Assembling device and control method therefor, and die bonding system

Abstract

The present application belongs to the technical field of automation. Disclosed are an assembling device and a control method therefor, and a die bonding system. The assembling device (000) comprises: a first acquisition mechanism (100), a second acquisition mechanism (200), a first transfer mechanism (300), a first image acquisition mechanism (400) and a bearing mechanism (500). By means of the assembling device (000), not only can a carrier substrate (010) and a support carrier (020) be assembled, arrangement data of dies carried by the carrier substrate (010), which is assembled in the support carrier (020), can also be acquired on the basis of the first image acquisition mechanism (400). In this way, when a die bonding device (001) subsequently performs die bonding on the dies carried by the carrier substrate (010), instead of photographing the carrier substrate (010) to acquire the arrangement data of the dies, the die bonding device (001) can directly acquire, on the basis of the assembling device (000), the arrangement positions of the dies carried by the carrier substrate (010), thereby effectively improving the die bonding efficiency of the die bonding device (001).

Description

Assembly equipment and control method thereof, and die bonding system

[0001] This application claims priority to Chinese patent application No. 202311863267.9 filed on December 29, 2023, entitled “Assembly Equipment, Control Method Thereof, and Crystal Bonding System,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of automation technology, and in particular to an assembly device and a control method thereof, and a die bonding system. Background Art

[0003] With the development of display technology, LED chips have become the most advantageous new generation display media due to their advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle and stable and reliable operation. Therefore, display substrates integrated with LED chips have become the most advantageous new generation display media and have been widely used.

[0004] The LED chip can usually be fixed to the driver backplane, and the LED chip fixed to the driver backplane can emit light under the driving action of the driver backplane. Usually, a die-bonding device is required to fix the LED chip to the driver backplane.

[0005] However, before using a die-bonding device to bond LED chips, the die-bonding device typically needs to photograph the carrier substrate carrying the LED chips to obtain positional information about each LED chip on the carrier substrate. Only then can the die-bonding be performed on each LED chip based on the positional information. This results in a low efficiency in the die-bonding device in securing the LED chips. Summary of the Invention

[0006] The present invention provides an assembly device, a control method thereof, and a die-bonding system. These devices can address the low efficiency of conventional die-bonding devices in securing LED chips. The technical solution is as follows:

[0007] In one aspect, an assembly device is provided, comprising:

[0008] a first acquiring mechanism, the first acquiring mechanism being configured to acquire a carrier substrate carrying a chip;

[0009] a second acquisition mechanism, the second acquisition mechanism being used to acquire a supporting carrier;

[0010] a first transfer mechanism, the first transfer mechanism being used to pick up the carrier substrate and install it into the supporting carrier;

[0011] a first image acquisition mechanism, configured to acquire arrangement data of the chips on the carrier substrate;

[0012] a carrying mechanism, the carrying mechanism being used to carry a supporting carrier on which the carrier substrate is mounted;

[0013] Before the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate, there is a relative displacement between the supporting carrier and the carrying mechanism.

[0014] Optionally, the first transfer mechanism includes: a moving component, and a first picking component and a second picking component connected to the moving component, the first picking component is used to pick up the carrier substrate, and the second picking component is used to pick up the supporting carrier;

[0015] The movable component is used to drive the first picking component to pick up the carrier substrate located on the first acquisition mechanism; the movable component is used to move in the direction toward the supporting carrier located on the second acquisition mechanism to install the carrier substrate picked up by the first picking component into the supporting carrier; the second picking component is used to pick up the supporting carrier on which the carrier substrate is installed; the movable component moves in the direction toward the supporting mechanism to place the supporting carrier on which the carrier substrate is installed on the supporting mechanism.

[0016] Optionally, the first transfer mechanism further includes: a rotating component connected to the first picking component;

[0017] The assembly device further includes a second image acquisition mechanism; the second image acquisition mechanism is located on the first transfer mechanism and is connected to the moving component; or, when the first pickup component moves to the position where the first acquisition mechanism is located, the second image acquisition mechanism is arranged opposite to the first pickup component, so that the carrier substrate is located between the first pickup component and the second image acquisition mechanism;

[0018] The second image acquisition mechanism is used to acquire an image of the carrier substrate on the first acquisition mechanism to obtain a first image; the assembly equipment is configured to determine the deflection information of the carrier substrate according to the first image, control the first pickup part to pick up the carrier substrate, and control the rotating component to drive the first pickup part to rotate or not rotate based on the deflection information.

[0019] Optionally, the deflection information includes: a deflection direction and a deflection angle; and the assembly device is configured to: when the carrier substrate needs to be rotated, control the rotating component to drive the first pickup part to rotate the deflection angle in the opposite direction of the deflection direction.

[0020] Optionally, when the chip array is arranged on the carrier substrate and has a row arrangement direction and a column arrangement direction that are perpendicular to each other, the assembly device is configured to: obtain the row arrangement direction data and / or the column arrangement direction data; when the row arrangement direction is inconsistent with a first preset direction in the system coordinate system of the assembly device, control the rotating component to drive the first picking part to rotate so that the row arrangement direction is consistent with the first preset direction in the system coordinate system of the assembly device, and / or, when the column arrangement direction is inconsistent with a second preset direction in the system coordinate system of the assembly device, control the rotating component to drive the first picking part to rotate so that the column arrangement direction is consistent with the second preset direction in the system coordinate system of the assembly device.

[0021] Optionally, the assembly equipment is configured to: after controlling the first picking-up part to pick up the carrier substrate, and controlling the rotating component to drive the first picking-up part to rotate or not rotate based on the deflection information, control the first picking-up part to place the carrier substrate back onto the first acquisition mechanism; and control the second image acquisition mechanism to re-acquire the image of the carrier substrate placed back onto the first acquisition mechanism to obtain a second image; and confirm whether the deflection information of the carrier substrate meets preset conditions based on the second image.

[0022] Optionally, the moving component includes: a support frame, a first moving portion connected to the support frame, and a second moving portion connected to the first moving portion, and the support frame is respectively connected to the second image acquisition mechanism, the first pickup component, and the second pickup component;

[0023] The first moving portion is used to drive the support frame to move in the direction of gravity, and the second moving portion is used to drive the support frame to move in a first direction perpendicular to the direction of gravity.

[0024] Optionally, the support frame includes: a first bracket and a second bracket; the first bracket is connected to the first movable part and is fixedly connected to the first image acquisition mechanism; the rotating component is located between the first bracket and the second bracket, and is respectively connected to the first bracket and the second bracket, and the first picking component and the second picking component are both distributed on the second bracket.

[0025] Optionally, the first bracket has a first light-through hole, the second bracket has a second light-through hole, the rotating component is annular, and one side of the area enclosed by the rotating component is connected to the first light-through hole, and the other side is connected to the second light-through hole; the shooting direction of the second image acquisition mechanism is toward the first light-through hole.

[0026] Optionally, the first picking component includes: a plurality of first clamping portions provided on the second bracket, and the plurality of first clamping portions are distributed around the periphery of the second light hole.

[0027] Optionally, the second picking component includes: two second clamping parts connected to two sides opposite to the second bracket.

[0028] Optionally, the assembly device further comprises: a first receiving mechanism provided corresponding to the first acquiring mechanism, and a second receiving mechanism provided corresponding to the second acquiring mechanism;

[0029] Wherein, the first receiving mechanism is used to carry the carrier substrate, and the first obtaining mechanism is used to pull the carrier substrate from the first receiving mechanism;

[0030] The second storage mechanism is used to carry the supporting carrier, and the second obtaining mechanism is used to pull the supporting carrier from the second storage mechanism.

[0031] Optionally, the first storage mechanism comprises a first accommodating space, wherein first supporting structures are stacked and arranged along the direction of gravity, and each first supporting structure is used to accommodate one carrier substrate. The first storage mechanism further comprises a first lifting mechanism, and the first lifting mechanism is used to drive the plurality of first supporting structures to move simultaneously along the direction of gravity.

[0032] The second storage mechanism has a second accommodating space, in which second supporting structures are stacked along the direction of gravity. One second supporting structure is used to distribute one supporting carrier. The second storage mechanism also includes a second lifting mechanism, which is used to drive the multiple second supporting structures to move simultaneously along the direction of gravity.

[0033] Optionally, the first image acquisition mechanism and the second image acquisition mechanism are the same image acquisition mechanism;

[0034] The moving component is used to drive the second image acquisition mechanism to move to one side of the carrying mechanism after the supporting carrier mounted with the carrier substrate is placed on the carrying mechanism;

[0035] The second image acquisition mechanism is used to photograph the carrier substrate located on the carrying mechanism.

[0036] Optionally, the carrying mechanism includes a translation assembly; the translation assembly is used to drive the carrier substrate and the supporting carrier to translate to one side of the first image acquisition mechanism after the supporting carrier mounted with the carrier substrate is transferred to the translation assembly;

[0037] The translation component is further used to drive the carrier substrate to move on a plane perpendicular to the direction of gravity during the process of acquiring the arrangement data of the chip on the carrier substrate through the first image acquisition mechanism, so that the first image acquisition mechanism can scan the carrier substrate.

[0038] Optionally, the bearing mechanism further comprises: a pressing plate located on the translation assembly, and a pressing plate moving assembly connected to the pressing plate;

[0039] The pressure plate moving assembly is used to drive the pressure plate to move to the side of the carrier substrate away from the supporting carrier after the supporting carrier mounted with the carrier substrate is placed on the supporting mechanism, so that the pressure plate contacts the carrier substrate.

[0040] Optionally, the pressing plate has a third light-through hole; wherein, in the process of acquiring the arrangement data of the chips on the carrier substrate by the first image acquisition mechanism, the chips carried by the carrier substrate are all located in the area surrounded by the third light-through hole.

[0041] Optionally, the assembly equipment further comprises: a spraying component provided on one side of the first image acquisition mechanism;

[0042] The spraying component is used to spray identification information corresponding to the carrier substrate onto the carrier substrate after the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate;

[0043] The assembly device is further configured to associate the arrangement data with identification information corresponding to the carrier substrate.

[0044] Optionally, the assembly equipment further includes: a third receiving mechanism, wherein the third receiving mechanism is used to receive the support carrier on which the carrier substrate is mounted.

[0045] Optionally, the assembly equipment further comprises: a second transfer mechanism, and a receiving mechanism corresponding to the third receiving mechanism;

[0046] The second transfer mechanism is used to transfer the support carrier mounted with the carrier substrate to the receiving mechanism after the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate; the receiving mechanism is used to transfer the support carrier mounted with the carrier substrate to the third storage mechanism.

[0047] Optionally, the carrier substrate acquired by the first acquisition mechanism includes: a carrier film for carrying the chip, and a mother-and-child ring connected to an edge portion of the carrier film.

[0048] Optionally, the assembly equipment further includes: a flipping mechanism, wherein the flipping mechanism is used to flip the carrier substrate and / or flip the supporting carrier on which the carrier substrate is mounted.

[0049] On the other hand, a die bonding system is provided, including: an assembly device, and a die bonding device cooperating with the assembly device, wherein the assembly device is the above-mentioned assembly device.

[0050] Optionally, the assembly device is used to: assemble the carrier substrate in a support carrier, and after obtaining arrangement information of the chips carried by the carrier substrate, send the arrangement information to the die bonding device;

[0051] The die-bonding device is used to fix the chips carried by the carrier substrate according to the arrangement information.

[0052] Optionally, the assembly device is further configured to: after acquiring arrangement information of the chips carried by the carrier substrate, generate an identifier corresponding to the carrier substrate, associate the arrangement information with the identifier, and then send the identifier to the die bonding device.

[0053] Optionally, the assembly device is further configured to: after generating a mark corresponding to the carrier substrate, spray corresponding mark information onto the carrier substrate;

[0054] The die bonding device is further configured to determine an identification corresponding to the carrier substrate based on identification information sprayed on the carrier substrate, and obtain arrangement data of the chips carried by the carrier substrate based on the identification corresponding to the carrier substrate.

[0055] Optionally, the die bonding system includes: a plurality of the die bonding devices, and the assembly device is communicatively connected to each of the die bonding devices;

[0056] The assembly device is used to: assemble the plurality of carrier substrates in the plurality of support carriers to obtain a plurality of support carriers mounted with the carrier substrates; wherein the plurality of support carriers mounted with the carrier substrates can be divided into: a plurality of groups of support carriers mounted with the carrier substrates corresponding one-to-one to the plurality of die-bonding devices, each group of support carriers mounted with the carrier substrates including at least one support carrier mounted with the carrier substrate;

[0057] The assembly device is further configured to: after acquiring arrangement information of the chips carried by each carrier substrate, send arrangement information corresponding to a group of support carriers mounted with the carrier substrates to a corresponding one of the die bonding devices.

[0058] In another aspect, a control method for an assembly device is provided, wherein the assembly device is the above-mentioned assembly device, and the method comprises:

[0059] Controlling the first acquisition mechanism to acquire the carrier substrate carrying the chip;

[0060] Controlling the second acquisition mechanism to acquire the support vehicle;

[0061] Controlling the first transfer mechanism to pick up the carrier substrate and install it into the supporting carrier;

[0062] controlling a first image acquisition mechanism to acquire arrangement data of the chips on the carrier substrate;

[0063] Before the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate, there is a relative displacement between the support carrier and the carrying mechanism, and the carrying mechanism is used to carry the support carrier with the carrier substrate installed thereon.

[0064] Optionally, before controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further includes:

[0065] The first transfer mechanism is controlled to transfer the support carrier mounted with the carrier substrate to the carrying mechanism.

[0066] Optionally, in the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further simultaneously performs at least one of the following processes:

[0067] controlling the first acquiring mechanism to acquire the next carrier substrate;

[0068] controlling the second acquisition mechanism to acquire the next supporting vehicle;

[0069] controlling the first transfer mechanism to pick up the next carrier substrate and install it into the next supporting carrier;

[0070] And / or, in the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further simultaneously performs at least one of the following processes:

[0071] controlling the second transfer mechanism to transfer the previous support carrier with the carrier substrate mounted thereon to the collecting mechanism;

[0072] The collecting mechanism is controlled to transfer the last supporting carrier mounted with the carrier substrate to a third receiving mechanism.

[0073] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0074] An assembly device includes a first acquisition mechanism, a second acquisition mechanism, a first transfer mechanism, a first image acquisition mechanism, and a carrier mechanism. This assembly device not only enables assembly between a carrier substrate and a support carrier, but also allows, based on the first image acquisition mechanism, to acquire the arrangement data of chips carried by the carrier substrate assembled in the support carrier. This allows subsequent die bonding of the chips carried by the carrier substrate by a die bonding device to directly acquire the arrangement positions of the chips carried by the carrier substrate based on the assembly device, eliminating the need for the die bonding device to acquire the chip arrangement data by photographing the carrier substrate. This effectively improves the die bonding efficiency of the die bonding device. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0076] FIG1 is a schematic structural diagram of an assembly device provided in an embodiment of the present application;

[0077] FIG2 is a schematic diagram of a first acquisition mechanism supporting a carrier substrate provided by an embodiment of the present application;

[0078] FIG3 is a schematic structural diagram of a carrier substrate provided in an embodiment of the present application;

[0079] FIG4 is a schematic diagram of a second acquisition mechanism carrying a support carrier provided in an embodiment of the present application;

[0080] FIG5 is a schematic diagram of a carrier substrate provided in an embodiment of the present application installed in a supporting vehicle;

[0081] FIG6 is a schematic structural diagram of another assembly device provided in an embodiment of the present application;

[0082] FIG7 is a front view of a first storage mechanism provided in an embodiment of the present application;

[0083] FIG8 is a schematic structural diagram of a first transfer mechanism provided in an embodiment of the present application;

[0084] FIG9 is a top view of a carrying mechanism provided in an embodiment of the present application;

[0085] FIG10 is a structural block diagram of a die bonding system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0086] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0087] Please refer to Figure 1, which is a schematic diagram of the structure of an assembly device provided in an embodiment of the present application. The assembly device 000 may include: a first acquisition mechanism 100, a second acquisition mechanism 200, a first transfer mechanism 300, a first image acquisition mechanism 400, and a carrying mechanism 500.

[0088] The first acquisition mechanism 100 in the assembly device 000 is used to acquire the carrier substrate 010. In order to more clearly see the structure of the carrier substrate 010, please refer to Figure 2, which is a schematic diagram of a first acquisition mechanism supporting the carrier substrate provided in an embodiment of the present application. After the first acquisition mechanism 100 acquires the carrier substrate 010, the carrier substrate 010 can be distributed on the first acquisition mechanism 100. Among them, the carrier substrate 010 can carry a chip a. For example, the carrier substrate 010 can have a setting area Q, and the number of chips a carried by the carrier substrate 010 is multiple, and the multiple chips a can be arranged in an array within the setting area Q of the carrier substrate 010. Here, the chip a carried by the carrier substrate 010 can be an LED chip, which can be a regular-sized LED chip, a mini light-emitting diode (English: mini Light-Emitting Diode, abbreviated: mini-LED) chip, or a micro LED (English: Micro Light-Emitting Diode, abbreviated: Micro-LED) chip. This embodiment of the present application does not limit this.

[0089] In one possible implementation, as shown in FIG3 , which is a schematic structural diagram of a carrier substrate provided in an embodiment of the present application, carrier substrate 010 may include: a carrier film 011, and a mother-and-child ring 012 connected to the edge of carrier film 011. Here, a mounting area Q may be provided in the central portion of carrier film 011, that is, the central portion of carrier film 011 may support multiple chips a. Each position of the edge of carrier film 011 may be connected to mother-and-child ring 012, so that mother-and-child ring 012 can tighten the entire carrier film 011, thereby facilitating subsequent die bonding of the chips a supported by carrier film 011.

[0090] The second acquisition mechanism 200 in the assembly apparatus 000 is used to acquire the support carrier 020. To more clearly illustrate the structure of the support carrier 020, please refer to FIG4 , which is a schematic diagram of a second acquisition mechanism carrying the support carrier provided in an embodiment of the present application. After the second acquisition mechanism 200 acquires the support carrier 020, the support carrier 020 can be distributed on the second acquisition mechanism 200. The support carrier 020 can have a hollowed-out mounting area P that matches the shape of the carrier substrate 010.

[0091] The first transfer mechanism 300 in the assembly apparatus 000 is used to pick up the carrier substrate 010 and install it in the support carrier 020. For example, the first transfer mechanism 300 in the assembly apparatus 000 can first move in a direction toward the first acquisition mechanism 100, so that the first transfer mechanism 300 picks up the carrier substrate 010 on the first acquisition mechanism 100; then, the first transfer mechanism 300 in the assembly apparatus 000 can move together with the picked-up carrier substrate 010 in a direction toward the second acquisition mechanism 200, so that the first transfer mechanism 300 can install the picked-up carrier substrate 010 in the installation area P of the support carrier 020, thereby achieving assembly between the carrier substrate 010 and the support carrier 020.

[0092] For example, as shown in Figures 4 and 5, Figure 5 is a schematic diagram of a carrier substrate installed in a support carrier according to an embodiment of the present application. A plurality of elastic clips S are provided within the mounting area P of the support carrier 020, and the mounting area P of the support carrier 020 also has a step structure T, which is used to support the parent ring 012 of the carrier substrate 010.

[0093] In this case, the mother-and-child ring 012 in the carrier substrate 010 can pass through the step structure T and then be supported on the step structure T of the mounting area P. In this way, one side of the mother-and-child ring 012 in the carrier substrate 010 can be placed on the step structure T, and the other side of the mother-and-child ring 012 in the carrier substrate 010 can be clamped to the mounting area P of the support carrier 020 by a plurality of elastic buckles S.

[0094] The first image acquisition mechanism 400 in the assembly apparatus 000 is used to acquire the arrangement data of the chips a on the carrier substrate 010. Here, the first image acquisition mechanism 400 can be a camera. After the first image acquisition mechanism 400 captures the carrier substrate 010, an image containing the carrier substrate 010 is obtained. After analyzing and processing the image, the arrangement data of the chips a on the carrier substrate 010 can be acquired. For example, the arrangement data of the chips a on the carrier substrate 010 can include: the position information of each chip a carried by the carrier substrate 010 within the arrangement area Q of the carrier substrate 010. For example, the position information of each chip a within the arrangement area Q of the carrier substrate 010 can be represented by coordinate values. Here, after the position information of each chip a within the arrangement area Q of the carrier substrate 010 is identified by coordinate values, the coordinate values ​​of each chip a can be coordinate values ​​within the coordinate system of the first image acquisition mechanism 400.

[0095] The carrying mechanism 500 in the assembly apparatus 000 is used to carry the support carrier 020 on which the carrier substrate 010 is mounted.

[0096] Before the first image acquisition mechanism 400 acquires the arrangement data of the chips on the carrier substrate 010 , there is a relative displacement between the support carrier 020 and the carrying mechanism 500 .

[0097] In one possible implementation, after the carrier substrate 010 and the support carrier 020 are assembled by the first transfer mechanism 300, the first transfer mechanism 300 can pick up the support carrier 020 with the carrier substrate 010 mounted thereon and transfer the support carrier 020 with the carrier substrate 010 mounted thereon to the carrier mechanism 500. Here, the first image acquisition mechanism 400 can be positioned above the carrier mechanism 500 so that the first image acquisition mechanism 400 can capture the carrier substrate 010 mounted on the support carrier 020, and further, can acquire the arrangement data of the chip a on the carrier substrate 010 based on the captured image.

[0098] In the embodiment of the present application, the assembly device 000 can not only realize the assembly between the carrier substrate 010 and the support carrier 020, but also obtain the arrangement data of the chips a carried by the carrier substrate 010 assembled in the support carrier 020 according to the first image acquisition mechanism 400. In this way, when the chips a carried by the carrier substrate 010 are subsequently bonded by the die bonding device, the die bonding device can directly obtain the arrangement position of the chips a carried by the carrier substrate 010 based on the assembly device 000, without the die bonding device having to obtain the chip arrangement data by photographing the carrier substrate 010, thereby effectively improving the die bonding efficiency of the die bonding device.

[0099] Optionally, as shown in FIG6 , FIG6 is a schematic structural diagram of another assembly device provided in an embodiment of the present application. The assembly device 000 may further include: a first storage mechanism 600 and a second storage mechanism 700. Here, the first storage mechanism 600 may be arranged corresponding to the first acquisition mechanism 100, and the first storage mechanism 600 may be used to carry multiple carrier substrates, and the first acquisition mechanism 100 may pull the carrier substrate from the first storage mechanism 600. Similarly, the second storage mechanism 700 may be arranged corresponding to the second acquisition mechanism 200, and the second storage mechanism 700 may carry multiple support carriers, and the second acquisition mechanism 200 may pull the support carrier from the second storage mechanism 700. It should be noted that the process of the first acquisition mechanism 100 pulling the carrier substrate from the first storage mechanism 600 and the process of the second acquisition mechanism 200 pulling the support carrier from the second storage mechanism 700 can be carried out simultaneously, which can effectively improve the efficiency of assembly between the carrier substrate and the support carrier.

[0100] For example, as shown in FIG7 , which is a front view of a first storage mechanism provided in an embodiment of the present application, the first storage mechanism 600 in the assembly device 000 may have a first accommodating space 601, and first support structures 602 stacked along the gravity direction Z may be distributed within the first accommodating space 601, with each first support structure 602 being distributed on a carrier substrate 010. Here, the first storage mechanism 600 may also include a first lifting structure that can drive multiple first support structures 602 to move simultaneously along the gravity direction Z. For example, the first lifting structure can drive the first storage mechanism 600 to move in the gravity direction Z as a whole, so that the multiple first support structures 602 within the first storage mechanism 600 and the carrier substrates 010 supported by each of them can move simultaneously in the gravity direction Z.

[0101] In the present application, the first acquisition mechanism 100 in the assembly apparatus 000 may further include: a first support frame, and a first drive structure connected to the first support frame. Here, the first drive structure can drive the first support frame to move in a second direction Y perpendicular to the direction of gravity Z. Furthermore, the first acquisition mechanism 100 and the first storage mechanism 600 can be arranged in the second direction Y. Thus, after the first support frame moves toward the first storage mechanism 600, it can extend into the first accommodating space 601 of the first storage mechanism 600.

[0102] In this case, the lifting structure in the first storage mechanism 600 drives the first storage mechanism 600 to move in the direction of gravity, so that after a carrier substrate 010 carried by a first supporting structure 602 is moved to a specified position, the first driving structure in the first acquisition mechanism 100 can drive the first support frame to move toward the first storage mechanism 600, so that the first support frame extending into the first accommodating space 601 of the first storage mechanism 600 can pull the carrier substrate 010 moved to the specified position. Then, the first driving structure drives the first support frame to move away from the first storage mechanism 600, and the carrier substrate 010 can be removed from the first storage mechanism 600. The removed carrier substrate 010 can be distributed on the first support frame in the first acquisition mechanism 100.

[0103] In the present application, the second storage mechanism 700 has a second accommodating space, in which second support structures are stacked and arranged along the direction of gravity. Each second support structure is used to distribute a support carrier. The second storage mechanism also includes a second lifting mechanism, which is used to drive multiple second support structures to move simultaneously along the direction of gravity. It should be noted that since the structures of the first acquisition mechanism 100 and the second acquisition mechanism 200 are similar, the structures of the first storage mechanism 600 and the second storage mechanism 700 are similar. Therefore, the way in which the second acquisition mechanism 200 acquires the support carrier from the second storage mechanism 700 can refer to the way in which the first acquisition mechanism 100 acquires the carrier substrate from the first storage mechanism 600, and will not be repeated here.

[0104] It should also be noted that after the first storage mechanism 600 has received a plurality of carrier substrates 010, it can be manually moved to the side of the first acquisition mechanism 100 so that the first acquisition mechanism 100 can acquire the carrier substrates 010 from the first storage mechanism 600. Similarly, after the second storage mechanism 700 has received a plurality of support carriers 020, it can be manually moved to the side of the second acquisition mechanism 200 so that the second acquisition mechanism 200 can acquire the support carriers 020 from the second storage mechanism 700.

[0105] In the embodiment of the present application, as shown in FIG8 , which is a schematic structural diagram of a first transfer mechanism provided by the embodiment of the present application, the first transfer mechanism 300 may include: a moving component 301 , and a first pickup component 302 and a second pickup component 303 connected to the first moving component 301 .

[0106] Here, the first pickup component 302 in the first transfer mechanism 300 is used to pick up the carrier substrate 010. The second pickup component 303 in the first transfer mechanism 300 is used to pick up the support carrier 020. The moving component 301 in the first transfer mechanism 300 can drive the first pickup component 302 and the second pickup component 303 to move along the gravity direction Z, or can drive the first pickup component 302 and the second pickup component 303 to move along a first direction X that is perpendicular to the gravity direction Z and perpendicular to the second direction Y.

[0107] Specifically, the first picking component 302 can pick up the carrier substrate 010 by clamping; the second picking component 303 can pick up the supporting carrier 020 by clamping.

[0108] In the present application, the movable component 301 is used to drive the first picking component to pick up the carrier substrate 010 located on the first acquisition mechanism 100; the movable component 301 is used to move in the direction toward the support carrier 020 located on the second acquisition mechanism 200 to install the carrier substrate 010 picked up by the first picking component 302 into the support carrier 020; the second picking component 303 is used to pick up the support carrier 020 with the carrier substrate 010 installed; the movable component 301 moves in the direction toward the carrying mechanism 500 to place the support carrier 020 with the carrier substrate 010 installed on the carrying mechanism.

[0109] For example, the assembly equipment 000 can be configured as follows: first, the moving part 301 in the first transfer mechanism 300 is controlled to drive the first picking part 302 to pick up the carrier substrate 010 located on the first acquisition mechanism 100; then, the moving part 301 in the first transfer mechanism 300 is controlled to move in the direction toward the support carrier 020 located on the second acquisition mechanism 200, so as to install the carrier substrate 010 picked up by the first picking part 302 into the support carrier 020, and control the second picking part 303 to pick up the support carrier 020 with the carrier substrate 010 installed; then, the moving part 301 in the first transfer mechanism 300 is controlled to move in the direction toward the carrying mechanism 500, so as to place the support carrier 020 with the carrier substrate 010 installed on the carrying mechanism 500. In this way, the first transfer mechanism 300 in the assembly equipment 000 can not only realize the assembly between the carrier substrate 010 and the supporting carrier 020, but the first transfer mechanism 300 can also transfer the supporting carrier 020 installed with the carrier substrate 010 to the carrying mechanism 500, so as to obtain the arrangement data of the chip a on the carrier substrate 010 by the first image acquisition mechanism 400.

[0110] For example, after the first acquisition mechanism 100 acquires the carrier substrate 010 and the second acquisition mechanism 200 acquires the support carrier 020, the movable component 301 in the first transfer mechanism 300 can first move above the first acquisition mechanism 100 in the first direction X, and then move toward the first acquisition mechanism 100 in the gravity direction Z, so that the first pickup component 302 in the first transfer mechanism 300 can pick up the carrier substrate 010 on the first acquisition mechanism 100. Thereafter, the movable component 301 in the first transfer mechanism 300 can drive the first pickup component 302, which has picked up the carrier substrate 010, to move away from the first acquisition mechanism 100 in the gravity direction Z, and then move above the second acquisition mechanism 200 in the first direction X. Then, the moving component 301 in the first transfer mechanism 300 can drive the first pickup component 302, which has picked up the carrier substrate 010, to move in the gravity direction Z toward the second acquisition mechanism 200, so that the carrier substrate 010 can be assembled into the support carrier 020 located on the second acquisition mechanism 200, completing the assembly between the carrier substrate 010 and the support carrier 020. Next, the second pickup component 303 in the first transfer mechanism 300 can pick up the support carrier 020 with the carrier substrate 010 mounted thereon, and the moving component 301 can drive the second pickup component 303, which has picked up the support carrier 020, to move away from the second acquisition mechanism 200 in the gravity direction Z, and then move in the first direction X to above the supporting mechanism 500. Finally, the moving component 301 in the first transfer mechanism 300 can drive the second picking component 303 that picks up the supporting carrier 020 to move toward the carrying mechanism 500 in the gravity direction Z, so that the supporting carrier 020 mounted with the carrier substrate 010 is placed on the carrying mechanism 500.

[0111] In the embodiment of the present application, as shown in Figure 8, the first transfer mechanism 300 may further include a rotating component 304 connected to the first pickup component 302. The assembly device 000 may further include a second image acquisition mechanism 1200. Here, the second image acquisition mechanism 1200 may be a camera.

[0112] In one possible scenario, as shown in FIG8 , the second image capturing mechanism 1200 can be located on the first moving mechanism 300 and can be connected to the moving component 301 in the first moving mechanism 300. In this case, the second image capturing mechanism 1200 can move along with the moving component 301 in the first moving mechanism 300. In this case, the second image capturing mechanism 1200 can capture images from top to bottom in the direction of gravity Z.

[0113] In another possible scenario, the second image capture mechanism 1200 may not move along with the moving component 301 in the first transfer mechanism 300. For example, if the first pickup component 302 in the first transfer mechanism 300 moves to the location of the first capture mechanism 100, the second image capture mechanism 1200 may be positioned opposite the first pickup component 302, such that the carrier substrate 010 on the first capture mechanism 100 is positioned between the first pickup component 302 and the second image capture mechanism 1200. In this case, the second image capture mechanism 1200 can still capture the carrier substrate 010. In this case, the second image capture mechanism 1200 may be fixed to the first capture mechanism 100 and can capture images from bottom to top in the direction of gravity Z.

[0114] In the present application, after the first acquisition mechanism 100 acquires the carrier substrate 010, the position of the carrier substrate 010 on the first acquisition mechanism 100 may deflect. To ensure high accuracy in the subsequent acquisition of chip arrangement data carried by the carrier substrate 010 by the second image acquisition mechanism 1200, the deflection of the carrier substrate 010 needs to be calibrated by the first transfer mechanism 300 before the carrier substrate 010 is assembled with the support carrier 020. To this end, before the carrier substrate 010 is assembled with the support carrier 020, the second image acquisition mechanism 1200 can be used to acquire an image of the carrier substrate 010 on the first acquisition mechanism 100 to obtain a first image. The assembly apparatus 000 can be configured to determine deflection information of the carrier substrate 010 based on the first image, control the first pickup component 302 to pick up the carrier substrate 010, and control the rotation component 304 to rotate or not rotate the first pickup portion 302 based on the deflection information. It can be understood that, based on the image of the carrier substrate 010 obtained by the first image, when deflection is not required, the assembly device 000 can be configured to directly control the first picking component 302 to pick up this carrier substrate 010, and control the moving component 301 to move in the direction toward the support carrier 020 located on the second acquisition mechanism 200, so as to install the carrier substrate 010 picked up by the first picking component 302 into the support carrier 020.

[0115] The following embodiments provide two exemplary implementations to illustrate the deflection calibration process:

[0116] In a first exemplary implementation, when the first pickup component 302 in the first transfer mechanism 300 is moved to the location of the first acquisition mechanism 100, the second image acquisition mechanism 1200 can be positioned opposite the first pickup component 302, such that the carrier substrate 010 on the first acquisition mechanism 100 can be positioned between the first pickup component 302 and the second image acquisition mechanism 1200. That is, when the second image acquisition mechanism 1200 is fixed to the first acquisition mechanism 100, before the carrier substrate 010 is assembled with the support carrier 020 via the first transfer mechanism 300, the moving component 301 in the first transfer mechanism 300 can first be moved in the first direction X to the upper portion of the first acquisition mechanism 100. The first pickup component 302 in the first transfer mechanism 300 then picks up the carrier substrate 010 on the first acquisition mechanism 100. After picking up the carrier substrate 010, the moving component 301 in the first transfer mechanism 300 can then be moved away from the first acquisition mechanism 100 in the direction of gravity Z. Afterwards, the second image acquisition mechanism 1200 captures the carrier substrate 010 on the first acquisition mechanism 100 to obtain a first image (for example, at this point, the carrier substrate 010 is located at the in-focus position of the second image acquisition mechanism 1200). The assembly apparatus 000 can then analyze this first image to obtain deflection information regarding the carrier substrate 010. Based on this deflection information regarding the carrier substrate 010, the assembly apparatus 000 can then control the rotating component 304 in the first transfer mechanism 300, causing the rotating component 304 to rotate the first pickup component 302 and the picked-up carrier substrate 010. After the rotating component 304 rotates the carrier substrate 010, the deflection of the carrier substrate 010 can be calibrated.

[0117] In a second exemplary implementation, when the second image acquisition mechanism 1200 is connected to the moving component 301 in the first moving mechanism 300, the moving component 301 in the first transfer mechanism 300 can simultaneously drive the first pickup component 302, the second pickup component 303, the second image acquisition mechanism 1200, and the rotating component 304 to move in the first direction X, and can also simultaneously drive the first pickup component 302, the second pickup component 303, the second image acquisition mechanism 1200, and the rotating component 304 to move in the gravity direction Z. The rotating component 304 in the first transfer mechanism 300 can drive the first pickup component 302 to rotate in a clockwise direction or a counterclockwise direction.

[0118] For example, before the carrier substrate 010 is assembled with the support carrier 020 via the first transfer mechanism 300, the movable component 301 of the first transfer mechanism 300 can be moved in the first direction X to above the first acquisition mechanism 100. The second image acquisition mechanism 1200 of the first transfer mechanism 300 can then capture the carrier substrate 010 on the first acquisition mechanism 100 to obtain a first image. The assembly apparatus 000 can then analyze this first image to obtain deflection information regarding the carrier substrate 010. The movable component 301 of the first transfer mechanism 300 can then be moved toward the first acquisition mechanism 100 in the direction of gravity Z, allowing the first pickup component 302 to pick up the carrier substrate 010 on the first acquisition mechanism 100. After picking up the carrier substrate 010, the movable component 301 of the first transfer mechanism 300 can be moved away from the first acquisition mechanism 100 in the direction of gravity Z. Next, the assembly apparatus 000 controls the rotating component 304 of the first transfer mechanism 300 based on the deflection information of the carrier substrate 010, so that the rotating component 304 rotates the first pickup component 302 and the picked-up carrier substrate 010. After the rotating component 304 rotates the carrier substrate 010, the deflection of the carrier substrate 010 can be calibrated.

[0119] It should be noted that after calibrating the deflection of the carrier substrate 010, the first transfer mechanism 300 can directly transfer the deflection-calibrated carrier substrate 010 to the top of the second acquisition mechanism 200 via the first pickup component 302 for installation on the support carrier 020 on the second acquisition mechanism 200. Alternatively, the first transfer mechanism 300 can reposition the deflection-calibrated carrier substrate 010 on the first acquisition mechanism, allowing the rotation mechanism 304 in the first transfer mechanism 300 to return to its pre-rotation position, and then transfer the carrier substrate 010 to the top of the second acquisition mechanism 200 for installation on the support carrier 020 on the second acquisition mechanism 200.

[0120] In this application, the deflection information of the carrier substrate 010 may include a deflection position and a deflection angle. The deflection position of the carrier substrate 010 indicates whether the carrier substrate 010 on the first acquisition mechanism 100 is deflected clockwise or counterclockwise. The deflection angle of the carrier substrate 010 indicates the angle at which the carrier substrate 010 on the first acquisition mechanism 100 is deflected along the deflection position.

[0121] It should be noted that after the assembly apparatus 000 acquires the deflection information of the carrier substrate 010 based on the first image captured by the second image acquisition mechanism 1200, the assembly apparatus 000 can determine whether it is necessary to subsequently control the rotation of the carrier substrate 010 using the rotation component 304 based on the deflection angle in the deflection information of the carrier substrate 010. For example, if it is determined that the deflection angle in the deflection information of the carrier substrate 010 is greater than a preset angle threshold (e.g., 0.5°), it is necessary to subsequently control the rotation of the carrier substrate 010 using the rotation component 304; if it is determined that the deflection angle in the deflection information of the carrier substrate 010 is greater than the preset angle threshold, it is not necessary to subsequently control the rotation of the carrier substrate 010 using the rotation component 304.

[0122] For example, as shown in FIG2 , the number of chips a carried on the carrier substrate 010 can be multiple, and these chips a can be arranged in an array on the carrier substrate 010. To this end, the chips a carried on the carrier substrate 010 have mutually perpendicular row and / or column arrangement directions. In this case, the assembly apparatus 000 can be configured to: obtain row arrangement direction data and / or column arrangement direction data of the chips a carried by the carrier substrate 010; if the row arrangement direction is inconsistent with a first preset direction in the system coordinate system of the assembly apparatus 000, control the rotating component 304 to drive the first pickup unit 302 to rotate so that the row arrangement direction of the chips a is consistent with the first preset direction in the system coordinate system of the assembly apparatus 000; and / or, if the column arrangement direction is inconsistent with a second preset direction in the system coordinate system of the assembly apparatus 000, control the rotating component 304 to drive the first pickup unit 302 to rotate so that the column arrangement direction of the chips a is consistent with the second preset direction in the system coordinate system of the assembly apparatus 000.

[0123] In one possible scenario, after the assembly apparatus 000 acquires a first image including the carrier substrate 010 located on the first acquisition mechanism 100, the assembly apparatus 000 may analyze the first image to determine the deflection position and angle of the row arrangement direction of the chips a relative to a first preset direction in the system coordinate system of the assembly apparatus 000, and may also determine the deflection position and angle of the column arrangement direction of the chips a relative to a second preset direction in the system coordinate system of the assembly apparatus 000. Here, the deflection position and angle of the row arrangement direction of the chips a relative to the first preset direction, and / or the deflection position and angle of the column arrangement direction of the chips a relative to the second preset direction, may be used as the deflection information of the carrier substrate 010.

[0124] To this end, when the deflection angle of the row arrangement direction of chip a relative to the first preset direction is large (for example, greater than 0.5°), and / or the deflection angle of the column arrangement direction of chip a relative to the second preset direction is large (for example, greater than 0.5°), the assembly equipment 000 needs to control the rotating part 304 to drive the first picking part 302 and the carrier part picked up by it to rotate together.

[0125] In other possible implementations, since the chips carried by the carrier substrate 010 are all distributed within the arrangement area Q of the carrier substrate 010, and the arrangement area Q is rectangular in shape, after the assembly apparatus 000 acquires a first image including the carrier substrate 010 located on the first acquisition mechanism 100, the assembly apparatus 000 can analyze the first image and identify the arrangement area Q of the carrier substrate 010 in the first image to determine the deflection direction and deflection angle of the long side of the arrangement area Q relative to a first preset direction in the system coordinate system of the assembly apparatus 000. Alternatively, the deflection direction and deflection angle of the short side of the arrangement area Q relative to a second preset direction in the system coordinate system of the assembly apparatus 000 can be determined. In this case, the deflection direction and deflection angle of the long side of the arrangement area Q relative to the first preset direction, and / or the deflection direction and deflection angle of the short side of the arrangement area Q relative to the second preset direction, can be used as the deflection information of the carrier substrate 010.

[0126] In the present application, after the assembly device 000 obtains the deflection information of the carrier substrate 010 and determines that the carrier substrate 010 needs to be rotated, the assembly device 000 can control the carrier substrate 010 to rotate according to the deflection information. For example, the assembly device 000 can be configured to: when the carrier substrate 010 needs to be rotated, control the rotating component 304 to drive the first pickup component 302 to rotate in the opposite direction of the deflection direction in the deflection information of the carrier substrate 010 by the deflection angle in the deflection information.

[0127] For example, if the assembly device 000 obtains deflection information of the carrier substrate 010 of 5° in the clockwise direction, after the assembly device 000 picks up the deflected carrier substrate 010 via the first pickup component 302, the assembly device 000 can control the rotating component 304 to rotate the first pickup component 302 and the picked-up carrier substrate 010 by 5° in the counterclockwise direction. In this way, the position of the deflected carrier substrate 010 obtained by the first acquisition mechanism 100 can be calibrated.

[0128] In an embodiment of the present application, the assembly device 000 can also be configured to: after controlling the first picking component 302 to pick up the carrier substrate 010, and controlling the rotating component 304 to drive the first picking component 302 to rotate or not rotate based on the deflection information of the carrier substrate 010, control the first picking component 302 to place the carrier substrate 010 back onto the first acquisition mechanism 100; and control the second image acquisition mechanism 1200 to re-acquire the image of the carrier substrate 010 placed back on the first acquisition mechanism 302 to obtain a second image; and confirm whether the deflection information of the carrier substrate meets the preset conditions based on the second image.

[0129] For example, after the rotating component 304 in the first transfer mechanism 300 drives the first pickup component 302 and the picked-up carrier substrate 010 to rotate together, the moving component 301 in the first transfer mechanism 300 can move toward the first acquisition mechanism 100 in the direction of gravity Z, so that the first acquisition mechanism 302 can place the carrier substrate 010 back onto the first acquisition mechanism 100. Then, the moving component 301 in the first transfer mechanism 300 can first move away from the first acquisition mechanism 100 in the direction of gravity Z, and then the second image acquisition mechanism 1200 can capture the carrier substrate 010, which has been placed back onto the first acquisition mechanism 100, to obtain a second image. The assembly apparatus 000 can then analyze this second image to determine deflection information of the carrier substrate 010. If the deflection angle in the deflection information of the carrier substrate 010 is not greater than the preset deflection angle threshold, the assembly device 000 can determine that the deflection information of the carrier substrate 010 meets the preset condition, and there is no need to control the rotation of the carrier substrate 010, and the assembly process between the carrier substrate 010 and the support carrier 020 can be entered. If the deflection angle in the deflection information of the carrier substrate 010 is not greater than the preset deflection angle threshold, the assembly device 000 can determine that the deflection information of the carrier substrate 010 meets the preset condition, and there is no need to control the rotation of the carrier substrate 010, and the assembly process between the carrier substrate 010 and the support carrier 020 can be entered. If the deflection angle in the deflection information of the carrier substrate 010 is still greater than the preset deflection angle threshold, the assembly device 000 can determine that the deflection information of the carrier substrate 010 does not meet the preset condition, and it is necessary to control the rotation of the carrier substrate 010 according to the above process.

[0130] Optionally, as shown in Figure 8 , the movable component 301 in the first transfer mechanism 300 may include a support frame 3011, a first movable portion 3012, and a second movable portion 3013. Here, the first movable portion 3012 may be connected to the support frame 3011, and the second movable portion 3013 may be connected to the first movable portion 3012. Furthermore, the support frame 3011 in the movable component 301 may be connected to the second image acquisition mechanism 1200, the first pickup component 302, and the second pickup component 303, respectively.

[0131] The first moving portion 3012 of the moving component 301 is used to drive the support frame 3011 to move in the gravity direction Z. The second moving portion 3013 of the moving component 301 is used to drive the support frame 3011 to move in a first direction X perpendicular to the gravity direction Z.

[0132] For example, since the second image capturing mechanism 1200, the first pickup component 302, and the second pickup component 303 in the first transfer mechanism 300 are all distributed on the support frame 3011, when the first moving portion 3012 drives the support frame 3011 to move in the gravity direction Z, the second image capturing mechanism 1200, the first pickup component 302, and the second pickup component 303 can all move together with the support frame 3011 in the gravity direction Z. Furthermore, since the first moving portion 3012 in the moving portion 301 is connected to the second moving portion 3013, when the second moving portion 3013 moves in the first direction X, the first moving portion 3012, the support frame 3011 connected thereto, and the second image capturing mechanism 1200, the first pickup component 302, and the second pickup component 303 distributed on the support frame 3011 can all move together in the first direction X.

[0133] It should be noted that the assembly device 000 may further include a guide rail extending along the first direction X. The second movable portion 3013 in the movable component 301 may be slidably connected to the guide rail, and a drive structure is provided within the second movable portion 3013. Driven by this drive structure, the second movable portion 3013 can slide on the guide rail, thereby allowing the entire first transfer mechanism 300 to move along the first direction X. Here, the driving principle of the drive structure in the second movable portion 3013 can be implemented using a transmission structure such as a screw nut, a gear rack, etc. This embodiment of the present application is not limited to this.

[0134] The first movable part 3012 also includes a corresponding driving structure. Driven by this driving structure, the first movable part 3012 can drive the support frame 3011 to move in the gravity direction Z. Here, the driving principle of the driving structure in the first movable part 3012 can also be implemented using a transmission structure such as a screw nut, a gear rack, etc. This embodiment of the present application is not limited to this.

[0135] Optionally, the support frame 3011 in the first transfer mechanism 300 may include: a first bracket 3011a and a second bracket 3011b.

[0136] The first bracket 3011a can be connected to the first moving portion 3012 and fixedly connected to the first image acquisition mechanism 304. In this way, when the first moving portion 3012 drives the first bracket 3011a to move in the gravity direction Z, the first image acquisition mechanism 304 fixed to the first bracket 3011a can also move in the gravity direction Z.

[0137] The rotating component 304 in the first transfer mechanism 300 can be located between the first bracket 3011a and the second bracket 3012, and connected to the first bracket 3011 and the second bracket 3012 respectively. The first picking component 302 and the second picking component 303 in the first transfer mechanism 300 can both be distributed on the second bracket 3011b.

[0138] Here, the first picking-up member 302 may be connected to the rotating member 304 , and the second picking-up member 303 may be connected to the second bracket 3011 b .

[0139] Exemplarily, the rotating component 304 in the first transfer mechanism 300 may include a fixed portion and a rotating portion rotatably connected to the fixed portion. The fixed portion may be connected to the first bracket 3011a and the second bracket 3012, respectively, and the rotating portion may be connected to the first pickup component 302 disposed on the second bracket 3012. Thus, during operation of the rotating component 304, the rotating portion in the transfer component 301 may rotate relative to the fixed portion, and the rotating portion may drive the first pickup component 302 to move and rotate, while the first bracket 3011a and the second bracket 3012 do not rotate. Therefore, during the rotation of the rotating component 304, the rotating component 304 only drives the first pickup component 302 to rotate, without causing other structures within the first transfer mechanism 300 to rotate. This effectively reduces the weight of the rotating component 304 during rotation, thereby ensuring high stability during the rotational drive process. Exemplarily, the rotating component 304 may include: a driving motor for driving the rotating part to rotate relative to the fixed part. By controlling the driving motor, the rotation direction and rotation angle of the rotating part relative to the fixed part can be accurately controlled, thereby ensuring high reliability in the process of driving the carrier substrate 010 to rotate.

[0140] In the embodiment of the present application, the first bracket 3011a may have a first light hole K1, and the second bracket 3011b may have a second light hole (not marked in the figure). The rotating part 304 in the first transfer mechanism 300 may be annular, and one side of the area enclosed by the rotating part 304 may be connected to the first light hole K1, and the other side may be connected to the second light hole. Here, the shooting direction of the second image acquisition mechanism 1200 fixed to the first bracket 3011a may be toward the first light hole K1. To this end, the second image acquisition mechanism 1200 can sequentially shoot the components below (for example, the carrier substrate 010 located on the first acquisition mechanism 100) through the first light hole K1, the area enclosed by the rotating part 304, and the second light hole.

[0141] Optionally, the first pickup component 302 in the first transfer mechanism 300 may include a plurality of first clamping portions 3021 disposed on the second bracket 3011b, and the plurality of first clamping portions 3021 may be distributed around the periphery of the second light-through hole of the second bracket 3011b. For example, the first transfer mechanism 300 may include four first clamping portions 3021, and the four first clamping portions 3021 may be evenly distributed around the periphery of the second light-through hole.

[0142] Illustratively, each first clamping portion 3021 may include: a first fixed seat connected to the rotating component 302; and a first clamping block movably connected to the first fixed seat. Here, the first fixed seats in each first clamping portion 3021 may be distributed around the periphery of the second light-through hole of the second bracket 3011b. The first clamping block in each first clamping portion 3021 may be movable relative to the first fixed seat in a direction toward the second light-through hole, or in a direction away from the second light-through hole. For example, after the first clamping block in each first clamping portion 3021 has moved relative to the first fixed seat in a direction toward the second light-through hole, the first clamping block in each first clamping portion 3021 may clamp the carrier substrate 010 to complete the pickup of the carrier substrate 010. For another example, after the first clamping block in each first clamping portion 3021 moves relative to the first fixing seat in a direction away from the second light-transmitting hole, the first clamping block in each first clamping portion 3021 no longer generates a clamping force on the carrier substrate 010, thereby stopping the picking up of the carrier substrate 010, so that the carrier substrate 010 can be replaced on the first acquisition mechanism 100, or the carrier substrate 010 can be installed in the supporting carrier 020.

[0143] Optionally, the second picking component 303 in the first transfer mechanism 300 may include: two second clamping portions 3031 connected to two sides opposite to the second bracket 3011b.

[0144] Illustratively, each second clamping portion 3031 may include: a second fixing base connected to the second bracket 3011b, and a second clamping block movably connected to the second fixing base. Here, the second clamping block in each second clamping portion 3031 can move relative to the second fixing base in a direction toward the second bracket 3011b, or move away from the second bracket 3011b. For example, after the second clamping block in each second clamping portion 3031 moves relative to the second fixing base in a direction toward the second bracket 3011b, the second bracket 3011b in each second clamping portion 3031 can clamp the support carrier 020 to complete the pickup of the support carrier 020. For another example, after the second clamping blocks in each second clamping portion 3031 move relative to the second fixed seat in a direction away from the second bracket 3011b, the second clamping blocks in each second clamping portion 3031 no longer generate clamping force on the support carrier 020 to stop picking up the support carrier 020, so that the support carrier 020 can be placed on the supporting mechanism 500.

[0145] It should be noted that the manner in which the first clamping block moves relative to the first fixing base, and the manner in which the second clamping block moves relative to the second fixing base in the above-mentioned embodiment can both be achieved by using a drive structure such as a drive motor, a pneumatic cylinder, or an oil cylinder. This embodiment of the present application does not limit this.

[0146] In the embodiment of the present application, the first image acquisition mechanism 400 and the second image acquisition mechanism 1200 in the assembly device 000 may be the same image acquisition mechanism, or may be two different image acquisition mechanisms.

[0147] Here, when the first image acquisition mechanism 400 and the second image acquisition mechanism 1200 are two different image acquisition mechanisms, the second image acquisition mechanism 1200 can be fixed on the support frame 3011 in the first transfer mechanism 300, and the first image acquisition mechanism 400 can be fixed above the supporting mechanism 500.

[0148] If the first image acquisition mechanism 400 and the second image acquisition mechanism 1200 are the same image acquisition mechanism, this image acquisition mechanism can be fixed to the support frame 3011 of the first transfer mechanism 300. In this case, the moving component 301 is used to drive the second image acquisition mechanism 1200 to move to the side of the carrier mechanism 500 after the support carrier 020 with the carrier substrate 010 mounted thereon is placed on the carrier mechanism 500. The second image acquisition mechanism 1200 is used to capture the carrier substrate positioned on the carrier mechanism 500.

[0149] In this way, the same image acquisition mechanism can not only photograph the carrier substrate 010 on the first acquisition mechanism 100 to obtain the deflection information of the carrier substrate 010, but also photograph the carrier substrate 010 on the carrying mechanism 500 to obtain the arrangement data of the chip a carried by the carrier substrate 010.

[0150] In an embodiment of the present application, as shown in Figure 9, which is a top view of a carrier mechanism provided in an embodiment of the present application, the carrier mechanism 500 in the assembly apparatus 000 may include a translation assembly 501. The translation assembly 501 in the assembly apparatus 000 is configured to cause the carrier substrate 010 and the support carrier 020 to translate toward one side of the first image acquisition mechanism 400 after the support carrier 020, which is mounted with the carrier substrate 010, moves onto the translation assembly 501.

[0151] In the present application, the translation component 501 can also be used to: in the process of acquiring the arrangement data of chip a on the carrier substrate 010 through the first image acquisition mechanism 400, drive the carrier substrate 010 to move on a plane perpendicular to the gravity direction Z, so that the first image acquisition mechanism 400 scans the carrier substrate 010.

[0152] For example, when the first image acquisition mechanism 400 captures the carrier substrate 010, the resulting image generally only includes a portion of the chips a in the carrier substrate 010. Therefore, in order for the first image acquisition mechanism 400 to capture an image that includes all the chips a in the carrier substrate 010, the first image acquisition mechanism 400 needs to capture and scan different areas of the carrier substrate 010. After stitching the images obtained from the different areas, an image that includes all the chips a in the carrier substrate 010 can be obtained. Subsequently, after the assembly device 000 analyzes the image, the arrangement data of the chips a carried by the carrier substrate 010 can be obtained.

[0153] Here, in order to enable the first image acquisition mechanism 400 to photograph different areas in the carrier substrate 010, and to ensure that the first image acquisition mechanism 400 is efficient in photographing the carrier substrate 010 each time, the translation component 501 can drive the carrier substrate 010 to move on a plane perpendicular to the gravity direction Z, so that different areas in the carrier substrate 010 can all face the first image acquisition mechanism 400.

[0154] Exemplarily, the translation assembly 501 in the supporting mechanism 500 may include: a base body 5011 for supporting a support carrier 020 mounted with a carrier substrate 010, a first translation member (not marked in the figure) connected to the base body 5011, and a second translation member (not marked in the figure) connected to the first translation member.

[0155] The first translation member can drive the base body 5011 to move in a second direction Y perpendicular to the gravity direction Z; the second translation member can drive the first translation member and the base body 5011 to move together in a first direction X perpendicular to the gravity direction Z. In this way, the first translation member can be used to move the carrier substrate 010 on the base body 5011 in the second direction Y, and the second translation member can be used to move the carrier substrate 010 on the base body 5011 in the first direction X, ensuring that different areas of the carrier substrate 010 can be aligned with the first image acquisition mechanism 400.

[0156] Here, both the first translation member and the second translation member can be implemented using the driving principle of a guide rail, a lead screw nut, and a gear rack, which is not limited in the present embodiment.

[0157] In an embodiment of the present application, the material of the carrier film 011 used to carry the chip a in the carrier substrate 010 is relatively soft. During the movement of the carrier substrate 010 on the translation assembly 501, the chip a may be displaced relative to the carrier film 011 in the carrier substrate 010 due to inertia, which may cause the accuracy of the subsequent arrangement data of the chip a on the carrier substrate 010 to deteriorate. To this end, the carrying mechanism 500 in the assembly device 000 may further include: a pressure plate 502 and a pressure plate moving assembly 503. The pressure plate 502 can be located on the translation assembly 501. The pressure plate moving assembly 503 can drive the pressure plate 502 to move. For example, the pressure plate moving assembly 503 can drive the pressure plate 502 to move in the gravity direction Z, or can also drive the pressure plate 502 to move in at least one of the first direction X and the second direction Y.

[0158] In this application, the pressure plate moving assembly 503 is used to drive the pressure plate 502 to move to the side of the carrier substrate 010 away from the support carrier 020 after the support carrier 020 with the carrier substrate 010 is placed on the carrying mechanism 500, so that the pressure plate 502 contacts the carrier substrate 010.

[0159] Here, after the support carrier 020 equipped with the carrier substrate 010 is placed on the translation component 501 in the carrying mechanism 500 under the drive of the first transfer mechanism 300, the pressure plate moving component 503 can drive the pressure plate 502 to move in the first direction X and / or the second direction Y toward the position of the translation component 501. After the pressure plate 502 moves to the top of the translation component 501, the pressure plate moving component 503 can drive the pressure plate 502 to move toward the translation component 501 in the gravity direction Z, so that the pressure plate 502 can contact the carrier film 011 in the carrier substrate 010 on the translation component 501, and the pressure plate 502 can apply a pressing force to the carrier film 011 toward the translation component 501, so that the carrier film 011 can be pressed, and then the chips a carried by the carrier film 011 can be restricted, so that these chips a will not produce relative displacement during the movement of the translation component 501.

[0160] Preferably, within the supporting mechanism 500 of the assembly device 000, the pressure plate moving assembly 503 can also be connected to the translation assembly 501. The pressure plate moving assembly 503 can drive the pressure plate 502 to move in the second direction Y and the gravity direction Z, equivalent to the translation assembly 501. Furthermore, the translation assembly 501 can drive the rock plate moving assembly 503 and the pressure plate 502 to move together in the first direction X and the second direction Y. In this case, when the translation assembly 501 is not carrying the support carrier 020 with the carrier substrate 010 mounted thereon, the pressure plate moving assembly 503 needs to drive the pressure plate to move in the gravity direction Z and the second direction Y in a direction away from the translation assembly 501. Then, after the support carrier 020 with the carrier substrate 010 mounted thereon is placed on the translation assembly 501, the pressure plate moving assembly 503 can drive the pressure plate 502 to move first in the second direction Y toward the translation assembly 501, and then in the gravity direction Z toward the translation assembly 501, so that the pressure plate 501 can press the multiple chips a carried by the carrier substrate 010 by pressing the carrying film 011. Subsequently, the translation assembly 501 can drive the carrier substrate 010, the pressure plate 502, and the pressure plate moving assembly 503 to move together in a plane perpendicular to the gravity direction Z. The pressure of the pressure plate 502 ensures that the chips a carried by the carrier substrate 010 will not be randomly displaced relative to the carrier substrate 010.

[0161] Optionally, the pressing plate 502 may have a third light hole K3. During the process of acquiring chip arrangement data on the carrier substrate 010 by the first image acquisition mechanism 400, the chips a carried by the carrier substrate 010 are all located within the area enclosed by the third light hole K3. Thus, when the first image acquisition mechanism 400 captures the carrier substrate 010, the pressing plate 502 does not block the chips a, allowing the first image acquisition mechanism 400 to acquire arrangement data for each chip a.

[0162] For example, a ring-shaped pressing protrusion surrounding the third light-transmitting hole K3 may be provided on the side of the pressing plate 502 facing the carrier substrate 010. The pressing protrusion may contact the carrier film 011 in the carrier substrate 010 and apply a pressing force to the carrier film 011. Here, after the ring-shaped pressing protrusion applies a pressing force to the carrier film 011, the arrangement area Q in the carrier film 011 may be distributed within the area enclosed by the ring-shaped pressing protrusion.

[0163] Optionally, the assembly apparatus 000 may further include a flipping mechanism for flipping the carrier substrate 010 and / or the support carrier 020 on which the carrier substrate 010 is mounted. It should be noted that, depending on the type of support carrier 020, after the carrier substrate 010 is mounted within the support carrier 020, the chip carried by the carrier substrate 010 may be closer to the first image acquisition mechanism 400 relative to the carrier film 011, or the chip carried by the carrier substrate 010 may be further away from the first image acquisition mechanism 400 relative to the carrier film 011, in the direction of gravity Z. When the first image acquisition mechanism 400 acquires chip arrangement data, the carrier film 011 must be brought closer to the first image acquisition mechanism 400 relative to the chip. To this end, after the carrier substrate 010 is installed in the supporting carrier 020, when, in the direction of gravity Z, the chip carried by the carrier substrate 010 is further away from the first image acquisition mechanism 400 relative to the carrying film 011, it is necessary to use the flipping mechanism to flip the carrier substrate 010 and / or the supporting carrier 020 on which the carrier substrate 010 is installed.

[0164] For example, a flipping mechanism can be provided in conjunction with the first acquisition mechanism 100. In this case, the flipping mechanism can flip the carrier substrate 010. For example, the flipping process can occur before the first transfer mechanism 300 picks up the carrier substrate 010. Alternatively, the flipping process can occur after the deflection of the carrier substrate 010 is corrected and before the movable member 301 moves toward the support carrier on the second acquisition mechanism. For example, the flipping mechanism can be provided on the first acquisition mechanism 100. For example, the flipping mechanism can include a first gripper that grasps at least two opposing sides of the carrier substrate 010 and causes the carrier substrate 010 to flip. The first gripper is also used to remove the carrier substrate 010 after flipping so that the carrier substrate 010 can be returned to the first acquisition mechanism 100.

[0165] For example, a flipping mechanism may be provided in conjunction with the second acquisition mechanism 200. In this case, the flipping mechanism can flip the support carrier 020 on which the carrier substrate 010 is mounted. For example, the flipping process occurs after the carrier substrate 010 is mounted on the support carrier 020 and before the first image acquisition mechanism 400 acquires the chip arrangement data on the carrier substrate 010. For example, the flipping mechanism may be provided on the second acquisition mechanism 200. For example, the flipping mechanism may be provided between the second support frames of the second acquisition mechanism 200. For example, the flipping mechanism may include a second gripper that grasps at least two opposing sides of the support carrier 020 and drives the support carrier 020 and the carrier substrate 010 to flip together. The second gripper is also used to detach the support carrier 020 after flipping, so that the support carrier 020 can be placed back on the second acquisition mechanism 200.

[0166] In the embodiment of the present application, as shown in FIG6 , the assembly apparatus 000 may further include a spraying unit 800 disposed on one side of the first image acquisition mechanism 400 . The spraying unit 800 is configured to, after acquiring chip arrangement data on the carrier substrate 010 via the first image acquisition mechanism 400 , spray identification information corresponding to the carrier substrate 010 onto the carrier substrate 010 . The identification information sprayed onto the carrier substrate 010 by the spraying unit 800 may be a barcode or a QR code, and this identification information is used to identify the carrier substrate 010 .

[0167] It should be noted that the chips a carried by the carrier substrate 010 are all distributed in the setting area Q of the carrier substrate 010. In order not to affect the subsequent bonding of the chips a, the spraying component 800 needs to coat the corresponding identification information outside the setting area Q of the carrier substrate 010.

[0168] Optionally, the assembly device 000 can also be configured to associate the chip arrangement data on the carrier substrate 010, acquired by the first image acquisition mechanism 400, with information about the carrier substrate 010. This allows the assembly device 000 to subsequently transmit the chip arrangement data on the carrier substrate 010 to the die-bonding device. The die-bonding device can then scan the identification information on the carrier substrate 010 to obtain the identification of the carrier substrate 010. Based on the identification of the carrier substrate 010, the die-bonding device can then retrieve the arrangement data of the chips carried by the carrier substrate 010 from the received arrangement data of various chips. In this way, the die-bonding device can automatically perform die-bonding on each chip according to the chip arrangement data carried by the carrier substrate 010.

[0169] It should be noted that after the spraying component 800 sprays the corresponding identification information onto the carrier substrate 010 , the pressure plate moving component 503 can drive the pressure plate 502 to move in a direction away from the translation component 501 , so that the pressure plate 502 no longer applies pressing force to the carrier substrate 010 .

[0170] In an embodiment of the present application, as shown in FIG6 , the assembly apparatus 000 may further include a third storage mechanism 900 . The third storage mechanism 900 is used to store the support carrier 020 mounted with the carrier substrate 010 . For example, after the spraying component 800 sprays the corresponding identification information onto the carrier substrate 010 , the support carrier 020 mounted with the carrier substrate 010 may be transferred to the third storage mechanism 900 for storage.

[0171] Optionally, the assembly apparatus 000 may further include a second transfer mechanism 1000 . The second transfer mechanism 1000 is configured to pick up the support carrier 020 with the carrier substrate 010 mounted thereon into the third storage mechanism 900 after the first image acquisition mechanism 400 acquires the chip arrangement data on the carrier substrate 010 .

[0172] For example, after the spraying component 800 sprays the corresponding identification information onto the carrier substrate 010 , the second transfer mechanism 1000 may pick up the support carrier 020 on which the carrier substrate 010 is mounted and place it into the third storage mechanism 900 .

[0173] In one possible implementation, the assembly device 000 may further include a receiving mechanism 1100 corresponding to the third storage mechanism 900. For example, after the spraying component 800 sprays the corresponding identification information onto the carrier substrate 010, the second transfer mechanism 1000 may first pick up the support carrier 020 mounted with the carrier substrate 010 onto the receiving mechanism 1100, and then the receiving mechanism 1100 transfers the support carrier 020 mounted with the carrier substrate 010 into the third storage mechanism 900. It should be noted that the structure of the third storage mechanism 900 is similar to that of the first storage mechanism 600 and the second storage mechanism 700 in the above-mentioned embodiment, and the specific structure of the third storage mechanism 900 will not be repeated here. Similarly, the structure of the receiving mechanism 1100 is also similar to that of the first acquisition mechanism 100 and the second acquisition mechanism 200 in the above-mentioned embodiment, and the specific operation of the receiving mechanism 1100 will not be repeated here.

[0174] It should also be noted that the second transfer mechanism 1000 can be the same transfer mechanism as the first transfer mechanism 300 in the above embodiment, or can be two different transfer mechanisms from the first transfer mechanism 300 in the above embodiment. Here, in the case where the second transfer mechanism 1000 and the first transfer mechanism 300 are two different transfer mechanisms, the structure of the second transfer mechanism 1000 can be similar to that of the first transfer mechanism 300. To this end, the second transfer mechanism 1000 can also move in the first direction X and the gravity direction Z, and the second transfer mechanism 1000 also has a pickup component for picking up the support carrier 020, so that the support carrier 020 with the carrier substrate 010 mounted on the carrying mechanism 500 can be transferred to the collection mechanism 1100.

[0175] In the present application, after a plurality of support carriers 020 with carrier substrates 010 mounted thereon are placed in the third storage mechanism 900, the third storage mechanism 900 can be moved out from one side of the collecting mechanism 1100 by manual pulling, and can be moved toward the crystal bonding equipment, so that the crystal bonding equipment can load the support carriers 020 with carrier substrates 010 mounted thereon in the third storage mechanism 900, and arrange the data of the chips obtained by the structural assembly equipment 000 on the carrier substrate 010, and perform crystal bonding on each chip carried by the carrier substrate 010.

[0176] In summary, the assembly equipment provided in the embodiment of the present application includes: a first acquisition mechanism, a second acquisition mechanism, a first transfer mechanism, a first image acquisition mechanism, and a carrying mechanism. Through this assembly equipment, not only can the assembly between the carrier substrate and the supporting carrier be realized, but also the arrangement data of the chips carried by the carrier substrate assembled in the supporting carrier can be obtained according to the first image acquisition mechanism. In this way, when the chips carried by the carrier substrate are subsequently bonded by the die bonding equipment, the die bonding equipment can directly obtain the arrangement position of the chips carried by the carrier substrate based on the assembly equipment, without the need for the die bonding equipment to obtain the chip arrangement data by photographing the carrier substrate, thereby effectively improving the die bonding efficiency of the die bonding equipment.

[0177] The present application also provides a die bonding system, as shown in Figure 10, which is a block diagram of the structure of a die bonding system provided in the present application. The die bonding system may include: an assembly device 000, and a die bonding device 001 that cooperates with the assembly device 000. The assembly device 000 may be the assembly device 000 provided in the above-mentioned embodiment.

[0178] Here, the assembly device 000 is used to assemble the carrier substrate into the support carrier, and after obtaining the arrangement information of the chips carried by the carrier substrate, sends the arrangement information to the die bonding device 001. The die bonding device 001 is used to fix the chips carried by the carrier substrate according to the arrangement information.

[0179] In this case, the assembly device 000 can not only assemble the carrier substrate and the support carrier, but also obtain the arrangement data of the chips carried by the carrier substrate. After obtaining the arrangement data of the chips carried by the carrier substrate, the assembly device 000 can send this arrangement data to the die bonding device 001. In this way, after the die bonding device 001 is loaded with the support carrier with the carrier substrate installed, the die bonding device 001 can directly obtain the arrangement data of the chips carried by the carrier substrate based on the received data, so that the die bonding device 001 can bond the chips carried by the carrier substrate according to this arrangement data.

[0180] For example, after the die bonding device 001 is loaded with a support carrier on which a carrier substrate is installed and the arrangement data of the chips carried by the carrier substrate is obtained, the die bonding device 001 can first identify n vertices (for example, 4 vertices) of the setting area in the carrier substrate, and combine the arrangement data of the chips carried by this carrier substrate to obtain the position information of each chip carried by this carrier substrate. Subsequently, the die bonding device 001 can combine the position information of each chip to bond each chip.

[0181] In an embodiment of the present application, the assembly device 000 is further used to: after obtaining the arrangement information of the chips carried by the carrier substrate, generate an identifier corresponding to the carrier substrate, and associate the arrangement information with the identifier and send it to the die bonding device 001.

[0182] Exemplarily, the assembly device 000 is further configured to: after generating a mark corresponding to the carrier substrate, spray corresponding mark information onto the carrier substrate. The mark information is a barcode or a QR code.

[0183] The die bonding device 001 is further used to determine an identification corresponding to the carrier substrate based on identification information sprayed on the carrier substrate, and obtain arrangement data of the chips carried by the carrier substrate based on the identification corresponding to the carrier substrate.

[0184] In this case, after the die bonding device 001 is loaded with a supporting carrier on which a carrier substrate is installed, the die bonding device 001 can first obtain the identification of the carrier substrate by scanning the identification information on the carrier substrate. Then, according to the identification of the carrier substrate, the arrangement data corresponding to the identification of the carrier substrate can be queried in all the received data. The arrangement data is: the arrangement data of the chip carried by the carrier substrate.

[0185] Optionally, the die bonding system in the present application may include: a plurality of the die bonding devices 001. Here, in the die bonding system, the assembly device 000 may be communicatively connected with each of the die bonding devices 001.

[0186] In the present application, assembly apparatus 000 can be used to assemble multiple carrier substrates within multiple support carriers to obtain multiple support carriers with mounted carrier substrates. The multiple support carriers with mounted carrier substrates can be divided into multiple groups of support carriers with mounted carrier substrates. A group of support carriers with mounted carrier substrates includes at least one support carrier with mounted carrier substrates. The multiple groups of support carriers with mounted carrier substrates can correspond one-to-one with multiple die-bonding apparatuses 001.

[0187] In one possible implementation, a group of support carriers mounted with carrier substrates can be stored in a third storage mechanism. In this way, there can be multiple third storage mechanisms, and these third storage mechanisms can be manually pulled and moved to the corresponding die bonding equipment 001, so that each die bonding equipment 001 can load the corresponding support carrier mounted with the carrier substrate and perform die bonding on the chips carried on the carrier substrate.

[0188] In the present application, the assembly device 000 is further configured to, after acquiring the arrangement information of the chips carried by each carrier substrate, transmit the arrangement information corresponding to a group of support carriers mounted with carrier substrates to a corresponding die-bonding device 001. In other words, the assembly device 000 only transmits the arrangement data of the chips carried by each carrier substrate in a group of support carriers mounted with carrier substrates to the die-bonding device 001 corresponding to this group, and not to other die-bonding devices, thereby effectively improving information transmission efficiency.

[0189] Of course, in other possible implementations, after obtaining the arrangement information of the chips carried by each carrier substrate, the assembly device 000 may also send this data to each die-bonding device 001. This embodiment of the present application does not limit this.

[0190] The present application also provides a control method for an assembly device, which may be the assembly device in the above embodiment. The control method for the assembly device may include:

[0191] Step S101: Control a first acquiring mechanism to acquire a carrier substrate carrying a chip.

[0192] Step S102: Control the second acquisition mechanism to acquire the support carrier.

[0193] Step S103 : controlling the first transfer mechanism to pick up the carrier substrate and install it into the supporting carrier.

[0194] Step S104 : controlling the first image acquisition mechanism to acquire arrangement data of the chips on the carrier substrate.

[0195] Before the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate, there is a relative displacement between the support carrier and the carrying mechanism, and the carrying mechanism is used to carry the support carrier with the carrier substrate installed thereon.

[0196] In summary, the control method for assembly equipment provided in the embodiments of the present application not only enables assembly between a carrier substrate and a support carrier, but also allows the arrangement data of the chips carried by the carrier substrate assembled in the support carrier to be obtained based on the first image acquisition mechanism. Thus, when the chips carried by the carrier substrate are subsequently bonded by the die bonding equipment, the die bonding equipment can directly obtain the arrangement position of the chips carried by the carrier substrate based on the assembly device, eliminating the need for the die bonding equipment to obtain the chip arrangement data by photographing the carrier substrate, thereby effectively improving the die bonding efficiency of the die bonding equipment.

[0197] The present application also provides another control method for an assembly device, which may be the assembly device in the above embodiment. The control method for the assembly device may include:

[0198] Step S201: Control a first acquiring mechanism to acquire a carrier substrate carrying a chip.

[0199] Step S202: Control the second acquisition mechanism to acquire the support carrier.

[0200] It should be noted that step S201 and step S202 can be performed simultaneously or in sequence, which is not limited in the present embodiment.

[0201] Step S203 : controlling the second image acquisition mechanism to acquire the image of the carrier substrate on the first acquisition mechanism to obtain a first image.

[0202] Step S204 : determining deflection information of the carrier substrate according to the first image, and controlling the first pickup portion to pick up the carrier substrate, and controlling the rotating component to drive the first pickup portion to rotate or not rotate based on the deflection information.

[0203] Step S205 : controlling the first picking unit to place the carrier substrate back onto the first acquiring mechanism.

[0204] Step S206 : controlling the second image acquisition mechanism to re-acquire the image of the carrier substrate placed back on the first acquisition mechanism to obtain a second image.

[0205] Step S207 : confirming whether the deflection information of the carrier substrate meets a preset condition according to the second image.

[0206] Step S208 : When the deflection information of the carrier substrate meets a preset condition, control the first transfer mechanism to pick up the carrier substrate and install it into the supporting carrier.

[0207] Step S209 : controlling the first transfer mechanism to transfer the support carrier mounted with the carrier substrate to the carrying mechanism.

[0208] Step S210: Control the first image acquisition mechanism to acquire arrangement data of the chips on the carrier substrate.

[0209] Step S211 : controlling the spraying component to spray identification information corresponding to the carrier substrate onto the carrier substrate.

[0210] Step S212: Associating the acquired arrangement data with identification information corresponding to the carrier substrate, and sending the data to the die bonding equipment.

[0211] Step S213 : controlling the second transfer mechanism to transfer the support carrier mounted with the carrier substrate to the receiving mechanism.

[0212] Step S214 : controlling the collecting mechanism to transfer the supporting carrier with the carrier substrate mounted thereon to the third receiving mechanism.

[0213] It should be noted that the specific process of the above method can refer to the above embodiment describing the structure of the assembly equipment, which will not be repeated here.

[0214] It should also be noted that in order to improve the efficiency of the assembly equipment in assembling the carrier substrate and the supporting vehicle, the above-mentioned different steps can be processed in parallel.

[0215] Exemplarily, in the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the control method also simultaneously performs at least one of the following processes:

[0216] The first acquisition mechanism is controlled to acquire the next carrier substrate; the second acquisition mechanism is controlled to acquire the next supporting carrier; and the first transfer mechanism is controlled to pick up the next carrier substrate and install it into the next supporting carrier.

[0217] And / or, in the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the control method also simultaneously performs at least one of the following processes:

[0218] The second transfer mechanism is controlled to transfer the last supporting carrier mounted with the carrier substrate to the collecting mechanism; and the collecting mechanism is controlled to transfer the last supporting carrier mounted with the carrier substrate to the third receiving mechanism.

[0219] In this case, the first transfer mechanism and the second transfer mechanism are not the same transfer mechanism. Thus, after assembling one set of carrier substrates and support carriers using the first transfer mechanism, while the subsequent process is being performed on this set of carrier substrates and support carriers (i.e., performing steps S210 to S212 above), the first transfer mechanism can be used to simultaneously assemble the next set of carrier substrates and support carriers, i.e., simultaneously performing steps S201 to S208 above. Similarly, while the subsequent process is being performed on this set of carrier substrates and support carriers (i.e., performing steps S210 to S212 above), the second transfer mechanism can be used to simultaneously transfer the previous set of carrier substrates and support carriers, i.e., simultaneously performing steps S213 to S214 above.

[0220] In summary, the control method for assembly equipment provided in the embodiments of the present application not only enables assembly between a carrier substrate and a support carrier, but also allows the arrangement data of the chips carried by the carrier substrate assembled in the support carrier to be obtained based on the first image acquisition mechanism. Thus, when the chips carried by the carrier substrate are subsequently bonded by the die bonding equipment, the die bonding equipment can directly obtain the arrangement position of the chips carried by the carrier substrate based on the assembly device, eliminating the need for the die bonding equipment to obtain the chip arrangement data by photographing the carrier substrate, thereby effectively improving the die bonding efficiency of the die bonding equipment.

[0221] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0222] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0223] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An assembling device, characterized in that, The assembly device includes: A first acquisition mechanism for acquiring a carrier substrate carrying chips; A second acquisition mechanism for acquiring a support carrier; A first transfer mechanism for picking up the carrier substrate and installing it into the support carrier; A first image acquisition mechanism for acquiring the arrangement data of the chips on the carrier substrate; A carrying mechanism for carrying the support carrier on which the carrier substrate is installed; Wherein, before the first image acquisition mechanism acquires the arrangement data of the chips on the carrier substrate, there is a relative displacement between the support carrier and the carrying mechanism.

2. The assembly device according to claim 1, characterized in that, The first transfer mechanism includes: a moving component, and a first picking component and a second picking component connected to the moving component, the first picking component is used for picking up the carrier substrate, and the second picking component is used for picking up the support carrier; Wherein, the moving component is used to drive the first picking component to pick up the carrier substrate located on the first acquisition mechanism; the moving component is used to move in the direction towards the support carrier located on the second acquisition mechanism to install the carrier substrate picked up by the first picking component into the support carrier; the second picking component is used to pick up the support carrier on which the carrier substrate is installed; the moving component moves in the direction towards the carrying mechanism to place the support carrier on which the carrier substrate is installed on the carrying mechanism.

3. The assembly device according to claim 2, wherein, The first transfer mechanism further includes: a rotating component connected to the first picking component; The assembly device further includes a second image acquisition mechanism; the second image acquisition mechanism is located on the first transfer mechanism and is connected to the moving component; or, when the first picking component moves to the position where the first acquisition mechanism is located, the second image acquisition mechanism is disposed opposite to the first picking component, so that the carrier substrate is located between the first picking component and the second image acquisition mechanism; Wherein, the second image acquisition mechanism is used to acquire an image of the carrier substrate on the first acquisition mechanism to obtain a first image; the assembly device is configured to determine the deflection information of the carrier substrate according to the first image, control the first picking part to pick up the carrier substrate, and control the rotating component to drive the first picking part to rotate or not to rotate based on the deflection information.

4. The assembly device according to claim 3, characterized in that, The deflection information includes: a deflection orientation and a deflection angle; the assembly device is configured to: when the carrier substrate needs to be rotated, control the rotating component to drive the first picking part to rotate the deflection angle in the opposite direction of the deflection orientation.

5. The assembly device according to claim 3, characterized in that, When the chip arrays are arranged on the carrier substrate and have a row arrangement direction and a column arrangement direction perpendicular to each other, the assembly device is configured to: obtain the row arrangement direction data and / or the column arrangement direction data; when the row arrangement direction is not consistent with a first preset direction in the system coordinate system of the assembly device, control the rotating member to drive the first picking portion to rotate so that the row arrangement direction is consistent with the first preset direction in the system coordinate system of the assembly device, and / or, when the column arrangement direction is not consistent with a second preset direction in the system coordinate system of the assembly device, control the rotating member to drive the first picking portion to rotate so that the column arrangement direction is consistent with the second preset direction in the system coordinate system of the assembly device.

6. The assembly device according to claim 3, characterized in that The assembly device is configured to: after controlling the first picking portion to pick up the carrier substrate and controlling the rotating member to drive the first picking portion to rotate or not to rotate based on the deflection information, control the first picking portion to place the carrier substrate back onto the first obtaining mechanism; and control the second image obtaining mechanism to re-obtain an image of the carrier substrate placed back onto the first obtaining mechanism to obtain a second image; and confirm whether the deflection information of the carrier substrate meets a preset condition according to the second image.

7. The assembly device according to claim 2, wherein, The moving member includes: a support frame, a first moving portion connected to the support frame, and a second moving portion connected to the first moving portion, and the support frame is respectively connected to the second image obtaining mechanism, the first picking member, and the second picking member; Wherein, the first moving portion is used for driving the support frame to move in the gravity direction, and the second moving portion is used for driving the support frame to move in a first direction perpendicular to the gravity direction.

8. The assembling device according to claim 7, characterized in that, The support frame includes: a first support frame and a second support frame; the first support frame is connected to the first moving portion and fixedly connected to the first image obtaining mechanism; the rotating member is located between the first support frame and the second support frame and is respectively connected to the first support frame and the second support frame, and the first picking member and the second picking member are both distributed on the second support frame.

9. The assembly device according to claim 8, characterized in that, The first support frame has a first light passing hole, the second support frame has a second light passing hole, the rotating member is annular, and one side of the area surrounded by the rotating member communicates with the first light passing hole, and the other side communicates with the second light passing hole; the shooting direction of the second image obtaining mechanism faces the first light passing hole.

10. The assembly device according to claim 9, characterized in that, The first picking member includes: a plurality of first clamping portions arranged on the second support frame, and the plurality of first clamping portions are circumferentially distributed around the periphery of the second light passing hole.

11. The assembling device according to claim 9, characterized in that, The second picking member includes: two second clamping portions connected to two opposite sides of the second support frame.

12. The assembly device according to claim 1, characterized in that, The assembly device further includes: a first storage mechanism corresponding to the first obtaining mechanism, and a second storage mechanism corresponding to the second obtaining mechanism; Wherein, the first storage mechanism is used to carry the carrier substrate, and the first acquisition mechanism is used to pull the carrier substrate from the first storage mechanism; The second storage mechanism is used to carry the supporting carrier, and the second obtaining mechanism is used to pull the supporting carrier from the second storage mechanism.

13. The assembling device according to claim 1, characterized in that, The first storage mechanism has a first accommodating space, in which first supporting structures are stacked along the gravity direction, one of the first supporting structures is used to distribute one of the carrier substrates, and the first storage mechanism further includes a first lifting mechanism, which is used to drive the plurality of first supporting structures to move simultaneously along the gravity direction; The second storage mechanism has a second accommodating space, in which second supporting structures are stacked along the direction of gravity. One second supporting structure is used to distribute one supporting carrier. The second storage mechanism also includes a second lifting mechanism, which is used to drive the multiple second supporting structures to move simultaneously along the direction of gravity.

14. The assembly device according to any one of claims 2-11, characterized in that, The first image acquisition mechanism and the second image acquisition mechanism are the same image acquisition mechanism; The moving component is used to drive the second image acquisition mechanism to move to one side of the carrying mechanism after the supporting carrier mounted with the carrier substrate is placed on the carrying mechanism; The second image acquisition mechanism is used to photograph the carrier substrate located on the carrying mechanism.

15. The assembly device according to any one of claims 1-13, characterized in that, The carrying mechanism includes a translation assembly; the translation assembly is used to drive the carrier substrate and the supporting carrier to translate to one side of the first image acquisition mechanism after the supporting carrier mounted with the carrier substrate is transferred to the translation assembly; The translation component is also used to drive the carrier substrate to move on a plane perpendicular to the direction of gravity during the process of acquiring the arrangement data of the chip on the carrier substrate by the first image acquisition mechanism, so that the first image acquisition mechanism can scan the carrier substrate.

16. The assembly device according to claim 15, characterized in that, The bearing mechanism further comprises: a pressing plate located on the translation assembly, and a pressing plate moving assembly connected to the pressing plate; The pressure plate moving assembly is used to drive the pressure plate to move to a side of the carrier substrate away from the supporting carrier after the supporting carrier mounted with the carrier substrate is placed on the supporting mechanism, so that the pressure plate contacts the carrier substrate.

17. The assembly device according to claim 16, characterized in that, The pressing plate has a third light-through hole; wherein, in the process of acquiring the arrangement data of the chip on the carrier substrate by the first image acquisition mechanism, the chips carried by the carrier substrate are all located in the area surrounded by the third light-through hole.

18. The assembly device according to claim 15, characterized in that, The assembly equipment further includes: a spraying component disposed on one side of the first image acquisition mechanism; The spraying component is used to spray identification information corresponding to the carrier substrate onto the carrier substrate after the first image acquisition mechanism acquires the arrangement data of the chip on the carrier substrate; The assembly device is further configured to: associate the arrangement data with identification information corresponding to the carrier substrate.

19. The assembly device according to any one of claims 1-13, characterized in that, The assembly device further includes: a third storage mechanism for storing the support carrier on which the carrier substrate is mounted.

20. The assembly device according to claim 19, characterized in that, The assembly device further includes: a second transfer mechanism, and a pickup mechanism corresponding to the third storage mechanism; The second transfer mechanism is configured to transfer the support carrier on which the carrier substrate is mounted to the pickup mechanism after the first image acquisition mechanism acquires the arrangement data of the chips on the carrier substrate; the pickup mechanism is configured to transfer the support carrier on which the carrier substrate is mounted into the third storage mechanism.

21. The assembly device according to any one of claims 1-13, characterized in that, The carrier substrate obtained by the first acquisition mechanism includes: a carrier film for carrying the chips, and a mother-daughter ring connected to an edge portion of the carrier film.

22. The assembly device according to any one of claims 1-13, characterized in that, The assembly device further includes: a flipping mechanism for flipping the carrier substrate and / or the support carrier on which the carrier substrate is mounted.

23. A die bonding system, characterized in that, Including: An assembly device and a die bonding device cooperating with the assembly device, the assembly device being the assembly device according to any one of claims 1 to 22.

24. The die bonding system according to claim 23, wherein The assembly device is configured to: assemble a carrier substrate in a support carrier, and after obtaining the arrangement information of the chips carried by the carrier substrate, send the arrangement information to the die bonding device; The die bonding device is configured to: fix the chips carried by the carrier substrate according to the arrangement information.

25. The die bonding system according to claim 24, wherein, The assembly device is further configured to: after obtaining the arrangement information of the chips carried by the carrier substrate, generate an identifier corresponding to the carrier substrate, and send the arrangement information and the identifier after being associated to the die bonding device.

26. The die bonding system according to claim 25, wherein, The assembly device is further configured to: after generating the identifier corresponding to the carrier substrate, spray corresponding identifier information on the carrier substrate. The die bonding device is further configured to: determine the identifier corresponding to the carrier substrate based on the identifier information sprayed on the carrier substrate, and obtain the arrangement data of the chips carried by the carrier substrate based on the identifier corresponding to the carrier substrate.

27. The die bonding system according to any one of claims 24-26, characterized in that, The die bonding system includes: a plurality of the die bonding devices, and the assembly device is communicatively connected to each of the die bonding devices; The assembly device is configured to: assemble a plurality of the carrier substrates in a plurality of the support carriers to obtain a plurality of support carriers on which the carrier substrates are mounted; wherein, the plurality of support carriers on which the carrier substrates are mounted can be divided into: a plurality of groups of support carriers on which the carrier substrates are mounted corresponding one-to-one to the plurality of die bonding devices, and each group of support carriers on which the carrier substrates are mounted includes at least one support carrier on which the carrier substrate is mounted; The assembly device is further configured to: after obtaining the arrangement information of the chips carried by each of the carrier substrates, send the arrangement information corresponding to a group of support carriers on which the carrier substrates are mounted to a corresponding one of the die bonding devices.

28. A control method for an assembly device, characterized in that, The assembly device is the assembly device according to any one of claims 1 to 22, and the method includes: Controlling a first acquisition mechanism to acquire a carrier substrate carrying chips; Controlling a second acquisition mechanism to acquire a support carrier; Controlling a first transfer mechanism to pick up the carrier substrate and mount it into the support carrier; Control the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate; Wherein, before the first image acquisition mechanism acquires the arrangement data of the chips on the carrier substrate, there is a relative displacement between the support carrier and the carrying mechanism, and the carrying mechanism is used to carry the support carrier on which the carrier substrate is installed.

29. The method according to claim 28, wherein Before the step of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further includes: Control the first transfer mechanism to transfer the support carrier on which the carrier substrate is installed to the carrying mechanism.

30. The method according to claim 29, wherein During the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further synchronously performs at least one of the following processes: Control the first acquisition mechanism to acquire the next carrier substrate; Control the second acquisition mechanism to acquire the next support carrier; Control the first transfer mechanism to pick up the next carrier substrate and install it into the next support carrier; And / or, during the process of controlling the first image acquisition mechanism to acquire the arrangement data of the chips on the carrier substrate, the method further synchronously performs at least one of the following processes: Control the second transfer mechanism to transfer the previous support carrier on which the carrier substrate is installed to the collection mechanism; Control the collection mechanism to transfer the previous support carrier on which the carrier substrate is installed to the third storage mechanism.

Images