Capacitor housing, integrated assembly, and manufacturing method therefor

Abstract

A capacitor housing, an integrated assembly, and a manufacturing method therefor, which relate to the technical field of capacitor cooling structures. The capacitor housing (1) is integrally formed by using metal and comprises a housing support portion (11) and a limiting portion (12), which are respectively used for integration of a cooling water channel (2) and a capacitor core (3); the cooling water channel is provided at the top surface of the housing support portion, and partially sinks and extends into the inside of the housing support portion; the limiting portion is vertically provided on the bottom surface of the housing support portion and is used for forming a limiting area (13) for accommodating the capacitor core, the cooling water channel covering the limiting area; the limiting portion is provided to correspond to both sides in the width direction and any side in the length direction of the cooling water channel, so as to form a peripheral side wall of the limiting area. The present invention solves the problems of low cooling efficiency and larger space occupation of existing capacitor housings with additional provision of cooling water channels or heat sinks.

Description

Capacitor housing, integrated assembly, and preparation method thereof Technical Field

[0001] The present invention relates to the technical field of capacitor heat dissipation structures, and in particular to a capacitor housing, an integrated component and a preparation method thereof. Background Art

[0002] In motor controllers, the bulky and heavy nature of busbar capacitors is a major obstacle to miniaturization. This necessitates a well-designed capacitor heat dissipation and packaging structure to effectively reduce the capacitor's size, achieve high power density, and achieve a platform-based product design and low cost. However, existing capacitor designs, especially when used with power modules, incorporate heat sinks or cooling channels outside the capacitor housing. This arrangement creates a long distance between the heat dissipation surface and the heat source, resulting in poor heat dissipation efficiency and limited housing space utilization, leading to a bulky capacitor. Summary of the Invention

[0003] In order to overcome the above technical defects, the purpose of the present invention is to provide a capacitor housing, an integrated component and a preparation method thereof, so as to solve the problem that the existing capacitor housing has additional heat dissipation channels or radiators, resulting in low heat dissipation efficiency and large volume.

[0004] The present invention discloses a capacitor housing.

[0005] Adopt metal one-piece molding;

[0006] It includes a shell support part and a limit part, which are used to integrate the heat dissipation channel and the capacitor core;

[0007] The heat dissipation water channel is arranged on the top surface of the shell support portion, and partially sinks and extends into the shell support portion;

[0008] The limiting portion is vertically arranged on the bottom surface of the housing support portion, and is used to form a limiting area for accommodating the capacitor core;

[0009] The heat dissipation water channel covers the limited area;

[0010] The limiting portions are provided corresponding to both sides of the heat dissipation water channel in the width direction and any one side in the length direction to form circumferential side walls of the limiting area.

[0011] Preferably, the shell support portion is provided with a water inlet and a water outlet on both sides of the heat dissipation water channel respectively;

[0012] The water inlet and the water outlet are arranged perpendicular to the heat dissipation water channel and extend out of the bottom surface of the shell support portion respectively.

[0013] Preferably, the limiting portion has a thickness that gradually decreases as it moves away from the end connected to the shell support portion.

[0014] Preferably, the side wall of the limiting portion located in the limiting area is inclined within a preset angle range from an end connected to the shell support portion to an end away from the shell support portion, and the preset angle range is 1-2°.

[0015] Preferably, the housing support portion is provided with a plurality of limiting through holes for connecting the power module.

[0016] The present invention provides an integrated component, comprising the capacitor housing described above:

[0017] Encapsulating a capacitor core in the limiting area of ​​the capacitor housing;

[0018] It also includes at least one power module, which is connected to the capacitor housing and closes the heat dissipation water channel;

[0019] The power module is connected to the capacitor core via a copper busbar.

[0020] Preferably, the capacitor core is wrapped with an insulating isolation film.

[0021] Preferably, one end of the copper busbar is connected to the capacitor core, and the other end is bent toward the top surface of the housing support portion to be connected to the power module.

[0022] The present invention also provides a method for preparing a capacitor housing, which is used to prepare the above-mentioned capacitor housing, comprising:

[0023] The pre-set mold is used for integral die-casting, and demoulding is performed by moving in a direction perpendicular to the top surface of the shell support portion.

[0024] The present invention also provides a method for preparing an integrated component, which is used to prepare the above-mentioned integrated component, comprising:

[0025] Obtaining a capacitor core, a capacitor housing as described in any one of the above items, or a capacitor housing obtained by the above preparation method;

[0026] Insulating and wrapping the capacitor core and assembling it with the capacitor housing;

[0027] Fixing the positions of the capacitor core and the capacitor housing by a preset tool, wherein the capacitor core is confined within the limiting area of ​​the preset tool and the capacitor housing;

[0028] Glue is poured between the preset tooling and the limiting area of ​​the capacitor housing, and after curing at 100°C for 6 hours, the preset tooling is demoulded;

[0029] The power module is fixed on the capacitor housing and connected to the capacitor core through a copper busbar.

[0030] Compared with the existing technology, the above technical solution has the following beneficial effects:

[0031] The present application provides a capacitor housing, an integrated component, and a preparation method thereof, wherein an integrally formed metal capacitor housing is provided, wherein the capacitor housing can simultaneously integrate a capacitor, a power module, and a heat dissipation channel, wherein there is no closed cavity and no welding process is required, and the limiting area for capacitor potting is open, with one side being an extension of the capacitor copper bar and a potting surface, and one side being a mold demoulding surface. During demoulding, the overall upward and downward movement distance of the capacitor housing is short, and the utilization rate of the capacitor cavity is high. The connection of the power module is achieved through the limiting through-hole using a plug or a special screw, so that the metal surface of the capacitor core close to the heat dissipation channel is flat, reducing thermal resistance, improving heat dissipation efficiency, and having a compact structure and simple assembly. This integrated design solves the problem that the existing capacitor housing has an additional heat dissipation channel or radiator, the heat dissipation surface is far away from the capacitor heat source, the heat dissipation efficiency is low, and the space utilization rate is low, and the volume occupies a large area. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 is a schematic structural diagram of a capacitor housing according to various embodiments of a capacitor housing, an integrated assembly, and a method for manufacturing the same;

[0033] FIG2 is a schematic structural diagram of the limiting area in various embodiments of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention;

[0034] FIG3 is a schematic structural diagram of a limiting portion in various embodiments of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention;

[0035] FIG4 is a schematic structural diagram of a heat dissipation channel in various embodiments of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention;

[0036] FIG5 is a schematic structural diagram of a limiting through hole in various embodiments of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention;

[0037] FIG6 is a schematic structural diagram of a mold in a second embodiment of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention;

[0038] FIG7 is a schematic structural diagram of tooling in a fourth embodiment of a capacitor housing, an integrated assembly, and a method for manufacturing the same according to the present invention.

[0039] Figure numerals: 1-capacitor housing; 11-housing support portion; 12-limiting portion; 13-limiting area; 2-heat dissipation channel; 3-capacitor core; 4-copper busbar; 5-water inlet; 6-water outlet; 7-limiting through hole; 8-power module; 9-insulating isolation membrane. DETAILED DESCRIPTION

[0040] The advantages of the present invention are further described below with reference to the accompanying drawings and specific embodiments.

[0041] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0042] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. Depending on the context, the word "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determining".

[0044] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0045] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal communication between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0046] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention and have no specific meaning. Therefore, "module" and "component" can be used interchangeably.

[0047] Example 1: This embodiment provides a capacitor housing. It should be emphasized that the capacitor housing is a metal shell and is die-cast as an integral unit. Referring to Figures 1 to 6, the capacitor housing can be used to integrate capacitors, heat dissipation channels, and power modules. Specifically, it includes a shell support portion, which can be set to a rectangular parallelepiped shape, and a limiting portion for integrating the heat dissipation channel and the capacitor core; the heat dissipation channel is arranged on the top surface of the shell support portion, and partially sinks and extends into the shell support portion; the limiting portion is vertically arranged on the bottom surface of the shell support portion, and is set to a plate-like structure for forming a limiting area for accommodating the capacitor core; the heat dissipation channel covers the limiting area, so that after the cooling water enters the heat dissipation channel, the capacitor core can be dissipated through the shell support portion, so that heat transfer only needs to pass through the shell support portion, and no other heat loss will be generated, thereby having a high heat dissipation efficiency.

[0048] It should also be noted that the top and bottom surfaces of the housing support portion are two opposite sides and are not limited to a specific side. When any side of the housing support portion is determined to be the top surface, the side opposite to it is the bottom surface. At the same time, it can be understood that the capacitor module formed by integrating the capacitor core into the capacitor housing in the present application is also a structure protected by the present application. The limiting area of ​​the capacitor housing provided in this embodiment for accommodating the capacitor core is different from the existing design. Specifically, the limiting portion is correspondingly arranged on both sides of the heat dissipation water channel along the width direction and on either side along the length direction to form the circumferential side wall of the limiting area. That is, the limiting area is not closed on all sides like the existing design, leaving the side opposite to the housing support portion for placing the capacitor core, nor is it the existing design that leaves one side of the limiting area circumferentially for placing the capacitor core, while the other sides and the side opposite to the housing support portion are closed. The design of the limiting area formed around three sides is on the one hand to achieve the limitation of the capacitor core to integrate the capacitor core, and on the other hand to reduce the space occupied by the entire capacitor housing to a certain extent. Furthermore, capacitor cores of different thicknesses can be integrated in actual scenarios to meet the needs of actual scenarios.

[0049] In a preferred embodiment, the heat dissipation channel can be arranged in the same direction along the length and width of the housing support portion, with its width and length being slightly smaller than the length and width of the housing support portion. This allows the housing support portion to protrude a portion of the heat dissipation channel, controlling water inlet and outlet in the extended portion. Specifically, the housing support portion is provided with a water inlet and a water outlet on either side of the heat dissipation channel, respectively, communicating with the heat dissipation channel. The water inlet and water outlet are arranged perpendicular to the heat dissipation channel and extend beyond the bottom surface of the housing support portion.

[0050] Based on the above, as a supplement, the water inlet and the water outlet in this embodiment are arranged to be perpendicular to the heat dissipation water channel and are connected to the heat dissipation water channel. That is to say, the ends of the water inlet and the water outlet are partially connected to the heat dissipation water channel (that is, the recessed space formed by sinking into the shell support part), and the side surfaces of the ends of the water inlet and the water outlet intersect with the bottom wall of the heat dissipation water channel. The entire shell support part has no enclosed space, does not require welding, and can be die-cast as a whole through a mold.

[0051] In a preferred embodiment, the thickness of the limiting portion gradually decreases toward the end away from the end connected to the housing support portion. The limiting portion surrounds and is used to form a limiting area for acting on the capacitor core, and has a certain height extending out. During the die-casting demolding process of the capacitor housing in this embodiment, demolding is performed along the extended height direction, that is, demolding is performed in the vertical direction from the top surface to the bottom surface of the housing support portion. Therefore, during the demolding process, the limiting portion moves in the vertical direction. At this time, the thickness change is set so that the limiting portion has a smaller thickness at a deeper position of the mold demolding and a larger thickness at a shallower position of the mold demolding, thereby forming an inclined surface on both side walls to facilitate demolding.

[0052] To be more specific, as described above, due to the need for demolding, the thickness of the limiting portion will vary to a certain extent. Specifically, the side wall of the limiting portion located in the limiting area is inclined at a preset angle range from the end connected to the shell support portion to the end away from the shell support portion. The preset angle range is 1-2°. The limiting portion is inclined relative to the two side walls inside and outside the limiting area so that the limiting portion can be viewed from the side of the shell support portion as an inverted trapezoid, which is thick on the top and thin on the bottom.

[0053] Based on the above, the limiting portion will form a side wall surrounding the circumferential part (not all) of the limiting area, and the overall design of the limiting portion is as described above. The capacitor housing of this embodiment can be demolded along the direction in which the limiting portion extends from the housing support portion, that is, demolded along the thickness direction of the capacitor core, rather than demolding along the length / width direction of the capacitor core as commonly used in the existing method. It should be noted that the inner wall is inclined to form an inclined surface for the purpose of facilitating demolding, but since the capacitor core is mostly rectangular, when the capacitor core is placed in the limiting area, there will be a gap between the inclined surface formed and the capacitor core, and most of the circumferential side is open to allow the capacitor core to enter. As the capacitor core goes deeper, it may be restricted by the inner diameter, that is, there is a part of the area with thicker thickness. The inclined space is invalid space, which will cause a part of the space loss of the capacitor housing. The limiting space formed by the limiting portion in this embodiment does not require the capacitor core to enter from one side of the circumference.

[0054] At the same time, it can be understood that the thickness direction of the capacitor core is smaller than the length / width direction of the capacitor core, which results in a shorter distance for the overall up and down movement of the capacitor housing during demolding, thereby making the length of the inclined surface formed by the thickness change of the above-mentioned limiting portion shorter than the existing required length, so the inclined surface formed is shorter, resulting in a smaller space loss caused by the inclined surface. As an example, the effective volume of the capacitor housing demolded along the length direction of the capacitor core is 106*19.8, and the space loss volume is 117*27. The volume utilization rate calculated from this, that is, the proportion of the effective volume to the sum of the effective volume and the loss volume, or the volume calculated according to the inner wall of the limiting area surrounded by the limiting portion / the volume calculated according to the outer wall of the limiting area surrounded by the limiting portion, is approximately 66%. The capacitor housing provided in this application has a smaller volume utilization rate of 98% due to the smaller inclined surface in the demolding direction.

[0055] In a preferred embodiment, the shell support portion is provided with a plurality of limiting through holes for connecting the power module. The limiting through holes can be arranged around the heat dissipation channel, such as at the four corners of the heat dissipation channel, or can be arranged inside the heat dissipation channel. In this case, the sealing after connection needs to be considered. In this embodiment, the power module is fixed to the shell support portion by inserting screws into the limiting through holes. As an option, a plug or a special screw can be used to make the screw fit tightly with the limiting through hole and not extend out of the shell support portion. This is different from the local protrusion towards the side of the capacitor core set to achieve the screw tightening depth in the prior art. As a result, the heat dissipation path formed by the capacitor core close to the heat dissipation channel through the metal surface is short and has low thermal resistance, thereby increasing the heat conduction capacity many times, further improving the heat dissipation efficiency, and eliminating the existing 2mm thermal resistance layer with a thermal conductivity coefficient of ~0.3W / (m·K) caused by the provision of the protrusion.

[0056] This embodiment utilizes mold-integrated molding, and a metal capacitor housing is provided to integrate the power module and the heat dissipation water channel at the same time. The structure is compact and the assembly is simple. There is no closed cavity, and the manufacturing of parts does not require welding technology. The capacitor potting cavity (i.e., the above-mentioned limiting area) is open, with one side being the extension and potting surface of the capacitor copper busbar and the other side being the mold demolding surface. The demolding size is small, and the utilization rate of the capacitor cavity is high. The capacitor core and the copper busbar are close to the water channel side, and a plug or a special tool is used to achieve the connection of the power module, avoiding the local setting of bumps, so that the capacitor core is close to the metal surface of the water channel at a short distance, the thermal resistance is low, and the heat dissipation efficiency is further improved.

[0057] Example 2: This example provides a method for preparing a capacitor housing, which is used to prepare the capacitor housing in the above-mentioned Example 1, refer to Figure 6, including: using a preset mold for one-piece die-casting. Based on the above-mentioned Example 1, the water inlet and outlet of the capacitor housing are set to be perpendicular to the heat dissipation water channel and are connected to the heat dissipation water channel. Therefore, there is no closed cavity inside the entire capacitor housing, which facilitates one-piece molding.

[0058] Furthermore, the demoulding is performed by moving up and down in a direction perpendicular to the top surface of the shell support portion, that is, the capacitor shell can be demoulded along the direction in which the limiting portion extends out of the shell support portion, that is, demoulding is performed along the thickness direction of the capacitor core, or it can be regarded as being demoulded along the direction of the shortest side of the capacitor core (up and down, rather than the existing left and right direction), so that the inclined surface set for facilitating demoulding is shorter to save the invalid space formed by the inclined surface. One side of the limiting area in the capacitor shell prepared in this embodiment is the extension and filling surface of the capacitor copper bus, and the other side is the mold demoulding surface. The demoulding size (that is, the distance the shell moves as a whole during demoulding) is small, and the utilization rate inside the capacitor cavity is high.

[0059] Example 3: This embodiment provides an integrated component, refer to Figures 1 to 7, including a capacitor housing according to any one of the above-mentioned Example 1: a capacitor core is encapsulated in a limited area of ​​the capacitor housing; and also includes at least one power module, which is connected to the capacitor housing and closes the heat dissipation water channel; the integrated component encapsulates the capacitor, and integrates the power module and the heat dissipation water channel, and the heat is dissipated from the capacitor core and the power module respectively through the two sides of the heat dissipation water channel. The number and size of the power modules can be specifically set according to the actual scenario.

[0060] In a preferred embodiment, the limiting area encapsulates the capacitor core. In order to improve the safety of use, the capacitor core needs to be insulated and isolated. Specifically, an insulating isolation film is wrapped around the outside of the capacitor core, and the insulating isolation film completely covers the circumference of the capacitor core. Other existing insulating isolation methods can also be integrated into the capacitor housing, including but not limited to coating an insulating coating.

[0061] Specifically, in this embodiment, the power module is connected to the capacitor core through a copper busbar, one end of the copper busbar is connected to the capacitor core, and the other end is bent toward the top surface of the shell support portion to connect to the power module. In addition, the above-mentioned copper busbar is bent at the connection with the capacitor core to fit the side of the capacitor shell and extend upward to the power module, that is, it is arranged on one side of the capacitor shell to facilitate the setting of the copper busbar support frame or the connection of other modules, thereby improving the applicability of the integrated component.

[0062] The integrated component provided in this embodiment integrates capacitors, heat dissipation channels and power modules, and utilizes the integrally formed capacitor housing described in Example 1. There is no need to withdraw the capacitor core from the side, and there are no welded water channels. Heat is transferred directly through the metal housing, resulting in high heat dissipation efficiency and high space utilization. Furthermore, the integrated component has a compact structure and can be assembled with other modules or components under motor control, solving the problem that the existing capacitor housing has additional heat dissipation channels or radiators, which has low heat dissipation efficiency, large volume, and inconvenient module arrangement.

[0063] Example 4: This example also provides a method for preparing an integrated component, which is used to prepare the integrated component described in Example 3 above, including: obtaining a capacitor core, the capacitor housing described in Example 1 above, or the capacitor housing obtained by the preparation method of Example 2 above, specifically, including the following steps:

[0064] S1: Insulating and wrapping the capacitor core and assembling it with the capacitor housing;

[0065] Specifically, the capacitor housing is made of metal and is integrally formed. In this embodiment, an insulating isolation film is used to wrap the capacitor core. Other existing insulating isolation materials can also be used to achieve this, and it is placed in a limited area within the capacitor housing to achieve assembly of the capacitor core and the capacitor housing.

[0066] S2: Fixing the positions of the capacitor core and the capacitor housing by a preset tool, wherein the capacitor core is confined within a limited area of ​​the preset tool and the capacitor housing;

[0067] As an explanation, the above-mentioned preset tooling (see Figure 7) can be optionally set as a plate-like structure, the size of which can be slightly larger than the length and width of the capacitor housing, and is used to fit with the end of the limiting portion on the capacitor housing, that is, to cover the side of the limiting area opposite to the bottom surface of the housing support portion, so that the capacitor core is restricted in the limiting area and cannot move out of the limiting area. Since the capacitor core can still move in the limiting area at this time, it needs to be fixed, as described below, by further fixing it by glue. Specifically, the tooling can be coated with a layer / film on the surface of the side in contact with the capacitor housing to prevent adhesion with the glue, so as to facilitate subsequent demolding.

[0068] S3: pouring glue between the preset tooling and the limiting area of ​​the capacitor housing, curing at 100° C. for 6 hours, and then demoulding the preset tooling;

[0069] Based on the above, after the preset tooling is arranged on one side of the capacitor housing, the five circumferential sides of the limiting area are closed, and the remaining side is open in one direction. Glue is poured into the limiting area from the side where the opening is located, and high-temperature curing is performed to fix the capacitor core in the limiting area and integrate it on the capacitor housing to form an integrated capacitor module. The capacitor module can also be directly used in motor control or assembled with other modules / components.

[0070] S4: Fix the power module on the capacitor housing and connect it to the capacitor core through a copper busbar.

[0071] Specifically, as described in the above-mentioned embodiment 1, a limiting through hole is provided on the capacitor housing. Optionally, a plug or a special screw can be used to make the screw fit tightly with the limiting through hole. The position of the limiting through hole does not protrude toward the capacitor core, so that the heat dissipation surface on the side where the capacitor core is located is completely flat, thereby improving the space utilization rate of the capacitor housing. At the same time, the heat dissipation water channel can also dissipate heat to the capacitor core through a metal layer, thereby improving the heat dissipation efficiency to a certain extent.

[0072] It should be noted that the above step S4 is to connect the power module and the capacitor housing. Since the power module and the capacitor core are arranged on both sides of the capacitor housing, this step can be completed before S1, that is, before the capacitor core is assembled, or it can be completed after S3. It can be selected according to the specific implementation scenario. The power module can apply various existing power modules, or other modules can be used to replace the power module, and it can be connected and adapted to the capacitor housing.

[0073] Based on the above steps S1-S4, an integrated component integrating capacitors, power modules and heat dissipation channels can be prepared to solve the problem that the existing capacitor housing is additionally provided with heat dissipation channels or radiators, which occupies a large volume and is inconvenient for module arrangement. At the same time, during the preparation process, the capacitor housing is a metal integral die-casting molding with integrated heat dissipation channels. The capacitor core and the capacitor housing are fixed by a preset tooling, so that the limiting area set for the capacitor core on the capacitor housing does not need to be closed, so that it forms an open space. Therefore, not only is the distance moved by the capacitor housing as a whole smaller during demoulding, but the distance of the inclined plane set for demoulding is smaller, resulting in a smaller invalid volume, and the space utilization rate in the formed capacitor housing is higher. At the same time, it can also adapt to capacitor cores of other different sizes, thereby improving application adaptability.

[0074] Therefore, the capacitor housing or integrated component prepared based on the above-mentioned embodiment 2 or 4 realizes the integrated installation of the capacitor and the power module to form a power component, which has a compact structure and simple assembly, is convenient for the platform design of the motor controller, has a small size and low cost, and is integrally formed of metal materials with high heat dissipation efficiency. It can also be integrated with other modules / components for application in motor control.

[0075] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A capacitor housing, characterized in that: It is integrally formed of metal; It includes a housing support part and a limiting part, and is used to integrate a heat dissipation water channel and a capacitor core; The heat dissipation water channel is arranged on the top surface of the housing support part, and part of it sinks and extends into the housing support part; The limiting part is vertically arranged on the bottom surface of the housing support part, and is used to form a limiting area for accommodating the capacitor core; The heat dissipation water channel covers the limiting area; The limiting part is correspondingly arranged on both sides of the heat dissipation water channel along the width direction and on any one side along the length direction, so as to form the circumferential side walls of the limiting area.

2. The capacitor housing according to claim 1, characterized in that: The housing support part is respectively provided with a water inlet part and a water outlet part on both sides of the heat dissipation water channel; The water inlet part and the water outlet part are arranged perpendicular to the heat dissipation water channel and respectively extend out of the bottom surface of the housing support part.

3. The capacitor housing according to claim 1, characterized in that: The thickness of the limiting part gradually decreases along the direction away from the end connected to the housing support part.

4. The capacitor housing according to claim 3, characterized in that: The side wall of the limiting part located in the limiting area is inclined at a preset angle range from the end connected to the housing support part to the end far away from the housing support part, and the preset angle range is 1-2°.

5. The capacitor housing according to claim 1, characterized in that: The housing support part is provided with a plurality of limiting through holes for connecting a power module.

6. An integrated component, characterized in that: It includes the capacitor housing according to any one of claims 1-5 above: A capacitor core is encapsulated in the limiting area of the capacitor housing; It further includes at least one power module, and the power module is connected to the capacitor housing and closes the heat dissipation water channel; The power module is connected to the capacitor core through a copper busbar.

7. The integrated component according to claim 6, characterized in that: The capacitor core is wrapped with an insulating isolation film.

8. The integrated component according to claim 6, characterized in that: One end of the copper busbar is connected to the capacitor core, and the other end is bent towards the top surface of the housing support part to be connected to the power module.

9. A preparation method of a capacitor housing, characterized in that, For preparing the capacitor housing according to any one of claims 1-5 above, it includes: Using a preset mold for integral die-casting molding, and performing moving demolding along the direction perpendicular to the top surface of the housing support part.

10. A method for preparing an integrated component, characterized in that, For preparing the integrated component according to any one of claims 6-8 above, it includes: Obtaining a capacitor core, the capacitor housing according to any one of claims 1-5 above or the capacitor housing obtained by the preparation method according to claim 9 above; Insulatingly wrapping the capacitor core and assembling it with the capacitor housing; Fixing the positions of the capacitor core and the capacitor housing through a preset tooling, wherein the capacitor core is restricted within the preset tooling and the limiting area of the capacitor housing; Pouring glue between the preset tooling and the limiting area of the capacitor housing, and after curing at 100°C for 6 hours, demolding the preset tooling; Fixing the power module on the capacitor housing and connecting it to the capacitor core through a copper busbar.

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