Magnetron forming method, magnetron, and magnetron sputtering device

Abstract

Disclosed in the present application are a magnetron forming method, a magnetron, and a magnetron sputtering device. The forming method comprises: on the basis of the arrangement of magnetic poles of a magnetron, obtaining the horizontal magnetic field intensity of the magnetron at each point on a magnetic field arc at any radius of a surface of a target; obtaining an erosion probability at any radius of the surface of the target on the basis of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius of the surface of the target and a relationship between the horizontal magnetic field intensity and the erosion probability of the target; and determining the arrangement of the magnetic poles of the magnetron on the basis of erosion probabilities at a plurality of radii of the surface of the target. Therefore, it is not necessary to use the target to conduct magnetron sputtering experiments to obtain erosion data of the surface of the target, thereby reducing the design costs of the magnetron and shortening the design cycle of the magnetron.

Description

Method for forming a magnetron, magnetron, and magnetron sputtering equipment Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a method for forming a magnetron, a magnetron, and a magnetron sputtering device. Background Art

[0002] Magnetron sputtering is a type of physical vapor deposition (PVD) that generates a plasma consisting of positive ions and new electrons by colliding electrons with a process gas (such as argon). The positive ions in the plasma collide with the target material, sputtering the material in the target and depositing it into a thin film.

[0003] To increase the sputtering rate, a magnetron is usually installed on the back of the target material in magnetron sputtering equipment. The magnetic field generated by the magnetron extends the trajectory of electrons, thereby increasing the collision probability between electrons and process gases and improving the plasma density. However, because the plasma density at the target surface where the magnetic field is dense is higher than that at other locations on the target, and the corrosion probability at locations with high plasma density is greater than that at other locations, the corrosion probability at the target surface where the magnetic field is dense is greater than that at other locations on the target, resulting in lower material utilization at other locations on the target.

[0004] While it's possible to improve target utilization by designing a magnetron with a specific magnetic pole distribution pattern, the design process requires obtaining target corrosion data based on magnetron sputtering experimental data to determine whether the magnetron design meets the requirements. However, the high cost of target materials, especially precious metal targets, and the lengthy magnetron sputtering experiments lead to high magnetron design costs and a long design cycle. Summary of the Invention

[0005] The present application discloses a method for forming a magnetron, a magnetron, and a magnetron sputtering device, so as to reduce the design cost and design cycle of the magnetron.

[0006] In a first aspect, the present application discloses a method for forming a magnetron, comprising: obtaining the horizontal magnetic field strength of each point on the magnetic field arc of the magnetron at any radius on the target surface based on the magnetic pole arrangement of the magnetron; obtaining the corrosion probability at any radius on the target surface based on the horizontal magnetic field strength of each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability; and determining the magnetic pole arrangement of the magnetron based on the corrosion probabilities at multiple radii on the target surface.

[0007] In some embodiments, obtaining the corrosion probability at any radius of the target surface based on the horizontal magnetic field strength at each point on the magnetic field arc at any radius of the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability includes: obtaining the radial corrosion probability at any radius of the target surface based on the radial component of the horizontal magnetic field strength at each point on the magnetic field arc at any radius of the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability in a static state of the magnetron; obtaining the tangential corrosion probability at any radius of the target surface based on the tangential component of the horizontal magnetic field strength at each point on the magnetic field arc at any radius of the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability in a rotating state of the magnetron; obtaining the corrosion probability at any radius of the target surface based on the radial corrosion probability and the tangential corrosion probability at any radius of the target surface, the corrosion probability at any radius of the target surface being equal to the sum of the radial corrosion probability and the tangential corrosion probability at the radius.

[0008] In some embodiments, obtaining the radial corrosion probability at any radius on the target surface according to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability in a static state of the magnetron includes:

[0009] According to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship E radial (r)=∑B xyr (L Arc (r)) / Max(∑B xyr (L Arc (r))), obtain the radial corrosion probability at any radius of the target surface; wherein r represents any radius of the target surface, B xyr (L Arc (r)) represents the radial component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑B xyr (L Arc (r)) represents the sum of the radial components of the horizontal magnetic field strength at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyr (L Arc (r))) represents the maximum value of the sum of the radial components of the horizontal magnetic field intensity at each point on the magnetic field arc at each radius on the target surface, E radial (r) represents the radial corrosion probability at any radius on the target surface.

[0010] In some embodiments, obtaining the tangential erosion probability at any radius on the target surface according to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target erosion probability in a magnetron rotating state includes:

[0011] According to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship Obtaining the tangential corrosion probability at any radius on the target surface;

[0012] Wherein, r represents any radius of the target surface, B xyv (L Arc (r)) represents the tangential component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑B xyv (L Arc (r)) represents the sum of the tangential components of the horizontal magnetic field strength at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyv (L Arc (r))) represents the maximum value of the sum of the tangential components of the horizontal magnetic field intensity at each point on the magnetic field arc at each radius on the target surface, E vertical (r) represents the probability of tangential corrosion at any radius on the target surface.

[0013] In some embodiments, determining the magnetic pole arrangement of the magnetron based on the corrosion probabilities at multiple radii on the target surface includes: obtaining the utilization rate of the target material based on the corrosion probabilities at multiple radii on the target surface; and adjusting the magnetic pole arrangement of the magnetron if the utilization rate of the target material is less than the target utilization rate.

[0014] In some embodiments, obtaining the utilization rate of the target material based on the corrosion probabilities at multiple radii on the target material surface includes: obtaining a corrosion probability curve or a corrosion area ratio on the target material surface based on the corrosion probabilities at multiple radii on the target material surface; obtaining the utilization rate of the target material based on the corrosion probability curve or the corrosion area ratio on the target material surface.

[0015] In some embodiments, it also includes: if the utilization rate of the target material is greater than or equal to the target utilization rate, obtaining the uniformity of the thin film formed by the magnetron sputtering equipment having the magnetron; if the uniformity of the thin film is less than the target uniformity, fine-tuning the magnetic pole arrangement of the magnetron.

[0016] In some embodiments, the adjusting of the magnetic pole arrangement of the magnetron includes: adjusting the magnetic pole arrangement at the corresponding radius according to the maximum corrosion probability or the minimum corrosion probability among the corrosion probabilities at multiple radii on the target surface; and / or adjusting at least one of the number of magnetic poles, the number of spirals in the arrangement pattern, and the change in spiral curvature of the magnetron.

[0017] In a second aspect, the present application discloses a magnetron, which is formed by any of the above forming methods.

[0018] In a third aspect, the present application discloses a magnetron sputtering device, comprising the magnetron as described in any one of the above items.

[0019] The magnetron formation method, magnetron and magnetron sputtering equipment disclosed in the present application obtain the horizontal magnetic field strength of each point on the magnetic field arc of the magnetron at any radius on the target surface based on the magnetic pole arrangement of the magnetron. The corrosion probability at any radius on the target surface is obtained based on the horizontal magnetic field strength of each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability. The magnetic pole arrangement of the magnetron is determined based on the corrosion probabilities at multiple radii on the target surface. Therefore, there is no need to use the target material to conduct magnetron sputtering experiments to obtain corrosion data on the target surface, thereby reducing the design cost of the magnetron and shortening the design cycle of the magnetron. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0021] FIG1 is a schematic structural diagram of a magnetron sputtering device disclosed in an embodiment of the present application.

[0022] FIG2 is a flow chart of a method for forming a magnetron disclosed in an embodiment of the present application.

[0023] FIG3 is a schematic diagram of the horizontal magnetic field intensity distribution of the magnetron disclosed in an embodiment of the present application at various points on the target surface.

[0024] FIG4 is a schematic diagram of the horizontal magnetic field intensity distribution of each point on each magnetic field arc on the target surface of the magnetron disclosed in some other embodiments of the present application.

[0025] FIG5 is a schematic diagram showing the distribution of various magnetic field arcs on the surface of a target material disclosed in an embodiment of the present application.

[0026] FIG6 is a schematic diagram of control disclosed in some other embodiments of the present application.

[0027] FIG7 is a schematic diagram showing the radial component distribution of the horizontal magnetic field intensity at each point on a magnetic field arc at multiple radii on a target surface disclosed in an embodiment of the present application.

[0028] FIG8 is a schematic diagram showing the distribution of the tangential component of the horizontal magnetic field intensity at each point on a magnetic field arc at multiple radii on a target surface disclosed in an embodiment of the present application.

[0029] FIG9 is a schematic diagram of a curve showing radial corrosion probability varying with radius disclosed in an embodiment of the present application.

[0030] FIG10 is a schematic diagram of a curve showing the variation of tangential corrosion probability with radius disclosed in an embodiment of the present application.

[0031] FIG11 is a schematic diagram of a curve showing a corrosion probability varying with radius disclosed in an embodiment of the present application and a curve showing an actual corrosion probability varying with radius.

[0032] FIG12 is a schematic diagram showing the relationship between the horizontal magnetic field intensity and the radial component and the tangential component at each point on each magnetic field arc line on the surface of a target material disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] As shown in Figure 1, the magnetron sputtering equipment includes a sputtering chamber 1, which includes: a chamber body 2, a process component 3, and a cathode sputtering system 4. The chamber body 2 includes a process gas interface 8, a chamber wall 9, a base 11, and a vacuum system 12. The process gas interface 8 is used to introduce process gas (such as argon) into the chamber. The base 11 is used to support the wafer 10 and other workpieces to be processed. The vacuum system 12 is used to evacuate the chamber to a vacuum state. The process component 3 includes a lower liner 13, a deposition ring 14, a cover ring 15, and an upper liner 16. The process component 3 can be arranged around the chamber body 2 to shield the side walls of the chamber body 2 and ensure that the side walls of the chamber body 2 are not contaminated. The cathode sputtering system 4 includes a magnetron 5, a target 6, and a DC power supply 7.

[0035] Before the magnetron sputtering process begins, a workpiece, such as a wafer 10, is placed on a susceptor 11. The chamber is then evacuated to a vacuum state by a vacuum system 12. Once the chamber reaches a specified vacuum level, a certain amount of argon gas is introduced through the process gas port 8 as the process gas. A negative bias voltage is applied to the target 6 via a DC power supply 7, ionizing the argon gas in the chamber. The magnetic field generated by the magnetron 5 binds electrons, forming a stable plasma 17 in the dense area of ​​the magnetic field 18 on the surface of the target 6. Under the influence of the electric field, the argon ions in the plasma 17 continuously bombard the surface of the target 6, causing atoms from the target 6 to be sputtered and deposited on the surface of the workpiece, such as the wafer 10, to form a coating.

[0036] Currently, magnetron 5 is typically controlled to rotate during magnetron sputtering equipment operation to improve the uniformity of target erosion and target utilization by increasing the uniformity of the magnetic field generated by magnetron 5. However, the uniformity of target erosion and utilization still needs to be further improved. Although it is possible to improve target erosion uniformity and target utilization by designing a magnetron with a specific magnetic pole distribution pattern, the magnetron design process requires obtaining target erosion data based on magnetron sputtering experiments to determine whether the magnetron design meets the requirements. This results in high magnetron design costs and a long design cycle.

[0037] The study found that electrons are mainly confined in the magnetron track near the target surface by the horizontal magnetic field of the magnetron, resulting in the plasma concentration in the corresponding area between the target surface and the magnetron track being much higher than the plasma concentration in other areas of the target surface, resulting in the corrosion probability in the corresponding area between the target surface and the magnetron track being much higher than the corrosion probability in other areas of the target surface. Therefore, it can be determined that the plasma distribution is similar to the horizontal magnetic field distribution, and the relationship between the horizontal magnetic field intensity and the corrosion probability is obtained based on the relationship between the plasma density and the corrosion probability, and then the corrosion probability of the target surface is obtained based on the relationship between the horizontal magnetic field intensity and the corrosion probability.

[0038] Based on this, the present application discloses a method for forming a magnetron, by obtaining the horizontal magnetic field strength of each point on the magnetic field arc of the magnetron at any radius on the target surface, and obtaining the corrosion probability at any radius on the target surface based on the horizontal magnetic field strength of each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field strength and the target corrosion probability. Therefore, there is no need to use the target material to conduct a magnetron sputtering experiment to obtain the corrosion data of the target surface, thereby reducing the design cost of the magnetron and shortening the design cycle of the magnetron.

[0039] It should be noted that the horizontal magnetic field intensity at each point on the magnetic field arc of the magnetron at any radius on the target surface can be obtained by simulating the magnetron or by other methods, and this application does not limit this. In addition, the relationship between the horizontal magnetic field intensity and the target corrosion probability can be a functional relationship or other relationship, and this application also does not limit this.

[0040] The following describes a method for forming a magnetron disclosed in an embodiment of the present application by taking a simulation of a magnetron as an example. As shown in FIG2 , the method includes:

[0041] S101: According to the magnetic pole arrangement of the magnetron, the horizontal magnetic field intensity of each point of the magnetic field arc of the magnetron at any radius on the target surface is obtained by simulation.

[0042] In an embodiment of the present application, a simulation model of the magnetron is established to simulate the horizontal magnetic field strength at each point on the magnetic field arc of the magnetron at multiple radii on the target surface, so as to obtain the corrosion probability at multiple radii on the target surface based on the functional relationship between the horizontal magnetic field strength and the target corrosion probability.

[0043] In some embodiments of the present application, a simulation model is established based on the initially designed magnetic pole arrangement of the magnetron, and based on the DC magnetron sputtering principle and the simulation model, the horizontal magnetic field strength at each point on the magnetic field arc of the magnetron at any radius on the target surface is simulated and obtained.

[0044] In some embodiments, based on the DC magnetron sputtering principle and simulation model, the horizontal magnetic field intensities B10~B1n of the magnetron at each point on the target surface as shown in Figure 3 can be simulated and then, based on the horizontal magnetic field intensities B10~B1n of the magnetron at each point on the target surface, the horizontal magnetic field intensities B20~B2n of each point on the magnetic field arc of the magnetron at any radius on the target surface can be obtained, that is, the horizontal magnetic field intensity dot matrix B20~B2n of the magnetic field arc of the magnetron at each radius on the target surface is obtained.

[0045] Of course, the present application is not limited to this. In other embodiments, based on the DC magnetron sputtering principle and simulation model, the horizontal magnetic field intensities B20 to B2n at each point on the magnetic field arc of the magnetron at any radius on the target surface as shown in FIG4 can be directly simulated to obtain, that is, the horizontal magnetic field intensity dot matrix B20 to B2n of the magnetic field arc of the magnetron at each radius on the target surface can be obtained. Where n is an integer greater than 2.

[0046] As shown in Figure 5 , the multiple radii on the surface of target 6 are circular locations at different distances from the target center O. The magnetic field arc at any radius is the overlap line between the circular location at that radius and the horizontal magnetic field intensity distribution diagram. Each point on the magnetic field arc is obtained by dividing the magnetic field arc into equal arc intervals or equal angular intervals.

[0047] It should be noted that the embodiments shown in Figures 3 to 5 are described using a circular target and a cardioid horizontal magnetic field intensity distribution diagram of the magnetron on the target surface. Of course, the present application is not limited thereto. In other embodiments, the horizontal magnetic field intensity distribution diagram may also be the magnetic field distribution diagram of a spiral magnetron as shown in Figure 6. The magnetic field intensity distribution diagram is determined by the magnetic pole distribution diagram, and the magnetic field intensity distribution diagram may be the same as the magnetic pole distribution diagram.

[0048] S102: Obtain the corrosion probability at any radius on the target surface according to the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship between the horizontal magnetic field intensity and the target corrosion probability.

[0049] It can be understood that because the plasma density distribution is mainly determined by the horizontal magnetic field intensity distribution, the plasma density distribution diagram is similar to the horizontal magnetic field intensity distribution diagram. According to the horizontal magnetic field intensity of each point on the magnetic field arc at each radius on the horizontal magnetic field intensity distribution diagram and the functional relationship between the horizontal magnetic field intensity and the target material corrosion probability, the corrosion probability at each radius on the target material surface can be obtained.

[0050] In some embodiments of the present application, if the magnetron is always in a stationary state during the operation of the magnetron sputtering equipment, the corrosion probability of the target material surface can be obtained based on the correspondence between the horizontal magnetic field strength of the magnetron in the stationary state and the corrosion probability of the target material; if the magnetron is always in a rotating state during the operation of the magnetron sputtering equipment, the corrosion probability of the target material surface can be obtained based on the correspondence between the horizontal magnetic field strength of the magnetron in the rotating state and the corrosion probability of the target material.

[0051] However, the inventors have found that although the magnetron is always in a rotating state during the operation of the magnetron sputtering equipment, the radial component of the horizontal magnetic field is independent of the angular velocity, and the tangential component of the horizontal magnetic field is positively correlated with the angular velocity. If the corrosion probability of the target surface is obtained only based on the correspondence between the horizontal magnetic field intensity in the rotating state of the magnetron and the target corrosion probability, the accuracy of the corrosion probability will be low.

[0052] Based on this, in order to improve the accuracy of the corrosion probability, the functional relationship between the horizontal magnetic field intensity of the magnetron in the static state and the target material corrosion probability can be considered as the functional relationship between the radial component of the horizontal magnetic field intensity and the target material corrosion probability, and the radial corrosion probability of the target material surface can be obtained accordingly. The corresponding relationship between the horizontal magnetic field intensity of the magnetron in the rotating state and the target material corrosion probability can be considered as the corresponding relationship between the tangential component of the horizontal magnetic field intensity and the target material corrosion probability, and the tangential corrosion probability of the target material surface can be obtained accordingly. Then, the corrosion probability of the target material surface can be obtained according to the radial corrosion probability and the tangential corrosion probability of the target material surface.

[0053] It should be noted that the horizontal magnetic field can be divided into radial and tangential magnetic fields based on the magnetron's rotation direction. As shown in Figure 12, the radial component of the horizontal magnetic field intensity is equal to the product of the horizontal magnetic field intensity and cosθ, and the tangential component of the horizontal magnetic field intensity is equal to the product of the horizontal magnetic field intensity and sinθ, where θ represents the angle between the horizontal magnetic field direction and the radial direction. The radial component of the horizontal magnetic field intensity at each point on the magnetron's magnetic field arc at any radius on the target surface is shown in Figure 7, and the tangential component of the horizontal magnetic field intensity at each point on the magnetron's magnetic field arc at any radius on the target surface is shown in Figure 8.

[0054] Based on this, in some embodiments of the present application, the radial corrosion probability at any radius of the target surface is obtained according to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius of the target surface and the functional relationship between the horizontal magnetic field intensity and the target corrosion probability when the magnetron is stationary; the tangential corrosion probability at any radius of the target surface is obtained according to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius of the target surface and the functional relationship between the horizontal magnetic field intensity and the target corrosion probability when the magnetron is rotating; the corrosion probability at any radius of the target surface is obtained according to the radial corrosion probability and the tangential corrosion probability at any radius of the target surface, and the corrosion probability at any radius of the target surface is equal to the sum of the radial corrosion probability and the tangential corrosion probability at the radius.

[0055] In some embodiments of the present application, the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship E radial (r)=∑B xyr (L Arc (r)) / Max(∑B xyr (L Arc (r))), the radial erosion probability at any radius on the target surface is obtained.

[0056] Where r represents any radius of the target surface, B xyr (L Arc (r)) represents the radial component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑Bxyr (L Arc (r)) represents the sum of the radial components of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyr (L Arc (r))) represents the maximum value of the sum of the radial components of the horizontal magnetic field intensity at each point on the magnetic field arc at each radius on the target surface, E radial (r) represents the radial corrosion probability at any radius on the target surface.

[0057] In some embodiments of the present application, the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship Obtain the tangential erosion probability at any radius on the target surface.

[0058] Where r represents any radius of the target surface, B xyv (L Arc (r)) represents the tangential component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑B xyv (L Arc (r)) represents the sum of the tangential components of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyv (L Arc (r))) represents the maximum value of the sum of the tangential components of the horizontal magnetic field intensity at each point on the magnetic field arc at each radius on the target surface, E vertical (r) represents the probability of tangential corrosion at any radius on the target surface.

[0059] It should be noted that, assuming that the radii are r1, r2, ..., rm, and m is an integer greater than 2, then Max(∑B xyr (L Arc (r))) is ∑B xyr (L Arc (r1)),∑B xyr (L Arc (r2))…∑B xyr (L Arc (rm)), the maximum value, Max(∑B xyv (L Arc (r))) is ∑B xyv (L Arc (r1)),∑B xyv (L Arc (r2))…∑B xyv (L Arc The maximum value in (rm)).

[0060] On this basis, the corrosion probability at any radius on the target surface can be obtained based on the sum of the radial corrosion probability and the tangential corrosion probability at any radius on the target surface. In some embodiments, a radial corrosion probability curve for the target surface can be obtained based on the radial corrosion probabilities at multiple radii on the target surface. The radial corrosion probability curve is a curve showing the radial corrosion probability of the target surface as a function of radius. The radial corrosion probability curve is shown in FIG9 . A tangential corrosion probability curve for the target surface can be obtained based on the tangential corrosion probabilities at multiple radii on the target surface. The tangential corrosion probability curve is a curve showing the tangential corrosion probability of the target surface as a function of radius. The tangential corrosion probability curve is shown in FIG10 . The corrosion probability at the radius where the target is most corroded is 1, and the corrosion probability at the radius where the target is least corroded is less than 1.

[0061] As shown in Figure 11, the curve of the target material surface corrosion probability calculated by the method disclosed in the embodiment of the present application as a function of radius is substantially similar to the curve of the actual target material surface corrosion probability as a function of radius, thereby verifying the correctness of the corrosion probability calculation method disclosed in the embodiment of the present application. After obtaining the target material corrosion probability corresponding to the initially designed magnetron, the design of the magnetron can be optimized based on the target material corrosion probability to obtain a magnetron with a higher target material utilization rate. In other words, the formation method disclosed in the embodiment of the present application can not only reduce the design cost of the magnetron and shorten the design cycle of the magnetron, but also improve the utilization rate of the target material, and has good engineering application prospects.

[0062] It should be noted that the embodiment of the present application only illustrates the corrosion probability estimation process using a circular target as an example. However, the present application is not limited to this. In other embodiments, the target may also be a square or diamond target or other shaped target, which will not be repeated here.

[0063] S103: Determine the magnetic pole arrangement of the magnetron according to the corrosion probability at multiple radii on the target surface.

[0064] According to the functional relationship between horizontal magnetic field intensity and target corrosion probability, the target corrosion probability is mainly related to the length of the magnetic field arc (or the number of points on the magnetic field arc) and the intensity of the horizontal magnetic field. The initial design of the magnetic field distribution shape of the magnetron can be a multi-spiral shape as shown in Figure 6. This shape can contain more magnetic field distribution paths, thereby increasing the area of ​​the corrosion zone and thus obtaining a high-utilization magnetron. However, the designed magnetic field distribution path cannot be too long. If the path is too long at a certain radius, it will cause that radius to be completely corroded first, while other radii will be less corroded, resulting in low target utilization. Based on this, when obtaining the corrosion probability at multiple radii on the target surface, it is also necessary to determine the magnetic pole arrangement of the magnetron based on the target utilization.

[0065] In some embodiments of the present application, the utilization rate of the target material can be obtained based on the corrosion probability at multiple radii on the target surface, wherein if the corrosion probability at one radius is 1, the utilization rate of the target material is equal to or close to 100%, and the utilization rate of the entire target material can be obtained based on the average value of the utilization rate of the target material at multiple radii. If the utilization rate of the target material is less than the target utilization rate, it means that the magnetic pole arrangement of the magnetron does not meet the design requirements and the magnetic pole arrangement of the magnetron needs to be adjusted. If the utilization rate of the target material is greater than or equal to the target utilization rate, it means that the magnetic pole arrangement of the magnetron meets the design requirements and the magnetic pole arrangement of the magnetron does not need to be adjusted, or the magnetic pole arrangement of the magnetron can be fine-tuned. Based on this, the method disclosed in the embodiments of the present application can not only reduce the design cost of the magnetron and shorten the design cycle of the magnetron, but also ensure the uniformity of target corrosion by adjusting the magnetic pole arrangement of the magnetron.

[0066] In some embodiments, the corrosion probability curve or corrosion area ratio of the target surface can be obtained based on the corrosion probability at multiple radii of the target surface, and the utilization rate of the target material can be obtained based on the corrosion probability curve or corrosion area ratio of the target surface.

[0067] On this basis, in some embodiments of the present application, the method for forming a magnetron further includes: if the utilization rate of the target material is greater than or equal to the target utilization rate, obtaining the uniformity of the film formed by the magnetron sputtering device having the magnetron, if the uniformity of the film is greater than or equal to the target uniformity, then not adjusting the magnetic pole arrangement of the magnetron, and determining the magnetic pole arrangement of the magnetron as the final arrangement result, if the uniformity of the film is less than the target uniformity, then fine-tuning the magnetic pole arrangement of the magnetron (for example, adjusting the magnetic pole arrangement of a local area of ​​the magnetron). If the uniformity of the film is still less than the target uniformity after multiple fine-tuning of the magnetic pole arrangement and process conditions (such as air pressure, power and target-base spacing), then redesigning the magnetic pole arrangement of the magnetron. Based on this, the method disclosed in the embodiment of the present application can not only reduce the design cost of the magnetron and shorten the design cycle of the magnetron, but also ensure the uniformity of the target material corrosion and the uniformity of the deposited film by adjusting the magnetic pole arrangement of the magnetron. In some embodiments, adjusting the magnetic pole arrangement of the magnetron includes: adjusting the magnetic pole arrangement at the corresponding radius according to the maximum corrosion probability (corrosion probability at the peak of the curve in FIG11 ) or the minimum corrosion probability (corrosion probability at the trough of the curve in FIG11 ) among the corrosion probabilities at multiple radii on the target surface. Specifically, the magnetic pole arrangement at the radius corresponding to the maximum corrosion probability or the magnetic pole arrangement at the radius corresponding to the minimum corrosion probability can be adjusted. And / or, adjusting at least one of the number of magnetic poles, the number of spirals in the arrangement pattern, and the change in spiral curvature of the magnetron. Of course, the present application is not limited to this. In specific applications, the adjustment scheme of the magnetic pole arrangement can be determined according to specific circumstances, which will not be repeated here.

[0068] As another embodiment of the disclosure of the present application, the embodiment of the present application further discloses a magnetron sputtering device, as shown in FIG1 , the magnetron sputtering device includes a magnetron 5 , etc., wherein the magnetron 5 can be formed using the formation method disclosed in any of the above embodiments.

[0069] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above embodiments merely represent several implementation methods of this specification. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of this specification, and these modifications and improvements fall within the scope of protection of this specification. Therefore, the scope of protection of the patent in this specification shall be subject to the appended claims.

Claims

1. A method for forming a magnetron, characterized in that: include: According to the magnetic pole arrangement of the magnetron, the horizontal magnetic field strength of each point on the magnetic field arc of the magnetron at any radius on the target surface is obtained; Obtaining the corrosion probability at any radius on the target surface according to the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability; The magnetic pole arrangement of the magnetron is determined according to the corrosion probability at multiple radii on the target surface.

2. The forming method according to claim 1, characterized in that: The obtaining of the corrosion probability at any radius on the target surface according to the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability comprises: According to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability in the static state of the magnetron, the radial corrosion probability at any radius on the target surface is obtained; Obtain the tangential corrosion probability at any radius on the target surface according to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability under the magnetron rotation state; According to the radial corrosion probability and the tangential corrosion probability at any radius of the target surface, the corrosion probability at any radius of the target surface is obtained, and the corrosion probability at any radius of the target surface is equal to the sum of the radial corrosion probability and the tangential corrosion probability at the radius.

3. The forming method according to claim 2, characterized in that: The obtaining of the radial corrosion probability at any radius on the target surface according to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc line at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability in a static state of the magnetron comprises: According to the radial component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship E radial (r) = ∑B xyr (L Arc (r)) / Max(∑B xyr (L Arc (r))), obtaining the radial corrosion probability at any radius on the target surface; Wherein, r represents any radius of the target surface, B xyr (L Arc (r)) represents the radial component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑B xyr (L Arc (r)) represents the sum of the radial components of the horizontal magnetic field strength at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyr (L Arc (r))) represents the maximum value of the sum of the radial components of the horizontal magnetic field intensity at each point on the magnetic field arc at each radius on the target surface, E radial (r) represents the radial corrosion probability at any radius on the target surface.

4. The forming method according to claim 2, characterized in that: The obtaining of the tangential corrosion probability at any radius on the target surface according to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc line at any radius on the target surface and the relationship between the horizontal magnetic field intensity and the target corrosion probability in the magnetron rotating state comprises: According to the tangential component of the horizontal magnetic field intensity at each point on the magnetic field arc at any radius on the target surface and the functional relationship Obtaining the tangential corrosion probability at any radius on the target surface; Wherein, r represents any radius of the target surface, B xyv (L Arc (r)) represents the tangential component of the horizontal magnetic field intensity at any point on the magnetic field arc at any radius on the target surface, ∑B xyv (L Arc (r)) represents the sum of the tangential components of the horizontal magnetic field strength at each point on the magnetic field arc at any radius on the target surface, Max(∑B xyv (L Arc (r))) represents the maximum value of the sum of the tangential components of the horizontal magnetic field intensity at each point on the magnetic field arc line at each radius on the target surface, E vertical (r) represents the probability of tangential corrosion at any radius on the target surface.

5. The forming method according to claim 1, characterized in that: Determining the magnetic pole arrangement of the magnetron according to the corrosion probabilities at multiple radii on the surface of the target material comprises: Obtaining the utilization rate of the target material according to the corrosion probabilities at multiple radii on the surface of the target material; If the utilization rate of the target material is less than the target utilization rate, the magnetic pole arrangement of the magnetron is adjusted.

6. The forming method according to claim 5, characterized in that: The step of obtaining the utilization rate of the target material according to the corrosion probabilities at multiple radii on the surface of the target material comprises: According to the corrosion probabilities at multiple radii on the target surface, obtaining a corrosion probability curve or a corrosion area ratio on the target surface; The utilization rate of the target material is obtained according to the corrosion probability curve or the corrosion area ratio of the target material surface.

7. The forming method according to claim 5, characterized in that: Also includes: If the utilization rate of the target material is greater than or equal to the target utilization rate, obtaining the uniformity of a thin film formed by a magnetron sputtering device having the magnetron; If the uniformity of the film is less than the target uniformity, the magnetic pole arrangement of the magnetron is fine-tuned.

8. The forming method according to claim 5, characterized in that: The adjustment of the magnetic pole arrangement of the magnetron includes: adjusting the magnetic pole arrangement at the corresponding radius according to the maximum corrosion probability or the minimum corrosion probability among the corrosion probabilities at multiple radii on the target surface; and / or adjusting at least one of the number of magnetic poles, the number of spirals in the arrangement pattern, and the change in spiral curvature of the magnetron.

9. A magnetron, characterized in that: The magnetron is formed by the forming method according to any one of claims 1 to 8.

10. A magnetron sputtering device, characterized in that: Comprising the magnetron as claimed in claim 9.

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