Semiconductor fabrication device

Abstract

Disclosed in the present invention is a semiconductor fabrication device. The semiconductor fabrication device comprises a developing machine, a curing mechanism, and an exhaust system, wherein the developing machine comprises a casing and a developing bearing platform located in the casing; and the curing mechanism comprises a hot plate arranged next to the developing bearing platform, a cover matching the hot plate, and a thermal insulation housing covering the hot plate and the cover, the hot plate, the cover and the thermal insulation housing each being arranged in the casing, thereby improving a developing effect.

Description

semiconductor manufacturing equipment

[0001] This application is based on the Chinese patent application with application number 202311773849.8 and application date December 21, 2023, and claims the priority of the Chinese patent application. The entire content of the above patent application is hereby introduced into this application as a reference. Technical Field

[0002] The present invention relates to the field of semiconductor processing technology, in particular to a semiconductor manufacturing device. Background Art

[0003] During the chip packaging process, the chip pads need to be rearranged, so a rewiring process is needed to generate a rewiring structure. During the rewiring process, a patterned metal layer electrically connected to the chip pads needs to be formed in the dielectric layer.

[0004] Exposure and development are key steps in creating a patterned metal layer. Prior to this process, a photoresist, a photosensitive material, must be coated on the wafer surface to form a photoresist film. After the photoresist film is formed through the coating process, an exposure device (a stepper) is used to pass light through a mask containing the circuit pattern, imprinting the circuit on the wafer. This process is called "exposure." After exposure, the exposed photoresist film is cleaned off in a process called "development." The patterned metal layer is then generated within the windows formed after development.

[0005] During the development process, a developer is required for wet processing. After the wet processing, moisture needs to be removed. In the prior art, a heating plate is generally used as a heating device to bake the wafer to remove moisture. After the moisture is removed, the developed wafer needs to be transported to the baking equipment for high-temperature baking to achieve the curing of the photoresist. The temperature of the photoresist layer coated on the wafer needs to be strictly controlled during the curing process, and the temperature of the working space where the wafer is located needs to be more uniform, otherwise it will affect the development effect and thus have a serious impact on the product quality. Therefore, the existing baking equipment is generally more complex and large, and uses wind control to achieve heat supply, and multiple heat sources are provided to ensure that the temperature in the entire working space is more uniform and avoid large temperature differences in the working space.

[0006] The above-mentioned setting of the baking equipment requires the wafer to travel a long distance and have a long interval during the conversion process from the development process to the baking process, which will have a great impact on the development effect of the product. Summary of the Invention

[0007] The object of the present invention is to provide a semiconductor manufacturing device to address the deficiencies in the prior art. The device can integrate a curing mechanism into a developing machine and be located next to the developing machine. After the developing process is completed, the device can be baked and cured more quickly, thereby avoiding an excessively long interval between the developing process and the baking process, and improving the developing effect.

[0008] The present invention provides a semiconductor manufacturing device, comprising:

[0009] The developing machine comprises a housing and a developing platform arranged in the housing;

[0010] The curing mechanism includes a baking tray disposed beside the developer carrier, a cover body cooperating with the baking tray, and an insulating shell covering the baking tray and the cover body, wherein the baking tray, the cover body, and the insulating shell are all disposed in the box body; the baking tray includes a heating plate body for carrying wafers;

[0011] The cover has a working state in which it is covered outside the heating tray and a non-working state away from the heating tray. In the working state, a baking space is enclosed between the cover and the heating tray. The cover is provided with a plurality of evenly arranged through holes.

[0012] An exhaust system is communicated with the through hole to extract volatile substances in the baking space.

[0013] Furthermore, a cover groove is provided on the side of the cover body facing the heating plate body, the cover groove has a bottom wall and a side wall, the through hole passes through the bottom wall, and when the cover body is in working state, the distance between the bottom wall and the heating plate body is not less than 1 cm.

[0014] Furthermore, when the cover is in working state, the distance between the bottom wall and the heating plate does not exceed 3 cm.

[0015] Furthermore, the baking tray also has a limiting ring provided on the heating tray body, and after the cover body is irradiated on the heating tray body, the side wall of the cover body groove matches the limiting ring.

[0016] Furthermore, the cover is a metal piece, and the thickness of the bottom wall is not less than the height of the baking space in the vertical direction.

[0017] Furthermore, the cover can be moved vertically toward or away from the heating plate.

[0018] Furthermore, the curing mechanism further comprises a lifting unit for controlling the cover to move in the vertical direction;

[0019] The lifting unit includes a sliding rod extending in a vertical direction, a slider matched with the sliding rod, and a driving mechanism. The slider is fixed on the cover body, and the driving mechanism drives the slider to slide along the sliding rod.

[0020] Furthermore, a plurality of the curing mechanisms are provided on the semiconductor manufacturing device, and the plurality of curing mechanisms are stacked in a vertical direction.

[0021] Furthermore, the baking tray also has support columns arranged on the heating tray body, and the support columns are used to support the wafer and are provided with at least three.

[0022] Furthermore, the curing mechanism also has a wafer sensor and / or a temperature sensor arranged on the heating plate.

[0023] Furthermore, a door is provided on the side of the heat-insulating shell facing the developing machine;

[0024] The semiconductor manufacturing device further includes a robot arm disposed between the developing platform and the curing mechanism.

[0025] Compared with the prior art, the present invention, through the arrangement of a baking tray and a cover, limits the wafer to a certain spatial range through the cover during the curing process of the developed wafer, thereby avoiding excessive heat release to the outside, focusing more heat in the baking space, and better achieving temperature control. In addition, through the through holes arranged on the cover, some volatile substances in the curing process can be released outwards and eventually extracted through the exhaust system, which can avoid the volatile substances adhering to the cover and splashing back on the wafer. The above arrangement can miniaturize the baking equipment, so that the curing mechanism can be integrated into the developing machine and located next to the developing machine, so that baking and curing can be carried out more quickly after the development process is completed, avoiding an excessively long interval between the development process and the baking process, and improving the development effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic structural diagram of a semiconductor manufacturing apparatus disclosed in an embodiment of the present invention;

[0027] FIG2 is a schematic structural diagram of a cover in a semiconductor manufacturing apparatus according to an embodiment of the present invention when in a working state;

[0028] 3 is a schematic structural diagram of a cover in a non-working state in a semiconductor manufacturing apparatus disclosed in an embodiment of the present invention;

[0029] FIG4 is an assembly diagram of the cover and the baking tray in the semiconductor manufacturing apparatus disclosed in an embodiment of the present invention when the cover is in a non-working state;

[0030] FIG5 is a top view of FIG4;

[0031] 6 is a perspective view of a cover in a semiconductor manufacturing apparatus according to an embodiment of the present invention;

[0032] Explanation of the accompanying drawings: 1-curing mechanism, 11-baking tray, 110-baking space, 111-heating tray, 112-limiting ring, 113-support column, 114-wafer sensor, 115-temperature sensor, 12-cover body, 120-through hole, 121-cover body groove, 1211-bottom wall, 1212-side wall, 13-insulating shell, 131-door body, 14-lifting unit, 141-slide rod, 142-slide block, 2-exhaust system. DETAILED DESCRIPTION

[0033] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0034] An embodiment of the present invention: As shown in Figures 1-6, a semiconductor manufacturing device is disclosed, including: a developing machine (not shown), a curing mechanism 1 and an exhaust system 2. The developing machine includes a housing and a developing carrier arranged in the housing; the developing carrier is used to support the wafer during the developing process.

[0035] The curing mechanism 1 includes a baking tray 11 disposed next to the development platform, a cover 12 cooperating with the baking tray 11, and an insulating shell 13 covering the baking tray 11 and the cover 12. The baking tray 11, the cover 12, and the insulating shell 13 are all disposed in a box; the baking tray 11 includes a heating plate 111 for supporting wafers;

[0036] The cover 12 has an operating state, where it covers the heating plate 111, and a non-operating state, where it is spaced away from the heating plate 111. As shown in FIG2 , in the operating state, a baking space 110 is defined between the cover 12 and the heating plate 111. The cover 12 is provided with a plurality of evenly spaced through holes 120. The exhaust system 2 communicates with the through holes 120 to extract volatile substances from the baking space 110.

[0037] The semiconductor manufacturing device disclosed in the present invention is provided with a curing mechanism 1 inside the housing of a developing machine and next to the developing machine, thereby conveniently achieving curing after development. Since the curing mechanism 1 is arranged adjacent to the developing machine, the transfer between the two is relatively convenient, thereby avoiding the problem of poor development caused by the developed wafer during the transfer process.

[0038] The curing mechanism 1 in this embodiment uses a baking tray 11 to heat the wafer, and the baking space 110 is limited to a certain range as much as possible through the cover 12 provided outside the baking tray 11, thereby better realizing uniform temperature control, meeting the conditions in the baking and curing process, and can replace large baking equipment.

[0039] For those skilled in the art, during the curing stage after development, when the photoresist on the wafer surface is baked and cured, the temperature requirements for the space are relatively high. Generally, a larger device is set up and heat is supplied by wind control. The heating method of air holes can make the temperature in the baking space more controllable and avoid large temperature differences.

[0040] For those skilled in the art, using a baking tray, which focuses heat in a single direction, is not typically an option. This single-source heating method makes it difficult to control temperature differences within the space. Large temperature differences within the chamber during wafer curing can affect development.

[0041] The present application utilizes the baking tray 11 and the cover 12 to confine the developed wafers within a certain space during the curing process. This prevents excessive heat release, focusing the heat within the baking space 110 and achieving better temperature control. Furthermore, through-holes are provided in the cover 12 to allow volatile substances to be released during the curing process and ultimately extracted by the exhaust system.

[0042] The above-mentioned arrangement enables the baking equipment to be miniaturized, so that the curing mechanism 1 can be integrated into the developing machine. At the same time, the curing mechanism 1 is arranged to be located next to the developing machine, so that baking and curing can be performed more quickly after the development process is completed, thereby avoiding an excessively long interval between the development process and the baking process, and improving the development effect.

[0043] In the prior art, it is generally not considered to place the high-temperature baking tray 11 of the curing mechanism 1 adjacent to the developer carrier. The temperature of the high-temperature baking tray 11 of the curing mechanism 1 is generally required to be 300°C. Excessively high temperatures not only affect the developer equipment and thus the developer process, but also the control of the temperature difference during the curing process makes it difficult to use a point heat source heating method for the curing and baking device. Although the prior art also provides a heating tray on the developer platform, the upper limit of these heating trays is generally only 100°C. These heating trays are mainly used to remove some moisture after wet processing, so the heating temperature is generally low. This low temperature has less impact on the curing of the photoresist, and therefore it can generally be set directly on the developer platform.

[0044] In this embodiment, since the baking tray 11 of the curing mechanism 1 is arranged in the developing machine and is located next to the developing carrier, in order to prevent the high temperature heat of the baking tray 11 from affecting the developing equipment, the insulating shell 13 is provided in the embodiment of the present invention. The insulating shell 13 is provided outside the baking tray 11 and the cover body 12, which can effectively reduce the outward radiation of the heat of the baking tray 11, and further reduce the impact of the heat of the baking tray 11 on the external developing equipment.

[0045] In this embodiment, the cover 12 and the insulating shell 13 form two layers of insulation to prevent heat from the baking pan 11 from radiating outward. Furthermore, the provision of the insulating shell 13 can also reduce heat loss from the baking pan 11, thereby slowing down heat loss from the baking space 110, thereby better enabling the curing mechanism 1 to meet the heating, baking, and curing conditions.

[0046] In a specific embodiment, a cover groove 121 is provided on the side of the cover body 12 facing the heating plate body 111. The cover groove 121 has a bottom wall 1211 and a side wall 1212. The through hole 120 passes through the bottom wall 1211. When the cover body 12 is in working state, the distance between the bottom wall 1211 and the heating plate body 111 is not less than 1 cm.

[0047] The above-mentioned arrangement of the cover body 12 can make the baking space 110 have a sufficiently large space. If the distance between the bottom wall 1211 and the heating plate body 111 is small, excessive volatiles will easily accumulate in the baking space 110 during the heating process and cannot be discharged in time. The consequence of this is that the pressure in the baking space 110 increases instantly, and the large pressure will affect the yield of the product.

[0048] Furthermore, when the cover 12 is in operation, the distance between the bottom wall 1211 and the heating tray 111 does not exceed 3 cm. If the distance between the cover 1211 and the heating tray 111 is too large, the baking space 110 will be larger, and the larger space will cause uneven heat dissipation, resulting in uneven temperature throughout the baking space 110, affecting the subsequent development effect.

[0049] The baking tray 11 further includes a limiting ring 112 disposed on the heating tray body 111 . After the cover body 12 is covered on the heating tray body 111 , the side wall 1212 of the cover body 12 matches the limiting ring 112 .

[0050] The outer wall of the limiting ring 112 can be in contact with the inner side of the side wall 1212, or the inner wall of the limiting ring 112 can be in contact with the outer side of the side wall 1212. The setting of the limiting ring 112 can make the cover 12 fit more tightly on the baking tray 11. At the same time, the limiting ring 112 can prevent the cover 12 from moving in the horizontal direction, thereby limiting the position of the cover 12.

[0051] In this embodiment, the cover 12 is a metal part. Specifically, the cover 12 is made of copper. The copper cover 12 can accumulate heat, thereby providing a certain amount of heat above the wafer, thereby providing better heat for the solidification of the wafer.

[0052] Furthermore, the thickness of the bottom wall 1211 is not less than the height of the baking space 110 in the vertical direction. The above arrangement of the bottom wall 1211 enables the bottom wall 1211 to store enough heat to meet the heat supply in the baking space 110.

[0053] In this embodiment, as shown in Figure 6, the through holes 120 provided on the cover body 12 are evenly arranged on the bottom wall 1211, and the through holes 120 are densely distributed on the bottom wall 1211. The above-mentioned setting of the cover body 12 can enable the volatilized substances to be quickly released outward and leave the baking space 110. The covering setting of the cover body 12 allows there to be sufficient heat in the baking space 110, so that the volatile substances can be maintained in a gaseous state during the flow in the baking space 110, thereby preventing the volatile substances from being cooled during the movement and precipitating on the side of the cover body 12 facing the wafer, thereby preventing the volatile substances from splashing back to the wafer surface.

[0054] After flowing out of the through-holes 120, the volatile substances are quickly extracted by the exhaust system 2, thereby preventing the volatile substances from settling on the inner wall of the insulating shell 13. Even if the volatile substances are pre-cooled and quickly settle after leaving the baking space 110, the cover 12 can act as a filter to receive these sediments, so that the volatile substances adhere to the side of the cover 12 facing away from the wafers, thereby protecting the wafers.

[0055] In this embodiment, the cover 12 can be moved vertically toward or away from the heating plate 111. When the cover 12 moves toward the heating plate 111, it abuts against the heating plate 111, thereby positioning the cover 12 in the working state. After the cover 12 moves away from the heating plate 111, it can be moved to the non-working state. When the cover 12 moves to the non-working state, it facilitates unloading of wafers from the heating plate 111 or loading of wafers onto the heating plate 111.

[0056] As shown in Figures 2-4, to facilitate the control of the lifting and lowering of the cover 12, the curing mechanism 1 further includes a lifting unit 14 for controlling the vertical movement of the cover 12. The lifting unit includes a vertically extending slide rod 141, a slider 142 engaged with the slide rod 141, and a drive mechanism. The slider 142 is fixed to the cover 12, and the drive mechanism drives the slider 142 to slide along the slide rod 141. The drive mechanism can be a cylinder or a motor, and the motor controls the vertical movement of the slider 142 through the engagement of a lead screw and a lead screw nut.

[0057] In the above embodiment, the cover 12 moves vertically toward or away from the baking tray 11. In other embodiments, the cover 12 may also move away from the baking tray 11 by flipping or rotating.

[0058] In a specific embodiment, a plurality of curing mechanisms 1 are provided on the semiconductor manufacturing apparatus, and the plurality of curing mechanisms 1 are stacked vertically. The plurality of curing mechanisms 1 can simultaneously bake and cure multiple wafers, thereby reducing the waiting time before baking and curing the wafers.

[0059] In this embodiment, the baking tray 11 further includes support columns 113 disposed on the heating tray body 111. The support columns 113 are used to support the wafer and are provided in at least three forms. The three support columns 113 are arranged along the circumference of the heating tray body 111. The three support columns 113 can support one surface, that is, support the wafer.

[0060] The curing mechanism 1 further comprises a wafer sensor 114 and a temperature sensor 115 provided on the heating plate 111. The wafer sensor 114 is used to detect whether there is a wafer on the heating plate 111, and the temperature sensor 115 is used to sense the temperature of the wafer surface.

[0061] It is understandable that the curing mechanism 1 further includes a heating wire disposed on the back of the heating tray 111 , and the heating wire generates heat to provide heat for the entire baking space 110 .

[0062] Furthermore, a door 131 is provided on the side of the insulating housing 13 facing the developing platform. The semiconductor manufacturing apparatus further includes a robotic arm disposed between the developing platform and the curing mechanism 1. When the door 131 is opened, the robotic arm moves from the developing platform to the heating plate 111 of the curing mechanism 1.

[0063] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A semiconductor manufacturing device, characterized in that: include: The developing machine comprises a housing and a developing bearing platform arranged in the housing; The curing mechanism comprises a baking tray arranged beside the developing platform, a cover body matched with the baking tray, and an insulating shell arranged outside the baking tray and the cover body, wherein the baking tray, the cover body and the insulating shell are all arranged inside the box body; the baking tray comprises a heating tray body for carrying the wafer; The cover body has a working state in which it is covered outside the heating plate body and a non-working state away from the heating plate body. In the working state, a baking space is enclosed between the cover body and the heating plate body. The cover body is provided with a plurality of evenly arranged through holes. An exhaust system is communicated with the through hole to extract volatiles in the baking space.

2. The semiconductor manufacturing device according to claim 1, characterized in that: A cover groove is provided on the side of the cover body facing the heating plate body, the cover groove has a bottom wall and a side wall, the through hole penetrates the bottom wall, and when the cover body is in working state, the distance between the bottom wall and the heating plate body is not less than 1 cm.

3. The semiconductor manufacturing device according to claim 2, characterized in that: When the cover is in working state, the distance between the bottom wall and the heating plate does not exceed 3 cm.

4. The semiconductor manufacturing device according to claim 2, characterized in that: The baking tray also has a limiting ring arranged on the heating tray body. After the cover body irradiates the heating tray body, the side wall of the cover body groove matches the limiting ring.

5. The semiconductor manufacturing device according to claim 2, characterized in that: The cover body is a metal piece, and the thickness of the bottom wall is not less than the height of the baking space in the vertical direction.

6. The semiconductor manufacturing device according to claim 1, wherein: The cover body can be moved along the vertical direction toward or away from the heating plate body.

7. The semiconductor manufacturing device according to claim 6, characterized in that: The curing mechanism also has a lifting unit for controlling the cover to move in the vertical direction; The lifting unit comprises a sliding rod extending in a vertical direction, a slider matched with the sliding rod, and a driving mechanism. The slider is fixed on the cover body, and the driving mechanism drives the slider to slide along the sliding rod.

8. The semiconductor manufacturing device according to claim 1, wherein: A plurality of the curing mechanisms are arranged on the semiconductor manufacturing device, and the plurality of the curing mechanisms are stacked in a vertical direction.

9. The semiconductor manufacturing device according to claim 1, characterized in that: The baking tray also has support columns arranged on the heating tray body, and the support columns are used to support the wafer and at least three of them are arranged.

10. The semiconductor manufacturing device according to claim 1, wherein: The curing mechanism further comprises a wafer sensor and / or a temperature sensor arranged on the heating plate.

11. The semiconductor manufacturing device according to claim 1, wherein: A door body is provided on the side of the heat-insulating shell facing the developing machine; The semiconductor manufacturing device further comprises a robot arm arranged between the developing platform and the curing mechanism.

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