Antenna and electronic device comprising same

Abstract

An electronic device, according to various embodiments, may comprise: a conductive side member; a conductive extension member extending from the conductive side member into an internal space; a non-conductive region disposed between the conductive side member and the conductive extension member; a conductive portion disposed through a segment part extending from the non-conductive region to the side member; a slit extending from the non-conductive region in a direction opposite to the conductive portion by a designated length, the slit corresponding to the segmented part; and a wireless communication circuit electrically connected through a first point of the conductive portion and configured to transmit or receive a wireless signal in a first frequency band.

Description

Antenna and electronic device including it

[0001] Embodiments of the present disclosure relate to an antenna and an electronic device including the same.

[0002] As the functional gap between manufacturers narrows, electronic devices are becoming increasingly slimmer to meet consumer purchasing demands. These devices are being developed to increase their rigidity, enhance their design, and differentiate their functional elements. Electronic devices may include at least one antenna, among their components, for communication. This at least one antenna may be implemented via a metal bezel (e.g., a side member) that serves as part of the electronic device's housing and needs to be improved to enhance radiation performance.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device may include at least one housing (e.g., a housing structure) that includes a space for accommodating electronic components. The housing may include a side member (e.g., a side bezel or bezel) that serves as at least a portion of a side of the electronic device. The side member may include a metallic material (e.g., a conductive member, a conductive portion, or a conductive material) for reinforcing the rigidity of the electronic device and / or performing a specific function (e.g., an antenna function). The side member may also include a polymer (e.g., a non-conductive member, a non-conductive portion, or a non-conductive material) combined with the metallic material. For example, the side member may include at least one conductive portion segmented by at least one segment (e.g., a non-conductive portion). The at least one conductive portion may be electrically connected to a wireless communication circuit of the electronic device, thereby operating as at least one antenna operating in at least one frequency band.

[0005] Meanwhile, at least one conductive portion used as a side member can be operated as an antenna capable of implementing ideal radiation performance through symmetrical arrangement of left and right segments and center feeding of the conductive portion.

[0006] However, as electronic devices become increasingly slimmer, and depending on the arrangement structure of peripheral electronic components such as cameras or speakers, the conductive portion may be arranged through an asymmetrical segment structure and may be set to have a feed position that is offset from the center. The conductive portion with such an arrangement structure may cause the current generation in higher modes such as mode 3 (e.g., j3 mode), mode 4 (e.g., j4 mode), and mode 5 (e.g., j5 mode) to relatively rapidly increase compared to mode 1 (e.g., j1 mode) and mode 2 (e.g., j2 mode) in a specific frequency band (e.g., low band (approximately 600 MHz to 960 MHz)), which may reduce the radiation efficiency of the antenna.

[0007] Furthermore, another antenna (e.g., a slot antenna) may be placed in close proximity to the bezel antenna that operates using the conductive portion. This other antenna may operate at a multiplier frequency, even if it operates in a frequency band different from the operating frequency band of the bezel antenna, and may reduce the radiation performance of the bezel antenna depending on the close placement.

[0008] Various embodiments of the present disclosure can provide an antenna and an electronic device including the same that can help improve the radiation performance of the antenna even when the segments and / or the feed locations are positioned asymmetrically.

[0009] Embodiments of the present disclosure may provide an antenna and an electronic device including the same that can help improve isolation from other closely placed antennas.

[0010] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, the electronic device may include a conductive side member, a conductive extension member extending from the conductive side member into an internal space, a non-conductive region disposed between the conductive side member and the conductive extension member, a conductive portion disposed through a segment extending from the non-conductive region to the side member, a slit extending from the non-conductive region corresponding to the segment to a specified length in a direction opposite to the conductive portion, and a wireless communication circuit electrically connected through a first point of the conductive portion, and configured to transmit or receive a wireless signal in a first frequency band.

[0012] An electronic device according to exemplary embodiments of the present disclosure may include a conductive portion arranged through a non-conductive region and a segment to operate as an antenna, wherein the conductive portion induces a current distribution through a slit extending a specified length from the non-conductive region, thereby helping to improve the radiation performance of the antenna due to a reduction in higher modes, and helping to improve isolation between other antennas arranged in the vicinity.

[0013] In addition, various effects may be provided, either directly or indirectly, through this document.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0019] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0020] FIG. 4a is a configuration diagram of a side member according to various embodiments of the present disclosure.

[0021] FIG. 4b is a partial configuration diagram of a side member of FIG. 4a according to various embodiments of the present disclosure.

[0022] FIG. 4c is an enlarged view of area 4c of FIG. 4a according to various embodiments of the present disclosure.

[0023] FIG. 5a is a diagram illustrating a mode-specific current distribution according to the length of a slit according to various embodiments of the present disclosure.

[0024] FIG. 5b is a graph comparing the radiation performance of the first antenna according to the length of the slit according to various embodiments of the present disclosure.

[0025] FIG. 6 is a graph comparing the isolation of the first antenna and the second antenna depending on the presence or absence of a slit according to various embodiments of the present disclosure.

[0026] FIGS. 7A and 7B are schematic diagrams of side members having different power supply positions according to various embodiments of the present disclosure.

[0027] FIG. 7c is a diagram comparing the current distribution by mode according to the presence or absence of a slit in the antenna of FIGS. 7a and 7b according to various embodiments of the present disclosure.

[0028] FIG. 7d is a graph comparing the radiation performance of the antennas of FIGS. 7a and 7b with and without a slit according to various embodiments of the present disclosure.

[0029] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), or the sound output module (155), or the electronic device (101) and 450.

[0040] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) connected directly or wirelessly.

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0055] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include other embodiments of the electronic device.

[0056] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0057] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0058] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0059] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0060] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may also include a tray member arranged through at least a portion of the side bezel structure (218).

[0061] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0062] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0063] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0064] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0065] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0066] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). In one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0067] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0068] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., the side bezel structure (218) of FIG. 2A and FIG. 2B), an extension member (2181) (e.g., a bracket or a support member), a front plate (202) (e.g., a front cover), a display (201), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or a support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the extension member (2181) or the support bracket (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or 2B, and a redundant description thereof will be omitted below.

[0069] According to various embodiments, the extension member (2181) may be disposed within the electronic device (200) and structurally coupled to the side member (218) or formed integrally with the side member (218). The extension member (2181) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The extension member (2181) may have a display (201) coupled to one surface and a substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the display (201) may be disposed to be supported by the extension member (2181).

[0070] The memory may include, for example, volatile memory or non-volatile memory.

[0071] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0072] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (250) may be integrally disposed within the electronic device (200). In another embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0073] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (218) and / or the extension member (2181).

[0074] FIG. 4A is a schematic diagram of a side member according to various embodiments of the present disclosure. FIG. 4B is a schematic diagram of a portion of the side member of FIG. 4A according to various embodiments of the present disclosure. FIG. 4C is an enlarged view of area 4C of FIG. 4A according to various embodiments of the present disclosure.

[0075] Referring to FIGS. 4A to 4C, the side member (218) (e.g., the side member (218) of FIG. 2A) may be formed by bonding a conductive member (218-1) (e.g., a metal) and / or a non-conductive member (218-2) (e.g., a polymer). In one embodiment, the side member (218) may include an extension member (2181) that extends at least partially from a side (e.g., the side (210C) of FIG. 2A) of an electronic device (e.g., the electronic device (200) of FIG. 2A) into an interior space. In one embodiment, the side member (218) may be configured such that at least a portion of the side and extension member (2181) of the electronic device (200) is formed of a conductive member (218-1), and at least a portion of the extension member (2181) and the segments (321, 322, 323, 324, 325, 326) described below (e.g., non-conductive portions or gaps) are formed of a non-conductive material. In one embodiment, the side member (218) may include a first side (218a) having a first length, a second side (218b) extending from one end of the first side (218a) in a direction perpendicular to the first side (218a) (e.g., along the -y axis) to have a second length, a third side (218c) extending from the second side (218b) substantially parallel to the first side (218a) and having the first length, and a fourth side (218d) extending from the third side (218c) to the other end of the first side (218a) and having the second length and being substantially parallel to the second side (218b).

[0076] According to various embodiments, the side member (218) may include conductive portions (311, 312, 313, 314, 315, 316) arranged to be segmented by spaced apart segments (321, 322, 323, 324, 325, 326) (e.g., non-conductive portions or gaps). In one embodiment, the conductive portions (311, 312, 313, 314, 315, 316) form at least a portion of a side surface of the electronic device (200) and may be arranged to be visible from the outside. For example, at least one of the first, second, third, and fourth sides (218a, 218b, 218c, 218d) of the side member (218) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., substrate (240) of FIG. 3) of the electronic device (200) via conductive portions (311, 312, 313, 314, 315, 316), thereby operating in a designated frequency band (e.g., a legacy band in the range of about 600 MHz to 6000 MHz).

[0077] According to various embodiments, the conductive portions (311, 312, 313, 314, 315, 316) may include a first conductive portion (310) disposed between a first spaced segment (321) and a second spaced segment (322), a second conductive portion (312) disposed between a second spaced segment (322) and a third spaced segment (323), a third conductive portion (313) disposed between a third spaced segment (323) and a fourth spaced segment (324), a fourth conductive portion (314) disposed between a fourth spaced segment (324) and a fifth spaced segment (325), a fifth conductive portion (315) disposed between a fifth spaced segment (325) and a sixth spaced segment (326), and / or a A sixth conductive portion (316) may be disposed between the sixth segment (326) and the first segment (321). In one embodiment, the first conductive portion (311) may be disposed from a portion of the first side (218a) to a portion of the second side (218b) through the first segment (321) disposed on the first side (218a) and the second segment (322) disposed on the second side (218b). In one embodiment, the second conductive portion (312) may be disposed on a portion of the second side (218b) through the second segment (322) and the third segment (323) disposed on the second side (218b). In one embodiment, the third conductive portion (313) may be disposed from a portion of the second side (218b) to a portion of the third side (218c) via the third segment (323) and the fourth segment (324) disposed on the third side (218c). In one embodiment, the fourth conductive portion (314) may be disposed on a portion of the third side (218c) via the fourth segment (324) and the fifth segment (325) disposed on the third side (218c). In one embodiment, the fifth conductive portion (315) may be disposed to extend from a portion of the third side (218c) to a portion of the fourth side (218d) via the fifth segment (325) and the sixth segment (326) disposed on the fourth side (218d).In one embodiment, the sixth conductive portion (316) may be arranged to extend from a portion of the fourth side (218d) to a portion of the first side (218a) via the sixth segment (326) and the first segment (321).

[0078] According to various embodiments, the electronic device (200) may include a first antenna (SA1) operating through a first conductive portion (311), a second antenna (SA2) operating through a slot (3122) disposed adjacent to the first antenna (SA1) near a second conductive portion (312), third and fourth antennas (SA3, SA4) operating through a sixth conductive portion (316), a fifth antenna (SA5) operating through a portion of the fifth conductive portion (315), and / or a sixth antenna (SA6) operating through a slot disposed near the fifth conductive portion (315). In one embodiment, the first to sixth antennas (SA1, SA2, SA3, SA4, SA5, SA6) may be configured as upper antennas disposed on an upper side of the electronic device (e.g., the electronic device (200) of FIG. 2A). In one embodiment, the electronic device (200) may include a seventh antenna (MA1) operating through the fourth conductive portion (314) and / or the third conductive portion (313), an eighth antenna (MA2) operating through a portion of the third conductive portion (313), and / or a ninth antenna (MA3) operating through a portion of the second conductive portion (312). In one embodiment, the seventh to ninth antennas (MA1, MA2, MA3) may be configured as bottom antennas disposed on the lower side of the electronic device (e.g., the electronic device (200) of FIG. 2A). In one embodiment, the antennas (SA1, SA2, SA3, SA4, SA5, SA6, MA1, MA2, MA3) can operate in at least one frequency band of a low band of about 600 MHz to 960 MHz, a mid band of about 1700 MHz to 2200 MHz, a high band of about 2300 MHz to 2800 MHz, a sub-6 band of about 5 GHz to 6 GHz, an UHB band of about 3.2 GHz to 4.5 GHz, BT (Bluetooth), GPS (Global Positioning System), or WIFI (Wireless Fidelity).

[0079] According to various embodiments, the first conductive portion (311) may be electrically connected to a wireless communication circuit (F1) (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., a substrate (240) of FIG. 3) at a first point (L1), thereby operating as a first antenna (SA1) (e.g., a metal bezel antenna). In one embodiment, the first conductive portion (311) may be disposed through a first segment (321) disposed at a second point (L2) of the first side (218a), a second segment (322) disposed at a third point (L3) of the second side (218b), and an extension member (2181) formed by a conductive member (218-1) and a non-conductive region (2182) disposed between the first and second sides (218a, 218b). In some embodiments, the first segment (321) may be omitted. In one embodiment, the first point (L1) may be located between the second point (L2) and the third point (L3). In one embodiment, the non-conductive region (2182) may be filled with a non-conductive member (218-2), such as a polymer. In one embodiment, the non-conductive member (218-2) may be filled seamlessly from the non-conductive region (2182) to the first segment (321) and / or the second segment (322). In some embodiments, the non-conductive region (2182) and the segments (321, 322) may each be filled with non-conductive members of different materials. In some embodiments, at least one of the non-conductive region (2182) or segments (321, 322) may be left empty without the non-conductive member (218-2).

[0080] According to various embodiments, the electronic device (200) may include a slit (3121) extending from a non-conductive region (2182) near the second segment (322) in the side member (218) to a designated length (d). In one embodiment, the slit (3121) may extend along the longitudinal direction of the second side (218b) (e.g., the ±y-axis direction) to have the length (d) in an opposite direction (e.g., the -y-axis direction) to the first conductive portion (311). In one embodiment, the slit (3121) may extend uninterruptedly from the non-conductive region (2182) and be filled with the non-conductive member (218-2). For example, the non-conductive region (2182), the second segment (322), and the slit (3121) may be formed as a part of the extended member (3181) by extending without interruption and filling with a non-conductive member (218-2) (e.g., a polymer). In one embodiment, the length (d) of the slit (3121) may be formed to have a length in the range of about 0<d≤λ / 4, for example, based on the frequency band of the first antenna (SA1) that operates using the first conductive portion (311).

[0081] According to various embodiments, the first conductive portion (311) may be fed to a non-symmetrical position through asymmetrically arranged segments (321, 322) in the side member (218), thereby increasing the current distribution in higher modes such as mode 3 (j3), mode 4 (j4), and mode 5 (j5), thereby reducing the radiation performance of the first antenna (SA1).

[0082] According to exemplary embodiments of the present disclosure, the first antenna (SA1) is induced to operate through a slit (3121) extending from the non-conductive region (2182) to have a specific length in the opposite direction to the first conductive portion (311) near the second segment (322), thereby increasing the current distribution in mode 1 (j1) and mode 2 (j2) more than the current distribution in higher modes, such as mode 3 (j3), mode 4 (j4), and mode 5 (j5), thereby helping to improve radiation performance.

[0083] According to various embodiments, the electronic device (200) may include a slot (3122) formed in the side member (218) to have a length substantially parallel to the second side surface (218b). In one embodiment, the slot (3122) may be formed by changing the shape of a conductive portion of an extension member (2181) and may be filled with a non-conductive member (218-2). In one embodiment, the slot (3122) may be electrically connected to a wireless communication circuit (F2) (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., a substrate (240) of FIG. 3) across the slot (3122) at a fourth point (L4), thereby operating as a second antenna (SA2) (e.g., a slot antenna). In one embodiment, the second antenna (SA2) may operate in a frequency band of about 600 MHz to 2.4 GHz.

[0084] According to various embodiments, the electronic device (200) may include a key button device (217) (e.g., the key input device (217) of FIG. 2A) disposed through at least a portion of the slot (3122). In one embodiment, the key button device (217) may include a button substrate (2171) accommodated in at least a portion of the slot (3122) and a connector cable (2172) extending from the button substrate (2171) into an interior space of the electronic device (200) and electrically connected to a substrate (e.g., substrate 240 of FIG. 3). In one embodiment, the key button device (217) may include at least one key button (2173) disposed to penetrate from the exterior of the side member (218) to the slot (3122).

[0085] According to various embodiments, the slot (3122) may be arranged in proximity to the first conductive portion (311) used as the first antenna (SA1) due to the arrangement of the key button device (217), and due to this close arrangement, the first antenna (SA1) may be subject to interference and its radiation performance may be reduced. For example, when the second antenna (SA2) is operated in a band (e.g., low band) similar to the operating frequency band of the first antenna (SA1) (e.g., when resonance occurs), the radiation performance may be further reduced.

[0086] According to an exemplary embodiment of the present disclosure, the first antenna (SA1) includes a slit (3121) extending from the non-conductive region (2182) to a specific length (d) in the opposite direction to the first conductive portion (311) near the second segment (322), thereby reducing interference by the second antenna (SA2) and improving isolation, thereby helping to improve radiation performance.

[0087] FIG. 5a is a diagram illustrating a mode-specific current distribution according to the length of a slit according to various embodiments of the present disclosure. FIG. 5b is a graph comparing the radiation performance of a first antenna according to the length of a slit according to various embodiments of the present disclosure.

[0088] Referring to FIGS. 5A and 5B, when the first antenna (SA1) operating in a frequency band of about 900 MHz is operated without a slit (3121) (graph 501), a current distribution of about 36.8% is exhibited in mode 1 and mode 2, and a relatively high current distribution of about 63.2% is exhibited in higher modes of mode 3, mode 4, and mode 5, whereas when operated through a slit (3121) having a length (d) of about 20 mm (graph 502), a relatively increased current distribution of about 54.1% is exhibited in mode 1 and mode 2, and a relatively decreased current distribution of about 45.9% is exhibited in higher modes of mode 3, mode 4, and mode 5, thereby improving the radiation performance of the first antenna (SA1). In addition, when the first antenna (SA1) is operated through a slit (3121) of 30 mm length (d) with a length of about λ / 4 based on an operating frequency band of about 900 MHz (graph 503), a relatively increased current distribution of about 63.8% is exhibited in mode 1 and mode 2, and a relatively decreased current distribution of about 36.3% is exhibited in the higher mode of mode 3, mode 4, and mode 5, thereby showing that the radiation performance of the first antenna (SA1) is further improved.

[0089] According to various embodiments, it can also be seen that when the first antenna (SA1) is operated through a slit (3121) of about 40 mm, which is longer than 30 mm and has a length (d) of about λ / 4, based on an operating frequency band of about 900 MHz (graph 504), a current distribution of about 23% is exhibited in mode 1 and mode 2, and a relatively increased current distribution of about 77% is exhibited in the higher mode of mode 3, mode 4, and mode 5, thereby reducing the radiation performance of the first antenna (SA1). In addition, when the first antenna (SA1) is operated through a slit (3121) of about 50 mm that is longer than 30 mm (graph 505), a current distribution of about 9.2% is exhibited in mode 1 and mode 2, and a relatively increased current distribution of about 90.8% is exhibited in the higher mode of mode 3, mode 4, and mode 5, so that it can be seen that the radiation performance of the first antenna (SA1) is further reduced.

[0090] This may mean that even if the first antenna (SA1) is operated through a slit (3121), when operated through a slit (3121) having a length (d) in the range of approximately 0 < d ≤ λ / 4 based on the operating frequency band, relatively superior radiation performance is exhibited compared to when the slit (3121) does not exist.

[0091] FIG. 6 is a graph comparing the isolation of the first antenna and the second antenna depending on the presence or absence of a slit according to various embodiments of the present disclosure.

[0092] In the S21 graph of FIG. 6, when the slit (3121) is not included (graph 601), the signal amount induced from the second antenna (SA2) to the first antenna (SA1) is approximately -17.38 dB, whereas when the slit (3121) is included (graph 602), the signal amount induced from the second antenna (SA2) to the first antenna (SA1) is approximately -22.05 dB, which is a decrease of approximately 4.67 dB. This may mean that when the first antenna (SA1) is operated through the slit (3121), the isolation from the second antenna (SA2) arranged nearby is improved, and the radiation performance of the first antenna (SA1) is enhanced.

[0093] FIGS. 7A and 7B are schematic diagrams of side members having different power supply positions according to various embodiments of the present disclosure.

[0094] In describing the side member (218) of FIGS. 7a and 7b, the same reference numerals are given to components that are substantially the same as those of the side member (218) of FIG. 4a, and a detailed description thereof may be omitted.

[0095] Referring to FIGS. 7A and 7B, an electronic device (e.g., the electronic device (200) of FIG. 2A) may include a side member (218) that includes an extension member (2181) extending into an interior space. In one embodiment, the side member (218) may include a first conductive portion (311) extending from a portion of a first side (218a) to a portion of a second side (218b) and disposed through a first segment (321) disposed on the first side (218a) and a second segment (322) disposed on the second side (218b). In one embodiment, the first conductive portion (311) may be disposed through a non-conductive region (2182) (or a non-conductive member (218-2) filled in the non-conductive region (2182)) disposed between a portion of the first side (218a) and a portion of the second side (218b) and the conductive member (218-1) of the extension member (2181). In one embodiment, the first conductive portion (311) may be electrically connected to a wireless communication circuit (F1) (e.g., a wireless communication module (192) of FIG. 1) at a designated point (e.g., L1 or L5), thereby operating as a first antenna (SA1) in a low band. For example, the first conductive portion (311) may be electrically connected to a wireless communication circuit (F1) disposed on a substrate (e.g., substrate (240) of FIG. 3) at a first point (L1), as illustrated in FIG. 7a, thereby operating as a first antenna (SA1) in a frequency band of about 900 MHz. In one embodiment, the first conductive portion (311) may be electrically connected to a wireless communication circuit (F1) disposed on a substrate (e.g., substrate (240) of FIG. 3) at a fifth point (L5) closer to the second segment (322) than the first point (L1), as illustrated in FIG. 7b, thereby operating as a first antenna (SA1) in a frequency band of about 700 MHz. In one embodiment, the first antenna (SA1) may have improved radiation performance by including a slit (3121) extending a certain length from the non-conductive region (2182).

[0096] FIG. 7c is a diagram comparing the current distribution by mode according to the presence or absence of a slit in the antennas of FIGS. 7a and 7b according to various embodiments of the present disclosure. FIG. 7d is a graph comparing the radiation performance of the antennas of FIGS. 7a and 7b according to various embodiments of the present disclosure according to the presence or absence of a slit.

[0097] Referring to FIGS. 7c and 7d, when the first antenna (SA1) operating in a frequency band of about 700 MHz and 900 MHz is operated without a slit (3121) (graph 701), current distributions of about 80.1% and 36.8% are expressed in mode 1 and mode 2, respectively, and current distributions of 19.9% ​​and 63.2% are expressed in higher modes of mode 3, mode 4, and mode 5, respectively, whereas, in the case of the first antenna (SA1) operating in a frequency band of about 700 MHz and 900 MHz (graph 702) through a slit (3121) extended by a length of about 20 mm from a non-conductive region (2182), relatively high current distributions of about 91% and 54.1% are expressed in mode 1 and mode 2, respectively, and current distributions of 19.9% ​​and 63.2% are expressed in higher modes of mode 3, mode 4, and mode 5, respectively. It can be seen that relatively low current distributions of 9% and 45.9% are exhibited in each mode. This may imply that, even when the first antenna operates in different low-band frequency bands, better radiation performance can be exhibited when the slit (3121) is used than when the slit (3121) is not used.

[0098] Although not shown, it is apparent that the present invention can also be applied to various electronic devices in which a portion of the conductive side member (e.g., conductive side bezel) is used as an antenna, for example, foldable electronic devices and / or rollable electronic devices.

[0099] According to various embodiments, an electronic device includes a conductive side member (e.g., a side member (218) of FIG. 4A), a conductive extension member (e.g., an extension member (2181) of FIG. 4A) extending from the conductive side member into an internal space, a conductive portion (e.g., a first conductive portion (311) of FIG. 4A) disposed through a non-conductive region (e.g., a non-conductive region (2182) of FIG. 4A) disposed between the conductive side member and the conductive extension member and a segment (e.g., a second segment (322) of FIG. 4A) extending from the non-conductive region to the side member, a slit (e.g., a slit (3121) of FIG. 4A) extending from the non-conductive region corresponding to the segment to a specified length in a direction opposite to the conductive portion (e.g., a length (d) of FIG. 4C), and a first point of the conductive portion (e.g., a first point of FIG. 4A) It may include a wireless communication circuit (e.g., a wireless communication circuit (F1) of FIG. 4a) that is electrically connected through a first point (L1)) and is configured to transmit or receive a wireless signal in a first frequency band.

[0100] According to various embodiments, the length of the slit (e.g., length (d) of FIG. 4c) may be set to have a length in the range 0<d≤λ / 4 based on the first frequency band.

[0101] According to various embodiments, the conductive portion may be formed as at least a portion of a side surface of the electronic device (e.g., the first side surface (218a) and the second side surface (218b) of FIG. 4A) and may be positioned so as to be visible from the outside.

[0102] According to various embodiments, the segment may include a first segment (e.g., the first segment (321) of FIG. 4A) formed at a second point (e.g., the second point (L2) of FIG. 4A) spaced apart from the first point to one side, and a second segment (e.g., the second segment (322) of FIG. 4A) formed at a third point (e.g., the third point (L3) of FIG. 4A) spaced apart from the first point to the other side.

[0103] According to various embodiments, the slit may extend from the non-conductive region near the second segment.

[0104] According to various embodiments, the side member includes a first side (e.g., the first side (218a) of FIG. 4A) and a second side (e.g., the second side (218b) of FIG. 4A) extending in a direction perpendicular to the first side, and the conductive portion can be disposed through a portion of the first side and a portion of the second side.

[0105] According to various embodiments, the first segment may be located on the first side, and the second segment may be located on the second side.

[0106] According to various embodiments, the first point may be located at a point other than the center of the first side.

[0107] According to various embodiments, the conductive side member and the conductive extension member may be formed of metal, and the non-conductive region and the segmented portion may be filled with a polymer.

[0108] According to various embodiments, near the slit, the side member includes a slot extending along the length direction (e.g., slot (3122) of FIG. 4A), and the wireless communication circuit (e.g., wireless communication circuit (F2) of FIG. 4A) is electrically connected through a fourth point of the slot (e.g., fourth point (L4) of FIG. 4A) and may be configured to transmit or receive a wireless signal in a second frequency band.

[0109] According to various embodiments, the wireless communication circuit can be electrically connected to the fourth point across the slot.

[0110] According to various embodiments, the first frequency band and the second frequency band may be different from each other.

[0111] According to various embodiments, the second frequency band may include a frequency band of 2.4 GHz.

[0112] According to various embodiments, a key button device (e.g., key button device (217) of FIG. 4A) may be included that is positioned through the slot.

[0113] According to various embodiments, the key button device includes a button substrate (e.g., button substrate (2171) of FIG. 4A), a connector cable extending from the button substrate and connected to a substrate of the electronic device (e.g., connector cable (2172) of FIG. 4A), and at least one key button connected to the button substrate (e.g., key button (2173) of FIG. 4A), wherein at least a portion of the button substrate can be arranged in a manner to be received in the slot.

[0114] According to various embodiments, the at least one key button is connected to the button substrate in a manner that penetrates the side member, and at least a portion of the key button may be exposed to the exterior of the side member.

[0115] According to various embodiments, the first frequency band may include a frequency band in the range of 600 MHz to 960 MHz.

[0116] According to various embodiments, the front plate (e.g., the front plate (202) of FIG. 2A) coupled with the side member and facing a first direction and the rear plate (e.g., the rear plate (211) of FIG. 2B) coupled with the side member and facing a second direction opposite to the first direction may be included, and a housing (e.g., the housing (210) of FIG. 2A) including the internal space may be formed through the front plate, the rear plate and the side member.

[0117] According to various embodiments, the internal space may include a display (e.g., display (201) of FIG. 3) arranged to be visible from the outside through the front plate.

[0118] According to various embodiments, the display may be positioned to be supported by at least a portion of the conductive extension member.

[0119] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, Absence of challenging aspect (218); A conductive extension member (2181) extending from the above-mentioned conductive side member into the internal space; A non-conductive region (2182) disposed between the conductive side member and the conductive extension member, and a conductive portion (311) disposed through a segment (322) extending from the non-conductive region to the side member; A slit (3121) extending from the non-conductive region corresponding to the segmented portion to a specified length (d) in the opposite direction to the conductive portion; and An electronic device comprising a wireless communication circuit (F1) electrically connected through a first point (L1) of the above-mentioned challenging portion and configured to transmit or receive a wireless signal in a first frequency band.

2. In paragraph 1, An electronic device in which the length (d) of the above slit is set to have a length in the range of 0<d≤λ / 4 based on the first frequency band.

3. In paragraph 1, An electronic device in which the above-mentioned challenging portion is formed as at least a portion of a side surface (218a, 218b) of the electronic device and is positioned so as to be visible from the outside.

4. In paragraph 1, The above segmented part is, A first segment (321) formed at a second point (L2) spaced to one side from the first point; and An electronic device including a second segment (322) formed at a third point (L3) spaced to the other side from the first point.

5. In paragraph 4, The above slit is an electronic device extending from the non-conductive region near the second segment.

6. In paragraph 4, The above side member includes a first side (218a) and a second side (218b) extending in a vertical direction from the first side, An electronic device wherein the above challenging portion is disposed through a portion of the first side and a portion of the second side.

7. In paragraph 6, An electronic device wherein the first segment is located on the first side, and the second segment is located on the second side.

8. In paragraph 6, The above first point is an electronic device located at a point other than the center of the first side.

9. In paragraph 1, The above conductive side member and the above conductive extension member are formed of metal, An electronic device wherein the non-conductive region and the segmented portion are filled with a polymer.

10. In paragraph 1, Near the above slit, a slot (3122) extending along the length direction of the side member is included, The above wireless communication circuit (F2) is an electronic device electrically connected through the fourth point (L4) of the slot and set to transmit or receive a wireless signal in a second frequency band.

11. In paragraph 10, The above wireless communication circuit is an electronic device electrically connected to the fourth point across the slot.

12. In paragraph 10, An electronic device comprising a key button device (217) arranged through the above slot.

13. In paragraph 12, The above key button device, Button board (2171); A connector cable (2172) extending from the button substrate and connected to the substrate of the electronic device; and At least one key button (2173) connected to the above button substrate, An electronic device wherein at least a portion of the button substrate is arranged in a manner that it is received in the slot.

14. In paragraph 1, A front plate (202) coupled with the above side member and facing in the first direction; and It includes a rear plate (211) coupled with the above side member and facing in a second direction opposite to the first direction, An electronic device forming a housing (210) including the internal space through the front plate, the rear plate, and the side members.

15. In paragraph 14, An electronic device including a display (201) arranged so as to be visible from the outside through the front plate in the above internal space.

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