Display module and electronic device

Abstract

The present application provides a display module and an electronic device. The display module comprises a display panel, a first module stack and a transmission layer which are stacked; the first module stack is located on the side away from a light emitting surface of the display panel; a first sub-stack of the first module stack is stacked between the transmission layer and the display panel; and the first sub-stack comprises a hard material. At least two wiring connection structures of the display module are both connected to the transmission layer; and one of the at least two wiring connection structures is configured to be electrically connected to a first apparatus in the electronic device, and the other one of the at least two wiring connection structures is configured to be electrically connected to a second apparatus in the electronic device, so that the transmission layer is used for transmitting a signal between the first apparatus and the second apparatus. The present application can achieve the compact structure of the electronic device by means of the display module, and is conductive to saving the internal space of the electronic device.

Description

Display modules and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 13, 2023, with application number 202311715876.X, and priority to the Chinese patent application with the invention name "Display Module and Electronic Device", all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0003] Inside electronic devices such as terminals, there are a large number of transmission lines (which can be signal transmission lines or power transmission lines). For example, transmission lines can be roughly categorized as display signals, camera signals, radio frequency signals, audio signals, sensors, and power supplies. The numerous transmission lines arranged inside electronic devices not only occupy the internal space of the electronic devices, but also require the design of the storage and organization of the lines. For example, designing the transmission lines in the form of flexible printed circuit boards (FPCs) can realize communication and power supply between the system on a chip (SOC) and various hardware interfaces. FPCs need to be independently assembled and fixed. FPCs need to occupy space inside electronic devices, especially space in the thickness of the electronic devices, which is not conducive to the compact and thin design of electronic devices. Summary of the Invention

[0004] An embodiment of the present application provides a display module and an electronic device. The display module integrates a display panel and a transmission layer. Signal transmission between device one and device two in the electronic device is achieved through the transmission layer, making the internal structure of the electronic device compact and easy to achieve a thin design.

[0005] In a first aspect, an embodiment of the present application provides a display module for use in an electronic device, wherein the display module includes a stacked display panel, a first module stack, and a transmission layer, wherein the first module stack is located on a side away from the light-emitting surface of the display panel, the first module stack includes a first sub-stack, the first sub-stack is stacked between the transmission layer and the display panel, and the first sub-stack includes a hard material; the display module also includes a display connection structure and at least two wiring connection structures, the display panel is electrically connected to a control unit of the electronic device through the display connection structure, the transmission layer is electrically connected to the at least two wiring connection structures, one of the at least two wiring connection structures is used to electrically connect the transmission layer and device one in the electronic device, and the other of the at least two wiring connection structures is used to electrically connect the transmission layer and device two in the electronic device, so that the transmission layer transmits signals between device one and device two.

[0006] The present application integrates a transmission layer and a display panel in a display module. The display module performs a display function through the display panel and performs a signal transmission function through the transmission layer. The transmission layer can realize signal transmission between device one and device two in the electronic device. There is no need to set more transmission lines in the electronic device, which reduces the number of transmission lines in the device body of the electronic device, and is conducive to the lightweight design of the device body. Since the circuits in the transmission layer are patterned wiring structures, for the display module, the newly added circuits are prone to mold imprints. The mold imprint can be understood as: the imprint formed by the pattern of the internal circuit can be seen on the display surface of the display module. The existence of the mold imprint affects the quality, reliability and user experience of the display module. The present application sets the first sub-layer of the first module stack between the transmission layer and the display panel, and isolates the transmission layer and the display panel through the hard material of the first sub-layer, thereby preventing the mold imprint problem of the display module caused by the setting of the transmission layer and improving the quality and reliability of the display module.

[0007] In one possible implementation, the hard material of the first sub-layer includes carbon fiber or cemented carbide. In one embodiment of the present application, the hard material of the first sub-layer can be carbon fiber or cemented carbide, and the cemented carbide can be 304 alloy or titanium alloy.

[0008] In one possible implementation, the display module has a first window and a second window; in the thickness direction of the display module, the first window and the second window are located on a side of the transmission layer facing away from the display panel, and the stacking direction between the display panel, the first module stack, and the transmission layer is the thickness direction of the display module; one of the at least two wiring connection structures is electrically connected to the wiring layer of the transmission layer within the first window, and the other of the at least two wiring structures is electrically connected to the wiring layer of the transmission layer within the second window. In one embodiment of the present application, by providing the first and second windows, the wiring connection structure can connect to the wiring layer of the transmission layer within the windows, which is conducive to achieving a small edge size of the display module and improving the screen-to-body ratio of the display module. Furthermore, the hard material of the first sub-layer of the first module stack supports the display panel at the first and second windows. That is, the provision of the hard material of the first sub-layer prevents mold printing problems at the window locations, which is also conducive to ensuring the quality and reliability of the display module.

[0009] In one possible implementation, the first module stack further includes a second sub-stack, the second sub-stack being made of a different material than the first sub-stack, the transmission layer being located between the first and second sub-stacks, the second sub-stack being made of a flexible material and being used to form an electrostatic protection structure on the side of the transmission layer facing away from the first sub-stack, and the first and second windows extending through the second sub-stack. In one embodiment of the present application, the transmission layer is disposed between the second sub-stack and the first sub-stack. The hard material of the first sub-stack resolves the mold printing problem, and the electrostatic protection provided by the second sub-stack also protects the circuitry of the transmission layer from the effects of static electricity, thereby ensuring the stability and security of the transmission signal of the display module.

[0010] In one possible implementation, the first sub-layer is made of metal and is used to shield signal interference between the transmission layer and the display panel. In one embodiment of the present application, by making the first sub-layer of metal, the first sub-layer not only supports the display panel but also shields signal interference between the transmission layer and the display panel, thereby facilitating a thinner design of the display module and ensuring the stability of the transmission signal of the display module.

[0011] In one possible implementation, the thickness of the first sub-laminate is 100-300 μm; the thickness of the second sub-laminate is 20-50 μm. Both the second sub-laminate and the first sub-laminate can be made of metal, and their thickness dimensions can determine whether they are rigid or flexible. In one embodiment of the present application, the rigid structure of the first sub-laminate is achieved by constraining the thickness of the first sub-laminate, while the flexible structure of the second sub-laminate is achieved by constraining the thickness of the second sub-laminate.

[0012] In one possible implementation, the first module stack is located between the transmission layer and the display panel, the transmission layer and the first module stack are adhered by an adhesive layer, the transmission layer includes a substrate layer and the routing layer, the routing layer is stacked between the substrate layer and the first module stack, and the first window and the second window pass through the substrate layer. In one embodiment of the present application, the transmission layer is arranged at the bottom of the first module stack, that is, the side of the first module stack away from the display panel, and by arranging the routing layer between the substrate layer and the first module stack, the substrate is used to protect the routing layer, and there is no need to set up an additional protective layer structure. In addition, a window is provided on the substrate to realize that the connection between the routing connection structure and the routing layer is located within the window, does not occupy external space, and is conducive to realizing a thin design of the display module.

[0013] In other embodiments, the first module stack is located between the transmission layer and the display panel, and the transmission layer and the first module stack are adhered by an adhesive layer. The transmission layer includes a substrate layer and the routing layer. The routing layer is stacked between the substrate layer and the first module stack. The substrate layer is the bottom layer of the display module. An electrical connection structure is provided on the substrate layer. The electrical connection structure is electrically connected to the routing layer, and the electrical connection structure is also used to connect the routing connection structure. In one embodiment of the present application, it is not necessary to provide a window on the substrate layer, which has the advantage of being easy to manufacture from the perspective of the manufacturing process.

[0014] In one possible implementation, the first module stack is located between the transmission layer and the display panel, the transmission layer includes a substrate layer and the routing layer, the substrate layer and the first module stack are adhered by an adhesive layer, the routing layer is located on the side of the substrate layer facing away from the first module stack, the display module also includes a bottom protective layer, the bottom protective layer is on the side of the routing layer facing away from the substrate layer and covers the routing layer, and the first window and the second window pass through the bottom protective layer. In one embodiment of the present application, by setting the transmission layer at the bottom of the first module stack and setting the routing layer on the side of the substrate layer facing away from the first module stack, the routing layer is protected by the bottom protective layer, and the first window and the second window pass through the bottom protective layer, which is beneficial to the production of the first window and the second window.

[0015] In one possible implementation, the display module is capable of switching between a folded state and a flattened state, and the display module includes a first portion, a second portion, and a connecting portion connected between the first portion and the second portion, wherein the connecting portion is configured to generate a bending deformation during the switching process between the folded state and the flattened state, the wiring connection structure for electrically connecting the device one is connected to the first portion, and the wiring connection structure for electrically connecting the device two is connected to the second portion, and the first module stack includes a structure with a bending function located within the connecting portion. For foldable electronic devices, by integrating the transmission layer into the display module, the design of the transmission line passing through the hinge within the device body is eliminated, reducing design costs and making the hinge structure of the electronic device simpler and more reliable.

[0016] In a second aspect, an embodiment of the present application provides a display module for use in an electronic device, wherein the display module includes a stacked transmission layer and a display panel, wherein the transmission layer is located on a side away from the light-emitting surface of the display panel; the display module also includes a display connection structure and at least two wiring connection structures, wherein the display panel is electrically connected to a control unit of the electronic device via the display connection structure, and at least two wiring connection structures are connected to the edge of the transmission layer, and one of the at least two wiring connection structures is used to electrically connect the transmission layer and device one in the electronic device, and the other of the at least two wiring connection structures is used to electrically connect the transmission layer and device two in the electronic device, so that the transmission layer transmits signals between device one and device two. In one embodiment, by leading the wiring connection structure out from the edge of the transmission layer, the integrity of the stacked structure formed by the display panel and the transmission layer can be ensured, without having to lead the wiring connection structure out by opening a window. Therefore, a possible embodiment of the present application can avoid mold printing problems in the display module, which is conducive to ensuring the quality and reliability of the display module.

[0017] In one possible implementation, the display module further includes a first module stack, and the transmission layer is disposed between the first module stack and the display panel. By disposing the transmission layer between the first module stack and the display panel and completely covering the transmission layer with the first module stack, the transmission layer's circuitry is protected, thereby facilitating the quality and reliability of the display module.

[0018] In one possible implementation, the display panel includes a substrate layer, a shielding layer, and a panel functional layer stacked in sequence, the shielding layer comprising a conductive material; the transmission layer is positioned between the first module stack and the substrate layer, the transmission layer comprising a routing layer, and the conductive material in the shielding layer at least partially isolates signals from the routing layer and the panel functional layer. In one possible implementation, the shielding layer is used to isolate signal interference between the routing layer within the transmission layer and the panel functional layer, resulting in a high level of integration and eliminating the need for a metal shielding layer within the transmission layer, which facilitates thinning of the electronic device.

[0019] In a possible implementation, the conductive material of the shielding layer covers the entire surface of the substrate layer. In a possible implementation, the shielding layer does not need to be patterned, which is easy to manufacture and has low manufacturing cost.

[0020] In one possible implementation, the shielding layer is a patterned conductive layer structure, and the specific shape of the pattern of the shielding layer can be set according to the pattern of the routing layer of the transmission layer. The patterned conductive layer structure of the shielding layer can be wider than the patterned conductive structure of the routing layer of the transmission layer, and the patterned conductive layer structure of the shielding layer can completely cover the patterned conductive structure of the routing layer of the transmission layer.

[0021] In a possible implementation, the transmission layer includes a substrate layer, the routing layer is formed on a surface of the substrate layer, and the routing layer is adhered to the base material layer and / or the first module stack via an adhesive layer.

[0022] In one possible implementation, the thickness of the substrate layer ranges from 10 μm to 50 μm. By restricting the substrate layer to a suitable range, a substrate layer that is too thick (over 50 μm) for a display module with a bending function can affect the display module's performance and user experience. A substrate layer that is too thin (less than 10 μm) can complicate the fabrication process for the transmission layer, making it difficult to ensure product yield and increasing production costs.

[0023] In one possible implementation, the elastic modulus of the substrate layer ranges from 2.5 GPa to 9 GPa. In another possible implementation, the elongation at break of the substrate layer is required to be greater than 5%. In another possible implementation, constraining the elastic modulus and elongation at break of the substrate layer is intended to meet the bending performance requirements of the display module. An elastic modulus range of 2.5 GPa to 9 GPa and an elongation at break requirement of greater than 5% both ensure good bending performance of the display module. This also meets impedance requirements for signal transmission.

[0024] In one possible implementation, the thickness range of the routing layer is: 3um-10um. In one possible implementation, by constraining the thickness range of the routing layer, the display module can have good bending performance. Moreover, constraining the thickness of the routing layer within the range of 3um-10um is also conducive to solving the mold printing problem of the display module. If the routing layer is too thick, it will not only affect the overall thickness of the display module, which is conducive to a thin design, but also affect the bending performance and produce mold printing. The mold printing can be understood as the line imprint of the routing layer being visible on the light-emitting surface of the display module, affecting the user experience of the electronic device.

[0025] In one possible implementation, the display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure for electrically connecting the device one is connected to the first part, and the wiring connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a second side arranged adjacent to each other, the first side is the long side of the first part, a part of the second side constitutes the short side of the first part, and a part of the second side constitutes the short side of the second part, the display connection structure is connected to the first side, and at least two of the wiring connection structures are connected to the second side.

[0026] In one possible implementation, the display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure for electrically connecting the device one is connected to the first part, and the wiring connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a third side arranged opposite to each other, the display connection structure is connected to the first side, one of the wiring connection structures is connected to the first side and is arranged to overlap with the display connection structure, and the other of the wiring connection structures is connected to the third side.

[0027] In one possible implementation, the display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure for electrically connecting the device one is connected to the first part, and the wiring connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a third side arranged opposite to each other, the display connection structure is connected to a first area of ​​the first side, one of the wiring connection structures is connected to the second area of ​​the first side, and is arranged side by side with the display connection structure, and the other of the wiring connection structures is connected to the third side.

[0028] In one possible implementation, the display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part, and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The routing connection structure for electrically connecting the device one is connected to the first part, and the routing connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular. The transmission layer and the display panel constitute a stacked structure, which includes a first side, one of the routing connection structures is connected to the first side, and the display connection structure is connected to the first side. The display connection structure and the routing connection structure connected to the first side are respectively connected to different flexible circuit boards, and the display connection structure is electrically connected to the control unit in the electronic device through the flexible circuit board. The routing connection structure realizes a conductive connection between the transmission layer and the device in the electronic device through the flexible circuit board.

[0029] In one possible implementation, the display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part, and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The routing connection structure for electrically connecting the device one is connected to the first part, and the routing connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular. The transmission layer and the display panel constitute a stacked structure, which includes a first side. One of the routing connection structures is connected to the first side, and the display connection structure is connected to the first side. The display connection structure and the routing connection structure connected to the first side are connected to different positions of the same flexible circuit board. The display connection structure is electrically connected to the control unit in the electronic device through the flexible circuit board. The routing connection structure realizes conductive connection between the transmission layer and the devices in the electronic device through the flexible circuit board.

[0030] In a third aspect, an embodiment of the present application provides an electronic device, comprising a device body and a display module provided by any possible implementation of the first aspect, wherein the device body is provided with a control unit, device one and device two, the display module is connected to the device body, the display connection structure is electrically connected to the control unit, one of the wiring connection structures is electrically connected to device one, and the other of the wiring connection structure is electrically connected to device two. In the electronic device provided by the present application, the signal transmission between device one and device two in the device body is realized through the integrated wiring part in the display module, which can save space in the device body and is conducive to the thin design of the electronic device. Using the display module provided by a possible implementation of the present application can also improve the capacitance of the electronic device, because the structure of the transmission line in the device body is integrated in the display module, which can increase the flexibility of the overall design of the electronic device. There is no need to set the transmission line in the thickness direction of the battery, so the thickness of the battery can be increased. That is to say, part of the space originally used to set the transmission line in the device body is supplied to the battery, so that the battery can have a larger capacity and increase the battery life. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to one embodiment;

[0032] FIG1B is a schematic diagram of the electronic device shown in FIG1A in a folded state;

[0033] FIG2A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to an embodiment;

[0034] FIG2B is a schematic diagram of the electronic device shown in FIG2A in a folded state;

[0035] FIG3A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to an embodiment;

[0036] FIG3B is a schematic diagram of the electronic device shown in FIG3A in a folded state;

[0037] FIG4 is a schematic diagram of interconnecting multiple functional devices within a device body of an electronic device through transmission lines according to an embodiment;

[0038] FIG5 is a schematic diagram of a display module provided in one embodiment of the present application;

[0039] FIG6 is a schematic diagram of a display module provided in another embodiment of the present application;

[0040] FIG7 is a cross-sectional view of the embodiment shown in FIG5 and FIG6 along the dotted line AA;

[0041] FIG8 is a schematic cross-sectional view of a display module provided in one embodiment of the present application;

[0042] FIG9 is a schematic cross-sectional view of a display module provided in one embodiment of the present application;

[0043] FIG10 is a schematic cross-sectional view of a display module provided in one embodiment of the present application;

[0044] FIG11 is a schematic cross-sectional view of a display module provided in one embodiment of the present application;

[0045] FIG12 is a schematic cross-sectional view of a display module provided in one embodiment of the present application;

[0046] FIG13A is a schematic plan view of a main body of an electronic device provided in one embodiment;

[0047] FIG13B is a schematic plan view of a display module of an electronic device provided in one embodiment;

[0048] FIG14A is a schematic diagram showing the device body shown in FIG13A and the display module shown in FIG13B being assembled together;

[0049] FIG14B is a schematic diagram illustrating electrical connection between components in a first body and components in a second body via transmission lines within the device body;

[0050] FIG15 , FIG16 , FIG17 , FIG18 , FIG19 and FIG20 are schematic diagrams of display modules provided in different embodiments respectively;

[0051] FIG21 is a schematic plan view of a stacked structure provided in one embodiment;

[0052] FIG22 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application;

[0053] FIG23 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application;

[0054] Figures 24, 25, and 26 are schematic diagrams showing a solution in which the wiring connection structure and the display connection structure located on the same side of the stacked structure share a common flexible circuit board. Figures 25 and 26 are schematic cross-sectional views of the solution sharing the common flexible circuit board, and Figure 24 is a schematic plan view of Figures 25 and 26 showing the solution sharing the common flexible circuit board.

[0055] FIG27 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application;

[0056] FIG28 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application;

[0057] FIG29 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application;

[0058] FIG30 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application;

[0059] FIG31 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application;

[0060] FIG32 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application;

[0061] FIG33 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application. DETAILED DESCRIPTION

[0062] The following describes possible implementations of the present application in conjunction with the accompanying drawings in possible implementations of the present application.

[0063] The embodiments of the present application provide an electronic device and a display module. The display module is a part of an electronic device. Examples of electronic devices may include, but are not limited to, smart phones, mobile phones, tablet personal computers ("PCs"), personal digital assistants ("PDAs"), portable multimedia players ("PMPs"), televisions, game consoles, watch-type electronic devices, head-mounted displays, personal computer displays, laptops, car navigation systems, car dashboards, digital cameras, camcorders, external billboards, electronic billboards, various medical devices, various inspection equipment, various household appliances (such as refrigerators or washing machines) that display images or videos on the display portion DPA, physical electronic devices, and / or daily necessities with extended Internet connections (e.g., Internet of Things devices), etc. The electronic device may be a foldable device. The electronic device may also be a tablet, that is, an electronic device that cannot be folded.

[0064] The term "foldable device" as used herein refers to a device that can be folded and unfolded and a folding device that maintains a folded state (e.g., non-expandable). A foldable electronic device can be folded at an angle between 0 degrees and about 180 degrees, but the present disclosure is not limited thereto. An electronic device that is set to be flat is considered to be set at 0 degrees and can be folded at a folding angle greater than or less than 180 degrees. In an embodiment, for example, the electronic device can be folded at a folding angle equal to or greater than 90 degrees and less than 180 degrees, or equal to or greater than 120 degrees and less than 180 degrees relative to 0 degrees. In addition, the folded state may refer to a state folded out from the unfolded state, even if it is not fully folded.

[0065] In one embodiment, the electronic device is a foldable mobile terminal, and the display module is a flexible display module. When the electronic device is in a folded state, the display module is in a folded state, the overall size is small, and it is easy to carry. When the electronic device is in a flattened state, the display module is in a flattened state, and the display module forms a display interface of a larger size. The electronic device provided in the specific embodiment of the present application can be a folding device (as shown in Figures 1A, 1B, 2A, and 2B), or a three-fold device (as shown in Figures 3A and 3B). For example, when the electronic device is a folding device, the display module can be an inward folding structure (as shown in Figures 1A and 1B), or an outward folding structure (as shown in Figures 2A and 2B).

[0066] FIG1A is a schematic diagram of an electronic device provided in one embodiment at one position during the process of transitioning from a flattened state to a folded state, and FIG1B is a schematic diagram of the electronic device shown in FIG1A in a folded state. Referring to FIG1A and FIG1B , in one embodiment, the electronic device 100 is a folding device with an inward folding scheme, and the electronic device 100 includes a device body 10 and a display module 20. The display module 20 is connected to the device body 10. The device body 10 includes a first body 1, a second body 2, and a hinge 3, and the hinge 3 is located between the first body 1 and the second body 2 so that the first body 1 and the second body 2 can be folded or flattened relative to each other. The display module 20 includes a first part 201, a second part 203, and a connecting part 202 connecting the first part 201 and the second part 203. The first part 201 is connected to the first body 1, and the second part 203 is connected to the second body 2. During the folding of the first and second bodies 1, 2, the display module 20 is located inward in the folding direction. During this process, the first and second parts 201, 203 fold relative to each other, causing the connecting portion 202 to bend and deform. In the folded state, the display module 20 is stacked between the first and second bodies 1, 2. In the illustration shown in Figure 1B, the display module 20 is obscured by the device body 10 and is not visible.

[0067] Figure 2A is a schematic diagram of an electronic device in one embodiment, illustrating a position during the transition from a flattened state to a folded state. Figure 2B is a schematic diagram of the electronic device shown in Figure 2A in the folded state. Referring to Figures 2A and 2B, in one embodiment, the electronic device 100 is an outward-folding device. During the relative folding of the first body 1 and the second body 2 of the device body 10, the display module 20 is located on the outside of the folding direction. The first body 1 and the second body 2 are relatively close together, so that in the folded state, they are stacked. In the folded state, the display module 20 wraps around the periphery of the device body 10.

[0068] FIG3A is a schematic diagram of an electronic device provided in one embodiment, showing a position during the transition from a flattened state to a folded state, and FIG3B is a schematic diagram of the electronic device shown in FIG3A in a folded state. Referring to FIG3A and FIG3B , in one embodiment, the electronic device 100 is a tri-fold device. The device body 10 includes a first body 1, a second body 2, a hinge 3, a hinge 4, and a third body 5. The hinge 3 is connected between the first body 1 and the second body 2, and the hinge 4 is connected between the third body 5 and the second body 2. The display module 20 includes a first portion 201, a connecting portion 202, a second portion 203, a connecting portion 204, and a third portion 205. The connecting portion 202 is connected between the first portion 201 and the second portion 203, and the connecting portion 204 is connected between the third portion 205 and the second portion 203. The first portion 201 is connected to the first body 1, the second portion 203 is connected to the second body 2, and the third portion 205 is connected to the third body 5. During the relative folding of the first body 1 and the second body 2, the first part 201 and the second part 203 correspond to an outward folding scheme, that is, the first part 201 and the second part 203 are located on the outside of the folding direction. During the relative folding of the second body 2 and the third body 5, the second part 203 and the third part 205 correspond to an inward folding scheme, that is, the second part 203 and the third part 205 are located on the inside of the folding direction. In the folded state, the device body 10 and the display module 20 are both folded into a three-fold structure, with the first body 1, the second body 2 and the third body 5 stacked. In the folded state, the first part 201 is located on the outer surface of the device body 10 and is used to display the interface. The second part 203 and the third part 205 are sandwiched and hidden between the second body 2 and the third body 5.

[0069] Figure 4 is a schematic diagram illustrating the interconnection of multiple functional components within a device body of an electronic device, provided in one embodiment, via transmission lines. Referring to Figure 4 , for example, the electronic device includes the following functional components: a system on chip (SOC), a display module, a radio frequency device, an imaging device, an audio device, a power supply, and a sensor. The SOC and the display module are electrically connected via transmission line L1, the SOC and the radio frequency device are electrically connected via transmission line L2, the SOC and the imaging device are electrically connected via transmission line L3, the SOC and the audio device are electrically connected via transmission line L4, the SOC and the power supply are electrically connected via transmission line L5, and the SOC and the sensor are electrically connected via transmission line L6. Figure 4 schematically illustrates the connections between the SOC and other functional components via transmission lines. It is understood that transmission lines may also be required between other functional components, for example, a power supply may also power multiple functional components. As electronic devices become increasingly versatile, the number of functional components within the device body of the electronic device also increases, and the number of transmission lines between the various functional components also increases. Transmission lines are used to transmit signals between the functional components, which can be data signals or power signals. In one embodiment, transmission lines are located within the device body. When there are many functional devices, the number of transmission lines increases, and these numerous transmission lines occupy a significant amount of space within the device body, making it difficult to achieve a thin design. Furthermore, when the electronic device is foldable, the transmission lines need to pass through the electronic device's hinge to electrically connect the functional devices on different parts of the body. This requires designing the hinge structure and considering the impact of the transmission lines at the hinge position on the overall structure or bending shape, increasing design costs.

[0070] In one embodiment of the present application, a transmission line for electrically connecting different functional devices in an electronic device is integrated into the display module. By manufacturing the transmission line in the display module during the manufacturing process, the number of transmission lines in the device body of the electronic device can be reduced, which is conducive to the lightweight design of the device body. The transmission line can also be made into a transmission layer structure that matches the size of the display module, and the transmission line can be integrated into the display module by sticking the transmission layer to the back of the display module without the transmission line. For foldable electronic devices, the design of the transmission line passing through the hinge is also eliminated, which reduces design costs and makes the hinge structure simpler and more reliable.

[0071] FIG5 is a schematic diagram of a display module provided in one embodiment of the present application, and FIG6 is a schematic diagram of a display module provided in another embodiment of the present application. Referring to FIG5 and FIG6 , the display module 20 includes a laminated structure 23 and a display connection structure 212 and at least two wiring connection structures 222 connected to the laminated structure 23. FIG5 schematically shows an embodiment in which the display module 20 has one display connection structure 212 and two wiring connection structures 222, and FIG6 schematically shows an embodiment in which the display module 20 has one display connection structure 212 and three wiring connection structures 222. The laminated structure 23 can be understood as a combination of all layer structures in the display module, for example, it can include a display panel, a first module laminate located on the backlight side of the display panel, a second module laminate located on the light-emitting side of the display panel, and so on. The display panel is a structure of the display module used for display function, such as an OLED display panel.

[0072] The present application can set an appropriate number of wiring connection structures 222 according to specific needs based on the specific application scenario of the display module. The laminated structure 23 is an integrated structure, and the laminated structure 23 includes a first surface 23S1, a second surface 23S2 and a side surface 23S3 connected between the first surface 23S1 and the second surface 23S2. The first surface 23S1 is the light-emitting surface (also called the display surface) of the display module 20. In the embodiments shown in Figures 5 and 6, the display connection structure 212 and the wiring connection structure 222 are both led out from the side surface 23S3 of the laminated structure 23, and the display connection structure 212 and the wiring connection structure 222 are connected to the edge of the laminated structure 23. In some embodiments of the present application, the wiring connection structure 222 can be led out from the second surface 23S2 of the laminated structure 23, that is, the connection position of the wiring connection structure 222 and the laminated structure 23 is located on the second surface 23S2, or located inside the laminated structure 23.

[0073] The half-folding electronic device shown in FIG. 1A , FIG. 1B , FIG. 2A , and FIG. 2B , and the tri-folding electronic device shown in FIG. 3A and FIG. 3B may all use the display module provided in the embodiments of the present application.

[0074] FIG7 is a schematic cross-sectional view of the embodiment shown in FIG5 and FIG6 along the dotted line AA.

[0075] Referring to FIG. 7 , in one embodiment, a display module includes a display portion 21 and an integrated wiring portion 22. The display portion 21 includes a stack assembly 211 (the portion within the dashed box in FIG. 7 represents the stack assembly 211) and a display connection structure 212. The display connection structure 212 is connected to the stack assembly 211 and is located outside the stack assembly 211, extending from an edge of the stack assembly 211. The display connection structure 212 is used to electrically connect the stack assembly 211 to a control unit within the electronic device (e.g., a controller or system-on-chip located on the electronic device's motherboard). The integrated wiring portion 22 includes a transmission layer 221 and at least two wiring connection structures 222 (only two wiring connection structures 222 are shown in FIG. 7 ). The transmission layer 221 and the stack assembly 211 are integrated into a one-piece stack structure 23. At least two wiring connection structures 222 are both connected to the transmission layer 221 and are located or extend outside the stack structure 23. One of the at least two wiring connection structures 222 is used to electrically connect device 1 within the electronic device, and the other of the at least two wiring connection structures 222 is used to electrically connect device 2 within the electronic device, thereby enabling signal transmission between device 1 and device 2 via the integrated wiring portion 22. The signal transmitted by the integrated wiring portion 22 can be a digital signal or a virtual signal, and the transmitted signal can be a current signal, a data signal, a radio frequency signal, or the like.

[0076] In the embodiment shown in FIG7 , the stack assembly 211 includes a first module stack 2111, a display panel 2112, and a second module stack 2113. The display panel 2112 includes a light-emitting surface 12S1 and a bottom surface 12S2 facing away from the light-emitting surface 12S1, with the bottom surface 12S2 facing the first module stack 2111. The first module stack 2111 may include a hard material, which may include, but is not limited to, carbon fiber or a cemented carbide material. The cemented carbide material may include, but is not limited to, 304 alloy or titanium alloy. The first module stack 2111 may include a bending structure, such as a bamboo book structure. In a display module, the bending structure corresponds to the bendable connection portion of the display module. Display modules are used in foldable electronic products, and the connection portion of the display module needs to deform during folding or unfolding. The bending structure of the first module stack 2111 needs to support the display panel while also bending to adapt to the different structural forms of the display module.

[0077] The light-emitting surface 12S1 of the display panel 2112 faces the second module stack 2113, which is located between the light-emitting surface 12S1 of the display panel 2112 and the first surface 23S1 of the stacked structure 23. The second module stack 2113 may be an optical layer structure or a protective layer on the light-emitting side of the display panel 2112. For example, the second module stack 2113 may include an optical layer structure such as a polarizer.

[0078] In the embodiment shown in FIG7 , the transmission layer 221 is located on the side of the first module stack 2111 away from the bottom surface 12S2 of the display panel 2112, and the wiring connection structure 222 extends from the edge of the transmission layer 221. In a specific embodiment, the wiring connection structure 222 and the transmission layer 221 are an integrated structure, and the two are integrally formed through the manufacturing process of the display module. It can be understood that the wiring connection structure 222 and the transmission layer 221 can be manufactured simultaneously through a process similar to the manufacturing of a circuit board. The wire portion on the wiring connection structure 222 and the wire portion on the transmission layer 221 can be a circuit structure arranged on the same layer, and are formed through a single step. The internal wiring of the transmission layer 221 is shielded by the first module stack 2111, so that the display module does not produce a mold imprint phenomenon. Figure 7 schematically shows the positional relationship between the first module stack 2111, the display panel 2112, the second module stack 2113 and the transmission layer 221 in the stack assembly 211 in the stack structure 23. In a specific embodiment, the layers can be connected by an adhesive layer, and other layer structures can also be set between two adjacent layers or at the top of the stack assembly 211 and the bottom of the transmission layer 221.

[0079] FIG8 is a schematic cross-sectional view of a display module provided in accordance with one embodiment of the present application. Referring to FIG8 in conjunction with the embodiment shown in FIG7 , a wiring connection structure 222 is connected to the second surface 23S2 of the laminate structure 23. The wiring connection structure 222 is connected to the surface of the transmission layer 221 facing away from the laminate assembly 211. In one possible implementation, the wiring connection structure 222 and the transmission layer 221 are not integrally formed, but are independent structures. Electrical connection between the wiring connection structure 222 and the transmission layer 221 can be achieved through (but not limited to) gold fingers or other electrical connection structures. In one possible implementation, the transmission layer 221 is fabricated within the laminate structure 23 using a process similar to that used in circuit board manufacturing. The laminate structure 23 can be provided with a connection structure, such as a conductive structure 221P (which can be a gold finger, pad, or other form of connector), which is secured and electrically connected to the wiring connection structure 222 via the connection structure. For example, the wiring connection structure 222 can be a flexible circuit board structure.

[0080] Figure 8 schematically illustrates the connection location between the wiring connection structure 222 and the transmission layer 221. In a specific embodiment, at least a portion of the wiring connection structure 222 is connected to the transmission layer 221 and attached to the surface of the laminate structure 23. In the embodiment shown in Figure 8, a portion of the wiring connection structure 222 can be attached to the surface of the transmission layer 221.

[0081] FIG9 is a schematic cross-sectional view of a display module according to one embodiment of the present application. Referring to FIG9 in conjunction with the embodiment shown in FIG7 , the portion within the dashed box in FIG9 represents a stacked assembly 211. Stacked assembly 211 is shown in two parts: a display panel 2112 and a second module stack 2113 located on top of a transmission layer 221, and a first module stack 2111 located on the bottom of the transmission layer 221. The transmission layer 221 is located between the first module stack 2111 and the display panel 2112, with a wiring connection structure 222 extending from the edge of the transmission layer 221. In one possible implementation, the wiring connection structure 222 and the transmission layer 221 can be an integrated structure, that is, they are integrally formed using a display module manufacturing process. This can be understood as follows: the wiring connection structure 222 and the transmission layer 221 can be fabricated simultaneously using a process similar to circuit board manufacturing. The wiring on the wiring connection structure 222 and the wiring on the transmission layer 221 can be arranged on the same layer and fabricated in a single step.

[0082] In one embodiment of the present application, the transmission layer 221 is arranged between the first module stack 2111 and the display panel 2112, and the transmission layer 221 is completely covered by the first module stack 2111, so as to protect the lines of the transmission layer 221. The wiring connection structure is led out from the edge of the transmission layer 221, which can ensure the integrity of the stacked structure composed of the display panel 2112 and the transmission layer 221. There is no need to lead out the wiring connection structure 222 by opening a window. Therefore, the display module provided by one embodiment of the present application can avoid the mold printing problem of the display module, which is conducive to ensuring the quality and reliability of the display module.

[0083] This embodiment protects the transmission layer 221 by disposing the transmission layer 221 between the first module stack 2111 and the display panel 2112. The display module provided in one embodiment of the present application can utilize the metal portion of the display panel 2112 as a shielding structure for the transmission layer 221, which facilitates thinning of the transmission layer 221 and enables a thinner design of the overall stacked structure 23.

[0084] Figure 10 is a schematic cross-sectional view of a display module provided in accordance with one embodiment of the present application. Referring to Figure 10 in conjunction with the embodiment shown in Figure 9 , the connection location between the wiring connection structure 222 and the transmission layer 221 is located within the area surrounded by the edge of the transmission layer 221. In one possible implementation, the transmission layer 221 is located between the first module stack 2111 and the display panel 2112, and a portion of the wiring connection structure 222 passes through the first module stack 2111 and connects to the transmission layer 221. In one possible implementation, a window 11H is provided in the first module stack 2111, exposing the transmission layer 221. The location of the exposed transmission layer may be a conductive structure 221P. During the manufacturing process, one end of the wiring connection structure 222 is inserted into the window 11H, and the wiring connection structure 222 is electrically connected to the conductive structure 221P on the transmission layer 221 located at the bottom of the window 11H.

[0085] In one possible implementation, in the embodiment shown in Figure 10, the wiring connection structure 222 is partially located within the window 11H, part of the wiring connection structure 222 is adhered to the transmission layer 221 located at the bottom of the window 11H, part of the wiring connection structure 222 is adhered to the first module stack 2111 located on the side wall of the window 11H, and part of the wiring connection structure 222 is adhered to the surface of the first module stack 2111 facing away from the transmission layer 221.

[0086] FIG11 is a schematic cross-sectional view of a display module provided in accordance with one embodiment of the present application. Referring to FIG11 in conjunction with the embodiment shown in FIG9 , the transmission layer 221 is located within the first module stack 2111. It can be understood that a portion of the first module stack 2111 is located between the transmission layer 221 and the display panel 2112, and a portion of the first module stack 2111 is located on the side of the transmission layer 221 facing away from the display panel 2112. In one possible implementation, the transmission layer 221 is integrated within the first module stack 2111. The structure of the first module stack 2111 can be reused to fabricate the transmission layer 221, facilitating a thinner design for the overall stack structure 23. A portion of the first module stack 2111 can also be used as isolation between the transmission layer 221 and the display panel 2112, thereby reducing interference between signals in the transmission layer 221 and the display panel 2112. Moreover, the transmission layer 221 is arranged inside the first module stack 2111, and part of the first module stack 2111 is located between the transmission layer 221 and the display panel 2112. This can solve the mold printing problem of the display module. Part of the first module stack 2111 makes it difficult for the wiring of the transmission layer 221 to produce mold printing. In a specific embodiment, the part of the first module stack 2111 located at the bottom of the transmission layer 221 can be copper foil, which has an anti-static function by covering the bottom surface of the transmission layer 221 with copper foil. In a specific embodiment, the part of the first module stack 2111 located on the top of the transmission layer 221 (between the transmission layer 221 and the display panel 2112) includes a hard material. The hard material can be, but is not limited to: carbon fiber or cemented carbide material. The cemented carbide material can be, but is not limited to: 304 alloy or Ti alloy.

[0087] In the embodiment shown in FIG11 , the wiring connection structure 222 extends from the edge of the transmission layer 221. The wiring connection structure 222 and the transmission layer 221 can be an integrated structure, that is, they are integrally formed using the manufacturing process of the display module. This can be understood as follows: the wiring connection structure 222 and the transmission layer 221 can be manufactured simultaneously using a process similar to that of circuit board manufacturing. The wire portions on the wiring connection structure 222 and the wire portions on the transmission layer 221 can be arranged on the same layer and formed in a single step.

[0088] FIG12 is a schematic cross-sectional view of a display module provided in accordance with one embodiment of the present application. Referring to FIG12 in conjunction with the embodiment shown in FIG11 , the connection location between the wiring connection structure 222 and the transmission layer 221 is located within the area surrounded by the edge of the transmission layer 221. In one possible implementation, the transmission layer 221 is located within the first module stack 2111, with a portion of the first module stack 2111 covering the side of the transmission layer 221 facing away from the display panel 2112. For ease of description, the first module stack 2111 covering the side of the transmission layer 221 facing away from the display panel 2112 is referred to as the bottom substrate 2111B. The wiring connection structure 222 passes through the bottom substrate 2111B and connects to the transmission layer 221. In one possible implementation, the bottom substrate 2111B is provided with a window 11H, through which the transmission lines of the transmission layer 221 are exposed. The location of the exposed transmission lines may be a conductive structure. During the fabrication process, a portion of the wiring connection structure 222 is placed within the window 11H, and the wiring connection structure 222 is electrically connected to the conductive structure on the transmission layer 221 at the bottom of the window 11H. As shown in Figure 12, a portion of the wiring connection structure 222 is positioned within the window 11H and aligned with the transmission layer 221.

[0089] Figure 13A is a schematic plan view of the main body of an electronic device provided in one embodiment, and Figure 13B is a schematic plan view of the display module of an electronic device provided in one embodiment. Referring to Figures 13A and 13B, the electronic device provided in this embodiment is a foldable device. The main body 10 includes a first body 1, a second body 2, and a hinge 3 connected between the first body 1 and the second body 2. The first body 1 contains a main board and a battery, while the second body contains a sub-board and a battery. The laminated structure 23 of the display module 20 includes a first portion 201, a second portion 203, and a connecting portion 202 connected therebetween. The area within the dashed line in Figure 13B represents the connecting portion 202, which deforms during the folding or unfolding of the electronic device. The display connecting structure 212 of the display module 20 is connected to the second portion 203. In one possible implementation, the display connecting structure 212 is located at an edge of the second portion 203 opposite the connecting portion 202. The two wiring connection structures 222 of the display module 20 are respectively connected to the first part 201 and the second part 203. In one possible implementation, the wiring connection structure 222 connected to the second part 203 is located at the top edge of the second part 203, and the top edge of the second part 203 is connected between the hinge and the edge where the display connection structure 212 is located. The wiring connection structure 222 connected to the first part 201 is located at the top edge of the first part 201, and the top edge of the first part 201 and the top edge of the second part 203 are collinear. The display connection structure 212 includes a connector C1, the wiring connection structure 222 located in the second part 203 includes a connector C2, and the wiring connection structure 222 located in the first part 201 includes a connector C3. Connectors C1' and C2' are provided on the sub-board within the device body 10, and connector C3' is provided on the main board within the device body 10.

[0090] FIG14A is a schematic diagram illustrating the assembly of the device body shown in FIG13A and the display module shown in FIG13B . Combining FIG13A , FIG13B , and FIG14A , after the display module 20 is assembled to the device body 10, the connector C1 of the display connection structure 212 is plugged into the connector C1' on the secondary board, the connector C2 of the wiring connection structure 222 located within the second portion 203 is plugged into the connector C2' on the secondary board, and the connector C3 of the wiring connection structure 222 located within the first portion 201 is plugged into the connector C3' on the primary board. The dotted line within the display module 20 in FIG14A represents the transmission layer 221, which is electrically connected between the two opposing wiring connection structures 222. In one embodiment, the primary heat source within the device body 10 is the primary heat source. Because the primary heat source is located within the first body 1, the heat generated within the first body 1 is greater than that within the second body 2. Since the display connection structure 212 of the display module 20 is also a heat-generating device in the working state, in a possible implementation, a heat-generating device DDIC (Display Driver IC) is provided on the display connection structure 212. The display module provided in one embodiment of the present application connects the display connection structure 212 to the sub-board, so that the heat generated by the DDIC on the display connection structure 212 is distributed within the second body 2. This is conducive to balancing the heat distribution on the first body 1 and the second body 2, and can avoid the concentrated heat generated by the connection of the display connection structure 212 to the main board, and can avoid the user experience being affected by the excessive temperature of some areas of the electronic device. Moreover, distributing the heat in different bodies is also conducive to improving the heat dissipation capacity of the electronic device. The display module provided in one embodiment of the present application can realize the electrical connection between the device 1 6 on the sub-board and the device 2 7 on the main board through the integrated wiring part in the display module 20.

[0091] The DDIC on the display connection structure 212 needs to be electrically connected to the SOC on the mainboard to achieve interaction between the DDIC and the SOC. The present application can achieve electrical connection between the DDIC and the SOC through the integrated wiring part of the display module 20.

[0092] Since device one 6 and device two 7 are distributed on both sides of the rotating shaft, the display module provided in one embodiment of the present application realizes the electrical connection between device one 6 and device two 7 through the integrated wiring part in the display module 20, and there is no need to set up a large number of transmission lines in the device body 10, which is conducive to the thin design of the electronic device and avoids the structural complexity of the rotating shaft and the increase in design cost caused by the transmission line passing through the rotating shaft in the device body 10.

[0093] Since the signal transmission between device 1 and device 2 in the device body 10 is realized through the integrated wiring part in the display module, the space in the device body 10 can be saved, which is conducive to the thin design of the electronic device. The display module provided in one embodiment of the present application can also improve the capacitance of the electronic device, because the structure of the transmission line in the device body is integrated in the display module, which can increase the flexibility of the overall design of the electronic device. There is no need to set the transmission line in the thickness direction of the battery, and the thickness of the battery can be increased. In other words, part of the space originally used for the transmission line in the device body is supplied to the battery, so that the battery can have a larger capacity and increase the battery life.

[0094] Figure 14B is a schematic diagram illustrating how a transmission line within the device body electrically connects a device within the first body to a device within the second body. As shown in Figure 14B , since the transmission line 9 is disposed within the device body 10, it occupies internal space within the device body 10, complicating the structure within the device body 10 and hindering a slim design. Transmission line 9 must pass through the shaft 3 to electrically connect the devices within the first body 1 and the devices within the second body 2. This requires designing a hole 301 in the shaft 3 for the transmission line 9 to pass through. The design process requires consideration of factors such as the reliability of the shaft 3 and the stability of the electronic product's shape after bending, increasing design costs.

[0095] Figures 15, 16, 17, 18, 19, and 20 are schematic diagrams of display modules provided in different embodiments. In these embodiments, the display connection structure and at least two wiring connection structures are connected to the edge of the stacked structure. The specific description of each embodiment is as follows.

[0096] Referring to Figure 15 , in one embodiment, the first portion 201 and the second portion 203 of the display module 20 are both rectangular. The laminated structure 23 includes a first side E1 and a third side E3, which are arranged opposite each other. The first side E1 is the longer side of the first portion 201, and the third side E3 is the longer side of the second portion 203. In one possible implementation, a display connection structure 212 is connected to the first side E1. One of the wiring connection structures 222 is connected to the first side E1, and another wiring connection structure 222 is connected to the third side E3. The display connection structure 212 and the wiring connection structure 222 partially overlap.

[0097] In conjunction with the embodiment shown in FIG15 , referring to FIG16 , the display connection structure 212 connected to the first side E1 and the wiring connection structure 222 connected to the first side E1 are arranged side by side and do not overlap. The display connection structure 212 is located in the center region of the first side E1, while the wiring connection structure 222 is located at the edge region of the first side E1. The wiring connection structure 222 is located between the bottom edge of the display connection structure 212 and the bottom end of the first side E1, and a gap is provided between the wiring connection structure 222 and the display connection structure 212 along the extension direction of the first side E1. The provision of this gap facilitates the bending and assembly of the wiring connection structure 222 and the display connection structure 212 without interference during assembly of the display module and the device body. In the embodiment shown in FIG15 , the wiring connection structure 222 connected to the third side E3 is adjacent to the top end of the third side E3, and the distance between the wiring connection structure 222 and the bottom end of the third side E3 is greater than the distance between the wiring connection structure 222 and the top end of the third side E3.

[0098] In conjunction with the embodiment shown in FIG16 , referring to FIG17 , the position of the routing connection structure 222 connected to the second portion 203 is different. Referring to FIG17 , in one possible implementation, the routing connection structure 222 is not connected to the third side E3 of the laminated structure 23. The laminated structure 23 includes a second side E2, a portion of which constitutes a short side of the second portion 203, and a portion of which constitutes a short side of the first portion 201. The routing connection structure 222 connected to the second portion 203 is connected to the second side E2. In one possible implementation, along the extension direction of the second side E2, the distance between the routing connection structure 222 connected to the second portion 203 and the third side E3 is less than the distance between the routing connection structure 222 connected to the second portion 203 and the connecting portion 202.

[0099] In conjunction with the embodiment shown in FIG17 , referring to FIG18 , the positions of the routing connection structures 222 connected to the first portion 201 are different. Referring to FIG18 , in one possible implementation, the routing connection structures 222 connected to the first portion 201 are connected to the second edge E2. The two routing connection structures 222 are located on the same side of the stacked structure 23, and both routing connection structures 222 are connected to the second edge E2. In a specific embodiment, the two routing connection structures 222 are symmetrically distributed on either side of the connecting portion 202.

[0100] In conjunction with the embodiment shown in FIG18 , referring to FIG19 , the wiring connection structure 222 connected to the second portion 203 is connected to the third side E3. In one possible implementation, the wiring connection structure 222 connected to the second portion 203 is located on the third side E3 adjacent to the second side E2, and the wiring connection structure 222 connected to the second portion 203 is close to the top of the second portion 203.

[0101] In conjunction with the embodiment shown in FIG19 , referring to FIG20 , the position of the wiring connection structure 222 connected to the second portion 202 is different. Referring to FIG20 , in one possible implementation, the wiring connection structure 222 connected to the second portion 203 is connected to the fourth side E4. The fourth side E4 is the bottom side of the stacked structure 23. The fourth side E4 is positioned opposite the second side E2, and the wiring connection structure 222 connected to the first portion 201 is connected to the second side E2.

[0102] Figure 21 is a schematic plan view of a stacked structure 23 according to one embodiment. In the embodiment shown in Figure 21 , a connection structure 212 is connected to an edge of the stacked structure 23, and at least two routing connection structures 222 are connected to the interior of the stacked structure 23. The rectangular boxes in Figure 21 indicate the connection locations between the routing connection structures 222 and the stacked structure 23; however, the rectangular boxes do not represent the specific configuration of the routing connection structures 222.

[0103] Figure 22 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application. Referring to Figure 22, in one possible implementation, the laminated structure 23 includes a first module laminate 2111, a transmission layer 221, a display panel 2112, and a second module laminate 2113 stacked in sequence. The transmission layer 221 and the display panel 2112 are adhered by an adhesive layer 231. The transmission layer 221 and the first module laminate 2111 are adhered by an adhesive layer 232. In one possible implementation, the transmission layer 221 includes a substrate layer 2211 and a wiring layer 2212. During the production process of the display module, the transmission layer 221 is produced separately. In the process of producing the transmission layer 221, a metal layer is laid on the surface of the substrate layer 2211 and patterned to form the wiring layer 2212. After the transmission layer 221 is produced, it is attached to the surface of the first module laminate 2111. In one possible implementation, the routing layer 2212 is oriented toward the first module stack 2111, and the transmission layer 221 and the first module stack 2111 are adhered and fixed via an adhesive layer 232. The adhesive layer 232 encapsulates the routing layer 2212 on the bottom surface of the substrate layer 2211 (the surface of the substrate layer 2211 facing the first module stack 2111). In one embodiment of the present application, the routing layer 2212 of the display module provided is formed on the bottom surface of the substrate layer 2211, thereby ensuring the flatness of the top surface of the substrate layer 2211 and reducing the display module imprinting phenomenon introduced by the routing layer 2212 of the transmission layer 221.

[0104] Referring to Figure 22, in one possible implementation, the routing connection structure 222 includes a stacked substrate layer 2221, a routing layer 2222, and a protective layer 2223, with the routing layer 2222 located between the substrate layer 2221 and the protective layer 2223. The protective layer 2223 and the adhesive layer 231 can be made of the same material and can be formed on the surface of the routing layer 2222 through the same manufacturing process. In a specific embodiment, the routing connection structure 222 and the transmission layer 221 are an integrally formed structure, that is, the routing connection structure 222 and the transmission layer 221 are manufactured simultaneously during the process of manufacturing the integrated routing portion through the circuit board manufacturing process. The substrate layer 2221 of the routing connection structure 222 and the substrate layer 2211 of the transmission layer 221 are the same layer structure. In one possible implementation, the substrate layer 2221 of the routing connection structure 222 and the substrate layer 2211 of the transmission layer 221 can have the same material, the same thickness, and the same manufacturing process. The routing layer 2222 of the routing connection structure 222 and the routing layer 2212 of the transmission layer 221 are the same layer structure. Similarly, the two can have the same material, the same thickness, and the same manufacturing process.

[0105] In one embodiment, the steps of the manufacturing process of the integrated routing portion shown in Figure 22 include: manufacturing a substrate layer (including a substrate layer 2211 of the transmission layer and a substrate layer 2221 of the routing connection structure); manufacturing the routing layer 2212 of the transmission layer and the routing layer 2222 of the routing connection structure on the surface of the substrate layer, wherein the routing layer 2222 of the routing connection structure 222 and the routing layer 2212 of the transmission layer 221 constitute a continuous transmission line; manufacturing an adhesive layer 232 and a protective layer 2223 of the routing connection structure, wherein the surface of the adhesive layer 232 and the surface of the protective layer 2223 can constitute a flat surface. In one embodiment, the first module stack 2111 can be further manufactured on the adhesive layer 232 of the manufactured integrated routing portion. Alternatively, the adhesive layer of the integrated routing portion and the first module stack 2111 can be glued and fixed together by a gluing process.

[0106] Figure 23 is a schematic cross-sectional view of a display module provided in one embodiment of the present application. In the display module provided in one embodiment of the present application, the position of the transmission layer 221 in the laminate structure 23 is the same as in the embodiment shown in Figure 22 , being located between the first module laminate 2111 and the display panel 2112. The embodiment shown in Figure 23 differs from the embodiment shown in Figure 22 in the specific structures of the transmission layer 221 and the wiring connection structure 222. Referring to Figure 23 , in the display module provided in one embodiment of the present application, the transmission layer 221 includes a substrate layer 2211 and a wiring layer 2212, with the wiring layer 2212 disposed on one side of the substrate layer 2211 and the other side of the substrate layer 2211 being a flat surface. During the placement of the transmission layer 221 on the first module laminate 2111, the flat surface of the substrate layer 2211, not provided with the wiring layer 2212, faces the first module laminate 2111. This flat surface is adhered to the first module laminate 2111 via an adhesive layer 232. In a display module provided in one embodiment of the present application, the transmission layer 221 further includes a flattening layer 2213. The flattening layer 2213 covers the surface of the routing layer 2212 and fills the gaps formed by the routing layer 2212 on the substrate layer 2211. The flattening layer 2213 is used to ensure that the surface of the transmission layer 221 supporting the display panel 2112 is flat, thereby reducing the display module imprint caused by the routing layer 2212 of the transmission layer 221. The flattening layer 2213 is adhered to the display panel 2112 via the adhesive layer 231.

[0107] In the embodiment shown in Figure 23, the routing connection structure 222 includes a stacked substrate layer 2221, a routing layer 2222, and a protective layer 2223, with the routing layer 2222 located between the substrate layer 2221 and the protective layer 2223. The protective layer 2223 and the flat layer 2213 can be made of the same material and can be formed on the surface of the routing layer 2222 through the same manufacturing process. In a specific embodiment, the routing connection structure 222 and the transmission layer 221 are an integrally formed structure, that is, the routing connection structure 222 and the transmission layer 221 are manufactured simultaneously during the process of manufacturing the integrated routing portion through the circuit board manufacturing process. The substrate layer 2221 of the routing connection structure 222 and the substrate layer 2211 of the transmission layer 221 are the same layer structure. In one possible implementation, the substrate layer 2221 of the routing connection structure 222 and the substrate layer 2211 of the transmission layer 221 can have the same material, the same thickness, and the same manufacturing process. The routing layer 2222 of the routing connection structure 222 and the routing layer 2212 of the transmission layer 221 are the same layer structure. Similarly, the two can have the same material, the same thickness, and the same manufacturing process.

[0108] In one embodiment, the steps of the manufacturing process of the integrated routing portion shown in Figure 23 may be: manufacturing a substrate layer (including a substrate layer 2211 of the transmission layer and a substrate layer 2221 of the routing connection structure); manufacturing the routing layer 2212 of the transmission layer and the routing layer 2222 of the routing connection structure on the surface of the substrate layer, and the routing layer 2222 of the routing connection structure 222 and the routing layer 2212 of the transmission layer 221 constitute a continuous transmission line; manufacturing a flat layer 2213 and a protective layer 2223 on the surface of the continuous transmission line, the flat layer 2213 covers the routing layer 2212 of the transmission layer 221, and the protective layer 2223 covers the routing layer 2222 of the routing connection structure 222, and the surface of the flat layer 2213 and the surface of the protective layer 2223 can constitute a continuous and flat surface. In one embodiment, the substrate layer 2211 of the transmission layer 221 is adhered to the surface of the first module stack 2111 through the adhesive layer 232 , and the display panel 2112 is adhered to the surface of the flat layer 2213 through the adhesive layer 231 .

[0109] Referring to Figures 22 and 23, in one embodiment, one wiring connection structure 222 and the display connection structure 212 are located on the same side of the stacked structure 23, and the wiring connection structure 222 and the display connection structure 212 on the same side of the stacked structure 23 are respectively connected to different flexible circuit boards. In one possible implementation, the display connection structure 212 is provided with a DDIC (display driver IC) for driving the display panel 2112. The display connection structure 212 is connected to the flexible circuit board F2, and the flexible circuit board F2 enables electrical connection between the display panel 2112 and the control unit within the electronic device, as well as between the DDIC and the control unit within the electronic device. The wiring connection structure 222 is connected to the flexible circuit board F1 and, through the flexible circuit board F1, is electrically connected to device 1 within the electronic device. The other wiring connection structure 222 is connected to the flexible circuit board F3 and, through the flexible circuit board F3, is electrically connected to device 2 within the electronic device. Therefore, the display module provided in one embodiment of the present application can be electrically connected between device 1 and device 2 via the transmission layer 221, enabling signal transmission between devices 1 and 2.

[0110] Figures 24, 25 and 26 are schematic diagrams of a solution in which the routing connection structure and the display connection structure located on the same side of the stacked structure share a flexible circuit board. Figures 25 and 26 are cross-sectional schematic diagrams of the shared flexible circuit board solution. Figure 24 is a plan schematic diagram of the shared flexible circuit board solution shown in Figures 25 and 26.

[0111] Referring to FIG. 24 , in one embodiment, a wiring connection structure 222 and a display connection structure 212 are located on the same side of the stacked structure 23, side by side, with wiring connection structure 222 located below display connection structure 212. A portion of the flexible circuit board F4 is connected to wiring connection structure 222, while another portion of the flexible circuit board F4 is connected to display connection structure 212.

[0112] The embodiment shown in FIG25 provides a display module with a transmission layer 221 whose structure and position within the stacked structure 23 are identical to those of the embodiment shown in FIG23 . The embodiment shown in FIG25 differs from the embodiment shown in FIG23 in that the wiring connection structure 222 and the display connection structure 212, located on the same side of the stacked structure 23, share a common flexible circuit board F4. Referring to FIG25 , the connection between the wiring connection structure 222 and the flexible circuit board F4 is located on the top surface of the flexible circuit board F4, as is the connection between the display connection structure 212 and the flexible circuit board F4. The flexible circuit board F4 is used to connect to device one, while the flexible circuit board F3 is used to connect to device two. Signal transmission between device one and device two is achieved through the sequential connection of the flexible circuit board F4, one of the wiring connection structures 222, the transmission layer 221, the other wiring connection structure 222, and the flexible circuit board F3.

[0113] The embodiment shown in FIG26 provides a display module with a transmission layer 221 whose structure and position within the stacked structure 23 are identical to those of the embodiment shown in FIG22 . The embodiment shown in FIG26 differs from the embodiment shown in FIG22 in that the wiring connection structure 222 and the display connection structure 212, located on the same side of the stacked structure 23, share a common flexible circuit board F4. Referring to FIG26 , the portion where the wiring connection structure 222 connects to the flexible circuit board F4 is located on the lower surface of the flexible circuit board F4, while the portion where the display connection structure 212 connects to the flexible circuit board F4 is located on the upper surface of the flexible circuit board F4. The wiring connection structure 222 and the display connection structure 212 are respectively secured to opposite sides of the flexible circuit board F4. The flexible circuit board F4 is used to connect to device one, while the flexible circuit board F3 is used to connect to device two. Signal transmission between device one and device two is achieved through the sequential connection of the flexible circuit board F4, one of the wiring connection structures 222, the transmission layer 221, the other wiring connection structure 222, and the flexible circuit board F3.

[0114] Figure 27 is a cross-sectional schematic diagram of a display module provided in one embodiment of the present application. Referring to Figure 27, in one possible implementation, the transmission layer 221 is located between the first module stack 2111 and the display panel 2112. The transmission layer 221 has a structure having two wiring layers. In other embodiments, the transmission layer 221 may also include three or more wiring layers, which can be understood as the transmission layer 221 can be a structure similar to a multi-layer flexible circuit board. In the embodiment shown in Figure 27, the transmission layer 221 includes a substrate layer 2211, two wiring layers 2212, and two flat layers 2213. One of the two wiring layers 2212 is located on the top surface of the substrate layer 2211, and the other is located on the bottom surface of the substrate layer 2211. The two wiring layers 2212 are electrically connected through conductive holes or conductive columns that pass through the substrate layer 2211. One of the two flat layers 2213 covers the routing layer 2212 located on the top surface of the substrate layer 2211, and the other of the two flat layers 2213 covers the routing layer 2212 located on the bottom surface of the substrate layer 2211. The stacked structure 23 has a first window 11H1 and a second window 11H2. In one possible implementation, the first window 11H1 and the second window 11H2 penetrate the first module stack 2111 and the flat layer 2213 adjacent to the first module stack 2111. One of the two routing connection structures 222 is electrically connected to the routing layer 2212 of the transmission layer 221 within the first window 11H1, and the other of the two routing connection structures 222 is electrically connected to the routing layer 2212 of the transmission layer 221 within the second window 11H2.

[0115] The present application provides windows (first window 11H1 and second window 11H2) on the laminated structure 23, and connects the wiring connection structure 222 to the transmission layer 221 within the windows, thereby facilitating a large screen-to-body ratio for the display module. If the wiring connection structure 222 were located at the edge of the laminated structure 23, it would occupy space outside the edge of the laminated structure 23, resulting in a large black border around the edge of the electronic device's display screen.

[0116] In the embodiment shown in Figure 27 , the display connection structure 212 is connected to a flexible circuit board F, enabling signal transmission between the display panel 2112 and a control unit in the electronic device via the flexible circuit board F. The two trace connection structures 222 can also be flexible circuit boards. One of the trace connection structures 222 connects to component 1, and the other connects to component 2. Signal transmission between components 1 and 2 is achieved via a transmission layer 221.

[0117] Figure 28 is a schematic cross-sectional view of a display module provided in one embodiment of the present application. Referring to Figure 28 , in one possible implementation, the transmission layer 221 has a single-layer routing layer architecture. The transmission layer 221 includes a substrate layer 2211 and a routing layer 2212. The routing layer 2212 is formed on the surface of the substrate layer 2211. The adhesive layer 232 covers the routing layer 2212 and is connected to the first module stack 2111. The laminate structure 23 has a first window 11H1 and a second window 11H2. In one possible implementation, the first window 11H1 and the second window 11H2 extend through the first module stack 2111 and the adhesive layer 232. One of the two routing connection structures 222 is electrically connected to the routing layer 2212 of the transmission layer 221 within the first window 11H1, and the other of the two routing connection structures 222 is electrically connected to the routing layer 2212 of the transmission layer 221 within the second window 11H2.

[0118] Figure 29 is a schematic cross-sectional view of a stacked structure of a display module provided in one embodiment of the present application. Referring to Figure 29 , the stacked structure 23 includes a first module stack 2111, a transmission layer 221, a display panel 2112, and a second module stack 2113, stacked in sequence. The display panel 2112 includes a substrate layer 21123, a shielding layer 21122, and a panel functional layer 21121, stacked in sequence. The shielding layer 21122 comprises a conductive material. The transmission layer 221 is positioned between the first module stack 2111 and the substrate layer 21123 of the display panel 2112. The transmission layer 221 includes a substrate layer 2211, a routing layer 2212, and a flat layer 2213. The routing layer 2212 is formed on the surface of the substrate layer 2211 facing the display panel 2112. The routing layer 2212 of the transmission layer 221 is a patterned design formed on the surface of the substrate layer 2211. The flat layer 2213 covers the routing layer 2212 and constructs a flat surface for supporting the display panel 2112. The flat layer and the base material layer 21123 of the display panel 2112 are adhered to each other by an adhesive layer 231. The conductive material of the shielding layer 21122 at least partially isolates the signals between the routing layer 2212 of the transmission layer 221 and the panel function layer 21121 of the display panel 2112, thereby reducing signal interference between the routing layer 2212 and the panel function layer 21121. A display module provided in one embodiment of the present application uses a shielding layer 21122 to isolate signal interference between the routing layer 2212 in the transmission layer 221 and the panel function layer 21121. It has a high degree of integration and does not require a metal shielding layer in the transmission layer 221, which is conducive to achieving thinness of electronic equipment.

[0119] In one embodiment, the conductive material of the shielding layer 21122 covers the entire surface of the substrate layer 21123. The shielding layer 21122 may be made of a metal material. The display module provided in one embodiment of the present application does not require patterning of the shielding layer 21122, making it easy to manufacture and low in cost.

[0120] In one embodiment, the shielding layer 21122 is a patterned conductive layer structure. The specific shape of the pattern of the shielding layer 21122 can be set according to the pattern of the routing layer of the transmission layer. The patterned conductive layer structure of the shielding layer can be wider than the patterned conductive structure of the routing layer of the transmission layer, and the patterned conductive layer structure of the shielding layer can completely cover the patterned conductive structure of the routing layer of the transmission layer.

[0121] In one embodiment, the thickness of the substrate layer 2211 of the transmission layer 221 is in the range of 10um to 50um. For example, in one specific embodiment, the thickness of the substrate layer 2211 is 25um. The thickness of the substrate layer 2211 of the display module provided in one embodiment of the present application is constrained within an appropriate range. For a display module with a bending function, if the substrate layer is too thick, exceeding 50um, it will affect the effect of the display module and the user experience. If the substrate layer is too thin, less than 10um, the manufacturing process of the transmission layer 221 is more difficult, it is difficult to ensure the yield of the product, and the manufacturing cost is also higher.

[0122] In one embodiment, the elastic modulus of the substrate layer 2211 of the transmission layer 221 is in the range of 2.5 GPa to 9 GPa. In one embodiment, the elongation at break of the substrate layer 2211 of the transmission layer 221 is required to be greater than 5%. The elastic modulus and elongation at break of the substrate layer of the display module provided in one embodiment of the present application are constrained within appropriate ranges to meet the bending performance of the display module. The elastic modulus range of 2.5 GPa to 9 GPa and the elongation at break requirement of greater than 5% both ensure that the display module has good bending performance. It can also meet the impedance requirements of signal transmission.

[0123] In one embodiment, the thickness range of the routing layer 2212 of the transmission layer 221 is: 3um-10um. The thickness of the routing layer of the display module provided in one embodiment of the present application is constrained within a suitable range, which can satisfy the display module with good bending performance. Moreover, constraining the thickness of the routing layer 2212 within the range of 3um-10um is also conducive to solving the mold printing problem of the display module. If the routing layer 2212 is too thick, it will not only affect the overall thickness of the display module, which is conducive to a thin design, and affect the bending performance, but also produce mold printing. The mold printing can be understood as the line imprint of the routing layer being visible on the light-emitting surface of the display module, affecting the user experience of the electronic device. In a possible implementation method, the routing layer 2212 is made of copper, and the elongation at break of the routing layer 2212 is required to be greater than 5%.

[0124] In one embodiment, as shown in FIG29 , the first module stack 2111 includes a second sub-stack 21111, a spacer layer 21113, and a first sub-stack 21112. Both the first sub-stack 21112 and the second sub-stack 21111 are metal layers, but are made of different materials. For example, the second sub-stack 21111 is made of Cu foil, while the first sub-stack 21112 is made of carbon fiber, 304 alloy, or Ti alloy. The second sub-stack 21111 is made of a flexible material and is used to form an electrostatic protection structure at the bottom of the stack structure 23 to prevent static electricity from entering the stack structure 23.

[0125] The spacer layer 21113 between the second sub-laminate 21111 and the first sub-laminate 21112 may be an adhesive layer. In a possible implementation, the second sub-laminate 21111 and the first sub-laminate 21112 are bonded together by the adhesive layer.

[0126] In the embodiment shown in Figure 29, the wiring connection structure 222 and the display connection structure 212 are both led out from the edge of the laminate structure 23. In one possible implementation, the display connection structure 212 is connected to the edge of the substrate layer 21123. The wiring connection structure 222 is connected to the edge of the wiring layer 2212. There is no need to set a window on the first module laminate 2111. The first module laminate 2111 completely covers the transmission layer to protect the circuit of the transmission layer 221. The wiring connection structure 222 of the display module provided in one embodiment of the present application is led out from the edge of the transmission layer 221, which can ensure the integrity of the laminate structure 23 composed of the display panel 2112 and the transmission layer 221. There is no need to lead the wiring connection structure 222 out by opening a window. Therefore, the display module provided in one embodiment of the present application can avoid the mold printing problem of the display module, which is conducive to ensuring the quality and reliability of the display module.

[0127] Figure 30 is a schematic cross-sectional view of the stacked structure of a display module provided in one embodiment of the present application. Referring to Figure 30 , in one possible implementation, the transmission layer 221 is located on the side of the first module stack 2111 facing away from the display panel 2112, i.e., the transmission layer 221 is located at the bottom of the first module stack 2111. The first sub-stack 21112 of the first module stack 2111 and the display panel 2112 are bonded together by an adhesive layer 231. A spacer layer 21113 is located between the first sub-stack 21112 and the second sub-stack 21111 of the first module stack 2111. The spacer layer 21113 may be an adhesive layer. The transmission layer 221 includes a substrate layer 2211 and a routing layer 2212. The substrate layer 2211 and the second sub-stack 21111 of the first module stack 2111 are bonded together by an adhesive layer 232. The wiring layer 2212 is stacked on the side of the substrate layer 2211 facing away from the first module stack 2111, and is located at the bottom of the substrate layer 2211. The display module also includes a bottom protective layer 2215, which is located on the side of the wiring layer 2212 facing away from the substrate layer 2211 and covers the wiring layer 2212. The display module has a first window 11H1 and a second window 11H2, which extend through the bottom protective layer 2215.

[0128] In one embodiment of the present application, by providing a first window 11H1 and a second window 11H2, the wiring connection structure can connect to the wiring layer of the transmission layer within the window, which is beneficial for achieving a small size at the edge of the display module and improving the screen-to-body ratio of the display module. Furthermore, the hard material of the first module laminate supports the display panel at the first and second windows. That is, at the window locations, the provision of the hard material of the first module laminate prevents mold printing issues, and maintains the quality and reliability of the display module.

[0129] Figure 31 is a schematic cross-sectional view of the laminated structure of a display module provided in one embodiment of the present application. Referring to Figure 31 , in one possible implementation, the transmission layer 221 is located on the side of the first module laminate 2111 facing away from the display panel 2112. The transmission layer 221 includes a substrate layer 2211 and a routing layer 2212. The routing layer 2212 is located on top of the substrate layer 2211, that is, between the substrate layer 2211 and the first module laminate 2111. The second sub-layer 21111 of the first module laminate 2111 of the routing layer 2212 is adhered via an adhesive layer 232. The substrate layer 2211 is the bottommost structure of the display module. The first window 11H1 and the second window 11H2 extend through the substrate layer 2211.

[0130] Figure 32 is a cross-sectional schematic diagram of the stacked structure of the display module provided in one embodiment of the present application. Referring to Figure 32, in one possible implementation, the transmission layer 221 is located on the side of the first module stack 2111 away from the display panel 2112. The transmission layer 221 includes a substrate layer 2211 and a routing layer 2212. The routing layer 2212 is located on top of the substrate layer 2211, that is, between the substrate layer 2211 and the first module stack 2111. The second sub-layer 21111 of the first module stack 2111 of the routing layer 2212 is adhered by an adhesive layer 232. In one embodiment of the present application, the display module is not provided with a window, and the substrate layer 2211 is provided with an electrical connection structure 2216. The electrical connection structure 2216 is electrically connected to the routing layer 2212, and the electrical connection structure 2216 is also used to connect the routing connection structure 222. In a possible implementation, the electrical connection structure 2216 is a structure such as a metal hole or a metal column in the substrate layer 2211 , and can be directly manufactured in the substrate layer 2211 through a circuit board manufacturing process.

[0131] Figure 33 is a schematic cross-sectional view of the stacked structure of a display module provided in one embodiment of the present application. Referring to Figure 33 , in one possible implementation, the transmission layer 221 is located between the second sub-layer 21111 and the first sub-layer 21112 of the first module stack 2111. The first sub-layer 21112 is located between the display panel 2112 and the transmission layer 221 and comprises the aforementioned hard material. The transmission layer 221 is located between the first sub-layer 21112 and the second sub-layer 21111. The second sub-layer 21111 is made of a flexible material and is used to form an electrostatic protection structure on the side of the transmission layer 221 facing away from the first sub-layer 21112. The transmission layer 221 includes a substrate layer 2211 and a routing layer 2212, with the routing layer 2212 located at the bottom of the substrate layer 2211. The substrate layer 2211 is bonded to the first sub-layer 21112 via an adhesive layer 232. The spacer layer 21113 of the first module stack 2111 is located between the second sub-stack 21111 and the routing layer 2212. The spacer layer 21113 may be a glue layer. The first window 11H1 and the second window 11H2 penetrate the second sub-stack 21111 and the spacer layer 21113.

[0132] In one embodiment of the present application, a first window 11H1 and a second window 11H2 are provided on the bottom side of the stacked structure 23, and the wiring connection structure 222 is connected to the wiring layer 2212 of the transmission layer 221 through the first window 11H1 and the second window 11H2. The first window 11H1 and the second window 11H2 pass through the second sub-stack 21111.

[0133] In one embodiment of the present application, the transmission layer is arranged between the second sub-layer and the first sub-layer of the first module stack, and the mold printing problem is solved by the hard material of the second sub-layer. The electrostatic protection provided by the first sub-layer can also protect the circuit of the transmission layer from the influence of static electricity, thereby ensuring the stability and security of the transmission signal of the display module.

[0134] In one embodiment, the first sub-layer 21112 is made of metal. The first sub-layer 21112 is used to shield signal interference between the transmission layer 221 and the display panel 2112, thereby ensuring the stability of the transmission signal of the display module.

[0135] In one possible implementation, the thickness of the first sub-laminate 21112 is 100 μm to 300 μm; the thickness of the second sub-laminate 21111 is 20 μm to 50 μm. Both the second sub-laminate 21111 and the first sub-laminate 21112 can be made of metal, and their thickness dimensions can determine whether they are rigid or flexible. In one embodiment of the present application, the first sub-laminate 21112 is designed to be rigid by constraining its thickness, and the second sub-laminate 21111 is designed to be flexible by constraining its thickness.

[0136] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: The display module is applied to an electronic device, the display module comprises a stacked display panel, a first module stack and a transmission layer, the first module stack is located on a side away from a light-emitting surface of the display panel, the first module stack comprises a first sub-stack, the first sub-stack is stacked between the transmission layer and the display panel, and the first sub-stack comprises a hard material; The display module also includes a display connection structure and at least two wiring connection structures. The display panel is electrically connected to the control unit of the electronic device through the display connection structure. The transmission layer is electrically connected to the at least two wiring connection structures. One of the at least two wiring connection structures is used to electrically connect the transmission layer and device one in the electronic device, and the other of the at least two wiring connection structures is used to electrically connect the transmission layer and device two in the electronic device, so that the transmission layer transmits signals between device one and device two.

2. The display module according to claim 1, characterized in that: The hard material of the first sub-laminate includes carbon fiber or cemented carbide material.

3. The display module according to claim 1 or 2, characterized in that: The display module has a first window and a second window; In the thickness direction of the display module, the first opening window and the second opening window are located on a side of the transmission layer away from the display panel, and the stacking direction of the display panel, the first module stack and the transmission layer is the thickness direction of the display module; One of the at least two routing connection structures is electrically connected to the routing layer of the transmission layer in the first opening, and the other of the at least two routing structures is electrically connected to the routing layer of the transmission layer in the second opening.

4. The display module according to claim 3, characterized in that: The first module stack also includes a second sub-stack, the second sub-stack and the first sub-stack are made of different materials, the transmission layer is located between the first sub-stack and the second sub-stack, the second sub-stack is made of flexible material and is used to form an electrostatic protection structure on the side of the transmission layer away from the first sub-stack, and the first window and the second window run through the second sub-stack.

5. The display module according to claim 4, characterized in that: The thickness of the first sub-layer is 100um-300um; the thickness of the second sub-layer is 20um-50um.

6. The display module according to claim 3, characterized in that: The first module stack is located between the transmission layer and the display panel, the transmission layer and the first module stack are adhered by an adhesive layer, the transmission layer includes a substrate layer and a wiring layer, the wiring layer is stacked between the substrate layer and the first module stack, and the first window and the second window penetrate the substrate layer.

7. The display module according to claim 3, characterized in that: The first module stack is located between the transmission layer and the display panel, the transmission layer includes a substrate layer and the wiring layer, the substrate layer and the first module stack are adhered by an adhesive layer, the wiring layer is located on the side of the substrate layer away from the first module stack, the display module also includes a bottom protective layer, the bottom protective layer is on the side of the wiring layer away from the substrate layer and covers the wiring layer, and the first window and the second window penetrate the bottom protective layer.

8. A display module, characterized in that: Applied to an electronic device, the display module includes a stacked transmission layer and a display panel, the transmission layer is located on a side away from the light-emitting surface of the display panel; the display module also includes a display connection structure and at least two wiring connection structures, the display panel is electrically connected to the control unit of the electronic device through the display connection structure, at least two of the wiring connection structures are connected to the edge of the transmission layer, one of the at least two wiring connection structures is used to electrically connect the transmission layer and device one in the electronic device, and the other of the at least two wiring connection structures is used to electrically connect the transmission layer and device two in the electronic device, so that the transmission layer transmits signals between device one and device two.

9. The display module according to claim 8, characterized in that: The display panel comprises a substrate layer, a shielding layer and a panel functional layer stacked in sequence, wherein the shielding layer comprises a conductive material; The transmission layer includes a routing layer, and at least partial isolation of signals is achieved between the routing layer and the panel functional layer through the conductive material of the shielding layer.

10. The display module according to claim 9, characterized in that: The conductive material of the shielding layer covers the entire surface of the base material layer.

11. The display module according to claim 9 or 10, characterized in that: The transmission layer includes a substrate layer, the routing layer is formed on the surface of the substrate layer, and the routing layer is adhered to the base material layer and / or the first module stack through an adhesive layer.

12. The display module according to claim 11, characterized in that: The thickness of the substrate layer ranges from 10um to 50um.

13. The display module according to claim 11 or 12, characterized in that: The elastic modulus of the substrate layer is in the range of 2.5 GPa to 9 GPa; and / or the elongation at break of the substrate layer is required to be greater than 5%.

14. The display module according to any one of claims 9 to 13, characterized in that: The thickness range of the routing layer is: 3um-10um.

15. The display module according to any one of claims 9 to 14, characterized in that: The display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure used to electrically connect the device one is connected to the first part, and the wiring connection structure used to electrically connect the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a second side arranged adjacent to each other, the first side is the long side of the first part, a part of the second side constitutes the short side of the first part, and a part of the second side constitutes the short side of the second part, the display connection structure is connected to the first side, and at least two of the wiring connection structures are connected to the second side.

16. The display module according to any one of claims 9 to 14, characterized in that: The display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure used to electrically connect the device one is connected to the first part, and the wiring connection structure used to electrically connect the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a third side arranged opposite to each other, the display connection structure is connected to the first side, one of the wiring connection structures is connected to the first side and is overlapped with the display connection structure, and the other of the wiring connection structures is connected to the third side.

17. The display module according to any one of claims 9 to 14, characterized in that: The display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure used to electrically connect the device one is connected to the first part, and the wiring connection structure used to electrically connect the device two is connected to the second part. The first part and the second part are both rectangular, and the transmission layer and the display panel constitute a stacked structure. The stacked structure includes a first side and a third side that are arranged opposite to each other. The display connection structure is connected to a first area of ​​the first side, and one of the wiring connection structures is connected to the second area of ​​the first side and is arranged side by side with the display connection structure, and the other of the wiring connection structures is connected to the third side.

18. The display module according to claims 9-14, characterized in that: The display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure for electrically connecting the device one is connected to the first part, and the wiring connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular. The transmission layer and the display panel constitute a stacked structure, and the stacked structure includes a first side. One of the wiring connection structures is connected to the first side, and the display connection structure is connected to the first side. The display connection structure and the wiring connection structure connected to the first side are respectively connected to different flexible circuit boards. The display connection structure is electrically connected to the control unit in the electronic device through the flexible circuit board, and the wiring connection structure realizes the conductive connection between the transmission layer and the device in the electronic device through the flexible circuit board.

19. The display module according to claims 9-14, characterized in that: The display module is applied to an electronic device with a folding function, and the display module can switch between a folded state and a flattened state. The display module includes a first part, a second part and a connecting part connected between the first part and the second part, and the connecting part is used to generate bending deformation during the switching process between the folded state and the flattened state. The wiring connection structure for electrically connecting the device one is connected to the first part, and the wiring connection structure for electrically connecting the device two is connected to the second part. The first part and the second part are both rectangular. The transmission layer and the display panel constitute a stacked structure, and the stacked structure includes a first side. One of the wiring connection structures is connected to the first side, and the display connection structure is connected to the first side. The display connection structure and the wiring connection structure connected to the first side are connected to different positions of the same flexible circuit board. The display connection structure is electrically connected to the control unit in the electronic device through the flexible circuit board, and the wiring connection structure realizes the conductive connection between the transmission layer and the device in the electronic device through the flexible circuit board.

20. The display module according to any one of claims 8 to 19, characterized in that: The display module further includes a first module stack, and the transmission layer is arranged between the display panel and the first module stack.

21. An electronic device, characterized in that: It comprises a device body and a display module as described in any one of claims 1-20, wherein the device body is provided with a control unit, device one and device two, the display module is connected to the device body, the display connection structure is electrically connected to the control unit, one of the wiring connection structures is electrically connected to the device one, and the other of the wiring connection structures is electrically connected to the device two.

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