the material feed direction. These guides 63 are configured to prevent the film layers from shifting during the laminating or cutting process. The cutter 70 includes a quickly installable and removable cutter 71 configured to punch the film layers into a predetermined shape. In this embodiment, the cutter 70 is preferably a punching machine, such as a flat-blade cutter. A temperature and humidity control device is provided on the laminating machine 60 and specifically includes a temperature controller and a humidity controller. The temperature controller is configured to monitor and control the temperature of the film layers to maintain it within a predetermined range. The humidity controller is configured to monitor and control the humidity of the film layers to maintain it within a predetermined range.

[0089] As shown in FIG4 , the composite unit 61 may include an upper pressing roller 611 and a lower pressing roller 612 arranged one above the other, with a gap between the upper pressing roller 611 and the lower pressing roller 612. The film passes through the gap and is pressed together by the upper pressing roller 611 and the lower pressing roller 612, thereby enabling the multilayer film to be composited.

[0090] The manufacturing method of this embodiment is implemented using the aforementioned conductive tape manufacturing system. To facilitate the description of the conductive tape manufacturing method, an XY two-dimensional coordinate system is constructed in this embodiment, with the film's length direction as X and its width direction as Y. The length direction X and the width direction Y are perpendicular to each other and extend horizontally. The length direction X is defined as the material feed direction of the compound machine 60.

[0091] The method for manufacturing a conductive tape in this embodiment includes the following steps:

[0092] Step I—Providing a first insulating film;

[0093] Step II—providing a second film layer and a third film layer, wherein one of the second film layer and the third film layer comprises an insulating layer and the other comprises a metal layer;

[0094] Step III: Laminating the second film layer on the first insulating film, cutting the second film layer to form a plurality of second film units, and removing the second waste material after cutting; and

[0095] Step IV: Laminating the third film layer onto the plurality of second film units, cutting the third film layer to form a plurality of third film units, and removing the cut third waste;

[0096] Each second membrane unit corresponds to one of the plurality of third membrane units, and each second membrane unit is covered with a corresponding third membrane unit.

[0097] A specific process of the above method is shown in FIG1 , which includes the following steps:

[0098] S11-providing a first insulating film and a third insulating film (i.e., a second film layer), and overlapping and compounding the third insulating film on the upper surface of the first insulating film;

[0099] S12—punching the third insulating film on the upper surface of the first insulating film into a plurality of third insulating film units (i.e., second film units) having a second preset shape, and removing waste of the punched third insulating film, that is, removing a portion other than the plurality of third insulating film units, and leaving only the plurality of mutually separated third insulating film units on the first insulating film;

[0100] S13—Providing a metal foil film (i.e., a third film layer), overlapping and laminating the metal foil film on the first insulating film, wherein the metal foil film covers a plurality of third insulating film units;

[0101] S14 – Punching the metal foil into a plurality of metal foil units (i.e., a third film unit) having a first preset image, and removing the punched metal foil, that is, removing the portion other than the plurality of metal foil units, and retaining only a plurality of mutually separated metal foil units, wherein the third insulating film unit does not completely cover the metal foil unit; or, the metal foil unit completely covers the third insulating film unit and may further exceed its range.

[0102] A specific process for manufacturing conductive tape using the above system is shown in FIG2 , and specifically includes the following steps:

[0103] S21-Overlapping and laminating the first insulating film and the third insulating film using a laminating machine to form a composite structure, wherein the first insulating film is on the bottom and the third insulating film is on the top of the composite structure, and the upper surface of the first insulating film is tightly attached to the lower surface of the third insulating film;

[0104] S22: punching the third insulating film in the composite structure in step S21 into a plurality of third insulating film units having a second preset shape using a cutting machine, and removing waste third insulating film after punching;

[0105] S23 - overlapping and laminating the metal foil film and the first insulating film by a laminating machine to form a new composite structure, so that the metal foil film covers the third insulating film unit having the second preset shape, and the upper surface of the third insulating film unit is tightly attached to the lower surface of the metal foil film;

[0106] S24: punching the metal foil in the composite structure in step S23 into a plurality of metal foil units having a first preset shape using a cutting machine, and removing the metal foil waste after punching, wherein the third insulating film unit having a second preset shape does not completely cover the metal foil unit having the first preset shape.

[0107] As shown in Figures 3 to 5 , in a specific example, the first insulating film 10 includes at least a first insulating layer 11, and the metal foil film and the cut metal foil film unit 40 include a first metal foil layer 41 and a conductive adhesive layer 42. The manufacturing method of the first insulating film 10 includes: providing a granular insulating material, melting the insulating material and extruding it into a film, drying it through a drying device, and cooling it to form the first insulating layer 11. Before the insulating material is melted, a certain proportion of adhesive and other additives may be added as needed to improve its adhesive and mechanical properties. The manufacturing method of the metal foil film includes: providing a metal blank, forming the metal blank into a film through a rolling process to form a first metal foil layer 41, wherein the rolling process includes a hot rolling process and / or a cold rolling process; and coating the first metal foil layer 41 with a conductive adhesive to form a conductive adhesive layer 42. The first metal foil layer 41 and the conductive adhesive layer 42 together form a metal foil film, and the upper surface of the first metal foil layer 41 is tightly bonded to the lower surface of the conductive adhesive layer 42. In an atmosphere with a preset temperature and a preset humidity, a composite metal foil film is overlapped on the first insulating film 10, and the conductive adhesive layer 42 is tightly fitted to the first insulating layer 11. The metal foil film of the composite structure is punched into a metal foil film unit 40 having a first preset shape, and the waste 91 after the metal foil film is punched is removed. Specifically, the metal foil film is cut into strips with a long length, and the edges of the strip-shaped metal foil film unit 40 can be straight or wavy, and can be set according to actual needs, which is not limited here. The manufacturing method of the conductive tape of this embodiment can produce conductive tape in large quantities, greatly improve production efficiency, and effectively reduce production costs; it can ensure the consistency and stability of the conductive tape, and avoid fluctuations in product quality due to differences in manual operation.

[0108] During the manufacturing process of the conductive tape 92 using the conductive tape manufacturing system, for the conductive tape 92 comprising a first insulating film 10 and a metal foil film, the first insulating film 10 is in the form of a first insulating film roll 100, and the metal foil film is in the form of a metal foil roll 400. The first insulating film roll 100 is placed on an unwinder 621 below a laminating machine 60, and the metal foil roll 400 is placed on another unwinder 621 above the laminating machine 60. The unwinding is performed simultaneously, and the metal foil film and the first insulating film 10 are overlapped and laminated together by a laminating unit 61 to form a composite structure. In the composite structure, the first insulating film 10 is positioned at the bottom and the metal foil film is positioned at the top. The conductive adhesive layer 42 of the metal foil film is tightly bonded to the first insulating film 10. Both the metal foil film and the first insulating film 10 are guided by a guide structure 63 before and after lamination to prevent them from shifting during the lamination process. The composite structure is passed along the guide device 63 into the cutting machine 70, where the cutter 71 on the cutting machine 70 punches the metal foil on the composite structure into metal foil units 40 having a first predetermined shape. That is, the first metal foil layer 41 and the conductive adhesive layer 42 of the metal foil are simultaneously punched into the first predetermined shape. In other embodiments, to achieve high dimensional precision of the conductive tape 92, two cutters 71 are provided on the cutting machine 70. The first cutter 71 punches the first metal foil layer 41 into the first metal foil unit of the first predetermined shape, and the second cutter 71 with higher precision punches the conductive adhesive layer 42 into the conductive adhesive unit of the first predetermined shape. The composite structure is passed along the guide device 63 into another laminating machine 60 arranged along the feeding direction. A reel 622 above the laminating machine 60 reels and removes the waste material 91 after the metal foil is punched, and another reel 622 below the laminating machine 60 reels the composite structure.

[0109] The conductive tape manufactured in this way is prone to residual adhesive left on the semi-finished battery cell after being pasted on the semi-finished battery cell for electroplating due to environmental temperature, humidity and other issues, which affects the processing of the semi-finished battery cell in subsequent processes. In order to solve this problem, the conductive tape manufacturing system can be placed in an atmosphere with a preset temperature and humidity to manufacture the conductive tape 72. However, long-term atmosphere settings may cause damage to various device parts of the manufacturing system, affecting the service life. Preferably, the conductive tape manufacturing system also includes a temperature and humidity control device, which is provided on the compounding machine 60. When the compounding machine 60 compounds the film layer, the temperature and humidity control device only controls the temperature and humidity of the film layer, or only controls the temperature and humidity near the film layer to be within a preset range, so that the compounded film layer is in a calculated preset environmental atmosphere.

[0110] It should be noted that when the metal foil is rolled into a metal foil roll 400, a release film 90 is placed on the conductive adhesive 42 to prevent adhesion. When the metal foil roll 400 is unwound, a rewinder 622 is also required to rewind the release film 90 peeled off from the conductive adhesive 42. When punching the metal foil, multiple metal foil units 40 can be punched simultaneously along the width direction Y within the permitted size range. In this embodiment, two metal foil units 40 are punched simultaneously, as shown in Figure 5.

[0111] In one specific example, multiple metal foil units 40 are arranged regularly or irregularly, and the metal foil is punched at the maximum punching ratio to avoid wasting the metal foil. In another specific example, the metal foil is pre-punched into multiple metal foil units 40, but the punched metal foil units 40 are not separated from the waste 91, leaving a small connection area; the metal foil is then overlapped and composited with the first insulating film 10. The waste 91 of the metal foil on the composite structure is then removed, and the composite structure is cut into multiple conductive tapes 92 of a preset size by a roller cutter; preferably, the multiple conductive tapes 92 are cut into narrower widths, and the metal foil units 40 with the first preset shape on each conductive tape 92 are not damaged during cutting; finally, the multiple conductive tapes 92 that have been cut are rolled into rolls, or are rolled up separately by the winder 622 on the composite machine.

[0112] As shown in FIG5 , in one example of this embodiment, the metal foil unit 40 is in the form of an elongated strip, with a width much smaller than its length. The specific shape of the metal foil unit 40 can also be set according to actual conditions and is not specifically limited here. Preferably, the metal foil unit 40 is "convex" or T-shaped as a whole. When the conductive tape 92 is used in the electroplating process of the battery cell, the punched metal foil unit 40 is peeled off from the first insulating film 10, and one end of the metal foil unit 40 is adhered to the semi-finished battery cell to be electroplated, and the other end is adhered to the conductive clip. However, since the first metal foil 41 and the conductive adhesive layer 42 of the metal foil unit 40 are both conductors, part of the metal foil will follow the semi-finished battery cell into the electroplating tank and come into direct contact with the electroplating solution in the electroplating tank. During the electroplating process, the metal ions in the electroplating solution will adhere to the charged metal foil unit 40, affecting the electroplating quality of the battery cell. In view of the above, it is necessary to insulate and cover at least one side of the metal foil unit 40 on the conductive tape 92 to improve the electroplating quality of the battery cell.

[0113] In a further embodiment, a layer of insulating film is overlapped and laminated above and / or below the metal foil membrane unit 40 .

[0114] As shown in FIG6 , in one example, a second insulating film unit 20 is superimposed and composited on top of a metal foil unit 40. The second insulating film unit 20 includes a second insulating layer 21 and a second insulating adhesive layer 22. The second insulating adhesive layer 22 of the entire second insulating film, which has not yet been cut, is tightly bonded to the first metal foil layer 41 of the metal foil. The second insulating film and the metal foil are simultaneously punched to form a plurality of second insulating film units 20 and metal foil units 40 having a first predetermined shape. The waste material 91 from the punched second insulating film units 20 and metal foil units 40 is then removed. The manufacturing method for the second insulating film includes: providing a granular insulating material, melting the insulating material and extruding it into a film, cooling it to form the second insulating layer 21. Before the insulating material is melted, a certain proportion of adhesive and other additives may be added as needed to improve its adhesiveness and mechanical properties. Insulating adhesive is applied to the second insulating layer 21 and dried to form the second insulating adhesive layer 22. The second insulating layer 21 and the second insulating adhesive layer 22 together form the second insulating film, with the upper surface of the second insulating layer 21 tightly bonded to the lower surface of the second insulating adhesive layer 22. The material of the second insulating layer 21 and the material of the insulating glue can be set according to actual needs and are not limited here.

[0115] FIG7 illustrates a specific example of a system for manufacturing the conductive tape shown in FIG6 , which is suitable for a conductive tape 92 comprising a first insulating film 10, a metal foil film, and a second insulating film. The second insulating film is also in the form of a second insulating film roll 200. The first insulating film roll 100, the metal foil film roll 400, and the second insulating film roll 200 are sequentially mounted on three unwinders 621 on a laminating machine 60. The three unwinders 621, each mounting the first insulating film roll 100, the metal foil film roll 400, and the second insulating film roll 200, simultaneously unwind the films. The unwound first insulating film 10, the metal foil film, and the second insulating film are synchronously and continuously passed through the laminating unit 61, thereby overlapping and laminating to form a composite structure. The composite structure comprises, from bottom to top, the first insulating film 10, the metal foil film, and the second insulating film. The conductive adhesive layer 42 of the metal foil film is tightly bonded to the first insulating film 10, and the second insulating adhesive layer 22 of the second insulating film is tightly bonded to the first metal foil layer 41 of the metal foil film. The first insulating film 10, the metal foil film, and the second insulating film are all guided by a guide structure 63 before and after lamination to prevent them from shifting during the lamination process. During the overlapping and laminating process, the temperature and humidity of the film layers are controlled by a temperature and humidity control device to maintain the film layers within a calculated preset environmental range. The composite structure is passed along the guide structure 63 into a cutting machine 70, where a cutter 71 on the cutting machine 70 simultaneously punches the second insulating film and the metal foil film on the composite structure into second insulating film units 20 and metal foil film units 40 having a first preset shape. Specifically, the second insulating layer 21 and second insulating adhesive layer 22 of the second insulating film, as well as the first metal foil layer 41 and conductive adhesive layer 42 of the metal foil film, are simultaneously punched into the first preset shape. In one example, to achieve high dimensional precision for the conductive tape 92, two cutters 71 are provided on the cutting machine 70. The first cutter 71 punches the second insulating film into second insulating film units 20 having the first preset shape, and the second cutter 71, with higher precision, punches the metal foil into metal foil film units 40 having the first preset shape. In another example, the number of cutters 71 on the cutting machine 70 may be set to be greater than two, specifically corresponding to the number of each layer structure on all the films, and each layer structure of each film is finely punched to improve the accuracy of the tape size.

[0116] The composite structure is fed along the guide device 63 into another laminating machine arranged along the feeding direction. The waste material 91 of the second insulating film and metal foil film after punching is wound up by the winder 622 above the laminating machine 60. A single winder 622 can simultaneously wind up both layers of the punched film. However, this method of winding the composite structure places excessive stress on it, and it is easy for the second insulating film unit 20 or the metal foil unit 40 in the composite structure to be wound up along with the waste material 91 during the winding process, affecting the uniformity of the conductive tape 92. Preferably, two winders 622 are provided in sequence to wind up the waste material 91 of the punched second insulating film and the waste material 91 of the metal foil, respectively. A single winder 622 below the laminating machine 60 winds up the composite structure, completing the production of the conductive tape 92.

[0117] It should be noted here that when the second insulating film is rolled into the second insulating film roll 200, in order to avoid mutual adhesion, a layer of release film 90 is also set on the second insulating adhesive layer 32. When the second insulating film roll 200 is unwound by the unwinding machine 621, a winder 622 is also required to rewind the release film 90 peeled off from the second insulating adhesive layer 32.

[0118] In the example of overlapping and compounding the second insulating film unit 20 above the metal foil membrane unit 40, since the first metal foil layer 41 in the metal foil membrane unit 40 is not easy to adhere to the second insulating glue 22 layer of the second insulating film unit 20, a layer of double-sided insulating glue with greater viscosity can be added between the metal foil membrane unit 40 and the second insulating film unit 20 to assist in overlapping and compounding the second insulating film unit 20 above the metal foil membrane unit 40, or the second insulating film unit 20 only includes one second insulating layer 21, and a layer of double-sided insulating glue with greater viscosity is added between the metal foil membrane unit 40 and the second insulating layer 21 to achieve the purpose of insulating and shielding the non-working surface of the metal foil membrane unit 40.

[0119] Figures 8 and 10 show another example of a conductive tape. A third insulating film is laminated between a first insulating film 10 and a metal foil film. The third insulating film includes a third insulating layer 31 and a third insulating adhesive layer 32. The first insulating film 10 includes a first insulating adhesive layer 12. The third insulating film is laminated on the first insulating film 10, with the third insulating layer 31 of the third insulating film tightly attached to the first insulating adhesive layer 11 of the first insulating film. The third insulating film is punched into third insulating film units 30 having a second predetermined shape, and the resulting waste 91 of the third insulating film is removed. A metal foil is laminated on the third insulating film units 30, with the conductive adhesive layer 42 of the metal foil tightly attached to the third insulating adhesive layer 31 of the third insulating film units 30. The metal foil is punched into metal foil units 40 having a first predetermined shape, and the resulting waste 91 of the metal foil is removed. In the width direction Y, the dimensions of the punched metal foil units 40 having the first predetermined shape are no greater than the dimensions of the punched third insulating film units 30 having the second predetermined shape. In the length direction X, the size of the punched metal foil unit 40 having the first preset shape is larger than the size of the punched third insulating film unit 30 having the second preset shape, so that the ends of the conductive adhesive layer 42 of the punched metal foil unit 40 having the first preset shape are not covered by the punched third insulating film unit 30 having the second preset shape. The manufacturing method of the third insulating film includes: providing a granular insulating material, melting the insulating material and extruding it into a film, cooling it to form a third insulating layer 31, and adding a certain proportion of adhesive and other additives as needed before melting the insulating material to improve its bonding and mechanical properties; applying insulating glue on the third insulating layer 31, drying it to form a third insulating glue layer 32, and the third insulating layer 31 and the third insulating glue layer 32 together form a third insulating film. The upper surface of the third insulating layer 31 and the lower surface of the third insulating glue layer 32 are tightly bonded. The materials of the third insulating layer 31 and the insulating glue can be set according to actual needs and are not limited here. The manufacturing method of the first insulating film 10 includes applying an insulating adhesive onto the first insulating layer 11 and drying the insulating adhesive in a dryer to form a first insulating adhesive layer 12. The first insulating layer 11 and the first insulating adhesive layer 12 together form the first insulating film 10. The upper surface of the first insulating layer 11 and the lower surface of the first insulating adhesive layer 12 are tightly bonded. The materials of the first insulating layer 11 and the insulating adhesive can be set according to actual needs and are not limited here.

[0120] It should be noted that, in the width direction Y, if the size of the punched metal foil unit 40 having the first preset shape is larger than the size of the punched third insulating film unit 30 having the second preset shape, the third insulating film unit 30 will not be able to completely insulate and shield the non-working area of ​​the conductive adhesive layer 42 of the metal foil unit 40, causing the conductive tape to still affect the electroplating effect during the electroplating process. Preferably, in the width direction Y, the second preset shape and the first preset shape have the same size; in the length direction X, the punched metal foil unit 40 having the first preset shape is exposed at both ends of the conductive adhesive layer 42, with one end bonded to the semi-finished cell to be electroplated and the other end bonded to the conductive clip.

[0121] Figure 9 shows a specific example of a system for manufacturing the conductive tape shown in Figure 8 , suitable for a conductive tape 92 comprising a first insulating film 10, a third insulating film, and a metal foil film. In this specific example, the first insulating film 10 serves as the base of the conductive tape 92. The first insulating layer 11 is preferably an acrylic protective layer, and the first insulating adhesive layer 12 is preferably a single layer of silicone with low viscosity. In a preferred embodiment, the first insulating layer 11 and the first insulating adhesive layer 12 are each separately wound up in the form of a first insulating layer roll 110 and a silicone film roll 80. The first insulating layer roll 110 and the silicone film roll 80 are both placed on two unwinders 621 arranged in sequence below the machine platform of a laminating machine 60. The third insulating film is in the form of a third insulating film roll 300, which is placed on a winder 622 above the machine platform of the same laminating machine 60. The first insulating layer roll 110, the silicone film roll 80, and the third insulating film roll 300 are unwound simultaneously. The first insulating layer 11, the single silicone layer (i.e., the first insulating adhesive layer 12), and the third insulating film are overlapped and compounded by the compounding unit 61 to form a composite structure. The composite structure is composed of the first insulating layer 11, the first insulating adhesive layer 12, and the third insulating film from bottom to top. The third insulating layer 31 of the third insulating adhesive film is tightly attached to the first insulating adhesive layer 12. The first insulating layer 11, the first insulating adhesive layer 12, and the third insulating film all pass through the guide structure 63 before and after compounding to prevent their positions from deviating during the compounding process. During the overlapping and compounding process of the film layers, the temperature and humidity of the film layers are controlled by the temperature and humidity control device to keep the film layers within the calculated preset environmental range. The composite structure is passed into the cutting machine 70 along the guide device 63, and the knife 71 on the cutting machine 70 punches the third insulating film on the composite structure into a third insulating film unit 30 having a second preset shape, that is, the third insulating layer 31 and the third insulating glue layer 32 of the third insulating film are punched into the second preset shape at the same time to form the third insulating film unit 30.

[0122] The composite structure is fed along a guide 63 to a second laminating machine 60 in the feeding direction. A reel 622 on the platform of the second laminating machine 60 reels the third insulating film waste 91 after punching. Meanwhile, the metal foil film is also in the form of a metal film roll 400. The metal film roll 400 is placed on an unwinder 621 above the platform of the second laminating machine 60 in the feeding direction. While the third insulating film waste 91 is being rewound, the metal film roll 400 is also unwound. The metal foil film and the composite structure are then overlapped and laminated with each other via the laminating unit 61 to form a new composite structure. From bottom to top, the new composite structure comprises, in order, the first insulating film 10, the third insulating film unit 30, and the metal foil film. The conductive adhesive layer 42 of the metal foil film is tightly bonded to the third insulating adhesive layer 32 of the third insulating film unit 30. During the overlapping and laminating process, the temperature and humidity of the film layers are controlled by a temperature and humidity control device to maintain the film layers within a pre-calculated, preset environmental range. The new composite structure is passed along the guide device 63 into a second cutting machine 70 along the feeding direction. The cutter 71 on the cutting machine 70 punches the metal foil on the composite structure into a metal foil unit 40 having a first preset shape. That is, the first metal foil layer 41 and the conductive adhesive layer 42 of the metal foil unit 40 are simultaneously punched into the first preset shape to form the metal foil unit 40. The new composite structure is passed along the guide device 63 into a third compounding machine 60 arranged along the feeding direction. A winder 622 above the third compounding machine 60 winds up the waste material 91 after the metal foil is punched. After the third compounding machine 60 has compounded the new composite structure again, another winder 622 below the compounding machine 60 winds up the composite structure. At this point, the conductive adhesive tape 92 is manufactured.

[0123] It should be noted that when the third insulating film is rolled into the third insulating film roll 300, a release film 90 is placed on the third insulating adhesive layer 32 to prevent adhesion. When the third insulating film roll 300 is unwound by the unwinder, a rewinder 622 is also required to rewind the release film 90 that has been peeled off from the third insulating adhesive layer 32.

[0124] In order to solve the problem of inaccurate overlap of film layers, the system for manufacturing conductive tape also includes a position detection device, which is configured to locate the position of the film layer when punching. When punching the metal foil film into a first preset shape, it needs to be aligned and stacked with the third insulating film unit 30 having a second preset shape.

[0125] Regardless of whether an insulating film is laminated above or below the metal foil unit 40, one side of the metal foil unit 40 will remain conductive and uninsulated, thus affecting the electroplating effect of the cell in the plating solution. To address this issue, both the top and bottom of the metal foil unit 40 are insulated and shielded.

[0126] In another embodiment, a composite third insulating film unit 30 is overlapped between the first insulating film 10 and the metal foil film unit 40, and the metal foil film unit 40 further includes an insulating layer. The insulating layer is located on the side of the first metal foil layer 41 away from the conductive adhesive layer 42, and the insulating layer and the metal foil layer 41 are integrally provided. Specifically, the insulating layer can be a passivation layer, an oxide layer, or a layer of insulating coating of the metal foil layer 41. As long as the insulating layer has an insulating shielding function, it can also be provided according to actual needs, and there is no limitation here. As shown in Figures 11 and 13, in an example of this embodiment, a composite second insulating film unit 20 is overlapped above the metal foil film unit 40, and a composite third insulating film unit 30 is overlapped between the first insulating film 10 and the metal foil film unit 40. The first insulating film 10 includes a first insulating layer 11 and a first insulating adhesive layer 12. The upper surface of the first insulating layer 11 and the lower surface of the first insulating adhesive layer 12 are tightly bonded. During the manufacturing of the conductive tape, a composite third insulating film is superimposed on the first insulating film 10, with the third insulating layer 31 of the third insulating film tightly bonded to the first insulating adhesive layer 12 of the first insulating film 10. The third insulating film is then punched into a plurality of third insulating film units 30 having a second predetermined shape, and the resulting waste 91 of the third insulating film is removed. A composite metal foil is superimposed on the third insulating film units 30, with the conductive adhesive layer 42 of the metal foil tightly bonded to the third insulating adhesive layer 32 of the third insulating film units 30. The metal foil is then punched into a plurality of metal foil units 40 having a first predetermined shape, and the resulting waste 91 of the metal foil is removed. In the width direction Y, the dimensions of the punched metal foil units 40 having the first predetermined shape are no greater than the dimensions of the punched third insulating film units 30 having the second predetermined shape. In the length direction X, the size of the punched metal foil unit 40 having the first preset shape is larger than the size of the punched third insulating film unit 30 having the second preset shape, so that one end of the conductive adhesive layer 42 of the punched metal foil unit 40 having the first preset shape is not insulated and covered by the punched third insulating film unit 30 having the second preset shape. A second insulating film is laminated on the metal foil unit 40, with the second insulating adhesive layer 22 of the second insulating film tightly attached to the first metal foil layer 41 of the metal foil unit 40. The second insulating film is punched into a second insulating film unit 20 having the third preset shape, and the waste material 91 after the punching of the second insulating film is removed. In the width direction Y, the size of the punched metal foil unit 40 having the first preset shape is no larger than the size of the punched second insulating film unit 20 having the third preset shape. In the length direction X, the size of the metal foil membrane unit 40 with the first preset shape after punching is larger than the size of the second insulating membrane unit 20 with the third preset shape after punching, so that the other end of the first metal foil layer 41 of the metal foil membrane unit 40 with the first preset shape after punching is not covered by the second insulating membrane unit 20 with the third preset shape after punching.Preferably, the manufacturing method, material and structure of the second insulating film and the third insulating film are completely the same.

[0127] It should be noted that, in the width direction Y, if the dimensions of the punched third insulating film unit 30 having the second preset shape and the punched second insulating film unit 20 having the third preset shape are both smaller than the dimensions of the punched metal foil unit 40 having the first preset shape, the third insulating film unit 30 and the second insulating film unit 20 cannot completely shield the non-working area of ​​the metal foil unit 40, causing the conductive tape to affect the electroplating effect during the electroplating process. Preferably, in the width direction Y, the dimensions of the second preset shape and the third preset shape are the same as the dimensions of the first preset shape; in the length direction X, the two ends of different surfaces of the punched metal foil unit 40 having the first preset shape are exposed, that is, the first end of the conductive adhesive layer 42 is exposed, and the second end of the first metal foil layer 41 is exposed, while the other parts are insulated and shielded. The exposed first end of the conductive adhesive layer 42 is attached to the semi-finished cell to be electroplated, and the exposed second end of the first metal foil layer 41 is clamped by a conductive clip.

[0128] FIG12 shows a specific example of a system for manufacturing the conductive tape shown in FIG11 , which is applicable to a conductive tape 92 including a first insulating film 10, a third insulating film, a metal foil film, and a second insulating film. The first insulating film 10 serves as the base of the conductive tape 92. The first insulating film 10 includes a first insulating layer 11 and a first insulating adhesive layer 12. The first insulating layer 11 is preferably an acrylic protective layer, and the first insulating adhesive layer 12 is preferably a single-layer silicone layer with low viscosity. In the first compounding machine 60, the first insulating layer 11, the single-layer silicone layer (i.e., the first insulating adhesive layer 12), and the third insulating film are overlapped and compounded by the compounding unit 61 to form a first composite structure. The first composite structure is composed of the first insulating layer 11, the first insulating adhesive layer 12, and the third insulating film from bottom to top, and the third insulating layer 31 of the third insulating film is tightly attached to the first insulating adhesive layer 12. The first composite structure is passed into the cutting machine 70 along the guide device 63, and the tool on the cutting machine 70 punches the third insulating film on the first composite structure into a plurality of third insulating film units 30 having a second preset shape, that is, the third insulating layer 31 and the third insulating glue layer 32 of the third insulating film are simultaneously punched into the second preset shape to form a plurality of third insulating film units 30.

[0129] The first composite structure is passed along a guide device 63 to a second composite machine 60 in the feeding direction. The metal foil film and the first composite structure are overlapped and composited with each other via a composite unit 61 to form a second composite structure. The second composite structure comprises, from bottom to top, a first insulating film 10, a third insulating film unit 30, and a metal foil film. The conductive adhesive layer 42 of the metal foil film is tightly bonded to the third insulating adhesive layer 32 of the third insulating film unit 30. The second composite structure is passed along a guide device 63 to a second cutting machine 70 in the feeding direction. A cutting tool 71 on the cutting machine 70 punches the metal foil film on the second composite structure into a plurality of metal foil film units 40 having a first predetermined shape. That is, the first metal foil layer 41 and the conductive adhesive layer 42 of the metal foil film are simultaneously punched into the first predetermined shape, forming a plurality of metal foil film units 40.

[0130] The second composite structure is passed along a guide device 63 into a third composite machine 60 arranged along the feed direction. The second insulating film and the second composite structure are overlapped and composited with each other via a composite unit 61 to form a third composite structure. From bottom to top, the third composite structure comprises, in order, a first insulating film 10, a third insulating film unit 30, a metal foil film unit 40, and a second insulating film. The second insulating layer 21 of the second insulating adhesive is tightly bonded to the metal foil layer 41 of the metal foil film unit 40. The third composite structure is passed along a guide device 63 into a third cutting machine 70 along the feed direction. The cutting tool on the cutting machine 70 punches the second insulating film on the third composite structure into a plurality of second insulating film units 20 having a third preset shape. In other words, the second insulating layer 21 and the second insulating adhesive layer 22 of the second insulating film are simultaneously punched into the third preset shape, forming a plurality of second insulating film units 20. The third composite structure is passed along the guide device 63 into the fourth composite machine 60 arranged along the feeding direction. The waste material 91 after punching the second insulating film is wound up by a winder 622 above the fourth composite machine 60, and the third composite structure is re-compounded to reduce the risk of cracking between the film layers. The third composite structure is wound up by another winder 622 below the fourth composite machine 60. At this point, the conductive tape 92 is manufactured.

[0131] As shown in Figure 14, in one embodiment, a second insulating film unit 20 is laminated on top of a metal foil unit 40, and a third insulating film unit 30 is laminated between the first insulating film 10 and the metal foil unit 40. The first insulating film 10 includes a first insulating layer 11 and a first insulating adhesive layer 12 thereon. A third insulating film is laminated on the first insulating film 10, with the third insulating layer 31 of the third insulating film tightly attached to the first insulating adhesive layer 11 of the first insulating film 10. The third insulating film is then punched into a plurality of third insulating film units 30 having a second predetermined shape, and waste material 91 from the punching of the third insulating film is removed. The composite metal foil film and the second insulating film are sequentially stacked on the third insulating film unit 30. The third insulating adhesive layer 32 of the third insulating film is tightly bonded to the conductive adhesive layer 42 of the metal foil film, and the second insulating adhesive layer 22 of the second insulating film is tightly bonded to the first metal foil layer 41 of the metal foil film. The second insulating film and the metal foil are then sequentially punched into a first predetermined shape to form a stacked second insulating film unit 20 and a metal foil film unit 40. The resulting punched waste 91 of the second insulating film and metal foil films is then removed. In the width direction Y, the dimensions of the punched second insulating film unit 20 and the metal foil film unit 40 having the first predetermined shape are no larger than the dimensions of the punched third insulating film unit 30 having the second predetermined shape. In the length direction X, the sizes of the second insulating film unit 20 and the metal foil film unit 30 having the first preset shape after punching are larger than the sizes of the third insulating film unit 30 having the second preset shape after punching, so that both ends of the conductive adhesive layer 42 of the metal foil film unit 50 having the first preset shape after punching are not covered by the third insulating unit 30 having the second preset shape after punching, so as to expose both ends of the conductive adhesive layer 42 of the metal foil film unit 40 having the first preset shape after punching. At the same time, the second insulating film unit 20 completely insulates and covers the first metal foil film 41 of the metal foil film unit 40, one end of the conductive adhesive layer 42 is adhered to the battery cell to be electroplated, and the other end is adhered to the conductive clip, thereby avoiding direct contact between other areas of the metal foil film unit 40 and the electroplating solution.

[0132] Figure 15 shows a specific example of a system for manufacturing the conductive tape shown in Figure 14, which is applicable to a conductive tape 92 including a first insulating film 10, a third insulating adhesive film, a metal foil film, and a second insulating film. In this example, the first insulating film 10 serves as the base of the conductive tape 92 and includes a first insulating layer 11 and a first insulating adhesive layer 12. The first insulating layer 11 is preferably an acrylic protective layer, and the first insulating adhesive layer 12 is preferably a single-layer silicone layer with low viscosity. The first insulating layer 11, the single-layer silicone layer (i.e., the first insulating adhesive layer 12), and the third insulating film are overlapped and compounded in a second compounding machine 60 to form a composite structure. The composite structure is composed of the first insulating layer 11, the first insulating adhesive layer 12, and the third insulating film from bottom to top. The third insulating layer 31 of the third insulating film is tightly attached to the first insulating adhesive layer 12.

[0133] The composite structure is passed into the cutting machine 70 along the guide device 63, and the tool 71 on the cutting machine 70 punches the third insulating film on the composite structure into a plurality of third insulating film units 30 having a second preset shape, that is, the third insulating layer 31 and the third insulating glue layer 32 of the third insulating film are punched into the second preset shape at the same time to form a plurality of third insulating film units 30.

[0134] The composite structure is fed along a guide 63 into a second laminating machine 60 in the feeding direction. The metal foil and the second insulating film are then laminated with the composite structure via a laminating unit 61. This new composite structure comprises, from bottom to top, the first insulating film 10, the third insulating film unit 30, the metal foil, and the second insulating film. The conductive adhesive layer 42 of the metal foil is tightly bonded to the third insulating adhesive layer 32 of the third insulating film unit 30, and the second insulating adhesive layer 22 of the second insulating film is tightly bonded to the first metal foil layer 41 of the metal foil. The new composite structure is passed along the guide device 62 into a second cutting machine 70 along the feeding direction. The cutter 71 on the cutting machine 70 punches the metal foil and the second insulating film on the new composite structure into a plurality of stacked metal foil units 40 and second insulating film units 20 having a first predetermined shape. That is, the first metal foil layer 41 and the conductive adhesive layer 42 of the metal foil, and the second insulating film 21 and the second insulating adhesive layer 22 of the second insulating film, are simultaneously punched into the first predetermined shape, forming a plurality of metal foil units 40 and a plurality of second insulating film units 20. The composite structure is passed along the guide device 63 into a third laminating machine 60 arranged along the feeding direction. The waste materials 91 of the metal foil and the second insulating film after punching are simultaneously or sequentially wound by the winder 622 above the third laminating machine 60. Another winder 622 below the laminating machine 60 winds up the composite structure, and the conductive tape 92 is thus manufactured.

[0135] As shown in FIG. 16 to FIG. 18 , in a further embodiment, the metal foil film needs to be pre-treated before being overlapped and laminated on the third insulating film unit 30 .

[0136] In the first example shown in FIG16 , the conductive adhesive layer 42 of the metal foil is punched out to remove a first predetermined portion, so that the metal foil overlaps and is laminated on the third insulating film unit 30 and then punched into a metal foil unit 40 of a second predetermined shape. In the longitudinal direction X, the first end of the punched conductive adhesive layer 42 is flush with the first end of the punched third insulating film unit 30, and the lower surface of the first end of the first metal foil layer 41 is exposed. The second end of the conductive adhesive layer 42 is not insulated and shielded by the third insulating film unit 30, thereby facilitating clamping with a conductive clip.

[0137] In the second example shown in FIG17 , in the length direction X, both ends of the punched conductive adhesive layer 42 are not insulated and shielded by the punched third insulating film unit 30, and a window is provided on one end of the conductive adhesive layer 42 to expose a portion of the lower surface of the first section of the first metal foil layer 41 for easy clamping by the conductive clip.

[0138] In a third example, as shown in FIG18 , a second metal foil layer 43 is laminated on the conductive adhesive layer 42 of the metal foil film. The second metal foil layer 43 is then punched out to remove a second predetermined portion. This allows the metal foil film to be laminated on the third insulating film unit 30 and punched into a metal foil unit 40 of the second predetermined shape. In the longitudinal direction X, both ends of the punched conductive adhesive layer 42 are not insulated or shielded by the punched third insulating film unit 30, and the second metal foil layer 43 on one end remains. In other words, the second metal foil layer 42 covers one end of the conductive adhesive layer 42, facilitating clamping by the conductive clip. Furthermore, the second metal foil layer 43 is located outside the third insulating film unit 30, thereby being relatively exposed.

[0139] Specifically, during the manufacturing process of the conductive tape 92 by the conductive tape manufacturing system, the metal foil roll 400 formed of the metal foil needs to be pre-processed in advance. In one example, the metal foil roll 400 is passed along the guide device 63 into the cutting machine 70. The cutting tool 71 on the cutting machine 70 punches out a predetermined portion of the conductive film layer 42 of the metal foil. The pre-processed metal foil is then rolled into the metal foil roll 400 and then passed into the laminating machine 60 for manufacturing according to any of the above manufacturing processes.

[0140] In another example, the metal foil film of the metal foil film roll 400 includes a first metal foil layer 41, a conductive adhesive layer 42 and a second metal foil layer 43 in sequence. The metal foil film roll 400 enters the cutting machine 70 along the guide device 63, and the tool 71 on the cutting machine 70 punches the second metal foil layer 43 of the metal foil film into a preset shape. The pre-treated metal foil film is then rolled up and placed into the compounding machine 60 for manufacturing according to any of the above manufacturing processes.

[0141] The above embodiments all cover the non-working area of ​​the punched metal foil membrane unit 40 . In other embodiments, as long as the non-working area of ​​the punched metal foil membrane unit 40 is covered, it falls within the protection scope of the present disclosure.

[0142] In one possible implementation of this embodiment, all involved film layers can be pre-treated, with a release film 90 disposed on each film layer. A single film layer is then pre-punched. The resulting pre-cut patterns and their arrangement positions can correspond one-to-one during lamination. The pre-treated film layers are then simultaneously laminated on the laminating unit 61. Release films 90 are removed sequentially before lamination, and waste materials 91 are removed sequentially after lamination. The composite structure is then cut using a roller cutter into multiple strips of conductive tape 92 of predetermined sizes.

[0143] In one possible implementation of this embodiment, the first insulating film 10, the second insulating film, the third insulating film and the metal foil film are all carried out in an atmosphere with a preset temperature and preset humidity created by a temperature and humidity control device, regardless of the manufacturing process before provision, the overlapping and compounding process, or one or two or more processes in the punching process, so as to facilitate changing the properties of the adhesive layer in the film layer through the preset atmosphere, and avoid the problem of residual adhesive left after the conductive tape 92 is pasted to the battery cell for electroplating.

[0144] The conductive tape 92 manufactured in any of the above embodiments is baked, i.e., heat-treated. The specific temperature of the heat treatment can be set according to actual needs and is not limited here. The various film layers can also be pre-heated in advance. The heat treatment can be performed after overlapping and laminating, after punching, or during one, two, or more of the above steps to enhance the change in the properties of the adhesive layer in the film layer and further fully avoid the problem of residual adhesive remaining after the conductive tape 92 is attached to the battery cell for electroplating.

[0145] The metal foil material in the metal foil membrane unit 40 includes any one of copper, aluminum, gold, silver, and nickel, or a combination of two or more thereof. Since copper has good electrical conductivity and low cost, copper foil is preferably used in this embodiment.

[0146] The above embodiment is only for illustrating the technical concept and features of the present disclosure and is a preferred embodiment. Its purpose is to enable people familiar with this technology to understand the content of the present disclosure and implement it accordingly, and it cannot be used to limit the scope of protection of the present disclosure.

Claims

1. A method for manufacturing a conductive tape, comprising: Step I—providing a first insulating film; Step II—providing a second film layer and a third film layer, wherein one of the second film layer and the third film layer comprises an insulating layer, and the other comprises a metal layer; Step III: Compounding the second film layer on the first insulating film, cutting the second film layer to form a plurality of second film units or the second film layer has a plurality of second film units formed by cutting in advance, and removing the second waste material after cutting; and Step IV: Compounding the third film layer on a plurality of the second film units, cutting the third film layer to form a plurality of third film units or the third film layer has a plurality of third film units formed by pre-cutting, and removing the third waste material after cutting; Wherein, each of the second membrane units corresponds to one of the plurality of third membrane units, and each of the second membrane units is covered with a corresponding third membrane unit.

2. The method for manufacturing a conductive tape according to claim 1, characterized in that: In step III, after the second film layer is composited on the first insulating film, the second film layer is punched to obtain a plurality of second film units.

3. The method for manufacturing a conductive tape according to claim 1, characterized in that: In step IV, after the third film layer is compounded on the second film layer, the third film layer is punched to obtain a plurality of the third film units.

4. The method for manufacturing a conductive tape according to claim 1, characterized in that: The third film layer includes the metal layer, and the third film unit includes a metal sheet formed by cutting the metal layer; the method further includes: Step V - providing an insulating fourth film layer, compounding the fourth film layer on a plurality of the third film units, cutting the fourth film layer to form a plurality of fourth film units or the fourth film layer having a plurality of pre-cut fourth film units, each of the fourth film units covering a portion or all of a third film unit.

5. The method for manufacturing a conductive tape according to claim 1, characterized in that: The third film layer includes the metal layer, and the third film unit includes a metal sheet formed by cutting the metal layer; in the step IV, an insulating fourth film layer is covered on the upper surface of the third film layer, and after being composited on the second film unit, the third film layer and the fourth film layer are cut to form a stack of multiple third film units and fourth film units, and the length of the stack is less than the length of the second film unit, so that part of the lower surface of the third film unit is shielded by the second film unit to allow the lower surface of at least one end of the third film unit to be exposed.

6. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: The third film layer includes the metal layer and a conductive adhesive film covering the metal layer. The method also includes a step of pretreating the third film layer. The pretreating step includes: locally cutting the conductive adhesive film to form a plurality of windows on the conductive adhesive film to expose the metal layer; wherein, after cutting in step IV, the window is located at the end of the third film unit formed by cutting.

7. The method for manufacturing a conductive tape according to any one of claims 1 to 3, characterized in that: The second film layer includes the metal layer and a conductive adhesive film covering the metal layer. The method also includes a step of pretreating the second film layer. The pretreating step includes: locally cutting the conductive adhesive film to form a plurality of windows on the conductive adhesive film to expose the metal layer; wherein, after cutting in step III, the window is located at the end of the second film unit formed by cutting.

8. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: The third film layer includes a first metal layer, a second metal layer and a conductive adhesive film located between the first metal layer and the second metal layer. The method also includes a step of pre-treating the third film layer, and the pre-treating step includes: locally cutting the second metal layer to form a plurality of second metal layer units; wherein, after cutting in step IV, the second metal layer unit is located on the end of the third film unit formed by cutting, and the second metal layer unit is located on the outside of the second film unit.

9. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: The metal layer comprises a metal foil, a conductive adhesive layer is coated on the surface of the metal foil, and the metal foil is adhered to the first insulating film or the second film layer through the conductive adhesive layer.

10. The method for manufacturing a conductive tape according to claim 9, characterized in that: The metal foil includes copper foil, aluminum foil, gold foil, silver foil or nickel foil.

11. The method for manufacturing a conductive tape according to any one of claims 1 to 3, characterized in that: The third film layer includes a metal layer, a portion of the lower surface of the third film unit is shielded by the second film unit, and a length of the third film unit is greater than a length of the second film unit so that the lower surface of at least one end of the metal layer is exposed.

12. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: The first insulating film includes a first insulating layer and a first insulating adhesive layer covering a surface of one side of the first insulating layer, and the first insulating layer is adhered to the second film layer through the first insulating adhesive layer.

13. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: The second film layer or the third film layer includes an insulating layer and an insulating adhesive layer covering the insulating layer, and the second film layer and the third film layer are adhered to each other via the insulating adhesive layer.

14. The method for manufacturing a conductive tape according to any one of claims 1 to 4, characterized in that: In the finished product of the conductive tape, the first insulating film is in the shape of a continuous strip, one or more rows of the second film units are arranged on the first insulating film, each row of the second film units includes a plurality of second film units arranged at intervals along the length direction of the first insulating film, each of the second film units is provided with a third film unit, and the third film unit covers all or part of the second film unit.

15. The method for manufacturing a conductive tape according to claim 14, characterized in that: The first insulating film, the second film layer or the third film layer is unwound from a film roll by an unwinder and then compounded by a compounding machine; the second film layer or the third film layer is covered with a release film, and the release film is peeled off and rolled up before compounding; the second waste material after cutting off a plurality of the second film units is rolled up by a winder; the third waste material after cutting off a plurality of the third film units is rolled up by a winder.

16. The method for manufacturing a conductive tape according to claim 1, characterized in that: In step III or IV, when the film layers are compounded, the temperature and / or humidity near the film layers are controlled to be within a preset range.

17. The method for manufacturing a conductive tape according to claim 1, characterized in that: The second film layer is pre-cut to form a plurality of second film units, and the second film units are connected to the waste material of the cut second film layer, and after being compounded onto the first insulating film, the waste material of the second film layer is separated from the second film units, and the waste material of the second film layer is removed; The third membrane layer is pre-cut to form a plurality of third membrane units, and the third membrane units are connected to the waste parts of the cut third membrane layer. After being compounded onto the second membrane layer, the waste parts of the third membrane layer are separated from the third membrane units, and the waste parts of the third membrane layer are removed.

18. A system for manufacturing a conductive tape, comprising: A first unwinder, which is used to install and unwind the first insulating film roll; Second unwinder; a third unwinder, wherein one of the second unwinder and the third unwinder is used to install and unwind the insulating film roll, and the other is used to install and unwind the film roll containing the metal layer; A laminating machine having a gap for allowing a plurality of films to pass through after being unwound, and the plurality of films are laminated with each other after passing through the gap; and The cutting machine comprises a cutting knife used for cutting at least one layer of the composite films into a preset pattern.

19. The system for manufacturing a conductive tape according to claim 18, characterized in that: The system further comprises: A finished tape reel, which is used to reel the tape after passing through the cutting machine; The waste winding machine is used to wind up the cut waste.

20. The system for manufacturing a conductive tape according to claim 18 or 19, characterized in that: The first unwinding machine, the second unwinding machine and the third unwinding machine are arranged on the compound machine; the compound machine comprises: a first compounding unit, which is used to compound the film unwound by the second unwinder onto the upper surface of the first insulating film unwound by the first unwinder; and A second compounding unit, which is used to compound the film unwound by the third unwinder onto the upper surface of the laminated film compounded by the first compounding unit; The cutting machine is located at the rear side of the second composite unit to cut the two layers of film on the first insulating film.

21. The system for manufacturing a conductive tape according to claim 18 or 19, characterized in that: The system also includes a fourth unwinder, the system includes a plurality of the compounding units and a plurality of the cutting units, the plurality of the compounding units and the plurality of the cutting units are arranged at intervals, and each of the compounding units is provided with one, two or three of the first to fourth unwinders; the system also includes a release film winder for winding up the release film separated from the film roll.

22. The system for manufacturing a conductive tape according to claim 18 or 19, characterized in that: The system further comprises a temperature and humidity control device, which is configured to control the temperature and / or humidity near the film layer within a preset range.

Images