Transparent display for preventing metal wiring from being visible and being corroded, and method for manufacturing same

Abstract

A transparent display comprises: a substrate; metal wirings formed in the substrate; a black solder resist which seals the upper and side portions of the metal wirings while forming an opening for mounting a surface mounting component in the upper side thereof; a functional layer which is coupled while covering the upper portions of the substrate, the metal wirings, the black solder resist, and the surface mounting component; and a transparent cover coupled to the functional layer.

Description

A transparent display that blocks metal wiring and corrosion and a method for manufacturing the same

[0001] The present invention relates to a transparent display. More specifically, the present invention relates to a transparent display that blocks metal wiring visibility and corrosion, and a method for manufacturing the same.

[0002] Recently, the display market is seeing an increase in demand for transparent displays along with large-area displays.

[0003] Transparent displays, for example, transparent LED displays, are implemented by forming metal wiring on a transparent substrate and mounting elements (such as LEDs) in appropriate locations.

[0004] Transparent displays primarily use flexible resin films, such as PET, as their transparent substrate. However, transparent displays face challenges achieving high-brightness displays above a certain level. This difficulty stems from the limited heat resistance of flexible resin films. Specifically, achieving high-brightness displays requires a relatively large current to flow through the circuit. This inevitably leads to increased substrate temperature, resulting in thermal deformation of the flexible resin film. A typical example of thermal deformation is shrinkage of the transparent substrate. This shrinkage can cause components, such as metal wiring or mounted LEDs, to detach from the transparent substrate.

[0005] To address thermal deformation of flexible resin films, prior technologies using glass as a transparent substrate have emerged. Using glass as a transparent substrate can address thermal deformation. However, when forming metal wiring on a glass substrate, it is difficult to ensure sufficient adhesion between the metal wiring and the glass substrate.

[0006] Thus, conventional transparent displays utilize transparent substrates such as resin films and glass. In these cases, the transparency of the substrate can cause metal wiring to become visible. Furthermore, light bleed from illuminated elements (such as LEDs) can degrade the display's image quality by making the metal wiring less visible.

[0007] Additionally, in conventional transparent displays, the LED brightness decreases as metal wiring corrodes in high temperature / high humidity environments.

[0008] The purpose of the present invention is to prevent or minimize the deterioration of the image quality of a display due to the reflection of light on adjacent metal wiring caused by light spreading when a light-emitting element (such as an LED) is turned on in a transparent display.

[0009] In addition, the present invention aims to block or minimize the phenomenon of LED brightness deterioration due to corrosion of metal wiring in a high temperature / high humidity environment in a transparent display.

[0010] To achieve this purpose, the transparent display of the present invention may include a substrate, metal wiring, and black solder resist.

[0011] The substrate supports metal wiring, black solder resist, etc.

[0012] Metal wiring is formed on the substrate.

[0013] Black solder resist seals the top and sides of the metal wiring, creating openings for mounting surface-mount components on the top.

[0014] In the transparent display of the present invention, black solder resist may not be formed on metal wiring on which surface-mount components are not mounted.

[0015] In the transparent display of the present invention, the black solder resist can be formed to a thickness of 3 to 21 μm thicker than the metal wiring.

[0016] In the transparent display of the present invention, the black solder resist can be formed to have a width that is 3 to 12 μm wider than the metal wiring on one side.

[0017] In the transparent display of the present invention, the substrate may be composed of glass.

[0018] In the transparent display of the present invention, the surface-mounted component may use an LED.

[0019] The transparent display of the present invention may further include a functional layer and a transparent cover.

[0020] The functional layer covers the substrate, metal wiring, black solder resist, and the top of the surface-mounted components, and can use transparent adhesive resin (OCR).

[0021] The transparent cover can be combined with a functional layer and can be composed of glass. The glass can include ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc. The transparent cover can also be composed of a laminated body in which two or more layers of glass, such as ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc., are laminated.

[0022] The transparent display of the present invention may further include an adhesive layer bonded between the substrate and the metal wiring.

[0023]

[0024] The method for manufacturing a transparent display of the present invention may include a step of forming a metal wire on a substrate; a step of forming a black solder resist on the substrate while covering the metal wire; a step of patterning the black solder resist to seal the upper and side portions of the metal wire while forming an opening for mounting a surface-mounted component; and a step of mounting a surface-mounted component through the opening and connecting it to the metal wire.

[0025] In the method for manufacturing a transparent display of the present invention, the step of patterning a black solder resist can open metal wiring on which surface-mount components are not mounted.

[0026] In the method for manufacturing a transparent display of the present invention, the step of forming a black solder resist may use a negative type non-conductive organic film as the black solder resist.

[0027] In the transparent display manufacturing method of the present invention, the step of patterning the black solder resist can form the black solder resist to be 3 to 21 ㎛ thicker than the metal wiring.

[0028] In the transparent display manufacturing method of the present invention, the step of patterning the black solder resist can form the black solder resist so that the width is 3 to 8 ㎛ wider on one side than the metal wiring.

[0029] In the method for manufacturing a transparent display of the present invention, the step of forming a metal wire on a substrate may comprise forming the substrate of glass.

[0030] In the method for manufacturing a transparent display of the present invention, the step of mounting a surface-mounted component may use an LED as the surface-mounted component.

[0031] The method for manufacturing a transparent display of the present invention may include a step of bonding a transparent cover to a space between a substrate, a metal wiring, a black solder resist, and a surface-mounted component, and a step of injecting a functional layer into the space between the substrate, the metal wiring, the black solder resist, and the surface-mounted component and the transparent cover.

[0032] In the method for manufacturing a transparent display of the present invention, the step of forming a functional layer may use transparent adhesive resin (OCR) as the functional layer.

[0033] In the method for manufacturing a transparent display of the present invention, the step of forming a metal wire on a substrate may further include a step of forming an adhesive layer between the substrate and the metal wire.

[0034] The transparent display of the present invention covers metal wiring with black solder resist, thereby blocking or minimizing light reflection from adjacent metal wiring even when light scattering occurs when a light-emitting element (such as an LED) is turned on. As a result, the present invention can resolve the problem of display image quality deteriorating when adjacent metal wiring is visible.

[0035] Furthermore, the transparent display of the present invention can prevent metal wiring from corroding even in high-temperature / high-humidity environments by covering the metal wiring with black solder resist. As a result, the present invention can resolve the problem of LED brightness reduction due to metal wiring corrosion.

[0036] FIG. 1 is a cross-sectional view illustrating a first embodiment of a transparent display according to the present invention.

[0037] FIG. 2 is a cross-sectional view illustrating a second embodiment of a transparent display according to the present invention.

[0038] Figure 3 is a process diagram for manufacturing the first and second embodiments of a transparent display according to the present invention.

[0039] Figure 4 is a cross-sectional view illustrating a third embodiment of a transparent display according to the present invention.

[0040] Figure 5 is a cross-sectional view showing a fourth embodiment of a transparent display according to the present invention.

[0041] Figure 6 is a process diagram for manufacturing the third and fourth embodiments of a transparent display according to the present invention.

[0042] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0043]

[0044] FIG. 1 is a cross-sectional view illustrating a first embodiment of a transparent display according to the present invention.

[0045] As illustrated in FIG. 1, the first embodiment of a transparent display according to the present invention may include a substrate (110), metal wiring (120), black solder resist (130), etc.

[0046] The substrate (110) supports metal wiring (120), black solder resist (130), etc., which are combined on the upper side, and can be made of transparent film, glass, etc.

[0047] Any transparent plastic film can be used as a transparent film, for example, cycloolefin derivatives having units of monomers containing cycloolefins such as norbornene or polycyclic norbornene monomers, cellulose (diacetyl cellulose, triacetyl cellulose, acetyl cellulose butyrate, isobutyl ester cellulose, propionyl cellulose, butyryl cellulose, acetyl propionyl cellulose), ethylene vinyl acetate copolymer, polyester, polystyrene, polyamide, polyetherimide, polyacrylic, polyimide, polyethersulfone, polysulfone, polyethylene, polypropylene, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyvinyl acetal, polyether ketone, polyether ether ketone, polyether sulfone, It can be composed of polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyurethane, epoxy, etc.

[0048] The thickness of the transparent film is not particularly limited, but can range from 8 to 1,000 ㎛, specifically 20 to 150 ㎛. If the thickness of the transparent film is less than 8 ㎛, the film's strength is reduced, resulting in poor processability. If the thickness exceeds 1,000 ㎛, transparency may be reduced.

[0049] Considering thermal deformation, etc., it is preferable that the substrate (110) be composed of glass. The glass can be composed of, for example, silicate glass, borate glass, phosphate glass, etc.

[0050] Glass can be configured with a thickness of 1 to 20 mm. If the glass thickness is less than 1 mm, it may be difficult to protect the metal wiring (120) or other laminated components from external impact. If the glass thickness exceeds 20 mm, it may be disadvantageous in terms of thinning and weight reduction.

[0051] Glass may have micro-roughnesses formed on its surface to disperse the strain generated during heat treatment or cooling. These micro-roughnesses can prevent warping of the substrate (110) by dispersing the strain that may occur during heat treatment. These micro-roughnesses may also be etched to form through-holes or micro-channels. These micro-roughnesses, through-holes, or micro-channels can enhance the adhesion of metal wiring during a subsequent metal wiring formation process.

[0052] Metal wiring (120) can be formed on the substrate (110).

[0053] The metal wiring (120) may be composed of a conductive metal. The conductive metal may be, for example, copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), tungsten (W), etc.

[0054] The metal wiring (120) can be formed using a known metal thin film process. The metal thin film process can use, for example, electroplating, electroless plating, sputtering, thermal evaporation, and electron beam evaporation.

[0055] The metal wiring (120) may be formed to a thickness of 3 to 120 μm, preferably 3 to 110 μm, and more preferably 18 to 105 μm. If the thickness of the metal wiring (120) is less than 3 μm, it may not be easy to form a uniform thin film or pattern. If the thickness of the metal wiring (120) exceeds 120 μm, it may not be suitable for application to electronic devices having a thin film structure.

[0056] The metal wiring (120) can be bonded to the substrate (110) via an adhesive layer to increase adhesion to the substrate (110).

[0057] The adhesive layer may use a silicone-based adhesive. When a glass substrate is used as the substrate (110), the silicone-based adhesive has excellent adhesion to the glass substrate, excellent chemical resistance to etchants, and excellent heat resistance and reliability in high temperature and high humidity environments.

[0058] The adhesive layer may be prepared from an adhesive layer composition comprising a silicone-based adhesive. The adhesive layer composition comprises a silicone-based adhesive and a solvent, and may further comprise an additive.

[0059] The silicone-based adhesive may be selected within a range that does not detrimentally affect the purpose of the present invention. The silicone-based adhesive may be, for example, one or more of a silicone compound and a siloxane compound.

[0060] The silicon compound may be used without particular limitation as long as it is a compound containing a silicon (Si) atom. In addition, the siloxane compound may be a compound containing a siloxane bond of a Si-O bond without limitation. More specifically, in one example of the present invention, the silicon compound and the siloxane compound may be at least one of trimethylated silica, vinyl terminated polydimethylsiloxane, hexamethyl di siloxane, trisiloxane, and tetrakis(trimethylsilyloxy)silane.

[0061] The silicone-based adhesive is preferably included in an amount of 40-60% of the total weight of the adhesive layer composition. Thus, the silicone-based adhesive of the present invention may be added in a diluted state at a lower concentration than conventional adhesives. Accordingly, when bonding the adhesive layer of the present invention to a metal layer or glass substrate, adhesion to the metal layer or glass substrate can be maximized. As a result, bonding is advantageous in that bonding is possible without additional treatment, such as UV curing, of the adhesive layer.

[0062] The solvent is not particularly limited as long as it can dilute the silicone-based adhesive. Examples of the solvent include toluene, xylene, PGME, and / or PGMEA. It is preferable to include the solvent in an amount of 40 to 55% of the total weight of the adhesive layer composition, from the perspective of maintaining the thickness stability of the adhesive coating under the metal layer.

[0063] The additive may be one or more of an anchorage, a cross linker, and a catalyst.

[0064] Anchorage is added to increase the bonding strength between the adhesive layer and the metal layer during adhesive coating, thereby preventing the adhesive layer from detaching from the metal layer. Typically, any material used as anchorage is not particularly limited, but it is preferred that the anchorage not undergo thermal deformation at temperatures below 200°C.

[0065] A crosslinking agent is a substance added to chemically bond the components of the adhesive layer composition, and a product that does not undergo thermal deformation at temperatures below 200°C is preferred.

[0066] A catalyst is a component added to the adhesive layer composition for curing, and helps the adhesive layer composition transform from a liquid state to a solid state. Examples of catalysts that can be used include a platinum catalyst, a palladium catalyst, and / or an osmium catalyst.

[0067] In terms of adhesive stability, it is preferable that the additive be included in an amount of 0.1 to 10% based on the total weight of the adhesive layer composition.

[0068] The adhesive layer may be formed by heating the adhesive layer composition to a temperature of 100 to 180°C and curing it.

[0069] The adhesive layer may have a thickness of 5 to 50 μm, preferably 5 to 30 μm, and more preferably 5 to 25 μm. If the thickness of the adhesive layer is less than 5 μm, it may be difficult to maintain sufficient adhesive strength with other components. If the thickness of the adhesive layer exceeds 50 μm, there may be a disadvantage in terms of increasing the thickness of the product.

[0070] Thus, by using a silicone-based adhesive with excellent chemical resistance to etchants, damage to the adhesive layer caused by the etchant can be prevented. As a result, the need for separate intermediate layers or protective layers, which were previously required to protect the adhesive layer, is eliminated. This improves processability, reduces manufacturing costs, and even facilitates film thinning.

[0071] Bonding of the adhesive layer and the glass substrate can be performed appropriately within a range that does not impair the purpose of the present invention. For example, a laminator or the like can be used for such bonding.

[0072] Black solder resist (130) seals the upper and side portions of the metal wiring (120) while forming an opening for mounting a surface-mounted component (140) on the upper side, and can be composed of a black photosensitive resin composition, etc.

[0073] Black solder resist (130) can be classified into heat-curing, photo-curing, and thermal-curing types depending on the curing method, and can be classified into liquid and film types depending on the form.

[0074] Liquid type black solder resist may contain binder resin, photopolymerizable compound, photopolymerization initiator, pigment, dye, solvent, other additives, etc.

[0075] The present invention may include a black inorganic pigment and / or a black organic pigment. The black inorganic pigment may be at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black. The black organic pigment may be at least one selected from the group consisting of lactam black, perylene black, cyanine black, and aniline black. The black inorganic / organic pigments are not limited to these. Using a black pigment can improve visibility by minimizing light scattering.

[0076] Film-type black solder resists may include a protective film, a photosensitive resin layer, and a base film. The base film uses a polyester film, such as polyethylene terephthalate, and serves as a support. The protective film acts as a protective layer to prevent damage to the resist. The photosensitive resin layer may use the same ingredients as liquid-type black solder resist.

[0077] Since liquid-type black solder resist requires repeated printing and drying processes during manufacturing, it is preferable to use a film-type black solder resist layer. Forming a film-type black solder resist reduces the risk of air bubbles entering between the substrate and the solder resist, improves film flatness, facilitates efficient mounting of LED chips, and achieves high resolution.

[0078]

[0079] Table 1 below shows the luminance change of a transparent LED display measured when black solder resist (130) is bonded to metal wiring (120) and when it is not. Here, the black solder resist (130) is a mixture of Carbon Black and a binder (VORAMER TM , manufacturer: DOW), photoinitiator (Irugacure 907, manufacturer: Chiba Specialty Chemical (Made)) were mixed in a ratio of 5:3:2, and PGMEA solvent, Carbon Black, binder, and photoinitiator mixture were mixed in a ratio of 8:2 to prepare a liquid solution. This was uniformly applied to the upper part of the film and dried in an oven at 85°C for 6 minutes to produce a black DFSR (Dry Film Solder Resist). Using this black DFSR, a black solder resist (130) was formed with a thickness of 10 μm and a width 5 μm wider than the metal wiring (120) on one side. In addition, the substrate (110) was formed of glass, and the metal wiring (120) was formed of copper.

[0080] Evaluation conditionsBlack solder resistPresence / absenceLuminance changeLuminance change rate(%)0(hr)240(hr)Temperature 85℃Humidity 85%01528.901622.176X1596.10977.06-39Temperature 65℃Humidity 90%O1547.421505.64-3X2319.071031.41-56-20℃O1549.461545.870X2375.871225.4-48T / C(thermal shock)O1504.591554.753X1601.501006.57-37

[0081] As seen in Table 1 above, it can be confirmed that when a black solder resist (130) is formed on a metal wiring (120), the change in brightness of a transparent LED display can be blocked or minimized.

[0082]

[0083] Table 2 below compares LED lighting photos of a transparent LED display with and without black solder resist (130) bonded to metal wiring (120).

[0084] Black solder resist presence / absence LED lighting photo evaluation (light reflection and image quality light bleed level of metal wiring) O Weak X Strong (severe)

[0085] As seen in Table 2 above, it can be confirmed that when a black solder resist (130) is formed on a metal wiring (120), light reflection by the metal wiring and the resulting light scattering in the image quality can be greatly improved in a transparent LED display.

[0086]

[0087] Table 3 below shows the change in brightness of a transparent LED display after 240 hours under evaluation conditions (temperature 85°C, humidity 85%) when bonding a metal wiring (120) having a width of 60 μm and a thickness of 10 μm (wherein, the thickness of the black solder resist (130) is measured based on the upper portion of the metal wiring (120)) while changing the thickness of the black solder resist (130) (the width of the black solder resist (130) is fixed at 70 μm).

[0088] Thickness (㎛) of black solder resist Luminance change rate (%) 113.739.658.377.296.3115.5134.8154.3173.8193.4213.2233.1253.1

[0089] As seen in Table 3 above, in order to reduce the luminance change rate to within 10%, it is preferable to form the black solder resist (130) to a thickness of 3 µm or more. However, when the black solder resist (130) is formed to a thickness of 21 µm or more, it was measured that the decrease (change) in the luminance change rate was extremely minimal. Therefore, it may be preferable to form the black solder resist (130) to a thickness of 3 to 21 µm.

[0090]

[0091] Table 4 below shows the change in brightness of a transparent LED display after 240 hours under evaluation conditions (temperature 85°C, humidity 85%) when bonding a metal wire (120) with a width of 60 μm and a thickness of 10 μm while changing the width of the black solder resist (130) (the thickness of the black solder resist (130) is fixed at 10 μm).

[0092] Black solder resist width (㎛) luminance change rate (%) 6215.26413.5669.8687.3705.1723.8742.2761.8781.7801.7821.6841.6861.6

[0093] As seen in Table 4 above, in order to reduce the luminance change rate to within 10%, it is preferable to form the black solder resist (130) to be at least 3 ㎛ wider on one side than the width of the metal wiring (120). However, when the black solder resist (130) is formed to be at least 8 ㎛ wide on one side, it was measured that the decrease (change) in the luminance change rate was extremely minimal. Therefore, it may be preferable to form the black solder resist (130) to be at least 3 to 8 ㎛ wider on one side than the width of the metal wiring (120).

[0094] Surface-mounted components (140) are components that are mounted (bonded) to metal wiring (120), and may include, for example, LEDs, FPCBs, etc.

[0095]

[0096] FIG. 2 is a cross-sectional view illustrating a second embodiment of a transparent display according to the present invention.

[0097] As illustrated in FIG. 2, the second embodiment of the transparent display according to the present invention may further include a functional layer (150) and a transparent cover (160) in the first embodiment.

[0098] The functional layer (150) seals the substrate (110), metal wiring (120), black solder resist (130), and surface-mounted components (140), and can be configured to cover them. The functional layer (150) can use, for example, transparent adhesive resin (OCR).

[0099] The transparent cover (160) is combined with the functional layer (150) to cover and protect one side of the transparent display, and may be composed of glass. The glass may be selected from, for example, ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc. The transparent cover may also be composed of a glass laminate, i.e., a laminate in which two or more layers of ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc. are laminated.

[0100]

[0101] Figure 3 is a process diagram for manufacturing the first and second embodiments of a transparent display according to the present invention.

[0102] As illustrated in FIG. 3, a method for manufacturing a transparent display according to the present invention may include a step (a) of forming a metal wiring (120) on a substrate (110); a step (b) of forming a black solder resist (130) on the substrate while covering the metal wiring (120); a step (c) of forming an opening for mounting a surface-mounted component (140) while sealing the upper and side portions of the metal wiring (120) by patterning the black solder resist (130); and a step (d) of mounting the surface-mounted component (140) through the opening and connecting it to the metal wiring (120).

[0103] First, in step (a), a metal wiring (120) can be formed on the substrate (110).

[0104] The substrate (110) may be composed of a transparent film, glass, etc., as described above. It is preferable that the substrate (110) be a glass substrate that is resistant to deformation.

[0105] A method for forming a metal wiring (120) on a substrate (110) may include a step of forming a metal thin film on the substrate (110), a step of forming a photoresist pattern on the metal thin film, a step of etching the metal thin film exposed to the photoresist pattern, and a step of peeling the photoresist pattern.

[0106] Metal thin films can be formed using methods such as electroplating, electroless plating, sputtering, thermal evaporation, and electron beam evaporation.

[0107] The photoresist pattern may include a step of applying a composition for forming a photoresist pattern to a metal thin film by spin coating, slit coating, inkjet printing, etc., a step of drying and heat treating the applied photoresist pattern forming composition to form a photoresist film, a step of selectively exposing / developing the photoresist film to dissolve / remove the photoresist film in an exposed area or an unexposed area, etc.

[0108] Etching of exposed areas of a metal thin film can be performed by dry etching, wet etching, etc. For example, wet etching can use an etchant containing at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid.

[0109] Photoresist pattern stripping can be accomplished by immersing the object on which the photoresist pattern is formed in a photoresist stripping solution, spraying the stripping solution onto the object, or other methods. After the photoresist stripping solution treatment, an additional cleaning process can be performed to remove any remaining stripping solution from the object. The cleaning process uses water or isopropyl alcohol instead of the stripping solution, and the process can be performed in the same manner as the stripping step.

[0110] In step (b), a black solder resist (130) can be formed (laminated) on the substrate while covering the metal wiring (120). Step (b) forms a photosensitive resin film on the substrate (110) and the metal wiring (120), and a photosensitive dry film can be used. The photosensitive dry film can be a photosensitive resin film bonded to a protective film (or support film). The photosensitive resin film can be attached to the substrate (110) and the metal wiring (120) while peeling the protective film from the photosensitive dry film. The photosensitive resin film can be, for example, a negative-type non-conductive organic film. Attachment can be performed using, for example, a film attachment device. The film attachment device can use a vacuum laminator. A vacuum laminator can peel off the protective film of a photosensitive dry film and adhere (attach) the exposed photosensitive resin film to a substrate (110) and metal wiring (120) at a speed of 0.5 to 3.5 m / min on a table at 100 to 130°C using an adhesive roll at a pressure of 10 to 90 psi in a vacuum chamber at a vacuum level of 50 to 500 Pa.

[0111] In step (c), the upper and side portions of the metal wiring (120) can be sealed while forming an opening for mounting a surface-mounted component (140) by patterning the black solder resist (130).

[0112] Patterning of the black solder resist (130) includes a step of exposing a photosensitive resin film using a pattern mask, a step of dissolving and removing the exposed or unexposed portion of the photosensitive resin film with a developer, and a post-curing heat treatment may be performed as needed.

[0113] The opening formed after the development is where the surface-mounted component (140) is mounted (bonded), and can expose the land of the metal wiring (120).

[0114] The photosensitive resin film can be composed of photosensitive acrylic resin, photosensitive urethane resin, photosensitive phenol resin, photosensitive polyimide, etc. Among these, photosensitive acrylic resin has excellent formability and can improve pattern resolution.

[0115] As described above, in step (c), the thickness of the black solder resist (130) can be formed to be 3 to 21 ㎛ thicker than the metal wiring (120), and the width of the black solder resist (130) can be formed to be 3 to 8 ㎛ wider than the metal wiring (120) on one side.

[0116] In step (d), a surface-mount component (140) can be bonded (mounted) through the opening of the black solder resist (130). The surface-mount component (140) can be an LED, FPCB, etc.

[0117] In the method for manufacturing a transparent display according to the present invention, as illustrated in FIG. 3, in step (e), a transparent cover (160) can be joined to the upper portion of the substrate (110), metal wiring (120), black solder resist (130), and surface-mounted component (140) while being spaced apart from each other. The transparent cover (160) can be made of transparent glass or the like.

[0118] Thereafter, in step (f), a functional layer (150) can be injected into the space between the substrate (110), the metal wiring (120), the black solder resist (130), and the surface-mounted component (140) and the transparent cover (160). Here, the functional layer (150) can use, for example, a transparent adhesive resin (OCR).

[0119]

[0120] Figures 4 and 5 are cross-sectional views showing third and fourth embodiments of a transparent display according to the present invention.

[0121] As shown in FIGS. 4 and 5, in the third and fourth embodiments, unlike the first and second embodiments, black solder resist (130) may not be formed on metal wiring (120) on which surface-mount components (140) are not mounted.

[0122] Since the remaining configurations of the third and fourth embodiments are identical to the corresponding configurations of the first and second embodiments, detailed descriptions of the remaining configurations are replaced with the relevant descriptions of the first and second embodiments.

[0123]

[0124] Figure 6 is a process diagram for manufacturing the third and fourth embodiments of a transparent display according to the present invention.

[0125] As illustrated in FIG. 6, unlike the transparent display manufacturing methods of the first and second embodiments, the transparent display manufacturing methods of the third and fourth embodiments can remove the black solder resist (130) formed on the metal wiring (120) on which the surface-mounted component is not mounted when patterning the black solder resist (130) in step (c).

[0126] Since the remaining steps in the transparent display manufacturing method of the third and fourth embodiments are identical to the corresponding steps in the transparent display manufacturing method of the first and second embodiments, the detailed description of the remaining steps is replaced with the relevant description of the transparent display manufacturing method of the first and second embodiments.

[0127]

[0128] The present invention has been described in detail with several embodiments, which are intended to illustrate the invention. Those skilled in the art will readily appreciate the potential for modifications and variations to these embodiments. However, the scope of the present invention is defined by the claims below, and therefore, such modifications and variations are construed as falling within the scope of the present invention.

[0129] [Explanation of symbols]

[0130] 110: Description

[0131] 120: Metal wiring

[0132] 130: Black solder resist

[0133] 140: Surface-mount components

[0134] 150: Functional layer

[0135] 160: Transparent cover

Claims

1. Description; Metal wiring formed on the above-mentioned substrate; and A transparent display comprising a black solder resist that seals the upper and side portions of the metal wiring while forming an opening for mounting a surface-mount component on the upper side.

2. In the first paragraph, the black solder resist A transparent display that does not form on metal wiring that does not mount the above surface-mount components.

3. In the first paragraph, the black solder resist A transparent display formed with a thickness 3 to 21㎛ thicker than the above metal wiring.

4. In the first paragraph, the black solder resist A transparent display formed with a width 3 to 8㎛ wider on one side than the metal wiring.

5. In paragraph 1, the description is A transparent display made of glass.

6. In paragraph 1, the surface-mounted component LED, transparent display.

7. In any one of paragraphs 1 to 6, A functional layer covering and bonding the upper portion of the above-described substrate, metal wiring, black solder resist, and surface-mounted components; and A transparent display comprising a transparent cover bonded to the functional layer.

8. In paragraph 7, the functional layer A transparent display comprising transparent adhesive resin (OCR).

9. In the 7th paragraph, the transparent cover A transparent display made of glass.

10. In the 9th paragraph, the glass A transparent display made of one of the following: regular glass, mesh glass, colored glass, magic mirror, or holographic glass.

11. In the 9th paragraph, the transparent cover A transparent display composed of a laminate.

12. In any one of paragraphs 1 to 6, A transparent display further comprising an adhesive layer bonded between the above-described substrate and the metal wiring.

13. Step of forming metal wiring on the substrate; A step of forming a black solder resist on the substrate while covering the metal wiring; A step of forming an opening for mounting a surface-mount component while sealing the upper and side portions of the metal wiring by patterning the black solder resist; and A method for manufacturing a transparent display, comprising the step of mounting the surface-mounted component through the opening and connecting it to the metal wiring.

14. In the 13th paragraph, the step of patterning the black solder resist is A method for manufacturing a transparent display, which opens metal wiring on which the surface-mounted component is not mounted.

15. In the 13th paragraph, the step of forming the black solder resist is A method for manufacturing a transparent display using a negative type non-conductive organic film as the above black solder resist.

16. In the 13th paragraph, the step of patterning the black solder resist is A method for manufacturing a transparent display, wherein the thickness of the black solder resist is formed to be 3 to 21 ㎛ thicker than the metal wiring.

17. In the 13th paragraph, the step of patterning the black solder resist A method for manufacturing a transparent display, wherein the width of the black solder resist is formed to be 3 to 8 μm wider on one side than the metal wiring.

18. In the 13th paragraph, the step of forming a metal wiring in the above-mentioned material is A method for manufacturing a transparent display comprising the above-mentioned material made of glass.

19. In the 13th paragraph, the step of mounting a surface-mounted component through the opening is A method for manufacturing a transparent display using an LED as the surface-mount component.

20. In any one of paragraphs 13 to 19, The step of bonding a transparent cover to the upper part of the above-mentioned substrate, metal wiring, black solder resist, and surface-mounted components; and A method for manufacturing a transparent display, comprising the step of injecting a functional layer into a space between the above-described substrate, metal wiring, black solder resist, and surface-mounted components and the transparent cover.

21. In paragraph 20, the step of forming the functional layer is A method for manufacturing a transparent display, using transparent adhesive resin (OCR) as the functional layer.

22. In any one of claims 13 to 19, the step of forming a metal wiring in the substrate comprises: A method for manufacturing a transparent display, further comprising the step of forming an adhesive layer between the substrate and the metal wiring.

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