Component mounting machine and component mounting method

Abstract

This component mounting machine comprises: a first head; a second head; a first movement unit that moves the first head in a first movement range; a second movement unit that moves the second head in a second movement range which at least partially overlaps the first movement range; a first mounting control unit that controls the first head and the first movement unit so as to hold a component on the first head and mount the component at a mounting position of a substrate; a second mounting control unit that controls the second head and the second movement unit so as to hold a component on the second head and mount the component at a mounting position of the substrate; and an interference avoidance control unit. When one head among the first head and the second head is moved to a mounting position of the substrate that interferes with the other head while the other head is mounting a component on the substrate, the interference avoidance control unit performs control such that, while the other head is moved away from an interference region before the one head reaches the interference region, the one head is moved to the mounting position of the substrate without stopping in front of the interference region.

Description

Component mounting machine and component mounting method

[0001] This specification discloses a component mounter and a component mounting method.

[0002] Conventionally, there has been known a component mounter that has two opposing mounting heads and uses the heads to alternately mount components on a board. For example, Patent Document 1 discloses a mounter in which one head holding a component is made to wait at a standby position just before an interference area where the other head interferes with the other head while the other head mounts components on a board, and when the other head starts to move to a component supply area, the one head is moved from the standby position to a component mounting position.

[0003] Patent No. 4750664

[0004] However, the component mounting machine described above is based on the premise that one of the heads is kept waiting (stopped) just before the interference area, which does not necessarily allow components to be mounted efficiently, and there is still room for improvement in terms of improving mounting efficiency.

[0005] A primary object of the present disclosure is to improve component mounting efficiency.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] A component mounter according to the present disclosure is a component mounter that mounts components on a board, and includes: a first head; a second head; a first movement unit that moves the first head within a first movement range; a second movement unit that moves the second head within a second movement range that at least partially overlaps with the first movement range; a first mounting control unit that controls the first head and the first movement unit so that the first head holds a component and mounts it at a mounting position on the board; and a second mounting control unit that controls the second head and the second movement unit so that the second head holds a component and mounts it at the mounting position on the board. an interference avoidance control unit that controls one head to stop in front of the interference area and wait until the other head leaves the interference area before moving to the mounting position on the board, when one of the first head and the second head moves to a mounting position on the board where it will interfere with the other head while the other head is mounting a component on the board, and when the other head has not left the interference area by the time the one head reaches in front of the interference area where it interferes with the other head, and controls one head to move to the mounting position on the board without stopping in front of the interference area, when the other head leaves the interference area by the time the one head reaches the interference area.

[0008] In the component mounter of the present disclosure, when one head moves to a mounting position on the board where it interferes with the other head, the head moves to the mounting position on the board without stopping in front of the interference area when the other head leaves the interference area. Compared to waiting in front of the interference area, the one head can move to the component mounting position at a faster speed, thereby improving component mounting efficiency.

[0009] 1 is a perspective view of the component mounter 10; FIG. 2 is a top view of the component mounter 10; FIG. 3 is a block diagram showing electrical connection relationships of the component mounter 10; FIG. 4 is a flowchart showing an example of a component mounting process; FIG. 5 is a flowchart showing an example of a movement process; FIG. 6 is an explanatory diagram showing a state in which a first head 31 mounts components on a board S without interfering with a second head 32; FIG. 7 is an explanatory diagram showing a state in which a first head 31 mounts components on a board S while stopping in front of an interference region R2; FIG. 8 is an explanatory diagram showing a state in which a first head 31 mounts components on a board S without stopping in front of the interference region R2; FIG. 9 is an explanatory diagram showing a speed change when a first head 31 mounts components on a board S while stopping in front of the interference region R2; FIG. 10 is an explanatory diagram showing a speed change when a first head 31 mounts components on a board S without stopping in front of the interference region R2; FIG. 11 is an explanatory diagram showing position changes of the first head 31 and the second head 32 when a first head 31 mounts components on a board S while stopping in front of the interference region R2. 10A and 10B are explanatory diagrams showing changes in the positions of the first head 31 and the second head 32 when the first head 31 mounts components on the board S without stopping just before the interference region R2.

[0010] Next, embodiments of the present disclosure will be described with reference to the drawings.

[0011] Fig. 1 is a perspective view of the component mounter 10. Fig. 2 is a top view of the component mounter 10. Fig. 3 is a block diagram showing the electrical connections of the component mounter 10. The left-right direction (X-axis direction), front-rear direction (Y-axis direction), and up-down direction (Z-axis direction) are as shown in Figs. 1 and 2.

[0012] 1 and 2, the component mounter 10 of this embodiment picks up components supplied from a tape feeder 60 and mounts them on a board S. This component mounter 10 includes a base B, a first head 31 and a second head 32 facing each other, a first head moving device 11 that moves the first head 31 in the horizontal direction, a second head moving device 12 that moves the second head 32 in the horizontal direction, and a control device 80 (see FIG. 3). On both the left and right sides of the upper stage of the base B, strip-shaped support bases 13 are provided that extend in the front-to-rear direction (Y-axis direction).

[0013] The mounter 10 also includes a first beam member 23 that supports the first head 31 and a second beam member 24 that supports the second head 32. The first beam member 23 and the second beam member 24 are elongated members that extend in the left-right direction and support the first head 31 and the second head 32 so that they can move left-right (in the X-axis direction) and can move forward-backward (in the Y-axis direction). The mounter 10 also includes a first part camera 41 and a second part camera 42 that can capture images of components from below. The mounter 10 also includes a board transport device 70 (see FIG. 3 ) that includes a pair of front and rear conveyor belts and a motor that drives the conveyor belts in a circular motion. The motor drives the conveyor belts to transport the board S on the conveyor belts from left to right.

[0014] The first head 31 and the second head 32 are configured to pick up (pick up) components. Each of the first head 31 and the second head 32 has one or more nozzles for picking up components. Each of the first head 31 and the second head 32 is equipped with an elevator 33 (see FIG. 3 ) for raising and lowering the nozzle. The first head 31 and the second head 32 can pick up components by applying negative pressure to the suction ports of the nozzles via a negative pressure source. The first head 31 and the second head 32 can release the component from suction by applying positive pressure to the suction ports via a positive pressure source. As shown in FIGS. 1 and 2 , the first head 31 is supported on the opposing surface 23 a of the first beam member 23, which faces the second beam member 24. The second head 32 is supported on the opposing surface 24 a of the second beam member 24, which faces the opposing surface 23 a of the first beam member 23. In the XY plane view, the first head 31 and the second head 32 have a length in the front-rear direction (Y-axis direction) that is longer than the length in the left-right direction (X-axis direction).

[0015] The first head moving device 11 comprises a first Y-axis moving device 51 that moves the first head 31 in the front-to-back direction (Y-axis direction) together with the first beam member 23, and a first X-axis moving device 21 that moves the first head 31 in the left-to-right direction (X-axis direction) relative to the first beam member 23.

[0016] As shown in FIG. 2, the first Y-axis movement device 51 has a pair of left and right Y-axis linear guides 53 and a pair of left and right Y-axis linear motors 54. The pair of left and right Y-axis linear guides 53 are arranged on the upper surfaces of the left and right support bases 13 so as to extend in the front-to-rear direction (Y-axis direction). The Y-axis linear motor 54 has a Y-axis stator 55 fixed to the support bases 13 so as to extend in the front-to-rear direction, and a Y-axis mover 56 fixed to the first beam member 23 so as to face the Y-axis stator 55 at a predetermined vertical distance and supported by the Y-axis linear guides 53. The position of the first head 31 in the Y-axis direction is detected by a first Y-axis linear encoder 57 (see FIG. 3).

[0017] As shown in FIG. 2 , the first X-axis movement device 21 includes a pair of upper and lower X-axis linear guides 26 and an X-axis linear motor 27 (see FIG. 3 ). The pair of upper and lower X-axis linear guides 26 are disposed on the opposing surface 23 a of the first beam member 23 so as to extend in the left-right direction (X-axis direction). The X-axis linear motor 27 includes an X-axis stator (not shown) fixed to the opposing surface 23 a of the first beam member 23 so as to extend in the left-right direction, and an X-axis mover 28 supported by the X-axis linear guide 26 so as to face the X-axis stator at a predetermined distance in the front-to-rear direction. The first head 31 is attached to one of the sides of the X-axis mover 28 opposite the first beam member 23. The position of the first head 31 in the X-axis direction is detected by a first X-axis linear encoder 37 (see FIG. 3 ).

[0018] The second head moving device 12 includes a second Y-axis moving device 52 that moves the second head 32 in the front-to-back direction (Y-axis direction) together with the second beam member 24, and a second X-axis moving device 22 that moves the second head 32 in the left-to-right direction (X-axis direction) relative to the second beam member 24.

[0019] 2, the second Y-axis moving device 52 has a pair of left and right Y-axis linear guides 53 and a Y-axis linear motor 54 provided on each side. The second Y-axis moving device 52 shares the pair of left and right Y-axis linear guides 53 and the Y-axis stator 55 of the Y-axis linear motor 54 with the first Y-axis moving device 51. The second Y-axis moving device 52 also has a Y-axis mover 56 fixed to the second beam member 24 and supported by the Y-axis linear guides 53. The position of the second head 32 in the Y-axis direction is detected by a second Y-axis linear encoder 58 (see FIG. 3).

[0020] As shown in Fig. 2, the second X-axis movement device 22 has a pair of upper and lower X-axis linear guides 26 and an X-axis linear motor 27 (see Fig. 3). The second X-axis movement device 22 has a configuration similar to that of the first X-axis movement device 21, except that the pair of upper and lower X-axis linear guides 26 are arranged on the opposing surfaces 24a of the second beam member 24, and that a second head 32 is attached to the side surface of the X-axis mover 28 opposite to the second beam member 24. The position of the second head 32 in the X-axis direction is detected by a second X-axis linear encoder 38 (see Fig. 3).

[0021] The first head 31 and the second head 32 can each move in the horizontal direction (X and Y directions) by combining the drive of the X-axis linear motor 27 and the drive of the Y-axis linear motor 54, and therefore have a rectangular movement range. The movement range of the first head 31 covers the position where the front tape feeder 60 supplies components in FIG. 2 and the entire area on the board S. The movement range of the second head 32 covers the position where the rear (rear) tape feeder 60 supplies components in FIG. 2 and the entire area on the board S. The first Y-axis moving device 51 and the second Y-axis moving device 52 share the Y-axis linear guide 53 and the Y-axis stator 55. Furthermore, the first head 31 and the second head 32 mount components on the same board S. Therefore, the movement range of the first head 31 and the movement range of the second head 32 overlap in the area directly above the board S. Therefore, if the first head 31 and the second head 32 were to move independently, there is a risk of them interfering with each other.

[0022] The control device 80 is responsible for overall control of the component mounter 10. As shown in FIG. 3 , the control device 80 is a computer having a CPU 81, a ROM 82, a RAM 83, and a storage (e.g., an HDD or SSD) 84. The storage 84 stores a plurality of profiles that define the acceleration α when moving the first head 31 and the second head 32 and the deceleration β when stopping them. The control device 80 outputs control signals to the tape feeder 60, the substrate transport device 70, the first head 31, the second head 32, the Y-axis linear motors 54 of the first Y-axis moving device 51 and the second Y-axis moving device 52, the X-axis linear motors 27 of the first X-axis moving device 21 and the second X-axis moving device 22, the first part camera 41, the second part camera 42, etc. In addition, the control device 80 inputs pulse signals from the first Y-axis linear encoder 57, the second Y-axis linear encoder 58, the first X-axis linear encoder 37, the second X-axis linear encoder 38, etc., and inputs image signals from the first part camera 41, the second part camera 42, etc.

[0023] Next, the operation of the component mounter 10 will be described. In this embodiment, a component mounting process will be described in which components are alternately mounted on one board S using the first head 31 and the second head 32. FIG. 4 is a flowchart showing an example of the component mounting process. The component mounting process is repeatedly executed by the CPU 81 of the control device 80 after a command to start production is input. Note that in this embodiment, a series of processes will be described as an example in which a component is picked up by the first head 31 and mounted at the component mounting position (hereinafter referred to as mounting position P1), but the same applies to a case in which a component is picked up by the second head 32 and mounted at the component mounting position (hereinafter referred to as mounting position P2).

[0024] When the component mounting process starts, the CPU 81 first controls the first head moving device 11 (the X-axis linear motor 27 of the first X-axis moving device 21 and the Y-axis linear motor 54 of the first Y-axis moving device 51) to move the first head 31 to a component pickup position (S100). Next, the CPU 81 controls the lifting device 33 of the first head 31 to pick up a component supplied from the tape feeder 60 (S102). Specifically, the CPU 81 applies negative pressure to the suction nozzle of the suction nozzle and controls the lifting device 33 to lower the suction nozzle 45 until the suction nozzle of the nozzle abuts the component, thereby picking up the component onto the nozzle. Next, the CPU 81 controls the first head moving device 11 to move the first head 31 to above the first part camera 41 (S104). Then, the CPU 81 controls the first part camera 41 to capture an image of the component picked up by the first head 31 (S106).

[0025] Next, the CPU 81 processes the captured image to determine whether the component is being picked up properly, measure the amount of deviation in the pickup position, and correct the mounting position P1 (S108). Next, the CPU 81 determines whether the mounting position P1 of the first head 31 is included in the interference region R2 when the second head 32 is mounting (S110). The interference region R2 is a rectangular region that is centered on the position (mounting position P2) of the second head 32 when mounting, and is within a predetermined distance range in the left-right direction (X-axis direction) and a predetermined distance range in the front-back direction (Y-axis direction). The interference region R2 is determined in advance depending on the shape and size of the first head 31 and the second head 32. Specifically, the CPU 81 determines whether the mounting position P1 of the first head 31 is included in the interference region R2 when the second head 32 arrives at the mounting position P2 and mounts the component before the first head 31 arrives at the mounting position P1. Here, examples of cases in which the second head 32 arrives at the mounting position P2 before the first head 31 arrives at the mounting position P1 include cases in which the second head 32 has already arrived at the mounting position P2, or cases in which the second head 32 is moving toward the mounting position P2 faster than the first head 31 and arrives at the mounting position P2 before the first head 31 arrives at the mounting position P1. When the CPU 81 determines that the mounting position P1 of the first head 31 is not included in the interference region R2, it reads a normal profile from the storage 84 as a profile including the acceleration α and deceleration β of the first head 31 during movement (S112). Here, the acceleration α is a positive value, and the deceleration β is a negative value. Next, the CPU 81 sets the mounting position P1 of the first head 31 as the target position (S114). Next, the CPU 81 repeatedly executes the movement process shown in FIG. 5 every predetermined time Δt (e.g., several ms) until the first head 31 arrives at the mounting position P1 (S116, S118). The movement process will be described later. As a result, the first head 31 moves from above the first part camera 41 to the mounting position P, as shown in FIG. 6 . Then, the CPU 81 mounts the component on the board S (S132). Specifically, the CPU 81 controls the lifting device 33 to press the component picked up by the nozzle against the board S, and applies positive pressure to the tip of the nozzle to mount the component on the board S.

[0026] On the other hand, if the CPU 81 determines that the mounting position P1 of the first head 31 is included in the interference region R2 when the second head is mounted, it reads out an interference profile from the storage 84 as the profile of the first head 31 (S120). Next, the CPU 81 sets a position just before the interference region R2 on the movement path to the mounting position P1 of the first head 31 as the target position (S122). The acceleration α of the interference profile is set to a value smaller than the acceleration α of the normal profile. The deceleration β of the interference profile is set to a value larger (smaller absolute value) than the deceleration β of the normal profile. Next, the CPU 81 executes the movement process shown in FIG. 5.

[0027] When the CPU 81 starts the movement process, it calculates the distance L to the target position set in S114 or S122 (S200). Specifically, the CPU 81 calculates the X and Y coordinate values ​​of the position of the first head 31 based on the pulse signals from the first X-axis linear encoder 37 and the first Y-axis linear encoder 57, and calculates the distance L based on the X and Y coordinate values ​​of the position of the first head 31 and the X and Y coordinate values ​​of the target position. Next, the CPU 81 substitutes the movement speed V and the value of the deceleration β included in the profile read in S112 or S120 of the component mounting process into a threshold setting function f shown in the following equation (1), to calculate the distance required for the first head 31 to stop (for the movement speed V to become 0) assuming that the first head 31 is decelerated from the current movement speed V by the deceleration β, and sets the calculated distance as the distance threshold D (S202).

[0028] f(V,β)=(V^2 / (2×β))…(1)

[0029] Next, the CPU 81 determines whether the distance L is longer than the distance threshold D (S204). If the CPU 81 determines that the distance L is longer than the distance threshold D, it determines that the movement section of the first head 31 is not a deceleration section, and determines whether the movement speed V is less than the upper limit speed Vmax, which is its upper limit value (S206). If the CPU 81 determines that the movement speed V is less than the upper limit speed Vmax, it determines that the movement section of the first head 31 is an acceleration section, and performs acceleration control using the acceleration α included in the profile read in S112 or S120 of the component mounting process shown in FIG. 4 (S208). Specifically, the CPU 81 calculates a current command value so that the movement speed V of the first head 31 is the smaller of the speed obtained by adding the acceleration α and the time Δt to the movement speed V, as shown in the following equation (2), and the upper limit speed Vmax, and generates a drive command based on the current command value and outputs it to the first head moving device 11 (the first X-axis moving device 21 and the first Y-axis moving device 51). On the other hand, if the CPU 81 determines that the movement speed V is the upper limit speed Vmax, it determines that the movement section of the first head 31 is a constant speed section, and controls the first head moving device 11 so that the first head 31 moves at the upper limit speed Vmax.

[0030] V=min(V+α×Δt, Vmax)…(2)

[0031] On the other hand, if the CPU 81 determines that the distance L is equal to or less than the distance threshold D, it determines that the movement section of the first head 31 is a deceleration section and performs deceleration control using the deceleration β included in the profile read in S112 or S120 of the component mounting process shown in Fig. 4 (S212). Specifically, the CPU 81 calculates a current command value so that the movement speed V of the first head 31 is the greater of the speed obtained by adding the deceleration β and the integrated value of the predetermined time Δt to the movement speed V, as shown in the following equation (3), or 0, and generates a drive command based on the current command value and outputs it to the first head moving device 11 (the first X-axis moving device 21 and the first Y-axis moving device 51). After S208, S210, or S212, the CPU 81 proceeds to S126 of the component mounting process shown in Fig. 4.

[0032] V=max(V+β×Δt,0)…(3)

[0033] In the component mounting process, the CPU 81 determines whether the second head 32 has started to retract from the interference region R1 during mounting by the first head 31 (S126). The interference region R1 is a rectangular region that is centered on the mounting position P1 of the first head 31 and that is within a predetermined distance in the left-right direction (X-axis direction) and a predetermined distance in the front-back direction (Y-axis direction). The interference region R1 is determined in advance based on the shape and size of the first head 31 and the second head 32. Specifically, the CPU 81 determines whether the second head 32 has started to move away from the interference region R1. After the second head 32 finishes mounting a component on its own device, it starts to raise the nozzle that has been suctioning the component and simultaneously starts to move from the mounting position P2 toward the tape feeder on the rear side. In other words, whether the second head 32 has started to move away from the interference region R1 indicates whether the second head 32 has started such an operation. If the CPU 81 determines that the second head 32 has not started retraction, the process returns to S124, and the CPU 81 repeatedly executes the movement process every predetermined time Δt with the target position set to a position in front of the interference region R2 during mounting of the second head 32. On the other hand, if the CPU 81 determines that the second head 32 has started retraction, the CPU 81 sets the mounting position P1 of the first head 31 as the target position (S128). Then, the CPU 81 determines whether the first head 31 has reached the mounting position P1 (S130). If the CPU 81 determines that the first head 31 has not reached the mounting position P1, the process returns to S124, and the CPU 81 repeatedly executes the movement process every predetermined time Δt with the mounting position P1 of the first head 31 set as the target position. On the other hand, if the CPU 81 determines that the first head 31 has reached the mounting position P1, the CPU 81 mounts a component on the board S (S132), and ends the component mounting process.

[0034] An example of the operation of the first head 31 in the processes of S122 to S130 will now be described with reference to Figures 7 to 12. In Figures 7 to 12, the symbols in the circles indicate the timing of the operations of the first head 31 and the second head 32, and the same symbols indicate the timing of the same operations.

[0035] When the mounting position P1 of the first head 31 is included in the interference region R2 when the second head 32 is mounted, the CPU 81 repeatedly executes a movement process every predetermined time Δt with a position in front of the interference region R2 set as the target position. As a result, the first head 31 moves while accelerating at an acceleration α until the movement speed V reaches an upper limit speed Vmax. After the movement speed V reaches the upper limit speed Vmax, the first head 31 continues to move at the upper limit speed Vmax for a while. As the first head 31 approaches a position in front of the interference region R2, the CPU 81 decelerates at a deceleration β and stops at the position in front of the interference region R2. Even after stopping the first head 31 in a position in front of the interference region R2, the CPU 81 repeatedly executes the movement process every predetermined time Δt until the second head 32 begins to retract, setting the movement speed V of the first head 31 to a value of 0. Therefore, the first head 31 waits while stopped in a position in front of the interference region R2, as indicated by the symbol B in the circle in FIGS. 7, 9, and 11.

[0036] When the second head 32 starts retracting while the first head 31 is waiting, the CPU 81 sets the mounting position P1 of the first head 31 as the target position, as indicated by the symbol C in the circle in FIGS. 7 and 11 . The CPU 81 then repeatedly executes the movement process at predetermined time intervals Δt until the first head 31 reaches the mounting position P1. As a result, the first head 31, which has stopped just before the interference region R2 during mounting by the second head 32, begins accelerating again with an acceleration α toward the mounting position P1 at the same time as the second head 32 starts retracting, as indicated by the symbol C in the circle in FIGS. 7 , 9 , and 11 . As the first head 31 approaches the mounting position P1, it moves while decelerating at a deceleration β, and stops at the mounting position P1. Note that FIG. 9 illustrates an example in which the movement speed V of the first head 31, which has been re-accelerated from a state in which it has stopped just before the interference region R2, is decelerated by the deceleration β before reaching the upper limit speed Vmax.

[0037] Furthermore, the second head 32 may start retracting before the first head 31 reaches a position in front of the interference region R2 when the second head 32 is mounted. This includes cases where the second head 32 starts retracting while the first head 31 is moving while accelerating at the acceleration α or while moving at the upper limit speed Vmax, and cases where the first head 31 starts retracting while moving while decelerating at the deceleration β just before the interference region R2.

[0038] In the former case, the CPU 81 sets the mounting position P1 as the target position before decelerating the first head 31 just before the interference region R2 during mounting by the second head 32. Then, the CPU 81 executes the movement process every predetermined time Δt until the first head 31 reaches the mounting position P1. As a result, the first head 31 moves to the mounting position P1 without decelerating just before the interference region R2. Note that the operation of the first head 31 at this time is the same as the case shown in FIG. 6, except that the acceleration α when accelerating and the deceleration β when decelerating are those included in the interference profile read out in S120 of the component mounting process shown in FIG.

[0039] In the latter case, the CPU 81 sets the mounting position P1 as the target position while decelerating the first head 31 just before the interference region R2 during mounting of the second head 32. The CPU 81 then executes the movement process every predetermined time Δt until the first head 31 reaches the mounting position P1. As a result, the first head 31, which has once decelerated just before the interference region R2, begins to accelerate again at an acceleration α toward the mounting position P1, as indicated by the symbol E in the circle in FIGS. 8, 10, and 12. As it approaches the mounting position P1, it moves while decelerating at a deceleration β, and stops at the mounting position P1. Note that FIG. 10 shows an example in which the movement speed V of the first head 31, which has been re-accelerated just before the interference region R, is decelerated at the deceleration β before reaching the upper limit speed Vmax.

[0040] Here, the acceleration α when the first head 31 located above the first part camera 41 starts to move toward a position in front of the interference region R2 when the second head 32 is mounted, and the acceleration α when the first head 31, which has decelerated or stopped in front of the interference region R2, is re-accelerated toward the mounting position P1, are both the same acceleration α included in the interference profile read out in S120. Also, the deceleration β when the first head 31 is decelerated in front of the interference region R2 and the deceleration β when the first head 31 is decelerated in front of the mounting position P1 are both the same deceleration β included in the interference profile read out in S120.

[0041] In this way, when mounting a component at a position where the first head 31 interferes with the second head 32, the CPU 81 can move the first head 31 to the mounting position P on the board S without stopping it just before the interference region R2 when the second head 32 starts to retract. Therefore, compared to when the first head 31 is made to wait just before the interference region R2, the time required to move to the mounting position P1 can be shortened, and the component mounting efficiency can be improved.

[0042] Furthermore, when the second head 32 starts to retreat while the first head 31 is decelerating or stopped just before the interference region R2 during mounting of the second head 32, the CPU 81 accelerates the first head 31 toward the mounting position P1 at an acceleration α. ​​Because the first head 31 moves toward the mounting position P1 from a close state, the time required to move to the mounting position P1 can be shortened compared to when the first head 31 starts moving after the second head 32 has completed moving to the component supply position of the tape feeder 60.

[0043] Furthermore, the CPU 81 accelerates the first head 31 positioned above the first part camera 41 at the same acceleration α when it starts to move, and accelerates the first head 31, which has decelerated or stopped just before the interference region R2, again toward the mounting position P. This makes it possible to control the movement speed V of the first head 31 relatively easily.

[0044] Furthermore, the first head 31 and the second head 32 are arranged side by side in the front-to-back direction (Y-axis direction), and the length in the front-to-back direction is longer than the length in the left-to-right direction (X-axis direction), so that the first head 31 and the second head 32 are likely to interfere with each other when moved in the front-to-back direction. For this reason, it is very significant to move the first head 31 toward the mounting position P1 at the same time that the second head 32 starts to retract.

[0045] Here, the correspondence between the components of the embodiment and the components of the present disclosure will be clarified. The component mounter 10 of the present embodiment corresponds to the component mounter of the present disclosure, the first head 31 corresponds to the first head, the second head 32 corresponds to the second head, the first head moving device 11 corresponds to the first moving unit, the second head moving device 12 corresponds to the second moving unit, the CPU 81 that executes the processes of S112 to S118 of the component mounting process corresponds to the first mounting control unit and the second mounting control unit, and the CPU 81 that executes the processes of S110 and S120 to S130 of the component mounting process corresponds to the interference avoidance control unit.

[0046] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present disclosure.

[0047] In the above-described embodiment, components are mounted on one board S using the first head 31 and the second head 32. However, the first head 31 and the second head 32 may mount components on different boards S. In this case, the board transport device 70 may have two lanes aligned in the width direction (Y-axis direction) perpendicular to the transport direction of the board S, each of which transports the board S. In this case, the movement range of the first head 31 may cover the position where the front tape feeder 60 supplies components and the entire area on the board S transported by one lane (the side closer to the first part camera 41 in the Y-axis direction). Furthermore, the movement range of the second head 32 may cover the position where the rear (rear) tape feeder 60 supplies components and the entire area on the board S transported by the other lane (the side closer to the second part camera 42 in the Y-axis direction). In this case, because the two lanes are arranged close to each other, a part of the head mounting components on the board S on one lane may enter the other lane, potentially causing interference between the two heads. In such a case, processing similar to that of the above-described embodiment may be performed.

[0048] In the above-described embodiment, the acceleration α when moving the first head 31 from above the first part camera 41 toward a position in front of the interference region R2 during mounting of the second head 32 and the acceleration α when moving the first head 31 from in front of the interference region R2 toward the mounting position P were set to the same value. However, the former acceleration α may be set to a value greater than the latter acceleration α. ​​In this case, the interference profile may include multiple accelerations α. Furthermore, in this case, when the CPU 81 sets a position in front of the interference region R2 as the target position in S122 of the component mounting process, the CPU 81 may set the acceleration α when executing the movement process to a value smaller than the acceleration α included in the read profile. Furthermore, when the CPU 81 sets the mounting position P1 as the target position in S128 of the component mounting process, the CPU 81 may set the acceleration α when executing the movement process to a value larger than the acceleration α included in the read profile.

[0049] In the above-described embodiment, the deceleration β when the first head 31 is decelerated just before the interference region R2 during mounting of the second head 32 and the deceleration β when the first head 31 is decelerated just before the mounting position P1 are set to the same value. However, the former deceleration β may be set to a smaller value than the latter deceleration β. In this case, the interference profile may include multiple decelerations β. Furthermore, in this case, when the CPU 81 sets a position just before the interference region R2 as the target position in S122 of the component mounting process, the CPU 81 may set a smaller deceleration β among the decelerations β included in the read profile as the deceleration β when executing the movement process. Furthermore, when the CPU 81 sets the mounting position P1 as the target position in S128 of the component mounting process, the CPU 81 may set a larger deceleration β among the decelerations β included in the read profile as the deceleration β when executing the subsequent movement process.

[0050] In the above-described embodiment, the acceleration α when the first head 31 is decelerated just before the interference region R2 during mounting of the second head 32 and then accelerated again is set to the same value as the acceleration α when the first head 31 is stopped just before the interference region R and then accelerated again. However, the former acceleration α may be set to a value greater than the latter acceleration α, or the former acceleration α may be set to a value smaller than the latter acceleration α. ​​In this case, the interference profile may include multiple accelerations α. Furthermore, in this case, when the CPU 81 sets a position just before the interference region R2 as the target position in S122 of the component mounting process, it may set one of the accelerations α included in the read profile as the acceleration α when executing the movement process. Furthermore, when the CPU 81 sets the mounting position P1 as the target position in S128 of the component mounting process, it may set one of the accelerations α included in the read profile other than the acceleration α set in S122 as the acceleration α when executing the movement process thereafter.

[0051] In the above-described embodiment, the mounter 10 alternately mounts components on the board S using the first head 31 and the second head 32. However, the mounter 10 may mount components on the board S continuously using the second head 32, and then continuously mount components on the board S using the first head 31. In this case, the first head 31 and the second head 32 may have multiple nozzles. In this case, the entire region separated by a predetermined distance in the horizontal direction (X and Y directions) from the mounting position P2 of all components held by the second head 32, including the component currently being mounted, may be defined as the interference region R2 during mounting by the second head 32, and the entire region separated by a predetermined distance in the horizontal direction (X and Y directions) from the mounting position P1 of all components held by the first head 31 may be defined as the interference region R1 during mounting by the first head 31.

[0052] In the above-described embodiment, the first head moving device 11 and the second head moving device 12 are both mechanisms having linear motors. However, one or more of these may be mechanisms having ball screws.

[0053] In the above-described embodiment, the first head 31 and the second head 32 pick up (suck) components using nozzles. However, at least one of the first head 31 and the second head 32 may pick up components using a mechanical chuck or an electromagnetic chuck.

[0054] In the embodiment described above, the first head 31, which has decelerated or stopped just before the interference region R2 when the second head 32 is mounted, is accelerated again toward the mounting position P1 at the same time that the second head 32 starts to retract. However, the first head 31 may also be accelerated again toward the mounting position P1 after a predetermined time (e.g., several seconds) has elapsed since the second head 32 started to retract.

[0055] In the above-described embodiment, the interference region R1 when the first head 31 is mounted and the interference region R2 when the second head 32 is mounted are rectangular regions. However, the interference regions R1 and R2 may be circular regions or elliptical regions.

[0056] In the component mounter disclosed above, when one head moves to a mounting position on the board where it interferes with the other head, the head moves to the mounting position on the board without stopping in front of the interference area when the other head leaves the interference area. Compared to waiting in front of the interference area, the one head can move to the component mounting position at a faster speed, thereby improving component mounting efficiency.

[0057] In the component mounter described above, if one head is decelerating when the other head leaves the interference region before the other head reaches the interference region, the interference avoidance control unit may control the one head to accelerate toward the mounting position. This reduces the time it takes to move toward the component mounting position compared to starting movement after the other head has completed retraction. In this case, if one head is decelerating when the other head leaves the interference region before the other head reaches the interference region, the interference avoidance control unit may control the one head to accelerate toward the mounting position at the same acceleration as the acceleration with which the one head accelerated toward the interference region. This makes it relatively easy to control the speed of one head.

[0058] In the component mounter described above, the interference avoidance control unit may control, if one head is stopped, that the other head accelerates toward the mounting position at the same time that the other head accelerates to move away from the interference area when the other head leaves the interference area before the other head reaches the interference area. This reduces the time it takes to move toward the component mounting position compared to when the other head starts moving after retraction is complete.

[0059] In the mounter of the present disclosure, the first head and the second head may be arranged along a predetermined arrangement direction so as to face each other, and the width in the arrangement direction may be longer than the width in an orthogonal direction perpendicular to the arrangement direction. When the first head is moved in the arrangement direction by the first moving unit and the second head is moved in the arrangement direction by the second moving unit, the first head and the second head are likely to interfere with each other, so that the significance of applying the present disclosure is great.

[0060] The present disclosure may also be embodied as a component mounting method.

[0061] The present disclosure is applicable to the component mounting machine manufacturing industry and the like.

[0062] 10 Component mounter, 11 First head moving device, 12 Second head moving device, 13 Support stand, 21 First X-axis moving device, 22 Second X-axis moving device, 23 First beam member, 23a Side, 24 Second beam member, 24a Side, 26 X-axis linear guide, 27 X-axis linear motor, 28 X-axis mover, 31 First head, 32 Second head, 37 First X-axis linear encoder, 38 Second X-axis linear encoder, 41 First part camera, 42 Second part camera, 51 First Y-axis moving device, 52 Second Y-axis moving device, 53 Y-axis linear guide, 54 Y-axis linear motor, 55 Y-axis stator, 56 Y-axis mover, 57 First Y-axis linear encoder, 58 Second Y-axis linear encoder, 60 Tape feeder, 70 Substrate transport device, 80 Control device, 81 CPU, 82 ROM, 83 RAM, 84 storage, B base, S board.

Claims

1. A component mounter for mounting components on a substrate, comprising: a first head; a second head; a first moving unit configured to move the first head within a first movement range; a second moving unit configured to move the second head within a second movement range that at least partially overlaps with the first movement range; a first mounting control unit configured to control the first head and the first moving unit so as to hold a component on the first head and mount the component at a mounting position of the substrate; a second mounting control unit configured to control the second head and the second moving unit so as to hold a component on the second head and mount the component at the mounting position of the substrate; and an interference avoidance control unit configured to control such that when one of the first head and the second head moves to a mounting position of the substrate where it interferes with the other head while the other head is mounting a component on the substrate, if the other head has not left the interference area before the one head reaches before the interference area where the one head interferes with the other head, the one head stops before the interference area and waits until the other head leaves the interference area and then moves to the mounting position of the substrate, and if the other head leaves the interference area before the one head reaches the interference area, the one head moves to the mounting position of the substrate without stopping before the interference area.

2. The component mounter according to claim 1, wherein the interference avoidance control unit controls such that when the other head leaves the interference area before the one head reaches the interference area, if the one head is decelerating, the one head accelerates toward the mounting position.

3. The component mounter according to claim 1 or 2, wherein the interference avoidance control unit controls such that when the other head leaves the interference area before the one head reaches the interference area, if the one head is stopped, the one head accelerates toward the mounting position simultaneously with the other head accelerating to leave the interference area.

4. A component mounter according to claim 2, wherein when the other head leaves the interference area before the one head reaches the interference area, if the one head is decelerating, the interference avoidance control unit controls the one head to accelerate toward the mounting position with the same acceleration as the acceleration at which the one head accelerates toward the interference area. Component mounter.

5. A component mounter according to claim 1 or 2, wherein the first head and the second head are arranged along a predetermined arrangement direction so as to face each other, and the width in the arrangement direction is longer than the width in the orthogonal direction orthogonal to the arrangement direction. Component mounter.

6. A component mounting method applied to a component mounter having a first head, a second head, a first moving unit that moves the first head in a first moving range, and a second moving unit that moves the second head in a second moving range that at least partially overlaps the first moving range, wherein the first head and the first moving unit are controlled to hold a component on the first head and mount it at the mounting position of the substrate, the second head and the second moving unit are controlled to hold a component on the second head and mount it at the mounting position of the substrate, and when one of the first head and the second head moves to the mounting position of the substrate where it interferes with the other head while the other head is mounting a component on the substrate, if the other head has not left the interference area before the one head reaches in front of the interference area where the one head interferes with the other head, the one head stops in front of the interference area and waits until the other head leaves the interference area and then is controlled to move to the mounting position of the substrate, and when the other head leaves the interference area before the one head reaches the interference area, the one head is controlled to move to the mounting position of the substrate without stopping in front of the interference area. Component mounting method.

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