Plating solution supply device, plating system, and maintenance method for plating solution supply device

Abstract

The present invention provides a plating solution supply device and a maintenance method, with which it is possible to perform maintenance while preventing scattering of a powder as much as possible.　This plating solution supply device for supplying a plating solution that is used for plating includes: a hopper housing that houses a hopper and also houses a feeder in a state in which a part of the feeder is protruded to the outside, the hopper housing being able to be switched between a connected state in which the part of the feeder is housed in a tank housing and a separated state in which the part of the feeder is positioned outside the tank housing; and a cover member that is attached to the hopper housing and is able to be switched between a covering state in which the part of the feeder is housed and an exposing state in which the part of the feeder is exposed.

Description

Plating solution supply device, plating system, and maintenance method for plating solution supply device

[0001] The present invention relates to a plating solution supply device, a plating system, and a maintenance method for the plating solution supply device.

[0002] Conventionally, wiring has been formed in minute wiring grooves, holes, or resist openings provided on the surface of a substrate such as a semiconductor wafer, or bumps (protruding electrodes) that electrically connect to package electrodes, etc., have been formed on the surface of the substrate. While electrolytic plating, vapor deposition, printing, ball bumping, and the like are known as methods for forming such wiring and bumps, with an increase in the number of I / Os on semiconductor chips and finer pitches, electrolytic plating, which allows for finer wiring and has relatively stable performance, has come to be widely used.

[0003] In electrolytic plating devices, an anode and a substrate are generally placed opposite each other in a plating tank containing a plating solution, and a voltage is applied between the anode and the substrate, forming a plating film on the surface of the substrate.

[0004] Conventionally, electrolytic plating apparatuses have used either soluble anodes that dissolve in the plating solution or insoluble anodes that do not dissolve in the plating solution. When plating is performed using insoluble anodes, metal ions in the plating solution are consumed as the plating process progresses. Therefore, it is necessary to periodically replenish the plating solution with metal ions to adjust the concentration of the metal ions in the plating solution. Therefore, an apparatus is known that dissolves metal powder in a plating solution contained in a plating solution tank separate from the plating tank and supplies the plating solution to the plating tank (see, for example, Patent Document 1). The apparatus described in Patent Document 1 includes a hopper that contains the metal powder and a feeder that transports the metal powder that falls from the bottom opening of the hopper toward the plating solution tank.

[0005] Japanese Patent Application Laid-Open No. 2017-141503

[0006] The above-mentioned hoppers and feeders may experience problems in supplying powder to the plating solution tank, such as powder adhesion due to evaporation of the plating solution and adhesion to the machine surface, or clumps in the powder causing blockages. For this reason, it is desirable to perform maintenance on plating solution supply devices when an abnormality occurs or periodically. However, there is a risk of metal powder scattering during maintenance. If metal powder scatters within a manufacturing plant, it may adversely affect the plating equipment or harm the health of workers.

[0007] The present invention has been made in view of the above problems, and one of its objects is to provide a plating solution supply device, a plating system, and a maintenance method that can perform maintenance while preventing powder scattering as much as possible.

[0008] According to one aspect of the present invention, there is provided a plating solution supplying device for supplying a plating solution used in plating, the plating solution supplying device comprising: a mixing tank configured to dissolve a powder containing a metal in a plating solution; a tank housing that accommodates the mixing tank; a hopper configured to accommodate the powder; a feeder configured to supply the powder toward the mixing tank from an opening provided in a lower part of the hopper; a hopper housing that accommodates the hopper and accommodates the feeder with a portion of the feeder protruding to the outside, the hopper housing being changeable between a connected state in which the portion of the feeder is accommodated within the tank housing and a separated state in which the portion of the feeder is located outside the tank housing; and a cover member attached to the hopper housing and changeable between a covered state in which the portion of the feeder is accommodated and an exposed state in which the portion of the feeder is exposed.

[0009] FIG. 1 is a schematic diagram showing the overall configuration of a plating system according to an embodiment of the present invention. FIG. 2 is a diagram showing details of the plating tank shown in FIG. 1. FIG. 3 is a perspective view showing the appearance of a plating solution supply device according to an embodiment of the present invention. FIG. 4 is a schematic view showing the configuration of a plating solution supply device according to an embodiment of the present invention. FIG. 5 is a diagram showing the inside of a sealed chamber according to an embodiment of the present invention. FIG. 6 is a perspective view of a hopper housing and a sealed chamber according to an embodiment of the present invention, as viewed from above. FIG. 7 is a schematic view showing the configuration of a plating solution supply device in a connected state. FIG. 8 is a schematic view showing the configuration of a plating solution supply device in a separated state. FIG. 9 is a perspective view showing the appearance of a plating solution supply device in a separated state. FIG. 10 is a flowchart showing an example of a maintenance method for a plating solution supply device. FIG. 11 is a perspective view showing an example of the appearance of a hopper housing in a separated state.

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, identical or corresponding components are designated by the same reference numerals, and redundant description will be omitted. FIG. 1 is a schematic diagram showing the overall configuration of a plating system according to this embodiment. In this embodiment, a plating apparatus 1 is an electrolytic plating unit for electrolytically plating a metal such as copper onto a substrate such as a wafer. Furthermore, a plating solution supply device 20 is a device for adjusting the metal ion concentration in the plating solution used in the plating apparatus 1.

[0011] Examples of metals to be plated on the substrate include copper, indium, nickel, cobalt, and ruthenium. Examples of powders include copper oxide powder, sulfates such as indium sulfate, nickel sulfate, and cobalt sulfate, sulfamates such as nickel sulfamate and cobalt sulfamate, halides such as nickel bromide, nickel chloride, and cobalt chloride, and indium oxide. In this embodiment, the average particle size of the powder containing at least a metal is in the range of 10 to 200 micrometers, and more preferably in the range of 15 to 50 micrometers. If the average particle size is too small, the powder may become dust and be easily dispersed. Conversely, if the average particle size is too large, the powder may have poor solubility in the plating solution.

[0012] The plating apparatus 1 has a plurality of plating tanks 2 for plating substrates. Each plating tank 2 has an inner tank 5 and an outer tank 6. A plating solution fills the inner tank 5 and overflows from the sidewall of the inner tank 5 into the outer tank 6. A substrate to be plated (not shown in FIG. 1 ) is immersed in the plating solution in the inner tank 5. In one embodiment, the plating apparatus 1 may have a single plating tank 2.

[0013] FIG. 2 is a detailed view of the plating tank 2 shown in FIG. 1 . As shown in FIG. 2 , an insoluble anode 8 held by an anode holder 9 is disposed in the inner tank 5. Furthermore, a neutral film (not shown) is disposed around the insoluble anode 8 in the plating tank 2. The inner tank 5 is filled with a plating solution, which overflows the inner tank 5 and flows into the outer tank 6. The inner tank 5 may be provided with a stirring paddle (not shown) for stirring the plating solution. This stirring paddle reciprocates parallel to the substrate W to stir the plating solution, thereby enabling sufficient metal ions and additives to be uniformly supplied to the surface of the substrate W.

[0014] A substrate W such as a wafer is held by a substrate holder 11 and is immersed together with the substrate holder 11 in the plating solution in the inner tank 5 of the plating tank 2. The substrate W, which is the object to be plated, may be a semiconductor substrate, a printed wiring board, or the like.

[0015] The insoluble anode 8 is electrically connected to the positive electrode of a plating power supply 15 via an anode holder 9, and the substrate W held by the substrate holder 11 is electrically connected to the negative electrode of the plating power supply 15 via the substrate holder 11. When a voltage is applied by the plating power supply 15 between the insoluble anode 8 immersed in the plating solution and the substrate W, an electrochemical reaction occurs in the plating solution contained in the plating tank 2, and a metal (e.g., copper) is deposited on the surface of the substrate W. In this way, the surface of the substrate W is plated with the metal.

[0016] Returning to FIG. 1, the plating solution supply device 20 includes a main tank 18 configured to hold the plating solution therein, and a mixing tank 19 that mixes and dissolves powder (hereinafter simply referred to as metal powder) containing at least a metal (e.g., copper) into the plating solution to produce a highly concentrated replenisher plating solution.

[0017] The plating tank 2 and main tank 18 of the plating apparatus 1 are connected by a plating solution supply line 21 and a plating solution return line 24. The plating solution supply line 21 extends from the main tank 18 to the plating tank 2, and the plating solution return line 24 extends from the plating tank 2 to the main tank 18. During plating of a substrate, the plating solution circulates between the plating tank 2 and the main tank 18.

[0018] A portion of the plating solution supply line 21 is made up of a plurality of branch supply lines 21a, each of which is connected to the bottom of the inner tank 5 of the plating tank 2. A flow rate control valve 26 is attached to each of the branch supply lines 21a. The flow rate of the plating solution from the main tank 18 is adjusted by the flow rate control valve 26, and the plating solution flows into the plating tank 2 at the adjusted flow rate. Similarly, a portion of the plating solution return line 24 is made up of a plurality of branch return lines 24a, each of which is connected to the bottom of the outer tank 6 of the plating tank 2. An on-off valve 27 is attached to each of the branch return lines 24a.

[0019] The plating solution supply device 20 further includes a first temperature sensor 30 that measures the temperature of the plating solution in the main tank 18, a first liquid level detector 31 that measures the liquid level of the plating solution in the main tank 18, a first agitator 33 that agitates the plating solution in the main tank 18, and an additive inlet 34 that introduces an additive into the plating solution in the main tank 18. The first temperature sensor 30, the first liquid level detector 31, the first agitator 33, and the additive inlet 34 are attached to the top of the main tank 18. The first agitator 33 has an agitating blade 33a disposed in the main tank 18.

[0020] The plating solution supply device 20 further includes a circulation pump 38, a first temperature regulator 39, an on-off valve 41, a flow meter 42, and a filter 44 attached to the plating solution supply line 21. When the circulation pump 38 is operated, the plating solution in the main tank 18 is supplied to the inner tank 5 of the plating tank 2 through the plating solution supply line 21, overflows the sidewall of the inner tank 5, flows into the outer tank 6, and is returned to the main tank 18 through the plating solution return line 24. In this manner, as the circulation pump 38 operates, the plating solution circulates between the plating tank 2 and the main tank 18. The temperature of the plating solution flowing through the plating solution supply line 21 is adjusted by the first temperature regulator 39 to within a predetermined plating temperature range. The plating temperature range is predetermined based on the plating process of the substrate in the plating tank 2. In one example, the plating temperature range is 25°C to 45°C. The temperature-adjusted plating solution passes through a flow meter 42, a filter 44, and a flow control valve 26 and is supplied to each inner tank 5 of the plating tank 2. The flow rate of the plating solution passing through the plating solution supply line 21 is measured by the flow meter 42.

[0021] A pressure relief line 48 branches off from the plating solution supply line 21, and the tip of the pressure relief line 48 is connected to the top of the main tank 18. A pressure sensor 49 and a pressure relief valve 50 are attached to this pressure relief line 48. When the pressure in the plating solution supply line 21 exceeds a certain set value due to clogging of the filter 44 or other reasons, the pressure relief valve 50 opens, and a portion of the plating solution passing through the plating solution supply line 21 is returned to the main tank 18 through the pressure relief line 48.

[0022] A first concentration meter 54 for measuring the concentration of metal ions (e.g., copper ions in the case of copper plating) in the plating solution is attached to the plating solution return line 24. The first concentration meter 54 is connected to an operation control unit 57, and the measured value of the metal ion concentration is transmitted from the first concentration meter 54 to the operation control unit 57. The operation control unit 57 controls the operations of the plating apparatus 1 and the plating solution supply device 20. The operation control unit 57 may be composed of a dedicated or general-purpose computer.

[0023] The plating solution supply device 20 includes a second temperature sensor 60 that measures the temperature of the replenishment plating solution in the mixing tank 19, a second liquid level detector 61 that measures the liquid level of the replenishment plating solution in the mixing tank 19, a second agitator 64 that agitates the replenishment plating solution in the mixing tank 19, and a second concentration meter 66 that measures the metal ion concentration in the replenishment plating solution in the mixing tank 19. The second temperature sensor 60, the second liquid level detector 61, the second agitator 64, and the second concentration meter 66 are attached to the top of the mixing tank 19. The second agitator 64 has an agitating blade 64a disposed inside the mixing tank 19.

[0024] The plating solution supply device 20 further includes a plating solution replenishment line 68 connecting the mixing tank 19 to the main tank 18. A mixing pump 71, a second temperature regulator 73, a replenishment valve 74, and a flow meter 75 are attached to the plating solution replenishment line 68. The replenishment valve 74 is normally closed. When the replenishment valve 74 is opened while the mixing pump 71 is operating, the high-concentration replenishment plating solution produced in the mixing tank 19 is injected into the plating solution held in the main tank 18 through the plating solution replenishment line 68. The replenishment plating solution has a higher concentration of metal ions than the concentration of metal ions in the plating solution in the main tank 18.

[0025] The plating solution supply device 20 further includes a mixed circulation line 77 branching off from the plating solution replenishment line 68. One end of the mixed circulation line 77 is connected to the plating solution replenishment line 68, and the other end of the mixed circulation line 77 is connected to the mixing tank 19. A mixed circulation valve 78 is attached to the mixed circulation line 77. The mixed circulation valve 78 is normally open. When the mixing pump 71 is operated with the replenishment valve 74 closed, the replenishment plating solution circulates through the mixing tank 19, a portion of the plating solution replenishment line 68, and the mixed circulation line 77.

[0026] The mixing pump 71 and the second temperature regulator 73 are located upstream of the mixed circulation line 77. The temperature of the replenishment plating solution is adjusted by the second temperature regulator 73 while circulating through the mixing tank 19, a portion of the plating solution replenishment line 68, and the mixed circulation line 77. As an example, the temperature of the replenishment plating solution is adjusted to a temperature (e.g., 80°C) higher than the plating temperature range described above.

[0027] The plating system further includes a powder supplying device 80 that supplies metal powder containing at least a metal such as copper to the mixing tank 19. As an example, the powder supplying device 80 is located in a downstairs room and isolated from the clean room. The powder supplying device 80 is connected to the mixing tank 19 and configured to add a set amount of metal powder to the mixing tank 19. The plating solution containing the metal powder is agitated by the second agitator 64 in the mixing tank 19 and circulates through the mixing tank 19, a portion of the plating solution replenishment line 68, the second temperature regulator 73, and the mixing circulation line 77. As a result, the metal powder is dissolved in the plating solution, producing a highly concentrated replenished plating solution.

[0028] The mixing tank 19 is a sealed tank. An exhaust line 82 is connected to the top of the mixing tank 19. One end of the exhaust line 82 is connected to the mixing tank 19, and the other end of the exhaust line 82 is connected to a vacuum pump (not shown). An exhaust filter 83 is attached to the exhaust line 82. As described above, the replenishment plating solution in the mixing tank 19 is maintained at a relatively high temperature by the second temperature regulator 73, causing steam to be generated from the replenishment plating solution. This steam flows into the exhaust line 82 and is captured by the exhaust filter 83. Furthermore, the exhaust filter 83 can capture a portion of the metal powder supplied from the powder supply device 80 to the mixing tank 19. The exhaust filter 83 can be made of a nonwoven fabric made of a resin such as polypropylene that is resistant to the plating solution.

[0029] The plating system further includes a withdrawal line 86 branching off from the plating solution supply line 21, and a flow meter 87 and a withdrawal valve 88 attached to the withdrawal line 86. One end of the withdrawal line 86 is connected to the plating solution supply line 21, and the other end of the withdrawal line 86 is connected to the mixing tank 19. The flow meter 87 is configured to measure the flow rate of the plating solution passing through the withdrawal line 86. The withdrawal valve 88 is normally closed.

[0030] When the concentration of metal ions in the plating solution in plating tank 2 is within an appropriate range (e.g., higher than a preset threshold), mixing circulation valve 78 is open and replenishment valve 74 is closed. When the concentration of metal ions in the plating solution in plating tank 2 is lower than the threshold, mixing circulation valve 78 is closed and replenishment valve 74 is opened. This operation supplies a high-concentration replenishment plating solution from mixing tank 19 through plating solution replenishment line 68 to main tank 18. The replenishment plating solution is mixed with the plating solution in main tank 18.

[0031] The plating solution supplying apparatus 20 will be further described. FIG. 3 is a perspective view showing the appearance of the plating solution supplying apparatus of this embodiment, and FIG. 4 is a schematic diagram showing the configuration of the plating solution supplying apparatus of this embodiment. Note that the main tank 18 and other components are not shown in FIGS. 3 and 4. The powder supplying device 80 in the plating solution supplying apparatus 20 has a hopper 133, a feeder 130, and a motor 131. The plating solution supplying apparatus 20 also has a sealed chamber 124, a hopper housing 210 that houses the hopper 133 and the feeder 130, and a tank housing 260 that houses the mixing tank 19 and the main tank 18.

[0032] FIG. 5 is a diagram showing the interior of the sealed chamber 124 of this embodiment. A powder container 121 containing copper oxide powder is loaded into the sealed chamber 124. Arranged within the sealed chamber 124 are a vacuum clamp 161 that holds the powder container 121 by vacuum suction, a vibration device (vibrator) 165 that vibrates the powder container 121, and a base 166 that supports the powder container 121. The powder container 121 is placed on the vacuum clamp 161 and base 166 with the powder conduit 146 facing downward. The vacuum clamp 161 is fixed to a frame 168, and the vibration device 165 is fixed to the vacuum clamp 161. The vacuum clamp 161 has a vibration-isolating rubber 161a that contacts the powder container 121. The vibration-isolating rubber 161a has a through-hole (not shown) formed therein for creating a vacuum. The operation of the vibration device 165 and the vacuum clamp 161 is controlled by the operation control unit 57 shown in FIG. 1.

[0033] The vacuum clamp 161 is connected to an ejector 170, which is a vacuum generating device. The ejector 170 and the vibrating device 165 are connected to a compressed air supply pipe 172. The compressed air supply pipe 172 branches into two pipes: one connected to the ejector 170 and the other connected to the vibrating device 165. When compressed air is sent to the ejector 170, the ejector 170 creates a vacuum within the vacuum clamp 161, and the powder container 121 is held by the vibration-isolating rubber 161a of the vacuum clamp 161 through vacuum suction. The vibrating device 165 is structured to be operated by compressed air. The vibrating device 165 transmits vibrations to the powder container 121 through the vacuum clamp 161, vibrating the powder container 121 held by the vacuum clamp 161. The vibrating device 165 may be in direct contact with the side of the powder container 121. In one embodiment, the vibrating device 165 may be an electrically powered vibrating device.

[0034] An inlet 126 of a hopper 133 connectable to a powder container 121 is disposed within the sealed chamber 124. A powder conduit 146 of the powder container 121 is inserted into the inlet 126 of the hopper 133. When the valve 148 is opened with the powder conduit 146 and the inlet 126 connected, the copper oxide powder in the powder container 121 flows through the powder conduit 146 into the inlet 126 and ultimately falls into the hopper 133. The powder density may increase near the powder conduit 146 in the powder container 121, causing a bridging phenomenon that blocks the powder container 121. To prevent this bridging phenomenon, a vibrating device 165 vibrates the powder container 121 to fluidize the copper oxide powder in the powder container 121.

[0035] Returning to Figure 4, the hopper 133 contains the copper oxide powder supplied from the powder container 121. The hopper 133 has an overall truncated cone shape, which allows the copper oxide powder to flow downward easily. The upper opening of the hopper 133 is covered with a lid 141. The lid 141 has an inlet 126 through which the copper oxide powder is introduced from the powder container, and an exhaust port 142. The exhaust port 142 communicates with the internal space of the hopper 133 and is connected to a negative pressure source (not shown) through an exhaust pipe 144. The exhaust pipe 144 is provided with an on-off valve 144a such as a butterfly valve, and a detachable duct 144b between the exhaust port 142 and the on-off valve 144.

[0036] The feeder 130 is configured to supply the powder supplied from the opening at the bottom of the hopper 133 toward the mixing tank 19. In this embodiment, the feeder 130 is a screw feeder having a screw (not shown) inside the supply pipe 130b. However, the feeder 130 is not limited to this, and any mechanism can be used, such as a feeder using a belt conveyor inside the supply pipe 130b. The motor 131 is connected to the feeder 130 and configured to drive the feeder 130. The hopper 133 and the feeder 130 are fixed to a bracket 134, which is further supported by a weight measuring device 140. In other words, the weight measuring device 140 is configured to measure the total weight of the copper oxide powder present inside the hopper 133, the feeder 130, the motor 131, and the hopper 133 and the feeder 130.

[0037] The outlet of the feeder 130 is surrounded by an enclosing cover 143 provided on the top of the mixing tank 19. When the motor 131 drives the feeder 130, the copper oxide powder in the hopper 133 is transported by the feeder 130 into the enclosing cover 143 and falls into the mixing tank 19. The powder supplying device 80 may have an input pipe extending vertically from the inside of the enclosing cover 143 toward the mixing tank 19. The input pipe is preferably made of an ultra-high molecular weight polyethylene material that prevents static electricity. A spiral airflow may be generated inside the input pipe to prevent the copper oxide powder from scattering through the gap between the feeder 130 and the enclosing cover 143.

[0038] The weight measuring device 140 is connected to an operation control unit 57 that controls the operation of the motor 131. The weight measurement value output from the weight measuring device 140 can be sent to the operation control unit 57. The operation control unit 57 receives a signal indicating a required replenishment value sent from the plating apparatus 1 (see FIG. 1 ) and operates the motor 131 until the amount of copper oxide powder to be added reaches the required replenishment value. The motor 131 drives the feeder 130, and the feeder 130 adds an amount of copper oxide powder corresponding to the required replenishment value to the mixing tank 19.

[0039] In this embodiment, the powder supplying device 80 is housed in a hopper housing 210, and the mixing tank 19 is housed in a tank housing 260. That is, the powder supplying device 80 and the mixing tank 19 of the plating solution supplying device 20 are housed in separate housings.

[0040] The hopper housing 210 houses the powder supplying device 80. Specifically, the hopper housing 210 houses the hopper 133, the feeder 130, and the motor 131. The hopper housing 210 of this embodiment also houses a bracket 134 that supports the hopper 133 and the feeder 130, and a weight measuring device 140. The hopper housing 210 is formed of a synthetic resin such as polyethylene, for example. The hopper housing 210 houses the feeder 130 with a portion of the feeder 130 protruding to the outside so that the outlet of the feeder 130 can be inserted into the tank housing 260. At least a portion of the feeder 130 that is located below the hopper 133 and receives powder from the hopper 133 is housed in the hopper housing 210. Additionally, a cover member 280 is attached to the hopper housing 210, capable of covering the portion of the feeder 130 protruding from the hopper housing 210 (hereinafter referred to as the "protrusion"). The cover member 280 is configured as a tubular member formed to be expandable and contractible. As an example, the cover member is formed of polypropylene, is expandable, and can contract to one-third to one-quarter of its original length. The cover member 280 expands to a covering state in which the protrusion of the feeder 130 is accommodated, and contracts to an exposed state in which the protrusion of the feeder 130 is exposed. As shown in FIG. 4 , when the outlet of the feeder 130 is accommodated in the tank housing 260 (connected state), the cover member 280 is contracted, and the protrusion of the feeder 130 is not covered by the cover member 280. In one embodiment, the cover member 280 is configured to be attachable to the tank housing 260 by a piping band 282 such as a spiral wire band (an example of a "locking mechanism"; see FIGS. 7 and 8 ).

[0041] A sealed chamber 124 is placed on top of the hopper housing 210, and the hopper housing 210 and the sealed chamber 124 are in communication with each other so that powder can be supplied from the powder container 121 contained in the sealed chamber 124 to the hopper 133. FIG. 6 is a perspective view of the hopper housing 210 and the sealed chamber 124 of one embodiment, viewed from above. As shown in the figure, an exhaust pipe 144 is provided on the top surface of the hopper housing 210. The exhaust pipe 144 branches and connects to the sealed chamber 124 and the hopper housing 210, and negative pressure is created inside the sealed chamber 124 and the hopper housing 210 through the exhaust pipe 144. In addition, a compressed air supply pipe 172 connected to the ejector 170 and the vibrating device 165 is provided on the top surface of the hopper housing 210. Furthermore, power lines 158 and signal lines 159 connected to electrical devices inside the hopper housing 210, such as the vibration device 165, the motor 131, and the operation control unit 57, are arranged on the top surface of the hopper housing 210. The compressed air supply pipe 172, the power lines 158, and the signal lines 159 are provided with air connectors and wiring connectors, and are configured to be able to disconnect them.

[0042] In one embodiment, casters 220 are attached to the bottom of the hopper housing 210, making the hopper housing 210 movable. The casters 220 may be provided with caster locks 222 to prevent movement by the casters 220. The hopper housing 210 may be configured to be movable in a straight or curved line by using mechanisms such as slide rails or hinges instead of casters, or may not be provided with a mechanism for movement.

[0043] Referring to FIG. 4 , the tank housing 260 accommodates the mixing tank 19. In the present embodiment, the tank housing 260 accommodates the main tank 18. The tank housing 260 may accommodate at least a portion of the plating apparatus 1 in addition to the plating solution supply device 20. The tank housing 260 is formed of a synthetic resin such as polyethylene, for example. The tank housing 260 has an opening through which the outlet of the feeder 130 can be inserted. In the example shown in FIGS. 3 and 4 , legs are attached to the bottom of the tank housing 260, but no mechanism for moving the tank housing 260, such as casters, is attached. However, a mechanism for moving the hopper housing 210 may be attached to the tank housing 260 instead of or in addition to the hopper housing 210.

[0044] In one embodiment, the hopper housing 210 and the tank housing 260 are provided with a housing locking mechanism 270 for locking the hopper housing 210 and the tank housing 260 together in a connected state. The housing locking mechanism 270 can employ various mechanisms such as a latch, an index plunger, or a hook lock.

[0045] FIG. 7 is a schematic diagram showing the configuration of the plating solution supplying device in a connected state, and FIG. 8 is a schematic diagram showing the configuration of the plating solution supplying device in a separated state. FIG. 9 is a perspective view showing the appearance of the plating solution supplying device in a separated state. The hopper housing 210 and the tank housing 260 can be switched between a connected state in which the outlet of the feeder 130 is housed within the tank housing 260, as shown in FIGS. 3, 4, and 7, and a separated state in which the outlet 130c of the feeder 130 is located outside the tank housing 260, as shown in FIGS. 8 and 9. In other words, the hopper housing 210 and the tank housing 260 are configured to be separable from each other. This allows the hopper housing 210 and the tank housing 260 to be separated to perform maintenance on the hopper 133 or the feeder 130.

[0046] As a maintenance method for the plating solution supply apparatus 20, a method for separating the hopper housing 210 and the tank housing 260 will be described. FIG. 10 is a flowchart showing an example of a maintenance method for the plating solution supply apparatus. To perform maintenance on the plating solution supply apparatus, first, the on-off valve 144a of the exhaust pipe 144 is closed and the duct 144b is removed from the exhaust pipe 144 (step S102). In one embodiment, the duct 144b is attached to the exhaust pipe 144 with a spiral wire band, and is removed from the exhaust pipe 144 by loosening the spiral wire band. In addition, the compressed air supply pipe 172, the power line 158, and the signal line 159 are disconnected from each other by the air connector and the wiring connector (step S104).

[0047] Next, the caster locks 222 are released, and the lock between the hopper housing 210 and the tank housing 260 by the housing lock mechanism 270 is released (step S106). Furthermore, if the cover member 280 is not attached to the tank housing 260, the cover member 280 is attached to the tank housing 260 using the piping bands 282 (step S108). Note that if the piping bands 282 for attaching the cover member 280 to the tank housing 260 are not provided, the operator may press the end of the cover member 280 against the tank housing 260. Then, the hopper housing 210 is moved to separate the hopper housing 210 from the tank housing 260 (step S110). This causes the outlet 130c of the feeder 130 to be pushed out of the tank housing 260, and the hopper housing 210 and the tank housing 260 are separated (see FIGS. 8 and 9). 9, as the hopper housing 210 moves, the cover member 280 extends to cover the feeder 130, and the protruding portion of the feeder 130 is accommodated by the cover member 280. This prevents the powder from scattering from the protruding portion of the feeder 130.

[0048] After the hopper housing 210 and the tank housing 260 are separated, the cover member 280 is removed from the tank housing 260 (step S112). This allows the hopper housing 210 to be moved to any location for maintenance of the hopper 133, the feeder 130, and the like. In one embodiment, the cover member 280 may have its end closed by a lid 284 while it is in a covering state that accommodates the protruding portion of the feeder 130. FIG. 11 is a perspective view showing an example of the appearance of the hopper housing in a separated state. As shown in the figure, closing the end of the cover member 280 with the lid 284 prevents powder from scattering from the end of the cover member 280 during subsequent maintenance work.

[0049] Once the maintenance work is completed, the hopper housing 210 and the tank housing 260 may be reconnected. As an example, the hopper housing 210 and the tank housing 260 can be connected by performing the steps opposite to those of the method for separating the hopper housing 210 and the tank housing 260 described above. However, for example, if there is no risk of powder scattering from the outlet 130c of the feeder 130 due to maintenance work on the feeder 130, the hopper housing 210 and the tank housing 260 may be connected without the protruding portion of the feeder 130 being accommodated by the cover member 280. In one embodiment, when the hopper housing 210 and the tank housing 260 are connected, the end of the cover member 280 may be attached to the tank housing 260 by a piping band 282.

[0050] The present invention can also be described as the following aspects. [Aspect 1] According to aspect 1, a plating solution supplying device for supplying a plating solution used in plating is proposed, the plating solution supplying device including: a mixing tank configured to dissolve a metal-containing powder in the plating solution; a tank housing that accommodates the mixing tank; a hopper configured to accommodate the powder; a feeder configured to supply the powder toward the mixing tank through an opening provided in a lower part of the hopper; a hopper housing that accommodates the hopper and accommodates the feeder with a portion of the feeder protruding to the outside, the hopper housing being changeable between a connected state in which the portion of the feeder is accommodated within the tank housing and a separated state in which the portion of the feeder is positioned outside the tank housing; and a cover member attached to the hopper housing and changeable between a covered state in which the portion of the feeder is accommodated and an exposed state in which the portion of the feeder is exposed. According to aspect 1, maintenance can be performed while minimizing scattering of the powder.

[0051] [Mode 2] According to Mode 2, the cover member in Mode 1 is configured as a tubular member formed to be expandable. According to Mode 2, the cover member can be expanded and contracted to switch between a covered state and an exposed state.

[0052] [Mode 3] According to Mode 3, in Mode 2, the cover member has a lid that can close an end of the tubular member. According to Mode 3, a part of the feeder can be housed in the cover member, and the end can be closed with the lid.

[0053] [Mode 4] According to Mode 4, in Modes 1 to 3, a locking mechanism that locks the cover member to the tank housing is further provided. According to Mode 4, the cover member can be locked to the tank housing, and the hopper housing and the tank housing can be separated.

[0054] [Mode 5] According to Mode 5, in Modes 1 to 4, the hopper housing has casters, and the state is changed between the connected state and the separated state by moving on the casters. According to Mode 5, the hopper housing can be easily moved.

[0055] [Mode 6] According to Mode 6, in Modes 1 to 5, a housing locking mechanism that locks the hopper housing and the tank housing in the connected state is further provided. According to Mode 6, it is possible to prevent the hopper housing and the tank housing from being unintentionally separated.

[0056] [Mode 7] According to Mode 7, in any of Modes 1 to 6, a main tank is further provided for storing the plating solution and circulating the plating solution between the plating tank and the main tank.

[0057] [Mode 8] According to Mode 8, there is provided a plating system, the plating system comprising the plating solution supply device of any one of Modes 1 to 7, a plating tank for plating a substrate, and a plating solution supply line connected to the plating solution supply device and the plating tank. Mode 8 can achieve the same effects as Modes 1 to 7.

[0058] [Mode 9] According to Mode 9, there is provided a maintenance method for the plating solution supply apparatus of Modes 1 to 7, the maintenance method including changing the state of the hopper casing from the connected state to the separated state with the cover member attached to the tank casing, accommodating the portion of the feeder with the cover member, and removing the cover member from the tank casing. Mode 9 can achieve the same effects as Modes 1 to 7.

[0059] Although the embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0060] DESCRIPTION OF SYMBOLS W...substrate 1...plating apparatus 2...plating tank 18...main tank 19...mixing tank 20...plating solution supply device 21...plating solution supply line 57...operation control unit 68...plating solution replenishment line 71...mixing pump 77...mixing circulation line 80...powder supply device 121...powder container 124...sealed chamber 126...feeding port 130...feeder 130b...supply pipe 130c...outlet 131...motor 133...hopper 172...compressed air supply pipe 210...hopper housing 220...caster 260...tank housing 270...housing locking mechanism 280...cover member 282...piping band (locking mechanism) 284...lid

Claims

1. A plating solution supply device for supplying a plating solution used for plating, comprising: a mixing tank configured to dissolve a powder containing metal in the plating solution; a tank housing that houses the mixing tank; a hopper configured to house the powder; a feeder configured to supply the powder from an opening provided at a lower portion of the hopper toward the mixing tank; a hopper housing that houses the hopper and houses the feeder in a state where a part of the feeder protrudes outside, the hopper housing being capable of changing a state between a connection state in which the part of the feeder is housed in the tank housing and a separation state in which the part of the feeder is located outside the tank housing; and a cover member attached to the hopper housing and capable of changing a state between a cover state in which the part of the feeder is housed and an exposed state in which the part of the feeder is exposed.

2. The plating solution supply device according to claim 1, wherein the cover member is formed of a tubular member that is stretchable.

3. The plating solution supply device according to claim 2, wherein the cover member has a lid capable of closing an end portion of the tubular member.

4. The plating solution supply device according to claim 1, further comprising a lock mechanism for locking the cover member to the tank housing.

5. The plating solution supply device according to claim 1, wherein the hopper housing has casters, and changes a state between the connection state and the separation state by moving with the casters.

6. The plating solution supply device according to claim 1, further comprising a housing lock mechanism for locking the hopper housing and the tank housing in the connection state.

7. The plating solution supply device according to claim 1, further comprising a main tank for storing a plating solution and circulating the plating solution between the main tank and a plating tank.

8. A plating system comprising the plating solution supply device according to any one of claims 1 to 7, a plating tank for plating a substrate, and a plating solution supply line connected to the plating solution supply device and the plating tank.

9. A maintenance method for the plating solution supply device according to any one of claims 1 to 7, comprising: changing the state of the hopper housing from the connected state to the separated state with the cover member attached to the tank housing; accommodating a part of the feeder with the cover member; and removing the cover member from the tank housing.

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