Heat dissipation structure integrating heat dissipation plate and phase change heat transfer device

Abstract

Disclosed in the present invention is a heat dissipation structure integrating a heat dissipation plate and a phase change heat transfer device, comprising a heat dissipation plate and a vapor chamber. The heat dissipation plate is provided with a flow channel allowing for flowing of a dielectric material, an inlet allowing for flowing of the dielectric material into the flow channel, and an outlet allowing for flowing of the dielectric material from the flow channel. In addition, the upper end surface of the heat dissipation plate is further provided with an opening, and the vapor chamber is blocked on the opening in the upper end surface of the heat dissipation plate to directly perform contact heat transfer with the dielectric material in the heat dissipation plate. The present invention can efficiently solve the problem of insufficient heat exchange efficiency between the vapor chamber and a cooling medium material during composite heat dissipation of the vapor chamber and the heat dissipation plate, and effectively improve the cooling efficiency of the composite heat dissipation mode of the vapor chamber and the heat dissipation plate. Since the vapor chamber has high structural requirements, there is no need to make significant modifications to components, and in the present application, there is no need to change the internal structure of the vapor chamber, thereby making the production and processing easier to implement.

Description

A heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device. Background Art

[0002] Phase change heat transfer devices (heat sinks) are recognized as the most efficient heat conducting devices and are widely used in various heat dissipation scenarios. However, heat sinks are heat conducting devices rather than heat dissipating devices and must be used in conjunction with heat dissipation plate structures such as air cooling plates or liquid cooling plates. However, when the heat sink contacts the heat dissipation plate, the contact interface between the two plates has a thermal conductivity of less than 10W / mK. For example, the thermal conductivity of the water cooling plate material is less than 400W / mK. Such low thermal conductivity seriously affects the heat exchange efficiency between the heat sink and the heat dissipation plate.

[0003] Therefore, a method for heat exchange between the heat spreader and the heat sink without resistance is needed to reduce the impact of the contact interface and the heat sink material on the heat transfer efficiency.

[0004] Summary of the Invention

[0005] In view of this, the technical problem to be solved by the present invention is to propose a heat dissipation structure of a heat sink coupled with a phase change heat transfer device. By removing part of the shell structure of the heat sink, the heat spreader as a whole is used as the missing shell part of the heat sink, so that the dielectric material in the heat sink is in direct contact with the heat spreader for heat conduction, thereby increasing the thermal conductivity between the two, and solving the problem of poor heat dissipation effect caused by low heat exchange efficiency of the contact interface and low thermal conductivity of the heat sink material during the contact heat dissipation process between the heat spreader and the dielectric heat sink.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device, comprising a heat dissipation plate and a heat spreader;

[0008] The heat sink is provided with a flow channel for the medium material to flow. The flow channel can be any continuous internal channel. In order to increase the length of the flow channel, the flow channel is preferably set to a serpentine shape. Therefore, as a preferred embodiment of the present invention, the flow channel is a serpentine flow channel;

[0009] The heat sink's upper shell is unenclosed, meaning it has a notch on its upper end. The vapor chamber is attached to the notch in the upper end of the heat sink, replacing the upper shell. Of course, the heat sink's upper shell can also be complete, with only a notch on the upper shell, and the vapor chamber's lower surface is adapted to the size of the notch and blocks it. In other words, the heat sink has a notch for the vapor chamber to block, and this notch can be part of the entire upper shell or a portion of it.

[0010] The heat dissipation plate is also provided with an inlet and an outlet for the medium material to flow into the flow channel and to flow out of the flow channel.

[0011] In the present invention, the upper shell surface of the heat sink that was originally in direct contact with the heat spreader is removed, or a gap is opened in the upper shell surface, so that the dielectric material in the heat sink has the opportunity to directly contact the heat spreader, which greatly improves the thermal conductivity. At the same time, it also eliminates the influence of the heat sink plate material on the heat exchange efficiency.

[0012] In the present invention, considering the size of the vapor chamber and the heat sink itself, the preferred solution is to completely remove the upper shell of the heat sink, forming a gap in the upper shell, and then use the vapor chamber to block this gap. In other words, the size of the gap in the upper end surface of the heat sink is consistent with the size of the upper shell of the entire heat sink, and the vapor chamber is attached to the gap in the upper end surface of the heat sink, serving as the upper shell of the heat sink.

[0013] Preferably, a waterproof sealing structure is provided between the heat sink and the vapor chamber. The waterproof sealing structure is a waterproof glue applied to the upper surface of the flow channel partition wall of the heat sink. Alternatively, the waterproof sealing structure may be a sealing ring provided between the heat sink and the vapor chamber. Preferably, the shape and size of the sealing ring are adapted to the upper surface of the flow channel partition wall. This ensures the sealing of the heat sink and prevents air or liquid leakage from the heat sink. Furthermore, when a sealing ring is used as the waterproof sealing structure, a sealing ring groove is provided on the upper end surface of the heat sink (the upper surface of the flow channel partition wall) to ensure that the sealing ring does not shift. The sealing ring is provided in the sealing ring groove to provide greater stability and will not press against the vapor chamber when the vapor chamber is installed.

[0014] In addition, the waterproof sealing structure may also be a waterproof coating sprayed on the contact surface of the heat spreader or the heat sink.

[0015] Preferably, the heat sink has a plurality of threaded holes on its flow channel partition wall, and correspondingly, the non-working area of ​​the vapor chamber has a plurality of through holes, and the vapor chamber is fixedly connected to the heat sink by bolts. To ensure the flatness of the heat dissipation structure of the present invention, the through holes are countersunk holes.

[0016] Preferably, the heat sink is a water-cooled plate, and the coolant in the water-cooled plate directly contacts the vapor chamber for heat exchange, which is more efficient. In addition, to further improve the heat exchange efficiency, the surface of the vapor chamber that contacts the dielectric material is also provided with fins that protrude into the flow channel.

[0017] Preferably, to accommodate high-heat-flux heat sources such as chips or power devices, the upper surface of the vapor chamber, where it mates with the heat source, is machined with a boss that mates with the heat source. Alternatively, the vapor chamber can be shaped to suit actual usage scenarios, such as a stepped shape. Regardless of the shape of the vapor chamber, it only needs to have a contact surface that mates with the notch on the upper end of the heat sink.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] This invention effectively addresses the challenge of insufficient heat exchange efficiency between the vapor chamber and the cooling medium in a combined heat dissipation system using a vapor chamber and a heat sink, effectively improving the cooling efficiency of this combined heat dissipation system. No major modifications are required to the components, as the vapor chamber has high structural requirements. This application eliminates the need for changes to the internal structure of the vapor chamber, making production and processing easy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic diagram of the three-dimensional structure of the water-cooling plate of Example 1;

[0021] FIG2 is a schematic diagram of the three-dimensional structure of the vapor chamber of Example 1;

[0022] FIG3 is a schematic diagram of the three-dimensional structure of the sealing ring of Example 1;

[0023] FIG4 is a schematic diagram of the assembly of the heat dissipation structure of Example 1;

[0024] FIG5 is a schematic structural diagram of the heat dissipation structure of Example 1 after assembly;

[0025] FIG6 is a schematic diagram of the three-dimensional structure of the water-cooling plate of Example 2;

[0026] FIG7 is a schematic diagram of the assembly of the heat dissipation structure of Example 2.

[0027] In the picture:

[0028] 1 water-cooling plate, 11 flow channel, 12 inlet, 13 outlet, 14 upper end face notch, 15 flow channel partition wall, 2 heat sink, 3 sealing ring, 4 sealing ring groove, 5 threaded hole, 6 through hole, 7 bolt, 8 waterproof glue. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to understand the present invention more clearly and intuitively, the present invention will be further described below with reference to the accompanying drawings.

[0030] Example 1

[0031] The heat dissipation structure of the water-cooling plate coupled with the phase-change heat transfer device of this embodiment is shown in FIG1-5 , and includes a water-cooling plate 1 and a vapor chamber 2 ;

[0032] The water cooling plate 1 is provided with a flow channel 11 for the flow of the medium material. In this embodiment, the flow channel 11 is configured as a serpentine flow channel. The head and tail ends of the flow channel 11 are respectively connected to an inlet 12 for water to flow into the flow channel 11 and an outlet 13 for water to flow out of the flow channel 11;

[0033] In this embodiment, the upper end of the water-cooling plate 1 is not encapsulated with an upper shell surface. That is, the water-cooling plate 1 has an upper end surface notch 14, and the heat sink 2 is attached to the upper end surface notch 14 of the water-cooling plate 1 and functions as the upper shell surface of the water-cooling plate 1. This arrangement allows the water in the water-cooling plate 1 to directly contact and exchange heat with the heat sink 2. This direct heat exchange between the water and the heat sink 2 eliminates the disadvantage of heat transfer through the shells of the water-cooling plate 1 and the heat sink 2, as well as the two layers of interface material. This greatly improves heat dissipation efficiency and eliminates the influence of the shell material of the water-cooling plate 1 on heat exchange efficiency.

[0034] In this embodiment, when the water-cooling plate 1 is manufactured, the inlet 12 and the outlet 13 are integrally formed with the water-cooling plate 1 without an upper shell surface. The processing methods include but are not limited to milling, drilling and turning. They can also be processed separately and then connected by threading, welding or gluing. The material of the water-cooling plate 1 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials. The heat spreader 2 is a high thermal conductivity heat transfer device prepared based on the principle of phase change heat transfer. The material of the heat spreader 2 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials.

[0035] Since one shell surface of the water-cooled plate 1 is removed in this embodiment, although the heat spreader 2 has blocked the notch 14 on the upper end surface, the stability during use, such as sealing stability, must still be considered. In order to ensure the sealing of the connection position between the water-cooled plate 1 and the heat spreader 2, a sealing ring 3 is provided between the water-cooled plate 1 and the heat spreader 2. Furthermore, the shape and size of the sealing ring 3 should be compatible with the upper surface of the flow channel partition wall 15, so as to facilitate the stable placement of the sealing ring 3 during assembly, and at the same time, ensure the waterproof sealing performance of the entire flow channel 11; further, a sealing ring groove 4 is also provided on the upper surface of the flow channel partition wall 15 on the water-cooled plate 1, and the sealing ring 3 is provided in the sealing ring groove 4 to be more stable and will not press against the heat spreader 2 when the heat spreader 2 is installed.

[0036] The connection between the water-cooling plate 1 and the vapor chamber 2 is preferably bolted in this embodiment. Specifically, the flow channel partition 15 of the water-cooling plate 1 is provided with a plurality of threaded holes 5. Correspondingly, the non-working area of ​​the vapor chamber 2 is provided with a plurality of through-holes 6. The vapor chamber 2 is screwed onto the threaded holes 5 on the water-cooling plate 1 with bolts 7, thereby achieving a stable connection between the two. To ensure the smoothness of the entire heat dissipation structure, the through-holes 6 are countersunk in this embodiment.

[0037] During implementation, the size of the sealing ring 3 is determined by the size of the sealing ring groove 4. For ease of assembly, it is recommended to offset the sealing ring 3 by 0.2-0.5mm toward the solid portion, based on the principle of insertion. The sealing ring 3 has a hole that mates with the threaded hole 5 on the water-cooling plate 1. Materials for the sealing ring 3 include, but are not limited to, waterproof materials such as rubber.

[0038] In order to further improve the heat exchange efficiency, in some embodiments, fins protruding into the flow channel are provided on the contact surface of the lower side of the heat spreader 2 with the water, which is not described in this embodiment.

[0039] To accommodate high-heat-flux heat sources like chips or power devices, the upper surface of the vapor chamber 2 is machined with a boss (not shown) that mates with the heat source. Alternatively, the vapor chamber can be shaped to suit actual usage scenarios, such as a stepped shape. Regardless of the vapor chamber's shape, it only needs to have a contact surface that mates with the notch 14 on the upper end face of the cooling plate 1.

[0040] Example 2

[0041] The heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device in this embodiment is shown in Figures 6-7. The difference between the heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device in Example 1 is that the sealing ring 3 and related structures in Example 1, such as the sealing ring groove 4, are replaced. In order to achieve waterproof sealing of the heat dissipation structure, in this embodiment, waterproof glue 8 is applied to the upper surface of the flow channel partition wall 15 of the water-cooled plate 1. Before the waterproof glue 8 is cured, the water-cooled plate 1 and the heat spreader 2 are assembled with 7 bolts. Then, the assembled heat dissipation structure is baked at 90°C to accelerate the curing of the waterproof glue 8. In this way, the heat dissipation structure can meet the requirements of waterproof sealing.

[0042] Relatively speaking, compared with Example 1, this embodiment is simpler to implement because it does not need to process the sealing ring groove 4 that cooperates with the sealing ring 3.

[0043] The above two embodiments are both illustrative of the case where the upper shell surface of the water-cooling plate 1 is completely missing. However, in some special cases, the upper shell surface of the water-cooling plate 1 is not completely missing, but only a part thereof. In this case, the gap of the water-cooling plate 1 can be sealed with the entire heat spreader 2. The principle is the same as that of the above two embodiments.

[0044] The above embodiments are preferred implementations of the present invention, but the implementations of the present invention are not limited to the above embodiments. The core of the present invention is to use the heat spreader 2 as a cover for the missing part of the water-cooling plate 1, and together with the water-cooling plate 1 form a water flow channel 11, so that the water directly contacts the heat spreader 2, thereby improving the thermal conductivity.

[0045] Therefore, in the present invention, any equivalent replacement method by changing the water-cooling plate, heat spreader, bolt hole and bolt size, position and number is included in the protection scope of the present invention.

[0046] Changing the sealing method between the water-cooling plate and the vapor chamber, for example, using adhesive seals instead of rubber or other materials for waterproof sealing, is an equivalent replacement method and is also within the scope of protection of this invention. Spraying a coating on the phase change heat transfer device or the bottom or top of the water-cooling plate is also an equivalent replacement method and is also within the scope of protection of this invention.

[0047] Changing the shape, structure and size parameters of the flow channel on the water-cooling plate shell is an equivalent replacement method and is included in the protection scope of the present invention.

[0048] Changing the external structure of the heat spreader, for example, providing bosses, steps, and grooves on the contact surface with the heat source, are equivalent replacement methods and are all included in the scope of protection of the present invention.

[0049] Changing the hole structure of the vapor chamber, for example, replacing a countersunk hole with a through hole, is an equivalent replacement method and is included in the protection scope of the present invention.

[0050] Any other structural changes, modifications, substitutions, combinations and simplifications of parts that do not deviate from the core idea of ​​the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device, characterized in that It includes a heat dissipation plate and a vapor chamber; The heat dissipation plate is provided with a flow channel for the medium material to flow, an inlet for the medium material to flow into the flow channel, and an outlet for the medium material to flow out of the flow channel; In addition, the upper end surface of the heat dissipation plate has a notch, and the vapor chamber seals the notch on the upper end surface of the heat dissipation plate to directly contact and exchange heat with the medium material in the heat dissipation plate.

2. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 1, characterized in that, The flow channel is a serpentine flow channel that winds and turns.

3. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 1, characterized in that, The size of the notch on the upper end surface of the heat dissipation plate is the same as the size of the upper shell surface of the entire heat dissipation plate, and the vapor chamber is attached to the notch on the upper end surface of the heat dissipation plate as the upper shell surface of the heat dissipation plate.

4. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 3, characterized in that A waterproof sealing structure is provided between the heat dissipation plate and the vapor chamber.

5. The heat dissipation structure of the heat dissipation plate-coupled phase change heat transfer device according to claim 4, characterized in that, The waterproof sealing structure is a waterproof glue applied to the upper surface of the flow channel partition wall of the heat dissipation plate.

6. The heat dissipation structure of the heat dissipation plate-coupled phase change heat transfer device according to claim 4, wherein, The waterproof sealing structure is a sealing ring arranged between the heat dissipation plate and the vapor chamber, and the shape and size of the sealing ring are adapted to the shape and size of the upper surface of the flow channel partition wall.

7. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 6, characterized in that, A sealing ring groove is also provided on the upper surface of the flow channel partition wall of the heat dissipation plate, and the sealing ring is arranged in the sealing ring groove.

8. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 1, characterized in that, A number of threaded holes are provided on the flow channel partition wall of the heat dissipation plate, and a number of through holes corresponding to the positions of the threaded holes are provided in the non-working area of the vapor chamber. The vapor chamber is fixedly connected to the heat dissipation plate by bolts.

9. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 1, characterized in that, The heat dissipation plate is a water-cooled plate, and fins protruding into the flow channel are also provided on the water contact surface of the vapor chamber.

10. The heat dissipation structure of the heat dissipation plate coupled phase change heat transfer device according to claim 1, characterized in that, A boss matching the heat source is provided on the contact surface of the vapor chamber with the heat source.

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