Reuse determination device for semiconductor integrated circuit, reuse determination system, and reuse determination method

Abstract

The present invention uses monitoring statistic calculation data to map, on a graph, the normal state and the failure state of a semiconductor integrated circuit, calculates a reuse boundary for separating a region on the graph into a normal data group region and a failure data group region, and determines the reuse possibility of the semiconductor integrated circuit on the basis of the reuse boundary.

Description

Semiconductor integrated circuit reuse determination device, reuse determination system, and reuse determination method

[0001] The present invention relates to a reuse determination device, a reuse determination system, and a reuse determination method for a semiconductor integrated circuit.

[0002] As the trend toward reducing environmental impact grows, there is a demand for technology that allows semiconductor integrated circuits used inside electronic devices to be reused without being discarded. One such technology is a technology that estimates the deterioration of semiconductor integrated circuits during use. This technology allows for the efficient replacement of semiconductor integrated circuits by detecting their deterioration.

[0003] For example, in Patent Document 1, a means for determining the maximum operating frequency is incorporated into a semiconductor integrated circuit to be tested, and the amount of degradation is calculated based on the maximum operating frequency by monitoring it at any timing during use.

[0004] International Publication No. WO2011 / 115038

[0005] However, the technology of Patent Document 1 requires a monitor circuit for calculating the maximum operating frequency to be provided in the semiconductor integrated circuit to be tested, which makes it unsuitable for general use and unable to diagnose degradation of semiconductor integrated circuits currently on the market.

[0006] Furthermore, deterioration of semiconductor integrated circuits can occur due to a combination of factors such as HCI (Hot Carrier Injection), BTI (Bias Temperature Instability), and TDDB (Time Dependent Dielectric Breakdown), but some deterioration is recoverable.

[0007] For this reason, it is difficult to determine whether a semiconductor integrated circuit can be reused by simply calculating the amount of degradation, and inspections equivalent to the shipping inspection are required when determining whether the semiconductor integrated circuit can be reused. The need for such inspections increases the number of steps and costs, which can be an obstacle to improving the reusability of semiconductor integrated circuits.

[0008] An object of the present invention is to simply determine the reusability of a semiconductor integrated circuit.

[0009] A reuse determination device for a semiconductor integrated circuit according to one embodiment of the present invention is a reuse determination device having a reuse determination unit that determines the reusability of a semiconductor integrated circuit, wherein the reuse determination unit determines the state of the semiconductor integrated circuit using monitor data of the semiconductor integrated circuit using a processor, and if the state of the semiconductor integrated circuit is determined to be faulty, recycles or discards the semiconductor integrated circuit, and if the state of the semiconductor integrated circuit is determined to be normal, calculates statistical values ​​of the monitor data to obtain monitor statistical calculation data, uses the monitor statistical calculation data to map the normal state and the faulty state of the semiconductor integrated circuit on a graph, calculates a reuse boundary that separates an area on the graph into a normal data group area indicating the normal state and a faulty data group area indicating the faulty state, and determines the reusability of the semiconductor integrated circuit based on the reuse boundary.

[0010] According to one aspect of the present invention, the reusability of a semiconductor integrated circuit can be easily determined.

[0011] FIG. 1 is a schematic diagram showing an example of a system configuration of a reuse determination system. FIG. 1 is a schematic diagram showing an example of a hardware configuration of a reuse determination system according to Example 1. FIG. 2 is a schematic diagram showing an example of an electronic device configuration. FIG. 3 is a schematic diagram showing an example of monitor data. FIG. 4 is a schematic diagram showing an example of monitor data. FIG. 5 is a schematic diagram showing an example of rated data. FIG. 6 is a schematic diagram showing an example of rated data. FIG. 7 is a schematic diagram showing an example of classification data and a reuse boundary according to Example 1. FIG. 8 is a schematic diagram showing an example of classification data and a reuse boundary according to Example 1. FIG. 9 is a flowchart showing an example of a process for determining reusability according to Example 1. FIG. 10 is a flowchart showing an example of a process for calculating classification data and a reuse boundary according to Example 1. FIG. 11 is a schematic diagram showing an example of a hardware configuration of a reuse determination system according to Example 2. FIG. 12 is a schematic diagram showing an example of classification data and a reuse boundary according to Example 2. FIG. 13 is a flowchart showing an example of a process for determining reusability according to Example 2.

[0012] Hereinafter, the embodiments will be described with reference to the drawings. In all the drawings for explaining the embodiments, the same components are generally designated by the same reference numerals, and repeated description thereof will be omitted as appropriate.

[0013] Furthermore, it goes without saying that in the following examples, the components (including element steps, etc.) are not necessarily essential unless otherwise specified or unless they are clearly considered essential in principle.

[0014] Furthermore, when it is said that "consists of A," "is made of A," "has A," or "includes A," it goes without saying that it does not exclude other elements, unless it is specifically stated that only those elements are included.

[0015] Similarly, in the following examples, when referring to the shape, positional relationship, etc. of components, etc., it includes things that are substantially similar or similar to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0016] 1 is a schematic diagram showing an example of the system configuration of a reuse determination system, which is a system for determining the reusability of a semiconductor integrated circuit, and includes a computer 1 and electronic devices 3a to 3n.

[0017] The computer 1 is a computer that determines reusability and presents the reusability determination results to a user via a GUI (Graphical User Interface) or the like. The electronic devices 3a to 3n are intended as equipment or edge devices such as industrial equipment, IT equipment, medical equipment, etc., and are devices equipped with semiconductor integrated circuits that are the subject of the reusability determination. The computer 1 and the electronic devices 3a to 3n are connected to each other via a network (communication line) 2 such as the Internet or a LAN (Local Area Network).

[0018] FIG. 2 is a schematic diagram illustrating an example of a hardware configuration of the reuse determination system according to the first embodiment.

[0019] The electronic devices 3a to 3n are systems that include monitor modules 30a to 30n and semiconductor integrated circuits 31a to 31n.

[0020] The monitor modules 30a to 30n are modules that include sensors that measure the voltages and temperatures of the semiconductor integrated circuits 31a to 31n, and processors such as a CPU (Central Processing Unit) for controlling the sensors. Note that the monitor circuits such as the voltmeter and thermometer may notify the calculator 1 using internal functions of the semiconductor integrated circuits 31a to 31n. The monitor modules 30a to 30n have a configuration that is common to the semiconductor integrated circuits 31a to 31n.

[0021] The semiconductor integrated circuits 31a to 31n are processors such as CPUs (Central Processing Units) and FPGAs (Field Programmable Gate Arrays) for realizing the functions of the electronic devices 3a to 3n, and are components whose reusability is to be determined.

[0022] In order for the computer 1 to generate, transmit, receive data and perform various other processes, the processor 10 reads a processing program stored in the memory resource 13, and the processor 10 executes processing according to the processing program.

[0023] The computer 1 may be, for example, a personal computer, a tablet computer, a smartphone, a server computer, a blade server, or a cloud server, or may be a system including at least one of these computers. That is, the computer 1 also includes a system including, for example, a cloud server and a display computer (for example, a tablet computer or a smartphone). Another example of the computer 1 is a controller that controls or manages some device including the processor 10 and memory resource 13.

[0024] 2, the computer 1 has one or more processors 10, one or more UI (User Interface) devices 11, one or more NI (Network Interface) devices 12, and one or more memory resources 13. The computer 1 may also include components other than these. The processors 10, the UI devices 11, the NI devices 12, and the memory resources 13 are connected to one another via a bus 14.

[0025] The processor 10 is an arithmetic device that reads the reuse determination program 15 stored in the memory resource 13 and executes each process of the reuse determination method. The processor 10 is, for example, a microprocessor, a CPU, a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), a quantum processor, or any other semiconductor device capable of performing calculations.

[0026] The UI device 11 is an input device for inputting instructions from a user (or an operator) to the computer 1 and an output device for outputting information generated by the computer 1. Examples of input devices include a keyboard, a touch panel, a pointing device such as a mouse, and a voice input device such as a microphone.

[0027] The output device may be, for example, a display, a printer, or a voice synthesizer. Unless otherwise specified below, it is assumed that input and output of information between the computer 1 and the user is performed via the UI device 11. The UI device 11 may be either an input device only or an output device only.

[0028] The NI device 12 is a communication device that communicates information with external devices. The NI device 12 communicates information with external devices such as the electronic devices 3a to 3n via the network 2. Unless otherwise specified below, it is assumed that information communication between the computer 1 (or the processor 10) and external devices is performed via the NI device 12.

[0029] The memory resource 13 is, for example, a non-volatile memory and / or a volatile memory. Examples of the volatile memory are a random access memory (RAM) and a read-only memory (ROM). Examples of the non-volatile memory may be a rewritable storage medium such as a flash memory, a hard disk, or a solid state drive (SSD), or may be a universal serial bus (USB) memory, a memory card, or a hard disk.

[0030] In addition, RAM such as MRAM (Magnetoresistive RAM), PRAM (Phase change RAM), and ReRAM (Resistive RAM) may be considered as non-volatile memory. The processor 10 may provide a service of distributing the reuse determination program 14 stored in the memory resource 13 to other computers.

[0031] The memory resource 13 stores a reuse determination program 15 , monitor data 16 , rating data 17 , monitor statistical value data 18 , classification data 19 and reuse boundary data 20 .

[0032] The reuse determination program 15 is a program for the computer 1 to execute the reuse determination method, and functions as a reuse determination unit.

[0033] The monitor data 16 is information obtained from the monitor modules 30a to 30n of the electronic devices 3a to 3n via the NI device 12, and stores the voltage, temperature, operating status (normal or faulty), etc. related to the semiconductor integrated circuits 31a to 31n inside each electronic device 3a to 3n.

[0034] The rating data 17 is rating information obtained from data sheets or the like of the semiconductor integrated circuits 31a to 31n that are the subject of reuse judgment, and is stored in advance by the user in the memory resource 13. Information such as the maximum voltage, the minimum and maximum junction temperatures, and ESD (Electro-static discharge) is mainly stored.

[0035] The monitor statistical calculation data 18 is information on statistical values ​​such as maximum values, average values, and standard deviations for any period calculated from the monitor data 16, and is stored in the memory resource 13 in advance by the user.

[0036] The classification data 19 is a plurality of graphs in which the operating status (binary values ​​of normal or fault) is plotted on a graph with the statistical values ​​of the monitor data 16 as the axis.

[0037] The reuse boundary data 20 is information that separates normal data groups from faulty data groups in each graph, and defines the plane that separates them as the reuse boundary. By calculating the reuse boundary, it becomes possible to determine whether or not the data can be reused based on the statistical information of the monitor data 16.

[0038] FIG. 3 shows an example of the configuration of the electronic device 3.

[0039] In this example, a power supply voltage sensor 300, a temperature sensor 301, and an ESD sensor 302 are mounted to monitor the power supply voltage, temperature, and ESD, which are mainly listed on the data sheet as device rated values. The analog information of each sensor is acquired as a digital value by an AD converter 305, and is transferred as monitor data 16 to the computer 1 via a CPU 306 and a data transfer circuit 307.

[0040] At this time, the CPU 306 performs a thinning process to transfer data at any time (daily, etc.), and a process to store pre-transfer data in the non-volatile memory 304 and transfer the data at any time. Also included is a failure detection circuit 303 that detects a failure in the semiconductor integrated circuit 31. Note that in this embodiment, voltage, temperature, and ESD are monitored as examples, but atmospheric pressure and humidity may also be included, and a monitor inside the semiconductor integrated circuit 31 may be used.

[0041] 4A and 4B are examples of the monitor data 16. FIG.

[0042] The monitor data 16 stores the serial number, operating status, devices to which the device has been applied, total operating time, and monitored data for each semiconductor integrated circuit 31. The monitored data of power supply voltage, temperature, and ESD are recorded as average values, upper and lower limits, etc., for each day, etc.

[0043] The total operating time is information indicating the cumulative operating time of the semiconductor integrated circuit 31. For example, the operating time is the cumulative time that the power supply voltage is supplied to the semiconductor integrated circuit 31. The cumulative time is monitored by the CPU 306 or the like.

[0044] 5A and 5B are examples of the rating data 17. FIG.

[0045] The rated value is extracted and input from the data sheet or the like of the semiconductor integrated circuit 31 that is the object of reuse determination.

[0046] 6A and 6B are examples of classification data 19 and reuse boundary data 20. Statistical values ​​of monitor data 16 (here, average maximum value of power supply voltage, maximum temperature, total number of ESD events, and average temperature over the entire period) are calculated based on monitor statistical calculation data 18. The state of each semiconductor integrated circuit 31 is plotted as an axis, and by collecting the number of plotted data, a plane (a curve in the figure, since it is a two-dimensional graph) that separates the normal data group from the faulty data group is calculated.

[0047] This plane is the reuse boundary, and at the next monitoring timing, it can be determined whether it is reusable or not by whether it is within the normal data group area. Even if it is normal, if it is plotted in the failure data group area, it means that there is a high possibility of failure in a short period of time, so it is determined that it cannot be reused.

[0048] Next, a description will be given of the processing performed by the computer 1. Fig. 7 is a flowchart showing an example of the processing performed by the computer 1 when determining whether to reuse an individual semiconductor integrated circuit 31. Here, dotted lines in Fig. 7 indicate points where data is input and output.

[0049] First, the processor 10 monitors each electronic device 3 at an arbitrary timing (step S1), such as when a failure occurs in the semiconductor integrated circuit 31. As a result, data is accumulated in the monitor data 16.

[0050] Next, the processor 10 compares the acquired monitor data 16 with the rated data 17 to determine whether the semiconductor integrated circuit 31 is operating outside of its rated capacity (step S2). If the semiconductor integrated circuit 31 is operating outside of its rated capacity (NO), even if the semiconductor integrated circuit 31 is operating normally, the semiconductor integrated circuit 31 may be deteriorating at an accelerated rate. Therefore, in step S3, the corresponding semiconductor integrated circuit 31 is recycled or disposed of. If the semiconductor integrated circuit 31 is operating within its rated capacity (YES), the process proceeds to step S4, where a state determination is performed.

[0051] Next, the state is determined (step S5), and if it is determined to be a malfunction (NO), the process proceeds to step S6, where recycling or disposal is carried out. If it is determined to be normal (YES), the process proceeds to step S7. At this time, normal or malfunction information is stored in the monitor data 16 as the operating status.

[0052] In step S7, it is determined whether the reuse boundary has been calculated. The calculation flow of the reuse boundary will be described in another flowchart. If the calculation has not been performed (NO), the process proceeds to step S8, where the corresponding semiconductor integrated circuit 31 is either continued to be used or secured as inventory. The continued use here assumes that the electronic device 3 is continued to be used at the monitoring timing.

[0053] When determining whether or not the part can be reused, if the reuse boundary has not been calculated, it is not possible to determine whether or not the part can be reused, and therefore it is possible to put the part into inventory. If the reuse boundary has been calculated (YES), the process proceeds to step S9.

[0054] In step S9, the state of the semiconductor integrated circuit 31 is mapped onto the graph of the classification data 19 to determine whether it is within the normal data group area. If it is outside the normal data group area, it is recycled or discarded (step S10). If it is within the normal data group area, it is determined that it can be used continuously or reused (step S11).

[0055] So far, it has been explained that the individual semiconductor integrated circuits 31 can easily determine whether they can be reused by using the reuse boundary data 20. Next, a method for generating the reuse boundary data will be explained.

[0056] Fig. 8 shows an example of a method for generating reuse boundary data 20. Here, dotted lines in Fig. 8 indicate points where data is input and output.

[0057] First, the processor 10 performs monitoring (step S12).

[0058] Next, the monitor data 16 is referenced to determine whether a given number of faults (here, N) has been accumulated (step S13). If the number of faults is less than N (NO), the process returns to step S12. If the number of faults is N or greater (YES), the process proceeds to step S14. The reason for collecting a certain number of faults here is that, in operation of the electronic device 3, the absolute number of faults is likely to be small, and the number of data is necessary to calculate the reuse boundary.

[0059] Next, in step S14, a statistical value of the monitor data 16 is calculated based on the monitor data 16 and the monitor statistical calculation data 18. The statistical value here is, for example, the maximum power supply voltage over the entire operating time, and by calculating a unique value as the statistical value, the state of each semiconductor integrated circuit 31 can be mapped on a graph (step S15). This mapped graph becomes classification data 19.

[0060] Next, a reuse boundary plane that divides the normal group and the faulty group is calculated from the classification data 19 (step S16). The plane can be calculated using machine learning, such as an algorithm such as SVM (Support Vector Machine). The calculated reuse boundary plane is stored as reuse boundary data 20. Up to this point, the process of calculating the reuse boundary by the processor 10 has been described. This completes the basic processing performed by the computer 1.

[0061] According to the first embodiment, by calculating the reuse boundary, it becomes possible to instantly determine whether each semiconductor integrated circuit 31 can be continuously used or reused at any monitoring timing.

[0062] FIG. 9 is a diagram illustrating an example of the configuration of the computer 1 according to the second embodiment.

[0063] In the second embodiment, the contents of the reuse determination program 15 in the memory resource 13 are different from those in the first embodiment, and reuse area data 21 is further added. The other configurations are the same as the configuration example of the computer 1 according to the first embodiment (see FIG. 2), and therefore detailed explanations will be omitted.

[0064] FIG. 10 shows an example of the reuse area data 21. As shown in FIG.

[0065] The reuse area data 21 is information that divides areas according to the distance from the reuse boundary. When the monitored voltage and temperature are regarded as stress on the semiconductor integrated circuit 31, it can be said that the closer to the reuse boundary the stress is, the greater the stress. Therefore, by dividing the area, it is possible to divide the reliability based on the amount of stress that has been applied to the semiconductor integrated circuit 31 up to now. When making a reuse determination, it is possible to select a reuse destination depending on which area the integrated circuit 31 belongs to.

[0066] For example, since area A in FIG. 10 is an area close to the reuse boundary, even if it has been operating normally, the amount of stress up to now may be large, and deterioration may be accelerating, resulting in low reliability when reused.

[0067] On the other hand, area C is the area farthest from the reuse boundary, and can be said to have a high reliability. Individuals with low reliability can be reused, for example, for prototype products. Conversely, individuals with high reliability can be reused in products.

[0068] 11 is a flowchart showing an example of processing performed by the computer 1 when determining whether to reuse an individual semiconductor integrated circuit 32 in another embodiment. Here, dotted lines in FIG. 11 indicate points where data is input and output.

[0069] Steps S20 to S25 are the same as steps S1 to S6 in FIG. 7 in the first embodiment, and therefore a description thereof will be omitted.

[0070] In step S26, it is determined whether the reuse area data 21 has been calculated, and if not, the reuse area data 21 is either continuously used or put into stock (step S27).If the reuse area data 21 has been calculated, the process proceeds to step S28.

[0071] In step S28, it is determined whether the individual is plotted within the reuse area C. If it is within the reuse area C, it is sent to reuse destination X, which requires continued use or high reliability (step S29). If it is outside the reuse area C, the process proceeds to step S30.

[0072] In step S30, it is determined whether the individual is plotted within reuse area B. If it is within reuse area B, it is sent to reuse destination Y, which requires continued use or medium reliability (step S29). If it is outside reuse area B, the process proceeds to step S32.

[0073] In step S32, it is determined whether the individual is plotted within reuse area A. If it is within reuse area A, it is either sent for continued use or to reuse destination Z, which requires low reliability (step S29). If it is outside reuse area A, the process proceeds to step S34. If it does not belong to any area (step S34), it belongs to the area of ​​the failure data group, and so the individual is either recycled or discarded.

[0074] Here, reuse destination X may be, for example, an automobile (ECU). Furthermore, reuse destination Y may be, for example, an inspection device (signal processing system). Reuse destination Z may be, for example, a prototype of an inspection device. Here, an example with three areas has been described, but there may be more or fewer than three.

[0075] So far, it has been explained that each semiconductor integrated circuit 31 can easily determine whether or not it can be reused and where it can be reused by using the reuse area data 21. Next, a method for generating the reuse area data 21 will be explained.

[0076] Fig. 12 shows an example of a method for generating reuse area data 21. Here, dotted lines in Fig. 12 indicate points where data is input and output.

[0077] Steps S35 to S39 are the same as steps S12 to S16 in FIG. 8 in the first embodiment, and therefore a description thereof will be omitted.

[0078] In step S40, a reuse area is calculated from the calculated reuse boundary. The reuse area is defined, for example, as a region obtained by shrinking the reuse boundary line to the minimum value of each axis so that the area is similar, as shown in Figure 10. For example, as shown in Figure 10, the reuse area is calculated as a region obtained by shrinking the reuse boundary line 20 in the direction of area C21 (the direction of the arrow in Figure 10) while maintaining the similarity of the figure formed by the reuse boundary and the graph axes. This completes the basic processing performed by Calculator 1.

[0079] According to the second embodiment, by calculating the reuse area, it becomes possible to instantly determine whether each semiconductor integrated circuit 31 can be continuously used or reused and to which destination it can be reused at any monitoring timing.

[0080] The present invention is not limited to the above-described embodiments, and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to an embodiment including all of the described components.

[0081] In addition, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with another configuration.

[0082] Furthermore, the above-described configurations, functions, processing units, processing means, etc. may be partly or entirely realized in hardware by, for example, designing them as integrated circuits, etc. Furthermore, the above-described configurations, functions, etc. may be realized in software by a processor interpreting and executing a program that realizes each function.

[0083] Information such as programs, decision tables, and files that realize each function can be stored in a memory, a storage device such as an HDD or SSD, or a recording medium such as an IC (Integrated Circuit) card, an SD (Secure Digital) card, or a DVD (Digital Versatile Disc). Furthermore, control lines and information lines are shown that are considered necessary for explanation, and do not necessarily represent all control lines and information lines in the product. In reality, it can be assumed that almost all components are interconnected.

[0084] The computer 1 may be realized by a user (operator) performing some or all of the functions and processes realized by the reuse determination program 15 .

[0085] There may be cases where the computer 1 does not have a UI device 11, and instead delegates output processing to the user and part of the processing of input from the user to a processor system (referred to as an external processor system) such as a smartphone or tablet terminal external to the system. In such cases, the computer 1 (or the processor 10, the reuse determination program 15) may perform the following in order to execute the processing described above and other parts of the program.

[0086] Instead of outputting to the user using the UI device 11 described above, data required for output to the user is transmitted to an external processor system via the NI device 12 .

[0087] Examples of such data include the data to be output itself, data for generating output data in another processor system, but it may also be a program or web data that describes the process of performing user output in an external processor system.

[0088] Instead of receiving input or operation from the user using the UI device 11 described above, data indicating the user input or operation is received from an external processor system via the NI device 12. From another perspective, the meaning of outputting data to the user may include not only outputting the data by the computer 1 itself, but also having another entity other than the computer 1 output the data (using it).

[0089] Furthermore, the meaning of input or operation reception from the user may include not only direct output or reception to the user by the UI device 11 of the computer 1, but also indirect reception by the computer 1.

[0090] According to the above embodiment, the remaining life of an electronic component can be easily predicted, for example, the reusability of a semiconductor integrated circuit can be easily predicted.

[0091] 1 Computer 2 Network 3 Electronic device 10 Processor 11 UI device 12 NI device 13 Memory resource 14 Bus 15 Reuse determination program (reuse determination unit) 16 Monitor data 17 Rating data 18 Monitor statistical calculation data 19 Classification data 20 Reuse boundary data 21 Reuse area data 30 Monitor module 31 Semiconductor integrated circuit 300 Power supply voltage sensor 301 Temperature sensor 302 ESD sensor 303 Fault detection circuit 304 Non-volatile memory 305 AD converter 306 CPU 307 Data transfer circuit

Claims

1. A reuse determination device having a reuse determination unit that determines the reusability of a semiconductor integrated circuit, wherein the reuse determination unit, using a processor, determines the state of the semiconductor integrated circuit using monitor data of the semiconductor integrated circuit, and if the state of the semiconductor integrated circuit is determined to be faulty, recycles or discards the semiconductor integrated circuit, and if the state of the semiconductor integrated circuit is determined to be normal, calculates statistics of the monitor data to obtain monitor statistical calculation data, uses the monitor statistical calculation data to map the normal state and the faulty state of the semiconductor integrated circuit on a graph, calculates a reuse boundary that separates an area on the graph into a normal data group area indicating the normal state and a faulty data group area indicating the faulty state, and determines the reusability of the semiconductor integrated circuit based on the reuse boundary.

2. The reuse determination device of claim 1, wherein the reuse determination unit uses a processor to determine whether the monitor statistics calculation data exists in the normal data group area or the failure data group area, and if it is determined that the monitor statistics calculation data exists in the failure data group area, recycles or discards the semiconductor integrated circuit, and if it is determined that the monitor statistics calculation data exists in the normal data group area, continues to use or reuses the semiconductor integrated circuit.

3. The reuse determination device according to claim 1, characterized in that the reuse determination unit uses machine learning by a processor to calculate the reuse boundary that separates the area on the graph into the normal data group area and the faulty data group area.

4. The reuse determination device according to claim 1, characterized in that the reuse determination unit divides the normal data group area into a plurality of reuse areas using a processor, and determines the reuse destination of the semiconductor integrated circuit according to the divided reuse areas.

5. The reuse determination device according to claim 4, characterized in that the reuse determination unit, using a processor, divides the normal data group area into a plurality of reuse areas corresponding to the reliability calculated from the amount of stress related to the semiconductor integrated circuit, and determines the reuse destination of the semiconductor integrated circuit based on the reliability.

6. The reuse determination device according to claim 4, characterized in that the reuse determination unit calculates, by a processor, an area obtained by reducing a figure consisting of the reuse boundary and the axis of the graph while maintaining a similarity relationship as the reuse area.

7. The reuse determination device according to claim 1, characterized in that the reuse determination unit uses the monitor data by a processor to determine whether the rated value of the semiconductor integrated circuit is exceeded, and if it is determined that the rated value is exceeded, recycles or discards the semiconductor integrated circuit.

8. The reuse determination device according to claim 1, characterized in that the reuse determination unit calculates, by a processor, a maximum value, a minimum value or a standard deviation of the monitor data in a predetermined period as the statistical value of the monitor data.

9. A reuse determination system in which a reuse determination device having a reuse determination unit that determines the reusability of a semiconductor integrated circuit and a plurality of electronic devices are connected via a communication line, each of the electronic devices having the semiconductor integrated circuit and a monitor module that acquires monitor data of the semiconductor integrated circuit, the reuse determination device acquires the monitor data from the monitor module of the electronic device via the communication line, and the reuse determination unit uses the monitor data by a processor to determine a state of the semiconductor integrated circuit, and if the state of the semiconductor integrated circuit is determined to be faulty, recycles or discards the semiconductor integrated circuit, and if the state of the semiconductor integrated circuit is determined to be normal, calculates statistics of the monitor data and acquires monitor statistical calculation data, maps the normal state and the faulty state of the semiconductor integrated circuit on a graph using the monitor statistical calculation data, calculates a reuse boundary that separates an area on the graph into a normal data group area indicating the normal state and a faulty data group area indicating the faulty state, and determines the reusability of the semiconductor integrated circuit based on the reuse boundary.

10. The reuse determination system described in claim 9, characterized in that each of the electronic devices has a monitor module common to each of the semiconductor integrated circuits, and the monitor module has a power supply voltage sensor, a temperature sensor and an ESD sensor for monitoring the power supply voltage, temperature and ESD, which are rated values ​​of the semiconductor integrated circuit, and a failure detection circuit for detecting a failure of the semiconductor integrated circuit.

11. The reuse determination system of claim 9, wherein the reuse determination unit determines, by a processor, whether the monitor statistics calculation data exists in the normal data group area or the failure data group area, and if it is determined that the monitor statistics calculation data exists in the failure data group area, recycles or discards the semiconductor integrated circuit, and if it is determined that the monitor statistics calculation data exists in the normal data group area, continues to use or reuses the semiconductor integrated circuit.

12. The reuse determination system according to claim 9, characterized in that the reuse determination unit divides the normal data group area into a plurality of reuse areas using a processor, and determines the reuse destination of the semiconductor integrated circuit according to the divided reuse areas.

13. The reuse determination system described in claim 12, characterized in that the reuse determination unit divides the normal data group area into a plurality of reuse areas corresponding to the reliability calculated from the amount of stress related to the semiconductor integrated circuit by a processor, and determines the reuse destination of the semiconductor integrated circuit based on the reliability.

14. The reuse determination system described in claim 10, characterized in that the reuse determination unit uses the monitor data by a processor to determine whether the rated value of the semiconductor integrated circuit has been exceeded, and if it is determined that the rated value has been exceeded, recycles or discards the semiconductor integrated circuit.

15. A reuse determination method for determining the reusability of a semiconductor integrated circuit by a processor, comprising: a step of determining a state of the semiconductor integrated circuit using monitor data of the semiconductor integrated circuit; a step of recycling or discarding the semiconductor integrated circuit if the state of the semiconductor integrated circuit is determined to be faulty; a step of calculating statistics of the monitor data to obtain monitor statistical calculation data if the state of the semiconductor integrated circuit is determined to be normal; a step of mapping the normal state and the faulty state of the semiconductor integrated circuit on a graph using the monitor statistical calculation data; a step of calculating a reuse boundary that separates an area on the graph into a normal data group area indicating the normal state and a faulty data group area indicating the faulty state; and a step of determining the reusability of the semiconductor integrated circuit based on the reuse boundary.

Images