Display module and display apparatus

Abstract

Provided in the present disclosure are a display module and a display apparatus. The display module comprises: a control circuit board and a conductive structure, wherein the control circuit board comprises at least one conductive layer, the bottom conductive layer, which is closest to the conductive structure, among the at least one conductive layer comprises a plurality of grounding patterns, and at least some of the grounding patterns are coupled to the conductive structure. The display apparatus comprises the display module. The display module is configured to realize a display function and a communication function.

Description

Display module and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202410018548.2 filed in China on January 5, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display communication technology, and in particular to a display module and a display device. Background Art

[0004] With the continuous development of display technology, the application fields of display products are becoming increasingly broad. Consequently, the low cost and ultra-thinness of display products are attracting increasing attention. Display products generally include a control circuit board, which is typically a multi-layer circuit board. The multi-layer circuit board is used to provide corresponding signals to the display screen of the display product.

[0005] Due to the complexity of the internal circuits of the control circuit board, signal lines may be laid out on the bottom layer of the control circuit board. However, the bottom layer lacks ground plane protection, which makes the audio lines laid out on the bottom layer susceptible to radio frequency radiation interference, thereby generating current noise and affecting the normal use of the product. Summary of the Invention

[0006] The present disclosure aims to provide a display module and a display device.

[0007] In order to achieve the above objectives, the present disclosure provides the following technical solutions:

[0008] A first aspect of the present disclosure provides a display module, comprising: a control circuit board and a conductive structure, wherein the control circuit board comprises at least one conductive layer, wherein the bottom conductive layer closest to the conductive structure among the at least one conductive layer comprises a plurality of ground patterns, and at least some of the ground patterns are coupled to the conductive structure.

[0009] Optionally, the at least partial grounding pattern includes: a grounding pattern located in an edge area of ​​the control circuit board, and / or a grounding pattern located in a middle area of ​​the control circuit board; the at least partial grounding pattern is coupled to the conductive structure respectively.

[0010] Optionally, the at least partial ground pattern includes a ground pattern located in an edge area of ​​the control circuit board, and the at least partial ground pattern is arranged around a central area of ​​the control circuit board.

[0011] Optionally, the area of ​​the central portion of the control circuit board surrounded by at least part of the ground pattern is greater than or equal to 70% of the entire area of ​​the control circuit board.

[0012] Optionally, the display module further includes a housing, the control circuit board is located inside the housing, and the housing is reused as the conductive structure.

[0013] Optionally, the housing includes a conductive shell and a coating covering the surface of the conductive shell, the coating forming at least one coating opening, the coating opening exposing a portion of the conductive shell; the at least partial grounding pattern is coupled to the exposed conductive shell at the coating opening.

[0014] Optionally, the coating forms a plurality of coating openings that are independent of each other, and the plurality of coating openings correspond one-to-one to at least a portion of the grounding pattern, and the grounding pattern is coupled to the exposed conductive shell at the corresponding coating openings.

[0015] Optionally, the coating forms a coating opening, and at least part of the grounding pattern is coupled to the exposed conductive shell at the coating opening.

[0016] Optionally, the conductive structure includes an independent steel plate.

[0017] Optionally, the ground pattern is coupled to the conductive structure through conductive foam.

[0018] Based on the technical solution of the above-mentioned display module, a second aspect of the present disclosure provides a display device including the above-mentioned display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The exemplary embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation of the present disclosure. In the drawings:

[0020] FIG1 is a schematic diagram of coupling a control circuit board and a conductive structure provided by an embodiment of the present disclosure;

[0021] FIG2 is a schematic diagram of the layout of a ground pattern on a control circuit board provided by an embodiment of the present disclosure;

[0022] FIG3 is a schematic diagram showing that a housing in a communication device is reused as a conductive structure according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] In order to further illustrate the display module and display device provided by the embodiments of the present disclosure, a detailed description is given below with reference to the accompanying drawings.

[0024] Referring to Figures 1 and 2, an embodiment of the present disclosure provides a display module, including: a control circuit board 10 and a conductive structure 20, the control circuit board 10 includes at least one conductive layer, and the bottom conductive layer closest to the conductive structure 20 among the at least one conductive layer includes multiple ground patterns 40, and at least some of the ground patterns 401 are coupled to the conductive structure 20.

[0025] Exemplarily, the display module includes a display panel, a control circuit board 10 and a conductive structure 20. The control circuit board 10 is coupled to the display panel and is used to provide corresponding signals to the display panel to control the display panel to realize the display function.

[0026] Exemplarily, the control circuit board 10 includes six conductive layers, such as a Top layer, a GND layer, a Signal layer, a Power layer, a GND layer, and a Bottom layer, but is not limited thereto.

[0027] Exemplarily, the control circuit board 10 includes 8 conductive layers, such as: a Top layer, a GND layer, a Signal layer, a Power layer, a Power layer, a Signal layer, a GND layer, and a Bottom layer, but is not limited thereto.

[0028] Illustratively, the bottom conductive layer closest to the conductive structure 20 in the at least one conductive layer includes a bottom layer.

[0029] Exemplarily, the bottom conductive layer closest to the conductive structure 20 in the at least one conductive layer includes a plurality of ground patterns 40, the ground patterns 40 having a grounding property and used to transmit ground signals, and at least some of the ground patterns 401 are coupled to the conductive structure 20, so that the conductive structure 20 transmits the ground signal. It is also possible to set all the ground patterns 40 to be coupled to the conductive structure 20. As shown in FIG2 , the plurality of ground patterns 40 may also include a ground pattern 402 that is not coupled to the conductive foam 30.

[0030] Exemplarily, the display module is applied to a mobile communication device capable of implementing a GSM (Global System for Mobile Communications, which may refer to a 2G network) cellular phone.

[0031] In more detail, due to the complexity of the internal circuit of the control circuit board 10, the signal lines are arranged on the bottom layer of the control circuit board 10, and the bottom layer lacks ground plane protection, which makes the audio lines arranged on the bottom layer susceptible to radio frequency radiation interference, thereby generating current noise (TDMA noise). This current noise originates from the frequency waveform of 217 Hz or its multiples generated by the GSM cellular phone. When it couples to the audio path or speakers or microphones, it generates audible noise.

[0032] As can be seen from the specific structure of the display module described above, in the display module provided by the embodiments of the present disclosure, the control circuit board 10 is configured to include at least one conductive layer. The bottom conductive layer, of the at least one conductive layer, closest to the conductive structure 20 includes multiple ground patterns 40, with at least some of the ground patterns 401 coupled to the conductive structure 20. This configuration utilizes the conductive properties of the conductive structure 20 to create a virtual ground plane. This ground plane covers the signal lines arranged on the bottom conductive layer, thereby protecting the signal lines arranged on the bottom conductive layer from interference from radio frequency radiation and ensuring normal operation of the display product.

[0033] In the display module provided by the embodiment of the present disclosure, at least a portion of the ground pattern 401 is coupled to the conductive structure 20, so that the conductive structure 20 forms a virtual ground plane, which protects the signal lines arranged on the underlying conductive layer, and avoids adding an additional conductive layer specifically for forming a ground plane in the control circuit board 10. This method not only reduces the thickness of the control circuit board 10, which is conducive to the thinning of the display module, but also reduces the production cost of the control circuit board 10, thereby reducing the production cost of the display module.

[0034] As shown in Figures 1 and 2, in some embodiments, the at least partial grounding pattern 401 includes: a grounding pattern 40 located in an edge area of ​​the control circuit board 10, and / or a grounding pattern 40 located in a central area of ​​the control circuit board 10; the at least partial grounding pattern 401 is coupled to the conductive structure 20 respectively.

[0035] Exemplarily, the at least part of the ground pattern 401 includes: a plurality of ground patterns 40 located in the edge area of ​​the control circuit board 10 .

[0036] Exemplarily, the at least part of the ground pattern 401 includes: a plurality of ground patterns 40 located in the middle area of ​​the control circuit board 10 .

[0037] Exemplarily, the edge region surrounds the middle region, but is not limited thereto.

[0038] Exemplarily, on the control circuit board 10 , each of the ground patterns 40 is independently arranged and has ground properties.

[0039] Exemplarily, the ground pattern 40 is made of metal Cu, but is not limited thereto.

[0040] In the display module provided in the above embodiment, at least part of the grounding pattern 401 is provided to include: a grounding pattern 40 located in the edge area of ​​the control circuit board 10, and / or a grounding pattern 40 located in the middle area of ​​the control circuit board 10; so that the control circuit board 10 can be coupled to the conductive structure 20 through the grounding pattern 40 located in the middle area and / or the edge area of ​​the control circuit board 10, which not only improves the reliability of the coupling but also reduces the difficulty of implementing the coupling.

[0041] As shown in FIG1 and FIG2 , in some embodiments, the at least partial grounding pattern 401 includes a grounding pattern 40 located in an edge region of the control circuit board 10 , and the at least partial grounding pattern 401 is arranged around a central region of the control circuit board 10 .

[0042] Exemplarily, at least part of the ground patterns 401 are arranged around the central area of ​​the control circuit board 10, and there is a certain distance between adjacent ground patterns 40. For example, the distances between adjacent ground patterns 40 are the same or different.

[0043] In the display module provided by the above embodiment, by arranging at least a portion of the ground pattern 401 around the central region of the control circuit board 10, the control circuit board 10 can be coupled to the conductive structure 20 at multiple locations, ensuring that the virtual ground plane formed by the conductive structure 20 protects the control circuit board 10. Furthermore, by arranging at least a portion of the ground pattern 401 around the central region of the control circuit board 10, the control circuit board 10 can be evenly coupled to the conductive structure 20 at multiple locations, further enhancing the protective effect of the virtual ground plane formed by the conductive structure 20 on the control circuit board 10.

[0044] In addition, the at least partial grounding pattern 401 is arranged around the central area of ​​the control circuit board 10, so that the contact positions between the control circuit board 10 and the conductive structure 20 are distributed in the edge area of ​​the control circuit board 10, so that the area enclosed by the at least partial grounding pattern 401 coupled in sequence along the circumferential direction has a larger area, thereby making the area enclosed by the areas where the conductive structure 20 and the grounding pattern 40 are coupled in sequence along the circumferential direction have a larger area, further enhancing the protective effect of the virtual ground plane formed by the conductive structure 20 on the control circuit board 10.

[0045] In some embodiments, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 70% of the entire area of ​​the control circuit board 10 .

[0046] Illustratively, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 75% of the entire area of ​​the control circuit board 10 .

[0047] Illustratively, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 80% of the entire area of ​​the control circuit board 10 .

[0048] Illustratively, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 85% of the entire area of ​​the control circuit board 10 .

[0049] Illustratively, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 90% of the entire area of ​​the control circuit board 10 .

[0050] Illustratively, the area of ​​the central portion of the control circuit board 10 surrounded by at least a portion of the ground pattern 401 is greater than or equal to 95% of the entire area of ​​the control circuit board 10 .

[0051] In the display module provided by the above embodiment, by setting the area of ​​the central part of the control circuit board 10 surrounded by the at least partial grounding pattern 401 to be greater than or equal to 70% of the overall area of ​​the control circuit board 10, the contact positions of the control circuit board 10 and the conductive structure 20 are distributed in the edge area of ​​the control circuit board 10, so that the area enclosed by the at least partial grounding pattern 401 coupled in sequence along the circumferential direction has a larger area, thereby making the area enclosed by the areas coupled between the conductive structure 20 and the grounding pattern 401 coupled in sequence along the circumferential direction have a larger area, further enhancing the protective effect of the virtual ground plane formed by the conductive structure 20 on the control circuit board 10.

[0052] As shown in FIG. 1 and FIG. 3 , in some embodiments, the display module further includes a housing 60 , the control circuit board 10 is located in the housing 60 , and the housing 60 is multiplexed as the conductive structure 20 .

[0053] The above-mentioned shell 60 of the display module is reused as the conductive structure 20, so that the shell 60 can virtualize a ground plane, which covers the signal lines arranged on the bottom conductive layer to protect the signal lines arranged on the bottom conductive layer from radio frequency radiation interference, thereby ensuring the normal use of the display product.

[0054] In the display module provided in the above embodiment, by setting the shell 60 to be reused as the conductive structure 20, there is no need to add an additional conductive structure 20. This method not only reduces the overall thickness of the display module, which is conducive to the thinning of the display module, but also reduces the production cost of the display module.

[0055] As shown in Figures 1 and 3, in some embodiments, the housing 60 includes a conductive shell and a coating covering the surface of the conductive shell, the coating forming at least one coating opening 62, and the coating opening 62 exposing a portion of the conductive shell; the at least partial grounding pattern 40 is coupled to the exposed conductive shell at the coating opening 62.

[0056] Exemplarily, the conductive housing includes an aluminum housing, but is not limited thereto.

[0057] Exemplarily, the coating covers the conductive shell to prevent the conductive shell from short-circuiting with other surrounding structures.

[0058] In more detail, the conductive housing includes an aluminum housing. Utilizing the conductive properties of the aluminum housing, the coating in the area where the aluminum housing contacts the ground pattern 40 is removed, thereby forming the coating opening 62. This exposes the metal surface in the area where the aluminum housing contacts the ground pattern 40. At least a portion of the ground pattern 40 is coupled to the exposed metal surface at the coating opening 62.

[0059] In the display module provided in the above embodiment, the housing 60 is provided to include the conductive shell and the coating, and the coating forms at least one coating opening 62 capable of exposing a portion of the conductive shell. The at least partial ground pattern 401 is coupled to the exposed conductive shell at the coating opening 62, so that the conductive shell can virtually form a ground plane, which covers the signal lines arranged on the underlying conductive layer to protect the signal lines arranged on the underlying conductive layer from interference from radio frequency radiation, thereby ensuring normal use of the display product.

[0060] Moreover, except for the portion of the conductive housing coupled to the ground pattern 401 exposed by the coating opening 62 , the rest of the portion is covered by the coating, effectively preventing the conductive housing from short-circuiting with other surrounding structures and ensuring the yield of the display module.

[0061] As shown in Figures 1 and 3, in some embodiments, the coating forms a plurality of independent coating openings 62, and the plurality of coating openings 62 correspond one-to-one to the at least partial ground pattern 40, and the ground pattern 40 is coupled to the exposed conductive shell at the corresponding coating openings 62.

[0062] This arrangement ensures that the multiple coating openings 62 are formed only in the area where the ground pattern 40 is to be coupled to the conductive housing. The coating still covers the conductive housing in other areas. For example, the coating covers the portion of the conductive housing between two adjacent areas, and the coating covers the portion of the conductive housing between any two areas. This arrangement effectively prevents short circuits between the conductive housing and the control circuit board 10 in other areas, thereby ensuring the yield of the display module.

[0063] In some embodiments, the coating forms a coating opening 62 , and at least a portion of the ground pattern 401 is coupled to the exposed conductive housing at the coating opening 62 .

[0064] Exemplarily, the size of the one coating opening 62 is relatively large, and the orthographic projection of the at least part of the grounding pattern 401 on the shell 60 is located inside the one coating opening 62 and is surrounded by the one coating opening 62, so that the at least part of the grounding pattern 401 can be coupled to the exposed conductive shell at the coating opening 62.

[0065] The above configuration ensures the connection performance between at least part of the ground pattern 401 and the conductive housing, so that the conductive housing can better protect the signal lines arranged on the bottom conductive layer from radio frequency radiation interference, ensuring the normal use of the display product.

[0066] In more detail, the formation process of the display module is as follows:

[0067] The control circuit board 10 is designed to have multiple ground patterns 40 arranged on the bottom conductive layer. The ground patterns 40 comprise copper metal patterns and have grounding properties. The multiple ground patterns 40 can be positioned accordingly based on actual circuit requirements. At least a portion of the multiple ground patterns 401 surrounds the central region of the control circuit board 10, forming the exposed copper region of the control circuit board 10 and coupling to the conductive housing.

[0068] Select a conductive foam 30 with good electrical properties and attach it to the exposed copper area on the control circuit board 10. The better the conductivity of the conductive foam 30, the better the shielding of the virtual ground plane formed by the conductive shell, and the stronger the resistance to radio frequency radiation interference.

[0069] The housing 60 is designed such that the coating on the surface of the conductive shell is removed in the area where the conductive shell is coupled to the ground pattern 401 to form the coating opening 62 . The coating opening 62 exposes the conductive shell in the coupled area.

[0070] The control circuit board 10 is installed in the housing 60. The ground pattern 401 in the control circuit board 10 is coupled to the conductive shell exposed by the coating opening 62 through the conductive foam 30. The conductive shell forms a virtual ground plane to protect the signal lines arranged on the bottom conductive layer from radio frequency radiation interference.

[0071] Measure the TDMA noise of the entire device and optimize the signal transmission (TX) and signal reception (RX) indicators by 15dB.

[0072] As shown in Table 1 and Table 2, it should be noted that the B shell is the aluminum shell. The mobile communication device also includes a speaker 50, a battery 51, a camera 52 and a control circuit board installation area 61.

[0073] As shown in Table 1, when the display module is applied to a mobile communication device, the following sets of data are tested in speaker mode:

[0074] In 2G call mode (GSM850), with a maximum signal transmit power of PCL = 5, the TX and RX TDMA noise of channels 128, 190, and 251 were tested. The TDMA noise of the TX and RX signals was measured when the B shell was uncoated and without conductive foam. The TDMA noise of the TX and RX signals was also measured when the B shell was uncoated and the motherboard (i.e., the control circuit board) was coupled to the B shell via conductive foam. For example, the network device may be, but is not limited to, Global System of Mobile communications (GSM).

[0075] In 2G call mode (GSM900), with a maximum signal transmit power of PCL = 5, the TX and RX TDMA noise of channels 1, 62, and 124 were tested. The TDMA noise of the TX and RX signals was measured with the B case uncoated and without conductive foam. The TDMA noise of the TX and RX signals was also measured with the B case uncoated and the motherboard coupled to the B case via conductive foam.

[0076] Tested the TX and RX TDMA noise on channels 512, 700, and 885 in the 2G operating frequency band (DCS1800) with maximum signal transmit power PCL = 0. The noise was measured with the B case uncoated and without conductive foam. The noise was also measured with the B case uncoated and the motherboard coupled to the B case via conductive foam.

[0077] The 2G network operates in the frequency band (PCS1900) and has a maximum transmit power of PCL = 0. TDMA noise on channels 512, 700, and 885 is measured. The TDMA noise on both TX and RX signals is measured with the B-shell uncoated and without conductive foam. The TDMA noise on both TX and RX signals is also measured with the B-shell uncoated and the motherboard coupled to the B-shell via conductive foam.

[0078] Table 1

[0079] As shown in Table 2, when the display module is applied to a mobile communication device, the following sets of data are tested in the headset mode:

[0080] In 2G call mode (GSM850), with a maximum signal transmit power of PCL = 5, the TX and RX TDMA noise of channels 128, 190, and 251 were tested. The TDMA noise of the TX and RX signals was measured with the B shell uncoated and without conductive foam. The TDMA noise of the TX and RX signals was also measured with the B shell uncoated and the motherboard (i.e., control circuit board) coupled to the B shell via conductive foam.

[0081] In 2G call mode (GSM900), with a maximum signal transmit power of PCL = 5, the TX and RX TDMA noise of channels 1, 62, and 124 were tested. The TDMA noise of the TX and RX signals was measured with the B case uncoated and without conductive foam. The TDMA noise of the TX and RX signals was also measured with the B case uncoated and the motherboard coupled to the B case via conductive foam.

[0082] Tested the TX and RX TDMA noise on channels 512, 700, and 885 in the 2G operating frequency band (DCS1800) with maximum signal transmit power PCL = 0. The noise was measured with the B case uncoated and without conductive foam. The noise was also measured with the B case uncoated and the motherboard coupled to the B case via conductive foam.

[0083] The 2G network operates in the frequency band (PCS1900) and has a maximum transmit power of PCL = 0. TDMA noise on channels 512, 700, and 885 is measured. The TDMA noise on both TX and RX signals is measured with the B-shell uncoated and without conductive foam. The TDMA noise on both TX and RX signals is also measured with the B-shell uncoated and the motherboard coupled to the B-shell via conductive foam.

[0084] Table 2

[0085] In some embodiments, the conductive structure comprises a separate steel plate.

[0086] Exemplarily, the area of ​​the steel plate is greater than or equal to the area of ​​the surface of the control circuit board facing the steel plate. This arrangement allows the steel plate to better cover the signal lines arranged on the bottom conductive layer, thereby protecting the signal lines arranged on the bottom conductive layer from radio frequency radiation interference, ensuring normal use of the display product.

[0087] In some embodiments, the ground pattern is coupled to the conductive structure through conductive foam.

[0088] Conductive foam has good electrical conductivity, diverse structures, and is easy to install. The above arrangement not only enables good electrical connection between the ground pattern and the conductive structure, but also reduces the difficulty of connecting the ground pattern and the conductive structure.

[0089] An embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module.

[0090] It should be noted that the display device can be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device also includes a flexible circuit board, a printed circuit board and a backplane.

[0091] Exemplarily, the display device includes an organic light emitting diode display device, a liquid crystal display device, etc., but is not limited thereto. The control circuit board can serve as a main board in the display device.

[0092] In the display module provided in the above embodiment, the control circuit board is configured to include at least one conductive layer. The bottom conductive layer closest to the conductive structure includes multiple ground patterns, at least some of which are coupled to the conductive structure. This configuration utilizes the conductive properties of the conductive structure to create a virtual ground plane. This ground plane covers the signal lines arranged on the bottom conductive layer, thereby protecting the signal lines arranged on the bottom conductive layer from interference from radio frequency radiation and ensuring normal operation of the display product.

[0093] In the display module provided by the above embodiment, at least part of the grounding pattern is coupled to the conductive structure, so that the conductive structure forms a virtual ground plane, which protects the signal lines laid out on the underlying conductive layer, and avoids adding an additional conductive layer specifically for forming a ground plane in the control circuit board. This method not only reduces the thickness of the control circuit board, which is conducive to the thinning of the display module, but also reduces the production cost of the control circuit board, thereby reducing the production cost of the display module.

[0094] The display device provided by the embodiment of the present disclosure also has the above-mentioned beneficial effects when including the above-mentioned display module, which will not be described in detail here.

[0095] It should be noted that the "same layer" in the embodiment of the present disclosure may refer to a film layer on the same structural layer. Or, for example, a film layer in the same layer may be a film layer formed by using the same film forming process to form a specific pattern, and then patterning the film layer using the same mask through a single composition process to form a layer structure. Depending on the specific pattern, a single composition process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0096] It should be noted that the signal line extending along the X-direction means that the signal line includes a main portion and a secondary portion connected to the main portion, the main portion is a line, a line segment, or a strip-shaped body, the main portion extends along the X-direction, and the length of the main portion extending along the X-direction is greater than the length of the secondary portion extending along other directions.

[0097] In the various method embodiments of the present disclosure, the serial numbers of the steps cannot be used to limit the order of the steps. For ordinary technicians in this field, without paying any creative work, changes to the order of the steps are also within the scope of protection of the present disclosure.

[0098] It should be noted that the various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences from other embodiments. In particular, the method embodiments are described briefly because they are generally similar to the product embodiments. For relevant parts, refer to the description of the product embodiments.

[0099] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meanings understood by persons having ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "connect", "couple" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0100] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0101] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0102] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0103] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included within the scope of protection of the present disclosure. Certain improvements and modifications can be made without departing from the principles described in this disclosure, and such improvements and modifications are also within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, comprising: Control circuit board and conductive structure, the control circuit board includes at least one conductive layer, and the bottom conductive layer closest to the conductive structure in the at least one conductive layer includes a plurality of grounding patterns, and at least part of the grounding patterns are coupled to the conductive structure.

2. The display module according to claim 1, wherein, The at least part of the grounding patterns includes: grounding patterns located in the edge area of the control circuit board, and / or grounding patterns located in the middle area of the control circuit board; the at least part of the grounding patterns are respectively coupled to the conductive structure.

3. The display module according to claim 2, wherein, The at least part of the grounding patterns includes grounding patterns located in the edge area of the control circuit board, and the at least part of the grounding patterns are arranged around the middle area of the control circuit board.

4. The display module according to claim 3, wherein, The area of the central part of the control circuit board surrounded by the at least part of the grounding patterns is greater than or equal to 70% of the overall area of the control circuit board.

5. The display module according to any one of claims 1 to 4, wherein, The display module further includes a housing, the control circuit board is located inside the housing, and the housing is reused as the conductive structure.

6. The display module according to claim 5, wherein, The housing includes a conductive shell and a coating covering the surface of the conductive shell, the coating forms at least one coating opening, and the coating opening exposes part of the conductive shell; The at least part of the grounding patterns are coupled to the exposed conductive shell at the coating opening.

7. The display module according to claim 6, wherein, The coating forms a plurality of independent coating openings, and the plurality of coating openings correspond to the at least part of the grounding patterns one by one, and the grounding patterns are coupled to the exposed conductive shell at the corresponding coating openings.

8. The display module according to claim 6, wherein The coating forms one coating opening, and the at least part of the grounding patterns are all coupled to the exposed conductive shell at the coating opening.

9. The display module according to claim 1, wherein, The conductive structure includes an independent steel plate.

10. The display module according to any one of claims 1 to 4, wherein, The grounding patterns are coupled to the conductive structure through conductive foam.

11. A display device, including the display module according to any one of claims 1 to 10.

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