Refrigerator

Abstract

This refrigerator comprises: a storage chamber formed inside a main body; a thermoelectric element provided to cool the storage chamber; a sink base provided to be in contact with the thermoelectric element; a heat sink including a plurality of fins protruding from one surface of the sink base; and a temperature sensor provided to measure the temperature of the heat sink and including a sensor member and an electric wire. The heat sink includes a sensor accommodation groove formed to be recessed on one surface of the sink base, and the sensor member is accommodated in the sensor accommodation groove.

Description

refrigerator

[0001] The present disclosure relates to a refrigerator, and more particularly, to a refrigerator having a thermoelectric module for cooling a storage compartment.

[0002] A refrigerator is a home appliance that has a main body having a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.

[0003] A thermoelectric module, which generates heat and cooling through the Peltier effect of a thermoelectric element, can be used as a cooling device in a refrigerator. The thermoelectric element has a heat generating portion formed on one side and a heat absorbing portion formed on the opposite side. When current is applied to the thermoelectric element, heat generation occurs in the heat generating portion and heat absorption occurs in the heat absorbing portion.

[0004] A thermoelectric module may include a heat sink in contact with a heat generating portion and a cooling sink in contact with a heat absorbing portion to increase the efficiency of the heat generating and heat absorbing actions of the thermoelectric element. The heat sink may be provided with a temperature sensor for measuring the temperature of the heat sink, and the cooling sink may be provided with a temperature sensor for measuring the temperature of the cooling sink.

[0005] One aspect of the present disclosure discloses an improved thermoelectric module and a refrigerator having the same, wherein a temperature sensor is stably fixed to a heat sink or a cooling sink.

[0006] One aspect of the present disclosure is to disclose an improved thermoelectric module and a refrigerator having the same for improving the accuracy of temperature measurement of a heat sink or a cooling sink.

[0007] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0008] According to one embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment formed inside the main body; a thermoelectric element configured to cool the storage compartment; a heat sink configured to contact the thermoelectric element and including a sink base and a plurality of fins protruding from one surface of the sink base; a temperature sensor configured to measure a temperature of the heat sink and including a sensor member and a wire connected to the sensor temperature member; and a sensor fastening member coupled to the heat sink by penetrating the sensor member to fix the sensor member; wherein the heat sink includes a sensor receiving groove formed to be recessed into one surface of the sink base, and the sensor member is received in the sensor receiving groove.

[0009] The plurality of pins may include an outermost pin positioned closest to an edge of one side of the sink base among the plurality of pins, and the sensor receiving groove may be formed between the edge of one side of the sink base and the outermost pin.

[0010] The plurality of pins protrude in a first direction perpendicular to one surface of the sink base, the plurality of pins each extend in a second direction perpendicular to the first direction, and the plurality of pins can be arranged to be spaced apart from each other along a third direction perpendicular to the first direction and the second direction.

[0011] The above sensor receiving groove can be formed along the second direction.

[0012] The above sensor member may have a rectangular parallelepiped shape.

[0013] At least three surfaces of the sensor member can be supported on the inner surface of the sensor receiving groove.

[0014] The inner surface of the sensor receiving groove may include a bottom surface, a first side surface extending vertically from the bottom surface, and a second side surface extending vertically from the bottom surface and parallel to the first side surface.

[0015] The first side surface may be formed on the same plane as the side surface of any one of the plurality of fins.

[0016] The above sensor member may be formed of the same material as the above heat sink.

[0017] The above sensor member may be placed next to the outermost pin among the plurality of pins.

[0018] The sensor member may include a sensor penetration hole formed so that the sensor fastening member penetrates therethrough.

[0019] The above heat sink may include a sensor coupling hole to which the sensor fastening member is coupled.

[0020] The sensor fastening member includes a head portion and a fastening member body portion having a diameter smaller than the head portion, and the refrigerator may further include a rubber ring provided between the head portion and the sensor member.

[0021] The refrigerator may further include a thermally conductive tape, a portion of which is adhered to at least one surface of the sensor member and another portion of which is adhered to at least one surface of the heat sink, to secure the sensor member to the sensor receiving groove.

[0022] The above heat sink can be formed by extrusion along the second direction.

[0023] In another aspect, according to an embodiment of the present disclosure, a refrigerator includes a main body; a storage compartment formed inside the main body; a thermoelectric element configured to cool the storage compartment; a heat sink configured to contact the thermoelectric element and including a sink base and a plurality of fins protruding from one surface of the sink base; and a temperature sensor configured to measure a temperature of the heat sink and including a sensor member and a wire connected to the sensor temperature member; wherein a plurality of channels are formed between the plurality of fins, and the sensor member is provided on one surface of the sink base and is disposed in one of the plurality of channels.

[0024] The above plurality of channels may include basic channels and at least one wide channel having a width greater than the basic channels.

[0025] The sensor member is disposed in the basic channel and can be supported between the first pin and the second pin forming one of the basic channels.

[0026] The sensor member may be positioned in at least one of the wide channels.

[0027] The refrigerator further includes a module plate supporting the heat sink; a module fastening member for connecting the heat sink and the module plate; and a washer member provided between the head of the module fastening member and the heat sink and arranged in the wide channel; wherein the fastening member can be connected to the washer member.

[0028] According to one embodiment of the present disclosure, a temperature sensor can be stably secured to a heat sink or cooling sink.

[0029] According to one embodiment of the present disclosure, the accuracy of temperature measurement of a heat sink or cooling sink through a temperature sensor can be improved.

[0030] According to one embodiment of the present disclosure, corrosion can be prevented from occurring due to contact between a temperature sensor and a heat sink or between a temperature sensor and a cooling sink.

[0031] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0032] FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure.

[0033] FIG. 2 is a drawing showing the doors of a refrigerator in an open state according to one embodiment of the present disclosure.

[0034] FIG. 3 is a drawing illustrating a storage compartment of a refrigerator according to one embodiment of the present disclosure.

[0035] FIG. 4 is a schematic cross-sectional side view of a refrigerator according to one embodiment of the present disclosure.

[0036] Figure 5 is a cross-sectional view taken along line I-I of Figure 2.

[0037] FIG. 6 is a drawing showing a top cover and a thermoelectric module assembly separated from the main body of a refrigerator according to one embodiment of the present disclosure.

[0038] FIG. 7 is a drawing illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to one embodiment of the present disclosure.

[0039] FIG. 8 is a bottom perspective view illustrating a heat dissipation duct cover, a heat dissipation duct body, and a thermoelectric module according to one embodiment of the present disclosure.

[0040] FIG. 9 is a perspective view illustrating an exploded view of a thermoelectric module according to one embodiment of the present disclosure.

[0041] FIG. 10 is a bottom perspective view illustrating an exploded view of a thermoelectric module according to one embodiment of the present disclosure.

[0042] FIG. 11 is a cross-sectional view of a heat dissipation duct and a thermoelectric module according to one embodiment of the present disclosure.

[0043] FIG. 12 is a perspective view illustrating a combined structure of a temperature sensor and a heat sink according to one embodiment of the present disclosure.

[0044] FIG. 13 is an enlarged view of a temperature sensor according to one embodiment of the present disclosure.

[0045] Fig. 14 is a cross-sectional view showing the combined structure of the temperature sensor and heat sink of Fig. 12.

[0046] FIG. 15 is a perspective view illustrating a combined structure of a temperature sensor and a cooling sink according to one embodiment of the present disclosure.

[0047] FIG. 16 is a perspective view illustrating a structure in which a temperature sensor is coupled to a heat sink via a thermally conductive tape according to one embodiment of the present disclosure.

[0048] Fig. 17 is a cross-sectional view showing a structure in which the temperature sensor of Fig. 16 is coupled to a heat sink through a thermal conductive tape.

[0049] FIG. 18 is a front view illustrating a combined structure of a temperature sensor and a heat sink according to one embodiment of the present disclosure.

[0050] FIG. 19 is a front view illustrating a combined structure of a temperature sensor and a heat sink according to one embodiment of the present disclosure.

[0051] FIG. 20 is a perspective view illustrating a combined structure of a temperature sensor, a heat sink, and a washer member according to one embodiment of the present disclosure.

[0052] Fig. 21 is a cross-sectional view showing the combined structure of the temperature sensor, heat sink, and washer member of Fig. 20.

[0053] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

[0054] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0055] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0056] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0057] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0058] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0059] In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0060] Terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0061] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0062] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0063] A refrigerator according to one embodiment may include a body.

[0064] The body may include insulation. The insulation may insulate the interior and exterior of the storage compartment so that the temperature inside the storage compartment can be maintained at a set temperature without being affected by the external environment of the storage compartment. In one embodiment, the insulation may include a foam insulation, such as polyurethane foam. In another embodiment, the insulation may additionally include a vacuum insulation in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation instead of the foam insulation.

[0065] A storage room can store various items such as food, medicine, and cosmetics, and the storage room can be formed so that at least one side is open for taking items in and out.

[0066] A refrigerator may include one or more storage compartments. When a refrigerator includes two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.

[0067] The storage room may be designed to maintain an appropriate temperature range depending on its intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished by their intended use and / or temperature range. A refrigerator may be maintained at a temperature appropriate for refrigerating items, and a freezer may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them frozen, and for example, a freezer may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. A variable temperature room may be used as either a refrigerator or a freezer, at the user's option or not.

[0068] In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.

[0069] In one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the main body in a pivotal or sliding manner.

[0070] The door may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to the body, to insulate the storage compartment when the door is closed.

[0071] According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.

[0072] The door inner panel may be provided with a gasket that seals the storage compartment by contacting the front of the body when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.

[0073] In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.

[0074] Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.

[0075] According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.

[0076] The cold air supply device may include a system of machines, devices, electronic devices and / or combinations thereof that can generate cold air and guide the cold air to cool the storage room.

[0077] In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.

[0078] According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.

[0079] The machine room may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to be connected to the exterior of the main body to dissipate heat from components placed within the machine room.

[0080] In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and / or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.

[0081] In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.

[0082] According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.

[0083] The control unit may include a memory that stores or memorizes a program and / or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and / or data memorized in the memory.

[0084] Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.

[0085] The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.

[0086] Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and / or data stored / stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.

[0087] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.

[0088] In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.

[0089] The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0090] The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.

[0091] The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.

[0092] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the attached drawings.

[0093] FIG. 1 is a drawing illustrating a refrigerator according to an embodiment of the present disclosure. FIG. 2 is a drawing illustrating a state in which doors of a refrigerator according to an embodiment of the present disclosure are opened. FIG. 3 is a drawing illustrating a storage compartment of a refrigerator according to an embodiment of the present disclosure. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to an embodiment of the present disclosure. FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2. FIG. 6 is a drawing illustrating a top cover and a thermoelectric module assembly separated from a main body of a refrigerator according to an embodiment of the present disclosure. FIG. 7 is a drawing illustrating a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module according to an embodiment of the present disclosure. FIG. 8 is a bottom perspective view illustrating a heat dissipation duct cover, a heat dissipation duct body, and a thermoelectric module according to an embodiment of the present disclosure.

[0094] Referring to FIGS. 1 to 8, a refrigerator (1) may include a main body (100), storage chambers (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage chambers (11, 12, 13).

[0095] The main body (100) may include an inner case (170), an outer case (180) coupled to the outer side of the inner case (170), and an insulating material (190) provided between the inner case (170) and the outer case (180). The inner case (170) may form a storage chamber (11, 12, 13), and the outer case (180) may form the outer appearance of the main body (100). The insulating material (190) may be a urethane foam insulating material.

[0096] In another aspect, the main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150). The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface (111), a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.

[0097] The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may each be formed of an inner surface (170), an outer surface (180), and an insulating material (190). For example, the upper surface (111) of the upper wall (110) is formed by the outer surface (180), the lower surface of the upper wall (110) is formed by the inner surface (170), and an insulating material (190) may be provided on the inside of the upper wall (110).

[0098] The upper wall (110) may include an installation opening (115, FIG. 6). The storage chamber (11) and the exterior of the main body (100) may be connected through the installation opening (115). At least a portion of the thermoelectric module (500), which will be described later, may be placed inside the installation opening (115). The thermoelectric module (500) may be placed so as to penetrate the installation opening (115).

[0099] The storage compartments (11, 12, 13) can accommodate items. The storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out. The main body (100) can include a horizontal partition wall (160) that divides the storage compartments (11, 12, 13) into a first storage compartment (11) at the top and lower storage compartments (12, 13), and a vertical partition wall (161) that divides the lower storage compartments (12, 13) into a second storage compartment (12) and a third storage compartment (13). The first storage compartment (11) can be a refrigerator compartment, the second storage compartment (12) can be a freezer compartment, and the third storage compartment (13) can be a variable temperature room.

[0100] Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13). The first door (21) and the second door (22) can open and close the first storage room (11), the third door (23) can open and close the second storage room (12), and the fourth door (24) can open and close the third storage room (13). The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).

[0101] The doors (21, 22, 23, 24) may be rotatably coupled to the main body (100) by hinges. For example, the first door (21) and the second door (22) may be rotatably coupled to the main body (100) by a hinge (31) provided on the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively. The hinge (31) may include a hinge pin that protrudes vertically to form a rotational axis of the door. The hinge (31) may be covered by a top cover (300) provided to cover a front portion of the upper surface (111) of the main body (100).

[0102] A rotating bar (40) may be provided on either the first door (21) or the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed. The rotating bar (40) may be provided rotatably on either the first door (21) or the second door (22). The rotating bar (40) may have a rod shape that is formed long in a vertical direction. The rotating bar (40) may also be referred to as a pillar, a mullion, or the like.

[0103] A guide protrusion (46) may be provided at the top of the rotating bar (40), and a rotation guide (119) that guides the rotation of the guide protrusion (46) may be provided at the top of the main body (100).

[0104] The doors (21, 22, 23, 24) may include a gasket (51). The gasket (51) may be provided on the back surface of the doors (21, 22, 23, 24). The gasket (51) may be in close contact with the front surface of the body (100) when the doors (21, 22, 23, 24) are closed. The doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward. A door shelf (53) capable of storing items may be mounted on the ditch (52). A rotating bar (40) may be rotatably installed on the ditch (52).

[0105] Although the number and arrangement of storage compartments and the number and arrangement of doors have been described above, there is no limitation on the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure.

[0106] The refrigerator (1) may include a thermoelectric cooling device (400) arranged to cool the storage compartment (11).

[0107] A thermoelectric cooling device (400) may be provided on the upper side of the storage room (11) to cool the storage room (11). That is, the thermoelectric cooling device may be provided on the upper wall (110) of the main body (100).

[0108] A thermoelectric cooling device (400) may include a thermoelectric module assembly (450). The thermoelectric module assembly (450) may include a thermoelectric module (500) and a heat dissipation duct (700). The thermoelectric module (500) and the heat dissipation duct (700) may be assembled together to form a thermoelectric module assembly (450).

[0109] The thermoelectric module assembly (450) can be coupled from top to bottom to the upper wall (110) of the main body (100). After the thermoelectric module assembly (450) is coupled from top to bottom to the upper wall (110) of the main body (100), a cooling duct (900), which will be described later, can be coupled from bottom to top to the lower surface of the upper wall (110) of the main body (100).

[0110] The thermoelectric module assembly (450) can be coupled to the upper wall (110) of the main body (100) by at least one fastening member (S2, FIG. 6). The at least one fastening member (S2) can be a mechanical element for coupling, such as a screw, a bolt, or the like.

[0111] A thermoelectric module (500) may include a thermoelectric element (530), a heat sink, and a module plate (550). The heat sink may include a heat dissipation sink (520) and a cooling sink (570).

[0112] A thermoelectric element (530) may be a semiconductor element that converts thermal energy into electrical energy using the thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, etc.

[0113] The thermoelectric element (530) may include a heat generating portion (531) and a heat absorbing portion (532). When current is applied to the thermoelectric element (530), a heat generating action may occur in the heat generating portion (531) and a heat absorbing action may occur in the heat absorbing portion (532). The thermoelectric element (530) may have a thin hexahedral shape. The heat generating portion (531) may be provided on one surface of the thermoelectric element (530) and the heat absorbing portion (532) may be provided on the opposite surface.

[0114] The thermoelectric element (530) may be provided on the upper wall (110) such that the heating portion (531) faces above the thermoelectric element (530) and the heat absorption portion (532) faces below the thermoelectric element (530). That is, the heating portion (531) faces the outside of the main body (100), and the heat absorption portion (532) may face the inside of the storage chamber (11) through the installation hole (115) of the upper wall (110). Accordingly, air that has been warmed through heat exchange with the heating portion (531) can be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the heat absorption portion (532) can be supplied to the storage chamber (11) to cool the storage chamber (11).

[0115] The heat sink (520) can contact the heat generating part (531) to absorb the heat of the heat generating part (531) and release the heat to the outside of the main body (100). The heat sink (520) may also be referred to as a hot sink, a heat dissipation heat sink, a hot heat sink, etc.

[0116] The heat sink (520) may be formed of a metal material with good thermal conductivity. For example, the heat sink (520) may be formed of aluminum or copper.

[0117] The heat sink (520) may include a heat sink base (521) that contacts the heat generating portion (531) and a plurality of heat sink fins (525) that protrude from the heat sink base (521) to expand the heat transfer area.

[0118] The heat sink base (521) is arranged horizontally, and a plurality of heat sink fins (525) can protrude upward from the heat sink base (521). The heat sink base (521) and the plurality of heat sink fins (525) can be formed integrally.

[0119] The cooling sink (570) can cool the storage room (11) by taking away heat from the storage room (11) and transferring it to the heat absorbing part (532). The cooling sink (570) may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc.

[0120] The cooling sink (570) may be formed of a metal material with good thermal conductivity. For example, the cooling sink (570) may be formed of aluminum or copper.

[0121] The cooling sink (570) may include a cooling sink base (571) that contacts the heat absorbing portion (532) and a plurality of cooling fins (575) that protrude from the cooling sink base (571) to expand the heat transfer area. The cooling sink base (571) is arranged horizontally, and the plurality of cooling fins (525) may protrude downward from the cooling sink base (571). The cooling sink base (571) and the plurality of cooling fins (575) may be formed integrally.

[0122] The module plate (550) can support a heat sink (520) and a cooling sink (570). The heat sink (520) can be placed on one side of the module plate (550) and the cooling sink (570) can be placed on the other side of the module plate (570). That is, the heat sink (520) can be placed on the upper side of the module plate (550) and the cooling sink (570) can be placed on the lower side of the module plate (550).

[0123] The thermoelectric module (500) may include a heat dissipation fan (600) that circulates air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100). The heat dissipation fan (600) may be arranged to blow air toward the heat dissipation sink (520). The heat dissipation fan (600) may be arranged to be positioned horizontally with respect to the heat dissipation sink (520).

[0124] The heat dissipation fan (600) may be a centrifugal fan that draws in air in an axial direction and discharges it in radial directions. The centrifugal fan may include a blower fan. The rotation axis (610) of the heat dissipation fan (600) may be arranged vertically. The heat dissipation fan (600) may be installed in a fan case (650). The fan case (650) and the module plate (550) may be formed integrally. However, unlike the present embodiment, the fan case (650) and the module plate (550) may be formed separately.

[0125] The heat dissipation duct (700) can guide air outside the main body (100) to exchange heat with the heat dissipation sink (520), and guide air that has exchanged heat with the heat dissipation sink (520) to be discharged back to the outside of the main body (100).

[0126] A heat dissipation duct (700) may be coupled to the upper side of a thermoelectric module (500). A duct coupling portion (722) may be provided on the heat dissipation duct body (720), and a module coupling portion (651) may be provided on the thermoelectric module (500). The duct coupling portion (722) and the module coupling portion (651) may be coupled in a hook or fitting manner. In FIGS. 7 and 8, the module coupling portion (651) is illustrated as being provided on the fan case (650), but the module coupling portion (651) may also be provided on the module plate (550).

[0127] The heat dissipation duct (700) may include a heat dissipation duct body (720), a heat dissipation duct cover (710), and an extension duct (740).

[0128] A heat dissipation duct cover (710) may be coupled to the upper portion of the heat dissipation duct body (720) so as to cover the upper portion of the heat dissipation duct body (720). A duct cover coupling portion (711) may be provided on the heat dissipation duct cover (710), and a duct body coupling portion (721) coupled to the duct cover coupling portion (711) may be provided on the heat dissipation duct body (720). The duct cover coupling portion (711) and the duct body coupling portion (721) may be coupled in a hook or fitting manner.

[0129] An extension duct (740) may be provided in front of the heat dissipation duct body (720) so as to be connected to the heat dissipation duct body (720). The extension duct (740) may be formed separately from the heat dissipation duct body (720). However, alternatively, the extension duct (740) may be formed integrally with the heat dissipation duct body (720).

[0130] The extension duct (740) can be placed under the top cover (300) and can be coupled to the lower part of the top cover (300). For this purpose, the extension duct (740) can be provided with an extension duct coupling portion (745) coupled to the top cover (300).

[0131] A heat dissipation duct body (720) may be provided on the upper side of the thermoelectric module (500) to cover the heat dissipation fan (600) and the heat dissipation sink (520). An outside air intake port (751) is formed on the upper surface of the front portion of the heat dissipation duct body (720), and the outside air intake port (751) may be covered by a top cover (300) to be described later.

[0132] The heat dissipation duct (700) may include outside air outlets (782, 794) that discharge air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100). The outside air outlets (782, 794) may include a first outside air outlet (782) that discharges warm air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100), and a second outside air outlet (794) that discharges the warm air toward the rotating bar (40).

[0133] The heat dissipation duct body (720) may include a first external air discharge port (782). The first external air discharge port (782) may include a connection port (784) provided to guide air inside the heat dissipation duct (700) to the inside of the top cover (300), and an external discharge port (783) provided to be separated from the connection port (784) to discharge air in the heat dissipation duct (700) to the outside of the top cover (300).

[0134] High-temperature air guided into the interior of the top cover (300) through the connection port (784) can heat the upper surface (111) of the main body (100) while passing through the interior of the top cover (300). Therefore, condensation can be prevented from occurring on the upper front surface of the main body (100).

[0135] A grill may be formed in the external exhaust port (783) to prevent foreign substances from entering the interior of the heat dissipation duct (700) through the external exhaust port (783).

[0136] The extension duct (740) may include a second external air outlet (794). High temperature air discharged toward the rotary bar (40) through the second external air outlet (794) may heat the rotary bar (40). Accordingly, condensation may be prevented from occurring on the rotary bar (40).

[0137] However, the heat dissipation duct (700) does not have to include both the first outdoor air discharge port (782) and the second outdoor air discharge port (794), and depending on the embodiment, the second outdoor air discharge port (794) may be omitted.

[0138] Additionally, the first external air discharge port (782) of the heat dissipation duct (700) does not have to include both a connection port (784) and an external discharge port (783), and depending on the embodiment, the connection port (784) may be omitted.

[0139] The heat dissipation duct body (720) may include a fan accommodation space (762) that accommodates a heat dissipation fan (600). The fan accommodation space (762) may be formed on the bottom surface of the heat dissipation duct body (720). The heat dissipation duct body (720) may include a fan inlet (761) through which air is introduced into the fan accommodation space (762).

[0140] The heat dissipation duct body (720) may include a sink accommodation space (771) formed on the downstream side of the fan accommodation space (762) to accommodate a heat dissipation sink (520).

[0141] The heat dissipation duct body (720) may include an intake space (752) formed on an upper surface of the heat dissipation duct body (720) to guide air sucked in through an outside air intake port (751) to a fan receiving space (762). The upper side of the intake space (752) may be formed to be open, and the open upper side of the intake space (752) may be covered by a heat dissipation duct cover (710). The intake space (752) may be formed on an upstream side of the fan receiving space (762). The intake space (752) may be connected to the fan receiving space (762) through a fan inlet port (761).

[0142] The heat dissipation duct body (720) may include a first exhaust space (781) formed on an upper surface of the heat dissipation duct body (720) to guide air that has exchanged heat with the heat dissipation sink (520) to a first outside air exhaust port (782). The upper side of the first exhaust space (781) may be open, and the open upper side of the first exhaust space may be covered by a heat dissipation duct cover (710). The first exhaust space (781) may be formed on a downstream side of the sink receiving space (771).

[0143] The heat dissipation duct body (720) may include a second exhaust space (791) formed on the upper surface of the heat dissipation duct body (720) to guide air that has exchanged heat with the heat dissipation sink (520) to a second outside air outlet (794). The upper side of the second exhaust space (791) may be open, and the open upper side of the second exhaust space (791) may be covered by a heat dissipation duct cover (710). The second exhaust space (791) may be formed on the downstream side of the sink receiving space (771).

[0144] The extension duct (740) may include an extension exhaust space (746) connected to a second exhaust space (791) of the heat dissipation duct body (720). Air in the second exhaust space (791) may be guided to a second outside air outlet (794) through the extension exhaust space (746).

[0145] The refrigerator (1) may include a top cover (300) coupled to a front portion of the upper surface (111) of the main body (100) to cover a plurality of hinges (31). After the thermoelectric module assembly (450) is coupled to the upper wall (110) of the main body (100), the top cover (300) may be coupled to the upper wall (110) of the main body (100). When the top cover (300) is coupled to the upper wall (110) of the main body (100), the top cover (300) may press downward a front end of the thermoelectric module assembly (450). Therefore, the thermoelectric module assembly (450) may be more stably coupled to the upper wall (110). The top cover (300) may be coupled to the upper wall (110) of the main body (100) via at least one fastening member (S3).

[0146] The thermoelectric cooling device (400) may include a dust filter (390) designed to filter foreign substances from air flowing into the outside air intake (751). The dust filter (390) may be slidably mounted on the top cover (300) in the front-back direction.

[0147] The top cover (300) may include a suction grill portion (350) formed on the upper surface (310) of the top cover. The suction grill portion (350) may be located above the dust filter (390). The suction grill portion (350) may primarily block foreign substances from being sucked into the interior of the heat dissipation duct (700) before the dust filter (390). The suction grill portion (350) may protect the dust filter (390) by preventing external force from being applied to the dust filter (390).

[0148] The top cover (300) may include forward protrusions (313) protruding forward from both ends of the top cover (300) to cover a plurality of hinges (31). A top cover outlet (340) through which air inside the top cover (300) is discharged to the outside of the top cover (300) may be formed in the forward protrusions (313).

[0149] Air from the heat dissipation duct (700) can be introduced into the interior of the top cover (300) through the connection port (784). The air introduced into the interior of the top cover (300) can heat the upper surface (111) of the main body (100) and be discharged to the exterior of the top cover (300) through the top cover outlet (340).

[0150] The thermoelectric cooling device (400) may include a cooling fan (800) that circulates air to ensure efficient heat exchange between the cooling sink (570) and the air inside the storage chamber (11).

[0151] A cooling fan (800) may be provided to blow air toward a cooling sink (570). The cooling fan (800) may be positioned horizontally with respect to the cooling sink (570). The cooling fan (800) may be provided inside the storage compartment (11). The cooling fan (800) may be provided on the lower side of the upper wall (110).

[0152] The cooling fan (800) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions. The rotation axis (810) of the cooling fan (800) may be arranged perpendicular to the bottom surface of the upper wall (110).

[0153] The thermoelectric cooling device (400) may include a cooling duct (900) provided to guide air flowing by a cooling fan (800). The cooling duct (900) may guide air inside the storage room (11) to exchange heat with the cooling sink (570), and guide air that has exchanged heat with the cooling sink (570) to be discharged back into the storage room (11).

[0154] A cooling fan (800) may be positioned inside a cooling duct (900). A cooling sink (570) may be positioned inside the cooling duct (900) by penetrating the upper portion of the cooling duct (900). The cooling duct (900) may be coupled to the lower surface of the upper wall (110).

[0155] The cooling duct (900) may include an intake port (991) for drawing air inside the storage room (11) into the interior of the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the cooling sink (570) into the interior of the storage room (11).

[0156] A refrigerator (1) may include a refrigeration cycle device to cool a storage compartment through a refrigeration cycle. The refrigeration cycle device may include a compressor (2), a condenser (not shown), an expansion device (not shown), and an evaporator (3). The evaporator (3) may be provided at the rear of the storage compartment (12, 13).

[0157] The refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3). The first evaporator duct (60) may be provided at the rear side of the second storage compartment (12) and the third storage compartment (13). The second evaporator duct (70) may be provided at the rear side of the first storage compartment (11).

[0158] The cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60) by the evaporator fan (80). The cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port (not shown) formed on the front. In addition, the cold air sucked into the interior of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70). The first evaporator duct (60) may be provided with a damper (61) that controls the supply of the cold air inside the first evaporator duct (60) to the second evaporator duct (70). A connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).

[0159] Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed on the front of the second evaporator duct (70).

[0160] Thus, according to one embodiment of the present disclosure, the refrigerator may include a thermoelectric cooling device (400) and a refrigeration cycle device, but is not limited thereto, and the refrigerator may include only a thermoelectric cooling device (400).

[0161] Fig. 9 is an exploded perspective view of a thermoelectric module according to one embodiment of the present disclosure. Fig. 10 is an exploded bottom perspective view of a thermoelectric module according to one embodiment of the present disclosure. Fig. 11 is a cross-sectional view of a thermoelectric module according to one embodiment of the present disclosure.

[0162] A thermoelectric module (500) may include a thermoelectric element (530) having a heat generating portion (531) and a heat absorbing portion (532), a heat dissipation sink (520) in contact with the heat generating portion (531) of the thermoelectric element (530), a cooling sink (570) in contact with the heat absorbing portion (532) of the thermoelectric element (530), and a module plate (550) on which the thermoelectric element (530), the heat dissipation sink (520), and the cooling sink (570) are installed.

[0163] The module plate (550) can serve as a skeleton of the thermoelectric module (500). The module plate (550) can be formed of a resin material with low thermal conductivity. The module plate (550) can support a heat sink (520) and a cooling sink (570). The module plate (550) can maintain a gap between the heat sink (520) and the cooling sink (570).

[0164] The module plate (550) may include a plate base (552). The plate base (552) may be provided horizontally. The plate base (552) may support a heat sink (520). The plate base (552) may contact a bottom surface of the heat sink base (521) to support the heat sink (520). The plate base (552) may have a size and shape corresponding to the heat sink (520). The plate base (552) may have a rectangular shape.

[0165] The module plate (550) may include a module plate opening (551). The module plate (550) may include a component mounting portion (555) forming the module plate opening (551). The component mounting portion (555) may protrude from the lower surface of the plate base (552).

[0166] The thermoelectric element (530) may be placed inside the module plate opening (551). The vertical length of the module plate opening (551) (i.e., the vertical length of the element mounting portion (555)) may be greater than the vertical length of the thermoelectric element (530), and the thermoelectric element (530) may be placed closer to the upper end of the module plate opening (551).

[0167] The reason why the thermoelectric element (530) is positioned at the upper part inside the module plate opening (551) is that the heat generation amount of the thermoelectric element (530) is usually higher than the heat absorption amount, and the positioning of the thermoelectric element (530) at the upper part of the module plate opening (551) is advantageous for heat dissipation of the heat generating part (531), and the overall operating efficiency of the thermoelectric element (530) can be increased.

[0168] Since the thermoelectric element (530) is positioned at the upper end of the module plate opening (551), the cooling sink (570) may include a cooling conductive portion (574) protruding from the cooling sink base (571) for contact with the heat absorbing portion (532) of the thermoelectric element (530). The cooling conductive portion (574) may be formed integrally with the cooling sink base (571). The cooling conductive portion (574) may be inserted from below into the module plate opening (551) so as to contact the heat absorbing portion (532) of the thermoelectric element (530).

[0169] The thermoelectric module (500) may include a module plate (550) and an element insulation material (540) that insulates the thermoelectric element (530). The element insulation material (540) may be placed in the module plate opening (551) to prevent the thermoelectric element (530) from contacting the module plate (550). The element insulation material (540) may be provided to surround a side of the thermoelectric element (530). The element insulation material (540) may include an element insulation material body (543) and an element insulation material cover (542) coupled to an upper side of the element insulation material body (543). The element insulation material (540) may be formed of a resin material having low thermal conductivity. For example, the element insulation material (540) may be formed of a silicone material.

[0170] The thermoelectric module (500) may include a sink insulation (580) provided between the module plate (550) and the cooling sink (570). The sink insulation (580) may prevent heat from being transferred between the heat sink (520) and the cooling sink (570) through the module plate (550). The sink insulation (580) may include a sink insulation opening (581).

[0171] The sink insulation (580) can support the upper surface of the cooling sink (570). However, depending on the embodiment, the sink insulation (580) may be omitted, in which case the cooling sink (570) may be supported by contacting the lower surface of the module plate (550). Alternatively, the sink insulation (580) may be provided between the heat dissipation sink (520) and the module plate (550).

[0172] The heat sink (520) and the cooling sink (570) can be coupled to the module plate (550) via a fastening member (S1). The fastening member (S1) can be a mechanical element for coupling, such as a screw or bolt.

[0173] A heat sink through hole (523) may be formed in the heat sink (520) so that a fastening member (S1) may pass through it. A plate through hole (553) may be formed in the module plate (550) so that a fastening member (S1) may pass through it. A cooling sink through hole (573) may be formed in the cooling sink (570) so that a fastening member (S1) may pass through it.

[0174] The thermoelectric module (500) may include a washer member (510) supported between the head portion of the fastening member (S1) and the heat sink (520). The washer member (510) is provided between the head portion of the fastening member (S1) and the heat sink (520) to prevent the fastening member (S1) and the heat sink (520) from contacting each other and reduce heat of the heat sink (520) from being transferred through the fastening member (S1). The washer member (510) may be formed of a plastic material having low thermal conductivity. The washer member (510) may be injection-molded using a resin material.

[0175] A loosening prevention member (502) may be provided between the head of the fastening member (S1) and the washer member (510) to prevent loosening of the fastening member (S1).

[0176] The thermoelectric module (500) may include a nut member (590) to which an end opposite the head of the fastening member (S1) is fastened. The nut member (590) may be supported on a cooling sink (570). The nut member (590) may be provided between the end opposite the head of the fastening member (S1) and the cooling sink (570) to prevent the fastening member (S1) and the cooling sink (570) from contacting each other and to reduce the transfer of cold air from the cooling sink (570) through the fastening member (S1). The nut member (590) may be formed of a plastic material to reduce heat transfer between the fastening member (S1) and the cooling sink (570).

[0177] When the heat sink (520) and the cooling sink (570) are coupled to the module plate (550) via the fastening member (S1), the heat sink (520) and the cooling sink (570) can be coupled to the module plate (550) via the fastening member (S1) while the element insulation (540) and the thermoelectric element (530) are placed in the opening (551) of the module plate (550). Accordingly, the heat sink (520) and the cooling sink (570) can be fixed to the module plate (550) while the thermoelectric element (530) is also fixed at the same time.

[0178] The heat generating part (531) of the thermoelectric element (530) is supported and fixed by a heat sink (520), the heat absorbing part (532) of the thermoelectric element (530) is supported and fixed by a cooling sink (570), and the side connecting the heat generating part (531) and the heat absorbing part (532) of the thermoelectric element (530) can be supported and fixed by the inner surface of the element insulation material (540).

[0179] In this way, the heat sink (520) and the cooling sink (570) can be easily assembled to the module plate (550) by the fastening member (S1). In addition, the heat sink (520) and the heat generating portion (531) of the thermoelectric element (530) can be in close contact, and the cooling sink (570) and the heat absorbing portion (532) of the thermoelectric element (530) can be in close contact, so that heat exchange between the heat sink (520) and the heat dissipating portion (531) of the thermoelectric element (530) and heat exchange between the cooling sink (570) and the heat absorbing portion (532) of the thermoelectric element (530) can be efficiently performed, thereby increasing the efficiency of the thermoelectric module (500).

[0180] The thermoelectric module (500) may include a temperature sensor (560) for measuring the temperature of the heat sink (520). The thermoelectric module (500) may include a temperature sensor (565) for measuring the temperature of the cooling sink (570). The refrigerator (1) may control the output of the thermoelectric element (530) by adjusting the voltage supplied to the thermoelectric element (530) based on the temperature information of the heat sink (520) measured through the temperature sensor (560) or the temperature information of the cooling sink (570) measured through the temperature sensor (565).

[0181] The temperature sensor (560) may be coupled to the heat sink (520) via a sensor fastening member (564). A rubber ring (564a) may be provided between the temperature sensor (560) and the sensor fastening member (564) to reduce vibration. However, depending on the embodiment, the rubber ring (564a) may be omitted.

[0182] The temperature sensor (565) may be coupled to the cooling sink (570) by a sensor fastening member (569). A rubber ring (569a) may be provided between the temperature sensor (565) and the sensor fastening member (569) to reduce vibration. However, depending on the embodiment, the rubber ring (569a) may be omitted.

[0183] FIG. 12 is a perspective view illustrating a coupling structure of a temperature sensor and a heat sink according to an embodiment of the present disclosure. FIG. 13 is an enlarged view illustrating a temperature sensor according to an embodiment of the present disclosure. FIG. 14 is a cross-sectional view illustrating a coupling structure of a temperature sensor and a heat sink of FIG. 12. FIG. 15 is a perspective view illustrating a coupling structure of a temperature sensor and a cooling sink according to an embodiment of the present disclosure.

[0184] Referring to FIGS. 12 to 15, the heat sink base (521) may include one side (522a) and an opposite side (522b) opposite the one side (522a). The one side (522a) may face upward of the heat sink base (521), and the other side (522b) may face downward of the heat sink base (521).

[0185] A plurality of heat dissipation fins (525) may protrude from one surface (522a) of the heat dissipation sink base (521). The other surface (522b) of the heat dissipation sink base (521) may contact a thermoelectric element (530).

[0186] A plurality of heat dissipation fins (525) may protrude from one surface (522a) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may protrude in a direction (D1) perpendicular to the one surface (522a) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may be formed to extend in a direction (D2) parallel to the one surface (522a) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may be arranged in one direction (D3) so as to be spaced apart from each other. The direction (D3) in which the plurality of heat dissipation fins (525) are arranged may be orthogonal to the direction (D1) in which the plurality of heat dissipation fins (525) protrude and the direction (D2) in which the plurality of heat dissipation fins (525) extend.

[0187] Heat dissipation channels (528) may be formed between a plurality of adjacent heat dissipation fins (525). The heat dissipation channels (528) may include basic heat dissipation channels (528a) and at least one wide heat dissipation channel (528b) having a width greater than that of the basic heat dissipation channels (528a). That is, the width of the wide heat dissipation channel (528b) may be greater than the width of the basic heat dissipation channels (528a).

[0188] The reason why the heat sink (520) has a wide heat dissipation channel (528b) is that the heat sink (520) is formed through an extrusion process, and this is to efficiently perform the task of creating a space for installing a washer member (510) in the heat sink (520). The heat sink (520) can be formed by extrusion along the direction (D2) in which a plurality of heat dissipation fins (525) extend.

[0189] Air flowing by the heat dissipation fan (600) can pass through the heat dissipation channels (528) and exchange heat with a plurality of heat dissipation fins (525).

[0190] The temperature sensor (560) may include a sensor member (561) formed of a material whose physical properties, such as resistance value, change according to a change in temperature of the target object. For example, a thermistor, an NTC (Negative Temperature Coefficient thermistor), a thermoelement, a thermocouple, or the like may be used as the sensor member (561).

[0191] The sensor member (561) may have a rectangular parallelepiped shape. That is, the sensor member (561) may include a bottom surface (561a), an upper surface (561b) parallel to the bottom surface (561a), and side surfaces (561c, 561d, 561e, 561f) connecting the bottom surface (561a) and the upper surface (561b). The side surfaces (561c, 561d, 561e, 561f) may each have a rectangular shape. However, the shape of the sensor member (561) is not limited to a rectangular parallelepiped, and the sensor member (561) may have various shapes. For example, the sensor member (561) may be formed in a cylindrical shape.

[0192] The sensor member (561) may be formed of a material that conducts heat well and is resistant to corrosion. In particular, the sensor member (561) may be formed of the same material as the heat sink (520) to prevent galvanic corrosion. For example, the sensor member (561) and the heat sink (520) may be formed of the same aluminum material.

[0193] The sensor member (561) can contact the heat sink (520) to measure the temperature of the heat sink (520). The sensor member (561) can be coupled to the heat sink (520).

[0194] The temperature sensor (560) may include a wire (563) connected to a sensor member (561). The wire (563) may be connected to the underside (561a) of the sensor member (561).

[0195] The heat sink (520) may include a sensor receiving groove (526). The sensor receiving groove (526) may be formed to be recessed into one surface (522a) of the heat sink base (521). At least a portion of the sensor member (561) may be received in the sensor receiving groove (526). In the drawing, a portion of the sensor member (561) is depicted as being received in the sensor receiving groove (526), ​​but in some embodiments, the entire sensor member (561) may be received in the sensor receiving groove (526).

[0196] The sensor receiving groove (526) may be formed along the direction (D2) in which the heat dissipation fins (525) extend. That is, the direction (D2) in which the sensor receiving groove (526) is formed may be the same as the direction (D2) in which the heat dissipation sink (520) is extruded. Therefore, a separate processing such as cutting is not required to form the sensor receiving groove (526), ​​and the sensor receiving groove (526) may be integrally formed with the heat dissipation sink (520) through a single extrusion molding process.

[0197] The sensor receiving groove (526) may be formed between the edge (521a) of one side (522a) of the heat sink base (521) and the outermost heat dissipation fin (525a) that is closest to the edge (521a) of one side (522a) of the heat sink base (521) among the plurality of heat dissipation fins (525). That is, the sensor receiving groove (526) may be formed outside the outermost heat dissipation fin (525a).

[0198] An edge (521a) of one side (522a) of the heat sink base (521) may be an edge along the arrangement direction (D3) of the heat sink fins (525) of the one side (522a) of the heat sink base (521).

[0199] In this way, since the sensor receiving groove (526) is formed outside the outermost heat dissipation fin (525a), the flow of air toward the sensor member (561) can be minimized. Accordingly, the accuracy of temperature measurement of the heat dissipation sink (520) through the sensor member (561) can be improved.

[0200] The sensor receiving groove (526) may have a shape corresponding to the sensor member (561). For example, the inner side surface (527) of the sensor receiving groove (526) may include a first inner side surface (527a), a first inner side surface (527b) that is vertically bent from one side of the first inner side surface (527a), and a third inner side surface (527c) that is vertically bent from the other side of the first inner side surface (527a) and is parallel to the second inner side surface (527b).

[0201] The sensor member (561) can be accommodated in the sensor accommodation groove (526) such that at least three of its side surfaces (561c, 561d, 561e, 561f) are supported on the inner surface (527) of the sensor accommodation groove (526).

[0202] Specifically, the first side (561c) of the sensor member (561) may be supported on the first inner side (527a) of the sensor receiving groove (526). The second side (561d) of the sensor member (561) may be supported on the second inner side (527b) of the sensor receiving groove (526). The third side (561e) of the sensor member (561) may be supported on the third inner side (527c) of the sensor receiving groove (526).

[0203] In other words, the first side (561c) of the sensor member (561) can contact or be in proximity to the first inner side (527a) of the sensor receiving groove (526). The second side (561d) of the sensor member (561) can contact or be in proximity to the second inner side (527b) of the sensor receiving groove (526). The third side (561e) of the sensor member (561) can contact or be in proximity to the third inner side (527c) of the sensor receiving groove (526).

[0204] With this structure, since the three surfaces of the sensor member (561) are supported on the inner surface (527) of the sensor receiving groove (526), ​​not only can the sensor member (561) be stably fixed to the sensor receiving groove (526), ​​but also the contact area between the sensor member (561) and the heat sink (520) is increased, so that the accuracy of temperature measurement of the heat sink (520) through the sensor member (561) can be improved.

[0205] Among the inner surfaces (527) of the sensor receiving groove (526), ​​the second inner surface (527b) may be formed on the same plane as one side surface (525b) of the outermost heat dissipation fin (525a). Accordingly, a part of the second side surface (561d) of the sensor member (561) may be supported by the second inner surface (527b) of the sensor receiving groove (526), ​​and the remaining part of the second side surface (561d) of the sensor member (561) may be supported by one side surface (525b) of the outermost heat dissipation fin (525a). That is, the entire second side surface (561) of the sensor member (561) may be supported by the heat dissipation sink (520). Accordingly, the sensor member (561) can be more stably fixed to the sensor receiving groove (526), ​​and the contact area between the sensor member (561) and the heat sink (520) can be increased, thereby improving the accuracy of temperature measurement.

[0206] The sensor member (561) can be fixed to the sensor receiving groove (526) via a sensor fastening member (564). The sensor fastening member (564) can be a mechanical element for joining, such as a screw or a bolt. The fastening member (564) can have a head portion (SH) and a fastening member body (SB) having a diameter smaller than the head portion (SH). The fastening member body (SB) can have a cylindrical shape. Screw threads can be formed on the outer circumferential surface of the fastening member body (SB).

[0207] The sensor fastening member (564) can be fastened to the heat sink base (521) of the heat sink (520) by penetrating the sensor member (561). A sensor penetration hole (562) through which the sensor fastening member (564) passes can be formed in the sensor member (561). A sensor coupling hole (529) to which the sensor fastening member (564) is coupled can be formed in the heat sink base (521).

[0208] As described above, since the sensor member (561) is supported by the second inner surface (527b) and the third inner surface (527c) of the sensor receiving groove (526), ​​the sensor member (561) can be prevented from rotating together with the sensor fastening member (564) while the sensor member (561) rotates to couple the sensor member (561) and the heat sink (520). That is, there is no need to hold the sensor member (561) by hand while fastening the sensor fastening member (564), and the sensor fastening member (564) can be conveniently fastened.

[0209] A rubber ring (564a) may be provided between the head portion (SH) of the sensor fastening member (564) and one surface (561f) of the sensor member (561). The sensor fastening member (564) may penetrate the rubber ring (564a). The rubber ring (564a) may reduce vibration transmitted to the sensor member (561) and the heat dissipation sink (520) due to the operation of the heat dissipation fan (600), etc., thereby protecting the sensor member (561) and the heat dissipation sink (520) from impact and maintaining close contact between the sensor member (561) and the heat dissipation sink (520). However, the rubber ring (564a) may be omitted, and the head portion (SH) of the sensor fastening member (564) may directly contact one surface (561f) of the sensor member (561).

[0210] Referring to FIG. 15, similar to the heat sink (520), the cooling sink (570) may also be provided with a temperature sensor (565) for measuring the temperature of the cooling sink (570).

[0211] Hereinafter, the cooling sink (570) and the temperature sensor (565) will be described. The structures of the cooling sink (570) and the temperature sensor (565) largely correspond to the structures of the heat sink (520) and the temperature sensor (561), so even if not described below, the structures of the heat sink (520) and the temperature sensor (561) can be applied as is to the cooling sink (570) and the temperature sensor (566).

[0212] The cooling sink base (571) may include one side (572a) and an opposite side (572b) opposite the one side (572a). The one side (572a) may face downward of the cooling sink base (571) and the other side (572b) may face downward of the cooling sink base (571).

[0213] A plurality of cooling fins (575) may protrude from one surface (572a) of the cooling sink base (571). A cooling conductive member (574) may protrude from the other surface (572b) of the cooling sink base (571).

[0214] A plurality of cooling fins (575) may protrude from one surface (572a) of the cooling sink base (571). The plurality of cooling fins (575) may protrude in a direction (D4) perpendicular to the one surface (572a) of the cooling sink base (571). The plurality of cooling fins (575) may be formed to extend in a direction (D5) parallel to the one surface (572a) of the cooling sink base (571). The plurality of cooling fins (575) may be arranged in one direction (D6) so as to be spaced apart from each other. The direction (D6) in which the plurality of cooling fins (575) are arranged may be orthogonal to the direction (D4) in which the plurality of cooling fins (575) protrude and the direction (D5) in which the plurality of cooling fins (575) extend.

[0215] Cooling channels (578) may be formed between a plurality of adjacent cooling fins (575). The cooling channels (578) may include primary cooling channels (578a) and at least one wide cooling channel (578b) having a width greater than that of the primary cooling channels (578a). That is, the width of the wide cooling channel (578b) may be greater than that of the primary cooling channels (578a).

[0216] The reason why the cooling sink (570) has a wide cooling channel (578b) is that the cooling sink (570) is formed through an extrusion process, and the task of creating a space for installing a nut member (590) in the cooling sink (570) is efficiently performed. The cooling sink (570) can be formed by extrusion along the direction (D5) in which a plurality of cooling fins (575) extend.

[0217] Air flowing by the cooling fan (800) passes through cooling channels (578) and can exchange heat with a plurality of cooling fins (575).

[0218] The temperature sensor (565) may include a sensor member (566) formed of a material whose physical properties, such as resistance value, change according to a change in temperature of the target object. For example, a thermistor, an NTC (Negative Temperature Coefficient thermistor), a thermoelement, a thermocouple, etc. may be used as the sensor member (561).

[0219] The sensor member (566) may have a rectangular parallelepiped shape. However, the shape of the sensor member (566) is not limited to a rectangular parallelepiped, and the sensor member (566) may have various shapes. For example, the sensor member (566) may be formed in a cylindrical shape.

[0220] The sensor member (566) may be formed of a material that conducts heat well and is resistant to corrosion. In particular, the sensor member (566) may be formed of the same material as the cooling sink (570) to prevent galvanic corrosion. For example, the sensor member (566) and the cooling sink (570) may be formed of the same aluminum material.

[0221] The temperature sensor (565) may include a wire (568) connected to a sensor member (566).

[0222] The cooling sink (570) may include a sensor receiving groove (576). The sensor receiving groove (576) may be formed to be recessed into one surface (572a) of the cooling sink base (571). At least a portion of the sensor member (566) may be received in the sensor receiving groove (576). In the drawing, a portion of the sensor member (566) is depicted as being received in the sensor receiving groove (576), but in some embodiments, the entire sensor member (566) may be received in the sensor receiving groove (576).

[0223] The sensor receiving groove (576) may be formed along the direction (D5) in which the cooling fins (575) extend. That is, the direction (D5) in which the sensor receiving groove (576) is formed may be the same as the direction (D5) in which the cooling sink (570) is extruded. Therefore, a separate processing such as cutting is not required to form the sensor receiving groove (576), and the sensor receiving groove (576) may be integrally formed with the cooling sink (570) through a single extrusion molding process.

[0224] The sensor receiving groove (576) may be formed between the edge (571a) of one surface (572a) of the cooling sink base (571) and the outermost cooling fin (575a) that is closest to the edge (571a) of one surface (572a) of the cooling sink base (571) among the plurality of cooling fins (575). That is, the sensor receiving groove (576) may be formed on the outside of the outermost cooling fin (575a).

[0225] The edge (571a) of one side (572a) of the cooling sink base (571) may be an edge along the arrangement direction (D6) of the cooling fins (575) of the one side (572a) of the cooling sink base (571).

[0226] In this way, since the sensor receiving groove (576) is formed outside the outermost cooling fin (575a), the flow of air toward the sensor member (566) can be minimized. Accordingly, the accuracy of temperature measurement of the cooling sink (570) through the sensor member (566) can be improved.

[0227] The sensor receiving groove (576) may have a shape corresponding to the sensor member (566). The sensor member (566) may be received in the sensor receiving groove (576) such that at least three of its side surfaces are supported on the inner surface of the sensor receiving groove (576).

[0228] With this structure, not only can the sensor member (566) be stably fixed to the sensor receiving groove (576), but also the contact area between the sensor member (566) and the cooling sink (570) is increased, so that the accuracy of temperature measurement of the cooling sink (570) through the sensor member (566) can be improved.

[0229] The sensor member (566) can be fixed to the sensor receiving groove (576) via a sensor fastening member (569). The sensor fastening member (569) can be a mechanical element for fastening, such as a screw or bolt.

[0230] The sensor fastening member (569) can be fastened to the cooling sink base (571) of the cooling sink (570) by penetrating the sensor member (566). A sensor penetration hole (567) through which the sensor fastening member (569) passes can be formed in the sensor member (566). A sensor coupling hole (579) to which the sensor fastening member (569) is coupled can be formed in the cooling sink base (571).

[0231] A rubber ring (569a) may be provided between the head of the sensor fastening member (569) and one surface of the sensor member (566). The sensor fastening member (569) may penetrate the rubber ring (569a). The rubber ring (569a) may reduce vibration transmitted to the sensor member (566) and the cooling sink (570) due to the operation of the heat dissipation fan (600), etc., thereby protecting the sensor member (566) and the cooling sink (570) from impact and maintaining close contact between the sensor member (566) and the cooling sink (570). However, the rubber ring (569a) may be omitted, and the head of the sensor fastening member (569) may directly contact one surface of the sensor member (566).

[0232] FIG. 16 is a perspective view illustrating a structure in which a temperature sensor is coupled to a heat sink via a thermally conductive tape according to one embodiment of the present disclosure. FIG. 17 is a cross-sectional view illustrating a structure in which the temperature sensor of FIG. 16 is coupled to a heat sink via a thermally conductive tape.

[0233] Referring to FIGS. 16 and 17, the thermoelectric module (500) may further include a thermal conductive tape (564b) for fixing the sensor member (561) to the sensor receiving groove (526).

[0234] A portion of the thermal conductive tape (564b) may be adhered to at least one surface of the sensor member (561), and at least another portion of the thermal conductive tape (564b) may be adhered to at least one surface of the heat sink (520).

[0235] The sensor member (561) can be more stably fixed to the sensor receiving groove (526) by the thermal conductive tape (564b). When the thermal conductive tape (564b) is attached, the rubber ring (564a) can be omitted.

[0236] The thermal conductive tape (564b) may include a material with high thermal conductivity. For example, the thermal conductive tape (564b) may include an aluminum tape. Accordingly, the thermal conductive tape (564b) may improve thermal conductivity from the heat sink (520) to the sensor member (561), thereby improving the accuracy of temperature measurement of the heat sink (520) via the sensor member (561).

[0237] The sensor member (561) can sense the temperature through all four sides (561c, 561d, 561e, 561f) by means of the thermal conductive tape (564b).

[0238] This thermal conductive tape (564b) can be equally applied to the cooling sink (570) and its temperature sensor (565), and a description thereof is omitted.

[0239] FIG. 18 is a front view illustrating a coupling structure of a temperature sensor and a heat sink according to an embodiment of the present disclosure. FIG. 19 is a front view illustrating a coupling structure of a temperature sensor and a heat sink according to an embodiment of the present disclosure. FIG. 20 is a perspective view illustrating a coupling structure of a temperature sensor, a heat sink, and a washer member according to an embodiment of the present disclosure. FIG. 21 is a cross-sectional view illustrating a coupling structure of the temperature sensor, the heat sink, and the washer member of FIG. 20.

[0240] The following description of FIGS. 18 to 21 can be equally applied to the cooling sink (570) and its temperature sensor (565), and description thereof is omitted.

[0241] Referring to Fig. 18, in some embodiments, a sensor receiving groove (526) may not be formed in the heat sink base (521). In this case, the sensor member (561) may be provided to be supported by one side (522a) of the heat sink base (521) and the outermost heat dissipation fin (525a). That is, the sensor member (561) may be supported on two sides by the heat sink (520).

[0242] Referring to FIG. 19, according to an embodiment, a sensor member (561) may be placed in a basic heat dissipation channel (528a). That is, the sensor member (561) may be placed between a plurality of adjacent heat dissipation fins (525c, 525d) forming the basic heat dissipation channel (528a).

[0243] One side of the sensor member (561) may be supported on one side (522a) of the heat sink base (521), another side of the sensor member (561) may be supported on a heat sink fin (525c), and another side of the sensor member (561) may be supported on a heat sink fin (525d). The sensor member (561) may have three sides supported on the heat sink (520).

[0244] Referring to FIG. 20, according to an embodiment, a sensor member (561) may be placed in a wide heat dissipation channel (528b). In this case, the sensor member (561) may be provided between the bottom surface of the washer member (510) and one surface (522a) of the heat dissipation sink base (521).

[0245] The sensor member (561) can be coupled to the washer member (510). The sensor member (561) can be coupled to the washer member (510) by a sensor fastening member (2564). The sensor fastening member (2564) can be coupled to the sensor member (561) by penetrating the washer member (510).

[0246] A sensor mounting portion (519) capable of mounting a sensor member (561) may be formed on the washer member (510). The sensor mounting portion (519) may be formed on the bottom surface of the washer member (510).

[0247] While the technical concept of the present invention has been described above through specific examples, the scope of the present invention is not limited to these examples. Various embodiments that can be modified or altered by those skilled in the art without departing from the spirit of the present invention as defined in the claims are also within the scope of the present invention.

Claims

1. Main body; A storage room formed inside the above main body; A thermoelectric element provided to cool the above storage room; A heat sink arranged to contact the thermoelectric element, the heat sink including a sink base and a plurality of fins protruding from one surface of the sink base; A temperature sensor configured to measure the temperature of the heat sink, the temperature sensor including a sensor member and a wire connected to the sensor temperature member; and A sensor fastening member coupled to the heat sink through the sensor member to secure the sensor member; The above heat sink includes a sensor receiving groove formed to be sunken into one surface of the sink base, A refrigerator in which the sensor member is accommodated in the sensor accommodation home.

2. In paragraph 1, The above plurality of pins include an outermost pin positioned closest to an edge of one side of the sink base among the above plurality of pins, A refrigerator in which the sensor receiving home is formed between an edge of one side of the sink base and the outermost pin.

3. In paragraph 1, The above plurality of pins protrude in a first direction perpendicular to one surface of the sink base, The above plurality of pins each extend in a second direction perpendicular to the first direction, A refrigerator wherein the plurality of pins are arranged spaced apart from each other along a third direction perpendicular to the first direction and the second direction.

4. In paragraph 3, A refrigerator in which the sensor receiving home is formed along the second direction.

5. In paragraph 1, The above sensor member is a refrigerator having a rectangular parallelepiped shape.

6. In paragraph 5, A refrigerator in which at least three surfaces of the sensor member are supported on the inner surface of the sensor receiving groove.

7. In paragraph 6, A refrigerator in which the inner surface of the sensor receiving home includes a bottom surface, a first side surface extending vertically from the bottom surface, and a second side surface extending vertically from the bottom surface and parallel to the first side.

8. In paragraph 7, A refrigerator wherein the first side is formed on the same plane as the side of one of the plurality of fins.

9. In paragraph 1, A refrigerator wherein the sensor member is formed of the same material as the heat sink.

10. In paragraph 1, A refrigerator in which the sensor member is positioned next to the outermost pin among the plurality of pins.

11. In paragraph 1, A refrigerator wherein the sensor member includes a sensor penetration hole formed so that the sensor fastening member penetrates therethrough.

12. In paragraph 1, A refrigerator wherein the heat sink includes a sensor coupling hole to which the sensor fastening member is coupled.

13. In paragraph 1, The above sensor fastening member includes a head portion and a fastening member body portion having a diameter smaller than the head portion, A refrigerator further comprising a rubber ring provided between the head portion and the sensor member.

14. In paragraph 1, A refrigerator further comprising a thermally conductive tape, a portion of which is adhered to at least one surface of the sensor member and another portion of which is adhered to at least one surface of the heat sink to secure the sensor member to the sensor receiving groove.

15. In paragraph 3, A refrigerator in which the heat sink is formed by extrusion along the second direction.

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