Heat dissipation assembly and circuit board assembly

Abstract

The present application relates to the technical field of electronic device heat dissipation, and provides a heat dissipation assembly and a circuit board assembly. The heat dissipation assembly comprises at least one group of heat dissipation structures; each group of heat dissipation structures comprise fixing assemblies and two opposite heat conduction assemblies; an accommodating space is formed between the two heat conduction assemblies, and the accommodating space is used for installing heating elements; the fixing assemblies are used for detachably fastening and connecting the two heat conduction assemblies, so that the heating elements are clamped between the two heat conduction assemblies; at least one end of each heat conduction assembly is used for being connected to a cold plate. That is to say, by means of the fixing assemblies, it is ensured that the heating elements are stably clamped in the accommodating space between the two heat conduction assemblies, and at least one end of each heat conduction assembly is connected to the cold plate, so as to transfer heat from the heating elements to the cold plate, thereby achieving an effective heat dissipation effect. The heat dissipation apparatus has a compact structure, is easily installed, and provides an efficient and reliable solution for heat dissipation of an electronic device.

Description

Heat dissipation assembly and circuit board assembly

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 29, 2023, with application number 202311868726.2 and application name “A heat dissipation component and circuit board assembly”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation component and a circuit board component. Background Art

[0003] With the rapid development of computer technology, the requirements for storage and heat dissipation of memory devices are constantly increasing. Memory chips generate a large amount of heat when working. If this heat cannot be effectively dissipated in a timely manner, it will have a negative impact on the performance and stability of the computer.

[0004] In the prior art, the memory chip is connected to the heat conducting plate via a memory thermal pad, and the heat conducting plate is connected to the cold plate via a cold plate thermal pad. The heat generated by the memory chip during operation is transferred to the cold plate via the heat conducting plate, and the cold plate transfers the heat to the air to achieve a heat dissipation effect.

[0005] However, during repeated assembly and disassembly of the memory, the memory thermal pads are subject to significant shear forces, affecting assembly and disassembly efficiency. Furthermore, improper handling can cause the cold plate thermal pad to be repeatedly compressed, affecting its resilience and causing poor contact between the memory thermal pad and the cold plate, reducing the memory's cooling efficiency.

[0006] Summary of the Invention

[0007] The present invention provides a heat dissipation assembly and circuit board assembly that address the heat dissipation limitations of memory devices. The heat dissipation structure and cold plate are configured to transfer heat from the heating element and achieve effective heat dissipation. The fixed assembly and thermal conductive assembly simplify and speed up the installation and removal of the heat dissipation structure, preventing the impact of repeated removal and installation on the thermal pad's resilience, thereby improving heat dissipation efficiency.

[0008] The embodiments of the present application provide the following technical solutions to solve the above technical problems:

[0009] An embodiment of the present application provides a heat dissipation assembly, comprising:

[0010] At least one group of heat dissipation structures, each group of heat dissipation structures includes a fixing component and two opposing heat-conducting components, and a receiving space is provided between the two heat-conducting components, and the receiving space is used to install a heating element;

[0011] The fixing assembly is used to detachably fasten the two heat-conducting assemblies so that the heating element is clamped between the two heat-conducting assemblies;

[0012] At least one end of the heat conducting component is used to be connected to a cold plate.

[0013] Beneficial effects of the embodiments of the present application: The heat dissipation assembly provided in the embodiments of the present application includes at least one group of heat dissipation structures, each group of heat dissipation structures includes a fixed assembly and two opposite heat-conducting assemblies, and there is a accommodating space between the two heat-conducting assemblies, and the accommodating space is used to install the heating element. The fixed assembly is used to detachably fasten the two heat-conducting assemblies so that the heating element is clamped between the two heat-conducting assemblies. At least one end of the heat-conducting assembly is used to be connected to the cold plate. In other words, the heating element is firmly clamped in the accommodating space between the two heat-conducting assemblies by the fixed assembly, and at least one end of the heat-conducting assembly is connected to the cold plate so as to transfer heat from the heating element to the cold plate, thereby achieving effective heat transfer, and the cold plate transfers the heat to the air to achieve a heat dissipation effect.

[0014] In a possible embodiment, each of the heat-conducting components includes a heat-conducting plate and a first heat-conducting pad, wherein the first heat-conducting pad is arranged on a side of the heat-conducting plate facing the accommodating space, and the first heat-conducting pad is located between the heating element and the heat-conducting plate;

[0015] The fixing assembly is connected to the heat conducting plate.

[0016] In a possible implementation, each of the heat conducting components further includes at least one of the following:

[0017] a first fixing plate, wherein a first opening is provided on the first fixing plate, and the two first fixing plates of the two heat conducting components are connected via the fixing component passing through the two first openings;

[0018] The second fixing plate is provided with a second opening, and the two second fixing plates of the two heat-conducting components are connected through the fixing components and the two second openings.

[0019] In a possible implementation, a heat pipe is provided on the heat conducting plate;

[0020] And / or, each of the heat conducting components further includes a second heat conducting pad, which is arranged on a side of the heat conducting plate facing the accommodating space, and is located between the heat conducting plate and the cold plate.

[0021] In a possible implementation, the fixing assembly includes a fixing seat and a fastener, and the fixing seat is provided with a fastening hole connected to the fastener.

[0022] In a possible implementation, the fastener includes a tapered portion, and the tapered portion is passed through the first openings of the two first fixing plates of the two heat-conducting components;

[0023] Alternatively, the tapered portion is provided through the second openings of the two second fixing plates of the two heat conducting components;

[0024] The tapered portion is used to move the two heat conducting plates of the two heat conducting assemblies closer to each other, so that the two heat conducting plates clamp the heating element.

[0025] In a possible implementation, the fixing assembly further includes an elastic member, one end of the elastic member is connected to the fixing seat, and the other end of the elastic member abuts against a surface of the heat conducting plate facing the accommodating space.

[0026] In a possible embodiment, two cold plates are further included, and two ends of the two heat-conducting components in each group of the heat dissipation structure are respectively connected to the cold plates;

[0027] The cold plate includes a main body, and a plurality of spaced steps connected to the main body;

[0028] A cooling pipe is provided in the main body and the step, and an inlet and an outlet are provided at both ends of the cooling pipe;

[0029] There are multiple groups of heat dissipation structures, and two ends of each group of heat dissipation structures are in contact with one of the steps.

[0030] An embodiment of the present application provides a circuit board assembly, including:

[0031] A circuit board, a heating element, and a heat dissipation assembly arranged on the circuit board;

[0032] A portion of the fixing assembly of the heat dissipation assembly is fixed on the circuit board;

[0033] The heating element is arranged on the circuit board, and is located in the accommodation space between the two heat-conducting components of the heat dissipation component, and the heating element is arranged in close contact with the heat-conducting components.

[0034] In a possible implementation, the heating element includes a memory component, and the memory component includes a substrate and a memory chip disposed on the substrate;

[0035] The memory chip is attached to the first thermal pad of the thermal conductive component.

[0036] In addition to the technical problems solved by the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by a heat dissipation component and circuit board component provided by the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the embodiments of the present application or the description of the prior art. Obviously, the drawings described below are only part of the embodiments of the present application. These drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for those skilled in the art by referring to specific embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] FIG1 is a schematic structural diagram of a heat dissipation assembly and a circuit board assembly provided in an embodiment of the present application;

[0039] FIG2 is a schematic top view of the assembly of a heat dissipation assembly and a circuit board assembly according to an embodiment of the present application;

[0040] FIG3 is a schematic top view of a partial structure of a heat dissipation assembly and a circuit board assembly provided in an embodiment of the present application;

[0041] FIG4 is an assembled side view of a heat dissipation assembly and a circuit board assembly provided in an embodiment of the present application;

[0042] FIG5 is a diagram illustrating the assembly process of a heat dissipation assembly and a circuit board assembly according to an embodiment of the present application;

[0043] FIG6 is a side view of the heat dissipation assembly and circuit board assembly structure provided in an embodiment of the present application;

[0044] FIG7 is a schematic diagram of the interior of a cold plate of a heat dissipation assembly provided in an embodiment of the present application;

[0045] FIG8 is a schematic diagram of a heat pipe inside a heat conducting plate according to an embodiment of the present application;

[0046] FIG9 is a front view of the circuit board assembly provided in an embodiment of the present application.

[0047] Description of reference numerals:

[0048] 100, heat dissipation structure; 200, fixing assembly; 300, heat conduction assembly; 400, cold plate; 500, circuit board assembly;

[0049] 210, fixing seat; 220, fastener; 230, fastening hole; 240, elastic member;

[0050] 221, tapered portion;

[0051] 310, heat conducting plate; 320, heat conducting pad; 330, first fixing plate; 340, second fixing plate;

[0052] 311, accommodation space; 312, heat pipe; 3121, first section; 3122, second section;

[0053] 321, first thermal pad; 322, second thermal pad; 331, first opening; 341, second opening;

[0054] 410, main body; 420, step; 430, cooling pipe; 440, inlet; 450, outlet;

[0055] 510, circuit board; 520, connector; 530, heating element;

[0056] 531. Substrate; 532. Memory chip. DETAILED DESCRIPTION

[0057] With the rapid development of computer technology, the heat dissipation requirements for memory devices are also increasing. In existing technologies, memory chips are connected to a heat-conducting plate via a memory thermal pad, and the heat-conducting plate is connected to a cold plate via a cold plate thermal pad. Heat generated by the memory chips during operation is transferred to the cold plate via the heat-conducting plate to achieve a heat dissipation effect. However, during the repeated assembly and disassembly of memory, the memory thermal plate is subjected to significant shear forces on both sides, causing multiple compression of the cold plate thermal pad, affecting its rebound performance and causing poor contact between the memory thermal plate and the cold plate, thus affecting the memory's heat dissipation performance.

[0058] In view of this, the embodiments of the present application provide at least one heat dissipation structure, each comprising a fixed assembly and two opposing heat-conducting assemblies with a storage space between the two heat-conducting assemblies. A heating element is mounted within the storage space, and the two heat-conducting assemblies are removably fastened together using the fixed assembly, thereby clamping the heating element between the two heat-conducting assemblies. Furthermore, at least one end of the heat-conducting assembly is connected to a cold plate to transfer heat from the heating element to the cold plate, achieving effective heat dissipation.

[0059] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0060] Figure 1 is a schematic diagram of the structure of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 2 is a schematic top view of the assembly of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 3 is a schematic top view of the partial structure of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 4 is an assembly side view of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 5 is an assembly process diagram of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 6 is a structural side view of the heat dissipation component and the circuit board component provided in an embodiment of the present application, Figure 7 is a schematic diagram of the interior of the cold plate of the heat dissipation component provided in an embodiment of the present application, Figure 8 is a schematic diagram of the heat pipe inside the heat conduction plate provided in an embodiment of the present application, and Figure 9 is a front view of the circuit board assembly provided in an embodiment of the present application.

[0061] An embodiment of the present application provides a circuit board assembly, as shown in Figures 1 and 4. The circuit board assembly includes a circuit board 510, a heating element 530, and a heat dissipation assembly. Part of the fixing assembly 200 of the heat dissipation assembly is fixed to the circuit board 510. The heating element 530 is arranged on the circuit board 510. The heating element 530 is located in the accommodating space 311 between the two heat-conducting assemblies 300 of the heat dissipation assembly, and the heating element 530 is arranged in contact with the heat-conducting assemblies 300. The heating element 530 can be a memory assembly, including a substrate 531 and a memory chip 532 arranged on the substrate 531. The memory chip 532 is in contact with the first thermal pad 321 of the heat-conducting assembly 300.

[0062] It should be noted that the memory chip 532 can be disposed on one side of the substrate 531, but is not limited to being disposed on only one side of the substrate 531. For example, it can be disposed on both sides of the substrate 531. As shown in FIG2 , in the embodiment of the present application, the memory chip 532 is specifically disposed on both sides of the substrate 531.

[0063] 9 , a connector 520 is provided on the circuit board 510, and the heating element 530 is connected to the circuit board 510 via the connector 520. It should be noted that the connector 520 can be a slot, but is not limited to a slot, such as a buckle.

[0064] In some embodiments of the present application, the heat dissipation assembly includes at least one group of heat dissipation structures 100, each group of heat dissipation structures 100 includes a fixing assembly 200 and two opposing heat-conducting assemblies 300, and there is an accommodating space 311 between the two heat-conducting assemblies 300, and the accommodating space 311 is used to install the heating element 530.

[0065] It should be noted that the heat dissipation structure 100 can be one or more groups, such as two, three, or four groups. The embodiment of the present application specifically takes three groups as an example, as shown in Figure 1. For example, as shown in Figure 2, each group of heat dissipation structures 100 includes a fixed component 200 and two opposing heat-conducting components 300. The two heat-conducting components 300 are arranged oppositely on both sides of the fixed component 200 to form an accommodating space 311 for accommodating the heating element 530.

[0066] In some embodiments of the present application, as shown in Figures 2 and 3, a fixing assembly 200 is used to removably fasten two opposing thermally conductive assemblies 300, such that the heating element 530 is clamped between the two introduction assemblies, and at least one end of the thermally conductive assembly 300 is connected to the cold plate 400. In other words, the fixing assembly 200 brings the two thermally conductive assemblies 300 together close to the accommodating space 311 and clamps and fits the heating element 530. Heat from the heating element 530 is transferred to the cold plate 400 through the thermally conductive assemblies 300, dissipating heat from the heating element 530.

[0067] It should be noted that at least one end of the heat-conducting assembly 300 is connected to the cold plate 400, and this can be one or both ends. This is shown in Figure 3 . This embodiment of the present application specifically uses two ends as an example. It should be noted that the cold plate 400 is used to dissipate heat from the heating element 530 and can be made of metal or a thermally conductive material, but is not limited to these two materials.

[0068] In some embodiments of the present application, each thermal conductive component 300 includes a thermal conductive plate 310, a first thermal conductive pad 321, and a second thermal conductive pad 322. The first thermal conductive pad 321 and the second thermal conductive pad 322 are arranged on the side of the thermal conductive plate 310 facing the accommodating space 311. The first thermal conductive pad 321 is located between the heating element 530 and the thermal conductive plate 310, the second thermal conductive pad 322 is located between the thermal conductive plate 310 and the cold plate 400, and the fixing component 200 is connected to the thermal conductive plate 310.

[0069] It is understood that the heat conducting plate 310 is used to receive heat from the heating element 530 and is made of a material with good thermal conductivity. The thermal pad 320 is used to increase the contact area and improve the heat transfer efficiency. It is made of a soft, highly thermally conductive material such as graphene or a specific thermally conductive silicone, but is not limited to the above materials.

[0070] As shown in Figures 2 and 3, one side of the first thermal pad 321 directly contacts the memory chip 532 of the heating element 530, while the other side is in close contact with the thermal plate 310. The first thermal pad 321 transfers heat from the heating element 530 to the thermal plate 310, and the soft material of the thermal pad 320 protects the memory chip 532. The second thermal pad 322 directly contacts the cold plate 400 on one side, while the other side contacts the thermal plate 310. The second thermal pad 322 is used to transfer heat from the thermal plate 310 to the cold plate 400 for dissipation.

[0071] It should be noted that the embodiment of the present application specifically takes the contact between the two ends of the thermal conductive assembly 300 and the cold plate 400 as an example, as shown in Figure 3. In addition, two second thermal conductive pads 322 are provided on the side of each thermal conductive assembly 300 facing the accommodating space 311, and the second thermal conductive pads 322 are provided at both ends of the first thermal conductive pad 321.

[0072] In some embodiments of the present application, each heat-conducting assembly 300 further includes a first fixing plate 330, the first fixing plate 330 being provided with a first opening 331, and the two first fixing plates 330 of the two heat-conducting assemblies 300 are connected through the two first openings 331 by the fixing assembly 200. In other examples, each heat-conducting assembly 300 further includes a second fixing plate 340, the second fixing plate 340 being provided with a second opening 341, and the two second fixing plates 340 of the two heat-conducting assemblies 300 are connected through the two second openings 341 by the fixing assembly 200. In other examples, each heat-conducting assembly 300 further includes a first fixing plate 330 and a second fixing plate 340, the two first fixing plates 330 of the two heat-conducting assemblies 300 are connected through the two first openings 331 by the fixing assembly 200, and the two second fixing plates 340 are connected through the two second openings 341 by the fixing assembly 200. It can be understood that each heat conducting assembly 300 includes but is not limited to only having the first fixing plate 330 or the second fixing plate 340 . For example, each heat conducting assembly 300 includes a third fixing plate or a fourth fixing plate.

[0073] The present embodiment of the present application specifically describes an example in which each heat conducting assembly 300 includes a first fixing plate 330 and a second fixing plate 340. For example, as shown in Figures 2 and 4 , the first fixing plate 330 and the second fixing plate 340 are vertically disposed on the side of the heat conducting plate 310 facing the receiving space 311. However, it should be noted that the first fixing plate 330 and the second fixing plate 340 can be, but are not limited to, vertically disposed and can be, for example, tilted.

[0074] Continuing with Figures 2 and 4 , the first fixing plate 330 is provided with a first opening 331. The two first fixing plates 330 of the two heat-conducting assemblies 300 are connected through the two first openings 331 via the fixing assembly 200. The second fixing plate 340 is provided with a second opening 341. The two second fixing plates 340 of the two heat-conducting assemblies 300 are connected through the two second openings 341 via the fixing assembly 200. Connecting the two heat-conducting assemblies 300 via the fixing assembly 200 enhances the stability and reliability of the heat dissipation structure 100, allowing the two heat-conducting assemblies 300 to better clamp the heating element 530 and transfer heat from the heating element 530.

[0075] In some embodiments of the present application, a heat pipe 312 is provided on the heat conducting plate 310. It should be noted that the heat pipe 312 is a component with excellent heat transfer performance, including a main tube shell, an internal cavity containing a working medium, and a capillary structure. Heat from the heating element 530 is transferred through the heat conducting plate 310 and the heat pipe 312 within the heat conducting plate 310 to the cold plate 400 for dissipation.

[0076] For example, as shown in Figure 7, the heat pipe 312 within the heat conducting plate 310 includes a first section 3121 and a second section 3122. The first section 3121 of the heat pipe 312 is connected to the second section 3122. The first section 3121 of the heat pipe 312 is used to improve the efficiency of heat transfer between the heating element 530, and the second section 3122 of the heat pipe 312 is used to improve the efficiency of heat transfer between the cold plate 400. It should be noted that the cold pipe arrangement can be as described above, but is not limited to the above arrangement.

[0077] In some embodiments of the present application, the fixing assembly 200 includes a fixing seat 210 and a fastener 220 . The fixing seat 210 is provided with a fastening hole 230 connected to the fastener 220 . The fixing seat 210 is disposed on the circuit board assembly 500 .

[0078] 5 and 9 , the fixing base 210 is provided on the circuit board 510 and is used to install the fastener 220 (not shown in FIG9 ). It should be noted that the shape of the fixing base 210 can be a cuboid or a cylinder, but is not limited to the above two shapes.

[0079] In some embodiments of the present application, the fastener 220 includes a tapered portion 221, and the tapered portion 221 of the fastener 220 is inserted through the first openings 331 of the two first fixing plates 330 of the two thermally conductive components 300. In other examples, the tapered portion 221 of the fastener 220 is inserted through the second openings 341 of the two second fixing plates 340 of the two thermally conductive components 300. In other examples, each heat dissipation structure 100 is provided with two fasteners 220, wherein the tapered portion 221 of one fastener 220 is inserted through the first openings 331 of the two first fixing plates 330 of the two thermally conductive components 300, and the tapered portion 221 of the other fastener 220 is inserted through the second openings 341 of the two second fixing plates 340 of the two thermally conductive components 300.

[0080] For example, as shown in Figures 4, 5, and 6, this embodiment specifically provides two fasteners 220, which are respectively provided through the first openings 331 of the two first fixing plates 330 of the two heat-conducting assemblies 300, and the second openings 341 of the two second fixing plates 340 of the two heat-conducting assemblies 300, and connected to the fixing base 210 through the fastening holes 230. The tapered portion 221 is used to move the two heat-conducting plates 310 of the two heat-conducting assemblies 300 toward the accommodating space 311, so that the two heat-conducting plates 310 clamp the heating element 530, so that the memory chip 532 of the heating element 530 is tightly fitted with the first thermal pad 321.

[0081] It should be noted that the tapered portion 221 of each fastener 220 includes, but is not limited to, being installed only through the first openings 331 of the two first fixing plates 330 of the two heat-conducting assemblies 300, or being installed only through the second openings 341 of the two second fixing plates 340 of the two heat-conducting assemblies 300. For example, the tapered portion 221 of each fastener 220 may also be installed through the third opening of the third fixing plate, or through the fourth opening of the fourth fixing plate.

[0082] It is understood that twisting the fastener 220 moves the tapered portion 221 downward toward the mounting base 210, thereby clamping the heating element 530. Twisting the fastener 220 moves the tapered portion 221 away from the mounting base 210, thereby loosening the heating element 530. The tapered portion 221 of the fastener 220 adjusts and controls the tight fit between the first thermal pad 321 and the memory chip 532 of the heating element 530.

[0083] In some embodiments of the present application, the fixing assembly 200 further includes an elastic member 240, one end of which is connected to the fixing base 210, and the other end of the elastic member 240 abuts against a surface of the heat conducting plate 310 facing the accommodating space 311. It should be noted that the elastic member 240 can be a reed, but is not limited to a reed, and can be, for example, a spring.

[0084] For example, as shown in Figures 4, 5 and 6, the other end of the elastic member 240 abuts against the first thermal pad 320 of the heat-conducting plate 310 to form an elastic support with flexibility and usability to meet the requirements of fixing the heat-conducting plate 310 to the heat-conducting plate 310 of heating elements 530 of different specifications. It should be noted that the elastic member 240 can also directly abut against the heat-conducting plate 310. The elastic member 240 is elastic and pushes the two heat-conducting plates 310 away from the fixing seat 210. The elastic member 240 can meet the needs of heating elements 530 of different sizes, shapes or positions. And when the fastener 220 is twisted to loosen the clamping of the heat-conducting plate 310 on the heating element 530, an outward pushing force is provided to keep the heat-conducting assembly 300 away from the memory chip 532 of the heating element 530 to ensure that the memory chip 532 is not affected by friction.

[0085] In some embodiments of the present application, the cold plate 400 includes a main body 410 and a plurality of spaced steps 420 connected to the main body 410. A cooling pipe 430 is provided in the main body 410 and the steps 420. An inlet 440 and an outlet 450 are provided at both ends of the cooling pipe 430.

[0086] Exemplarily, as shown in FIG7 , a coolant (not shown) is provided in the cooling pipe 430 of the cold plate 400 , and an inlet 440 and an outlet 450 are provided at both ends of the cooling pipe 430 , so that the coolant can flow in and out smoothly, forming an effective cycle to transfer heat away.

[0087] In some embodiments of the present application, one end of at least one heat-conducting component 300 of each group of heat dissipation structures 100 is fitted with one of the steps 420. Referring to Figures 1 and 3, the embodiments of the present application specifically take three groups of heat dissipation structures 100 as an example, and the number of steps 420 of each cold plate 400 is three. Both ends of each group of heat dissipation structures 100 are fitted with one of the steps 420 of each cold plate 400, and a second thermal pad 322 is provided between the heat dissipation structure 100 and the steps 420 of the cold plate 400. In other words, the heat dissipation structure 100 is tightly fitted with the steps 420 of the cold plate 400 through the second thermal pad 322, which promotes heat transfer and improves the heat dissipation effect.

[0088] Among them, the terms "upper" and "lower" are used to describe the relative position relationship of each structure in the accompanying drawings, which is only for the convenience of description and is not used to limit the scope of implementation of this application. Changes or adjustments to their relative relationships should also be regarded as the scope of implementation of this application without substantially changing the technical content.

[0089] It should be noted that, in this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0090] Furthermore, in this application, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed," and the like should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0091] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation component, characterized in that, Comprising: At least one set of heat dissipation structures, each set of the heat dissipation structures including a fixing component and two opposite heat conducting components, with an accommodation space between the two heat conducting components for mounting a heating element; The fixing component is used for detachably fastening and connecting the two heat conducting components so that the heating element is clamped between the two heat conducting components; At least one end of the heat conducting component is used for connecting with a cold plate.

2. The heat dissipation component according to claim 1, characterized in that Each heat conducting component includes a heat conducting plate and a first heat conducting pad, the first heat conducting pad being disposed on a surface of the heat conducting plate facing the accommodation space, and the first heat conducting pad being located between the heating element and the heat conducting plate; The fixing component is connected to the heat conducting plate.

3. The heat dissipation component according to claim 2, wherein Each heat conducting component further includes at least one of the following: A first fixing plate, with a first opening provided on the first fixing plate, and the two first fixing plates of the two heat conducting components being connected through the first openings by the fixing component passing through the two first openings; A second fixing plate, with a second opening provided on the second fixing plate, and the two second fixing plates of the two heat conducting components being connected through the second openings by the fixing component passing through the two second openings.

4. A heat dissipation component according to any one of claims 2 or 3, characterized in that, A heat pipe is provided on the heat conducting plate; And / or, each heat conducting component further includes a second heat conducting pad, the second heat conducting pad being disposed on a surface of the heat conducting plate facing the accommodation space, and the second heat conducting pad being located between the heat conducting plate and the cold plate.

5. The heat dissipation component according to claim 3, wherein, The fixing component includes a fixing base and a fastener, and a fastening hole for connecting with the fastener is provided on the fixing base.

6. The heat dissipation component according to claim 5, wherein The fastener includes a tapered portion, and the tapered portion is inserted through the first openings of the two first fixing plates of the two heat conducting components; Or, the tapered portion is inserted through the second openings of the two second fixing plates of the two heat conducting components; The tapered portion is used for moving the two heat conducting plates of the two heat conducting components closer to each other so that the two heat conducting plates clamp the heating element.

7. A heat dissipation component according to claim 6, wherein The fixing component further includes an elastic member, one end of the elastic member being connected to the fixing base, and the other end of the elastic member abutting against a surface of the heat conducting plate facing the accommodation space.

8. A heat dissipation component according to claim 7, characterized in that It further includes two cold plates, and both ends of the two heat conducting components in each set of the heat dissipation structures are respectively connected to the cold plates; The cold plate includes a main body portion and a plurality of spaced steps connected to the main body portion; A cooling pipeline communicating with each other is provided in the main body portion and the steps, and an inlet and an outlet are provided at both ends of the cooling pipeline; The number of the heat dissipation structures is multiple, and at least one end of at least one heat conducting component in each set of the heat dissipation structures is attached to one of the steps.

9. A circuit board assembly, characterized in that, Comprising: A circuit board, a heating element, and the heat dissipation component according to any one of claims 1 - 8 above; Part of the fixing component of the heat dissipation component is fixed on the circuit board; The heating element is disposed on the circuit board, the heating element is located in the accommodation space between the two heat conducting components of the heat dissipation component, and the heating element is attached to the heat conducting component.

10. A circuit board assembly according to claim 9, wherein The heating element includes a memory component, and the memory component includes a substrate and memory chips disposed on the substrate; The memory chips are attached to the first heat conducting pads of the heat conducting components.

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