Transparent display for preventing metal wiring visibility and light spreading and manufacturing method thereof

Abstract

This transparent display comprises: a substrate; metal wiring formed on the substrate; a surface mount component coupled to a part of the metal wiring; a filler coupled to the substrate, the metal wiring, and the surface mount component; a cover black matrix coupled to the filler while covering an upper portion of the metal wiring and an edge of the surface mount component; and a cover coupled to the filler and the black matrix.

Description

A transparent display that blocks metal wiring and light scattering, and a method for manufacturing the same

[0001] The present invention relates to a transparent display. More specifically, the present invention relates to a transparent display that blocks metal wiring visibility and light scattering, and a method for manufacturing the same.

[0002] Recently, the display market is seeing an increase in demand for transparent displays along with large-area displays.

[0003] Transparent displays, for example, transparent LED displays, form metal wiring on a transparent substrate and mount elements (such as LEDs) in appropriate locations.

[0004] Transparent displays primarily use flexible resin films, such as PET, as the transparent substrate. However, these materials present challenges in achieving high-brightness displays above a certain level. This is due to the limited heat resistance of flexible resin films. Specifically, achieving high-brightness displays requires a relatively large current to flow through the circuit, which inevitably increases the current flow. This increases the substrate temperature, potentially causing thermal deformation in the flexible resin film. This thermal deformation typically manifests as shrinkage of the transparent substrate. This shrinkage can cause metal wiring or embedded LEDs, such as those formed on the transparent substrate, to peel off. To address this thermal deformation of flexible resin films, several technologies have emerged that utilize glass as the transparent substrate. While using glass as the transparent substrate can address thermal deformation, it is difficult to ensure sufficient adhesion between the metal wiring and the glass substrate when forming the metal wiring on the glass substrate.

[0005] Fig. 1 is a cross-sectional view of a transparent display according to the prior art. As illustrated in Fig. 1, the prior art transparent display uses a transparent substrate (or film) such as a resin film or glass as a base (110) or a cover (150). However, in the prior art, metal wiring may be visible due to the transparency of the base (110) or the cover (150). Furthermore, in the prior art, when the light-emitting element (130) is turned on, the visibility of the metal wiring (120) may deteriorate due to light scattering, which may degrade the image quality of the display.

[0006] The present invention aims to block or minimize the visibility of metal wiring due to the use of a transparent substrate in a transparent display.

[0007] In addition, the present invention aims to block or minimize the visibility of metal wiring due to light reflection from adjacent metal wiring caused by light scattering when a light-emitting element (such as an LED) is turned on.

[0008] One form of a transparent display according to the present invention for achieving this purpose includes a substrate, metal wiring, surface-mounted components, filler, cover black matrix, cover, etc.

[0009] The substrate supports metal wiring, etc. on the upper side.

[0010] Metal wiring is formed on the substrate.

[0011] Surface mount components are bonded to some metal wiring.

[0012] The filler is bonded to the substrate, metal wiring, and surface mount components.

[0013] The cover black matrix bonds to the filler while covering the top of the metal wiring and the edges of the surface mount components.

[0014] The cover is bonded to the filler and black matrix.

[0015] In one form of a transparent display according to the present invention, the cover black matrix is ​​formed with a line width 8 to 13㎛ wider on one side than the metal wiring.

[0016] In one form of a transparent display according to the present invention, the cover black matrix is ​​formed with a width of 12 to 20 μm from the edge of the surface-mounted component outward.

[0017] One form of the transparent display according to the present invention further includes a substrate black matrix formed on the lower portion of the substrate and covering the lower portion of the metal wiring.

[0018] In one form of a transparent display according to the present invention, the substrate black matrix is ​​formed with a line width 8 to 13㎛ wider on one side than the metal wiring.

[0019]

[0020] Other forms of the transparent display according to the present invention include a substrate, metal wiring, surface-mounted components, fillers, covers, substrate black matrices, etc.

[0021] The substrate supports metal wiring, etc.

[0022] Metal wiring is formed on the substrate.

[0023] Surface mount components are bonded to some metal wiring.

[0024] The filler is bonded to the substrate, metal wiring, and surface mount components.

[0025] The cover is bonded to the filler.

[0026] The substrate black matrix is ​​formed on the lower part of the substrate and covers the lower part of the metal wiring.

[0027] In another form of the transparent display according to the present invention, the substrate black matrix is ​​formed with a line width 8 to 13 ㎛ wider on one side than the metal wiring.

[0028] The transparent display according to the present invention further includes an adhesive layer bonded between the substrate and the metal wiring.

[0029] In the transparent display of the present invention, the substrate is made of glass.

[0030] In the transparent display of the present invention, the surface-mounted component is an LED.

[0031] In the transparent display of the present invention, the cover is made of glass. The glass may be selected from among ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc. The cover is made of a glass laminate, i.e., a laminate in which two or more layers of ordinary glass, meshed glass, colored glass, magic mirror, holographic glass, etc. are laminated.

[0032]

[0033] One embodiment of a method for manufacturing a transparent display according to the present invention includes the steps of forming metal wiring on one surface of a substrate, combining a surface-mounted component to a portion of the metal wiring, forming a cover black matrix on one surface of a cover that covers the upper portion of the metal wiring and the edge of the surface-mounted component in a mirror image with the metal wiring and the surface-mounted component, turning over the cover on which the cover black matrix is ​​formed so that one surface of the substrate and one surface of the cover face each other to fix the substrate and the cover apart from each other, and injecting a filler between the substrate and the cover.

[0034] In one embodiment of the method for manufacturing a transparent display according to the present invention, the step of forming a cover black matrix on the cover forms the line width of the cover black matrix covering the metal wiring to be 8 to 13 ㎛ wider on one side than the metal wiring.

[0035] In one embodiment of the method for manufacturing a transparent display according to the present invention, the step of forming a cover black matrix on the cover forms a cover black matrix that covers the edge of the surface-mounted component with a width of 12 to 20 μm outward from the edge of the surface-mounted component.

[0036] One form of a method for manufacturing a transparent display according to the present invention further includes a step of forming a substrate black matrix that covers a lower portion of the metal wiring on a lower portion of the substrate after a step of forming a metal wiring on one surface of the substrate or after a step of injecting a filler between the substrate and the cover.

[0037] In one embodiment of the method for manufacturing a transparent display according to the present invention, the step of forming a base black matrix forms the line width of the base black matrix to be 8 to 13 ㎛ wider on one side than the metal wiring.

[0038]

[0039] Another form of a method for manufacturing a transparent display according to the present invention includes a step of forming metal wiring on one surface of a substrate, a step of forming a substrate black matrix that covers the metal wiring on the other surface of the substrate, a step of bonding a surface-mounted component to a portion of the metal wiring, a step of spacedly fixing a cover to one surface of the substrate, and a step of injecting a filler between the one surface of the substrate and the cover.

[0040] In another form of the method for manufacturing a transparent display according to the present invention, the step of forming a base black matrix forms the line width of the base black matrix to be 8 to 13 ㎛ wider on one side than the metal wiring.

[0041] In a method for manufacturing a transparent display according to the present invention, the step of forming a metal wire on one surface of a substrate further includes a step of forming an adhesive layer between the substrate and the metal wire.

[0042] The present invention can block or minimize the visibility of metal wiring by forming a black matrix on a cover or substrate to block the upper or lower portion of the metal wiring. In this case, by optimizing the line width of the black matrix according to the line width of the metal wiring, the visibility of the metal wiring can be effectively blocked without compromising transparency.

[0043] Furthermore, the present invention can block or minimize the occurrence of light scattering when the light-emitting element is turned on by blocking the edge of the light-emitting element to a certain width, thereby preventing or minimizing the visibility of adjacent metal wiring due to such light scattering. Through this, the present invention can block or minimize the deterioration of display image quality.

[0044] Figure 1 is a cross-sectional view of a transparent display according to the prior art.

[0045] Figure 2 is a cross-sectional view of a first embodiment of a transparent display according to the present invention.

[0046] Figure 3 is a cross-sectional view of a second embodiment of a transparent display according to the present invention.

[0047] Figure 4 is a cross-sectional view of a third embodiment of a transparent display according to the present invention.

[0048] Figure 5 is a process diagram for manufacturing a first embodiment of a transparent display according to the present invention.

[0049] Figure 6 is a process diagram for manufacturing a second embodiment of a transparent display according to the present invention.

[0050] [Correction under Rule 91, January 14, 2025] Figure 7 is a process diagram for manufacturing a third embodiment of a transparent display according to the present invention. Figures 8a and 8b are photographs of LED lighting in a transparent LED display with and without a cover black matrix formed on the inner surface of the cover.

[0051] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0052]

[0053] Figure 2 is a cross-sectional view of a first embodiment of a transparent display according to the present invention.

[0054] One form of a transparent display according to the present invention may include a substrate (110), metal wiring (120), surface-mounted components (130), filler (140), cover black matrix (210), cover (150), etc.

[0055] The substrate (110) supports metal wiring (120) and surface-mounted components (130) that are coupled to the upper portion, and can be made of a transparent material such as transparent glass or transparent plastic film.

[0056] Considering thermal deformation, etc., it is preferable that the substrate (110) be composed of glass, tempered glass, etc. The glass may be, for example, silicate glass, borate glass, phosphate glass, etc.

[0057] The glass can be configured with a thickness of 1 to 20 mm. If the glass thickness is less than 1 mm, it may be difficult to protect the metal wiring (120) or other laminated members from external impact, and if it exceeds 20 mm, it may be disadvantageous in terms of thinning or weight reduction.

[0058] Glass may have micro-roughnesses formed on its surface to disperse the strain generated during heat treatment or cooling. These micro-roughnesses can disperse the strain that may occur during heat treatment, thereby preventing warping of the substrate (110). These micro-roughnesses may also be etched to form through-holes or micro-channels. These micro-roughnesses, through-holes, or micro-channels can enhance the adhesion of metal wiring during a subsequent metal wiring formation process.

[0059] The substrate (110) can also be a transparent plastic film. Transparent plastic films are, for example, cycloolefin derivatives having units of monomers containing cycloolefins such as norbornene or polycyclic norbornene monomers, cellulose (diacetyl cellulose, triacetyl cellulose, acetyl cellulose butyrate, isobutyl ester cellulose, propionyl cellulose, butyryl cellulose, acetyl propionyl cellulose), ethylene vinyl acetate copolymer, polyester, polystyrene, polyamide, polyetherimide, polyacrylic, polyimide, polyethersulfone, polysulfone, polyethylene, polypropylene, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyvinyl acetal, polyether ketone, polyether ether ketone, polyether sulfone, polymethyl methacrylate, It can be composed of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycarbonate, polyurethane, epoxy, etc.

[0060] The thickness of the transparent plastic film is not particularly limited, but can be configured to be 8 to 1,000 ㎛, preferably 20 to 150 ㎛. If the thickness of the transparent plastic film is less than 8 ㎛, the strength is reduced, resulting in poor processability. If the thickness exceeds 1,000 ㎛, the transparency may be reduced.

[0061]

[0062] Metal wiring (120) transmits an electric signal and can be formed on the substrate (110).

[0063] The metal wiring (120) can be composed of a conductive metal, for example, copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), tungsten (W), etc.

[0064] The metal wiring (120) can be formed using a known metal thin film process. The metal thin film process can use, for example, electroplating, electroless plating, sputtering, thermal evaporation, and electron beam evaporation.

[0065] The metal wiring (120) can be formed to a thickness of 3 to 120 μm, preferably 3 to 110 μm, and more preferably 18 to 105 μm. If the thickness of the metal wiring (120) is less than 3 μm, it may not be easy to form a uniform thin film or pattern, and if it exceeds 120 μm, it may not be suitable for application to an electronic device having a thin film structure.

[0066] The metal wiring (120) can be bonded to the substrate (110) via an adhesive layer to increase adhesion to the substrate (110).

[0067] The adhesive layer may use a silicone-based adhesive. When a glass substrate is used as the substrate (110), the silicone-based adhesive has excellent adhesive strength with the glass substrate, excellent chemical resistance to etchants, and excellent heat resistance and reliability in high temperature and high humidity environments.

[0068] The adhesive layer may be prepared from an adhesive layer composition comprising a silicone-based adhesive. The adhesive layer composition comprises a silicone-based adhesive and a solvent, and may further comprise an additive.

[0069] The silicone-based adhesive may be selected within a range that does not harm the purpose of the present invention, and may be at least one of a silicone compound and a siloxane compound.

[0070] The silicon compound may be used without particular limitation as long as it is a compound containing a silicon (Si) atom. The siloxane compound may be a compound containing a siloxane bond of a Si-O bond without limitation. More specifically, in one example of the present invention, the silicon compound and the siloxane compound may be at least one of trimethylated silica, vinyl terminated polydimethylsiloxane, hexamethyl di siloxane, trisiloxane, and tetrakis(trimethylsilyloxy)silane.

[0071] The silicone-based adhesive may preferably be included in an amount of 40% to 60% of the total weight of the adhesive layer composition, and may be added in a diluted state at a lower concentration than conventional adhesives. The adhesive layer of the present invention can maximize adhesion to a metal layer or glass substrate when bonded to the metal layer or glass substrate, thereby enabling bonding without additional treatment such as UV curing of the adhesive layer.

[0072] The solvent is not particularly limited as long as it can dilute the silicone-based adhesive, but may be, for example, toluene, xylene, PGME, and / or PGMEA. It is preferable to include the solvent in an amount of 40 to 55% of the total weight of the adhesive layer composition in terms of the stability of the adhesive coating thickness under the metal layer.

[0073] The additive may be one or more of an anchorage, a cross linker, and a catalyst.

[0074] Anchorage is added during adhesive layer coating to increase bonding strength with the metal layer, thereby preventing the adhesive layer from detaching from the metal layer. Generally, there are no specific limitations on the material used as anchorage, but it is preferable that it does not undergo thermal deformation at temperatures below 200°C.

[0075] A crosslinking agent is a substance added to chemically bond the components of the adhesive layer composition, and it is preferable that it be a product that does not undergo thermal deformation at temperatures below 200°C.

[0076] A catalyst is a component added to the adhesive layer composition for curing, and helps the adhesive layer composition transform from a liquid state to a solid state. Specific examples include a platinum catalyst, a palladium catalyst, and / or an osmium catalyst.

[0077] It is preferable from the viewpoint of adhesive stability that the additive be included in an amount of 0.1 to 10% relative to the total weight of the adhesive layer composition.

[0078] The adhesive layer may be formed by heating the adhesive layer composition to a temperature of 100 to 180°C and curing it.

[0079] The adhesive layer may have a thickness of 5 to 50 μm, preferably 5 to 30 μm, and preferably 5 to 25 μm. If the thickness of the adhesive layer is less than 5 μm, sufficient adhesive strength with other materials cannot be maintained, and if it exceeds 50 μm, there may be a disadvantage in terms of increasing the thickness of the product.

[0080] Thus, using a silicone-based adhesive with excellent chemical resistance to etchants prevents damage to the adhesive layer caused by the etchant, eliminating the need for separate intermediate layers or protective layers, which were previously required to protect the adhesive layer. This improves processability, reduces manufacturing costs, and facilitates film thinning.

[0081] Bonding of the adhesive layer and the glass substrate can be performed appropriately within a range that does not harm the purpose of the present invention, and can be performed using, for example, a laminator.

[0082]

[0083] Surface-mounted components (130) are components that are bonded (mounted) to metal wiring (120), and may include, for example, LEDs, FPCBs, etc.

[0084]

[0085] The filler (140) is bonded to the substrate (110), metal wiring (120), and surface-mounted component (130) to fill the space between the substrate (110) and the cover (150), and may be made of a transparent material.

[0086] The filler (140) may be a polymer gel such as silicone, a curing resin that is cured by heat or ultraviolet rays to change into a solid or semi-solid gel state, etc. The filler (140) may be formed by injecting a liquid having a certain viscosity between the substrate (110) and the cover (150). For example, the curing resin may be a heat-curing resin, an ultraviolet-curing resin, etc., and an ultraviolet-curing resin may be advantageous in terms of workability. The ultraviolet-curing resin may be made by mixing various acrylic units and an ultraviolet-curing catalyst with, for example, a polyurethane resin, an epoxy resin, or a polyester resin.

[0087] The filler (140) may be composed of a transparent adhesive material, for example, a transparent adhesive resin (OCR: Optical Clear Adhesive) may be used.

[0088]

[0089] The cover (150) covers and protects one side of the transparent display, and can be spaced apart from the substrate (110) with the filler (140) interposed therebetween.

[0090] The cover (150) can support a cover black matrix (210) described later on a surface facing the substrate (110).

[0091] The cover (150) may be made of a transparent material, for example, transparent glass, transparent plastic film, etc. The glass may be selected from general glass, meshed glass, colored glass, magic mirror, holographic glass, etc. The cover (150) may also be made of a glass laminate, i.e., a laminate in which two or more layers of general glass, meshed glass, colored glass, magic mirror, holographic glass, etc. are laminated.

[0092]

[0093] The cover black matrix (210) can be bonded to the filler (140), specifically, to the inner surface of the cover (150) facing the substrate (110), while covering the upper portion of the metal wiring (120) and the edge of the surface-mounted component (130).

[0094] The cover black matrix (210) can be composed of a black resin composition. The black resin composition can be a composition including a resin in which black pigment particles are dispersed, a binder resin, a polymerizable compound, a polymerization initiator, an additive, etc., or a photocurable (thermocurable) resin composition that contains a black pigment and has a black color.

[0095] The black inorganic pigment may be at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black, and the black organic pigment may be at least one selected from the group consisting of lactam black, perylene black, cyanine black, and aniline black, but is not limited thereto.

[0096] The additives may include adhesion promoters, photocrosslinking agents, curing promoters, surfactants, dispersants, antioxidants, ultraviolet absorbers, thermal polymerization inhibitors, leveling agents, and the like, and may include one or more of these.

[0097]

[0098] Table 1 below compares LED lighting photos of a transparent LED display in cases where a cover black matrix (210) is formed on the inside of the cover (150) and in cases where it is not formed.

[0099] [Correction pursuant to Rule 91, January 14, 2025]

[0100] As seen in Table 1 above, it can be confirmed that when a cover black matrix (210) is formed on a metal wiring (120), light reflection and resulting light spreading due to the metal wiring in a transparent LED display can be significantly improved.

[0101] Table 2 below shows the change in brightness (brightness change between 0 and 240 hours) of a transparent LED display after 240 hours under evaluation conditions (temperature 85°C, humidity 85%) when forming a copper wire (120) with a width of 60 μm and a thickness of 10 μm while changing the width of the cover black matrix (210) on the cover (150) (the thickness of the cover black matrix (210) is fixed at 10 μm). Here, the cover black matrix (210) is composed of Carbon Black, a binder (VORAMER TM , manufacturer: DOW), and a photoinitiator (Irugacure 907, manufacturer: Chiba Specialty Chemical (Made)) were mixed in a ratio of 5:3:2, and a mixture of PGMEA solvent, Carbon Black, a binder, and a photoinitiator was mixed in a ratio of 8:2 to prepare a liquid solution. This was uniformly applied to the upper part of the cover (150), and a black matrix pattern was produced. A cover black matrix (210) was formed using this black matrix. Here, the substrate (110) and the cover (150) were formed of glass. The gap between the copper wiring (120) and the black matrix (210) was set to 850 μm.

[0102] Cover black matrix width (㎛) luminance change rate (%) 7215.27413.5769.8787.3805.1823.8842.2861.8881.7901.7921.6941.6961.6

[0103] As seen in Table 2 above, in order to reduce the luminance change rate to less than 10%, it is desirable to form the cover black matrix (210) to be at least 8㎛ wider on one side than the width of the metal wiring (120). However, when the cover black matrix (210) is formed to be at least 13㎛ wide on one side, it was measured that the decrease (change) in the luminance change rate was extremely minimal. Therefore, it may be desirable to form the cover black matrix (210) to be at least 8 to 13㎛ wider on one side than the width of the metal wiring (120).

[0104] Table 3 below shows the change in luminance (luminance change between 0 and 240 hours) of a transparent LED display after 240 hours under evaluation conditions (temperature 85°C, humidity 85%) when forming a cover black matrix (210) with a thickness varying on a copper wire (120) having a width of 60 μm and a thickness of 10 μm (the width of the cover black matrix (210) is fixed at 80 μm). Here, the cover black matrix (210) used was the black matrix used in Table 1 above. The substrate (110) and the cover (150) were made of glass. In addition, the gap between the copper wire (120) and the black matrix (210) was set to 850 μm.

[0105] Thickness of cover black matrix (㎛) Luminance change rate (%) 113.6 39.5 58.177.0 96.1115.2 134.5 154.0 173.5 193.1212.9 232.8 252.8

[0106] As seen in Table 3 above, in order to reduce the luminance change rate to within 10%, it is desirable to form the black matrix (210) with a thickness of 3 ㎛ or more. However, when the cover black matrix (210) is formed with a thickness of 23 ㎛ or more, the decrease (change) in the luminance change rate was measured to be minimal. Therefore, it may be desirable to form the cover black matrix (210) with a thickness of 3 to 21 ㎛.

[0107] Table 4 below shows the change in luminance (luminance change between 0 and 240 hours) of a transparent LED display after 240 hours under evaluation conditions (temperature 85°C, humidity 85%), in which an LED (140) having a thickness of 700 μm, a width of 1,000 μm, and a height of 1,000 μm was mounted on a copper wire (120) having a width of 60 μm and a thickness of 10 μm, and a cover black matrix (210) having the same width was formed on the cover (150) along the edge of the LED (140), and the width of the cover black matrix (210) was changed (the thickness of the cover black matrix (210) was fixed to 10 μm). Here, the cover black matrix (210) used was the black matrix used in Table 1 above. The substrate (110) and the cover (150) were made of glass. Additionally, the gap between the LED (140) and the cover black matrix (210) was set to 100 μm.

[0108] Cover black matrix width (㎛) Luminance change rate (%) 223.54 18.36 14.88 12.210 10.31 28.6 147.4 166.8 186.5 206.3226.2246.2266.1

[0109] As seen in Table 4 above, in order to reduce the luminance change rate to within 10%, it is desirable to form the cover black matrix (210) surrounding the edge of the LED (140) with a width of 12 ㎛ or more. However, when the width of the cover black matrix (210) is formed to be 22 ㎛ or more, the decrease (change) in the luminance change rate was measured to be minimal. Therefore, it may be desirable to form the black matrix (210) surrounding the edge of the LED (140) with a width of 12 to 20 ㎛.

[0110]

[0111] Figure 3 is a cross-sectional view of a second embodiment of a transparent display according to the present invention.

[0112] As illustrated in FIG. 3, the transparent display of the second embodiment according to the present invention can further form a substrate black matrix (220) covering the lower portion of the metal wiring (120) at the lower portion of the substrate (110).

[0113] By additionally forming a substrate black matrix (220) at the bottom of the substrate (110), the widths of the cover black matrix (210) and the substrate black matrix (220) can be further reduced when the luminance change rate measured in Tables 2 and 4 above is to be reduced to within 10%. As a result, the second embodiment can increase transparency compared to the first embodiment described above.

[0114] However, even if the width of the substrate black matrix (220) in the second embodiment is configured to be the same width as the cover black matrix (210) of the first embodiment, no significant difference in transparency is observed compared to the first embodiment. Therefore, from the perspective of process convenience, it may be desirable to configure the width of the substrate black matrix (220) to be the same width as the cover black matrix (210) of the first embodiment.

[0115]

[0116] Figure 4 is a cross-sectional view of a third embodiment of a transparent display according to the present invention.

[0117] As shown in FIG. 4, the transparent display of the third embodiment according to the present invention, unlike the first embodiment, does not form a cover black matrix (210), but only forms a base black matrix (220) that covers the lower part of the metal wiring (120) under the base (110).

[0118] Even when the substrate black matrix (220) is formed only under the substrate (110), similar results to the first embodiment above can be obtained. In measurements related to the surface-mounted component (130), the third embodiment showed slightly better results in luminance change rate than the first embodiment, but transparency was slightly worse. This is interpreted to be due to the substrate black matrix (220) covering the entire lower portion of the surface-mounted component (130) area.

[0119] In the third embodiment, even if the width of the substrate black matrix (220) is configured to be the same as that of the cover black matrix (210) of the first embodiment, no significant difference occurs in the luminance change rate and transparency compared to the first embodiment. Therefore, in the third embodiment, the width of the substrate black matrix (220) can be formed to be 8 to 13 μm wider on one side than the width of the cover black matrix (210) of the first embodiment, i.e., the width of the metal wiring (120).

[0120]

[0121] Figure 5 is a process diagram for manufacturing a first embodiment of a transparent display according to the present invention.

[0122] As shown in FIG. 5, a method for manufacturing a first embodiment of a transparent display can first form a metal wire (120) on one surface of a substrate (110), as shown in FIG. 5a.

[0123] As described above, the substrate (110) can be made of transparent glass, transparent plastic film, etc.

[0124] A method for forming a metal wiring (120) on a substrate (110) may include a step of forming a metal thin film on the substrate (110), a step of forming a photoresist pattern on the metal thin film, a step of etching the metal thin film exposed to the photoresist pattern, and a step of peeling the photoresist pattern.

[0125] Metal thin films can be formed using methods such as electroplating, electroless plating, sputtering, thermal evaporation, and electron beam evaporation.

[0126] The photoresist pattern may include a step of applying a composition for forming a photoresist pattern to a metal thin film by spin coating, slit coating, inkjet printing, etc., a step of drying and heat treating the applied photoresist pattern forming composition to form a photoresist film, a step of selectively exposing / developing the photoresist film to dissolve / remove the photoresist film in an exposed area or an unexposed area, etc.

[0127] Etching of a metal thin film can be performed by dry etching, wet etching, etc. For example, wet etching can use an etchant containing at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid.

[0128] Photoresist pattern stripping can be accomplished by immersing the object on which the resist pattern is formed in a resist stripping solution, spraying the stripping solution onto the object, or other methods. After the resist stripping solution treatment, an additional cleaning process can be performed to remove any remaining stripping solution from the object. The cleaning process can use water or isopropyl alcohol instead of the stripping solution, and the process can be performed in the same manner as the stripping step.

[0129]

[0130] The second step may be to couple (mount) a surface-mount component (130) to some of the metal wiring (120), as illustrated in Fig. 5b. The surface-mount component (130) may be an LED, FPCB, or the like.

[0131]

[0132] The third step is to form a cover black matrix (210) on one side of the cover (150), as illustrated in FIG. 5c. The cover black matrix (210) is formed in a form that covers the upper portion of the metal wiring (120) and the edge of the surface-mounted component (130). When forming the cover black matrix (210) on the cover (150), it is necessary to form it in a mirror image with the edge of the metal wiring (120) and the surface-mounted component (130) in consideration of the fact that it is coupled to the substrate (110).

[0133] The cover black matrix (210) can be formed by a process such as spin coating, drying / heat treatment, exposure / development, dissolution / removal, and washing of a liquid photosensitive resin.

[0134] As described above, the cover black matrix (210) can be formed to be 8 to 13 μm wider on one side than the width of the metal wiring (120) in the metal wiring (120) area, and can be formed to be 12 to 20 μm wider from the edge of the surface-mounted component (130) in the surface-mounted component (130) area.

[0135]

[0136] The fourth step is to flip over the cover (150) on which the cover black matrix (210) is formed, as shown in FIG. 5d, so that the cover black matrix (210) faces the metal wiring (120), and then the base material (110) and the cover (150) can be spaced apart and fixed so that they face each other. The spaced-fixing of the base material (110) and the cover (150) can be accomplished through steps such as attachment and lamination of dam tape.

[0137]

[0138] In the fifth step, as illustrated in FIG. 5e, a transparent filler (140) can be injected into the space between the substrate (110) and the cover (150). Here, the filler (140) can be a known filler, for example, a curable resin such as a heat-curable or ultraviolet-curable resin, or a transparent adhesive resin (OCR) having adhesive properties.

[0139]

[0140] Figure 6 is a process diagram for manufacturing a second embodiment of a transparent display according to the present invention.

[0141] As illustrated in FIG. 6, the manufacturing method of the second embodiment may further perform a step of forming a substrate black matrix (220) covering the lower portion of the metal wiring (120) on the lower portion of the substrate (110) after the step of forming a metal wiring (120) on one surface of the substrate (110) as illustrated in FIG. 6(b), or after the step of injecting a filler (140) between the substrate (110) and the cover (150) (not illustrated).

[0142] As described above, the substrate black matrix (220) can be formed to be 8 to 13 μm wider on one side than the width of the metal wiring (120).

[0143] In the manufacturing method of the second embodiment, the remaining steps are substantially the same as the manufacturing method of the first embodiment, so the detailed description of the remaining steps is replaced with the relevant description of the manufacturing method of the first embodiment.

[0144]

[0145] Figure 7 is a process diagram for manufacturing a third embodiment of a transparent display according to the present invention.

[0146] As illustrated in FIG. 7, the manufacturing method of the third embodiment may include a step of forming a metal wiring (120) on one surface of a substrate (110) as in FIG. 7(a), a step of forming a substrate black matrix (220) that covers the metal wiring (120) on the other surface of the substrate (110) as in FIG. 7(b), a step of bonding a surface-mounted component (130) to a portion of the metal wiring (120) as in FIG. 7(c), a step of spacedly fixing a cover (150) to one surface of the substrate (110) as in FIG. 7(d), and a step of injecting a filler (140) between one surface of the substrate (110) and the cover (150) as in FIG. 7(e).

[0147] The manufacturing method of the third embodiment performs a step of forming a metal wiring (120) on one side (the upper side in FIG. 7) of a substrate (110) and forming a substrate black matrix (220) that covers the metal wiring (120) on the other side (the lower side in FIG. 7), but does not perform a step of forming a cover black matrix (210) on a cover (150).

[0148] Since the manufacturing method of the third embodiment is substantially the same as the relevant steps of the manufacturing methods of the first and second embodiments, the detailed description of each step is replaced with the relevant description of the manufacturing methods of the first and second embodiments.

[0149]

[0150] The present invention has been described in detail with several embodiments, which are intended to illustrate the invention. Those skilled in the art will readily appreciate the potential for modifications and variations to these embodiments. However, the scope of the present invention is defined by the claims below, and therefore, such modifications and variations are construed as falling within the scope of the present invention.

[0151] [Explanation of symbols]

[0152] 110: Description

[0153] 120: Metal wiring

[0154] 130: Surface-mount components

[0155] 140: Filler

[0156] 150: Cover

[0157] 210: Cover Black Matrix

[0158] 220: Black Matrix

Claims

1. Description; Metal wiring formed on the above substrate; Surface mount components that bond to some of the above metal wiring; Filler bonded to the above-mentioned substrate, metal wiring, and surface-mount components; A cover black matrix bonded onto the filler while covering the upper portion of the metal wiring and the edge of the surface-mounted component; A transparent display comprising a cover coupled to the above-described filler and cover black matrix.

2. In the first paragraph, the cover black matrix A transparent display with a line width that is 8 to 13㎛ wider on one side than the metal wiring.

3. In the first paragraph, the cover black matrix A transparent display formed with a width of 12 to 20 μm from the edge of the surface-mounted component.

4. In paragraph 1, the description is A transparent display made of glass.

5. In the first paragraph, the surface-mounted component LED, transparent display.

6. In the first paragraph, the cover A transparent display made of glass.

7. In the 6th paragraph, the glass A transparent display made of one of the following: regular glass, mesh glass, colored glass, magic mirror, or holographic glass.

8. In paragraph 6, the cover A transparent display composed of a laminate.

9. In any one of paragraphs 1 to 8, A transparent display further comprising a substrate black matrix formed on a lower portion of the substrate and covering a lower portion of the metal wiring.

10. In the 9th paragraph, the black matrix described above A transparent display with a line width that is 8 to 13㎛ wider on one side than the metal wiring.

11. In any one of paragraphs 1 to 8, A transparent display further comprising an adhesive layer bonded between the above-described substrate and the metal wiring.

12. Description; Metal wiring formed on the above substrate; Surface mount components that bond to some of the above metal wiring; Filler bonded to the above-mentioned substrate, metal wiring, and surface-mount components; a cover bonded to the above filler; and A transparent display comprising a substrate black matrix formed on the lower portion of the substrate and covering the lower portion of the metal wiring.

13. In the 12th paragraph, the black matrix described above A transparent display with a line width that is 8 to 13㎛ wider on one side than the metal wiring.

14. In paragraph 12, the description is A transparent display made of glass.

15. In paragraph 12, the surface-mounted component LED, transparent display.

16. In the 12th paragraph, the cover A transparent display made of glass.

17. In the 16th paragraph, the glass A transparent display made of one of the following: regular glass, mesh glass, colored glass, magic mirror, or holographic glass.

18. In the 16th paragraph, the cover A transparent display composed of a laminate.

19. In any one of paragraphs 12 to 18, A transparent display further comprising an adhesive layer bonded between the above-described substrate and the metal wiring.

20. A step of forming metal wiring on one side of the substrate; A step of bonding surface-mount components to some of the above metal wiring; A step of forming a cover black matrix on one side of the cover, which covers the upper part of the metal wiring and the edge of the surface-mounted component, as a mirror image of the metal wiring and the surface-mounted component; A step of turning over the cover on which the cover black matrix is ​​formed, so that one side of the substrate and one side of the cover are opposite each other and fixing the substrate and the cover apart from each other; A method for manufacturing a transparent display, comprising the step of injecting a filler between the above-mentioned substrate and the above-mentioned cover.

21. In the 20th paragraph, the step of forming a cover black matrix on the cover A method for manufacturing a transparent display, wherein the line width of a cover black matrix covering the metal wiring is formed to be 8 to 13 ㎛ wider on one side than the metal wiring.

22. In the 20th paragraph, the step of forming a cover black matrix on the cover A method for manufacturing a transparent display, wherein a cover black matrix covering the edge of the surface-mounted component is formed with a width of 12 to 20 μm from the edge of the surface-mounted component outward.

23. In paragraph 20, the step of forming a metal wiring on one side of the substrate is A method for manufacturing a transparent display, further comprising the step of forming an adhesive layer between the substrate and the metal wiring.

24. In any one of clauses 20 to 23, after the step of forming a metal wire on one side of the substrate or after the step of injecting a filler between the substrate and the cover, A method for manufacturing a transparent display, further comprising the step of forming a substrate black matrix covering a lower portion of the metal wiring on a lower portion of the substrate.

25. In the 24th paragraph, the step of forming the described black matrix is A method for manufacturing a transparent display, wherein the line width of the black matrix described above is formed to be 8 to 13㎛ wider on one side than the metal wiring.

26. A step of forming metal wiring on one side of the substrate; A step of forming a black matrix of the substrate covering the metal wiring on the other side of the substrate; A step of bonding surface-mount components to some of the above metal wiring; A step of fixing a cover to one side of the above description; A method for manufacturing a transparent display, comprising the step of injecting a filler between one side of the above-described substrate and the cover.

27. In the 26th paragraph, the step of forming the black matrix described above is A method for manufacturing a transparent display, wherein the line width of the black matrix described above is formed to be 8 to 13㎛ wider on one side than the metal wiring.

28. In the 26th or 27th paragraph, the step of forming a metal wiring on one side of the substrate is A method for manufacturing a transparent display, further comprising the step of forming an adhesive layer between the substrate and the metal wiring.

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