Temperature measuring apparatus, cooking appliance, and temperature measuring method

Abstract

Embodiments of the present application provides a temperature measuring apparatus. The temperature measuring apparatus comprises a first temperature sensor, a second temperature sensor, and a processing unit. The first temperature sensor is used to acquire a first temperature value of a first measurement position in a heat conduction channel, the second temperature sensor is used to acquire a second temperature value of a second measurement position in the heat conduction channel, and the processing unit is electrically connected to the first temperature sensor and the second temperature sensor. The first temperature sensor and the second temperature sensor can acquire the first temperature value and the second temperature value, respectively, and the distance between the first measurement position and an object on which temperature measurement is to be performed is not equal to the distance between the second measurement position and said object; thus, a gradient occurs between the first temperature value and the second temperature value. The processing unit can determine, on the basis of gradient information, the temperature of the object on which temperature measurement is to be performed. When said object may be a carrier plate, the temperature of the carrier plate can be monitored without providing a hole on the carrier plate, and the hole-free configuration can ensure the structural performance of a cooking appliance. The present application further provides a cooking appliance and a temperature measuring method therefor.

Description

Temperature measuring device, cooking appliance, and temperature measuring method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application with application number 202311867480.7 filed with the China Patent Office on December 29, 2023, entitled “Temperature measuring device, cooking appliance and temperature measurement method” and the Chinese patent application with application number 202323663773.1 filed with the China Patent Office on December 29, 2023, entitled “Cross-media temperature measuring device and kitchen cooking appliance”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of household appliances, and in particular to a temperature measuring device, a cooking utensil, and a temperature measuring method. Background Art

[0004] With the advancement of technology, household appliances have gradually entered people's lives, among which cooking utensils play an indispensable role in people's lives.

[0005] To improve the safety and performance of cooking appliances, they are often equipped with temperature measuring devices that detect, for example, the heating temperature of the appliance. The appliance can adjust power based on the heating temperature to ensure it remains within a safe temperature range, and also adjust the heating effect accordingly. To prevent damage and aging to the outer casing of the appliance due to heat, the outer casing is often constructed of high-thermal-resistance, high-temperature-resistant materials. Heat transfers slowly within the outer casing, preventing damage to components within the appliance. However, since the temperature measuring device is located within the outer casing, its measurement results are affected by the outer casing. This makes temperature measurement accuracy difficult to guarantee, and the results exhibit a lag. Using these temperature measurement results as the basis for controlling the appliance makes it difficult to ensure timely and accurate operation, which in turn reduces the safety and performance of the appliance. Summary of the Invention

[0006] The embodiments of the present application provide a temperature measuring device, a cooking utensil, and a temperature measuring method to at least partially improve the above-mentioned technical problems.

[0007] In a first aspect, an embodiment of the present application provides a temperature measuring device, which is used to measure the temperature of an object to be measured, wherein the object to be measured includes a contact surface and a bearing surface facing each other, and a heat conduction channel is formed on the side of the object to be measured close to the contact surface. The temperature measuring device includes a first temperature sensor, a second temperature sensor, and a processing unit. The first temperature sensor is used to collect a first temperature value of a first measurement position of the heat conduction channel, and the second temperature sensor is used to collect a second temperature value of a second measurement position of the heat conduction channel. The distances between the first measurement position and the second measurement position and the contact surface are not equal. The processing unit is electrically connected to the first temperature sensor and the second temperature sensor, and is used to determine the temperature of the bearing surface based on the first temperature value and the gradient between the first temperature value and the second temperature value.

[0008] In one embodiment, the processing unit is configured to use the following formula:

[0009] Determine the temperature of the bearing surface, wherein T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured, R2 is the thermal resistance value of the heat-conducting medium between the first measurement position and the second measurement position, and C1 is the heat capacity value of the object to be measured.

[0010] In one embodiment, the processing unit is further configured to: The mapping relationship between Determine R1, the processing unit is further configured to determine R1 according to C1 and T1 and The mapping relationship between Determine C1, the processing unit is further configured to determine C1 based on R2, T2 and The mapping relationship between Determine R2, where is the change of T2 per unit time.

[0011] In one embodiment, the temperature measuring device further includes an insulator, which forms a heat conduction channel filled with a heat conduction medium. One end of the heat conduction channel is used to contact the contact surface to guide the heat flow into the heat conduction channel.

[0012] In one embodiment, the heat transfer medium is air.

[0013] In one embodiment, a heat conductor is provided in the heat conduction channel, the heat conductor is formed by a heat conduction medium, the heat conductor has a first surface and a second surface opposite to each other and a side surface connected between the first surface and the second surface, the first surface is used to contact the medium in contact with the object to be measured; the first temperature sensor is provided on the heat conductor and adjacent to the first surface; the second temperature sensor is provided on the heat conductor and adjacent to the second surface.

[0014] In one embodiment, a line connecting the temperature measuring point of the first temperature sensor and the temperature measuring point of the second temperature sensor is perpendicular or nearly perpendicular to the first surface.

[0015] In one embodiment, the first temperature sensor and the second temperature sensor are both disposed on or near the central axis of the heat conductor.

[0016] In one embodiment, the heat conductor includes a contact portion and a supporting portion, the supporting portion is connected to the contact portion, the first surface is located at the contact portion, the cross-sectional area of ​​the contact portion is larger than the cross-sectional area of ​​the supporting portion, and the heat insulator includes a first cylinder and a second cylinder connected to each other, the first cylinder is sleeved outside the supporting portion, and the second cylinder is sleeved outside the contact portion.

[0017] In one embodiment, the heat conductor is provided with a first mounting groove and a second mounting groove, the first temperature sensor is provided in the first mounting groove, and the second temperature sensor is provided in the second mounting groove.

[0018] In one embodiment, the first mounting groove is opened on the first surface, and the second mounting groove is opened on the second surface.

[0019] In one embodiment, an opening of one of the first mounting groove and the second mounting groove is formed on a side surface, and an opening of the other one is formed on the first surface or the second surface or the side surface.

[0020] In one embodiment, the first temperature sensor and the second temperature sensor are both disposed inside the heat conductor, and the heat conductor, the first temperature sensor, and the second temperature sensor are integrally disposed.

[0021] In one embodiment, the temperature measuring device further includes: a wire, one end of the wire is used to be electrically connected to the first temperature sensor and the second temperature sensor, and the other end of the wire is led out from a side of the thermal insulation body adjacent to the second surface.

[0022] In one embodiment, the thermal conductivity of the thermally conductive medium is higher than the thermal conductivity of the thermal insulator.

[0023] In one embodiment, the first temperature sensor and / or the second temperature sensor is a thermal resistance sensor, a thermocouple sensor, an infrared thermal radiation sensor, or an ultrasonic temperature sensor.

[0024] In a second aspect, an embodiment of the present application provides a cooking utensil comprising an object to be measured and the temperature measuring device of the first aspect, wherein one end of a heat conduction channel of the temperature measuring device contacts the object to be measured to conduct heat flow into the heat conduction channel.

[0025] In one embodiment, the object to be temperature measured includes a supporting plate, which includes a supporting surface for supporting the cookware and a contact surface, and the heat conduction channel abuts against the contact surface to guide the heat flow on the supporting plate into the heat conduction channel.

[0026] In one embodiment, the object to be temperature measured further includes a pot suitable for being supported on the supporting surface.

[0027] In a third aspect, an embodiment of the present application provides a temperature measurement method, which is applied to the cooking appliance according to the second aspect, and the method includes:

[0028] Obtaining a first temperature value and a second temperature value;

[0029] determining gradient information between the first measurement bit and the second measurement bit according to the first temperature value and the second temperature value;

[0030] The temperature of the bearing surface is determined according to the first temperature value and the gradient information.

[0031] In one embodiment, determining the temperature of the bearing surface according to the gradient information includes:

[0032] Determine the temperature of the bearing surface using the following formula:

[0033] Determine the temperature of the bearing surface, wherein T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured, R2 is the thermal resistance value of the heat-conducting medium located between the first measurement position and the second measurement position, and C1 is the heat capacity value of the object to be measured.

[0034] In one embodiment, before determining the temperature of the object to be measured based on the gradient information, the method further includes:

[0035] According to R1 and T1 and The mapping relationship between Determine R1 based on C1, T1 and The mapping relationship between Determine C1 based on R2, T2 and The mapping relationship between Determine R2, where is the change of T2 per unit time.

[0036] In one embodiment, the method further comprises:

[0037] Determining gradient information between the first measurement position and the bearing surface according to the first temperature value and the temperature of the bearing surface;

[0038] The temperature of the cookware suitable for being carried on the carrying surface is determined according to the temperature value of the carrying surface and the gradient information between the first measurement position and the carrying surface.

[0039] Embodiments of the present application provide a temperature measurement device and a cooking appliance that can support a cookware on a support surface and heat the cookware during operation. Heat is transferred along the object to be measured, forming a heat flow that is directed into a heat conduction channel. The temperature at each location within the heat conduction channel decreases along the direction of the heat flow. A first temperature sensor and a second temperature sensor can respectively capture a first temperature value and a second temperature value. Because the first and second measurement positions are unequally spaced from the object to be measured, a gradient appears between the first and second temperature values. A processing unit can determine the temperature of the support surface based on the first temperature value and the gradient information. If the object to be measured is a support plate, the temperature of the support plate can be measured without drilling holes in the plate, ensuring the structural performance of the cooking appliance and improving its safety and protective features. Furthermore, the temperature measurement device can obtain the temperature of the object to be measured in real time, ensuring timely and reliable measurement results. Subsequently, the cooking appliance can adjust parameters such as power in real time based on the temperature values ​​to improve cooking performance.

[0040] In the temperature measurement method provided in the embodiment of the present application, heat flow is introduced and transmitted between the first measurement position and the second measurement position, and the first temperature value and the second temperature value can be measured at the first measurement position and the second measurement position, respectively. Because the distances between the first measurement position and the second measurement position and the object to be measured are not equal, the first temperature value and the second temperature value form a gradient. Based on the first temperature value and the second temperature value, the gradient information between the first measurement position and the second measurement position can be determined. Based on the first temperature value and the gradient information, the temperature information of the object to be measured can be determined, thereby achieving the effect of cross-medium temperature measurement. The temperature measuring device can complete the temperature measurement process without directly contacting the object to be measured. It can both ensure the accuracy of the temperature measurement method and reduce the difficulty of temperature measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0042] FIG1 is a schematic structural diagram of a cooking utensil proposed in an embodiment of the present application;

[0043] FIG2 is a block diagram of a cooking appliance according to an embodiment of the present application;

[0044] FIG3 is a schematic structural diagram of another temperature measuring device proposed in an embodiment of the present application;

[0045] FIG4 is a schematic structural diagram of another temperature measuring device proposed in an embodiment of the present application;

[0046] FIG5 is a schematic structural diagram of another temperature measuring device proposed in an embodiment of the present application;

[0047] FIG6 is a schematic structural diagram of another temperature measuring device proposed in an embodiment of the present application;

[0048] FIG7 is a flow chart of a temperature measurement method proposed in an embodiment of the present application.

[0049] Figure 1: Cooking utensil 100, object to be measured temperature 10, supporting plate 11, supporting surface 111, contact surface 112, side surface 113, contact portion 114, supporting portion 115, first mounting groove 116, second mounting groove 117, first surface 118, second surface 119, temperature measuring device 20, heat conduction channel 21, first measuring position 211, second measuring position 212, heat conduction medium 22, insulation 23, first temperature sensor 24, second temperature sensor 25, processing unit 26, cookware 30, first cylinder 141, second cylinder 142, wire 150. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0051] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0052] With the advancement of technology, household appliances have gradually entered people's lives, among which cooking utensils play an indispensable role in people's lives.

[0053] To improve the safety and performance of cooking appliances, cooking appliances are usually equipped with temperature measuring devices. The temperature measuring devices can detect the heating temperature of the cooking appliance, ensure that it is within a safe temperature range, and adjust the heating effect of the cooking appliance according to the temperature. In order to prevent the outer shell of the cooking appliance from being damaged or aged due to heat, the outer shell of the cooking appliance will be made of materials with high thermal resistance and high temperature resistance. Thermal resistance is a physical quantity used to describe the resistance of a material or structure to the conduction of heat flow. That is, the greater the thermal resistance, the smaller its thermal conductivity and the worse the thermal conductivity. Heat is transferred slowly within the outer shell, which can prevent heat from damaging the components within the cooking appliance. However, the temperature measuring device is set inside the outer shell, and the measurement results of the temperature measuring device will be affected by the outer shell, thereby reducing the safety and performance of the cooking appliance.

[0054] In the prior art, a temperature measuring device is inserted into a corresponding hole in the outer casing, allowing the temperature measuring device to directly contact the object to be measured, thereby ensuring measurement accuracy. However, this hole can damage the structural strength and protective performance of the outer casing, seriously affecting the safety and lifespan of the cooking appliance.

[0055] Example

[0056] The present application provides a cooking appliance 100. Please refer to FIG1 . The cooking appliance 100 in this embodiment may be an induction cooker, a microwave oven, an electric stew pot, etc. The following description will take the induction cooker as an example.

[0057] In this embodiment, referring to FIG1 , the cooking utensil 100 may include an object to be measured 10 and a temperature measuring device 20. The object to be measured 10 may be a microcrystalline panel of an induction cooker. In another embodiment, the object to be measured 10 may also be a glass plate of a microwave oven or an inner pot of an electric stew pot, etc., which may be selected according to the specific cooking utensil 100 and heating requirements. A heat conduction channel 21 is formed on one side of the object to be measured 10 close to the contact surface 112, and a heat conduction medium 22 is provided in the heat conduction channel 21. The heat conduction channel 21 may be formed in the temperature measuring device 20, and one end of the heat conduction channel 21 is in contact with the object to be measured 10, so that the heat of the object to be measured 10 can be transferred along the heat conduction channel 21.

[0058] When the cooking appliance 100 starts working, heat is generated in the object to be measured 10. The heat of the object to be measured 10 can be transferred through the heat-conducting medium 22 to form a heat flow in the heat-conducting channel 21. Because the object to be measured 10 and the heat-conducting medium 22 have a certain thermal resistance during the heat transfer process, the object to be measured 10 and / or the heat-conducting medium 22 absorb part of the heat, and the temperature of the object to be measured 10 and the heat-conducting medium 22 rises. Then, as the heat flow direction changes, the heat flow gradually decreases, the heat in the subsequent heat-conducting medium 22 decreases, and the temperature rise is weakened. Furthermore, the farther the heat-conducting medium 22 is from the object to be measured 10, the lower the temperature, and the temperature in the heat-conducting channel 21 shows a decreasing trend in the direction away from the object to be measured 10. The temperature measuring device 20 can measure the temperature values ​​of at least two positions in the heat-conducting channel 21, and the temperature values ​​of multiple positions are gradient. The temperature difference between the multiple locations, as well as parameters such as the thermal resistance and the thermal resistance of the object 10 to be measured, is comprehensively calculated to determine the surface temperature of the object 10 to be measured, away from the temperature measuring device 20. The cooking appliance 100 can then perform subsequent operations based on the temperature value of the object 10 to be measured, such as increasing the heating power to improve the heating effect or decreasing the heating power to ensure cooking safety, thereby improving the performance and safety of the cooking appliance 100.

[0059] It is understandable that, in the heat conduction channel 21 , the more temperature measurement positions the temperature measuring device 20 has, the clearer the obtained temperature distribution in the heat conduction channel 21 is, and the higher the temperature measurement accuracy of the temperature measuring device 20 is.

[0060] Furthermore, to provide a clearer view for the user, the cooking appliance 100 may include a display device that displays the surface temperature of the object 10 to be measured in real time, allowing the user to observe and facilitate subsequent operations. The cooking appliance 100 may also be equipped with an alarm device. When the surface temperature of the object 10 to be measured exceeds a preset safety temperature, the alarm device sounds an alarm, prompting the user to perform operations such as powering off.

[0061] Further, referring to Figures 1 and 2, the object 10 to be temperature-measured may include a carrier plate 11. For example, the carrier plate 11 may be a microcrystalline panel of an induction cooker. The microcrystalline panel has a large thermal resistance and is resistant to high temperatures, which can ensure the cooking safety of the cooking utensil 100. In another embodiment, the carrier plate 11 may also be a ceramic inner pot of an electric stew pot. The carrier plate 11 may include a carrier surface 111 and a contact surface 112. The carrier surface 111 can be used to carry the pot 30, and the contact surface 112 is opposite to the carrier surface 111. The pot 30 can be placed on the carrier surface 111, and the cooking utensil 100 heats the pot 30 when it is in operation. The heat of the pot 30 is transferred to the carrier surface 111, and continues to be transferred along the carrier surface 111 to the contact surface 112. The heat conduction channel 21 is offset against the contact surface 112 to guide the heat flow on the carrier plate 11 into the heat conduction channel 21. Furthermore, heat flow is transmitted within the heat conduction channel 21. FIG2 shows the specific flow direction of the heat flow. The temperature at each position along the heat conduction channel 21 shows a decreasing trend. The temperature measuring device 20 can measure the temperature values ​​of at least two positions in the heat conduction channel 21, and the temperature values ​​at multiple positions show a gradient. Based on the temperature difference between the multiple positions and parameters such as the thermal resistance and the thermal resistance of the support plate 11, the temperature value of the support surface 111 is calculated comprehensively. This can prevent the occurrence of dry burning in the cooking appliance 100, improve the safety of the support plate 11, and ensure the service life of the cooking appliance 100.

[0062] In this embodiment, please continue to refer to Figure 1. The temperature measuring device 20 may include a first temperature sensor 24, a second temperature sensor 25, and a processing unit 26. A first measuring position 211 and a second measuring position 212 are spaced apart in the heat conduction channel 21. The distance between the first measuring position 211 and the second measuring position 212 can be selected according to the specific different heat conduction media 22, but this embodiment does not make a selection. For example, when a heat conduction medium 22 with a high thermal conductivity is used, the thermal resistance of the heat conduction medium 22 per unit volume is small. The heat transfer rate is large, and the temperature change between the first measuring position 211 and the second measuring position 212 is not obvious. The distance between the first measuring position 211 and the second measuring position 212 can be increased to increase the thermal resistance between the first measuring position 211 and the second measuring position 212, so that the temperature difference between the first measuring position 211 and the second measuring position 212 is more obvious, which facilitates subsequent calculations.

[0063] The first measurement position 211 and the second measurement position 212 are unequally spaced from the object 10 to be measured. For example, the first measurement position 211 and the second measurement position 212 can be distributed along the extension direction of the heat conduction channel 21, thereby ensuring that the first measurement position 211 and the second measurement position 212 are unequally spaced from the object 10 to be measured, thereby resulting in a significant temperature difference between the first measurement position 211 and the second measurement position 212. In another embodiment, the first measurement position 211 and the second measurement position 212 can also have other positional relationships. For example, the first measurement position 211 and the second measurement position 212 are arranged side by side relative to the object 10 to be measured. This can be selected based on specific measurement requirements, sensor type, and other factors.

[0064] In one embodiment, the temperature measuring device 20 may further include an insulator 23, which may be connected to the contact surface 112 of the object 10 to be measured by fastener connection, bonding, or the like, and the insulator 23 may enclose a heat conduction channel 21. The insulator 23 may prevent external heat from flowing into the heat conduction channel 21, and may also prevent heat inside the heat conduction channel 21 from diffusing toward the outside, thereby reducing factors that affect the temperature measurement accuracy of the temperature measuring device 20. This may improve the heat flow transmission effect, thereby improving the measurement accuracy of the temperature measuring device 20. The heat conduction channel 21 is filled with a heat conducting medium 22, and the thermal conductivity of the heat conducting medium 22 is higher than that of the insulator 23. The heat conducting medium 22 may be made of metal or heat conducting ceramics, for example, copper. Metal materials have high thermal conductivity and a certain degree of heat resistance. Heat conducting ceramics can withstand higher temperatures, and the structure of heat conducting ceramics is more stable, which may improve the stability of the temperature measuring device 20. The shape and size of the heat conducting medium 22 can be configured to correspond to the heat conducting channel 21, so that the heat conducting channel 21 can cooperate with the heat conducting medium 22. The heat conducting medium 22 can ensure that the heat flow has a certain flow direction and ensure the flow effect of the heat flow, thereby ensuring that the temperature values ​​at multiple locations are gradient, thereby improving the temperature measurement accuracy of the temperature measuring device 20.

[0065] Preferably, when the thermal resistance of the insulator 23 is greater than that of air, air can be used as the heat conducting medium 22. Heat flow can still be transferred through the heat conducting medium 22, and temperature measurement can be performed based on the heat flow rate. This ensures the temperature measurement accuracy of the temperature measuring device 20 while simplifying its structure, reducing the difficulty of installing the cooking device 100.

[0066] In this embodiment, the first temperature sensor 24 and / or the second temperature sensor 25 can be a thermal resistor sensor, a thermocouple sensor, an infrared thermal radiation sensor or an ultrasonic temperature sensor. Among them, the thermal resistor sensor has the advantages of high measurement accuracy, a large measurement range and ease of use, and is suitable for implementation scenarios of low-temperature measurements. Thermocouple sensors have the advantages of fast response speed, strong anti-interference ability and high accuracy, and are suitable for high-interference scenarios and can effectively resist various external interferences. Infrared thermal radiation sensors have the advantages of non-contact, long-distance perception, high-temperature measurement, and high safety. Ultrasonic temperature sensors use advanced sensing technology for real-time measurement, with high measurement accuracy and stable performance, and can be applied to various severe weather conditions. The selection can be made according to the specific implementation scenario and implementation requirements, and this embodiment does not limit it.

[0067] The first temperature sensor 24 can be used to collect a first temperature value at the first measurement position 211, and the second temperature sensor 25 can be used to collect a second temperature value at the second measurement position 212. Specifically, the first temperature sensor 24 can be set at the first measurement position 211, and the first temperature sensor 24 can collect the first temperature value. The second temperature sensor 25 can be set at the second measurement position 212, and the second temperature sensor 25 can collect the second temperature value. The first temperature value of the first measurement position 211 and the second temperature value of the second measurement position 212 are different, wherein the temperature value of the one closer to the object 10 to be measured is higher. For example, the first measurement position 211 is set on the side of the second measurement position 212 closer to the object 10 to be measured. Under the influence of the direction of heat flow transmission, the first temperature value is greater than the second temperature value.

[0068] In another embodiment, when the first temperature sensor 24 and the second temperature sensor 25 are non-contact sensors, such as infrared thermal radiation sensors, the first temperature sensor 24 can obtain the first temperature value by detecting a thermal radiation signal, and the second temperature sensor 25 can obtain the second temperature value by detecting a thermal radiation signal.

[0069] The processing unit 26 is electrically connected to the first temperature sensor 24 and the second temperature sensor 25. The processing unit 26 can provide power and / or transmit signals to the first temperature sensor 24 and the second temperature sensor 25. Information such as the first temperature value and the second temperature value can be transmitted to the processing unit 26 by the first temperature sensor 24 and the second temperature sensor 25, respectively.

[0070] The heat conductor 110 has a first surface 118 and a second surface 119 facing each other and a side surface 113 connected between the first surface 118 and the second surface 119 . The first surface 118 is used to contact the medium of the object to be measured. The heat insulator 23 can be mounted on the side surface 113 .

[0071] The embodiments of the present application do not limit the specific structure and material of the heat conductor 110. For example, in some embodiments, the heat conductor 110 can be made of a material with high thermal conductivity, such as metal, ceramic, graphite, etc. These materials have excellent thermal conductivity, can quickly transfer heat, reduce thermal resistance, and improve heat conduction efficiency. The specific thermal conductive material to be used can be selected according to actual conditions.

[0072] In this embodiment, the longitudinal cross-section of the heat conductor 110 can be roughly T-shaped. The heat conductor 110 can include a contact portion 114 and a support portion 115. The support portion 115 can be connected to the contact portion 114. The first surface 118 can be located at the contact portion 114. The cross-sectional area of ​​the contact portion 114 can be greater than the cross-sectional area of ​​the support portion 115. It can be understood that the embodiment of the present application does not limit the specific structure of the support portion 115 and the contact portion 114. For example, the support portion 115 and the contact portion 114 can both be cylindrical structures. For another example, the support portion 115 and the contact portion 114 can both be rectangular structures. For another example, one of the support portion 115 and the contact portion 114 is a rectangular structure and the other is a cylindrical structure, etc.

[0073] The embodiment of the present application is explained by taking the example that the support portion 115 and the contact portion 114 are both cylindrical structures. The cross-sectional area of ​​the contact portion 114 is the diameter of the contact portion 114, and the cross-sectional area of ​​the support portion 115 is the diameter of the support portion 115. The cross-sectional area of ​​the contact portion 114 is larger than the cross-sectional area of ​​the contact portion 114, which can make the contact area between the contact portion 114 and the object to be measured 10 larger, thereby facilitating the object to be measured 10 to transfer heat to the heat conductor 110, so as to increase the speed at which the first temperature sensor 24 and the first temperature sensor 25 sense the temperature of the heat conductor 110, thereby improving the temperature measurement efficiency of the cross-medium temperature measuring device 20.

[0074] Furthermore, in this embodiment, the heat conductor 110 may also be provided with a first mounting groove 116 and a second mounting groove 117. The first mounting groove 116 and the second mounting groove 117 may be used to accommodate the first temperature sensor 24 and the first temperature sensor 25, respectively. It should be noted that the embodiment of the present application does not specifically limit the first mounting groove 116 and the second mounting groove 117. For example, an opening may be provided on the outer surface of the heat conductor 110 to form a mounting groove. It can be understood that the embodiment of the present application does not limit the specific position of the above-mentioned opening.

[0075] Please continue to refer to Figure 1. In this embodiment, the first mounting groove 116 and the second mounting groove 117 can both be set on the support portion 115. Specifically, the first mounting groove 116 and the second mounting groove 117 can be set on the side 113, and the opening of the first mounting groove 116 and the opening of the second mounting groove 117 are formed in the same direction, which can facilitate the production and processing of the heat conductor 110.

[0076] In one embodiment, the first temperature sensor 24 is disposed within the heat conductor 110 and adjacent to the first surface 118. The first temperature sensor 24 can be used to measure the temperature within the heat conductor 110 adjacent to the first surface 118. The first temperature sensor 25 is disposed within the heat conductor 110 and adjacent to the second surface 119. The first temperature sensor 25 can be used to measure the temperature within the heat conductor 110 adjacent to the second surface 119.

[0077] It should be noted that in the embodiment of the present application, the first temperature sensor 24 and the first temperature sensor 25 are spaced a certain distance apart in a direction perpendicular to the first surface 118 to facilitate a temperature difference between the first temperature sensor 24 and the first temperature sensor 25, thereby facilitating the calculation of the heat flux within the heat conductor 110. It should be noted that since the temperature of the object to be measured gradually transfers from the first surface 118 to the second surface 119, and this temperature transfer process takes time, there is a temperature difference between the first temperature sensor 24 and the first temperature sensor 25.

[0078] In one embodiment, the line connecting the temperature measuring point of the first temperature sensor 24 and the temperature measuring point of the first temperature sensor 25 is perpendicular or nearly perpendicular to the first surface 118. This can shorten the response time of the temperature sensing between the first temperature sensor 24 and the first temperature sensor 25, thereby speeding up the detection speed.

[0079] Furthermore, in one embodiment, the first temperature sensor 24 and the first temperature sensor 25 can be arranged on or near the central axis of the heat conductor 110. It can be understood that the closer to the edge of the heat conductor 110, the greater the possibility of being affected by the external temperature. Therefore, the above-mentioned setting of the first temperature sensor 24 and the first temperature sensor 25 can further reduce the impact of the external temperature on the first temperature sensor 24 and the first temperature sensor 25, thereby helping to improve the measurement accuracy of the first temperature sensor 24 and the first temperature sensor 25.

[0080] In addition, in one embodiment, the cross-medium temperature measuring device 20 may further include a wire 150, one end of which is used to electrically connect to the first temperature sensor 24 and the first temperature sensor 25. Specifically, in this embodiment, one end of the wire 150 can be divided into two bundles, one of which can be led out from the opening of the first mounting groove 116 after connecting to the first temperature sensor 24, and the other can be led out from the opening of the second mounting groove 117 after connecting to the second temperature sensor. The other end is led out from the side of the insulator 23 adjacent to the second surface 119. Using a single wire 150 to simultaneously connect the first temperature sensor 24 and the first temperature sensor 25 can reduce the number of wires 150 used, thereby avoiding the problem of wire 150 being entangled and causing a short circuit. It should be noted that the embodiment of the present application does not limit the specific structure and shape of the wire 150. For example, copper wire, silver wire, etc. can be used, and the specific shape can be selected according to actual conditions.

[0081] Figure 3 shows the structure of a temperature measuring device 20. Referring to Figure 3, the thermal insulator 23 may include a first cylinder 141 and a second cylinder 142 that are connected to each other. The first cylinder 141 may be sleeved outside the support portion 115, and the second cylinder 142 may be sleeved outside the contact portion 114. That is to say, in this embodiment, a T-shaped heat conduction channel 21 may be formed inside the thermal insulator 23, and the heat conductor 110 may be embedded in the heat conduction channel 21. In addition, the contact portion 114 of the heat conductor 110 may abut against the end face of the first cylinder 141, which can also facilitate the connection between the heat conductor 110 and the insulator.

[0082] It will be appreciated that to facilitate the extraction of the wire 150 from the second surface 119, in this embodiment, a wire channel can be formed between the outer surface of the support portion 115, which is provided with the first mounting groove 116 and the second mounting groove 117, and the inner surface of the thermal insulator 23. The wire channel can be used for wiring and can communicate with the first mounting groove 116 and the second mounting groove 117. Specifically, after the wire 150 is connected to the first temperature sensor 24 and the first temperature sensor 25, the wire 150 can be extracted from the second surface 119 through the wire channel.

[0083] Continuing with FIG3 , the first temperature sensor 24, the first temperature sensor 25, the wire 150, the thermal conductor 110, and the thermal insulator 23 can be integrated into a single piece. For example, a filling process can be employed, where a solidifiable thermally conductive material is poured into the thermal insulator 23 to serve as the thermal conductor 110, and the first temperature sensor 24, the first temperature sensor 25, and the wire 150 are individually encapsulated in the solidifiable thermally conductive material. This helps to improve the overall structural strength of the cross-medium temperature measuring device 20.

[0084] Please refer to Figure 4, which shows the structure of another temperature measuring device 20. In this embodiment, the heat conductor 110 may also be provided with a first mounting groove 116 and a second mounting groove 117, wherein the first mounting groove 116 is provided on the first surface 118, and the second mounting groove 117 is provided on the second surface 119. In other words, in this embodiment, the first temperature sensor 24 and the first temperature sensor 25 may be externally located, which can reduce the difficulty of processing the heat conductor 110 and thus reduce the processing cost. At the same time, in this embodiment, the first temperature sensor 24 can directly contact the medium, thereby more quickly acquiring the temperature, thereby facilitating the detection speed of the cross-medium temperature measuring device 20.

[0085] One end of the wire 150 can also be divided into two bundles, one of which is connected to the first temperature sensor 24, and then routed along the first surface 118 to the insulator 23, and routed inside the insulator 23. The other bundle is connected to the first temperature sensor 25, and then routed along the second surface 119 to the insulator 23. The two bundles of wires 150 can be bundled inside the insulator 23, and then the other end of the wire 150 can be led out through the insulator 23, for example, from the side of the insulator 23 away from the heat conductor 110. The embodiment of the present application routes the wires inside the insulator 23, which can avoid the wires being subjected to excessively high temperatures, causing damage to the wires, and is beneficial to improving the service life of the wires.

[0086] In addition, the first mounting groove 116 and the second mounting groove 117 are respectively arranged on the first surface 118 and the second surface 119, so that the distance between the first temperature sensor 24 and the first temperature sensor 25 can be longest, thereby making the temperature difference at the first temperature sensor 24 and the temperature difference at the first temperature sensor 25 more obvious, avoiding the distance between the first temperature sensor 24 and the first temperature sensor 25 being too close, resulting in the temperature difference at the first temperature sensor 24 and the first temperature sensor 25 being unclear, thereby improving the detection accuracy of the temperature measuring device 20.

[0087] In another embodiment, the first temperature sensor 24 and the first temperature sensor 25 can also be directly printed on the first surface 118 and the second surface 119 through a printing process. In this way, the first temperature sensor 24 and the first temperature sensor 25 can be more tightly connected to the heat conductor 110.

[0088] FIG5 shows the structure of another temperature measuring device 20 of the present application. The opening of the first mounting groove 116 can be formed on the first surface 118, and the opening of the second mounting groove 117 can be formed on the side 113. In this case, the first temperature sensor 24 is closer to the medium, which can reduce the detection delay to a certain extent. At the same time, in this embodiment, one end of the wire 150 can also be divided into two bundles. After one bundle is connected to the first temperature sensor 24, it is routed along the first surface 118 to the insulator 23 and routed inside the insulator 23. After the other bundle is connected to the first temperature sensor 25, it is led out from the opening of the second mounting groove 117, and then routed inside the insulator 23. It is bundled inside the insulator 23, and then the other end of the wire 150 is led out from the side of the insulator 23 close to the heat conductor 110. The embodiment of the present application routes the wire inside the insulator 23, which can avoid the wire being subjected to excessively high temperatures, resulting in damage to the wire, and is conducive to improving the service life of the wire.

[0089] Figure 6 shows the structure of another temperature measuring device 20. Referring to Figure 6, the opening of the first mounting groove 116 can be formed on the side 113, and the opening of the second mounting groove 117 can be formed on the second surface 119. If the thermal conductivity of the medium is too large, the temperature of the medium will rise sharply in a short time. If the first temperature sensor 24 is in direct contact with the medium, it will be detrimental to the long-term use of the first temperature sensor 24 and may shorten the service life of the first temperature sensor 24. At the same time, in this embodiment, one end of the wire 150 can also be divided into two bundles, one of which is connected to the first temperature sensor 24, led out from the opening of the first mounting groove 116, and then routed inside the insulator 23; the other is connected to the first temperature sensor 25, routed along the second surface 119 to the insulator 23, and routed inside the insulator 23, and bundled inside the insulator 23, and then the other end of the wire 150 is led out from the side of the insulator 23 away from the heat conductor 110. The embodiment of the present application routes the wire inside the insulator 23, which can avoid the wire being subjected to excessively high temperature, causing damage to the wire, and is beneficial to improving the service life of the wire.

[0090] Please refer to FIG. 1 and FIG. 2 again. The processing unit 26 can be used to determine the temperature of the carrying surface 111 according to the gradient between the first temperature value and the second temperature value. The specific contents are as follows:

[0091] The first measurement position 211 is used as a heat flow node for simplified analysis. At any time, the heat flow Q of the object 10 to be measured flowing to the first measurement position 211 is in Equal to the heat Q stored in the object 10 to be measured save and the heat flow Q flowing along the heat conduction channel 21 to the first measurement position 211 out , and then we can get the following formula: Q in =Q save +Q out

[0092] For the first measurement position 211, according to the heat conduction equation, the thermal resistance is equal to the temperature difference divided by the heat flow. in The temperature T0 of the carrying surface 111 and the temperature T1 of the first measurement position 211 can be measured by Q in =(T0-T1) / R1, where R1 is the thermal resistance of the heat-conducting medium 22 between the object to be measured and the first measuring position 211.

[0093] It is understandable that when calculating the thermal resistance value R1 of the heat-conducting medium 22 between the bearing surface 111 and the first measuring position 211, relatively speaking, the thermal resistance of the object to be measured 10 is greater, and the thermal resistance of the heat-conducting medium 22 is smaller, and the thermal resistance of the heat-conducting medium 22 can be negligible relative to the object to be measured 10. The thermal resistance of the heat-conducting medium 22 can be fitted to the thermal resistance of the object to be measured 10, that is, R1 can be the thermal resistance value of the object to be measured 10. Preferably, because the first measuring position 211 is set at a position close to the object to be measured 10, R1 can be closer to the thermal resistance value of the object to be measured 10. The first measuring position 211 can be configured as a position of the temperature measuring device 20 close to the object to be measured 10 to improve the measurement accuracy of the temperature measuring device 20.

[0094] The heat Q stored in the object 10 to be measured save For example, at a certain moment, the heat stored in the object 10 to be measured is equal to the temperature change of the object 10 to be measured per unit time multiplied by the heat capacity of the object 10 to be measured. By approximate equivalence simplification, the average temperature of the object 10 to be measured is replaced by the first temperature value T1. Then, we can get in, It is the variation of the first temperature value T1 per unit time, that is, the derivative of the first temperature value T1 with respect to the heating time of the object 10 to be measured.

[0095] For the heat flux Q flowing along the heat conduction channel 21 to the second measurement position 212 out According to the heat conduction equation, the thermal resistance is equal to the temperature difference divided by the heat flow. The temperature gradient between the first temperature value and the second temperature value can be calculated. The temperature gradient between the first measurement position 211 and the second measurement position 212 can be calculated by Q out =(T1-T2) / R2 is calculated.

[0096] Combining the above formulas, we can get the following formula:

[0097] Wherein, T0 is the temperature value of the bearing surface 111, T1 is the first temperature value, is the change in T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object 10 to be measured, R2 is the thermal resistance value of the heat-conducting medium 22 located between the first measurement position 211 and the second measurement position 212, and C1 is the thermal capacitance value of the object 10 to be measured. In one embodiment, the thermal resistance value R1 of the object 10 to be measured, the thermal resistance value R2 of the heat-conducting medium 22 located between the first measurement position 211 and the second measurement position 212, and the thermal capacitance value C1 of the object 10 to be measured can all be measured in advance and then transmitted to the processing unit 26 via other devices, or the relevant information can be pre-stored in the processing unit 26 during installation, ensuring that the processing unit 26 can accurately calculate the temperature of the object 10 to be measured, thereby improving the accuracy of the temperature measuring device 20.

[0098] The processing unit 26 can be used to Determine the temperature of the carrying surface 111. Subsequently, the working status and cooking temperature of the cooking appliance 100 can be monitored in real time based on the obtained temperature value of the carrying surface 111. For example, when the cooking appliance 100 is dry-burned, the temperature of the carrying surface 111 will rise. The temperature measuring device 20 can calculate the accurate temperature of the carrying surface 111 through this formula and use this temperature to determine the working status of the cooking appliance 100. For example, the processing unit 26 can compare the temperature of the carrying surface 111 with a preset safety temperature. When the temperature of the carrying surface 111 exceeds the safety temperature, it can be determined that the cooking appliance 100 is operating abnormally, and subsequent alarm prompts, power-off protection, and other operations can be performed to improve the safety of the cooking appliance 100. The temperature value can be accurately calculated through this formula to improve the use effect of the temperature measuring device 20 and also improve the safety of the cooking appliance 100.

[0099] As the cooking appliance 100 heats up, the temperature of the object 10 to be measured and the heat-conducting medium 22 gradually rises, potentially affecting R1, R2, and C1. In this embodiment, the processing unit 26 calibrates R1, R2, and C1 to determine their values ​​at different temperatures. This reduces the impact of operating temperature on R1, R2, and C1, thereby improving the detection accuracy of the temperature measuring device 20.

[0100] In some embodiments, R1 and T1 can be pre-established. Specifically, the mapping relationship between R1 and T1 and The mapping relationship between the first temperature value and the thermal resistance value of the object 10 to be measured can be established. The mapping relationship between the thermal resistance value of the object 10 to be measured and the first temperature value and the first temperature value per unit time can be established. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0101] According to the different first temperature values ​​T1 obtained and the unit time variation of the first temperature value The thermal resistance value R1 of the object to be measured 10 is fitted to obtain a mapping relationship between the thermal resistance value of the object to be measured 10, the first temperature value, and the unit time change of the first temperature value. In the subsequent calculation process, the processing unit 26 can calculate the value of the The mapping relationship between By determining R1, calculating the thermal resistance value R1 of the object to be measured 10 at different temperatures and different temperature changes in real time, and then using the thermal resistance value for subsequent calculations, more accurate temperature measurement results can be obtained, effectively improving the detection accuracy of the temperature measuring device 20, and ensuring the reliability of the cooking appliance 100 and the cooking effect.

[0102] In another embodiment, C1 and T1 can be pre-established. Specifically, the mapping relationship between C1 and T1 and The mapping relationship between the heat capacity of the object 10 to be measured and the first temperature value is gradually increased. The mapping relationship between the heat capacity of the object 10 to be measured and the first temperature value and the first temperature value per unit time is established. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0103] According to the different first temperature values ​​T1 obtained and the unit time variation of the first temperature value The heat capacity value C1 of the object to be measured 10 is fitted to obtain a mapping relationship between the heat capacity value of the object to be measured 10, the first temperature value, and the unit time change of the first temperature value. In the subsequent calculation process, the processing unit 26 can calculate the The mapping relationship between By determining C1, calculating the heat capacity value C1 of the object to be measured 10 at different temperatures and different temperature changes in real time, and then using this heat capacity value for subsequent calculations, more accurate temperature measurement results can be obtained, effectively improving the detection accuracy of the temperature measuring device 20, and ensuring the reliability of the cooking appliance 100 and the cooking effect.

[0104] In another embodiment, R2 and T2 can be pre-established. Specifically, the mapping relationship between R2 and T2 can be established as follows The cooking appliance 100 can be subjected to a heating test during the debugging or assembly phase. As the heating time of the cooking appliance 100 increases, the temperature of the object 10 to be measured gradually rises, and the first temperature value and the second temperature value also gradually increase. The thermal resistance values ​​of the heat-conducting medium 22 located between the first measuring position 211 and the second measuring position 212 at a plurality of different second temperature values ​​and a plurality of different second temperature value unit time changes are measured. A mapping relationship is established between the thermal resistance value of the heat-conducting medium 22 located between the first measuring position 211 and the second measuring position 212, the second temperature value, and the second temperature value unit time change. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0105] According to the different second temperature values ​​T2 obtained and the unit time variation of the second temperature value The thermal resistance value R2 of the heat-conducting medium 22 between the first measuring position 211 and the second measuring position 212 is fitted to obtain a mapping relationship between the thermal resistance value and the second temperature value of the heat-conducting medium 22 between the first measuring position 211 and the second measuring position 212 and the unit time change of the second temperature value. In the subsequent calculation process, the processing unit 26 can calculate the value of the The mapping relationship between By determining R2 and calculating the thermal resistance of the heat-conducting medium 22 between the first measuring position 211 and the second measuring position 212 at different temperatures and different temperature changes in real time, and then using the thermal resistance value for subsequent calculations, a more accurate temperature measurement result can be obtained, thereby effectively improving the detection accuracy of the temperature measuring device 20 and ensuring the reliability of the cooking appliance 100 and the cooking effect.

[0106] In this embodiment, referring to Figure 2 , the object to be measured 10 may also include a pot 30 suitable for being supported on the support surface 111. When the cooking appliance 100 is in operation, it heats the pot 30. Heat from the pot 30 is transferred through the object to be measured 10 into the heat conduction channel 21, forming a heat flow. As the heat flow propagates, the temperature of the pot 30, the temperature of the support surface 111, the first temperature value, and the second temperature value successively exhibit a gradient. The temperature measuring device 20 can also measure the temperature of the pot 30 using this gradient information. Furthermore, when the cooking appliance 100 is in operation, it heats the pot 30. Heat is transferred from the pot 30 along the object to be measured 10 into the heat conduction channel 21. Consequently, as the heat flow propagates, the heat flow gradually decreases, and the amount of heat subsequently transferred through the heat conducting medium 22 decreases, reducing the temperature rise. Consequently, heat flow is transmitted between the pot 30 and the temperature measuring device 20. Along the direction of the heat flow, the temperature at each location between the pot 30 and the temperature measuring device 20 exhibits a decreasing trend. The temperature measuring device 20 can measure the temperature of at least two locations between the pot 30 and the temperature measuring device 20, with the temperature values ​​at these multiple locations forming a gradient. The temperature of the pot 30 is calculated based on the temperature differences between the multiple locations, as well as parameters such as the thermal resistance, the thermal resistance, and the heat capacity of the pot 30. The cooking process of the cooking device 100 can be monitored in real time based on the temperature of the pot 30, allowing the cooking device 100 to adjust heating power and duration in real time to improve the cooking effect. Calculations can be performed based on the thermal resistance and heat capacity of different pots 30, allowing the cooking device 100 to adapt to a variety of different pots 30. While ensuring the temperature measurement accuracy of the temperature measuring device 20, the cooking effect and adaptability of the cooking device 100 can also be improved.

[0107] Furthermore, the processing unit 26 can also be used to determine the temperature of the cookware 30 based on the gradient between the first temperature value and the temperature value of the carrying surface 111. The calculation formula for the temperature value of the cookware 30 can be derived based on the calculation formula for the temperature value of the carrying surface 111. Specifically, it is as follows:

[0108] Wherein, T is the temperature value of the cookware 30, T0 is the temperature value of the carrying surface 111, is the change of T0 per unit time, T1 is the first temperature value, R0 is the thermal resistance value of the cookware 30, R1 is the thermal resistance value of the object 10 to be measured, and C0 is the heat capacity value of the cookware 30.

[0109] The processing unit 26 can be used to To determine the temperature of the cookware 30, the thermal resistance R0 of the cookware 30, the thermal resistance R1 of the object 10 to be measured, and the thermal capacity C1 of the cookware 30 can all be measured in advance and then transmitted to the processing unit 26 via other devices. Alternatively, the relevant information can be pre-stored in the processing unit 26 during installation to ensure that the processing unit 26 can accurately calculate the temperature of the cookware 30, thereby improving the accuracy of the temperature measuring device 20.

[0110] It is understandable that the thermal resistance R0 and thermal capacity C1 of the cookware, the temperature T0 of the carrying surface 111, and the temperature change of the carrying surface 111 per unit time can be established. The processing unit 26 can use the mapping relationship, T0 and Calibrate the thermal resistance and thermal capacity of the cookware to improve the detection accuracy of the temperature measuring device for the cookware temperature.

[0111] The cooking utensil 100 provided in this embodiment can support the pot 30 via the support surface 111. When the cooking utensil 100 is in operation, it generates heat to heat the pot 30. Heat is transferred along the object 10 to be measured, forming a heat flow that is introduced into the heat conduction channel 21. The temperature at each position in the heat conduction channel 21 decreases along the direction of the heat flow. The first temperature sensor 24 and the second temperature sensor 25 can respectively collect a first temperature value and a second temperature value. The first measurement position 211 and the second measurement position 212 are unequally spaced from the object 20 to be measured, resulting in a gradient between the first temperature value and the second temperature value. The processing unit 26 can determine the temperature of the support surface 111 based on the first temperature value and the gradient information. The object 10 to be measured can be a support plate 11. Without opening a hole in the support plate 11, the temperature of the support plate 11 can be monitored, thereby ensuring the structural performance of the cooking utensil 100 and improving the safety and protective performance of the cooking utensil 100. Furthermore, the temperature of the object 10 to be measured can be obtained in real time through the temperature measuring device 20, and the temperature measurement result is timely and reliable. Subsequently, the cooking appliance 100 can adjust parameters such as power in real time according to the temperature value to improve the cooking effect of the cooking appliance 100.

[0112] This embodiment also provides a temperature measurement method, which can be applied to the cooking utensils described above. Referring to FIG. 7 , the method includes the following steps S110 to S130:

[0113] Step S110: Acquire a first temperature value and a second temperature value.

[0114] The selection and design of the first temperature sensor and the second temperature sensor can be carried out according to the characteristics and implementation scenarios of the specific temperature sensors. In addition, the arrangement of the first temperature sensor and the second temperature sensor can be different according to the type of temperature sensor. For example, when the first temperature sensor and the second temperature sensor are contact temperature sensors, the first temperature sensor and the second temperature sensor can be arranged at the first measurement position and the second measurement position, respectively. Alternatively, when the first temperature sensor and the second temperature sensor are non-contact temperature sensors, the first temperature sensor and the second temperature sensor can be arranged at any position of the heat conduction channel, respectively. The orientation of the infrared detection structure of the first temperature sensor and the second temperature sensor can be adjusted so that they can obtain the infrared radiation of the first measurement position and the second measurement position, thereby meeting the use requirements of the measuring device.

[0115] A first temperature value at a first measurement location can be acquired by a first sensor and transmitted to a processing unit. A second temperature value at a second measurement location can also be acquired by a second sensor and transmitted to the processing unit. The first and second temperature values ​​can be used in various applications of the cooking appliance, such as temperature monitoring, control, and alarms.

[0116] For example, when the cooking appliance is operating, heat flows from the object to be measured to the heat-conducting medium, resulting in a temperature gradient between the support surface, the first measurement point, and the second measurement point. Both the first and second temperature values ​​are lower than the temperature of the support surface. When either the first or second temperature value exceeds the safe temperature of the object to be measured, the support surface temperature has exceeded the safe temperature value, and the cooking pot can be powered off and an alarm can be issued. This prevents dry cooking and ensures the safety of the cooking appliance.

[0117] Step S120: determining gradient information between the first measurement bit and the second measurement bit according to the first temperature value and the second temperature value.

[0118] The first temperature value and the second temperature value are transmitted to the processing unit. Because the first and second measurement positions are unequally spaced from the contact surface, the first and second temperature values ​​are different. The first and second temperature values ​​can be compared to calculate the difference between them. Furthermore, based on the difference between the first and second temperature values, information such as the direction of heat flow and heat flow rate can be determined. For example, when the first and second temperature values ​​are compared and the result is that the first temperature value is greater than the second temperature value, the direction of heat flow is from the first measurement position to the second measurement position. This indicates that the temperature of the object being measured is still rising, thereby confirming that the cooking appliance is still being heated. Furthermore, assuming that the first and second measurement positions are relatively fixed, the difference between the first and second temperature values ​​can be calculated to determine the temperature variation in the heat conduction channel, thereby determining the gradient between the first and second measurement positions.

[0119] By fitting the first and second measurement points in the heat conduction channel, the first temperature value, and the second temperature value, a temperature distribution curve within the heat conduction channel can be obtained, thereby determining the temperature change trend within the heat conduction channel. Based on the temperature change trend, the operating status of the cooking appliance can be determined, thereby improving the measurement performance of the temperature measurement device.

[0120] Step S130: determining the temperature of the bearing surface according to the first temperature value and the gradient information.

[0121] The gradient information may include the first temperature value, the second temperature value, the difference between the first temperature value and the second temperature value, and the direction of heat flow. Furthermore, the temperature of the bearing surface may be determined according to the following formula:

[0122] Wherein, T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured, R2 is the thermal resistance value of the heat-conducting medium between the first measurement position and the second measurement position, and C1 is the heat capacity value of the object to be measured.

[0123] Determine the temperature of the bearing surface, and then perform real-time monitoring of the working status and cooking temperature of the cooking appliance based on the obtained temperature value of the bearing surface. For example, in cases where the cooking appliance is dry-burned, the temperature of the bearing surface may rise. The temperature measuring device can calculate the accurate temperature of the bearing surface through the formula and compare it with the safe temperature. When the temperature of the bearing surface exceeds the safe temperature, it can be determined that the cooking appliance is operating abnormally, and subsequent alarm prompts, power-off protection and other operations can be performed to improve the safety of the use of the cooking appliance. The temperature value can be accurately calculated through the formula to improve the use effect of the temperature measuring device and also improve the safety of the use of the cooking appliance.

[0124] In one embodiment, before determining the temperature of the object to be measured based on the gradient information, the method further includes calibrating R1, R2, and C1 to determine the values ​​of R1, R2, and C1 at different temperatures. This improves the detection accuracy of the temperature measurement device and reduces the impact of factors such as temperature on the measurement results.

[0125] In some embodiments, R1 and T1 can be pre-established. Specifically, the mapping relationship between R1 and T1 and The mapping relationship between them can be established. During the debugging stage or the assembly stage, the cooking appliance can be subjected to a heating test. As the heating time of the cooking appliance increases, the temperature of the object to be measured gradually rises, and the first temperature value also gradually increases. The thermal resistance values ​​of the object to be measured under multiple different first temperature values ​​and multiple different first temperature value unit time changes can be measured. A mapping relationship between the thermal resistance value of the object to be measured and the first temperature value and the first temperature value unit time change is established. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0126] According to the different first temperature values ​​T1 obtained and the unit time variation of the first temperature value The thermal resistance value R1 of the object to be measured is fitted to obtain the mapping relationship between the thermal resistance value of the object to be measured, the first temperature value, and the unit time change of the first temperature value. In the subsequent calculation process of the temperature of the object to be measured, the thermal resistance value R1 of the object to be measured can be fitted according to R1, T1 and The mapping relationship between By determining R1, calculating the thermal resistance value R1 of the object to be measured at different temperatures and different temperature changes in real time, and then using the thermal resistance value for subsequent calculations, more accurate temperature measurement results can be obtained, effectively improving the detection accuracy of the temperature measuring device 20, and ensuring the reliability of the cooking appliance and the cooking effect.

[0127] In another embodiment, C1 and T1 can be pre-established. Specifically, the mapping relationship between C1 and T1 and The cooking appliance can be subjected to a heating test during the debugging or assembly phase. As the heating time of the cooking appliance increases, the temperature of the object to be measured gradually rises, and the first temperature value also gradually increases. Measure the heat capacity values ​​of the object to be measured under multiple different first temperature values ​​and multiple different unit time changes of the first temperature values. Establish a mapping relationship between the heat capacity value of the object to be measured and the first temperature value and the unit time change of the first temperature value. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0128] According to the different first temperature values ​​T1 obtained and the unit time variation of the first temperature value The heat capacity value C1 of the object to be measured is fitted to obtain a mapping relationship between the heat capacity value of the object to be measured, the first temperature value, and the unit time change of the first temperature value. In the subsequent calculation process, the processing unit 26 can calculate the The mapping relationship between By determining C1, calculating the heat capacity value C1 of the object to be measured at different temperatures and different temperature changes in real time, and then using this heat capacity value for subsequent calculations, more accurate temperature measurement results can be obtained, effectively improving the detection accuracy of the temperature measuring device 20, and ensuring the reliability of the cooking appliance and the cooking effect.

[0129] In another embodiment, R2 and T2 can be pre-established. Specifically, the mapping relationship between R2 and T2 can be established as follows The mapping relationship between them. The cooking appliance can be subjected to a heating test during the debugging stage or the assembly stage. As the heating time of the cooking appliance increases, the temperature of the object to be measured gradually rises, and the first temperature value and the second temperature value also gradually increase. The thermal resistance value of the heat-conducting medium located between the first measuring position and the second measuring position at a plurality of different second temperature values ​​and a plurality of different second temperature value unit time changes are measured. A mapping relationship between the thermal resistance value of the heat-conducting medium located between the first measuring position and the second measuring position and the second temperature value and the second temperature value unit time change is established. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0130] According to the different second temperature values ​​T2 obtained and the unit time variation of the second temperature value The thermal resistance value R2 of the heat-conducting medium between the first measurement position and the second measurement position is fitted to obtain the mapping relationship between the thermal resistance value and the temperature value of the heat-conducting medium between the first measurement position and the second measurement position and the unit time change of the second temperature value. In the subsequent calculation process, the processing unit can calculate the The mapping relationship between Determine R2, calculate the thermal resistance of the heat-conducting medium between the first and second measurement positions at different temperatures and temperature variations in real time, and then use this thermal resistance for subsequent calculations. This can obtain more accurate temperature measurement results, effectively improve the detection accuracy of the temperature measuring device, and ensure the reliability of the cooking appliance and the cooking effect.

[0131] The temperature measurement method in this embodiment can also measure the temperature of the cookware, as follows:

[0132] Gradient information between the first measurement position and the bearing surface is determined according to the first temperature value and the temperature of the bearing surface.

[0133] The first temperature value and the temperature of the bearing surface are different. The first temperature value and the temperature of the bearing surface can be compared to calculate the difference between the first temperature value and the temperature of the bearing surface. In addition, the direction of the heat flow and the heat flow rate can be confirmed based on the difference between the first temperature value and the temperature of the bearing surface. For example, when the first temperature value and the temperature of the bearing surface are compared and the result is that the first temperature value is greater than the temperature of the bearing surface, the direction of the heat flow is from the bearing surface to the first measuring position. It can be known that the temperature of the object to be measured is still rising, and it can be confirmed that the cooking utensil is still in a heating state. In addition, under the premise that the first measuring position and the bearing surface are relatively fixed, the temperature change amplitude in the object to be measured can be obtained by calculating the difference between the first temperature value and the temperature of the bearing surface, and the gradient information between the first measuring position and the bearing surface can be determined.

[0134] The temperature of the cookware is determined according to the temperature value of the bearing surface and the gradient between the first temperature value and the temperature value of the bearing surface. To determine the temperature of the cookware, the thermal resistance R0 of the cookware, the thermal resistance R1 of the object to be measured, and the thermal capacity C1 of the cookware can all be measured in advance and then transmitted to the processing unit through other devices, or the relevant information can be pre-stored in the processing unit during installation to ensure that the processing unit can accurately calculate the temperature of the cookware, thereby improving the accuracy of the temperature measuring device.

[0135] It is understandable that the thermal resistance and heat capacity values ​​of the cookware can be calibrated based on the mapping relationship between the thermal resistance and heat capacity values ​​of the cookware and the temperature of the bearing surface and the temperature change value of the bearing surface per unit time, so as to improve the detection accuracy of the temperature measuring device for the cookware temperature.

[0136] In the temperature measurement method provided in the embodiments of the present application, heat flow is transmitted between a first measurement position and a second measurement position. Based on the first and second temperature values, gradient information between the first and second measurement positions can be determined. The temperature information of the object to be measured can be determined based on the first temperature value and the gradient information, thereby achieving cross-medium temperature measurement. The temperature measurement device can complete the temperature measurement process without direct contact with the object to be measured. This ensures the accuracy of the temperature measurement method while reducing the difficulty of temperature measurement.

[0137] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A temperature measuring device, characterized in that, The temperature measuring device is used to measure the temperature of an object to be measured. The object to be measured includes an opposite contact surface and a bearing surface. A heat conduction channel is formed on one side of the object to be measured close to the contact surface. The temperature measuring device includes: A first temperature sensor for collecting a first temperature value at a first measurement position of the heat conduction channel; A second temperature sensor for collecting a second temperature value at a second measurement position of the heat conduction channel, where the distances between the first measurement position and the second measurement position and the contact surface are not equal; and A processing unit electrically connected to the first temperature sensor and the second temperature sensor, and used to determine the temperature of the bearing surface according to the first temperature value and the gradient between the first temperature value and the second temperature value.

2. The temperature measuring device according to claim 1, wherein, The processing unit is used to follow the following formula: Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface and T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured, R2 is the thermal resistance value of the heat conduction medium between the first measurement position and the second measurement position, and C1 is the heat capacity value of the object to be measured.

3. The temperature measuring device according to claim 1, characterized in that, The processing unit is further configured to determine R1 according to the mapping relationship between R1 and T1 and therebetween The processing unit is further configured to determine C1 according to the mapping relationship between C1 and T1 and therebetween The processing unit is further configured to determine R2 according to the mapping relationship between R2 and T2 and therebetween to determine R2, where is the change amount of T2 per unit time.

4. The temperature measuring device according to claim 1, wherein The temperature measuring device further includes a heat insulator that encloses the heat conduction channel. The heat conduction channel is filled with a heat conduction medium, and one end of the heat conduction channel is used to contact the contact surface to introduce heat flow into the heat conduction channel.

5. The temperature measuring device according to claim 4, wherein The heat conduction medium is air.

6. The temperature measuring device according to claim 4, characterized in that A heat conductor is arranged in the heat conduction channel. The heat conductor is formed by the heat conduction medium. The heat conductor has an opposite first surface and second surface and a side surface connecting the first surface and the second surface. The first surface is used to contact the medium in contact with the object to be measured; the first temperature sensor is arranged on the heat conductor and adjacent to the first surface; the second temperature sensor is arranged on the heat conductor and adjacent to the second surface.

7. The temperature measuring device according to claim 6, characterized in that The connection line between the temperature measurement points of the first temperature sensor and the second temperature sensor is perpendicular or nearly perpendicular to the first surface.

8. The temperature measuring device according to claim 7, characterized in that, Both the first temperature sensor and the second temperature sensor are arranged on or near the central axis of the heat conductor.

9. The temperature measuring device according to claim 8, characterized in that, The heat conductor includes a contact part and a support part. The support part is connected to the contact part. The first surface is located on the contact part. The cross-sectional area of the contact part is larger than that of the support part. The heat insulator includes a connected first cylinder and a second cylinder. The first cylinder is sleeved outside the support part, and the second cylinder is sleeved outside the contact part.

10. The temperature measuring device according to claim 6, characterized in that, The heat conductor is provided with a first installation groove and a second installation groove. The first temperature sensor is arranged in the first installation groove, and the second temperature sensor is arranged in the second installation groove.

11. The temperature measuring device according to claim 10, characterized in that, The first installation groove is opened on the first surface, and the second installation groove is opened on the second surface.

12. The temperature measuring device according to claim 10, characterized in that, The opening of one of the first installation groove and the second installation groove is formed on the side surface, and the opening of the other is formed on the first surface or the second surface or the side surface.

13. The temperature measuring device according to claim 6, characterized in that, Both the first temperature sensor and the second temperature sensor are disposed inside the heat conductor, and the heat conductor, the first temperature sensor, and the second temperature sensor are integrally provided.

14. The temperature measuring device according to claim 6, characterized in that, The temperature measuring device further includes: a wire, one end of the wire is used for electrically connecting to the first temperature sensor and the second temperature sensor, and the other end is led out from a side of the heat insulator adjacent to the second surface.

15. The temperature measuring device according to any one of claims 4-14, characterized in that, The thermal conductivity of the heat transfer medium is higher than that of the heat insulator.

16. The temperature measuring device according to any one of claims 1-14, characterized in that, The first temperature sensor and / or the second temperature sensor is a resistance temperature sensor, a thermocouple sensor, an infrared thermal radiation sensor, or an ultrasonic temperature sensor.

17. A cooking appliance, characterized in that, Comprising: An object to be temperature measured; And The temperature measuring device according to any one of claims 1-16, one end of the heat conduction channel of the temperature measuring device is in contact with the object to be temperature measured to introduce heat flow into the heat conduction channel.

18. The cooking appliance according to claim 17, wherein The object to be temperature measured includes a carrier plate, the carrier plate includes the bearing surface and the contact surface for bearing the cookware, and the heat conduction channel abuts against the contact surface to introduce the heat flow on the carrier plate into the heat conduction channel.

19. The cooking appliance according to claim 18, characterized in that, The object to be temperature measured further includes a cookware adapted to be borne on the bearing surface.

20. A temperature measurement method, characterized in that, Applied to the cooking appliance according to any one of claims 17-19, the method includes: Obtaining the first temperature value and the second temperature value; Determining the gradient information between the first measurement position and the second measurement position according to the first temperature value and the second temperature value; Determining the temperature of the bearing surface according to the first temperature value and the gradient information.

21. The temperature measurement method according to claim 20, wherein The determining the temperature of the bearing surface according to the gradient information includes: Determine the temperature of the bearing surface according to the following formula: Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface and T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be temperature measured, R2 is the thermal resistance value of the heat transfer medium between the first measurement position and the second measurement position, and C1 is the heat capacity value of the object to be temperature measured.

22. The temperature measurement method according to claim 21, characterized in that, Before the determining the temperature of the object to be temperature measured according to the gradient information, the method further includes: According to R1 and T1 and The mapping relationship between Determine R1, based on C1 and T1 and The mapping relationship between Determine C1, based on R2 and T2 and The mapping relationship between Determine R2, where, is the change amount of T2 per unit time.

23. The temperature measurement method according to claim 21, characterized in that The method further includes: Determining the gradient information between the first measurement position and the bearing surface according to the first temperature value and the temperature of the bearing surface; Determining the temperature of the cookware adapted to be borne on the bearing surface according to the temperature value of the bearing surface and the gradient information between the first measurement position and the bearing surface.

Images