Surface temperature test apparatus for alloy surface-mounted device

Abstract

The present application relates to the technical field of special-purpose thermometers. Disclosed is a surface temperature test apparatus for an alloy surface-mounted device. The surface temperature test apparatus comprises a body housing, and the interior of the body housing is divided into a storage part and a test part in sequence from top to bottom, wherein the storage part comprises a storage cavity, a storage hole is provided in a bottom surface of the storage cavity, the storage hole is in communication with the upper end of a storage pipeline, and an alloy surface-mounted device under test enters the storage pipeline through the storage hole; and the test part comprises a test assembly, an inlet and an outlet of the test assembly are both connected to the storage pipeline, and the alloy surface-mounted device which has been tested is discharged from the outlet of the test assembly through the storage pipeline. In the present application, a plurality of alloy surface-mounted devices can be placed in one step, and surface temperature testing is performed on each device in sequence in a continuous testing manner, such that the test process is continuous and does not require stopping or waiting, thereby shortening the time interval between two adjacent instances of testing and greatly improving the efficiency of testing.

Description

A surface temperature testing device for alloy patch devices Technical Field

[0001] The present application relates to the technical field of special-purpose thermometers, and in particular to a surface temperature testing device for alloy patch devices. Background Art

[0002] Alloy chip devices are components frequently used in circuit design and production. They integrate originally large discrete devices into a smaller volume in the form of an overall package, thus greatly improving the degree of circuit integration.

[0003] During production and use, alloy patch devices need to be tested for surface temperature. To achieve automated testing, various testing devices are available. For example, CN114414092A provides a surface temperature testing device for alloy patch devices. This patent achieves both qualitative and quantitative testing through the coordination of a housing, base, guide rods, upper and lower plates, and a PCB.

[0004] However, although the aforementioned patent can achieve automated testing, it can only test one alloy chip device at a time. After completing the test of one device, the tested device needs to be removed and replaced with the next device. This test device has the problem of low testing efficiency. Summary of the Invention

[0005] The embodiment of the present application provides a surface temperature testing device for an alloy patch device, which is used to solve the problem of low testing efficiency of the testing device in the prior art.

[0006] On the one hand, an embodiment of the present application provides a surface temperature testing device for an alloy patch device, comprising:

[0007] The main body shell is divided into a storage part and a test part from top to bottom, and the storage part and the test part are connected through a storage pipe;

[0008] The storage part includes a storage cavity, which is used to store the alloy patch device to be tested. A storage hole is provided on the bottom surface of the storage cavity. The storage hole is connected to the upper end of the storage pipe. The alloy patch device to be tested enters the storage pipe through the storage hole.

[0009] The test part includes a test assembly, the inlet and outlet of the test assembly are connected to the storage pipe, and a test seat is provided at the bottom of the test assembly. The test seat is used to perform surface temperature testing on the alloy patch device to be tested thereon. The alloy patch device after the test is discharged from the outlet of the test assembly through the storage pipe.

[0010] In one possible implementation, the main shell is provided with a storage portion below the testing portion. The storage portion includes a storage box. The storage box is directly opposite to the outlet of the storage pipe for discharging the alloy patch devices. The storage box is used to store the tested alloy patch devices discharged from the storage pipe.

[0011] In a possible implementation, the inner bottom of the main body shell has a storage cavity, and the storage box is arranged in the storage cavity.

[0012] In one possible implementation, a stirring chamber is provided on the bottom surface of the storage chamber, the storage hole is located on the bottom surface of the stirring chamber, and a stirring plate is rotatably provided in the stirring chamber. When the stirring plate rotates, it drives the alloy patch device in the stirring chamber to move, so that the alloy patch device enters the storage hole.

[0013] In a possible implementation, the bottom surface of the storage chamber is an inclined surface, and the stirring chamber is located at the lowest point of the storage chamber.

[0014] In a possible implementation, a rotating wheel is further provided on the storage pipe between the storage hole and the test assembly, and a storage slot is provided on the rotating wheel. Each rotation of the rotating wheel can deliver a predetermined number of alloy patch devices into the test assembly.

[0015] In one possible implementation, the test assembly includes a test baffle and a limit baffle. The test baffles are arranged relative to and in parallel to form a test space between the two test baffles. The test seat and the limit baffle are respectively arranged at the bottom and the exit of the test space. The limit baffle moves in the vertical direction. When the limit baffle is raised, the alloy patch device is blocked in the test space for surface temperature testing. When the limit baffle is lowered to the lowest position, the alloy patch device slides out of the test space.

[0016] In a possible implementation, the bottom surface of the test baffle and the top surface of the test seat are both inclined, and the outlet of the test space is located at the bottom end of the top surface of the test seat.

[0017] In one possible implementation, the test seat is connected to an air pipe connected to an air source. After the alloy patch device completes the test, the air source sprays air to blow the alloy patch device away from the test seat and slide it out from the exit of the test space.

[0018] In one possible implementation, a horizontally movable pressing plate is provided above the test baffle. When the alloy patch device enters the test space, the pressing plate moves above the alloy patch device to press the alloy patch device onto the test seat.

[0019] The surface temperature testing device of an alloy patch device in this application has the following advantages:

[0020] Multiple alloy chip devices can be placed at one time, and the surface temperature of each device can be tested in sequence using a continuous test method. The test process is continuous and does not require stopping or waiting, which shortens the time interval between two adjacent tests and greatly improves the efficiency of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] FIG1 is a schematic diagram of the overall structure of an alloy patch device surface temperature testing device provided in an embodiment of the present application;

[0023] FIG2 is a schematic diagram of the structure of a storage part provided in an embodiment of the present application;

[0024] FIG3 is a schematic structural diagram of a stirring assembly provided in an embodiment of the present application;

[0025] FIG4 is a schematic diagram of the structure of a quantity control component provided in an embodiment of the present application;

[0026] FIG5 is a schematic diagram of a test assembly provided in an embodiment of the present application in a test state viewed from the side;

[0027] FIG6 is a schematic diagram of a test assembly provided in an embodiment of the present application in an open state as viewed from the side;

[0028] FIG7 is a schematic diagram of a test assembly provided in an embodiment of the present application in an open state in a front view direction;

[0029] FIG8 is a schematic diagram of a test assembly provided in an embodiment of the present application in a test state in a front view direction;

[0030] FIG9 is a schematic structural diagram of the storage portion provided in an embodiment of the present application.

[0031] Explanation of the accompanying reference numerals: 100, main body shell; 101, storage cavity; 110, top cover; 120, storage box; 200, storage cavity; 210, stirring cavity; 220, storage hole; 230, stirring plate; 240, storage pipe; 250, rotating wheel; 251, storage slot; 300, test baffle; 310, test seat; 320, test signal line; 330, air pipe; 340, limit baffle; 350, pressure plate; 360, top baffle. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] Figures 1-9 are schematic diagrams of the structure of an alloy patch device surface temperature testing device provided in an embodiment of the present application. The present application provides an alloy patch device surface temperature testing device, comprising:

[0034] The main body shell 100 is divided into a storage part and a test part from top to bottom, and the storage part and the test part are connected through a storage pipe 240;

[0035] The storage portion includes a storage cavity 200 for storing the alloy patch devices to be tested. A storage hole 220 is provided on the bottom surface of the storage cavity 200. The storage hole 220 is connected to the upper end of the storage pipe 240. The alloy patch devices to be tested enter the storage pipe 240 through the storage hole 220.

[0036] The test part includes a test assembly, the inlet and outlet of the test assembly are connected to the storage pipe 240, and a test seat 310 is provided at the bottom of the test assembly. The test seat 310 is used to perform surface temperature testing on the alloy patch device to be tested thereon. The alloy patch device after the test is discharged from the outlet of the test assembly through the storage pipe 240.

[0037] For example, the alloy chip device to be tested can be an unmounted device, such as a single chip resistor, chip capacitor, etc., or a device that has been mounted on a small PCB. Regardless of the state of the alloy chip device that needs to be tested, the storage hole 220 and the storage pipe 240 need to be set to a shape and size corresponding to the size of the alloy chip device in its current state, so that the alloy chip device can pass through the storage hole 220 normally and enter the storage pipe 240, and then smoothly carry out the surface temperature test.

[0038] In the embodiment of the present application, a top cover 110 is further provided on the top of the main body shell 100, and the top cover 110 is hingedly connected to the main body shell 100. When the top cover 110 is closed, it forms a closed space with the storage cavity 200 to prevent the multiple alloy chip devices placed in the storage cavity 200 from accidentally falling out.

[0039] Furthermore, in order to improve the stability of the connection between the top cover 110 and the main shell 100, a connection structure can be set at the corresponding positions of the top cover 110 and the main shell 100, for example, a magnetic buckle, a mechanical snap-fit ​​structure, etc. can be selected.

[0040] The alloy patch device that enters the storage pipe 240 through the storage hole 220 will continue to move in the inclined storage pipe 240 until it falls into the test assembly from the entrance. In this application, the test socket 310 is also tilted in the same direction as the storage pipe 240, so that the tested alloy patch device can be discharged from the outlet of the test assembly and continue to enter the lower storage pipe 240, and finally discharged outside the test device.

[0041] The test socket 310 in this application is internally provided with a temperature probe, and the top of the temperature probe is flush with the top surface of the test socket 310 to ensure that it can contact the alloy patch device. Each temperature probe transmits a temperature signal through a test signal line 320. After the transmitted temperature signal is filtered, amplified, and analog-to-digital converted, it will be converted by the processing unit into a corresponding temperature value. The temperature value can be displayed on the display unit provided on the main body shell 100, or it can be stored. When a batch of alloy patch devices is tested, the processing unit can also generate a temperature test report. The temperature test report can record detailed data such as the number of alloy patch devices in the batch and the distribution of surface temperature.

[0042] In a possible embodiment, the main body shell 100 is provided with a storage portion below the testing portion. The storage portion includes a storage box 120. The storage box 120 is directly opposite to the outlet of the storage pipe 240 for discharging the alloy patch devices. The storage box 120 is used to store the tested alloy patch devices discharged from the storage pipe 240.

[0043] For example, the outlet of the storage pipe 240 can be set on the outer surface of the main shell 100, so that when the tested alloy patch devices are discharged from the storage pipe 240, they can be caught by the storage box 120 to prevent the alloy patch devices from scattering.

[0044] In the embodiment of the present application, the inner bottom of the main body shell 100 has a storage cavity 101, and the storage box 120 is disposed in the storage cavity 101. When the storage box 120 is stored in the storage cavity 101, the main body shell 100 will remain a whole, greatly improving the aesthetics of the test device.

[0045] It should be understood that in order to facilitate the removal of the storage box 120 from the storage cavity 101, a handle can be provided on the outer side of the storage box 120. In addition, a flexible buffer layer can be provided on the inner surface of the storage box 120 to reduce the impact between the alloy patch device and the storage box 120 to avoid damage to the alloy patch device.

[0046] In a possible embodiment, a stirring chamber 210 is provided on the bottom surface of the storage chamber 200, and the storage hole 220 is located on the bottom surface of the stirring chamber 210. A stirring plate 230 is rotatably provided in the stirring chamber 210. After the stirring plate 230 rotates, it drives the alloy patch device in the stirring chamber 210 to move, so that the alloy patch device enters the storage hole 220.

[0047] Exemplarily, the stirring chamber 210 and the stirring plate 230 are collectively referred to as a stirring assembly. When multiple alloy patch devices are stacked inside the storage cavity 200, they will be unable to align with the storage hole 220 due to mutual restrictions between the alloy patch devices, thereby preventing the alloy patch devices from falling into the storage hole 220. In order to prevent this from happening, the present application uses a driving unit such as a rotating motor to drive the stirring plate 230 to continuously rotate at different speeds, so that the alloy patch devices are always in an active state. Even if no alloy patch device falls into the storage hole 220 at a certain moment, the state of each alloy patch device will change during the activity process. In this way, the probability of the alloy patch device falling into the storage hole 220 can be greatly increased.

[0048] In an embodiment of the present application, the storage hole 220 can also be set as a funnel structure, with a circular opening at the upper end so that the alloy patch device in any state can enter, and the lower end of the storage hole 220 gradually changes into a shape that matches the storage pipe 240. The alloy patch device continuously adjusts its direction and posture during the falling process, and finally reaches a state consistent with the storage pipe 240.

[0049] Furthermore, the bottom surface of the storage chamber 200 is an inclined surface, and the stirring chamber 210 is located at the lowest point of the storage chamber 200 .

[0050] In a possible embodiment, a rotating wheel 250 is further provided on the storage pipe 240 between the storage hole 220 and the test assembly. The rotating wheel 250 is provided with a storage slot 251. Each rotation of the rotating wheel 250 can deliver a predetermined number of alloy patch devices into the test assembly.

[0051] For example, since the test socket 310 can only complete the test of a predetermined number of alloy patch devices at a time, and there may be many alloy patch devices entering the storage pipe 240 through the storage hole 220, the present application uses a quantity control component including a rotating wheel 250 to control the number of alloy patch devices entering the test component at one time, ensuring that the test component can normally perform the test work on each alloy patch device.

[0052] In the embodiment of the present application, storage slots 251 are provided on the outer surface of rotating wheel 250. Their shape and size are compatible with a single alloy patch device, so that only one alloy patch device can be placed in storage slot 251. Rotating wheel 250 is controlled by a drive unit, such as a stepper motor, to rotate by a predetermined angle, so that after each rotation, a storage slot 251 is directly opposite storage pipe 240.

[0053] In a possible embodiment, the test assembly includes a test baffle 300 and a limit baffle 340. The test baffles 300 are arranged relative to and in parallel. A test space is formed between the two test baffles 300. The test seat 310 and the limit baffle 340 are respectively arranged at the bottom and the exit of the test space. The limit baffle 340 moves in the vertical direction. When the limit baffle 340 is raised, the alloy patch device is blocked in the test space for surface temperature testing. When the limit baffle 340 is lowered to the lowest position, the alloy patch device slides out of the test space.

[0054] For example, the top surface shape of the test socket 310 matches the surface of the alloy patch device, so when the alloy patch device falls on the test socket 310, it can be in close contact with the test socket 310, thereby enabling the temperature probe in the test socket 310 to perform surface temperature testing on the alloy patch device.

[0055] The limit baffle 340 can be driven by a telescopic device such as an electric telescopic rod or a linear motor so that when it drops to the lowest height, it is flush with the top surface of the test socket 310, ensuring that the alloy patch device can slide smoothly over the limit baffle 340 and enter the next section of the storage pipe 240.

[0056] In an embodiment of the present application, the bottom surface of the test baffle 300 and the top surface of the test seat 310 are both inclined, and the exit of the test space is located at the bottom end of the top surface of the test seat 310. After adopting this inclined setting method, the angle of the test assembly as a whole is equivalent to the angle of the storage pipe 240 in the current area. Therefore, after the alloy patch device slides into the inclined storage pipe 240 and enters the test seat 310, it will continue to maintain an inclined state and cannot continue to slide down due to the obstruction of the limit baffle 340. When the test is completed and the limit baffle 340 is retracted, the alloy patch device in the inclined state can continue to slide on the test seat 310 and enter the storage pipe 240.

[0057] Furthermore, the test socket 310 is connected to an air pipe 330 , which is connected to an air source. After the alloy patch device completes the test, the air source sprays air to blow the alloy patch device away from the test socket 310 and slide it out from the exit of the test space.

[0058] The outlet end of the air pipe 330 passes through the top surface of the test socket 310 and remains flush. After the test is completed, the static friction between the alloy patch device and the test socket 310 may prevent the alloy patch device from sliding further. Therefore, this application uses a periodic air source to blow air into the alloy patch device, temporarily separating the alloy patch device from the test socket 310. When the alloy patch device falls again, it can slide downward under the action of gravity.

[0059] In a possible embodiment, a horizontally movable pressure plate 350 is provided above the test baffle 300 . When the alloy patch device enters the test space, the pressure plate 350 moves above the alloy patch device to press the alloy patch device onto the test socket 310 .

[0060] For example, in order to ensure that the pressure plate 350 moves in a predetermined direction, the present application also provides a top baffle 360 ​​above the test baffle 300. There is a gap between the top baffle 360 ​​and the test baffle 300. The pressure plate 350 can be extended from the gap under the drive of a telescopic device such as an electric telescopic rod or a linear motor, and then move to the top of the alloy patch device, and apply downward pressure to the alloy patch device to press the alloy patch device tightly on the test socket 310, thereby improving the contact tightness between the alloy patch device and the test socket 310.

[0061] In an embodiment of the present application, the bottom surface of the pressure plate 350 is a slope. During the extension process, the smaller end extends first, and the slope at its bottom gradually contacts the top edge of the alloy patch device. As the pressure plate 350 continues to extend, the distance between its bottom surface and the alloy patch device gradually becomes smaller, thereby applying an increasingly greater downward pressure on the alloy patch device.

[0062] It should be understood that the sloped bottom surface of the pressure plate 350 is designed to ensure that it can apply sufficient downward pressure to the alloy chip device without damaging it. Furthermore, two pressure plates 350 are required, extending from above the two test baffles 300 to simultaneously apply the same downward pressure to the opposite ends of the alloy chip device.

[0063] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0064] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A surface temperature testing device for alloy patch devices, characterized in that: include: A main body shell (100), wherein the interior of the main body shell (100) is divided into a storage part and a test part from top to bottom, and the storage part and the test part are connected via a storage pipe (240); The storage part comprises a storage cavity (200), the storage cavity (200) is used to store the alloy patch device to be tested, a storage hole (220) is provided on the bottom surface of the storage cavity (200), the storage hole (220) is communicated with the upper end of the storage pipe (240), and the alloy patch device to be tested enters the storage pipe (240) through the storage hole (220); The test part comprises a test assembly, the inlet and outlet of the test assembly are both connected to the storage pipe (240), a test seat (310) is arranged at the bottom of the test assembly, and the test seat (310) is used to perform a surface temperature test on the alloy patch device to be tested thereon, and the tested alloy patch device is discharged from the outlet of the test assembly through the storage pipe (240).

2. The surface temperature testing device of an alloy patch device according to claim 1, characterized in that: The main body shell (100) further comprises a storage portion located below the testing portion, wherein the storage portion comprises a storage box (120). The storage box (120) is directly opposite to the outlet of the storage pipe (240) for discharging alloy patch devices, and the storage box (120) is used to store the tested alloy patch devices discharged from the storage pipe (240).

3. The surface temperature testing device of an alloy patch device according to claim 2, characterized in that: The inner bottom of the main body shell (100) has a storage cavity (101), and the storage box (120) is arranged in the storage cavity (101).

4. The surface temperature testing device of an alloy patch device according to claim 1, characterized in that: A stirring chamber (210) is arranged on the bottom surface of the storage chamber (200), the storage hole (220) is located on the bottom surface of the stirring chamber (210), a stirring plate (230) is rotatably arranged in the stirring chamber (210), and the stirring plate (230) drives the alloy patch device in the stirring chamber (210) to move after rotating, so that the alloy patch device enters the storage hole (220).

5. The surface temperature testing device of an alloy patch device according to claim 2, characterized in that: The bottom surface of the storage chamber (200) is an inclined surface, and the stirring chamber (210) is located at the lowest point of the storage chamber (200).

6. The surface temperature testing device of an alloy patch device according to claim 1, characterized in that: A rotating wheel (250) is also provided on the storage pipe (240) between the storage hole (220) and the test assembly, and a storage slot (251) is provided on the rotating wheel (250). Each time the rotating wheel (250) rotates, a predetermined number of alloy patch devices can be delivered into the test assembly.

7. The surface temperature testing device of an alloy patch device according to claim 1, characterized in that: The test assembly comprises a test baffle (300) and a limit baffle (340), the test baffles (300) are arranged opposite to each other and in parallel, a test space is formed between the two test baffles (300), the test seat (310) and the limit baffle (340) are arranged at the bottom and the exit of the test space respectively, the limit baffle (340) moves in a vertical direction, when the limit baffle (340) is raised, the alloy patch device is blocked in the test space to perform a surface temperature test, and when the limit baffle (340) is lowered to the lowest position, the alloy patch device slides out of the test space.

8. The surface temperature testing device of an alloy patch device according to claim 7, characterized in that: The bottom surface of the test baffle (300) and the top surface of the test seat (310) are both arranged to be inclined, and the outlet of the test space is located at the bottom end of the top surface of the test seat (310).

9. The surface temperature testing device of an alloy patch device according to claim 8, characterized in that: The test seat (310) is connected to an air pipe (330), and the air pipe (330) is connected to an air source. After the alloy patch device completes the test, the air source sprays air to blow the alloy patch device away from the test seat (310) and slide it out from the outlet of the test space.

10. The surface temperature testing device of an alloy patch device according to claim 7, characterized in that: A horizontally movable pressing plate (350) is arranged above the test baffle (300); when the alloy patch device enters the test space, the pressing plate (350) moves to above the alloy patch device to press the alloy patch device onto the test seat (310).

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