Mold, device for molding workpiece, and method for molding workpiece

Abstract

A lower mold 1 has a mounting surface 1a on which a workpiece 110 containing a resin is mounted, and presses the workpiece 110 together with an upper mold 2 facing the mounting surface 1a while heating the workpiece 110. The lower mold 1 includes: a heating block 10 having a heater 12 and a support surface 10a that supports the workpiece 110 and is included in the mounting surface 1a; and a support base 20 that is disposed on an opposite side from the support surface 10a with respect to the heating block 10 and supports the heating block 10. The support base 20 has a cooling flow passage 22 through which a cooling medium passes.

Description

Mold, molding device for molded object, and molding method for molded object

[0001] The technology disclosed herein relates to a mold, a molding device for a molded object, and a molding method for a molded object.

[0002] Conventionally, there have been known dies that heat and press a resin-containing object to be molded. For example, the die disclosed in Patent Document 1 bonds a reinforcing material to a panel, which is the object to be molded. Specifically, the die has a support including a support surface that supports the panel. The support surface is provided with a groove for accommodating the reinforcing material. A heater is disposed inside the support to heat the contact area between the panel and the reinforcing material.

[0003] U.S. Patent No. 8,603,279

[0004] However, in the mold described above, when the contact portion between the panel and the reinforcing material is heated by a heater to join the reinforcing material to the panel, the support body may be deformed by the heat from the heater, and the panel supported by the support body may be affected by the thermal deformation of the support body, which may result in a decrease in the molding accuracy of the panel.

[0005] The technique disclosed herein has been made in view of the above points, and its purpose is to improve the molding accuracy of the object to be molded.

[0006] The mold disclosed herein has a mounting surface on which a resin-containing object to be molded is placed, and presses the object to be molded together with an opposing mold facing the mounting surface while heating it.The mold comprises a heating block that supports the object to be molded and has a support surface included in the mounting surface and a heater, and a support stand that is positioned on the opposite side of the support surface from the heating block and supports the heating block, and the support stand has a cooling flow path through which a cooling medium passes.

[0007] The molding device for a molded object disclosed herein comprises a mold that heats the molded object containing resin while the molded object is placed thereon, and an opposing mold that presses the molded object together with the mold to mold it.

[0008] The method for molding an object to be molded disclosed herein includes preparing the mold, placing the object to be molded on the mounting surface of the mold, and pressing the object to be molded with the mold and the opposing mold while heating the heating block and flowing a cooling medium through the cooling flow path to cool the support table.

[0009] According to the mold, the molding device for a molded object, and the molding method for a molded object, the molding accuracy of the molded object can be improved.

[0010] FIG. 1 is a schematic perspective view showing a molding apparatus for a molded object according to an embodiment. FIG. 2 is a schematic view showing the configuration of the molding apparatus for a molded object according to an embodiment. FIG. 3 is a view showing a schematic hardware configuration of a control device. FIG. 4 is a cross-sectional view of a lower mold taken along a plane perpendicular to the longitudinal direction. FIG. 5 is an enlarged view of region A in FIG. 4. FIG. 6 is an enlarged view of region B in FIG. 4. FIG. 7 is a perspective view showing a molded object and a reinforcing member before molding. FIG. 8 is an enlarged view of the molded object and the reinforcing member placed in the lower mold. FIG. 9 is a perspective view showing a molded object and a reinforcing member after molding. FIG. 10 is a diagram for explaining a preheating step for the molded object. FIG. 11 is a diagram for explaining a first pressurizing step for the molded object. FIG. 12 is a diagram for explaining a moving step for the molded object. FIG. 13 is a diagram for explaining a second pressurizing step for the molded object. FIG. 14 is a diagram for explaining a predetermined number of pressurizing steps for the molded object. FIG. 15 is a cross-sectional view of a lower mold according to Modification 1. FIG. 16 is a cross-sectional view of a lower mold according to Modification 2.

[0011] Exemplary embodiments will now be described in detail with reference to the drawings. Fig. 1 is a schematic perspective view showing a molding apparatus 100 for a molded object according to an embodiment. Fig. 2 is a schematic view showing the configuration of the molding apparatus 100 for a molded object according to an embodiment. Hereinafter, the molding apparatus 100 for a molded object will be simply referred to as the molding apparatus 100.

[0012] The molding apparatus 100 includes a lower mold 1 that heats the object 110 to be molded while the object 110 is placed thereon, and an upper mold 2 that presses the object 110 together with the lower mold 1 to mold it. The lower mold 1 is an example of a mold. The upper mold 2 is an example of an opposing mold. Specifically, the molding apparatus 100 molds the thin plate-shaped object 110 to curve it in the thickness direction of the object 110. At this time, the molding apparatus 100 joins a reinforcing member 111 shown in FIG. 7 to the object 110. Note that the reinforcing member 111 is omitted from FIGS. 1 and 2 to simplify the drawings.

[0013] The molded object 110 includes a resin. The resin is, for example, a thermoplastic resin. In this example, the molded object 110 is a prepreg laminate in which carbon fibers are impregnated with a thermoplastic resin prepared in advance. Prepreg is an intermediate material in which fibers are impregnated with a resin. Fiber reinforced plastics (FRP) are manufactured by heating and pressurizing a prepreg laminate in which prepregs are stacked. Fiber reinforced plastics include carbon fiber reinforced thermoplastics (CFRTP). In this example, the molded object 110 is used for an aircraft fuselage panel. In this example, the reinforcing member 111 is a reinforcing material for the aircraft fuselage panel and is also called a stringer or longeron.

[0014] The lower mold 1 has a mounting surface 1a on which the object to be molded 110 is mounted. The upper mold 2 is disposed opposite the mounting surface 1a. The lower mold 1 presses the object to be molded 110 together with the upper mold 2 while heating the object to be molded. In this example, the upper mold 2 also heats the object to be molded 110.

[0015] The installation surface 1a of the lower mold 1 is the upper surface of the lower mold 1. The installation surface 1a has a convex shape, specifically a convex curved surface. The installation surface 1a is an elongated rectangle in a plan view.

[0016] The upper mold 2 has an opposing surface 2a that faces the installation surface 1a. The opposing surface 2a of the upper mold 2 is the lower surface of the upper mold 2. The opposing surface 2a has a concave shape, specifically a concave curved surface. The opposing surface 2a is rectangular in plan view. The installation surface 1a and the opposing surface 2a have shapes that correspond to each other and can be fitted together.

[0017] The lower mold 1 and the upper mold 2 can be moved closer to or farther away from each other. That is, the lower mold 1 and the upper mold 2 can be moved closer to each other to press the molding target object 110. In this example, the upper mold 2 can be moved closer to or farther away from the lower mold 1.

[0018] In the following description, the direction in which the lower mold 1 and the upper mold 2 press the molded object 110 and release the pressure on the molded object 110 is referred to as the pressing direction Dp. In this example, the pressing direction Dp coincides with the up-and-down direction. The long dimension of the installation surface 1a as viewed from the pressing direction Dp is referred to as the longitudinal direction Dn. The direction perpendicular to the longitudinal direction Dn as viewed from the pressing direction Dp is referred to as the width direction Dh.

[0019] The length of the installation surface 1a of the lower mold 1 in the longitudinal direction Dn is, for example, 2500 mm, but is not limited to this. The length of the opposing surface 2a of the upper mold 2 in the longitudinal direction Dn is, for example, 1080 mm, but is not limited to this. The length of the installation surface 1a of the lower mold 1 in the width direction Dh is, for example, 2000 mm, but is not limited to this. The length of the opposing surface 2a of the upper mold 2 in the width direction Dh is, for example, 2000 mm, but is not limited to this.

[0020] In addition to the lower mold 1 and the upper mold 2 , the molding device 100 is equipped with a conveying device 3 , an upper mold support portion 4 , a pressure plate 5 , and a control device 6 .

[0021] The conveying device 3 includes a base portion 3a and a drive portion 3b. The lower mold 1 and pressure plates 5 are provided on the base portion 3a. The pressure plates 5 are disposed at both ends of the lower mold 1 in the longitudinal direction Dn and at both ends in the width direction Dh. Each pressure plate 5 comes into contact with the upper mold 2 to suppress movement of the upper mold 2 in the pressing direction Dp.

[0022] The drive unit 3b is controlled by the control device 6 to transport the base portion 3a in the longitudinal direction Dn. For example, the drive unit 3b transports the base portion 3a in a feed direction Ds, which is one of the longitudinal directions Dn. In other words, the molding object 110 placed on the lower mold 1 is transported in the feed direction Ds. The drive unit 3b includes, for example, a rack gear, a pinion gear, and an electric motor. In this case, the rack gear provided on the base portion 3a is moved in the feed direction Ds by rotation of the pinion gear connected to the rotation shaft of the electric motor. This causes the base portion 3a to move intermittently in the feed direction Ds, and therefore the lower mold 1 can be moved intermittently in the feed direction Ds. The drive unit 3b may include a ball screw and an electric motor, a chain and a hydraulic motor, or a wire and a hydraulic motor instead of a rack gear, a pinion gear, and an electric motor.

[0023] The upper mold support portion 4 supports the upper mold 2. The control device 6 controls the upper mold support portion 4 so that it moves in the pressing direction Dp. The control device 6 controls the upper mold support portion 4 so that the upper mold support portion 4 approaches the lower mold 1 in the pressing direction Dp, whereby the upper mold 2 presses the molding object 110 placed on the lower mold 1. The upper mold support portion 4 has, for example, a drive unit having a configuration similar to that of the drive unit 3b. The drive unit moves the upper mold support portion 4 so that the upper mold support portion 4 approaches the lower mold 1 in the pressing direction Dp.

[0024] The control device 6 controls the conveying device 3 to convey the object 110 to be molded along the feed direction Ds while it is placed on the lower mold 1. Next, the control device 6 controls the upper mold support part 4 to move the upper mold 2 downward at the predetermined position and press the object 110 to be molded. Thereafter, the control device 6 raises the upper mold 2 to convey the object 110 to the next predetermined position along the feed direction Ds and press the object 110 against the upper mold 2 at the next predetermined position. In this way, the control device 6 repeats a cycle consisting of conveying the object 110 to be molded and pressing the object 110 to be molded. In this way, the molding device 100 can mold the object 110 to be molded.

[0025] The lower mold 1 is heated to a predetermined temperature. The lower mold 1 is heated to a temperature close to the melting point of the object 110 to be molded. For example, when the melting point of the object 110 to be molded is 305°C, the predetermined temperature of the lower mold 1 is 300°C to 330°C. Note that the melting point and the predetermined temperature are not limited to these values, and are determined to an appropriate temperature based on the melting point of the object 110 to be molded, for example, within a range of the melting point ±40°C.

[0026] The temperature of the lower mold 1 is detected by a temperature sensor such as a thermocouple or an infrared camera. The lower mold 1 has a plurality of heaters 12 as shown in Fig. 4. For example, a predetermined number of heaters 12 are arranged in the longitudinal direction Dn, and a predetermined number of heaters 12 are arranged in the width direction Dh. The heating operation of the plurality of heaters 12 is controlled by the control device 6, thereby adjusting the temperature of the lower mold 1.

[0027] A part of the lower mold 1 is controlled by the control device 6 so as to have a constant temperature over the entire length direction Dn. A part of the lower mold 1 is a heating block 10 shown in FIG. 4, which will be described later.

[0028] The upper mold 2 has a plurality of temperature regions R1, R2 along the longitudinal direction Dn. The temperatures of the plurality of temperature regions R1, R2 are controlled independently from one another by the control device 6. That is, when molding the object 110 to be molded, the control device 6 controls the plurality of temperature regions R1, R2 to different temperatures from one another.

[0029] Specifically, the upper mold 2 has two temperature regions R1 and R2 as shown in FIG. 2 . That is, the upper mold 2 has a first temperature region R1 and a second temperature region R2. The first temperature region R1 and the second temperature region R2 are arranged in order from the upstream side in the feed direction Ds. The upper mold 2 has heaters arranged in each of the temperature regions R1 and R2. The heating operation of the heaters on the upper mold 2 is controlled by the control device 6.

[0030] In this embodiment, for example, three heaters are arranged in the first temperature region R1 and four heaters are arranged in the second temperature region R2 in the longitudinal direction Dn of the upper mold 2. In addition, for example, four heaters are provided in each of the first temperature region R1 and the second temperature region R2 in the width direction Dh of the upper mold 2.

[0031] The control device 6 controls the temperature of the second temperature region R2 so that it is lower than the temperature of the first temperature region R1. Specifically, the temperature T1 of the first temperature region R1 is set to the process temperature, which is the highest temperature among the regions, for example, in the range of 350°C to 420°C. The process temperature is a reference temperature that is determined in consideration of the melting point of the object 110 to be molded.

[0032] The temperature T2 of the second temperature region R2 is set lower than the temperature T1 of the first temperature region R1. The temperature range of the temperature T2 is set to be, for example, 50° C. to 150° C. lower than the process temperature. The temperature T1 of the first temperature region R1 and the temperature T2 of the second temperature region R2 are detected by temperature sensors similar to those of the lower mold 1.

[0033] The respective lengths of the first temperature region R1 and the second temperature region R2 in the feed direction Ds are determined based on the length of the upper mold 2 and the length of the molded object 110 in the feed direction Ds, in relation to a predetermined amount of movement of the base portion 3a in the feed direction Ds.

[0034] The opposing surface 2a of the upper mold 2 has a first heating region 2a1 arranged upstream in the feed direction Ds and a second heating region 2a2 arranged downstream of the first heating region 2a1 in the feed direction Ds. In this embodiment, the first heating region 2a1 is arranged at the position of the first temperature region R1, and the second heating region 2a2 is arranged at the position of the second temperature region R2.

[0035] When the second heating region 2a2 contacts the molding object 110, the first heating region 2a1 is spaced apart from the molding object 110. That is, the thickness of the first heating region 2a1 in the pressing direction Dp is smaller than the thickness of the second heating region 2a2 in the pressing direction Dp. In other words, during the molding process of the molding object 110 in this embodiment, the first temperature region R1 of the upper mold 2 does not contact the molding object 110, and the second temperature region R2 intermittently contacts and separates from the molding object 110. In this embodiment, in order to achieve separation of the first heating region 2a1 from the molding object 110, the first heating region 2a1 has an inclined surface that is inclined with respect to the longitudinal direction Dn. On the other hand, the second heating region 2a2 has a parallel surface that is parallel to the longitudinal direction Dn.

[0036] It is preferable that the temperature of the entire first heating area 2a1 be higher than the melting point of the object to be molded 110, the temperature of the second heating area 2a2 be lower than the melting point of the object to be molded 110, and the temperature of the lower mold 1 be higher than the temperature of the second heating area 2a2.

[0037] 3 is a diagram showing a schematic hardware configuration of the control device 6. The control device 6 has a processor 6a, a storage device 6b, and a memory 6c.

[0038] The processor 6a controls the entire molding apparatus 100. The processor 6a performs various types of arithmetic processing. For example, the processor 6a is formed of a processor such as a CPU (Central Processing Unit). The processor 6a may be formed of an MCU (Micro Controller Unit), an MPU (Micro Processor Unit), an FPGA (Field Programmable Gate Array), a PLC (Programmable Logic Controller), a system LSI, or the like.

[0039] The memory 6b stores various programs and various data executed by the processor 6a. The memory 6b is formed of a non-volatile memory, a hard disk drive (HDD), a solid state drive (SSD), etc. The various programs cause the control device 6 to realize various functions. The memory 6b stores data related to the allowable temperature ranges of the heaters of the lower mold 1 and the upper mold 2, etc.

[0040] The memory 6c temporarily stores data, etc. For example, the memory 6c includes a volatile memory. Measurement values ​​from the temperature sensors of the lower mold 1 and the upper mold 2 are saved in the storage device 6b or the memory 6c.

[0041] The processor 6a controls the heater temperatures of the lower mold 1 and the upper mold 2 so that the heater temperatures are within an allowable range based on the measured values ​​from the temperature sensors of the lower mold 1 and the upper mold 2. The processor 6a also controls the drive unit 3b of the conveying device 3 and the drive unit of the upper mold support unit to convey the molded object 110 to a predetermined position along the feed direction Ds, and at the predetermined position moves the upper mold 2 downward to press the molded object 110.

[0042] Fig. 4 is a cross-sectional view of the lower mold 1 taken along a plane perpendicular to the longitudinal direction Dn. Fig. 5 is an enlarged view of area A in Fig. 4. Fig. 6 is an enlarged view of area B in Fig. 4. The lower mold 1 includes at least one heating block 10 and a support base 20. In Fig. 4, hatching representing the cross section of the support base 20 has been omitted to clarify the reference numerals.

[0043] The at least one heating block 10 includes a plurality of heating blocks 10 arranged along the installation surface 1a. Specifically, the at least one heating block 10 includes a plurality of heating blocks 10 arranged along the width direction Dh. In this example, the lower mold 1 has 12 heating blocks 10 arranged along the width direction Dh.

[0044] The heating block 10 has a support surface 10a and a heater 12. The support surface 10a supports the molding object 110 and is included in the placement surface 1a.

[0045] Specifically, the heating block 10 has a block body 11 and a heater 12. The upper surface of the block body 11 is a support surface 10a. The material of the block body 11 includes, for example, carbon steel. The block body 11 extends along the longitudinal direction Dn. The support surface 10a is a convex curved surface.

[0046] The heaters 12 are embedded inside the block main body 11. The heaters 12 are not exposed on the support surface 10a. The heaters 12 are, for example, cartridge heaters. In each block main body 11, a predetermined number of heaters 12 are arranged in the width direction Dh, and a predetermined number of heaters 12 are arranged in the longitudinal direction Dn. For example, in a given block main body 11, two heaters 12 are arranged in the width direction Dh, and 12 heaters 12 are arranged in the longitudinal direction Dn.

[0047] The support base 20 is disposed on the opposite side of the support surface 10a with respect to the heating block 10, and supports the heating block 10. The support base 20 has at least one cooling flow path 22 through which a cooling medium passes.

[0048] Specifically, the support table 20 has a table body 21. The table body 21 is made of, for example, cast iron. The table body 21 extends along the longitudinal direction Dn. The top surface of the table body 21 has a generally convex shape. The heating block 10 is disposed along the top surface of the table body 21.

[0049] The cooling flow path 22 is provided inside the base body 21. The cooling flow path 22 is configured by, for example, a pipe embedded in the base body 21. In other words, the internal space of the pipe is the cooling flow path 22.

[0050] The cooling flow path 22 is connected to, for example, a pump that pumps out a cooling medium. The cooling medium is, for example, a liquid such as water. The pump is controlled by the control device 6. Specifically, when the heater 12 of the heating block 10 is turned on, the control device 6 starts operation of the pump, causing the cooling medium to flow through the cooling flow path 22 and cool the support base 20. The cooling medium may be, for example, a gas such as air.

[0051] In a cross section perpendicular to the longitudinal direction Dn, at least one cooling flow channel 22 includes a plurality of cooling flow channels 22 arranged along the width direction Dh. In this example, in a cross section perpendicular to the longitudinal direction Dn, the support base 20 has 19 cooling flow channels 22 arranged along the width direction Dh. The plurality of cooling flow channels 22 are arranged near and along the upper surface of the base main body 21. All of the cooling flow channels 22 may be connected to each other, or all of the cooling flow channels 22 may be independent from each other, or all of the cooling flow channels 22 may be connected to each other every predetermined number.

[0052] The heating block 10 and the support base 20 are separate. A plurality of heating blocks 10 are arranged on the upper surface of the support base 20. A heat insulating material 41 is arranged between the heating block 10 and the support base 20. The material of the heat insulating material 41 includes, for example, resin or ceramics. The heating block 10 is attached to the support base 20 by a fastening material such as a bolt. The heat insulating material 41 is sandwiched and fixed between the heating block 10 and the support base 20.

[0053] The lower mold 1 further includes at least one storage block 30. The at least one storage block 30 includes a plurality of storage blocks 30 arranged along the width direction Dh. In this example, the lower mold 1 has eight storage blocks 30 arranged along the width direction Dh.

[0054] The storage block 30 extends along the longitudinal direction Dn. The storage block 30 includes a recess 31 that opens to the installation surface 1a and accommodates the reinforcing member 111 shown in Fig. 7. The material of the storage block 30 includes, for example, carbon steel.

[0055] In this example, the storage block 30 is disposed between adjacent first and second heating blocks 10 among the plurality of heating blocks 10. Specifically, the plurality of heating blocks 10 and the plurality of storage blocks 30 are disposed alternately along the width direction Dh. In this embodiment, the plurality of heating blocks 10 and the plurality of storage blocks 30 are disposed alternately in the intermediate portion between both ends of the support base 20 in the width direction Dh. Meanwhile, the plurality of heating blocks 10 are disposed adjacent to each other at each end of the support base 20 in the width direction Dh.

[0056] The storage block 30 and the support base 20 are separate. The storage block 30 is supported by the support base 20. The storage block 30 is in contact with the support base 20. A plurality of storage blocks 30 are arranged along the upper surface of the support base 20. The storage block 30 is attached to the support base 20 by fasteners such as bolts.

[0057] When viewed from the pressing direction Dp, each containing block 30 overlaps the cooling flow path 22. Specifically, the cooling flow path 22 is disposed below each containing block 30.

[0058] As shown in Figure 5, there is a gap S1 between two adjacent heating blocks 10 at room temperature. Room temperature refers to, for example, when the heater 12 is off, and is, for example, 20°C ± 15°C, i.e., in the range of 5°C to 35°C, as specified in Japanese Industrial Standard JIS Z 8703. The same applies to room temperature hereinafter. Specifically, there is a gap S1 between a portion of each of two adjacent heating blocks 10. In the width direction Dh, the gap S1 is, for example, 1 mm. In this example, there is a gap S1 between the upper side surfaces of two adjacent heating blocks 10.

[0059] A heat insulating material 41 is disposed between two adjacent heating blocks 10. Specifically, the heat insulating material 41 is disposed between a portion of each of the two adjacent heating blocks 10. In this example, the heat insulating material 41 is disposed between the lower side surfaces of the two adjacent heating blocks 10.

[0060] In addition, the insulating material 41 may be placed between the upper side surfaces of two adjacent heating blocks 10 without leaving a gap S1, or the insulating material 41 may be placed between the lower side surfaces of two adjacent heating blocks 10 without leaving a gap S1.

[0061] 6 , in the first heating block 10, the second heating block 10, and the containing block 30 disposed between the first heating block 10 and the second heating block 10, a heat insulating material 41 is disposed between the first heating block 10 and the containing block 30 and between the second heating block 10 and the containing block 30. Specifically, the heat insulating material 41 is disposed between the first heating block 10 and a portion of the containing block 30. The heat insulating material 41 is disposed between the second heating block 10 and a portion of the containing block 30. In this example, the heat insulating material 41 is disposed between the lower side surfaces of the first heating block 10 and the containing block 30 and between the lower side surfaces of the second heating block 10 and the containing block 30. In this case, the heat insulating material 41 preferably contacts the heating block 10 and the support base 20.

[0062] At room temperature, there is a gap S2 between the first heating block 10 and the containing block 30, and between the second heating block 10 and the containing block 30. Specifically, there is a gap S2 between the first heating block 10 and a portion of the containing block 30. There is a gap S2 between the second heating block 10 and a portion of the containing block 30. In this example, there is a gap S2 between the upper side surfaces of the first heating block 10 and the containing block 30, and between the upper side surfaces of the second heating block 10 and the containing block 30. In the width direction Dh, the gap S2 is, for example, 1 mm.

[0063] The heat insulating material 41 may be disposed between the upper side surfaces of the first heating block 10 and the containing block 30 without leaving a gap S2. The heat insulating material 41 may be disposed between the upper side surfaces of the second heating block 10 and the containing block 30 without leaving a gap S2. The heat insulating material 41 may be disposed between the lower side surfaces of the first heating block 10 and the containing block 30 without leaving a gap S2. The heat insulating material 41 may be disposed between the lower side surfaces of the second heating block 10 and the containing block 30 without leaving a gap S2.

[0064] 6, each heating block 10 has an end portion 15 located on the opposite side of the support surface 10a in the pressing direction Dp. In a cross section perpendicular to the longitudinal direction Dn, each cooling channel 22 is disposed in a direction from the support surface 10a toward the end portion 15 in the pressing direction Dp, further away from the end portion 15 of the heating block 10 located closest thereto.

[0065] Specifically, the block body 11 of each heating block 10 has a lower end portion 15. In a cross section perpendicular to the longitudinal direction Dn, each cooling channel 22 is disposed below the lower end portion 15 of the heating block 10 located closest to it. For example, the cooling channel 22 on the right side in Fig. 6 is disposed below the lower end portion 15 of the heating block 10 located closest to it on the right side. The cooling channel 22 on the left side in Fig. 6 is disposed below the lower end portion 15 of the heating block 10 located closest to it on the left side.

[0066] Next, a method for molding the molding object 110 will be described.

[0067] FIG. 7 is a perspective view showing a molding target object 110 and a reinforcing member 111 before molding. As shown in FIG. 7, one molding target object 110 and multiple reinforcing members 111 are prepared. In this example, eight reinforcing members 111, the same number as the number of storage blocks 30, are prepared. The molding target object 110 is flat. The reinforcing member 111 has a hat-shaped cross section. A hat-shaped cross section is a shape that includes a central portion, side portions that rise individually from both ends of the central portion, and end portions that extend outward from the upper ends of each side portion. However, the reinforcing member 111 may have other cross-sectional shapes, such as a J-shaped, I-shaped, or Z-shaped cross section. It is preferable that the shape of the storage block 30 corresponds to the shape of the reinforcing member 111.

[0068] 4 is prepared, and the molding object 110 and the reinforcing member 111 are placed on the lower mold 1. Specifically, the reinforcing member 111 is accommodated in the accommodation block 30, and the molding object 110 is placed on the placement surface 1a of the lower mold 1.

[0069] FIG. 8 is an enlarged view of the state in which the molding object 110 and the reinforcing member 111 are placed on the lower mold 1. FIG. 8 corresponds to FIG. 6. More specifically, as shown in FIG. 8, the reinforcing member 111 is placed in the recess 31 of the storage block 30, and then the core 115 is inserted into the recess of the reinforcing member 111. In this example, the shape of the recess 31 of the storage block 30 corresponds to the shape of the reinforcing member 111. At this time, the joining portion of the reinforcing member 111 that is joined to the molding object 110 is in contact with the support surface 10a of the heating block 10. Next, the molding object 110 is placed along the support surface 10a of the heating block 10 and the surface of the core 115 so as to cover the reinforcing member 111.

[0070] Thereafter, the heating block 10 is heated by the heater 12, and a cooling medium is circulated through the cooling flow path 22 to cool the support table 20. In this state, the molding target object 110 is pressed and molded by the lower mold 1 and the upper mold 2. At this time, the containing block 30 is not heated, so the portion of the molding target object 110 facing the containing block 30 is not heated. On the other hand, the portion of the molding target object 110 facing the heating block 10 is heated by the heating block 10. Also, because the containing block 30 is not heated, the portion of the reinforcing member 111 contained in the recess 31 is not heated. Since the containing portion of the reinforcing member 111 has already been molded, heating is not necessary. On the other hand, the joint portion of the reinforcing member 111 is heated by the heating block 10 and joined to the molding target object 110. The joining of the reinforcing member 111 to the molding target object 110 is specifically by welding. The heating block 10 is heated by the heater 12 and a cooling medium is passed through the cooling flow path 22 to cool the support base 20. In this state, the object 110 is pressed and molded with the lower mold 1 and the upper mold 2, whereby the object 110 is formed into a curved shape and the object 110 and the reinforcing member 111 are integrally molded. Thereafter, the core 115 is removed from the recess of the reinforcing member 111.

[0071] 9 is a perspective view showing the molded object 110 and the reinforcing members 111 after molding. As shown in Fig. 9, the molded object 110 is curved along the installation surface 1a of the lower mold 1 after molding, and the multiple reinforcing members 111 are attached parallel to the curved inner surface of the molded object 110.

[0072] Next, the detailed operation of the molding device 100 when molding the molding object 110 will be described.

[0073] Fig. 10 is a diagram for explaining the preheating step of the molding target object 110. Fig. 11 is a diagram for explaining the first pressurizing step of the molding target object 110. Fig. 12 is a diagram for explaining the moving step of the molding target object 110. Fig. 13 is a diagram for explaining the second pressurizing step of the molding target object 110. Hereinafter, "downstream" refers to the downstream side in the feed direction Ds, and is the side where the base portion 3a is transported. "Upstream" refers to the upstream side in the feed direction Ds, and is the side where the base portion 3a starts to be transported.

[0074] First, as shown in FIG. 10 , the control device 6 performs initial preheating, i.e., heating before pressurization, on the downstream end of the flat plate-shaped object 110 to be molded. In the example of FIG. 10 , the downstream end is the left end. In this case, the control device 6 heats the downstream end of the object 110 to be molded while the first heating region 2a1 of the upper mold 2 is spaced apart from the downstream end of the object 110 to be molded. By heating the downstream end of the object 110 to be molded while the first heating region 2a1 of the upper mold 2 is spaced apart from the downstream end of the object 110, the temperature of the downstream end of the object 110 to be molded increases. When the lower mold 1 and the upper mold 2 mold the object 110 to be molded, the control device 6 controls the lower mold 1 so that a portion of it has a predetermined temperature.

[0075] Next, as shown in FIG. 11 , the control device 6 moves the base portion 3a a predetermined amount in the feed direction Ds. The movement amount is, for example, one-tenth of the length of the object 110 to be molded in the feed direction Ds. Accordingly, the object 110 moves a predetermined amount in the feed direction Ds. The control device 6 then lowers the upper mold 2, thereby pressurizing the downstream end of the object 110 to be molded. Specifically, the downstream end of the object 110 to be molded is pressurized by the second heating region 2a2 of the upper mold 2 and the lower mold 1. The pressurizing time is, for example, 10 seconds or more, but is not limited thereto. When the downstream end of the object 110 to be molded is pressurized, the portion upstream of the downstream end of the object 110 to be molded, for example, the central portion, overlaps with the first heating region 2a1 when viewed from the pressing direction Dp. Because the portion of the object to be molded 110 upstream of the downstream end overlaps with the first heating region 2a1 when viewed from the pressing direction Dp, the portion of the object to be molded 110 upstream of the downstream end is simultaneously preheated. When the downstream end of the object to be molded 110 is pressed by the second heating region 2a2 of the upper mold 2 and the lower mold 1, the object to be molded 110 and the first heating region 2a1 are not in contact with each other. Because the object to be molded 110 and the first heating region 2a1 are not in contact with each other, preheating is performed by heat radiation from the first heating region 2a1 or by convection of air warmed by the first heating region 2a1.

[0076] Next, as shown in FIG. 12 , the control device 6 raises the upper mold 2 and moves the base portion 3a a predetermined distance in the feed direction Ds. As the base portion 3a moves a predetermined distance in the feed direction Ds, the object 110 moves a predetermined distance in the feed direction Ds. The downstream end of the object 110 moves to a position overlapping the downstream end of the upper mold 2 as viewed from the pressing direction Dp. With the downstream end of the object 110 moved to a position overlapping the downstream end of the upper mold 2 as viewed from the pressing direction Dp, the control device 6 lowers the upper mold 2 as shown in FIG. 13 , thereby pressurizing the downstream end of the object 110 and a portion upstream of the downstream end. Specifically, the downstream end of the object 110 is cooled by the second heating region 2a2 of the upper mold 2 and the lower mold 1, while the portion upstream of the downstream end of the object 110 is pressurized. When the portion of the object to be molded 110 upstream of the downstream end is pressed by the second heating area 2a2 of the upper mold 2 and the lower mold 1, the central portion of the object to be molded 110 is located below the first heating area 2a1, so preheating is performed on that portion.

[0077] Thereafter, from the state shown in Fig. 13, the base portion 3a is repeatedly moved in the feed direction Ds and the upper mold 2 is repeatedly raised and lowered, resulting in the state shown in Fig. 14. In this way, the position where the object 110 is heated and pressurized by the lower mold 1 and the upper mold 2 is changed in stages from the downstream side to the upstream side. When the heating and pressurizing process by the lower mold 1 and the upper mold 2 reaches the upstream end of the object 110, the molding process of the object 110 by the molding device 100 is completed.

[0078] According to the lower mold 1, the support base 20 has a cooling flow path 22 through which a cooling medium passes, so that by cooling the support base 20, it is possible to reduce thermal deformation of the support base 20 and thereby reduce thermal deformation of the lower mold 1. As a result, when the object 110 to be molded is pressed while being heated, the effect of thermal deformation of the lower mold 1 on the object 110 to be molded can be reduced, improving the molding accuracy of the object 110. In particular, when molding an aircraft fuselage panel as the object 110, the mold is large, and the effect of thermal expansion of the mold is significant on the molding accuracy required for the object 110, but by using the lower mold 1, it is possible to improve the molding accuracy of the object 110 to be molded.

[0079] Furthermore, since the thermal deformation of the lower mold 1 can be reduced, an inexpensive material that is subject to large thermal deformation can be used for the material of the lower mold 1. In particular, an inexpensive material can be used for the material of the support base 20 that occupies most of the lower mold 1.

[0080] Furthermore, since the support base 20 and the heating block 10 are separate, the heating block 10 can be easily removed from the support base 20, and the heating block 10 can be easily replaced.

[0081] Furthermore, because the support table 20 and the heating block 10 are separated, a heat insulating material 41 can be placed between the support table 20 and the heating block 10, making it difficult for heat from the heating block 10 to be transferred to the support table 20. This further reduces the thermal deformation of the support table 20, further reduces the effect of thermal deformation of the lower mold 1 on the object 110 to be molded, and further improves the molding accuracy of the object 110 to be molded.

[0082] Furthermore, since the support table 20 and the heating block 10 are separated, the shape of the lower mold 1 can be corrected in the pressing direction Dp by placing a shim plate between the support table 20 and the heating block 10 to compensate for dimensional differences due to the temperature distribution of the object to be molded 110 and the material thickness.

[0083] Furthermore, since there is a gap S1 between two adjacent heating blocks 10, even if the heating blocks 10 thermally expand in a direction along the installation surface 1a, the gap S1 absorbs the thermal expansion of the heating blocks 10, thereby further reducing thermal deformation of the lower mold 1. Specifically, even if the heating blocks 10 thermally expand, the gap S1 prevents the heating blocks 10 from excessively pressing against the adjacent heating blocks 10. This further reduces the effect of thermal deformation of the lower mold 1 on the object 110 to be molded, thereby further improving the molding accuracy of the object 110 to be molded.

[0084] Furthermore, since the containing block 30 is supported by the support base 20, when joining the reinforcing member 111 to the molding object 110, the containing block 30 can be cooled by the cooling effect of the support base 20 by cooling the support base 20, thereby reducing thermal deformation of the containing block 30 and further reducing thermal deformation of the lower mold 1. This makes it possible to further reduce the effect of thermal deformation of the lower mold 1 on the molding object 110, and further improve the molding accuracy of the molding object 110.

[0085] Furthermore, since the support base 20 and the storage block 30 are separated, the shape of the lower mold 1 can be corrected in the pressing direction Dp by placing a shim plate between the support base 20 and the storage block 30 to compensate for dimensional differences due to the temperature distribution and material thickness of the object to be molded 110 and the reinforcing member 111.

[0086] Furthermore, since the multiple heating blocks 10 and the multiple storage blocks 30 are arranged alternately along the width direction Dh, each storage block 30 is susceptible to heat from the heating blocks 10 adjacent to it, but each storage block 30 is cooled by the cooling effect of the support base 20, thereby reducing thermal deformation of each storage block 30. As a result, the pitch between two adjacent storage blocks 30 remains the same for all storage blocks 30, and the molding accuracy of the object 110 can be further improved.

[0087] Furthermore, since the heat insulating materials 41 are disposed between the first heating block 10 and the containing block 30 and between the second heating block 10 and the containing block 30, the heat from the first heating block 10 and the second heating block 10 is less likely to be transferred to the containing block 30. This further reduces the thermal deformation of the containing block 30, and further reduces the thermal deformation of the lower mold 1. Therefore, the effect of the thermal deformation of the lower mold 1 on the molded object 110 can be further reduced, and the molding accuracy of the molded object 110 can be further improved.

[0088] When the heat insulating material 41 is disposed between the first heating block 10 and the storage block 30 and between the second heating block 10 and the storage block 30, the heat insulating material 41 preferably contacts the heating block 10 and the support base 20, with a gap between the heat insulating material 41 and the storage block 30. As a result, even if the heating block 10 thermally expands, the load caused by the thermal expansion of the heating block 10 is transmitted to the support base 20 via the heat insulating material 41, but is unlikely to be transmitted to the storage block 30. Therefore, the load on the storage block 30 can be reduced.

[0089] Furthermore, because there is a gap S2 between the first heating block 10 and the storage block 30 and between the second heating block 10 and the storage block 30, even if the first heating block 10 and the second heating block 10 thermally expand in the width direction Dh of the installation surface 1a, the gap S2 absorbs the thermal expansion of the first heating block 10 and the second heating block 10, thereby further reducing thermal deformation of the lower mold 1. Specifically, even if the heating block 10 thermally expands, the presence of the gap S2 prevents the heating block 10 from excessively pressing against the adjacent storage block 30. This further reduces the effect of thermal deformation of the lower mold 1 on the molded object 110, thereby further improving the molding accuracy of the molded object 110.

[0090] Furthermore, as viewed from the pressing direction Dp, each storage block 30 overlaps the cooling flow path 22, so each storage block 30 is easily cooled by the cooling flow path 22. This further reduces thermal deformation of the storage blocks 30, thereby further reducing thermal deformation of the lower mold 1. Therefore, the effect of thermal deformation of the lower mold 1 on the molded object 110 can be further reduced, and the molding accuracy of the molded object 110 can be further improved.

[0091] Furthermore, in a cross section perpendicular to the longitudinal direction Dn of the installation surface 1a, each cooling channel 22 is disposed in the direction from the support surface 10a toward the end 15 in the pressing direction Dp, i.e., downward, relative to the end 15 of the heating block 10 located nearest thereto. This reduces the cooling effect of the cooling channel 22 on the heating block 10, and maintains the heating effect of the heating block 10 on the molding object 110.

[0092] According to the molding device 100 for the object to be molded described above, since it is provided with the lower mold 1, by cooling the support table 20, it is possible to reduce thermal deformation of the support table 20 and thereby reduce thermal deformation of the lower mold 1. As a result, when the object to be molded 110 is pressed while being heated, it is possible to reduce the effect of thermal deformation of the lower mold 1 on the object to be molded 110, and it is possible to improve the molding accuracy of the object to be molded 110.

[0093] According to the above-described method for molding an object to be molded, by cooling the support table 20, it is possible to reduce thermal deformation of the support table 20 and thereby reduce thermal deformation of the lower mold 1. As a result, when the object to be molded 110 is pressed while being heated, it is possible to reduce the effect of thermal deformation of the lower mold 1 on the object to be molded 110, and it is possible to improve the molding accuracy of the object to be molded 110.

[0094] <<Modification 1>> Figure 15 is a cross-sectional view of a lower mold 1A according to Modification 1. The lower mold 1A according to Modification 1 differs from the lower mold 1 according to the embodiment in that it includes a base 50 and in the configuration of the support base 20A. The following will focus on the configuration of the lower mold 1A according to Modification 1 that differs from the lower mold 1 according to the embodiment. Note that in the lower mold 1A according to Modification 1, the same reference numerals as those in the lower mold 1 according to the embodiment have the same configuration as the lower mold 1 according to the embodiment, and therefore their description will be omitted.

[0095] The lower mold 1A according to the first modification further includes a base 50 that supports the support base 20A. The base 50 contacts the underside of the support base 20A on the side opposite to the heating block 10. The material of the base 50 includes, for example, cast iron. The base 50 extends along the longitudinal direction Dn.

[0096] The support base 20A has a hollow portion 211 and support pillars 212. The hollow portion 211 opens to the base 50 side of the support base 20A. The support pillars 212 transmit the force applied to the installation surface 1a when the molding object 110 is pressed by the lower mold 1A together with the upper mold 2 to the base 50. The hollow portion 211 and the support pillars 212 are arranged in the base body 21.

[0097] Specifically, the cavity 211 is dug upward from the lower surface of the support base 20A. The support base 20A has multiple cavity portions 211 along the width direction Dh. In this example, the support base 20A has three cavity portions 211 along the width direction Dh. Each cavity portion 211 extends along the longitudinal direction Dn. Note that the support base 20A may have multiple cavity portions 211 along the longitudinal direction Dn.

[0098] The support pillars 212 protrude downward from above the support base 20A. The support pillars 212 include the underside of the support base 20A. The support pillars 212 are, for example, rib-shaped, wall-shaped, or column-shaped. The support base 20A has multiple support pillars 212 along the width direction Dh. In this example, the support base 20A has four support pillars 212 along the width direction Dh. In other words, a cavity 211 is disposed between adjacent support pillars 212 in the width direction Dh. Each support pillar 212 extends along the longitudinal direction Dn. Note that the support base 20A may have multiple support pillars 212 along the longitudinal direction Dn.

[0099] Preferably, the volume of the hollow portion 211 is 30% or more of the volume of the portion of the support base 20A other than the hollow portion 211. More preferably, the volume of the hollow portion 211 is 50% or more of the volume of the portion of the support base 20A other than the hollow portion 211. Since the support base 20A has a plurality of hollow portions 211 along the longitudinal direction Dn, the weight of the lower mold 1A can be reduced.

[0100] According to the lower mold 1A of the first modification, the thermal expansion of the support base 20A is reduced by the hollow portion 211. Furthermore, when the heater 12 generates heat by electric power, an electric wire that supplies electric power to the heater 12 can be passed through the hollow portion 211. Alternatively, when the heater 12 generates heat by a heat medium, a pipe that supplies the heat medium to the heater 12 can be passed through the hollow portion 211.

[0101] The description of other configurations, actions, and effects will be omitted, but the description of the lower mold 1 according to the embodiment can be used to describe the lower mold 1A according to the first modified example.

[0102] <<Modification 2>> Figure 16 is a cross-sectional view of a lower mold 1B according to Modification 2. The lower mold 1B according to Modification 2 differs from the lower mold 1 according to the embodiment in that it includes a base 50 and in the configuration of the support base 20B. The following description will focus on the configuration of the lower mold 1B according to Modification 2 that differs from the lower mold 1 according to the embodiment. Note that in the lower mold 1B according to Modification 2, the same reference numerals as those in the lower mold 1 according to the embodiment have the same configuration as the lower mold 1 according to the embodiment, and therefore their description will be omitted.

[0103] The lower mold 1B according to the second modification includes a support base 20B having a mounting surface 1a and a heater 12. The heater 12 is embedded inside the support base 20B. The heater 12 is not exposed from the mounting surface 1a. The mounting surface 1a includes a support surface 21a that supports the molding target object 110. The support surface 21a has the same shape as the support surface 10a of the heating block 10 of the lower mold 1 according to the embodiment, and detailed description of the support surface 21a will be omitted.

[0104] The support base 20B further has a recess 21b that opens to the installation surface 1a and accommodates a reinforcing member 111 that is to be joined to the molding target object 110. The recess 21b has the same shape as the recess 31 of the accommodation block 30 of the lower mold 1 according to the embodiment, and detailed description of the recess 21b will be omitted.

[0105] The support base 20B has a base body 21. The base body 21 is made of, for example, cast iron. The base body 21 extends along the longitudinal direction Dn. The upper surface of the base body 21 is the installation surface 1a.

[0106] The support base 20B further has at least one cooling channel 22 through which a cooling medium passes. The cooling channel 22 is provided inside the base main body 21. The cooling channel 22 is formed, for example, by a pipe embedded in the base main body 21. In other words, the internal space of the pipe is the cooling channel 22.

[0107] In this way, the support base 20B is an integrated unit of the heating block 10, the containing block 30, and the support base 20 of the lower mold 1 according to the embodiment. Note that the support base 20B does not necessarily have to have the recess 21b on the installation surface 1a. Furthermore, the support base 20B does not necessarily have to have the cooling flow path 22.

[0108] The lower mold 1B further includes a base 50 that supports the support base 20B. The base 50 contacts the underside of the support base 20B on the side opposite to the installation surface 1a. The material of the base 50 includes, for example, cast iron. The base 50 extends along the longitudinal direction Dn.

[0109] The support base 20B has a hollow portion 211 and support pillars 212. The hollow portion 211 opens to the base 50 side of the support base 20B. The support pillars 212 transmit the force applied to the installation surface 1a when the molding object 110 is pressed by the lower mold 1B together with the upper mold 2 to the base 50. The hollow portion 211 and the support pillars 212 are arranged in the base body 21.

[0110] Specifically, the cavity 211 is dug upward from the lower surface of the support base 20B. The support base 20B has multiple cavity portions 211 along the width direction Dh. In this example, the support base 20B has three cavity portions 211 along the width direction Dh. Each cavity portion 211 extends along the longitudinal direction Dn. Note that the support base 20B may have multiple cavity portions 211 along the longitudinal direction Dn.

[0111] The support pillars 212 protrude downward from above the support base 20B. The support pillars 212 include the underside of the support base 20B. The support pillars 212 are, for example, rib-shaped, wall-shaped, or column-shaped. The support base 20B has multiple support pillars 212 along the width direction Dh. In this example, the support base 20B has four support pillars 212 along the width direction Dh. In other words, a hollow portion 211 is disposed between adjacent support pillars 212 in the width direction Dh. Each support pillar 212 extends along the longitudinal direction Dn. Note that the support base 20B may have multiple support pillars 212 along the longitudinal direction Dn.

[0112] Preferably, when the heater 12 generates heat by electricity, an electric wire that supplies power to the heater 12 may be passed through the hollow portion 211. Alternatively, when the heater 12 generates heat by a heat medium, a pipe that supplies the heat medium to the heater 12 may be passed through the hollow portion 211.

[0113] Preferably, the volume of hollow portion 211 is 30% or more of the volume of the portion of support base 20B other than hollow portion 211. More preferably, the volume of hollow portion 211 is 50% or more of the volume of the portion of support base 20B other than hollow portion 211. By having hollow portion 211 in support base 20B, it is possible to reduce the weight of lower mold 1B.

[0114] According to the lower mold 1B of Modification 2, the thermal expansion of the support base 20B is reduced by the hollow portion 211, and thermal deformation of the lower mold 1B can be reduced. As a result, when the molded object 110 is pressed while being heated, the effect of thermal deformation of the lower mold 1B on the molded object 110 can be reduced, and the molding accuracy of the molded object 110 can be improved. Furthermore, electric wires that supply power to the heater 12 and piping that supply a heat medium to the heater 12 can be passed through the hollow portion 211.

[0115] Furthermore, since the support base 20B has a cooling flow path 22 through which a cooling medium passes, by cooling the support base 20B, the thermal deformation of the support base 20B can be reduced, and the thermal deformation of the lower mold 1B can be further reduced.

[0116] The description of other configurations, actions, and effects will be omitted, but the description of the lower mold 1 according to the embodiment can be used to describe the lower mold 1B according to the second modified example.

[0117] Other Embodiments As described above, the above-described embodiments have been described as examples of the technology disclosed in the present application. However, the technology disclosed herein is not limited to these embodiments and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are made as appropriate. Furthermore, the components described in the above-described embodiments can be combined to create new embodiments. Furthermore, the components described in the accompanying drawings and detailed description may include not only components essential for solving the problem, but also components that are not essential for solving the problem in order to exemplify the technology. Therefore, the fact that these non-essential components are described in the accompanying drawings or detailed description should not be interpreted as immediately determining that these non-essential components are essential.

[0118] For example, the molding object 110 includes a thermoplastic resin, but may also include a thermosetting resin.

[0119] The molded object 110 after molding is used for an aircraft fuselage panel, but may also be used for a long panel such as a car panel or a train panel. The reinforcing member 111 is a stringer, but may also be a reinforcing material such as a rib. The reinforcing material such as a rib may have a hat-shaped cross section, or may have other shapes such as a J-shaped, I-shaped, or Z-shaped cross section. It is preferable that the shape of the containing block 30 corresponds to the shape of the reinforcing material.

[0120] A lower mold 1 is used as the mold and an upper mold 2 is used as the opposing mold, but the mold may be any mold on which the object to be molded 110 is placed, and the opposing mold may be any mold that faces the mold, and is not limited to upper and lower molds arranged in the direction of gravity.

[0121] The lower mold 1 moves in the feed direction Ds while the upper mold 2 moves in the vertical direction, and the lower mold 1 and the upper mold 2 press the object to be molded 110 multiple times to complete the molding, but it is also possible to complete the molding with only one press.

[0122] The lower mold 1 and the upper mold 2 heat the molding object 110, but it is also possible to heat the molding object 110 only with the lower mold 1.

[0123] The lower mold 1 is controlled to have a constant temperature along the longitudinal direction Dn, but may also be controlled to have two temperature zones along the longitudinal direction Dn during the molding process of the object 110. Specifically, the lower mold 1 may be controlled to have a first temperature zone controlled to a predetermined temperature and a second temperature zone adjusted to a temperature lower than the predetermined temperature. In this case, the lower mold 1 may be controlled to change the ratio between the first temperature zone and the second temperature zone during the molding process of the object 110.

[0124] The upper mold 2 has two temperature regions R1 and R2 arranged along the longitudinal direction Dn, but may have only one temperature region, or may have three or more temperature regions.

[0125] The upper mold 2 can be moved toward or away from the lower mold 1, but the lower mold 1 may be moved toward or away from the upper mold 2, or the lower mold 1 and the upper mold 2 may be moved toward or away from each other.

[0126] Although the lower mold 1 moves in the feed direction Ds, it is sufficient that the lower mold 1 and the upper mold 2 are configured to be able to move relatively in the feed direction Ds, and the upper mold 2 may move in the feed direction Ds.

[0127] The number of heating blocks 10 may be increased or decreased, for example, may be one. The number of containing blocks 30 may be increased or decreased, for example, may be one.

[0128] The number of heaters in the lower mold 1 and the upper mold 2 may be increased or decreased. The number of cooling channels 22 in a cross section perpendicular to the longitudinal direction Dn may be increased or decreased.

[0129] The installation surface 1 a includes the support surface 10 a, but may also include a surface of a member other than the heating block 10.

[0130] Two adjacent heating blocks 10 may be in contact with each other without a gap S1 between them at room temperature.

[0131] A gap S2 may be present at room temperature between at least one of the first heating block 10 and the storage block 30 and the second heating block 10 and the storage block 30. Alternatively, the heating block 10 and the storage block 30 may be in contact with each other without a gap S2 being present between them at room temperature.

[0132] The heat insulating material 41 may not be disposed between the heating block 10 and the support base 20, and the heating block 10 and the support base 20 may be in contact with each other.

[0133] The heat insulating material 41 may be arranged between two adjacent heating blocks 10 without a gap S1, or the heat insulating material 41 may be arranged between two adjacent heating blocks 10 without a gap S1.

[0134] The at least one heating block 10 includes a plurality of heating blocks 10 arranged along the width direction Dh, but may also include a plurality of heating blocks 10 arranged along the longitudinal direction Dn. Alternatively, the at least one heating block 10 may be composed of a plurality of heating blocks 10 arranged along the longitudinal direction Dn.

[0135] The heat insulating material 41 may be disposed without the gap S2 between the first heating block 10 and the containing block 30 and between the second heating block 10 and the containing block 30. Alternatively, the heat insulating material 41 may not be disposed between the first heating block 10 and the containing block 30 and between the second heating block 10 and the containing block 30, but the gap S2 may be formed.

[0136] Each cooling flow path 22 is positioned below the lower end 15 of the heating block 10 located closest to it, but at least one cooling flow path 22 may be positioned above the lower end 15 of the heating block 10 located closest to it.

[0137] The lower mold 1 has a storage block 30, but the storage block 30 may be omitted, and in this case, a gap S1 may be formed between two adjacent heating blocks 10 at room temperature.

[0138] The molding method for the object to be molded 110 includes pressing and molding the object to be molded 110, as well as joining a reinforcing member 111 to the object to be molded 110, but it may also include only pressing and molding the object to be molded 110, omitting joining the reinforcing member 111 to the object to be molded 110.

[0139] In the molding method for the object to be molded 110, reinforcing members 111 are accommodated in all of the storage blocks 30, and eight reinforcing members 111 are joined to the object to be molded 110, but it is also possible to accommodate a reinforcing member 111 in at least one storage block 30, and join at least one reinforcing member 111 to the object to be molded 110.

[0140] The molding target object 110 is in the form of a flat plate, but the molding target object 110 may be formed by laminating prepregs into a curved surface by hand or by an automatic laminating device.

[0141] The method for molding the object to be molded is not limited to the molding apparatus 100 described above, and can also be realized by other apparatuses.

[0142] The functions performed by the components described herein may be implemented in circuitry or processing circuitry, including general-purpose processors, application-specific processors, integrated circuits, ASICs (Application Specific Integrated Circuits), a Central Processing Unit (CPU), conventional circuits, and / or combinations thereof, programmed to perform the described functions. A processor includes transistors and other circuits and is considered a circuit or processing circuit. A processor may also be a programmable processor that executes a program stored in a memory.

[0143] In this specification, a circuit, unit, or means is hardware that is programmed to realize or performs the described functions, which may be any hardware disclosed herein or any hardware known to be programmed to realize or perform the described functions.

[0144] If the hardware is a processor considered to be a type of circuitry, the circuit, means, or unit is a combination of hardware and software used to configure the hardware and / or processor.

[0145] [Aspects] The above-described embodiments are specific examples of the following aspects.

[0146] (Mode 1) A lower mold 1 (mold) has an installation surface 1a on which a resin-containing molded object 110 is placed, and the lower mold 1 presses the molded object 110 together with an upper mold 2 (opposing mold) facing the installation surface 1a while heating the molded object 110. The lower mold 1 includes a heating block 10 that supports the molded object 110 and has a support surface 10a included in the installation surface 1a and a heater 12, and a support base 20 that is arranged on the opposite side of the support surface 10a with respect to the heating block 10 and supports the heating block 10, and the support base 20 has a cooling flow path 22 through which a cooling medium passes.

[0147] According to the configuration of Aspect 1, the support table 20 has the cooling flow path 22 through which a cooling medium passes, and therefore, by cooling the support table 20, it is possible to reduce thermal deformation of the support table 20 and thereby reduce thermal deformation of the lower mold 1. As a result, when the object 110 to be molded is pressed while being heated, the effect of thermal deformation of the lower mold 1 on the object 110 to be molded can be reduced, and the molding accuracy of the object 110 can be improved.

[0148] (Aspect 2) In the lower mold 1 according to aspect 1, the heating block 10 and the support base 20 are separate.

[0149] According to the configuration of the second aspect, the heating block 10 can be easily removed from the support base 20, and the heating block 10 can be easily replaced.

[0150] (Aspect 3) In the lower mold 1 described in Aspect 1 or Aspect 2, the heating blocks 10 are composed of a plurality of heating blocks 10 arranged along the installation surface 1a, and there is a gap S1 between two adjacent heating blocks 10 at room temperature.

[0151] According to the configuration of Aspect 3, there is a gap S1 between two adjacent heating blocks 10, so even if the heating blocks 10 thermally expand in a direction along the installation surface 1a, the gap S1 absorbs the thermal expansion of the heating blocks 10, thereby further reducing thermal deformation of the lower mold 1. Specifically, even if the heating blocks 10 thermally expand, the presence of the gap S1 prevents the heating blocks 10 from excessively pressing against the adjacent heating blocks 10. This further reduces the effect of thermal deformation of the lower mold 1 on the object 110 to be molded, thereby further improving the molding accuracy of the object 110 to be molded.

[0152] (Aspect 4) In the lower mold 1 described in any one of Aspects 1 to 3, the heating blocks 10 include a plurality of heating blocks 10 arranged along a width direction Dh perpendicular to the longitudinal direction Dn of the installation surface 1a when viewed from a pressing direction Dp in which the molded object 110 is pressed, and further include a storage block 30 arranged between adjacent first and second heating blocks 10 of the plurality of heating blocks 10, opening to the installation surface 1a and including a recess 31 for accommodating a reinforcing member 111 to be joined to the molded object 110, and the storage block 30 is supported by the support base 20.

[0153] According to the configuration of Aspect 4, since the containing block 30 is supported by the support base 20, when joining the reinforcing member 111 to the molding object 110, the containing block 30 can be cooled by the cooling effect from the support base 20 by cooling the support base 20, thereby reducing thermal deformation of the containing block 30 and further reducing thermal deformation of the lower mold 1. This makes it possible to further reduce the effect of thermal deformation of the lower mold 1 on the molding object 110, and further improve the molding accuracy of the molding object 110.

[0154] (Aspect 5) In the lower mold 1 described in any one of Aspects 1 to 4, the storage block 30 is composed of a plurality of storage blocks 30 arranged along the width direction Dh of the installation surface 1a, and the plurality of heating blocks 10 and the plurality of storage blocks 30 are arranged alternately along the width direction Dh.

[0155] According to the configuration of Aspect 5, the plurality of heating blocks 10 and the plurality of storage blocks 30 are arranged alternately along the width direction Dh, so that each storage block 30 is susceptible to heat from the heating block 10 adjacent to it, but each storage block 30 is cooled by the cooling effect of the support base 20, thereby reducing thermal deformation of each storage block 30. As a result, the pitch between two adjacent storage blocks 30 remains unchanged in all storage blocks 30, and the molding accuracy of the object 110 can be further improved.

[0156] (Aspect 6) The lower mold 1 described in any one of Aspects 1 to 5 further includes heat insulating materials 41 arranged between the first heating block 10 and the storage block 30 and between the second heating block 10 and the storage block 30.

[0157] According to the configuration of Aspect 6, the heat insulating material 41 is disposed between the first heating block 10 and the containing block 30 and between the second heating block 10 and the containing block 30, respectively, so that the heat from the first heating block 10 and the second heating block 10 is less likely to be transferred to the containing block 30. This further reduces the thermal deformation of the containing block 30, and further reduces the thermal deformation of the lower mold 1. Therefore, the effect of the thermal deformation of the lower mold 1 on the molded object 110 can be further reduced, and the molding accuracy of the molded object 110 can be further improved.

[0158] (Aspect 7) In the lower mold 1 described in any one of Aspects 1 to 6, there is a gap S2 between the first heating block 10 and the storage block 30 and between the second heating block 10 and the storage block 30 at room temperature.

[0159] According to the configuration of Aspect 7, there is a gap S2 between the first heating block 10 and the storage block 30 and between the second heating block 10 and the storage block 30. Therefore, even if the first heating block 10 and the second heating block 10 thermally expand in the width direction Dh of the installation surface 1a, the gap S2 absorbs the thermal expansion of the first heating block 10 and the second heating block 10, thereby further reducing thermal deformation of the lower mold 1. Specifically, even if the heating block 10 thermally expands, the presence of the gap S2 prevents the heating block 10 from excessively pressing against the adjacent storage block 30. This further reduces the effect of thermal deformation of the lower mold 1 on the molded object 110, thereby further improving the molding accuracy of the molded object 110.

[0160] (Mode 8) In the lower mold 1 described in any one of modes 1 to 7, the storage block 30 is composed of a plurality of storage blocks 30 arranged along the width direction Dh of the installation surface 1a, and when viewed from the pressing direction Dp, each storage block 30 overlaps the cooling flow path 22.

[0161] According to the configuration of Aspect 8, each storage block 30 overlaps with the cooling flow path 22 when viewed from the pressing direction Dp, and therefore each storage block 30 is easily cooled by the cooling flow path 22. This further reduces thermal deformation of the storage blocks 30, and further reduces thermal deformation of the lower mold 1. Therefore, the effect of thermal deformation of the lower mold 1 on the molded object 110 can be further reduced, and the molding accuracy of the molded object 110 can be further improved.

[0162] (Aspect 9) In the lower mold 1 described in any one of Aspects 1 to 8, the heating blocks 10 include a plurality of heating blocks 10 arranged along a width direction Dh perpendicular to the longitudinal direction Dn of the installation surface 1a when viewed from the pressing direction Dp in which the molded object 110 is pressed, and each heating block 10 has an end 15 located on the opposite side of the support surface 10a in the pressing direction Dp, and in a cross section perpendicular to the longitudinal direction Dn of the installation surface 1a, the cooling flow path 22 is composed of a plurality of cooling flow paths 22 arranged along the width direction Dh of the installation surface 1a, and each cooling flow path 22 is arranged in the direction of the pressing direction Dp from the support surface 10a toward the end 15, rather than the end 15 of the heating block 10 located closest to it.

[0163] According to the configuration of Aspect 9, in a cross section perpendicular to the longitudinal direction Dn of the installation surface 1a, each cooling channel 22 is disposed in the pressing direction Dp in a direction (downward) from the support surface 10a toward the end 15, relative to the end 15 (lower end) of the heating block 10 located nearest to it. This reduces the cooling effect of the cooling channel 22 on the heating block 10, and maintains the heating effect of the heating block 10 on the object 110 to be molded.

[0164] (Mode 10) The lower mold 1A described in any one of modes 1 to 9 further comprises a base 50 that supports the support table 20A, and the support table 20A has a hollow portion 211 that opens to the base 50 side and a support portion 212 that transmits the force applied to the installation surface 1a to the base 50 when the lower mold 1A presses the molded object 110 together with the upper mold 2.

[0165] According to the configuration of Aspect 10, thermal expansion of the support base 20A is reduced by the hollow portion 211. Furthermore, electric wires for supplying power to the heater 12 and piping for supplying a heat medium to the heater 12 can be passed through the hollow portion 211.

[0166] (Mode 11) The molding device 100 for the molded object includes the lower mold 1 described in any one of modes 1 to 10, in which the molded object 110 containing resin is placed and heated, and the upper mold 2, which presses the molded object 110 together with the lower mold 1 to mold it.

[0167] According to the configuration of Aspect 11, since the lower die 1 is provided, by cooling the support base 20, it is possible to reduce thermal deformation of the support base 20 and thereby reduce thermal deformation of the lower die 1. As a result, when the object 110 to be molded is pressed while being heated, it is possible to reduce the effect of thermal deformation of the lower die 1 on the object 110 to be molded, and it is possible to improve the molding accuracy of the object 110 to be molded.

[0168] (Mode 12) A method for molding an object to be molded includes preparing the lower mold 1 described in any one of Modes 1 to 10, placing the object to be molded 110 on the mounting surface 1a of the lower mold 1, and pressing and molding the object to be molded 110 with the lower mold 1 and the upper mold 2 while heating the heating block 10 and flowing a cooling medium through the cooling flow path 22 to cool the support base 20.

[0169] According to the configuration of Aspect 12, by cooling the support table 20, it is possible to reduce thermal deformation of the support table 20 and thereby reduce thermal deformation of the lower mold 1. As a result, when the object 110 to be molded is pressed while being heated, it is possible to reduce the effect of thermal deformation of the lower mold 1 on the object 110 to be molded, and it is possible to improve the molding accuracy of the object 110 to be molded.

[0170] (Mode 13) The lower mold 1B has a setting surface 1a on which a resin-containing molded object 110 is placed, and presses the molded object 110 together with the upper mold 2 facing the setting surface 1a while heating the molded object 110. The lower mold 1B includes a support table 20B having the setting surface 1a and a heater 12, and a base 50 that supports the support table 20B. The support table 20B has a hollow portion 211 that opens to the base 50 side, and support portions 212 that transmit a force applied to the setting surface 1a to the base 50 when the molded object 110 is pressed together with the upper mold 2 by the lower mold 1B.

[0171] According to the configuration of Aspect 13, the hollow portion 211 reduces thermal expansion of the support base 20B, thereby reducing thermal deformation of the lower mold 1B. This reduces the effect of thermal deformation of the lower mold 1B on the molded object 110 when the molded object 110 is pressed while being heated, thereby improving the molding accuracy of the molded object 110. Furthermore, electric wires that supply power to the heater 12 and piping that supply a heat medium to the heater 12 can be passed through the hollow portion 211.

[0172] DESCRIPTION OF SYMBOLS 1, 1A, 1B Lower mold (mold) 1a Installation surface 2 Upper mold (opposing mold) 10 Heating block 10a Support surface 12 Heater 15 End 20, 20A, 20B Support base 21a Support surface 211 Cavity 212 Support column 22 Cooling flow path 30 Storage block 31 Recess 41 Heat insulating material 50 Base 100 Molding device for object to be molded 110 Object to be molded 111 Reinforcing member S1, S2 Gap Dp Pressing direction Dn Longitudinal direction Dh Width direction

Claims

1. A mold that has an installation surface for installing an object to be molded containing resin, and presses the object to be molded together with a counter mold facing the installation surface while heating the object to be molded, the mold comprising: a heating block that supports the object to be molded and has a support surface and a heater included in the installation surface; and a support base that is disposed on a side opposite to the support surface with respect to the heating block and supports the heating block, wherein the support base is a mold having a cooling channel through which a cooling medium passes.

2. The mold according to claim 1, wherein the heating block and the support base are separable molds.

3. The mold according to claim 1, wherein the heating block is composed of a plurality of heating blocks arranged along the installation surface, and there is a gap between two adjacent heating blocks at normal temperature.

4. The mold according to claim 1, wherein the heating block includes a plurality of heating blocks arranged along a width direction orthogonal to a longitudinal direction of the installation surface as viewed from a pressing direction for pressing the object to be molded, and further includes a housing block that is disposed between adjacent first and second heating blocks among the plurality of heating blocks and includes a recess for housing a reinforcing member that opens to the installation surface and is joined to the object to be molded, wherein the housing block is a mold supported by the support base.

5. The mold according to claim 4, wherein the housing block is composed of a plurality of housing blocks arranged along the width direction of the installation surface, and the plurality of heating blocks and the plurality of housing blocks are alternately arranged along the width direction.

6. The mold according to claim 4, further comprising a heat insulating material disposed between each of the first heating block and the housing block and between the second heating block and the housing block.

7. The mold according to claim 4, wherein there is a gap between each of the first heating block and the housing block and between the second heating block and the housing block at normal temperature.

8. The mold according to claim 4, wherein the housing block is composed of a plurality of housing blocks arranged along the width direction of the installation surface, and each housing block overlaps the cooling channel as viewed from the pressing direction.

9. In the mold according to claim 1, the heating block includes a plurality of heating blocks arranged along the width direction orthogonal to the longitudinal direction of the installation surface when viewed from the pressing direction for pressing the object to be molded, each heating block having an end portion located on the side opposite to the support surface in the pressing direction, and in a cross section orthogonal to the longitudinal direction of the installation surface, the cooling channel is composed of a plurality of cooling channels arranged along the width direction of the installation surface, and each cooling channel is arranged in the direction from the support surface to the end portion in the pressing direction, further away from the end portion in the nearest heating block.

10. In the mold according to claim 1, further comprising a base for supporting the support base, the support base having a cavity portion opening to the base side and a support column portion for transmitting the force applied to the installation surface to the base when pressing the object to be molded with the opposing mold in the mold.

11. A molding apparatus for an object to be molded, comprising the mold according to claim 1 for installing an object to be molded containing resin and heating the object to be molded, and the opposing mold for pressing and molding the object to be molded together with the mold.

12. A molding method for an object to be molded, comprising preparing the mold according to claim 1, installing the object to be molded on the installation surface of the mold, and pressing and molding the object to be molded with the mold and the opposing mold in a state where the heating block is heated and a cooling medium is flowed through the cooling channel to cool the support base.

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