Vapor chamber-based liquid cooling heat dissipation system for processor

Abstract

The present invention relates to a vapor chamber-based liquid cooling heat dissipation system for a processor, comprising a vapor chamber, a substrate and a liquid cooling apparatus, wherein bolt holes are respectively formed on the vapor chamber, the substrate and a liquid cooling plate of the liquid cooling apparatus, the liquid cooling plate, the vapor chamber, and the substrate are connected in sequence by bolts, sleeved with springs, passing through the bolt holes, a first heat conducting layer is arranged between and tightly pressed against the liquid cooling plate and a first surface of the vapor chamber, and a second heat conducting layer is arranged between and tightly pressed against a chip on the substrate and a second surface of the vapor chamber. The present invention can significantly improve the heat dissipation efficiency of the processor, provide strong support for further improving the computing power of the processor, and meet the growing heat dissipation demand of the processor.

Description

Processor liquid cooling system based on heat sink Technical Field

[0001] The present invention relates to the technical field of processor liquid cooling and heat dissipation systems, and in particular to a processor liquid cooling and heat dissipation system based on a vapor chamber. Background Art

[0002] The processor cooling system is a crucial component of electronic devices such as computers, workstations, and servers. Its primary function is to effectively cool the processor, ensuring it maintains a suitable temperature range during operation. A processor's computing power is directly related to its performance, and a good cooling system ensures that the processor does not overheat during high loads, thereby maintaining device stability and performance.

[0003] As electronic device performance continues to improve, the need for processor cooling is becoming increasingly urgent. To increase processor computing power and reduce operating temperatures, current cooling systems are primarily divided into two types: air cooling and liquid cooling. Among liquid cooling systems, designs based on liquid cold plates are currently considered the optimal solution, using liquid as a medium to more efficiently transfer and absorb heat.

[0004] However, while these systems meet cooling requirements to a certain extent, they face challenges with the heat transfer efficiency of heat sink and liquid cold plate materials. This inefficiency makes current air- and liquid-cooled processor cooling systems incapable of meeting the growing demand for processor cooling. Therefore, improvements must be made to existing air- and liquid-cooled systems to improve processor cooling efficiency.

[0005] Summary of the Invention

[0006] In order to overcome the defects of the existing technology, the technical problem to be solved by the present invention is to propose a processor liquid cooling system based on a heat sink, which can significantly improve the heat dissipation efficiency of the processor, provide strong guarantees for further improving the processor computing power, and meet the growing processor heat dissipation needs.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] The present invention provides a liquid cooling and heat dissipation system for a processor based on a vapor chamber, comprising a vapor chamber, a substrate and a liquid cooling device. Bolt holes are respectively provided on the vapor chamber, the substrate and the liquid cooling plate of the liquid cooling device. The liquid cooling plate, the vapor chamber and the substrate are sequentially connected by bolts with springs passing through the bolt holes. A first heat conducting layer is provided between the liquid cooling plate and the first surface of the vapor chamber and they are in close contact. A second heat conducting layer is provided between the chip on the substrate and the second surface of the vapor chamber and they are in close contact.

[0009] The preferred technical solution of the present invention is that the liquid cooling device also includes an air cooling module, a water tank and a pump body, the outlet of the liquid cooling plate is connected to the inlet of the air cooling module, the outlet of the air cooling module is connected to the inlet of the water tank, the outlet of the water tank is connected to the inlet of the pump body, and the outlet of the pump body is connected to the inlet of the liquid cooling plate.

[0010] The preferred technical solution of the present invention is that the air-cooling module structure includes an electric fan, a curved pipe with fins and a fixing frame, the fixing frame is connected to the electric fan and the curved pipe respectively, and the air outlet of the electric fan faces the curved pipe.

[0011] A preferred technical solution of the present invention is that the fins are coated with a graphene heat-conducting layer.

[0012] The preferred technical solution of the present invention is that both the pump body and the air cooling module are provided with a USB plug and an electrical plug.

[0013] The preferred technical solution of the present invention is that it also includes a chassis, which is provided with corresponding bolt holes, and the liquid cooling plate, heat spreader, base plate and chassis are sequentially connected by bolts with springs passing through the bolt holes.

[0014] A preferred technical solution of the present invention is that the air cooling module is fixedly connected to the chassis by bolts or magnets.

[0015] A preferred technical solution of the present invention is that a boss structure cooperating with the chip is further provided in the middle of the heat spreader.

[0016] The preferred technical solution of the present invention is that it further includes a temperature measuring module, wherein temperature sensors of the temperature measuring module are respectively arranged at the inlet and outlet of the liquid cooling plate and on the chip, and the temperature sensors are electrically connected to the display unit of the temperature measuring module.

[0017] A preferred technical solution of the present invention is that the materials of the first heat-conducting layer and the second heat-conducting layer are respectively one of thermal grease, thermal adhesive, thermal silica gel, and liquid metal thermal paste.

[0018] Beneficial effects of the present invention:

[0019] The present invention proposes a liquid cooling and heat dissipation system for a processor based on a vapor chamber. Bolted together, the liquid cooling plate, vapor chamber, and baseplate form a tightly integrated whole, effectively preventing loosening of the bolts caused by vibration during system operation and ensuring long-term system stability. A second thermally conductive layer is positioned between the chip on the baseplate and the second surface of the vapor chamber, ensuring close contact. This structure allows heat generated by the chip to be quickly transferred to the vapor chamber through the second thermally conductive layer. The vapor chamber's second surface at the evaporation end absorbs the heat, converting the liquid working fluid inside the vapor chamber into a gaseous state. This process facilitates efficient absorption and transfer of heat within the chip. Heat is released on the first surface at the condensation end of the vapor chamber and transferred to the liquid cooling plate through the first thermally conductive layer, further improving heat dissipation efficiency and achieving efficient heat transfer. Due to its simple structure, the present invention is suitable for improving existing processor liquid cooling and heat dissipation structures. The device is simple, easy to manufacture and install, and its various components are inexpensive and easy to implement. It achieves excellent heat dissipation while also being able to be added as a heat dissipation improvement module to existing branded computer chassis for efficient heat dissipation. It has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] FIG1 is a schematic diagram of a vapor chamber-based processor liquid cooling system according to a first embodiment;

[0022] FIG2 is a front view of the vapor chamber of Example 1;

[0023] FIG3 is a schematic diagram of the cooling liquid flow direction of the liquid cooling device of Example 1;

[0024] FIG4 is a perspective view of the air cooling module of the first embodiment;

[0025] FIG5 is a second perspective view of the air cooling module of the first embodiment;

[0026] FIG6 is a rear view of the air cooling module of Example 1;

[0027] FIG7 is a front view of the vapor chamber of Example 5;

[0028] FIG8 is a left side view of the vapor chamber of Example 5;

[0029] FIG9 is a schematic diagram of a vapor chamber-based processor liquid cooling system according to a sixth embodiment;

[0030] FIG10 is an electrical connection diagram of the temperature measurement module of the sixth embodiment.

[0031] In the figure: 1-heat sink; 11-boss structure; 2-base plate; 21-chip; 31-liquid cooling plate; 32-air cooling module; 321-electric fan; 322-elbow pipe; 323-fixing frame; 324-fin; 33-water tank; 34-pump body; 4-bolt hole; 5-spring; 6-bolt; 71-first heat conduction layer; 72-second heat conduction layer; 8-chassis; 91-temperature sensor; 92-display unit. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the internal parts of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Example 1

[0035] As shown in Figures 1-6, a liquid cooling and heat dissipation system for a processor based on a vapor chamber is provided in this embodiment, including a vapor chamber 1, a substrate 2 and a liquid cooling device. Bolt holes 4 are respectively provided on the vapor chamber 1, the substrate 2 and the liquid cooling plate 31 of the liquid cooling device. The liquid cooling plate 31, the vapor chamber 1 and the substrate 2 are bolted together in sequence by bolts 6 with springs 5 ​​passing through the bolt holes 4. The spring is used to provide a suitable pre-tightening force between the liquid cooling plate, the vapor chamber and the chip to avoid damage to the chip due to excessive pressure. A first heat conducting layer 71 is provided between the liquid cooling plate 31 and the first surface of the vapor chamber 1 and is in close contact with each other. A second heat conducting layer 72 is provided between the chip 21 on the substrate 2 and the second surface of the vapor chamber 1 and is in close contact with each other. The vapor chamber can be a copper-based or aluminum-based vapor chamber. In this embodiment, a copper-based vapor chamber is used, which has a very small thickness of about 0.5 mm. In the technical solution of this embodiment, bolt holes are respectively provided on the vapor chamber, the substrate and the liquid cooling plate of the liquid cooling device, and are connected by bolts. This design not only simplifies the assembly structure of the system, but also improves the stability and reliability of the connection. Through bolt connection, the liquid cooling plate, the heat spreader and the base plate form a tightly integrated whole, which effectively avoids the problem of loose bolts caused by vibration during system operation and ensures the long-term stability of the system. A second heat-conducting layer is provided between the chip on the base plate and the second surface of the heat spreader and is in close contact. This structure allows the heat generated by the chip to be quickly transferred to the heat spreader through the second heat-conducting layer. The second surface of the evaporation end of the heat spreader absorbs heat and converts the liquid working medium inside the heat spreader into a gas state due to the heat. This process contributes to the effective absorption and transfer of heat inside the chip. The process of releasing heat occurs on the first surface of the condensation end of the heat spreader and is transferred to the liquid cooling plate through the first heat-conducting layer, which further improves the heat dissipation efficiency, realizes the efficient conduction of heat energy, and avoids the generation of heat energy retention and heat sink problems.

[0036] Specifically, the system also includes a chassis 8, which is provided with corresponding bolt holes 4. The liquid cooling plate 31, vapor chamber 1, base plate 2, and chassis 8 are sequentially connected via bolts 6 encased in springs 5, which pass through these bolt holes 4. This spring-encased bolt connection creates a secure connection between the chassis, liquid cooling plate, vapor chamber, and base plate. This design effectively prevents bolt loosening caused by vibration or temperature fluctuations during system operation, ensuring the stability of the entire system even under high loads.

[0037] Specifically, the liquid cooling system also includes an air cooling module 32, a water tank 33, and a pump body 34. The outlet of the liquid cooling plate 31 is connected to the inlet of the air cooling module 32, the outlet of the air cooling module 32 is connected to the inlet of the water tank 33, the outlet of the water tank 33 is connected to the inlet of the pump body 34, and the outlet of the pump body 34 is connected to the inlet of the liquid cooling plate 31. The water tank is used to store coolant, and the various components are connected by water pipes. The combination of liquid cooling and air cooling allows the two heat dissipation methods to work synergistically. The liquid cooling system can efficiently absorb and transfer heat, while the air cooling system can quickly dissipate heat to the outside through a fan. This organic combination of the two not only improves the overall heat dissipation efficiency of the system but also avoids the limitations that may exist with a single heat dissipation method. Specifically, the user can increase or decrease the number of air cooling modules according to the actual cooling capacity required. In this embodiment, to improve heat dissipation efficiency, two air cooling modules are provided. Adjacent air cooling modules are connected using connectors, and the air cooling modules and water pipes are connected using connectors.

[0038] Specifically, the air-cooling module 32 structure includes an electric fan 321, a curved pipe 322, and a fixing frame 323, wherein the curved pipe 322 is provided with fins 324 for heat conduction. The fixing frame 323 is connected to the electric fan 321 and the curved pipe 322 respectively, with the air outlet of the electric fan 321 facing the curved pipe 322. The electric fan is fixed to the curved pipe with fins by bolts, and the fixing frame and the fins are connected by electric welding or brazing. It should be noted that the contact form between the electric fan and the curved pipe with fins is not limited, and can contact one side of the fixing frame with fins or the other side. By introducing the structure of the electric fan, the curved pipe with fins, and the fixing frame, an efficient air-cooling module is formed. The electric fan faces the curved pipe through the air outlet, so that the air flow can effectively cover the surface of the curved pipe. The curved pipe structure with fins can greatly increase the surface area and enhance the heat dissipation effect. The rational design of the overall structure effectively improves the performance of the air-cooling system. Since the air cooling module of this embodiment has strong integration, one end of the air cooling module is fixedly connected to the chassis by bolts.

[0039] Preferably, the material of the first thermally conductive layer 71 and the second thermally conductive layer 72 is respectively one of thermal grease, thermal adhesive, thermal silica gel, and liquid metal thermal paste. Thermal grease, thermal adhesive, thermal silica gel, and liquid metal thermal paste are all highly thermally conductive materials that can effectively conduct heat. This ensures that the first and second thermally conductive layers can efficiently transfer heat from the chip to the heat spreader, improving the efficiency of the entire heat dissipation system. Thermal grease, thermal adhesive, thermal silica gel, and liquid metal thermal paste generally have good stability and durability and can maintain their thermal conductivity during long-term operation. This ensures that the thermal conductive layer can continue to provide stable heat conduction throughout the life of the system. Liquid metal thermal paste is used in this embodiment. Liquid metal thermal paste is a relatively special and efficient thermal conductive material with several obvious advantages, especially in high-performance computing and applications with strict heat dissipation requirements. It contains highly thermally conductive metals such as silver, copper, and indium. This makes the thermal conductivity of liquid metal thermal paste very good, far higher than traditional thermal conductive materials such as common thermal grease and thermal adhesive. High thermal conductivity ensures that heat can be transferred from the processor to the heat spreader more quickly and efficiently. It should be noted that since liquid metal thermal paste may contain some metal components, caution should be exercised when using it to avoid chemical reactions with sensitive electronic components (such as aluminum electrolytic capacitors). In addition, due to its liquid nature, care should be taken to prevent leakage of liquid metal thermal paste when using it.

[0040] Preferably, a heat sink is provided within vapor chamber 3, which is deionized water. This water has a resistivity of 18.2 MΩ*cm, and the internal vacuum level after evacuation is 7 Pa. After condensation, the heat sink returns to the evaporation end through the capillary action of the wick for a second stage of heat transfer, completing a thermal cycle within the system.

[0041] Overall, this heat spreader-based processor liquid cooling and heat dissipation system, through innovative design and structural combination, fully utilizes various technical features, successfully solves the challenges existing in traditional cooling systems, provides the processor with more efficient and stable heat dissipation performance, and thus provides strong support for the performance improvement of the equipment. The processor liquid cooling and heat dissipation system of this embodiment replaces the computer air-cooled heat dissipation components and relies on the holes provided by the computer motherboard and chassis to achieve installation. The installation method is simple and effective. It can also be used as a heat dissipation improvement module and subsequently added to the purchased brand computer mainframe case to achieve efficient heat dissipation of the computer mainframe. In addition, the processor liquid cooling and heat dissipation system of this embodiment does not require maintenance, and each module is relatively independent, which is easy to replace.

[0042] Example 2

[0043] The fins are preferably coated with a graphene thermally conductive layer. Graphene, as a material with excellent thermal conductivity, has a thermal conductivity far higher than many traditional heat dissipation materials. By coating the fins with a graphene thermally conductive layer, the fins' thermal conductivity is effectively improved, helping to transfer heat from the processor to the outside world more quickly and efficiently.

[0044] Example 3

[0045] This embodiment provides a vapor chamber-based processor liquid cooling system. This differs from the first embodiment in that both the pump and air-cooling module are equipped with USB and electrical plugs. These plugs provide a more flexible power interface for the entire system, allowing for power supply or connection to other auxiliary devices. This design offers users greater customization options, allowing them to connect to different power sources based on their needs, either directly from the computer or through an external power source.

[0046] Example 4

[0047] This embodiment provides a vapor chamber-based processor liquid cooling system. This differs from the first embodiment in that the air cooling module is securely connected to the chassis via magnets. This magnet connection ensures a secure fit between the air cooling module and the chassis. This makes it easier for users to install or replace the air cooling module without the need for complex tools, improving the system's maintainability and user-friendliness.

[0048] Example 5

[0049] As shown in Figures 7-8, this embodiment provides a liquid cooling system for a processor based on a vapor chamber. The difference from the first embodiment is that a boss structure 11 is provided in the middle of the vapor chamber 1 to mate with the chip 21. The size of the boss structure matches the size of the chip. The design of the boss structure enables the vapor chamber to be in closer contact with the chip, optimizing the heat transfer path. This helps to improve the efficiency of heat conduction, ensuring that the heat generated by the processor can be more effectively transferred to the vapor chamber, thereby dissipating heat more efficiently.

[0050] Example 6

[0051] As shown in Figures 9-10, this embodiment provides a vapor chamber-based processor liquid cooling system. This differs from the first embodiment in that it also includes a temperature measurement module. Temperature sensors 91 of the temperature measurement module are located at the inlet and outlet of the liquid cooling plate 31 and on the chip 21. The temperature sensors 91 are electrically connected to the display unit 92 of the temperature measurement module. The provision of temperature sensors allows for real-time monitoring of the temperature at the inlet and outlet of the liquid cooling plate, as well as on the chip. This is crucial for timely detection of system temperature changes and processor operating status, helping to proactively prevent and resolve potential heat dissipation issues. By monitoring temperature in real time, the system can detect faults and provide early warnings. Once the temperature exceeds a set safety range, the temperature measurement module can issue an alarm, prompting the user to take appropriate action, thereby protecting the processor and the entire system from overheating risks. The temperature sensor is electrically connected to the display unit of the temperature measurement module, allowing real-time temperature data to be intuitively displayed to the user. This provides a user-friendly interface that allows users to keep abreast of system temperature conditions, providing greater control and opportunity for user involvement in system management.

[0052] The present invention is described through preferred embodiments. Those skilled in the art will appreciate that various modifications or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. The present invention is not limited to the specific embodiments disclosed herein; other embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A processor liquid cooling and heat dissipation system based on a vapor chamber, characterized in that: It includes a vapor chamber (1), a substrate (2) and a liquid cooling device; Bolting holes (4) are respectively formed on the vapor chamber (1), the substrate (2) and the liquid cooling plate (31) of the liquid cooling device, and the liquid cooling plate (31), the vapor chamber (1) and the substrate (2) are sequentially bolted through the bolting holes (4) by bolts (6) sleeved with springs (5); A first heat conduction layer (71) is provided between the first surface of the liquid cooling plate (31) and the vapor chamber (1) and is in close contact, and a second heat conduction layer (72) is provided between the chip (21) on the substrate (2) and the second surface of the vapor chamber (1) and is in close contact.

2. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 1, characterized in that: The liquid cooling device further includes an air cooling module (32), a water tank (33) and a pump body (34); The outlet of the liquid cooling plate (31) is communicated with the inlet of the air cooling module (32), the outlet of the air cooling module (32) is communicated with the inlet of the water tank (33), the outlet of the water tank (33) is communicated with the inlet of the pump body (34), and the outlet of the pump body (34) is communicated with the inlet of the liquid cooling plate (31).

3. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 2, characterized in that: The air cooling module (32) structure includes a fan (321), a finned elbow (322) and a fixing frame (323); The fixing frame (323) is respectively connected to the fan (321) and the elbow (322), and the air outlet of the fan (321) faces the elbow (322).

4. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 3, characterized in that: Graphene heat conduction layer is coated on the fins.

5. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 2, characterized in that: Both the pump body (34) and the air cooling module (32) are provided with USB plugs and electrical plugs.

6. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 2, characterized in that: It further includes a chassis (8), and corresponding bolting holes (4) are formed on the chassis (8); The liquid cooling plate (31), the vapor chamber (1), the substrate (2) and the chassis (8) are sequentially bolted through the bolting holes (4) by bolts (6) sleeved with springs (5).

7. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 6, characterized in that: The air cooling module (32) is fixedly connected to the chassis (8) by bolts (6) or magnets.

8. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 1, characterized in that: A boss structure (11) cooperating with the chip (21) is further provided in the middle of the vapor chamber (1).

9. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 1, characterized in that: It further includes a temperature measurement module; The temperature sensors (91) of the temperature measurement module are respectively arranged at the inlet and outlet of the liquid cooling plate (31) and on the chip (21), and the temperature sensors (91) are electrically connected to the display unit (92) of the temperature measurement module.

10. The processor liquid cooling and heat dissipation system based on a vapor chamber according to claim 1, wherein: The materials of the first heat conduction layer (71) and the second heat conduction layer (72) are respectively one of thermal conductive silicone grease, thermal conductive adhesive, thermal conductive silica gel, and liquid metal thermal paste.

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