Adhesive-filling mold for endoscope tip

Abstract

The present application relates to an adhesive-filling mold for an endoscope tip, the adhesive-filling mold comprising an adhesive-filling mounting base and an adhesive-filling sleeve. The adhesive-filling mounting base is provided with a limiting boss protruding from the adhesive-filling mounting base and a limiting column protruding from the limiting boss, the limiting boss abutting against an imaging module to limit the imaging module, and the limiting column extending into an instrument channel in a fixing member, which can effectively prevent an adhesive from flowing into the instrument channel and can also limit the fixing member. The adhesive-filling sleeve is sleeved on the limiting boss, and an accommodation space for accommodating the endoscope tip is formed between the adhesive-filling sleeve and the adhesive-filling mounting base. An adhesive-filling hole is formed in the adhesive-filling sleeve, and adhesive can be filled into the accommodation space from the adhesive-filling hole to fill a gap between the adhesive-filling sleeve and the adhesive-filling mounting base and the endoscope tip, and after the adhesive is cured, a tip shell can be formed on the outside of the imaging module to protect the imaging module. In addition, the structure is more compact and the operation is simple, thereby improving the production efficiency.

Description

Endoscope tip glue casting mold Technical Field

[0001] The present application relates to the technical field of endoscope assembly, and in particular to a glue-filling mold for the tip of an endoscope. Background Art

[0002] A medical endoscope is a device that examines and diagnoses diseases through the body's natural cavities (digestive tract, respiratory tract, urinary tract). Therefore, the smaller the insertion portion of the medical endoscope, the less trauma it causes to the patient. At the same time, it is hoped that the larger the forceps channel in the insertion portion will facilitate the doctor's selection of surgical instruments and surgical operations.

[0003] The tip of an endoscope generally includes a fixing part and an imaging module disposed on the fixing part. In related technologies, a transparent plastic part is generally added to the outside of the tip, and then the transparent plastic part is fixed to the imaging module and the fixing part by dispensing glue. However, adopting the above method will increase the external dimensions of the tip, and the assembly is more complicated, resulting in low production efficiency. Summary of the Invention

[0004] Based on this, it is necessary to provide a glue-filling mold for the tip of an endoscope that does not require additional transparent plastic parts on the outside of the tip, making the structure more compact and occupying a smaller area. At the same time, the structure and operation are simple, which can improve production efficiency.

[0005] A glue-filling mold for an endoscope tip, the endoscope tip comprising a fixing member and an imaging module disposed on the fixing member, the glue-filling mold for the endoscope tip comprising:

[0006] A glue-filling mounting seat, wherein the glue-filling mounting seat has a limiting boss protruding thereon and a limiting post protruding thereon, wherein the limiting boss is used to abut against the imaging module, and the limiting post is used to extend into the instrument channel on the fixing member;

[0007] A glue pouring sleeve, the glue pouring sleeve is sleeved on the limiting boss, and an accommodating space for accommodating the tip of the endoscope is formed between the glue pouring sleeve and the glue pouring mounting seat, and a glue pouring hole connected to the accommodating space is opened on the glue pouring sleeve; a gap for filling with glue can be formed between the glue pouring sleeve and the glue pouring mounting seat and the tip of the endoscope, so that the glue after curing can form a tip shell on the outside of the imaging module.

[0008] In the above scheme, by setting up a glue filling mounting seat, the limiting boss can abut against the imaging module to limit the imaging module, and the limiting column extends into the instrument channel on the fixing part, which can effectively prevent glue from flowing into the instrument channel, and can also limit the fixing part; by setting the glue filling sleeve on the limiting boss, the glue filling sleeve and the glue filling mounting seat can be easily maintained and replaced, which can meet the glue filling needs of endoscope tips of different specifications; glue can be poured into the accommodating space from the glue filling hole, and the gap between the glue filling sleeve and the glue filling mounting seat and the endoscope tip can be filled. After the glue is cured, a tip shell can be formed on the outside of the imaging module to protect the imaging module, effectively ensure the connection strength with the imaging module and the fixing part, and there is no need to add a transparent plastic part on the outside of the tip, making the structure more compact and occupying a smaller area. At the same time, the structure and operation of the present application are simple, which can improve production efficiency.

[0009] In one embodiment, the glue-potting sleeve has a sealing structure for sealingly connecting with the fixing member.

[0010] When glue can be poured into the accommodating space from the glue pouring hole, since the glue pouring sleeve is sealed with the fixing piece, the glue in the accommodating space will not leak out from the gap between the glue pouring sleeve and the fixing piece.

[0011] In one embodiment, the limiting column has a sealing structure for sealingly connecting with the instrument channel.

[0012] By sealingly connecting the glue-filling sleeve to the fixing piece, the glue in the accommodating space will not leak into the instrument channel from the gap between the limiting column and the fixing piece.

[0013] In one embodiment, the glue-filling sleeve is sealed to the limiting boss.

[0014] By sealingly connecting the glue-filling sleeve and the limiting boss, the glue in the accommodating space will not leak out from the gap between the glue-filling sleeve and the limiting boss.

[0015] In one embodiment, an end of the glue-filling sleeve close to the limiting boss is provided with a mounting groove for facilitating insertion into the limiting boss, and the inner diameter of the mounting groove is larger than the outer diameter of the limiting boss.

[0016] When the glue-filling sleeve is installed on the limiting boss, since the inner diameter of the installation groove is larger than the outer diameter of the limiting boss, the glue-filling sleeve can be quickly installed on the limiting boss, thereby improving installation efficiency.

[0017] In one embodiment, the outer side walls of the glue-potting mounting seat and the glue-potting sleeve are configured to withstand negative pressure extrusion to expel bubbles in the glue.

[0018] After the glue pouring is completed, the glue pouring mount and the glue pouring sleeve can be placed in a vacuum environment. The negative pressure squeezes the outer walls of the glue pouring mount and the glue pouring sleeve to discharge the bubbles of glue in the accommodating space to the outside, thereby ensuring the glue pouring effect.

[0019] In one embodiment, the glue injection hole is opened on the side wall of the glue injection sleeve.

[0020] In one embodiment, a connecting hole communicating with the glue injection hole is formed on the fixing member, and the connecting hole is connected with the accommodating space.

[0021] In one embodiment, the glue pouring mounting seat is further provided with an avoidance groove for avoiding the glue pouring sleeve.

[0022] By setting the avoidance groove, the avoidance groove can avoid the upper corner of the glue pouring sleeve to ensure the installation effect of the glue pouring sleeve and the glue pouring mounting seat, and avoid interference between the glue pouring sleeve and the glue pouring mounting seat during installation, which makes the glue pouring sleeve unable to be installed.

[0023] In one embodiment, the glue-filling mounting seat and the glue-filling sleeve are both made of non-stick glue material.

[0024] The glue used is UV glue, which uses UV curing. UV curing is a process in which the photoinitiator in the liquid UV glue is stimulated by medium and short wavelength UV light (300nm-800nm) and converted into free radicals or cations under UV radiation, thereby initiating the polymerization of the polymer material (resin) containing active functional groups into an insoluble solid coating.

[0025] In one embodiment, the material used for the glue-filling mounting seat and the glue-filling sleeve is silicone or Teflon.

[0026] Silicone has high adsorption properties, good thermal stability, chemical stability, and high mechanical strength. Teflon offers non-stick properties, heat resistance, sliding properties, moisture resistance, wear resistance, and corrosion resistance. Almost all substances do not adhere to Teflon coatings. Teflon coatings offer excellent heat and low-temperature resistance. They can withstand temperatures up to 300°C for short periods and can generally be used continuously between 240°C and 260°C. They possess remarkable thermal stability, operating at freezing temperatures without becoming brittle or melting at high temperatures. Teflon coatings have a low coefficient of friction. While the coefficient of friction varies under load and sliding, it remains between 0.05 and 0.15. The Teflon coating surface is impervious to water and oil, and is also resistant to liquids during production operations. Even small amounts of dirt can be removed with a simple wipe, minimizing downtime, saving labor, and improving efficiency. They also exhibit excellent wear resistance under high loads. Under certain loads, they offer both wear resistance and non-stick properties. Teflon is almost impervious to chemical attack and can protect parts from any kind of chemical corrosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings that constitute a part of this application are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] FIG1 is a cross-sectional view of the connection structure between the glue-filling mold for the endoscope tip shown in one embodiment of the present application and the endoscope tip in the first embodiment.

[0030] FIG2 is a schematic diagram of the connection structure between the glue-filling mold for the endoscope tip shown in one embodiment of the present application and the endoscope tip in the first embodiment.

[0031] FIG3 is a cross-sectional view of the structure of the endoscope tip before glue filling shown in the first embodiment of the present application.

[0032] FIG4 is a schematic structural diagram of the endoscope tip after glue filling and curing shown in the first embodiment of the present application.

[0033] FIG5 is a cross-sectional view of the connection structure between the glue-filling mold for the tip of the endoscope shown in one embodiment of the present application and the tip of the endoscope in the second embodiment.

[0034] FIG6 is a cross-sectional view of the structure of the endoscope tip before glue filling shown in the second embodiment of the present application.

[0035] FIG7 is a cross-sectional view of the connection structure between the glue-filling mold for the endoscope tip shown in one embodiment of the present application and the endoscope tip in the third embodiment.

[0036] FIG8 is a cross-sectional view of the structure of the endoscope tip before glue filling shown in the second embodiment of the present application.

[0037] Description of Reference Numerals

[0038] 10. Glue-potting mold for the tip of the endoscope; 100. Tip of the endoscope; 110. Fixing part; 111. Instrument channel; 120. Imaging module; 121. Circuit board; 122. Camera assembly; 123. LED lamp; 124. Fixing bracket; 130. Tip housing; 200. Glue-potting mounting seat; 210. Limiting boss; 220. Limiting column; 230. Avoidance groove; 300. Glue-potting sleeve; 310. Glue-potting hole; 320. Mounting groove. DETAILED DESCRIPTION

[0039] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0041] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0042] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0045] Please refer to Figures 1, 4, 5 and 7. An embodiment of the present application provides a glue-potting mold 10 for an endoscope tip. The endoscope tip 100 includes a fixing member 110 and an imaging module 120 arranged on the fixing member 110. The glue-potting mold 10 for the endoscope tip is used to pot the endoscope tip 100 with glue. After the glue is cured, a tip shell 130 can be formed on the outside of the imaging module 120, and can protect the imaging module 120.

[0046] Please refer to Figures 1, 3 and 4. In one embodiment, the imaging module 120 includes a circuit board 121, a camera component 122, an LED light 123 and a fixing bracket 124. The circuit board 121 is arranged on the fixing bracket 124, the camera component 122 is arranged on the circuit board 121, and the LED light 123 is arranged on one side of the camera component 122.

[0047] Please refer to Figure 1 and Figure 6. In another embodiment, the imaging module 120 includes a circuit board 121, a camera component 122 and an LED light 123. The camera component 122 is disposed on the circuit board 121, and the LED light 123 is disposed on one side of the camera component 122.

[0048] Please refer to FIG. 1 and FIG. 8 . In another embodiment, the imaging module 120 includes a circuit board 121 and an LED light 123 . The LED light 123 is disposed on one side of the circuit board 121 .

[0049] Referring to Figures 1, 4, 5, and 7, an endoscope tip casting mold 10 includes a casting mount 200 and a casting sleeve 300. The casting sleeve 300 is mounted on the casting mount 200. A receiving space for accommodating the endoscope tip 100 is defined between the casting sleeve 300 and the casting mount 200. The endoscope tip 100 can be accommodated in the receiving space.

[0050] A limiting boss 210 and a limiting column 220 are formed on the glue-filling mounting seat 200, and the limiting boss 210 is used to abut against the imaging module 120. The limiting column 220 is used to extend into the instrument channel 111 on the fixing member 110. The limiting boss 210 can limit the imaging module 120. Specifically, the lower surface of the limiting boss 210 abuts against the upper surface of the imaging module 120. The instrument channel 111 is set through the fixing member 110. More specifically, the upper surface of the imaging module 120 can be the upper surface of the camera assembly 122, or the upper surface of the circuit board 121.

[0051] The limiting post 220 extends into the instrument channel 111 on the fixing member 110 , which can effectively prevent glue from flowing into the instrument channel 111 , and can also limit the fixing member 110 .

[0052] Referring to Figures 1, 4, 5, and 7, the glue-filling sleeve 300 is mounted on the limiting boss 210. By mounting the glue-filling sleeve 300 on the limiting boss 210, the glue-filling sleeve 300 and the glue-filling mounting base 200 can be easily maintained and replaced, allowing glue-filling for endoscope tips 100 of different specifications. It should be understood that when glue-filling endoscope tips 100 of different specifications, the corresponding glue-filling sleeve 300 can be replaced.

[0053] The glue-filling sleeve 300 is provided with a glue-filling hole 310 that communicates with the receiving space. The gap between the glue-filling sleeve 300, the glue-filling mounting base 200, and the endoscope tip 100 is filled with glue. After curing, the glue forms the tip housing 130 on the exterior of the imaging module 120. It should be noted that the tip housing 130 is a transparent structure.

[0054] Glue can be poured into the accommodating space through the glue injection hole 310 to fill the gap between the glue injection sleeve 300 and the glue injection mounting seat 200 and the endoscope tip 100. After the glue solidifies, a tip housing 130 can be formed on the outside of the imaging module 120, which protects the imaging module 120 and effectively ensures the connection strength with the imaging module 120 and the fixing member 110. There is no need to add a transparent plastic part on the outside of the tip, making the structure more compact and occupying a smaller area. At the same time, the structure and operation of this application are simple, which can improve production efficiency. It should be noted that the transparent plastic part can be used as the tip housing 130 mentioned in the background technology.

[0055] The following describes in detail the glue-potting mold 10 for the endoscope tip according to an embodiment of the present application with reference to the accompanying drawings.

[0056] Referring to Figures 1, 5, and 7, according to some embodiments of the present application, the glue-pouring sleeve 300 is optionally sealed to the fixing member 110. While glue can be poured into the receiving space through the glue-pouring hole 310, the glue-pouring sleeve 300 is sealed to the fixing member 110, preventing the glue in the receiving space from leaking out of the gap between the glue-pouring sleeve 300 and the fixing member 110.

[0057] The limiting post 220 is sealedly connected to the instrument channel 111. Specifically, the limiting post 220 is sealedly connected to the fixing member 110. While glue can be poured into the receiving space through the glue injection hole 310, the glue injection sleeve 300 is sealedly connected to the fixing member 110, preventing the glue in the receiving space from leaking into the instrument channel 111 through the gap between the limiting post 220 and the fixing member 110.

[0058] Please refer to Figures 1, 5 and 7. According to some embodiments of the present application, optionally, a mounting groove 320 is opened at one end of the glue-filling sleeve 300 close to the limiting boss 210 for easy insertion into the limiting boss 210, and the inner diameter of the mounting groove 320 is larger than the outer diameter of the limiting boss 210.

[0059] When the glue-filling sleeve 300 is installed on the limiting boss 210 , since the inner diameter of the installation groove 320 is larger than the outer diameter of the limiting boss 210 , the glue-filling sleeve 300 can be quickly installed on the limiting boss 210 , thereby improving installation efficiency.

[0060] The glue-filling sleeve 300 is sealedly connected to the limiting boss 210. When glue is poured into the accommodation space through the glue-filling hole 310, the glue-filling sleeve 300 is sealedly connected to the limiting boss 210, so that the glue in the accommodation space will not leak out from the gap between the glue-filling sleeve 300 and the limiting boss 210.

[0061] Referring to FIG. 1 , FIG. 5 and FIG. 7 , according to some embodiments of the present application, optionally, the outer side walls of the glue potting mount 200 and the glue potting sleeve 300 are configured to withstand negative pressure extrusion to expel bubbles in the glue.

[0062] After the glue filling is completed, the glue filling mounting seat 200 and the glue filling sleeve 300 can be placed in a vacuum environment. The negative pressure squeezes the outer walls of the glue filling mounting seat 200 and the glue filling sleeve 300 to discharge the bubbles of the glue in the accommodating space to the outside, thereby ensuring the glue filling effect.

[0063] Referring to Figures 1, 2, 5, and 7, according to some embodiments of the present application, a glue injection hole 310 may be optionally provided on a sidewall or bottom of the glue injection sleeve 300. A connecting hole is provided on the fixing member 110, communicating with the glue injection hole 310. The connecting hole is in communication with the receiving space. Glue can be injected from the glue injection hole 310 into the connecting hole, and the glue in the connecting hole can flow into the receiving space.

[0064] In one embodiment, the glue injection hole 310 is formed on a side wall of the glue injection sleeve 300 . In another embodiment, the glue injection hole 310 is formed on a bottom of the glue injection sleeve 300 .

[0065] Referring to Figures 1, 2, 5, and 7, according to some embodiments of the present application, the glue potting mounting base 200 is optionally further provided with an escape groove 230 for evading the glue potting sleeve 300. Specifically, the escape groove 230 is used at the upper corner of the glue potting sleeve 300 to ensure the installation effect of the glue potting sleeve 300 and the glue potting mounting base 200, and to avoid interference between the glue potting sleeve 300 and the glue potting mounting base 200 during installation, which would make it impossible to install the glue potting sleeve 300.

[0066] Referring to Figures 1, 5, and 7, according to some embodiments of the present application, in one embodiment, the glue material used is UV glue. UV glue utilizes UV curing. It should be understood that UV curing is a process in which the photoinitiator in the liquid UV glue is stimulated to become free radicals or cations under UV radiation using medium- and short-wavelength UV light (300 nm-800 nm), thereby initiating the polymerization of a polymer material (resin) containing active functional groups into an insoluble solid coating film.

[0067] In other embodiments, the glue may be heat-curing glue or naturally curing glue.

[0068] 1 , 5 , and 7 , according to some embodiments of the present application, the glue potting mount 200 and the glue potting sleeve 300 are optionally made of non-stick materials to facilitate demolding. Specifically, the glue potting mount 200 and the glue potting sleeve 300 are made of silicone or Teflon.

[0069] Silicone has high adsorption performance, good thermal stability, stable chemical properties, high mechanical strength, etc. Teflon has non-stick properties, heat resistance, sliding properties, moisture resistance, wear resistance and corrosion resistance.

[0070] Specifically, almost all substances do not adhere to Teflon coatings. Teflon coatings offer excellent heat and low-temperature resistance. They can withstand temperatures up to 300°C for short periods and can generally be used continuously between 240°C and 260°C. They possess remarkable thermal stability, operating at freezing temperatures without becoming brittle or melting at high temperatures. Teflon coatings also have a low coefficient of friction. While the coefficient of friction varies under load and sliding, the value is only between 0.05 and 0.15. The Teflon coating surface is impervious to water and oil, and is also susceptible to solvents during production operations. Even small amounts of dirt can be removed with a simple wipe, minimizing downtime, saving labor, and improving efficiency. They exhibit excellent wear resistance under high loads. Under certain loads, they offer the dual advantages of wear resistance and non-stick properties. Teflon is virtually impervious to chemicals, protecting parts from all types of chemical corrosion.

[0071] In this embodiment, the material used for the glue-filling mounting seat 200 and the glue-filling sleeve 300 is silicone, which can play the role of non-stick glue, and at the same time can also make the glue-filling sleeve 300 and the fixing part 110, the limiting column 220 and the fixing part 110, and the limiting column 220 and the fixing part 110 have a sealing connection.

[0072] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An epoxy injection mold for the distal end of an endoscope, the distal end of the endoscope comprising a fixing member and an imaging module disposed on the fixing member, characterized in that, The glue injection mold for the endoscope tip includes: A glue injection mounting base, on which a limiting boss and a limiting post protruding from the limiting boss are formed. The limiting boss is used to abut against the imaging module, and the limiting post is used to extend into the instrument channel on the fixing member; A glue injection sleeve, which is sleeved on the limiting boss. A receiving space for receiving the endoscope tip is formed between the glue injection sleeve and the glue injection mounting base. A glue injection hole communicating with the receiving space is opened on the glue injection sleeve. A gap for filling glue can be formed between the glue injection sleeve, the glue injection mounting base and the endoscope tip, so that the cured glue can form a tip housing outside the imaging module.

2. The potting mold for the distal end of the endoscope according to claim 1, characterized in that, The glue injection sleeve has a sealing structure for sealing connection with the fixing member.

3. The potting mold for the distal end of the endoscope according to claim 1, characterized in that The limiting post has a sealing structure for sealing connection with the instrument channel.

4. The potting mold for the distal end of the endoscope according to claim 1, wherein, The glue injection sleeve is sealingly connected to the limiting boss.

5. The potting mold for the distal end of the endoscope according to claim 1, wherein An installation groove for facilitating the insertion of the limiting boss is opened at one end of the glue injection sleeve close to the limiting boss, and the inner diameter of the installation groove is larger than the outer diameter of the limiting boss.

6. The potting mold for the distal end of the endoscope according to claim 1, characterized in that The outer side walls of the glue injection mounting base and the glue injection sleeve are configured to be able to withstand the extrusion of negative pressure to discharge the air bubbles in the glue.

7. The potting mold for the distal end of the endoscope according to claim 1, wherein The glue injection hole is opened on the side wall of the glue injection sleeve.

8. The potting die for the distal end of the endoscope according to claim 1, characterized in that, A relief groove for avoiding the glue injection sleeve is further provided on the glue injection mounting base.

9. The potting mold for the endoscope tip according to claim 1, characterized in that, The materials of the glue injection mounting base and the glue injection sleeve are both non-sticky glue materials.

10. The potting mold for the distal end of the endoscope according to claim 9, wherein The materials of the glue injection mounting base and the glue injection sleeve are silicone or Teflon.

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