Display apparatus and display terminal

Abstract

The present application provides a display apparatus and a display terminal. A backlight module of the display apparatus is arranged on a mounting part of a screen rear cover. A display module is arranged on a light-emitting side of the backlight module, the display module comprises an array substrate and a color filter substrate, and an electronic device is arranged in a binding area of the array substrate and is invertedly arranged in the screen rear cover. A wireless module is at least partially arranged in the binding area, and the array substrate is arranged away from the backlight module relative to the color filter substrate and covers an opening side of the screen rear cover.

Description

Display device and display terminal

[0001] This application claims priority to Chinese patent application No. 202311845536.9 filed on December 28, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display device and a display terminal. Background Art

[0003] As laptops become thinner and lighter, the materials used for the B cover (front bezel) of the entire device also tend to be lighter and thinner. This reduces the mechanical strength of the B cover and makes it more susceptible to deformation. When the device is pressed, the B cover deforms under the force, causing the adhesive to come loose at the bond with the display module, resulting in an abnormal gluing sound. In addition, common sources of abnormal display module noise when the device is shaken or pressed include: FPC (flexible printed circuit) material sounds, cell tape (adhesive tape) material sounds and adhesive sounds, and PCBA (circuit board) tape attachment sounds.

[0004] In this way, during the use of the device, the generation of abnormal sounds will reduce the user's use experience, thereby failing to meet the use requirements of the device. SUMMARY OF THE INVENTION

[0005] The embodiments of the present application provide a display device and a display terminal, which can improve the technical problem in the related art that the display device is prone to generating abnormal sounds.

[0006] The technical solutions provided in this application are as follows:

[0007] In the first aspect, an embodiment of the present application provides a display device, which includes: a screen back cover having a mounting portion; a backlight module arranged on the mounting portion; a display module arranged on the light-emitting side of the backlight module, the display module including at least an array substrate, and a color filter substrate arranged opposite to the array substrate, one end of the array substrate is longer than the color filter substrate and forms a binding area; an electronic device is fixedly arranged in the binding area of ​​the array substrate; a wireless module is at least partially arranged in the binding area, and the wireless module is used to receive inductive signals and wireless signals; wherein, the array substrate is arranged away from the backlight module relative to the color filter substrate and covers the opening side of the screen back cover, the electronic device is inverted in the screen back cover and is located at the end of the backlight module, and the electronic device, the screen back cover and the backlight module are fixed by curing glue.

[0008] In a second aspect, an embodiment of the present application provides a display terminal, which includes the above-mentioned display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0010] FIG1 is a schematic cross-sectional view of a display device provided in an embodiment of the present application.

[0011] FIG2 is a schematic diagram showing the connection between the mainboard area and the display device area of ​​the whole machine provided in an embodiment of the present application.

[0012] FIG3 is a schematic structural diagram of a display device provided in an embodiment of the present application.

[0013] The above drawings include the following reference numerals:

[0014] 10. Screen back cover; 101. Mounting portion; 11. Side wall; 12. Bottom wall;

[0015] 20. Backlight module;

[0016] 31. Array substrate; 32. Color filter substrate; 33. Polarizing layer;

[0017] 40. Binding area;

[0018] 50. Curing glue;

[0019] 60. Buffer parts;

[0020] A. Mainboard area; B. Display device area; 70. Mainboard area; 80. Signal transmitter; 90. Power management module; 100. Power coil transmitter module; 110. Inductor; 120. Driver IC; 130. Backlight driver module; 140. Signal receiver; 150. Fixing tape. Modes for Carrying Out the Invention

[0021] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0022] The present application provides a display device, comprising: a screen back cover having a mounting portion;

[0023] A backlight module is arranged on the mounting portion;

[0024] A display module is provided on the light-emitting side of the backlight module, the display module comprising at least an array substrate and a color filter substrate arranged opposite to the array substrate, one end of the array substrate being longer than the color filter substrate and forming a binding area;

[0025] an electronic device, comprising at least a power management module and a backlight driving module, wherein the electronic device is fixedly disposed in the binding area of ​​the array substrate;

[0026] a wireless module, at least partially disposed in the binding area, the wireless module in the binding area being electrically connected to the electronic device, and configured to receive an inductive signal and a wireless signal;

[0027] In which, the array substrate is arranged away from the backlight module relative to the color film substrate and covers the opening side of the screen back cover. The electronic device is inverted in the screen back cover and located at the end of the backlight module. The electronic device, the screen back cover and the backlight module are fixed by curing glue.

[0028] In one embodiment, the wireless module includes an inductor and a signal receiving component. The signal receiving component is arranged in the binding area to receive the wireless signal. The inductor is arranged below the backlight module and is electrically connected to the electronic device in the binding area.

[0029] In one embodiment, the outer sidewalls of the curing adhesive are adapted to the sidewalls of the backlight module and the display module, so as to fill the gaps between the curing adhesive and the backlight module and the display module.

[0030] In one embodiment, the curing adhesive includes insulating light-shielding adhesive.

[0031] In one embodiment, the display module further includes a polarizing layer, which is located on a side of the array substrate away from the color filter substrate, and forms a packaging side of the display device.

[0032] In one embodiment, the screen back cover has side walls and a bottom wall that are connected in sequence and arranged at an angle, the bottom wall has the mounting portion, the side wall is spaced apart from the display module, the side wall, the bottom wall, the display module and the backlight module together form a accommodating area, and the binding area and the curing glue are arranged in the accommodating area.

[0033] In one embodiment, a height of the mounting portion in the second direction is smaller than a height of the bottom wall in the second direction.

[0034] In one embodiment, the side wall and the bottom wall are an integrally formed structure, and the angle between the side wall and the bottom wall is 90°.

[0035] In one embodiment, the display device further includes a buffer component, a gap is provided between the side wall and the side wall of the array substrate, and the buffer component is located between the side wall and the side wall of the array substrate.

[0036] In one embodiment, the buffer member includes a silicone ring.

[0037] An embodiment of the present application further provides a display terminal, which includes the display device of one of the aforementioned embodiments.

[0038] In one embodiment, the display terminal also includes a complete mainboard, on which a power coil transmitting module and a signal transmitting component are provided, wherein the power coil transmitting module can transmit a wireless inductive signal to the inductive component of the display device, and the signal transmitting component can transmit a wireless signal to the signal receiving component of the display device.

[0039] In the display device and display terminal provided in the embodiments of the present application, some electronic components in the binding area are connected to the array substrate, and curing glue is provided on the periphery of the binding area, which can prevent other components from affecting the operation of the electronic components in the binding area. At the same time, multiple electronic components are integrated in the same area and a wireless module is provided in the binding area, which can reduce the use of excessive tape and electrical connection lines in the traditional layout mode. This can reduce the thickness of the frame, and use one side of the display module as the packaging side, so that the B cover can be removed, which can not only reduce the production cost of the device, but also effectively reduce the overall abnormal sound of the device.

[0040] The display device and display terminal of the present application will be described in detail below with reference to the accompanying drawings and specific implementations.

[0041] As shown in FIG1 , in the first aspect, an embodiment of the present application provides a display device, which includes: a screen back cover 10 having a mounting portion 101; a backlight module 20, which is arranged on the mounting portion 101; a display module, which is arranged on the light-emitting side of the backlight module 20, and the display module at least includes an array substrate 31 and a color filter substrate 32 arranged opposite to the array substrate 31, one end of the array substrate 31 is longer than the color filter substrate 32 and forms a binding area 40; an electronic device at least includes a power management module 90 and a backlight driving module 130, the ... The device is fixedly arranged in the binding area 40 of the array substrate 31, and the wireless module is at least partially arranged in the binding area 40. The wireless module located in the binding area is electrically connected to the electronic device, and the wireless module is used to receive inductive signals and wireless signals; wherein, the array substrate 31 is arranged away from the backlight module 20 relative to the color film substrate 32, and covers the opening side of the back cover 10 of the screen. The electronic device is inverted in the back cover 10 of the screen and is located at the end of the backlight module 20. The electronic device, the back cover 10 of the screen and the backlight module 20 are fixed by curing glue 50.

[0042] Specifically, the wireless module includes an inductor 110 and a signal receiving element 140 . The signal receiving element 140 is arranged in the binding area 40 to receive wireless signals. The inductor 110 is arranged below the backlight module 20 and is electrically connected to the electronic devices in the binding area 40 .

[0043] In the present application, the display module further includes a polarizing layer 33 , which serves as the outermost layer and plays a role of encapsulation.

[0044] By applying the technical solution of the present application, some electronic components in the binding area 40 are connected to the driver IC 120, and a curing glue 50 is provided on the periphery of the binding area 40, which can prevent other components from affecting the operation of the electronic components in the binding area 40. At the same time, multiple electronic components are integrated in the same area, which can reduce the use of excessive tape in the traditional layout mode, thereby effectively reducing the overall abnormal noise of the device.

[0045] Among them, the backlight module 20 has two settings: direct backlight and edge-entry backlight. The backlight module 20 includes a back panel and a light source. The back panel specifically includes a bottom panel and side panels. The side panels are arranged perpendicular to the bottom panel. At the same time, the backlight module 20 also includes an optical film, a light guide plate and a reflective plate, which are stacked on the bottom panel from top to bottom. The light source can be fixed to the back panel in the form of a light bar or in the form of an array arrangement. The fixing method can be gluing or other methods. This application does not specifically limit this. The light source can be a light emitting diode (LED) or other types of LEDs, such as sub-millimeter light emitting diodes (Mini Light Emitting Diode, Mini LED) or micro light emitting diodes (Micro Light Emitting Diode, Micro LED), etc. This application does not specifically limit this. In this application, it can be selected according to actual use needs, which can improve the applicability and scope of application of the device.

[0046] Specifically, the outer sidewalls of the curing adhesive 50 are adapted to the sidewalls of the backlight module 20 and the display module to fill the gaps between the curing adhesive 50 and the backlight module 20 and the display module. In the present application, the curing adhesive 50 is specifically an insulating light-shielding adhesive. This configuration not only reduces light leakage from the device, but also prevents interference from external components in the electronic components within the binding area 40, thereby ensuring stable operation of the device.

[0047] In the present application, a fixing tape 150 is provided between the backlight module 20 and the display module, and a fixing tape 150 is provided between the backlight module 20 and the mounting portion 101. This arrangement can fix the backlight module 20 and the display module to prevent the two from being displaced during the use of the device, thereby facilitating the normal operation of the device.

[0048] At the same time, the display module also includes a substrate (Glass), a buffer layer (Buffer), a gate insulating layer (GI), an interlayer dielectric layer (ILD), a planarization layer (PLN), and a pixel definition layer (PDL). The TFT may include a source metal, a semiconductor layer, a gate electrode, and a drain metal. The substrate material may include insulating materials such as glass, quartz, ceramic, plastic, and polyimide. A buffer layer may be formed on the substrate. The buffer layer material may include silicon nitride, silicon oxide, and the like. The buffer layer may be used to prevent unwanted components such as impurities or moisture from penetrating the substrate and to form a flat surface. The semiconductor layer of the TFT may be formed on the buffer layer. A gate insulating layer may be formed on the semiconductor layer and the buffer layer. The gate insulating layer material may include silicon nitride, and the like. The gate insulating layer may be photolithographically and etched to form two first through-holes penetrating the gate insulating layer. Each first through-hole may be opposite the semiconductor layer. A gate electrode may be formed on the gate insulating layer. An interlayer dielectric layer (an example of a target layer) may be formed on the gate insulating layer and the gate electrode. The interlayer dielectric layer can be photolithographically and etched to form two second through holes penetrating the interlayer dielectric layer, and each second through hole can be directly opposite to a first through hole. A metal layer can be deposited on the interlayer dielectric layer, and in the process of forming the metal layer, the material of the metal layer can also be deposited in each first through hole and the second through hole to form a conductive contact hole. The metal layer can be photolithographically and etched to form the source metal and drain metal of the TFT. Then, a conductive material layer can be deposited on the source metal and the drain metal, and the conductive material layer can be photolithographically and etched to form a third electrode. The third electrode can be electrically connected to the drain metal (or the third electrode can be electrically connected to the source metal). The source metal and the drain metal can be separated on the interlayer dielectric layer, and the source metal and the drain metal can be electrically connected to the semiconductor layer through conductive contact holes, respectively. Generally, each pixel unit will include three color blocks, namely a red color block, a green color block and a blue color block.

[0049] The semiconductor layer may include polycrystalline silicon and a heavily doped region. The semiconductor layer is divided into a channel region and source and drain regions formed on both sides of the channel region. The channel region of the semiconductor is polycrystalline silicon without doping impurities, i.e., an intrinsic semiconductor. The source and drain regions are polycrystalline silicon doped with conductive impurities, i.e., impurity semiconductors. The impurities doped in the source and drain regions can be either P-type impurities or N-type impurities.

[0050] Specifically, the screen back cover 10 has a side wall 11 and a bottom wall 12, which are connected in sequence and arranged at an angle. The bottom wall 12 has a mounting portion 101. The side wall 11 is separated from the display module by a gap. The side walls 11, bottom wall 12, display module, and backlight module 20 together form a storage area. The binding area 40 and curing adhesive 50 are disposed within the storage area. This arrangement simplifies the overall structure of the device, facilitates assembly of the device, and improves assembly efficiency.

[0051] In the present application, the angle between the side wall 11 and the bottom wall 12 is 90°. Of course, in other embodiments of the present application, the angle can also be set to 80°, 110° or other angles. The specific setting should be selected according to the use environment of the device, as long as it can meet the use requirements of the device.

[0052] Specifically, the height of the mounting portion in the second direction is less than the height of the bottom wall 12 in the second direction. This arrangement can reduce the overall height of the display module and the backlight module 20 to minimize the thickness of the display device, thereby achieving lightweight development of the device.

[0053] Furthermore, the sidewalls 11 and bottom wall 12 are integrally formed. This structure is not only easy to process, but also improves the structural strength of the device, thereby reducing the possibility of the sidewalls 11 and bottom wall 12 breaking when colliding with the outside world, thereby extending the service life of the device.

[0054] Specifically, the display device further includes a buffer member 60, with a gap between the sidewall 11 and the sidewall of the array substrate 31. The buffer member 60 is located between the sidewall 11 and the sidewall of the array substrate 31. This arrangement prevents collision between the buffer layer and the sidewall 11, thereby protecting the display module. It also prevents foreign matter from entering the accommodating cavity, thereby further ensuring stable operation of the device.

[0055] In the present application, the buffer member 60 is specifically a silicone ring.

[0056] As shown in Figures 2 and 3, in the second aspect, an embodiment of the present application provides a display terminal, which includes the above-mentioned display device. In the present application, the display terminal includes a whole machine motherboard 70 area and a display device area, the inductor 110 is specifically an induction coil, the model of the signal receiving component 140 is BCM4331, and a power coil transmitting module 100, a power management module 90, a model SC9610, SC8329, and a signal transmitting component 80 is an L-PAMID module provided on the whole machine motherboard 70. The electronic device area also includes an induction coil receiving module, a model SW5208, a driver IC 120, a model NT36532, and a backlight driver module 130, a model NT50577. The whole machine motherboard 70 area includes the whole machine motherboard 70, a signal transmitting component 80, a power management module 90, a power coil transmitting module 100, and a display device. The storage area includes a power management module 90, an inductor 110, a driver IC 120, a backlight driver module 130, and a signal receiving component 140, wherein the power management module 90 and the signal transmitting component 80 are electrically connected to the mainboard 70 of the whole machine, the power management module 90 controls the operating status of the power coil transmitting module 100, the inductor 110 can receive the inductance signal of the power coil transmitting module 100, and then transmit the signal to the power management module 90, the power management module 90 is electrically connected to the driver IC 120 and the backlight driver module 130 to provide energy thereto, the signal receiving component 140 receives the signal of the signal transmitting component 80 and transmits it to the driver IC 120 to output the display electrical signal, and the backlight driver module 130 is used to output the electrical signal.

[0057] By applying the technical solution of the present application, some electronic components in the binding area 40 are connected to the driver IC 120, and a curing glue 50 is provided on the periphery of the binding area 40, which can prevent other components from affecting the operation of the electronic components in the binding area 40. At the same time, multiple electronic components are integrated in the same area, which can reduce the use of excessive tape in the traditional layout mode, thereby effectively reducing the overall abnormal noise of the device.

[0058] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0059] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0060] In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0061] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0062] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0063] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A display device, comprising: Rear cover of the screen, having a mounting portion; Backlight module, disposed on the mounting portion; Display module, disposed on the light-emitting side of the backlight module, the display module at least includes an array substrate and a color filter substrate disposed opposite to the array substrate, one end of the array substrate is longer than the color filter substrate and forms a bonding area; Electronic device, at least including a power management module and a backlight driving module, the electronic device is fixedly disposed in the bonding area of the array substrate; Wireless module, at least partially disposed in the bonding area, the wireless module located in the bonding area is electrically connected to the electronic device, and the wireless module is used for receiving an inductive signal and a wireless signal; Wherein, the array substrate is disposed away from the backlight module relative to the color filter substrate and covers the opening side of the rear cover of the screen, the electronic device is inverted in the rear cover of the screen and located at the end of the backlight module, and the electronic device, the rear cover of the screen, and the backlight module are fixed by a curing adhesive.

2. The display device according to claim 1, wherein, The wireless module includes an inductor and a signal receiving member, the signal receiving member is disposed in the bonding area to receive the wireless signal, the inductor is disposed below the backlight module, and the inductor is electrically connected to the electronic device in the bonding area.

3. The display device according to claim 1, wherein, The outer sidewall of the curing adhesive is adapted to the sidewalls of the backlight module and the display module to fill the gap between the curing adhesive and the backlight module and the display module.

4. The display device according to claim 3, wherein, The curing adhesive includes an insulating light-shielding adhesive.

5. The display device according to claim 1, wherein, The display module further includes a polarizing layer, the polarizing layer is located on the side of the array substrate away from the color filter substrate, and the polarizing layer forms the encapsulation side of the display device.

6. The display device according to any one of claims 1-5, wherein, The rear cover of the screen has sidewalls and a bottom wall that are sequentially connected and disposed at an angle, the bottom wall has the mounting portion, there is a gap between the sidewalls and the display module, and the sidewalls, the bottom wall, the display module, and the backlight module jointly form a receiving area, and the bonding area and the curing adhesive are disposed in the receiving area.

7. The display device according to claim 6, wherein, The height of the mounting portion in the second direction is less than the height of the bottom wall in the second direction.

8. The display device according to claim 6, wherein, The sidewalls and the bottom wall are an integrally formed structure, and the included angle between the sidewalls and the bottom wall is 90°.

9. The display device according to claim 6, wherein, The display device further includes a buffer member, there is a gap between the sidewalls of the sidewalls and the array substrate, and the buffer member is located between the sidewalls of the sidewalls and the array substrate.

10. The display device according to claim 9, wherein, The buffer member includes a silicone rubber ring.

11. A display terminal, wherein, The display terminal includes the display device, and the display device includes: a rear cover of the screen, having a mounting portion; Backlight module, disposed on the mounting portion; Display module, disposed on the light-emitting side of the backlight module, the display module at least includes an array substrate and a color filter substrate disposed opposite to the array substrate, one end of the array substrate is longer than the color filter substrate and forms a bonding area; Electronic device, at least including a power management module and a backlight driving module, the electronic device is fixedly disposed in the bonding area of the array substrate; A wireless module, at least partially disposed within the bonding area, wherein the wireless module within the bonding area is electrically connected to the electronic device, and the wireless module is configured to receive an inductive signal and a wireless signal; Wherein, the array substrate is disposed away from the backlight module relative to the color filter substrate and covers the opening side of the screen back cover, the electronic device is inverted within the screen back cover and located at an end of the backlight module, and the electronic device, the screen back cover, and the backlight module are fixed by a curing adhesive.

12. The display terminal according to claim 11, wherein, The wireless module includes an inductive component and a signal receiving component, the signal receiving component is disposed within the bonding area to receive the wireless signal, the inductive component is disposed below the backlight module, and the inductive component is electrically connected to the electronic device within the bonding area.

13. The display terminal according to claim 11, wherein, The outer sidewall of the curing adhesive is adapted to the sidewalls of the backlight module and the display module to fill the gap between the curing adhesive and the backlight module and the display module.

14. The display terminal according to claim 13, wherein, The curing adhesive includes an insulating light-shielding adhesive.

15. The display terminal according to claim 11, wherein, The display module further includes a polarizing layer, the polarizing layer is located on a side of the array substrate away from the color filter substrate, and the polarizing layer forms a packaging side of the display device.

16. The display terminal according to any one of claims 11-15, wherein, The screen back cover has sidewalls and a bottom wall that are sequentially connected and disposed at an angle, the bottom wall has the mounting portion, the sidewalls and the display module have a gap, and the sidewalls, the bottom wall, the display module, and the backlight module together form a receiving area, and the bonding area and the curing adhesive are disposed within the receiving area.

17. The display terminal according to claim 16, wherein, The height of the mounting portion in the second direction is less than the height of the bottom wall in the second direction.

18. The display terminal according to claim 16, wherein, The display device further includes a buffer member, there is a gap between the sidewall of the sidewall and the sidewall of the array substrate, and the buffer member is located between the sidewall and the sidewall of the array substrate.

19. The display terminal according to claim 18, wherein, The buffer member includes a silicone rubber ring.

20. The display terminal according to claim 11, wherein The display terminal further includes a main board of the whole machine, and a power coil transmitting module and a signal transmitting member are disposed on the main board of the whole machine. Among them, the power coil transmitting module can transmit a radio inductive signal to the inductive component of the display device, and the signal transmitting member can transmit a wireless signal to the signal receiving component of the display device.

Images