Heater block and substrate heat treatment apparatus including same

Abstract

The present invention relates to a heater block which has excellent heat dissipation characteristics and is capable of precisely controlling the heating temperature, and a substrate heat treatment apparatus including same. The heater block of the present invention may comprise: a cooling plate unit having a cooling channel provided therein such that cooling water flows therethrough; a light-emitting module unit provided on the first surface of the cooling plate unit and configured to emit light toward the object to be heated; and a power supply module unit provided on the second surface of the cooling plate unit and configured to supply power to the light-emitting module unit.

Description

Heater block and substrate heat treatment device including the same

[0001] The present invention relates to a heater block and a substrate heat treatment device including the same, and more particularly, to a heater block having excellent heat dissipation characteristics and capable of precise heating temperature control, and a substrate heat treatment device including the same.

[0002] Semiconductor devices are typically manufactured through repeated unit processes involving substrate processing, such as ion implantation, thin film deposition, and heat treatment. These unit processes require the supply of thermal energy to process the substrate at a predetermined temperature. In particular, the use of light energy to heat the substrate to the desired temperature allows for a short heating time, minimizing the negative effects of impurities. This has led to its widespread use.

[0003] In a typical substrate heating device, a substrate is placed in a chamber and heat treated through a heater containing multiple halogen lamps, and the temperature of the substrate is measured in a non-contact manner using a temperature measuring device such as a pyrometer. The pyrometer collects radiant energy emitted from the substrate and measures the temperature of the substrate in a non-contact manner based on the blackbody radiation temperature relationship, and the measured temperature is fed back to the heater block through the heating control unit, thereby controlling the temperature of the heater.

[0004] When a silicon wafer, which has the property of transmitting light in a low-temperature region due to the nature of the material, is used as a substrate, some of the light from the halogen lamp will transmit through the substrate at a substrate temperature of 600°C or lower, and a pyrometer with a measurement wavelength band of 0.9 to 1 μm will measure some of the light from the halogen lamp with a radiation wavelength of 0.4 to 6 μm that has transmitted through the substrate, so the temperature of only the substrate cannot be accurately measured, and a temperature measurement error will occur.

[0005] In addition, halogen lamps cannot be divided into multiple control areas, making more precise control by control area impossible. Accordingly, a substrate heat treatment technology capable of controlling by control area with a smaller area than a halogen lamp is required.

[0006] In addition, in the technology of heat-treating a substrate at a high temperature using a high-power power source, effective heat dissipation for the light-emitting module and power supply module is essential to prevent deterioration of the heat source, especially the light-emitting module and power supply module, among the heater blocks.

[0007] (Patent Document 1) Registered Patent No. 10-0974013

[0008] The present invention provides a heater block having excellent heat dissipation characteristics by effectively removing heat generated from a light-emitting module unit and a power module unit, and a substrate heat treatment device including the same.

[0009] The present invention provides a heater block capable of supplying stable power by simplifying the connection structure and assembly structure between a light-emitting module unit and a power module unit, and a substrate heat treatment device including the same.

[0010] A heater block according to an embodiment of the present invention comprises: a cooling plate portion having a cooling channel through which cooling water flows; a light emitting module portion provided on a first surface of the cooling plate portion and irradiating light toward a heated object; and a power supply module portion provided on a second surface of the cooling plate portion and supplying power to the light emitting module portion; wherein the light emitting module portion comprises: an insulating base plate; an electrode pad provided on the insulating base plate; and a light emitting semiconductor element provided on the insulating base plate and electrically connected to the electrode pad; wherein the power supply module portion can supply power to the electrode pad by penetrating the cooling plate portion.

[0011] The above power supply module unit can supply power to the electrode pad by penetrating the insulating base plate.

[0012] The power supply module part may include a terminal part that is connected to an external power source to receive power; a body part that supports the terminal part; and an electrode load part that is electrically connected to the terminal part and extends from a lower surface of the body part; and the cooling plate part may include a first through hole into which the electrode load part is inserted.

[0013] The cooling plate portion may further include a first plate having a plurality of upper protrusions protruding from an upper surface to form a side surface of the cooling channel; and a second plate provided on the first plate and coupled to each other to form an upper surface of the cooling channel.

[0014] The above first through hole may be provided to penetrate an area where the plurality of upper protrusions are provided.

[0015] The light emitting module portion further includes a second through hole penetrating the insulating base plate; and an upper electrode portion provided to cross the second through hole and electrically connected to the electrode pad; and an end of the electrode rod portion inserted into the second through hole can be connected to the upper electrode portion.

[0016] The light emitting module portion includes a second through hole penetrating the insulating base plate; an upper electrode portion provided to cross the second through hole and electrically connected to the electrode pad; an insert electrode portion extending from the upper electrode portion and inserted into the second through hole; and a conductive cap member coupled to a lower portion of the insert electrode portion; and an end of the electrode rod portion can be connected to a lower surface of the conductive cap member.

[0017] The lower portion of the above-mentioned insert electrode portion and the conductive cap member can be screw-connected by having screw threads on opposite surfaces that are inserted into each other.

[0018] The above light emitting module part may further include an insulating insert provided between the second through hole and the insert electrode part to support the insert electrode part.

[0019] The above light-emitting module part may further include a metal plate made of a thermally conductive metal, which supports the insulating base plate; and a third through hole which penetrates the metal plate and is provided to communicate with the second through hole.

[0020] The end of the above electrode load section may be provided as a flat surface so as to be in surface contact.

[0021] It may further include a light-emitting plate provided on the light-emitting surface of the light-emitting module portion to protect the light-emitting module portion; and a cooling gas supply portion that supplies cooling gas to the space between the light-emitting module portion and the light-emitting plate.

[0022] It may further include a cover part provided on the power supply module part; and a cooling gas exhaust part for exhausting the cooling gas that diffuses into the space between the power supply module part and the cover part.

[0023] The electrode load portion includes a rod-shaped conductive member made of metal; and an insulating coating layer extending along a side surface of the conductive member and wrapping the side surface of the conductive member, and exposing an end portion of the conductive member; and a cross-section of the electrode load portion has different widths depending on the direction, so that a distance between an outer surface of the electrode load portion and an inner surface of the first through hole may be different depending on the direction.

[0024] The above insulating insert may be provided with a gas path in the height direction through which cooling gas can flow.

[0025] The above body portion may include an elastic member that provides elasticity to the electrode rod portion in the extension direction.

[0026] The electrode load portion may be provided to be linearly movable along the extension direction, and the body portion may further include a guide hole in which the elastic member is accommodated and the electrode load portion guides a linear movement path; an insulating guide member connecting the elastic member and the electrode load portion and linearly moving along the guide hole; and a flexible cable member electrically connecting the electrode load portion and the terminal portion.

[0027] Each of the above light emitting module and power supply module may have a polygonal shape.

[0028] Each of the above light emitting module section and power supply module section can be arranged two-dimensionally in multiple units to correspond to each other to form a honeycomb structured array structure.

[0029] A substrate heat treatment device according to another embodiment of the present invention may include a chamber portion providing a heat treatment space; a substrate support portion supporting a substrate provided in the heat treatment space; and a heater block according to an embodiment of the present invention provided to face the substrate support portion and irradiating light to the substrate to heat the substrate.

[0030] According to the heater block according to the present invention and the substrate heat treatment device including the same, the heat generated from the plurality of light emitting module parts and the plurality of power supply module parts can be effectively removed due to the simple assembly structure of the plurality of light emitting module parts and the plurality of power supply module parts provided around the cooling plate part, thereby resolving the problem of reduced output of the light emitting module parts and instability of power supply that may occur due to insufficient heat dissipation. Furthermore, not only does the light emitting module part and the power supply module part exchange heat with the cooling plate, but also cooling gas is supplied to the light emitting module part and the power supply module part to prevent heat accumulation and enable more effective heat dissipation.

[0031] In addition, by simplifying the connection structure and assembly structure between the light-emitting module and the power supply module, a stable high-power power supply can be supplied, and rapid detachment and stable replacement of the light-emitting module and the power supply module can be achieved, thereby ensuring mass production.

[0032] In addition, the plurality of power supply module units can selectively control the plurality of light emitting module units by independently supplying power to each of the plurality of corresponding light emitting module units, thereby controlling the heating temperature by distinguishing between the positions of the plurality of light emitting module units, and improving the heating uniformity for a heating target such as a substrate.

[0033] Figure 1 is a partial perspective view of a heater block and a partial cross-sectional view of a power supply module according to an embodiment of the present invention.

[0034] Figure 2 is a drawing showing an assembly aspect of a heater block according to an embodiment of the present invention.

[0035] Figure 3 is a drawing showing the cooling gas flow of a heater block according to an embodiment of the present invention.

[0036] Fig. 4 is a cross-sectional configuration diagram of a heater block according to an embodiment of the present invention.

[0037] Fig. 5 is a drawing explaining the assembly state of a heater block according to an embodiment of the present invention.

[0038] Figure 6 is a configuration diagram of a substrate heat treatment device according to another embodiment of the present invention.

[0039] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In the description, identical reference numerals are assigned to identical components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention, and identical numerals in the drawings indicate identical elements.

[0040] FIG. 1 is a partial perspective view and a partial cross-sectional view of a power supply module portion of a heater block according to an embodiment of the present invention, FIG. 2 is a drawing showing an assembled aspect of a heater block according to an embodiment of the present invention, FIG. 3 is a drawing showing a cooling gas flow of a heater block according to an embodiment of the present invention, FIG. 4 is a cross-sectional view of a heater block according to an embodiment of the present invention, and FIG. 5 is a drawing explaining an assembled state of a heater block according to an embodiment of the present invention.

[0041] Referring to FIGS. 1 to 5, a heater block (1000) according to an embodiment of the present invention may include a cooling plate portion (100) having a cooling channel (111) through which cooling water flows; a light emitting module portion (200) provided on a first surface of the cooling plate portion (100) and irradiating light toward a heated object; and a power supply module portion (300) provided on a second surface of the cooling plate portion (100) and supplying power to the light emitting module portion (200). In addition, the light emitting module portion (200) may include an insulating base plate (221); an electrode pad (222) provided on the insulating base plate (221); And a light-emitting semiconductor element (230) provided on the insulating base plate (221) and electrically connected to the electrode pad (222); wherein the power supply module unit (300) can supply power to the electrode pad (222) by penetrating the cooling plate unit (100).

[0042] The heater block (1000) of the present invention may include a light source or heat source that irradiates light to provide light energy to a heated object as a means for supplying heat energy in various heat treatment devices such as a substrate heat treatment device.

[0043] The cooling plate unit (100) has a cooling channel (111) through which cooling water flows inside, and absorbs and removes heat energy generated in the light emitting module unit (200) and / or the power supply module unit (300) mounted on both sides of the cooling plate unit (100) or transferred from a heated object, thereby enabling the light emitting module unit (200) and / or the power supply module unit (300) to maintain a constant temperature.

[0044] The cooling plate unit (100) may include a cooling water inlet (130) for supplying cooling water flowing through a cooling channel and a cooling water outlet (140) for discharging cooling water after heat exchange with the light emitting module unit (200) and / or the power supply module unit (300). The cooling plate unit may further include a circulation pipe connecting the cooling water inlet (130) and the cooling water outlet (140) to circulate the cooling water, a temperature control unit connected to the circulation pipe to control the temperature of the cooling water, and a cooling water filter unit for removing impurities in the cooling water. The cooling water may be process cooling water (PCW), or various refrigerants other than cooling water may also be used.

[0045] The light emitting module unit (200) can function as a light source or heat source that irradiates light toward a heated object and heats the heated object to perform heat treatment. The light emitting module unit (200) can be provided in one or more, and the plurality of light emitting module units (200) can be independently separated from each other and individually mounted or detached from the cooling plate unit (100). The light emitting module units (200) are provided on the first surface of the cooling plate unit (100) and come into contact with each other, so that heat generated in the process of the light emitting module unit (200) converting electrical energy into light energy can be transferred to the cooling plate unit (100) and removed through heat exchange with each other, thereby effectively suppressing deterioration of the light emitting module unit (200).

[0046] The light-emitting semiconductor element (230) is a semiconductor element that emits light when electrons provided through an n-type semiconductor layer and holes provided through a p-type semiconductor layer combine, and may include a light-emitting diode (LED) or a laser diode (LD). In order to be used as a heat source or light source that uniformly supplies energy to a heated object having a large area in the heater block (1000), it must have a surface light source shape having a large area. To this end, the light-emitting semiconductor element (230) needs to be manufactured in a two-dimensional array shape in the light-emitting module unit (200).

[0047] The light-emitting semiconductor element (230) includes an n-type electrode connected to an n-type semiconductor layer and a p-type electrode connected to a p-type semiconductor layer. The n-type electrode may be connected to an electrode pad (222) in a low-potential state, and the p-type electrode may be connected to an electrode pad (222) in a high-potential state. A plurality of electrode pads (222) may be provided to supply power to a plurality of light-emitting semiconductor elements (230) provided in a two-dimensional array form. An insulating portion (222a) may be provided between the plurality of electrode pads (222) so that the plurality of neighboring electrode pads (222) may be electrically isolated from each other.

[0048] The insulating base plate (221) supports the electrode pads (222) and the light-emitting semiconductor elements (230), and must be electrically insulating so that the plurality of electrode pads (222) and the plurality of light-emitting semiconductor elements (230) do not electrically short each other. Meanwhile, the insulating base plate (221) may be thermally conductive so as to effectively dissipate heat generated from the light-emitting semiconductor elements (230). That is, the insulating base plate (221) may be made of a material (e.g., alumina, etc.) that exhibits high electrical insulation and excellent thermal conductivity. The insulating base plate (221) may also include wiring for electrical connection between the electrode pads (222). The insulating base plate (221) and the electrode pads (222) may be a ceramic printed circuit board (220) that constitutes circuit wiring that supplies power to the semiconductor light-emitting element (230).

[0049] The light-emitting semiconductor element (230) may be electrically connected to the electrode pad (222) by flip-chip bonding or wire bonding, and the light-emitting semiconductor element (230) and the electrode pad (222) may be electrically connected in various ways. For example, the n-type electrode of the first light-emitting semiconductor element (230) may be bonded to the first electrode pad (222) using conductive paste or the like, and the p-type electrode of the first light-emitting semiconductor element (230) may be electrically connected to the neighboring second electrode pad (222) by wire bonding. In addition, when the n-type electrode of the second light-emitting semiconductor element (230) is bonded to the second electrode pad (222) using conductive paste or the like, and the p-type electrode of the second light-emitting semiconductor element (230) is electrically connected to the neighboring second electrode pad (222) by wire bonding, a plurality of light-emitting semiconductor elements (230) may be connected in series.

[0050] The light-emitting semiconductor device (230) may include a vertical-cavity surface-emitting laser (VCSEL) device. Unlike side-emitting lasers such as conventional distributed feedback laser diodes (DFB LDs) or Fabri-Perot laser diodes (FP LDs), the VCSEL device has a structure in which a laser beam is emitted in a direction perpendicular to a heated object such as a substrate. Since the laser beam is emitted in a direction perpendicular to the heated object, it has a circular symmetry distribution, so that the light uniformity is superior to that of the side-emitting laser, and a wafer-scale process and manufacturing using a single silicon wafer (or circular substrate) may be possible. In addition, since the resonance distance is made very short, the critical current may decrease, and the overall output may decrease.

[0051] In particular, in order to be used as a heating light source in a substrate heat treatment device, it must be in the form of a surface light source having a large area. For this purpose, the light-emitting semiconductor element (120) needs to be manufactured as a two-dimensional array type light source. In the case of a side-emitting laser, it is difficult to manufacture it as a two-dimensional array type light source because it emits light through the side of a structure laminated on a substrate, whereas a vertical cavity surface-emitting laser (VCSEL) can be manufactured as a two-dimensional array type light source very easily in a desired shape because the structure laminated on the substrate can be formed into a desired structure.

[0052] In addition, the vertical cavity surface-emitting laser (VCSEL) has a light source irradiation angle of about 20 to 25 degrees with respect to the vertical direction of the light-emitting surface, which is much narrower than the 30 to 40 degrees irradiation angle of a light-emitting diode (LED), resulting in excellent light straightness. This allows for a two-dimensional array-type light source that can irradiate high-power and high-precision light onto the heating target, as well as emit uniform light.

[0053] The power supply module unit (300) is a means for supplying power by being electrically connected to the corresponding light emitting module unit (200), and may be provided as one or more. The plurality of power supply module units (300) may individually correspond to the plurality of light emitting module units (200) and supply power to each of them, or may correspond to a light emitting module unit group in which some of the plurality of light emitting module units (200) are grouped and supply power to a light emitting module unit group. The plurality of power supply module units (300) may be independently separated from each other and individually mounted or detached from the cooling plate unit (100). The plurality of power supply module units (300) are provided on the second surface of the cooling plate unit (100) and come into contact with each other, thereby transferring heat generated from the plurality of power supply module units (300) to the cooling plate unit (100) and removing it by heat exchange with each other.

[0054] A plurality of light emitting module parts (200) and / or a plurality of power supply module parts (300) can be independently separated from each other and individually mounted or detached from the cooling plate part (100), so that when some of the light emitting module parts (200) or power supply module parts (300) malfunction or have a deterioration in performance, the corresponding light emitting module parts (200) or power supply module parts (300) can be replaced or individually repaired, so that maintenance of the heater block (1000) is convenient and very effective heat management can be achieved.

[0055] In the present invention, a plurality of light emitting module parts (200) and a plurality of power supply module parts (300) are provided and mounted on the first and second surfaces of the cooling plate part (100) facing each other with the cooling plate part (100) as the center, so that the cooling plate part (100) can stably support the plurality of light emitting module parts (200) and the plurality of power supply module parts (300). Furthermore, the cooling plate part (100) supports the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) separately on both sides, so that heat generated from the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) can be effectively removed without accumulating. For example, if a plurality of light emitting module parts (200) and a plurality of power supply module parts (300) are mounted on one surface of a cooling plate part (100), heat generated from a module part located far from the cooling plate part (200) among the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) is not dissipated and not only is the heat accumulated on its own, but heat may also be accumulated on the contact surfaces of other module parts, so that effective heat dissipation as a whole is not achieved and heat may be accumulated.

[0056] If the heat generated from the light emitting module unit (200) and the power supply module unit (300) is not effectively dissipated, the operation of the power supply module unit (300) and / or the light emitting module unit (200) may be affected by the accumulated heat, which may result in instability of the supplied power or a decrease in light emitting output. In addition, the electrical connection between the power supply module unit and the light emitting module unit may be partially short-circuited due to the accumulated heat, which may cause durability problems of the heater block.

[0057] However, in the present invention, the cooling plate part (100) is placed between the light emitting module part (200) and the power supply module part (300), so that the cooling plate part (100) comes into contact with each of the light emitting module part (200) and the power supply module part (300), thereby effectively dissipating the heat generated in the light emitting module part (200) and the power supply module part (300).

[0058] The power supply module (300) can supply power to the electrode pad (222) by penetrating the insulating base plate (221).

[0059] In order for the power supply module (300) provided on the second surface of the cooling plate portion to supply power to the light emitting module (200) provided on the first surface of the cooling plate portion (100), the power supply module (300) is connected to the lower surface of the insulating base plate (221), and the electrode pad (222) provided on the lower surface and the insulating base plate (221) can be electrically connected to the power supply module (300) and the electrode pad (222) by using a via hole in which a through hole penetrating the insulating base plate (221) is filled with a conductive material. However, in the case of a heater block used in a substrate heat treatment device, etc., high power is used to enable rapid heat treatment at a high temperature, so that when power is supplied through the via hole, the power supply may be unstable due to the resistance component of the via hole. Meanwhile, in order to stably lower the resistance component of a via hole by increasing the diameter of the via hole or increasing the number of via holes, a significant portion of the insulating base plate may be formed as a via hole, which may cause structural instability.

[0060] Accordingly, in the present invention, the power supply module part (300) supplies power to the electrode pad (222) by directly penetrating the insulating base plate (221) without using a via hole, thereby stably supplying high-power power while suppressing additional heat generation in the light-emitting module part (200).

[0061] Meanwhile, the power supply module (300) may include a terminal portion (310) that is connected to an external power source to receive power; a body portion (320) that supports the terminal portion (310); and an electrode load portion (330) that is electrically connected to the terminal portion (310) and extends from the lower surface of the body portion (320).

[0062] In addition, the cooling plate portion (100) may include a first through hole into which the electrode load portion (330) is inserted so that the electrode load portion (330) can penetrate the cooling plate portion (100) and be connected to the corresponding light emitting module portion (200). By this structure, a plurality of power supply module portions (300) can be stably and easily detachably provided in a state in which they are independently separated from each other on the second surface of the cooling plate portion (200).

[0063] The terminal portion (310) can be connected to a power line extended from an external power source to supply power necessary for generating light in the corresponding light-emitting module (200). The terminal portion (310) can be provided with a connecting portion into which a socket terminal of the power line is inserted and connected.

[0064] The body part (320) can support a terminal part (310) provided on the upper surface, and can be provided with a wiring part that transmits the power supplied to the terminal part (310) to the electrode load part (330), a switching part that selectively short-circuits the supplied power, etc. The body part (320) may further be provided with a fixing hole into which a fixing member that fixes the power supply module part (300) to the cooling plate part (100) is inserted.

[0065] An electrode load portion (330) electrically connected to the terminal portion (310) and extending downward from the lower surface of the body portion (320) may penetrate the cooling plate portion (100) in the thickness direction and be connected to an electrode terminal portion of a corresponding light-emitting module portion (200) to which the power supply module portion (300) supplies power. The electrode load portion (330) may be provided as a pair, each connected to an n-type electrode terminal portion and a p-type electrode terminal portion of the light-emitting module portion (200). Since the cooling plate part (100) is made of an electrically conductive material (e.g., a metal such as copper or stainless steel) so that heat transfer can occur smoothly, the electrode load part (330) may include a metal load part (331) that transmits power supplied from the terminal part (320) and an insulating coating layer (332) that covers the side surface except for the end portion (333) of the metal load part (331) so that the electrode load part (330) is not electrically short-circuited with the cooling plate part (100).

[0066] In this invention, by using a plurality of light emitting module units (200) and a plurality of power supply module units (300), the light emitting state of a plurality of light emitting module units (200) can be controlled independently or selectively for each area to increase the heating uniformity or the temperature uniformity of the heated object.

[0067] Meanwhile, in order to further subdivide the control area, each of the plurality of light-emitting module parts (200) may include a first light-emitting part and a second light-emitting part that can emit light independently of each other. The first light-emitting part and the second light-emitting part may be provided to equally divide the light-emitting surface of the light-emitting module part into two, or may be provided to divide it at different ratios. The first light-emitting part and the second light-emitting part may each have a plurality of light-emitting semiconductor elements that provide light energy. The plurality of light-emitting semiconductor elements may be formed by mounting a plurality of chips, or a multi-chip may be formed in the form of a single element.

[0068] In order for the first light-emitting unit and the second light-emitting unit to emit light independently of each other, the terminal unit (310) may include a first terminal unit (310a) to a second terminal unit (310b) that receive power supplied to the first to second light-emitting units, respectively, and the electrode load unit (330) may include a first electrode load unit to a second electrode load unit that are electrically connected to the first terminal unit (310a) to the second terminal unit (310b). The first to second electrode load units are each provided as a pair of anodes and cathodes, and may transmit power supplied to the first terminal unit (310a) to the second terminal unit (310b) to the corresponding first to second light-emitting units by penetrating the cooling plate unit (100).

[0069] In order to increase the temperature uniformity of a heated object such as a substrate, a plurality of light emitting module units (200) and a plurality of power supply module units (300) can be arranged two-dimensionally to selectively control each region. In this case, heat may accumulate in the central region of the two-dimensionally arranged plurality of light emitting module units (200) and the plurality of power supply module units (300), but the cooling plate unit (100) can suppress the heat accumulation by directly exchanging heat with the plurality of light emitting module units (200) and the plurality of power supply module units (300) to effectively dissipate heat, thereby enabling precise control of the heating temperature and power supply for each region, thereby improving the temperature uniformity of the heated object.

[0070] The cooling plate part (100) may further include a first plate (110) having a plurality of upper protrusions (112) protruding from the upper surface to form a side surface of the cooling channel (111); and a second plate (120) provided on the first plate (110) and coupled to each other to form an upper surface of the cooling channel (111). That is, the cooling channel (111) is sufficient as long as it is surrounded by the upper surface of the first plate (110), the upper protrusions (112), and the lower surface of the second plate (120) so that the cooling water can flow, and the structure or formation position of the upper protrusions (112), etc. for defining the cooling channel (111) (for example, the lower surface of the second plate (120), etc.) may be varied in various ways.

[0071] In the case where the cooling channel (111) is a linear channel having a straight or curved shape formed by a pipe or drilling inserted between the cooling water inlet (130) and the cooling water outlet (140), the cooling water quickly flows along the linear channel from the cooling water inlet (130) toward the cooling water outlet (140). Therefore, the cooling water not only does not have sufficient time to exchange heat with the first plate and / or the second plate, but also cannot help but have a temperature gradient (or temperature difference) from the cooling water inlet (130) toward the cooling water outlet (140). On the other hand, if the cooling water flows through a wide empty space formed in the center between the first plate and the second plate that are joined to each other at the edge or border of the cooling plate (100), the area where the flowing cooling water comes into contact with the first plate and / or the second plate may not be large, so heat exchange may not occur well.

[0072] If the coolant does not flow along the shortest path (or a path close to the shortest path) between the coolant inlet (130) provided on one side of the cooling plate part (100) and the coolant outlet (140) provided on the other side of the cooling plate part (100) that crosses the cooling plate part (100) but instead flows while making a continuous detour, the cooling area by heat exchange of the coolant can be maximized, thereby increasing the heat dissipation effect by the cooling plate part (100).

[0073] As illustrated in Fig. 5(a), which is a plan view showing the upper surface of the first plate (110), the upper surface of the first plate (110) may be provided with a plurality of upper protrusions (112) that form the side surfaces of the cooling passages (111). The plurality of upper protrusions (112) are provided on the upper surface of the first plate (110) at intervals from each other, so that the empty space between the plurality of upper protrusions (112) may form the cooling passages (111). When coolant flows onto the upper surface of the first plate (110) through the coolant inlet (130) provided on one side of the cooling plate part (200), the coolant flowing toward the coolant outlet (140) provided on the other side of the cooling plate part (100) has no choice but to spread out by continuously colliding with the plurality of upper protrusions (112), thereby effectively increasing the contact area or cooling area between the coolant and the first plate (110).

[0074] The first plate (110) and the second plate (120) forming the cooling plate (100) are joined to each other to form a single body. Since the first plate (110) and the second plate (120) are joined not only at the edges but also supported and joined to each other by the upper protrusion (112) from the inside, the cooling plate (100) can be structurally more stable.

[0075] The lower surface of the second plate (120), which forms the cooling plate (200) by being combined with the first plate (110), forms the upper surface of the cooling passage, and the lower surface of the second plate (120) is in direct contact with a plurality of upper protrusions (112) so that the heat of the second plate (120) can be quickly transferred to the upper protrusions (112). That is, the cooling water directly exchanges heat while being in contact with the upper surface of the first plate (110), the upper protrusions (112), and the lower surface of the second plate (110), and the first plate (110) and the second plate (120) are thermally connected through the upper protrusions (112) so as to form a cooling plate (100) having an integrated structure that can maintain a uniform temperature. The first plate (110) to the second plate (120) may be made of a metal having high thermal conductivity, and the first plate (110) to the second plate (120) may be joined by brazing or welding so that the first plate (110) to the second plate (120) can be completely joined so that heat transfer between the first plate (110) and the second plate (120) can occur more quickly.

[0076] Since the light emitting module unit (200) functioning as a heat source in the heater block (1000) can generate more heat than the power supply module unit (300), it is necessary to dissipate the heat emitted from the light emitting module unit (200) more quickly. Accordingly, a plurality of light emitting module units (200) may be provided on a first plate (110) that allows for more rapid heat dissipation by contacting the cooling water at the upper surface and the upper protrusion (112), and a plurality of power supply module units (300) may be provided on a second plate (120).

[0077] The first plate (110) and the second plate (120) may be made of the same material or may be made of different materials. The first plate (110), which requires relatively better heat dissipation properties, may be made of copper, a metal with good thermal conductivity properties, and the second plate (120), in order to reinforce the mechanical stability of the cooling plate (100), may be made of stainless steel, a metal with excellent mechanical strength and chemical stability.

[0078] The first through hole (150) into which the electrode load portion (330) is inserted may be provided so as to penetrate an area where a plurality of upper protrusions (112) are provided.

[0079] In order for the plurality of power supply module parts (300) to pass through the cooling plate part (100) and supply power to the corresponding plurality of light emitting module parts (200), a part of the plurality of power supply module parts (300) (e.g., the electrode load part (330)) must pass through the first plate (110) and the second plate (120). If the electrode load part (330) passes through the cooling passage (111) area, an electrical short may occur between the electrode load part (330) and the cooling water, or a leak may occur at the location where the electrode load part (330) is inserted. In order to solve this problem, in the present invention, a plurality of first through holes (150) are formed that penetrate the first plate (110) and the second plate (120) in the area where the upper protrusion (112) is provided, and the electrode load parts (330) of the plurality of power supply module parts (300) are inserted into the plurality of first through holes (150) so as to be electrically connected to the corresponding plurality of light emitting modules (200). In order to form the first through holes (150), a lower first through hole (150a) that penetrates the upper protrusion (112) of the first plate (110) can be formed to correspond to the position and number of the electrode load parts (330), and an upper first through hole (150b) can be formed in the area of ​​the second plate (120) where the upper protrusion (112) is joined. After combining the first plate (110) and the second plate (120), a first through hole (150) may be formed by drilling or the like in an area where a plurality of upper protrusions (112) are provided.

[0080] Since the electrode rod part (330) is inserted into the first through hole (150) that penetrates the plurality of protrusions (112) where the first plate (110) and the second plate (120) are joined to each other, not only does the electrode rod part (330) not come into direct contact with the coolant, but also the first through hole (150) is not exposed to the coolant, so the possibility of coolant leakage can be eliminated.

[0081] Meanwhile, the cooling plate portion (100) may further include a plurality of connecting through holes (160) penetrating the area where the plurality of upper protrusions (112) are provided; and a plurality of fixing members that are at least partially inserted into the plurality of connecting through holes (160) to fix the plurality of light emitting module portions (200) or the plurality of power supply module portions (300).

[0082] A plurality of light emitting module parts (200) and a plurality of power supply module parts (300) can be provided two-dimensionally arranged to face each other on the first and second surfaces of the cooling plate part (100). In order for the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) corresponding to each other to maintain an electrically connected state, they need to be stably fixed on the first and second surfaces of the cooling plate part (100), respectively.

[0083] To prevent leakage of the cooling water, a plurality of connecting through holes (160) may pass through an area where a plurality of upper protrusions (112) are provided. Depending on the method of inserting the fixing member to at least partially insert and fix the plurality of light emitting module parts (200) and / or the plurality of power supply module parts (300), the connecting through holes (160) may completely or partially pass through the cooling plate part (100).

[0084] In order to form a plurality of connecting through holes (160), a lower connecting through hole (160a) penetrating the upper protrusion (112) of the first plate (110) may be formed, and an upper connecting through hole (160b) may be formed in the area of ​​the second plate (120) where the upper protrusion (112) is joined. After connecting the first plate (110) and the second plate (120), connecting through holes (160) may be formed by drilling or the like in the area where the plurality of upper protrusions (112) are provided.

[0085] A plurality of fixing members are inserted at least partially into a plurality of connecting through holes (160) and one end thereof is inserted and fixed into a connecting groove formed in a plurality of light emitting module parts (200) or a plurality of power supply module parts (300), thereby fixing a plurality of light emitting module parts (200) or a plurality of power supply module parts (300) to a cooling plate part (100). The fixing members may be screws having threads formed on an outer surface, and a thread corresponding to a thread of an outer surface of the fixing members may be formed on an inner surface of the connecting through holes (160) or the connecting groove.

[0086] As shown in FIG. 5(b), the first plate (110) may further include a lower protrusion (113) that protrudes from the lower surface and defines a concave portion (114) on which a plurality of light emitting module portions (200) are mounted.

[0087] A plurality of light emitting module parts (200) may be provided on the first surface of the cooling plate part (100) facing the object to be heated in order to irradiate light toward the object to be heated. The plurality of light emitting module parts (200) must be uniformly arranged two-dimensionally on the first surface of the cooling plate part (100) (or the lower surface of the first plate (110)) in order to uniformly heat the object to be heated, such as a substrate. Therefore, in the present invention, in order to determine the correct positions at which the plurality of light emitting module parts (200) are to be mounted, the plurality of light emitting module parts (200) are inserted into a plurality of concave portions (114) formed between the lower protrusions (113) protruding from the lower surface of the first plate (110), thereby uniformly arranging the plurality of light emitting module parts (200) at predetermined positions on the lower surface of the first plate (110). When the light emitting module part (200) is inserted into the concave part (114), the heat generated in the light emitting module part (200) can be quickly dissipated to the cooling plate part (100) not only through the lower surface of the first plate (110) with which the lower surface of the light emitting module part (200) is in contact, but also through the lower protrusion (113) that is in contact with or close to the side surface of the light emitting module part (200).

[0088] Similar to the recessed portion (114) for accommodating a plurality of light emitting module portions (200), the second plate (120) may include a top recessed portion (121) formed on the upper surface of the second plate (120) to accommodate a plurality of power supply module portions (300). The top recessed portion (121) may be provided as a plurality of top recessed portions (121) to individually accommodate a plurality of power supply module portions (300), or may be provided as a single top recessed portion (121) for accommodating all of the plurality of power supply module portions (300). The second plate (120) may further include a cover portion (600) for covering the top recessed portion (121) to protect the plurality of power supply module portions (300) accommodated in the top recessed portion (121).

[0089] Each of the light emitting module (200) and the power supply module (300) may have a polygonal shape.

[0090] In order to uniformly heat a heated object such as a substrate, not only a plurality of light emitting module parts (200) that are uniformly arranged two-dimensionally, but also a plurality of power supply module parts (300) that supply power to the corresponding plurality of light emitting module parts (200) by penetrating the cooling plate part (100) may be uniformly arranged two-dimensionally. Not only must the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) be uniformly distributed two-dimensionally, but also the intervals between the plurality of light emitting module parts (200) and the intervals between the plurality of power supply module parts (300) must be two-dimensionally constant. If the intervals between the light emitting module parts (200) differ depending on the direction and position, light does not occur in the interval area between the light emitting module parts (200), and thus light may not be uniformly emitted over the entire light emitting surface of the heater block (1000).

[0091] If the planar shape (the outermost shape of each when viewed from above) of the light emitting module unit (200) and the power supply module unit (300) is not a polygon but a circle, the gap between the neighboring light emitting module units (200) and the corresponding power supply module units (300) may vary depending on the direction, making uniform light emission impossible. For example, the gap between neighboring light emitting module units (200) may be minimal in the horizontal and vertical directions, and the gap between neighboring light emitting module units (200) may be maximal in the direction inclined at a 45 degree angle.

[0092] When the planar shapes of the light emitting module unit (200) and the corresponding power supply module unit (300) have the same polygonal shape, not only can a plurality of light emitting module units (200) and a plurality of power supply module units (300) be uniformly distributed on both sides of the cooling plate unit (100), but also the spacing between adjacent light emitting module units (200) and power supply module units (300) can be maintained constant. By this arrangement structure, the heater block (1000) can provide uniform thermal energy or light energy to the heated object.

[0093] Referring to FIG. 1 and FIG. 5(b), each of the plurality of light-emitting module parts (200) and each of the plurality of power supply module parts (300) may have a hexagonal shape. When each of the plurality of light-emitting module parts (200) and each of the plurality of power supply module parts (300) have a hexagonal outermost shape, not only is two-dimensional expansion easy, but the entire arrangement of the plurality of light-emitting module parts (200) or the plurality of power supply module parts (300) can form a concentric structure from the center, so that uniform light emission can be achieved regardless of the location on the light-emitting surface of the heater block (1000).

[0094] A plurality of light emitting module parts (200) and a plurality of power supply module parts (300) can be arranged two-dimensionally to form an array shape of a honeycomb structure.

[0095] In a honeycomb structured array in which a plurality of light-emitting module parts (200) and a plurality of power supply module parts (300) having a hexagonal plane shape are arranged two-dimensionally, the entire circumference of the light-emitting module part (200) including the vertices can be wrapped by a minimum number (6) of adjacent light-emitting module parts (200) equal to the number of angles in the hexagon. Accordingly, the average density and light-emitting efficiency (or heating efficiency) of the light-emitting module parts (200) per unit area can be increased.

[0096] If each of the plurality of light emitting module parts (200) has a polygonal (e.g., hexagonal) shape, the concave part (114) defined by the lower protrusion part (113) can also be arranged two-dimensionally in a polygonal (e.g., hexagonal) shape.

[0097] A light emitting module (200) according to one embodiment of the present invention further includes a second through hole (223) penetrating the insulating base plate (221); and an upper electrode portion (224) provided to cross the second through hole (223) and electrically connected to the electrode pad (222); and an end portion (333) of the electrode rod portion (330) inserted into the second through hole (223) can be connected to the upper electrode portion (224) (see FIG. 2(b)).

[0098] In order to enable the power supply module unit (300) to directly penetrate the insulating base plate (221) and supply power to the electrode pad (222) without using a via hole that may cause instability in the power supply due to a high resistance component, a second through hole (223) into which the electrode load unit (330) can be inserted can be formed in the thickness direction of the insulating base plate (221). In order to supply power to the electrode pad (222) provided on the insulating base plate (221), a means for electrically connecting to the electrode load unit (330) inserted into the second through hole (223), penetrating the insulating base plate (221), and reaching the upper surface of the insulating base plate (221) is required. To this end, an upper electrode portion (224) is provided to cross the second through hole (223) or the upper portion of the second through hole (223), and at least one end of the upper electrode portion (224) is electrically connected to the electrode pad (222). At this time, the upper electrode portion (224) may be made of a metal having excellent electrical conductivity, such as copper, and the end of the upper electrode portion (224) and the electrode pad (222) may be fixed and electrically connected by soldering or the like.

[0099] The end (333) of the electrode rod portion (330) inserted into the second through hole (223) and reaching the upper surface of the insulating base plate (221) can be electrically connected to the lower surface of the central portion of the upper electrode portion (224) that crosses the upper portion of the second through hole (223) or the second through hole (223). The upper surface of the end (333) of the electrode rod portion (330) and the lower surface of the central portion of the upper electrode portion (224) can be formed as surfaces that correspond to each other (for example, a flat plane).

[0100] Meanwhile, if the heat generated in the light emitting module unit (200) is not smoothly dissipated to the cooling plate unit (100) and heat accumulation occurs, the soldering point that fixes the end of the upper electrode unit (224) and the electrode pad (222) may partially melt, which may cause the power supply to become unstable, and arcing may occur due to high power. In addition, in order to lower the resistance component at the area where the electrode load unit (330) and the upper electrode unit (224) come into contact with each other, the electrode load unit (330) may be pushed toward the upper electrode unit (224) so ​​that they can be brought into close contact with each other. However, the partially melted soldering point may be lifted or completely separated by this force.

[0101] To compensate for this, a light emitting module part (200) according to another embodiment of the present invention includes: a second through hole (223) penetrating the insulating base plate (221); an upper electrode part (224) provided to cross the second through hole (223) and electrically connected to the electrode pad (222); an insertion electrode part (225) extending from the upper electrode part (224) and inserted into the second through hole (223); and a conductive cap member (226) coupled to a lower portion of the insertion electrode part (225); and an end of the electrode load part (330) can be connected to a lower surface of the conductive cap member (226) (see FIG. 2(c)).

[0102] An upper electrode portion (224) is provided so as to cross a second through hole (223) formed in the thickness direction of an insulating base plate (221) or an upper portion of the second through hole (223), and at least one end of the upper electrode portion (224) is electrically connected to an electrode pad (222). At this time, the upper electrode portion (224) may be made of a metal having excellent electrical conductivity, such as copper, and the end of the upper electrode portion (224) and the electrode pad (222) may be fixed and electrically connected by soldering or the like.

[0103] In another embodiment of the present invention, the electrode load portion (330) is inserted into the second through hole (223) and reaches the upper surface of the insulating base plate (221) so as not to be connected to the lower surface of the central portion of the upper electrode portion (224), but rather, the upper electrode portion (224) can be electrically extended to the lower surface (or vicinity) of the insulating base plate (221) by means of an insertion electrode portion (225) that extends from the lower surface of the central portion of the upper electrode portion (224) and is inserted into the second through hole (223) and a conductive cap member (226) that is coupled to the lower portion of the insertion electrode portion (225). The insertion electrode portion (225) and the conductive cap member (226) can be made of a metal having excellent electrical conductivity, such as copper.

[0104] The end of the electrode load portion (330) is not directly connected to the upper electrode portion (224), but is connected to the lower surface of the conductive cap member (226), so that even if the electrode load portion (330) is pushed toward the upper electrode portion (224), the end of the upper electrode portion (224) and the electrode pad (222) do not lift off from each other or are partially separated from each other at the soldering point, and power can be stably supplied to the upper electrode portion (224) and the electrode pad (222).

[0105] When the conductive cap member (226) is fixed to the position of the insulating base plate (221) without moving in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)), the insert electrode member (225) and the upper electrode member (224) connected to the conductive cap member (226) can also be fixed, and the end of the electrode load member (330) can be stably connected by being pressed against the lower surface of the conductive cap member (226) by the force that pushes the electrode load member (330). The conductive cap member (226) can be fixed without moving in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)) by having its upper surface supported by the lower surface of the insulating base plate (221) or the step formed on the lower surface. In this case, the step formed on the lower surface or lower surface of the insulating base plate (221) can provide a reference position for the coupling of the insert electrode portion (225) and the conductive cap member (226).

[0106] The lower portion of the insert electrode portion (225) and the conductive cap member (226) can be screw-connected by having screw threads (227) on the opposite surfaces that are inserted into each other.

[0107] The insertion electrode portion (225) and the conductive cap member (226) may be provided with a joining structure such as a concave portion or a convex portion so that they can be inserted into each other. For example, as shown in Fig. 2(c), a concave portion into which the lower portion of the insertion electrode portion (225) can be inserted may be formed on the upper portion of the conductive cap member (226), or a concave portion may be formed on the lower portion of the insertion electrode portion (225), and a protrusion may be formed on the upper portion of the conductive cap member (226) into which the insertion electrode portion (225) can be inserted. When the insertion electrode portion (225) and the conductive cap member (226) are inserted into each other and have screw threads (227) on the opposing surfaces, and the conductive cap member (226) is fixed and rotated in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)), the insertion electrode portion (225) and the conductive cap member (226) can be firmly screw-connected to each other by the screw threads (227). In addition, since the upper electrode portion (224) connected to the insertion electrode portion (225) is supported on the upper surface of the insulating base plate (221), as the insertion electrode portion (225) screw-connected to the conductive cap member (226) is pulled, the soldering point provided between or between the upper electrode portion (224) and the electrode pad (222) can be firmly attached without lifting. Moreover, since the conductive cap member (226) is firmly fixed to the insulating base plate (221), even if the electrode load member (330) connected to the lower surface of the conductive cap member (226) is pushed so that they can be in close contact with each other at the connection portion, the pushing force of the electrode load member (330) is not directly transmitted to the upper electrode member (224) but can be blocked by the conductive cap member (226), so that even if the soldering point is partially melted, a stable connection state can be maintained.

[0108] The light emitting module part (200) according to another embodiment of the present invention may further include an insulating insert (228) provided between the second through hole (223) and the insert electrode part (225) to support the insert electrode part (225).

[0109] If the insertion electrode part (225) is allowed to move within the second through hole (223) into which it is inserted and is tilted to one side, the upper electrode part (224) connected to the insertion electrode part (225) will also move, and thus the electrical connection between the end of the upper electrode part (224) and the electrode pad (222) may be damaged. Therefore, in order to maintain a stable electrical connection path by keeping the insertion electrode part fixed and not moving within the second through hole (223), an insulating insert (228) may be provided between the second through hole (223) and the insertion electrode part (225) to support the insertion electrode part (225).

[0110] Meanwhile, since the lower cross-sectional area of ​​the insulating insert (228) is larger than the upper cross-sectional area, the upper side of the insulating insert (228) can be stably supported by being inserted into the second through hole (223) and contacting the inner surface, and the lower side of the insulating insert (228) is not inserted into the second through hole, but is supported by the lower surface of the insulating base plate (221) or a step on the lower surface, so that it can maintain a constant height without moving toward the upper electrode part (224) along the extension direction of the second through hole (223). In addition, the upper end of the insulating insert (228) can stably support the upper electrode part (224) and the inserted electrode part (225) by contacting the lower surface of the central part of the upper electrode part (224).

[0111] The insulating insert (228) has a through hole penetrating the body of the insulating insert, and may include an upper through hole into which the insert electrode portion (225) is inserted, and a lower through hole into which the conductive cap member (226) is inserted. At the connecting surface where the upper through hole and the lower through hole are connected, the cross-sectional area of ​​the upper through hole is smaller than the cross-sectional area of ​​the lower through hole, so that a connecting step portion may be provided between the upper through hole and the lower through hole, so that the upper portion of the conductive cap member (226) is supported by the connecting step portion and can maintain a constant height without moving toward the upper electrode portion (224) along the extension direction of the second through hole. That is, the insulating insert (228) can provide a reference surface for (screw) coupling between the insert electrode portion (225) and the conductive cap member (226) to enable mutual compression. The conductive cap member (226) that maintains a constant height from the reference plane for (screw) connection can be pulled toward the conductive cap member (226) by the insert electrode member (225) that is (screw) connected to the conductive cap member, so that the solder provided between or between the upper electrode member (224) and the electrode pad (222) can be firmly adhered without lifting.

[0112] In addition, since the conductive cap member (226) is supported by the connecting step, even if the electrode load member (330) connected to the lower surface of the conductive cap member (226) transmits a force to lower the electrical resistance, the conductive cap member (226) maintains a constant height, so that the conductive cap member and the electrode load member (330) can be firmly pressed against each other.

[0113] The light emitting module (200) may further include a metal plate (210) made of a thermally conductive metal, which supports an insulating base plate (221); and a third through hole (211) which penetrates the metal plate (210) and is provided to communicate with the second through hole (223).

[0114] The light emitting module (200) is provided on the lower surface of the first plate (110), but since the light emitting semiconductor element (230) and the ceramic PCB (220) do not have a thermally conductive material distributed over the entire surface, heat may not be quickly transferred to the lower surface of the first plate (110). However, in the present invention, the metal plate (210) is configured to integrally support the ceramic PCB (220) and the light emitting semiconductor element (230) connected thereto, and is made of a thermally conductive metal to quickly transfer heat generated from the light emitting semiconductor element (230) to the first plate (110) so that it can be dissipated to the outside. And, in order to at least partially accommodate the insert electrode portion (225), the conductive cap member (226), and the insulating insert (228), which are electrical connection structures of the ceramic PCB (220), the light emitting module portion (200) may further include a third through hole (211) that penetrates the metal plate (210) and is provided to communicate with the second through hole (223). The third through hole (211) may include an upper third through hole (211a) into which the upper side of the insulating insert (228) having a narrow cross-sectional area is inserted, and a lower third through hole (211b) into which the lower side of the insulating insert (228) having a wide cross-sectional area is inserted, so that a step portion may be formed between the upper third through hole (211a) and the lower third through hole (211b). The upper surface of the lower side of the insulating insert (228) can be stably supported by contacting the step portion between the upper third through hole (211a) and the lower third through hole (211b), so that the insulating insert (228) can maintain a constant height without moving toward the upper electrode portion (224) along the extension direction of the second through hole (223).

[0115] Meanwhile, for rapid heat exchange, the joint surfaces of the light emitting module unit (200) and the first plate (110) that come into contact with each other may both be made of metal. However, since the surface structure of the metal surfaces has a roughness, a gap may be generated at the interface between the metal surfaces due to the surface roughness when the metal surfaces come into contact. The air filling the gap generated at the interface between the light emitting module unit (200) and the first plate (110) has low thermal conductivity, so the thermal conductivity characteristics between the light emitting module unit (200) and the first plate (110) may deteriorate. In particular, when the heater block (1000) is placed and used in a process space maintained in a vacuum, such as a substrate heat treatment device, the gap generated at the interface between the light emitting module unit (200) and the first plate (110) becomes a vacuum, so that the heat exchange between the light emitting module unit (200) and the first plate (110) is significantly reduced, which may be fatal. To solve this problem, an elastic heat dissipation pad can be provided between the cooling plate portion (100) and the plurality of light-emitting module portions (200).

[0116] If a heat dissipation pad having elasticity, such as a silicone heat dissipation pad, is provided between the light emitting module unit (200) and the first plate (110), the heat dissipation pad can fill the gap created by the surface roughness of the light emitting module unit (200) and the first plate (110) while elastically deforming, thereby increasing the thermal contact area between the light emitting module unit (200) and the first plate (110), thereby effectively improving the heat exchange efficiency. In addition, slip may occur between the metal plate (210) and the first plate (110), resulting in a deviation from the correct position for electrical connection. If an elastic heat dissipation pad is provided between the light emitting module unit (200) and the first plate (110), slipping can be prevented and the correct position can be maintained.

[0117] The end (333) of the electrode load portion (330) is formed as a flat surface and is provided to be in close contact with the lower surface of the opposing upper electrode portion (224) or the lower surface of the conductive cap member (226), so that the power supply method for supplying power to the light emitting module portion (200) enables End Flat contact.

[0118] The heater block (1000) of the present invention may further include a light-emitting plate (400) provided on the light-emitting surface of the light-emitting module portion (200) to protect the light-emitting module portion; and a cooling gas supply portion (500) that supplies cooling gas to the space between the light-emitting module portion (200) and the light-emitting plate (400).

[0119] The light-emitting plate (400) can be mounted on the first plate (110) so as to be provided on the light-emitting surface of the light-emitting module (200), and can transmit light emitted from the light-emitting semiconductor element (230) and protect the light-emitting semiconductor element (120).

[0120] The heat generated in the light emitting module unit (200) is dissipated through the lower surface of the light emitting module unit (200) and the cooling plate unit (100). However, in a structure in which a plurality of light emitting semiconductor elements (230), which are point light sources, and a plurality of light emitting module units (200), are two-dimensionally arranged, the arrangement area of ​​the light emitting semiconductor elements (230) cannot be completely uniform, and sufficient heat dissipation or temperature uniformity may not be achieved solely by heat conduction. Therefore, in the present invention, the cooling gas supply unit (500) supplies cooling gas to the space between the light emitting module unit (200) and the light emitting plate (400), so that the cooling gas flows while colliding with the exposed surface of the light emitting module unit, thereby utilizing not only conduction but also convection, thereby further improving the heat dissipation effect and temperature uniformity.

[0121] The cooling gas can be nitrogen (N2) or process air.

[0122] The cooling gas unit (500) may be provided in multiple numbers facing each other at the edge of the cooling plate unit (100) so as to uniformly supply and flow cooling gas into the space between the light emitting module unit (200) and the light-emitting panel (400). Alternatively, the cooling gas unit (500) provided in multiple numbers facing each other at the edge of the cooling plate unit (100) may first diffuse through a cooling gas path formed to extend along the edge of the first plate (110) and surround the light emitting module unit (200) at the center, and then the cooling gas may be sprayed in all directions toward the light emitting module unit (200) through a supply hole communicating with the cooling gas path so as to flow in the space between the light emitting module unit (200) and the light-emitting panel (400) so as to enable more uniform temperature control.

[0123] The heater block (1000) of the present invention may further include a cover portion (600) provided on the power supply module portion (300); and a cooling gas exhaust portion (700) for exhausting cooling gas that diffuses into the space between the power supply module portion (300) and the cover portion (600).

[0124] The cover part (600) can be mounted on the second plate (120) to be provided on the power supply module part (300) and can protect the power supply module part (300).

[0125] The cooling gas supplied by the cooling gas supply unit (500) may flow in the space between the light emitting module unit (200) and the light-emitting plate (400) and exchange heat with the light emitting module unit (200), and then sequentially pass through the second through hole (223), the third through hole (211), and the first through hole (150) to diffuse into the space between the power supply module unit (300) and the cover unit (600). The temperature of the cooling gas that has exchanged heat with the light emitting module unit (200) may rise, but the temperature of the cooling gas may decrease again as it passes through the first through hole (150) of the cooling plate unit (100), so that the cooling gas may radiate heat generated in the power supply module unit (300) by flowing in the space between the power supply module unit (300) and the cover unit (600) and then being discharged to the outside through the cooling gas exhaust unit (700).

[0126] In the above, it has been described that the cooling gas supply unit (500) is provided on the side of the light emitting module unit (200) and the cooling gas exhaust unit (700) is provided on the side of the power supply module unit (300) because it is important to stabilize the light emitting characteristics of the light emitting module unit (200) that is more sensitive to temperature. However, the cooling gas supply unit (500) may be provided on the side of the power supply module unit (300) and the cooling gas exhaust unit (700) may be provided on the side of the light emitting module unit (200).

[0127] In order to stabilize the temperature by dissipating heat from the light emitting module unit (200) and the power supply module unit (300) while the cooling gas supplied to the cooling gas supply unit (500) is exhausted through the cooling gas exhaust unit (700), the cooling gas must be able to flow smoothly in the space between the light emitting module unit (200) and the light-emitting panel (400) and the space between the power supply module unit (300) and the cover unit (600). The cooling gas diffuses by passing through the second through hole (223), the third through hole (211), and the first through hole (150). The second through hole (223), the third through hole (211), and the first through hole (150) may need a passage through which the cooling gas can move smoothly without feeling flow resistance, such as by inserting an electrode rod unit (330), an insert electrode unit (225), a conductive cap member (226), or an insulating insert (228).

[0128] To this end, the electrode rod portion (330) inserted into the first through hole (150) includes a rod-shaped conductive member (331) made of metal; and an insulating coating layer (332) extending along the side surface of the conductive member (331) to surround the side surface of the conductive member (331) and exposing an end portion (333) of the conductive member; and the cross-section of the electrode rod portion (330) has different widths depending on the direction, so that the distance between the outer surface of the electrode rod portion (330) and the inner surface of the first through hole (150) may be different depending on the direction.

[0129] When the size and shape of the cross-section of the electrode rod part (330) inserted into the first through hole (150) are almost identical so that they touch each other or have a distance apart that allows insertion, the outer surface of the electrode rod part (330) can be stably supported by the inner surface of the first through hole (150), but sufficient space for the cooling gas to flow is not secured, so the cooling gas may not be able to move through the space between the first through hole (150) and the electrode rod part (330).

[0130] However, if the cross-section of the electrode load part (330) has different widths depending on the direction, and the distance between the outer surface of the electrode load part (330) and the inner surface of the first through hole (150) is different depending on the direction, a separation space through which the cooling gas can flow smoothly can be secured. That is, in the area where the electrode load part (330) has the maximum width, the separation distance from the inner surface of the first through hole (150) is minimized so that the electrode load part (330) can be stably supported, and in the area (332a) where the electrode load part (330) has the minimum width, the separation distance from the inner surface of the first through hole (150) is maximized so that the cooling gas can easily flow through the separation space. For example, the cross-section of the first through hole (150) can be circular, and the cross-section of the electrode load part (330) can be elliptical with a long axis and a short axis.

[0131] The cross-section of the conductive member (331) may have different widths depending on the direction, or the transverse thickness of the insulating coating layer (332) may be formed to be different depending on the direction, so that the cross-section of the electrode load portion (330) may have different widths depending on the direction.

[0132] Likewise, when the electrode load part (330) is inserted into the second through hole (223) and / or the third through hole (211), the cross-section of the electrode load part (330) may have different widths depending on the direction, so that the distance between the outer surface of the electrode load part (330) and the inner surface of the second through hole (223) and / or the distance between the outer surface of the electrode load part (330) and the inner surface of the third through hole (211) may be different depending on the direction.

[0133] In a light-emitting module (200) according to another embodiment of the present invention, an insulating insert (228) may be provided with a gas path (228a) through which cooling gas can flow in the height direction.

[0134] The insulating insert (228) is inserted into the second through hole (223) and the third through hole (211), and the gas path (228a) may be provided in the form of a concave portion (or channel) extending in the height direction on the outer surface of the insulating insert (228), or the cross-section of the edge of the insulating insert (228) may be provided to have different widths depending on the direction.

[0135] In addition, the second through hole (223) or the upper electrode portion (224) crossing the upper portion of the second through hole (223) may be provided so that the second through hole (223) does not block the second through hole (223), so that the cooling gas can freely flow into the second through hole (223). To this end, the central portion of the upper electrode portion (224) may be higher than the electrode pad (222), and the width (width perpendicular to the extension direction) of the upper electrode portion (224) may be smaller than the diameter of the second through hole (223) (see FIG. 3).

[0136] Meanwhile, the body part (320) of the present invention may include an elastic member (324) that provides elasticity to the electrode load part (330) in the extension direction.

[0137] Since the electrode load portion (330) is electrically connected by making surface contact with the lower surface of the upper electrode portion (224) or the conductive cap member (226), the electrode load portion (330) can be pushed by the elastic force provided by the elastic member (324) to make it adhere to the upper electrode portion (224) or the conductive cap member (226), thereby reducing the electrical resistance at the surface contact area. The elastic member (324) may be a spring or the like that can expand in the extension direction of the electrode load portion (330).

[0138] In order for the electrode load portion (330) to be in close contact with the upper electrode portion (224) or the conductive cap portion (226) by the elastic force provided by the elastic member (324), the electrode load portion (330) must be provided so as to be able to move linearly along the extension direction of the electrode load portion (330) so as to push the fixed upper electrode portion (224) or the conductive cap portion (226).

[0139] If the elastic member (324) does not provide elastic force along the extension direction of the electrode load portion (330) or if the electrode load portion (324) does not move linearly along the extension direction of the electrode load portion (330), the electrode load portion (330) may bend due to the elastic force or the pushing force, or the upper electrode portion (224) or the conductive cap member (226) may be damaged, and lifting and arcing may occur at the soldering portion of the upper electrode portion (224) and the electrode pad (222).

[0140] The body part (320) may further include a guide hole (325) in which an elastic member (324) is accommodated and an electrode load part (330) guides a linear movement path; an insulating guide part (326) that connects the elastic member (324) and the electrode load part (330) and moves linearly along the guide hole (325); and a flexible cable part (323) that electrically connects the electrode load part (330) and the terminal part (310).

[0141] The guide hole (325) has a hole shape that extends parallel to the extension direction of the electrode load portion (330), and an elastic member (324) is accommodated in the space inside the hole so that the elastic member (324) can provide elastic force to the electrode load portion (330) while being stretched in the extension direction of the electrode load portion (330). In addition, a part of the electrode load portion (330) is accommodated in the hole space inside the guide hole (325), so that the electrode load portion (330) can guide a linear movement path in the extension direction of the electrode load portion (330).

[0142] An insulating guide member (326) is provided in the inner space of the guide hole (325) to connect the elastic member (324) and the electrode load portion (330), and allows the elastic member (324) and the electrode load portion (330) to move linearly along the guide hole (325) without deviating from the extension direction of the electrode load portion (330). One end of the elastic member (324) is supported at the inner end of the guide hole (325), and the other end of the elastic member (324) is connected to the insulating guide member (326) that moves linearly along the guide hole (325), so that the elastic member (324) can extend in the extension direction of the electrode load portion (330) and provide elastic force. An electrically insulating insulating guide member (326) is interposed between the electrode load portion (330) and the elastic member (324) to prevent the power used in the light-emitting module portion (200) from leaking from the electrode load portion (330) to the elastic member (324), thereby suppressing the risk of arcing that may occur in the elastic member inside the guide hole (325) or electricity leaking to the outside.

[0143] The body part (320) may further include a printed circuit board part (321) that divides the power supplied to the terminal part (310) and a power connection block part (322) that is electrically connected to the printed circuit board part (321) and transmits the divided power to the electrode load part (330). The power connection block part (322) is connected to the printed circuit board part (321) and is fixed, and the electrode load part (330) moves linearly along the guide hole (325). Therefore, the power connection block part (322) and the electrode load part (330) are electrically connected by a flexible cable member (323) that can be deformed and moved according to the linear movement of the electrode load part (330), so that the power supplied to the terminal part (310) can be transmitted to the electrode load part (330).

[0144] Figure 6 is a configuration diagram of a substrate heat treatment device according to another embodiment of the present invention.

[0145] In describing a substrate heat treatment device according to another embodiment of the present invention, any details that overlap with those previously described in relation to the heater block according to the embodiment of the present invention will be omitted.

[0146] Referring to FIG. 6, a substrate heat treatment device according to another embodiment of the present invention may include a chamber portion (2000) providing a heat treatment space; a substrate support portion (3000) supporting a substrate (S) provided in the heat treatment space; and a heater block (1000) according to an embodiment of the present invention, which is provided to face the substrate support portion (3000) and irradiates light onto a first surface of the substrate (S) to heat the substrate (S).

[0147] A substrate heat treatment device can heat a substrate (S) for various processes, such as heat treating the substrate (S) or forming a thin film on the substrate (S). For example, the substrate heat treatment device can be a rapid thermal process (RTP) device that generates high-temperature heat to rapidly heat treat the substrate (S).

[0148] The chamber (2000) can provide a heat treatment space that is separated from the outside and can be controlled to various atmospheres. To prevent contamination of the substrate (S), the heat treatment space can be maintained under vacuum, or an inert gas or the like can be introduced to maintain an inert atmosphere.

[0149] The substrate support (3000) can support the substrate (S) during the heat treatment process. The substrate support (3000) can be configured to support an edge of the lower portion of the substrate (S), so that a portion (or region) of the lower surface of the substrate (S) that does not come into contact with the substrate support (3000) may be exposed. For example, the substrate support (3000) can be formed in a hollow shape with an open center, so that when the substrate (S) is placed on the substrate support (3000), the edge portion of the lower surface of the substrate (S) comes into contact with the substrate support (3000), and the remaining portion may be exposed downward.

[0150] The heater block (1000) may be a heater block according to one embodiment of the present invention, may be provided facing the substrate support (3000), and may heat the substrate (S) by irradiating light onto a first surface (e.g., an upper surface) of the substrate (S). Here, the heater block (1000) serves to supply thermal energy to the substrate (S), and a plurality of light-emitting module parts (100) may irradiate light toward the first surface of the substrate (S), and are spaced apart from each other on the upper side of the substrate support (3000), so that light energy generated by the plurality of light-emitting module parts (100) may be provided through the first surface of the substrate (S) mounted on the substrate support (3000) to heat the substrate (S).

[0151] The substrate heat treatment device of the present invention may further include a pyrometer (4100) provided on the second surface of the substrate (S) opposite to the first surface, for measuring the temperature of the substrate (S).

[0152] The pyrometer (4100) may be a pyrometer that is provided on the second surface (e.g., the lower surface) opposite the first surface of the substrate (S) and measures the temperature of the substrate (S), and may detect light incident from the substrate (S) to measure the temperature. For example, the pyrometer (4100) may receive radiant light incident from the substrate (S) and measure the radiant energy (or light quantity) of the radiant light. Meanwhile, a plurality of pyrometers (4110, 4120, 4130) may be arranged on the lower side of the substrate (S) mounted on the substrate support member (3000) to obtain radiant energy and reflectivity at facing portions, and the temperature of each position (or each portion) of the substrate (S) at the corresponding position of the pyrometer (3000) may be measured.

[0153] The substrate heat treatment device of the present invention may further include a heating control unit (4000) that selectively controls the power supplied to each of the plurality of power supply module units (300) based on the temperature measured by the pyrometer (4100).

[0154] The heating control unit (4000) can control the power supplied to the plurality of light emitting module units (100) corresponding to the temperature measurement positions based on the temperatures respectively measured by the plurality of pyrometers (4100). Here, the plurality of pyrometers (4100) can measure the amount of light incident from the substrate (S) to calculate the temperature, and the heating control unit (4000) can control the power input to the plurality of corresponding light emitting module units (100) using the calculated temperature.

[0155] The heating control unit (4000) may include a temperature setting unit (4200) that sets a target temperature of the substrate (S) and a power determination unit (4300) that compares the target temperature set in the temperature setting unit (4200) with the temperature measured by the pyrometer (4100) to determine a supply power value. The temperature setting unit (4200) may set the target temperature of the substrate (S) and may set the temperature of the substrate (S) to be achieved through heating by the heater block (1000).

[0156] The power determination unit (4300) can determine a supply power value by comparing the target temperature set in the temperature setting unit (4200) with the temperature measured by the pyrometer (4100), and can supply the determined power from the power supply unit (4400). The power supply unit (4400) can include a first power supply unit (4410) and a second power supply unit (4420) that independently or selectively supply power to the first and second light-emitting units that are provided in the light-emitting module unit (100) and can emit light independently of each other. Through this, the determined power can be supplied to the light-emitting module unit (100) located in an area of ​​the heater block (1000) corresponding to (or opposite to) a portion of the substrate (S) measured by the pyrometer (4110 to 4130), thereby controlling the heating temperature of the area, and compensating for the temperature of the portion of the substrate (S) measured by the pyrometer (4110 to 4130).

[0157] The heating control unit (4000) may simultaneously control the entirety of the plurality of light-emitting module units (200) according to the measured temperature, or may divide the plurality of light-emitting module units (200) into a plurality of groups (e.g., the central region group and the edge region group, etc.) according to the temperature of each part of the substrate (S) corresponding to the position provided by each of the plurality of pyrometers (4110 to 4130) and independently control operation and power supply for each group. Similarly, the first and second light-emitting units provided in the light-emitting module unit (200) may be simultaneously controlled as a whole, or may be grouped and then controlled by group.

[0158] As described above, according to the substrate heat treatment device of the present invention, by controlling the heating temperature of a plurality of light-emitting module parts arranged two-dimensionally using the temperature measured by a pyrometer, the temperature uniformity of the substrate can be improved during the heat treatment process. At this time, a plurality of pyrometers are configured and provided for each region, and the plurality of light-emitting module parts can be more precisely controlled for each subdivided region based on the temperature measured by each of the plurality of pyrometers, thereby improving process characteristics such as excellent substrate temperature uniformity.

[0159] According to the heater block (1000) according to the present invention and the substrate heat treatment device including the same, the heat generated from the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) can be effectively removed due to the simple assembly structure of the plurality of light emitting module parts (200) and the plurality of power supply module parts (300) provided around the cooling plate part (100), thereby resolving the problems of reduced output of the light emitting module parts (200) and instability of power supply that may occur due to insufficient heat dissipation. Furthermore, not only does the light emitting module part (200) and the power supply module part (300) exchange heat with the cooling plate (300), but also cooling gas is supplied to the light emitting module part (200) and the power supply module part (300) to prevent heat accumulation and enable more effective heat dissipation and temperature uniformity.

[0160] In addition, by simplifying the connection structure and assembly structure between the light emitting module unit (200) and the power supply module unit (300), high-power power can be stably supplied, and rapid detachment and stable replacement of the light emitting module unit (200) and the power supply module unit (300) are possible when necessary, thereby ensuring mass production.

[0161] In addition, the plurality of power supply module units (300) can selectively control the plurality of light emitting module units (200) by independently supplying power to each of the plurality of corresponding light emitting module units (200), thereby controlling the heating temperature by distinguishing between the positions of the plurality of light emitting module units (200), and improving the heating uniformity for a heating target such as a substrate.

[0162] The meaning of 'on' used in the above description includes cases where they are in direct contact and cases where they are not in direct contact but are positioned opposite the upper or lower surface, and it is possible to be positioned opposite the entire upper or lower surface as well as partially opposite, and it is used to mean that they are positionally opposite or directly in contact with the upper or lower surface. In addition, the terms 'above', 'below', 'leading end', 'rear end', 'upper part', 'lower part', 'top', 'bottom', etc. used in the above description are defined based on the drawings for convenience, and the shape and position of each component are not limited by these terms.

[0163] While preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible without departing from the spirit and scope of the present invention as claimed in the claims. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

Claims

1. A cooling plate section having a cooling channel through which coolant flows inside; A light-emitting module section provided on the first surface of the cooling plate section and irradiating light toward the heated body; and A power supply module section provided on the second surface of the cooling plate section and supplying power to the light-emitting module section; The above light emitting module part, insulating base plate; Electrode pads provided on the insulating base plate; and A light-emitting semiconductor element provided on the insulating base plate and electrically connected to the electrode pad; The above power supply module section is a heater block that supplies power to the electrode pad by penetrating the cooling plate section.

2. In claim 1, The above power supply module section is a heater block that supplies power to the electrode pad by penetrating the insulating base plate.

3. In claim 2, The above power supply module part, A terminal section that is connected to an external power source and receives power; A body part supporting the above terminal part; and An electrode load portion electrically connected to the terminal portion and extending from the lower surface of the body portion; The cooling plate portion is a heater block including a first through hole into which the electrode load portion is inserted.

4. In claim 3, The above cooling plate part, A first plate having a plurality of upper protrusions protruding from the upper surface and forming the side surfaces of the cooling channel; and A heater block further comprising a second plate provided on the first plate and coupled to each other to form an upper surface of the cooling channel.

5. In claim 4, A heater block in which the first through hole is provided to penetrate an area in which the plurality of upper protrusions are provided.

6. In claim 3, The above light emitting module part, A second through hole penetrating the insulating base plate; and Further comprising an upper electrode portion provided to cross the second through hole and electrically connected to the electrode pad; A heater block in which an end of the electrode rod portion inserted into the second through hole is connected to the upper electrode portion.

7. In claim 3, The above light emitting module part, A second through hole penetrating the insulating base plate; An upper electrode portion provided to cross the second through hole and electrically connected to the electrode pad; An insertion electrode portion extending from the upper electrode portion and inserted into the second through hole; and A conductive cap member coupled to the lower portion of the above-mentioned insert electrode portion; A heater block in which an end of the electrode load section is connected to the lower surface of the conductive cap member.

8. In claim 7, A heater block in which the lower part of the above-mentioned inserted electrode part and the conductive cap member are inserted into each other and have screw threads on opposite surfaces to be screw-connected.

9. In claim 7, A heater block further comprising an insulating insert provided between the second through hole and the insert electrode portion to support the insert electrode portion, wherein the light emitting module portion is 10. In claim 6 or claim 7, The above light emitting module part, A metal plate supporting the insulating base plate and made of a thermally conductive metal; and A heater block further comprising a third through hole provided to penetrate the metal plate and communicate with the second through hole.

11. In claim 6 or claim 7, A heater block provided so that the end of the above electrode load section is formed as a flat surface and is in surface contact.

12. In claim 1, A light-emitting plate provided on the light-emitting surface of the light-emitting module to protect the light-emitting module; and A heater block further comprising a cooling gas supply unit that supplies cooling gas to a space between the light-emitting module unit and the light-emitting plate.

13. In claim 12, A cover part provided on the power supply module part; and A heater block further comprising a cooling gas exhaust section for exhausting the cooling gas that diffuses into the space between the power supply module section and the cover section.

14. In claim 3, The above electrode load section is, A conductive member in the shape of a rod made of metal; and An insulating coating layer extending along a side surface of the conductive member and wrapping the side surface of the conductive member, wherein an end of the conductive member is exposed; A heater block in which the cross-section of the electrode load portion has different widths depending on the direction, and the distance between the outer surface of the electrode load portion and the inner surface of the first through hole is different depending on the direction.

15. In claim 9, The above insulating insert is a heater block having a gas path in the height direction through which cooling gas can flow.

16. In claim 3, A heater block in which the body part includes an elastic member that provides elasticity to the electrode load part in the extension direction.

17. In claim 16, The above electrode load section is provided so as to be able to move linearly along the extension direction, The above body part, A guide hole in which the elastic member is accommodated and the electrode load portion guides a linear movement path; An insulating guide member connecting the elastic member and the electrode load member and moving linearly along the guide hole; and A heater block further comprising a flexible cable member electrically connecting the electrode load portion and the terminal portion.

18. In claim 1, Each of the above light-emitting module section and the power supply module section is a heater block having a polygonal shape.

19. In claim 1, A heater block in which each of the above light-emitting module section and power supply module section is two-dimensionally arranged in a plurality to correspond to each other to form a honeycomb-structured array structure.

20. Chamber section providing heat treatment space; A substrate support member supporting a substrate provided in the above heat treatment space; and A substrate heat treatment device comprising a heater block according to any one of claims 1 to 9 and claims 12 to 19, which is provided so as to face the substrate support and irradiates light to the substrate to heat the substrate.

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