Lid material and packaging material

Abstract

A lid material 30 for sealing a storage part 21 of a storage container 20 includes: a base material layer 35; a circuit pattern 32 provided on the base material layer 35 and having a wiring route that is broken when the storage part is opened; a resin layer 37 covering the circuit pattern 32 from the side opposite to the base material layer; and a layer 31 for heat adhesion with the storage container 20. The wiring route is provided with a terminal part connected to an external device 40 for detecting breakage. The resin layer 37 is divided into a first area 37A1 covering the terminal part and a second area 37A2 covering the part other than the terminal part. The thickness T2 of the second area 37A2 of the resin layer 37 is larger than the thickness T1 of the first area.

Description

Lid material, packaging material

[0001] The present technology relates to a lid material and a packaging material.

[0002] Conventionally, in a packaging material (e.g., a press-through package (PTP)) having a storage section for storing tablets or the like, a technology for detecting whether the storage section has been opened has been known, and an example of such a technology is disclosed in Patent Document 1. The packaging material described in Patent Document 1 includes a storage sheet (an example of a storage container) having a plurality of storage sections, and an opening detection sheet on which a circuit pattern is formed. When the contents are removed from the storage section, the circuit pattern on the opening detection sheet is broken. This break is detected by an external opening detector, thereby detecting whether the storage section has been opened.

[0003] The circuit pattern of the tamper detection sheet is divided into an area covered by a resin layer and an area that is not covered. The area that is not covered serves as a connection portion that is electrically connected to the terminal portion of the tamper detection device.

[0004] Japanese Patent Application Laid-Open No. 2020-189636

[0005] (Problem to be Solved by the Invention) Although an opening detection sheet can be attached to the lid of a storage sheet afterwards, it would be convenient if the opening detection sheet could be thermally bonded to the storage sheet in advance as the lid. Using the opening detection sheet as the lid makes it possible to add opening detection functionality to existing PTPs without increasing the number of manufacturing processes.

[0006] However, there is a concern that the connection portions of the circuit pattern of the tamper-detecting sheet described in Patent Document 1 may be damaged during thermocompression bonding. For example, in the PTP manufacturing process, thermocompression bonding of the lid material and the containing sheet is performed by applying a pressure of about 0.2 MPa to 0.4 MPa at a temperature range of about 200° C. to 300° C. The connection portions of the circuit pattern described in Patent Document 1 are not covered with a resin layer, and there is a concern that they may peel off from the substrate under such high temperature and pressure.

[0007] This technology was developed based on the above-mentioned circumstances, and aims to realize a lid material with an opening detection function that can be stably thermocompressed, and a packaging material equipped with the same.

[0008] (Means for solving the problem) The lid material related to the technology described in the present specification is a lid material that seals the storage section of a storage container, and includes a base layer, a circuit pattern provided on the base layer and having a wiring path that is broken when the storage section is opened, a resin layer that covers the circuit pattern from the opposite side of the base layer, and a thermal adhesive layer to the storage container, wherein the wiring path is provided with a terminal portion that is connected to an external device for detecting the breakage, and the resin layer is divided into a first region that covers the terminal portion and a second region that covers parts other than the terminal portion, and the thickness of the second region of the resin layer is greater than the thickness of the first region.

[0009] Furthermore, in the lid material having the above configuration, the resin layer may have a first resin layer that is provided across the first region and the second region, and a second resin layer that is provided in the second region but not in the first region.

[0010] In the lid material having the above configuration, the dry weight per unit area of ​​the second region of the resin layer is 3.0 g / m 2 Above, 5.0g / m 2 It may be the following:

[0011] In the lid material having the above configuration, the dry weight per unit area of ​​the first region of the resin layer is 0.6 g / m 2 Above, 2.5g / m 2 It may be the following:

[0012] In the cover member having the above configuration, the terminal portion may be configured to be electrically conductive by contacting with a tapered contact provided on the external device.

[0013] In the lid member having the above configuration, the thermal adhesive layer may be capable of sealing the storage portion by thermocompression bonding at a heating temperature of 220°C to 240°C.

[0014] The packaging material related to the technology described in this specification comprises a lid material of the above-mentioned configuration and a storage container having a storage section sealed by the lid material, and the contents in the storage section can be removed by breaking the lid material.

[0015] In the packaging material having the above configuration, the wiring path may have a shape that passes through an overlapping portion that overlaps the storage portion in a plan view, turns back, and passes through the overlapping portion again.

[0016] Effect of the Invention According to the present technology, it is possible to realize a lid material with an opening detection function that can be stably thermocompression bonded, and a packaging material including the same.

[0017] A perspective view of a PTP attached to an opening detector. A perspective view of the opening detector with the second lid displaced upward. An exploded perspective view of the PTP. A cross-sectional view showing how the opening detection sheet is thermally bonded to the sheet-like container by a heat roll. A top view of the PTP. A cross-sectional view taken along line II in FIG. 5. A cross-sectional view enlarging the vicinity of the second region of the resin layer in FIG. 6. A table showing the results of evaluation experiment 1. A top view of a PTP according to another embodiment.

[0018] 1 to 8. In this embodiment, an opening detection sheet 30 (an example of a lid material with an opening detection function) and a PTP (a press-through package, an example of a packaging material) 10 to which the opening detection sheet 30 is thermally bonded are illustrated. Note that some of the drawings show an X-axis, a Y-axis, and a Z-axis, and the directions of the axes are drawn so that they are common to all the drawings.

[0019] As shown in Fig. 1, the PTP 10 can detect an opened state by being attached to an external device, an opening detector 40. The opening detection method of the opening detector 40 and the method of outputting the opening detection result are not limited, but an example of the opening detector 40 will be described below with reference to Figs. 1 and 2. The opening detector 40 includes at least a plurality of contacts 41B (12 in this embodiment), a communication module 42, and a housing 50. The housing 50 houses each component and also serves as an attachment portion that detachably clamps and holds the PTP 10.

[0020] The housing 50 of the tamper detector 40 is made of a resin material and includes a first housing 51 and a second housing 52. The first housing 51 occupies the majority of the housing 50 and is recessed at the upper front side. The second housing 52 is a lid that covers the recess at the upper front side of the first housing 51. The second housing 52 is pressed in the vertical direction (Z-axis direction) and displaces toward the first housing 51. As a result, the PTP 10 is sandwiched and held between the first housing 51 and the second housing 52. In this manner, the PTP 10 is attached to the tamper detector 40.

[0021] The contact 41B of the opening detector 40 protrudes from the surface of the first housing 51 where the PTP 10 is sandwiched, and has a tapered tip. At least the protruding end of the contact 41B is conductive. When the PTP 10 is attached to the opening detector 40 (FIG. 1), the contact 41B comes into contact with and becomes conductive with each of the terminal portions 32Z1, 32A1-32J1 of the circuit pattern 32 of the PTP 10, which will be described later.

[0022] The communication module 42 of the opening detector 40 includes a control unit (detection unit) and a communication unit. The control unit passes a current through the contact 41B and detects the voltage generated in the circuit pattern 32 of the PTP 10. The control unit 44 then compares the detected voltage value with a predetermined threshold value, and if the detected voltage value is below the threshold value, determines that the circuit pattern 32 is not broken and is in an unopened state, and if the detected voltage value is greater than the threshold value, determines that the circuit pattern 32 is broken and is in an opened state. The communication unit transmits and outputs the determined opening detection information to the management server or the information processing terminal.

[0023] Next, the PTP 10 will be described in detail. As shown in Fig. 3, the PTP 10 includes a sheet-like container 20 including a storage section 21 for contents M such as tablets, and an opening detection sheet 30 that is thermocompression bonded to the sheet-like container 20. For example, as shown in Fig. 4, the opening detection sheet 30 is thermally bonded to the sheet-like container 20 by a heat roll HR provided in a contents filling machine. When the opening detection sheet 30 is thermally bonded to the sheet-like container 20, it covers the opening 21A of the storage section 21 and seals the storage section 21. The planar shape and planar size of the opening detection sheet 30 are formed so as to be able to cover the entire main surface of the sheet-like container 20, and in this embodiment, are substantially the same as those of the sheet-like container 20.

[0024] The sheet-like container 20 has a plurality of storage sections 21 protruding on the side opposite the tamper-evident sheet 30. Each storage section 21 has an internal space for storing the contents M, and the boundary with the tamper-evident sheet 30 forms an opening 21A. The storage sections 21 are formed to have a shape that follows the shape of the contents M when viewed from above. A material known as a sheet-like container for PTP is appropriately used for the sheet-like container 20. The sheet-like container 20 is, for example, a resin container made from a processed resin sheet material having a thickness of approximately 60 μm to 400 μm.

[0025] In this embodiment, each storage section 21 has a circular shape in a plan view, and ten storage sections 21 are formed, five at a time in the longitudinal direction (Y-axis direction) at a predetermined interval and two at a time in the transverse direction (X-axis direction) at a predetermined interval. The five storage sections 21 arranged in the longitudinal direction are formed closer to one short side 20A of the sheet-like container 20. As a result, a marginal region 20S that is wider than the region between the one short side 20A and the storage section 21 is formed between the other short side 20B of the sheet-like container 20 and the storage section 21. The marginal region 20S is the region that overlaps the first region 37A1 of the resin layer 37 of the opening detection sheet 30 described later in a plan view.

[0026] The opening detection sheet 30 is a press-through sheet-like composite material. The opening detection sheet 30 is thermally bonded to the sheet-like container 20 except for the portion covering the opening 21A of the storage section 21. As shown in Fig. 6 , the opening detection sheet 30 is an aluminum laminate in which, from the bottom (the sheet-like container 20 side), a thermal adhesive layer 31, a base layer 35 (aluminum foil 33 and insulating layer 34), a circuit pattern 32, and a resin layer (overcoat layer, protective layer) 37 are laminated.

[0027] The thermal adhesive layer 31 is thermally bonded to the sheet-like container 20 to cover the storage section 21. The sealing ability of the storage section 21 is appropriately designed depending on the use of the PTP 10, but it does not need to be airtight to the extent that gas does not leak at all, as long as it is airtight to the extent that solids do not leak at least. Known thermal adhesives for PTPs can be used for the thermal adhesive layer 31. The thermal adhesive layer 31 is made of a thermal adhesive such as a polyester-based adhesive, a polypropylene-based adhesive, a vinyl chloride-based adhesive, or a vinyl chloride-vinyl acetate copolymer-based adhesive (vinyl chloride-vinyl acetate-based adhesive).

[0028] The temperature at which the thermal adhesive layer 31 is thermocompressed, i.e., the heating temperature by the heat roll HR, is selected appropriately depending on the type of PTP 10, but is typically in the range of 220°C to 260°C or 200°C to 300°C. In this embodiment, since the second region 37A2 of the resin layer 37 is formed as a thick film as described below, the thermal adhesive layer 31 is preferably made of a low-melting-point material so that it can be reliably thermally bonded in a short time as before, even when heated by the heat roll HR through the thick resin layer 37. The thermal adhesive layer 31 may be made of a thermal adhesive such as a polyester-based adhesive, a polypropylene-based adhesive, a vinyl chloride-based adhesive, or a vinyl chloride-vinyl acetate copolymer-based adhesive (vinyl chloride-vinyl acetate-based adhesive).

[0029] The base layer 35 includes an aluminum foil 33 and an insulating layer 34. By using the aluminum foil 33 for the base layer 35, moisture resistance can be improved compared to resin or paper. The insulating layer 34 is interposed between the aluminum foil 33 and the circuit pattern 32, ensuring insulation between them. Note that the main surface of the aluminum foil 33 facing the insulating layer 34 may be coated entirely with, for example, a solid white ink to make it easier to read barcodes or two-dimensional barcodes printed as needed.

[0030] The circuit pattern 32 is provided on the main surface 34A of the insulating layer 34 opposite the aluminum foil 33. The circuit pattern 32 is a plurality of wiring patterns formed by printing a conductive ink or the like on the insulating layer 34. The circuit pattern 32 is formed, for example, by supplying the conductive ink in a predetermined pattern shape to the surface of the insulating layer 34 and then curing it. The conductive ink is a conductive composition in which conductive particles are dispersed in a vehicle containing a binder. For example, various particles composed of materials exhibiting good conductivity, such as gold, silver, copper, platinum, aluminum, and alloys thereof, as well as carbon black, are used. The conductive ink can be supplied by various printing methods, such as supplying using a dispenser, gravure printing, or inkjet printing. The conductive composition can be cured by a drying curing method, a heat curing method, or the like, depending on the type of conductive ink used.

[0031] 5, the circuit pattern 32 according to this embodiment includes wiring paths in the same number as the number of accommodation sections 21, more specifically, ten wiring paths 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, and 32J (hereinafter referred to as 32A-32J). Each of the wiring paths 32A-32J is provided for each accommodation section 21 so as to be a different path for each accommodation section 21.

[0032] Both ends of each of the wiring paths 32A-32J are provided on one of the short sides 10A of the PTP 10. Both ends of each of the wiring paths 32A-32J are provided with terminals that come into contact with and are connected to the contacts 41B of the opening detector 40. More specifically, a first terminal 32Z1 is provided on one end of each of the wiring paths 32A-32J, and second terminals 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, 32J1 (hereinafter referred to as 32A1-32J1) are provided on the other end.

[0033] The first terminal 32Z1 is provided at the same position for all of the wiring paths 32A-32J and is a terminal common to all of the wiring paths 32A-32J. The first terminal 32Z1 is connected to one of the contacts 41B, and a predetermined reference potential (specifically, GND potential) is supplied from the contact 41B. The second terminals 32A1-32J1 are provided at different positions for each of the wiring paths 32A-32J. Each of the second terminals 32A1-32J1 is connected to one of the contacts 41B, and a predetermined potential is supplied from the contact 41B. When a predetermined potential difference occurs between the first terminal 32Z1 and the second terminals 32A1-32J1 (when a voltage is applied), a current flows through each of the wiring paths 32A-32J.

[0034] Each wiring path 32A-32J is formed to connect the first terminal portion 32Z1 and the second terminal portions 32A1-32J1. The length of the wiring path 32A-32J is greater for wiring paths 32A-32J provided in the housing portion 21 that are farther away from the terminal portions 32Z1, 32A1-32J1. Each wiring path 32A-32J has an overlapping portion 32A2-32J2 that overlaps with the housing portion 21 in a plan view. When the housing portion 21 is opened, the overlapping portion 32A2-32J2 of the wiring paths 32A-32J is broken.

[0035] 5, the wiring paths 32A-32J may be formed so as to pass through the overlapping portions 32A2 and 32J2, turn back in a substantially U-shape, and then pass through the overlapping portions 32A2 and 32J2 again. In this way, the wiring paths 32A-32J are more reliably broken when the storage section 21 is opened.

[0036] When the PTP 10 is attached to the opening detector 40 (FIG. 1), the terminals 32Z1, 32A1-32J1 are electrically connected to the contacts 41B of the opening detector 40. When the PTP 10 is sandwiched between the first housing 51 and the second housing 52 of the opening detector 40, the contacts 41B are pressed toward the opposing terminals 32Z1, 32A1-32J1. As described above, the contacts 41B have a tapered tip, and are configured to be electrically connected to the terminals 32Z1, 32A1-32J1 when pressed.

[0037] The resin layer 37 is formed on the entire surface of the tamper detection sheet 30 as the outermost layer, covering and protecting the other layers of the tamper detection sheet 30. The resin layer 37 is printed and applied to the entire main surface 34A of the insulating layer 34, covering the entire circuit pattern 32. The material of the resin layer 37 is not particularly limited as long as it is a resin material, but it may be made of, for example, an epoxy-based resin material and formed by printing (MOP, Mat Over Print). The resin layer 37 protects the tamper detection sheet 30 from heat and pressure applied by the heat roll HR during manufacturing and from damage caused by external forces during transportation. Therefore, the resin layer 37 preferably has heat resistance and pressure resistance against heat applied by the heat roll HR, as well as adhesion strength (adhesion) that prevents it from easily peeling off due to external forces.

[0038] 5 to 7, the sheet surface of the resin layer 37 is divided into a first region 37A1 that covers the terminal portions 32Z1, 32A1-32J1 of the circuit pattern 32, and a second region 37A2 that covers most of the circuit pattern 32 except for the terminal portions 32Z1, 32A1-32J1. The first region 37A1 is a region on one short side 10A of the PTP 10 (see FIG. 5), and is a region that overlaps with the margin region 20S of the sheet-like container 20 in a plan view.

[0039] The resin layer 37 has a laminated structure of a first resin layer 38 and a second resin layer 39 in the layer thickness direction. The first resin layer 38 is applied across the first region 37A1 and the second region 37A2. The second resin layer 39 is applied to the second region 37A2 but not to the first region 37A1. As a result, the thickness T2 of the second region 37A2 of the resin layer 37 is greater than the thickness T1 of the first region, as shown in FIG. 7 .

[0040] In this manner, within the sheet surface of the tamper detecting sheet 30, the portion attached to the tamper detector 40, i.e., the terminal portions 32Z1, 32A1-32J1 of the circuit pattern 32, are protected by the first region 37A1 of the resin layer 37, while allowing electrical conduction with the tamper detector 40. More specifically, by adjusting the thickness T1 of the first region 37A1 of the resin layer 37 to be sufficiently small, the terminal portions 32Z1, 32A1-32J1 can be made electrically conductive with the contactors 41B of the tamper detector 40 via the thin-film first region 37A1. In this embodiment, the contactors 41B have a tapered tip, and when pressed, the contactors 41B are easily electrically conductive with the terminal portions 32Z1, 32A1-32J1 via the first region 37A1 of the resin layer 37. Depending on the thickness T1 of the first region 37A1 of the resin layer 37, the contact 41B penetrates the first region 37A1 of the resin layer 37 and contacts the terminals 32Z1, 32A1-32J1. This ensures electrical continuity between the contact 41B of the opening detector 40 and the terminals 32Z1, 32A1-32J1 of the opening detection sheet 30. Meanwhile, most of the sheet surface of the opening detection sheet 30 is covered by the second region 37A2 of the resin layer 37, which has a large thickness T2, ensuring insulation. As a result, an opening detection sheet 30 that can be stably thermocompression bonded to the sheet-like container 20 can be realized, and PTPs 10 can be manufactured using a conventional content filling machine.

[0041] The amount of resin layer 37 applied is such that the dry weight per unit area of ​​the first region 37A1 of the resin layer 37 is 0.6 g / m 2 Above, 2.5g / m 2 It is preferable that the dry weight is 0.6 g / m or less. 2 If the dry weight is less than 2.5 g / m, the thickness T1 of the first region 37A1 of the resin layer 37 becomes small, and the terminals 32Z1, 32A1-32J1 cannot be protected from the heat of the heat roll HR, and the heat resistance and pressure resistance cannot be ensured. 2 If it is larger, the thickness T1 of the first region 37A1 of the resin layer 37 becomes excessively large, and the terminal portions 32Z1, 32A1-32J1 cannot be electrically connected to the contact 41B of the opening detector 40.

[0042] The amount of resin layer 37 applied is set so that the dry weight per unit area of ​​the second region 37A2 of resin layer 37 is 3.0 g / m 2 Above, 5.0g / m 2 It is preferable that the dry weight is 3.0 g / m or less. 2 If the dry weight is less than 5.0 g / m, the thickness T2 of the second region 37A2 of the resin layer 37 becomes small, and it becomes impossible to ensure the insulation of the circuit pattern 32 covered with the second region 37A2 of the resin layer 37. 2 If it is larger, the thickness T2 of the second region 37A2 of the resin layer 37 becomes larger, and the insulation properties improve, but making it thicker than necessary increases the amount of resin used and requires more frequent application, which increases manufacturing costs.

[0043] <Evaluation Experiment 1> Evaluation Experiment 1 was conducted to evaluate the performance of the above-described PTP 10. In Evaluation Experiment 1, evaluation samples (Examples 1 to 6) of the PTP 10 were evaluated for the sealing property of the storage section 21 and the conductivity of the circuit pattern 32. The results of the evaluation experiment are shown in the table of FIG.

[0044] <Conditions> Thermal adhesive layer 31: Type 1 (hard vinyl chloride-based thermal adhesive sheet) or Type 2 (hard vinyl chloride-based thermal adhesive sheet, melting point higher than Type 1) Resin layer 37: Epoxy-based resin material Aluminum foil 33: White ink was applied to the entire main surface on the insulating layer 34 side in Examples 1 and 2, but not in Examples 3 to 6 Thermocompression bonding conditions to sheet-like container 20: temperatures of 180°C, 200°C, 220°C, 240°C, and 260°C, and pressure was constant at 0.3 MPa

[0045] <Evaluation Method> In the sealability test (leak test), the evaluation sample was evacuated at 0.07 MPa for 1 minute and the presence or absence of air leakage was evaluated. The sealability test was evaluated on a two-level scale of A or C, with no air leakage being rated as A (good) and air leakage being rated as C (bad). In the continuity test (device operation check), the device was attached to an opening detector 40 and continuity was checked. The continuity test was evaluated on a two-level scale of A or C, with continuity confirmed being A (good) and not confirmed being C (bad).

[0046] <Evaluation Results> As shown in Figure 8, in Examples 1 to 4 in which a Type 1 thermal adhesive sheet was used for thermal bonding 31, good results were obtained when the tamper-evident sheet 30 was bonded to the sheet-like container 20 by thermocompression bonding at a heating temperature of 220°C or higher (Rating A). On the other hand, in Examples 5 and 6 in which a Type 2 thermal adhesive sheet was used for thermal bonding 31, good results were obtained with thermocompression bonding at a heating temperature of 260°C (Rating A), but insufficient sealing was obtained with thermocompression bonding at a heating temperature of 240°C or lower (Rating C). It was confirmed that the use of a Type 1 thermal adhesive sheet, which has a lower melting point, made it easier to lower the temperature during thermocompression bonding.

[0047] Regarding conductivity, good results (rating A) were obtained for thermocompression bonding at a heating temperature of 220° C. or higher in all of Examples 1 to 6. On the other hand, for thermocompression bonding at a heating temperature of 200° C. or lower, the results of the previously conducted sealing test were poor (rating C), so a conductivity test was not conducted (shown as "-" in the table of FIG. 8).

[0048] <Other Embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included within the technical scope of the present invention.

[0049] (1) The shape of the circuit pattern 32 of the opening detection sheet 30 is an example and can be changed as appropriate. For example, the wiring paths 132A-132J may be formed like the opening detection sheet 130 of the PTP 100 shown in FIG. 9. Each wiring path 132A-132J may be formed so as to pass through each overlapping portion 132A2-132J2, return in a substantially U-shape, and then pass through each overlapping portion 132A2-132J2 again. In this way, all wiring paths 132A-132J are more reliably broken when the storage portion 21 is opened.

[0050] (2) The configuration of the base material layer 35 of the tamper-evident sheet 30 can be changed as appropriate depending on the purpose. For example, the aluminum foil 33 in the base material layer 35 is not limited to a single layer, and may be configured such that two aluminum foils are bonded together with an intermediate resin layer.

[0051] (3) The size and shape of the sheet-like container 20, the number and spacing of the storage sections 21, etc. shown in the drawings are merely examples and can be changed as appropriate.

[0052] 10: PTP (packaging material), 20: sheet-like container (storage container), 21: storage section, 21A: opening, 30, 130: opening detection sheet (lid material), 31: thermal adhesive layer, 32: circuit pattern, 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J: wiring path, 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, 32J1: second terminal portion, 32Z1: first terminal portion, 33: aluminum foil, 34: insulating layer, 35: base material layer, 37: resin layer, 37A1: first region, 37A2: second region, 38: first resin layer, 39: second resin layer, 40: opening detector (external device), 41B: contact, M: contents

Claims

1. A lid material for sealing a storage section of a storage container, comprising: a base layer; a circuit pattern provided on the base layer, the circuit pattern having a wiring path that is broken when the storage section is opened; a resin layer covering the circuit pattern from the opposite side to the base layer; and a thermal adhesive layer to the storage container, wherein the wiring path is provided with a terminal portion that is connected to an external device for detecting the breakage, the resin layer is divided into a first region covering the terminal portion and a second region covering a portion other than the terminal portion, and the thickness of the second region of the resin layer is greater than the thickness of the first region.

2. The lid material described in claim 1, wherein the resin layer comprises a first resin layer provided across the first region and the second region, and a second resin layer provided in the second region but not in the first region.

3. The dry weight per unit area of ​​the resin layer in the second region is 3.0 g / m 2 Above, 5.0g / m 2 The lid material according to claim 1 or 2, wherein:

4. The dry weight per unit area of ​​the resin layer in the first region is 0.6 g / m 2 Above, 2.5g / m 2 The lid material according to claim 1 or 2, wherein:

5. A lid material as described in claim 1 or 2, wherein the terminal portion is configured to be conductive by contacting with a tapered contact provided on the external device.

6. A lid material as described in claim 1 or 2, wherein the thermal adhesive layer is capable of sealing the storage section by thermocompression bonding at a heating temperature of 220°C to 240°C.

7. A packaging material comprising: a lid material as claimed in claim 1 or 2; and a storage container having a storage section sealed by the lid material, wherein the contents in the storage section can be removed by breaking the lid material.

8. A packaging material as described in claim 7, wherein the wiring path has a shape such that it passes through an overlapping portion that overlaps with the storage portion in a plan view, turns around, and passes through the overlapping portion again.

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