Vapor chamber combined with liquid cooling

Abstract

The utility model is suitable for the technical field of temperature uniformizing plates, and provides a temperature uniformizing plate combined with liquid cooling, which comprises a liquid cooling plate, a liquid cooling groove is arranged on the end face of one side of the liquid cooling plate, connecting holes communicated with the liquid cooling groove are arranged on the side walls of the left end and the right end of the liquid cooling plate, water nozzles are fixed at the connecting holes, and the temperature uniformizing plate further comprises a temperature uniformizing module, one end of the temperature equalizing module extends into the liquid cooling tank and is in contact with liquid cooling liquid in the liquid cooling tank, a heat source is fixed on the other side of the temperature equalizing module, and relieving tooth flow channels are distributed on the side, extending to the liquid cooling tank, of the temperature equalizing module. According to the vapor chamber combined with liquid cooling, a heat conducting sheet in the prior art is replaced, so that impedance in the heat conduction process is reduced, the heat transfer and heat dissipation efficiency is improved, the liquid cooling quality and the liquid cooling efficiency are ensured, materials and cost are saved, the heat conduction and heat dissipation efficiency is better than that in the prior art, and the vapor chamber is suitable for popularization and application. And the functions of reducing cost and reducing consumption are realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature averaging plates, and in particular relates to a temperature averaging plate combined with liquid cooling. Background Art

[0002] In the design of liquid cold plates, the heat transfer method is crucial. In traditional liquid cold plate designs, the heat source is often transferred to the liquid cold plate through a copper or aluminum base plate, and then the heat is carried away by the fluid in the flow channel. Another common method is that the heat source is first transferred to the liquid cold plate through a temperature homogenizer, and then the heat is carried away by the liquid through the liquid flow channel. After the heat exchange is completed, the heat is returned to the heat source area through the cold liquid, forming a cycle that repeats itself.

[0003] However, there are certain problems with the design in the prior art, such as Figure 1 As shown in the figure, the heat source needs to pass through multiple media (such as copper plates, aluminum plates or temperature distribution plates) before it can be transferred to the liquid cooling plate. This multi-media transfer method not only increases thermal resistance and makes the heat conduction process more difficult, but also may increase the reliability risk of the system due to the use of multiple materials.

[0004] In order to fill the gaps caused by insufficient flatness, traditional designs often use different materials (such as thermal interface materials) to assist in heat conduction. These materials include thermal paste or thermal patches. Although they can improve the thermal conductivity to a certain extent, they increase costs and cannot truly achieve the goal of cost reduction and energy saving.

[0005] Therefore, in view of the above situation, there is an urgent need to develop a temperature distribution plate combined with liquid cooling to overcome the shortcomings in current practical applications. Utility Model Content

[0006] In view of the shortcomings of the prior art, the embodiment of the present invention aims to provide a temperature vapor chamber combined with liquid cooling to solve the problems in the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A temperature homogenizing plate combined with liquid cooling, comprising a liquid cooling plate, wherein a liquid cooling groove is formed on an end surface of one side of the liquid cooling plate, and connection holes connected to the liquid cooling groove are formed on the side walls at both ends of the liquid cooling plate, and water nozzles are fixed to the connection holes. The water nozzles on one side of the liquid cooling plate guide the liquid cooling liquid into the liquid cooling groove through the connection holes, and the water nozzles on the other side of the liquid cooling plate guide the liquid cooling liquid in the liquid cooling groove to the outside of the liquid cooling plate through the connection holes, and further comprising:

[0009] A temperature balancing module is installed on one side of the liquid cooling plate where a liquid cooling tank is opened. One end of the temperature balancing module extends into the liquid cooling tank and contacts the liquid cooling liquid therein. A heat source is fixed on the other side of the temperature balancing module, and a skived tooth flow channel is distributed on one side of the temperature balancing module extending to the liquid cooling tank.

[0010] As a further technical solution of the present invention, the temperature equalizing module includes a first temperature equalizing plate and a second temperature equalizing plate, one side of the first temperature equalizing plate is fixedly connected to one side of the second temperature equalizing plate, a skived flow channel is distributed on the other side of the first temperature equalizing plate, and the other side of the first temperature equalizing plate is fixedly connected to one side of the liquid cooling plate by brazing, and a heat source is installed on the other side of the second temperature equalizing plate.

[0011] As a further technical solution of the present invention, the interior of the second temperature equalizing plate is hollow, and a vacuum liquid injection nozzle is installed on one side wall of the second temperature equalizing plate. One end of the vacuum liquid injection nozzle extends into the interior of the second temperature equalizing plate and is connected with its interior.

[0012] As a further technical solution of the present invention, the water nozzle is fixedly connected to the side wall and the connecting hole of the liquid cooling plate respectively by tunnel brazing.

[0013] As a further technical solution of the present invention, the first temperature equalizing plate and the skived flow channel are an integrated structure, the first temperature equalizing plate is provided with a skived flow channel on one side thereof by CNC processing, and the first temperature equalizing plate and the second temperature equalizing plate are connected as a whole by diffusion welding.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The present invention replaces the heat conducting sheet in the prior art, thereby reducing the impedance in the heat conduction process to improve the heat transfer and heat dissipation efficiency. This ensures the quality and efficiency of liquid cooling while also saving materials and costs. The heat conduction and heat dissipation efficiency are better than the prior art, achieving the function of cost reduction and energy saving.

[0016] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 An exploded diagram of the structure of a temperature distribution plate combined with liquid cooling provided by the prior art.

[0018] Figure 2 A schematic structural diagram of a temperature homogenizing plate combined with liquid cooling provided in an embodiment of the present invention.

[0019] Figure 3This is a structural explosion diagram from the first perspective of a temperature vapor chamber combined with liquid cooling provided in an embodiment of the present invention.

[0020] Figure 4 This is a structural explosion diagram from a second perspective of the temperature vapor chamber combined with liquid cooling provided in an embodiment of the present invention.

[0021] Figure 5 for Figure 3 Exploded diagram of the structure of the first and second vapor chambers.

[0022] Figure 6 This is the Tvc thermal resistance curve.

[0023] Figure 7 This is the Tcase thermal resistance curve.

[0024] Figure numerals: 1-liquid cooling plate, 2-temperature averaging module, 21-first temperature averaging plate, 22-second temperature averaging plate, 23-vacuum liquid injection nozzle, 24-shovel-tooth flow channel, 3-heat source, 4-water nozzle, 5-liquid cooling tank, 6-connection hole, 7-heat conducting plate. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0027] like Figures 1 to 5 As shown, as an embodiment of the present invention, a temperature distribution plate combined with liquid cooling is provided, including a liquid cooling plate 1, an end surface of one side of the liquid cooling plate 1 is provided with a liquid cooling groove 5, and the side walls at both ends of the liquid cooling plate 1 are provided with connection holes 6 connected to the liquid cooling groove 5, and a water nozzle 4 is fixed at the connection hole 6. The water nozzle 4 on one side of the liquid cooling plate 1 can guide the liquid cooling liquid into the liquid cooling groove 5 through the connection hole 6, and the water nozzle 4 on the other side of the liquid cooling plate 1 can guide the liquid cooling liquid in the liquid cooling groove 5 to the outside of the liquid cooling plate 1 through the connection hole 6, thereby realizing the circulation of the liquid cooling liquid and improving the liquid cooling efficiency and liquid cooling quality of the liquid cooling plate 1, and further comprising:

[0028] The temperature equalizing module 2 is installed on one side of the liquid cooling tank 5 on the liquid cooling plate 1. One end of the temperature equalizing module 2 extends into the liquid cooling tank 5 and contacts the liquid cooling liquid therein. A heat source 3 is fixed on the other side of the temperature equalizing module 2, and a skived flow channel 24 is distributed on one side of the temperature equalizing module 2 extending to the liquid cooling tank 5. The temperature equalizing module 2 replaces the heat conducting plate 7 in the prior art to reduce the impedance in the heat conduction process, so as to improve the heat transfer and heat dissipation efficiency. In this way, while ensuring the liquid cooling quality and liquid cooling efficiency, it also achieves material and cost savings. The heat conduction and heat dissipation efficiency are better than the prior art, achieving the function of reducing costs and saving consumption.

[0029] like Figures 2 to 5 As shown, as a preferred embodiment of the present invention, the temperature equalizing module 2 includes a first temperature equalizing plate 21 and a second temperature equalizing plate 22, one side of the first temperature equalizing plate 21 is fixedly connected to one side of the second temperature equalizing plate 22, the other side of the first temperature equalizing plate 21 is distributed with a skived flow channel 24, and the other side of the first temperature equalizing plate 21 is fixedly connected to one side of the liquid cooling plate 1 by brazing, and the other side of the second temperature equalizing plate 22 is installed with a heat source 3.

[0030] like Figures 2 to 5 As shown, as a preferred embodiment of the present invention, the interior of the second temperature equalizing plate 22 is hollow, and a vacuum liquid injection nozzle 23 is installed on one side wall of the second temperature equalizing plate 22, and one end of the vacuum liquid injection nozzle 23 extends to the interior of the second temperature equalizing plate 22 and is connected with the interior thereof.

[0031] like Figures 2 to 5 As shown, as a preferred embodiment of the present invention, the water nozzle 4 is fixedly connected to the side wall and the connecting hole 6 of the liquid cooling plate 1 by tunnel brazing. This welding method can ensure the airtightness between each other, thereby ensuring the liquid cooling efficiency and liquid cooling quality.

[0032] like Figures 2 to 5 As shown, as a preferred embodiment of the present invention, the first temperature equalizing plate 21 and the skived flow channel 24 are an integrated structure, and the first temperature equalizing plate 21 is processed by CNC to open a skived flow channel 24 on one side thereof, and the first temperature equalizing plate 21 and the second temperature equalizing plate 22 can also be connected as a whole by diffusion welding.

[0033] In this embodiment, the bulk welding technology mainly achieves atomic contact on the surface of the material and realizes mutual diffusion between atoms under certain conditions (such as high temperature and pressure), thereby forming a strong connection.

[0034] Table 1 Thermal resistance test comparison table

[0035]

[0036] In the above table, T-VC represents the present utility model, Tcase represents Figure 1 The prior art shown.

[0037] like Figure 6 and Figure 7 As shown, Figure 6 This is a curve diagram of the thermal resistance test of the utility model. Figure 7 This is a curve chart of the thermal resistance test of the prior art. By comparing the two curve charts, it can be seen that the thermal conductivity and heat dissipation efficiency of the present invention are better than those of the prior art.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature homogenizing plate combined with liquid cooling, comprising a liquid cooling plate, wherein a liquid cooling groove is formed on an end surface of one side of the liquid cooling plate, and connection holes connected to the liquid cooling groove are formed on the side walls at both ends of the liquid cooling plate, and a water nozzle is fixed to the connection hole. The water nozzle on one side of the liquid cooling plate guides the liquid cooling liquid into the liquid cooling groove through the connection hole, and the water nozzle on the other side of the liquid cooling plate guides the liquid cooling liquid in the liquid cooling groove to the outside of the liquid cooling plate through the connection hole, characterized in that Also includes: A temperature balancing module is installed on one side of the liquid cooling plate where a liquid cooling tank is opened. One end of the temperature balancing module extends into the liquid cooling tank and contacts the liquid cooling liquid therein. A heat source is fixed on the other side of the temperature balancing module, and a skived tooth flow channel is distributed on one side of the temperature balancing module extending to the liquid cooling tank.

2. The temperature vapor chamber combined with liquid cooling according to claim 1, characterized in that: The temperature averaging module includes a first temperature averaging plate and a second temperature averaging plate, one side of the first temperature averaging plate is fixedly connected to one side of the second temperature averaging plate, a skived flow channel is distributed on the other side of the first temperature averaging plate, and the other side of the first temperature averaging plate is fixedly connected to one side of the liquid cooling plate by brazing, and a heat source is installed on the other side of the second temperature averaging plate.

3. The temperature vapor chamber combined with liquid cooling according to claim 2, characterized in that: The second temperature averaging plate is hollow inside, and a vacuum liquid injection nozzle is installed on one side wall of the second temperature averaging plate. One end of the vacuum liquid injection nozzle extends into the interior of the second temperature averaging plate and is communicated with the interior of the second temperature averaging plate.

4. The temperature vapor chamber combined with liquid cooling according to claim 1, characterized in that: The water nozzle is fixedly connected to the side wall and the connecting hole of the liquid cooling plate respectively by tunnel brazing.

5. The temperature vapor chamber combined with liquid cooling according to claim 2, characterized in that: The first temperature averaging plate and the skived-tooth flow channel are an integrated structure. The skived-tooth flow channel is opened on one side of the first temperature averaging plate by CNC processing, and the first temperature averaging plate and the second temperature averaging plate are connected as a whole by diffusion welding.

Images