Chip holding device, chip holding method, and apparatus for producing semiconductor device

Abstract

A chip holding device (10) comprises: a chip holding tool (12) which has a holding surface (18) that holds a chip (100) in a contactless manner and a vibration source (30) that applies ultrasonic vibration to the holding surface (18) to form a squeeze film between the holding surface (18) and the chip (100); and a rotation mechanism (40) which rotates the chip holding tool (12) around a specific rotation shaft (46), wherein the rotation shaft (46) is a shaft that is for rotating the chip (100) in a direction in which the chip (100) is turned upside down and that is set in an area other than an area in which the holding surface (18) is pushed out in a direction opposite to the chip (100).

Description

Chip holding device, chip holding method, and semiconductor device manufacturing device

[0001] The present specification discloses a chip holding device that holds a chip in a non-contact manner, a chip holding method, and a semiconductor device manufacturing apparatus.

[0002] In recent years, in order to realize further miniaturization and higher density of semiconductor devices, there is a demand for chip holding devices that hold chips without contact. To meet this demand, some chip holding devices that hold semiconductor chips without contact have been proposed. This technology can prevent chip chipping and contamination.

[0003] For example, Patent Document 1 discloses a chip holding device having a chip holder that holds a chip in a non-contact manner by utilizing the ultrasonic squeeze effect. In Patent Document 1, ultrasonic vibrations are applied to the holding surface of the chip holder to form a squeeze film between the holding surface and the chip. The squeeze film exerts an ultrasonic holding force on the chip, tending to keep the chip on the surface of the squeeze film.

[0004] Japanese Patent Application Laid-Open No. 2023-045216

[0005] In order to reverse the orientation of a chip, such a chip holding device may rotate the chip holder while holding the chip. In conventional chip holding devices, the rotation axis is set on the opposite side of the holding surface from the chip. In this case, gravity and centrifugal force can cause the chip to become misaligned or detach from the holding surface during rotation.

[0006] Therefore, this specification discloses a chip holding device, a chip holding method, and a semiconductor device manufacturing apparatus that are capable of reversing the orientation of a chip while suppressing positional deviation of the chip relative to the holding surface.

[0007] The chip holding device disclosed in this specification comprises a chip holding tool having a holding surface that holds the chip non-contact, and a vibration source that applies ultrasonic vibrations to the holding surface to form a squeeze film between the holding surface and the chip, and a rotation mechanism that rotates the chip holding tool around a specified rotation axis, wherein the rotation axis is an axis that rotates the chip in a direction that turns it upside down, and is an axis that is set in an area other than the area where the holding surface is pushed in the opposite direction to the chip.

[0008] In this case, the rotation axis may be set in an area where the holding surface is pushed out in a direction approaching the chip from the holding surface.

[0009] For example, the rotation axis may be an axis passing through the tip, or may be set outside the holding surface when viewed in the axial direction of the tip holder.

[0010] The device may further include a controller, which controls the rotation speed of the chip holder by the rotation mechanism according to the rotation angle so that, at least temporarily, the vertical component of the centrifugal force acting on the chip is substantially balanced with the gravity acting on the chip.

[0011] The controller may also rotate the tip holder with the rotation mechanism while accelerating it so that an inertial force acts on the tip in a direction approaching the holding surface at least temporarily.

[0012] The device may further include a controller and a suction source that applies negative pressure to the holding surface to suck the chip onto the holding surface, and the controller may make at least one of the suction force by the suction source and the ultrasonic holding force by the vibration source larger when an inertial force acting on the chip in a direction away from the holding surface is greater than when an inertial force acting on the chip in a direction toward the holding surface.

[0013] Furthermore, the device may further include a swinging mechanism that swings the chip holder around a swing axis different from the rotation axis, and the controller may at least temporarily swing the chip holder using the swinging mechanism in accordance with the rotation angle.

[0014] The rotation mechanism may be configured to change a rotation radius, which is the distance from the rotation axis to the chip holder, and the controller may cause the rotation mechanism to rotate the chip holder in a non-circular shape so that the rotation radius changes depending on the rotation angle.

[0015] The semiconductor device manufacturing apparatus disclosed in this specification includes the above-described chip holding device.

[0016] The chip holding method disclosed in this specification is characterized in that, while holding a chip non-contactingly on the holding surface of a chip holder, the chip holder is rotated around a specified rotation axis, the rotation axis being an axis that rotates the chip in a direction that turns the chip upside down, and being an axis that is set in an area other than the area where the holding surface is pushed in the opposite direction to the chip.

[0017] According to the technology disclosed in this specification, even when the chip holder is rotated at high speed, centrifugal force does not act on the chip in a direction that moves it away from the holding surface in the thickness direction, thereby effectively preventing the chip from falling off.

[0018] FIG. 1 is a diagram showing the configuration of a chip holding device. FIG. 2 is a schematic diagram showing the principle of holding a semiconductor chip without contact. FIG. 3 is a diagram showing the rotation of a chip holder by a chip holding device of a comparative example. FIG. 4 is a diagram showing the rotation of a chip holder by a chip holding device of a comparative example. FIG. 5 is a diagram showing the rotation of a chip holder. FIG. 6 is a diagram showing the rotation of another chip holder. FIG. 7 is a diagram showing the rotation of another chip holder. FIG. 8 is a diagram showing the rotation of another chip holder. FIG. 9 is a diagram showing the rotation of another chip holder. FIG. 10 is a view from the axial direction of a holding surface. FIG. 11 is an image showing the function of a positioning recess. FIG. 12 is an image showing the function of an airflow forming groove. FIG. 13 is a diagram showing an example of a manufacturing apparatus having a chip holding device.

[0019] The configuration of the chip holding device 10 will be described below with reference to the drawings. Fig. 1 is a diagram showing the configuration of the chip holding device 10. This chip holding device 10 is a device that holds and transports semiconductor chips 100 in a non-contact manner, and is incorporated into, for example, semiconductor device manufacturing equipment, inspection equipment, etc.

[0020] As shown in FIG. 1 , the chip holding device 10 includes a chip holder 12, a rotation mechanism 40, a vibration source 30, a suction source 36, and a controller 50. The chip holder 12 holds a semiconductor chip 100 in a non-contact manner. The chip holder 12 has a substantially plate-shaped holding plate 16 and a main body 14. An end face of the holding plate 16 functions as a holding surface 18 that holds the semiconductor chip 100. A suction hole 22 that communicates with a suction source 36 (described later) is formed in the center of the holding surface 18. The main body 14 extends axially from the holding plate 16. A suction path 24 that communicates the suction hole 22 with the suction source 36 is formed in the main body 14. The main body 14 also incorporates a vibration source 30. The main body 14 may function as a horn that amplifies ultrasonic vibrations generated by the vibration source 30 and transmits the amplified vibrations to the holding surface 18.

[0021] The rotation mechanism 40 is an actuator that rotates the chip holder 12 around a rotation axis 46. The rotation axis 46 is an axis that rotates the chip 100 in a direction that turns the chip 100 upside down. The rotation axis 46 is, for example, parallel to the holding surface 18. By rotating the chip holder 12 180 degrees around this rotation axis 46, the semiconductor chip 100 is turned upside down. The rotation mechanism 40 has a power source 42 that is driven and controlled by a controller 50, which will be described later. The power source 42 may be any power source that can be electrically controlled, such as a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination of these.

[0022] The vibration source 30 generates ultrasonic vibrations and includes, for example, an ultrasonic vibration element 32 and an AC power supply 34. The ultrasonic vibration element 32 generates longitudinal vibrations upon receiving a drive signal, which is a voltage signal. The ultrasonic vibration element 32 includes, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage, and is a bolt-tightened Langevin-type transducer (commonly known as a BLT or BL transducer) in which the PZT is sandwiched between metal blocks and tightened with screws (bolts). The AC power supply 34 applies an alternating voltage of a frequency corresponding to a predetermined resonant frequency to the ultrasonic vibration element 32.

[0023] Driving the vibration source 30 causes the holding surface 18 to ultrasonically vibrate in the axial direction. The ultrasonic vibration of the holding surface 18 generates an ultrasonic squeeze effect between the holding surface 18 and a plane (e.g., an end face of the semiconductor chip 100) closely facing the holding surface 18. This ultrasonic squeeze effect causes the semiconductor chip 100 to be held on the holding surface 18 while remaining spaced apart from the holding surface 18, as will be described later.

[0024] The suction source 36 generates negative pressure and includes, for example, an air pump, etc. The suction source 36 is in communication with the suction path 24, and when the suction source 36 is driven, negative pressure acts on the suction holes 22, generating a suction force that attracts the semiconductor chip 100 to the holding surface 18.

[0025] The controller 50 controls the driving of the electrical elements of the chip holding device 10. This controller 50 is physically a computer having a processor 52 and a memory 54. Although the controller 50 is illustrated as a single computer in FIG. 1, the controller 50 may be configured by combining multiple physically separated computers.

[0026] The controller 50 controls the driving of the vibration source 30 and the suction source 36 so that the holding surface 18 can hold the semiconductor chip 100 in a non-contact manner. This will be explained with reference to Fig. 2. Fig. 2 is a schematic diagram showing the principle of holding the semiconductor chip 100 in a non-contact manner.

[0027] As described above, when an alternating voltage is applied to the ultrasonic vibration element 32, the holding surface 18 undergoes ultrasonic vibration. When the semiconductor chip 100 is brought close to the holding surface 18 while this ultrasonic vibration is occurring, an ultrasonic squeeze effect occurs between the holding surface 18 and the semiconductor chip 100. The ultrasonic squeeze effect is an effect in which, when one of two flat plates facing each other across a minute gap is vibrated, a pressure higher than that outside the gap is generated due to the influence of viscosity within the gap. When this ultrasonic squeeze effect occurs, a squeeze film Sf is formed.

[0028] Due to the pressure difference, a force acts on the semiconductor chip 100, tending to hold it on the surface of the squeeze film Sf. The force generated by the squeeze film Sf serves as the holding force for holding the semiconductor chip 100. Hereinafter, the holding force caused by the squeeze film Sf will be referred to as the "ultrasonic holding force." The ultrasonic holding force occurs both perpendicular to and parallel to the holding surface 18 (i.e., the planar direction). That is, when the squeeze film Sf is formed, a force acts on the semiconductor chip 100, moving it away from the holding surface 18 in the thickness direction, i.e., a force in the direction of floating it from the holding surface 18. Furthermore, when the squeeze film Sf is formed, the semiconductor chip 100 tends to remain within the vibration plane. Therefore, as shown in the lower diagram of FIG. 2 , even if the semiconductor chip 100 is temporarily displaced in the planar direction due to an external force, the semiconductor chip 100 tends to move in the planar direction so that its entirety is positioned within the vibration plane, and return to a state facing the holding surface 18.

[0029] In this example, to assist this ultrasonic holding force, a suction force is also generated by negative pressure on the holding surface 18. The controller 50 controls the driving of the suction source 36 and the vibration source 30 so that the suction force, the ultrasonic holding force, and the gravity acting on the semiconductor chip 100 are balanced when the semiconductor chip 100 is floating above the holding surface 18.

[0030] Furthermore, the controller 50 drives the rotation mechanism 40 to rotate the chip holder 12 as necessary in order to turn the semiconductor chip 100 upside down. During this rotation, gravity and centrifugal force can cause the semiconductor chip 100 to become misaligned with respect to the holding surface 18 or to fall off from the holding surface 18. This will be described with reference to FIGS.

[0031] 3 and 4 are diagrams showing the rotation of the chip holder 12 by the chip holding device 10* of the comparative example. As shown in Fig. 3 and 4, in the chip holding device 10* of the comparative example, the rotation axis 46* is set on the opposite side of the holding surface 18 from the semiconductor chip 100. In other words, in the chip holding device 10*, the rotation axis 46* is set within an area Aa where the holding surface 18 is pushed out to the opposite side of the semiconductor chip 100.

[0032] Consider the case where the chip holder 12 is rotated in such a chip holding device 10* so that the semiconductor chip 100 faces upward from a rotation angle θ1, at which the semiconductor chip 100 faces downward, to a rotation angle θ3, at which the semiconductor chip 100 faces upward, as shown in FIG. 3 . In this case, as shown by the rotation angle θ2 in FIG. 3 , the direction of gravity Fg acting on the semiconductor chip 100 becomes approximately parallel to the surface direction during the rotation, and the semiconductor chip 100 may be misaligned in the surface direction relative to the holding surface 18. This misalignment is automatically corrected by the ultrasonic holding force once the rotation is completed at the rotation angle θ3. However, it takes some time to correct this misalignment, and during that time the semiconductor chip 100 vibrates in the surface direction. This increases the processing time for the semiconductor chip 100.

[0033] For example, consider a case where the orientation of the semiconductor chip 100 held by the chip holder 12 is changed in order to inspect the semiconductor chip 100. In this case, if the semiconductor chip 100 vibrates for a while after the orientation of the semiconductor chip 100 is changed, the inspection process cannot be started during the vibration period, and the time required for the inspection increases. Alternatively, consider a case where the semiconductor chip 100 picked up by the chip holder 12 is transferred to a bonding tool. In this case, after picking up the semiconductor chip 100, the chip holder 12 rotates 180 degrees to change the orientation of the semiconductor chip 100. After this rotation is complete, the semiconductor chip 100 cannot be transferred to the bonding tool until the vibration in the surface direction of the semiconductor chip 100 stops. As a result, the manufacturing lead time of the semiconductor device increases.

[0034] Therefore, in order to prevent the semiconductor chip 100 from being displaced due to gravity, it is conceivable to rotate the chip holder 12 at high speed. However, in this case, as shown in FIG. 4 , a centrifugal force Fc acts on the semiconductor chip 100 in a direction away from the holding surface 18 in the thickness direction. This centrifugal force Fc may cause the semiconductor chip 100 to separate from the holding surface 18. Furthermore, if the absolute value of the acceleration (including negative acceleration) when rotating the chip holder 12 is large, an inertial force Fi acts on the semiconductor chip 100. This inertial force Fi may cause the semiconductor chip 100 to be displaced in the planar direction relative to the holding surface 18.

[0035] In this example, in order to prevent such misalignment or separation of the semiconductor chip 100, the rotation axis 46 of the chip holder 12 is set in an area other than the area Aa where the holding surface 18 is pushed out to the opposite side of the semiconductor chip 100. This will be described in detail below.

[0036] 5, the rotation axis 46 may be set in an area Ab that pushes the holding surface 18 in a direction approaching the semiconductor chip 100 from the holding surface 18. In other words, the rotation axis 46 is set in the area Ab so that a centrifugal force Fc acts on the semiconductor chip 100 in a direction toward the holding surface 18 as the chip holder 12 rotates. A line segment La that connects the rotation axis 46 and the bottom surface of the semiconductor chip 100 is perpendicular to the holding surface 18 and does not pass through the holding surface 18.

[0037] In this case, by rotating the chip holder 12, a centrifugal force Fc acts on the semiconductor chip 100 toward the holding surface 18. This centrifugal force Fc effectively prevents the semiconductor chip 100 from shifting in position or falling off. Furthermore, since the chip holder 12 can be rotated at high speed, the processing time can be shortened.

[0038] When the above-described chip holder 12 is used as a pickup collet or the like, an elevation mechanism 60 may be provided that elevates the chip holder 12 together with the rotation shaft 46 in conjunction with the rotation of the chip holder 12. That is, as shown in FIG. 13 , a pickup collet 78 picks up a semiconductor chip 100 from a chip supply source 72 located below the chip holder 12 and delivers the semiconductor chip 100 to a bonding tool 86 located above the chip holder 12. Therefore, the chip height position of the pickup collet 78 in the upward position must be higher than the chip height position in the downward position. On the other hand, as is clear from FIG. 5 , the chip height position of the above-described chip holder 12 in the upward position (θ3) is lower than the chip height position in the downward position (θ1). Therefore, when the above-described tip holder 12 is used as a pickup collet, an elevation mechanism 60 may be provided that raises and lowers the tip holder 12 together with the rotating shaft 46 so that the tip height position in the upward state (θ3) is higher than the tip height position in the downward state (θ1). The elevation mechanism 60 may have an electrically controllable power source 62, such as a motor, an electromagnetic cylinder, a pneumatic cylinder, or a hydraulic cylinder.

[0039] 6, the rotation axis 46 may be set at a position that passes through the semiconductor chip 100 held by the holding surface 18. In this case, the centrifugal force Fc acting on the semiconductor chip 100 as the chip holder 12 rotates can be reduced to almost zero. As a result, separation of the semiconductor chip 100 due to the centrifugal force Fc can be effectively prevented.

[0040] 7, the rotation axis 46 may be set outside the holding surface 18 when viewed in the axial direction of the chip holder 12. In this case, the centrifugal force Fc in the thickness direction (i.e., the axial direction of the chip holder 12) does not act on the semiconductor chip 100. As a result, separation of the semiconductor chip 100 due to the centrifugal force Fc can be effectively prevented.

[0041] In this case, at a rotation angle of θ3 = 90 degrees, the direction of gravity Fg acting on the semiconductor chip 100 becomes parallel to the surface direction. In this case, gravity Fg makes it easier for the semiconductor chip 100 to become misaligned in the surface direction. Therefore, the controller 50 may control the rotation speed of the chip holder 12 by the rotation mechanism 40 so that the vertical component of the centrifugal force Fc acting on the semiconductor chip 100 balances with gravity Fg when passing through the vicinity of θ3 = 90 degrees. With this configuration, it is possible to effectively suppress misalignment of the semiconductor chip 100 in the surface direction caused by gravity Fg.

[0042] In another embodiment, the controller 50 may temporarily accelerate the chip holder 12 to suppress positional deviation caused by the centrifugal force Fc or gravity Fg. Fig. 8 is a diagram showing how the semiconductor chip 100 is changed from an upward position (θ5) to a downward position (θ1). In this case, as shown in Fig. 8, by rotating the chip holder 12 while accelerating, an inertial force Fi acts on the semiconductor chip 100 in a direction toward the holding surface 18. The action of this inertial force Fi effectively suppresses positional deviation of the semiconductor chip 100 caused by the centrifugal force Fc or gravity Fg.

[0043] The chip holding device 10 may further include a swinging mechanism 64 that swings the chip holder 12 about a swinging axis 68 separate from the rotation axis 46. By changing the tilt of the holding surface 18 with the swinging mechanism 66, the direction of the resultant force Fgc of gravity Fg and centrifugal force Fc can be finely adjusted. For example, by tilting the chip holder 12 with the swinging mechanism 64 at a rotation angle θ4 in FIG. 8 , the direction of the resultant force Fgc of gravity Fg and centrifugal force Fc can be adjusted in a direction from the semiconductor chip 100 toward the holding surface 18. As a result, even when a sufficient inertial force Fi is not obtained, the semiconductor chip 100 can be pressed against the holding surface 18, effectively suppressing misalignment of the semiconductor chip 100.

[0044] Furthermore, the controller 50 may change the suction force Fs of the suction source 36 and the ultrasonic holding force Fv of the vibration source 30 according to the rotation angle, rotation speed, and acceleration of the chip holder 12. For example, at a rotation angle θ2 in FIG. 8 , the chip holder 12 decelerates to stop. Due to this deceleration, an inertial force Fi acts on the semiconductor chip 100 in a direction away from the holding surface 18 in the thickness direction. At this time, gravity Fg acting on the semiconductor chip 100 also acts in a direction away from the holding surface 18. Therefore, at the rotation angle θ2, the semiconductor chip 100 is likely to become detached or displaced. Therefore, at the rotation angle θ2, the suction force Fs of the suction source 36 and the ultrasonic holding force Fv of the vibration source 30 may be strengthened. This makes it possible to more effectively prevent the semiconductor chip 100 from becoming detached or displaced.

[0045] Furthermore, although the chip holder 12 has been described as rotating in a circular direction in the above description, the chip holder 12 may also rotate in a non-circular direction. For example, as shown in FIG. 9 , the rotation mechanism 40 may change the distance from the rotation axis 46 to the chip holder 12 (hereinafter referred to as the "radius of rotation") depending on the rotation angle. In the example of FIG. 9 , the radius of rotation around the rotation angle θ5 = 90 degrees, at which the semiconductor chip 100 is likely to be displaced in the planar direction due to gravity Fg, is set to be larger than the radius of rotation at other rotation angles. With this configuration, the centrifugal force Fc increases near the rotation angle of 90 degrees, effectively suppressing the displaced position in the planar direction due to gravity Fg.

[0046] 9, the swing angle of the chip holder 12 by the swing mechanism is also changed depending on the rotation angle. For example, in the example of Fig. 9, the chip holder 12 is swung at angle θ8, which is just before rotation stops, so that the centrifugal force Fc acting on the semiconductor chip 100 is directed toward the holding surface 18. This effectively prevents the semiconductor chip 100 from being separated from the holding surface 18 due to the inertial force Fi generated by deceleration. The controller 50 controls the driving of the rotation mechanism 40 and the swing mechanism 64 so that the chip holder 12 rotates as shown in Fig. 9.

[0047] Up to this point, the holding surface 18 has been described as having a substantially flat, planar shape. However, the shape of the holding surface 18 may be modified as appropriate as long as it can hold the semiconductor chip 100 without contact. For example, as shown in FIG. 10 , the holding surface 18 may be provided with a positioning recess 28 and an airflow-forming groove 26. FIG. 10 is an axial view of the holding surface 18. In FIG. 10 , the diagonally hatched areas indicate recesses that do not penetrate the holding plate 16, and the cross-hatched areas indicate holes that penetrate the holding plate 16.

[0048] The positioning recess 28 has substantially the same shape as the outer shape of the semiconductor chip 100. In the example of Fig. 10, the semiconductor chip 100 is a square with sides of approximately L1, so the shape of the inner peripheral edge of the positioning recess 28 is also a square with sides of approximately L1.

[0049] The function of the positioning recess 28 will be described with reference to Fig. 11. Fig. 11 is an image diagram showing the function of the positioning recess 28. Note that the airflow forming groove 26 is not shown in Fig. 11. When the positioning recess 28 is formed, the positioning accuracy in the surface direction of the semiconductor chip 100 is improved compared to when the positioning recess 28 is not formed. It is presumed that the principle behind this function is that the amplitude of the ultrasonic vibration changes suddenly at the boundary of the positioning recess 28.

[0050] That is, when the positioning recess 28 is present, it is estimated that the amplitude of the ultrasonic vibration generated on the holding surface 18 changes suddenly at the positioning recess 28. As a result, the ultrasonic holding force generated by the ultrasonic vibration also changes suddenly at the positioning recess 28. In such a case, as shown in FIG. 7 , if the semiconductor chip 100 is displaced in the planar direction relative to the holding surface 18, the ultrasonic holding force acting on the semiconductor chip 100 becomes unbalanced between the left and right. The semiconductor chip 100 moves in the planar direction to eliminate this force imbalance, so that the positional displacement of the semiconductor chip 100 in the planar direction is automatically corrected, i.e., self-aligned. As a result, the provision of the positioning recess 28 can improve the positioning accuracy of the semiconductor chip 100.

[0051] Next, the air flow forming groove 26 will be described. The air flow forming groove 26 is a groove connected to the suction source 36. The shape of the air flow forming groove 26 is not particularly limited as long as it is connected to the suction hole 22. In this example, the air flow forming groove 26 includes four lines extending radially or crisscrossing from the suction hole 22 and a substantially rectangular line surrounding the four lines.

[0052] The function of the air flow forming groove 26 will be described with reference to Fig. 12. Fig. 12 is an image diagram showing the function of the air flow forming groove 26. Note that the positioning recesses 28 are not shown in Fig. 12. When the air flow forming groove 26 is formed, the air flow in the surface direction between the semiconductor chip 100 and the holding surface 18 increases in speed and becomes stable.

[0053] That is, when the suction source 36 generates a suction force while the semiconductor chip 100 is levitated due to the ultrasonic squeeze effect, an airflow is generated in the levitation gap in a surface direction and toward the center. Here, without the airflow-forming groove 26, the surface-directed airflow toward the center tends to be slow and unstable due to the influence of fluid viscosity. Furthermore, the suction force acts locally only near the suction holes 22. In this case, even if the semiconductor chip 100 is misaligned in the surface direction, it is difficult for it to move in the surface direction, making it difficult for the misalignment to be corrected on its own.

[0054] On the other hand, as shown in FIG. 11 , when the airflow forming grooves 26 are formed, the gap between the semiconductor chip 100 and the holding surface 18 becomes thicker near the airflow forming grooves 26, reducing the influence of fluid viscosity acting on the entire airflow. As a result, the speed of the airflow in the planar direction increases, stabilizing the airflow in the planar direction. This stable airflow in the planar direction applies a force to the semiconductor chip 100 that moves the center of the semiconductor chip 100 closer to the suction holes 22 (and thus the center of the holding surface 18). This automatically positions the semiconductor chip 100 relative to the holding surface 18. Furthermore, by forming the airflow forming grooves 26, the peak suction force generated near the suction holes 22 can be reduced, dispersing the suction force in the planar direction. This facilitates movement of the semiconductor chip 100 in the planar direction and self-correction of misalignment in the planar direction. Note that the configurations of the positioning recesses 28 and the airflow forming grooves 26 described here are merely examples and may be modified as appropriate.

[0055] Next, a description will be given of a semiconductor device manufacturing apparatus 70 having such a chip holding device 10. Fig. 13 is a diagram showing an example of a manufacturing apparatus 70 having a chip holding device 10. The manufacturing apparatus 70 in Fig. 13 is an apparatus that manufactures a semiconductor device by bonding one or more semiconductor chips 100 to a substrate 110.

[0056] This manufacturing apparatus 70 has a chip supply source 72, a pickup unit 76, and a bonding unit 80. The chip supply source 72 is provided with semiconductor chips 100 attached to a dicing tape 74. The pickup unit 76 has push-up pins 77 that push up the semiconductor chips 100 attached to the dicing tape 74 from below, and a pickup collet 78 that picks up the pushed-up semiconductor chips 100. In this example, the above-mentioned chip holding device 10 is used as this pickup collet 78. In Figure 13, the pickup collet 78 (chip holding device 10) has a rotation axis 46 that extends in a direction parallel to the holding surface 18 on the outer side of the holding surface 18 in the planar direction.

[0057] The semiconductor chip 100 is attached to the dicing tape 74 with the surface to be bonded to the substrate 110, i.e., the bonding surface (the thick line portion in FIG. 13 ), facing upward. The chip holding device 10, which is a pickup collet 78, holds this bonding surface with its holding surface 18 in a non-contact manner.

[0058] After receiving the semiconductor chip 100 from the dicing tape 74, the pickup collet 78 rotates 180 degrees around the rotation axis 46. This changes the holding surface 18 from a downward facing state to an upward facing state. After rotating 180 degrees, the pickup collet 78 delivers the semiconductor chip 100 to the bonding tool 86.

[0059] Here, when the pickup collet 78 rotates, centrifugal force Fc does not act on the semiconductor chip 100 in a direction away from the holding surface 18. Therefore, the pickup collet 78 can be rotated at high speed while preventing the semiconductor chip 100 from separating from the holding surface 18. As a result, the lead time for manufacturing semiconductor devices can be shortened. Note that the controller 50 may change the acceleration, rotation radius, tilt angle of the holding surface 18, suction force, etc. in accordance with the rotation angle of the pickup collet 78 in order to more effectively prevent the semiconductor chip 100 from shifting position or separating.

[0060] The bonding section 80 has a stage 82 on which the substrate 110 is placed, and a bonding head 84 that holds and transports the semiconductor chip 100. The bonding head 84 has a bonding tool 86. The bonding tool 86 holds the semiconductor chip 100 by suction at its end surface and transports the semiconductor chip 100.

[0061] 13, the bonding tool 86 receives the semiconductor chip 100 from the pickup collet 78 which is in an upward position, and holds by suction the surface of the semiconductor chip 100 opposite to the bonding surface. After receiving the semiconductor chip 100 from the pickup collet 78, the bonding tool 86 moves to directly above a predetermined bonding position and bonds the semiconductor chip 100 to a substrate 110. A semiconductor device is manufactured by bonding the required number of semiconductor chips 100 to one substrate 110.

[0062] The configuration described above is merely an example, and other configurations may be changed as appropriate as long as the configuration described in claim 1 is included. For example, in the above description, the chip holding device 10 holds the semiconductor chip 100 using both ultrasonic holding force and suction force. However, the chip holding device 10 may not have the suction source 36 and may hold the semiconductor chip 100 using only ultrasonic holding force.

[0063] 10, 10* Chip holding device, 12 Chip holder, 14 Main body, 16 Holding plate, 18 Holding surface, 22 Suction hole, 24 Suction path, 26 Air flow forming groove, 28 Positioning recess, 30 Vibration source, 32 Ultrasonic vibration element, 34 AC power supply, 36 Suction source, 40 Rotation mechanism, 42 Power source, 46, 46* Rotation shaft, 50 Controller, 52 Processor, 54 Memory, 60 Lifting mechanism, 62 Power source, 64 Swing mechanism, 66 Swing mechanism, 68 Swing shaft, 70 Manufacturing apparatus, 72 Chip supply source, 74 Dicing tape, 76 Pickup unit, 78 Pickup collet, 80 Bonding unit, 82 Stage, 84 Bonding head, 86 Bonding tool, 100 Semiconductor chip, 110 Substrate, Fc Centrifugal force, Fg Gravity, Fgc Resultant force, Fi inertial force, Fs suction force, Fv ultrasonic holding force, Sf squeeze membrane.

Claims

1. A chip holding device comprising: a chip holding tool having a holding surface for holding a chip without contact, and a vibration source for applying ultrasonic vibrations to the holding surface to generate a holding force for holding the chip on the holding surface; and a rotation mechanism for rotating the chip holding tool around a specified rotation axis, wherein the rotation axis is an axis for rotating the chip in a direction for turning the chip upside down, and is an axis set in an area other than the area where the holding surface is pushed in the opposite direction to the chip.

2. A chip holding device as described in claim 1, characterized in that the rotation axis is set in an area where the holding surface is pushed out in a direction approaching the chip from the holding surface.

3. A chip holding device according to claim 1, characterized in that the rotation axis is an axis passing through the chip.

4. A chip holding device according to claim 1, characterized in that the rotation axis is set outside the holding surface when viewed in the axial direction of the chip holder.

5. A chip holding device as claimed in claim 4, further comprising a controller, which controls the rotation speed of the chip holder by the rotation mechanism in accordance with the rotation angle so that, at least temporarily, the vertical component of the centrifugal force acting on the chip is substantially balanced with the gravity acting on the chip.

6. A chip holding device as claimed in claim 4, further comprising a controller, wherein said controller rotates said chip holder while accelerating said chip holder using said rotation mechanism so that an inertial force acts on said chip in a direction approaching said holding surface, at least temporarily.

7. A chip holding device as described in claim 4, further comprising: a controller; and a suction source that applies negative pressure to the holding surface so as to suck the chip to the holding surface, wherein the controller makes at least one of the suction force by the suction source and the ultrasonic holding force by the vibration source greater when an inertial force acts on the chip in a direction away from the holding surface than when an inertial force acts on the chip in a direction towards the holding surface.

8. A chip holding device as claimed in claim 4, further comprising: a controller; and a swing mechanism for swinging the chip holder about a swing axis different from the rotation axis, wherein the controller swings the chip holder by the swing mechanism in accordance with the rotation angle, at least temporarily.

9. A chip holding device as claimed in claim 4, further comprising a controller, wherein the rotation mechanism is configured to be able to change a rotation radius, which is the distance from the rotation axis to the chip holder, and the controller causes the rotation mechanism to rotate the chip holder in a non-circular shape so that the rotation radius changes according to the rotation angle.

10. A semiconductor device manufacturing apparatus having a chip holding device according to any one of claims 1 to 9.

11. A chip holding method comprising: rotating a chip holder around a specified rotation axis while holding a chip in a non-contact manner on the holding surface of a chip holder; the rotation axis being an axis that rotates the chip in a direction that turns the chip upside down, and being an axis that is set in an area other than the area where the holding surface is pushed in the opposite direction to the chip.

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