Integrated horizontal electroplating device and integrated horizontal electroplating method

Abstract

The present invention relates to an integrated horizontal electroplating device, comprising a first power supply and an electroplating tank, an electroplating solution being provided in the electroplating tank. The electroplating tank comprises recovery tanks arranged at intervals within the electroplating tank, conductive cathode rollers and non-conductive rollers rotatably disposed within the electroplating tank, and a lower anode disposed within the electroplating tank, the conductive cathode rollers being located in the recovery tanks, and the non-conductive rollers being located between adjacent recovery tanks. The lower anode is connected to a positive electrode of the first power supply, the conductive cathode rollers are connected to a negative electrode of the first power supply, far ends of the non-conductive rollers are flush with far ends of the conductive cathode rollers, and the conductive cathode rollers and the non-conductive rollers rotate to convey a substrate. According to the integrated horizontal electroplating device of the present invention, since all positions within the electroplating tank are in communication with one another, the liquid level of the electroplating solution is flush at all positions within the electroplating tank, thus ensuring a sufficient and uniform electroplating thickness of the bottom surface of the substrate, and improving the electroplating effect for the substrate.

Description

Integrated horizontal electroplating equipment and integrated horizontal electroplating method Technical Field

[0001] The present invention relates to the technical field of horizontal electroplating equipment, and in particular to an integrated horizontal electroplating equipment and an integrated horizontal electroplating method. Background Art

[0002] The principle of horizontal electroplating is to utilize the redox reaction of ions in an electrolyte solution under the action of an electric field, reducing metal ions to metal and depositing them on the surface of the object being plated. In the traditional electroplating process, the object being plated serves as the cathode and the metal serves as the anode. The metal ions released by the anode are transferred by electrons in the electrolyte solution, causing the metal ions to be reduced to metal and deposited on the surface of the object being plated. In the electrolyte solution, metal ions combine with anions to form ion pairs. These ion pairs migrate toward the surface of the object being plated under the action of an electric field. The cathode on the surface of the object being plated attracts the metal ions, reducing them to metal and depositing them on the surface of the object being plated.

[0003] The Chinese invention patent with document number CN105543923B discloses a method and apparatus for horizontal electroplating. The horizontal electroplating method and apparatus disclosed in the invention use a number of independent and spaced electroplating tanks, and place the cathode contact point of the electroplating power supply on the outside of the independent electroplating tank so that the cathode contact point of the electroplating power supply is not in direct contact with the electroplating solution. In this method, the electroplating liquid level of each independent electroplating tank is controlled separately, and the overflow flow rate of each independent electroplating tank is different, so that the liquid level height and overflow flow rate between each independent electroplating tank are different. When the substrate is plated on different independent electroplating tanks, the surface electroplating thickness is insufficient or the electroplating thickness is uneven, which reduces the electroplating quality. Moreover, the separate control of the electroplating liquid level of each electroplating tank requires additional liquid level control equipment, resulting in increased equipment costs.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field.

[0005] Summary of the Invention

[0006] In response to the shortcomings of the existing technology, the present invention discloses an integrated horizontal electroplating equipment and an integrated horizontal electroplating method. The equipment and method only use one electroplating tank, and several recovery tanks are arranged in the electroplating tank to make the electroplating liquid level at various places on the surface of the electroplating tank the same, thereby ensuring the electroplating effect.

[0007] A further object of the present invention is to seek an integrated horizontal electroplating device and an integrated horizontal electroplating method, which have wide applicability and practicality, that is, the method and device can implement the electroplating process on the lower surface of the substrate alone, or implement the electroplating process on the upper surface of the substrate alone, or implement the electroplating process on the upper and lower surfaces of the substrate at the same time.

[0008] The technical solutions adopted in the present invention are as follows:

[0009] An integrated horizontal electroplating device includes an electroplating tank, wherein two or more recovery tanks are arranged in the electroplating tank, and a conductive cathode roller is arranged in the recovery tank.

[0010] Its further technical solution is that at least one non-conductive roller is rotatably arranged in the electroplating tank, the non-conductive roller is located between adjacent recovery tanks, at least one conductive cathode roller is rotatably arranged in the recovery tank, the integrated horizontal electroplating equipment also includes a first power supply, a lower anode is arranged in the electroplating tank, the electroplating tank is also connected to a liquid supply device, and a liquid outlet pipe is arranged on the side of the electroplating tank corresponding to the recovery tank; wherein, the lower anode is connected to the positive pole of the first power supply, the conductive cathode roller is connected to the negative pole of the first power supply, the non-conductive roller is flush with the far end of the conductive cathode roller, the conductive cathode roller and the non-conductive roller rotate to transport the substrate, and the liquid supply device transports the plating liquid to the electroplating tank so that the plating liquid wets the lower surface of the substrate and overflows the electroplating tank.

[0011] Its further technical solution is that the integrated horizontal electroplating equipment also includes a second power supply and an upper anode and a spraying device arranged above the substrate; wherein the upper anode is connected to the positive pole of the second power supply, the conductive cathode roller is connected to the negative pole of the second power supply, the conductive cathode roller and the non-conductive roller rotate to transport the substrate, and the spraying device sprays the plating liquid onto the upper surface of the substrate to wet the upper surface of the substrate and maintain the plating liquid level on the upper surface of the substrate.

[0012] A further technical solution is that the integrated horizontal electroplating equipment also includes a light source, which can illuminate at least one of the upper surface and the lower surface of the substrate.

[0013] A further technical solution is that at least one upper pressure wheel is provided on the conductive cathode roller.

[0014] A further technical solution is that the substrate is a solar cell.

[0015] A further technical solution is that a first rotating shaft is set in the non-conductive roller, and both ends of the first rotating shaft pass through the electroplating tank; a second rotating shaft is set in the conductive cathode roller, and both ends of the second rotating shaft pass through the electroplating tank.

[0016] A further technical solution is that the conductive cathode roller is detachably connected to the electroplating tank, and the non-conductive roller is detachably connected to the electroplating tank.

[0017] A further technical solution is that first plates are respectively provided on both sides of the first rotating shaft, and the first plates are clamped with both sides of the electroplating tank; second plates are respectively provided on both sides of the second rotating shaft, and the second plates are clamped with both sides of the electroplating tank.

[0018] Its further technical solution is that the integrated horizontal electroplating equipment also includes a driving assembly, which includes a motor, a support seat, and a driving rod arranged on the side of the electroplating tank. One end of the driving rod is connected to the output end of the motor, and the other end is rotatably connected to the support seat. The driving rod is engaged with the end of the first rotating shaft and the end of the second rotating shaft.

[0019] An integrated horizontal electroplating method comprises the following steps: a plating tank is provided below the substrate to be electroplated along the direction of movement of the substrate; two or more recovery tanks are provided in the plating tank; and a conductive cathode roller is provided in the recovery tank; after the lower surface of the substrate to be electroplated contacts the conductive cathode roller, at least one of the lower surface and the upper surface of the substrate to be electroplated forms the cathode surface of the electroplating process.

[0020] Its further technical solution is that when there is only a lower anode below the substrate, electrochemical plating is performed on the lower surface of the substrate alone; when there is only an upper anode above the substrate, any one of electrochemical plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the upper surface of the substrate alone; when there is a lower anode below the substrate and an upper anode above the substrate, any one of electrochemical plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the lower and upper surfaces of the substrate at the same time.

[0021] A further technical solution is that when any one of electrochemical plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the lower surface of the substrate, the lower surface of the substrate is wetted by the plating liquid in the plating tank, and a lower anode is set in the plating tank; when any one of electrochemical plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the upper surface of the substrate, a spraying device is set above the upper surface of the substrate, and the spraying device sprays the plating liquid onto the upper surface of the substrate, so that the plating liquid wets the upper surface of the substrate and contacts the upper anode.

[0022] The beneficial effects of the present invention are as follows:

[0023] (1) The integrated horizontal electroplating equipment of the present invention includes an electroplating tank, a recovery tank is arranged at intervals in the electroplating tank, and a non-conductive roller and a conductive cathode roller are respectively arranged in the electroplating tank and the recovery tank. The electroplating liquid is sprayed into the electroplating tank through the liquid supply device. Since all parts of the electroplating tank are connected, the liquid level of the electroplating liquid in the electroplating tank is level, ensuring that the electroplating thickness of the bottom surface of the substrate is sufficient and uniform, thereby improving the electroplating effect of the substrate.

[0024] (2) Furthermore, a liquid outlet pipe is provided on the side of the electroplating tank corresponding to the recovery tank to facilitate the recovery of overflow electroplating liquid.

[0025] (3) Furthermore, the conductive cathode roller is detachably connected to the electroplating tank, and the non-conductive roller is detachably connected to the electroplating tank, so as to facilitate the removal and replacement of the conductive cathode roller and the non-conductive roller;

[0026] A first plate is provided on both sides of the first rotating shaft, and the first plate is clamped to both sides of the electroplating tank. A second plate is provided on both sides of the second rotating shaft, and the second plate is clamped to both sides of the electroplating tank. The clamping connection can ensure the sealing between the first plate, the second plate and the electroplating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a side structural schematic diagram of an integrated horizontal electroplating device of the present invention.

[0028] FIG2 is a connection diagram of an integrated horizontal electroplating device of the present invention.

[0029] FIG3 is a schematic front view of the structure of an integrated horizontal electroplating device of the present invention.

[0030] FIG4 is a schematic diagram of the top view of the structure of an integrated horizontal electroplating device of the present invention.

[0031] FIG5 is a side structural schematic diagram of an integrated horizontal electroplating device according to a second embodiment of the present invention.

[0032] FIG6 is a connection diagram of an integrated horizontal electroplating device according to the second embodiment of the present invention.

[0033] FIG7 is a side structural schematic diagram of an integrated horizontal electroplating device according to the third embodiment of the present invention.

[0034] In the figure: 1. Plating tank; 11. Non-conductive roller; 111. First rotating shaft; 112. First plate; 12. Plating liquid; 13. Lower anode; 2. Recovery tank; 21. Conductive cathode roller; 211. Second rotating shaft; 22. Second plate; 23. Liquid outlet pipe; 24. Liquid inlet pipe; 25. Liquid supply equipment; 3. First power supply; 4. Base plate; 5. Drive assembly; 50. Motor; 51. Drive rod; 52. Bevel gear; 53. Support seat; 6. Spraying equipment; 61. Upper plating liquid level; 7. Upper anode; 71. Upper pressure wheel; 8. Second power supply; 9. Light source. DETAILED DESCRIPTION

[0035] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0036] In order to make the purpose, technical solutions and advantages of the present invention clearer, the device and method proposed in the present invention are further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the efficacy and purpose that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0037] In order to more clearly describe the structure of the above-mentioned fluid control device, the present invention defines the terms "distal end" and "proximal end". Specifically, the "distal end" refers to the end away from the ground, and the "proximal end" refers to the end close to the ground. Taking Figure 1 as an example, the lower end of the electroplating tank 1 in Figure 1 is the proximal end, and the upper end of the electroplating tank 1 in Figure 1 is the distal end.

[0038] First embodiment:

[0039] Figure 1 is a schematic diagram of the side structure of an integrated horizontal electroplating device of the present invention. Figure 2 is a connection relationship diagram of an integrated horizontal electroplating device of the present invention. Figure 3 is a schematic diagram of the front structure of an integrated horizontal electroplating device of the present invention. Figure 4 is a schematic diagram of the top structure of an integrated horizontal electroplating device of the present invention.

[0040] In this embodiment, the substrate 4 is a glass plate, and one surface of the glass plate to be electroplated can contact the conductive cathode roller 21 and the electroplating solution 12 for electroplating.

[0041] As shown in Figures 1 to 4, an integrated horizontal electroplating device includes a first power supply 3 and an electroplating tank 1. The electroplating tank 1 includes a recovery tank 2 arranged at intervals in the electroplating tank 1, a conductive cathode roller 21 and a non-conductive roller 11 rotatably arranged in the electroplating tank 1, and a lower anode 13 arranged in the electroplating tank 1. The conductive cathode roller 21 is located in the recovery tank 2, and the non-conductive roller 11 is located between adjacent recovery tanks 2. Exemplarily, the recovery tank 2 is arc-shaped, or it can be other shapes such as a V-shape, and is parallel to the width direction of the electroplating tank 1. The conductive cathode roller 21 and the non-conductive roller 11 are arranged parallel to the width direction of the electroplating tank 1. At least one conductive cathode roller 21 is arranged in each recovery tank 2, and at least one non-conductive roller 11 is arranged between adjacent recovery tanks 2. The non-conductive roller 11 is flush with the distal end of the conductive cathode roller 21.

[0042] The main function of the conductive cathode roller 21 and the non-conductive roller 11 is to support the substrate 4. When the conductive cathode roller 21 and the non-conductive roller 11 rotate, they can also play the role of moving the substrate 4. Two or more non-conductive rollers 11 can be set between adjacent recovery tanks 2 according to actual applications. Similarly, two or more conductive cathode rollers 21 can also be arranged in one recovery tank 2. The conductive cathode roller 21 is cylindrical. Preferably, the conductive cathode roller 21 and the non-conductive roller 11 are cylindrical, which can maintain contact with the liquid surface of the electroplating solution 12 on the lower surface of the substrate 4 while avoiding the formation of crystals of the electroplating solution 12 on the conductive cathode roller 21 and the non-conductive roller 11.

[0043] The conductive cathode roller 21 of the present invention is disposed within the recovery tank 2 and does not directly contact the electroplating solution 12 during the electroplating process, thereby effectively preventing a short circuit between the conductive cathode roller 21 and the lower anode 13. This design of the present invention not only makes the electric field within the electroplating tank 1 more uniform, or in other words, makes the electroplated layer on the lower surface of the substrate 4 more uniform, but also effectively prevents the formation of unnecessary electroplated layers on the conductive cathode roller 21.

[0044] A liquid inlet pipe 24 is also provided at the proximal end of the electroplating tank 1. This inlet pipe 24 is connected to a liquid supply device 25. The liquid supply device 25 pumps the electroplating solution 12 into the electroplating tank 1 through the liquid inlet pipe 24, causing the electroplating solution 12 to wet the lower surface of the substrate 4 and overflow the electroplating tank 1. A liquid outlet pipe 23 is provided on the side of the electroplating tank 1, corresponding to the recovery tank 2. The electroplating solution 12 overflowing into the electroplating tank 1 flows out through the liquid outlet pipe 23. Preferably, the liquid supply device 25 is a commercially available pump body capable of pumping a medium.

[0045] The lower anode 13 is connected to the positive electrode of the first power source 3, and the conductive cathode roller 21 is connected to the negative electrode of the first power source 3. For example, the lower anode 13 is connected to the positive electrode of the first power source 3 via a power line, and the conductive cathode roller 21 is connected to the negative electrode of the first power source 3 via a power line. The conductive cathode roller 21 and the non-conductive roller 11 rotate to transport the substrate 4.

[0046] Furthermore, a first rotating shaft 111 is set in the non-conductive roller 11, and both ends of the first rotating shaft 111 pass through the electroplating tank 1. A second rotating shaft 211 is set in the conductive cathode roller 21, and both ends of the second rotating shaft 211 pass through the electroplating tank 1, so that a portion of the first rotating shaft 111 and the second rotating shaft 211 are exposed from the electroplating tank 1.

[0047] Furthermore, the conductive cathode roller 21 is detachably connected to the electroplating tank 1, and the non-conductive roller 11 is detachably connected to the electroplating tank 1, so as to facilitate the disassembly and replacement of the conductive cathode roller 21 and the non-conductive roller 11. For example, a first plate 112 is provided on both sides of the first rotating shaft 111, and the first plate 112 is clamped to both sides of the electroplating tank 1. A second plate 22 is provided on both sides of the second rotating shaft 211, and the second plate 22 is clamped to both sides of the electroplating tank 1. The clamping connection can ensure the sealing between the first plate 112, the second plate 22 and the electroplating tank 1. Preferably, a convex edge (not shown in the figure) is provided on the proximal outer edge of the first plate 112 and the proximal outer edge of the second plate 22, and a clamping slot (not shown in the figure) for the convex edge to be clamped is provided on the electroplating tank 1.

[0048] Furthermore, the integrated horizontal electroplating equipment also includes a driving assembly 5, which includes a motor 50, a support seat 53, and a driving rod 51 arranged on the side of the electroplating tank 1. One end of the driving rod 51 is connected to the output end of the motor 50, and the other end is rotatably connected to the support seat 53. The driving rod 51 is engaged with the end of the first rotating shaft 111 and the end of the second rotating shaft 211 to drive the first rotating shaft 111 and the second rotating shaft 211 to rotate.

[0049] Furthermore, the driving rod 51 is arranged perpendicular to the first rotating shaft 111 and the second rotating shaft 211, and a bevel gear 52 is set at the end of the first rotating shaft 111 exposed from the electroplating tank 1 and the end of the second rotating shaft 211 exposed from the electroplating tank 1. A bevel gear 52 is set on the driving rod 51 corresponding to the first rotating shaft 111 and the second rotating shaft 211, and the bevel gears 52 of the first rotating shaft 111 and the second rotating shaft 211 are engaged with the bevel gear 52 of the driving rod 51.

[0050] Furthermore, at least one upper pressing wheel 71 is provided on the substrate 4 . The upper pressing wheel 71 can be made of elastic material or can float up and down, so that the upper pressing wheel 71 can ensure good electrical contact between the lower surface of the substrate 4 and the conductive cathode roller 21 .

[0051] The workflow of this embodiment is as follows:

[0052] Turn on the motor 50 and the first power supply 3. The output of the motor 50 drives the drive rod 51 to rotate, which in turn drives the first rotating shaft 111 and the second rotating shaft 211. The first rotating shaft 111 drives the non-conductive roller 11, and the second rotating shaft 211 drives the conductive cathode roller 21. The non-conductive roller 11 and the conductive cathode roller 21 drive the substrate 4 from the right side to the left side in Figure 1. The lower surface of the substrate 4 first contacts the upper surface of the conductive cathode roller 21. Under the action of the negative terminal of the first power supply 3, the lower surface of the substrate 4, relative to the lower anode 13, becomes the cathode surface during the electroplating process. As the substrate 4 continues to move leftward, a portion of the substrate 4 enters the far end of the electroplating tank 1. The liquid supply device 25 delivers the electroplating solution 12 into the electroplating tank 1 via the liquid inlet pipe 24. If there is no system fluctuation, the lower surface of the substrate 4 may not contact the electroplating solution 12 because the liquid level of the electroplating solution 12 in the electroplating tank 1 is lower than the level of the conductive cathode roller 21 and the non-conductive roller 11. To ensure that the lower surface of substrate 4 contacts the plating solution 12, the plating solution 12 can be caused to gush beneath substrate 4, or the vibrations of plating tank 1 itself can be utilized to bring the plating solution 12 into contact with the lower surface of substrate 4. Once the plating solution 12 contacts the lower surface of substrate 4, the surface tension of the plating solution 12 rapidly wets the lower surface of substrate 4 above plating tank 1. Excess plating solution 12 overflows along the lower surface of substrate 4 into recovery tank 2, where it then flows out of plating tank 1 through outlet pipe 23.

[0053] After the electroplating solution 12 contacts the lower surface of the substrate 4, the metal ions in the electroplating solution 12, under the action of the first power supply 3, gain electrons on the conductive area of ​​the lower surface of the substrate 4, generating solid metal that is deposited on the conductive area of ​​the lower surface of the substrate 4. Meanwhile, the lower anode 13 in the electroplating tank 1 loses electrons and dissolves in the electroplating solution 12, thus completing the redox reaction of a complete electroplating process within the system.

[0054] Second embodiment:

[0055] Based on the first embodiment, the second embodiment further optimizes and refines the structure of the electroplating tank 1 .

[0056] Figure 5 is a side view of the structure of an integrated horizontal electroplating device according to the second embodiment of the present invention. Figure 6 is a connection diagram of an integrated horizontal electroplating device according to the second embodiment of the present invention.

[0057] In this embodiment, the substrate 4 may be a crystalline silicon heterojunction solar cell (HJT), one surface of which has a positive metal electrode (p-type metal electrode) and the other surface of which has a negative metal electrode (n-type metal electrode).

[0058] In this embodiment, the p-type metal electrode surface of the crystalline silicon heterojunction solar cell (HJT) is directed downward to contact the conductive cathode roller 21, or is directed simultaneously to the conductive cathode roller 21 and the non-conductive roller 11, and the n-type metal electrode surface of the crystalline silicon heterojunction solar cell (HJT) is directed upward to electrically contact the upper anode 7 through the upper electroplating liquid level 61.

[0059] As shown in Figures 5 and 6, the integrated horizontal electroplating equipment further includes a second power supply 8, an upper anode 7, and a spraying device 6 disposed above the substrate 4. The upper anode 7 contacts the upper electroplating liquid level 61 on the upper surface of the substrate 4 but does not contact the substrate 4. The upper anode 7 is connected to the positive electrode of the second power supply 8, and the conductive cathode roller 21 is connected to the negative electrode of the second power supply 8. The conductive cathode roller 21 and the non-conductive roller 11 rotate to transport the substrate 4, and the spraying device 6 sprays the electroplating liquid 12 onto the upper surface of the substrate 4, so that the electroplating liquid 12 wets the upper surface of the substrate 4 and contacts the upper anode 7.

[0060] In this embodiment, during the electrochemical plating process, the upper anode 7 is placed above the substrate 4 and contacts the upper plating liquid surface 61 on the upper surface of the substrate 4. The upper anode 7 can have various shapes, such as square, cylindrical, etc. Preferably, the upper anode 7 is cylindrical, which can maintain contact with the upper plating liquid surface 61 on the upper surface of the substrate 4 while preventing the plating solution 12 from crystallizing on the upper anode 7.

[0061] The electroplating solution 12 can be delivered to the upper surface of the substrate 4 by various methods, such as by directly spraying the upper surface of the substrate 4 through the spraying device 6 to form an upper electroplating liquid level 61 on the substrate 4. Other methods can also be used to form the upper electroplating liquid level 61 on the substrate 4, such as a spray method. Further, the electroplating solution 12 can first be sprayed on the upper anode 7, and then flow to the upper surface of the substrate 4 after passing through the upper anode 7. The advantage of such a design is that the contact between the upper anode 7 and the upper electroplating liquid level 61 can be ensured to the greatest extent. Of course, in other embodiments of the present invention, the electroplating solution 12 can also be directly sprayed onto the upper surface of the substrate 4.

[0062] The non-conductive roller 11 and the conductive cathode roller 21 drive the substrate 4 from the right side to the left side in Figure 1. The lower surface of the substrate 4 first contacts the upper surface of the conductive cathode roller 21. Under the action of the negative electrode of the first power supply 3, the lower surface of the substrate 4 becomes the cathode surface relative to the lower anode 13 during the electroplating process. As the substrate 4 continues to move to the left, a portion of the substrate 4 enters the far end of the electroplating tank 1. The liquid supply device 25 delivers the electroplating solution 12 into the electroplating tank 1 through the liquid inlet pipe 24. If there is no system fluctuation, the lower surface of the substrate 4 may not contact the electroplating solution 12 because the liquid level of the electroplating solution 12 in the electroplating tank 1 is lower than the level of the conductive cathode roller 21 and the non-conductive roller 11. To ensure that the lower surface of the substrate 4 contacts the electroplating solution 12, the electroplating solution 12 can be caused to gush out from under the substrate 4. Alternatively, the vibrations generated by the electroplating tank 1 itself can be used to bring the electroplating solution 12 into contact with the lower surface of the substrate 4. Once the plating solution 12 contacts the lower surface of the substrate 4, the surface tension of the plating solution 12 rapidly wets the lower surface of the substrate 4 above the plating tank 1. Excess plating solution 12 overflows along the lower surface of the substrate 4 into the recovery tank 2. The plating solution 12 in the recovery tank 2 then flows out of the plating tank 1 through the liquid outlet pipe 23.

[0063] After the electroplating solution 12 contacts the lower surface of the substrate 4, the metal ions in the electroplating solution 12, under the action of the first power supply 3, gain electrons on the conductive area of ​​the lower surface of the substrate 4, forming solid metal that is deposited on the conductive area of ​​the lower surface of the substrate 4. After the upper electroplating solution surface 61 infiltrates the upper surface of the substrate 4 and contacts the upper anode 7, the metal ions gain electrons on the conductive area of ​​the upper surface of the substrate 4, forming solid metal that is deposited on the conductive area of ​​the upper surface of the substrate 4. Meanwhile, the upper anode 7 and the lower anode 13 lose electrons and dissolve in the electroplating solution 12, thus completing the redox reaction of a complete electroplating process within the system.

[0064] The integrated electroplating equipment and horizontal electroplating method can perform electrochemical plating only on the upper surface of the substrate 4, only on the lower surface of the substrate 4, or simultaneously on the upper and lower surfaces of the substrate 4.

[0065] Third embodiment:

[0066] Based on the first embodiment or the second embodiment, the third embodiment further optimizes and refines the structure of the electroplating tank 1 .

[0067] FIG7 is a side structural schematic diagram of an integrated horizontal electroplating device according to the third embodiment of the present invention.

[0068] In this embodiment, the substrate 4 may be a tunneling oxide passivated contact solar cell (TOPcon), which has a positive metal electrode (p-type metal electrode) on one surface and a negative metal electrode (n-type metal electrode) on the other surface.

[0069] In this embodiment, the p-type electrode surface of the tunneling oxide layer passivation contact solar cell (TOPcon) is downward, contacting the conductive cathode roller 21, or contacting the conductive cathode roller 21 and the non-conductive roller 11 at the same time, and the n-type electrode surface of the tunneling oxide layer passivation contact solar cell (TOPcon) is upward, and the n-type electrode surface is not electrically contacted with the upper anode 7, or is electrically contacted with the upper anode 7 through the upper electroplating liquid level 61.

[0070] As shown in FIG. 7 , the integrated horizontal electroplating equipment further includes a light source 9 , which can illuminate at least one of the upper surface and the lower surface of the substrate 4 .

[0071] In this embodiment, during the implementation of the pure light-induced electroplating process, in order to achieve the designed electroplating rate, a light source 9 with a high illumination intensity is required. Increasing the illumination intensity of light source 9 reveals the shortcomings of the pure light-induced electroplating process. For example, the use of high-power illumination equipment not only increases electricity costs but also generally requires a cooling device to dissipate the heat generated by the high-power illumination equipment. These problems in the pure light-induced electroplating process can be addressed by using the electrochemically assisted light-induced electroplating process of the present invention.

[0072] Referring to FIG7 , under the illumination of light source 9, a TOPcon solar cell generates direct current, wherein its upper surface serves as the negative electrode of the solar cell, and its lower surface serves as the positive electrode of the solar cell. As the TOPcon solar cell begins to move from the right side to the left side of FIG7 , its lower surface first contacts the conductive cathode roller 21. An upper plating liquid level 61 exists on the upper surface of the TOPcon solar cell, and after the upper anode 7 contacts the upper plating liquid level 61, electrochemically assisted light-induced plating begins on the upper surface of the TOPcon solar cell, i.e., the cathode surface of the solar cell. In other words, metal ions in the plating solution 12 receive electrons on the conductive area on the upper surface of the TOPcon solar cell, generating solid metal that is deposited on the conductive area on the upper surface of the crystalline silicon solar cell 100. After the plating solution 12 in the electroplating tank 1 contacts the lower surface of the tunneling oxide passivation contact solar cell (TOPcon), the metal ions in the plating solution 12, under the action of the first power supply 3, obtain electrons on the conductive area on the lower surface of the tunneling oxide passivation contact solar cell (TOPcon) to form solid metal, which is deposited on the conductive area on the lower surface of the substrate 4. Meanwhile, the upper anode 7 and the lower anode 13 lose electrons and dissolve in the plating solution 12, thus completing the redox reaction of a complete electroplating process within the system.

[0073] In this embodiment, during the electrochemically assisted light-induced plating process, with the assistance of a DC power supply, the plating rate on the upper surface of substrate 4 is the sum of the potential generated by the crystalline silicon solar cell under illumination by light source 9 and the potential provided by the DC power supply. This significantly reduces the illumination intensity requirement for light source 9, or in other words, overcomes the shortcomings of pure light-induced plating processes. Therefore, the electrochemically assisted light-induced plating process of the present invention has the advantage of simplifying the method and production costs of the present invention.

[0074] The integrated electroplating equipment and horizontal electroplating method can perform electrochemically assisted light-induced electroplating only on the upper surface of the substrate 4, or only on the lower surface of the substrate 4, or perform chemically assisted light-induced electroplating on both the upper and lower surfaces of the substrate 4, or perform electrochemical plating on one surface of the substrate 4 and electrochemically assisted light-induced electroplating on the other surface.

[0075] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. One-piece horizontal electroplating equipment, characterized in that: The integrated horizontal electroplating equipment includes an electroplating tank, where two or more recovery tanks are arranged, and conductive cathode rollers are arranged in the recovery tanks.

2. The integrated horizontal electroplating equipment according to claim 1, characterized in that: At least one non-conductive roller is rotatably arranged in the electroplating tank, and the non-conductive roller is located between adjacent recovery tanks. At least one conductive cathode roller is rotatably arranged in the recovery tank. The integrated horizontal electroplating equipment further includes a first power source. A lower anode is arranged in the electroplating tank. The electroplating tank is also connected to a liquid supply device. A liquid outlet pipe is arranged at the side of the electroplating tank corresponding to the recovery tank. Among them, the lower anode is connected to the positive pole of the first power source, the conductive cathode roller is connected to the negative pole of the first power source, the non-conductive roller is flush with the distal end of the conductive cathode roller. The conductive cathode roller and the non-conductive roller rotate to convey the substrate. The liquid supply device conveys electroplating solution to the electroplating tank, so that the electroplating solution wets the lower surface of the substrate and overflows the electroplating tank.

3. The integrated horizontal electroplating equipment according to claim 1 or 2, characterized in that: The integrated horizontal electroplating equipment further includes a second power source, an upper anode arranged above the substrate, and a spraying device. Among them, the upper anode is connected to the positive pole of the second power source, the conductive cathode roller is connected to the negative pole of the second power source. The conductive cathode roller and the non-conductive roller rotate to convey the substrate. The spraying device sprays electroplating solution onto the upper surface of the substrate, so that the electroplating solution wets the upper surface of the substrate and maintains the liquid level of the electroplating solution on the upper surface of the substrate.

4. The integrated horizontal electroplating equipment according to claim 2 or 3, characterized in that: The integrated horizontal electroplating equipment further includes a light source, and the light source can irradiate at least one of the upper surface and the lower surface of the substrate.

5. The integrated horizontal electroplating equipment according to claim 2, characterized in that: At least one upper pressing wheel is arranged above the conductive cathode roller.

6. The integrated horizontal electroplating equipment according to claim 2, characterized in that: The substrate is a solar cell.

7. The integrated horizontal electroplating equipment according to claim 2, characterized in that: A first rotating shaft is arranged inside the non-conductive roller, and both ends of the first rotating shaft pass through the electroplating tank. A second rotating shaft is arranged through the conductive cathode roller, and both ends of the second rotating shaft pass through the electroplating tank.

8. The integrated horizontal electroplating equipment according to claim 7, characterized in that: The conductive cathode roller is detachably connected to the electroplating tank, and the non-conductive roller is detachably connected to the electroplating tank.

9. The integrated horizontal electroplating equipment according to claim 8, wherein: First plate bodies are respectively arranged on both sides of the first rotating shaft, and the first plate bodies are clamped with both sides of the electroplating tank; second plate bodies are respectively arranged on both sides of the second rotating shaft, and the second plate bodies are clamped with both sides of the electroplating tank.

10. The integrated horizontal electroplating equipment according to claim 7, characterized in that: The integrated horizontal electroplating equipment further includes a driving assembly. The driving assembly includes a motor, a support seat, and a driving rod arranged on the side of the electroplating tank. One end of the driving rod is connected to the output end of the motor, and the other end is rotatably connected to the support seat. The driving rod meshes with the ends of the first rotating shaft and the second rotating shaft.

11. One-piece horizontal electroplating method, characterized in that: An electroplating tank is arranged below the substrate to be electroplated along the moving direction of the substrate. Two or more recovery tanks are arranged in the electroplating tank, and conductive cathode rollers are arranged in the recovery tanks. After the lower surface of the substrate to be electroplated contacts the conductive cathode roller, at least one of the lower surface and the upper surface of the substrate to be electroplated forms the cathode surface of the electroplating process.

12. The integrated horizontal electroplating method according to claim 11, characterized in that: Only when there is a lower anode below the substrate, electrochemically electroplate the lower surface of the substrate alone. When there is only an upper anode above the substrate, any one of electrochemically assisted plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the upper surface of the substrate alone; When there is a lower anode below the substrate and an upper anode above the substrate, any one of electrochemically assisted plating, photoinduced plating, and electrochemically assisted photoinduced plating is simultaneously performed on the lower surface and the upper surface of the substrate, respectively.

13. The integrated horizontal plating method according to claim 12, wherein: When any one of electrochemically assisted plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the lower surface of the substrate, the lower surface of the substrate is wetted by the plating solution in the plating tank, and a lower anode is provided in the plating tank at the same time; When any one of electrochemically assisted plating, photoinduced plating, and electrochemically assisted photoinduced plating is performed on the upper surface of the substrate, a spraying device is provided above the upper surface of the substrate, and the spraying device sprays the plating solution onto the upper surface of the substrate to wet the upper surface of the substrate with the plating solution and contact the upper anode.

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