Printed circuit board module and electronic device comprising same

Abstract

This printed circuit board module includes: a printed circuit board including a hole and a circuit pattern; an electronic component including a pin coupled to the hole; and a solder part disposed on the surface of the printed circuit board and in the hole, wherein the solder part includes an upper region arranged on the top surface of the printed circuit board and a lower region arranged on the bottom surface of the printed circuit board, and the volume of the lower region is greater than the volume of the upper region.

Description

Printed circuit board module and electronic device including the same

[0001] The present embodiment relates to a printed circuit board module and an electronic device including the same.

[0002]

[0003] A vehicle is equipped with a number of electronic devices, such as a controller. The electronic devices include a housing, a printed circuit board (PCB) arranged within the housing, and a number of electronic components arranged on the PCB.

[0004] Electronic components can be electrically and physically coupled to a printed circuit board. For example, the electronic component can be soldered to the printed circuit board. In this case, the electronic component includes a pin extending from a core, and the printed circuit board includes a hole into which the pin is coupled, such that the pin within the hole can be soldered.

[0005] However, there is a problem that the soldering quality deteriorates because cracks may occur in the solder area due to differences in physical properties, such as the coefficient of thermal expansion, between the pin and solder area.

[0006]

[0007] The present invention provides a printed circuit board module and an electronic device including the same, which can firmly maintain the bonding of electronic components within a printed circuit board by preventing cracks in a solder area.

[0008]

[0009] In the present embodiment, a printed circuit board module includes a printed circuit board including a hole and a circuit pattern; an electronic component including a pin coupled to the hole; and a solder portion disposed on a surface of the printed circuit board and within the hole, wherein the solder portion includes an upper region disposed on an upper surface of the printed circuit board and a lower region disposed on a lower surface of the printed circuit board, and a volume of the lower region is larger than a volume of the upper region.

[0010] The circuit pattern includes an upper pad arranged on an upper surface of the printed circuit board; a lower pad arranged on a lower surface of the printed circuit board; and a connection pad arranged in the hole and connecting the upper pad and the lower pad, wherein a radial length of the lower pad may be greater than a radial length of the upper pad.

[0011] The lower pad includes a first lower pad arranged to overlap the upper pad in a vertical direction, and a second lower pad arranged on the outside of the first lower pad, and the lower region can be arranged on the first lower pad and the second lower pad.

[0012] The first lower pad and the second lower pad can be spaced apart horizontally.

[0013] The above first lower pad and the above second lower pad can be connected.

[0014] The second lower pads are provided in multiple numbers and can be arranged radially based on the first lower pad.

[0015] The cross-sectional area of ​​the second lower pad may be smaller than the cross-sectional area of ​​the first lower pad.

[0016] A straight line distance (L3) from the center of the hole to the center of the second lower pad may be greater than the diameter (D3) of the second lower pad and smaller than the diameter of the upper pad or the first lower pad.

[0017] The lower region is disposed on the first lower pad, the solder portion includes an outer region disposed on the second lower pad, and the lower region and the outer region may have mutually spaced regions.

[0018] An electronic device according to the present embodiment comprises a housing; and a printed circuit board module disposed within the housing, wherein the printed circuit board module comprises: a printed circuit board including a hole and a circuit pattern; an electronic component including a pin coupled to the hole; and a solder portion disposed on a surface of the printed circuit board and within the hole, wherein the solder portion includes an upper region disposed on an upper surface of the printed circuit board and a lower region disposed on a lower surface of the printed circuit board, and a volume of the lower region is larger than a volume of the upper region.

[0019]

[0020] This embodiment has the advantage of minimizing cracks in the solder portion by increasing the volume of the solder portion, thereby maintaining a more solid connection of the pin within the hole.

[0021]

[0022] Figure 1 is a cross-sectional view of a printed circuit board module according to a first embodiment of the present invention.

[0023] FIG. 2 is a plan view showing the upper surface of a printed circuit board module according to the first embodiment of the present invention.

[0024] Figure 3 is a plan view showing the lower surface of a printed circuit board module according to the first embodiment of the present invention.

[0025] FIG. 4 is a drawing of the lower surface of a product manufactured according to a manufacturing process of a printed circuit board module according to the first embodiment of the present invention.

[0026] Figure 5 is a cross-sectional view of a printed circuit board module according to a second embodiment of the present invention.

[0027] Figure 6 is a plan view showing the upper surface of a printed circuit board module according to a second embodiment of the present invention.

[0028] Figure 7 is a plan view showing the lower surface of a printed circuit board module according to a second embodiment of the present invention.

[0029] FIG. 8 is a drawing of the lower surface of a product manufactured according to a manufacturing process of a printed circuit board module according to a second embodiment of the present invention.

[0030] FIG. 9 is a cross-sectional view of a product manufactured according to a manufacturing process of a printed circuit board module according to a second embodiment of the present invention.

[0031] Figure 10 is a cross-sectional view of a printed circuit board module according to a third embodiment of the present invention.

[0032] Figure 11 is a plan view showing the lower surface of a printed circuit board module according to a third embodiment of the present invention.

[0033] FIG. 12 is a cross-sectional view of a product manufactured according to a manufacturing process of a printed circuit board module according to a third embodiment of the present invention.

[0034]

[0035] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0036] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0037] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0038] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and / or at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0039] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0040] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0041] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0042] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0043] The electronic device according to the present embodiment may include electrical components such as a TV, a mobile terminal, and a controller installed in a vehicle, but this is exemplary, and the electronic device may include various devices whose exterior is formed by a housing and which include a printed circuit board module placed within the housing.

[0044] FIG. 1 is a cross-sectional view of a printed circuit board module according to a first embodiment of the present invention, FIG. 2 is a plan view showing the upper surface of a printed circuit board module according to a first embodiment of the present invention, FIG. 3 is a plan view showing the lower surface of a printed circuit board module according to a first embodiment of the present invention, and FIG. 4 is a drawing of the lower surface of a product manufactured according to a manufacturing process of a printed circuit board module according to a first embodiment of the present invention.

[0045] Referring to FIGS. 1 to 4, a printed circuit board module (10) according to the first embodiment of the present invention may include a printed circuit board (100), electronic components, and a solder portion (150).

[0046] The printed circuit board (100) may be formed in a plate shape. At least one electronic component may be arranged on the surface of the printed circuit board (100). The printed circuit board (100) may include a hole (110) penetrating from one surface to the other surface. The hole (110) may be referred to as a via hole. The holes (110) may be provided in multiple numbers and may be arranged to be spaced apart from each other within the printed circuit board (100).

[0047] The printed circuit board (100) may include a circuit pattern (120). The circuit pattern (120) is for electrical connection with the electronic component and may be made of copper (Cu), but may be formed of various materials other than the copper (Cu) described above. The circuit pattern (120) may be arranged in the hole (110) formation area.

[0048] In detail, the circuit pattern (120) may include an upper pad (122) disposed on the upper surface of the printed circuit board (100), a lower pad (124) disposed on the lower surface of the printed circuit board (100), and a connection pad (126) connecting the upper pad (122) and the lower pad (124) and disposed on the inner surface of the hole (110). The upper pad (122), the lower pad (124), and the connection pad (126) may be formed as one body. The connection pad (126) may be a metal material filled in the hole (110). A hollow may be formed on the inner surface of the connection pad (126) so that a pin (190) of the electronic component, which will be described later, may penetrate therethrough.

[0049] The lower pad (124) may include a first lower pad (124a, see FIG. 3) arranged to overlap the upper pad (122) in the vertical direction, and a second lower pad (124b) arranged on the outside of the first lower pad (124a). The second lower pads (124b) may be provided in plurality and may be arranged radially with the first lower pad (124a) as the center. The plurality of second lower pads (124b) may be arranged to be spaced apart from each other along the circumferential direction of the first lower pad (124a). For example, six of the plurality of second lower pads (124b) may be provided, and may be arranged to form a 60-degree gap in the circumferential direction between adjacent second lower pads (124b). The second lower pads (124b) and the first lower pads (124a) may be interconnected. The above second lower pad (124b) and the above first lower pad (124a) can be formed as one body.

[0050] As a variation, the first lower pad (124a) and the second lower pad (124b) may be spaced apart from each other by a predetermined distance in the horizontal direction.

[0051] The diameter (D2) of the upper pad (122) and the first lower pad (124a) may be larger than the diameter (D1, see FIG. 2) of the hole (110). For example, the diameter (D2) of the upper pad (122) and the first lower pad (124a) may be 2.0 mm to 2.5 mm. The diameter (D1) of the hole (110) may be 1.5 mm to 2.0 mm.

[0052] The diameter (D2) of the upper pad (122) and the first lower pad (124a) may be larger than the diameter (D3) of the second lower pad (124b). The diameter (D3) of the second lower pad (124b) may be 1.3 mm to 1.7 mm.

[0053] A straight-line distance (L3) from the center of the hole (110) to the center of the second lower pad (124b) may be greater than a diameter (D3) of the second lower pad (124b) and less than a diameter (D2) of the upper pad (122) or the first lower pad (124a). A straight-line distance (L3) from the center of the hole (110) to the center of the second lower pad (124b) may be 1.7 mm to 1.9 mm.

[0054] Due to the second lower pad (124b), the radial length (L1) of the lower pad (124) with respect to the hole (110) may be longer than the radial length (L2) of the upper pad (122).

[0055] The electronic component may be arranged on the printed circuit board (100). The electronic component may include a core (not shown) and a pin (190) extending from the core. The pin (190) may be coupled to a hole (110) of the printed circuit board (100). The pin (190) may be soldered to the hole (110) through the solder portion (150). The pins (190) may be arranged to protrude upward and downward from the upper and lower surfaces of the printed circuit board (100), respectively. The pins (190) may be provided in plurality and may be coupled to a plurality of holes arranged in the printed circuit board (100), respectively.

[0056] The solder portion (150) can electrically and physically connect the pin (190) and the circuit pattern (120) of the printed circuit board (100). The solder portion (150) can include an upper region (152) disposed on the upper pad (122), a lower region (154) disposed on the lower surface of the lower pad (124), and a connection region (156) disposed within the hole (110) and connecting the upper region (152) and the lower region (154).

[0057] The upper region (152) may be arranged to surround the outer circumferential surface of the pin (190) protruding upward from the upper surface of the printed circuit board (100). The upper region (152) may be arranged on the upper pad (122). A first inclined surface (153) having a shape in which the cross-sectional area of ​​the upper region (152) increases as it goes downward may be formed on the upper surface of the upper region (152).

[0058] The lower region (154) may be arranged to surround the outer circumferential surface of the pin (190) protruding downward from the lower surface of the printed circuit board (100). The lower region (154) may be arranged on the lower surface of the lower pad (124). A second inclined surface (155) having a shape in which the cross-sectional area of ​​the lower region (154) increases as it goes upward may be formed on the lower surface of the lower region (154).

[0059] The lower region (154) may be arranged on at least a portion of the lower surface of the first lower pad (124a) and the lower surface of the second lower pad (124b). The lower region (154) arranged on the lower surface of the first lower pad (124a) may be connected to the lower region (154) arranged on the lower surface of the second lower pad (124b).

[0060] The above connection area (156) can be filled within the hole (110). The above connection area (156) can embed the connection pad (126) within the hole (110).

[0061] Due to the difference in radial length between the lower pad (124) and the upper pad (122) through the second lower pad (124b) described above, the cross-sectional area of ​​the lower region (154) may be larger than the cross-sectional area of ​​the upper region (152). Based on the longitudinal direction of the pin (190), the height of the lower region (154) may be larger than the height of the upper region (152).

[0062] Accordingly, since cracks in the solder portion (150) are prevented by increasing the volume of the solder portion (150) through the lower region (154), there is an advantage in that the bonding of the pin (190) within the hole (110) can be maintained more firmly.

[0063] FIG. 5 is a cross-sectional view of a printed circuit board module according to a second embodiment of the present invention, FIG. 6 is a plan view showing the upper surface of a printed circuit board module according to a second embodiment of the present invention, FIG. 7 is a plan view showing the lower surface of a printed circuit board module according to a second embodiment of the present invention, FIG. 8 is a drawing showing the lower surface of a product manufactured according to a manufacturing process of a printed circuit board module according to a second embodiment of the present invention, and FIG. 9 is a drawing showing a cross-section of a product manufactured according to a manufacturing process of a printed circuit board module according to a second embodiment of the present invention.

[0064] Referring to FIGS. 5 to 9, a printed circuit board module (20) according to a second embodiment of the present invention may include a printed circuit board (200), electronic components, and a solder portion (250).

[0065] The printed circuit board (200) may be formed in a plate shape. At least one electronic component may be arranged on the surface of the printed circuit board (200). The printed circuit board (200) may include a hole (210) penetrating from one surface to the other surface. The hole (210) may be referred to as a via hole. The holes (210) may be provided in multiple numbers and may be arranged to be spaced apart from each other within the printed circuit board (200).

[0066] The printed circuit board (200) may include a circuit pattern (220). The circuit pattern (220) is for electrical connection with the electronic component and may be made of copper (Cu), but may be formed of various materials other than the copper (Cu) described above. The circuit pattern (220) may be arranged in the hole (210) formation area.

[0067] In detail, the circuit pattern (220) may include an upper pad (222) disposed on the upper surface of the printed circuit board (200), a lower pad (224) disposed on the lower surface of the printed circuit board (200), and a connection pad (226) that connects the upper pad (222) and the lower pad (224) and is disposed on the inner surface of the hole (210). The upper pad (222), the lower pad (224), and the connection pad (226) may be formed as one body. The connection pad (226) may be a metal material filled in the hole (210). A hollow may be formed on the inner surface of the connection pad (226) so that a pin (190) of the electronic component, which will be described later, may penetrate therethrough.

[0068] Based on the center of the hole (210), the radial length (L1) of the lower pad (224) can be formed to be longer than the radial length (L2) of the upper pad (222).

[0069] The circuit pattern (220) may include an outer pad (230). The outer pad (230) may be arranged on the lower surface of the printed circuit board (200). The outer pad (230) may be a metal material patterned on the lower surface of the printed circuit board (200). The outer pad (230) may be spaced apart from the lower pad (224) in a horizontal direction. A gap (270) may be formed between the outer pad (230) and the lower pad (224) to space the outer pad (230) and the lower pad (224) apart from each other in a horizontal direction. The gap (270) may be 0.05 mm to 0.15 mm.

[0070] The above outer pads (230) may be provided in plurality and may be arranged radially with the lower pad (224) as the center. The plurality of outer pads (230) may be arranged to be spaced apart from each other along the circumferential direction of the lower pad (224). For example, the plurality of outer pads (230) may be provided in six numbers and may be arranged to form a 60-degree gap in the circumferential direction between adjacent outer pads (230).

[0071] In this embodiment, a structure in which the outer pad (230) and the lower pad (224) are spaced apart from each other based on the gap (270) is described as an example, but as a modified example, the lower pad (224) and the outer pad (230) may be interconnected.

[0072] The above lower pad (224) can be named as the first lower pad, and the above outer pad (230) can be named as the second lower pad.

[0073] The diameter (D2) of the upper pad (222) may be larger than the diameter (D1) of the hole (210). For example, the diameter (D2) of the upper pad (222) may be 2.0 mm to 2.5 mm. The diameter (D1) of the hole (210) may be 1.5 mm to 2.0 mm.

[0074] The diameter (D2) of the upper pad (222) may be larger than the diameter (D3) of the outer pad (230). The diameter (D3) of the outer pad (230) may be 1.3 mm to 1.7 mm.

[0075] The straight-line distance (L3) from the center of the hole (210) to the center of the outer pad (230) may be greater than the diameter (D3) of the outer pad (230) and smaller than the diameter (D2) of the upper pad (222). The straight-line distance (L3) from the center of the hole (210) to the center of the outer pad (230) may be 1.8 mm to 2.0 mm.

[0076] The electronic component may be arranged on the printed circuit board (200). The electronic component may include a core (not shown) and a pin (190) extending from the core. The pin (190) may be coupled to a hole (210) of the printed circuit board (200). The pin (190) may be soldered to the hole (210) through the solder portion (250). The pins (190) may be arranged to protrude upward and downward from the upper and lower surfaces of the printed circuit board (200), respectively. The pins (190) may be provided in plurality and may be coupled to a plurality of holes arranged in the printed circuit board (200), respectively.

[0077] The solder portion (250) can electrically and physically connect the pin (190) and the circuit pattern (220) of the printed circuit board (200). The solder portion (250) can include an upper region (252) disposed on the upper pad (222), a lower region (254) disposed on the lower surface of the lower pad (224), and a connection region (256) disposed within the hole (210) and connecting the upper region (252) and the lower region (254).

[0078] The upper region (252) may be arranged to surround the outer circumferential surface of the pin (190) protruding upward from the upper surface of the printed circuit board (200). The upper region (252) may be arranged on the upper pad (222). A first inclined surface (253) having a shape in which the cross-sectional area of ​​the upper region (252) increases as it goes downward may be formed on the upper surface of the upper region (252).

[0079] The lower region (254) may be arranged to surround the outer circumferential surface of the pin (190) protruding downward from the lower surface of the printed circuit board (200). The lower region (254) may be arranged on the lower surface of the lower pad (224). A second inclined surface (255) having a shape in which the cross-sectional area of ​​the lower region (254) increases as it goes upward may be formed on the lower surface of the lower region (254).

[0080] Due to the difference in radial length between the upper pad (222) and the lower pad (224), the volume of the lower region (254) may be larger than the volume of the upper region (252).

[0081] The above connection area (156) can be filled within the hole (110). The above connection area (156) can embed the connection pad (126) within the hole (110).

[0082] The solder portion (250) may include an outer region (258). The outer region (258) may be arranged on the surface of the outer pad (230). The outer region (258) may be connected to the lower region (254). In this case, the gap (270) may be filled with a region connecting the outer region (258) and the lower region (254).

[0083] As a variation, the outer region (258) and the lower region (254) may have regions that are at least partially radially separated.

[0084] The cross-sectional area of ​​the lower region (254) may be greater than the cross-sectional area of ​​the upper region (252). Based on the longitudinal direction of the pin (190), the height of the lower region (254) may be greater than the height of the upper region (252).

[0085] According to the structure as described above, cracks in the solder portion (250) are prevented by increasing the volume of the solder portion (250) through the lower region (154) and the outer region (258), so there is an advantage in that the bonding of the pin (190) within the hole (210) can be maintained more firmly.

[0086] FIG. 10 is a cross-sectional view of a printed circuit board module according to a third embodiment of the present invention, FIG. 11 is a plan view showing the lower surface of a printed circuit board module according to a third embodiment of the present invention, and FIG. 12 is a cross-sectional view of a product manufactured according to a manufacturing process of a printed circuit board module according to a third embodiment of the present invention.

[0087] Referring to FIGS. 10 to 12, a printed circuit board module (30) according to a third embodiment of the present invention may include a printed circuit board (300), electronic components, and a solder portion (350).

[0088] The printed circuit board (300) may be formed in a plate shape. At least one electronic component may be arranged on the surface of the printed circuit board (300). The printed circuit board (300) may include a hole (310) penetrating from one surface to the other surface. The hole (310) may be referred to as a via hole. The holes (310) may be provided in multiple numbers and may be arranged to be spaced apart from each other within the printed circuit board (300).

[0089] The printed circuit board (300) may include a solder hole (360). The solder hole (360) may have a shape that penetrates from the upper surface to the lower surface of the printed circuit board (300). The diameter of the solder hole (360) may be smaller than the diameter of the hole (310).

[0090] The solder holes (360) may be provided in multiple numbers and may be arranged radially around the hole (310). The plurality of solder holes (360) may be arranged to be spaced apart from each other along the circumferential direction of the hole (310). For example, six of the plurality of solder holes (360) may be provided and may be arranged to form a 60-degree interval in the circumferential direction between adjacent solder holes (360).

[0091] The printed circuit board (200) may include a circuit pattern (320). The circuit pattern (320) is for electrical connection with the electronic component and may be made of copper (Cu), but may be formed of various materials other than the copper (Cu) described above. The circuit pattern (320) may be arranged in the hole (310) formation area and the solder hole (360) formation area.

[0092] In detail, the circuit pattern (320) may include an upper pad (322) disposed on the upper surface of the printed circuit board (300), a lower pad (324) disposed on the lower surface of the printed circuit board (300), and a connection pad (326) connecting the upper pad (322) and the lower pad (324) and disposed on the inner surface of the hole (310). The upper pad (322), the lower pad (324), and the connection pad (326) may be formed as one body. The connection pad (326) may be a metal material filled in the hole (310). A hollow may be formed on the inner surface of the connection pad (326) so that a pin (190) of the electronic component, which will be described later, may penetrate therethrough.

[0093] Based on the center of the hole (310), the radial length of the lower pad (324) can be formed to be longer than the radial length of the upper pad (322).

[0094] The circuit pattern (320) may include an outer pad. The outer pad may include an upper outer pad (332) and a lower outer pad (336). The upper outer pad (332) may be arranged along the perimeter of the solder hole (360) on the upper surface of the printed circuit board (300). The upper outer pad (332) may be spaced apart from the upper pad (322) in a horizontal direction. A hole (333) may be formed at the center of the upper outer pad (332) to overlap the solder hole (360).

[0095] The lower outer pad (336) may be arranged along the periphery of the solder hole (360) on the lower surface of the printed circuit board (300). The lower outer pad (336) may be in contact with the lower pad (324). The lower outer pad (336) may be connected to the lower pad (324). As a variation, the lower outer pad (336) may be spaced apart from the lower pad (324) by a predetermined distance in the horizontal direction. A hole (337) may be formed at the center of the lower outer pad (336) so as to overlap the solder hole (360).

[0096] The upper outer pad (332) and the lower outer pad (336) are provided in multiple numbers corresponding to the number of solder holes (360), and can be arranged radially around the hole (310).

[0097] The diameter (D2) of the upper pad (322) and the lower pad (324) may be larger than the diameter (D1) of the hole (310). For example, the diameter (D2) of the upper pad (322) and the lower pad (324) may be 2.0 mm to 2.5 mm. The diameter (D1) of the hole (310) may be 1.5 mm to 2.0 mm.

[0098] The diameter (D2) of the upper pad (322) and the lower pad (324) may be larger than the diameter (D3) of the outer pad. The diameter (D3) of the outer pad may be 1.3 mm to 1.7 mm. The diameter (D4) of the solder hole (360) may be 0.5 mm to 0.9 mm.

[0099] A straight line distance (D5) from the center of the hole (310) to the center of the solder hole (360) may be greater than the diameter (D3) of the outer pad and less than the diameter (D2) of the upper pad (322) or the lower pad (324). A straight line distance (D5) from the center of the hole (310) to the center of the solder hole (360) may be 1.7 mm to 1.9 mm.

[0100] The electronic component may be arranged on the printed circuit board (300). The electronic component may include a core (not shown) and a pin (190) extending from the core. The pin (190) may be coupled to a hole (310) of the printed circuit board (300). The pin (190) may be soldered to the hole (310) through the solder portion (350). The pins (190) may be arranged to protrude upward and downward from the upper and lower surfaces of the printed circuit board (300), respectively. The pins (190) may be provided in plurality and may be coupled to a plurality of holes arranged in the printed circuit board (300), respectively.

[0101] The solder portion (350) can electrically and physically connect the pin (190) and the circuit pattern (320) of the printed circuit board (300). The solder portion (350) can include an upper region (352) disposed on the upper pad (322), a lower region (354) disposed on the lower surface of the lower pad (324), and a connection region (356) disposed within the hole (310) and connecting the upper region (352) and the lower region (354).

[0102] The upper region (352) may be arranged to surround the outer circumferential surface of the pin (190) protruding upward from the upper surface of the printed circuit board (300). The upper region (352) may be arranged on the upper pad (322). A first inclined surface (353) having a shape in which the cross-sectional area of ​​the upper region (352) increases as it goes downward may be formed on the upper surface of the upper region (352).

[0103] The lower region (354) may be arranged to surround the outer circumferential surface of the pin (190) protruding downward from the lower surface of the printed circuit board (300). The lower region (354) may be arranged on the lower surface of the lower pad (324). A second inclined surface (355) having a shape in which the cross-sectional area of ​​the lower region (354) increases as it goes upward may be formed on the lower surface of the lower region (354).

[0104] Due to the difference in radial length between the upper pad (322) and the lower pad (324), the volume of the lower region (354) may be larger than the volume of the upper region (352).

[0105] The above connection area (356) can be filled within the hole (310). The above connection area (356) can embed the connection pad (326) within the hole (310).

[0106] The solder portion (350) can be filled in the solder hole (360) by the solder liquid discharged upward from the lower portion of the printed circuit board (300). In this case, the solder portion (350) can also be filled in the lower surface of the lower outer pad (336), the solder hole (360), and the hole (333) in the upper outer pad (332). The area of ​​the solder portion (350) filled in the solder hole (360) can be named an outer area (359).

[0107] The area of ​​the solder portion (350) filled in the lower outer pad (336) and the solder hole (336) can be connected to the area of ​​the solder portion (350) placed on the lower pad (324).

[0108] Due to the area of ​​the lower outer pad (336) and the solder portion (350) filled in the solder hole (336), the cross-sectional area of ​​the lower area (354) may be larger than the cross-sectional area of ​​the upper area (352). Based on the longitudinal direction of the pin (190), the height of the lower area (354) may be larger than the height of the upper area (352).

[0109] According to the structure as described above, cracks in the solder portion (350) are prevented by increasing the volume of the solder portion (350) through the lower region (354) and the outer region (359), so there is an advantage in that the bonding of the pin (190) within the hole (310) can be maintained more firmly.

[0110] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0111] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A printed circuit board including holes and circuit patterns; An electronic component including a pin coupled to the above hole; and Including a surface of the printed circuit board and a solder portion arranged within the hole, The solder portion includes an upper region arranged on the upper surface of the printed circuit board and a lower region arranged on the lower surface of the printed circuit board. A printed circuit board module wherein the volume of the lower region is larger than the volume of the upper region.

2. In paragraph 1, The above circuit pattern is, An upper pad arranged on the upper surface of the printed circuit board; A lower pad arranged on the lower surface of the above printed circuit board; and It is arranged in the above hole and includes a connecting pad connecting the upper pad and the lower pad, A printed circuit board module wherein the radial length of the lower pad is greater than the radial length of the upper pad.

3. In paragraph 2, The lower pad includes a first lower pad arranged to overlap the upper pad in a vertical direction, and a second lower pad arranged on the outside of the first lower pad. The above lower region is a printed circuit board module arranged on the first lower pad and the second lower pad.

4. In paragraph 3, A printed circuit board module wherein the first lower pad and the second lower pad are spaced apart in the horizontal direction.

5. In paragraph 3, A printed circuit board module in which the first lower pad and the second lower pad are connected.

6. In paragraph 3, A printed circuit board module having a plurality of second lower pads and arranged radially based on the first lower pad.

7. In paragraph 3, A printed circuit board module wherein the cross-sectional area of ​​the second lower pad is smaller than the cross-sectional area of ​​the first lower pad.

8. In paragraph 3, A printed circuit board module wherein a straight line distance (L3) from the center of the hole to the center of the second lower pad is larger than the diameter (D3) of the second lower pad and smaller than the diameter of the upper pad or the first lower pad.

9. In paragraph 4, The above lower region is placed on the first lower pad, The above solder portion includes an outer region disposed on the second lower pad, A printed circuit board module wherein the lower region and the outer region have mutually separated regions.

10. Housing; and A printed circuit board module is included that is arranged within the housing, The above printed circuit board module, A printed circuit board comprising holes and circuit patterns; An electronic component including a pin coupled to the above hole; and Including a surface of the printed circuit board and a solder portion arranged within the hole, The solder portion includes an upper region arranged on the upper surface of the printed circuit board and a lower region arranged on the lower surface of the printed circuit board. An electronic device wherein the volume of the lower region is greater than the volume of the upper region.

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