Exciter module and method for manufacturing exciter module

Abstract

This exciter module comprises: a support member; a plurality of semiconductor elements; a resin member; and a first terminal (any of a power terminal, an output terminal, and a dummy terminal). The support member has an insulating substrate, and a conductor layer disposed on one side in the thickness direction of the insulating substrate. The plurality of semiconductor elements are bonded to the conductor layer. The resin member covers the plurality of semiconductor elements and the conductor layer. The first terminal protrudes from the resin member in a first direction. The plurality of semiconductor elements include a switching element and a diode.

Description

Exciter module and method for manufacturing the exciter module

[0001] The present disclosure relates to an exciter module and a method for manufacturing an exciter module.

[0002] Conventionally, permanent magnet synchronous motors have been primarily used as motors for electric vehicles. However, rare earth elements used in permanent magnets have an unstable supply problem. Wound-field synchronous motors, which do not use rare earth elements, may become more common in the future. Wound-field synchronous motors generate a rotating magnetic field by passing a three-phase AC current through the stator windings and generate magnetic flux in the rotor by passing an excitation current through the rotor windings. The magnetic flux generated in the rotor can be directly controlled by controlling the excitation current. Patent Document 1 discloses a rotating electric machine including a motor and a control device. The motor includes a stator fixed to a housing and a rotor that rotates relative to the stator. The rotor includes a rotor core and a field winding. DC power is supplied to the field winding from a control board. The control board is equipped with field switching elements and the like. Miniaturization of components installed in electric vehicles is required, and miniaturization of the exciter (exciter), which passes excitation current through the rotor's field winding, is also desired.

[0003] Japanese Patent Application Laid-Open No. 2019-83661

[0004] [Summary] An object of the present disclosure is to provide an improved exciter module compared to conventional ones. In particular, in view of the above circumstances, an object of the present disclosure is to provide an exciter module that modularizes an exciter that passes an excitation current to a field winding of a rotor of a wound-field-type synchronous motor.

[0005] An exciter module provided by a first aspect of the present disclosure includes a support member having an insulating substrate and a conductive layer disposed on one side of the insulating substrate in a thickness direction, a plurality of semiconductor elements bonded to the conductive layer, a resin member covering the plurality of semiconductor elements and the conductive layer, and a first terminal protruding from the resin member in a first direction perpendicular to the thickness direction, The plurality of semiconductor elements include a first switching element, a second switching element, a first diode, and a second diode.

[0006] A method for manufacturing an exciter module provided by a second aspect of the present disclosure includes the steps of forming a conductive layer on an insulating substrate, joining a lead frame to the conductive layer, joining a plurality of semiconductor elements to the conductive layer, forming a resin member that covers the plurality of semiconductor elements and the conductive layer, and cutting the lead frame.

[0007] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a perspective view showing an exciter module according to a first embodiment of the present disclosure. FIG. 2 is a plan view of the exciter module shown in FIG. 1. FIG. 3 is a plan view corresponding to FIG. 2, seen through a resin member. FIG. 4 is a right side view of the exciter module shown in FIG. 1. FIG. 5 is a bottom view of the exciter module shown in FIG. 1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 3. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 3. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3. FIG. 9 is a circuit diagram showing a circuit configuration of the exciter module shown in FIG. 1. FIG. 10 is a block diagram for explaining an example of use of the exciter module shown in FIG. 1. FIG. 11 is a flowchart showing an example of a method for manufacturing the exciter module shown in FIG. 1. FIG. 12 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1. FIG. 13 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1. FIG. 14 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1 . FIG. 15 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1 . FIG. 16 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1 . FIG. 17 is a cross-sectional view showing steps in an example of a method for manufacturing the exciter module shown in FIG. 1 . FIG. 18 is a cross-sectional view showing an exciter module according to a first modified example of the first embodiment of the present disclosure. FIG. 19 is a cross-sectional view showing an exciter module according to a second modified example of the first embodiment of the present disclosure. FIG. 20 is a perspective view showing an exciter module according to a second embodiment of the present disclosure. FIG. 21 is a plan view of the exciter module shown in FIG. 20 , seen through the resin member. FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 21 . FIG. 23 is a plan view showing an exciter module according to a first modified example of the second embodiment of the present disclosure, seen through the resin member. FIG. 24 is a perspective view showing an exciter module according to a third embodiment of the present disclosure. Fig. 25 is a plan view of the exciter module shown in Fig. 24, seen through a resin member. Fig. 26 is a perspective view showing an exciter module according to a first modified example of the third embodiment of the present disclosure.Fig. 27 is a plan view of the exciter module shown in Fig. 26 , seen through a resin member. Fig. 28 is a circuit diagram showing a circuit configuration of an exciter module according to a fourth embodiment of the present disclosure. Fig. 29 is a perspective view showing an exciter module according to a fifth embodiment of the present disclosure. Fig. 30 is a plan view of the exciter module shown in Fig. 29 , seen through a resin member.

[0009] DETAILED DESCRIPTION A preferred embodiment of the exciter module of the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are merely used as labels and are not intended to necessarily assign any order to their objects.

[0010] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an) object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an) object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on (an) object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an) object B" includes "a certain object A is in contact with a certain object B and is located on (an) object B" and "a certain object A is located on (an) object B with another object interposed between the certain object A and the certain object B." Furthermore, "object A overlaps object B when viewed in a certain direction" includes "object A overlaps the entire object B" and "object A overlaps a part of object B," unless otherwise specified. Furthermore, "object A (its material) contains material C" includes "object A (its material) is made of material C" and "object A (its material) is mainly composed of material C." Furthermore, "a surface A faces in a certain direction B (one side or the other side of a certain direction B)," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to direction B, but also includes the case where surface A is tilted with respect to direction B. Furthermore, "a surface A is perpendicular to a surface B," unless otherwise specified, is not limited to the case where surface A is at a 90° angle with respect to surface B, but also includes the case where surface A is tilted with respect to surface B.

[0011] 1 to 10, an exciter module A10 according to a first embodiment of the present disclosure will be described. The exciter module A10 includes two switching elements 11 and 12, four diodes 13 to 16, a thermistor 10, a support member 2, a plurality of terminals 3, a plurality of connecting members 4, and a resin member 5. The plurality of terminals 3 include power terminals 31a and 31b, output terminals 32a and 32b, signal terminals 33a and 33b, and detection terminals 34a, 34b, 35a, and 35b. The switching elements 11 and 12 and the diodes 13 to 16 may also be referred to as semiconductor elements 11 to 16, respectively.

[0012] FIG. 1 is a perspective view showing the exciter module A10. FIG. 2 is a plan view of the exciter module A10. FIG. 3 is a plan view corresponding to FIG. 2, and for ease of understanding, the outline of the resin member 5 is shown by an imaginary line (two-dot chain line) through the resin member 5. FIG. 4 is a right side view showing the exciter module A10. FIG. 5 is a bottom view showing the exciter module A10. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 3. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 3. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3. FIG. 9 is a circuit diagram showing the circuit configuration of the exciter module A10. FIG. 10 is a block diagram for explaining an example of use of the exciter module shown in FIG. 1.

[0013] The portion of the exciter module A10 covered with the resin member 5 has a rectangular shape when viewed in the thickness direction. For ease of explanation, the thickness direction (direction in a plan view) of the exciter module A10 is referred to as the thickness direction z, the direction in which the power terminals 31 a, 31 b and the output terminals 32 a, 32 b of the exciter module A10 protrude (the up-down direction in FIG. 2 ) perpendicular to the thickness direction z is referred to as the first direction x, and the direction perpendicular to the thickness direction z and the first direction x (the left-right direction in FIG. 2 ) is referred to as the second direction y. Furthermore, one side of the thickness direction z (the right side in FIG. 4 ) is referred to as the first side z1, and the other side (the left side in FIG. 4 ) is referred to as the second side z2. One side of the first direction x (the upper side in FIGS. 2 and 3 ) is referred to as the first side x1, and the other side (the lower side in FIGS. 2 and 3 ) is referred to as the second side x2. One side in the second direction y (the right side in FIGS. 2 and 3) is referred to as the first side y1, and the other side (the left side in FIGS. 2 and 3) is referred to as the second side y2. Note that the shape and dimensions of the exciter module A10 are not limited.

[0014] The exciter module A10 is a module for exciting a rotor field winding by passing a DC current through the rotor field winding in a wound-field synchronous motor. As shown in FIG. 10 , the wound-field synchronous motor C includes a stator C1 and a rotor C2. The wound-field synchronous motor C generates a rotating magnetic field by passing three-phase AC current supplied from a three-phase inverter module B through a winding (not shown) of the stator C1. The wound-field synchronous motor C also generates magnetic flux by passing DC current supplied from the exciter module A10 through a field winding (not shown) of the rotor C2. The exciter module A10 controls the DC current (excitation current) it outputs in response to a drive signal input from a drive circuit (not shown), thereby controlling the magnetic flux generated in the rotor C2. The three-phase inverter module B and the exciter module A10 receive DC power from a battery D, which is converted to an appropriate voltage by a transformer (not shown).

[0015] The multiple semiconductor elements 11-16 are elements that perform the electrical functions of the exciter module A10. Each of the semiconductor elements 11-16 is made of a semiconductor material primarily made of, for example, silicon (Si). Note that the semiconductor material is not limited to Si, and may be silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), or the like. The multiple semiconductor elements 11-16 are bonded to a conductor layer 22 (described later) of the support member 2 by a conductive bonding material (not shown). The conductive bonding material may be, for example, solder, silver paste, or sintered metal.

[0016] In this embodiment, the switching elements 11 and 12 are insulated gate bipolar transistors (IGBTs). However, the switching elements 11 and 12 are not limited to IGBTs and may be field effect transistors such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and metal-insulator-semiconductor field-effect transistors (MISFETs).

[0017] The switching element 11 has a main surface 11a and a back surface 11b. The main surface 11a and the back surface 11b face opposite each other in the thickness direction z. The main surface 11a faces the second side z2. The back surface 11b faces the first side z1. The back surface 11b faces the support member 2.

[0018] The switching element 11 also has a first electrode 111, a second electrode 112, and a third electrode 113. The first electrode 111 and the second electrode 112 are disposed on the element main surface 11a. The first electrode 111 is larger than the second electrode 112 in a plan view. The third electrode 113 is disposed on the element rear surface 11b. The third electrode 113 covers substantially the entire surface of the element rear surface 11b. In the switching element 11, which is an IGBT, the first electrode 111 is an emitter electrode from which current is output, the second electrode 112 is a gate electrode to which a drive signal is input, and the third electrode 113 is a collector electrode to which current is input. The third electrode 113 is conductively joined to a portion of the conductor layer 22 of the support member 2 (a conductor layer 221 described below) via a conductive bonding material.

[0019] The switching element 12 has a main surface 12a and a back surface 12b. The main surface 12a and the back surface 12b face in opposite directions in the thickness direction z. The main surface 12a faces the second side z2. The back surface 12b faces the first side z1. The back surface 12b faces the support member 2.

[0020] The switching element 12 also has a first electrode 121, a second electrode 122, and a third electrode 123. The first electrode 121 and the second electrode 122 are arranged on the element main surface 12a. The first electrode 121 is larger than the second electrode 122 in a plan view. The third electrode 123 is arranged on the element back surface 12b. The third electrode 123 covers substantially the entire element back surface 12b. In the switching element 12 which is an IGBT, the first electrode 121 is an emitter electrode, the second electrode 122 is a gate electrode, and the third electrode 123 is a collector electrode. The third electrode 123 is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 224 described later) via a conductive bonding material.

[0021] Diodes 13 to 16 are diodes. Diodes 13 and 14 are connected in series in the reverse direction to switching elements 11 and 12, respectively. Diodes 13 and 14 are freewheel diodes for circulating current due to a flyback voltage generated in the coil of a motor, which is a load, when switching elements 11 and 12 are turned off. Diodes 15 and 16 are connected in antiparallel to switching elements 11 and 12, respectively. Diodes 15 and 16 are freewheel diodes for preventing reverse voltage from being applied to switching elements 11 and 12 when switching elements 11 and 12 are turned off.

[0022] The diode 13 has an element principal surface 13a and an element rear surface 13b. The element principal surface 13a and the element rear surface 13b face opposite each other in the thickness direction z. The element principal surface 13a faces the second side z2. The element rear surface 13b faces the first side z1. The element rear surface 13b faces the support member 2. The diode 13 has an anode electrode 131 to which a current is input and a cathode electrode 132 to which a current is output. The anode electrode 131 is disposed on the element principal surface 13a. The cathode electrode 132 is disposed on the element rear surface 13b. The cathode electrode 132 is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 223 described later) via a conductive bonding material.

[0023] The diode 14 has an element principal surface 14a and an element rear surface 14b. The element principal surface 14a and the element rear surface 14b face opposite each other in the thickness direction z. The element principal surface 14a faces the second side z2. The element rear surface 14b faces the first side z1. The element rear surface 14b faces the support member 2. The diode 14 has an anode electrode 141 and a cathode electrode 142. The anode electrode 141 is disposed on the element principal surface 14a. The cathode electrode 142 is disposed on the element rear surface 14b. The cathode electrode 142 is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 221 described below) via a conductive bonding material.

[0024] The diode 15 has an element principal surface 15a and an element rear surface 15b. The element principal surface 15a and the element rear surface 15b face opposite each other in the thickness direction z. The element principal surface 15a faces the second side z2. The element rear surface 15b faces the first side z1. The element rear surface 15b faces the support member 2. The diode 15 has an anode electrode 151 and a cathode electrode 152. The anode electrode 151 is disposed on the element principal surface 15a. The cathode electrode 152 is disposed on the element rear surface 15b. The cathode electrode 152 is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 221 described later) via a conductive bonding material.

[0025] The diode 16 has a main surface 16a and a back surface 16b. The main surface 16a and the back surface 16b face opposite each other in the thickness direction z. The main surface 16a faces the second side z2. The back surface 16b faces the first side z1. The back surface 16b faces the support member 2. The diode 16 has an anode electrode 161 and a cathode electrode 162. The anode electrode 161 is disposed on the main surface 16a. The cathode electrode 162 is disposed on the back surface 16b. The cathode electrode 162 is conductively joined to a portion of the conductor layer 22 of the support member 2 (a conductor layer 224 described below) via a conductive bonding material.

[0026] The thermistor 10 is disposed at the center of the support member 2 when viewed in the thickness direction z, and is used as a temperature detection sensor for the exciter module A10. One electrode of the thermistor 10 is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 227a described below) via a conductive bonding material, and the other electrode is conductively joined to a part of the conductor layer 22 of the support member 2 (a conductor layer 227b described below) via a conductive bonding material. Note that the exciter module A10 does not necessarily have to include the thermistor 10.

[0027] The support member 2 supports the semiconductor elements 11 to 16 and also provides conductive paths between the semiconductor elements 11 to 16 and the terminals 3. In this embodiment, the support member 2 is made of a direct bonded copper (DBC) substrate. The support member 2 includes an insulating substrate 21, a conductive layer 22, and a back surface metal layer 23.

[0028] The insulating substrate 21 is, for example, in the form of a flat plate and has electrical insulation properties. The constituent material of the insulating substrate 21 is, for example, a ceramic with excellent thermal conductivity, and in this embodiment, is Al2O3 (aluminum oxide). The constituent material of the insulating substrate 21 is not limited and may be other ceramics such as AlN (aluminum nitride) or SiN (silicon nitride). The constituent material of the insulating substrate 21 is also not limited to ceramics and may be Si or a synthetic resin. The constituent material of the insulating substrate 21 may be any material as long as it has insulation properties and can withstand the heat generated by the semiconductor elements 11-16.

[0029] The insulating substrate 21 has a main surface 211 and a back surface 212. The main surface 211 and the back surface 212 face in opposite directions in the thickness direction z. The main surface 211 faces the second side z2. The back surface 212 faces the first side z1.

[0030] The conductor layer 22 is disposed on the main surface 211 of the insulating substrate 21. The constituent material of the conductor layer 22 is, for example, a metal containing Cu. However, the constituent material is not limited thereto. The conductor layer 22 does not protrude from the insulating substrate 21 when viewed in the thickness direction z, but is contained within the insulating substrate 21 when viewed in the thickness direction z. Furthermore, the conductor layer 22 is entirely covered by the resin member 5 and is not exposed from the resin member 5.

[0031] The conductor layer 22 includes conductor layers 221 to 224, 225a, 225b, 226a, 226b, 227a, and 227b. As shown in Fig. 3, the conductor layers 221 to 224, 225a, 225b, 226a, 226b, 227a, and 227b are spaced apart from one another. Note that the conductor layers 22 are hatched in Fig. 3 for ease of understanding.

[0032] The conductor layer 221 is disposed on the main surface 211 of the insulating substrate 21 from a first side x1 in the first direction x to a second side y2 in the second direction y, and extends in the first direction x. The switching element 11 and the diodes 14 and 15 are bonded to the conductor layer 221, and a portion of the power terminal 31a is also bonded to the conductor layer 221. The conductor layer 221 has a recess recessed from the second side y2 to the first side y1 in the second direction y. As shown in FIG. 6 , the conductor layer 221 is electrically connected to the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15. In other words, the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15 are electrically connected to each other via the conductor layer 221.

[0033] The conductor layer 222 is disposed on the main surface 211 of the insulating substrate 21 on a first side x1 in the first direction x and a first side y1 in the second direction y. A part of the power terminal 31b is joined to the conductor layer 222.

[0034] The conductor layer 223 is disposed on the main surface 211 of the insulating substrate 21 on the second side x2 in the first direction x and the second side y2 in the second direction y. The diode 13 and a part of the output terminal 32a are joined to the conductor layer 223. The conductor layer 223 is electrically connected to the cathode electrode 132 of the diode 13, as shown in FIG. 7 .

[0035] The conductor layer 224 is disposed on the main surface 211 of the insulating substrate 21 on a second side x2 in the first direction x and a first side y1 in the second direction y, and extends in the first direction x. The switching element 12 and the diode 16 are joined to the conductor layer 224, and a portion of the output terminal 32b is also joined to the conductor layer 224. The conductor layer 224 has a recess recessed from the first side y1 to the second side y2 in the second direction y. As shown in FIGS. 7 and 8 , the conductor layer 224 is electrically connected to the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16. In other words, the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16 are electrically connected via the conductor layer 224.

[0036] The conductor layers 225a and 225b are arranged side by side in the first direction x in the recess of the conductor layer 221 on the main surface 211 of the insulating substrate 21. A signal terminal 33a is joined to the conductor layer 225a. A detection terminal 34a is joined to the conductor layer 225b.

[0037] The conductor layers 226a and 226b are arranged side by side in the first direction x in the recess of the conductor layer 224 on the main surface 211 of the insulating substrate 21. A detection terminal 34b is joined to the conductor layer 226a. A signal terminal 33b is joined to the conductor layer 226b.

[0038] The conductor layers 227a and 227b are arranged side by side in the first direction x, surrounded by the conductor layers 221, 223, and 224, approximately in the center of the main surface 211 of the insulating substrate 21. A detection terminal 35a is bonded to the conductor layer 227a. A detection terminal 35b is bonded to the conductor layer 227b. Different electrodes of the thermistor 10 are bonded to the conductor layer 227a and the conductor layer 227b, respectively. In other words, the thermistor 10 is arranged across the conductor layer 227a and the conductor layer 227b.

[0039] The arrangement and shape of the conductive layers 221 to 224, 225a, 225b, 226a, 226b, 227a, and 227b are not limited to those described above, but may be appropriately designed depending on the arrangement position of the terminals 3, etc.

[0040] The back surface metal layer 23 is disposed on the back surface 212 of the insulating substrate 21. The constituent material of the back surface metal layer 23 is, for example, a metal containing Cu. However, the constituent material is not limited thereto. The back surface metal layer 23 does not protrude from the insulating substrate 21 as viewed in the thickness direction z, but is contained within the insulating substrate 21 as viewed in the thickness direction z. As shown in FIGS. 5 to 7 , the surface of the back surface metal layer 23 facing the first side z1 in the thickness direction z is exposed from the resin member 5.

[0041] Note that the support member 2 is not limited to being made of a DBC substrate, and there are no limitations on the method for forming the support member 2. The support member 2 may be an insulating substrate 21 on which a conductor layer 22 and a back surface metal layer 23 are formed by, for example, plating.

[0042] Each terminal 3 is bonded to the conductive layer 22 inside the resin member 5. A portion of each terminal 3 is exposed from the resin member 5. Each terminal 3 serves as a conduction path for input / output currents or input / output signals of the exciter module A10.

[0043] The power terminals 31a, 31b and the output terminals 32a, 32b each protrude from the insulating substrate 21 when viewed in the thickness direction z and protrude from the resin member 5 in the first direction x. The power terminals 31a, 31b and the output terminals 32a, 32b are each plate-shaped members and are formed from the same lead frame. The lead frame is made of metal, preferably either Cu or Ni, or an alloy thereof, such as 42 alloy. The power terminals 31a, 31b are terminals for applying a DC voltage to the exciter module A10. The output terminals 32a, 32b are terminals for outputting a DC voltage from the exciter module A10.

[0044] The power terminal 31a is one terminal for applying a DC voltage and is a positive terminal. The power terminal 31a is conductively joined to the conductor layer 221 via a conductive bonding material. The joining method is not limited, and may be laser joining, ultrasonic joining, or the like. The power terminal 31a is conductively connected to the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15 via the conductor layer 221. The power terminal 31a is partially covered by the resin member 5, and partially protrudes from the resin member 5 toward a first side x1 in the first direction x, extending in the first direction x.

[0045] The power terminal 31b is the other terminal for applying a DC voltage and is a negative terminal. The power terminal 31b is conductively joined to the conductor layer 222 via a conductive bonding material. The joining method is not limited. The power terminal 31b is conductively connected to the first electrode 121 (emitter electrode) of the switching element 12 via the conductor layer 222 and a connecting member 4 (a connecting member 45 described later). The power terminal 31b is partially covered with a resin member 5 and partially protrudes from the resin member 5 toward a first side x1 in the first direction x, extending in the first direction x.

[0046] The output terminal 32a is one terminal for outputting an excitation current and is a positive terminal. The output terminal 32a is conductively joined to the conductor layer 223 via a conductive bonding material. The joining method is not limited. The output terminal 32a is conductively connected to the cathode electrode 132 of the diode 13 via the conductor layer 223. The output terminal 32a is partially covered with the resin member 5, and partially protrudes from the resin member 5 toward the second side x2 in the first direction x, extending in the first direction x.

[0047] The output terminal 32b is the other terminal for outputting the excitation current and is a negative terminal. The output terminal 32b is conductively joined to the conductor layer 224 via a conductive bonding material. The joining method is not limited. The output terminal 32b is conductively connected to the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16 via the conductor layer 224. The output terminal 32b is partially covered with the resin member 5 and partially protrudes from the resin member 5 toward the second side x2 in the first direction x, extending in the first direction x.

[0048] The signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b are all press-fit terminals that protrude from the resin member 5 toward the second side z2 in the thickness direction z. As shown in FIG. 8 , the signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b each include a holder 3a and a metal pin 3b. The holder 3a is made of a conductive material and has a cylindrical shape extending in the thickness direction z. The holder 3a is joined to the conductive layer 22 via a conductive bonding material. Note that the joining method is not limited. The metal pin 3b is made of a conductive material and is a rod-shaped member extending in the thickness direction z. The metal pin 3b is press-fitted and supported along the inner circumferential surface of the holder 3a. The metal pin 3b is electrically connected to the conductive layer 22 via the holder 3a and the conductive bonding material.

[0049] The signal terminal 33a is a terminal to which a drive signal for driving the switching element 11 is input. The signal terminal 33a is electrically connected to the second electrode 112 (gate electrode) of the switching element 11 via the conductor layer 225a and the connection member 4 (connection member 41a described below). A drive signal for controlling the on / off of the switching element 11 is input to the signal terminal 33a. For example, a drive circuit is connected to the signal terminal 33a. The drive circuit generates a drive signal for controlling the switching operation of the switching element 11. The drive signal is input to the signal terminal 33a from the drive circuit.

[0050] The signal terminal 33b is a terminal to which a drive signal for driving the switching element 12 is input. The signal terminal 33b is electrically connected to the second electrode 122 (gate electrode) of the switching element 12 via the conductive layer 226b and the connection member 4 (connection member 41b, described later). A drive signal for controlling the on / off of the switching element 12 is input to the signal terminal 33b. For example, a drive circuit is connected to the signal terminal 33b. The drive circuit generates a drive signal for controlling the switching operation of the switching element 12. The drive signal is input to the signal terminal 33b from the drive circuit. The drive signal input to the signal terminal 33b may be the same as or different from the drive signal input to the signal terminal 33a. For example, drive signals with different phases may be input to the signal terminals 33a and 33b.

[0051] The detection terminal 34a is an emitter sense terminal of the switching element 11. The detection terminal 34a is electrically connected to the first electrode 111 (emitter electrode) of the switching element 11 via the conductive layer 225b and the connection member 4 (connection member 42a, described later). A drive circuit, for example, is connected to the detection terminal 34a. The voltage applied to the detection terminal 34a is input to the drive circuit as a feedback signal.

[0052] The detection terminal 34b is an emitter sense terminal of the switching element 12. The detection terminal 34b is electrically connected to the first electrode 121 (emitter electrode) of the switching element 12 via the conductive layer 226a and the connection member 4 (connection member 42b described below). A drive circuit, for example, is connected to the detection terminal 34b. The voltage applied to the detection terminal 34b is input to the drive circuit as a feedback signal.

[0053] The detection terminals 35a and 35b are temperature detection terminals of the exciter module A10. The detection terminal 35a is electrically connected to one electrode of the thermistor 10 via the conductive layer 227a. The detection terminal 35b is electrically connected to the other electrode of the thermistor 10 via the conductive layer 227b. A drive circuit, for example, is connected to the detection terminals 35a and 35b. The drive circuit detects overheating abnormalities based on the potential difference between the detection terminals 35a and 35b, i.e., the potential difference between the two electrodes of the thermistor 10, which is a potential difference corresponding to the ambient temperature of the thermistor 10. When the detected potential difference exceeds a potential difference corresponding to a threshold temperature, the drive circuit stops outputting a drive signal, thereby stopping the drive of the exciter module A10.

[0054] The signal terminal 33a and the detection terminal 34a are arranged side by side in the first direction x. The signal terminal 33b and the detection terminal 34b are arranged side by side in the first direction x. The detection terminals 35a and 35b are arranged side by side in the first direction x. The arrangement of the signal terminals 33a and 33b and the detection terminals 34a, 34b, 35a, 35b is not limited.

[0055] Each of the multiple connection members 4 provides electrical continuity between two spaced apart portions. Each connection member 4 is a so-called bonding wire. The constituent material of each connection member 4 is, for example, Al, Au, Cu, or an alloy containing any of these. The multiple connection members 4 include connection members 41a, 41b, 42a, 42b, 43a, 43b, and 44 to 46.

[0056] The connecting member 41a has one end joined to the second electrode 112 (gate electrode) of the switching element 11, and the other end joined to the conductor layer 225a. The connecting member 41a provides electrical continuity between the second electrode 112 and the conductor layer 225a. The connecting member 41b has one end joined to the second electrode 122 (gate electrode) of the switching element 12, and the other end joined to the conductor layer 226b. The connecting member 41b provides electrical continuity between the second electrode 122 and the conductor layer 226b.

[0057] One end of the connecting member 42a is joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end is joined to the conductive layer 225b. The connecting member 42a provides electrical continuity between the first electrode 111 and the conductive layer 225b. The connecting member 42b has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the conductive layer 226a. The connecting member 42b provides electrical continuity between the first electrode 121 and the conductive layer 226a.

[0058] The connecting member 43a has one end joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end joined to the anode electrode 151 of the diode 15. The connecting member 43a electrically connects the first electrode 111 and the anode electrode 151. The connecting member 43b has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the anode electrode 161 of the diode 16. The connecting member 43b electrically connects the first electrode 121 and the anode electrode 161.

[0059] The connecting member 44 has one end joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end joined to the conductive layer 223. The connecting member 44 electrically connects the first electrode 111 and the conductive layer 223.

[0060] The connecting member 45 has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the conductive layer 222. The connecting member 45 electrically connects the first electrode 121 and the conductive layer 222.

[0061] The connecting member 46 has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the anode electrode 131 of the diode 13. The connecting member 46 electrically connects the first electrode 121 and the anode electrode 131.

[0062] The connecting member 47 has one end joined to the anode electrode 141 of the diode 14 and the other end joined to the conductive layer 224. The connecting member 47 electrically connects the anode electrode 141 and the conductive layer 224.

[0063] The resin member 5 is an electrically insulating semiconductor encapsulant. The resin member 5 covers the entire semiconductor elements 11-16, the insulating substrate 21, the conductor layer 22, and the plurality of connection members 4, as well as a portion of each terminal 3. The constituent material of the resin member 5 is, for example, epoxy resin. However, the constituent material of the resin member 5 is not limited. The resin member 5 is formed, for example, by transfer molding using a mold. However, the method of forming the resin member 5 is not limited. The resin member 5 has a resin main surface 51, a resin back surface 52, and a plurality of resin side surfaces 531-534.

[0064] The resin main surface 51 and the resin back surface 52 face opposite each other in the thickness direction z. The resin main surface 51 faces the second side z2, and the resin back surface 52 faces the first side z1. The back surface metal layer 23 is exposed from the resin back surface 52, and the resin back surface 52 and the surface of the back surface metal layer 23 facing the first side z1 in the thickness direction z are flush with each other. Each of the multiple resin side surfaces 531 to 534 is connected to both the resin main surface 51 and the resin back surface 52 and is sandwiched between them. As shown in FIG. 2 , the two resin side surfaces 531, 532 face opposite each other in the first direction x. The resin side surface 531 is a surface disposed on the first side x1 in the first direction x and facing the first side x1. The resin side surface 532 is a surface disposed on the second side x2 in the first direction x and facing the second side x2. The two resin side surfaces 533, 534 face opposite each other in the second direction y. The resin side surface 533 is a surface that is disposed on a first side y1 in the second direction y and faces the first side y1. The resin side surface 534 is a surface that is disposed on a second side y2 in the second direction y and faces the second side y2.

[0065] The resin side surfaces 531 to 534 are each connected to the resin main surface 51 and have surfaces that are inclined so as to approach each other as they approach the resin main surface 51. In other words, the portions of the resin member 5 that are surrounded by the inclined surfaces that are connected to the resin main surface 51 have a tapered shape in which the cross-sectional area in the xy plane decreases toward the resin main surface 51. The resin side surfaces 531 to 534 are each connected to the resin back surface 52 and have surfaces that are inclined so as to approach each other as they approach the resin back surface 52. In other words, the portions of the resin member 5 that are surrounded by the inclined surfaces that are connected to the resin back surface 52 have a tapered shape in which the cross-sectional area in the xy plane decreases toward the resin back surface 52. The shapes of the resin member 5 shown in FIGS. 1 to 8 are merely examples. The shape of the resin member 5 is not limited to the illustrated shapes.

[0066] The circuit configuration of the exciter module A10 is as shown in the circuit diagram of FIG.

[0067] The first electrode 111 (emitter electrode) of the switching element 11 and the cathode electrode 132 of the diode 13 are electrically connected via the connecting member 44 and the conductive layer 222. The third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14 are electrically connected via the conductive layer 224 and the connecting member 47. The third electrode 113 (collector electrode) of the switching element 11 and the cathode electrode 142 of the diode 14 are electrically connected via the conductive layer 221. The anode electrode 131 of the diode 13 and the first electrode 121 (emitter electrode) of the switching element 12 are electrically connected via the connecting member 46. The diode 15 is connected in anti-parallel to the switching element 11 via the connecting member 43a and the conductive layer 221. The diode 16 is connected in anti-parallel to the switching element 12 via the connecting member 43b and the conductive layer 224.

[0068] A power terminal 31a is joined to the conductor layer 221, which electrically connects the third electrode 113 (collector electrode) of the switching element 11 and the cathode electrode 142 of the diode 14. The first electrode 121 (emitter electrode) of the switching element 12, which is electrically connected to the anode electrode 131 of the diode 13, is electrically connected to the conductor layer 222 via a connecting member 45, and a power terminal 31b is joined to the conductor layer 222. An output terminal 32a is joined to the conductor layer 223, which electrically connects the first electrode 111 (emitter electrode) of the switching element 11 and the cathode electrode 132 of the diode 13. An output terminal 32b is joined to the conductor layer 224, which electrically connects the third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14.

[0069] The second electrode 112 (gate electrode) of the switching element 11 is conductively connected to the signal terminal 33a via the connecting member 41a and the conductive layer 225a. The second electrode 122 (gate electrode) of the switching element 12 is conductively connected to the signal terminal 33b via the connecting member 41b and the conductive layer 226b. The first electrode 111 (emitter electrode) of the switching element 11 is conductively connected to the detection terminal 34a via the connecting member 42a and the conductive layer 225b. The first electrode 121 (emitter electrode) of the switching element 12 is conductively connected to the detection terminal 34b via the connecting member 42b and the conductive layer 226a.

[0070] An external DC voltage is applied between power terminals 31 a and 31 b of the exciter module A10, and a voltage is output between output terminals 32 a and 32 b. The drive circuit receives feedback signals from detection terminals 34 a and 34 b and outputs drive signals to signal terminals 33 a and 33 b. The exciter module A10 outputs, as excitation current, a DC current controlled in accordance with the drive signal input from the drive circuit to the field winding of the rotor C2 of the wound-field-type synchronous motor C, which is connected between output terminals 32 a and 32 b.

[0071] One electrode of thermistor 10 is conductively connected to detection terminal 35a via conductive layer 227a, and the other electrode of thermistor 10 is conductively connected to detection terminal 35b via conductive layer 227b. The drive circuit detects an overheating abnormality based on the potential difference between detection terminal 35a and detection terminal 35b.

[0072] Next, an example of a method for manufacturing the exciter module A10 will be described below with reference to FIGS. 11 to 17. Note that the manufacturing method described below is one means for realizing the exciter module A10, and is not limited to this. FIG. 11 is a flowchart showing an example of a method for manufacturing the exciter module A10. FIGS. 12 to 17 are diagrams showing steps in an example of a method for manufacturing the exciter module A10. FIGS. 12 to 17 are cross-sectional views corresponding to FIG. 6. Note that the first direction x, second direction y, and thickness direction z shown in FIGS. 12 to 17 indicate the same directions as those in FIGS. 1 to 8.

[0073] As shown in FIG. 11, the manufacturing method of the exciter module A10 includes a support member forming process (S1), a lead frame joining process (S2), a semiconductor element mounting process (S3), a wire connecting process (S4), a resin forming process (S5), a metal pin inserting process (S6), and a frame cutting process (S7).

[0074] The support member forming step (S1) is a step of forming a support member 2. In the support member forming step, a DBC substrate, in which Cu foil is bonded to both sides of an insulating substrate 91, is formed by patterning the Cu foil on one side of the insulating substrate 91, thereby forming a conductor layer 22 on the insulating substrate 91. Furthermore, the Cu foil on the other side of the DBC substrate is patterned to form a back surface metal layer 23 on the insulating substrate 91. The conductor layer 22 and the back surface metal layer 23 may be formed on both sides of the insulating substrate 91 by plating or the like. Next, the DBC substrate is cut to form a support member 2 in which the conductor layer 22 is disposed on the main surface 211 of the insulating substrate 21 and the back surface metal layer 23 is disposed on the back surface 212 (see FIG. 12 ).

[0075] In the lead frame bonding process (S2), first, a lead frame 94 that will become the power terminals 31a, 31b and the output terminals 32a, 32b is prepared. The lead frame 94 includes portions that will become the power terminals 31a, 31b and the output terminals 32a, 32b, and further includes a frame to which the power terminals 31a, 31b and the output terminals 32a, 32b are connected. Note that the shape of the lead frame 94 is not limited in any way. Next, a conductive bonding paste is applied to the conductor layer 22 at positions where the power terminals 31a, 31b and the output terminals 32a, 32b will be bonded. As shown in FIG. 13 , the portions of the lead frame 94 that will become the power terminals 31a, 31b and the output terminals 32a, 32b are bonded to the conductor layer 22. For example, the portion of the lead frame 94 that will become the power terminal 31a is bonded to the conductor layer 221, and the portion of the lead frame 94 that will become the output terminal 32a is bonded to the conductor layer 223. The method for joining the lead frame 94 is not limited.

[0076] In the semiconductor element mounting step (S3), first, a conductive adhesive paste is applied to the conductive layer 22 in the area where the semiconductor elements 11 to 16 are to be disposed. Next, as shown in FIG. 14 , the semiconductor elements 11 to 16 are attached to the conductive adhesive paste, heated, and then cooled. This bonds the semiconductor elements 11 to 16 to the conductive layer 22 via the conductive adhesive. For example, the semiconductor elements 11, 14, and 15 are bonded to the conductive layer 221. At this time, the holders 3a of the signal terminals 33a and 33b and the detection terminals 34a, 34b, 35a, and 35b are also bonded to the conductive layer 22 via the conductive adhesive.

[0077] In the wire connection step (S4), a plurality of connection members 4 are connected. For example, as shown in Fig. 15, a connection member 43a is formed so as to connect the first electrode 111 of the switching element 11 and the anode electrode 151 of the diode 15.

[0078] In the resin forming step (S5), a mold is used to surround a portion of the lead frame 94, a portion of the support member 2, the semiconductor elements 11 to 16, and the plurality of connection members 4. A liquid resin material is then injected into the space defined by the mold. The resin material is then cured to obtain the resin member 5 (see FIG. 16).

[0079] In the metal pin inserting step (S6), as shown in FIG. 17, the metal pins 3b of the signal terminals 33a and 33b and the detection terminals 34a, 34b, 35a, and 35b are individually inserted into the corresponding holders 3a.

[0080] In the frame cutting step (S7), as shown in Fig. 17, the lead frame 94 is cut at appropriate locations of the portions thereof that are exposed from the resin member 5. This separates the power terminals 31a, 31b and the output terminals 32a, 32b from each other. In this manner, the exciter module A10 described above is obtained.

[0081] Next, the function and effect of the exciter module A10 will be described.

[0082] According to this embodiment, the exciter module A10 includes two switching elements 11 and 12, four diodes 13 to 16, a thermistor 10, a support member 2, a plurality of terminals 3, a plurality of connecting members 4, and a resin member 5. The exciter module A10 configures an exciter circuit in which the two switching elements 11 and 12 and the four diodes 13 to 16 are connected as shown in the circuit diagram in Fig. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and the plurality of connecting members 4 serving as conduction paths. In other words, the exciter module A10 is a modularized exciter, and is smaller in size than conventional exciters.

[0083] Furthermore, in this embodiment, the power terminals 31 a, 31 b and the output terminals 32 a, 32 b are joined as part of the same lead frame 94 in the lead frame joining step (S2) of the manufacturing process. Therefore, the exciter module A10 is easy to handle during manufacturing. Furthermore, since multiple exciter modules A10 can be manufactured using a common lead frame 94, manufacturing efficiency is improved.

[0084] In this embodiment, the power terminals 31 a, 31 b and the output terminals 32 a, 32 b are plate-shaped members made of lead frames, allowing a larger current to flow through them than when the power terminals 31 a, 31 b and the output terminals 32 a, 32 b are made of press-fit terminals whose cross-sectional area is smaller than that of the lead frames.

[0085] Furthermore, in this embodiment, the surface of the back surface metal layer 23 of the support member 2 facing the first side z1 in the thickness direction z is exposed from the resin member 5. This allows the exciter module A10 to improve its heat dissipation efficiency. Furthermore, the exciter module A10 can further improve its heat dissipation effect by attaching a heat dissipation member or cooler to the exposed surface of the back surface metal layer 23.

[0086] In the present embodiment, the case where all of the plurality of connection members 4 are bonding wires has been described, but this is not limiting. Instead of any of the plurality of connection members 4, a connection member other than a bonding wire (for example, a metal plate member or a metal ribbon) may be used.

[0087] In addition, in the present embodiment, the case where the power terminals 31 a, 31 b and the output terminals 32 a, 32 b are all joined to the conductor layer 22 has been described, but this is not limiting. Either the power terminals 31 a, 31 b or the output terminals 32 a, 32 b may be joined to the insulating substrate 21 at a distance from the conductor layer 22. In this case, the terminal is electrically connected to the conductor layer 22 by a connecting member such as a bonding wire.

[0088] In addition, in the present embodiment, the signal terminals 33 a, 33 b and the detection terminals 34 a, 34 b, 35 a, 35 b are all press-fit terminals, but this is not limiting. Any of the signal terminals 33 a, 33 b and the detection terminals 34 a, 34 b, 35 a, 35 b may be formed from the same lead frame as the power terminals 31 a, 31 b and the output terminals 32 a, 32 b.

[0089] 18 and 19 show modified examples of the support member 2 according to the first embodiment. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment, and redundant explanations will be omitted.

[0090] First Modification: Fig. 18 is a diagram for explaining an exciter module A11 according to a first modification of the first embodiment. Fig. 18 is a cross-sectional view showing the exciter module A11, and corresponds to Fig. 6. The exciter module A11 differs from the exciter module A10 in that the support member 2 is entirely covered with the resin member 5.

[0091] Second Modification: Fig. 19 is a diagram illustrating an exciter module A12 according to a second modification of the first embodiment. Fig. 19 is a cross-sectional view showing the exciter module A12, and corresponds to Fig. 6 . The exciter module A12 differs from the exciter module A10 in that the support member 2 does not include a back surface metal layer 23. Note that the back surface 212 of the insulating substrate 21 may be exposed from the resin back surface 52 of the resin member 5.

[0092] 20 to 30 show other embodiments of the present disclosure. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as in the above embodiment, and redundant explanations will be omitted.

[0093] Second Embodiment: FIGS. 20 to 22 are diagrams illustrating an exciter module A20 according to a second embodiment of the present disclosure. FIG. 20 is a perspective view of the exciter module A20, corresponding to FIG. 1. FIG. 21 is a plan view of the exciter module A20, seen through the resin member 5. FIG. 21 is a view corresponding to FIG. 3. FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 21. The exciter module A20 according to this embodiment differs from the exciter module A10 according to the first embodiment in that the power terminals and output terminals are configured as press-fit terminals. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that the parts of the first embodiment and the modified examples described above may be combined in any desired manner.

[0094] The exciter module A20 according to this embodiment includes, instead of the power terminals 31a, 31b and the output terminals 32a, 32b, a plurality of power terminals 36a, 36b and a plurality of output terminals 36c, 36d. The power terminals 36a, 36b and the output terminals 36c, 36d are all press-fit terminals that protrude from the resin member 5 toward the second side z2 in the thickness direction z. The plurality of power terminals 36a are one terminal for applying a DC voltage and are positive terminals. The plurality of power terminals 36a are conductively joined to the conductor layer 221 in the second direction y. The plurality of power terminals 36b are the other terminal for applying a DC voltage and are negative terminals. The plurality of power terminals 36b are conductively joined to the conductor layer 222 in the second direction y. The plurality of output terminals 36c are one terminal for outputting an excitation current and are positive terminals. The plurality of output terminals 36c are electrically connected to the conductor layer 223 and arranged in the second direction y. The plurality of output terminals 36d are the other terminals for outputting the excitation current and are negative terminals. The plurality of output terminals 36d are electrically connected to the conductor layer 224 and arranged in the second direction y.

[0095] The excitation current flowing through the field winding of the rotor of a wound-field-type synchronous motor is sufficiently small compared to the three-phase AC current flowing through the stator winding. Therefore, even if the power terminals 36a, 36b and the output terminals 36c, 36d are press-fit terminals with smaller cross-sectional areas than the power terminals 31a, 31b and the output terminals 32a, 32b formed from lead frames, current can still be passed through them by arranging multiple terminals. In this embodiment, the exciter module A20 has four power terminals 36a, 36b and four output terminals 36c, 36d. However, the number of power terminals 36a, 36b and output terminals 36c, 36d is not limited.

[0096] The conductor layer 22 according to this embodiment further includes conductor layers 228a, 228b, 228c, and 228d. The conductor layer 228a is disposed on a first side x1 of the conductor layer 221 in the first direction x and extends in the second direction y. The conductor layer 228b is disposed on a first side x1 of the conductor layer 222 in the first direction x and extends in the second direction y. The conductor layer 228c is disposed on a second side x2 of the conductor layer 223 in the first direction x and extends in the second direction y. The conductor layer 228d is disposed on a second side x2 of the conductor layer 224 in the first direction x and extends in the second direction y. None of the conductor layers 228a, 228b, 228c, and 228d is electrically connected to either the semiconductor elements 11-16 or the thermistor 10.

[0097] The exciter module A20 according to this embodiment further includes dummy terminals 37a, 37b, 38a, and 38b. The dummy terminals 37a, 37b, 38a, and 38b each protrude from the insulating substrate 21 when viewed in the thickness direction z and protrude from the resin member 5 in the first direction x. The dummy terminals 37a, 37b, 38a, and 38b are each plate-shaped members formed from the same lead frame. The dummy terminals 37a, 37b, 38a, and 38b are conductively bonded to the conductor layers 228a, 228b, 228c, and 228d, respectively, via conductive bonding materials. Note that the bonding method is not limited. None of the dummy terminals 37a, 37b, 38a, and 38b are electrically connected to either the semiconductor elements 11 to 16 or the thermistor 10. The dummy terminals 37a, 37b, 38a, and 38b are portions that remain after cutting the lead frame in a manufacturing method that uses the lead frame.

[0098] In this embodiment as well, the exciter module A20 configures an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram of Fig. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and the plurality of connecting members 4 serving as conduction paths. In other words, the exciter module A20 is a modularized exciter, and is smaller in size than conventional exciters.

[0099] Furthermore, in this embodiment, the dummy terminals 37 a, 37 b, 38 a, and 38 b are joined as part of the same lead frame in the lead frame joining step (S2) of the manufacturing process. Therefore, the exciter module A20 is easy to handle during manufacturing. Furthermore, since multiple exciter modules A20 can be manufactured using a common lead frame, manufacturing efficiency is improved.

[0100] Furthermore, the exciter module A20 has a configuration in common with the exciter module A10, and thereby achieves the same effects as the exciter module A10. Furthermore, according to this embodiment, the multiple power terminals 36a, 36b and the output terminals 36c, 36d are all press-fit terminals that protrude from the resin member 5 to the second side z2 in the thickness direction z. Therefore, the exciter module A20 can input power and output excitation current using only press-fit terminals.

[0101] First Modification: Fig. 23 is a diagram illustrating an exciter module A21 according to a first modification of the second embodiment. Fig. 23 is a plan view showing the exciter module A21, seen through the resin member 5. Fig. 23 corresponds to Fig. 21. In Fig. 23, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as in the above embodiment, and redundant description will be omitted. The exciter module A21 differs from the exciter module A20 in that the conductor layer 22 does not include conductor layers 228a, 228b, 228c, and 228d, and the dummy terminals 37a, 37b, 38a, and 38b are directly bonded to the main surface 211 of the insulating substrate 21 of the support member 2.

[0102] Third Embodiment: FIGS. 24 and 25 are diagrams illustrating an exciter module A30 according to a third embodiment of the present disclosure. FIG. 24 is a perspective view showing the exciter module A30, and corresponds to FIG. 1. FIG. 25 is a plan view showing the exciter module A30, seen through the resin member 5. FIG. 25 corresponds to FIG. 3. The exciter module A30 according to this embodiment differs from the exciter module A10 according to the first embodiment in that the output terminals are configured as press-fit terminals. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that the parts of the first and second embodiments and the modified examples described above may be combined in any desired manner.

[0103] The exciter module A30 according to this embodiment includes multiple output terminals 36c and 36d instead of the output terminals 32a and 32b. The output terminals 36c and 36d are press-fit terminals that protrude from the resin member 5 toward the second side z2 in the thickness direction z. The multiple output terminals 36c are one terminal for outputting the excitation current and are positive terminals. The multiple output terminals 36c are conductively joined to the conductor layer 223 in the second direction y. The multiple output terminals 36d are the other terminal for outputting the excitation current and are negative terminals. The multiple output terminals 36d are conductively joined to the conductor layer 224 in the second direction y. In this embodiment, the exciter module A30 includes four output terminals 36c and four output terminals 36d. The number of output terminals 36c and 36d is not limited.

[0104] The conductor layer 22 according to this embodiment further includes a conductor layer 229. The conductor layer 22 is disposed on the second side x2 of the conductor layers 223 and 224 in the first direction x, and extends in the second direction y. The conductor layer 229 is not electrically connected to any of the semiconductor elements 11 to 16 or the thermistor 10.

[0105] The exciter module A30 according to this embodiment further includes a dummy terminal 39. The dummy terminal 39 protrudes from the insulating substrate 21 when viewed in the thickness direction z, and protrudes from the resin member 5 in the first direction x. The dummy terminal 39 is a plate-shaped member and is formed from the same lead frame as the power terminals 31a and 31b. The dummy terminal 39 is conductively joined to the conductor layer 229 via a conductive bonding material. The joining method is not limited. The dummy terminal 39 is not conductive to any of the semiconductor elements 11 to 16 or the thermistor 10.

[0106] In this embodiment as well, the exciter module A30 has an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram in Fig. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and the plurality of connecting members 4 serving as conduction paths. In other words, the exciter module A30 is a modularized exciter, and is smaller in size than conventional exciters.

[0107] Furthermore, in this embodiment, the power terminals 31 a, 31 b and the dummy terminals 39 are joined as part of the same lead frame in the lead frame joining step (S2) of the manufacturing process. Therefore, the exciter module A30 is easy to handle during manufacturing. Furthermore, since multiple exciter modules A30 can be manufactured using a common lead frame, manufacturing efficiency is improved.

[0108] Furthermore, the exciter module A30 has the same configuration as the exciter module A10, and thus achieves the same effects as the exciter module A10.

[0109] First Modification: Figures 26 and 27 are diagrams illustrating an exciter module A31 according to a first modification of the third embodiment. Figure 26 is a perspective view of the exciter module A31, corresponding to Figure 24. Figure 27 is a plan view of the exciter module A31, seen through the resin member 5. Figure 27 is a diagram corresponding to Figure 25. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as in the above embodiment, and redundant description will be omitted. The exciter module A31 differs from the exciter module A30 in the layout of the conductor layers 22 and the positions of the press-fit terminals.

[0110] In the first modified example, the conductor layer 221 extends in the first direction x to near the end of the second side x2 of the main surface 211 of the insulating substrate 21 and has two recesses recessed from the second side y2 to the first side y1 in the second direction y. The conductor layers 225a and 225b are arranged side by side in the first direction x in the recess on the second side x2 of the two recesses of the conductor layer 221. The conductor layers 226b and 226a are arranged side by side in the first direction x in the recess on the first side x1 of the two recesses of the conductor layer 221. The conductor layer 223 is arranged on the second side x2 of the conductor layer 224 in the first direction x. The conductor layers 227a and 227b are arranged side by side in the second direction y on the second side x2 of the conductor layer 223 in the first direction x and on the first side y1 of the conductor layer 221 in the second direction y.

[0111] The output terminals 36c are electrically connected to the conductor layer 223 and aligned in the first direction x. The output terminals 36d are electrically connected to the conductor layer 224 and aligned in the second direction y. In this embodiment, there are three output terminals 36c and three output terminals 36d. The number of output terminals 36c and 36d is not limited. The detection terminal 34b, the signal terminal 33b, the signal terminal 33a, and the detection terminal 34a are arranged in a line in this order from the first side x1 to the second side x2 in the first direction x near the end of the resin principal surface 51 on the second side y2 in the second direction y. The output terminals 36c are arranged in a line in the first direction x near the end of the resin principal surface 51 on the first side y1 in the second direction y. The detection terminals 35a and 35b are arranged in a line in the second direction y near the end of the resin principal surface 51 on the second side x2 in the first direction x. The multiple output terminals 36d are arranged in a row in the second direction y near the end of the resin main surface 51 on the first side x1 in the first direction x.

[0112] Fourth Embodiment: FIG. 28 is a diagram illustrating an exciter module A40 according to a fourth embodiment of the present disclosure. FIG. 28 is a circuit diagram showing the circuit configuration of the exciter module A40, and corresponds to FIG. 9 . The exciter module A40 according to this embodiment differs from the exciter module A10 according to the first embodiment in that it further includes a switching element 17 and diodes 18 and 19. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that the parts of the first to third embodiments and the modifications described above may be combined in any desired manner.

[0113] The exciter module A40 according to this embodiment further includes a switching element 17 and diodes 18 and 19. The switching element 17 has a configuration similar to that of the switching elements 11 and 12. The diodes 18 and 19 have a configuration similar to that of the diodes 13 to 16. The diode 18 is connected in series with the switching element 17 in the forward direction, with its anode electrode conductively connected to the emitter electrode of the switching element 17. The diode 19 is connected in antiparallel with the switching element 17, with its anode electrode conductively connected to the emitter electrode of the switching element 17 and its cathode electrode conductively connected to the collector electrode of the switching element 17. The collector electrode of the switching element 17 is conductively connected to the conduction path between the first electrode 111 (emitter electrode) of the switching element 11 and the cathode electrode 132 of the diode 13. The cathode electrode of the diode 18 is conductively connected to the conduction path between the third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14. In other words, the exciter module A40 is configured such that a circuit comprising a switching element 17 and diodes 18 and 19 is connected between output terminals 32a and 32b, i.e., in parallel with the load connected to output terminals 32a and 32b. When a drive signal input to signal terminal 33b connected to the gate electrode of switching element 17 is turned on, the load can be short-circuited.

[0114] According to this embodiment, the exciter module A40 has an exciter circuit in which three switching elements 11, 12, and 17 and six diodes 13 to 16, 18, and 19 are connected as shown in the circuit diagram in Fig. 28, with the conductor layer 22 arranged on the main surface 211 of the insulating substrate 21 and the plurality of connecting members 4 serving as conduction paths. In other words, the exciter module A40 is a modularized exciter, and is smaller in size than conventional exciters.

[0115] Furthermore, the exciter module A40 has a configuration in common with the exciter module A10, and thereby achieves the same effects as the exciter module A10. Furthermore, in the exciter module A40, a circuit consisting of a switching element 17 and diodes 18 and 19 is connected between the output terminals 32a and 32b, i.e., in parallel with the load connected to the output terminals 32a and 32b. The exciter module A40 can short-circuit the load when a drive signal input to a signal terminal 33b connected to the gate electrode of the switching element 17 is turned on.

[0116] Fifth Embodiment: FIGS. 29 and 30 are diagrams illustrating an exciter module A50 according to a fifth embodiment of the present disclosure. FIG. 29 is a perspective view showing the exciter module A50, and corresponds to FIG. 1. FIG. 30 is a plan view showing the exciter module A50, seen through the resin member 5. FIG. 30 corresponds to FIG. 3. The exciter module A50 according to this embodiment differs from the exciter module A10 according to the first embodiment in that some of the signal terminals and detection terminals are formed from lead frames. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that the parts of the first to fourth embodiments and the modifications described above may be combined in any desired manner.

[0117] The exciter module A50 according to this embodiment includes signal terminals 33a' and 33b' instead of the signal terminals 33a and 33b, and detection terminals 34a' and 34b' instead of the detection terminals 34a and 34b. The signal terminals 33a' and 33b' and the detection terminals 34a' and 34b' are all rod-shaped members and are formed from the same lead frame as the power terminals 31a and 31b and the output terminals 32a and 32b. The signal terminal 33a' is conductively joined to the conductor layer 225a via a conductive bonding material. The signal terminal 33b' is conductively joined to the conductor layer 226b via a conductive bonding material. The detection terminal 34a' is conductively joined to the conductor layer 225b via a conductive bonding material. The detection terminal 34b' is conductively joined to the conductor layer 226a via a conductive bonding material. The joining method is not limited. The signal terminals 33a', 33b' and the detection terminals 34a', 34b' all protrude from the resin member 5 in the second direction y, bend to the second side z2 in the thickness direction z, and extend in the thickness direction z.

[0118] In this embodiment as well, the exciter module A50 has an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram in Fig. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and the plurality of connecting members 4 serving as conduction paths. In other words, the exciter module A50 is a modularized exciter, and is smaller in size than conventional exciters.

[0119] Furthermore, in this embodiment, the power terminals 31 a, 31 b, the output terminals 32 a, 32 b, the signal terminals 33 a', 33 b', and the detection terminals 34 a', 34 b' are joined as part of the same lead frame in the lead frame joining step (S2) of the manufacturing process. Therefore, the exciter module A50 is easy to handle during manufacturing. Furthermore, since multiple exciter modules A50 can be manufactured using a common lead frame, manufacturing efficiency is improved.

[0120] Furthermore, the exciter module A50 has the same configuration as the exciter module A10, and thus achieves the same effects as the exciter module A10. In the present embodiment, the case where some of the signal terminals and detection terminals are configured from lead frames has been described, but this is not limited to this. For example, in the exciter module A50, all of the signal terminals and detection terminals (i.e., all terminals 3) may be configured from lead frames.

[0121] The present disclosure is not limited to the above-described embodiment, and the specific configuration of each part of the present disclosure can be freely modified in various ways.

[0122] The present disclosure includes embodiments described in the following supplementary notes. Supplementary note 1. An exciter module comprising: a support member (2) having an insulating substrate (21) and a conductive layer (22) arranged on one side (z1) in a thickness direction (z) of the insulating substrate; a plurality of semiconductor elements (11-16) bonded to the conductive layer; a resin member (5) covering the plurality of semiconductor elements and the conductive layer; and first terminals (31a, 31b, 32a, 32b, 37a, 37b, 38a, 38b, 39) protruding from the resin member in a first direction (x) perpendicular to the thickness direction, wherein the plurality of semiconductor elements include a first switching element (11), a second switching element (12), a first diode (13), and a second diode (14). Supplementary note 2. The exciter module according to Supplementary Note 1, further comprising a second terminal (32a) protruding from the resin member on a side opposite to a direction in which the first terminal protrudes in the first direction. Supplementary Note 3. The exciter module according to Supplementary Note 1 or 2, wherein the conductive layers include a first conductive layer (221), a second conductive layer (224), and a third conductive layer (223) arranged to be spaced apart from each other, the first switching element and the second diode are bonded to the first conductive layer, the second switching element is bonded to the second conductive layer, and the first diode is bonded to the third conductive layer. Supplementary Note 4. The exciter module according to Supplementary Note 3, wherein the first terminal (31a) is bonded to the first conductive layer. Supplementary Note 5. The exciter module according to Supplementary Note 3, wherein the first terminal (32b) is bonded to the second conductive layer. Supplementary Note 6. The exciter module of claim 3, wherein the first terminal (32a) is bonded to the third conductive layer. The exciter module of claim 3, wherein the conductive layers further include a fourth conductive layer (222) that is electrically connected to the second switching element, and the first terminal (31b) is bonded to the fourth conductive layer.Supplementary Note 8. (Fig. 21, Second Embodiment) The exciter module according to Supplementary Note 3, wherein the conductive layers further include a fifth conductive layer (228a) that is not electrically connected to any of the plurality of semiconductor elements, and the first terminal (37a) is bonded to the fifth conductive layer. Supplementary Note 9. (Fig. 23, First Modification of Second Embodiment) The exciter module according to Supplementary Note 3, wherein the first terminal (37a) is bonded to the insulating substrate. Supplementary Note 10. (Fig. 9) The first switching element has a first input electrode (111) to which a current is input and a first output electrode (112) to which a current is output, The second switching element has a second input electrode (121) to which a current is input and a second output electrode (122) to which a current is output, The first diode has a first anode electrode (131) to which a current is input and a first cathode electrode (132) to which a current is output, The second diode has a second anode electrode (141) to which a current is input and a second cathode electrode (142) to which a current is output, The first output electrode and the first cathode electrode are electrically connected, The second input electrode and the second anode electrode are electrically connected, The first input electrode and the second cathode electrode are electrically connected, The first anode electrode and the second output electrode are electrically connected, An exciter module according to any one of Supplementary Notes 1 to 9, wherein a DC voltage is applied between the first input electrode and the first anode electrode from the outside, and a voltage is output between the first output electrode and the second input electrode. Supplementary Note 11. (FIG. 28, Fourth Embodiment) The exciter module according to Supplementary Note 10, wherein the plurality of semiconductor elements further include a third switching element (17) and a third diode (18), the third switching element has a third input electrode to which current is input and a third output electrode from which current is output, the third diode has a third anode electrode to which current is input and a third cathode electrode from which current is output, the third output electrode and the third anode electrode are electrically connected, the first output electrode and the third input electrode are electrically connected, and the second input electrode and the third cathode electrode are electrically connected.Appendix 12. The exciter module according to any one of Appendixes 1 to 11, further comprising a third terminal (33a, 33b, 34a, 34b, 35a, 35b, 36a, 36b, 36c, 36d) protruding from the resin member in the thickness direction. Appendix 13. The exciter module according to Appendix 12, wherein the third terminal is electrically connected to the first switching element or the second switching element. Appendix 14. (Fig. 8) The exciter module according to Appendix 12 or 13, wherein the third terminal comprises: a holder (3a) having a cylindrical shape extending in the thickness direction and joined to the conductive layer; and a metal pin (3b) press-fitted along the inner circumferential surface of the holder. Appendix 14-1. (Fig. 29, fifth embodiment) An exciter module according to any one of Supplementary Notes 1 to 11, further comprising fourth terminals (33a', 33b', 34a', 34b') protruding from the resin member in a second direction perpendicular to the thickness direction and the first direction. Supplementary Note 14-2. An exciter module according to any one of Supplementary Notes 1 to 14, wherein the support member further has a back surface facing the other side in the thickness direction, and the back surface is exposed from the resin member. Supplementary Note 15. (Fig. 11) A method for manufacturing an exciter module, comprising: a step (S1) of forming a conductor layer on an insulating substrate; a step (S2) of bonding a lead frame to the conductor layer; a step (S3) of bonding a plurality of semiconductor elements to the conductor layer; a step (S5) of forming a resin member covering the plurality of semiconductor elements and the conductor layer; and a step (S7) of cutting the lead frame.

[0123] A10 to A12, A20, A21, A30, A31, A40: Exciter 11, 12, 17: Switching element 11a, 12a: Element main surface 11b, 12b: Element back surface 111, 121: First electrode 112, 122: Second electrode 113, 123: Third electrode 13 to 16, 18, 19: Diode 13a to 16a: Element main surface 13b, 14b, 15b, 16b: Element back surface 131, 141, 151, 161: Anode electrode 132, 142, 152, 162: Cathode electrode 10: Thermistor 2: Support member 21: Insulating substrate 211: Element main surface 212: Back surface 22, 221 to 224, 225a, 225b, 226a, 226b, 227a, 227b, 228a, 228b, 228c, 228d, 229: Conductor layer 23: Back metal layer 3: Terminal 31a, 31b, 36a, 36b: Power terminal 32a, 32b, 36c, 36d: Output terminal 33a, 33b, 33a', 33b': Signal terminal 34a, 34b, 35a, 35b, 34a', 34b': Detection terminal 37a, 37b, 38a, 38b, 39: Dummy terminal 3a: Holder 3b: Metal pin 4: Connection member 41a, 41b, 42a, 42b, 43a, 43b, 44 to 47: Connection member 5: Resin member 51: Resin main surface 52: Resin back surface 531, 532, 533, 534: Resin side surface 91: Insulating substrate 94: Lead frame B: Three-phase inverter module C: Wound magnetic field type synchronous motor C1: Stator C2: Rotor D: Battery

Claims

1. An exciter module comprising an insulating substrate, a support member having a conductor layer disposed on one side in the thickness direction of the insulating substrate, a plurality of semiconductor elements joined to the conductor layer, a resin member covering the plurality of semiconductor elements and the conductor layer, and a first terminal protruding from the resin member in a first direction orthogonal to the thickness direction. The plurality of semiconductor elements include a first switching element, a second switching element, a first diode, and a second diode.

2. The exciter module according to claim 1, further comprising a second terminal protruding from the resin member on the side opposite to the direction in which the first terminal protrudes in the first direction.

3. The conductor layer includes a first conductor layer, a second conductor layer, and a third conductor layer disposed apart from each other. The first switching element and the second diode are joined to the first conductor layer, the second switching element is joined to the second conductor layer, and the first diode is joined to the third conductor layer. The exciter module according to claim 1 or 2.

4. The exciter module according to claim 3, wherein the first terminal is joined to the first conductor layer.

5. The exciter module according to claim 3, wherein the first terminal is joined to the second conductor layer.

6. The exciter module according to claim 3, wherein the first terminal is joined to the third conductor layer.

7. The conductor layer further includes a fourth conductor layer electrically connected to the second switching element, and the first terminal is joined to the fourth conductor layer. The exciter module according to claim 3.

8. The conductor layer further includes a fifth conductor layer not electrically connected to any of the plurality of semiconductor elements, and the first terminal is joined to the fifth conductor layer. The exciter module according to claim 3.

9. The exciter module according to claim 3, wherein the first terminal is joined to the insulating substrate.

10. The first switching element has a first input electrode to which a current is input and a first output electrode from which a current is output. The second switching element has a second input electrode to which a current is input and a second output electrode from which a current is output. The first diode has a first anode electrode to which a current is input and a first cathode electrode from which a current is output. The second diode has a second anode electrode to which a current is input and a second cathode electrode from which a current is output. The first output electrode and the first cathode electrode are conductively connected, the second input electrode and the second anode electrode are conductively connected, the first input electrode and the second cathode electrode are conductively connected, and the first anode electrode and the second output electrode are conductively connected. A DC voltage is externally applied between the first input electrode and the first anode electrode, and a voltage between the first output electrode and the second input electrode is output. The exciter module according to any one of claims 1 to 9.

11. The plurality of semiconductor elements further includes a third switching element and a third diode. The third switching element has a third input electrode to which a current is input and a third output electrode from which a current is output. The third diode has a third anode electrode to which a current is input and a third cathode electrode from which a current is output. The third output electrode and the third anode electrode are conductively connected, the first output electrode and the third input electrode are conductively connected, and the second input electrode and the third cathode electrode are conductively connected. The exciter module according to claim 10.

12. The exciter module according to any one of claims 1 to 11, further comprising a third terminal protruding in the thickness direction from the resin member.

13. The third terminal is conductively connected to the first switching element or the second switching element. The exciter module according to claim 12.

14. The third terminal is in a cylindrical shape extending in the thickness direction and includes a holder joined to the conductor layer and a metal pin press-fitted along the inner peripheral surface of the holder. The exciter module according to claim 12 or 13.

15. A method for manufacturing an exciter module, comprising: a step of forming a conductor layer on an insulating substrate; a step of bonding a lead frame to the conductor layer; a step of bonding a plurality of semiconductor elements to the conductor layer; a step of forming a resin member covering the plurality of semiconductor elements and the conductor layer; and a step of cutting the lead frame.

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