Power semiconductor soc and method for operating power semiconductor soc

Abstract

The present invention proposes a power semiconductor device SoC comprising DC-based used power measurement, control, and security elements so as to be used as a core element of a blockchain device, and a method for operating the power semiconductor device SoC. The power semiconductor SoC comprises a sensor unit, a switch control signal detector, an OTP register, and a control logic circuit.

Description

Power semiconductor SOC and its operation method

[0001] The present invention relates to a power semiconductor device, and more particularly, to a power semiconductor SoC including DC-based power usage measurement, control, and security elements and a method of operating the power semiconductor SoC so that it can be used as a core element of a blockchain device.

[0002] The proliferation of renewable energy is a crucial element in addressing global warming through carbon reduction. While the use of renewable energy is a global trend, the rapid influx of renewable energy into the power grid (GRID) during specific periods has disrupted power grid frequency regulation, resulting in large-scale blackouts.

[0003] The grid-centric power supply system built to date requires enormous costs for network construction, so in an attempt to overcome this, power users are building micro and nano grids of renewable energy for self-consumption.

[0004] To issue carbon credits, the entire process of renewable energy generation and consumption must be tracked and documented. This process of renewable energy generation, distribution, and consumption—from off-grid solar DC power generation, battery storage, and DC appliances—must be measured at each stage to generate "verifiable and immutable data" from renewable energy production to consumption. This requires devices that can be integrated with blockchain technology.

[0005] The technical problem to be solved by the present invention is to provide a power semiconductor SoC including DC-based power usage measurement, control, and security elements so that it can be used as a core element of a blockchain device.

[0006] Another technical problem to be solved by the present invention is to provide a method for operating a power semiconductor SoC including DC-based power usage measurement, control, and security elements so that it can be used as a core element of a blockchain device.

[0007] The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0008] A power semiconductor SoC according to the present invention for achieving the above technical task includes a sensor unit, a switch control signal detector, an OTP register, and a control logic circuit.

[0009] The sensor unit monitors the temperature of the switch constituting the power semiconductor SoC, and the voltage and current across the switch, respectively. The switch control signal detector receives an operation control signal applied from the outside. The OTP register includes a first register section used when manufacturing the power semiconductor SoC and a second register section used when applying the power semiconductor SoC to a blockchain. The control logic circuit generates a gate signal for controlling the opening and closing of the switch by using the temperature, voltage, and current values ​​(hereinafter, monitored values) monitored by the sensor unit and the correction value stored in the first register in response to the operation control signal, and then comparing the result with a circuit protection condition stored in advance.

[0010] The method for operating a power semiconductor SoC according to the present invention for achieving the above other technical tasks includes a post-manufacturing test step of performing a test before shipment after manufacturing the power semiconductor SoC to store temperature / voltage / current values ​​for correction in an index register, and applying the temperature / voltage / current values ​​for correction to the temperature, voltage, and current of a switch included in the power semiconductor SoC received from a sensor unit to generate a corrected value, a step of assigning a serial number to the power semiconductor SoC that has undergone the post-manufacturing test and storing the serial number in a serial number register in order to apply the power semiconductor SoC to a blockchain, and a step of storing a key value corresponding to a password in an LEDGER register at the time of generating a token combined with a user's independent asset by the power semiconductor SoC assigned with the serial number.

[0011] The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] The power semiconductor SoC and the method for operating the power semiconductor SoC according to the present invention as described above include DC-based power usage measurement, control, and security elements so that they can be used as core elements of a blockchain device, and thus have the advantage of being able to be combined with blockchain technology as well as the operation of the power semiconductor SoC.

[0013] The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention belongs from the description below.

[0014] Figure 1 shows a block diagram of a power semiconductor SoC to which blockchain technology according to the present invention can be applied.

[0015] Figure 2 shows an example of the internal configuration of an OTP register.

[0016] Figure 3 shows an example of an operating method of a power semiconductor SoC.

[0017] In order to fully understand the present invention, its operational advantages, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating embodiments of the present invention and the contents described in the accompanying drawings.

[0018] Hereinafter, the present invention will be described in detail by describing preferred embodiments thereof with reference to the attached drawings. The same reference numerals in each drawing represent the same components.

[0019] Figure 1 shows a block diagram of a power semiconductor SoC to which blockchain technology according to the present invention can be applied.

[0020] Referring to FIG. 1, a power semiconductor SoC (hereinafter referred to as power semiconductor SoC (100)) to which blockchain technology according to the present invention can be applied includes a sensor unit (110), a serial interface (120), a switch control signal detector (130), a control logic circuit (140), a gate driver (150), an OTP register (160), an ADC (170), and a switch (180).

[0021] The sensor unit (110) includes a temperature sensor (111), a voltage sensor (112), and a current sensor (113) that monitor the temperature (T) of a switch (180) constituting a power semiconductor SoC (100), the voltage (V) across the switch (180), and the current (C), respectively. The temperature, voltage, and current values ​​(T, V, C) monitored by the sensor unit (110) are transmitted to a control logic circuit (140).

[0022] The serial interface (120) is an interface between the MCU (10) and the control logic circuit (140) outside the power semiconductor SoC (100). It receives a monitor control signal (MON_con) for monitoring the status of power and load from the MCU (10) and transmits it to the control logic circuit (140).

[0023] The switch control signal detector (130) receives an operation control signal (OP_con) having a voltage level of, for example, 5 V (Volts) or higher from an external power source (20) and transmits it to the control logic circuit (140).

[0024] The control logic circuit (140) transmits the temperature, voltage and current values ​​(T, V, C; hereinafter referred to as monitored values) monitored by the sensor unit (110) in response to the monitor control signal (MON_con) and the operation control signal (OP_con) to the ADC (170) to convert the monitored values ​​(T, V, C) which are analog values ​​into digital values ​​(T, V, C), and then corrects the monitored values ​​(T, V, C) in digital form converted by the ADC (170) using correction values ​​(REF_T, REF_V, REF_C; described later) stored in the OTP register (160), and then generates a gate signal (G_S) that controls the opening and closing of the switch (180) using the result of comparison with a preset circuit protection condition.

[0025] A switch (180) provides or blocks a path for supplying current from a first voltage source (VDD) connected to one terminal (P1) to a load (30) connected to another terminal (P2) in response to a gate signal (G_S). The load (30) is installed between the other terminal (P2) of the switch (180) and a second voltage source (VSS). Here, the first voltage source (VDD) has a relatively higher voltage level (Voltages) than the second voltage source (VSS), and for example, the second voltage source (VSS) may be a ground voltage.

[0026] The OTP register (160) includes a first register section used in the production of a power semiconductor SoC (100) and a second register used in the application of blockchain.

[0027] Figure 2 shows an example of the internal configuration of an OTP register.

[0028] Referring to FIG. 2, the OTP register (160) includes a first register section (161) including an index register (162) and a serial number register (163) and a second register section (165) including an LEDGER register (166).

[0029] The index register (162) stores a correction temperature (REV_T), a correction voltage (REV_V), and a correction current (REV_C) for correcting the monitored values ​​(T, V, C) received from the sensor unit (110). The power semiconductor SoC (100) according to the present invention is produced on a wafer in the shape of a disk having a certain diameter, and the electrical characteristics of the power semiconductor SoC (100) located at the center of the wafer and the power semiconductor SoC (100) located at the periphery are different.

[0030] For this reason, the influence of the magnitude of the temperature (T), voltage (B), and current (C) measured by the sensor unit (110) on the circuit operation and physical characteristics of the power semiconductor SoC (100) may have a certain difference for each power semiconductor SoC (100), and the correction values ​​(REV_T, REV_V, REV_C) obtained through testing before shipment of the power semiconductor SoC (100) are stored in the index register (162).

[0031] At this time, the control logic (140) reflects the correction values ​​(REV_T, REV_V, REV_C) stored in the index register (162) to the monitored values ​​(T, V, C) in digital form to correct them, and determines the gate control signal (GATE_con) according to the corrected values ​​(T', V', C'). Here, generating a gate control signal (GATE_con) according to the corrected values ​​(T', V', C') means comparing the corrected values ​​(T', V', C') with the circuit protection conditions stored in advance to determine whether the power semiconductor SoC (100) is operating normally, and if it is determined that there is no problem in operating the switch (180), that is, if it is determined that the conditions for normal operation of the power semiconductor SoC (100) are met, the switch (180) is operated, and conversely, if the power semiconductor SoC (100) is determined to be in an overheated, overvoltage, or overcurrent state, the operation of the switch (180) is stopped.

[0032] The serial number register (163) stores a unique serial number assigned to a power semiconductor SoC (100) that has completed storing correction values ​​in the index register (162) prior to shipment. For example, assuming that more than 10 billion individual identification factors are required, it is preferable to configure the serial number register (163) to be 34 bits or more. The serial number register (163) is intended to ensure integrity until the token is generated and will be used only once.

[0033] The LEDGER register (166) stores a key value collected through a secure element designated by a power user for self-consumption. In order to secure the integrity of a token generated by combining the power user's independent assets and the power semiconductor SoC (100) according to the present invention, it is preferable that the key value stored in the LEDGER register (166) have a value of at least 32 bytes, i.e., 256 bits.

[0034] The operation of the power semiconductor SoC according to the present invention illustrated in Fig. 1 proceeds as follows.

[0035] When a first voltage source (VDD) is connected to one terminal (P1) of a switch (180) and a load (30) is connected to the other terminal (P3), and an operation control signal (OP_con) having a voltage level of 5 V (Volts) or higher is input to a switch control signal detector (130), the control logic circuit (140) converts the temperature, voltage, and current values ​​(T, V, C) detected by the sensor unit (110) into digital values ​​in the ADC (170), modifies the values ​​converted into digital values ​​by reflecting the correction values ​​(REV_T, REV_V, REV_C) stored in the index register (162), and compares the modified values ​​(T', V', C') with the preset circuit protection conditions, and if the operating conditions are met, transmits a gate control signal (GATE_con) to the gate driver (150), and the gate driver (150) responds to the gate control signal (GATE_con) to turn on the switch (180). A gate signal (G_S) controlling opening and closing is transmitted to the switch (180) to turn on the switch (180) so that current flows from the first voltage source (VDD) to the load (30). Here, when the voltage level of the operation control signal (OP_con) is 2.5 V or lower, it can be judged as an instruction not to activate the switch (180).

[0036] At this time, when an external MCU (20) transmits a signal instructing the control logic circuit (140) to monitor the status of the power supply and load, the control logic circuit (140) transmits the temperature, voltage and current values ​​(T, V, C) detected by the sensor unit (110) to the ADC (170) to convert them into digital values, and receives the temperature, voltage and current values ​​(T, V, C) converted into digital form from the ADC (170) and reflects the correction values ​​(REV_T, REV_V, REV_C) stored in the index register (162) to correct them, and then compares the corrected temperature, voltage and current values ​​(T', V', C') with the circuit protection conditions that serve as criteria for determining overheating, overvoltage and overcurrent states set in advance within the control logic circuit (140) to determine whether to maintain the operation of the power semiconductor SoC (100) or stop the operation. Stopping the operation means that the switch (180) is turned off.

[0037] Figure 3 shows an example of an operating method of a power semiconductor SoC.

[0038] Referring to FIG. 3, the operating method (300) of the power semiconductor SoC according to the present invention includes a post-manufacturing test step (310) including a step of performing a test before shipment after manufacturing the power semiconductor SoC (100) to store the temperature / voltage / current values ​​(REV_T, REV_V, REV_C) for correction in the index register (162) (311), and applying the temperature / voltage / current values ​​(REV_T, REV_V, REV_C) for correction to the temperature, voltage and current (T, V, C) of the received switch to generate the corrected values ​​(T', V', C'), a step of assigning a serial number to the power semiconductor SoC (100) that has undergone the post-manufacturing test in order to apply the power semiconductor SoC (100) to the blockchain, and a step of storing the serial number in the serial number register (153) (330), and a step of registering the power semiconductor SoC (100) to which the serial number has been assigned. It includes a step (350) of storing a key value corresponding to a password in the LEDGER register (166) at the time of generation of a token combined with the user's independent asset.

[0039] Although not shown in FIG. 1, the power semiconductor SoC (100) may include an embodiment including a source voltage generator that generates a voltage used internally, a voltage sensor that measures the voltage level of the source voltage generated from the source voltage generator, a charge pumping oscillator that pumps the voltage level of the gate signal (G_S), an oscillator timer, and an ESD circuit.

[0040] The present invention proposes a power semiconductor SoC including DC-based power usage measurement, control, and security elements, and a method for operating the power semiconductor SoC, which can be used as a core element of a blockchain device. The power semiconductor SoC includes a sensor unit, a switch control signal detector, an OTP register, and a control logic circuit.

Claims

1. A sensor unit that monitors the temperature of the switch constituting the power semiconductor SoC, and the voltage and current at both ends of the switch; A switch control signal detector that receives an externally applied motion control signal; An OTP register including a first register section used when manufacturing the power semiconductor SoC and a second register section used when applying the power semiconductor SoC to a blockchain; and A control logic circuit that generates a gate signal that controls the opening and closing of the switch by using the results of comparing the temperature, voltage and current values ​​(hereinafter, monitored values) monitored by the sensor unit and the compensation values ​​stored in the first register in response to the operation control signal with the circuit protection conditions stored in advance; Power semiconductor SoC including.

2. In paragraph 1, Further comprising a serial interface for receiving a monitor control signal for monitoring the status of power and load from an MCU outside the power semiconductor SoC and transmitting the same to the control logic circuit; The above control logic circuit is a power semiconductor SoC that operates in response to the above operation control signal and the above monitor control signal.

3. In paragraph 1, It further includes an ADC that converts an analog signal into a digital signal; The above control logic circuit is a power semiconductor SoC that converts the monitored value in analog form received from the sensor unit into a monitored value in digital form using the ADC, and applies the correction value stored in the first register to the converted value to correct it.

4. In paragraph 3, The above first register section includes an index register and a serial number register, The above index register stores correction values ​​including correction temperature, correction voltage and correction current used to correct the monitored values ​​received from the sensor unit, The above serial number register stores a unique serial number assigned to the power semiconductor SoC upon shipment.

5. In the fourth paragraph, the serial number register, A power semiconductor SoC capable of storing 34 bits.

6. In the third paragraph, the second register section, A power semiconductor SoC including an LEDGER register that stores a key value collected through a security element designated by a power user for self-consumption.

7. In paragraph 6, the LEDGER register, A power semiconductor SoC that can store 32 bytes.

8. In the first paragraph, the voltage level of the operation control signal is A power semiconductor SoC having a voltage of 5 V or higher when the above switch is to be operated and 2.5 V or lower when the above switch is not to be operated.

9. In paragraph 1, the switch, A power semiconductor SoC that switches a first voltage source connected to one terminal and a load connected to another terminal in response to the gate signal.

10. In paragraph 1, the circuit protection conditions are: A power semiconductor SoC including criteria for overheating, overvoltage and overcurrent of the above switch.

11. A post-manufacturing test step for performing a test before shipment after manufacturing a power semiconductor SoC to store temperature / voltage / current values ​​for correction in an index register, and applying the temperature, voltage and current of a switch included in the power semiconductor SoC received from a sensor unit to the temperature / voltage / current values ​​for correction to generate a corrected value; A step of assigning a serial number to the power semiconductor SoC and storing the serial number in a serial number register in order to apply the power semiconductor SoC that has undergone the above-mentioned post-manufacturing test to the blockchain; and A step of storing a key value corresponding to a password in the LEDGER register at the time of generation of a token combined with the user's independent asset by the power semiconductor SoC to which a serial number is assigned; A method of operating a power semiconductor SoC including:

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